Cooling electronic equipment in data centers

Abstract

For example, a cooling system for rack-mounted electronic equipment (e.g., servers, processors, memory, networking equipment, etc.) in a data center. In various disclosed embodiments, the cooling system can be or include a liquid cooling plate assembly that is part of or integrated with a server tray package. In some embodiments, the liquid cooling plate assembly includes a base and a top that combine to form a cooling liquid flow path and a thermal interface between one or more heat-generating devices and the cooling liquid, and the cooling liquid circulates through the cooling liquid flow path.

Description

Technical Field

[0001] This document relates to systems and methods for providing cooling to electronic equipment, such as computer server racks and related equipment in a computer data center, using cold plates. Background Art

[0002] Computer users often focus on the speed of their computer's microprocessors (e.g., megahertz and gigahertz). Many computer users forget that such speeds often come with higher power consumption. Such power consumption also generates heat. This is because, by the simple laws of physics, all power has to go somewhere, and somewhere it is ultimately converted to heat. A pair of microprocessors mounted on a single motherboard can draw hundreds of watts of power or more. Multiply that number by thousands (or tens of thousands) to account for the many computers in a large data center, and one can easily understand the heat that can be generated. The impact of the power consumed by critical loads in a data center is often compounded when combined with all of the auxiliary equipment required to support the critical loads.

[0003] Many techniques can be used to cool electronic devices (e.g., processors, memory, networking devices, and other heat generating devices) located on a server or network rack tray. For example, forced convection can be generated by providing cooling airflow over the equipment. Fans located near the equipment, fans located in the computer server room, and / or fans located in a duct system that is in fluid communication with the air surrounding the electronic equipment can force cooling airflow over the tray containing the equipment. In some cases, one or more components or devices on a server tray may be located in an area of ​​the tray that is difficult to cool; for example, an area where forced convection is not particularly effective or available.

[0004] The consequence of inadequate and / or insufficient cooling can be the failure of one or more electronic devices on the tray due to the temperature of the device exceeding the maximum rated temperature. While some redundancy can be built into computer data centers, server racks, and even individual trays, the failure of equipment due to overheating can be costly in terms of speed, efficiency, and expense. Summary of the invention

[0005] The present disclosure describes cooling systems for rack-mounted electronic equipment (e.g., servers, processors, memory, networking equipment, etc.) in a data center, for example. In various disclosed embodiments, the cooling system can be or include a liquid cooling plate assembly that is part of or integrated with a server tray package. In some embodiments, the liquid cooling plate assembly includes a base and a top that combine to form a cooling liquid flow path and a thermal interface between one or more heat-generating devices and the cooling liquid, through which the cooling liquid circulates.

[0006] In an example embodiment, a server tray package includes a motherboard assembly, the motherboard assembly including a plurality of data center electronic devices. The plurality of data center electronic devices include at least one heat generating processor device, the at least one heat generating processor device having a height less than a corresponding height of at least another data center electronic device of the plurality of data center electronic devices. The server tray package includes a liquid cooling plate assembly, the liquid cooling plate assembly including a base, the base mounted to the motherboard assembly, the base and the motherboard assembly defining a volume at least partially surrounding the plurality of data center electronic devices; and a top cap mounted to the base and including a heat transfer member, the heat transfer member including an inlet end and an outlet end in fluid communication with a coolant flow path defined through the heat transfer member. The heat transfer member includes a first portion having a first thickness dimension in thermal contact with the at least another data center electronic device of the plurality of data center electronic devices, and a second portion having a second thickness dimension greater than the first thickness dimension in thermal contact with the heat generating processor device.

[0007] An aspect that may be combined with the example embodiment further includes a first thermal interface material located between the at least another one of the plurality of data center electronic devices and the first portion of the top cap.

[0008] Another aspect which may be combined with any of the previous aspects further comprises a second thermal interface material located between the at least one heat generating handler device and the second portion of the top cap.

[0009] In another aspect which may be combined with any of the previous aspects, the liquid cooling plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.

[0010] In another aspect which may be combined with any of the previous aspects, the heat transfer surface is located in a volume of the top hat defined by the second portion.

[0011] In another aspect which may be combined with any of the previous aspects, the heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap.

[0012] In another aspect that may be combined with any of the previous aspects, the coolant flow path comprises a first height in the first portion of the top cap that is less than a second height in the second portion of the top cap.

[0013] In another aspect which may be combined with any of the previous aspects, the heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap.

[0014] In another aspect that may be combined with any of the previous aspects, the coolant flow path comprises a first height in the first portion of the top cap that is equal to a second height in the second portion of the top cap.

[0015] In another aspect which may be combined with any of the previous aspects, the heat transfer surface is located in the first portion and the second portion of the top cap.

[0016] In another aspect that may be combined with any of the previous aspects, the base further comprises a cover comprising a hole therethrough, the hole being sized to receive the second portion of the overcap.

[0017] In another aspect that may be combined with any of the previous aspects, the cover is in thermal contact between the first portion of the top cap and the other data center electronic device of the plurality of data center electronic devices.

[0018] In another aspect that may be combined with any of the previous aspects, the first portion of the overcap includes a perimeter and the second portion of the overcap includes an interior defined by the perimeter.

[0019] In another aspect which may be combined with any of the previous aspects, the another one of the plurality of data center electronic devices comprises a voltage regulator.

[0020] In another example embodiment, a method for cooling heat generating devices in a data center includes circulating a flow of cooling liquid to a server tray enclosure. The server tray enclosure includes a motherboard assembly including a plurality of data center electronic devices including at least one heat generating processor device having a height less than a corresponding height of at least one other of the plurality of data center electronic devices, and a liquid cooling plate assembly including a base mounted to the motherboard assembly, the base and motherboard assembly defining a volume at least partially surrounding the plurality of data center electronic devices, and a top cap mounted to the base and including a heat transfer member including a first portion having a first thickness dimension in thermal contact with the at least one other of the plurality of data center electronic devices, and a second portion having a second thickness dimension greater than the first thickness dimension in thermal contact with the heat generating processor device. The method further includes circulating a cooling liquid flow into an inlet end of the heat transfer component; circulating the cooling liquid flow from the inlet end through a cooling liquid flow path defined through the first portion of the heat transfer component; receiving heat from the other data center electronic device among the plurality of data center electronic devices into the cooling liquid flowing through the first portion of the heat transfer component; circulating the cooling liquid flow from the inlet end through the cooling liquid flow path defined through the second portion of the heat transfer component; receiving heat from the heat-generating processing equipment into the cooling liquid flowing through the second portion of the heat transfer component; and circulating the heated cooling liquid flow from the cooling liquid flow path to the outlet end of the heat transfer component.

[0021] An aspect that may be combined with the example embodiment further includes a first thermal interface material, wherein the first thermal interface material is located between at least another data center electronic device among the plurality of data center electronic devices and the first portion of the top cap; and a second thermal interface material, wherein the second thermal interface material is located between the at least one heat generating processor device and the second portion of the top cap.

[0022] In another aspect which may be combined with any of the previous aspects, the liquid cooling plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.

[0023] In another aspect which may be combined with any of the previous aspects, the heat transfer surface is located in a volume of the top hat defined by the second portion.

[0024] In another aspect which may be combined with any of the previous aspects, the heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap.

[0025] In another aspect that may be combined with any of the previous aspects, the coolant flow path comprises a first height in the first portion of the top cap that is less than a second height in the second portion of the top cap.

[0026] In another aspect that may be combined with any of the previous aspects, the heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap, and the coolant flow path includes a first height in the first portion of the top cap that is equal to a second height in the second portion of the top cap.

[0027] In another aspect which may be combined with any of the previous aspects, the heat transfer surface is located in the first portion and the second portion of the top cap.

[0028] In another aspect that may be combined with any of the previous aspects, the base further comprises a cover comprising a hole therethrough, the hole being sized to receive the second portion of the overcap.

[0029] In another aspect that may be combined with any of the previous aspects, the cover is in thermal contact between the first portion of the top cap and the other data center electronic device of the plurality of data center electronic devices.

[0030] In another aspect that may be combined with any of the previous aspects, the first portion of the overcap includes a perimeter and the second portion of the overcap includes an interior defined by the perimeter.

[0031] In another aspect which may be combined with any of the previous aspects, the another one of the plurality of data center electronic devices comprises a voltage regulator.

[0032] Various embodiments of the data center cooling system according to the present disclosure may include one, some or all of the following features. For example, a server tray package according to the present disclosure may provide direct liquid cooling of high-heating electronic devices in a data center. As another example, a server tray package according to the present disclosure may provide multiple functions, including cooling, mechanical rigidity, and liquid coolant sealing. As another example, a server tray package according to the present disclosure may provide customized cooling liquid flow paths and flow geometries to cool high-heating electronic devices and low-heating electronic devices mounted on a single substrate. As another example, a server tray package according to the present disclosure may allow cooling of heat-generating devices with different heights (and different power consumption) mounted on a substrate. As a further example, a server tray package according to the present disclosure may allow hot spot diffusion to be combined with high-performance liquid cooling via a cooling plate. As another example, a server tray package according to the present disclosure may include one or more vapor chambers that may be adjusted to cool a separate heat source based on temperature and power requirements. As another example, a server tray package according to the present disclosure may allow cooling of higher-power computing components (e.g., processors) by direct conductive contact with a liquid-cooled cooling plate to obtain better performance. As a further example, a server tray package according to the present disclosure may include a partial cover with holes to allow integration of a liquid-cooled cold plate with less potential for warping, but with protection for the server package electronics. As yet another example, a server tray package according to the present disclosure may include a partial cover that provides a seating surface for a liquid-cooled cold plate and prevents the plate from tilting. As another example, a server tray package according to the present disclosure may provide more direct heat transfer through conductive contact between heat-generating devices (such as processors) while still providing cooling for devices that generate less heat (such as memory modules).

[0033] The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A front view of a server rack for use in a data center environment and a server rack subassembly configured to be mounted within the rack is shown.

[0035] Figure 2 A schematic cross-sectional side view of an example implementation of a server tray package including a liquid cold plate assembly is shown.

[0036] Figure 3A A schematic cross-sectional side view of another example embodiment of a server tray package including a liquid cold plate assembly and a vapor chamber is shown.

[0037] Figure 3B A schematic cross-sectional side view of an example implementation of a vapor chamber that may be used in a liquid cooling plate assembly in a server tray package is shown.

[0038] Figure 3C and 3D Schematic side and top views of another example embodiment of a vapor chamber that may be used in a liquid cooling plate assembly in a server tray enclosure are shown.

[0039] Figure 4A A schematic cross-sectional side view of another example embodiment of a server tray package including a liquid cold plate assembly and a vapor chamber is shown.

[0040] Figure 4B and 4C Schematic side and top views of another example embodiment of a vapor chamber that may be used in a liquid cooling plate assembly in a server tray enclosure are shown.

[0041] Figure 5 A schematic cross-sectional side view of another example embodiment of a server tray package including a liquid cold plate assembly and a vapor chamber is shown.

[0042] Figure 6 A schematic cross-sectional side view of another example embodiment of a server tray package including a liquid cold plate assembly and a vapor chamber is shown.

[0043] Figure 7 A schematic cross-sectional side view of a portion of an example embodiment of a server tray enclosure including a liquid cooling plate assembly disposed on a partial cover is shown.

[0044] Figure 8 A schematic cross-sectional side view of a portion of an example embodiment of a server tray enclosure including a liquid cooling plate assembly disposed on a partial cover is shown.

[0045] Fig. 9 A schematic cross-sectional side view of a portion of another example embodiment of a server tray enclosure including a liquid cooling plate assembly disposed on a partial cover is shown.

[0046] Fig.10 A schematic cross-sectional side view of a portion of another example embodiment of a server tray enclosure including a liquid cooling plate assembly disposed on a partial cover is shown.

[0047] Fig.11 A schematic cross-sectional side view of a portion of another example embodiment of a server tray enclosure including a liquid cooling plate assembly disposed on a partial cover is shown. DETAILED DESCRIPTION

[0048] In some example embodiments, cooling systems are disclosed, for example, for rack-mounted electronic equipment (e.g., servers, processors, memory, networking equipment, etc.) in a data center. In various disclosed embodiments, the cooling system can be or include a liquid cooling plate assembly that is part of or integrated with a server tray package. In some embodiments, the liquid cooling plate assembly includes a base and a top that combine to form a cooling liquid flow path and a thermal interface between one or more heat-generating devices and the cooling liquid, through which the cooling liquid circulates.

[0049] Figure 1 An example system 100 is shown that includes a server rack 105 (e.g., a 13-inch or 19-inch server rack) and a plurality of server rack subassemblies 110 mounted within the rack 105. Although a single server rack 105 is shown, the server rack 105 can be one of several server racks within the system 100, which can include a server farm or a co-located facility containing various rack-mounted computer systems. In addition, although a plurality of server rack subassemblies 110 are shown as being mounted within the rack 105, there can be only a single server rack subassembly. Generally, the server rack 105 defines a plurality of slots 107 arranged in an ordered and repeating manner within the server rack 105, and each slot 107 is a space in the rack into which a corresponding server rack subassembly 110 can be placed and removed from the space. For example, the server rack subassemblies can be supported on rails 112 that protrude from opposite sides of the rack 105, and the rails 112 can define the location of the slots 107.

[0050] The slots 107 and server rack subassembly 110 can be oriented in the horizontal arrangement shown (relative to gravity). Alternatively, the slots 107 and server rack subassembly 110 can be oriented vertically (relative to gravity). In the case where the slots are oriented horizontally, they can be stacked vertically in the rack 105, and in the case where the slots are oriented vertically, they can be stacked horizontally in the rack 105.

[0051] The server rack 105 may provide data processing and storage capacity as part of, for example, a larger data center. In operation, the data center may be connected to a network and may receive and respond to various requests from the network to retrieve, process, and / or store data. For example, in operation, the server rack 105 typically facilitates information communication over a network with a user interface generated by a web browser application of a user who requests services provided by an application running on a computer in the data center. For example, the server rack 105 may provide or facilitate access to a website on the Internet or the World Wide Web to a user who is using a web browser.

[0052] The server rack subassembly 110 can be one of a variety of structures that can be mounted in a server rack. For example, in some embodiments, the server rack subassembly 110 can be a "tray" or tray assembly that can be slidably inserted into the server rack 105. The term "tray" is not limited to any particular arrangement, but applies to a motherboard or other relatively flat structure attached to the motherboard for supporting the motherboard in an appropriate position in the rack structure. In some embodiments, the server rack subassembly 110 can be a server tray package, a server chassis, or a server container (e.g., a server box). In some embodiments, the server rack subassembly 110 can be a hard drive cage.

[0053] Figure 2 A schematic cross-sectional side view of an example embodiment of a server tray package 200 including a liquid cooling plate assembly 201 is shown. In some embodiments, the server tray package 200 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Figure 2, the server tray package 200 includes a printed circuit board (e.g., motherboard 202) that supports one or more data center electronic devices; in this example, two or more memory modules 214 and one or more processing devices 216 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 202 can be mounted on a frame (not shown), which can include or simply be a flat structure that can be grasped by a technician to move the motherboard 202 into position and hold it in place within the rack 105. For example, the server tray package 200 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 200 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 202, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 202), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0054] In some examples, one motherboard 202 is mounted on the frame; alternatively, multiple motherboards 202 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 202 or the frame so that when the server tray enclosure 200 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 200 closer to the front of the rack 105, flows through the motherboard 202, flows through some data center electronic components on the motherboard 202, and when the server tray enclosure 200 is mounted in the rack 105, is exhausted from the server tray enclosure 200 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 202 or the frame by brackets.

[0055] As shown, the substrate 204 and the interposer 212 (e.g., a silicon interposer) are located between the data center electronic devices (e.g., the memory module 214 and the processing device 216) and the motherboard 202. For example, the substrate 204 provides an interface between one or more data center electronic devices (e.g., the processing device 216) and the motherboard 202, such as by providing pins for electrical and communication interfaces. In this example, the substrate 204 can also provide a mounting location for one or more components of the liquid cooling plate assembly 201. For example, the interposer 212 provides a high bandwidth connection between the data center electronic devices (such as between the memory module 214 and the processing device 216).

[0056] like Figure 2 , the liquid cold plate assembly 201 includes a top 222 (also referred to as a top cap 222) and a base 206. The base 206 includes a cover 208 that defines a top surface of the base 206 and sides 210 that couple the cover 208 to the substrate 204. The cover 208 and the sides 210 combine to define or enclose a volume 203 in which an interposer 212 and data center electronics (e.g., memory modules 214 and processing devices 216) (mounted thereon) are located in the server tray package 200. As shown in this example, a thermal interface material 218 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the cover 208 and the data center electronics (e.g., memory modules 214 and processing devices 216) to provide a conductive heat transfer interface between these components.

[0057] In this example embodiment, the top cap 222 is mounted to the top surface of the cover 208 via another thermal interface material 220 (e.g., a phase change material or other thermally conductive material) that provides a conductive heat transfer interface between a bottom 228 of the top cap 222 and the cover 208 of the base 206. As shown, the top cap 222 includes a cover 224 connected to the bottom 228 via sides 226. The cover 224, sides 226, and bottom 228 combine to define a volume 234 through which a flow of cooling fluid can circulate.

[0058] As shown in this example, the cover 224 includes a coolant inlet 230 through which a coolant source 240 can enter. The cover 224 also includes a coolant outlet 232 through which a coolant return 242 can exit. The volume 234 defines or includes a coolant flow path between the inlet 230 and the outlet 232 to form a heat transfer member in or of the top cap 222. As shown in this example, one or more heat transfer surfaces 236 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located in the volume 234. The heat transfer surfaces 236 define channels 238 through which, for example, coolant can be circulated to increase the amount of heat transferred from the data center electronic equipment (e.g., the memory modules 214 and the processing devices 216) to the coolant (e.g., relative to the amount transferred in embodiments of the server tray package 200 that do not include the heat transfer surfaces 236). Alternative embodiments of the server tray enclosure 200 may include multiple inlets 230 , multiple outlets 232 , or may not include the heat transfer surface 236 .

[0059] In an example operation in which the server tray package 200 cools data center electronic equipment (e.g., memory modules 214 and processing devices 216), the server tray package 200 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 200, the processing devices 216 and memory modules 214 generate heat that may need to be dissipated or removed from the server tray package 200 (e.g., for proper operation of the server tray package 200). The heat generated by the processing devices 216 and memory modules 214 is transferred to the cover 208 of the base 206 of the liquid cold plate assembly 201 through the thermal interface material 218. The transferred heat is further transferred from the cover 208 to the bottom 228 of the top cap 222 through the thermal interface material 220. In some examples, one or more components of the liquid cold plate assembly 201 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0060] The heat transferred to the bottom 228 of the top cap 222 is then transferred to a cooling liquid source 240 that circulates through the inlet 230 and into the volume 234 of the top cap 222. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 200. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 240 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., the memory modules 214 and the processing devices 216).

[0061] In some examples, heat is transferred directly from the bottom 228 to the coolant source 240. Heat can also be transferred from the bottom 228 through one or more heat transfer surfaces 236 and then to the coolant source 240 flowing through the channels 238. The heated coolant source 240 circulates to the outlet 232 and exits the top cap 222 as a coolant return 242 (e.g., the temperature of the coolant return 242 is higher than the temperature of the coolant source 240). The coolant return 242 circulates back to, for example, the coolant source to remove heat from the return 242 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0062] Figure 3A A schematic cross-sectional side view of another example embodiment of a server tray package 300 including a liquid cooling plate assembly 301 and a vapor chamber 350 is shown. In some embodiments, the server tray package 300 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Figure 3A, the server tray package 300 includes a printed circuit board (e.g., motherboard 302) that supports one or more data center electronic devices; in this example, two or more memory modules 314 and one or more processing devices 316 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 302 can be mounted on a frame (not shown), which may include or simply be a flat structure that can be grasped by a technician to move the motherboard 302 into position and hold it in place within the rack 105. For example, the server tray package 300 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 300 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 302, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 302), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0063] In some examples, one motherboard 302 is mounted on the frame; alternatively, multiple motherboards 302 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 302 or the frame so that when the server tray enclosure 300 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 300 closer to the front of the rack 105, flows through the motherboard 302, flows through some data center electronic components on the motherboard 302, and when the server tray enclosure 300 is mounted in the rack 105, is exhausted from the server tray enclosure 300 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 302 or the frame by brackets.

[0064] As shown, the substrate 304 and the interposer 312 (e.g., a silicon interposer) are located between the data center electronics (e.g., the memory module 314 and the processing device 316) and the motherboard 302. For example, the substrate 304 provides an interface between one or more data center electronics (e.g., the processing device 316) and the motherboard 302, such as by providing pins for electrical and communication interfaces. In this example, the substrate 304 can also provide a mounting location for one or more components of the liquid cooling plate assembly 301. For example, the interposer 312 provides a high bandwidth connection between the data center electronics (such as between the memory module 314 and the processing device 316).

[0065] like Figure 3A , the liquid cold plate assembly 301 includes a top portion (also referred to as a top cap 322) and a base 306. The base 306 includes a cover 308 defining a top surface of the base 306 and sides 310 coupling the cover 308 to the base plate 304. The cover 308 and sides 310 combine to define or enclose a volume 303 in which an interposer 312 and data center electronics (e.g., memory modules 314 and processing devices 316) (mounted thereon) are located in the server tray package 300. As shown in this example, a thermal interface material 318 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the cover 308 and the data center electronics (e.g., memory modules 314 and processing devices 316) to provide a conductive heat transfer interface between these components.

[0066] In this example embodiment, the top cap 322 is mounted to the vapor chamber 350 via another thermal interface material 320 (e.g., a phase change material or other thermally conductive material) that provides a conductive heat transfer interface between the bottom 328 of the top cap 322 and the vapor chamber 350. Figure 3B , which shows a schematic cross-sectional side view of an example embodiment of a steam chamber 350. As shown, the steam chamber 350 includes a shell containing a heat transfer fluid 354 (e.g., water, refrigerant, or other fluid that boils in response to received heat). In this example, the steam chamber 350 includes a single chamber within a shell 352 that surrounds the fluid 354. In some aspects, the steam chamber 350 may include a boiling enhancement member (e.g., fins or other) within the chamber (e.g., on the bottom inner surface) to increase heat transfer to the fluid 354. The steam chamber 350 may also include a condensation enhancement member (e.g., a wicking structure) within the chamber (e.g., on the top inner surface) to allow better heat transfer from the fluid 354 to the bottom 328 of the top cap 322.

[0067] As shown in this example, a vapor chamber 350 (having a single chamber and fluid 354) is located atop data center electronics (e.g., memory modules 314 and processing devices 316). In some aspects, one or more of the electronics (e.g., processing devices 316) may generate more heat than other electronics (e.g., memory modules 314). Thus, the vapor chamber 350 may eliminate or help eliminate hot spots caused by the processing devices 316 by distributing the heat from the processing devices 316 throughout the chamber 350 (e.g., into the fluid 354). Thus, while there may be non-uniform (per unit area) heat transfer from the data center electronics (e.g., memory modules 314 and processing devices 316) to the vapor chamber, there is uniform or substantially uniform (per unit area) heat transfer from the vapor chamber to the top cap 322.

[0068] The vapor chamber 350 is mounted to the cover 308 of the base 306 by another thermal interface material 353 (eg, phase change material or other thermally conductive material). Thus, there is a conductive heat transfer interface between the vapor chamber 350 and the cover 308 of the base 306.

[0069] As shown, top cap 322 includes a cover 324 connected to a bottom 328 via sides 326. Cover 324, sides 326, and bottom 328 combine to define a volume 334 through which a flow of cooling fluid may circulate.

[0070] As shown in this example, the cover 324 includes a coolant inlet 330 through which a coolant source 340 can enter. The cover 324 also includes a coolant outlet 332 through which a coolant return 342 can exit. The volume 334 defines or includes a coolant flow path between the inlet 330 and the outlet 332 to form a heat transfer member in or of the top cap 322. As shown in this example, one or more heat transfer surfaces 336 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located in the volume 334. The heat transfer surfaces 336 define channels 338 through which, for example, coolant can be circulated to increase the amount of heat transferred from the data center electronic equipment (e.g., memory modules 314 and processing devices 316) to the coolant (e.g., relative to the amount transferred in embodiments of the server tray package 300 that do not include heat transfer surfaces 336). Alternative embodiments of the server tray enclosure 300 may include multiple inlets 330 , multiple outlets 332 , or may not include the heat transfer surface 336 .

[0071] In an example operation in which the server tray package 300 cools data center electronic equipment (e.g., memory modules 314 and processing devices 316), the server tray package 300 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 300, the processing devices 316 and memory modules 314 generate heat that may need to be dissipated or removed from the server tray package 300 (e.g., for proper operation of the server tray package 300). The heat generated by the processing devices 316 and memory modules 314 is transferred to the cover 308 of the base 306 of the liquid cooling plate assembly 301 through the thermal interface material 318. The transferred heat is further transferred from the cover 308 to the vapor chamber 350 through the thermal interface material 320. When heat is transferred into the fluid 354, the fluid 354 can boil or evaporate. The boiling or evaporating fluid 354 naturally circulates toward the top of the vapor chamber 350, where the heat is transferred to the bottom 328 of the top cap 322. As heat is transferred to the bottom 328 , the evaporated or boiling fluid 354 condenses back into liquid form and falls back to the bottom of the vapor chamber 350 .

[0072] The heat transferred to the bottom 328 of the top cap 322 is then transferred to a cooling liquid source 340 that circulates through the inlet 330 and enters the volume 334 of the top cap 322. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 300. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 340 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., the memory modules 314 and the processing devices 316).

[0073] In some examples, heat is transferred directly from the bottom 328 to the coolant source 340. Heat can also be transferred from the bottom 328 through one or more heat transfer surfaces 336 and then to the coolant source 340 flowing through the channels 338. The heated coolant source 340 circulates to the outlet 332 and exits the top cap 322 as a coolant return 342 (e.g., the temperature of the coolant return 342 is higher than the temperature of the coolant source 340). The coolant return 342 circulates back to, for example, the coolant source to remove heat from the return 342 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0074] Figure 3C and 3D Schematic side and top views of another example embodiment of a vapor chamber 370 that may be used in a liquid cooling plate assembly in a server tray package, such as server tray package 300, are shown. As shown, vapor chamber 370 has a plurality of subchambers; in this example, three subchambers are divided between two subchambers 374 and subchamber 376. A heat transfer fluid may be contained in each of subchambers 374 and 376. As further shown, subchamber 374 may have different dimensions (e.g., length and width) than subchamber 376. As shown in FIG. Figure 3D 308, a larger single subchamber 376 may be located above the processing device 316, while two subchambers 374 may be located above the memory module 314. In this example, each subchamber may be customized, for example, based on the thermal power output of the specific data center electronic equipment in which each subchamber is located. For example, the type of heat transfer fluid contained in each subchamber or the size of each subchamber may be customized to meet the heat transfer requirements for removing heat from the specific data center electronic equipment.

[0075] Figure 4A A schematic cross-sectional side view of another example embodiment of a server tray package 400 including a liquid cooling plate assembly 401 and a vapor chamber 450 is shown. In some embodiments, the server tray package 400 can be used as Figure 1 4 , the server tray package 400 includes a printed circuit board (e.g., motherboard 402) that supports one or more data center electronic devices; in this example, two or more memory modules 414 and one or more processing devices 416 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 402 can be mounted on a frame (not shown) that can include or simply be a flat structure that can be grasped by a technician to move the motherboard 402 into position and hold it in place within the rack 105. For example, the server tray package 400 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 400—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 402, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 402), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls that protrude upward from the edge of the flat panel, and the flat panel may be the bottom panel of a closed-top or open-top box or cage.

[0076] In some examples, one motherboard 402 is mounted on the frame; alternatively, multiple motherboards 402 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 402 or the frame so that when the server tray enclosure 400 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 400 closer to the front of the rack 105, flows through the motherboard 402, flows through some data center electronic components on the motherboard 402, and when the server tray enclosure 400 is mounted in the rack 105, is exhausted from the server tray enclosure 400 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 402 or the frame by brackets.

[0077] As shown, substrate 404 and interposer 412 (e.g., silicon interposer) are located between data center electronics (e.g., memory module 414 and processing device 416) and motherboard 402. For example, substrate 404 provides an interface between one or more data center electronics (e.g., processing device 416) and motherboard 402, such as by providing pins for electrical and communication interfaces. In this example, substrate 404 can also provide a mounting location for one or more components of liquid cooling plate assembly 401. For example, interposer 412 provides high bandwidth connections between data center electronics (such as between memory module 414 and processing device 416).

[0078] As shown in FIG4 , the liquid cold plate assembly 401 includes a top portion (also referred to as a top cap 422) and a base 406. The base 406 includes a cover 408 defining a top surface of the base 406 and sides 410 coupling the cover 408 to the substrate 404. The cover 408 and sides 410 combine to define or enclose a volume 403 in which an interposer 412 and data center electronics (e.g., memory modules 414 and processing devices 416) (mounted thereon) are located in the server tray package 400. As shown in this example, a thermal interface material 418 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the cover 408 and the data center electronics (e.g., memory modules 414 and processing devices 416) to provide a conductive heat transfer interface between these components.

[0079] In this example embodiment, the top cap 422 is mounted to the vapor chamber 450 via another thermal interface material 420 (e.g., a phase change material or other thermally conductive material) that provides a conductive heat transfer interface between the bottom 428 of the top cap 422 and the vapor chamber 450. In this example, the vapor chamber 450 may be a single chamber vapor chamber (e.g., Figure 3B ) or may be a multi-chamber steam chamber (such as Figure 3C-3D 4B-4C). In addition, as shown in this example, the top cap 422 and the steam chamber 450 can have dimensions (e.g., length and width) that are greater than the base 406. Thus, as shown, the steam chamber 450 and the top cap 422 can overhang two or more sides of the cover 408 of the base 406 ( Figure 4A 414 and 415). The vapor chamber 450 / top cap 422 combination can provide better heat transfer from data center electronics (e.g., memory modules 414 and processing devices 416) than a vapor chamber / top cap combination having dimensions (e.g., length and width) similar to cover 408. Thus, more heat can be removed, or alternatively, a smaller volume of cooling liquid flow can be circulated to top cap 422 to produce the same amount of heat transfer performance.

[0080] In some aspects, one or more electronic devices (e.g., processing device 416) may generate more heat than other electronic devices (e.g., memory module 414). Thus, vapor chamber 450 may eliminate or help eliminate hot spots caused by processing device 416 by distributing heat from processing device 416 throughout chamber 450 (e.g., into the fluid). Thus, while there may be non-uniform (per unit area) heat transfer from the data center electronic devices (e.g., memory module 414 and processing device 416) to the vapor chamber, there is uniform or substantially uniform (per unit area) heat transfer from the vapor chamber to top cap 422.

[0081] The vapor chamber 450 is mounted to the cover 408 of the base 406 by another thermal interface material 453 (eg, phase change material or other thermally conductive material). Thus, there is a conductive heat transfer interface between the vapor chamber 450 and the cover 408 of the base 406.

[0082] As shown, the top cap 422 includes a cover 424 connected to a bottom 428 by a side 426. The cover 424, the side 426, and the bottom 428 combine to define a volume 434 through which a coolant flow can circulate. As shown in this example, the cover 424 includes a coolant inlet 430 through which a coolant source 440 can enter. The cover 424 also includes a coolant outlet 432 through which a coolant return 442 can exit. The volume 434 defines or includes a coolant flow path between the inlet 430 and the outlet 432 to form a heat transfer component in the top cap 422 or to form a heat transfer component of the top cap 422. As shown in this example, one or more heat transfer surfaces 436 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 434. The heat transfer surface 436 defines a channel 438 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the memory modules 414 and the processing devices 416) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray enclosure 400 that do not include the heat transfer surface 436). Alternative embodiments of the server tray enclosure 400 may include multiple inlets 430, multiple outlets 432, or may not include the heat transfer surface 436.

[0083] In an example operation in which the server tray package 400 cools data center electronic equipment (e.g., memory modules 414 and processing devices 416), the server tray package 400 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 400, the processing device 416 and the memory module 414 generate heat that may need to be dissipated or removed from the server tray package 400 (e.g., for proper operation of the server tray package 400). The heat generated by the processing device 416 and the memory module 414 is transferred to the cover 408 of the base 406 of the liquid cooling plate assembly 401 through the thermal interface material 418. The transferred heat is further transferred from the cover 408 to the vapor chamber 450 through the thermal interface material 420. When heat is transferred to the fluid, the fluid can boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of the vapor chamber 450, where the heat is transferred to the bottom 428 of the top cap 422. When heat is transferred to the bottom 428 , the evaporated or boiling fluid condenses back into liquid form and falls back to the bottom of the vapor chamber 450 .

[0084] The heat transferred to the bottom 428 of the top cap 422 is then transferred to a cooling liquid source 440 that circulates through the inlet 430 and enters the volume 434 of the top cap 422. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 400. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 440 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., memory modules 414 and processing devices 416).

[0085] In some examples, heat is transferred directly from the base 428 to the coolant source 440. Heat can also be transferred from the base 428 through one or more heat transfer surfaces 436 and then to the coolant source 440 flowing through the channels 438. The heated coolant source 440 circulates to the outlet 432 and exits the top cap 422 as a coolant return 442 (e.g., the temperature of the coolant return 442 is higher than the temperature of the coolant source 440). The coolant return 442 circulates back to, for example, the coolant source to remove heat from the return 442 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0086] Figure 4B and 4CSchematic side and top views of another example embodiment of a vapor chamber 470 that may be used in a liquid cooling plate assembly in a server tray package, such as server tray package 400, are shown. As shown, vapor chamber 470 has a plurality of subchambers; in this example, three subchambers are divided between two subchambers 474 and subchamber 476. A heat transfer fluid may be contained in each of subchambers 474 and 476. As further shown, subchamber 474 may have different dimensions (e.g., length and width and even shape) than subchamber 476. As shown in FIG. Figure 4C 4, when the vapor chamber 470 is located on the cover 408, a larger single subchamber 476 can be located above the processing device 416 and extend adjacent to the memory module 414 (e.g., in an "I" or "H" shape). Two subchambers 474 can be located above the memory module 414 and are rectangular in shape in this example. In this example, each subchamber can be customized, for example, based on the thermal power output of the specific data center electronic equipment in which each subchamber is located. For example, the type of heat transfer fluid contained in each subchamber or the size or shape of each subchamber can be customized to meet the heat transfer requirements for removing heat from the specific data center electronic equipment.

[0087] Figure 5 A schematic cross-sectional side view of another example embodiment of a server tray package 500 including a liquid cooling plate assembly 501 and a vapor chamber 550 is shown. In some embodiments, the server tray package 500 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Figure 5, the server tray package 500 includes a printed circuit board (e.g., motherboard 502) that supports one or more data center electronic devices; in this example, two or more memory modules 514 and one or more processing devices 516 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 502 can be mounted on a frame (not shown), which can include or simply be a flat structure that can be grasped by a technician to move the motherboard 502 into position and hold it in place within the rack 105. For example, the server tray package 500 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 500 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 502, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 502), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0088] In some examples, one motherboard 502 is mounted on the frame; alternatively, multiple motherboards 502 may be mounted on the frame as needed for a particular application. In some implementations, one or more fans (not shown) may be placed on the motherboard 502 or the frame so that when the server tray enclosure 500 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 500 closer to the front of the rack 105, flows through the motherboard 502, flows through some data center electronic components on the motherboard 502, and when the server tray enclosure 500 is mounted in the rack 105, is exhausted from the server tray enclosure 500 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 502 or the frame by brackets.

[0089] As shown, the substrate 504 and the interposer 512 (e.g., a silicon interposer) are located between the data center electronic devices (e.g., the memory module 514 and the processing device 516) and the motherboard 502. For example, the substrate 504 provides an interface between one or more data center electronic devices (e.g., the processing device 516) and the motherboard 502, such as by providing pins for electrical and communication interfaces. In this example, the substrate 504 can also provide a mounting location for one or more components of the liquid cooling plate assembly 501. For example, the interposer 512 provides a high bandwidth connection between the data center electronic devices (such as between the memory module 514 and the processing device 516).

[0090] like Figure 5 , the liquid cold plate assembly 501 includes a top portion (also referred to as a top cap 522) and a base 506. The base 506 includes a cover 508 defining a top surface of the base 506 and sides 510 coupling the cover 508 to the substrate 504. The cover 508 and sides 510 combine to define or enclose a volume 503 in which an interposer 512 and data center electronics (e.g., memory modules 514 and processing devices 516) (mounted thereon) are located in the server tray package 500. As shown in this example, a thermal interface material 518 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the cover 508 and the data center electronics (e.g., memory modules 514 and processing devices 516) to provide a conductive heat transfer interface between these components.

[0091] In this example embodiment, the top cap 522 includes (is integrated with) a steam chamber 550. The steam chamber 550 may be a single chamber steam chamber (e.g., Figure 3B ) or a multi-chamber steam chamber (e.g., as shown in Figure 3C-3D 4B-4C). As shown in this example, the vapor chamber 550 is located on top of the data center electronic equipment (e.g., memory modules 514 and processing devices 516). In some aspects, one or more electronic devices (e.g., processing devices 516) can generate more heat than other electronic devices (e.g., memory modules 514). Therefore, the vapor chamber 550 can eliminate or help eliminate hot spots caused by the processing devices 516 by distributing the heat from the processing devices 516 throughout the chamber 550 (e.g., into the fluid). Therefore, while there may be uneven (per unit area) heat transfer from the data center electronic equipment (e.g., memory modules 514 and processing devices 516) to the vapor chamber, there is uniform or substantially uniform (per unit area) heat transfer from the vapor chamber to the top cap 522.

[0092] The top cap 522 including the vapor chamber 550 is mounted to the lid 508 of the base 506 through another thermal interface material 520 (e.g., phase change material or other thermally conductive material). Thus, a conductive heat transfer interface is formed between the top cap 522 and the lid 508 of the base 506 through the vapor chamber 550 and the thermal interface material 520.

[0093] As shown, the top cap 522 includes a cover 524 connected to a steam chamber 550 via a side 526. The cover 524, the side 526, and the steam chamber 550 combine to define a volume 534 through which a coolant flow can circulate. As shown in this example, the cover 524 includes a coolant inlet 530 through which a coolant source 540 can enter. The cover 524 also includes a coolant outlet 532 through which a coolant return 542 can exit. The volume 534 defines or includes a coolant flow path between the inlet 530 and the outlet 532 to form a heat transfer component in the top cap 522 or to form a heat transfer component of the top cap 522. As shown in this example, one or more heat transfer surfaces 536 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 534. The heat transfer surface 536 defines a channel 538 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the memory modules 514 and the processing devices 516) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray enclosure 500 that do not include the heat transfer surface 536). Alternative embodiments of the server tray enclosure 500 may include multiple inlets 530, multiple outlets 532, or may not include the heat transfer surface 536.

[0094] In an example operation in which the server tray package 500 cools data center electronic equipment (e.g., memory modules 514 and processing devices 516), the server tray package 500 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 500, the processing devices 516 and memory modules 514 generate heat that may need to be dissipated or removed from the server tray package 500 (e.g., for proper operation of the server tray package 500). The heat generated by the processing devices 516 and memory modules 514 is transferred to the cover 508 of the base 506 of the liquid cooling plate assembly 501 through the thermal interface material 518. The transferred heat is further transferred from the cover 508 to the vapor chamber 550 through the thermal interface material 520. When heat is transferred to the fluid, the fluid can boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of the vapor chamber 550, where the heat is transferred to the cooling liquid source 540. When the heat is transferred to the source 540, the evaporated or boiling fluid condenses back into liquid form and falls back to the bottom of the vapor chamber 550.

[0095] Heat from the vapor chamber 550 is transferred to a cooling liquid source 540 that circulates through the inlet 530 and into the volume 534 of the top cap 522. In some examples, the cooling liquid can be cooling water or glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 500. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 540 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics (e.g., memory modules 514 and processing devices 516).

[0096] In some examples, heat is transferred directly from the steam chamber 550 (housing) to the coolant source 540. Heat can also be transferred from the housing of the steam chamber 550 through one or more heat transfer surfaces 536 and then to the coolant source 540 flowing through the channel 538. The heated coolant source 540 circulates to the outlet 532 and exits the top hat 522 as a coolant return 542 (e.g., the temperature of the coolant return 542 is higher than the temperature of the coolant source 540). The coolant return 542 circulates back to, for example, the coolant source to remove heat from the return 542 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0097] Figure 6 A schematic cross-sectional side view of another example embodiment of a server tray package 600 including a liquid cooling plate assembly 601 and a vapor chamber 650 is shown. In some embodiments, the server tray package 600 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Figure 6, the server tray package 600 includes a printed circuit board (e.g., motherboard 602) that supports one or more data center electronic devices; in this example, two or more memory modules 614 and one or more processing devices 616 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 602 can be mounted on a frame (not shown), which can include or simply be a flat structure that can be grasped by a technician to move the motherboard 602 into position and hold it in place within the rack 105. For example, the server tray package 600 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 600 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 602, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 602), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0098] In some examples, one motherboard 602 is mounted on the frame; alternatively, multiple motherboards 602 may be mounted on the frame as needed for a particular application. In some implementations, one or more fans (not shown) may be placed on the motherboard 602 or the frame so that when the server tray enclosure 600 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 600 closer to the front of the rack 105, flows through the motherboard 602, flows through some data center electronic components on the motherboard 602, and when the server tray enclosure 600 is mounted in the rack 105, is exhausted from the server tray enclosure 600 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 602 or the frame by brackets.

[0099] As shown, substrate 604 and interposer 612 (e.g., silicon interposer) are located between data center electronics (e.g., memory module 614 and processing device 616) and motherboard 602. For example, substrate 604 provides an interface between one or more data center electronics (e.g., processing device 616) and motherboard 602, such as by providing pins for electrical and communication interfaces. In this example, substrate 604 can also provide a mounting location for one or more components of liquid cooling plate assembly 601. For example, interposer 612 provides high bandwidth connections between data center electronics (such as between memory module 614 and processing device 616).

[0100] like Figure 6 , the liquid cold plate assembly 601 includes a top portion (also referred to as a top cap 622) and a base 606. The base 606 includes a vapor chamber 650 integrated therein that defines a top surface of the base 606 and a side 610 that couples the vapor chamber 650 to the substrate 604. The vapor chamber 650 and the side 610 combine to define or enclose a volume 603 in which an interposer 612 and data center electronics (e.g., memory modules 614 and processing devices 616) (mounted thereon) are located in the server tray package 600. As shown in this example, a thermal interface material 618 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the vapor chamber 650 and the data center electronics (e.g., memory modules 614 and processing devices 616) to provide a conductive heat transfer interface between these components.

[0101] In this example embodiment, the top cap 622 is mounted to the vapor chamber 650 via another thermal interface material 620 (e.g., a phase change material or other thermally conductive material) that provides a conductive heat transfer interface between the bottom 628 of the top cap 622 and the vapor chamber 650. The vapor chamber 650 may be a single chamber vapor chamber (e.g., Figure 3B ) or a multi-chamber steam chamber (e.g., as shown in Figure 3C-3D 4B-4C). As shown in this example, the vapor chamber 650 is located on top of the data center electronic devices (e.g., memory modules 614 and processing devices 616). In some aspects, one or more electronic devices (e.g., processing devices 616) can generate more heat than other electronic devices (e.g., memory modules 614). Therefore, the vapor chamber 650 can eliminate or help eliminate hot spots caused by the processing devices 616 by distributing the heat from the processing devices 616 throughout the chamber 650 (e.g., into the fluid). Therefore, while there may be uneven (per unit area) heat transfer from the data center electronic devices (e.g., memory modules 614 and processing devices 616) to the vapor chamber, there is uniform or substantially uniform (per unit area) heat transfer from the vapor chamber to the top cap 622.

[0102] As shown, the top cap 622 includes a cover 624 connected to a bottom 628 by a side 626. The cover 624, the side 626, and the bottom 628 combine to define a volume 634 through which a coolant flow can circulate. As shown in this example, the cover 624 includes a coolant inlet 630 through which a coolant source 640 can enter. The cover 624 also includes a coolant outlet 632 through which a coolant return 642 can exit. The volume 634 defines or includes a coolant flow path between the inlet 630 and the outlet 632 to form a heat transfer component in the top cap 622 or to form a heat transfer component of the top cap 622. As shown in this example, one or more heat transfer surfaces 636 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 634. The heat transfer surface 636 defines a channel 638 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the memory modules 614 and the processing devices 616) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray package 600 that do not include the heat transfer surface 636). Alternative embodiments of the server tray package 600 may include multiple inlets 630, multiple outlets 632, or may not include the heat transfer surface 636.

[0103] In an example operation in which the server tray package 600 cools data center electronic equipment (e.g., memory modules 614 and processing devices 616), the server tray package 600 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 600, the processing devices 616 and memory modules 614 generate heat that may need to be dissipated or removed from the server tray package 600 (e.g., for proper operation of the server tray package 600). The heat generated by the processing devices 616 and memory modules 614 is transferred to the vapor chamber 650 of the base 606 of the liquid cooling plate assembly 601 through the thermal interface material 618. The transferred heat is transferred to the fluid of the vapor chamber 650 through the thermal interface material 620. When heat is transferred to the fluid, the fluid can boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of the vapor chamber 650, where the heat is transferred to the bottom 628 of the top cap 622. When the heat is transferred to the bottom 628, the evaporated or boiling fluid condenses back into liquid form and falls back to the bottom of the vapor chamber 650.

[0104] The heat transferred to the bottom 628 of the top cap 622 is then transferred to a cooling liquid source 640 that circulates through the inlet 630 and enters the volume 634 of the top cap 622. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 600. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 640 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., memory modules 614 and processing devices 616).

[0105] In some examples, heat is transferred directly from the base 628 to the coolant source 640. Heat can also be transferred from the base 628 through one or more heat transfer surfaces 636 and then to the coolant source 640 flowing through the channels 638. The heated coolant source 640 circulates to the outlet 632 and exits the top cap 622 as a coolant return 642 (e.g., the temperature of the coolant return 642 is higher than the temperature of the coolant source 640). The coolant return 642 circulates back to, for example, the coolant source to remove heat from the return 642 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0106] Figure 7 A schematic cross-sectional side view of a portion of an example embodiment of a server tray package 700 including a liquid cooling plate assembly 701 disposed on a partial cover 706 is shown. In some embodiments, the server tray package 700 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Figure 7, the server tray package 700 includes a printed circuit board (e.g., motherboard 702) that supports one or more data center electronic devices; in this example, two or more voltage regulators 714, two or more capacitors 705, and one or more processing devices 716 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 702 can be mounted on a frame (not shown), which can include or simply be a flat structure that can be grasped by a technician to move the motherboard 702 into position and hold it in place within the rack 105. For example, the server tray package 700 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 700 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 702, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 702), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0107] In some examples, one motherboard 702 is mounted on the frame; alternatively, multiple motherboards 702 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 702 or the frame so that when the server tray enclosure 700 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 700 closer to the front of the rack 105, flows through the motherboard 702, flows through some data center electronic components on the motherboard 702, and when the server tray enclosure 700 is mounted in the rack 105, is exhausted from the server tray enclosure 700 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 702 or the frame by brackets.

[0108] As shown, the substrate 704 and one or more interposers 712 (e.g., silicon interposers) are located between the data center electronics (e.g., capacitors 705, voltage regulators 714, and processing devices 716) and the motherboard 702. For example, the substrate 704 provides an interface between the one or more data center electronics (e.g., processing devices 716) and the motherboard 702, such as by providing pins for electrical and communication interfaces. In this example, the substrate 704 can also provide a mounting location for one or more components of the liquid cooling plate assembly 701. For example, the interposer 712 provides a high bandwidth connection between the data center electronics (such as between the voltage regulator 714 and the processing device 716).

[0109] In the example of server tray package 700, data center electronics (e.g., capacitor 705, voltage regulator 714, and processing device 716) can have different sizes, and more specifically, different heights. For example, as shown, voltage regulator 714 can be relatively taller than processing device 716 (and capacitor 705) (e.g., 2 to 3 times taller). Additionally, in some aspects, data center electronics (e.g., capacitor 705, voltage regulator 714, and processing device 716) can generate different heat outputs during their respective operations. For example, in some aspects, processing device 716 can generate much more heat during operation than voltage regulator 714 (e.g., at least an order of magnitude more).

[0110] like Figure 7 , the liquid cooling plate assembly 701 includes a side 735 and a base 739. As shown, the side 735 extends from the base 739 and is thinner (e.g., a shorter vertical distance) than the base 739. In other words, different parts of the assembly can have different thickness dimensions. The figure also shows that the base 739 can have different thicknesses in different areas, for example, the area at the top of the voltage regulator 714 is thinner than the area above the processing device 716. The different thicknesses have the effect that the base can achieve a higher thermal conductivity in the latter area than in the former area, which is useful because, for example, the processing device may generate more heat than the voltage regulator. In addition, the different thickness dimensions provide the effect of accommodating devices of different heights (e.g., a processing device and a voltage regulator) of the assembly. Although not shown, from a top view, the liquid cooling plate assembly 701 can be a relatively square shape, wherein the side 735 is part of the peripheral area circumscribed with the base 739.

[0111] The cover 706 or a portion of the cover 706 is located on the base plate 704 and includes a hole through which the base 739 can extend when the liquid cooling plate assembly 701 is located on the cover 706. Although not shown, from a top view, the partial cover 706 can be in the shape of a square ring, wherein the hole is square in shape to allow the base 739 of the liquid cooling plate assembly to be inserted when the side 735 is located on the partial cover 706.

[0112] As shown, a partial cover 706 defines or encloses a volume 703 within which an interposer 712 and data center electronics (eg, capacitors 705 , voltage regulators 714 , and processing devices 716 ) mounted thereon are located in the server tray enclosure 700 . Figure 7It is shown that data center electronics (which may be, for example, processing equipment) may have different height dimensions. The terms height dimension and thickness dimension are used interchangeably herein. As shown in this example, thermal interface material 718 (e.g., phase change material or other thermally conductive material) is located in contact between the bottom side of a portion of cover 706 and the data center electronics (e.g., voltage regulator 714) to provide a conductive heat transfer interface between these components.

[0113] In this example embodiment, the side portion 735 is mounted to the top surface of the partial cover 706. When the side portion 735 is mounted to the top end of the partial cover 706, the base 739 (e.g., the bottom surface of the base 739) is positioned in thermal contact with the top surface of the processing device 716 through the phase change material (or other thermally conductive material) that provides a conductive heat transfer interface between the bottom of the base 739 and the processing device 716.

[0114] As shown in this example, the liquid cooling plate assembly 701 includes a cooling liquid inlet 730 through which a cooling liquid source 740 can enter. The liquid cooling plate assembly 701 also includes a cooling liquid outlet 732 through which a cooling liquid return 742 can exit. The volume 734 defines or includes a cooling liquid flow path between the inlet 730 and the outlet 732 to form a heat transfer component in the assembly 701 or to form a heat transfer component of the assembly 701. As shown in this example, one or more heat transfer surfaces 736 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 734. In this example, the heat transfer surface 736 extends from at or near the top inner surface of the assembly 701 to at or near the bottom inner surface of the base 739 of the assembly 701.

[0115] The heat transfer surface 736 defines a channel 738 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the voltage regulator 714 and the processing device 716) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray enclosure 700 that do not include the heat transfer surface 736). Alternative embodiments of the server tray enclosure 700 may include multiple inlets 730, multiple outlets 732, or may not include the heat transfer surface 736.

[0116] In an example operation in which the server tray package 700 cools data center electronic equipment (e.g., voltage regulator 714 and processing device 716), the server tray package 700 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 700, the processing device 716 and the voltage regulator 714 generate heat that may need to be dissipated or removed from the server tray package 700 (e.g., for proper operation of the server tray package 700). The heat generated by the processing device 716 is transferred to the base 739 of the liquid cooling plate assembly 701 through the thermal interface material 718. The heat generated by the voltage regulator 714 is transferred to the side 735 of the liquid cooling plate assembly 701 through the thermal interface material 718, through the portion of the cover 706. In some examples, one or more components of the liquid cooling plate assembly 701 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0117] Heat transferred to the base 739 and sides 735 of the liquid cooling plate assembly 701 is then transferred to a cooling liquid source 740 that circulates through the inlet 730 and into the volume 734 of the liquid cooling plate assembly 701. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 700. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 740 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., voltage regulators 714 and processing equipment 716).

[0118] In some examples, heat is transferred directly from the base 739 to the coolant source 740. Heat can also be transferred from the base 739 through one or more heat transfer surfaces 736 (in this example, confined to the base 739) and then to the coolant source 740 flowing through the channels 738. The heated coolant source 740 circulates to the outlet 732 and exits the liquid cold plate assembly 701 as a coolant return 742 (e.g., the temperature of the coolant return 742 is higher than the temperature of the coolant source 740). The coolant return 742 circulates back to, for example, the coolant source to remove heat from the return 742 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0119] Figure 8 A schematic cross-sectional side view of a portion of an example embodiment of a server tray package 800 including a liquid cooling plate assembly 801 disposed on a partial cover 806 is shown. In some embodiments, the server tray package 800 can be used as Figure 1One or more server rack subassemblies 110 are shown in FIG. Figure 8 , the server tray package 800 includes a printed circuit board (e.g., motherboard 802) that supports one or more data center electronic devices; in this example, two or more voltage regulators 814, two or more capacitors 805, and one or more processing devices 816 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 802 can be mounted on a frame (not shown), which may include or simply be a flat structure that can be grasped by a technician to move the motherboard 802 into position and hold it in place within the rack 105. For example, the server tray package 800 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 800 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 802, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 802), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0120] In some examples, one motherboard 802 is mounted on the frame; alternatively, multiple motherboards 802 may be mounted on the frame as needed for a particular application. In some implementations, one or more fans (not shown) may be placed on the motherboard 802 or the frame so that when the server tray enclosure 800 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 800 closer to the front of the rack 105, flows through the motherboard 802, flows through some data center electronic components on the motherboard 802, and when the server tray enclosure 800 is mounted in the rack 105, is exhausted from the server tray enclosure 800 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 802 or the frame by brackets.

[0121] As shown, the substrate 804 and one or more interposers 812 (e.g., silicon interposers) are located between the data center electronics (e.g., capacitors 805, voltage regulators 814, and processing devices 816) and the motherboard 802. For example, the substrate 804 provides an interface between the one or more data center electronics (e.g., processing devices 816) and the motherboard 802, such as by providing pins for electrical and communication interfaces. In this example, the substrate 804 can also provide a mounting location for one or more components of the liquid cooling plate assembly 801. For example, the interposer 812 provides a high bandwidth connection between the data center electronics (such as between the voltage regulator 814 and the processing device 816).

[0122] In the example of server tray package 800, data center electronics (e.g., capacitor 805, voltage regulator 814, and processing device 816) can have different sizes, and more specifically, different heights. For example, as shown, voltage regulator 814 can be relatively taller than processing device 816 (and capacitor 805) (e.g., 2 to 3 times taller). Additionally, in some aspects, data center electronics (e.g., capacitor 805, voltage regulator 814, and processing device 816) can generate different heat outputs during their respective operations. For example, in some aspects, processing device 816 can generate much more heat during operation than voltage regulator 814 (e.g., at least an order of magnitude more).

[0123] like Figure 8 , the liquid cooling plate assembly 801 includes a side portion 835 and a base portion 839. As shown, the side portion 835 extends from the base portion 839 and is thinner (e.g., shorter vertically) than the base portion 839. Although not shown, from a top view, the liquid cooling plate assembly 801 can be a relatively square shape, wherein the side portion 835 is a portion of a peripheral area circumscribed with the base portion 839.

[0124] The cover 806 or a portion of the cover 806 is located on the base plate 804 and includes a hole through which the base 839 can extend when the liquid cooling plate assembly 801 is located on the cover 806. Although not shown, from a top view, the partial cover 806 can be in the shape of a square ring, wherein the hole is square in shape to allow the base 839 of the liquid cooling plate assembly to be inserted when the side 835 is located on the partial cover 806.

[0125] As shown, a partial cover 806 defines or encloses a volume 803 within which an interposer 812 and data center electronics (e.g., capacitor 805, voltage regulator 814, and processing device 816) (mounted thereon) are located in the server tray package 800. As shown in this example, a thermal interface material 818 (e.g., phase change material or other thermally conductive material) is located in contact between the bottom side of the partial cover 806 and the data center electronics (e.g., voltage regulator 814) to provide a conductive heat transfer interface between these components.

[0126] In this example embodiment, the side portion 835 is mounted to the top surface of the partial cover 806. When the side portion 835 is mounted to the top end of the partial cover 806, the base 839 (e.g., the bottom surface of the base 839) is positioned in thermal contact with the top surface of the processing device 816 via a phase change material (or other thermally conductive material) that provides a conductive heat transfer interface between the bottom of the base 839 and the processing device 816. In some embodiments, different thermal interface materials can be located between the data center electronics and the base 839 or the bottom surface of the partial cover 806. In some aspects, the thermal interface material can be composed of different materials that can have different thermal conductivities and thus can more efficiently dissipate heat from the equipment to the cold plate assembly depending on the heat generation of the underlying data center electronics.

[0127] As shown in this example, the liquid cooling plate assembly 801 includes a cooling liquid inlet 830 through which a cooling liquid source 840 can enter. The liquid cooling plate assembly 801 also includes a cooling liquid outlet 832 through which a cooling liquid return 842 can exit. The volume 834 defines or includes a cooling liquid flow path between the inlet 830 and the outlet 832 to form a heat transfer component in the assembly 801 or to form a heat transfer component of the assembly 801. As shown in this example, one or more heat transfer surfaces 836 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 834. In this example, the heat transfer surface 836 extends from at or near the top inner surface of the assembly 801 to at or near the bottom inner surface of the base 839 of the assembly 801. Therefore, in this example, the volume 834 (and the heat transfer surface 836) has a substantially uniform height between the inlet 830 and the outlet 832.

[0128] The heat transfer surface 836 defines a channel 838 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the voltage regulator 814 and the processing device 816) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray enclosure 800 that do not include the heat transfer surface 836). Alternative embodiments of the server tray enclosure 800 may include multiple inlets 830, multiple outlets 832, or may not include the heat transfer surface 836.

[0129] In an example operation in which the server tray package 800 cools data center electronic equipment (e.g., voltage regulator 814 and processing device 816), the server tray package 800 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 800, the processing device 816 and the voltage regulator 814 generate heat that may need to be dissipated or removed from the server tray package 800 (e.g., for proper operation of the server tray package 800). The heat generated by the processing device 816 is transferred to the base 839 of the liquid cooling plate assembly 801 through the thermal interface material 818. The heat generated by the voltage regulator 814 is transferred to the side 835 of the liquid cooling plate assembly 801 through the thermal interface material 818, through the portion of the cover 806. In some examples, one or more components of the liquid cooling plate assembly 801 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0130] Heat transferred to the base 839 and sides 835 of the liquid cooling plate assembly 801 is then transferred to a cooling liquid source 840 that circulates through the inlet 830 and into the volume 834 of the liquid cooling plate assembly 801. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 800. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 840 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., voltage regulators 814 and processing equipment 816).

[0131] In some examples, heat is transferred directly from the base 839 to the coolant source 840. Heat can also be transferred from the base 839 through one or more heat transfer surfaces 836 (in this example, confined to the base 839, but only to the height of the volume 834), and then transferred to the coolant source 840 flowing through the channel 838. The heated coolant source 840 circulates to the outlet 832 and exits the liquid cold plate assembly 801 as a coolant return 842 (e.g., the temperature of the coolant return 842 is higher than the temperature of the coolant source 840). The coolant return 842 circulates back to, for example, the coolant source to remove heat from the return 842 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0132] Fig. 9 A schematic cross-sectional side view of a portion of another example embodiment of a server tray enclosure 900 including a liquid cooling plate assembly 901 disposed on a partial cover 906 is shown. In some embodiments, the server tray enclosure 900 may be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Fig. 9 , the server tray package 900 includes a printed circuit board (e.g., motherboard 902) that supports one or more data center electronic devices; in this example, two or more voltage regulators 914, two or more capacitors 905, and one or more processing devices 916 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 902 can be mounted on a frame (not shown), which can include or simply be a flat structure that can be grasped by a technician to move the motherboard 902 into position and hold it in place within the rack 105. For example, the server tray package 900 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 900 - much like sliding a lunch tray into a cafeteria rack. The frame can extend below the motherboard 902, or can have other forms (e.g., by implementing it as a peripheral frame around the motherboard 902), or can be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat panel or include one or more side walls projecting upwardly from the edge of the flat panel, and the flat panel may be the floor of a closed-top or open-top box or cage.

[0133] In some examples, one motherboard 902 is mounted on the frame; alternatively, multiple motherboards 902 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 902 or the frame so that when the server tray enclosure 900 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 900 closer to the front of the rack 105, flows through the motherboard 902, flows through some data center electronic components on the motherboard 902, and when the server tray enclosure 900 is mounted in the rack 105, is exhausted from the server tray enclosure 900 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 902 or the frame by brackets.

[0134] As shown, the substrate 904 and one or more interposers 912 (e.g., silicon interposers) are located between the data center electronics (e.g., capacitors 905, voltage regulators 914, and processing devices 916) and the motherboard 902. For example, the substrate 904 provides an interface between the one or more data center electronics (e.g., processing devices 916) and the motherboard 902, such as by providing pins for electrical and communication interfaces. In this example, the substrate 904 can also provide a mounting location for one or more components of the liquid cooling plate assembly 901. For example, the interposer 912 provides a high bandwidth connection between the data center electronics (such as between the voltage regulator 914 and the processing device 916).

[0135] In the example of server tray package 900, data center electronics (e.g., capacitor 905, voltage regulator 914, and processing device 916) can have different sizes, and more specifically, different heights. For example, as shown, voltage regulator 914 can be relatively taller than processing device 916 (and capacitor 905) (e.g., 2 to 3 times taller). Additionally, in some aspects, data center electronics (e.g., capacitor 905, voltage regulator 914, and processing device 916) can generate different heat outputs during their respective operations. For example, in some aspects, processing device 916 can generate much more heat during operation than voltage regulator 914 (e.g., at least an order of magnitude more).

[0136] like Fig. 9 , the liquid cooling plate assembly 901 includes a side portion 935 and a base portion 939. As shown, the side portion 935 extends from the base portion 939 and is thinner (e.g., shorter vertically) than the base portion 939. Although not shown, from a top view, the liquid cooling plate assembly 901 can be a relatively square shape, wherein the side portion 935 is a portion of a peripheral area circumscribed with the base portion 939.

[0137] The cover 906 or a portion of the cover 906 is located on the base plate 904 and includes a hole through which the base 939 can extend when the liquid cooling plate assembly 901 is located on the cover 906. Although not shown, from a top view, the partial cover 906 can be in the shape of a square ring, wherein the hole is square in shape to allow the base 939 of the liquid cooling plate assembly to be inserted when the side 935 is located on the partial cover 906.

[0138] As shown, a partial cover 906 defines or encloses a volume 903 within which an interposer 912 and data center electronics (e.g., capacitors 905, voltage regulators 914, and processing devices 916) (mounted thereon) are located in the server tray package 900. As shown in this example, a thermal interface material 918 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the partial cover 906 and the data center electronics (e.g., voltage regulators 914) to provide a conductive heat transfer interface between these components.

[0139] In this example embodiment, the side portion 935 is mounted to the top surface of the partial cover 906. When the side portion 935 is mounted to the top end of the partial cover 906, the base 939 (e.g., the bottom surface of the base 939) is positioned in thermal contact with the top surface of the processing device 916 through the phase change material (or other thermally conductive material) that provides a conductive heat transfer interface between the bottom of the base 939 and the processing device 916.

[0140] As shown in this example, the liquid cooling plate assembly 901 includes a cooling liquid inlet 930 through which a cooling liquid source 940 can enter. The liquid cooling plate assembly 901 also includes a cooling liquid outlet 932 through which a cooling liquid return 942 can exit. The volume 934 defines or includes a cooling liquid flow path between the inlet 930 and the outlet 932 to form a heat transfer component in the assembly 901 or to form a heat transfer component of the assembly 901. As shown in this example, one or more heat transfer surfaces 936 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 934. In this example, the heat transfer surface 936 extends from at or near the top inner surface of the assembly 901 to at or near the bottom inner surface of the base 939 of the assembly 901. Therefore, in this example, the volume 934 (and the heat transfer surface 936) has a substantially uniform height between the inlet 930 and the outlet 932. Furthermore, as shown in this example, the heat transfer surface extends from at or near inlet 930 to at or near outlet 932 .

[0141] The heat transfer surface 936 defines a channel 938 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., voltage regulator 914 and processing device 916) to the cooling liquid (e.g., relative to the amount transferred in an embodiment of the server tray enclosure 900 that does not include the heat transfer surface 936). Alternative embodiments of the server tray enclosure 900 may include multiple inlets 930, multiple outlets 932, or may not include the heat transfer surface 936.

[0142] In an example operation in which the server tray package 900 cools data center electronic equipment (e.g., voltage regulator 914 and processing device 916), the server tray package 900 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 900, the processing device 916 and the voltage regulator 914 generate heat that may need to be dissipated or removed from the server tray package 900 (e.g., for proper operation of the server tray package 900). The heat generated by the processing device 916 is transferred to the base 939 of the liquid cooling plate assembly 901 through the thermal interface material 918. The heat generated by the voltage regulator 914 is transferred to the side 935 of the liquid cooling plate assembly 901 through the thermal interface material 918, through the portion of the cover 906. In some examples, one or more components of the liquid cooling plate assembly 901 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0143] Heat transferred to the base 939 and sides 935 of the liquid cooling plate assembly 901 is then transferred to a cooling liquid source 940 that circulates through the inlet 930 and into the volume 934 of the liquid cooling plate assembly 901. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 900. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 940 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., voltage regulators 914 and processing equipment 916).

[0144] In some examples, heat is transferred directly from the base 939 to the coolant source 940. Heat can also be transferred from the base 939 through one or more heat transfer surfaces 936 (in this example, extending through the volume 934 between the inlet 930 and the outlet 932), and then transferred to the coolant source 940 flowing through the channel 938. The heated coolant source 940 circulates to the outlet 932 and exits the liquid cold plate assembly 901 as a coolant return 942 (e.g., the temperature of the coolant return 942 is higher than the temperature of the coolant source 940). The coolant return 942 circulates back to, for example, the coolant source to remove heat from the return 942 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0145] Fig.10 A schematic cross-sectional side view of a portion of another example embodiment of a server tray package 1000 including a liquid cooling plate assembly 1001 disposed on a partial cover 1006 is shown. In some embodiments, the server tray package 1000 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Fig.10 , the server tray package 1000 includes a printed circuit board (e.g., motherboard 1002) that supports one or more data center electronic devices; in this example, two or more voltage regulators 1014, two or more capacitors 1005, and one or more processing devices 1016 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 1002 can be mounted on a frame (not shown) that can include or simply be a flat structure that can be grasped by a technician to move the motherboard 1002 into position and hold it in place within the rack 105. For example, the server tray package 1000 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 1000 - much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 1002, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 1002), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more side walls that protrude upward from the edge of the flat plate, and the flat plate may be the bottom plate of a closed-top or open-top box or cage.

[0146] In some examples, one motherboard 1002 is mounted on the frame; alternatively, multiple motherboards 1002 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 1002 or the frame so that when the server tray enclosure 1000 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 1000 closer to the front of the rack 105, flows through the motherboard 1002, flows through some data center electronic components on the motherboard 1002, and when the server tray enclosure 1000 is mounted in the rack 105, is exhausted from the server tray enclosure 1000 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 1002 or the frame by brackets.

[0147] As shown, the substrate 1004 and one or more interposers 1012 (e.g., silicon interposers) are located between the data center electronics (e.g., capacitors 1005, voltage regulators 1014, and processing devices 1016) and the motherboard 1002. For example, the substrate 1004 provides an interface between the one or more data center electronics (e.g., processing devices 1016) and the motherboard 1002, such as by providing pins for electrical and communication interfaces. In this example, the substrate 1004 can also provide a mounting location for one or more components of the liquid cooling plate assembly 1001. For example, the interposer 1012 provides a high bandwidth connection between the data center electronics (such as between the voltage regulator 1014 and the processing device 1016).

[0148] In the example of server tray package 1000, data center electronics (e.g., capacitor 1005, voltage regulator 1014, and processing device 1016) can have different sizes, and more specifically, different heights. For example, as shown, voltage regulator 1014 can be relatively taller than processing device 1016 (and capacitor 1005) (e.g., 2 to 3 times taller). Additionally, in some aspects, data center electronics (e.g., capacitor 1005, voltage regulator 1014, and processing device 1016) can generate different heat outputs during their respective operations. For example, in some aspects, processing device 1016 can generate much more heat during operation than voltage regulator 1014 (e.g., at least an order of magnitude more).

[0149] like Fig.10, the liquid cooling plate assembly 1001 includes a side portion 1035 and a base 10310. As shown, the side portion 1035 extends from the base 10310 and is thinner (e.g., shorter vertically) than the base 10310. Although not shown, from a top view, the liquid cooling plate assembly 1001 can be a relatively square shape, wherein the side portion 1035 is part of a peripheral area circumscribed with the base 1039.

[0150] The cover 1006 or a portion of the cover 1006 is located on the base plate 1004 and includes a hole through which the base 1039 can extend when the liquid cooling plate assembly 1001 is located on the cover 1006. Although not shown, from a top view, the partial cover 1006 can be in the shape of a square ring, wherein the hole is square in shape to allow the base 1039 of the liquid cooling plate assembly to be inserted when the side 1035 is located on the partial cover 1006.

[0151] As shown, a partial cover 1006 defines or encloses a volume 1003 within which an interposer 1012 and data center electronics (e.g., capacitors 1005, voltage regulators 1014, and processing devices 1016) (mounted thereon) are located in the server tray package 1000. As shown in this example, a thermal interface material 1018 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the partial cover 1006 and the data center electronics (e.g., voltage regulators 1014) to provide a conductive heat transfer interface between these components.

[0152] In this example embodiment, the side portion 1035 is mounted to the top surface of the partial cover 1006. When the side portion 1035 is mounted to the top end of the partial cover 1006, the base 1039 (e.g., the bottom surface of the base 1039) is positioned in thermal contact with the top surface of the processing device 1016 through the phase change material (or other thermally conductive material) that provides a conductive heat transfer interface between the bottom of the base 1039 and the processing device 1016.

[0153] As shown in this example, the liquid cooling plate assembly 1001 includes a cooling liquid inlet 1030 through which a cooling liquid source 1040 can enter a central location of the assembly 1001 in this example. The liquid cooling plate assembly 1001 also includes cooling liquid outlets 1032a and 1032b located at opposite edges of the side 1035 through which cooling liquid returns 1042a and 1042b can exit. The volume 1034 defines or includes a cooling liquid flow path between the inlet 1030 and the outlets 1032a and 1032b to form a heat transfer component in the assembly 1001 or to form a heat transfer component of the assembly 1001. As shown in this example, one or more heat transfer surfaces 1036 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 1034. In this example, the heat transfer surface 1036 extends from at or near the top inner surface of the component 1001 to at or near the bottom inner surface of the base 1039 of the component 1001. Thus, in this example, the volume 1034 (and the heat transfer surface 1036) has a substantially uniform height between the inlet 1030 and the outlets 1032a and 1032b. Furthermore, as shown in this example, the heat transfer surface extends from at or near the inlet 1030 to at or near the outlets 1032a and 1032b.

[0154] The heat transfer surface 1036 defines a channel 1038 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the voltage regulator 1014 and the processing device 1016) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray package 1000 that do not include the heat transfer surface 1036). Alternative embodiments of the server tray package 1000 may include multiple inlets 1030, multiple outlets 1032, or may not include the heat transfer surface 1036.

[0155] In an example operation in which the server tray package 1000 cools data center electronic equipment (e.g., voltage regulator 1014 and processing device 1016), the server tray package 1000 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 1000, the processing device 1016 and the voltage regulator 1014 generate heat that may need to be dissipated or removed from the server tray package 1000 (e.g., for proper operation of the server tray package 1000). The heat generated by the processing device 1016 is transferred to the base 1039 of the liquid cooling plate assembly 1001 through the thermal interface material 1018. The heat generated by the voltage regulator 1014 is transferred to the side 1035 of the liquid cooling plate assembly 1001 through the thermal interface material 1018, through the portion of the cover 1006. In some examples, one or more components of the liquid cooling plate assembly 1001 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0156] Heat transferred to the base 1039 and sides 1035 of the liquid cooling plate assembly 1001 is then transferred to a cooling liquid source 1040 that circulates through the inlet 1030 and into the volume 1034 of the liquid cooling plate assembly 1001. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 1000. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 1040 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., the voltage regulator 1014 and the processing equipment 1016).

[0157] In some examples, heat is transferred directly from the base 1039 to the coolant source 1040. Heat can also be transferred from the base 1039 through one or more heat transfer surfaces 1036 (in this example, extending through the volume 1034 between the inlet 1030 and the outlets 1032a and 1032b), and then transferred to the coolant source 1040 flowing through the channels 1038. The heated coolant source 1040 circulates to the outlets 1032a and 1032b and exits the liquid cold plate assembly 1001 as coolant returns 1042a and 1042b (e.g., the temperature of the coolant returns 1042a and 1042b is higher than the temperature of the coolant source 1040). The coolant returns 1042a and 1042b circulate back to, for example, the coolant source to remove heat from the outlets 1032a and 1032b (e.g., in a chiller, cooling tower, or other heat exchanger).

[0158] Fig.11A schematic cross-sectional side view of a portion of another example embodiment of a server tray package 1100 including a liquid cooling plate assembly 1101 disposed on a partial cover 1106 is shown. In some embodiments, the server tray package 1100 can be used as Figure 1 One or more server rack subassemblies 110 are shown in FIG. Fig.11 , the server tray package 1100 includes a printed circuit board (e.g., motherboard 1102) that supports one or more data center electronic devices; in this example, two or more voltage regulators 1114, two or more capacitors 1105, and one or more processing devices 1116 (e.g., one or more application specific integrated circuits (ASICs)). In some aspects, the motherboard 1102 can be mounted on a frame (not shown) that can include or simply be a flat structure that can be grasped by a technician to move the motherboard 1102 into position and hold it in place within the rack 105. For example, the server tray package 1100 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and over a pair of rails in the rack 105 on opposite sides of the server tray package 1100 - much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 1102, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 1102), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more side walls that protrude upward from the edge of the flat plate, and the flat plate may be the bottom plate of a closed-top or open-top box or cage.

[0159] In some examples, one motherboard 1102 is mounted on the frame; alternatively, multiple motherboards 1102 may be mounted on the frame as needed for a particular application. In some embodiments, one or more fans (not shown) may be placed on the motherboard 1102 or the frame so that when the server tray enclosure 1100 is mounted in the rack 105, air enters at the front edge of the server tray enclosure 1100 closer to the front of the rack 105, flows through the motherboard 1102, flows through some data center electronic components on the motherboard 1102, and when the server tray enclosure 1100 is mounted in the rack 105, is exhausted from the server tray enclosure 1100 at the rear edge closer to the rear of the rack 105. The one or more fans may be secured to the motherboard 1102 or the frame by brackets.

[0160] As shown, the substrate 1104 and one or more interposers 1112 (e.g., silicon interposers) are located between the data center electronics (e.g., capacitors 1105, voltage regulators 1114, and processing devices 1116) and the motherboard 1102. For example, the substrate 1104 provides an interface between the one or more data center electronics (e.g., processing devices 1116) and the motherboard 1102, such as by providing pins for electrical and communication interfaces. In this example, the substrate 1104 can also provide a mounting location for one or more components of the liquid cooling plate assembly 1101. For example, the interposer 1112 provides a high bandwidth connection between the data center electronics (such as between the voltage regulator 1114 and the processing device 1116).

[0161] In the example of server tray package 1100, data center electronics (e.g., capacitor 1105, voltage regulator 1114, and processing device 1116) can have different sizes, and more specifically, different heights. For example, as shown, voltage regulator 1114 can be relatively taller than processing device 1116 (and capacitor 1105) (e.g., 2 to 3 times taller). Additionally, in some aspects, data center electronics (e.g., capacitor 1105, voltage regulator 1114, and processing device 1116) can generate different heat outputs during their respective operations. For example, in some aspects, processing device 1116 can generate much more heat during operation than voltage regulator 1114 (e.g., at least an order of magnitude more).

[0162] like Fig.11 , the liquid cooling plate assembly 1101 includes a side portion 1135 and a base portion 1139. As shown, the side portion 1135 extends from the base portion 1139 and is thinner (e.g., shorter vertically) than the base portion 1139. Although not shown, from a top view, the liquid cooling plate assembly 1101 can be a relatively square shape, wherein the side portion 1135 is part of a peripheral area circumscribed with the base portion 1139.

[0163] The cover 1106 or a portion of the cover 1106 is located on the base plate 1104 and includes a hole through which the base 1139 can extend when the liquid cooling plate assembly 1101 is located on the cover 1106. As shown in this example, the partial cover does not contact the top surface of the voltage regulator 1114 (e.g., through the phase change material), but is shaped as a ring. Although not shown, from a top view, the partial cover 1106 can be in the shape of a square ring, wherein the hole is square in shape to allow the base 1139 of the liquid cooling plate assembly to be inserted when the side 1135 is located on the partial cover 1106.

[0164] As shown, a partial cover 1106 defines or encloses a volume 1103 in which an interposer 1112 and data center electronics (e.g., capacitors 1105, voltage regulators 1114, and processing devices 1116) (mounted thereon) are located in the server tray package 1100. As shown in this example, a thermal interface material 1118 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the side 1135 and the voltage regulator 1114 to provide a conductive heat transfer interface between these components.

[0165] In this example embodiment, the side portion 1135 is mounted to the top surface of the voltage regulator 1114. When the side portion 1135 is mounted to the top of the voltage regulator 1114, the base 1139 (e.g., the bottom surface of the base 1139) is positioned in thermal contact with the top surface of the processing device 1116 through the phase change material (or other thermally conductive material) that provides a conductive heat transfer interface between the bottom of the base 1139 and the processing device 1116.

[0166] As shown in this example, the liquid cooling plate assembly 1101 includes a cooling liquid inlet 1130 through which a cooling liquid source 1140 can enter. The liquid cooling plate assembly 1101 also includes a cooling liquid outlet 1132 through which a cooling liquid return 1142 can exit. The volume 1134 defines or includes a cooling liquid flow path between the inlet 1130 and the outlet 1132 to form a heat transfer component in the assembly 1101 or to form a heat transfer component of the assembly 1101. As shown in this example, one or more heat transfer surfaces 1136 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 1134. In this example, the heat transfer surface 1136 extends from at or near the top inner surface of the assembly 1101 to at or near the bottom inner surface of the base 1139 of the assembly 1101.

[0167] The heat transfer surface 1136 defines a channel 1138 through which, for example, a cooling liquid can be circulated to increase the amount of heat transferred from the data center electronics (e.g., the voltage regulator 1114 and the processing device 1116) to the cooling liquid (e.g., relative to the amount transferred in embodiments of the server tray enclosure 1100 that do not include the heat transfer surface 1136). Alternative embodiments of the server tray enclosure 1100 may include multiple inlets 1130, multiple outlets 1132, or may not include the heat transfer surface 1136.

[0168] In an example operation in which the server tray package 1100 cools data center electronic equipment (e.g., voltage regulator 1114 and processing device 1116), the server tray package 1100 can be deployed, for example, in a data center server rack 105 in a data center. During operation of the server tray package 1100, the processing device 1116 and the voltage regulator 1114 generate heat that may need to be dissipated or removed from the server tray package 1100 (e.g., for proper operation of the server tray package 1100). The heat generated by the processing device 1116 is transferred to the base 1139 of the liquid cooling plate assembly 1101 through the thermal interface material 1118. The heat generated by the voltage regulator 1114 is transferred to the side 1135 of the liquid cooling plate assembly 1101 through the thermal interface material 1118. In some examples, one or more components of the liquid cooling plate assembly 1101 can be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

[0169] Heat transferred to the base 1139 and sides 1135 of the liquid cooling plate assembly 1101 is then transferred to a cooling liquid source 1140 that circulates through the inlet 1130 and into the volume 1134 of the liquid cooling plate assembly 1101. In some examples, the cooling liquid can be cooling water or ethylene glycol, such as from one or more chillers fluidly coupled to the server tray enclosure 1100. In alternative examples, the cooling liquid can be condenser water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the cooling liquid can be a dielectric single-phase or two-phase fluid. In any case, the cooling liquid source 1140 can be at an appropriate temperature and flow rate to remove the desired heat from the data center electronic equipment (e.g., voltage regulators 1114 and processing equipment 1116).

[0170] In some examples, heat is transferred directly from the base 1139 to the cooling liquid source 1140. Heat can also be transferred from the base 1139 through one or more heat transfer surfaces 1136 (in this example, confined to the base 1139) and then to the cooling liquid source 1140 flowing through the channels 1138. The heated cooling liquid source 1140 circulates to the outlet 1132 and exits the liquid cold plate assembly 1101 as a cooling liquid return 1142 (e.g., the temperature of the cooling liquid return 1142 is higher than the temperature of the cooling liquid source 1140). The cooling liquid return 1142 circulates back to, for example, the cooling liquid source to remove heat from the return 1142 (e.g., in a chiller, cooling tower, or other heat exchanger).

[0171] Several embodiments have been described. However, it should be understood that various modifications may be made without departing from the spirit and scope of what is described. For example, the steps of the example operations of the example methods and processes described herein may be performed in other orders, some steps may be removed, and other steps may be added. Therefore, other embodiments are within the scope of the following claims.

Claims

1. A server tray package (700), characterized in that: include: a motherboard assembly (702) comprising a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device (716), the at least one heat generating processor device having a height less than a corresponding height of at least another data center electronic device (714) of the plurality of data center electronic devices; as well as A liquid cooling plate assembly (701), the liquid cooling plate assembly comprising: a base mounted to the motherboard assembly (702), the base and motherboard assembly defining a volume (703) at least partially surrounding the plurality of data center electronic devices, wherein the base further includes a cover (706); and A top cap is mounted to the base and includes a heat transfer member, the heat transfer member including an inlet end (730) and an outlet end (732) in fluid communication with a coolant flow path (734) defined through the heat transfer member, the heat transfer member including a first portion and a second portion (739), the first portion being in thermal contact with at least one other of the plurality of data center electronic devices through the cover and a first thermal interface material between the at least one other of the plurality of data center electronic devices (714) and the cover, the first portion having a first thickness dimension, the second portion being in thermal contact with the at least one heat generating processor device (716) through a second thermal interface material between the at least one heat generating processor device and the second portion of the top cap, the second portion having a second thickness dimension greater than the first thickness dimension, wherein the cover includes a hole therethrough, the hole being sized to accommodate the second portion (739) of the top cap.

2. The server tray package according to claim 1, characterized in that: The liquid cooling plate assembly further includes a plurality of heat transfer surfaces (736) enclosed within the cooling liquid flow path (734).

3. The server tray package according to claim 2, characterized in that: The heat transfer surface (736) is located in the volume of the top hat defined by the second portion (739).

4. The server tray package according to claim 3, characterized in that: The heat transfer surface (736) extends from a bottom inner surface of the second portion (739) of the top cap to at or near a top inner surface of the top cap, and the coolant flow path includes a first height in the first portion of the top cap that is less than a second height in the second portion (739) of the top cap.

5. The server tray package according to claim 3, characterized in that: The heat transfer surface (736) extends from a bottom inner surface of the second portion (739) of the top cap to at or near a top inner surface of the top cap, and the coolant flow path (734) includes a first height in the first portion of the top cap that is equal to a second height in the second portion of the top cap.

6. The server tray package according to claim 1, characterized in that: The heat transfer surface (736) is located in the first portion and the second portion of the top hat.

7. The server tray package according to claim 1, characterized in that: The cover is in thermal contact between the first portion of the top cap and the other data center electronic device (714) of the plurality of data center electronic devices; or The first portion of the top cap includes a peripheral portion, and the second portion of the top cap includes an interior bounded by the peripheral portion; or The other one of the plurality of data center electronic devices (714) includes a voltage regulator.

8. A method for cooling heat generating equipment in a data center, characterized in that: include: Circulating a cooling fluid flow to a server tray enclosure (700), the server tray enclosure comprising: a motherboard assembly (702) comprising a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device (716), the at least one heat generating processor device having a height less than a corresponding height of at least another data center electronic device (714) of the plurality of data center electronic devices; and A liquid cooling plate assembly (701), the liquid cooling plate assembly comprising: a base mounted to the motherboard assembly (702), the base and motherboard assembly defining a volume (703) at least partially surrounding the plurality of data center electronic devices, wherein the base further includes a cover (706); and a top cap mounted to the base and comprising a heat transfer member, the heat transfer member comprising an inlet end (730) and an outlet end (732) in fluid communication with a coolant flow path (734) defined through the heat transfer member, the heat transfer member comprising a first portion and a second portion (739), the first portion being in thermal contact with at least one other of the plurality of data center electronic devices through the cover and a first thermal interface material between the at least one other of the plurality of data center electronic devices (714) and the cover, the first portion having a first thickness dimension, the second portion being in thermal contact with the at least one heat generating processor device (716) through a second thermal interface material between the at least one heat generating processor device (716) and the second portion of the top cap, the second portion having a second thickness dimension greater than the first thickness dimension, wherein the cover comprises a hole therethrough, the hole being sized to receive the second portion (739) of the top cap; circulate a coolant flow into an inlet end of the heat transfer member (730); circulate the coolant flow from the inlet end through a coolant flow path (734) defined through a first portion of the heat transfer member; receiving heat from another data center electronic device of the plurality of data center electronic devices into the cooling fluid flowing through the first portion of the heat transfer member; circulating the coolant flow from the inlet end through the coolant flow path defined through the second portion of the heat transfer member; receiving heat from a heat generating process device into the coolant flowing through the second portion of the heat transfer member; and The heated coolant flow is circulated from the coolant flow path to the outlet end (732) of the heat transfer member.

9. The method according to claim 8, characterized in that The liquid cooling plate assembly further includes a plurality of heat transfer surfaces (736) enclosed within the cooling liquid flow path; and The heat transfer surface is located in the volume of the top hat defined by the second portion (739).

10. The method according to claim 9, characterized in that the heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap, and the coolant flow path includes a first height in the first portion of the top cap that is less than a second height in the second portion of the top cap; or The heat transfer surface extends from a bottom inner surface of the second portion of the top cap to at or near a top inner surface of the top cap, and the coolant flow path includes a first height in the first portion of the top cap that is equal to a second height in the second portion of the top cap.

11. The method according to claim 8, characterized in that The heat transfer surfaces are located in the first portion and the second portion of the top hat.

12. The method according to claim 8, characterized in that The cover is in thermal transfer contact between the first portion of the top cap and the other data center electronic device of the plurality of data center electronic devices.

13. The method according to claim 8, characterized in that The first portion of the top cap includes a peripheral portion, and the second portion of the top cap includes an interior bounded by the peripheral portion; or The other one of the plurality of data center electronic devices (714) includes a voltage regulator.

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