A cutting system and method for solar silicon wafers

Abstract

This invention provides a solar silicon wafer cutting system, including a vertical feeding device, a horizontal moving device, a follow-up liquid supply device, a coolant spraying device, and a mounting bracket. The vertical feeding device is connected to the horizontal moving device, and the mounting bracket is movably connected to the horizontal moving device, facilitating movement of the mounting bracket in both vertical and horizontal directions. The follow-up liquid supply device is connected to the horizontal moving device, and the coolant spraying device is connected to the follow-up liquid supply device, providing and spraying coolant during the silicon ingot cutting process. The beneficial effect of this invention is that the presence of both a vertical feeding device and a horizontal moving device allows the monocrystalline silicon ingot to be fed downwards and moved horizontally simultaneously during the cutting process, increasing resistance during diamond wire cutting and improving diamond wire cutting capability.

Description

Technical Field

[0001] This invention belongs to the field of solar silicon wafer production technology, and in particular relates to a cutting system and cutting method for solar silicon wafers. Background Technology

[0002] Currently, the solar wafer slicing market primarily utilizes diamond wire cutting. This works by winding diamond wire around two main rollers, which rotate reciprocally to cut the silicon ingot as it is fed downwards, ultimately forming a silicon wafer. With increasing market cost pressures, the focus is on further reducing costs and increasing efficiency, aiming to improve wafer output per kilogram. However, as the steel wire becomes increasingly thinner, its cutting capacity is limited, and existing equipment methods cannot continue to improve wire cutting capabilities. Summary of the Invention

[0003] In view of the above problems, the present invention aims to provide a cutting system and method for solar silicon wafers, which is particularly suitable for use with diamond wire cutting machines. It has a vertical feeding device and a horizontal moving device, so that the monocrystalline silicon rod is fed downward and moved horizontally at the same time during the cutting process, thereby increasing the resistance during the diamond wire cutting process and improving the diamond wire cutting capability.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a solar silicon wafer cutting system, comprising a vertical feeding device, a horizontal moving device, a follow-up liquid supply device, a coolant spraying device, and a mounting bracket, wherein,

[0005] The vertical feed device is connected to the horizontal moving device, and the mounting bracket and the horizontal moving device can be moved relative to each other, which facilitates the movement of the mounting bracket in the vertical and horizontal directions.

[0006] The follow-up liquid supply device is connected to the horizontal moving device, and the coolant spraying device is connected to the follow-up liquid supply device to provide coolant and spray coolant during the silicon rod cutting process.

[0007] Furthermore, the horizontal moving device is equipped with a slide rail, on which the mounting bracket is slidably mounted, facilitating the horizontal movement of the mounting bracket.

[0008] Furthermore, the slide is a pneumatic guide rail.

[0009] Furthermore, the follow-up liquid supply device includes a liquid supply tank and a connecting pipe. The liquid supply tank is connected to the horizontal moving device, the liquid outlet of the liquid supply tank is connected to one end of the connecting pipe, and the other end of the connecting pipe is connected to the coolant spraying device to supply liquid to the coolant spraying device.

[0010] Furthermore, the connecting pipes are rigid pipes.

[0011] Furthermore, the coolant spraying device consists of a spraying body and a spray pipe. The spraying body is connected to the connecting pipe and the spray pipe respectively to spray coolant.

[0012] Furthermore, the spraying unit is equipped with a filtration device.

[0013] A cutting method for a solar silicon wafer cutting system, wherein when cutting a monocrystalline silicon rod, the monocrystalline silicon rod is simultaneously fed downward and moved horizontally by a vertical feeding device and a horizontal moving device to cut the monocrystalline silicon rod.

[0014] Furthermore, when the single-crystal silicon rod moves horizontally, the horizontal commutation period is the same as that of the diamond wire.

[0015] Furthermore, the horizontal movement direction of the single-crystal silicon rod is opposite to the running direction of the diamond wire.

[0016] The above-mentioned technical solution results in a compact solar silicon wafer cutting system with high cutting efficiency for monocrystalline silicon rods. It features a vertical feeding device and a horizontal moving device, enabling the monocrystalline silicon rod to move both horizontally and vertically. During the cutting process, the monocrystalline silicon rod is fed downwards while simultaneously moving horizontally, increasing the cutting resistance of the diamond wire and improving its cutting capability. Furthermore, it includes a follow-up liquid supply device and a coolant spraying device, which move with the horizontal movement of the monocrystalline silicon rod to cool and lubricate the diamond wire, further enhancing the cutting efficiency of the monocrystalline silicon rod. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a structure according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the force applied to a single-crystal silicon rod according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the stress on a single-crystal silicon rod in the existing technology.

[0020] In the picture:

[0021] 1. Main roller; 2. Coolant spraying device; 3. Monocrystalline silicon rod

[0022] 4. Vertical feed device; 5. Follow-up liquid supply device; 6. Horizontal moving device. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Figure 1A schematic diagram of an embodiment of the present invention is shown, specifically illustrating the structure of this embodiment. This embodiment relates to a cutting system and method for solar silicon wafers, applied to a diamond wire cutting machine, for cutting monocrystalline silicon rods. It has a vertical feeding device and a horizontal moving device, so that the monocrystalline silicon rod is simultaneously fed downwards and moved horizontally during cutting, increasing the resistance to wire cutting during the cutting process, improving wire cutting capability, and increasing the cutting efficiency of monocrystalline silicon rods.

[0025] A solar silicon wafer cutting system, such as Figure 1 and 2 As shown, the device includes a vertical feed device 4, a horizontal moving device 6, a follow-up liquid supply device 5, a coolant spraying device 2, a main roller 1, and a mounting bracket. The vertical feed device 4 is connected to the horizontal moving device 6, allowing the horizontal moving device 6 to move up and down in the vertical direction. The mounting bracket is relatively movable to the horizontal moving device 6, allowing the mounting bracket to move horizontally and be fed downwards in the vertical direction. This facilitates the horizontal movement of the mounting bracket in both the vertical and horizontal directions, thereby facilitating the horizontal movement and downward feeding of the monocrystalline silicon rod 3 during cutting. The follow-up liquid supply device 5 is connected to the horizontal moving device 6, and the coolant spraying device 2 is connected to the follow-up liquid supply device 5, allowing the follow-up liquid supply device 5 and the coolant spraying device 2 to move horizontally and vertically along with the monocrystalline silicon rod 3, providing and spraying coolant during the silicon rod cutting process. The main roller 1 is located below the mounting bracket and is used for winding the cutting wire to form a wire mesh for cutting the monocrystalline silicon rod.

[0026] In this solar silicon wafer cutting system, when cutting the monocrystalline silicon rod 3, the monocrystalline silicon rod 3 is mounted on the mounting bracket via a material holder and cut by diamond wire wound on the main roller. During the cutting process, under the action of the vertical feed device 4 and the horizontal moving device 6, the monocrystalline silicon rod 3 is vertically fed and horizontally moved simultaneously. The horizontal moving direction is opposite to the running direction of the diamond wire, which increases the cutting resistance of the diamond wire and improves the silicon wafer cutting efficiency. At the same time as the monocrystalline silicon rod 3 is being cut, the follow-up liquid supply device 5 supplies liquid to the coolant spraying device, which sprays coolant to cool and lubricate the diamond wire. The follow-up liquid supply device 5 and the coolant spraying device 2 move with the monocrystalline silicon rod 3, fully cooling and lubricating the diamond wire.

[0027] Specifically, the aforementioned mounting bracket includes a mounting bracket body and a mounting bracket connector. The mounting bracket connector is located on one side of the mounting bracket body and in the middle of the mounting bracket body. It is fixedly connected by bolts or other connecting parts, either integrally formed or using other fixing connection methods, depending on actual needs. No specific requirements are specified here. The shape of the mounting bracket connector is adapted to the shape of the material seat connecting groove, facilitating the connection between the material seat and the mounting bracket connector.

[0028] The aforementioned vertical feed device 4 is preferably a hydraulic cylinder. A mounting plate is fixedly installed at the free end of the hydraulic cylinder's telescopic rod to facilitate the installation of the horizontal moving device. To ensure smooth operation of the horizontal moving device during vertical movement, multiple hydraulic cylinders can be used. These hydraulic cylinders are commercially available products, and the selection is based on actual needs; no specific requirements are specified here.

[0029] The aforementioned horizontal moving device 6 is equipped with a slide rail, on which the mounting bracket is slidably mounted for easy horizontal movement. The slide rail is fixedly connected to the mounting plate via bolts or other connecting components. A slider is mounted on the slide rail, and the mounting bracket is fixedly connected to the slider, allowing the mounting bracket to move horizontally along the slide rail. Preferably, the slide rail is a pneumatic guide rail, which controls the movement of the slider, enabling it to move left and right along the horizontal guide rail at a constant speed. This, in turn, allows the mounting bracket to move horizontally along the guide rail, ensuring the cutting quality of the single-crystal silicon rod.

[0030] Alternatively, the aforementioned horizontal moving device 6 includes a slide rail and a horizontal driving device. The horizontal driving device is installed at one end of the slide rail, which is fixedly mounted on the mounting plate of the vertical feed device 4 by bolts or other connecting parts. A slider is provided on the slide rail, and a mounting bracket is fixedly connected to the slider, allowing the mounting bracket to move horizontally along the slide rail with the slider. The horizontal driving device is connected to the slider, causing the slider to move horizontally along the slide rail under the action of the horizontal driving device. Under the control of the horizontal driving device, the slider can move at a uniform speed, thereby causing the mounting bracket to move horizontally, ensuring the horizontal movement of the monocrystalline silicon rod 3 and guaranteeing the cutting quality of the monocrystalline silicon rod. Preferably, the horizontal driving device is a cylinder, with the free end of the cylinder's telescopic rod fixedly connected to the slider on the slide rail. The horizontal movement of the slider is controlled by the extension and retraction of the telescopic rod.

[0031] The aforementioned follow-up liquid supply device 5 is designed to continuously supply liquid to the coolant spraying device 2, ensuring sufficient coolant usage. This follow-up liquid supply device 5 includes a supply tank and connecting pipes. The supply tank is connected to the horizontal moving device 6. The outlet of the supply tank is connected to one end of the connecting pipe, and the other end of the connecting pipe is connected to the coolant spraying device 2, supplying liquid to the coolant spraying device. The supply tank has a tank structure with an inlet and an outlet. The inlet is connected to an external coolant supply circulation system via a connecting pipe for coolant supply. The supply tank is fixedly mounted on the slider via a connector, allowing it to move with the slider. The outlet of the supply tank is connected to the coolant spraying device 2 via a connecting pipe, facilitating the supply of liquid from the supply tank to the coolant spraying device 2 and ensuring the lubrication and cooling of the diamond wire during the cutting of the single-crystal silicon rod 3. At the same time, through the connection of the connecting pipe, the coolant spraying device 2 moves with the movement of the supply tank to spray coolant onto the diamond wire.

[0032] There are two liquid supply tanks and coolant spraying devices, symmetrically arranged on both sides of the mounting bracket, which facilitates the cooling and lubrication of the diamond wires on both sides during the cutting of the monocrystalline silicon rod.

[0033] The aforementioned connecting pipes are rigid pipes, for example, stainless steel connecting pipes, so that the coolant spraying device 2 and the follow-up liquid supply device 5 move horizontally simultaneously.

[0034] The aforementioned coolant spraying device 2 consists of a spraying body and a spray pipe. The spraying body is connected to the connecting pipe and the spray pipe respectively to spray coolant. The spraying body has a box structure and is equipped with a filter device inside to filter the coolant entering the spraying body, ensuring the cleanliness of the coolant sprayed from the spray pipe and preventing impurities from causing diamond wire winding or skipping.

[0035] The inlet of the spray unit is located at the top, and the outlet, which connects to the spray pipe, is located at the bottom. This facilitates the cooling fluid entering the spray unit to be filtered by the filter device before being discharged from the spray pipe. The filter device is a filter screen, which can be a single-layer filter screen or a multi-layer filter screen, depending on the actual needs. No specific requirements are specified here.

[0036] A method for cutting a solar silicon wafer using a cutting system involves cutting a monocrystalline silicon rod 3. The monocrystalline silicon rod 3 is simultaneously fed downwards and moved horizontally by a vertical feeding device 4 and a horizontal moving device 6. The horizontal reversal cycle of the monocrystalline silicon rod 3 during horizontal movement is the same as the reversal cycle of the diamond wire. The horizontal movement direction of the monocrystalline silicon rod 3 is opposite to the running direction of the diamond wire. Specifically, when cutting the monocrystalline silicon rod using this solar silicon wafer cutting system, the monocrystalline silicon rod 3 with a material holder attached is mounted on the mounting bracket via a snap-fit ​​connection between the material holder and the mounting bracket. The supply tank of the follow-up liquid supply device 5 is connected to an external coolant circulation system to supply coolant, which then enters the spray body of the coolant spraying device 2 through a connecting pipe and is discharged through a spray nozzle onto the diamond wire to cool and lubricate it.

[0037] Under the action of the vertical feeding device 4, the single-crystal silicon rod 3 moves downward in the vertical direction for vertical feeding and cutting. Simultaneously, under the action of the horizontal moving device 6, the single-crystal silicon rod 3 moves in the opposite direction to the diamond wire, increasing the cutting capability of the diamond wire and improving the cutting efficiency of the single-crystal silicon rod. Furthermore, the reversing cycle of the horizontal moving device 6 is the same as the reversing cycle of the diamond wire, ensuring that the horizontal moving device 6 and the diamond wire reverse direction simultaneously, guaranteeing that the horizontal movement direction of the single-crystal silicon rod is always opposite to the movement direction of the diamond wire. This results in the single-crystal silicon rod being subjected to two forces F1 and F2 in the horizontal direction: the force exerted by the diamond wire and the force exerted by the horizontal moving device. Figure 3 As shown, in the prior art, a single crystal silicon rod is subjected to a force F1, and the force given by the diamond wire increases the cutting resistance of the diamond wire and improves the cutting force of the diamond wire.

[0038] The above-mentioned technical solution results in a compact solar silicon wafer cutting system with high cutting efficiency for monocrystalline silicon rods. It features a vertical feeding device and a horizontal moving device, enabling the monocrystalline silicon rod to move both horizontally and vertically. During the cutting process, the monocrystalline silicon rod is fed downwards while simultaneously moving horizontally, increasing the cutting resistance of the diamond wire and improving its cutting capability. Furthermore, it includes a follow-up liquid supply device and a coolant spraying device, which move with the horizontal movement of the monocrystalline silicon rod to cool and lubricate the diamond wire, further enhancing the cutting efficiency of the monocrystalline silicon rod.

[0039] The embodiments of the present invention have been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A cutting method for a solar silicon wafer cutting system, characterized in that: The solar silicon wafer cutting system includes a vertical feeding device, a horizontal moving device, a follow-up liquid supply device, a coolant spraying device, and a mounting bracket, wherein... The vertical feeding device is connected to the horizontal moving device, and the mounting bracket is movable relative to the horizontal moving device, which facilitates the movement of the mounting bracket in the vertical and horizontal directions. The single crystal silicon rod is connected to the mounting bracket. The follow-up liquid supply device is connected to the horizontal moving device, and the coolant spraying device is connected to the follow-up liquid supply device to provide coolant and spray coolant during the silicon rod cutting process. When the solar silicon wafer cutting system cuts monocrystalline silicon rods, the monocrystalline silicon rods are simultaneously fed downwards and moved horizontally by a vertical feeding device and a horizontal moving device. The horizontal moving direction of the monocrystalline silicon rods is opposite to the running direction of the diamond wire, which increases the cutting resistance of the diamond wire and performs the cutting of the monocrystalline silicon rods. The follow-up liquid supply device includes a liquid supply tank and a connecting pipe. The liquid supply tank is connected to the horizontal moving device. The liquid outlet of the liquid supply tank is connected to one end of the connecting pipe, and the other end of the connecting pipe is connected to the coolant spraying device to supply liquid to the coolant spraying device. When the single-crystal silicon rod moves horizontally, the horizontal commutation period is the same as the diamond wire commutation period.

2. The cutting method of the solar silicon wafer cutting system according to claim 1, characterized in that: The horizontal moving device is provided with a slide rail, and the mounting bracket is slidably disposed on the slide rail to facilitate the horizontal movement of the mounting bracket.

3. The cutting method of the solar silicon wafer cutting system according to claim 2, characterized in that: The slide is a pneumatic guide rail.

4. The cutting method of the solar silicon wafer cutting system according to claim 1, characterized in that: The connecting pipe is a rigid pipe.

5. The cutting method of the solar silicon wafer cutting system according to claim 4, characterized in that: The coolant spraying device consists of a spraying body and a spray pipe. The spraying body is connected to the connecting pipe and the spray pipe respectively to spray coolant.

6. The cutting method of the solar silicon wafer cutting system according to claim 5, characterized in that: The spraying unit is equipped with a filtration device.

Images