A passive expandable wireless sensor and its manufacturing method

Abstract

The present invention provides a passive expandable wireless sensor and a manufacturing method thereof, comprising a plurality of sensor chips, an impedance ring and an antenna circuit; the plurality of sensor chips are connected to the impedance ring, and the impedance ring is detachably connected to the antenna circuit; the present invention connects the impedance ring to the antenna circuit, and the connection between the impedance ring and the antenna circuit is a detachable connection, so that the sensor chip can charge itself through the signal of the antenna circuit to achieve passive operation without the need for external charging, and can adapt to relatively harsh working environments. At the same time, the detachable connection between the impedance ring and the antenna circuit enables the sensor chip to be flexibly combined with different antenna circuits in different scenarios, thereby increasing the flexibility of sensor application.

Description

Technical Field

[0001] The present invention relates to the field of sensors, and in particular to a passive expandable wireless sensor and a manufacturing method thereof. Background Art

[0002] Most existing sensors are active and require external power to work. However, in actual industrial applications, there are many scenarios where power supply cannot be guaranteed. Traditional sensor models are fixed and cannot be expanded. The output also relies on wired methods. The application is limited and the wiring is complicated. They cannot fully meet the changing needs of actual applications. Especially in some scenarios with high standards, existing sensors cannot achieve good monitoring effects. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a passive expandable wireless sensor and a manufacturing method thereof, so as to expand the application scenarios of the sensor.

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is:

[0005] A passive scalable wireless sensor includes multiple sensor chips, an impedance loop, and an antenna circuit;

[0006] The plurality of sensor chips are connected to the impedance loop, and the impedance loop is connected to the antenna circuit;

[0007] The sensor chip and the impedance ring or the impedance ring and the antenna circuit are detachably connected.

[0008] In order to solve the above technical problems, another technical solution adopted by the present invention is:

[0009] A method for manufacturing a passive expandable wireless sensor, which can be used to manufacture the above-mentioned passive expandable wireless sensor, includes the following steps:

[0010] The preset impedance loop and input terminal are etched into a roll or sheet sensor circuit by means of PET / PI / PP composite aluminum foil / copper foil or FR4 PCB composite copper foil;

[0011] The sensor chip is fixed at a preset position on the sensor circuit by a preset fixing method.

[0012] The beneficial effects of the present invention are: the sensor chip is connected to the impedance ring, the impedance ring is connected to the antenna circuit, and the connection between the impedance ring and the antenna circuit is a detachable connection. The sensor chip can charge itself through the signal of the antenna circuit to achieve passive operation without external charging, and can adapt to harsh working environments. At the same time, the detachable connection between the impedance ring and the antenna circuit enables the sensor chip to be flexibly combined with different antenna circuits in different scenarios, increasing the flexibility of sensor application, and can integrate multiple sensor chips on the antenna circuit, thereby improving the signal transmission quantity and transmission efficiency of a single antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of a parallel solution of a passive scalable wireless sensor according to an embodiment of the present invention;

[0014] Figure 2 A schematic diagram of a series connection solution of a passive scalable wireless sensor according to an embodiment of the present invention;

[0015] Figure 3 This is a schematic diagram of the operation of an optocoupler input parallel scheme of a passive scalable wireless sensor according to an embodiment of the present invention;

[0016] Figure 4 This is a schematic diagram of the working of a switch-type input parallel scheme of a passive scalable wireless sensor according to an embodiment of the present invention;

[0017] Figure 5 This is a schematic diagram of the operation of an optocoupler input series scheme of a passive scalable wireless sensor according to an embodiment of the present invention;

[0018] Figure 6 This is a schematic diagram of the working of a switch-type input series connection scheme of a passive scalable wireless sensor according to an embodiment of the present invention;

[0019] Figure 7 This is a schematic diagram of an optical coupling access according to an embodiment of the present invention;

[0020] Figure 8 A schematic diagram of a switch-type access according to an embodiment of the present invention;

[0021] Figure 9 This is a schematic diagram of an antenna circuit according to an embodiment of the present invention;

[0022] Figure 10 A schematic diagram of a parallel impedance design according to an embodiment of the present invention;

[0023] Figure 11 A schematic diagram of a series impedance design according to an embodiment of the present invention;

[0024] Description of labels:

[0025] 1. Sensor chip; 2. Impedance loop; 3. Antenna line. DETAILED DESCRIPTION

[0026] To illustrate the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and accompanying drawings.

[0027] Please refer to Figure 1 , a passive scalable wireless sensor, characterized by comprising a plurality of sensor chips, an impedance loop and an antenna circuit;

[0028] A plurality of the sensor chips are connected to the impedance ring, and the impedance ring is detachably connected to the antenna circuit.

[0029] From the above description, it can be seen that the beneficial effects of the present invention are: the sensor chip is connected to the impedance ring, the impedance ring is connected to the antenna circuit, and the connection between the impedance ring and the antenna circuit is a detachable connection. The sensor chip can charge itself through the signal of the antenna circuit to achieve passive operation without external charging, and can adapt to harsh working environments. At the same time, the detachable connection between the impedance ring and the antenna circuit enables the sensor chip to be flexibly combined with different antenna circuits in different scenarios, increasing the flexibility of sensor application, and can integrate multiple sensor chips on the antenna circuit to improve the signal transmission quantity and transmission efficiency of a single antenna.

[0030] Furthermore, it includes a plurality of input terminals, one end of the plurality of input terminals is connected to the plurality of sensor chips in a one-to-one correspondence, and the other end of the plurality of input terminals is an external interface.

[0031] From the above description, we can know that the input port is set, one end is connected to the sensor chip, and the other end is set to the external interface, which can be connected to different sensing lines according to different environments, such as Figure 7 The optocoupler and Figure 8 The switch type shown increases the application scenarios of the sensor chip.

[0032] Furthermore, there are a plurality of impedance loops, the plurality of impedance loops are connected to the plurality of sensor chips in a one-to-one correspondence, and the plurality of impedance loops are connected to the antenna circuit, through which signals are output.

[0033] From the above description, it can be seen that multiple impedance loops are set to be connected one-to-one with multiple sensor chips, and the chips are connected to the antenna line through the impedance loops, and signals are output / received through the antenna line. Multiple sensor chips can be integrated on one antenna line as needed, thereby improving the utilization efficiency of the antenna line.

[0034] Furthermore, the number of the impedance ring is 1, a plurality of the chips are connected to one impedance ring, and the impedance ring is detachably connected to the antenna circuit.

[0035] From the above description, it can be seen that an impedance loop is set up, multiple chips are connected to the impedance loop, and the impedance loop is detachably connected to the antenna line. It can be combined with different antenna lines according to different application scenarios to achieve the best communication effect.

[0036] Furthermore, the sensor chip is an RFID chip.

[0037] As can be seen from the above description, the RFID chip can provide itself with power by receiving wireless signals to operate without the need for an external power cord, further reducing the size of the sensor and reducing the constraints of the use environment.

[0038] Furthermore, the impedance loop and the antenna circuit are etched on a flexible FPC board or a FR4 PCB board.

[0039] From the above description, it can be seen that if the circuit is etched on a flexible FPC board, the flexible material can conform to irregular surfaces, while the FR4 PCB board is a rigid material that can adapt to different usage scenarios.

[0040] A method for manufacturing a passive expandable wireless sensor, which can be used to manufacture the above-mentioned passive expandable wireless sensor, includes the following steps:

[0041] The preset impedance loop and input terminal are etched into a roll or sheet sensor circuit by means of PET / PI / PP composite aluminum foil / copper foil or FR4 PCB composite copper foil;

[0042] The sensor chip is fixed at a preset position on the sensor circuit by a preset fixing method.

[0043] From the above description, it can be seen that the above-mentioned passive expandable wireless sensor can be obtained by the above-mentioned method. The sensor chip is connected to the impedance ring, and the impedance ring is connected to the antenna line. The connection between the impedance ring and the antenna line is a detachable connection. The sensor chip can charge itself through the signal of the antenna line to achieve passive operation without external charging, and can adapt to harsh working environments. At the same time, the detachable connection between the impedance ring and the antenna line enables the sensor chip to be flexibly combined with different antenna lines in different scenarios, thereby increasing the flexibility of sensor application, and can integrate multiple sensor chips on the antenna line to improve the signal transmission quantity and transmission efficiency of a single antenna.

[0044] Please refer to Figure 1 、 Figure 3 、 Figures 7 to 9 , embodiment 1 of the present invention is:

[0045] A passive scalable wireless sensor, comprising a plurality of sensor chips 1, a plurality of impedance loops 2, an antenna circuit 3 and a plurality of input terminals ( Figure 1 and Figure 2 1#-n#); in this embodiment, the sensor chips are connected in parallel;

[0046] The plurality of sensor chips 1 are connected to the impedance ring 2, and the impedance ring is detachably connected to the antenna circuit 3;

[0047] One end of the plurality of input terminals is connected to the plurality of sensor chips in a one-to-one correspondence, and the other end of the plurality of input terminals is an external interface;

[0048] Please refer to Figure 7 ,In an optional embodiment, the external interface is connected to a photoelectric coupler, which can detect wired high and low voltage inputs and signal inputs;

[0049] Please refer to Figure 8 ,In an optional implementation, the external interface is connected to a wired switch to directly detect the working ,status of the target device, which may include on / off;

[0050] In an optional embodiment, the external interface is connected to the switch circuit to be tested by conductive glue, solder paste, rivets, etc. If there is a high voltage problem in the application scenario, it can be isolated and connected through a photoelectric coupler. After the sensor is connected normally, a handheld RFID reader or a fixed RFID reader can be used to realize the unique UID ID number method to realize the collection and reading of different sensor ports one by one or in batches;

[0051] Please refer to Figure 1 The plurality of impedance loops are connected to the plurality of sensor chips in a one-to-one correspondence, and the plurality of impedance loops are connected to the antenna circuit. Signals are output through the antenna circuit;

[0052] In an optional embodiment, the antenna line radiating arm is a metal conductor such as aluminum, copper, printed silver paste, etc.; the antenna line can be Figure 9 The dedicated antenna body shown may also be a metal conductor shell (e.g., the device shell is directly used as the antenna line);

[0053] The sensor chip is an RFID chip, which works passively by receiving radio waves and converting them into electrical energy for power supply;

[0054] In an optional embodiment, the sensor chip is a chip with a Tamper Detection function, such as sensor chips of models EM4423T, EM4425T, G2IL+, G2IM+, KX2005XBL, etc.;

[0055] In an optional embodiment, a certain distance needs to be maintained between each sensor chip 1 to avoid the phenomenon that the signals between sensors affect each other and cause the sensors to malfunction or the signals to be unstable;

[0056] In an optional embodiment, the distance between each sensor chip 1 is at least 5 mm;

[0057] The impedance loop and the antenna circuit are etched on a flexible FPC board or a FR4 PCB board.

[0058] Please refer to Figure 2 、 Figure 4 and Figures 7 to 9 , the second embodiment of the present invention is:

[0059] A passive scalable wireless sensor, which differs from the first embodiment in that:

[0060] In this embodiment, the sensor chips 1 are connected in series;

[0061] The number of the impedance ring 2 is 1, a plurality of the chips are connected to one impedance ring, and the impedance ring is detachably connected to the antenna circuit.

[0062] Please refer to Figures 10 and 11 The third embodiment of the present invention is:

[0063] A method for manufacturing a passive scalable wireless sensor, which can be used to manufacture the passive scalable wireless sensor described in Example 1 or Example 2, comprises the following steps:

[0064] The preset impedance loop and input terminal are etched into a roll or sheet sensor circuit by means of PET / PI / PP composite aluminum foil / copper foil or FR4 PCB composite copper foil;

[0065] Fixing the sensor chip at a preset position on the sensor circuit by a preset fixing method;

[0066] In an optional embodiment, the fixing method includes a flip-chip packaging method, a COB binding method, or an SMT patch technology, where the sensor chip is packaged to a preset position on the sensor circuit through a curing material such as glue / gold wire / aluminum wire or solder paste;

[0067] If the sensor chips are connected in parallel, each sensor is fixed to its corresponding impedance loop;

[0068] If the sensor chips are connected in series, fix each sensor to an impedance ring in turn, ensuring that a certain distance is maintained between each sensor.

[0069] Please refer to Figure 11In an optional embodiment, the sensor chip is a G2TL+ chip, whose matching parameters are at 915Mhz, and its own impedance Z1, Z2 and Z3 are all 23-j224. If two sensor chips are connected in series on a single impedance loop, the final impedance loop impedance should be Z=Z1+Z2=46-j448; please refer to Figure 10 If a sensor chip is set on each impedance loop and the sensor chips are connected in parallel, the impedance of the impedance loop can be equal to the impedance value of each impedance loop, that is, Z1=Z2=Z3=Z4=Z……=23-j224, or the impedance of each impedance loop is equal to the sensor chip set on it; if two chips are connected in parallel, the total impedance is Z=(23-j224) 2 / (46-j448);

[0070] If each sensor chip corresponds to an impedance ring one by one, the sensor module composed of the sensor chip and the impedance ring is mounted or pasted on the antenna line at a certain distance;

[0071] If multiple sensor chips are arranged on one impedance ring, the sensor module consisting of the sensor chips and the impedance ring is mounted or pasted onto the antenna circuit.

[0072] In summary, the present invention provides a passive expandable wireless sensor and a manufacturing method thereof. The sensor chip is connected to the impedance ring, and the impedance ring is detachably connected to the antenna circuit. Different antennas can be flexibly configured to adapt to different application scenarios. At the same time, the antenna circuit can be a specially set antenna body, or a metal surface such as the metal surface of the device can be directly used as the antenna body, further expanding the use scenarios of the sensor; at the same time, the number of sensor chips can be flexibly configured according to the actual scenario, and the RFID sensor chip can power itself from the wireless signal to achieve passive operation.

[0073] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's description and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A passive scalable wireless sensor, characterized in that: It includes multiple sensor chips, impedance loops and antenna circuits; A plurality of the sensor chips are connected to the impedance ring, and the impedance ring is detachably connected to the antenna circuit; It also includes a plurality of input terminals, one end of each of the input terminals is connected to each of the plurality of sensor chips in a one-to-one correspondence, and the other end of each of the input terminals is an external interface, and the external interface is used to connect to different sensing circuits according to different environments; The sensor chip is an RFID chip; If the sensor chips are connected in parallel, there are multiple impedance loops, and the multiple impedance loops are connected to the multiple sensor chips in a one-to-one correspondence. The multiple impedance loops are connected to the antenna circuit to output signals through the antenna circuit. If the sensor chips correspond to the impedance rings one by one, the sensor module composed of the sensor chips and the impedance rings is mounted or pasted onto the antenna circuit at a certain distance; If the sensor chips are connected in series, the number of the impedance ring is 1, multiple chips are connected to one impedance ring, and the impedance ring is detachably connected to the antenna circuit; If multiple sensor chips are arranged on one impedance ring, the sensor module consisting of the sensor chips and the impedance ring is mounted or pasted onto the antenna circuit.

2. A passive scalable wireless sensor according to claim 1, characterized in that: The impedance loop and the antenna circuit are etched on a flexible FPC board or a FR4 PCB board.

3. A method for manufacturing a passive scalable wireless sensor, which can be used to manufacture a passive scalable wireless sensor according to any one of claims 1-2, characterized in that: Including steps: The preset impedance loop and input terminal are etched into a roll or sheet sensor circuit by means of PET / PI / PP composite aluminum foil / copper foil or FR4PCB composite copper foil; The sensor chip is fixed at a preset position on the sensor circuit by a preset fixing method.

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