Substrate processing device and substrate transport method

Abstract

The present invention relates to a substrate processing device and a substrate conveying method. The first processing block includes a developing processing layer and a transfer layer arranged in the up-down direction. Therefore, the transfer layer can be connected to the carrier block. In addition, the substrate conveying mechanism of the carrier block conveys the substrate from a buffer portion of a substrate buffer located at a specific height position to a buffer portion of a substrate buffer located at another height position. Therefore, the transfer layer only needs to enter and exit the buffer portion corresponding to the height of the transfer layer. Therefore, the transfer layer can be simplified. In addition, since the transfer layer is arranged in the up-down direction of the developing processing layer, the occupied area can be reduced.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate and a substrate conveying method of the substrate processing device. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] Conventional substrate processing apparatuses sequentially include a carrier block, a coating block, a developing block, and a transfer block (for example, see Japanese Patent Publication No. 2014-187273). In addition, the carrier block is appropriately referred to as an "ID (indexer) block" hereinafter, and the transfer block is appropriately referred to as an "IF (interface) block" hereinafter.

[0003] The ID block is equipped with a carrier stage and a substrate transfer mechanism. The substrate transfer mechanism takes out a substrate from a carrier mounted on the carrier stage and transfers the substrate to the coating block. The coating block forms a photoresist film on the substrate, for example. The substrate formed with the photoresist film is transferred to the IF block via the developing block. The IF block transfers the substrate in and out of the exposure device.

[0004] The exposed substrate is transferred from the IF block to the developing block. The developing block performs development on the exposed substrate. The substrate after development is transferred to the ID block via the coating block. The substrate transfer mechanism of the ID block returns the substrate after development to the carrier on the stage. In addition, the coating block and the developing block each have two processing layers.

[0005] In addition, Japanese Patent Laid-Open No. 09-045613 discloses a substrate processing device, which includes a coating processing block, a cassette stage (equivalent to an ID block), and a developing processing block in sequence. The cassette stage is configured to be able to accommodate four cassettes, and the cassettes accommodate any one of unprocessed substrates and processed substrates. In addition, a first substrate loading portion for substrate alignment is provided at a boundary portion between the coating processing block and the cassette stage, and a second substrate loading portion for substrate alignment is provided at a boundary portion between the cassette stage and the developing processing block. In addition, each block is configured with a single processing layer in the up and down direction rather than a plurality of processing layers. Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] However, the conventional device has the following problems. The conventional device includes an IF block, and the IF block includes a first substrate conveying mechanism for actually conveying the substrate to the exposure device, and two second substrate conveying mechanisms. The second substrate conveying mechanism is arranged between the developing block adjacent to the IF block and the first substrate conveying mechanism. The second substrate conveying mechanism, for example, conveys the substrate to the first substrate conveying mechanism via a substrate loading portion. In addition, the second substrate conveying mechanism rises and falls between two processing layers arranged in the upper and lower directions of the developing block, receives the substrate W from the two processing layers, and distributes the substrate to the two processing layers. That is, in addition to the first substrate conveying mechanism, the IF block also includes two second substrate conveying mechanisms, and these two second substrate conveying mechanisms have the function of rising and falling between the two processing layers. Therefore, the IF block is enlarged.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate transport method capable of simplifying a transfer structure.

[0009] [Technical means to solve the problem]

[0010] The present invention adopts the following structure to achieve the above object. That is, the substrate processing device of the present invention includes a transfer block, a first processing block and a second processing block. The transfer block is provided with a carrier stage, and the carrier stage is used to carry a carrier capable of accommodating a substrate. In addition, the transfer block includes a substrate buffer and a transfer mechanism. The substrate buffer has a plurality of buffer parts for carrying substrates. The transfer mechanism transports substrates. The first processing block includes a transfer layer and a first processing layer. The transfer layer carries in and carries out substrates relative to an external device. The first processing layer is arranged on the upper side or the lower side of the transfer layer. The second processing block has a plurality of second processing layers arranged in the up-down direction. The first processing block, the transfer block and the second processing block are connected in sequence in the horizontal direction. The transfer mechanism transports the substrate between the carrier carried on the carrier stage and the substrate buffer. The transfer mechanism transports the substrate from the buffer part of the substrate buffer located at a specific height position to the buffer part of the substrate buffer located at another height position. The plurality of second processing layers receive and deliver substrates to the buffer portions of the substrate buffer located at height positions corresponding to the plurality of second processing layers, respectively. The delivery layer at least receives a substrate to the buffer portion of the substrate buffer located at a height position corresponding to the delivery layer. The first processing layer at least delivers a substrate to the buffer portion of the substrate buffer located at a height position corresponding to the first processing layer.

[0011] According to the substrate processing device of the present invention, the first processing block has a first processing layer and a transfer layer arranged in the up-down direction. Therefore, the transfer layer can be connected to the carrier block. In addition, the carrier mechanism of the carrier block transports the substrate from the buffer portion of the substrate buffer located at a specific height position to the buffer portion of the substrate buffer located at another height position. Therefore, the transfer layer only needs to enter and exit the buffer portion corresponding to the height of the transfer layer. Therefore, the transfer layer can be simplified. In addition, since the transfer layer is arranged on the upper side or the lower side of the first processing layer, the occupied area can be reduced.

[0012] In one example of the substrate processing device, the first processing layer is a developing processing layer, the second processing layer is a coating processing layer, and the external device is an exposure device. In this case, the transfer layer can be simplified and the occupied area can be reduced.

[0013] In addition, the substrate processing device is preferably configured as follows. The transfer layer includes a processing area connected to the transfer block and a transfer area connected to the processing area. The processing area includes: an exposure-related processing unit that performs a specific process on the substrate after coating and before development; and a conveying mechanism that conveys the substrate between the substrate buffer of the transfer block, the exposure-related processing unit, and the transfer area. The transfer area includes an exposure device conveying mechanism that conveys the substrate between the exposure device and the processing area.

[0014] The exposure-related processing unit is provided in the transfer layer. Therefore, the number of exposure-related processing units provided in other processing layers can be suppressed. Therefore, other processing layers can be provided with processing units other than the exposure-related processing unit.

[0015] In addition, in the substrate processing device, the transfer region is preferably configured in such a manner that the end of the transfer region on the exposure device side protrudes outside the first processing layer. Thus, an air layer can be formed between the exposure device and the substrate processing device. Therefore, in the case where the thermal influence of the substrate processing device may affect the exposure device, the thermal influence can be blocked by the air layer.

[0016] In the substrate processing apparatus, the transfer region is preferably arranged such that an end of the transfer region on the exposure device side is received inside the first processing layer. This can reduce an area occupied by the substrate processing apparatus.

[0017] In addition, the substrate processing apparatus is preferably configured as follows. The transfer area includes a substrate mounting portion for mounting a substrate. The first processing block includes a transport space extending from the processing area of ​​the transfer layer through the first processing layer in the vertical direction, and an inter-layer transport mechanism disposed in the transport space. The first processing layer includes an adjacent processing unit disposed adjacent to the transport space. The inter-layer transport mechanism receives a substrate from the substrate mounting portion of the transfer area and directly transports the substrate to the adjacent processing unit of the first processing layer.

[0018] In the case where a substrate is transported from the transfer layer to the carrier block and then transported from the carrier block to the first processing layer, a lot of time may be required. In addition, a large burden may be placed on the transport mechanism of the transfer layer. In the present invention, the substrate can be directly transported to the adjacent processing unit of the first processing layer without passing through the carrier block. Therefore, the substrate can be transported to the first processing layer faster, and the burden on the transport mechanism of the transfer layer can be reduced. In addition, the transport space for configuring the inter-layer transport mechanism is provided not only in the transfer layer, but also in the area of ​​the first processing layer. Therefore, the simplicity of the transfer layer can be maintained.

[0019] In addition, in the substrate processing device, it is preferred that the processing area has an adjacent processing unit, the adjacent processing unit is the exposure-related processing unit, and is arranged adjacent to the transfer area, and the exposure device conveying mechanism directly conveys the substrate after the exposure process to the adjacent processing unit in the processing area. In the transfer layer, for example, when the substrate is conveyed from the transfer area to the processing area via a buffer section, the conveying mechanism in the processing area must convey the substrate from the buffer section to the adjacent processing unit. In the present invention, the exposure device conveying mechanism can convey the substrate after the exposure process to the adjacent processing unit without passing through the buffer section. Therefore, the load of the conveying mechanism in the processing area in conveying the substrate can be reduced.

[0020] In addition, the substrate processing apparatus preferably further comprises: a carrier storage rack for storing the carrier; and a carrier transport mechanism for transporting the carrier between the carrier placement table and the carrier storage rack; the height of the second processing block is lower than the height of the first processing block, and the carrier storage rack and the carrier transport mechanism are mounted on the second processing block. Thus, the height of the substrate processing apparatus can be suppressed.

[0021] In addition, the substrate conveying method of the present invention is a substrate conveying method of a substrate processing device. The substrate processing device includes a transfer block, a first processing block and a second processing block. The transfer block is provided with a carrier mounting table, and the carrier mounting table is used to mount a carrier capable of accommodating a substrate. In addition, the transfer block includes a substrate buffer and a transfer mechanism. The substrate buffer has a plurality of buffer portions for mounting substrates. The transfer mechanism transports a substrate. The first processing block has a first processing layer. The second processing block has a plurality of second processing layers arranged in the up-down direction. The first processing block, the transfer block and the second processing block are sequentially connected in the horizontal direction. The substrate conveying method of the substrate processing device includes the following steps: conveying the substrate between the carrier mounted on the carrier mounting table and the substrate buffer through the conveying mechanism; conveying the substrate from the buffer portion of the substrate buffer located at a specific height position to the buffer portion of the substrate buffer located at another height position through the conveying mechanism; receiving and delivering the substrate to the buffer portion of the substrate buffer located at a height position corresponding to the plurality of second processing layers through each of the plurality of second processing layers; receiving at least the substrate to the buffer portion of the substrate buffer located at a height position corresponding to the transfer layer through the transfer layer arranged on the upper side or lower side of the first processing layer; delivering at least the substrate to the buffer portion of the substrate buffer located at a height position corresponding to the first processing layer through the first processing layer; and carrying the substrate in and out of the external device through the transfer layer.

[0022] According to the substrate transfer method of the present invention, the first processing block has a first processing layer and a transfer layer arranged in the up-down direction. Therefore, the transfer layer can be connected to the carrier block. In addition, the carrier mechanism of the carrier block transfers the substrate from the buffer portion of the substrate buffer located at a specific height position to the buffer portion of the substrate buffer located at another height position. Therefore, the transfer layer only needs to enter and exit the buffer portion corresponding to the height of the transfer layer. Therefore, the transfer layer can be simplified. In addition, since the transfer layer is arranged on the upper side or the lower side of the first processing layer, the occupied area can be reduced.

[0023] [Effects of the Invention]

[0024] According to the substrate processing apparatus and substrate transport method of the present invention, the transfer structure can be simplified. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Several aspects currently considered appropriate are shown in the drawings to explain the invention, but it is to be understood that the invention is not limited to the illustrated configurations and measures.

[0026] Figure 1 This is a longitudinal sectional view showing the substrate processing apparatus of Example 1.

[0027] Figure 2 This is a top view of a substrate processing apparatus showing the upper and middle development processing layers in a cross-sectional view.

[0028] Figure 3 It is a diagram showing a substrate transfer mechanism of a transfer block.

[0029] Figure 4 It is a top view of the two hand-shaped parts and the forward and backward driving part.

[0030] Figure 5 It is a cross-sectional view showing the transfer layer as the lower layer, and the coating treatment layers as the middle layer and the lower layer.

[0031] Figure 6 This is a side view of the substrate processing apparatus as viewed from the right side.

[0032] Figure 7 This is a side view of the substrate processing apparatus as viewed from the left side.

[0033] Fig. 8A , Figure 8B This is a diagram for explaining the structure of a heat treatment unit having two substrate carrying ports.

[0034] Fig. 9 This is a flowchart showing an example of a processing step of the substrate processing apparatus according to the first embodiment.

[0035] Fig.10 This is a flowchart showing an example of a processing step of the substrate processing apparatus according to the second embodiment.

[0036] Fig.11 It is a longitudinal sectional view showing a substrate processing apparatus according to the third embodiment.

[0037] Fig. 12A , Fig. 12B This is a cross-sectional view showing the structure and operation of the transmission layer of Example 3.

[0038] Fig.13 This is a cross-sectional view showing the transmission layer of Example 4.

[0039] Fig.14 1 is a cross-sectional view showing the development-treated layers of the upper layer and the intermediate layer of Example 4.

[0040] Fig.15 This is a side view of the substrate processing apparatus of Example 4 as viewed from the left side.

[0041] Fig.16A , Fig. 16B This is a diagram for explaining the effect of Example 4.

[0042] Fig.17This is a side view of the substrate processing apparatus according to the modification as viewed from the left side.

[0043] Fig.18 This is a side view of the substrate processing apparatus according to the modification as viewed from the left side. DETAILED DESCRIPTION

[0044] [Example 1]

[0045] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 1 is a longitudinal sectional view showing a substrate processing apparatus 1 according to the first embodiment.

[0046] (1) Configuration of Substrate Processing Apparatus 1

[0047] Reference Figure 1 The substrate processing apparatus 1 includes an ID block 2, a first processing block 3, a second processing block 5, and a carrier buffer device 8. The first processing block 3, the ID block 2, and the second processing block 5 are linearly connected in sequence in the horizontal direction.

[0048] In addition, the substrate processing device 1 includes a control unit 9 and an operating unit 10. The control unit 9 includes, for example, a central processing unit (CPU). The control unit 9 controls each component of the substrate processing device 1. The operating unit 10 includes a display unit (for example, a liquid crystal monitor), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touch panel, and various buttons. The storage unit stores various conditions for substrate processing and an action program required to control the substrate processing device 1.

[0049] (1-1) Structure of ID Block 2

[0050] The ID block 2 has four openers 11 to 14 (see Figure 1 , Figure 2 ), two substrate transport mechanisms (robots) MHU1, MHU2, and a substrate buffer BF. The two substrate transport mechanisms MHU1, MHU2 and the substrate buffer BF are arranged inside the ID block 2. In addition, the two substrate transport mechanisms MHU1, MHU2 are respectively equivalent to the carrier mechanism of the present invention.

[0051] (1-1-1) Configuration of the four openers 11 to 14

[0052] Four openers 11 to 14 are provided on the outer wall of the ID block 2. Two openers 11 and 12 are arranged in the vertical direction. Similarly, two openers 13 and 14 are arranged in the vertical direction. Figure 1As shown, the four openers 11 to 14 are respectively provided with a mounting table 16, an opening 18, a baffle member (not shown) and a baffle member driving mechanism (not shown). The mounting table 16 is used to mount the carrier C. The mounting table 16 is equivalent to the carrier mounting table of the present invention. In addition, Figure 1 The openers 11 to 14 in two stages in the vertical direction and two rows in the horizontal direction within the circle show what is seen in the direction of arrow AR1.

[0053] The carrier C can store multiple (for example, 25) substrates W. The carrier C uses, for example, a wafer transfer box (FOUP: Front Open Unified Pod) or a SMIF (Standard Mechanical Interface Face) box. The carrier C uses, for example, a carrier having a carrier body and a cover, wherein the carrier body is provided with an opening for the substrate W to enter and exit and stores the substrate W, and the cover is used to block the opening of the carrier body.

[0054] The opening 18 is used to allow the substrate W to pass through. The shutter member opens and closes the opening 18 and attaches and detaches the cover to the carrier body of the carrier C. The shutter member driving mechanism includes an electric motor to drive the shutter member. After the cover is detached from the carrier body, the shutter member moves, for example, in the horizontal direction (Y direction) or the downward direction (Z direction) along the opening 18.

[0055] The mounting table 16 is arranged above the second processing block 5. That is, the mounting tables 16 of the four openers 11 to 14 are arranged above the second processing block 5. In addition, the two lower mounting tables 16 may also be provided on the upper surface or the roof of the second processing block 5.

[0056] (1-1-2) Configuration of Substrate Transport Mechanisms MHU1 and MHU2

[0057] like Figure 2 As shown, the two substrate transfer mechanisms MHU1 and MHU2 are arranged to sandwich the substrate buffer BF. The two substrate transfer mechanisms MHU1 and MHU2 are arranged in a direction (Y direction) orthogonal to the direction (X direction) in which the first processing block 3 and the second processing block 5 are arranged side by side.

[0058] The first substrate transfer mechanism MHU1 can transfer substrates W between carriers C mounted on the respective mounting tables 16 of the two openers 11 and 12 and the substrate buffer BF. The second substrate transfer mechanism MHU2 can transfer substrates W between carriers C mounted on the respective mounting tables 16 of the two openers 13 and 14 and the substrate buffer BF.

[0059] Reference Figure 3 , Figure 4The two substrate transport mechanisms MHU1 and MHU2 each include two hand-shaped parts 21, a forward and backward driving part 23, and a lifting and rotating driving part 25. The two hand-shaped parts 21 each hold a substrate W. The two hand-shaped parts 21 can each move forward and backward in the horizontal direction. Therefore, one substrate W can be taken out from the carrier C, or two substrates W can be taken out at the same time.

[0060] like Figure 4 As shown, the hand 21 has a base portion 21A and two front end portions 21B and 21C branching from the base portion 21A, so as to be configured in a Y-shape, a U-shape or a forked shape. The base portion 21A and the two front end portions 21B and 21C are provided with suction portions 27A, 27B, and 27C, and the suction portions 27A, 27B, and 27C hold the substrate W by suctioning the substrate W. The three suction portions 27A to 27C are configured so that suction force is given by, for example, a pump connected via piping. In addition, the two substrate transport mechanisms MHU1 and MHU2 each have two hand portions 21, but may also have three or more hand portions 21.

[0061] The advance / retract drive unit 23 movably supports each hand-shaped unit 21 and advances / retracts each hand-shaped unit 21. The advance / retract drive unit 23 includes, for example, an electric motor, a linear screw shaft that rotates around an axis by the electric motor, a movable member having a hole that meshes with the screw shaft, and a guide that guides the movable member, thereby driving one hand-shaped unit 21.

[0062] The lifting and rotating driving unit 25 lifts and rotates the two hand-shaped parts 21 by lifting and rotating the advancing and retreating driving unit 23. Figure 3 As shown, the lifting and rotating driving unit 25 includes a support portion 25A and a rotating portion 25B. The support portion 25A is provided in a manner extending in the up-down direction. The support portion 25A is fixed to the floor portion of the ID block 2. Therefore, the horizontal position (XY direction) of the support portion 25A, i.e., the lifting and rotating driving unit 25 is fixed and does not move. The rotating portion 25B rotates the advancing and retreating driving unit 23 around the vertical axis AX1. The lifting and rotating of the lifting and rotating driving unit 25 are driven by an electric motor.

[0063] (1-1-3) Configuration of substrate buffer BF

[0064] Reference Figure 1 , Figure 2 , Figure 5 The substrate buffer BF carries a plurality of substrates W. Figure 5As shown, the substrate buffer BF is arranged between the first processing block 3 and the second processing block 5 (center). Thus, not only the two substrate transport mechanisms MHU1 and MHU2 can put substrates W in and out of the substrate buffer BF, but also the substrate transport mechanism MHU3 of the first processing block 3 and the substrate transport mechanism MHU4 of the second processing block 5 can put substrates W in and out of the substrate buffer BF. That is, the substrate W placed on the substrate buffer BF can be taken out in turn from four directions by the four substrate transport mechanisms MHU1 to MHU4.

[0065] like Figure 1 As shown, the substrate buffer BF includes three buffers BU1 to BU3. The three buffers BU1 to BU3 are arranged in a row in the vertical direction. The three buffers BU1 to BU3 each include a plurality of (eg, 15) substrate placement portions (not shown) arranged in the vertical direction for placing substrates W thereon.

[0066] The first buffer unit BU1 is provided at the same level (i.e., the lower level or the first level) as the transfer layer 3A of the first processing block 3 and the coating processing layer 5A of the second processing block 5. The second buffer unit BU2 is provided at the same level (i.e., the middle level or the second level) as the processing layer 3B of the first processing block 3 and the processing layer 5B of the second processing block 5. The third buffer unit BU3 is provided at the same level (i.e., the upper level or the third level) as the processing layer 3C of the first processing block 3 and the carrier buffer device 8. For example, the transfer layer 3A is provided at a different level from the coating processing layer 5B of the middle level.

[0067] (1-2) Configuration of Processing Blocks 3 and 5

[0068] Reference Figure 1 . The first processing block 3 has three processing layers 3A, 3B, and 3C. Among the three processing layers 3A to 3C, the processing layer 3A is a transfer layer which is a characteristic part of the present invention. The other processing layers 3B and 3C are development processing layers. On the other hand, the second processing block 5 has two coating processing layers 5A and 5B. In addition, the transfer layer 3A is appropriately referred to as the "IF layer 3A" hereinafter. The details of the IF layer 3A are described below.

[0069] The three processing layers 3A to 3C of the first processing block 3 are stacked in the vertical direction. The two processing layers 5A and 5B of the second processing block 5 are also stacked in the vertical direction. The two coating processing layers 5A and 5B perform coating processing on the substrate W. The two developing processing layers 3B and 3C perform developing processing on the substrate W. The IF layer 3A carries the substrate W in and out of the exposure device EXP as an external device.

[0070] The two development processing layers 3B and 3C are respectively provided with a third substrate transport mechanism MHU3, a plurality of liquid processing units 36, a plurality of heat treatment units 37 and a transport space 39 (see Figure 2 The two coating treatment layers 5A and 5B are respectively provided with a fourth substrate transport mechanism MHU4, a plurality of liquid treatment units 36, a plurality of heat treatment units 37 and a transport space 39 (see Figure 5 The transport space 39 is a rectangular space that is long in the X direction when viewed from above. The substrate transport mechanism MHU3 or the substrate transport mechanism MHU4 is disposed in the transport space 39. The liquid treatment unit 36 ​​and the heat treatment unit 37 are disposed across the transport space 39. Furthermore, the liquid treatment unit 36 ​​and the heat treatment unit 37 are disposed along the long side direction (X direction) of the transport space 39.

[0071] (1-2-1) Configuration of Substrate Transport Mechanisms MHU3 and MHU4

[0072] The substrate transport mechanisms MHU3 and MHU4 transport the substrate W respectively. Figure 1 As shown, the substrate transport mechanisms MHU3 and MHU4 each include two hand portions 41, an advance / retract drive portion 43, a rotation drive portion 45, a first moving mechanism 47, and a second moving mechanism 48. The two hand portions 41, the advance / retract drive portion 43, and the rotation drive portion 45 are respectively configured in the same manner as, for example, the two hand portions 21, the advance / retract drive portion 23, and the rotation portion 25B of the first substrate transport mechanism MHU1 (see Figure 3 , Figure 4 ).

[0073] The two hand-shaped parts 41 are movably mounted on the advance and retreat drive part 43. The advance and retreat drive part 43 makes the two hand-shaped parts 41 advance and retreat respectively. The rotation drive part 45 rotates the advance and retreat drive part 43 around the vertical axis AX3. In this way, the directions of the two hand-shaped parts 41 can be changed. The first moving mechanism 47 can make the rotation drive part 45 rotate in the vertical direction. Figure 1 The second moving mechanism 48 can move the first moving mechanism 47 in the front-back direction (X direction). Figure 1 By means of two moving mechanisms 47 and 48, the two hand-shaped parts 41 and the advancing and retreating driving part 43 can be moved in the XZ direction.

[0074] The forward / backward drive unit 43 , the rotation drive unit 45 , the first moving mechanism 47 , and the second moving mechanism 48 each include an electric motor.

[0075] (1-2-2) Configuration of Liquid Processing Unit 36

[0076] Figure 6This is a side view of the substrate processing apparatus 1 as viewed from the right side. Each of the five processing levels 3A to 3C, 5A, and 5B includes six liquid processing units 36. The six liquid processing units 36 can be arranged in two vertical stages and three horizontal rows. Figure 6 In the embodiment, the two coating treatment layers 5A and 5B respectively include three coating units BARC and three coating units PR. The two developing treatment layers 3B and 3C respectively include six developing units DEV. In addition, the number and type of liquid treatment units 36 (including the liquid treatment unit 36 ​​of the IF layer 3A) can be changed as needed.

[0077] Reference Figure 2 , Figure 5 . The liquid processing unit 36 ​​(coating unit BARC, PR and developing unit DEV) respectively includes a holding rotating part 51, a nozzle 52 and a nozzle moving mechanism 53. The holding rotating part 51 holds the lower surface of the substrate W, for example, by vacuum adsorption, and rotates the held substrate W around the vertical axis (Z direction). The nozzle 52 sprays a processing liquid (for example, a liquid for forming an anti-reflective film, a photoresist liquid or a developer) onto the substrate W. The nozzle 52 is connected to a processing liquid supply source via a pipe, and a pump and an opening and closing valve are provided on the pipe. The nozzle moving mechanism 53 moves the nozzle 52 to an arbitrary position. The holding rotating part 51 and the nozzle moving mechanism 53 respectively include, for example, an electric motor.

[0078] (1-2-3) Configuration of Heat Treatment Unit 37 (and Other Treatment Units)

[0079] Figure 7 1 is a side view of the substrate processing apparatus 1 viewed from the left side. The five processing layers 3A to 3C, 5A, and 5B may each include 16 heat treatment units 37. The 16 heat treatment units 37 are arranged in 4 stages × 4 rows. The heat treatment unit 37 includes a plate 55 (see FIG. 1 ) on which the substrate W is placed. Figure 2 , Figure 5 ), heat treatment is performed on the substrate W. The heat treatment unit 37 includes a heater such as an electric heater when heating the plate 55. In addition, the heat treatment unit 37 includes a water-cooling circulation mechanism or a Peltier element when cooling the plate 55. The number, type and position of the heat treatment units 37 can be changed appropriately.

[0080] Figure 7 In the embodiment, the two coating treatment layers 5A and 5B are provided with, for example, four cooling units CP and eight heating treatment units PAB, respectively. The cooling unit CP cools the substrate W. The heating treatment unit PAB bakes the coated substrate W. In addition, the two coating treatment layers 5A and 5B may also be provided with a close contact strengthening treatment unit AHP, respectively. The close contact strengthening treatment unit AHP applies a close contact strengthening agent such as hexamethyldisilazane (HMDS) to the substrate W and heats it.

[0081] In addition, the two development processing layers 3B and 3C, for example, respectively include 4 post-exposure baking processing units PEB, 4 cooling units CP, 6 post-baking units PB and 1 inspection unit LSCM2. The post-exposure baking processing unit PEB bakes the substrate W after exposure. The post-baking unit PB bakes the substrate W after the development processing. The inspection unit LSCM2 and the inspection unit LSCM1 described later are respectively equipped with a CCD (Charge Coupled Device) camera or an image sensor. The inspection unit LSCM2 inspects the substrate W after development. In addition, the heating processing unit PAB, the post-exposure baking processing unit PEB, the post-baking unit PB and the close contact strengthening processing unit AHP have cooling functions.

[0082] (1-2-4) Configuration of IF layer (transfer layer) 3A

[0083] The IF layer 3A is disposed below the two development-processed layers 3B and 3C. Figure 5 As shown, the IF layer 3A includes a processing region 57 , a transfer region 58 , and a buffer unit BU4 (transfer buffer unit). The processing region 57 is connected to the ID block 2 .

[0084] The processing area 57 is configured similarly to the two development processing layers 3B and 3C. That is, the processing area 57 includes a substrate transport mechanism MHU3, a plurality of liquid processing units 36, a plurality of heat treatment units 37, and a transport space 39. The liquid processing unit 36 ​​and the heat treatment unit 37 provided in the processing area 57 are exposure-related processing units. The exposure-related processing unit is a unit that performs a specific process on the substrate W after the coating process and before the development process. In addition, the substrate transport mechanism MHU3 of the IF layer 3A corresponds to the transport mechanism of the present invention.

[0085] The processing area 57 includes, for example, three backside cleaning units BSS and three post-exposure cleaning units SOAK as the liquid processing units 36 (see Figure 5 , Figure 6 The cleaning units BSS and SOAK include, for example, a holding and rotating unit for holding the substrate W and a nozzle for spraying a cleaning liquid onto the substrate W. In addition, the back cleaning unit BSS cleans the back side of the substrate W with a brush. The back side of the substrate W is, for example, the side opposite to the side on which the circuit pattern is formed.

[0086] In addition, the processing area 57 includes, for example, two edge exposure units EEW, one inspection unit LSCM1, and four post-exposure baking processing units PEB as the heat treatment unit 37 and other processing units (indicated by reference numeral 37) (see Figure 5 , Figure 7The edge exposure unit EEW performs exposure processing on the peripheral portion of the substrate W. Instead of the edge exposure unit EEW, a processing unit that performs overall wafer exposure (OWE) may be used. The inspection unit LSCM1 inspects a coating film (eg, a photoresist film).

[0087] The buffer unit BU4 includes a substrate mounting portion PS1 and a mounting and cooling portion P-CP (see Figure 1 The substrate placement part PS1 and the placement and cooling part P-CP are arranged in the up-down direction. The substrate placement part PS1 and the placement and cooling part P-CP place one or more substrates W, respectively. Figure 5 In the embodiment, the buffer unit BU4 (substrate placement unit PS1 and placement and cooling unit P-CP) is provided in the transfer space 39 of the processing area 57 to reduce the occupied area. In this regard, the buffer unit BU4 may also be provided in the transfer area 58. That is, the buffer unit BU4 is provided between the processing area 57 and the transfer area 58. The substrate transfer mechanism MHU3 of the processing area 57 can transfer the substrate W between the buffer unit BU1, the liquid processing unit 36, the heat treatment unit 37, other processing units (for example, the edge exposure unit EEW), the substrate placement unit PS1, and the placement and cooling unit P-CP.

[0088] The transfer area 58 is connected to the processing area 57. The transfer area 58 includes a substrate transport mechanism MHU5. The substrate transport mechanism MHU5 transports the substrate W between the exposure device EXP, the substrate loading unit PS1, and the loading and cooling unit P-CP. In addition, the substrate transport mechanism MHU5 can also directly transport the substrate W to the four thermal processing units 37 (post-exposure baking processing unit PEB, see Figure 5 ) on the flat plate 55A. The substrate transport mechanism MHU5 includes two hand-shaped parts 21 and the like, and is substantially similar to the substrate transport mechanisms MHU1 and MHU2. The substrate transport mechanism MHU5 is different from the substrate transport mechanisms MHU1 and MHU2 in that it is configured to move the lifting and rotating drive unit 25 in the horizontal Y direction orthogonal to the X direction in which the two processing blocks 3 and 5 are arranged. In addition, the substrate transport mechanism MHU5 corresponds to the transport mechanism for the exposure apparatus of the present invention.

[0089] In addition, if Figure 1 , Figure 6 , Figure 7 As shown, the transfer region 58 is arranged in such a manner that the end of the transfer region 58 on the exposure device EXP side protrudes outside the two development processing layers 3B and 3C. As a result, an air layer can be formed between the exposure device EXP and the substrate processing device 1. Therefore, when the thermal influence of the substrate processing device may affect the exposure device, the thermal influence can be blocked by the air layer.

[0090] (1-2-5) Configuration of Adjacent Processing Units AD1 and AD2

[0091] Reference Figure 7 The two development processing layers 3B and 3C each have four post-exposure baking processing units PEB (adjacent processing units AD1) arranged adjacent to the ID block 2. Fig. 8A As shown, the four post-exposure bake processing units PEB include, for example, two substrate carrying ports 60A and 60B for the substrate W to enter and exit from two directions. That is, the post-exposure bake processing units PEB each include a substrate carrying port 60A opened toward the transfer space 39 side, and a substrate carrying port 60B opened toward the substrate transfer mechanism MHU1 side of the ID block 2.

[0092] For example, in the development processing layer 3C, the substrate transport mechanism MHU3 can deliver the substrate W to the plate 55A of the post-exposure bake processing unit PEB through the substrate delivery port 60A. In addition, the substrate transport mechanism MHU1 of the ID block 2 can deliver the substrate W to the plate 55A of the post-exposure bake processing unit PEB through the substrate delivery port 60B.

[0093] in addition, Figure 7 In the embodiment, the processing area 57 of the IF layer 3A includes four post-exposure bake processing units PEB (adjacent processing units AD2) arranged adjacent to the transfer area 58. Figure 8B As shown, the four post-exposure bake processing units PEB include, for example, two substrate carrying ports 60A and 60C for the substrate W to enter and exit from two directions. That is, the post-exposure bake processing units PEB each include a substrate carrying port 60A opened toward the transfer space 39 side, and a substrate carrying port 60C opened toward the substrate transfer mechanism MHU5 side.

[0094] In the IF layer 3A, the substrate transport mechanism MHU3 can deliver the substrate W to the plate 55A of the post-exposure bake processing unit PEB through the substrate delivery port 60A. In addition, the substrate transport mechanism MHU5 of the transfer area 58 can deliver the substrate W to the plate 55A of the post-exposure bake processing unit PEB through the substrate delivery port 60C. In addition, the adjacent processing units AD1, AD2 and the adjacent processing unit AD3 described later are also exposure-related units.

[0095] (1-3) Configuration of Carrier Buffer Device 8

[0096] Reference Figure 1 , Figure 2The development processing layer 5C is arranged at the same level (third level) as the carrier buffer device 8 and the buffer unit BU3. That is, the height of the second processing block 5 is lower than the height of the first processing block 3. The carrier buffer device 8 (carrier conveying mechanism 61 and carrier storage rack 63) is mounted on the second processing block 5. Thus, the height of the substrate processing device 1 can be suppressed.

[0097] The carrier buffer device 8 includes a carrier transport mechanism 61 and a carrier storage rack 63. The carrier transport mechanism 61 transports the carrier C between the mounting tables 16 of the four openers 11 to 14 and the carrier storage rack 63. The carrier storage rack 63 stores the carrier C.

[0098] Reference Figure 2 The carrier transport mechanism 61 includes two multi-joint arms 65 and 66. A gripping portion 67 is provided at one end of the first multi-joint arm 65, and a gripping portion 68 is provided at one end of the second multi-joint arm 66. The other end of the first multi-joint arm 65 is supported by a pillar-shaped lifting drive portion 69 so as to be movable in the up-down direction (Z direction), and the other end of the second multi-joint arm 66 is supported by the lifting drive portion 69 so as to be movable in the up-down direction.

[0099] The two gripping parts 67 and 68 are respectively configured to grip, for example, protrusions provided on the upper surface of the carrier C. The lifting drive part 69 is configured to be able to lift and lower the two multi-joint arms 65 and 66 individually. The two gripping parts 67 and 68, the two multi-joint arms 65 and 66, and the lifting drive part 69 are respectively equipped with electric motors.

[0100] The front-rear drive unit 70 includes a support portion 70A that supports the lifting drive unit 69, a long side portion 70B that extends long in the front-rear direction (X direction), and an electric motor. For example, the long side portion 70B may be a track (guide rail), and the support portion 70A may be a trolley. In this case, the trolley (support portion 70A) may be moved along the track (long side portion 70B) by the electric motor.

[0101] Alternatively, for example, an electric motor, a plurality of pulleys, a conveyor belt, and a guide rail may be built into the long side portion 70B, and the support portion 70A may be fixed to the conveyor belt. In this case, the pulley may be rotated by the electric motor to move the conveyor belt mounted on the plurality of pulleys, thereby moving the support portion 70A along the guide rail. Alternatively, for example, an electric motor, a screw shaft, and a guide rail may be built into the long side portion 70B, and a nut portion meshing with the screw shaft may be provided on the support portion 70A. In this case, the screw shaft may be rotated by the electric motor to move the support portion 70A along the guide rail.

[0102] A track 77 of an external transport mechanism OHT (Overhead Hoist Transport) is provided above a portion of the carrier storage rack 63. The external transport mechanism OHT is a mechanism for transporting carriers C within the factory. The external transport mechanism OHT transports carriers C containing unprocessed substrates W to the carrier storage rack 63. In addition, the external transport mechanism OHT receives carriers C containing processed substrates W from the carrier storage rack 63. The unprocessed substrates W refer to substrates W that have not been processed by the substrate processing device 1 in this embodiment, and the processed substrates W refer to substrates W that have been processed by the substrate processing device 1 in this embodiment. The carrier transport mechanism 61 enables the carriers C to move freely between the mounting table 16 and each rack 63.

[0103] (2) Operation of Substrate Processing Apparatus 1

[0104] Next, the operation of the substrate processing apparatus 1 will be described. Fig. 9 It is a flowchart showing an example of a processing procedure of the substrate processing apparatus 1 .

[0105] Figure 2 The carrier transport mechanism 61 shown transports the carrier C containing the unprocessed substrate W transported by the external transport mechanism OHT to one of the openers 11 and 12. Here, the case where the carrier C is transported to the opener 11 is described. The shutter member and the shutter member driving mechanism (both not shown) remove the cover of the carrier C placed on the mounting table 16 of the opener 11 and open the opening 18.

[0106] [Step S01] Transferring a substrate W from a carrier C

[0107] The substrate transfer mechanism MHU1 of the ID block 2 takes out a substrate W from the carrier C on the mounting table 16 of the opener 11 , and transfers the substrate W to one of the two buffers BU1 and BU2 .

[0108] When all substrates W have been taken out from the carrier C, the carrier transport mechanism 61 transports the empty carrier C to one of the two openers 13 and 14. When the empty carrier C cannot be transported to either of the two openers 13 and 14, the carrier transport mechanism 61 transports the empty carrier C to the carrier storage rack 63. In addition, the carrier transport mechanism 61 transports a carrier C containing an unprocessed substrate W to the opener 11 instead of the empty carrier C.

[0109] Furthermore, after taking out all the substrates W from the carriers C on the mounting table 16 of the opener 11, the substrate transport mechanism MHU1 takes out the substrates W from the carriers C on the mounting table 16 of the opener 12. After taking out all the substrates W from the carriers C of the opener 12, the substrate transport mechanism MHU1 starts taking out substrates W again from the carriers C newly mounted on the opener 11. That is, the substrate transport mechanism MHU1 takes out substrates W alternately from the carriers C of the two openers 11 and 12.

[0110] [Step S02] Forming an anti-reflection film using the coating treatment layer 5A (5B)

[0111] For example, the coating treatment layer 5A forms an anti-reflection film and a photoresist film on the substrate W. Specifically, the substrate transport mechanism MHU4 of the coating treatment layer 5A takes out the substrate W from the buffer unit BU1 and transports the substrate W to the cooling unit CP, the coating unit BARC, and the heating treatment unit PAB in sequence. The coating unit BARC forms an anti-reflection film on the substrate W.

[0112] Then, the substrate transport mechanism MHU4 of the coating treatment layer 5A transports the substrate W with the antireflection film formed thereon to the cooling unit CP, the coating unit PR, the heating unit PAB, and the buffer unit BU1 in sequence. The coating unit PR forms a photoresist film on the substrate W (ie, on the antireflection film).

[0113] The coating treatment layer 5B is also subjected to the same treatment as the coating treatment layer 5A. When the coating treatment layer 5B is subjected to the coating treatment, the substrate W subjected to the coating treatment is transferred to the buffer unit BU2 by the substrate transfer mechanism MHU4 of the coating treatment layer 5B. In this case, one of the two substrate transfer mechanisms MHU1 and MHU2 of the ID block 2 transfers the substrate W from the buffer unit BU2 to the buffer unit BU1.

[0114] [Step S03] Processing using the transfer layer 3A

[0115] The IF layer 3A carries out the substrate W after the coating process in the coating process layer 5A (5B) to the exposure device EXP. Also, the IF layer 3A carries in the substrate W after the exposure process in the exposure device EXP to the IF layer 3A. This will be described in detail.

[0116] The substrate transport mechanism MHU3 (see Figure 5) takes out the substrate W from the buffer unit BU1, and transports the substrate W to the inspection unit LSCM1, the edge exposure unit EEW, the back cleaning unit BSS, and the placement and cooling unit P-CP (buffer unit BU4) in sequence. The inspection unit LSCM1 inspects and measures the photoresist film (coating film). The substrate transport mechanism MHU5 of the transfer area 58 takes out the substrate W from the placement and cooling unit P-CP, and carries the substrate W out to the exposure device EXP. The exposure device EXP performs exposure processing on the substrate W that has been carried out.

[0117] The substrate transport mechanism MHU5 transports the substrate W processed by the exposure device EXP into the transfer area 58, and transports the substrate W to the substrate mounting portion PS1 (buffer portion BU4, see Figure 1 ). The substrate transfer mechanism MHU3 of the processing area 57 receives the substrate W from the substrate placement unit PS1, and sequentially transfers the substrate W to the post-exposure cleaning unit SOAK and the buffer unit BU1.

[0118] In addition, when the exposure device EXP does not use the liquid immersion exposure technology for exposure processing, it can also be as follows Fig. 9 As shown by the dotted line, the cleaning process of the post-exposure cleaning unit SOAK is not performed. In this case, the substrate transfer mechanism MHU3 of the process area 57 receives the substrate W from the substrate placement unit PS1 and directly transfers the substrate W to the buffer unit BU1.

[0119] The substrate transport mechanism MHU1 of the ID block 2 receives the substrate W from the buffer unit BU1. Figure 7 , Fig. 8A As shown, the substrate transport mechanism MHU1 directly transports the substrate W to any one of the four post-exposure baking processing units PEB of the development processing layer 3B. The four post-exposure baking processing units PEB are adjacent to the processing unit AD1. Fig. 8A As shown in FIG. 1 , the substrate transport mechanism MHU1 does not transport the substrate W to the buffer unit BU2, but directly transports the substrate W to the plate 55A of the specific post-exposure bake unit PEB through the substrate transport port 60B. As a result, the operation of the substrate transport mechanism MHU3 of the development processing layer 3B to take out the substrate W from the buffer unit BU2 and transport the taken-out substrate W to the plate 55A of the post-exposure bake unit PEB through the substrate transport port 60A can be omitted. Therefore, the load of substrate transport of the substrate transport mechanism MHU3 of the development processing layer 5B can be reduced.

[0120] In addition, when the substrate W is transferred to any of the four post-exposure baking processing units PEB of the adjacent processing unit AD1 of the development processing layer 3C, the same processing as described above is also performed. In addition, the substrate W after exposure processing is alternately transferred from the IF layer 3A to the two development processing layers 3B and 3C.

[0121] [Step S04] Development treatment using the development treatment layer 3B (3C)

[0122] The development processing layers 3B and 3C perform development processing on the substrate W, respectively. The following is a specific description. The substrate W directly transported by the substrate transport mechanism MHU1 is heat-treated by the post-exposure baking processing unit PEB. The substrate transport mechanism MHU3 of the development processing layer 3B receives the substrate W from the post-exposure baking processing unit PEB and transports the substrate W to the cooling unit CP, the developing unit DEV, the post-baking unit PB, the inspection unit LSCM2, and the buffer unit BU2 in sequence. The developing unit DEV performs development processing on the substrate W after the exposure processing by the exposure device EXP. The inspection unit LSCM2 inspects the substrate W after development.

[0123] The development processing layer 3C is subjected to the same treatment as the development processing layer 3B. The development processing layer 3C finally transports the developed substrate W to the buffer unit BU3.

[0124] [Step S05] Transferring the substrate to the carrier C

[0125] The substrate transfer mechanism MHU2 of the ID block 2 takes out a substrate W from one of the two buffers BU2 and BU3, and transfers the taken-out substrate W to a carrier C placed on the mounting table 16 of one of the two openers 13 and 14 (for example, the opener 13). In addition, the substrate transfer mechanism MHU2 alternately takes out substrates W from the two buffers BU2 and BU3, and transfers the taken-out substrates W to the carrier C placed on the mounting table 16. When all the substrates W are transferred back to the carrier C, the shutter member and the shutter drive mechanism cover the carrier C and close the opening 18. Then, the carrier transfer mechanism 61 transfers the carrier C containing the processed substrate W from the opener 13 to hand it over to the external transfer mechanism OHT.

[0126] According to the present embodiment, the first processing block 3 includes development processing layers 3B, 3C and IF layer 3A arranged in the up-down direction. Therefore, the IF layer 3A can be connected to the ID block 2. In addition, the substrate transport mechanisms MHU1 and MHU2 of the ID block 2 transport the substrate W from the buffer portion (for example, BU2) of the substrate buffer BF located at a specific height position to the buffer portion (for example, BU1) of the substrate buffer BF located at another height position. Therefore, the IF layer 3A only needs to enter and exit the buffer portion BU1 corresponding to the height of the IF layer 3A. Therefore, the IF layer 3A can be simplified. In addition, since the IF layer 3A is arranged in the up-down direction of the development processing layers 3B and 3C, the occupied area of ​​the substrate processing device 1 can be reduced.

[0127] In addition, the IF layer 3A includes a processing area 57 connected to the ID block 2, a buffer unit BU4 for placing a substrate W, and a transfer area 58 connected to the processing area 57 via the buffer unit BU4. The processing area 57 includes exposure-related processing units (for example, a back cleaning unit BSS, a post-exposure cleaning unit SOAK, an edge exposure unit EEW, an inspection unit LSCM1, and a post-exposure baking processing unit PEB), and a substrate transport mechanism MHU3. In addition, the substrate transport mechanism MHU3 transports the substrate W between the substrate buffer BF of the ID block 2, the post-exposure baking processing unit PEB, and the buffer unit BU4. The transfer area 58 does not include an exposure-related processing unit (for example, a post-exposure baking processing unit PEB), but includes a substrate transport mechanism MHU5 (a transport mechanism for an exposure device) that transports the substrate W between the exposure device EXP and the buffer unit BU4.

[0128] Since the exposure-related processing unit is provided in the IF layer 3A, the number of exposure-related processing units provided in other processing layers can be reduced. Thus, other processing layers can be provided with processing units other than the exposure-related processing unit.

[0129] [Example 2]

[0130] Next, Embodiment 2 of the present invention will be described with reference to the drawings. In addition, descriptions overlapping with Embodiment 1 will be omitted. Fig.10 This is a flowchart showing an example of a processing step of the substrate processing apparatus 1 according to the second embodiment.

[0131] In the first embodiment, the substrate W after the exposure process is cleaned by the post-exposure cleaning unit SOAK. In this regard, when the exposure device EXP does not use the liquid immersion exposure technology to perform the exposure process, the cleaning process of the post-exposure cleaning unit SOAK may not be performed. In the second embodiment, the operation of the substrate processing device 1 in this case is described. In particular, the parts different from the first embodiment are described.

[0132] [Step S03A] Processing using IF layer 3A

[0133] The IF layer 3A carries out the substrate W after the coating treatment by the coating treatment layer 5A (5B) to the exposure device EXP. The exposure device EXP performs exposure treatment on the carried out substrate W. The operation up to this point is the same as that of the embodiment 1, so the specific description is omitted. Then, the IF layer 3A carries out the substrate W after the exposure treatment by the exposure device EXP to the IF layer 3A. The specific description is given.

[0134] The substrate transport mechanism MHU5 transports the substrate W processed by the exposure unit EXP into the transfer area 58, and does not transport the substrate W to the substrate placement unit PS1 (buffer unit BU4), but transports the substrate W to any one of the four post-exposure bake processing units PEB (see Figure 7 ). The four post-exposure bake processing units PEB are adjacent processing units AD2 adjacent to the transfer area 58. In this case, Figure 8B As shown, the four post-exposure bake processing units PEB are respectively provided with two substrate carrying ports 60A and 60C so that the substrate W can enter and exit from two directions. Therefore, the substrate transport mechanism MHU5 of the transfer area 58 allows the hand unit 21 to enter the substrate carrying port 60C without passing through the substrate placement unit PS1 (buffer unit BU4), and directly transports the substrate W to a specific post-exposure bake processing unit PEB.

[0135] Thus, the operation of the substrate transport mechanism MHU3 in the processing area 57 of the IF layer 3A to take out the substrate W from the substrate mounting part PS1 (buffer part BU4) and to transport the taken out substrate W to the plate 55A of the post-exposure baking processing part PEB through the substrate carrying port 60A can be omitted. Therefore, the load of substrate transport of the substrate transport mechanism MHU3 in the processing area 57 can be reduced. In addition, by shortening the time from the end of exposure to the start of the post-exposure baking process, the dimensional uniformity of the photoresist pattern after development is stabilized.

[0136] Then, the substrate transport mechanism MHU3 of the processing area 57 of the IF layer 3A receives the substrate W from the post-exposure bake processing unit PEB through the substrate transport port 60A. Next, the substrate transport mechanism MHU3 transports the substrate W to the buffer unit BU1. Then, one of the two substrate transport mechanisms MHU1 and MHU2 receives the substrate W from the buffer unit BU1 and transports the substrate W to one of the buffer units BU2 and BU3.

[0137] According to the present embodiment, the processing area 57 is provided with four post-exposure baking processing units PEB (adjacent processing unit AD2) arranged adjacent to the transfer area 58. The fifth substrate transport mechanism MHU5 of the transfer area 58 directly transports the substrate W after the exposure process to the post-exposure baking processing unit PEB (adjacent processing unit AD2) of the processing area 57. In the IF layer 3A, for example, when the substrate W is transported from the transfer area 58 to the processing area 57 via the buffer unit BU4, the substrate transport mechanism MHU3 of the processing area 57 must transport the substrate W from the buffer unit BU4 to any one of the four post-exposure baking processing units PEB (adjacent processing unit). According to the present embodiment, the substrate transport mechanism MHU5 can transport the substrate W after the exposure process to the post-exposure baking processing unit PEB without passing through the buffer unit BU4. Therefore, the load of substrate transport of the substrate transport mechanism MHU3 of the processing area 57 can be reduced. In addition, by shortening the time from the end of exposure to the start of the post-exposure baking process, the dimensional uniformity of the photoresist pattern after development is stabilized.

[0138] [Example 3]

[0139] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Embodiments 1 and 2 will be omitted.

[0140] In Example 1, Figure 1 As shown, the IF layer 3A is arranged in such a manner that the end of the IF layer 3A on the side of the exposure device EXP of the development processing layers 3B and 3C protrudes to the outside of the development processing layers 3B and 3C. In this regard, in Example 3, the IF layer 3A can also be arranged in such a manner that the end of the IF layer 3A on the side of the exposure device EXP is retracted inside the development processing layers 3B and 3C.

[0141] Fig.11 It is a longitudinal sectional view of the substrate processing apparatus 1 of the third embodiment. Fig.11 In the embodiment, the end of the transfer region 58 on the side of the exposure device EXP is consistent with the end of the development processing layer 3B, 3C on the side of the exposure device EXP. That is, the side surface SF1 on the side of the exposure device EXP of the transfer region 58 is aligned with the side surface SF2 on the side of the exposure device EXP of the development processing layer 3B, 3C, without a step difference.

[0142] in addition, Fig. 12A This is a cross-sectional view showing the structure and operation of the IF layer 3A of Example 3. Since the transfer area 58 enters the inner side of the development processing layer 3B, 3C, the setting area of ​​the processing area 57 is reduced. Therefore, the back cleaning unit BSS and the post-exposure cleaning unit SOAK are arranged in a space of 2 sections × 2 columns. In addition, the post-exposure baking processing unit PEB, the edge exposure unit EEW and the inspection unit LSCM1 are arranged in a space of 3 sections × 4 columns.

[0143] The operation of the substrate processing apparatus 1 is performed as shown in steps S03 and S03A of the first and second embodiments. Fig. 9 As shown in step S03, the substrate transport mechanism MHU3 of the processing area 57 of the IF layer 3A takes out the substrate W from the buffer unit BU1, and sequentially transports the substrate W to the inspection unit LSCM1, the edge exposure unit EEW, the back cleaning unit BSS, and the placement and cooling unit P-CP (buffer unit BU4). Then, the substrate transport mechanism MHU5 of the transfer area 58 takes out the substrate W from the placement and cooling unit P-CP, and transports the substrate W to the exposure device EXP.

[0144] Then, the substrate transport mechanism MHU5 transports the substrate W processed by the exposure device EXP to the transfer area 58, and transports the substrate W to the substrate mounting part PS1 (buffer part BU4). The substrate transport mechanism MHU3 of the processing area 57 takes out the substrate W from the substrate mounting part PS1, and transports the substrate W to the post-exposure cleaning unit SOAK and the buffer part BU1 in sequence.

[0145] According to the present embodiment, the transfer region 58 is arranged so that the end of the transfer region 58 on the exposure device EXP side is received inside the two development processing layers 3B and 3C. This can reduce the occupied area of ​​the substrate processing apparatus 1.

[0146] In addition, if Fig. 12B As shown, the processing area 57 includes an edge exposure unit EEW and an inspection unit LSCM1 arranged in the up-down direction. The edge exposure unit EEW and the inspection unit LSCM1 are adjacent to the transfer area 58. The edge exposure unit EEW is an adjacent processing unit AD3. The edge exposure unit EEW (adjacent processing unit AD3) and the post-exposure baking processing unit PEB (adjacent processing unit AD2) are arranged in a manner of sandwiching the conveying space 39. The edge exposure unit EEW as the adjacent processing unit AD3 is provided with two substrate carrying ports 60A and 60D in the same manner as the adjacent processing units AD1 and AD2, so that the substrate W can be entered and exited from two directions. The substrate carrying port 60D is open toward the transfer area 58 side.

[0147] For example, when the processing by the back side cleaning unit BSS and the post-exposure cleaning unit SOAK is unnecessary, the substrate processing apparatus 1 operates as follows. Fig. 12BIn the embodiment, the substrate transport mechanism MHU3 of the processing area 57 of the IF layer 3A takes out the substrate W from the buffer unit BU1 and transports the substrate W to the inspection unit LSCM1 and the edge exposure unit EEW in sequence. At this time, the substrate transport mechanism MHU3 of the processing area 57 transports the substrate W to the edge exposure unit EEW through the substrate transport port 60A. After the substrate W is processed by the edge exposure unit EEW, the substrate transport mechanism MHU5 of the transfer area 58 receives the substrate W from the edge exposure unit EEW through the substrate transport port 60D and transports the substrate W to the exposure device EXP. Thus, the process of receiving the substrate W from the edge exposure unit EEW and transporting it to the buffer unit BU4 by the substrate transport mechanism MHU3 of the processing area 57 can be omitted. Therefore, the burden of substrate transport on the substrate transport mechanism MHU3 of the processing area 57 can be reduced.

[0148] Then, the substrate transport mechanism MHU5 transports the substrate W after the exposure process from the exposure device EXP to the transfer area 58, and does not transport the substrate W to the substrate loading unit PS1 (buffer unit BU4), but directly transports the substrate W to any one of the four post-exposure baking processing units PEB. The transport is performed through the substrate transport port 60C. In addition, the four post-exposure baking processing units PEB are adjacent to the processing unit AD2 (refer to Figure 7 ). After the processing is performed in the post-exposure baking processing unit PEB, the substrate transfer mechanism MHU3 of the processing area 57 receives the substrate W from the post-exposure baking processing unit PEB through the substrate transfer port 60A and transfers the substrate W to the buffer unit BU1. As a result, the process of taking out the substrate W from the buffer unit BU4 and transferring the substrate W to the post-exposure baking processing unit PEB by the substrate transfer mechanism MHU3 of the processing area 57 can be omitted. Therefore, the burden of substrate transfer on the substrate transfer mechanism MHU3 of the processing area 57 can be reduced.

[0149] In addition, if Fig. 12B As shown, the processing area 57 is provided with an inspection unit LSCM1 adjacent to the transfer area 58 and arranged on the upper side or the lower side of the edge exposure unit EEW. The inspection unit LSCM1 may also be adjacent to the processing unit AD3. In this case, the substrate transport mechanism MHU3 of the processing area 57 can transport the substrate W to the inspection unit LSCM1 through the substrate transport port 60A, and the substrate transport mechanism MHU5 of the transfer area 58 can receive the substrate W from the inspection unit LSCM1 through the substrate transport port 60D. In addition, when the back cleaning unit BSS and the post-exposure cleaning unit SOAK are not required, the back cleaning unit BSS and the post-exposure cleaning unit SOAK may not be provided. In addition, when the buffer unit BU4 is not required, the buffer unit BU4 may not be provided.

[0150] [Example 4]

[0151] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first to third embodiments will be omitted.

[0152] In the IF layer 3A of the first embodiment, the substrate W is transferred from the buffer unit BU1 to the exposure unit EXP, and after the exposure process, the substrate W is transferred from the exposure unit EXP back to the buffer unit BU1. In this regard, the substrate W may be transferred to the two development processing layers 3B and 3C without being transferred back to the buffer unit BU1 after the exposure process and without using the two substrate transfer mechanisms MHU1 and MHU2 of the ID block 2.

[0153] Fig.13 : is a cross-sectional view of the IF layer 3A of the fourth embodiment. The IF layer 3A includes a transport space 81, a sixth substrate transport mechanism MHU6, and a substrate placement portion PS2. The transport space 81 is an area where the heat treatment unit 37 of the processing area 57 is arranged, and is provided adjacent to the transfer area 58. The substrate transport mechanism MHU6 is arranged in the transport space 81. The substrate transport mechanism MHU6 is configured similarly to the substrate transport mechanisms MHU1 and MHU2. The substrate placement portion PS2 is arranged in the transfer area 58 in a manner that allows the two substrate transport mechanisms MHU5 and MHU6 to transfer the substrate W, or is arranged between the transfer area 58 and the transport space 81. The substrate placement portion PS2 places one or more substrates W.

[0154] The back cleaning unit BSS is arranged in a space of 2 stages x 2 rows. The edge exposure unit EEW and the inspection unit LSCM1 are arranged in a space of 4 stages x 2 rows. The sixth substrate transport mechanism MHU6 corresponds to the inter-layer transport mechanism of the present invention.

[0155] Fig.14 1 is a cross-sectional view showing two development processing layers 3B and 3C of Example 4. The two development processing layers 3B and 3C are respectively provided with a transfer space 81. The transfer space 81 is provided in a region where the heat treatment unit 37 and other treatment units 37 are arranged. Fig.14 In the figure, the transfer space 81 is separated between the multiple post-exposure baking processing units PEB. The multiple post-exposure baking processing units PEB are respectively equipped with two substrate transfer ports 60A and 60E so that the substrate can enter from two directions. The substrate transfer mechanism MHU6 transfers the substrate W taken out from the substrate loading unit PS2 to the post-exposure baking processing unit PEB of the development processing layer 3B and 3C through the substrate transfer port 60E. The substrate transfer mechanism MHU3 of the development processing layer 3B and 3C delivers the substrate W to the flat plate 55 of the post-exposure baking processing unit PEB through the substrate transfer port 60A. In addition, the developing unit DEV is arranged in a space of 2 sections × 3 columns.

[0156] Reference Fig.15 . Fig.15This is a side view of the substrate processing apparatus 1 of Embodiment 4 as viewed from the left side. The transfer space 81 is a space extending in the vertical direction from the processing area 57 of the IF layer 3A through the two development processing layers 3B and 3C. The sixth substrate transfer mechanism MHU6 can move its two hand-shaped parts 21 from the lower IF layer 3A to the upper development processing layer 3C.

[0157] The two development processing layers 3B and 3C respectively have eight post-exposure baking processing parts PEB as adjacent processing units AD4 and AD5. Fig.15 As shown in FIG. 1 , eight post-exposure baking processing units PEB are adjacent to the conveying space 81, and are arranged in a manner that each of the four stages of post-exposure baking processing units PEB is separated by the conveying space 81. The sixth substrate conveying mechanism MHU6 arranged in the conveying space 81 transfers the substrate W through the substrate carrying inlet 60E (see FIG. 1 ) of each post-exposure baking processing unit PEB. Fig.14 ) are transported to each post-exposure baking processing unit PEB. In addition, the two development processing layers 3B and 3C are respectively equipped with four post-baking units PB.

[0158] In addition, the number and type of the heat treatment unit 37 and other processing units can be changed as needed. For example, part of the eight post-exposure baking processing units PEB and the four post-bake units PB can be replaced with the cooling unit CP. Fig.14 As shown, the ID block 2 may also include an inspection unit LSCM2. In this case, the inspection unit LSCM2 may be provided in a manner that is separated from the buffer units BU2 and BU3 (substrate buffers BF) by the substrate transport mechanism MHU1. In addition, the inspection unit LSCM2 may also be provided in a manner that is separated from the buffer units BU2 and BU3 by the substrate transport mechanism MHU2. The inspection unit LSCM2 is provided at each level of the two development processing layers 3B and 3C.

[0159] Next, refer to Fig.10 The operation of the substrate processing apparatus 1 will be described. The substrate W is subjected to coating processing in one of the two coating processing layers 5A and 5B, and is then conveyed to the buffer unit BU1.

[0160] [Step S03A] Processing using IF layer 3A

[0161] The IF layer 3A carries out the substrate W after the coating treatment by the coating treatment layer 5A (5B) to the exposure device EXP. The exposure device EXP performs exposure treatment on the carried out substrate W. The operation up to this point is the same as that of the embodiment 1, so the specific description is omitted. Then, the IF layer 3A carries out the substrate W after the exposure treatment by the exposure device EXP to the IF layer 3A. The specific description is given.

[0162] The substrate transport mechanism MHU5 transports the substrate W processed by the exposure device EXP to the transfer area 58, and transports the substrate W to the substrate mounting portion PS2. The substrate transport mechanism MHU6 takes out the substrate W from the substrate mounting portion PS2. Fig.15 As shown, the substrate transport mechanism MHU6 transports the substrate W to any one of the eight post-exposure bake processing units PEB of one of the two development processing layers 3B and 3C. Fig.14 ) The substrate W is transported to the post-exposure baking processing unit PEB.

[0163] [Steps S04, S05] Development treatment using the development treatment layer 3B (3C) etc.

[0164] For example, in the development processing layer 3B, the substrate transport mechanism MHU3 receives the substrate W after the heat treatment from the post-exposure baking processing unit PEB through the substrate transport port 60A. Then, the substrate transport mechanism MHU3 sequentially transports the substrate W to the development unit DEV, the post-bake unit PB, and the buffer unit BU2. In addition, when the development processing layer 3B is provided with a cooling unit CP, the substrate transport mechanism MHU3 sequentially transports the substrate W after the heat treatment in the post-exposure baking processing unit PEB to the cooling unit CP, the development unit DEV, the post-bake unit PB, and the buffer unit BU2. In addition, the transport to the post-bake unit PB may be omitted. Then, one of the two substrate transport mechanisms MHU1 and MHU2 of the ID block 2 receives the substrate W from the buffer unit BU2 and transports the substrate W to the inspection unit LSCM2. Then, when the substrate W is inspected by the inspection unit LSCM2 on the side of the first substrate transport mechanism MHU1, the substrate transport mechanism MHU1 transports the substrate W to one of the two buffer units BU2 and BU3. Then, the second substrate transport mechanism MHU2 receives the substrate W from any one of the inspection unit LSCM2, the buffer unit BU2, and the buffer unit BU3 on the second substrate transport mechanism MHU2 side, and transports the substrate W to the carrier C on the mounting table 16 of one of the two openers 13 and 14.

[0165] According to the present embodiment, the transfer area 58 includes a substrate mounting portion PS2 for mounting a substrate W. The first processing block 3 includes a transport space 81 extending in the vertical direction from the processing area 57 of the IF layer 3A through the two development processing layers 3B and 3C, and a sixth substrate transport mechanism MHU6 disposed in the transport space 81. The two development processing layers 3B and 3C include a post-exposure baking processing portion PEB (adjacent processing units AD4 and AD5) disposed adjacent to the transport space 81. The substrate transport mechanism MHU6 receives the substrate W from the substrate mounting portion PS2 of the transfer area 58, and directly transports the substrate W to the post-exposure baking processing portion PEB of the two development processing layers 3B and 3C.

[0166] In the case where the substrate W is transported from the IF layer 3A to the ID block 2 and then transported from the ID block 2 to the two development processing layers 3B and 3C, a lot of time may be required. In addition, a large burden may be placed on the transport mechanism of the IF layer 3A. According to the present embodiment, the substrate W can be directly transported to the post-exposure baking processing unit PEB of the two development processing layers 3B and 3C without passing through the ID block 2. Therefore, the substrate W can be transported to the two development processing layers 3B and 3C more quickly, and the burden on the substrate transport mechanism MHU3 of the IF layer 3A can be reduced. In addition, the transport space 81 for configuring the substrate transport mechanism MHU6 is provided not only in the IF layer 3A, but also in the area of ​​the development processing layers 3B and 3C. Therefore, the simplicity of the IF layer 3A is maintained.

[0167] In addition, the effect is supplemented. Fig.16A As shown in FIG. 1 , if the substrate W is moved back and forth between the exposure device EXP and the ID block 2, it is possible that a large burden is placed on the substrate transport of the substrate transport mechanism MHU3 of the IF layer 3A. In addition, it is also possible that a burden is placed on the substrate transport of the two substrate transport mechanisms MHU1 and MHU2 of the ID block 2. Fig. 16B As shown, by setting up the substrate transfer mechanism MHU6 in the first processing block 3, not only the return path for transferring the substrate from the exposure device EXP to the ID block 2 is omitted, but also the burden of substrate transfer in the ID block 2 is reduced.

[0168] In addition, if Fig.17 As shown in FIG. Fig.15 In the embodiment, the two development processing layers 3B and 3C each have four post-exposure baking processing units PEB as adjacent processing units AD5. Fig.17In the embodiment, the two development processing layers 3B and 3C may each be provided with two post-exposure cleaning units SOAK instead of four post-exposure baking processing units PEB. In this case, the following operation may also be performed. The sixth substrate transport mechanism MHU6 takes out the substrate W from the substrate loading unit PS2 of the transfer area 58, and directly transports the substrate W to one of the two post-exposure cleaning units SOAK of one of the two development processing layers 3B and 3C. Then, the substrate transport mechanism MHU3 or the substrate transport mechanism MHU6 of each of the two development processing layers 3B and 3C receives the substrate W from the post-exposure cleaning unit SOAK, and transports the substrate W to the post-exposure baking processing unit PEB.

[0169] The present invention is not limited to the above-described embodiment, and can be implemented in various modified forms as follows.

[0170] (1) In the fourth embodiment, the transfer region 58 is arranged so that the end of the transfer region 58 on the exposure device EXP side is received inside the two development processing layers 3B and 3C. In this regard, the transfer region 58 may be arranged so that the end of the transfer region 58 on the exposure device EXP side protrudes outside the two development processing layers 3B and 3C as in the first embodiment. The configuration of this modified example can also obtain the same effect as that of the fourth embodiment.

[0171] Reference Fig.18 The first processing block 3 includes a transfer space 81 extending in the vertical direction from the processing area 57 of the IF layer 3A through the two development processing layers 3B and 3C, and a sixth substrate transfer mechanism MHU6 disposed in the transfer space 81. Fig.18 As shown, the two development processing layers 3B and 3C are respectively provided with four post-exposure baking processing parts PEB (adjacent processing unit AD4) arranged adjacent to the transfer space 81. The substrate transfer mechanism MHU6 takes out the substrate W from the substrate mounting part PS2 and directly transfers the substrate W to any one of the four post-exposure baking processing parts PEB of one of the two development processing layers 3B and 3C.

[0172] (2) In each of the above-mentioned embodiments 1 and 2, the first processing block 3 includes an IF layer 3A and two development processing layers 3B and 3C, and the second processing block 5 includes two coating processing layers 5A and 5B. In this regard, the arrangement of the two development processing layers 3B and 3C and the two coating processing layers 5A and 5B may be reversed. In other words, the first processing block 3 may include an IF layer 3A and two coating processing layers 5A and 5B, and the second processing block 5 may include two development processing layers 3B and 3C.

[0173] (3) In each of the above-mentioned embodiments and variations, the first processing block 3 has two developing processing layers 3B and 3C. In this regard, the first processing block 3 may also have one or more than three developing processing layers. In addition, the second processing block 5 may also have more than three coating processing layers. In order to mount the carrier buffer device 8 in the second processing block 5, the number of coating processing layers is preferably less than the number of developing processing layers. In order to maintain a good balance of parallel processing, the number of coating processing layers is more preferably the same as the number of developing processing layers.

[0174] The present invention can be implemented in other specific forms without departing from the spirit or essence thereof. Therefore, the scope of the invention is not indicated by the above description but by reference to the appended claims.

[0175] [Explanation of Symbols]

[0176] 1 Substrate processing device

[0177] 2 Carrier Block (ID Block)

[0178] 3. Processing Block 1

[0179] 3A Transfer layer (IF layer)

[0180] 3B, 3C development treatment layer

[0181] 5. Second processing block

[0182] 5A, 5B coating treatment layer

[0183] 8 Carrier buffer device

[0184] 16 Loading table

[0185] 21, 41 hand shape part

[0186] BF Substrate Buffer

[0187] BU1~BU4 Buffer unit

[0188] 36 Liquid Handling Unit

[0189] 37 Heat treatment unit

[0190] EXP Exposure Device

[0191] 57 Processing Area

[0192] 58 Transfer Area

[0193] 60A Substrate transfer port

[0194] 60B Substrate transfer port

[0195] 81 Transport Space

[0196] BSS Backside Cleaning Unit

[0197] SOAK post-exposure cleaning unit

[0198] PEB Post Exposure Bake Processing Unit

[0199] PS1 Substrate mounting unit

[0200] PS2 substrate mounting unit

[0201] MHU1~MHU6 substrate transport mechanism.

Claims

1. A substrate processing device, characterized in that have: The carrier block is provided with a carrier mounting table for mounting a carrier capable of accommodating a substrate, and has a substrate buffer and a carrier mechanism, wherein the substrate buffer has a plurality of buffer portions for mounting the substrate, and the carrier mechanism transports the substrate; The first processing block includes a transfer layer for transferring a substrate into and out of an external device, and a first processing layer disposed on an upper side or a lower side of the transfer layer; A second processing block having a plurality of second processing layers arranged in a vertical direction; A carrier storage rack for storing the carrier; as well as a carrier transport mechanism for transporting the carrier between the carrier placement table and the carrier storage rack; and The first processing block, the carrier block, and the second processing block are sequentially connected in a horizontal direction, and the carrier mechanism transfers a substrate between the carrier mounted on the carrier mounting table and the substrate buffer. The transfer mechanism transports the substrate from a buffer portion of the substrate buffer located at a specific height position to a buffer portion of the substrate buffer located at another height position. The plurality of second processing layers receive and deliver substrates to the buffer portions of the substrate buffer located at height positions corresponding to the plurality of second processing layers, respectively. The transfer layer receives at least the substrate at a buffer portion located at a height position corresponding to the transfer layer relative to the substrate buffer. The first processing layer at least delivers the substrate to the buffer portion of the substrate buffer located at a height position corresponding to the first processing layer. The height of the second processing block is lower than that of the first processing block. The carrier storage rack and the carrier transport mechanism are mounted on the second processing block.

2. The substrate processing device according to claim 1, characterized in that: The first processing layer is a development processing layer, The second treatment layer is a coating treatment layer, The external device is an exposure device.

3. The substrate processing device according to claim 2, characterized in that: The transmission layer comprises: a processing area connected to the carrier block, and a transfer region connected to the processing region, The processing area includes: an exposure-related processing unit for performing specific processing on the substrate after coating processing and before developing processing; and a conveying mechanism for conveying the substrate between the substrate buffer of the carrier block, the exposure-related processing unit and the transfer area; The transfer area includes an exposure device transport mechanism for transporting a substrate between the exposure device and the processing area.

4. The substrate processing device according to claim 3, characterized in that: The transfer region is arranged such that an end of the transfer region on the exposure device side protrudes outside the first processing layer.

5. The substrate processing device according to claim 3, characterized in that: The transfer region is arranged such that an end of the transfer region on the exposure device side is received inside the first processing layer.

6. The substrate processing device according to any one of claims 3 to 5, characterized in that: The transfer region includes a substrate mounting portion for mounting a substrate, The first processing block includes a transport space extending in a vertical direction from the processing area of ​​the transfer layer through the first processing layer, and an inter-layer transport mechanism disposed in the transport space. The first processing layer includes an adjacent processing unit arranged adjacent to the conveying space. The inter-layer transfer mechanism receives a substrate from the substrate placement portion of the transfer region and directly transfers the substrate to the adjacent processing unit of the first processing layer.

7. The substrate processing device according to any one of claims 3 to 5, characterized in that: The processing area includes an adjacent processing unit, the adjacent processing unit is the exposure-related processing unit, and is arranged adjacent to the transfer area. The exposure device uses a transport mechanism to directly transport the substrate after the exposure process to the adjacent processing unit in the processing area.

8. A substrate transport method, which is a substrate transport method of a substrate processing device, wherein the substrate processing device comprises: The carrier block is provided with a carrier mounting table for mounting a carrier capable of accommodating a substrate, and has a substrate buffer and a carrier mechanism, wherein the substrate buffer has a plurality of buffer portions for mounting the substrate, and the carrier mechanism transports the substrate; A first processing block having a first processing layer; and A second processing block having a plurality of second processing layers arranged in a vertical direction; The first processing block, the carrier block and the second processing block are sequentially connected in a horizontal direction; The substrate transfer method is characterized by comprising the following steps: The substrate is transferred between the carrier mounted on the carrier mounting table and the substrate buffer by the transfer mechanism; The substrate is transported from a buffer portion of the substrate buffer located at a specific height position to a buffer portion of the substrate buffer located at another height position by the transfer mechanism; receiving and delivering the substrate to the buffer portion of the substrate buffer located at a height position corresponding to each of the plurality of second processing layers through each of the plurality of second processing layers; At least the substrate is received by the transfer layer disposed on the upper side or the lower side of the first processing layer relative to the buffer portion of the substrate buffer located at a height position corresponding to the transfer layer; Passing at least a substrate to a buffer portion of the substrate buffer located at a height position corresponding to the first processing layer through the first processing layer; and Through the transfer layer, the substrate is moved in and out of the external device; The substrate processing apparatus further comprises: a carrier storage rack for storing the carrier; and a carrier transport mechanism for transporting the carrier between the carrier placement table and the carrier storage rack; and The height of the second processing block is lower than that of the first processing block. The carrier storage rack and the carrier transport mechanism are mounted on the second processing block.

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