Packaged electronic device with suspended magnetic subassembly

Abstract

A packaged electronic device (100) includes a die pad (104) directly connected to a first set (125) of conductive leads (124-139) of a leadframe structure, a semiconductor die (102) attached to the conductive die pad (104), a conductive support structure (121, 122) directly connected to a second set (127-131, 132-136) of conductive leads (124-139) and spaced apart from all other conductive structures of the leadframe structure (104, 108, 121, 122, 124-139). A magnetic assembly (110) is attached to the conductive support structure (121, 122), and a molded package structure (120) encloses the conductive die pad (104, 108), the conductive support structure (121, 122), the semiconductor die (102, 106), the magnetic assembly (110), and portions of the conductive leads (124-139), the molded package structure (120) including a top side and an opposite bottom side with a laminate structure (112) centered between the top and bottom sides.

Description

Background Technology

[0001] Modern packaged electronic devices sometimes include integrated passive circuit components such as transformers, inductors, and / or other passive components, whose internal electrical connections to semiconductor dies and externally accessible leads (e.g., pins or pads) are used for soldering to printed circuit boards (PCBs). Transformer or inductor coils may be fabricated in a laminated structure for integration into the packaged electronic device. Isolation power transformer applications sometimes require high-voltage isolation, and some product design specifications require high withstand voltage performance (e.g., above 5kV rms). Existing integrated devices include laminated magnetic components mounted to die attachment pads on asymmetric leadframes, which can result in small internal spacing and high electric field strength levels (e.g., 3V / um in outside air) between the die attachment pads and package leads connected to different power domains. For example, some leads in an electronic component package may connect to the high-voltage primary circuitry of an isolated power converter, while the die attachment pads may connect to the low-voltage secondary circuitry. Excessive voltage difference between the primary and secondary circuits can cause external arcing at the high-voltage leads during manufacturing testing. Simply increasing the spacing in an asymmetric design reduces the area available for the integrated magnetic circuit, and this approach is not scalable because each design requires custom optimization regarding electric field, efficiency, and electromagnetic interference (EMI) performance. Furthermore, increasing the vertical thickness of laminated magnetic components mounted on solid die attach pads can lead to complex die flow issues during manufacturing, resulting in die voids during package assembly. Summary of the Invention

[0002] The described examples include a packaged electronic device having: a die pad connected to a first set of conductive leads of a leadframe structure; and a semiconductor die attached to the conductive die pad. A conductive support structure is connected to a second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure. A magnetic stack assembly is attached to the conductive support structure, and a package structure encloses portions of the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly, and the conductive leads. In one example, the magnetic assembly includes a laminated structure having patterned conductive features forming part of a passive electronic component, and a core structure is attached to a first and a second side of the laminated structure, wherein the laminated structure is attached to the conductive support structure. In one example, the device includes a plurality of conductive die pads and attached semiconductor dies. Certain examples include bonding wires or other connections between one or more conductive features of the second semiconductor die and the conductive leads of the leadframe structure, and / or between conductive features of the semiconductor die and conductive features of the magnetic assembly. In one example, the conductive support structure includes a first conductive support member and a second conductive support member, and the magnetic assembly is attached to the first conductive support member and the second conductive support member. In one example, the magnetic assembly is centered between a first lateral side and a second lateral side of the packaging structure. In one example, the laminated structure is centered between the top side and the bottom side of the packaging structure.

[0003] A method for manufacturing an electronic device is described, the method comprising: attaching a magnetic assembly to a conductive support structure of a lead frame structure; attaching a semiconductor die to a conductive die pad of the lead frame structure; forming a connection between a first conductive feature of the semiconductor die and a conductive lead; and forming a second connection between a second conductive feature of the semiconductor die and a conductive feature of the magnetic assembly. The method further comprises encapsulating portions of the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly, and the conductive lead within a package structure. Attached Figure Description

[0004] Figure 1 This is a bottom view of an encapsulated electronic device with a levitation magnetic assembly.

[0005] Figure 2 It is along Figure 1 A partial cross-sectional end view of the packaged electronic device taken from line 2-2.

[0006] Figure 3 It is along Figure 1 Line 3-3 shows a partial cross-sectional end view elevation of the packaged electronic device.

[0007] Figure 4 It is along Figure 1 A partial cross-sectional end view of the packaged electronic device taken from line 4-4.

[0008] Figure 5 yes Figures 1 to 4 A top view of a packaged electronic device.

[0009] Figure 6 yes Figures 1 to 5 A top-view perspective view of the packaged electronic device.

[0010] Figure 7 This is a flowchart of a method for manufacturing an electronic device.

[0011] Figures 8 to 13 It is based on Figure 7 The method used to fabricate a partial cross-sectional end view elevation of an encapsulated electronic device. Detailed Implementation

[0012] In the drawings, similar reference numerals refer to similar elements throughout, and various features are not necessarily drawn to scale. In the following discussion and in the claims, the terms “including,” “includes,” “having,” “has,” “with,” or variations thereof are intended to be inclusive in a manner similar to the term “comprising,” and should therefore be interpreted as meaning “including, but not limited to….” Furthermore, the terms “couple” or “couples” are intended to include indirect or direct electrical or mechanical connections, or combinations thereof. For example, if a first device is coupled to or with a second device, the connection can be a direct electrical connection or an indirect electrical connection via one or more intervening devices and the connection.

[0013] Figures 1 to 6 An example packaged electronic device 100 is shown, featuring a laminated magnetic assembly suspended on a conductive support structure spaced apart from an integrated semiconductor die and associated conductive die pads. Example device 100 provides symmetrically positioned magnetic assemblies to help reduce electric field levels and enhance high withstand voltage ratings without adversely affecting die material flow during fabrication, and provides a cost-effective and scalable solution to the problems described above.

[0014] Figure 1 Showing a bottom view of example device 100, and Figures 2 to 4 Display along Figure 1 Partial cross-sections and elevation views of the corresponding lines 2-2, 3-3 and 4-4 in the diagram. Figure 5 Show a top view, and Figure 6A top perspective view of the encapsulated electronic device 100 is shown. (Example) Figure 1 As shown, device 100 includes a lead frame structure having physically spaced conductive features for mounting one or more semiconductor dies and laminated magnetic assemblies. The lead frame assemblies may contain any suitable conductive structure, such as copper, aluminum, etc. Figure 1 Example device 100 includes a first semiconductor die 102 attached to a first conductive die pad 104 of a leadframe assembly. Some embodiments may include a single semiconductor die 102 attached to a single conductive die pad 104. In other embodiments, device 100 may include multiple semiconductor dies and associated die pads. Figure 1 The example device 100 includes a second semiconductor die 106 attached to a second conductive die pad 108 of a lead frame structure.

[0015] The packaged electronic device 100 also includes a laminated magnetic assembly 110 with a conductive support structure attached to the lead frame assembly. The laminated magnetic assembly 110 includes patterned conductive features 111 in a laminated structure 112. In some embodiments, the laminated structure 112 may include a single patterned conductive feature, for example, to form an inductor winding. In other instances, one or more patterned conductive features may form a capacitor, resistor, or other passive component in the laminated structure 112. In the illustrated example, the laminated structure includes multiple conductive features forming the primary and secondary windings of a transformer. The magnetic assembly 110 also includes one or more core structures to facilitate the combination of the patterned conductive features 111 to form a magnetic circuit. The illustrated example includes a first (lower or bottom) core structure 114 (e.g., ...). Figure 1 (as seen in the text); and the second (upper or top) core structure 200 ( Figure 2 and 5 (As seen in the image). A first core structure 114 is attached to a first side of the laminated structure 112, and a second core structure 200 is attached to a second side of the laminated structure 112. In one example, the first magnetic core structure 114 is the same size as the second core structure 200. In another example, the first magnetic core structure 114 is larger than the second core structure 200. In yet another example, the first magnetic core structure 114 is smaller than the second core structure 200. In one example, one or both of the magnetic core structures 114 and 200 are prefabricated magnetic cores attached using an epoxy paste adhesive. In another example, one or both of the magnetic core structures 114 and 200 are made using a thick layer of magnetic paste.

[0016] In one example, the laminate 112 is a multilayer structure having patterned conductive features 111 that form portions of a passive transformer electronic component. In one example, a first patterned conductive feature 111 forms a transformer primary winding, a second patterned conductive feature forms a first transformer secondary winding, and another patterned conductive feature forms a second secondary winding. In one example, the patterned conductive features have components on multiple layers of the multilayer laminate 112, although this is not required in all possible embodiments. In one example, the patterned winding turns of individual primary and secondary windings extend on different layers of the laminate 112, although this is not required in all possible embodiments. Example patterned winding features comprise multiple turns in a helical pattern on individual layers of the laminate 112, although other embodiments are possible, such as single-turn winding structures on a single layer.

[0017] The upper core structure 200 and the lower core structure 114 are attached to the laminated structure 112 via epoxy resin or other suitable attachment structures and / or techniques to form a magnetically coupled transformer device. In other examples, one of the upper core structure 200 or the lower core structure 114 may be omitted, wherein the remaining core structure provides magnetic coupling for passive electronic components or assemblies of the device 100. In other transformer examples, the laminated structure includes a winding 111 and a single secondary winding, and another secondary winding may be omitted. In other examples, a single patterned conductive feature 111 may be provided to form a single conductive winding of an inductor, and the inductor winding is magnetically coupled to one or more core structures via a magnetic adhesive layer material. In another example, a passive capacitor electronic assembly may be constructed, wherein the laminated structure 112 includes first and second capacitor plates separated by dielectric materials of a multilayer laminated structure.

[0018] Examples of forming the primary and secondary windings of a transformer include patterned conductive features that allow the windings to be interconnected to pins of device 100 or to conductive terminals of a semiconductor die, such as bonding wires 115, 116, 117, and 118 in the packaged electronic device 100. Semiconductor dies 102 and 106 include pillars, solder bumps, conductive landing pads, or other conductive features that can be electrically interconnected to other structures using bonding wires 115, 116, 117, and 118 or by direct soldering using any suitable electrical interconnection technology.

[0019] The packaged electronic device 100 also includes a package structure 120 that encloses conductive die pads 104 and 108, semiconductor dies 102 and 106, magnetic assembly 110, and all or part of other conductive features of the lead frame structure. In one example, the package structure 120 is or includes a molded material, such as plastic. In another example, the package structure 120 is or includes a ceramic material.

[0020] The lead frame structure in example device 100 also includes a conductive support structure, which has a first conductive support member 121 and a second conductive support member 122. A laminated structure 112 is attached to the bottom side or surface of the inner portion of the first conductive support member 121 and the second conductive support member 122, such as... Figure 2 It is best displayed in the middle.

[0021] The lead frame structure further includes conductive leads 124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134, 135, 136, 137, 138, and 139. The package structure 120 encloses the conductive support structure components 121 and 122, and encloses the internal portions of the conductive leads 124 to 139. In one example, the conductive leads 124 to 139 are so-called gull-wing leads extending downward and outward from the package structure 120, such as... Figures 2 to 4 And as shown in 6. In other examples, different types and shapes of conductive leads can be used.

[0022] like Figure 1 As best illustrated, the first conductive die pad 104 is directly connected to a first group 125 of conductive leads 124 to 139. In the illustrated example, the first group comprises a single lead 125. In other examples, the die pad 104 is directly connected to multiple conductive leads. In example device 100, the die pad 104 and the leads 125 are a single continuous metallic structure, such as copper or aluminum.

[0023] Conductive support structures 121 and 122 are directly connected to the second group of conductive leads 127 to 131 and 132 to 136. Furthermore, conductive support structures 121 and 122 are spaced apart from all other conductive structures of the lead frame structure. In the illustrated example, the first conductive support member 121 is directly connected to the first group of leads 127 to 131 of the second group, and the first conductive support member 121 is spaced apart from all other conductive structures of the lead frame structure. In the illustrated example, the first group of the second group includes multiple leads 127 to 131. In other examples, the first group of the second group includes a single lead. In example device 100, the first conductive support member 121 and leads 127 to 131 are a single continuous metal structure, for example, copper or aluminum. The second conductive support member 122 is directly connected to the second group of leads 124 to 139, 132 to 136 of the second group, and the second conductive support member 122 is spaced apart from all other conductive structures of the lead frame structure. In the illustrated example, the second group of the second group comprises a plurality of leads 132 to 136. In other examples, the second group of the second group comprises a single lead. In example device 100, the second conductive support member 122 and the leads 132 to 136 are a single continuous metal structure, such as copper or aluminum.

[0024] The second conductive die pad 108 is directly connected to the third set of conductive leads, and the second conductive die pad 108 is spaced apart from the conductive support structures 121, 122. In the illustrated example, the third set includes a single lead 138. In other examples, the second die pad 108 is directly connected to multiple conductive leads. In example device 100, the second die pad 108 and the lead 138 are a single continuous metal structure, for example, copper or aluminum.

[0025] Figures 1 to 6 The example of packaged electronic device 100 includes a transformer isolation circuit having a high-voltage primary side and a lower-voltage secondary side. In this example, the high-voltage primary side circuit system includes leads 124 to 131, a first semiconductor die 102, a first die pad 104, and a first support member 121. Figure 1 , 3 As best seen in 5 and 6, the primary circuit system also includes a first bonding line 115 connecting the semiconductor die 102 and the first conductive lead 126, and a second bonding line 116 connecting the semiconductor die 102 and the magnetic assembly 110.

[0026] The low-voltage secondary-side circuit system includes leads 132 to 139, a second semiconductor die 106, a second die pad 108, and a second support member 122. The low-voltage secondary-side circuit system also includes a third bonding line 117 connecting the second semiconductor die 106 to the second conductive lead 137 of the conductive leads 124 to 139, and a fourth bonding line 118 connecting the second semiconductor die 106 to the magnetic assembly 110.

[0027] The withstand voltage performance of device 100 relative to the isolated primary and secondary circuit system is affected by the separation distance between the conductive structures associated with the primary and secondary side circuits. For example... Figure 1 and 2 As best shown, the first conductive support member 121 and the second conductive support member 122 are laterally spaced (e.g., along the X direction) by a distance of 140. Furthermore, the conductive die pads 104 and 108 are spaced apart from each other by a lateral distance of 142. Figure 1 , 3 And 4), the first die attachment pad 104 is spaced apart from the first support member 121 by a longitudinal distance 144 (e.g., along the Y direction), and the second die attachment pad 106 is spaced apart from the second support member 122 by a longitudinal distance 146. In one example, distances 144 and 146 are the same, although this is not a strict requirement in all embodiments.

[0028] When the laminated magnetic assembly 110 is suspended by attachment to laterally spaced support members 121 and 122, the high-voltage circuit and the low-voltage circuit are spaced apart by the smaller of lateral distances 140 and 142. These distances are greater than the minimum spacing that would occur if the laminated magnetic assembly 110 were instead mounted to a wide extension of one of the die attachment pads 104 or 108. For example, if the low-voltage second die pad 108 extends downward in the negative Y direction and laterally along the negative X direction to support the laminated magnetic assembly 110, the lateral (X-direction) spacing between the extended die pad 108 and the high-voltage leads 127 to 131 would be significantly smaller than the smaller of lateral distances 140 and 142 in the example device 100. Therefore, the withstand voltage performance of device 100 is improved compared to a device that mounts integrated magnetic components on die attachment pads.

[0029] like Figures 1 to 6As further shown, the package structure 120 includes a first lateral side 151 and a corresponding second lateral side 152. In this example, the outer portions of individual conductive leads 124 to 131 (of the high-voltage primary-side circuitry) extend outward from the package structure 120 along the first side 151, and the outer portions of individual conductive leads 132 to 139 (of the low-voltage secondary-side circuitry) extend outward from the second side 152 of the package structure 120. Furthermore, in this example, the laminated magnetic assembly 110 is laterally centered between the first lateral side 151 and the second lateral side 152.

[0030] like Figure 2 As best illustrated, example package structure 120 includes a top side 211 and a corresponding bottom side 212. Laminate structure 112 is spaced from bottom side 212 by a first vertical (e.g., Z-direction) spacing distance 201. Laminate structure 112 is spaced from top side 211 by a second vertical spacing distance 202. In one example, distances 201 and 202 are equal, and laminate structure 112 is centered between top side 211 and bottom side 212. In some examples, vertical and lateral centering contributes to enhanced breakdown voltage performance of the circuit relative to a reduced electric field compared to asymmetrical designs.

[0031] For reference Figures 7 to 13 , Figure 7 Demonstration for making, for example Figures 1 to 6 Method 700 for an electronic device of device 100. Figures 8 to 13 An example of an encapsulated electronic device 100 manufactured according to method 700 is shown. Method 700 includes fabricating a laminated magnetic assembly at 701. In some embodiments, the magnetic assembly is assembled separately and provided as input to method 700.

[0032] In the illustrated example, the magnetic assembly at 701 includes attaching a bottom magnetic sheet to the back side of the laminate at 702. Figure 8 This illustration shows an example of an attachment process 800 performed therein (i.e., attaching the first (lower or bottom) core structure 114 to the bottom side of the example laminate structure 112). The laminate structure 112 may be any suitable single-layer or multi-layer stack having one or more patterned conductive features 111, such as inductor or transformer windings. The patterned conductive features 111 may then be formed by any suitable process, such as screen printing conductive material onto the laminate. The laminate structure 112 may include one or more bonding steps to bond the laminates or sheets to each other to form the laminate structure 112. In one example, the core structure 114 is a magnetic sheet structure, although this is not required in all possible embodiments.

[0033] The attachment process 800 may include depositing epoxy resin or other adhesive onto the bottom surface of the laminate and / or the surface of the core structure 114. In one example, the adhesive is a printable magnetic ink epoxy resin, although in other examples a non-magnetic adhesive may be used. The attachment process 800 also includes contacting the core structure 114 with the bottom side of the laminate 112 and / or with the epoxy resin formed thereon. In one example, the attachment process 800 also includes any necessary curing steps (e.g., thermal, optical, ultraviolet (UV) curing, etc.).

[0034] Example method 700 continues at 704 to attach the top magnetic sheet to the front side of the laminated structure. Figure 9 An example of performing a second attachment process 900 (i.e., attaching the second (upper or top) core structure 200 to the second side of the laminate structure 112) is shown. Attachment process 900 may be the same as or similar to the first attachment process 800 used to attach the first core structure 114 to the laminate structure 112.

[0035] At 706, method 700 further includes a single magnetic assembly. In one example, the magnetic assembly process is used to simultaneously fabricate multiple laminated magnetic assemblies, for example using a single large laminated structure 112 and attaching one or more core structures 114, 200 to their opposite sides. Figure 10 This illustrates an example of how large laminated structures 112 are sliced ​​or cut from an initial single structure to individualize or separate individual laminated magnetic assemblies. Figure 10 In one instance, a single-component process 1000 is performed, which, for example, uses saw blades, etching, laser cutting, etc., to single out or separate multiple laminated magnetic assemblies from a single structure.

[0036] Method 700 continues at 708 with the provision of a lead frame structure comprising conductive leads, one or more conductive die pads, a set of conductive leads, and a conductive support structure. In one embodiment, the lead frame structure is provided on an adhesive tape or other adhesive carrier, wherein the various constituent structures are assembled in a predetermined relative arrangement to facilitate subsequent assembly steps in method 700.

[0037] As discussed above, in one example, the conductive support structure is directly connected to a set of leads and spaced apart from all other conductive structures of the lead frame structure. In the above... Figures 1 to 6 In this example, the lead frame structure includes conductive features 104, 108, 121, 122, and 124 to 139. In this example, the various conductive features are directly connected to each other by a single structure formed, for example, a continuous copper or aluminum structure. In one example, these continuous conductive structures are arranged relative to each other on an adhesive carrier in a predetermined arrangement at 708.

[0038] The above text Figure 1 In this example, the first conductive die pad 104 is connected to a first group 125 of conductive leads 124 to 139, and the conductive support structure is connected to a second group 127 to 131, 132 to 136 of the conductive leads, and is spaced apart from all other conductive structures of the lead frame structure. Figure 1 In this example, the conductive support structure includes a first conductive support member 121 and a second conductive support member 122. The first conductive support member 121 is directly connected to the first group 127 to 131 of the second group of leads, and the first conductive support member 121 is spaced apart from all other conductive structures of the lead frame structure. Furthermore, as... Figure 1 As shown, in this example, the second conductive support member 122 is directly connected to the second group 132 to 136 of the second set of leads, and the second conductive support member 122 is spaced apart from all other conductive structures of the lead frame structure. In some cases, the second conductive die pad 108 is directly connected to the third set of conductive leads (e.g., Figure 1 The single lead 138 in the middle, and the second conductive die pad 108 is spaced apart from the conductive support structures 121, 122.

[0039] Method 700 attaches the magnetic assembly to the conductive support structure (e.g., at 710) at point 710. Figure 1 (Continue with the first support component 121 and the second support component 122). Figure 11 This illustration shows one example of performing attachment process 1100 (i.e., attaching the laminated structure 112 of the magnetic assembly 110 to the corresponding surfaces of the first conductive support member 121 and the second conductive support member 122). Any suitable attachment process 1100 can be used, such as applying adhesive, connecting components, and any necessary curing. In another example, the conductive features of the laminated structure 112 may be soldered to the conductive support members 121 and 122.

[0040] Process 700 in Figure 7 At point 712, one or more semiconductor dies can be attached to the corresponding die attachment pads. Figure 12 This illustration shows an example of performing a die attachment process 1200, which involves attaching a first semiconductor die 102 to a first die attachment pad 104 (e.g., where the die attachment pad 104 is a continuous conductive structure including leads 125). In the illustrated example, process 1200 also attaches a second semiconductor die 106 to a corresponding second die attachment pad 108 (e.g., also a continuous conductive structure including leads 138).

[0041] Instance method 700 also includes wire bonding or other interconnection processing at 714. Figure 13This illustration demonstrates an example of performing a wire bonding process 1300 (i.e., forming a connection between a semiconductor die or a die and one or more conductive leads or conductive features of a magnetic assembly 110). In example device 100, the connection process 1300 includes forming a first bonding wire connection 115 between a first conductive feature of a first semiconductor die 102 and a conductive lead 126, and forming a second bonding wire connection 116 between a second conductive feature of the first semiconductor die 102 and a conductive feature of the magnetic assembly 110. Example process 1300 also includes forming a third bonding wire connection 117 between a first conductive feature of a second semiconductor die 106 and a conductive lead 137, and forming a fourth bonding wire connection 118 between a second conductive feature of the second semiconductor die 106 and a second conductive feature of the magnetic assembly 110. For a particular design, other connections may be made at 714, for example, to connect multiple secondary windings and one primary winding of the magnetic assembly 110 to various conductive features of one or more of the semiconductor dies 102, 106, and / or to the semiconductor dies 102, 106, and / or to the semiconductor dies 102, 106 of the device 100 and various conductive leads, etc.

[0042] Unlike other magnetic assembly support techniques where laminated wire bonding pads are supported on solid die attachment pads by means of a bottom magnetic core structure, example device 100 provides a floating attachment of magnetic assembly 110 to a conductive support structure. This contributes to an increased spacing between high-voltage and low-voltage domain characteristics of device 100, and a corresponding reduction in the electric field level during operation and manufacturing testing of device 100. In some instances, wire bonding or other interconnection processes at 714 can be performed using a support structure to provide mechanical structural support for one or more features of magnetic assembly 110 during wire bonding. In one instance, one or both of the magnetic core structures 114, 200 can be supported during wire bonding operations using a custom wire bonding clamping tool (not shown). In one instance, the wire bonding clamping tool may include cavities for supporting the laminated bonding pad area extending beyond the supported magnetic core structure.

[0043] Method 700 continues at 716 to form the final package structure. In one example, the package at 716 includes performing a molding process (not shown) that forms a portion of package structure 122 adjacent to conductive die pads 104, 108, conductive support structure components 121, 122, semiconductor dies 102, 106, magnetic assembly 110, and conductive leads 124 to 139. Figures 1 to 6 Shown Figure 7 In one example, a molded plastic encapsulation structure 120 is formed at position 716. In another example, a ceramic encapsulation structure can be formed at position 716. Figure 7At point 718, other backend processing can be performed, such as form pruning.

[0044] The described packaged electronic device 100 and manufacturing method 700 address the problems in asymmetric laminated magnetic assemblies by providing a levitated mount for the magnetic assembly 110 in a symmetrical configuration. In the illustrated example, the laminate structure 112 is vertically and laterally centered within the package structure 120, and the support members 121 and 122 facilitate the increased spacing between the high-voltage and low-voltage domains within the packaged electronic device 100. The support structure of the disclosed example also mitigates the characteristics associated with increased stacking height of the die filler and integrated magnets. The described device and method can also be extended for different designs, unlike the attempts to increase feature spacing in asymmetric die attach pad mounting methods.

[0045] Modifications are possible in the described embodiments, and other embodiments are possible within the scope of the claims.

Claims

1. A packaged electronic device comprising: a leadframe structure including: a plurality of conductive leads, a conductive die pad directly connected to a first set of the conductive leads, and a conductive support structure directly connected to a second set of the conductive leads and spaced apart from all other conductive structures of the leadframe structure; a semiconductor die attached to the conductive die pad; a magnetic assembly attached to the conductive support structure; and a package structure enclosing the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly, and portions of the conductive leads, wherein the package structure includes a top side and an opposing bottom side, and the magnetic assembly is centered between the top side and the bottom side.

2. The packaged electronic device of claim 1, wherein the leadframe structure further includes a second conductive die pad directly connected to a third set of the conductive leads and spaced apart from the conductive support structure; and wherein the packaged electronic device further includes a second semiconductor die attached to the second conductive die pad.

3. The packaged electronic device of claim 2, further comprising: a first wire bond connected between the semiconductor die and a first conductive lead of the conductive leads; a second wire bond connected between the semiconductor die and the magnetic assembly; a third wire bond connected between the second semiconductor die and a second conductive lead of the conductive leads; and a fourth wire bond connected between the second semiconductor die and the magnetic assembly.

4. The packaged electronic device of claim 2, wherein the conductive support structure includes: a first conductive support member directly connected to a first group of the second set of the conductive leads and spaced apart from all other conductive structures of the leadframe structure, and a second conductive support member directly connected to a second group of the second set of the conductive leads and spaced apart from all other conductive structures of the leadframe structure; and wherein the magnetic assembly is attached to the first conductive support member and the second conductive support member.

5. The packaged electronic device of claim 4, wherein the magnetic assembly includes: a laminate structure including patterned conductive features forming a portion of a passive electronic component, a first core structure attached to a first side of the laminate structure, and a second core structure attached to a second side of the laminate structure; and wherein the laminate structure is attached to the first conductive support member and the second conductive support member.

6. The packaged electronic device of claim 4, wherein the package structure includes a first lateral side and an opposing second lateral side; wherein portions of individual ones of the conductive leads extend outwardly from the package structure along a corresponding one of the first lateral side and the second lateral side; and wherein the magnetic assembly is centered between the first lateral side and the second lateral side.

7. The packaged electronic device of claim 2, ​ ​ wherein the package structure includes a first lateral side and an opposite second lateral side; wherein portions of individual ones of the conductive leads extend outwardly from the package structure along a corresponding one of the first lateral side and the second lateral side; and wherein the magnetic assembly is centered between the first lateral side and the second lateral side.

8. The packaged electronic device of claim 1, wherein the conductive support structure includes: a first conductive support component directly connected to a first group of the second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure, and a second conductive support component directly connected to a second group of the second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure, wherein the magnetic assembly is attached to the first conductive support component and the second conductive support component.

9. The packaged electronic device of claim 1, wherein the magnetic assembly includes: a laminate structure including patterned conductive features forming a portion of a passive electronic component, a first core structure attached to a first side of the laminate structure, and a second core structure attached to a second side of the laminate structure, wherein the laminate structure is attached to the conductive support structure.

10. The packaged electronic device of claim 1, wherein the package structure includes a first lateral side and an opposite second lateral side; wherein portions of individual ones of the conductive leads extend outwardly from the package structure along a corresponding one of the first lateral side and the second lateral side; and wherein the magnetic assembly is centered between the first lateral side and the second lateral side.

11. The packaged electronic device of claim 1, wherein the magnetic assembly includes a laminate structure including patterned conductive features forming a portion of a passive electronic component.

12. A device comprising: a conductive die pad directly connected to a first set of conductive leads of a leadframe structure; a semiconductor die attached to the conductive die pad; a conductive support structure directly connected to a second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure; a magnetic assembly including a laminate structure attached to the conductive support structure; and a molded package structure enclosing the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly, and portions of the conductive leads, the molded package structure including a top side and an opposite bottom side, wherein the laminate structure is centered between the top side and the bottom side.

13. The device of claim 12, wherein the conductive support structure includes: a first conductive support component directly connected to a first group of the second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure, and a second conductive support component directly connected to a second group of the second set of conductive leads and spaced apart from all other conductive structures of the leadframe structure, wherein the magnetic assembly is attached to the first conductive support component and the second conductive support component. a second electrically conductive support component directly connected to a second group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure, wherein the laminate structure is attached to the first and second electrically conductive support components.

14. The device of claim 12, wherein the package structure includes a first lateral side and an opposite second lateral side; wherein portions of individual of the electrically conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and wherein the magnetic assembly is centered between the first and second lateral sides.

15. A method for making an electronic device, the method comprising: providing a leadframe structure including: an electrically conductive die pad connected to a first set of electrically conductive leads; and an electrically conductive support structure connected to a second set of the electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure; attaching a magnetic assembly to the electrically conductive support structure; attaching a semiconductor die to the electrically conductive die pad; forming a first connection between a first electrically conductive feature of the semiconductor die and a first electrically conductive lead of the electrically conductive leads, and a second connection between a second electrically conductive feature of the semiconductor die and an electrically conductive feature of the magnetic assembly; and enclosing the electrically conductive die pad, the electrically conductive support structure, the semiconductor die, the magnetic assembly, and portions of the electrically conductive leads in a package structure, wherein the package structure includes a top side and an opposite bottom side, and the magnetic assembly is centered between the top and bottom sides.

16. The method of claim 15, further comprising: attaching a second semiconductor die to a second electrically conductive die pad spaced apart from the electrically conductive support structure of the leadframe structure; forming a third connection between a first electrically conductive feature of the second semiconductor die and a second one of the electrically conductive leads, and a fourth connection between a second electrically conductive feature of the second semiconductor die and a second electrically conductive feature of the magnetic assembly.

17. The method of claim 15, wherein the magnetic assembly includes a laminate structure having patterned electrically conductive features forming part of a passive electronic component; and wherein attaching the magnetic assembly to the electrically conductive support structure includes attaching the laminate structure to the electrically conductive support structure.

18. The method of claim 17, wherein the package structure includes a first lateral side and an opposite second lateral side; wherein portions of individual of the electrically conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and wherein the magnetic assembly is centered between the first and second lateral sides.

19. The method of claim 17, wherein the electrically conductive support structure includes: a first electrically conductive support component directly connected to a first group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure, and a second electrically conductive support component directly connected to a second group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure, wherein the laminate structure is attached to the first and second electrically conductive support components. a second electrically conductive support component directly connected to a second group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure; and wherein attaching the magnetic assembly to the electrically conductive support structure includes attaching the laminate structure to the first electrically conductive support component and the second electrically conductive support component.

20. An apparatus comprising: an electrically conductive die pad directly connected to a first set of electrically conductive leads of a leadframe structure; a semiconductor die attached to the electrically conductive die pad; an electrically conductive support structure directly connected to a second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure, wherein the electrically conductive support structure includes: a first electrically conductive support component directly connected to a first group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure, and a second electrically conductive support component directly connected to a second group of the second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure; a magnetic assembly including a laminate structure attached to the electrically conductive support structure, wherein the magnetic assembly is attached to the first electrically conductive support component and the second electrically conductive support component; and a molded package structure enclosing the electrically conductive die pad, the electrically conductive support structure, the semiconductor die, the magnetic assembly, and portions of the electrically conductive leads, the molded package structure including a top side and an opposing bottom side, wherein the laminate structure is centered between the top side and the bottom side.

21. An apparatus comprising: an electrically conductive die pad directly connected to a first set of electrically conductive leads of a leadframe structure; a semiconductor die attached to the electrically conductive die pad; an electrically conductive support structure directly connected to a second set of electrically conductive leads and spaced apart from all other electrically conductive structures of the leadframe structure; a magnetic assembly including a laminate structure attached to the electrically conductive support structure, wherein the magnetic assembly includes: a laminate structure including patterned electrically conductive features forming part of a passive electronic component, a first core structure attached to a first side of the laminate structure, and a second core structure attached to a second side of the laminate structure, wherein the laminate structure is attached to the electrically conductive support structure; and a molded package structure enclosing the electrically conductive die pad, the electrically conductive support structure, the semiconductor die, the magnetic assembly, and portions of the electrically conductive leads, the molded package structure including a top side and an opposing bottom side, wherein the laminate structure is centered between the top side and the bottom side.

22. An apparatus comprising: an electrically conductive die pad directly connected to a first set of electrically conductive leads; a semiconductor die attached to the electrically conductive die pad; an electrically conductive support structure directly connected to a second set of electrically conductive leads, not connected to any of the first set of electrically conductive leads, and spaced apart from the electrically conductive die pad; a magnetic assembly including a laminate structure attached to the electrically conductive support structure; and a molded package structure enclosing the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly, and portions of the conductive leads, the molded package structure including a top side and an opposing bottom side, wherein the laminate structure is centered between the top side and the bottom side.

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