Lead frame interlayer type material placing structure
By using a layered material placement structure for the lead frame, and by designing components such as a back vertical plate, side baffles, pads, and limit screws, the problem of deformation of the folded leads of the lead frame is solved, achieving stable fixation and anti-deformation effect of the lead frame.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-03-24
AI Technical Summary
In the prior art, the folded leads on the lead frame are prone to deformation when stacked, which affects semiconductor processing.
The material is placed in a layered structure with lead wire frames. The design of components such as back vertical plate, side baffle, pad strip, lower pressure strip, limit screw and movable plate ensures that the lead wire frames are placed at intervals. The combination of spring and push column prevents the deformation of the folded structure.
It effectively prevents deformation of the bent leads on the lead frame, ensuring the stability and reliability of semiconductor processing.
Smart Images
Figure CN224037793U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor processing, especially to a lead frame interlayer type material placing structure. BACKGROUND
[0002] The lead frame is a kind of intermediate structure commonly used in semiconductor processing, which is provided with a plurality of base islands for fixing chips and pins connected to the base islands, and jumper wires are needed to connect the chips and pins on some special semiconductor devices, or the pins are processed into a folded structure, and the horizontal section of the pin at the upper end protrudes from the plane of the lead frame. At present, in order to facilitate the processing of semiconductors, the lead frames are usually stacked and placed in the material placing part, and this placement method can easily cause the jumper wires in the folded structure to deform, thereby adversely affecting the processing of semiconductors. SUMMARY
[0003] The utility model provides a kind of lead frame interlayer type material placing structure to solve the deficiency of above-mentioned prior art, solve the problem of easy deformation of folded pin on lead frame, with strong practicality.
[0004] In order to achieve the purpose of the utility model, the following technologies are used:
[0005] A lead frame interlayer type material placing structure includes a back vertical plate, side plates are bent on both sides of the back vertical plate, lead frames are arranged between the side plates, and there is a gap between adjacent two lead frames. The back vertical plate and the side plates thereon limit the two ends and one side of the lead frames to ensure the protection effect of the lead frames. A plurality of pads are installed on the back vertical plate by screws, the lead frames are placed on the pads, the upper side of each lead frame is provided with a pressing strip, two pairs of limiting screws are arranged on the pressing strip, a plurality of strip-shaped holes are formed in the back vertical plate, the strip-shaped holes are arranged vertically, the limiting screws are arranged in the strip-shaped holes, the outer ends of the limiting screws at the same end are connected with movable plates by threads, and the movable plates are located outside the back vertical plate. The pads support the bottom surface of the lead frames, and the pressing strips act on the upper side of the lead frames to achieve the effect of fixing the lead frames. After being fixed, there is a gap between adjacent two lead frames, which can avoid deformation of the folded structure on the lead frames.
[0006] Further, in order to ensure the pressing effect of the pressing strip on the lead frame, and to ensure the posture of the lead frame, a pushing column is arranged on the movable plate, recessed parts are arranged at the upper and lower ends of the back vertical plate, a pair of outward extending rods are connected to the two sides of the recessed part through threads, end caps are arranged at the outer ends of the outward extending rods, springs are arranged on the outward extending rods, outer top plates are arranged on the outward extending rods at the same side, a moving back plate is arranged at the inner end of the outer top plate, a plurality of inclined holes are arranged on the moving back plate, the outer end of the inclined hole is inclined upward, the pushing column is arranged in the inclined hole, the inner end of the spring acts on the side wall of the recessed part, and the outer end of the spring acts on the outer top plate, wherein the elastic force provided by the spring can make the moving back plate move outward, and then the inclined hole on the moving back plate acts on the pushing column, so as to ensure the pressing effect of the pressing strip.
[0007] Further, in order to facilitate the taking and placing of the lead frame, a pair of hinged columns are arranged on the back vertical plate, and an inner top rotating plate is rotatably arranged on the hinged column.
[0008] Further, in order to facilitate the rotation of the inner top rotating plate, the inner end of the inner top rotating plate is arranged in an arc shape.
[0009] Further, in order to support and limit the lead frame, two pairs of limiting columns are arranged on the upper and lower sides of each lead frame, the limiting columns are rotatably arranged on the side stop plate, and the rotatably arranged limiting columns can avoid damaging the lead frame when the lead frame is placed, and also provide convenience for placing.
[0010] The above technical scheme has the following advantages:
[0011] The lead frame is placed in intervals, which can avoid deformation of the lead pin structure on the lead frame, and the lead frame can be fixed and constrained to avoid affecting the lead frame during transfer. BRIEF DESCRIPTION OF DRAWINGS
[0012] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model will be described in further detail below with reference to the drawings.
[0013] Figure 1 A perspective structure of one embodiment is shown Figure One .
[0014] Figure 2 An enlarged view of A is shown.
[0015] Figure 3 An enlarged view of B is shown.
[0016] Figure 4 A perspective structure of one embodiment is shown Figure Two. Detailed Implementation
[0017] like Figures 1-4 As shown, a lead frame interlayer material placement structure includes a back vertical plate 1, side baffles 10 bent on both sides of the back vertical plate 1, a lead frame disposed between the side baffles 10, and a gap between adjacent two lead frames.
[0018] Multiple pads 2 are installed on the back vertical plate 1 by screws. The lead frame is placed on the pads 2. Each lead frame has a lower pressure strip on its upper side. The lower pressure strip has two pairs of limit screws 3. Multiple strip holes 12 are opened on the back vertical plate 1. The strip holes 12 are arranged vertically. The limit screws 3 are inserted into the strip holes 12. The outer ends of the limit screws 3 located at the same end are connected to a movable plate 30 by threads. The movable plate 30 is located on the outer side of the back vertical plate 1. Specifically, the movable plate 30 is provided with a push column 31, and concave parts 4 are respectively installed at the upper and lower ends of the back vertical plate 1. The two sides of the concave parts 4 are connected by threads to an extension rod 40. The outer end of the extension rod 40 is provided with an end cap, and a spring 41 is sleeved on the extension rod 40. An outer top plate 42 is sleeved on the extension rod 40 on the same side. A movable back plate 43 is provided on the inner end of the outer top plate 42. The movable back plate 43 has multiple oblique holes 44. The outer ends of the oblique holes 44 extend upward at an angle. The push column 31 passes through the oblique holes 44. The inner end of the spring 41 acts on the side wall of the concave part 4, and the outer end of the spring 41 acts on the outer top plate 42. The back vertical plate 1 is provided with a pair of hinge columns 45. An inner top rotating plate 46 is rotatably provided on the hinge columns 45. The inner end of the inner top rotating plate 46 acts on the outer wall of the movable back plate 43. The inner end of the inner top rotating plate 46 has an arc-shaped structure.
[0019] Each lead frame has two pairs of limiting posts 11 on its upper and lower sides, and the limiting posts 11 are rotatably mounted on the side baffle 10.
[0020] In the application, the operator places the lead frame between each set of the pad strip 2 and the pressing strip one by one. The lead frame is placed between the side plates 10 from the opening end and between each two pairs of the limiting columns 11. Before the placement, in order to have enough gap between the pad strip 2 and the pressing strip, the inner top turn plate 46 is turned to make the inner end of the inner top turn plate 46 act on the outer wall of the moving back plate 43, so that the moving back plate 43 moves inward, and the spring 41 is compressed. During the inward movement of the moving back plate 43, the inclined hole 44 acts on the pushing column 31, so that the pressing strip moves upward. After the lead frame is placed, the inner top turn plate 46 is turned outward, so that the moving back plate 43 moves outward under the action of the spring 41, so that the pressing strip acts on the upper side of the lead frame, and then the lead frame is positioned. When the lead frame is taken out, the inner top turn plate 46 is turned again to cancel the action of the pressing strip, and then the lead frame is taken out.
[0021] The preferred embodiments of the present application are described above, but the present application is not limited to the above, and it is obvious that those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Therefore, if these modifications and changes of the present application belong to the scope of the claims of the present application and the equivalent technology, the present application also intends to include these modifications and changes.
Claims
1. A lead frame decked material placement structure, characterized by, The back vertical plate (1) is provided with a plurality of side plates (10) on both sides, and lead frames are arranged between the side plates (10), and gaps exist between adjacent two lead frames. A plurality of pad strips (2) are arranged on the back vertical plate (1) by screws, and the lead frames are arranged on the pad strips (2), the upper side of each lead frame is provided with a pressing strip, the pressing strip is provided with two pairs of limiting screws (3), a plurality of strip-shaped holes (12) are arranged on the back vertical plate (1), the strip-shaped holes (12) are arranged vertically, the limiting screws (3) are arranged in the strip-shaped holes (12), and the outer ends of the limiting screws (3) at the same end are connected with movable plates (30) through threads, and the movable plates (30) are arranged outside the back vertical plate (1).
2. The leadframe decked material placement structure of claim 1, wherein, The movable plate (30) is provided with a pushing column (31), the upper and lower ends of the back vertical plate (1) are respectively provided with concave pieces (4), the two sides of the concave pieces (4) are connected with a pair of outer extension rods (40) through threads, the outer ends of the outer extension rods (40) are provided with end caps, the outer extension rods (40) are sleeved with springs (41), the outer extension rods (40) on the same side are sleeved with outer top plates (42), the inner ends of the outer top plates (42) are provided with moving back plates (43), the moving back plates (43) are provided with a plurality of inclined holes (44), the outer ends of the inclined holes (44) are inclined upward, the pushing column (31) is arranged in the inclined hole (44), the inner ends of the springs (41) are arranged on the side walls of the concave pieces (4), and the outer ends of the springs (41) are arranged on the outer top plates (42).
3. The leadframe decked material placement structure of claim 1, wherein, The back vertical plate (1) is provided with a pair of hinge columns (45), the hinge columns (45) are rotatably provided with inner top rotating plates (46), and the inner ends of the inner top rotating plates (46) are arranged on the outer side walls of the moving back plates (43).
4. The leadframe decked material placement structure of claim 3, wherein, The inner ends of the inner top rotating plates (46) are in arc-shaped structures.
5. The leadframe decked placement structure of claim 1, wherein, The upper and lower sides of each lead frame are respectively provided with two pairs of limiting columns (11), and the limiting columns (11) are rotatably arranged on the side plates (10).