Heat dissipation device and server having the same

CN112882983BActive Publication Date: 2026-06-16BEIJING BAIDU NETCOM SCI & TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING BAIDU NETCOM SCI & TECH CO LTD
Filing Date
2021-04-21
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

In existing technologies, heat pipe coolers have low and uneven heat dissipation efficiency for the front and rear GPUs, and high airflow resistance, which affects the heat dissipation effect.

⚗Method used

In the direction of air convection, the front and rear rows of radiator fins are located in convection spaces at different heights, forming independent cooling channels that are staggered vertically. Heat exchange channels are set in the fin groups and filled with phase change media to improve heat dissipation efficiency and uniformity.

🎯Benefits of technology

It improves the heat dissipation efficiency and uniformity of the heat dissipation device, reduces the airflow resistance of the cooling air, and improves the cooling effect on the rear GPU and the overall heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a heat dissipation device and a server with the same, and relates to the technical field of server heat dissipation. The heat dissipation device is used for dissipating heat of a chip in a server, and comprises: a plurality of heat dissipaters; the plurality of heat dissipaters are respectively installed on front and back staggered chips in the direction of air convection; the plurality of heat dissipaters each comprises a heat conduction substrate and a fin group, one side surface of the heat conduction substrate is attached to a heat dissipation surface of the chip, and the fin group is connected to the other side surface of the heat conduction substrate; wherein, in the direction of air convection, the fin groups of the heat dissipaters at different positions are located in different convection spaces. The heat dissipation device can reduce the resistance of air convection, improve the heat dissipation efficiency and uniformity of the chip in the server.
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