Heat dissipation device and server having the same

Abstract

The application discloses a heat dissipation device and a server with the same, and relates to the technical field of server heat dissipation. The heat dissipation device is used for dissipating heat of a chip in a server, and comprises: a plurality of heat dissipaters; the plurality of heat dissipaters are respectively installed on front and back staggered chips in the direction of air convection; the plurality of heat dissipaters each comprises a heat conduction substrate and a fin group, one side surface of the heat conduction substrate is attached to a heat dissipation surface of the chip, and the fin group is connected to the other side surface of the heat conduction substrate; wherein, in the direction of air convection, the fin groups of the heat dissipaters at different positions are located in different convection spaces. The heat dissipation device can reduce the resistance of air convection, improve the heat dissipation efficiency and uniformity of the chip in the server.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a heat dissipation device and a server having the same. Background Technology

[0002] With the accelerated application of cloud computing and artificial intelligence, the computing power and power consumption of chips have increased significantly, which poses a severe challenge to chip heat dissipation.

[0003] Currently, the mainstream heat dissipation solution for Artificial Intelligence (AI) servers is still the use of heat pipe coolers to cool the chips. Specifically, AI servers have multiple arrays of Graphics Processing Units (GPUs), each equipped with a heat pipe cooler. The heat pipe cooler includes a thermally conductive substrate, heat pipes, and heat sink fins. One side of the thermally conductive substrate is attached to the GPU's heat dissipation surface, and the heat sink fins are connected to the other side of the thermally conductive substrate. The heat pipe portion is located on the side of the thermally conductive substrate facing the GPU and is in contact with the GPU's heat dissipation surface; the other portion of the heat pipe passes through the heat sink fins. Summary of the Invention

[0004] This application provides a heat dissipation device and a server having the same. The heat dissipation device can reduce air convection resistance and improve the heat dissipation efficiency and uniformity of the chips in the server.

[0005] According to one aspect of this application, a heat dissipation device is provided for dissipating heat from chips in a server. The heat dissipation device includes: a plurality of heat sinks; the plurality of heat sinks are respectively mounted on chips that are staggered in the front and back in the air convection direction.

[0006] Each heat sink includes a thermally conductive substrate and a fin assembly. One side of the thermally conductive substrate is attached to the heat dissipation surface of the chip, and the fin assembly is connected to the other side of the thermally conductive substrate.

[0007] In the direction of air convection, the fin assemblies of the radiator at different positions are located in convection spaces at different heights.

[0008] As described above, the heat dissipation device may optionally include at least a first heat dissipation device and a second heat dissipation device, and the multiple chips may include at least a first chip group and a second chip group that are staggered in the air convection direction; the first heat dissipation device is mounted on the chip in the first chip group, and the second heat dissipation device is mounted on the chip in the second chip group.

[0009] The first heat sink includes a first thermally conductive substrate and a first fin group, and the second heat sink includes a second thermally conductive substrate and a second fin group; wherein the first fin group and the second fin group are located in convection spaces at different heights.

[0010] In the heat dissipation device described above, optionally, the first fin group is connected to the first thermally conductive substrate, and the second fin group and the second thermally conductive substrate have a gap between them.

[0011] Optionally, in the heat dissipation device described above, a support portion is connected between the second fin group and the second heat-conducting substrate.

[0012] In the heat dissipation device described above, optionally, in the airflow direction, the first radiator is located in front of the second radiator, or the first radiator is located behind the second radiator.

[0013] As described above, the heat dissipation device may optionally include a plurality of spaced-apart heat dissipation fins, with air convection channels formed between adjacent heat dissipation fins.

[0014] As described above, the heat dissipation device may optionally include at least one heat exchange channel;

[0015] One end of the heat exchange channel is connected to the heat-conducting substrate, and the other end of the heat exchange channel extends to the top surface of the fin assembly. The outer wall of the heat exchange channel is connected to the heat dissipation fins. The heat exchange channel is filled with a phase change medium.

[0016] As described above, the heat dissipation device may optionally have a hollow interior on the heat-conducting substrate, with the bottom end of the heat exchange channel communicating with the interior of the heat-conducting substrate.

[0017] In the heat dissipation device described above, optionally, the heat exchange channel extends in a direction perpendicular to the surface of the heat-conducting substrate.

[0018] As described above, the heat dissipation device may optionally include multiple heat exchange channels, which are spaced apart between the two sides of the fin assembly.

[0019] As described above, the heat dissipation device may optionally include an end plate connected to the top surface of the fin assembly, and the top of the heat exchange channel is connected to the end plate.

[0020] In the heat dissipation device described above, optionally, the heat dissipation fins extend along the surface direction of the heat-conducting substrate.

[0021] According to another aspect of this application, a server is provided, the server including a processor and a heat dissipation device as described above, the processor including a plurality of chips, and the heat dissipation device for dissipating heat from the plurality of chips.

[0022] The heat dissipation device and server provided in this application include a server with multiple chips arranged in a staggered manner along the air convection direction. The heat dissipation device includes multiple heat sinks, which are respectively installed on the staggered chips to dissipate heat. Specifically, each heat sink includes a thermally conductive substrate and fins connected to the thermally conductive substrate. The thermally conductive substrate is attached to the heat dissipation surface of the chip, and heat from the chip is conducted to the thermally conductive substrate, which then conducts the heat to the fins. The heat is then carried away by air convection. In the air convection direction, by positioning the fins of the heat sinks at different locations within convection spaces of different heights, the front and rear rows of heat sinks form independent, staggered cooling channels along the air convection direction. Cooling air passes parallel to the fins of the front and rear rows of heat sinks, avoiding obstruction of the fins of the rear rows by the front rows of heat sinks, thus improving the heat dissipation efficiency and uniformity of the heat dissipation device.

[0023] It should be understood that the description in the Summary Section is not intended to limit the key or essential features of the embodiments of this application, nor is it intended to restrict the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0024] The above and other features, advantages, and aspects of the embodiments of this application will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0025] Figure 1 This is an installation diagram of the heat dissipation device according to Embodiment 1 of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the first heat sink according to Embodiment 1 of this application;

[0027] Figure 3 This is a schematic diagram of the structure of the second heat sink according to Embodiment 1 of this application;

[0028] Figure 4 This is a schematic diagram of the server layout according to Embodiment 2 of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Heat dissipation device;

[0031] 11-Radiator; 11a-First radiator; 11b-Second radiator;

[0032] 111-Heat-conducting substrate; 111a-First heat-conducting substrate; 111b-Second heat-conducting substrate; 112-Fin assembly; 112a-First fin assembly; 112b-Second fin assembly; 113-Support portion; 114-Heat exchange channel; 115-End plate;

[0033] 1121 - Heat dissipation fins;

[0034] 2-Server;

[0035] 21 - I / O area; 22 - Processor area; 23 - Heat dissipation area; 24 - Fan area. Detailed Implementation

[0036] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of this application, including various details to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0037] AI servers contain multiple graphics processing units (GPUs). In practical applications, these GPUs are usually divided into two groups, which are arranged one in front of the other in the direction of air convection within the processor.

[0038] Currently, heat pipe coolers are mainly used to dissipate heat from each GPU. Specifically, heat pipe coolers are installed on the surface of each GPU. The heat pipe cooler includes a thermally conductive substrate attached to the GPU surface. Multiple heat pipes are spaced apart on the GPU-facing side of the substrate. A heatsink fin assembly is connected to the other side of the substrate, and the heat pipes bend towards the other side of the substrate and pass through multiple heatsink fins in the fin assembly. The heat generated by the GPU is absorbed by the multiple heat pipes in contact with the GPU surface, and then transferred to the heatsink fins. Finally, the heat is carried away by cooling airflow.

[0039] However, in terms of the direction of the cooling airflow, since the cooling airflow passes through the front row of GPUs first and then the rear row of GPUs, on the one hand, the temperature of the front row of GPUs increases after being cooled by the cooling airflow, and then it passes through the rear row of GPUs, which is equivalent to preheating the rear row of GPUs, thus reducing the cooling effect on the rear row of GPUs; on the other hand, the cooling airflow has to pass through both the front and rear rows of GPUs, resulting in greater wind resistance and affecting the heat dissipation efficiency.

[0040] In summary, using heat pipe coolers to cool the front and rear rows of GPUs results in low cooling efficiency and uneven heat dissipation, which affects the overall cooling performance of the GPUs.

[0041] In view of this, this application provides a heat dissipation device and a server having the same. The heat dissipation device is used to dissipate heat from the chips in the server. By setting different heat sinks on the front and rear rows of chips corresponding to the air convection direction, and the heat dissipation fins of the front and rear rows of heat sinks are located in convection spaces at different heights, the heat dissipation efficiency and heat dissipation uniformity of the heat dissipation device are improved, thereby improving the heat dissipation effect of the heat dissipation device.

[0042] The heat dissipation device and server of this application will be described in detail below through specific embodiments.

[0043] Example 1

[0044] Figure 1 This is an installation diagram of the heat dissipation device according to Embodiment 1 of this application; Figure 2 This is a schematic diagram of the structure of the first heat sink according to Embodiment 1 of this application; Figure 3 This is a schematic diagram of the structure of the second heat sink according to Embodiment 1 of this application.

[0045] Reference Figure 1 As shown, this embodiment provides a heat dissipation device 1, which is used to dissipate heat from chips in a server. In practical applications, the server can be, for example, an AI server, and the heat dissipation device 1 can be used to dissipate heat from the GPU in the AI ​​server to ensure the GPU's performance.

[0046] It is understood that the server is not limited to an AI server, and the chip is not limited to a GPU; this embodiment does not impose specific limitations on these.

[0047] Specifically, the heat dissipation device 1 is used to absorb the heat of the chip, and a cold air convection circulation is formed inside the server. The heat of the heat dissipation device 1 is carried away by the air convection to dissipate heat from the chip.

[0048] For example, the server is equipped with a fan and has an air inlet and an air outlet. Cold air from the outside enters the server through the air inlet, the fan accelerates the flow of the cold air and blows it to the heat dissipation device 1, which then uses convection heat exchange to remove the heat from the heat dissipation device 1. The air that has undergone heat exchange is then discharged to the outside of the server through the air outlet, and so on.

[0049] The server contains multiple chips that are staggered in the direction of air convection. The heat dissipation device 1 includes multiple heat sinks 11, each of which is installed on a corresponding chip to dissipate heat.

[0050] Taking an AI server as an example, the AI ​​server may have 8 GPUs. In the air convection direction, the 8 GPUs are arranged in two groups, one in front and one behind, with 4 GPUs in each group. In this regard, the heat dissipation device 1 may include 8 heat sinks 11, which are respectively installed on the 8 GPUs. That is, the 8 heat sinks 11 are arranged in two rows in the air convection direction, with 4 heat sinks 11 in each row.

[0051] Specifically, refer to Figure 1 As shown, each heat sink 11 includes a thermally conductive substrate 111 and a fin assembly 112. One side surface of the thermally conductive substrate 111 is attached to the heat dissipation surface of the chip, and the fin assembly 112 is connected to the other side surface of the thermally conductive substrate 111.

[0052] The heat collected on the heat dissipation surface of the chip is conducted to the heat-conducting substrate 111 of the heat sink 11. The heat-conducting substrate 111 conducts the heat to the fin group 112, and the heat is carried away by the air convection, thereby dissipating heat from the chip.

[0053] The fin assembly 112 includes multiple spaced-apart heat dissipation fins 1121, with the space between adjacent heat dissipation fins 1121 forming an air convection channel. Cooling airflow moves within the air convection channel and exchanges heat with the heat dissipation fins 1121, thus dissipating heat from the fins.

[0054] For example, the fan inside the server blows cool air onto the fin assembly 112. The cooling airflow enters the air convection channel between adjacent heat dissipation fins 1121 from one side of the fin assembly 112, and flows out from the other side of the fin assembly 112 after passing through the air convection channel. During the flow of the cooling airflow in the air convection channel, it exchanges heat with the heat dissipation fins 1121 through convection, carrying away the heat from the heat dissipation fins 1121.

[0055] Multiple heat dissipation fins 1121 are arranged in parallel to form the same air convection channel between adjacent heat dissipation fins 1121, ensuring the uniformity of heat dissipation in each region of the fin assembly 112. For example, the heat dissipation fins 1121 can extend along the surface direction of the heat-conducting substrate 111, that is, the heat dissipation fins 1121 and the heat-conducting substrate 111 are parallel to each other, or the heat dissipation fins 1121 and the heat-conducting substrate 111 are perpendicular to each other. In this way, multiple horizontally or vertically separated air convection channels can be formed, the air flow in the air convection channels is good, and the pressure in each region of the air convection channels is relatively uniform.

[0056] It should be noted that the chip is fixed inside the server by one side of its surface, for example, one side of the chip faces the circuit board and is fixed on the circuit board; the heat sink 11 is mounted on the other side of the chip, and the thermally conductive substrate 111 of the heat sink 11 is attached to the other side of the chip.

[0057] In practical applications, the heat sink 11 can be fixed by a circuit board. For example, the edge of the thermally conductive substrate 111 of the heat sink 11 extends to the outside of the chip, and the edge of the thermally conductive substrate 111 is fixedly connected to the circuit board. For example, the thermally conductive substrate 111 is connected to the circuit board by fasteners such as screws or rivets.

[0058] In the heat dissipation device 1 of this embodiment, heat sinks 11 with different structures are provided for chips that are staggered in the air convection direction, so as to reduce the mutual influence between the front and rear rows of heat sinks 11 and improve the heat dissipation efficiency and heat dissipation uniformity of the heat dissipation device 1.

[0059] Specifically, in the air convection direction, the heat sinks 11 installed on the front and rear rows of chips, and the fin groups 112 of the heat sinks 11 at different positions, are located in convection spaces at different heights. It should be noted that the heat sinks 11 at different positions refer to heat sinks 11 located in different rows in the air convection direction.

[0060] Multiple chips are arranged one in front of the other in the direction of air convection, and correspondingly, heat sinks 11 mounted on each chip are arranged one in front of the other. By placing the fin groups 112 of the front and rear rows of heat sinks 11 in convection spaces at different heights, for example, the fin groups 112 of the front row of heat sinks 11 are close to the heat-conducting substrate 111, while the fin groups 112 of the rear row of heat sinks 11 are far away from the heat-conducting substrate 111, there is a height difference between the fin groups 112 of the front row of heat sinks 11 and the fin groups 112 of the rear row of heat sinks 11, so that the fin groups 112 of the front and rear rows form independent cooling channels that are staggered vertically, and the cooling airflow passes through the fin groups 112 of the front and rear rows in parallel.

[0061] In related technologies, the fin groups 112 of the front and rear radiators 11 are usually located in the same height area. The cooling airflow first passes through the fin group 112 of the front radiator 11 to carry away the heat of the front radiator 11, and then passes through the fin group 112 of the rear radiator 11 to carry away the heat of the rear radiator 11.

[0062] With this configuration, after the cooling airflow passes through the fin group 112 of the front radiator 11, the temperature of the cooling airflow increases to a certain extent due to heat exchange with the fin group 112 of the front radiator 11. After passing through the fin group 112 of the rear radiator 11, the increased temperature of the cooling airflow reduces the cooling effect on the fin group 112 of the rear radiator 11.

[0063] In addition, the cooling airflow passes through the fin groups 112 of the front and rear rows of radiators 11 in sequence. It is doubly obstructed by the fin groups 112 of the front and rear rows, resulting in greater wind resistance. This causes the flow rate of the cooling airflow to decrease, which reduces the heat dissipation efficiency of the heat dissipation fins 1121.

[0064] Therefore, in this embodiment, by placing the fin groups 112 of the front and rear rows of radiators 11 in different height regions, the fin groups 112 of the front row of radiators 11 do not obstruct the fin groups 112 of the rear row of radiators 11, and the cooling airflow passes through the fin groups 112 of the front and rear rows of radiators 11 in parallel. On the one hand, the front row of radiators 11 does not preheat the rear row of radiators 11, which can improve the heat dissipation effect on the rear row of radiators 11, thereby improving the heat dissipation uniformity of the heat dissipation device 1; on the other hand, the wind resistance of the cooling airflow passing through the front and rear rows of radiators 11 is reduced, which can improve the heat dissipation efficiency of the heat dissipation device 1.

[0065] In practical applications, the multiple chips in a server include at least a first chipset and a second chipset. In the direction of air convection, the first chipset and the second chipset are staggered, that is, the first chipset is in one row and the second chipset is in another row.

[0066] Reference Figure 1 As shown, corresponding to the first and second chipsets that are staggered one after the other, the plurality of heat sinks 11 include at least a first heat sink 11a and a second heat sink 11b. The first heat sink 11a is installed on each chip of the first chipset, and the second heat sink 11b is installed on each chip of the second chipset.

[0067] It should be noted that the first radiator 11a does not refer to a single radiator 11, but rather to a class of radiators 11 with the same structure; similarly, the second radiator 11b does not refer to a single radiator 11, but rather to a class of radiators 11 with the same structure; furthermore, the second radiator 11b has a different structure from the first radiator 11a.

[0068] The first heat sink 11a includes a first thermally conductive substrate 111a and a first fin assembly 112a connected to the first thermally conductive substrate 111a. Taking a chip in the first chipset as an example, one side surface of the first thermally conductive substrate 111a is attached to the heat dissipation surface of the chip, and the first fin assembly 112a is connected to the other side surface of the first thermally conductive substrate 111a.

[0069] The second heat sink 11b includes a second thermally conductive substrate 111b and a second fin assembly 112b connected to the second thermally conductive substrate 111b. Taking a chip in the second chipset as an example, one side surface of the second thermally conductive substrate 111b is attached to the heat dissipation surface of the chip, and the second fin assembly 112b is connected to the other side surface of the second thermally conductive substrate 111b.

[0070] The first fin group 112a and the second fin group 112b are located in convection spaces at different heights.

[0071] In this way, in the direction of air convection, the first fin group 112a and the second fin group 112b form two independent cooling channels that are staggered vertically. The cooling airflow can pass through the first fin group 112a and the second fin group 112b in parallel without affecting each other. Therefore, the heat dissipation efficiency and heat dissipation effect of the heat dissipation device 1 can be improved, and the heat dissipation device 1 provides good heat dissipation uniformity for the first chip group and the second chip group.

[0072] It should be understood that, in the direction of air convection, for the case where a first chipset and a second chipset are set up in the server with their front and rear staggered, the heat dissipation device 1 may only include a first heat sink 11a set on each chip of the first chipset and a second heat sink 11b set on each chip of the second chipset.

[0073] In other embodiments, the heat dissipation device 1 may include not only the first heat sink 11a and the second heat sink 11b, but also other heat sinks 11. For example, the heat dissipation device 1 may also include a third heat sink 11. In addition to the first and second chipsets, a third chipset may be provided in the server. In the air convection direction, the third chipset is not in the same row as the first and second chipsets. The third heat sink 11 is installed on each chip of the third chipset. The third heat sink 11 includes a third fin group 112. In the height direction of the convection space, the third fin group 112 is located in a height range different from that of the first fin group 112a and the second fin group 112b.

[0074] The following description assumes that the server is equipped with a first chipset and a second chipset, and the heat sink 11 includes a first heat sink 11a and a second heat sink 11b.

[0075] Specifically, refer to Figure 1 and Figure 2 As shown, in one embodiment, the first fin assembly 112a of the first heat sink 11a is connected to the first thermally conductive substrate 111a. It is understood that the first fin assembly 112a extends in the height direction of the convection space, so that different regions of the first fin assembly 112a are located at different heights to improve the efficiency of air convection heat transfer. Therefore, one end of the first fin assembly 112a is connected to the first thermally conductive substrate 111a, and the other end of the first fin assembly 112a is the end furthest from the thermally conductive substrate 111a.

[0076] Reference Figure 1 and Figure 3As shown, there is a gap between the second fin group 112b and the second thermally conductive substrate 111b. That is, there is a gap between the end of the second fin group 112b near the thermally conductive substrate 111 and the thermally conductive substrate 111; while the gap between the other end of the second fin group 112b away from the thermally conductive substrate 111 and the thermally conductive substrate 111 is larger.

[0077] With this configuration, the first fin group 112a is closer to the chip, while the second fin group 112b is farther from the chip. In the direction of air convection, there is a height difference between the first fin group 112a and the second fin group 112b, which allows the cooling airflow to pass through the first fin group 112a and the second fin group 112b in parallel, thereby improving the heat dissipation uniformity of the first fin group 112a and the second fin group 112b and increasing the heat dissipation efficiency of the first fin group 112a and the second fin group 112b.

[0078] Since the first fin group 112a is connected to the first heat-conducting substrate 111a, the overall height of the first heat sink 11a is relatively low; since there is a gap between the second fin group 112b and the second heat-conducting substrate 111b, the overall height of the second heat sink 11b is relatively high.

[0079] It is understandable that, in the direction of airflow, regardless of whether the lower first radiator 11a or the higher second radiator 11b is in front, as long as the first fin group 112a and the second fin group 112b are located in different height spaces, the first radiator 11a and the second radiator 11b can form two independent cooling channels that are staggered vertically.

[0080] Therefore, in the direction of airflow, the first radiator 11a can be located in front of the second radiator 11b, or the first radiator 11a can be located behind the second radiator 11b. This embodiment does not impose any limitations on this.

[0081] Among them, reference Figure 3 As shown, for the second fin group 112b having a gap between it and the second thermally conductive substrate 111b, the second fin group 112b can be connected to the second thermally conductive substrate 111b via a support portion 113. For example, support portions 113 can be connected to both sides of the second thermally conductive substrate 111b, and the second fin group 112b can be connected between the support portions 113 on both sides. The second fin group 112b has a gap between its bottom surface near the second thermally conductive substrate 111b and the thermally conductive substrate 111b, and the support portion 113 extends from the second thermally conductive substrate 111b to the top surface of the second fin group 112b.

[0082] Additionally, support portions 113 may be connected to both sides of the first fin assembly 112a. One end of the support portion 113 is connected to the first thermally conductive substrate 111a, and the other end of the support portion 113 extends to the top surface of the first fin assembly 112a. The bottom surface of the first fin assembly 112a is located on the first thermally conductive substrate 111a.

[0083] Reference Figure 2 and Figure 3 As shown, taking the support portion 113 as an example of a support plate connected to the heat-conducting substrate 111, the support plate can be located on both sides of the heat-conducting substrate 111 in the air convection direction, and the support plate extends along the air convection direction to prevent the support portion 113 from obstructing the flow of cooling air. An air convection channel for the heat sink 11 is formed between the support plates on both sides.

[0084] To improve the efficiency of heat transfer from the thermally conductive substrate 111 to the heat dissipation fins 1121, related technologies utilize heat pipes to transfer heat to the heat dissipation fins 1121. Specifically, the heat pipe is disposed on the side of the thermally conductive substrate 111 facing the chip and in contact with the chip's heat dissipation surface. The heat pipe is bent to the other side of the thermally conductive substrate 111 and passes through the heat dissipation fins 1121, making close contact with the heat dissipation fins 1121. The heat pipe absorbs the heat generated by the chip and then transfers it to the heat dissipation fins 1121, where the heat is carried away by convective heat transfer through the cooling airflow.

[0085] However, the bending and length of the heat pipe can affect its heat transfer efficiency. The temperature of the heat pipe decreases in the direction of heat transfer, resulting in uneven heat conduction. This is especially true for tall and large radiators 11, where the heat transfer effect of the heat pipe radiator will be significantly worse.

[0086] In this regard, refer to Figure 2 and Figure 3 As shown, in this embodiment, the heat dissipation efficiency and heat dissipation uniformity of the heat sink 11 are improved by providing a heat exchange channel 114 in the heat sink 11. Specifically, one end of the heat exchange channel 114 is connected to the heat-conducting substrate 111, the other end of the heat exchange channel 114 extends to the top surface of the fin assembly 112, and the outer wall of the heat exchange channel 114 is connected to the heat dissipation fins 1121.

[0087] By providing a heat exchange channel 114, which connects the top surface of the thermally conductive substrate 111 and the fin assembly 112, and interlacing the heat exchange channel 114 within the fin assembly 112 between each heat dissipation fin 1121 (i.e., the heat exchange channel 114 is connected to the heat dissipation fins 1121), the thermally conductive substrate 111 can transfer heat from the chip to the heat exchange channel 114, and the heat is transferred along the outer wall of the heat exchange channel 114 to its top surface.

[0088] In this process, by filling the heat exchange channel 114 with a phase change medium, the heat from the outer wall of the heat exchange channel 114 is conducted to the heat exchange channel 114, which allows the phase change medium to absorb heat and undergo a phase change, thereby accelerating the heat absorption efficiency of the radiator 11. Furthermore, after the phase change medium undergoes a phase change, its movement speed increases, and the phase change medium moves from the bottom end to the top end of the heat exchange channel 114. Through the outer wall of the heat exchange channel 114, it transfers heat to the heat dissipation fins 1121 that are in contact with the heat exchange channel 114, and the heat from the heat dissipation fins 1121 is carried away by the cooling airflow.

[0089] Therefore, by setting a heat exchange channel 114 in the radiator 11 and filling the heat exchange channel 114 with a phase change medium, the heat exchange efficiency of the radiator 11 is accelerated by phase change heat transfer, thereby improving the heat dissipation efficiency of the radiator 11.

[0090] Meanwhile, due to the phase change heat transfer occurring within the heat exchange channel 114, the velocity of the phase change medium increases. Therefore, there is no temperature unevenness within the heat exchange channel 114, meaning there is no issue of heat transfer performance degradation. Along the extension direction of the heat exchange channel 114, the temperature is uniform across all parts of the channel, and the heat transferred to the corresponding parts of the heat dissipation fins 1121 is also uniform. This improves the heat transfer uniformity of the radiator 11 and enhances its heat exchange performance.

[0091] Taking water as the phase change medium within the heat exchange channel 114 as an example, the heat-conducting substrate 111 transfers heat from the chip to the bottom of the heat exchange channel 114, and the heat is conducted along the outer wall of the heat exchange channel 114 to the top. The water within the heat exchange channel 114 absorbs heat from the outer wall, causing the water temperature to rise and vaporize into water vapor. The water vapor moves faster within the heat exchange channel 114 and moves towards the top. During this process, the water vapor transfers heat through the outer wall of the heat exchange channel 114 to the heat dissipation fins 1121. The heat on the heat dissipation fins 1121 is carried away by the cooling airflow, and the water vapor releases heat and condenses into water droplets. The water droplets fall along the inner wall of the heat exchange channel 114 to the bottom. This cycle repeats, using the phase change heat transfer of water to accelerate the heat exchange efficiency of the heat sink 11 and improve the heat transfer uniformity of the heat sink 11.

[0092] It is understood that the phase change medium in the heat exchange channel 114 is not limited to water; it can also be other substances that can change phase to gas after absorbing heat and then change phase to liquid after releasing heat. This embodiment does not impose specific limitations on this.

[0093] It should be noted that, referring to Figure 2, for the first heat sink 11a, since the first fin group 112a is in contact with the first heat-conducting substrate 111a, and the heat exchange channel 114 is connected between the top surface of the first heat-conducting substrate 111a and the first fin group 112a, the heat exchange channel 114 is inserted entirely into the heat dissipation fins 1121 of the first fin group 112a in its extension direction.

[0094] Reference Figure 3 As shown, for the second heat sink 11b, since there is a gap between the bottom end face of the second fin group 112b and the second heat-conducting substrate 111b, and the heat exchange channel 114 is connected between the top end face of the second heat-conducting substrate 111b and the second fin group 112b, the lower half of the heat exchange channel 114 is located in the hollow area between the second heat-conducting substrate 111b and the second fin group 112b in its extension direction, and the upper half is inserted into the heat dissipation fins 1121 of the second fin group 112b.

[0095] To improve the heat exchange efficiency of the heat exchange channel 114, as one embodiment, the thermally conductive substrate 111 can be hollow inside, and the bottom end of the heat exchange channel 114 is connected to the interior of the thermally conductive substrate 111. In this way, the thermally conductive substrate 111 also serves as part of the heat exchange channel 114, which means that the outer wall of the heat exchange channel 114 is in direct contact with the heat dissipation surface of the chip.

[0096] In this way, when the phase change medium in the heat exchange channel 114 is in a liquid state before absorbing heat, the phase change medium is located inside the thermally conductive substrate 111, and the thermally conductive substrate 111 can directly transfer the heat from the chip to the phase change medium. At this time, since the phase change medium is in direct contact with the side surface of the thermally conductive substrate 111 that is attached to the heat dissipation surface of the chip, and the contact area between the phase change medium and the thermally conductive substrate 111 is large, the efficiency of heat transfer from the thermally conductive substrate 111 to the phase change medium can be significantly improved, thereby improving the heat exchange efficiency of the phase change medium and enhancing the heat exchange performance of the heat sink 11.

[0097] In addition, after the liquid phase change medium is vaporized, in order to allow the gaseous phase change medium to move smoothly in the heat exchange channel 114, the heat exchange channel 114 can extend in a direction perpendicular to the surface of the heat-conducting substrate 111, that is, the heat exchange channel 114 extends vertically upward.

[0098] After the phase change medium vaporizes, its general motion is vertical upward from the bottom of the heat exchange channel 114. Therefore, by setting a vertical heat exchange channel 114 in this embodiment, the sidewall of the heat exchange channel 114 provides less obstruction to the gaseous phase change medium, ensuring that the gaseous phase change medium moves smoothly upward within the heat exchange channel 114, accelerating the movement speed of the gaseous phase change medium, and improving the heat exchange efficiency of the phase change medium.

[0099] For a vertically arranged heat exchange channel 114, since the outer wall of the heat exchange channel 114 is in contact with the heat dissipation fins 1121, the heat dissipation fins 1121 cannot be arranged vertically, that is, the heat dissipation fins 1121 cannot be vertically connected to the heat-conducting substrate 111. For example, the heat dissipation fins 1121 can be arranged parallel to the heat-conducting substrate 111.

[0100] Based on this, refer to Figure 2 and Figure 3 As shown, each radiator 11 of the heat dissipation device 1 can be provided with multiple heat exchange channels 114, and the multiple heat exchange channels 114 are spaced apart between the two sides of the fin group 112.

[0101] By providing multiple heat exchange channels 114 between the two sides of the fin assembly 112, for example, by spaced-apart between the support portions 113 on both sides, phase change heat transfer occurs simultaneously within the multiple heat exchange channels 114. The outer walls of different heat exchange channels 114 contact different areas of the heat dissipation fins 1121, increasing the number of contact points and the contact area between the heat exchange channels 114 and the heat dissipation fins 1121. This improves the heat exchange efficiency and uniformity of the heat exchange channels 114, thereby enhancing the heat exchange performance of the radiator 11.

[0102] Reference Figures 1 to 3 As shown, in some embodiments, the radiator 11 may further include an end plate 115, which is connected to the top surface of the fin assembly 112, and the top end of the heat exchange channel 114 is connected to the end plate 115.

[0103] By connecting an end plate 115 to the top surface of the fin assembly 112, the fin assembly 112 is connected between the heat-conducting substrate 111 and the end plate 115. The heat-conducting substrate 111 and the end plate 115 respectively fix both ends of the fin assembly 112, thereby improving the strength of the fin assembly 112. Furthermore, the top end of the heat exchange channel 114 is fixedly connected to the end plate 115, making the connection of the heat exchange channel 114 more robust. This, in turn, improves the strength of the heat sink 11.

[0104] The heat dissipation device provided in this embodiment is used to dissipate heat from chips inside a server. The server contains multiple chips arranged in a staggered pattern along the airflow direction. The heat dissipation device includes multiple heat sinks, each mounted on one of the staggered chips, to dissipate heat. Specifically, each heat sink includes a thermally conductive substrate and fins connected to the substrate. The substrate is attached to the heat dissipation surface of the chip. Heat from the chip is conducted to the substrate, which then conducts it to the fins, which are then carried away by air convection. By positioning the fins of the heat sinks at different heights within convection spaces along the airflow direction, the front and rear rows of heat sinks form independent, staggered cooling channels. Cooling air passes parallel to the fins of the front and rear rows, preventing obstruction of the rear rows by the fins and improving the heat dissipation efficiency and uniformity.

[0105] Example 2

[0106] Figure 4 This is a schematic diagram of the server layout according to Embodiment 2 of this application. (Refer to...) Figure 4 As shown, this embodiment provides a server 2, which is equipped with a processor and the heat dissipation device described in Embodiment 1.

[0107] The processor comprises multiple chips, and a heat dissipation device is used to cool these chips to ensure their performance. Specifically, the heat dissipation device includes multiple heat sinks, each mounted on a separate chip.

[0108] The heat sink includes a thermally conductive substrate and a fin assembly. One surface of the thermally conductive substrate is attached to the heat dissipation surface of the chip, and the fin assembly is connected to the other surface of the thermally conductive substrate. The heat from the chip is transferred to the thermally conductive substrate, which then transfers the heat to the fin assembly. The heat from the fin assembly is dissipated by air convection, thus cooling the chip.

[0109] Within the server, multiple chips are staggered in terms of airflow direction. To accommodate this, heatsinks located on different chips have fins positioned within convection spaces at varying heights. This allows cooling airflow to pass parallel through the fins of the heatsinks, improving heat dissipation efficiency and uniformity.

[0110] Taking an AI server as an example, the AI ​​server has 8 GPUs. In terms of air convection, 4 GPUs are arranged in the front row and 4 GPUs are arranged in the back row, and each GPU is equipped with a heat sink. The fins of the heat sinks on the front row GPUs and the heat sinks on the back row GPUs are located in convection spaces at different heights.

[0111] Reference Figure 4 As shown, server 2 includes an I / O area 21, a processor area 22, a heat dissipation area 23, and a fan area 24. The I / O area 21 contains input / output interfaces for signal transmission between server 2 and external devices. The processor area 22 houses multiple processors, such as eight GPUs. The heat dissipation area 23 contains heat dissipation devices to cool the processors within the processor area 22. The fan area 24 contains fans to accelerate airflow within server 2; the fan exhaust can be directed towards the heat dissipation device to improve its cooling efficiency.

[0112] Specifically, the I / O area 21 and the fan area 24 can be arranged on both sides of the server 2, the processor area 22 and the heat dissipation device area 23 are located in the middle of the server 2, and the heat dissipation device area 23 is located above the processor area 22.

[0113] The specific structure, function, and working principle of the heat dissipation device have been described in detail in Embodiment 1, and will not be repeated here.

[0114] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipation device for dissipating heat from chips in a server, characterized in that, include: Multiple heat sinks; in the direction of air convection, the multiple heat sinks are respectively mounted on the chip in a staggered manner; Each of the heat sinks includes a thermally conductive substrate and a fin assembly. One side surface of the thermally conductive substrate is attached to the heat dissipation surface of the chip, and the fin assembly is connected to the other side surface of the thermally conductive substrate. In the direction of air convection, the fin assemblies of the radiator at different positions are located in convection spaces at different heights; The heat sink includes multiple heat exchange channels, which are spaced apart between the two sides of the fin assembly; the heat exchange channels extend in a direction perpendicular to the surface of the heat-conducting substrate. One end of the heat exchange channel is connected to the heat-conducting substrate, and the other end of the heat exchange channel extends to the top surface of the fin assembly, and the outer wall of the heat exchange channel is connected to the heat dissipation fins; wherein, the heat exchange channel is filled with a phase change medium. The plurality of heat sinks include at least a first heat sink and a second heat sink, and the plurality of chips include at least a first chip group and a second chip group that are staggered in the air convection direction; the first heat sink is mounted on a chip in the first chip group, and the second heat sink is mounted on a chip in the second chip group; The first heat sink includes a first thermally conductive substrate and a first fin group, and the second heat sink includes a second thermally conductive substrate and a second fin group; wherein the first fin group and the second fin group are located in convection spaces at different heights; for the second heat sink, the lower half of the heat exchange channel is located in the hollow region between the second thermally conductive substrate and the second fin group in its extension direction, and the upper half is inserted into the heat dissipation fins of the second fin group. The first fin group is connected to the first thermally conductive substrate, and there is a gap between the end of the second fin group near the second thermally conductive substrate and the second thermally conductive substrate; in the air convection direction, the first fin group and the second fin group form independent cooling channels that are staggered vertically, and the cooling airflow passes through the first fin group and the second fin group in parallel. A support portion is connected between the second fin group and the second thermally conductive substrate, and the support portion extends from the second thermally conductive substrate to the top surface of the second fin group; The support portion is a support plate connected to the second thermally conductive substrate. The support plate is located on both sides of the second thermally conductive substrate in the air convection direction, and the support plate extends along the air convection direction. The radiator also includes an end plate connected to the top surface of the fin assembly, and the top of the heat exchange channel is connected to the end plate.

2. The heat dissipation device according to claim 1, characterized in that, In the direction of airflow, the first radiator is located in front of the second radiator, or the first radiator is located behind the second radiator.

3. The heat dissipation device according to claim 1, characterized in that, The fin assembly includes multiple spaced-apart heat dissipation fins, with air convection channels formed between adjacent heat dissipation fins.

4. The heat dissipation device according to claim 1, characterized in that, The heat-conducting substrate is hollow inside, and the bottom end of the heat exchange channel is connected to the interior of the heat-conducting substrate.

5. A server, characterized in that, The device includes a processor and a heat dissipation device as described in any one of claims 1-4, wherein the processor includes a plurality of chips and the heat dissipation device is used to dissipate heat from the plurality of chips.

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