Carrier and semiconductor processing equipment

Abstract

The present application discloses a carrier device and a semiconductor processing equipment. The carrier device includes a main body, a boss and a limiter. The main body includes a first surface and a side surface connected to the first surface. The boss is arranged at the edge of the first surface and together with the main body forms a cavity. The boss includes an adsorption surface away from the first surface, and the adsorption surface is provided with an adsorption unit, and the adsorption unit is used to adsorb the first area of ​​the workpiece to the adsorption surface. The cavity corresponds to the second area of ​​the workpiece, and the first area surrounds the second area. The limiter is arranged on the side and is located on the side of the boss away from the cavity. The limiter is radially against the workpiece and is used to limit the position of the workpiece. In the carrier device and the semiconductor processing equipment of the embodiment of the present application, the boss and the main body together form a cavity. Since the first area of ​​the workpiece is carried on the adsorption surface of the boss, the second area of ​​the workpiece corresponding to the cavity is spaced from the bottom of the cavity, thereby avoiding damage to the second area of ​​the workpiece when it is placed on the carrier device.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to a carrier device and semiconductor processing equipment. Background Art

[0002] During the inspection of workpieces, such as wafers, a wafer carrier is usually used to carry the wafer, driving the wafer to rotate or translate, so as to complete the inspection, measurement and exposure of the wafer. However, after the wafer is placed, the wafer is often damaged due to contact between the wafer and the wafer carrier. Therefore, how to avoid damage to the wafer during inspection is an urgent problem to be solved. Summary of the invention

[0003] Embodiments of the present application provide a carrier device and semiconductor processing equipment.

[0004] The supporting device of the embodiment of the present application includes a body, a boss and a limiter. The body includes a first surface and a side surface connected to the first surface. The boss is arranged at the edge of the first surface and forms a cavity together with the body. The boss includes an adsorption surface away from the first surface, and the adsorption surface is provided with an adsorption unit. The adsorption unit is used to adsorb the first area of ​​the workpiece to the adsorption surface. The cavity corresponds to the second area of ​​the workpiece, and the first area surrounds the second area. The limiter is arranged on the side surface and is located on the side of the boss away from the cavity. The limiter is radially against the workpiece and is used to limit the position of the workpiece.

[0005] In some embodiments, there are multiple limit members, and the multiple limit members are evenly distributed along the side wall of the body so that the center of the workpiece coincides with the center of the body.

[0006] In some embodiments, the limiting member includes an arc-shaped chamfer, and the chamfer is used to guide the center of the workpiece to coincide with the center of the body when the workpiece is placed on the first surface.

[0007] In some embodiments, the protrusion is annular and has an opening connected to the cavity, and the opening is used for a robot to pick up and place the workpiece.

[0008] In some embodiments, the supporting device also includes an exhaust unit, the adsorption unit includes a groove arranged on the first surface and a connecting hole located at the bottom of the groove, the groove is connected to the exhaust unit through the connecting hole, and the exhaust unit is used to exhaust the connecting hole and the groove to adsorb the workpiece on the first surface.

[0009] In some embodiments, the body further includes a second surface opposite to the first surface, the air extraction unit is disposed on the second surface, and the connecting hole is located between the first surface and the second surface.

[0010] In some embodiments, there are multiple grooves, and the multiple grooves are evenly spaced on the adsorption surface. There are multiple connecting holes, and each groove corresponds to a connecting hole. Each groove is connected to the exhaust unit through the corresponding connecting hole.

[0011] In some embodiments, the supporting device further includes a plug, the side surface is provided with a through hole communicating with the connecting hole, and the plug is detachably installed in the through hole to seal the through hole.

[0012] In some embodiments, the carrying device further includes a moving unit, and the main body is provided with a transfer hole, and the transfer hole is used to connect the main body and the moving unit.

[0013] The semiconductor processing equipment of the embodiment of the present application comprises a processing device and a carrier device of any one of the above embodiments, wherein the processing device corresponds to the carrier device and is used to process a workpiece carried by the carrier device.

[0014] In some embodiments, the processing device includes an optical detector, the optical detector includes a detector, the detector is used to image the workpiece, and the distance between the first surface and the adsorption surface is such that the bottom of the cavity is outside the depth of field of the detector.

[0015] In the carrier device and semiconductor processing equipment of the embodiments of the present application, the boss and the main body together form a cavity. Since the first area of ​​the workpiece is carried on the adsorption surface of the boss, the second area of ​​the workpiece corresponding to the cavity is spaced from the bottom of the cavity, so that only the first area (the edge-cut part) of the workpiece contacts the carrier device, thereby avoiding damage to the second area of ​​the workpiece (for example, a wafer) when placed on the carrier device.

[0016] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a three-dimensional schematic diagram of a carrying device carrying a workpiece according to some embodiments of the present application;

[0019] Figure 2 is a three-dimensional schematic diagram of a carrying device of certain embodiments of the present application;

[0020] Figure 3 yes Figure 2 A three-dimensional schematic diagram of the carrying device shown in another perspective;

[0021] Figure 4 is a three-dimensional schematic diagram of a manipulator in certain embodiments of the present application extending into a cavity of a carrying device;

[0022] Figure 5 It is a three-dimensional schematic diagram of a manipulator in certain embodiments of the present application extending into a cavity to remove a workpiece;

[0023] Figure 6 yes Figure 2 An enlarged schematic diagram of the V portion of the carrying device shown;

[0024] Figure 7 is a cross-sectional schematic diagram of a carrier device according to certain embodiments of the present application;

[0025] Figure 8 is a three-dimensional schematic diagram of a limiting member of a carrying device in certain embodiments of the present application;

[0026] Fig. 9 It is a schematic diagram of the structure of a semiconductor processing device according to certain embodiments of the present application. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and cannot be understood as limiting the embodiments of the present application.

[0028] See also Figure 1 and Figure 2 The present application provides a carrying device 100, which includes a body 10, a boss 20 and a stopper 30. The body 10 includes a first surface 101 and a side surface 102 connected to the first surface 101. The boss 20 is arranged at the edge of the first surface 101, and together with the body 10, forms a cavity 40. The boss 20 includes an adsorption surface 21 away from the first surface 101, and the adsorption surface 21 is provided with an adsorption unit 211. The adsorption unit 211 is used to adsorb the first area 51 of the workpiece 50 on the adsorption surface 21. The cavity 40 corresponds to the second area 52 of the workpiece 50, and the first area 51 surrounds the second area 52. The stopper 30 is arranged on the side surface 102 and is located on the side of the boss 20 away from the cavity 40. The stopper 30 is radially against the workpiece 50 to limit the position of the workpiece 50.

[0029] The workpiece 50 includes, but is not limited to, wafers, chips, display panels, mobile phone front covers, mobile phone back covers, VR glasses, AR glasses, smart watch covers, glass, lenses, wood, iron plates, housings of any devices (such as mobile phone cases), etc. This application takes the workpiece 50 as an example of a wafer, and it is understood that the workpiece 50 is not limited to a wafer.

[0030] When the workpiece 50 is a wafer, the wafer can be a patterned wafer or a non-patterned wafer. When the wafer is a non-patterned wafer, the second area 52 corresponds to the processing area of ​​the non-patterned wafer where a pattern is to be formed, and the first area 51 corresponds to the edge removal area where no pattern is required. When the wafer is a patterned wafer, the second area 52 corresponds to the pattern area of ​​the patterned wafer, and the first area 51 corresponds to the non-patterned area, which is also the edge removal area.

[0031] At present, when the workpiece 50 is placed on the carrier 100, the surface of the workpiece 50 is often damaged or scratched due to contact with the carrier 100. For example, if the workpiece 50 is a patterned wafer, the existing process pattern portion of the patterned wafer may be damaged or scratched due to contact with the carrier 100, thereby making the workpiece 50 unusable.

[0032] In the carrier device 100 of the embodiment of the present application, the boss 20 and the main body 10 together form a cavity 40. Since the first area 51 of the workpiece 50 is supported on the adsorption surface 21 of the boss 20, the second area 52 of the workpiece 50 corresponding to the cavity 40 is spaced from the bottom 41 of the cavity 40, so that only the first area 51 (the edge-cut part) of the workpiece 50 contacts the carrier device 100, thereby avoiding damage to the second area 52 of the workpiece 50 (for example, a wafer) when placed on the carrier device 100.

[0033] The following is a further description with reference to the accompanying drawings.

[0034] See also Figure 2 and Figure 3 The carrying device 100 includes a body 10, a boss 20, a stopper 30, and an air extraction unit 60. The boss 20, the stopper 30, and the air extraction unit 60 are arranged on the body 10.

[0035] Please combine Figure 2 The body 10 includes a first surface 101, a side surface 102 and a second surface 103. The first surface 101 is opposite to the second surface 103, and the side surface 102 is connected to both the first surface 101 and the second surface 103. The outer contour of the body 10 can be circular, triangular, quadrilateral, pentagonal, hexagonal or other regular or irregular shapes to be suitable for workpieces 50 of different shapes. This application only takes the outer contour of the body 10 as a circular shape as an example for description.

[0036] The boss 20 is arranged at the edge of the first surface 101 and together with the body 10, forms a cavity 40. The boss 20 is annular and has an opening 201 connected to the cavity 40. The opening 201 is used for the manipulator 400 to extend into the cavity ( Figure 4 As shown) pick up and place the workpiece 50.

[0037] At present, when the robot 400 places the workpiece 50 on the carrier 100, the robot 400 is often required to first place the workpiece 50 on a suction cup that can be raised and lowered, and then lower the suction cup to place the workpiece 50 on the carrier 100. When the robot 400 takes out the workpiece 50 from the carrier 100, it is necessary to raise the suction cup to lift the workpiece 50 to a certain height relative to the first surface 101, so as to provide an operating space for the robot 400 to take out the workpiece 50, thereby completing the robot 400 taking out the workpiece 50 from the carrier 100. If the workpiece 50 is a wafer, if the operating space is not reserved enough, the surface of the workpiece 50 is easy to contact with the carrier 100, thereby causing damage to the surface of the workpiece 50. Such a carrier 100, on the one hand, increases the time for the robot 400 to take and place the workpiece 50, thereby affecting the efficiency of processing multiple workpieces 50. On the other hand, when the workpiece 50 is placed on the carrier 100, the surface of the workpiece 50 will be damaged, thereby causing the workpiece 50 to be unable to be used.

[0038] In the carrier device 100 of the present application embodiment, as Figure 4 As shown, when the robot 400 places the workpiece 50 on the carrier 100, that is, when the robot 400 places the workpiece 50 on the boss 20, the robot 400 can pass through the opening 201 and extend into the cavity 40. After placing the workpiece 50 on the boss 20, the robot 400 is withdrawn from the opening 201 to complete the placement of the workpiece 50 by the robot 400. Figure 5 As shown, when the robot 400 takes out the workpiece 50 from the carrier 100, the robot 400 can penetrate the opening 201 to extend into the cavity 40, and then raise the height of the robot 400 to drive the workpiece 50 away from the boss 20, so that the robot 400 takes out the workpiece 50. The boss 20 and the body 10 surround the cavity 40 and open the opening 201. On the one hand, when the robot 400 takes and places the workpiece 50, there is no need to lift the workpiece 50 to a high degree, so that the robot 400 can take and place the workpiece 50, thereby improving the efficiency of processing the workpiece 50. On the other hand, if the workpiece 50 is a wafer, only the first area 51 (edge ​​removal area) of the workpiece 50 contacts the boss 20, and the second area 52 (pattern area or area to be processed) corresponding to the cavity 40 is spaced from the bottom 41 of the cavity 40, thereby preventing the workpiece 50 (wafer) from being damaged when placed on the carrier 100.

[0039] Please also read Figure 2and Figure 6 The boss 20 includes a suction surface 21 , which is disposed away from the first surface 101 . The suction surface 21 is provided with a suction unit 211 , which is used to suction the workpiece 50 onto the suction surface 21 .

[0040] Please combine Figure 7 The adsorption unit 211 includes a groove 212 disposed on the first surface 101 and a connection hole 213 located at the bottom of the groove 212 . The connection hole 213 is located between the first surface 101 and the second surface 103 .

[0041] The air inside the groove 212 can be discharged to the outside of the main body 10 through the connecting hole 213. When the workpiece 50 is placed on the boss 20, the workpiece 50 covers the groove 212, and at least part of the air inside the groove 212 is discharged to the outside of the main body 10 through the connecting hole 213 to adjust the pressure inside the groove 212, so that the groove 212 produces different sizes of adsorption force on the workpiece 50, and then the workpiece 50 is adsorbed on the adsorption surface 21.

[0042] The number of the grooves 212 may be one or more, for example, 2, 4, 6 or more, and the number of the connecting holes 213 is consistent with the number of the grooves 212, and the plurality of grooves 212 and the connecting holes 213 are evenly spaced and distributed on the adsorption surface 21. In one embodiment, when the number of the grooves 212 is 6, the number of the connecting holes 213 is also 6, and the plurality of grooves 212 adsorb the workpiece 50 at the same time, and the plurality of grooves 212 are evenly spaced and distributed on the adsorption surface 21, so as to ensure that when the adsorption surface 21 adsorbs the workpiece 50, the adsorption force on the edge of the workpiece 50 is uniform, thereby ensuring that the workpiece 50 can be stably placed on the adsorption surface 21.

[0043] Currently, when the workpiece 50 is placed on the carrier 100 , the robot 400 cannot ensure that the center of the workpiece 50 coincides with the center of the carrier 100 , which results in errors in processing the workpiece 50 .

[0044] Please combine Figure 2In the carrier device 100 of the embodiment of the present application, the stopper 30 is arranged on the side 102 and is located on the side of the boss 20 away from the cavity 40. The stopper 30 is radially against the workpiece 50 to limit the position of the workpiece 50. The number of the stopper 30 can be multiple, for example, 3, 4, 5 or more. The multiple stoppers 30 are evenly distributed along the side wall 104 of the body 10. The multiple stoppers 30 are radially against the workpiece 50 at the same time to limit the center of the workpiece 50 to coincide with the center of the body 10. In one embodiment, when the number of the stoppers 30 is 3, the three stoppers 30 are evenly distributed on the side wall 104 of the body 10. When the workpiece 50 is placed on the adsorption surface 21, the three stoppers 30 are radially against the workpiece 50 at the same time to limit the placement position of the workpiece 50 to not deviate from or exceed the adsorption surface 21, and to make the center of the workpiece 50 coincide with the center of the body 10, thereby ensuring the processing accuracy of the workpiece 50.

[0045] Please combine Figure 8 The stopper 30 can be detachably or non-detachably mounted on the side 102 of the body 10 by screwing or gluing. In one embodiment, a through hole 302 can be provided on the stopper 30, and a threaded hole can be correspondingly provided on the body 10. The screw passes through the through hole 302 and is screwed into the threaded hole to mount the stopper 30 on the body 10, thereby completing the screwing installation of the stopper 30 on the body 10, so as to facilitate the later maintenance and replacement of the stopper 30. In another embodiment, the surface of the stopper 30 in contact with the body 10 can be coated with an adhesive such as oiled metal glue, high-temperature glue, etc., to complete the gluing installation of the stopper 30 on the body 10, so as to ensure the firmness between the stopper 30 and the body 10.

[0046] The limiting member 30 includes an arc-shaped chamfer 301 , and the chamfer 301 is used to guide the center of the workpiece 50 to coincide with the center of the body 10 when the workpiece 50 is placed on the first surface 101 .

[0047] When the workpiece 50 is placed on the adsorption surface 21, if the center of the workpiece 50 does not coincide with the center of the main body 10, the workpiece 50 cannot completely cover the groove 212, resulting in air leakage in some grooves 212, so that the adsorption unit 211 cannot completely adsorb the workpiece 50 on the adsorption surface 21. At this time, the arc-shaped chamfer 301 can make the workpiece 50 deviate from the limit member 30 (with a high horizontal height) and slide toward other limit members 30 (with a low horizontal height) to make the workpiece 50 in a horizontal state until multiple limit members 30 radially abut against the workpiece 50 at the same time, so that the center of the workpiece 50 coincides with the center of the main body 10, so as to reduce the risk of deviation in the placement of the workpiece 50 and the inability of the workpiece 50 to be adsorbed by the adsorption surface 21, thereby ensuring the accuracy of processing the workpiece 50, and the arc-shaped chamfer 301 can make the workpiece 50 slide downward slowly, so as to avoid damage to the workpiece 50 when the limit member 30 abuts against the workpiece 50.

[0048] See also Figure 3 and Figure 7 , the air extraction unit 60 is disposed on the second surface 103, and the air extraction unit 60 is used to extract air from the connection hole 213 and the groove 212 to adsorb the workpiece 50 on the adsorption surface 21. Specifically, the air extraction unit 60 is disposed at the center of the second surface 103 of the body 10. When the number of the groove 212 and the connection hole 213 is multiple, the multiple grooves 212 are connected to the air extraction unit 60 through the connection hole 213 ( Figure 7 In one embodiment, when the workpiece 50 is placed on the adsorption surface 21, the workpiece 50 completely covers the groove 212, thereby completely closing the groove 212. The air extraction unit 60 can extract the air in the groove 212 through the plurality of connection holes 213, so that the interior of the groove 212 is in a vacuum state or a negative pressure state, so as to ensure that when the workpiece 50 is processed, the suction force generated by the adsorption unit 211 can adsorb the workpiece 50 on the adsorption surface 21.

[0049] After completing the processing of the workpiece 50, since the vacuum unit 60 extracts the air inside the groove 212, the interior of the groove 212 is in a vacuum state or a negative pressure state. Therefore, when the robot 400 is removing the workpiece 50, the workpiece 50 will continue to be subjected to the suction force of the adsorption surface 21. If the material of the workpiece 50 is relatively soft, when the robot 400 removes the workpiece 50, the workpiece 50 is simultaneously subjected to the suction force of the adsorption surface 21 with opposite effects and the force of the robot 400 to drive the workpiece 50 away from the adsorption surface 21, which may cause the workpiece 50 to be easily damaged.

[0050] See also Figure 3 In order to solve this problem, in some embodiments, the carrying device 100 may further include a plug 70, which is disposed on the side 102, wherein the side 102 is provided with a through hole 71 communicating with the connecting hole 213, and the plug 70 is detachably installed in the through hole 71 and seals the through hole 71. When the air extraction unit 60 extracts the gas in the groove 212 through the plurality of connecting holes 213 to make the inside of the groove 212 in a vacuum state or a negative pressure state, the plug 70 can be removed to allow air to enter the groove 212 through the through hole 71 and the connecting hole 213, thereby restoring the air pressure in the groove 212, so that the adsorption unit 211 no longer generates suction to adsorb the workpiece 50, so that the robot 400 can take away the workpiece 50.

[0051] Please also read Figure 2 and Figure 3 In some embodiments, the carrying device 100 may further include a moving unit 80, and the moving unit 80 is provided with a second surface 103, wherein the body 10 is provided with a transfer hole 105, and the transfer hole 105 is used to connect the body 10 and the moving unit 80. In one embodiment, the transfer hole 105 may be a stepped hole ( Figure 2As shown in the figure, the interior of the adapter hole 105 may be provided with a thread, and the screw may be screwed into the interior of the adapter hole 105 and extend out of the body 10, and the screw head is placed inside the adapter hole 105 to ensure that the surface of the cavity 40 is flat, so as to prevent the screw from contacting the second area 52 of the workpiece 50 when the workpiece 50 is placed on the boss 20. The motion unit 80 may be provided with a corresponding screw hole 81 that cooperates with the screw, and the screw is screwed into the screw hole 81 to achieve the connection between the body 10 and the motion unit 80. When processing the workpiece 50, when the position of the workpiece 50 is not in a processable position, the motion unit 80 can drive the body 10 and the workpiece 50 to move, so as to move the workpiece 50 to a processable position. When the processing angle of the workpiece 50 is not suitable, the body 10 can rotate relative to the motion device 80, thereby driving the workpiece 50 to rotate, so as to rotate the workpiece 50 to a suitable processing angle, thereby completing the processing of the workpiece 50.

[0052] Please also read Figure 1 , Figure 2 and Fig. 9 The embodiment of the present application also provides a semiconductor processing device 1000, which includes a carrier 100 and a processing device 500. The carrier 100 is used to carry a workpiece 50, and the processing device 500 corresponds to the carrier 100 and is used to process the workpiece 50 carried on the carrier 100.

[0053] Among them, the processing device 500 includes but is not limited to grinding, etching, defect removal, cleaning and detection of the workpiece 50. The processing device 500 can be a grinder, an etcher, a cleaning equipment, an optical detector, etc. The embodiment of the present application takes the processing device 500 as an optical detector as an example. It can be understood that the processing device 500 is not limited to an optical detector, and the processing device 500 is not limited to the detection of the workpiece 50.

[0054] When the processing device 500 is an optical detector, the optical detector includes a detector 501, and the detector 501 is used to image the workpiece 50. When the detector 501 images the workpiece 50, if the workpiece 50 is a light-transmitting member, the bottom 41 will reflect or scatter the light, and after passing through the workpiece 50, the light enters the detector 501 and is collected, thereby causing the carrier 100 to interfere with the detection result or measurement result.

[0055] In order to solve this problem, in the carrying device 100 of the embodiment of the present application, the distance between the first surface 101 and the adsorption surface 21 makes the bottom 41 of the cavity 40 outside the depth of field of the detector 501, thereby avoiding the scattered or reflected light generated by the bottom 41 of the cavity 40 from passing through the workpiece 50 and being collected by the detector 501, so as to eliminate the interference of the cavity 40 on the imaging result of the detector 501, thereby improving the accuracy of the processing device 500 in processing the workpiece 50.

[0056] In the semiconductor processing device 1000 of the embodiment of the present application, after the carrier device 100 is placed in the semiconductor processing device 1000, the manipulator 400 places the workpiece 50 on the adsorption surface 21 of the boss 20 through the opening 201. If the center of the workpiece 50 does not coincide with the center of the body 10, the workpiece 50 will be guided to the center of the body 10 through the chamfer 301 of the stopper 30, thereby limiting the center of the workpiece 50 to coincide with the center of the body 10, so that the workpiece 50 can completely cover the groove 212. Before the processing device 500 processes the workpiece 50, the exhaust unit 60 exhausts the inside of the groove 212 through the connecting hole 213, so that the inside of the groove 212 is in a vacuum state or a negative pressure state, thereby ensuring that the adsorption unit 211 can always adsorb the workpiece 50 on the adsorption surface 21. When the processing device 500 processes the workpiece 50, the detector 501 images the workpiece 50. If the position of the workpiece 50 is not within the imaging range of the detector 501, the motion unit 80 can drive the body 10 to move, thereby driving the workpiece 50 to move, so as to move the workpiece 50 to the imaging position of the detector 501. If the imaging angle of the workpiece 50 is not suitable, the body 10 can rotate relative to the motion unit 80 to drive the workpiece 50 to rotate, so as to rotate the workpiece 50 to a suitable imaging angle of the detector 501, thereby completing the imaging of the workpiece 50. When the processing device 500 completes the processing of the workpiece 50, the plug 70 can be removed to allow air to enter the groove 212 through the through hole 71 and the connecting hole 213, thereby restoring the air pressure inside the groove 212, so that the adsorption unit 211 no longer adsorbs the workpiece 50, and the manipulator 400 then penetrates the opening 201 to extend into the cavity 40 to remove the workpiece 50, so as to complete the collection of the workpiece 50.

[0057] In the description of this specification, the descriptions with reference to the terms "certain embodiments", "in an example", "exemplarily", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0058] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0059] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A carrying device, characterized in that: include: A body, the body comprising a first surface and a side surface connected to the first surface; a boss, the boss being arranged at an edge of the first surface and forming a cavity together with the body, the boss comprising an adsorption surface away from the first surface, the adsorption surface being provided with an adsorption unit, the adsorption unit being used to adsorb a first area of ​​the workpiece to the adsorption surface, the cavity corresponding to a second area of ​​the workpiece, and the first area surrounding the second area; and An air extraction unit, wherein the adsorption unit comprises a groove disposed on the first surface and a connecting hole located at the bottom of the groove, the groove is connected to the air extraction unit through the connecting hole, and the air extraction unit is used to evacuate the connecting hole and the groove to adsorb the workpiece on the first surface; A stopper, wherein the number of the stoppers is multiple, and the multiple stoppers are evenly distributed along the side wall of the body, the stopper is arranged on the side and is located on the side of the boss away from the cavity, and the stopper is radially against the workpiece to limit the position of the workpiece; the stopper includes an arc chamfer, and the chamfer is used to guide the center of the workpiece to coincide with the center of the body when the workpiece is placed on the first surface; The boss is annular and has an opening connected to the cavity, and the opening is used for the robot to pick up and place the workpiece; The bearing device further comprises a plug, the side surface is provided with a through hole communicating with the connecting hole, and the plug is detachably installed in the through hole to seal the through hole; The outer diameter of the boss is smaller than the outer diameter of the body, the stopper is partially supported on the first surface, and the surface where the stopper contacts the body is glued and mounted on the body by applying oiled metal glue or high-temperature glue adhesive; The main body is provided with a transfer hole, which is a stepped hole. A thread may be provided inside the transfer hole. A screw may be screwed into the transfer hole and extend out of the main body, and the screw head is placed inside the transfer hole to ensure that the surface of the cavity is flat; the supporting device is also provided with a moving unit, and a screw hole corresponding to the screw is provided on the moving unit. The screw is screwed into the screw hole to realize the connection between the main body and the moving unit.

2. The carrying device according to claim 1, characterized in that: The body further includes a second surface opposite to the first surface, the air extraction unit is arranged on the second surface, and the connecting hole is located between the first surface and the second surface.

3. The carrying device according to claim 1, characterized in that: There are multiple grooves, and the multiple grooves are evenly spaced on the adsorption surface. There are multiple connecting holes, and each groove corresponds to a connecting hole. Each groove is connected to the air extraction unit through the corresponding connecting hole.

4. A semiconductor processing device, characterized in that: include: The carrying device according to any one of claims 1 to 3; and A processing device, the processing device corresponds to the carrying device and is used to process the workpiece carried by the carrying device.

5. The semiconductor processing equipment according to claim 4, characterized in that The processing device comprises an optical detector, the optical detector comprises a detector, the detector is used to image the workpiece, and the distance between the first surface and the adsorption surface makes the bottom of the cavity outside the depth of field of the detector.

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