Handheld electronic devices

Abstract

The present disclosure relates to a handheld electronic device. The present disclosure provides a mobile phone, which includes: a housing structure, which defines a side surface of the mobile phone; a front cover, which is coupled to the housing structure and defines the front surface of the mobile phone; a rear cover, which is coupled to the housing structure and defines the rear surface of the mobile phone; a display positioned below the front cover; a first directional antenna, which defines a first radiation pattern extending through the front surface of the mobile phone; a second directional antenna, which defines a second radiation pattern extending through the rear surface of the mobile phone; and a third directional antenna, which defines a third radiation pattern extending through the side surface of the mobile phone.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a patent application for and claims the benefits of U.S. Patent Application No. 62 / 943,199, entitled “Handheld Electronic Device,” filed on December 3, 2019, U.S. Patent Application No. 62 / 946,920, entitled “Handheld Electronic Device,” filed on December 11, 2019, and U.S. Provisional Patent Application No. 63 / 047,760, entitled “Handheld Electronic Device,” filed on July 2, 2020, and the disclosures of these patent applications are hereby incorporated by reference in their entirety. Technical Field

[0003] The presently disclosed subject matter relates generally to handheld electronic devices, and more particularly to mobile telephones. Background Art

[0004] Modern consumer electronic devices come in many shapes and forms and have many uses and functions. For example, smartphones provide users with various ways to interact with others outside the communication range of the phone. Such devices may include many systems for facilitating such interactions. For example, a smartphone may include a touch-sensitive display for providing graphical output and for accepting touch input, a wireless communication system for connecting to other devices to send and receive voice and data content, a camera for capturing photos and videos, etc. However, there are many technical challenges in integrating these subsystems into a compact and reliable product that can withstand daily use. The systems and techniques described herein can address most of these challenges while providing a device with many different functions. Summary of the invention

[0005] Some exemplary embodiments relate to a mobile phone, the mobile phone including a housing structure defining a side surface of the mobile phone. The mobile phone may also include a front cover coupled to the housing structure and defining the front surface of the mobile phone, and a rear cover coupled to the housing structure and defining the rear surface of the mobile phone. The mobile phone may also include a display positioned below the front cover. The mobile phone may also include: a first directional antenna, the first directional antenna defining a first radiation pattern extending through the front surface of the mobile phone; a second directional antenna, the second directional antenna defining a second radiation pattern extending through the rear surface of the mobile phone; and a third directional antenna, the third directional antenna defining a third radiation pattern extending through the side surface of the mobile phone. The first directional antenna, the second directional antenna, and the third directional antenna may be configured to operate in a frequency band between about 25 GHz and about 39 GHz.

[0006] In some cases, the frequency band is a first frequency band, and the first directional antenna, the second directional antenna, and the third directional antenna define a first antenna group. The mobile phone may also include a second antenna group configured to operate at a second frequency band different from the first frequency band, and a third antenna group configured to operate at a third frequency band different from the first frequency band and the second frequency band. In some specific implementations, the housing structure includes: a first conductive component, the first conductive component defines a first portion of the side surface of the mobile phone; a second conductive component, the second conductive component defines a second portion of the side surface of the mobile phone; and a non-conductive bonding element, the non-conductive bonding element holds the first conductive component and the second conductive component and defines a third portion of the side surface of the mobile phone. The first conductive component defines a first antenna of the second antenna group and a first antenna of the third antenna group. The second antenna group may define a first multiple-input multiple-output antenna array. The third antenna group may define a second multiple-input multiple-output antenna array.

[0007] In some cases, the first radiation pattern extends along a first main transmission direction. The second radiation pattern may extend along a second main transmission direction different from the first main transmission direction. The third radiation pattern may extend along a third main transmission direction different from the first main transmission direction and different from the second main transmission direction. In some cases, the first antenna gain of the first directional antenna is highest along the first main transmission direction, the second antenna gain of the second directional antenna is highest along the second main transmission direction, and the third antenna gain of the third directional antenna is highest along the third main transmission direction. The second main transmission direction may be orthogonal to the first main transmission direction and orthogonal to the third main transmission direction.

[0008] In some embodiments, the first directional antenna includes: a first directional antenna element, the first directional antenna element is configured to operate at a first frequency; and a second directional antenna element, the second directional antenna element is configured to operate at a second frequency different from the first frequency. In some cases, the second directional antenna includes: a third directional antenna element, the third directional antenna element is configured to operate at the first frequency; and a fourth directional antenna element, the fourth directional antenna element is configured to operate at the second frequency.

[0009] Some exemplary embodiments relate to a portable electronic device including a housing structure, a display, a front cover, a rear cover, and an antenna array. The housing structure may define a side wall and an antenna window, the side wall defining at least a portion of a side surface of the portable electronic device, the antenna window being formed in the side wall, and the antenna window may define a first hole extending through the side wall and a second hole extending through the side wall. The display may be at least partially located within the housing structure. The front cover may be coupled to the housing structure and define the front surface of the portable electronic device. The rear cover may be coupled to the housing structure and define the rear surface of the portable electronic device. The antenna array may include: a first directional antenna element, the first directional antenna element being configured to operate at a first frequency and defining a first radiation pattern extending through the first hole; and a second directional antenna element, the second directional antenna element being configured to operate at a second frequency different from the first frequency and defining a second radiation pattern extending through the second hole.

[0010] In some cases, the antenna window further defines a third hole extending through the sidewall and a fourth hole extending through the sidewall. The antenna array may also include: a third directional antenna element configured to operate at the first frequency and define a third radiation pattern extending through the third hole; and a fourth directional antenna element configured to operate at the second frequency and define a fourth radiation pattern extending through the fourth hole. The first hole may define a first waveguide, and the second hole may define a second waveguide. A first non-conductive covering element may be positioned in the first hole, and a second non-conductive covering element may be positioned in the second hole.

[0011] In some cases, the portion of the side surface of the portable electronic device is a first portion of the side surface of the portable electronic device, the side wall defines a recessed area having a bottom surface, and the first hole and the second hole are formed along the bottom surface of the recessed area. In some cases, the portable electronic device also includes a third non-conductive covering element, the third non-conductive covering element is located in the recessed area and defines a second portion of the side surface of the portable electronic device.

[0012] The first non-conductive cover element and the second non-conductive cover element may be adhered to the third non-conductive cover element.The side wall may be formed of a conductive material and is a radiating member of an antenna system.

[0013] Some exemplary embodiments relate to a portable electronic device, the portable electronic device comprising: a housing member, the housing member defining a side surface of the portable electronic device; a front cover, the front cover coupled to the housing member and defining the front surface of the portable electronic device; a rear cover, the rear cover coupled to the housing member and defining the rear surface of the portable electronic device; a display positioned below the front cover; and an antenna array. The antenna array may include a first directional antenna element, the first directional antenna element being configured to operate at a first frequency and defining a first radiation pattern extending through the front cover along a first direction perpendicular to the front surface of the portable electronic device. The antenna array may also include a second directional antenna element, the second directional antenna element being configured to operate at a second frequency different from the first frequency and defining a second radiation pattern extending through the front cover along a second direction perpendicular to the front surface of the portable electronic device.

[0014] In some cases, the antenna array further includes: a third directional antenna element configured to operate at the first frequency and define a third radiation pattern extending through the front cover along a third direction; and a fourth directional antenna element configured to operate at the second frequency and define a fourth radiation pattern extending through the front cover along a fourth direction. The first direction, the second direction, the third direction, and the fourth direction may be parallel to each other.

[0015] In some cases, the antenna array includes a circuit substrate, the first directional antenna element is a first ceramic post conductively coupled to the circuit substrate, and the second directional antenna element is a second ceramic post conductively coupled to the circuit substrate. The antenna array may also include a polymer cover structure at least partially encapsulating the first ceramic post and the second ceramic post. The polymer cover structure may define an air gap between the first ceramic post and the second ceramic post.

[0016] In some implementations, the antenna array further includes: a first set of conductive contacts, the first set of conductive contacts contacting the first ceramic post and being welded to the circuit substrate; a first polymer retaining structure, the first polymer retaining structure fixing the first set of conductive contacts to the first ceramic post; a second set of conductive contacts, the second set of conductive contacts contacting the second ceramic post and being welded to the circuit substrate; and a second polymer retaining structure, the second polymer retaining structure fixing the second set of conductive contacts to the second ceramic post. The polymer cover structure may at least partially encapsulate the first polymer retaining structure and the second polymer retaining structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0018] Figure 1A to Figure 1B An example electronic device is shown;

[0019] Figure 1C to Figure 1D Another exemplary electronic device is shown;

[0020] Figure 2 An exploded view of an exemplary electronic device is shown;

[0021] Figure 3 An exploded view of an exemplary electronic device is shown;

[0022] Figure 4 An exploded view of an exemplary electronic device is shown;

[0023] Figure 5 An exploded view of an exemplary electronic device is shown;

[0024] Fig. 6A A cross-sectional view of a portion of an exemplary electronic device is shown;

[0025] Figures 6B to 6D A cross-sectional view of a portion of an exemplary electronic device is shown;

[0026] Fig. 6E A cross-sectional view of a portion of an exemplary electronic device is shown;

[0027] FIG. 6F to FIG. 6I shows a cross-sectional view of an exemplary front cover of an electronic device;

[0028] Figure 7 A partial view of an exemplary electronic device is shown;

[0029] Fig. 8AAn exemplary antenna arrangement for an exemplary electronic device is shown;

[0030] FIG. 8B to FIG. 8D An exemplary antenna-using housing for an exemplary electronic device is shown;

[0031] FIG. 9A to FIG. 9B An exemplary side-firing antenna window for an electronic device is shown;

[0032] Fig. 10A An exemplary front transmitting antenna for an electronic device is shown;

[0033] Fig. 10B Another exemplary front transmitting antenna for an electronic device is shown;

[0034] Fig. 10C Another exemplary front transmitting antenna for an electronic device is depicted;

[0035] Fig. 10D Shows Fig. 10C A side view of the front transmitting antenna;

[0036] Fig. 10E Shows Fig. 10C A perspective view of the front transmitting antenna;

[0037] Fig.11 An exemplary antenna feed and ground point for an electronic device is shown;

[0038] Fig. 12A A partial view of a housing member for an electronic device is shown;

[0039] Fig. 12B The electronic device includes Fig. 12A A partial cross-sectional view of a housing of a housing member;

[0040] Fig. 12C A partial view of a housing member for an electronic device is shown;

[0041] Fig.12D The electronic device includes Fig. 12C A partial cross-sectional view of a housing of a housing member;

[0042] Fig.12E The electronic device includes Fig. 12A and Fig. 12C A partial cross-sectional view of a housing of a housing member;

[0043] Fig.12F A partial view of an electronic device is shown showing a coupling structure for a housing member;

[0044] Figure 12GA partial view of an electronic device is shown showing another coupling structure for a housing member;

[0045] Fig.12H A partial view of an electronic device is shown showing another coupling structure for a housing member;

[0046] Fig.13A An exploded view of an exemplary cover and display stackup for an electronic device is shown;

[0047] Fig. 13B shows an exploded view of another exemplary cover and display stackup for an electronic device;

[0048] Fig. 13C A partial cross-sectional view of an electronic device is shown;

[0049] Fig.13D Shows Fig. 13C A partial cross-sectional view of a portion of an electronic device;

[0050] Fig.14A An electronic device is shown showing a portion of an exemplary sensor array;

[0051] Fig. 14B An exploded view of a camera portion of an exemplary electronic device is shown;

[0052] FIG. 14C to FIG. 14D A partial cross-sectional view of a depth sensor module of an exemplary electronic device is shown;

[0053] Fig.14E A bracket member for a camera module of an electronic device is shown;

[0054] Fig.14F A partial cross-sectional view of an exemplary electronic device is shown illustrating aspects of a camera trim structure;

[0055] Figure 14G depicts an electronic device having a portion of a frame member attached to a housing;

[0056] Fig.14H A partial cross-sectional view of a camera module of an exemplary electronic device is shown;

[0057] Fig.14I An exploded view of a camera component of an exemplary electronic device is shown;

[0058] Fig.14J A flexible circuit element for conductively coupling components of an exemplary electronic device is shown;

[0059] Fig.15A An exploded view of an exemplary camera of an electronic device is shown;

[0060] Fig. 15B Shows Fig.15A A cross-sectional view of components of a camera;

[0061] Fig.16A illustrates a view of a front flash module of an exemplary electronic device;

[0062] Fig. 16B Shows Fig.16A A partial cross-sectional view of a flash module;

[0063] Fig. 16C shows a partial cross-sectional view of another exemplary flash module;

[0064] Fig.16D shows the process of assembling a flash memory module;

[0065] Fig.17A shows a partial cross-sectional view of an exemplary electronic device;

[0066] FIG. 17B to FIG. 17G A partial cross-sectional view showing a housing member and cover configuration for an electronic device;

[0067] FIG. 17H to FIG. 17I shows a partial cross-sectional view of a cover for an exemplary electronic device;

[0068] Fig.18 shows a partial view of the interior of an exemplary electronic device;

[0069] Fig.19A An exemplary haptic actuator for use in an exemplary electronic device is shown;

[0070] Fig.19B Another exemplary haptic actuator for use in an exemplary electronic device is shown;

[0071] Fig. 20A A partial cutaway view of a speaker portion of an example electronic device is shown;

[0072] Fig. 20B Shows Fig. 20A An exploded view of the electronic equipment;

[0073] Fig. 20C A partial cutaway view of a speaker portion of an example electronic device is shown;

[0074] Fig.20D An exemplary sealing assembly for a speaker of an exemplary electronic device is shown;

[0075] Fig.21A An exemplary component assembly is shown positioned along an upper region of a display;

[0076] Fig. 21BShows Fig.21A A partial exploded view of the component assembly;

[0077] Fig. 21C A partial cross-sectional view of a flood illuminator is shown;

[0078] Fig.21D Another partial cross-sectional view of the flood illuminator is shown;

[0079] Fig.21E An exemplary light-transmitting component for a flood illuminator is shown;

[0080] Fig.21F Another exemplary light-transmitting component for a flood illuminator is shown;

[0081] Figure 21G An ambient light sensor is shown;

[0082] Fig.21H Shows Figure 21G An exploded view of the ambient light sensor;

[0083] Fig.21I Another exemplary ambient light sensor is shown;

[0084] FIG. 22A to FIG. 22C An exemplary battery for an electronic device is shown;

[0085] FIG. 22D to FIG. 22E shows a partial cross-sectional view of an exemplary battery;

[0086] Fig.23A An exemplary logic board for an electronic device is shown;

[0087] Fig. 23B Shows Fig.23A An exploded view of the logic board;

[0088] Fig.23C Shows Fig.23A Rear view of the logic board;

[0089] Fig.23D Shows Fig.23A A partial cross-sectional view of a portion of a logic board;

[0090] Fig.23E Shows Fig.23A A partial cross-sectional view of another portion of the logic board;

[0091] Fig.23F Shows Fig.23A A partial cross-sectional view of another portion of the logic board;

[0092] FIG. 24A to FIG. 24CAn exploded view showing an exemplary multi-layer configuration of electronic components of an electronic device; and

[0093] Fig.25 A schematic diagram illustrating an exemplary electronic device is shown. DETAILED DESCRIPTION

[0094] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0095] A mobile phone as described herein may include complex and sophisticated components and systems that facilitate a variety of functions. For example, a mobile phone according to the present disclosure may include a touch-sensitive display and / or a force-sensitive display, multiple cameras (including both forward-facing and rear-facing cameras), a GPS system, a tactile actuator, a wireless charging system, and all necessary computing components and software for operating these (and other) systems and otherwise providing the functionality of the mobile phone.

[0096] Figure 1A An exemplary electronic device 100 is shown embodied as a mobile phone. Although device 100 is a mobile phone, the concepts presented herein may be applicable to any suitable electronic device, including a portable electronic device, a wearable device (e.g., a watch), a laptop computer, a handheld gaming device, a tablet computer, a computing peripheral device (e.g., a mouse, a trackpad, a keyboard), or any other device. Thus, any reference to an "electronic device" encompasses any and all of the foregoing.

[0097] The electronic device 100 includes a cover 102 (e.g., a front cover) such as glass, glass ceramic, ceramic, plastic, sapphire, or other substantially transparent material, component, or assembly attached to a housing 104 (which may include a housing structure defined by one or more housing members). The cover 102 may be positioned above the display 103. The cover 102 may be formed of glass (e.g., chemically strengthened glass), sapphire, ceramic, glass ceramic, plastic, or another suitable material. The cover 102 may be formed as a single piece or integral sheet. The cover 102 may also be formed as a composite of multiple layers of different materials, coatings, and other elements.

[0098] Display 103 may be at least partially positioned within the interior volume of housing 104. Display 103 may be coupled to cover 102, such as via an adhesive or other coupling scheme. Display 103 may include a liquid crystal display (LCD), a light emitting diode, an organic light emitting diode (OLED) display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. Display 103 may be configured to display graphical output, such as a graphical user interface that a user can view and interact with. Device 100 may also include an ambient light sensor that may determine properties of ambient light conditions surrounding device 100. Device 100 may use information from the ambient light sensor to change, modify, adjust, or otherwise control display 103 (e.g., by changing the hue, brightness, saturation, or other optical aspects of the display based on information from the ambient light sensor).

[0099] Display 103 may include or be associated with one or more touch sensing systems and / or force sensing systems. In some cases, components of the touch sensing system and / or force sensing system are integrated with the display stack. For example, the electrode layers of the touch sensor and / or force sensor may be provided in the form of a stack that includes display components (and is optionally attached to or at least visible through the cover 102). The touch sensing system and / or force sensing system may use any suitable type of sensing technology, including capacitive sensors, resistive sensors, surface acoustic wave sensors, piezoelectric sensors, strain gauges, etc. The exterior or external surface of the cover 102 may define an input surface of the device (e.g., a touch-sensitive input surface and / or a force-sensitive input surface). Although both a touch sensing system and a force sensing system may be included, in some cases, the device 100 includes a touch sensing system and does not include a force sensing system.

[0100] Device 100 may also include a forward-pointing camera 106. Forward-pointing camera 106 may be positioned below cover 102 or otherwise covered and / or protected by the cover. Forward-pointing camera 106 may have any suitable operating parameters. For example, forward-pointing camera 106 may include a 12 megapixel sensor (with a pixel size of 1 micron) and a field of view of 80° to 90°. Forward-pointing camera 106 may have a fixed focal length optical element with an aperture number of f / 2.2. Other types of cameras may also be used for forward-pointing camera 106.

[0101] Device 100 may also include one or more buttons (e.g., buttons 116, 120), switches (e.g., switch 118), and / or other physical input systems. Such input systems may be used to control power state (e.g., button 120), change speaker volume (e.g., button 116), switch between "ring" mode and "silent" mode, etc. (e.g., switch 118).

[0102] Device 100 may also include speaker port 110 to provide audio output to a user (e.g., to the user's ear) during a voice call. In the context of a mobile phone, speaker port 110 may also be referred to as an earpiece. Device 100 may also include charging port 112 (e.g., for receiving a power cable for providing power to device 100 and charging a battery of device 100). Device 100 may also include audio opening 114. Audio opening 114 may allow for audio to be output from an internal speaker system (e.g., Figure 2 The sound output by the speaker system 224 of the housing 104 can leave the housing 104. The device 100 can also include one or more microphones. In some cases, the microphones within the housing 104 can be acoustically coupled to the surrounding environment through the audio opening 114.

[0103] The housing 104 may be a multi-piece housing. For example, the housing 104 may be formed of a plurality of housing members 124, 125, 126, 127, 128, and 130 that are structurally coupled together via one or more joint structures 122 (e.g., 122-1 to 122-6). The housing members 124, 125, 126, 127, 128, and 130 together with the joint structure 122 may define a band-like housing structure that defines four side walls (and thus four exterior side surfaces) of the device 100. Thus, both the housing members and the joint structures define portions of the exterior side surfaces of the device 100.

[0104] Shell members 124, 125, 126, 127, 128 and 130 may be formed of conductive materials (e.g., metals such as aluminum, stainless steel, etc.), and joint structure 122 may be formed of one or more polymer materials (e.g., glass reinforced polymer). Joint structure 122 may include two or more molded elements that may be formed of different materials. For example, an inner molded element may be formed of a first material (e.g., a polymer material), and an outer molded element may be formed of a second material that is different from the first material (e.g., a different polymer material). These materials may have different properties, which may be selected based on different functions of the inner molded element and the outer molded element. For example, an inner molded element may be configured to form a main structural connection between shell members, and may have higher mechanical strength and / or toughness than an outer molded element. On the other hand, an outer molded element may be configured to have a specific appearance, surface finish, chemical resistance, waterproof function, etc., and its composition may be selected to give priority to those functions over mechanical strength.

[0105] In some cases, one or more of housing members 124, 125, 126, 127, 128, and 130 (or portions thereof) are configured to operate as antennas (e.g., members configured to transmit and / or receive electromagnetic waves to facilitate wireless communications with other computers and / or devices). To facilitate use of the housing members as antennas, feed and ground wires may be conductively coupled to the housing members to couple the housing members to other antennas and / or communications circuits. Fig.11 Exemplary antenna feed lines and ground lines for an exemplary device are shown. In addition, the connector structure 122 can be substantially non-conductive to provide suitable separation and / or electrical isolation between the housing components (which can be used to tune the radiating portion, reduce capacitive coupling between the radiating portion and other structures, etc.). In addition to the housing components 124, 125, 126, 127, 128, and 130, the device 100 can also include various internal antenna elements configured to transmit and receive wireless communication signals through various areas of the housing 104. Figure 1A As shown, device 100 may include an antenna window 129 that allows radio frequency communication signals to be transmitted through a corresponding area of ​​housing 104 .

[0106] The joint structure 122 can mechanically interlock with the shell components to structurally couple the shell components and form a structural shell assembly. Further details regarding the joint structure 122 and its mechanical integration with the shell components are provided herein.

[0107] The exterior surfaces of the shell members 124, 125, 126, 127, 128, and 130 may have substantially the same color, surface texture, and overall appearance as the exterior surface of the joint structure 122. In some cases, the exterior surfaces of the shell members 124, 125, 126, 127, 128, and 130 and the exterior surface of the joint structure 122 are subjected to at least one common finishing process, such as abrasive blasting, machining, polishing, grinding, etc. Thus, the exterior surfaces of the shell members and the joint structure may have the same or similar surface finish (e.g., surface texture, roughness, pattern, etc.). In some cases, the exterior surfaces of the shell members and the joint structure may be subjected to a two-stage blasting method to produce a target surface finish.

[0108] Figure 1BThe back side of the device 100 is shown. The device 100 may include a back cover or rear cover 132 coupled to the housing 104 and defining at least a portion of the outer rear surface of the device 100. The rear cover 132 may include a substrate formed of glass, but other suitable materials (e.g., plastic, sapphire, ceramic, glass ceramic, etc.) may be used alternatively. The rear cover 132 may include one or more decorative layers on the outer surface or inner surface of the substrate. For example, one or more opaque layers may be applied to the inner surface of the substrate (or otherwise positioned along the inner surface of the substrate) to provide a specific appearance to the back side of the device 100. The opaque layer may include a sheet, ink, dye, or a combination of these (or other) layers, materials, etc. In some cases, the opaque layer has a color that substantially matches the color of the housing 104 (e.g., the outer surface of the housing member and the joint structure). The device 100 may include a wireless charging system, whereby the device 100 may be powered and / or its battery recharged by inductive (or other electromagnetic) coupling between the charger and the wireless charging system within the device 100. In such cases, the rear cover 132 may be formed of a material (e.g., glass) that allows and / or facilitates wireless coupling between the charger and the wireless charging system.

[0109] The device 100 may also include a sensor array 134, which may include various types of sensors, including one or more rear-facing cameras, depth sensing devices, flashes, microphones, etc. The sensor array 134 may be at least partially defined by a protrusion 137 extending from the rear of the device 100. The protrusion 137 may define a portion of the rear outer surface of the device 100. In some cases, the protrusion 137 may be formed by attaching a material piece (e.g., glass) to another material piece (e.g., glass). In other cases, the rear cover 132 may include a monolithic structure, and the protrusion 137 may be part of the monolithic structure. For example, the rear cover 132 may include a monolithic glass structure (or glass-ceramic structure) defining the protrusion 137 and the surrounding area. In such cases, the protrusion 137 may be an area of ​​increased thickness of the monolithic structure, or it may be molded into a monolithic structure with substantially uniform thickness (e.g., and may correspond to a recessed area along the inner side of the monolithic structure).

[0110] The device may also include one or more rear-facing devices 138 as part of a sensor array, which may include an ambient light sensor (ALS), a microphone, and / or a depth sensing device configured to estimate the distance between the device 100 and a separate object or target. The sensor array 134 may include a camera having a 12 megapixel sensor and a variable focus lens with an aperture number of f / 1.6. The sensor array 134 may also include a plurality of cameras including: a wide-angle camera having a 12 megapixel sensor and an aperture number of f / 1.6; an ultra-wide-angle camera having a 12 megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an aperture number of f / 2.4; and a telephoto lens having a 12 megapixel sensor and a 2x optical zoom optical stack with an aperture number in the range of f / 2.0 to f / 2.2. One or more of the cameras of sensor array 134 may also include optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within device 100 to reduce the effects of "camera shake" on images captured by the camera. The camera may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly.

[0111] The sensor array 134, along with associated processors and software, may provide a number of image capture features. For example, the sensor array 134 may be configured to capture a full-resolution video clip of a particular duration each time a user captures a still image. As used herein, capturing a full-resolution image (e.g., a video image or a still image) may refer to capturing an image using all or substantially all of the pixels of an image sensor, or otherwise capturing an image using the maximum resolution of the camera (whether the maximum resolution is limited by hardware or software).

[0112] The captured video clip may be associated with a still image. In some cases, the user may be able to select individual frames from the video clip as representative still images associated with the video clip. Thus, when the user takes a snapshot of a scene, the camera will actually record a short video clip (e.g., 1 second, 2 seconds, etc.), and the user can select a precise frame from the video to use as the captured still image (in addition to simply viewing the video clip as a video).

[0113] The sensor array 134 may also include one or more cameras with a high dynamic range (HDR) mode in which the camera captures an image with a dynamic brightness range that is greater than the brightness range captured when the camera is not in HDR mode. In some cases, the sensor array 134 automatically determines whether to capture an image in HDR mode or non-HDR mode. Such a determination may be based on various factors, such as the ambient light of the scene, the detected brightness range, hue, or other optical parameters in the scene, etc. An HDR image may be generated by capturing multiple images, each using a different exposure or other image capture parameter, and generating a composite image from the multiple captured images.

[0114] Sensor array 134 may also include or be configured to operate in an object detection mode in which a user may select (and / or device 100 may automatically identify) objects within a scene to facilitate processing, displaying, or capturing those objects differently than other portions of the scene. For example, a user may select (or device 100 may automatically identify) a person's face in a scene, and device 100 may focus on the person's face while selectively blurring portions of the scene other than the person's face. Notably, features such as HDR mode and object detection mode may be provided with a single camera (e.g., a single lens and sensor).

[0115] The sensor array may include a flash 136 configured to illuminate a scene to facilitate capturing an image with the sensor array 134. The flash 136 may include one or more light sources, such as one or more light emitting diodes (e.g., 1, 2, 3, 4, or more LEDs). In conjunction with the sensor array 134 or other systems of the device 100, the flash 136 may adjust the color temperature of the light emitted by the light source to match or otherwise adapt to the color temperature within the scene being captured. The device 100 may also be configured to operate the flash 136 and shutter of the sensor array 134 to avoid the consequences of flash "blinking". For example, the device 100 may avoid capturing exposures during moments when the flash 136 is in no illumination or low illumination (e.g., which may be caused by discontinuous or pulsed operation of the LEDs).

[0116] Figure 1C and Figure 1D Another exemplary electronic device 140 embodied as a mobile phone is shown. The electronic device 140 may have many of the same or similar external components as the electronic device 100. Thus, Figure 1A and Figure 1B The descriptions and details of such components (e.g., displays, buttons, switches, housings, covers, charging ports, connector structures, etc.) also apply to Figure 1C and Figure 1D Corresponding parts shown.

[0117] Although Figure 1B The device 100 in FIG. 1 is shown as including a sensor array 134 having two cameras, but as shown in FIG. Figure 1D The device 140 shown includes a sensor array 141, which includes three cameras (e.g., Figure 3 and Figure 5 140). The sensor array 141 may be located in a sensor array area defined by a protrusion 151 in the rear cover of the device 140. The protrusion 151 may have a Figure 1B The protrusion 137 in is of the same or similar construction.

[0118] The sensor array 141 may also include a depth sensing device 149 configured to estimate the distance between the device and a separate object or target. For example, the first camera 142 may include a 12-megapixel sensor and a telephoto lens with a 2x or 2.5x optical zoom and an f / 2.0 aperture number; the second camera 144 may include a 12-megapixel sensor and a wide-angle lens with an f / 1.6 aperture number; and the third camera 146 may include a 12-megapixel sensor and an ultra-wide-angle camera with a wide field of view (e.g., 120° FOV) and an f / 2.4 aperture number. The depth sensing device 149 may use lasers and time-of-flight calculations or use other types of depth sensing components or technologies to estimate the distance between the device and a separate object or target. One or more of the cameras of the sensor array 141 may also include optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within the device 100 to reduce the effects of "camera shake" on the images captured by the camera. The camera may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly.

[0119] Device 140 may also include a flash 148 configured to illuminate a scene to facilitate capturing an image with a camera of sensor array 141. Flash 148 is configured to illuminate a scene to facilitate capturing an image with sensor array 141. Flash 148 may include one or more light sources, such as one or more light emitting diodes (e.g., 1, 2, 3, 4, or more LEDs).

[0120] Sensor array 141 may also include microphone 150. Microphone 150 may be acoustically coupled to the external environment through a hole defined in the rear cover of device 140 (eg, through a portion of the rear cover defining protrusion 151).

[0121] Other details regarding the sensor array, individual cameras of the sensor array, and / or flash described with respect to device 100 may apply to the sensor array, individual cameras, and / or flash of device 140, and such details will not be repeated here to avoid redundancy.

[0122] Figure 2 An exploded view of an exemplary electronic device is shown. Specifically, Figure 2 An exploded view of the device 200 is shown, illustrating various components of the device 200 and exemplary arrangements and configurations of these components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 2 The device 200 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0123] like Figure 2 As shown, the device 200 includes a cover 202 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 202 may be formed of a glass or glass-ceramic material. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 202. In some cases, the cover 202 may include a sheet of chemically strengthened glass or glass-ceramic having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings or optical treatment coatings. In some cases, the cover 202 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 202 to form a compressive stress layer along the outer surface of the cover 202.

[0124] The cover 202 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 210. As described in more detail below, the edges or sides of the cover 202 can be surrounded by a protective flange or lip of the housing 210 without a gap component between the edge of the cover 202 and the corresponding flange of the housing 210. This configuration can allow impacts or forces applied to the housing 210 to be transferred to the cover 202 without causing shear stresses to be directly transferred through the display 203 or the frame 204.

[0125] like Figure 2As shown, the display 203 is attached to the inner surface of the cover 202. The display 203 may include a borderless organic light emitting diode (OLED) display that measures 13.7 cm (5.4 inches) corner to corner. The perimeter or inactive area of ​​the display 203 may be reduced to allow a very thin device border around the active area of ​​the display 203. In some cases, the display 203 allows a border area of ​​1.5 mm or thinner. In some cases, the display 203 allows a border area of ​​1 mm or thinner. In an exemplary implementation, the border area is about 0.9 mm. The display 203 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, the display 203 has a pixel density of about 475 PPI. The display 203 may have an integrated (on-cell) touch sensing system. For example, the electrode array integrated into the OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. The electrodes may be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the exterior surface of cover 202. In some cases, display 203 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, device 200 may include one or more touch and / or force sensing layers positioned between display 203 and cover 202.

[0126] The display 203 (also referred to as the display stack) may include an always-on display (AOD) function. For example, the display 203 may be configured to allow a subset of a specified area or pixels to be displayed when the device 200 is powered on, so that the graphical content is visible to the user even when the device 200 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications, and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always-on graphical output. Although some battery power may be consumed when displaying a persistent or always-on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 203. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution to reduce the power consumption of the display 203.

[0127] like Figure 2As shown, the device 200 may also include a frame member 204 (also referred to simply as frame 204), which is positioned below the cover 202 and extends around the outer periphery of the display 203. The periphery of the frame 204 may be attached to the lower surface or inner surface of the cover 202. A portion of the frame 204 may extend below the display 203 and may attach the cover 202 to the housing 210. Because the display 203 is attached to the lower surface or inner surface of the cover 202, the frame 204 may also be described as attaching both the display 203 and the cover 202 to the housing 210. The frame 204 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 204 may support elements of the display stack, provide anchor points for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 204 includes one or more metallic or conductive elements that provide shielding between device components, such as between a display stack (including a display component and a touch sensor component) and other components such as a tactile actuator 222, a speaker system 224, etc.

[0128] The cover 202, display stack 203, and frame member 204 can be part of the top module 201 of the device 200. The top module 201 can be assembled as a subassembly, which can then be attached to the housing member. For example, as described herein, the display 203 can be attached to the cover 202 (e.g., via a transparent adhesive), and the frame member 204 can be attached to the cover around the perimeter of the display stack 203 (e.g., via an adhesive). The top module 201 can then be attached to the housing member of the device 200 by mounting and adhering the frame member 204 to the boss defined by the housing member.

[0129] like Figure 2 As shown, the device 200 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 200 includes a front camera 206, which includes a high-resolution camera sensor. The front camera 206 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The device 200 also includes a facial recognition sensor 252, which can be used to detect or capture a unique feature or biometric identifier (e.g., by projecting a pattern of dots onto the user's face and capturing an image of the user's face with the projected dots), which can be used to identify the user and unlock the device 200 or authorize functions on the device 200, such as purchasing software applications or using payment functions provided by the device 200.

[0130] The device may also include one or more other sensors or elements integrated into the forward sensor array 250. For example, the forward sensor array 250 may include a front light illuminator element for providing a flash or illumination to the front camera 206. The forward sensor array 250 may also include an ambient light sensor (ALS) for detecting ambient light conditions to set the exposure aspects of the front camera 206. The forward sensor array 250 may also include an antenna array configured to transmit and receive wireless communications along the front surface of the device 200. The antenna array may include antenna elements configured to conduct 5G wireless protocols, which may include millimeter wave and / or 6GHz communication signals. The antenna array may include multiple antenna elements and may be configured to use beamforming and other similar technologies to facilitate 5G wireless communications. As used herein, an antenna element may refer to a component configured (e.g., tuned) to resonate at a specific frequency or frequency band. The antenna element may be formed of any suitable component or material, such as a conductor (e.g., a wire, a metal trace, a metal housing segment), a ceramic, etc.

[0131] Figure 2 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 2 As shown, these elements can be part of the sensor array 260. In this example, the sensor array 260 includes a first camera 261 having a 12 megapixel image sensor and a wide-angle lens with an aperture number of f / 1.6. The first camera 261 also includes a dual photodiode sensor with an APS+ sensor format. The sensor array 260 also includes a second camera 262 having a 12 megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture number of f / 2.4. The sensor array 260 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. The sensor array 260 is also characterized by an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, the sensor array 260 also includes a microphone, an ambient light sensor, and other sensors suitable for sensing along the rear surface of the device 200.

[0132] like Figure 2As shown, cameras 261 and 262 can be aligned with camera covers 263 and 264, respectively. Covers 263, 264 can be formed of glass, glass ceramic, or sapphire materials and can provide transparent windows through which cameras 261, 262 can capture photographic images. In other cases, covers 263, 264 are optical lenses that filter, amplify, or otherwise condition the light received by the respective cameras 261, 262. Other sensing or transmitting elements of sensor array 260 can transmit and / or receive signals through areas of rear cover 272 or through separate covers coupled to rear cover 272. As shown in FIG. Figure 2 As shown, covers 263, 264 may extend beyond the outer surface of cover 272, and may define recesses along the inner side of cover 272 so that lenses or other elements of cameras 261 and 262 may extend into the corresponding recesses. In this way, device 200 may accommodate larger lenses or other elements of cameras 261 and 262 than would be possible without providing recesses.

[0133] The device 200 also includes a battery 230. The battery 230 provides power to the device 200 and its various systems and components. The battery 230 may include a 4.45V lithium-ion battery encapsulated in a foil or other encapsulating element (e.g., a soft pack). The battery 230 may be attached to the device 200 (e.g., to the base 219) using one or more adhesives and / or other attachment techniques. In one example, the battery 230 may be attached to the base 219 or another structure of the device 200 using two layers of adhesive, wherein the first adhesive adheres to the battery 230 and the second adhesive, and the second adhesive adheres to the first adhesive and the base 219 (or other structures of the device 200). The first adhesive and the second adhesive may have different properties, such as different stiffness (e.g., Young's modulus), different adhesive properties, etc. For example, in some cases, the first adhesive is configured to adhere to the material of the battery 230 (e.g., with an adhesive strength greater than a threshold), and the second adhesive is configured to adhere to the base 219 or other structure of the device (e.g., with an adhesive strength greater than a threshold). In such cases, the first adhesive may not form a sufficiently strong bond with the base 219, and the second adhesive may not form a sufficiently strong bond with the battery 230, but the first adhesive and the second adhesive may form a sufficiently strong bond with each other. Thus, by using two different adhesives (e.g., in the described layered configuration) to ultimately secure the battery 230 to the base 219, the overall strength and / or security of the attachment may be greater than when a single adhesive is used.

[0134] Battery 230 may be recharged via charging port 232 (e.g., via a power cable plugged into charging port 232) and / or via wireless charging system 240. Battery 230 may be coupled to charging port 232 and / or wireless charging system 240 via battery control circuitry that controls power provided to the battery and power provided by the battery to device 200. Battery 230 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0135] The charging system 240 may include a coil inductively coupled to an output coil or a transmitting coil of the wireless charger. The coil may provide current to the device 200 to charge the battery 230 and / or power the device. In this example, the charging system 240 includes a coil assembly 242, which includes a plurality of turns of a wound conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 242 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help to position the device 200 relative to the separate wireless charging device or other accessory. In some embodiments, the magnet array also helps to radially position, orient, or "rotate" the device 200 relative to the separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to a separate charging device in a specific orientation or a set of discrete orientations to help position the device 200 relative to the separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 2 As shown, the device 200 also includes a magnetic reference 244 for helping to position a separate wireless charging device or accessory. In one example, the magnetic reference 244 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 200 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. In addition, by magnetically coupling the cable or power cord to the rear surface of the device 200, the charging device or other accessory can be more securely coupled to the device 200.

[0136] The device 200 may also include a speaker system 224. The speaker system 224 may be positioned in the device 200 so that a corresponding speaker port 225 is aligned with or otherwise close to the audio output of the speaker system 224. Thus, the sound output by the speaker system 224 leaves the housing 210 via the corresponding speaker port 225. The speaker system 224 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 224 may include a left speaker and a right speaker aligned with a left speaker port and a right speaker port 225, respectively, to produce stereo sound.

[0137] The device 200 may also include a tactile actuator 222. The tactile actuator 222 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the tactile actuator 222 may have a profile or housing shape that facilitates physical integration with the battery 230 and other components of the device 200 so as to minimize space and / or maximize the size of the battery.

[0138] When the coil is energized, the coil can cause the mass to move, which causes a force to be applied to the device 200. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an outer surface of the device 200. The tactile actuator 222 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 222, other types of tactile actuators can be used.

[0139] The device 200 also includes a logic board 220 (also referred to herein as a circuit board assembly). The logic board 220 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 220 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 220 may include a device for a subscriber identity module (SIM). The logic board 220 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 220 may include a device for an electronic SIM. The logic board 220 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0140] The logic board 220 may also include a liquid detection circuit 227 positioned adjacent to the charging opening 226 or other opening in the housing 210. The liquid detection circuit 227 may include a resistive sensor or a conductive sensor configured to electrically detect moisture above a given threshold and transmit a signal to a processor to record an event of exposure to liquid. The liquid detection circuit 227 may also include a visual element that changes color or provides some other visual marker when exposed to moisture above a certain threshold. In some cases, the liquid detection circuit 227 is positioned within a sealed interior volume of a waterproof or water-resistant device and is configured to detect liquid that enters due to mechanical destruction of the housing 210 or physical damage to the device 200.

[0141] The logic board 220 may also include wireless communication circuitry that may be coupled to the housing members 211, 212, 213, 214, 215, or 216 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members to provide wireless communication. The logic board 220 may also include components such as an accelerometer, a gyroscope, a near field communication circuit and / or an antenna, a compass, etc.

[0142] Housing 210 may also include a base 219 that may be attached to housing 210. Base 219 may be formed of metal and may serve as a structural mounting point for components of device 200. Base 219 may define an opening corresponding to the size of coil assembly 242 of wireless charging system 240 such that base 219 does not shield wireless coil assembly 242 or otherwise adversely affect inductive coupling between the coil of charging system 240 and an external wireless charger or accessory.

[0143] like Figure 2 As shown, the housing may include a cover 272 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 200. The cover 272 may be formed of a glass (or glass-ceramic) substrate having a portion having a thickness of less than 1 mm. In some cases, the sheet substrate has a portion less than 0.80 mm. In some cases, the glass substrate has a portion of approximately 0.60 mm or thinner. The cover 272 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera cover 263, 264. The cover 272 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a rough appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 272 to provide the desired optical effect and final color for the device 200.

[0144] Similar to that described above with respect to cover 202, cover 272 can be at least partially positioned within an opening defined in housing 210. Also similar to that described above with respect to cover 202, the edges or sides of cover 272 can be surrounded by a protective flange or lip of housing 210 without intervening features between the edges of cover 272 and the corresponding flanges of housing 210. Cover 272 is typically chemically strengthened using an ion exchange process to form a compressive stress layer along the exterior surface of cover 272.

[0145] As described above, housing 210 may include housing components 211 , 212 , 213 , 214 , 215 , and 216 that are structurally joined together via joint structure 218 . Figure 2 218 can extend above the inner surface of the shell member. More specifically, a portion of the joint structure 218 can contact, cover, enclose, and / or engage with a retention feature of the shell member extending from the inner surface of the shell member.

[0146] The housing members 211, 212, 213, 214, 215 and 216 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 211, 212, 213, 214, 215 and 216 may provide a sturdy and impact-resistant sidewall for the device 200. In this example, the housing members 211, 212, 213, 214, 215 and 216 define a flat sidewall extending around the periphery of the device 200. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 210. The housing members 211, 212, 213, 214, 215 and 216 may each have a flange portion or lip extending around the respective sides of the front cover 202 and the rear cover 272 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 202 and the rear cover 272. This can allow forces or impacts applied to the housing 210 to be transferred to the front cover 202 and the rear cover 272 without affecting the display or other internal structural elements, which can improve the drop performance of the device 200.

[0147] like Figure 2As shown, the device 200 includes multiple antennas that can be adapted to wirelessly communicate using a 5G communication protocol. Specifically, the device 200 may include a (front transmitting) antenna array 286, which is positioned near the earpiece of the device 200 and is configured to transmit and receive wireless communication signals through the cover 202. The device 200 may also include a (side transmitting) antenna array 282, which is configured to transmit and receive wireless communication signals through an antenna window 283 or waveguide formed along the side wall of the housing 210 or otherwise integrated with the side wall. The side transmitting antenna array 282 can be coupled to the logic board 220 via a flexible circuit element or other conductive connection, as described herein. The device 200 may also include a (rear transmitting) antenna array 284, which can be configured to transmit and receive wireless communication signals through the cover 272. The antenna array 284 can be attached to the back surface or bottom surface of the logic board 220. Each of antenna arrays 282, 284, 286 may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 200 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing members 211, 212, 213, 214, 215, and 216 may be adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0148] Figure 3 An exploded view of an exemplary electronic device is shown. Specifically, Figure 3 An exploded view of device 300 is shown, illustrating various components of device 300 and exemplary arrangements and configurations of those components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 3 The device 300 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0149] like Figure 3As shown, the device 300 includes a cover 302 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 302 may be formed of glass or glass-ceramic materials. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 302. In some cases, the cover 302 may include a sheet of chemically strengthened material having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings or optical treatment coatings. In some cases, the cover 302 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 302 to form a compressive stress layer along the outer surface of the cover 302.

[0150] The cover 302 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 310. As described in more detail below, the edges or sides of the cover 302 can be surrounded by a protective flange or lip of the housing 310 without a gap component between the edge of the cover 302 and the corresponding flange of the housing 310. This configuration can allow impacts or forces applied to the housing 310 to be transferred to the cover 302 without directly transferring shear stresses through the display 303 or the frame 304.

[0151] like Figure 3 As shown, the display 303 is coupled to the inner surface of the cover 302. In this example, the display stack includes a display 303 (also referred to as a display element) and a touch sensing layer 305 positioned between the display 303 and the cover 302. The display 303 may include a frameless organic light emitting diode (OLED) display that measures 15.4 cm (6.1 inches) from corner to corner. The perimeter or non-active area of ​​the display 303 may be reduced to allow a very thin device border to exist around the active area of ​​the display 303. In some cases, the display 303 allows a border area of ​​1.5 mm or less. In some cases, the display 303 allows a border area of ​​1 mm or less. In an exemplary implementation, the border area is about 0.9 mm. The display 303 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, the display 303 has a pixel density of about 460 PPI.

[0152] like Figure 3As shown, the display stack includes both a display (element) 303 and a separate touch sensing layer 305, and includes a capacitive electrode array that is configured to sense the presence and location of one or more touches along the outer surface of the cover 302. The electrodes of the touch sensing layer 305 can be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the outer surface of the cover 302. In some cases, the touch sensing layer 305 is coupled to or has an integrated flexible circuit that extends from one or more of the long sides of the touch sensing layer 305, which can reduce the border around the display 303. Figure 2 As with the previous examples described, display 303 may have an integrated (on-cell) touch sensing system. For example, an electrode array integrated into an OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functionality. In some cases, display 303 includes another type of display element, such as a liquid crystal display (LCD).

[0153] The display 303 may include an always on display (AOD) function. For example, the display 303 may be configured to allow a subset of a specified area or pixels to be displayed when the device 300 is powered on, so that the graphical content is visible to the user even when the device 300 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always on graphical output. Although some battery power may be consumed when displaying a persistent or always on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 303. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution to reduce the power consumption of the display 303.

[0154] like Figure 3As shown, the device 300 may also include a frame 304, which is positioned below the cover 302 and extends around the outer periphery of the display 303. The periphery of the frame 304 may be attached to the lower surface or inner surface of the cover 302. A portion of the frame 304 may extend below the display 303 and may attach the cover 302 to the housing 310. Because the display 303 is attached to the lower surface or inner surface of the cover 302, the frame 304 may also be described as attaching both the display 303 and the cover 302 to the housing 310. The frame 304 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 304 may support elements of the display stack, provide an anchor point for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 304 includes one or more metal or conductive elements that provide shielding between device components, such as providing shielding between the display stack (including the display component and the touch sensor component) and other components such as the tactile actuator 322, the speaker system 324, etc.

[0155] The cover 302, touch sensing layer 305, display 303, and frame member 304 can be part of a top module 301 of the device 300. The top module 301 can be assembled as a subassembly, which can then be attached to the housing member. For example, as described herein, the display 303 and the touch sensing layer 305 can be attached to the cover 302 (e.g., via a transparent adhesive), and the frame member 304 can be attached to the cover around the perimeter of the display 303 (e.g., via an adhesive). The top module 301 can then be attached to the housing member of the device 300 by mounting and adhering the frame member 304 to the bosses defined by the housing member.

[0156] like Figure 3 As shown, the device 300 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 300 includes a front camera 306, which includes a high-resolution camera sensor. The front camera 306 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The front camera 306 may have an aperture number of f / 2.2. The device 300 also includes a facial recognition sensor 352, which includes a depth sensor, which includes an infrared light projector and an infrared light sensor, which is configured to sense a depth point array or area along the user's face. The depth point array can be characterized as a unique feature or biometric identifier, which can be used to identify the user and unlock the device 300 or authorize functions on the device 300, such as purchasing software applications or using payment functions provided by the device 300.

[0157] The device may also include one or more other sensors or elements integrated into the forward sensor array 350. For example, the forward sensor array 350 may include a front light illuminator element for providing a flash or illumination for the front camera 306. The forward sensor array 350 may also include an ambient light sensor (ALS) for detecting ambient light conditions to set exposure aspects of the front camera 306. The forward sensor array 350 may also include an antenna array configured to transmit and receive wireless communications along the front surface of the device 300. The antenna array may include elements configured to conduct 5G wireless protocols, which may include millimeter wave and / or 6 GHz communication signals. The antenna array may include multiple antenna elements and may be configured to use or be used with beamforming and other similar technologies to facilitate 5G wireless communications.

[0158] Figure 3 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 3 As shown, these elements may be integrated into the sensor array 360. In this example, the sensor array 360 includes a first camera 361 having a 12-megapixel image sensor and a wide-angle lens with an aperture of f / 1.6. The first camera 361 also includes a dual photodiode sensor with an APS+ sensor format. The sensor array 360 also includes a second camera 362 having a 12-megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture of f / 2.4. The sensor array 360 may also include a third camera 363 having a 12-megapixel image sensor and a telephoto optical lens assembly that achieves 2x optical zoom. The third camera 363 may also have an aperture of f / 2.0.

[0159] Sensor array 360 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. Sensor array 360 also features an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, sensor array 360 also includes microphones, ambient light sensors, and other sensors suitable for sensing along the back surface of device 300.

[0160] The sensor array 360 may also include a depth sensor 365 that is capable of estimating the distance to an object positioned behind the device 300. The depth sensor module 365 may include an optical sensor 214 that uses time of flight or other optical effects to measure the distance between the device 300 and an external object. The depth sensor 365 may include one or more optical emitters 212 adapted to emit one or more light beams that may be used to estimate the distance. In some cases, the one or more light beams are coherent light beams (e.g., laser beams) having a substantially uniform wavelength / frequency. Coherent light sources may facilitate depth measurements using time of flight, phase shift, or other optical effects. In some cases, the depth sensor 365 uses an acoustic output, a radio output, or other types of outputs that may be used to measure the distance between the device 300 and one or more external objects.

[0161] like Figure 3 As shown, cameras 361, 362, 363 can be aligned with camera covers 366, 367, 368, respectively. Covers 366, 367, 368 can be formed of glass or sapphire materials and can provide transparent windows through which cameras 361, 362, 363 can capture photographic images. In other cases, covers 366, 367, 368 are optical lenses that filter, amplify, or otherwise adjust the light received by the corresponding cameras 361, 362, 363. Other sensing or transmitting elements of sensor array 360 can transmit and / or receive signals through areas of rear cover 372 or through a separate cover (e.g., 369) coupled to rear cover 372. As shown in FIG. Figure 3 As shown, covers 366, 367, 368 may extend beyond the outer surface of cover 372 and may define recesses along the inner side of cover 372 so that lenses or other elements of cameras 361, 362, 363 may extend into the corresponding recesses. In this way, device 300 may accommodate larger lenses or other elements of cameras 361, 362, 363 than may be accommodated if recesses are not provided.

[0162] The device 300 also includes a battery 330. The battery 330 provides power to the device 300 and its various systems and components. The battery 330 may include a 4.45V lithium-ion battery encapsulated in a foil or other encapsulating element. The battery 330 may include a wound electrode configuration, sometimes referred to as a "jelly roll" or folded electrode configuration. The battery 330 may be recharged via a charging port 332 (e.g., by a power cable inserted into the charging port 332) and / or via a wireless charging system 340. The battery 330 may be coupled to the charging port 332 and / or the wireless charging system 340 via a battery control circuit that controls the power provided to the battery and the power provided by the battery to the device 300. The battery 330 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0163] The charging system 340 may include a coil inductively coupled to an output coil or transmission coil of the wireless charger. The coil may provide current to the device 300 to charge the battery 330 and / or power the device. In this example, the charging system 340 includes a coil assembly 342, which includes multiple turns of a wound conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 342 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help to position the device 300 relative to a separate wireless charging device or other accessory. In some embodiments, the magnet array also helps to radially position, orient, or "time" the device 300 relative to a separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to a separate charging device in a specific orientation or a set of discrete orientations to help position the device 300 relative to a separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 3 As shown, the device 300 also includes a magnetic reference 344 for assisting in positioning a separate wireless charging device or accessory. In one example, the magnetic reference 344 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 300 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. In addition, by magnetically coupling the cable or power cord to the rear surface of the device 300, the charging device or other accessory can be more securely coupled to the device 300.

[0164] In some implementations, the charging system 340 includes an antenna or other element that detects the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna that is suitable for receiving and / or sending wireless communications between the device 300 and a wireless charger or other accessory. In some cases, the device 300 is suitable for performing wireless communications to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the status of the device, the amount of charge held by the battery 330, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0165] The device 300 may also include a speaker system 324. The speaker system 324 may be positioned in the device 300 so that a corresponding speaker port 325 is aligned with or otherwise close to the audio output of the speaker system 324. Thus, the sound output by the speaker system 324 leaves the housing 310 via the corresponding speaker port 325. The speaker system 324 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 324 may include a left speaker and a right speaker aligned with a left speaker port and a right speaker port 325, respectively, to produce stereo sound.

[0166] The device 300 may also include a haptic actuator 322. The haptic actuator 322 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the haptic actuator 322 may have a profile or housing shape that facilitates physical integration with the battery 330 and other components of the device 300 so as to minimize space and / or maximize the size of the battery.

[0167] When the coil is energized, the coil can cause the mass to move, which causes a force to be applied to the device 300. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an outer surface of the device 300. The tactile actuator 322 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 322, other types of tactile actuators can be used.

[0168] The electronic device 300 also includes a logic board 320. The logic board 320 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 320 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 320 may include a device for a subscriber identity module (SIM). The logic board 320 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 320 may include a device for an electronic SIM. The logic board 320 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0169] The logic board 320 may also include a liquid detection circuit 327 positioned adjacent to the charging opening 326 or other opening in the housing 310. The liquid detection circuit 327 may include a resistive sensor or a conductive sensor configured to electrically detect moisture above a given threshold and transmit a signal to a processor to record an event of exposure to liquid. The liquid detection circuit 327 may also include a visual element that changes color or provides some other visual marker when exposed to moisture above a certain threshold. In some cases, the liquid detection circuit 327 is positioned within the sealed interior volume of the waterproof or water-resistant device and is configured to detect liquid that enters due to mechanical destruction of the housing 310 or physical damage to the device 300.

[0170] The logic board 320 may also include wireless communication circuitry that may be coupled to housing members 311, 312, 313, 314, 315, or 316 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members or structures to provide wireless communication. The logic board 320 may also include components such as accelerometers, gyroscopes, near field communication circuitry and / or antennas, compasses, and the like. In some implementations, the logic board 320 may include a magnetometer suitable for detecting and / or locating an accessory. For example, the magnetometer may be suitable for detecting magnetic (or non-magnetic) signals generated by an accessory of the device 300 or other device. The output of the magnetometer may include a directional output that may be used to display directional markings or other navigation guidance on the display 303 to guide the user toward the location of the accessory or other device.

[0171] The logic board 320 may also include one or more pressure transducers that may be operable to detect changes in external pressure in order to determine changes in altitude. The pressure sensors may be externally transported and / or positioned within the water-tight interior volume of the housing 310. The output of the pressure sensors may be used to track stairs climbed, location (e.g., floor) of a multi-story structure, movement performed during an activity in order to estimate physical exertion or calories burned, or other relative movement of the device 300.

[0172] The logic board 320 may also include global positioning system (GPS) electronics that may be used to determine the location of the device 300 relative to one or more satellites (e.g., a global navigation satellite system (SNSS)) in order to estimate the absolute location of the device 300. In some implementations, the GPS electronics may be operable to utilize dual frequency bands. For example, the GPS electronics may use L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands to estimate the location of the device 300.

[0173] like Figure 3 As shown, the housing may include a cover 372 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 300. The cover 372 may be formed of a glass substrate having a portion having a thickness less than 1 mm. In some cases, the sheet substrate has a portion less than 0.80 mm. In some cases, the glass substrate has a portion of approximately 0.60 mm or thinner. The cover 372 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera covers 366, 367, 368. The cover 372 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a rough appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 372 to provide the desired optical effect and final color for the device 300.

[0174] Similar to that described above with respect to cover 302, cover 372 can be at least partially positioned within an opening defined in housing 310. Also similar to that described above with respect to cover 302, the edges or sides of cover 372 can be surrounded by a protective flange or lip of housing 310 without intervening features between the edges of cover 372 and the corresponding flanges of housing 310. Cover 372 is typically chemically strengthened using an ion exchange process to form a compressive stress layer along the exterior surface of cover 372.

[0175] As described above, housing 310 may include housing components 311 , 312 , 313 , 314 , 315 , and 316 that are structurally joined together via joint structure 318 . Figure 3 318 can extend above the inner surface of the shell member. More specifically, a portion of the joint structure 318 can contact, cover, enclose, and / or engage with a retention feature of the shell member extending from the inner surface of the shell member.

[0176] The housing members 311, 312, 313, 314, 315 and 316 may also be referred to herein as housing segments, and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 311, 312, 313, 314, 315 and 316 may provide a sturdy and impact-resistant sidewall for the device 300. In this example, the housing members 311, 312, 313, 314, 315 and 316 define a flat sidewall extending around the periphery of the device 300. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 310. The housing members 311, 312, 313, 314, 315 and 316 may each have a flange portion or lip extending around the respective sides of the front cover 302 and the rear cover 372 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 302 and the rear cover 372. This can allow forces or impacts applied to the housing 310 to be transferred to the front cover 302 and the rear cover 372 without affecting the display or other internal structural elements, which can improve the drop performance of the device 300.

[0177] like Figure 3 As shown, the device 300 includes multiple antennas that can be adapted to wirelessly communicate using a 5G communication protocol. Specifically, the device 300 may include a (front transmitting) antenna array 386, which is positioned near the earpiece of the device 300 and is configured to transmit and receive wireless communication signals through the cover 302. The device 300 may also include a (side transmitting) antenna array 382, ​​which is configured to transmit and receive wireless communication signals through an antenna window 383 or waveguide formed along the side wall of the housing 310 or otherwise integrated with the side wall. The side transmitting antenna array 382 can be coupled to the logic board 320 via a flexible circuit element or other conductive connection, as described herein. The device 300 may also include a (rear transmitting) antenna array 384, which can be configured to transmit and receive wireless communication signals through the cover 372. The (rear transmitting) antenna array 384 can be attached to the back surface or bottom surface of the logic board 320. Each of antenna arrays 382, ​​384, 386 may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 300 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing components 311, 312, 313, 314, 315, and 316 may be adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0178] Figure 4 An exploded view of an exemplary electronic device is shown. Specifically, Figure 4 An exploded view of the device 400 is shown, illustrating various components of the device 400 and exemplary arrangements and configurations of these components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 4 The device 400 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0179] like Figure 4 As shown, the device 400 includes a cover 402 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 402 may be formed of glass or glass-ceramic materials. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 402. In some cases, the cover 402 may include a sheet of chemically strengthened material having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings or optical treatment coatings. In some cases, the cover 402 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 402 to form a compressive stress layer along the outer surface of the cover 402.

[0180] The cover 402 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 410. As described in more detail below, the edges or sides of the cover 402 can be surrounded by a protective flange or lip of the housing 410 without a gap component between the edge of the cover 402 and the corresponding flange of the housing 410. This configuration can allow impacts or forces applied to the housing 410 to be transferred to the cover 402 without directly transferring shear stresses through the display 403 or the frame 404.

[0181] like Figure 4As shown, display 403 is coupled to the inner surface of cover 402. In this example, the display stack includes display 403 (also referred to as display element) and touch sensing layer 405 positioned between display 403 and cover 402. Display 403 may include a borderless organic light emitting diode (OLED) display that measures 15.4 cm (6.1 inches) from corner to corner. The perimeter or inactive area of ​​display 403 may be reduced to allow very thin device borders to exist around the active area of ​​display 403. In some cases, display 403 allows a border area of ​​1.5 mm or less. In some cases, display 403 allows a border area of ​​1 mm or less. In an exemplary implementation, the border area is about 0.9 mm. Display 403 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, display 403 has a pixel density of about 460 PPI.

[0182] like Figure 4 As shown, the display stack includes both a display (element) 403 and a separate touch sensing layer 405, and includes a capacitive electrode array that is configured to sense the presence and location of one or more touches along the outer surface of the cover 402. The electrodes of the touch sensing layer 405 can be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the outer surface of the cover 402. In some cases, the touch sensing layer 405 is coupled to or has an integrated flexible circuit that extends from one or more of the long sides of the touch sensing layer 405, which can reduce the border around the display 403. Figure 2 As with the previous examples described, display 403 can have an integrated (on-cell) touch sensing system. For example, an electrode array integrated into an OLED display can be time and / or frequency multiplexed to provide both display and touch sensing functionality. In some cases, display 403 includes another type of display element, such as a liquid crystal display (LCD).

[0183] The display 403 may include an always on display (AOD) function. For example, the display 403 may be configured to allow a subset of a specified area or pixels to be displayed when the device 400 is powered on, so that the graphical content is visible to the user even when the device 400 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications, and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always on graphical output. Although some battery power may be consumed when displaying a persistent or always on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 403. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution to reduce the power consumption of the display 403.

[0184] like Figure 4 As shown, the device 400 may also include a frame 404, which is positioned below the cover 402 and extends around the outer periphery of the display 403. The periphery of the frame 404 may be attached to the lower surface or inner surface of the cover 402. A portion of the frame 404 may extend below the display 403 and may attach the cover 402 to the housing 410. Because the display 403 is attached to the lower surface or inner surface of the cover 402, the frame 404 may also be described as attaching both the display 403 and the cover 402 to the housing 410. The frame 404 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 404 may support elements of the display stack, provide an anchor point for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 404 includes one or more metal or conductive elements that provide shielding between device components, such as providing shielding between the display stack (including the display component and the touch sensor component) and other components such as the tactile actuator 422, the speaker system 424, etc.

[0185] Cover 402, touch sensing layer 405, display 403, and frame member 404 can be part of top module 401 of device 400. Top module 401 can be assembled as a subassembly, which can then be attached to a housing member. For example, as described herein, display 403 and touch sensing layer 405 can be attached to cover 402 (e.g., via a transparent adhesive), and frame member 404 can be attached to the cover around the perimeter of display 403 (e.g., via an adhesive). Top module 401 can then be attached to a housing member of device 400 by mounting and adhering frame member 404 to a boss defined by the housing member.

[0186] like Figure 4As shown, the device 400 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 400 includes a front camera 406, which includes a high-resolution camera sensor. The front camera 406 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The front camera 406 may have an aperture number of f / 2.2. The device 400 also includes a facial recognition sensor 452, which includes a depth sensor, which includes an infrared light projector and an infrared light sensor, which is configured to sense a depth point array or area along the user's face. The depth point array can be characterized as a unique feature or biometric identifier, which can be used to identify the user and unlock the device 400 or authorize functions on the device 400, such as purchasing software applications or using payment functions provided by the device 400.

[0187] The device may also include one or more other sensors or elements integrated into the forward sensor array 450. For example, the forward sensor array 450 may include a front light illuminator element for providing a flash or illumination for the front camera 406. The forward sensor array 450 may also include an ambient light sensor (ALS) for detecting ambient light conditions to set exposure aspects of the front camera 406. The forward sensor array 450 may also include an antenna array configured to transmit and receive wireless communications along the front surface of the device 400. The antenna array may include elements configured to conduct 5G wireless protocols, which may include millimeter wave and / or 6 GHz communication signals. The antenna array may include multiple antenna elements and may be configured to use or be used with beamforming and other similar technologies to facilitate 5G wireless communications.

[0188] Figure 4 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 4 As shown, these elements can be integrated into the sensor array 460. In this example, the sensor array 460 includes a first camera 461 having a 12 megapixel image sensor and a wide angle lens with an aperture number of f / 1.6. The first camera 461 also includes a dual photodiode sensor with an APS+ sensor format. The sensor array 460 also includes a second camera 462 having a 12 megapixel image sensor and an ultra-wide angle lens (120° FOV) with an aperture number of f / 2.4.

[0189] Sensor array 460 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. Sensor array 460 also features an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, sensor array 460 also includes microphones, ambient light sensors, and other sensors suitable for sensing along the back surface of device 400.

[0190] The sensor array 460 may also include a depth sensor that is capable of estimating the distance to an object positioned behind the device 400. The depth sensor may include an optical sensor that uses time of flight or other optical effects to measure the distance between the device 400 and an external object. The depth sensor may include one or more optical emitters 212 adapted to emit one or more light beams that may be used to estimate the distance. In some cases, the one or more light beams are coherent light beams having a substantially uniform wavelength / frequency. Coherent light sources may facilitate depth measurements using time of flight, phase shift, or other optical effects. In some cases, the depth sensor uses an acoustic output, a radio output, or other types of outputs that may be used to measure the distance between the device 400 and one or more external objects.

[0191] like Figure 4 As shown, cameras 461, 462 can be aligned with camera covers 466, 467, respectively. Covers 466, 467 can be formed of glass or sapphire materials and can provide transparent windows through which cameras 461, 462 can capture photographic images. In other cases, covers 466, 467 are optical lenses that filter, amplify, or otherwise adjust the light received by the respective cameras 461, 462. Other sensing or transmitting elements of sensor array 460 can transmit and / or receive signals through areas of rear cover 472 or through a separate cover (e.g., 469) coupled to rear cover 472. As shown in FIG. Figure 4 As shown, covers 466, 467 may extend beyond the outer surface of cover 472 and may define recesses along the inner side of cover 472 so that lenses or other elements of cameras 461 and 462 may extend into the corresponding recesses. In this way, device 400 may accommodate larger lenses or other elements of cameras 361, 461, 462 than may be accommodated if recesses are not provided.

[0192] The device 400 also includes a battery 430. The battery 430 provides power to the device 400 and its various systems and components. The battery 430 may include a 4.45V lithium-ion battery encapsulated in a foil or other encapsulating element. The battery 430 may include a wound electrode configuration, sometimes referred to as a "jelly roll" or folded electrode configuration. The battery 430 may be recharged via a charging port 432 (e.g., by a power cable inserted into the charging port 432) and / or via a wireless charging system 440. The battery 430 may be coupled to the charging port 432 and / or the wireless charging system 440 via a battery control circuit that controls the power provided to the battery and the power provided by the battery to the device 400. The battery 430 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0193] The charging system 440 may include a coil inductively coupled to an output coil or a transmitting coil of the wireless charger. The coil may provide current to the device 400 to charge the battery 430 and / or power the device. In this example, the charging system 440 includes a coil assembly 442, which includes a plurality of turns of a wound conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 442 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help to position the device 400 relative to the separate wireless charging device or other accessory. In some embodiments, the magnet array also helps to radially position, orient, or "time" the device 400 relative to the separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to a separate charging device in a specific orientation or a set of discrete orientations to help position the device 400 relative to the separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 4 As shown, device 400 also includes a magnetic reference 444 for assisting in positioning a separate wireless charging device or accessory. In one example, magnetic reference 444 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, rotational alignment of device 400 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. Additionally, by magnetically coupling the cable or power cord to the rear surface of device 400, the charging device or other accessory can be more securely coupled to device 400.

[0194] In some implementations, the charging system 440 includes an antenna or other element that detects the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna that is suitable for receiving and / or sending wireless communications between the device 400 and a wireless charger or other accessory. In some cases, the device 400 is suitable for performing wireless communications to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the status of the device, the amount of charge held by the battery 430, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0195] The device 400 may also include a speaker system 424. The speaker system 424 may be positioned in the device 400 so that a corresponding speaker port 425 is aligned with or otherwise close to the audio output of the speaker system 424. Thus, the sound output by the speaker system 424 leaves the housing 410 via the corresponding speaker port 425. The speaker system 424 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 424 may include a left speaker and a right speaker aligned with a left speaker port and a right speaker port 425, respectively, to produce stereo sound.

[0196] The device 400 may also include a tactile actuator 422. The tactile actuator 422 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the tactile actuator 422 may have a profile or housing shape that facilitates physical integration with the battery 430 and other components of the device 400 so as to minimize space and / or maximize the size of the battery.

[0197] When the coil is energized, the coil can cause the mass to move, which causes a force to be applied to the device 400. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an outer surface of the device 400. The tactile actuator 422 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 422, other types of tactile actuators can be used.

[0198] The electronic device 400 also includes a logic board 420. The logic board 420 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 420 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 420 may include a device for a subscriber identity module (SIM). The logic board 420 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 420 may include a device for an electronic SIM. The logic board 420 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0199] The logic board 420 may also include a liquid detection circuit 427 positioned adjacent to the charging opening 426 or other opening in the housing 410. The liquid detection circuit 427 may include a resistive sensor or a conductive sensor configured to electrically detect moisture above a given threshold and transmit a signal to a processor to record an event of exposure to liquid. The liquid detection circuit 427 may also include a visual element that changes color or provides some other visual marker when exposed to moisture above a certain threshold. In some cases, the liquid detection circuit 427 is positioned within the sealed interior volume of the waterproof or water-resistant device and is configured to detect liquid that enters due to mechanical destruction of the housing 410 or physical damage to the device 400.

[0200] The logic board 420 may also include wireless communication circuitry that may be coupled to housing members 411, 412, 413, 414, 415, or 416 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members or structures to provide wireless communication. The logic board 420 may also include components such as accelerometers, gyroscopes, near field communication circuitry and / or antennas, compasses, and the like. In some implementations, the logic board 420 may include a magnetometer suitable for detecting and / or locating accessories. For example, the magnetometer may be suitable for detecting magnetic (or non-magnetic) signals generated by accessories of the device 400 or other devices. The output of the magnetometer may include a directional output that may be used to display directional markings or other navigation guidance on the display 403 to guide the user toward the location of the accessory or other device.

[0201] The logic board 420 may also include one or more pressure transducers that may be operable to detect changes in external pressure in order to determine changes in altitude. The pressure sensor may be externally transported and / or positioned within the water-tight interior volume of the housing 410. The output of the pressure sensor may be used to track stairs climbed, location (e.g., floor) of a multi-story structure, movement performed during an activity in order to estimate physical exertion or calories burned, or other relative movement of the device 400.

[0202] The logic board 420 may also include global positioning system (GPS) electronics that may be used to determine the location of the device 400 relative to one or more satellites (e.g., a global navigation satellite system (SNSS)) in order to estimate the absolute location of the device 400. In some implementations, the GPS electronics may be operable to utilize dual frequency bands. For example, the GPS electronics may estimate the location of the device 400 using L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands.

[0203] like Figure 4 As shown, the housing may include a cover 472 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 400. The cover 472 may be formed of a glass, glass ceramic, ceramic, or other material substrate having a portion less than 1 mm thick. In some cases, the substrate has a portion less than 0.80 mm. In some cases, the substrate has a portion of approximately 0.60 mm or thinner. The cover 472 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera cover 466, 467. The cover 472 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a matte appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 472 to provide the desired optical effect and final color for the device 400.

[0204] Similar to that described above with respect to cover 402, cover 472 can be at least partially positioned within an opening defined in housing 410. Also similar to that described above with respect to cover 402, the edges or sides of cover 472 can be surrounded by a protective flange or lip of housing 410 without intervening features between the edges of cover 472 and the corresponding flanges of housing 410. Cover 472 can be chemically strengthened using an ion exchange process to form a compressive stress layer along the exterior surface of cover 472.

[0205] As described above, housing 410 may include housing components 411 , 412 , 413 , 414 , 415 , and 416 that are structurally joined together via joint structure 418 . Figure 4 Shown is how the joint structure 418 can extend above the inner surface of the shell member. More specifically, a portion of the joint structure 418 can contact, cover, enclose, and / or engage with a retention feature of the shell member extending from the inner surface of the shell member.

[0206] The housing members 411, 412, 413, 414, 415 and 416 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 411, 412, 413, 414, 415 and 416 may provide a sturdy and impact-resistant sidewall for the device 400. In this example, the housing members 411, 412, 413, 414, 415 and 416 define a flat sidewall extending around the periphery of the device 400. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 410. The housing members 411, 412, 413, 414, 415 and 416 may each have a flange portion or lip extending around the respective sides of the front cover 402 and the rear cover 472 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 402 and the rear cover 472. This can allow forces or impacts applied to the housing 410 to be transferred to the front cover 402 and the rear cover 472 without affecting the display or other internal structural elements, which can improve the drop performance of the device 400.

[0207] like Figure 4 As shown, the device 400 includes multiple antennas that can be adapted to wirelessly communicate using a 5G communication protocol. Specifically, the device 400 may include a (front transmitting) antenna array 486, which is positioned near the earpiece of the device 400 and is configured to transmit and receive wireless communication signals through the cover 402. The device 400 may also include a (side transmitting) antenna array 482, which is configured to transmit and receive wireless communication signals through an antenna window 483 or waveguide formed along the side wall of the housing 410 or otherwise integrated with the side wall. The side transmitting antenna array 482 can be coupled to the logic board 420 via a flexible circuit element or other conductive connector, as described herein. The device 400 may also include a (rear transmitting) antenna array 484, which can be configured to transmit and receive wireless communication signals through the cover 472. The antenna array 484 can be attached to the back surface or bottom surface of the logic board 420. Each of antenna arrays 482, 484, 486 may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 400 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing members 411, 412, 413, 414, 415, and 416 may be adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0208] Figure 5 An exploded view of an exemplary electronic device is shown. Specifically, Figure 5 An exploded view of the device 500 is shown, illustrating various components of the device 500 and exemplary arrangements and configurations of these components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 5 The device 500 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0209] like Figure 5 As shown, the device 500 includes a cover 502 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 502 may be formed of glass or glass-ceramic materials. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 502. In some cases, the cover 502 may include a sheet of chemically strengthened material having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings or optical treatment coatings. In some cases, the cover 502 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 502 to form a compressive stress layer along the outer surface of the cover 502.

[0210] The cover 502 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 510. As described in more detail below, the edges or sides of the cover 502 can be surrounded by a protective flange or lip of the housing 510 without a gap component between the edge of the cover 502 and the corresponding flange of the housing 510. This configuration can allow impacts or forces applied to the housing 510 to be transferred to the cover 502 without directly transferring shear stresses through the display 503 or the frame 504.

[0211] like Figure 5As shown, the display 503 is coupled to the inner surface of the cover 502. The display 503 may include a borderless organic light emitting diode (OLED) display that measures 16.97 cm (6.68 inches) corner to corner. The perimeter or inactive area of ​​the display 503 may be reduced to allow a very thin device border around the active area of ​​the display 503. In some cases, the display 503 allows a border area of ​​1.5 mm or thinner. In some cases, the display 503 allows a border area of ​​1 mm or thinner. In an exemplary implementation, the border area is about 0.9 mm. The display 503 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, the display 503 has a pixel density of about 458 PPI. The display 503 may have an integrated (on-cell) touch sensing system. For example, the electrode array integrated into the OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. The electrodes may be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the exterior surface of cover 502. In some cases, display 503 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, device 500 may include one or more touch and / or force sensing layers positioned between display 503 and cover 502.

[0212] The display 503 may include an always on display (AOD) function. For example, the display 503 may be configured to allow a subset of a specified area or pixels to be displayed when the device 500 is powered on, so that the graphical content is visible to the user even when the device 500 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always on graphical output. Although some battery power may be consumed when displaying a persistent or always on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 503. This function may be enabled by operating only a subset of display pixels and / or operating with a reduced resolution to reduce the power consumption of the display 503.

[0213] like Figure 5As shown, the device 500 may also include a frame 504, which is positioned below the cover 502 and extends around the outer periphery of the display 503. The periphery of the frame 504 may be attached to the lower surface or inner surface of the cover 502. A portion of the frame 504 may extend below the display 503 and may attach the cover 502 to the housing 510. Because the display 503 is attached to the lower surface or inner surface of the cover 502, the frame 504 may also be described as attaching both the display 503 and the cover 502 to the housing 510. The frame 504 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 504 may support elements of the display stack, provide an anchor point for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 504 includes one or more metal or conductive elements that provide shielding between device components, such as providing shielding between the display stack (including the display component and the touch sensor component) and other components such as the tactile actuator 522, the speaker system 524, etc.

[0214] The cover 502, display stack 503, and frame member 504 can be part of a top module 501 of the device 500. The top module 501 can be assembled as a subassembly, which can then be attached to a housing member. For example, as described herein, the display 503 can be attached to the cover 502 (e.g., via a transparent adhesive), and the frame member 504 can be attached to the cover around the perimeter of the display stack 503 (e.g., via an adhesive). The top module 501 can then be attached to the housing member of the device 500 by mounting and adhering the frame member 504 to a boss defined by the housing member.

[0215] like Figure 5 As shown, the device 500 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 500 includes a front camera 506, which includes a high-resolution camera sensor. The front camera 506 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The front camera 506 may have an aperture number of f / 2.2. The device 500 also includes a facial recognition sensor 552, which includes a depth sensor, which includes an infrared light projector and an infrared light sensor, which is configured to sense a depth point array or area along the user's face. The depth point array can be characterized as a unique feature or biometric identifier, which can be used to identify the user and unlock the device 500 or authorize functions on the device 500, such as purchasing software applications or using payment functions provided by the device 500.

[0216] The device may also include one or more other sensors or elements integrated into the forward sensor array 550. For example, the forward sensor array 550 may include a front light illuminator element for providing a flash or illumination for the front camera 506. The forward sensor array 550 may also include an ambient light sensor (ALS) for detecting ambient light conditions to set exposure aspects of the front camera 506. The forward sensor array 550 may also include an antenna array configured to transmit and receive wireless communications along the front surface of the device 500. The antenna array may include elements configured to conduct 5G wireless protocols, which may include millimeter wave and / or 6 GHz communication signals. The antenna array may include multiple antenna elements and may be configured to use or be used with beamforming and other similar technologies to facilitate 5G wireless communications.

[0217] Figure 5 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 5 As shown, these elements may be integrated into the sensor array 560. In this example, the sensor array 560 includes a first camera 561 having a 12 megapixel image sensor and a wide-angle lens with an aperture number of f / 1.6. The first camera 561 may also include a sensor shift mechanism that allows image stabilization and / or optical focusing. In some cases, the image sensor moves relative to one or more fixed elements of the optical lens assembly. The sensor array 560 also includes a second camera 562 having a 12 megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture number of f / 2.2. The sensor array 560 may also include a third camera 563 having a 12 megapixel image sensor and a telephoto optical lens assembly that achieves 2.5x optical zoom. The third camera 563 may also have an aperture number of f / 2.4.

[0218] Sensor array 560 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. Sensor array 560 also features an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, sensor array 560 also includes microphones, ambient light sensors, and other sensors suitable for sensing along the back surface of device 500.

[0219] The sensor array 560 may also include a depth sensor 565 that is capable of estimating the distance to an object positioned behind the device 500. The depth sensor module 565 may include an optical sensor that uses time of flight or other optical effects to measure the distance between the device 500 and an external object. The depth sensor 565 may include one or more optical emitters adapted to emit one or more light beams that may be used to estimate the distance. In some cases, the one or more light beams are coherent light beams having a substantially uniform wavelength / frequency. Coherent light sources may facilitate depth measurement using time of flight, phase shift or other optical effects. In some cases, the depth sensor 565 uses an acoustic output, a radio output or other types of output that may be used to measure the distance between the device 500 and one or more external objects. The depth sensor 565 may be positioned adjacent to a window 571 through which the depth sensor 565 may send and / or receive signals (e.g., laser, infrared light, visible light, etc.).

[0220] like Figure 5 As shown, cameras 561, 562, 563 can be aligned with camera covers 566, 567, 568, respectively. Covers 566, 567, 568 can be formed of glass or sapphire materials and can provide transparent windows through which cameras 561, 562, 563 can capture photographic images. In other cases, covers 566, 567, 568 are optical lenses that filter, amplify, or otherwise adjust the light received by the corresponding cameras 561, 562, 563. Other sensing or transmitting elements of sensor array 560 can transmit and / or receive signals through areas of rear cover 572 or through a separate cover (e.g., 569) coupled to rear cover 572. As shown in FIG. Figure 5 As shown, covers 566, 567, 568 may extend beyond the outer surface of cover 572 and may define recesses along the inner side of cover 572 so that lenses or other elements of cameras 561, 562, 563 may extend into the corresponding recesses. In this way, device 500 may accommodate larger lenses or other elements of cameras 561, 562, 563 than may be accommodated if recesses are not provided.

[0221] The device 500 also includes a battery 530. The battery 530 provides power to the device 500 and its various systems and components. The battery 530 may include a 4.40V lithium-ion battery encapsulated in a foil or other encapsulating element. The battery 530 may include a wound electrode configuration, sometimes referred to as a "jelly roll" or folded electrode configuration. The battery 530 may be recharged via a charging port 532 (e.g., by a power cable inserted into the charging port 532) and / or via a wireless charging system 540. The battery 530 may be coupled to the charging port 532 and / or the wireless charging system 540 via a battery control circuit that controls the power provided to the battery and the power provided by the battery to the device 500. The battery 530 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0222] The wireless charging system 540 may include a coil inductively coupled to an output or transmission coil of the wireless charger. The coil may provide current to the device 500 to charge the battery 530 and / or power the device. In this example, the wireless charging system 540 includes a coil assembly 542, which includes multiple turns of a wound conductive wire or other conduit configured to generate an electric current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 542 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help to position the device 500 relative to the separate wireless charging device or other accessory. In some specific implementations, the magnet array also helps to radially position, orient, or "time" the device 500 relative to the separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to the separate charging device in a specific orientation or a set of discrete orientations to help position the device 500 relative to the separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 5 As shown, the device 500 also includes a magnetic reference 544 for assisting in positioning a separate wireless charging device or accessory. In one example, the magnetic reference 544 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 500 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. In addition, by magnetically coupling the cable or power cord to the rear surface of the device 500, the charging device or other accessory can be more securely coupled to the device 500.

[0223] In some implementations, the wireless charging system 540 includes an antenna or other element that detects the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna that is suitable for receiving and / or sending wireless communications between the device 500 and the wireless charger or other accessory. In some cases, the device 500 is suitable for performing wireless communications to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the status of the device, the amount of power held by the battery 530, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0224] The device 500 may also include a speaker system 524. The speaker system 524 may be positioned in the device 500 so that a corresponding speaker port 525 is aligned with or otherwise close to the audio output of the speaker system 524. Therefore, the sound output by the speaker system 524 leaves the housing 510 via the corresponding speaker port 525. The speaker system 524 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 524 may include a left speaker and a right speaker aligned with a left speaker port and a right speaker port 525, respectively, to produce stereo sound.

[0225] The device 500 may also include a tactile actuator 522. The tactile actuator 522 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the tactile actuator 522 may have a profile or housing shape that facilitates physical integration with the battery 530 and other components of the device 500 so as to minimize space and / or maximize the size of the battery.

[0226] When the coil is energized, the coil can cause the mass to move, which causes a force to be applied to the device 500. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an outer surface of the device 500. The tactile actuator 522 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 522, other types of tactile actuators can be used.

[0227] The electronic device 500 also includes a logic board 520. The logic board 520 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 520 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 520 may include a device for a subscriber identity module (SIM). The logic board 520 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 520 may include a device for an electronic SIM. The logic board 520 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0228] The logic board 520 may also include a liquid detection circuit 527 positioned adjacent to the charging opening 526 or other opening in the housing 510. The liquid detection circuit 527 may include a resistive sensor or a conductive sensor configured to electrically detect moisture above a given threshold and transmit a signal to a processor to record an event of exposure to liquid. The liquid detection circuit 527 may also include a visual element that changes color or provides some other visual marker when exposed to moisture above a certain threshold. In some cases, the liquid detection circuit 527 is positioned within the sealed interior volume of the waterproof or water-resistant device and is configured to detect liquid that enters due to mechanical destruction of the housing 510 or physical damage to the device 500.

[0229] The logic board 520 may also include wireless communication circuitry that may be coupled to housing members 511, 512, 513, 514, 515, or 516 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members or structures to provide wireless communication. The logic board 520 may also include components such as accelerometers, gyroscopes, near field communication circuitry and / or antennas, compasses, and the like. In some implementations, the logic board 520 may include a magnetometer suitable for detecting and / or locating accessories. For example, the magnetometer may be suitable for detecting magnetic (or non-magnetic) signals generated by accessories of the device 500 or other devices. The output of the magnetometer may include a directional output that may be used to display directional markings or other navigation guidance on the display 503 to guide the user toward the location of the accessory or other device.

[0230] The logic board 520 may also include one or more pressure transducers that may be operable to detect changes in external pressure in order to determine changes in altitude. The pressure sensors may be externally transported and / or positioned within the water-tight interior volume of the housing 510. The output of the pressure sensors may be used to track stairs climbed, location (e.g., floor) of a multi-story structure, movement performed during an activity in order to estimate physical exertion or calories burned, or other relative movement of the device 500.

[0231] The logic board 520 may also include global positioning system (GPS) electronics that can be used to determine the location of the device 500 relative to one or more satellites (e.g., a global navigation satellite system (SNSS)) in order to estimate the absolute location of the device 500. In some implementations, the GPS electronics can be operable to utilize dual frequency bands. For example, the GPS electronics can estimate the location of the device 500 using L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands.

[0232] Housing 510 may also include a base 519 that may be attached to housing 510. Base 519 may be formed of metal and may serve as a structural mounting point for components of device 500. Base 519 may define an opening corresponding to the size of coil assembly 542 of wireless charging system 540 such that base 519 does not shield wireless coil assembly 542 or otherwise adversely affect inductive coupling between the coil of wireless charging system 540 and an external wireless charger or accessory.

[0233] like Figure 5 As shown, the housing may include a cover 572 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 500. The cover 572 may be formed of glass, glass ceramic, or other materials having a portion less than 1 mm thick. In some cases, the substrate has a portion less than 0.80 mm. In some cases, the substrate has a portion of approximately 0.60 mm or thinner. The cover 572 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera covers 566, 567, 568. The cover 572 may be machined (e.g., ground) into a final shape to provide a desired surface finish before being polished and / or textured. The texture may be specifically configured to provide a matte appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 572 to provide the desired optical effect and final color for the device 500.

[0234] Similar to what is described above with respect to cover 502, cover 572 can be at least partially positioned within an opening defined in housing 510. Also similar to what is described above with respect to cover 502, the edges or sides of cover 572 can be surrounded by a protective flange or lip of housing 510 without a gap component between the edge of cover 572 and the corresponding flange of housing 510. Cover 572 can be chemically strengthened using an ion exchange process to form a compressive stress layer along the outer surface of cover 572. In some cases, (rear) cover 572 is formed of the same or similar material as (front) cover 502.

[0235] As described above, housing 510 may include housing components 511 , 512 , 513 , 514 , 515 , and 516 that are structurally joined together via joint structure 518 . Figure 5 Shown is how the joint structure 518 can extend above the inner surface of the shell member. More specifically, a portion of the joint structure 518 can contact, cover, enclose and / or engage with a retention feature of the shell member extending from the inner surface of the shell member.

[0236] The housing members 511, 512, 513, 514, 515 and 516 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 511, 512, 513, 514, 515 and 516 may provide a sturdy and impact-resistant sidewall for the device 500. In this example, the housing members 511, 512, 513, 514, 515 and 516 define a flat sidewall extending around the periphery of the device 500. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 510. The housing members 511, 512, 513, 514, 515 and 516 may each have a flange portion or lip extending around the respective sides of the front cover 502 and the rear cover 572 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 502 and the rear cover 572. This can allow forces or impacts applied to the housing 510 to be transferred to the front cover 502 and the rear cover 572 without affecting the display or other internal structural elements, which can improve the drop performance of the device 500.

[0237] like Figure 5As shown, the device 500 includes multiple antennas that can be adapted to wirelessly communicate using a 5G communication protocol. Specifically, the device 500 may include a (front transmitting) antenna array 586, which is positioned near the earpiece of the device 500 and is configured to transmit and receive wireless communication signals through the cover 502. The device 500 may also include a (side transmitting) antenna array 582, which is configured to transmit and receive wireless communication signals through an antenna window or waveguide formed along the side wall of the housing 510 or otherwise integrated with the side wall. The side transmitting antenna array 582 can be coupled to the logic board 520 via a flexible circuit element or other conductive connector, as described herein. The device 500 may also include a (rear transmitting) antenna array 584, which can be configured to transmit and receive wireless communication signals through the cover 572. The antenna array 584 can be attached to the back surface or bottom surface of the logic board 520. Each of antenna arrays 582, 584, 586 may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 500 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing members 511, 512, 513, 514, 515, and 516 may be adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0238] Fig. 6A Shown along Figure 1A 6A-6A of the exemplary electronic device 600. The electronic device 600 may correspond to or be an embodiment of the electronic device 100, 200, 300, 400, 500 or any other device described herein.

[0239] Device 600 may include housing member 602, which may correspond to or be an embodiment of housing member 130. Housing member 602 may also represent other housing members of the devices described herein, such as housing members 124, 125, 126, 127, and 128. Housing member 602 may define an exterior side surface 603 of device 600. Device 600 may also include cover 604, which may correspond to or be Figure 1A to Figure 1B604 can define a front outer surface 606 of the device 600, which can be planar. In some cases, the cover 604 defines a chamfer 605 that extends around the perimeter of the planar front outer surface 606 and between the edge of the front outer surface 606 and the edge of the side surface 607 of the cover 604. The device 600 can also include a rear cover 609, which can correspond to or be an embodiment of the rear cover 132 (or any other rear cover described herein).

[0240] The cover 604 can be positioned over a display stack 608, which can correspond to or be Figure 1A to Figure 1B 103 (or any other display described herein). Display stack 608 can be coupled to cover 604 along the interior surface of cover 604 via adhesive 610, which can be a transparent adhesive. Adhesive 610 can have a thickness, such as a thickness of about 200 microns, about 300 microns, about 400 microns, etc.

[0241] The display stack 608 may include a display element 612 that may be configured to generate a graphical output. The display element 612 may be an OLED display and may include multiple layers and / or other components that facilitate generating a graphical output, including, for example, a substrate, an anode, a cathode, one or more organic layers, an emissive layer, an adhesive, etc. In some cases, the display element 612 may include an integrated (on-cell) touch sensing system, as described above. For example, an electrode array integrated into an OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. In other cases, a separate touch and / or force sensing system may be included above or below the display element 612 (each touch and / or force sensing system may include, for example, a capacitive electrode layer, a compliance layer, etc.). Does the display element include? Although an OLED display is described, the display element may be any suitable type of display, such as an LCD display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc.

[0242] The display stackup 608 may include various electrically active layers and components that need to be electrically interconnected to other electronic components, processors, circuit elements, and the like. Because such layers (e.g., anode and cathode layers of an OLED display) may be sandwiched between other layers of the display stackup 608, a flexible circuit element 622 (e.g., a flexible circuit board) may be wrapped around the sides of the display stackup 608 (forming a loop) to electrically couple the electrically active layers of the display stackup 608 to more accessible circuit elements 620 of the display stackup 608. More specifically, the flexible circuit element 622 may include conductive traces that interconnect electronic components within the display element 612 (e.g., cathode and anode layers, electrode layers of touch and / or force sensors, on-cell touch sensing layers, and the like) to other electrical traces, connectors, processors, or other electronic components mounted on the circuit element 620. The circuit element 620 may be a rigid or flexible circuit board. In some cases, a potting material (e.g., epoxy, foam, or other material or component) may be provided in annular region 616 between the sides of display stack 608 and flexible circuit element 622 to help provide structure to flexible circuit element 622 and to help prevent flexible circuit element 622 from deforming due to impact or other damage. FIG. 13C to FIG. 13D Additional details regarding potting materials are shown and described.

[0243] In addition to the display element 612 and the touch and / or force sensing components, the display stack 608 may include other components, such as support layers and shielding layers, as well as adhesive layers for holding the various components of the display stack 608 together. For example, the display stack 608 may include a first metal plate 614 that supports the display element 612 and imparts structural support, rigidity, and flatness to the display element 612. The first metal plate 614 may have the same or substantially the same front area as the display element 612 (e.g., the front area of ​​the first metal plate 614 may be greater than 90% of the front area of ​​the display element 612). The display stack may also include a second metal plate 618 that supports the circuit element 620. The second metal plate 618 may have a smaller front area than the first metal plate 614 and may have similar dimensions to the circuit element 620. The front areas of both the circuit element 620 and the second metal plate 618 may be less than 50% of the front area of ​​the display element 612, and optionally less than 30% of the front area of ​​the display element 612.

[0244] Display stack 608 may also include other layers and components. For example, display stack 608 may include adhesives between various layers and components in display stack 608. More specifically, display stack 608 may include adhesives between display element 612 and first metal plate 614, adhesives between first metal plate 614 and second metal plate 618, and adhesives between second metal plate 618 and circuit element 620. Of course, other layers, sheets, substrates, adhesives, and / or other components may also be included in display stack 608.

[0245] The cover 604 can be attached to the frame member 624. The frame member 624 can be formed of or include a polymer material and can extend around all or substantially all of the perimeter of the cover 604. The frame member 624 can be at least partially encapsulated and / or otherwise coupled to a backplate 628. The backplate 628 can be formed of or include glass, ceramic, plastic, or any other suitable material. The backplate 628 can provide shielding and structural support for the device and can protect the display stack 608 by forming an at least partially enclosed area in which the display stack 608 is positioned. The backplate 628 can be at least partially encapsulated in the frame member 624, or it can be attached to the frame member 624 in any other suitable manner.

[0246] The frame member 624 can be attached to the housing member 602. For example, the frame member 624 can be attached to a boss 623 or other feature defined by the housing member, such as Fig. 6A As shown. Boss 623 may extend from the inner side of housing member 602. Boss 623 may be part of the integral structure of housing member 602 (e.g., the housing member may be formed by molding, machining or otherwise forming a single piece of material to define boss 623 and other features and / or surfaces of housing member 602). Frame member 624 may be attached to housing member 602 via adhesive 625, which may be located between boss 623 and frame member 624 and in contact with both. Adhesive 625 may be any suitable adhesive, including pressure sensitive adhesive (PSA), heat sensitive adhesive (HSA), adhesive film, epoxy resin, etc. In some cases, the boss or other features to which frame member 624 is attached serve as a reference surface for frame member 624. Thus, the alignment (e.g., flushness) of the front outer surface 606 of the cover 604 with the upper portion 632 of the housing member 602 can be defined or established by the position of the boss (relative to the upper portion 632) and the position of the bottom surface of the frame member 624 (relative to the front outer surface 606 of the cover 604).

[0247] The cover 604 can be attached to the frame member 624 via an adhesive 626. The frame member 624 can define a recessed area 627 (which defines a bonding surface), and the adhesive 626 can be placed in the recessed area 627. The recessed area 627 can provide a trough-like volume for the adhesive 626 while also allowing the flange portion 629 of the frame member 624 to contact the underside of the cover 604. The direct contact between the flange portion 629 of the frame member 624 and the cover 604 can provide a rigid connection between the cover 604 and the frame member 624, and can ensure that forces applied to the cover 604 are transferred to the structural frame member 624. Although the recessed area 627 is defined by a single flange portion 629 (e.g., on the right side of the recessed area 627), other configurations are also possible, such as a recessed area defined by two flange portions or other sidewall-like features (e.g., a channel defined by two walls).

[0248] The housing member 602 can be specifically configured to allow for tight coupling between it and components including the cover 604, the display stack 608, and the frame member 624. Specifically, the housing member 602 can define a recessed area 630 (also referred to simply as a recessed portion) along an interior surface of the housing member 602 that is adjacent to or proximate to the frame member 624. The recessed area 630 can be formed into the housing member 602 in any suitable manner. For example, the recessed area 630 can be machined into the housing member 602, or the housing member 602 can be molded or cast, and the recessed area 630 can be formed as part of the casting or molding process.

[0249] The recessed area 630 can correspond to a portion of the housing member 602 that is thinner than other portions of the housing member 602. For example, the housing member 602 can define an upper portion 632 and a lower portion 634 that have a greater thickness than the portion of the housing member 602 that defines the recessed area 630 (e.g., Fig. 6A from left to right as shown).

[0250] The recessed area 630 can be configured such that the interior surface of the housing member 602 directly opposite the frame member 624 is disposed a target distance from the frame member 624. The target distance can be selected such that deformation or deflection of the housing member 602 along the sidewall (e.g., due to the device 600 being dropped or otherwise subjected to predictable misuse or damage) does not contact the frame member 624 and / or the display stack 608. More specifically, the recessed area 630 allows the device 600 to accommodate a certain amount of deformation of the sidewall of the housing member 602 without the housing member 602 contacting the frame member 624. For example, the interior surface of the recessed area 630 can be spaced apart from the outer peripheral surface 631 of the frame member 624 by approximately 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, or any other suitable distance. In some cases, the distance between the inner surface of the recessed area 630 and the outer surface of the frame member 624 is greater than the shell deformation resulting from standard tests such as a side impact test (e.g., where the device 600 is dropped from a specific height (e.g., 1m, 2m, or 3m) onto a specific surface (e.g., the edge of a triangular prism)).

[0251] In some cases, the height of recessed region 630 (e.g., Fig. 6A In some cases, the height of the recessed area 630 (and optionally the height of the recessed area 630 and the additional recessed area 636 combined) extends from the boss 623 to a height or position at or above the bottom surface of the cover 604.

[0252] In some cases, the distance between the inner surface of the recessed area 630 and the outer surface of the frame member 624 is greater than the distance between the side surface 607 and the inner side surface 633 of the cover 604. Thus, for example, deformation or deflection of the shell member 602 toward the cover 604 and the frame member 624 may cause the side surface 607 of the cover 604 to contact the inner side surface 633 of the frame member 624 before the shell member 602 (and specifically the inner surface of the recessed area 630) contacts the frame member 624. Thus, by forming the recessed area 630 that establishes a greater distance between the shell member 602 and the frame member 624 than the distance between the shell member 602 and the cover 604, the risk of contact between the shell member 602 and the frame member 624 during deformation or deflection of the shell member 602 may be reduced.

[0253] The side surface 607 of the cover 604 may abut the inner side surface 633 of the shell member 602 (or be adjacent to the inner side surface 633 without a gap component, as described herein). In some cases, there is no gap component or other material between the side surface 607 of the cover 604 and the inner side surface 633 of the shell member 602. This construction provides several structural and aesthetic advantages. For example, the lack of a border or other gap component or material between these surfaces provides a clean, frameless appearance for the front of the device 600. Specifically, the front surface of the device 600 may be defined only by the upper portion 632 of the shell member 602 and the front outer surface 606 of the cover 604. Although the side surface 607 of the cover 604 may abut the inner side surface 633 of the shell member 602, in some cases, there may be an air gap between these surfaces. In some cases, an adhesive or sealing material may be positioned between the side surface 607 of the cover 604 and the inner side surface 633 of the shell member 602. In such cases, the adhesive or sealing material may be the only material between the surfaces, may be in contact with both surfaces, and may have a thickness of less than about 0.5 mm, 0.3 mm, 0.1 mm, 0.05 mm, or any other suitable thickness.

[0254] The proximity between the side surface 607 of the cover 604 and the interior side surface 633 of the shell member 602 can define a load path through the upper portion 632 of the shell member 602 and into the cover 604. For example, a force applied to the exterior side surface 603 of the shell member 602 can be directed into the cover 604 at the interface between the side surface 607 of the cover 604 and the interior side surface 633 of the shell member 602. (Where the interior side surface 633 abuts the side surface 607 of the cover 604, the load may be transferred or directed directly into the cover 604, and although an air gap exists between the interior side surface 633 and the side surface 607 of the cover 604, the force may initially cause the gap to close such that the interior side surface 633 contacts the side surface 607.) The rigidity and structural integrity of the cover 604 may help prevent or reduce deformation of the housing member 602 during a drop or other impact event to the exterior side surface 603, thereby protecting the internal components of the device 600 from damage caused by the housing member 602 contacting them. By limiting the load path through the cover 604 and by configuring the housing member 602 to include the recessed area 630, the device 600 may be designed to omit the frame member 624 from the load path during many impact events (e.g., a drop of the device 600). For example, as Fig. 6A As shown, the recessed area 630 ensures that the frame member 624 is spaced a suitable distance from the shell member 602. In addition, no portion of the frame member 624 is between the shell member 602 and the cover 604. Therefore, the frame member 624 can be positioned so that even if the shell member 602 is impacted, deformed, deflected, or otherwise damaged (up to a certain amount of deformation or deflection), the frame member does not contact the shell member 602 or is not impacted by the shell member.

[0255] In some cases, the rear cover 609 interfaces with the lower portion 634 of the housing member 602 in that the lower portion 634 may contact a side surface of the rear cover 609 , thereby defining a load path through the lower portion 634 and into the rear cover 609 .

[0256] In some cases, the housing member 602 may include an additional recessed area 636. The additional recessed area 636 may be configured so that the housing member 602 in the area is disposed at a distance from components in the display stack 608, touch and / or force sensing components, antennas, or other electronic components of the device 600. Specifically, since the housing member 602 may be formed of metal, the metal may be capacitively coupled to other electronic components. By increasing the distance between the metal of the housing member 602 and the electronic components, the capacitive coupling may be reduced to an acceptable level. Therefore, the additional recessed area 636 may be configured so that the distance between the additional recessed area 636 and another electronic component is greater than about 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any other suitable distance. In some cases, the recessed area 630 may be more recessed than the additional recessed area 636 (and therefore corresponds to a thinner portion of the housing member 602).

[0257] The frame member 624 may also define a recess 657. The recess 657 may be at least partially defined by the flange portion 629 and may be configured to accommodate or receive at least a portion of the display stack 608. For example, the loop 635 defined by the flexible circuit element 622 may extend at least partially into the recess 657, as shown in FIG. Fig. 6A (as well as FIG. 6B to FIG. 6E ). In some cases, to facilitate attaching the cover 604 to the frame member 624, the frame member 624 can be deflected so that the ring 635 can leave the frame member 624 without contacting the flange portion 629. For example, the cover 604 and the display stack 608 can be attached together, and then the cover and display stack can be lowered onto the frame member 624. Without deflecting the frame member 624, the ring 635 can contact the flange portion 629 or another portion of the frame member 624. By deflecting the frame member 624 (e.g., with a clamp or tool relative to Fig. 6A In the illustrated orientation (with frame member 624 pulled leftward), ring 635 can be positioned in the recess (and at least partially overlapping flange portion 629) without ring 635 contacting frame member 624. By positioning ring 635 at least partially in recess 657, greater fill efficiency can be achieved because frame members can be positioned closer to the active area of ​​the display, thereby reducing display borders and other unused space in the device.

[0258] As above relative to Fig. 6AAs described, display stack 608 may be attached to cover 604 via adhesive 610, which may be a transparent adhesive to allow graphical output produced by display stack 608 to be visible through cover 604. To increase the amount of interior space in the device, it may be advantageous to use a thin adhesive to attach display stack 608 to cover 604. However, the structure of frame member 624 and display stack 608 (and / or other device components) may limit the minimum thickness of adhesive 610. For example, if Fig. 6A If the thickness of the adhesive 610 in the flexible circuit element 622 is reduced, the flexible circuit element 622 may contact or be too close to the flange portion 629 of the frame member 624.

[0259] Figure 6B Another exemplary configuration of a frame member and a cover is shown that may enable the use of a thinner adhesive to attach the display stack to the cover. For example, Figure 6B A cover 640 is shown having a thinned outer region 650. Except for the thinned outer region 650, the cover 640 can be the same or similar to the cover 604, and for the sake of brevity, these details are not repeated here. The cover 640 can be attached to a recessed region 654 (which defines a bonding surface) positioned on a frame member 656 via an adhesive 652. The frame member 656, adhesive 652, and recessed region 654 can be the same or similar to the frame member 624, adhesive 626, and recessed region 627, and for the sake of brevity, these details are not repeated here.

[0260] The thinned outer region 650 can extend along one or more edges of the cover 640. For example, the thinned outer region 650 can extend along one edge of the cover 640, and specifically, along an edge of the flexible circuit element 643 of the cover 640 adjacent to the display stack 642. In some cases, the thinned outer region 650 can extend along two, three, or four sides of the cover 640. For example, in the case of a substantially rectangular cover, the thinned outer region 650 can extend around the entire outer perimeter of the cover 640 (e.g., the thinned outer region 650 can extend around a display area of ​​the cover 640, where the display area corresponds to a central area of ​​the cover 640 through which a display is visible and / or generates a graphical output). The display stack 642 and the flexible circuit element 643 can be the same or similar to the display stack 608 and the flexible circuit element 622, and for the sake of brevity, these details are not repeated here.

[0261] The thinned outer region 650 can facilitate the use of a thinner adhesive (e.g., an optically clear or transparent adhesive) layer 644 to attach the display stack 642 to the cover 640. More specifically, the thinned outer region 650 can allow the flange portion 648 (similar to Fig. 6A The flange portion 629 of the cover 640 is positioned further toward the outer surface of the cover 640 (eg, higher in the vertical direction, such as Figure 6B ), display stack 642 and thus flexible circuit element 643 can also be positioned further toward the exterior surface of cover 640 without causing flexible circuit element 643 to contact or otherwise interfere with flange portion 648. Thus, the thickness of adhesive 644 can be made thinner (e.g., relative to adhesive 610), resulting in an overall height 658 of display stack 642 and cover 640 that is less than the height of a device that does not include a cover with a thinned exterior region (e.g., overall height 658 can be less than Fig. 6A 659). In some cases, adhesive 644 has a thickness of about 150 microns, about 125 microns, about 100 microns, or about 75 microns.

[0262] The thinned outer region 650 of the cover 640 may have a thickness 641 of about 400 microns, and the main portion 647 of the cover 640 (e.g., the portion to which the display stack 642 is attached and includes the graphically active area of ​​the device) may have a thickness 649 of about 600 microns. In some cases, the thinned outer region 650 is about 100 microns, about 200 microns, or about 300 microns thinner than the main portion 647 of the cover 640. The thickness 641 may be between about 375 microns and about 425 microns, and the thickness 649 may be between about 575 microns and about 625 microns.

[0263] The cover 640 can define a transition region 646 extending from the thinned outer region 650 to the main portion 647 of the cover 640. The transition region 646 can define a curved portion of the bottom surface of the cover 640 extending from the thinned outer region 650 to the main portion 647 of the cover 640. The transition surface can have a continuous curve (as shown), or can have another shape or configuration. For example, the transition surface can be completely or partially flat, and can resemble a chamfered surface.

[0264] The cover 640 can be formed in a variety of ways. For example, the cover 640 (including its thinned outer region 650) can be formed by molding (e.g., heating glass or another transparent material and applying a mold or press to produce a desired shape), machining (e.g., grinding, polishing, or otherwise removing material from a sheet to form a desired shape), and / or additive manufacturing (e.g., adhering, bonding, or otherwise attaching a first glass sheet to a second glass sheet to form a desired shape). Combinations of these processes can also be used to form the cover 640 and produce the thinned outer region 650.

[0265] The cover of the electronic device described herein can be attached to the frame member via an adhesive. Fig. 6A As stated, and as Fig. 6A and Figure 6B As shown, the frame member can define a recessed area (e.g., recessed areas 627, 654), and the adhesive can be placed in the recessed area. The recessed area can provide a channel-like volume for the adhesive while also allowing the flange portion of the frame member to contact the underside of the cover.

[0266] Figure 6C An exemplary cover and frame member configuration is shown in which the flange portion of the frame member does not contact the cover. Specifically, Figure 6C A cover 660 (which may be the same or similar to cover 604) and a frame member 661 are shown. The frame member 661 defines a recessed area 664 (which defines a bonding surface) defined by a flange portion 662. An adhesive 663 is positioned in the recessed area 664 and bonds the cover 660 to the frame member 661. In this configuration, the interior surface of the cover 660 does not contact the surface 665 of the flange portion 662. Instead, a portion of the adhesive 663 is positioned between the surface 665 and the interior surface of the cover 660 (e.g., in a gap or space 666 between the surfaces). By positioning some of the adhesive 663 between the surfaces, the adhesive 663 can provide compliance or flexibility in the coupling between the cover 660 and the frame member 661, which can provide additional elasticity and / or resistance to breakage or other damage in a drop or other impact event. In addition, positioning some of the adhesive 663 between the surfaces can allow for greater control over positioning the cover 660 relative to the frame member 661. For example, differences in the thickness of cover 660 or the size or shape of frame member 661 (e.g., due to manufacturing tolerances) can be accommodated by varying the distance between the interior surface of cover 660 and surface 665 of frame member 661. In some cases, adhesive 663 can be deposited on cover 660 and / or in recessed area 664 in a flowable state, and cover 660 and frame member 661 are attached together using a clamp that establishes a target relative position of cover 660 to frame member 661. Thus, adhesive 663 can flow to fill and accommodate any gaps that are created when cover 660 and frame member 661 are positioned as desired.

[0267] Fig.6D An exemplary cover and frame member configuration is shown wherein the frame member defines two flange portions that contact the cover and define two sides or walls of a slot for receiving and containing adhesive. Specifically, Fig.6DA cover 670 (which may be the same as or similar to cover 604) and a frame member 671 are shown. Frame member 671 defines a recessed area 675 (which defines a bonding surface) defined by a first flange portion 673 and a second flange portion 674. First flange portion 673 and second flange portion 674 define a groove or channel that retains adhesive 672. By using a Fig.6D The two flange portions shown can prevent or inhibit the adhesive from overflowing or flowing out of the recessed area and can provide improved bonding between the adhesive 672 and the cover 670 and the frame member 671. In some cases, the use of two flange portions can allow the use of a lower viscosity adhesive due to the additional containment / holding capacity of the groove. In addition, the use of two flange portions can increase the contact surface area between the cover 670 and the frame member 671, which can reduce stress concentration between the frame member 671 and the cover 670 and / or provide other structural advantages.

[0268] Fig. 6E An exemplary cover and frame member configuration is shown in which a ramp structure is used along the bottom surface of the front cover to deflect a portion of the display stack downward (e.g., away from the front cover) to help prevent or reduce the risk of contact between the display stack and the frame member. For example, Fig. 6E A front cover 681 is shown (which may be the same as or similar to cover 604 ) to which a frame member 682 may be attached (as described above). A display stack 687 may be attached to cover 604 via a transparent adhesive 686 .

[0269] The ramp structure 683 can be positioned between the bottom surface of the front cover 681 and the display stack 687, and more specifically, between the front cover 681 and the ring 684 of the display stack (which can be at least partially defined by the flexible circuit element of the display stack 687). The ramp structure 683 is configured to deflect the ring 684 away from the front cover 681 (e.g., as shown in FIG. Fig. 6E684). The ramp structure 683 may have a curved or flat ramp surface (e.g., a surface that contacts the ring 684) and may have a maximum thickness between about 100 microns and about 200 microns. The maximum thickness of the ramp structure 683 may be equal to the reduction in the thickness of the adhesive 686 that adheres the display stack 687 to the front cover 681. For example, if the adhesive 686 is reduced by about 150 microns (and the dimensions of the frame member and the front cover remain the same), a ramp structure (having a maximum thickness of about 150 microns (e.g., the same amount as the amount by which the adhesive thickness is reduced)) may be used to deflect the ring so as to keep the distance between the ring and the frame member the same or similar (e.g., the same distance as would exist with a thicker adhesive and without the ramp structure). Thus, the ramp structure 683 may facilitate the use of a thinner adhesive, resulting in a thinner device and / or more space within the device for other components (e.g., a larger battery).

[0270] Ramp structures, such as ramp structure 683, may be formed from various materials and have various configurations. FIG. 6F to FIG. 6I Various exemplary ramp configurations are shown. Fig. 6F A front cover 681 is shown. The front cover 681 may have a mask layer 679 applied to the bottom surface, the chamfered edges of the front cover 681, and at least a portion of the side surfaces of the front cover 681. Fig. 6F 681, the ramp structure is defined by a thickened area of ​​adhesive 688, which is the same adhesive that attaches the display stack to the front cover 681. Adhesive 688 can be a multi-layer adhesive structure, such as a transparent polymer having adhesive on the top and bottom surfaces (which has thicker areas that define the ramp structure). In some cases, adhesive 688 can be a unitary structure, such as formed or molded to include, for example, Fig. 6F Epoxy, liquid or gel of the ramp structure shown. Additional adhesive layers can be used to attach the monolithic structure to the front cover and / or to attach the display stack to the monolithic structure.

[0271] Figure 6GAnother exemplary ramp structure 690 is shown. In this example, the ramp structure 690 can be formed by a stack of layers. The layers defining the ramp structure 690 can be formed by any suitable material, such as multiple layers of ink, adhesive film, dye, or other mask material (e.g., the same material as mask layer 679). In some cases, the ramp structure 690 is formed as part of a masking process in which the mask layer 679 is applied and then additional mask material layers are added to form the ramp structure 690. In some cases, the multi-layer mask structure is manufactured separately and then applied to the mask layer 679 (e.g., with an adhesive). Adhesive 689 (e.g., a clear adhesive, which can be the same or similar to adhesive 686) can be applied to the front cover 681 and the ramp structure 690, as shown. Figure 6G shown.

[0272] Figure 6H Another exemplary ramp structure 691 is shown. In this example, the ramp structure 691 can be formed by a folded structure. The folded structure defining the ramp structure 691 can be formed by any suitable material, such as an adhesive film, an ink layer, a dye, or other masking material (e.g., the same material as the mask layer 679). In some cases, the ramp structure 691 is formed as part of a masking process in which the mask layer 679 is applied and then additional layers of masking material are added to form the ramp structure 691. In some cases, a multi-layer masking structure is fabricated separately and then applied to the mask layer 679 (e.g., with an adhesive). An adhesive 689 (e.g., a clear adhesive, which can be the same or similar to adhesive 686) can be applied to the front cover 681 and the ramp structure 691, as shown in FIG. Figure 6H shown.

[0273] Fig.6I Another exemplary ramp structure 692 is shown. In this example, the ramp structure 692 can be formed by an integral ramp component attached to the front cover 681 (e.g., below the mask layer 679). The ramp component can be formed from any suitable material, such as a polymer, foam, etc. An adhesive (e.g., an adhesive film, a liquid or gel adhesive, etc.) can attach the ramp structure 692 to the front cover 681 (e.g., attached to the mask layer 679). Adhesive 689 (e.g., a clear adhesive, which can be the same or similar to adhesive 686) can be applied to the front cover 681 and the ramp structure 692, such as Fig.6IAs shown. In some cases, adhesive 686 does not extend over ramp structure 692. In such cases, a different adhesive layer can be applied to ramp structure 692 to secure the ring of the display stack to front cover 681. In other cases, an anti-adhesive coating can be applied to the surface of ramp structure 692 that contacts the display stack. For example, polyimide, polyethylene terephthalate, polytetrafluoroethylene, or other suitable polymer materials can adhere to the surface of ramp structure 692 that contacts the display stack and deflects the display stack.

[0274] As described above, a device as described herein may include one or more antenna groups including elements configured to communicate via 5G wireless protocols (including millimeter wave and / or 6 GHz communication signals). Figure 7 A portion of an electronic device 700 is shown, with components removed to better illustrate an exemplary antenna group for 5G wireless communications. 5G communications may be implemented using a variety of different communication protocols. For example, 5G communications may use a communication protocol that utilizes a frequency band below 6 GHz (also referred to as a sub-6 GHz spectrum). As another example, 5G communications may use a communication protocol that utilizes a frequency band above 24 GHz (also referred to as a millimeter wave spectrum). In addition, the specific frequency bands of any given 5G implementation may be different from other implementations. For example, different wireless communication providers may use different frequency bands in the millimeter wave spectrum (e.g., one provider may use a frequency of about 28 GHz to implement a 5G communication network, while another provider may use a frequency of about 39 GHz to implement). A specific antenna group implemented in a device as described herein may be configured to allow communication via one or more frequency bands in the frequency bands that implement 5G communications.

[0275] Figure 7 The device 700 in the embodiment includes at least two groups of antennas, each group of antennas is configured to operate using a different communication protocol to provide 5G communication. For example, the first antenna group includes multiple antennas that communicate via a sub-6 GHz spectrum, and the second antenna group includes multiple antennas that communicate via a millimeter wave spectrum.

[0276] As mentioned above, the housing member of equipment such as mobile phone can be suitable for use as antenna.In equipment 700, for example, housing 750 may include housing members 701, 703, 705, 707, 709 and 711.These housing members may be formed by metal or another conductive material, and may be electrically coupled to a communication circuit (as described in more detail herein) so that the part of the housing member may send and / or receive wireless communication.Housing members 701, 703, 705, 707, 709 and 711 may be coupled together with engaging elements 716, 718, 720, 722, 724 and 726 to form the housing member into a single structural housing component.For simplicity, engaging elements 716, 718, 720, 722, 724 and 726 are shown as independent parts, but some of the engaging elements may be continuous (for example, engaging elements 716 and 718 may be parts of continuous molded polymer structures).

[0277] The joining element can mechanically and / or structurally couple the shell members together and provide electrical isolation between adjacent shell members to facilitate the use of the shell members as radiating antennas. More specifically, relative to mechanical coupling, the joining element can be firmly attached to adjacent shell members (e.g., via mechanical interlocking between the joining element and the shell member and / or via an adhesive or chemical bonding between the joining element and the shell member). Relative to the electrical isolation function, the joining element can provide the necessary electrical isolation between the antenna and another conductive component (e.g., another conductive shell member that acts as an antenna or a non-radiating structural member) to reduce the attenuation of the antenna performance (e.g., due to capacitive coupling between the antenna and another conductive component). The joining element can be formed of or include a non-conductive material and / or a dielectric material, such as a polymer, fiber-reinforced nylon, epoxy resin, etc. Therefore, the joining element may be referred to as a non-conductive joining element in this article.

[0278] The engaging element can be formed by a molding process. For example, the housing member can be placed in a mold or otherwise maintained in a fixed position relative to each other so that the gap is defined between adjacent housing members. Then one or more polymer materials can be injected into the gap (and optionally engaged with a retaining structure and / or interlocking feature defined in the housing member) so that the polymer material at least partially fills the gap and is allowed to solidify or otherwise harden to form the engaging element. In some cases, the engaging element can be formed by a variety of different materials. For example, the inner portion of the engaging element can be formed by a first material (for example, a polymer material), and the outer portion of the engaging element (for example, the portion of the outer surface of the housing that it defines) can be formed by a second material different from the first material. These materials can have different properties, which can be selected based on the different functions of the inner and outer portions of the engaging element. For example, the inner element can be configured to form a main structure connection between the housing members, and can have a higher mechanical strength and / or toughness than the outer material. On the other hand, the outer material can be configured to have a specific appearance, surface finish, chemical resistance, waterproof function, etc., and its composition can be selected to give priority to those functions over mechanical strength. The engagement elements may be formed from fiber reinforced polymer, epoxy, or any other suitable material.

[0279] In device 700, at least three sections of the housing are adapted to function as antennas for communicating via the sub-6 GHz spectrum. More specifically, the housing member may be adapted to function as an antenna by conductively coupling a ground line and a feed line to specific locations on the housing member (which is conductive and may be formed of or include metal). The specific locations of the ground line and the feed line on the housing member may, in part, define the specific wavelength to which the antenna is tuned.

[0280] Device 700 includes an exemplary configuration of a first group of antennas for communicating via a sub-6 GHz spectrum. The first group of antennas includes a first sub-6 GHz antenna 702, a second sub-6 GHz antenna 704, a third sub-6 GHz antenna 706, and a fourth sub-6 GHz antenna 708. In this exemplary configuration, the first sub-6 GHz antenna 702, the second sub-6 GHz antenna 704, and the third sub-6 GHz antenna 706 are defined by sections of a housing member, while the fourth sub-6 GHz antenna 708 is a conductive trace (e.g., on a circuit board) or other radiating element positioned within the device. The four antennas of the first group of antennas can be configured to operate according to a 4x4 MIMO (multiple-input, multiple-output) scheme.

[0281] The antennas defined by the sections of the housing member may be similar to each other in structure and function. Therefore, to avoid redundancy, only the first sub-6 GHz antenna 702 will be described in detail. However, it should be understood that the description is also applicable to the second sub-6 GHz antenna 704 and the third sub-6 GHz antenna 706.

[0282] The first sub-6 GHz antenna 702 may be defined by a portion of the housing member 701, and more specifically, by a portion of the housing member 701 adjacent to the connecting element 716. In order to transmit and receive electromagnetic signals from the first sub-6 GHz antenna 702, a ground line and a feed line may be conductively coupled to the housing member 701. For example, the ground line may be conductively coupled to the location 712, and the feed line may be conductively coupled to the location 710.

[0283] The portion of the housing member 701 that serves as the first sub-6 GHz antenna 702 may define structural features 713 and 714. These features may extend from the inside of the housing member 701 and toward the interior volume of the device 700. The features 713, 714 may have several functions, including defining the physical mounting locations of the ground and feed wires, and defining interlocking features with which the material of the engagement element engages and / or is packaged together to form a structural coupling between the housing members. Although the features 713, 714 are not necessarily identical, they are not necessarily identical. Figure 7 716, it will be appreciated that in some cases, the material of the bonding element 716 contacts, engages, and / or at least partially encapsulates the feature 713 and / or the feature 714. Furthermore, while such features are only shown on housing members 701 and 707, other housing members may include similar features adjacent to the bonding element.

[0284] As described above, the second sub-6 GHz antenna 704 and the third sub-6 GHz antenna 706 may have the same or similar structure as the first sub-6 GHz antenna 702. In some cases, the first sub-6 GHz antenna, the second sub-6 GHz antenna, and the third sub-6 GHz antenna are each configured to communicate via different frequency bands. Therefore, the exact shape, length, or other physical features of each of these antennas may be different from each other.

[0285] As described above, the fourth sub-6 GHz antenna 708, which is part of the first set of antennas operating according to the 4x4 MIMO scheme, is a conductive trace or other radiating element positioned within the device. However, in some cases, a portion of the first housing member 701 adjacent to the engagement element 726 may be configured to act as a fourth sub-6 GHz antenna. In this case, the first housing member 701 may include structural features similar to the structural features of the first sub-6 GHz antenna 702 (e.g., features 713, 714), and the ground wire and feed wire may be similarly coupled to this area of ​​the first housing member 701 to facilitate the transmission and reception of electromagnetic signals.

[0286] Although sub-6 GHz antennas 702, 704, 706, and 708 can be used to communicate via the sub-6 GHz spectrum, the device 700 may also (or alternatively) include antennas for communicating via the millimeter wave spectrum. The device 700 may include, for example, a first millimeter wave antenna 730, a second millimeter wave antenna 732, and a third millimeter wave antenna 734. Compared with antennas of other spectrums, millimeter wave antennas may be more directional and more susceptible to attenuation due to occlusion. For example, with respect to attenuation, if a user places his or her hand on a millimeter wave antenna, communication via the antenna may suffer a stop or stop completely. With respect to orientation, if the millimeter wave antenna is pointed away from a cellular tower by more than a certain angle, the antenna may stop being able to communicate effectively with the cellular tower. In order to mitigate these effects, the device may include multiple millimeter wave antennas strategically positioned to enable wireless communication in multiple different locations, positions, orientations, etc. For example, in the device 700, the first millimeter wave antenna 730 may be configured as a front transmitting antenna (e.g., it mainly sends and receives electromagnetic signals in a direction perpendicular to the front surface of the device). The second millimeter wave antenna 732 may be configured as a rear-transmitting antenna (e.g., it primarily transmits and receives electromagnetic signals in a direction perpendicular to the rear surface of the device). The third millimeter wave antenna 734 may be configured as a side-transmitting antenna (e.g., it primarily transmits and receives electromagnetic signals in a direction perpendicular to the side surface of the device). It should be understood that a directional millimeter wave antenna need not be oriented directly toward another antenna in order to communicate, but may tolerate slight misalignment (e.g., + / - 15 degrees, + / - 30 degrees, or another value).

[0287] Fig. 8A Device 700 is shown, showing exemplary radiation patterns of millimeter wave antennas, and how these radiation patterns are oriented relative to device 700. For example, a first millimeter wave antenna 730 defines a first radiation pattern 803 extending through a front surface 809 of the mobile phone 700, a second millimeter wave antenna 732 defines a second radiation pattern 805 extending through a rear surface 813 of the mobile phone, and a third millimeter wave antenna 734 defines a third radiation pattern 804 extending through a side surface 811 of the mobile phone. As described above, the millimeter wave antennas can be directional antennas (or high gain antennas). Thus, the antenna gain of the millimeter wave antennas can be highest along a particular direction. For example, as Fig. 8AAs shown and corresponding to the shape and orientation of the radiation pattern (or lobe) of the millimeter wave antenna, the first antenna gain of the first millimeter wave antenna 730 is highest along the first main transmission direction 806 (e.g., perpendicular to the front surface 809), the second antenna gain of the second millimeter wave antenna 732 is highest along the second main transmission direction 808 (e.g., perpendicular to the rear surface 813), and the third antenna gain of the third millimeter wave antenna 734 is highest along the third main transmission direction (e.g., perpendicular to the side surface 811). In this case, the main transmission directions of the first millimeter wave antenna 730 and the second millimeter wave antenna 732 are orthogonal (or substantially orthogonal) to the third millimeter wave antenna 734. As described below with respect to FIG. 8B to FIG. 8D As described, the radiation pattern and its associated transmission direction can provide millimeter wave reception when the device is held or used in different orientations and / or under different conditions of use. Although the radiation pattern and / or antenna gain are described relative to the main transmission direction, it should be understood that the transmission direction does not only refer to transmission operations (e.g., sending information to another device, antenna, system, etc.), but can include and / or involve both transmission and reception operations. In addition, although Fig. 8A A single radiation pattern is shown for each of the first, second, and third millimeter wave antennas, but each of the millimeter wave antennas may include multiple antenna elements, each antenna element being associated with its own radiation pattern. Thus, for example, the third millimeter wave antenna 734 may include four antenna elements, each antenna element having a radiation pattern similar to the third radiation pattern 804 in size, shape, gain, and / or primary transmission direction.

[0288] FIG. 8B to FIG. 8D Shown are how millimeter wave antennas can be coordinated to provide millimeter wave communications in a variety of different use cases. Figure 8B The device 700 is shown in a face-up position on a table 802 (which is merely representative of the many surfaces on which the device 700 may be placed). In this case, the back-transmitting (or rear-transmitting) millimeter-wave antenna 732 faces the table surface and is therefore obscured by the table and is not oriented toward a cellular tower or other remote antenna. However, the front-transmitting millimeter-wave antenna 730 and the side-transmitting millimeter-wave antenna 734 may be unobstructed (at least not obstructed by the tabletop). In addition, because the front-transmitting antenna and the side-transmitting antenna are oriented in different directions (e.g., the front-transmitting antenna radiates approximately perpendicular to the table top, and the side-transmitting antenna radiates approximately parallel to the table top), there is a greater likelihood that at least one of these antennas will be sufficiently pointed toward a cellular tower or other remote antenna to enable wireless communication.

[0289] Figure 8CDevice 700 is shown held in the hand of a user in a vertical or "portrait" orientation (e.g., with the long axis of device 700 parallel to the height axis of the user). In this case, side-firing millimeter-wave antenna 734 is obscured by the user's hand and, thus, may be temporarily ineffective or otherwise insufficient. However, front-firing millimeter-wave antenna 730 and rear-firing millimeter-wave antenna 732 may be unobstructed (at least by the user's hand). In addition, because the front-firing and rear-firing antennas are oriented in different directions (e.g., the front-firing antenna generally radiates toward the user and may be over the user's shoulder and / or around their body, and the rear-firing antenna radiates away from the user), there is a greater likelihood that at least one of these antennas will be adequately directed toward a cellular tower or other remote antenna to enable wireless communication.

[0290] Fig.8D Device 700 is shown being held in the hand of a user in a "landscape" orientation (e.g., with the long axis of device 700 perpendicular to the user's height axis and / or parallel to the ground). In this case, rear-firing millimeter-wave antenna 732 may be obscured by the user's hand and, thus, may be rendered temporarily ineffective or otherwise insufficient. However, side-firing millimeter-wave antenna 734 and optional front-firing millimeter-wave antenna 730 may be unobstructed (at least by the user's hand). In addition, because the front-firing antenna and the side-firing antennas are oriented in different directions (e.g., the front-firing antenna generally faces toward the user and may radiate over the user's shoulder and / or around their body, and the side-firing antenna radiates away from the user), there is a greater likelihood that at least one of these antennas will be adequately directed toward a cellular tower or other remote antenna to enable wireless communication.

[0291] return Figure 7 , the second (back-strike) millimeter wave antenna 732 can be coupled to the logic board 736 (which can be an embodiment of the logic board 220, 320, 420, 520, or any other logic board described herein). In some cases, the second millimeter wave antenna 732 (which can be or can include a passive antenna board) is directly surface mounted to the logic board 736. The second millimeter wave antenna 732 may include antenna arrays for two different frequencies (e.g., 28 GHz and 39 GHz, but other frequencies are also possible). Each antenna array may include four antenna elements, and each antenna element may have two different polarizations. By including two different antenna arrays, rather than using the same antenna element for two different frequency bands, the second millimeter wave antenna 732 may have a greater total bandwidth than an antenna that uses the same antenna element to communicate on two (or more) frequency bands. The greater bandwidth of the second millimeter wave antenna 732 may allow for greater tolerance in the positioning of the antenna 732 in the device 700 while still providing adequate antenna performance.

[0292] The device 700 may also include antenna circuitry in a system-in-package (SiP) component 738. The SiP component 738, referred to herein as SiP 738, may include components such as one or more processors, memory, analog-to-digital converters, filters, amplifiers, power control circuits, etc. The SiP 738 may be coupled to the logic board 736 and may be positioned above the second millimeter wave antenna 732. The antenna elements in the second millimeter wave antenna 732 may be conductively coupled to the SiP 738 so that the SiP 738 may process signals received via the second millimeter wave antenna 732 and cause the second millimeter wave antenna 732 to transmit signals.

[0293] SiP 738 may also include antenna circuitry for other antennas. For example, first millimeter wave antenna 730 may be conductively coupled to SiP 738 via circuit board 740 (which may be a flexible circuit element having conductive traces or other suitable conductors or conductor groups).

[0294] Fig.9A For along Figure 7 9A-9A in FIG. 7A . The cross-sectional view shows example details of the third (side-firing) millimeter wave antenna 734 of the device 700. The side-firing antenna 734 (also referred to as an antenna module) is fixed to the interior of the housing 750 of the device 700 and is configured to transmit and receive electromagnetic signals through one or more openings 901 in the sidewalls of the housing 750. The openings 901 may extend through the sidewalls of the housing 750 and may at least partially define an antenna window for the side-firing antenna 734.

[0295] The side transmitting antenna 734 includes an antenna array 926 including a plurality of directional antenna elements. The antenna array 926 may include antenna elements for two different frequencies (e.g., 28 GHz and 39 GHz, but other frequencies are also possible). For example, two antenna elements may be provided for each frequency, and each antenna element may have two different polarizations. Of course, other configurations of the sidewalls are also possible. For example, the antenna array 926 may include four antenna elements for each frequency.

[0296] The side-transmitting antenna 734 may also include antenna circuitry in a SiP component 928. The SiP component 928 (referred to herein as SiP 928) may include components such as one or more processors, memory, analog-to-digital converters, filters, amplifiers, power control circuitry, etc. The SiP 928 may be conductively coupled to the logic board 736 (e.g., via a flexible circuit element 934, Fig. 9B ). The antenna elements in the antenna array 926 may be conductively coupled to the SiP 928 so that the SiP 928 may process signals received via the antenna array 926 and cause the antenna array 926 to transmit signals.

[0297] The spacer 930 may be positioned between the SiP component 928 and the bracket 932. The bracket 932 may secure the components of the side-firing antenna 734 to the housing 750, such as with respect to Fig. 9B shown and described in more detail.

[0298] The side wall of the housing 750 ( Fig. 9B 750) can be configured to act as a waveguide for guiding electromagnetic signals into and out of the antenna array 926. The waveguide can be defined by a channel or hole 921 through the side wall of the housing 750. The channel 921 can be defined in part by a wall 922 extending from the outer side surface of the side wall of the housing 750 to the inner surface of the housing 750. As shown, the wall 922 is angled so that the opening on the outer side surface is staggered from the opening on the inner surface of the housing. More specifically, the center of the opening in the outer side surface of the side wall can be vertically offset from the center of the opening in the inner side of the housing 750.

[0299] The vertical offset of the openings defines a substantially non-horizontally aligned channel (relative to Fig.9A 901 ), which allows the internal components of the side-transmitting antenna 734 to be offset from the central axis of the device 700 while also allowing the opening 901 in the exterior side surface to be vertically centered in the exterior side surface. For example, the height 908 of the housing 750 above the opening 901 can be the same as the height 910 of the housing 750 below the opening 901. By aligning the opening 901 with the middle of the side surface (e.g., in the middle of the vertical direction), the structural integrity (e.g., stiffness, strength, etc.) of the housing 750 can be higher than if the opening 901 were vertically offset from the center of the side surface (e.g., because the amount of housing material above the opening 901 will be different than the amount below, resulting in one side being weaker than the other). In addition, the central alignment of the opening 901 provides the device 700 with an overall symmetrical and balanced appearance.

[0300] The side-firing antenna 734 may include a cover element 920 (also referred to as an insert) within a portion of the channel 921. The insert 920 may be a plastic, glass, or other material (e.g., non-conductive material) insert and may be adhered to the antenna array 926 via an adhesive 924. Notably, there may be no air gap between the antenna array 926 and the insert 920. The ability to construct the side-firing antenna 734 without an air gap between the antenna array 926 and the insert 920 may be at least partially due to the specific materials and other characteristics of the adhesive 924 and the insert 920. The insert 920 may be placed into the channel 921, or it may be formed in place by, for example, injecting a polymer material into the channel 921 and allowing the polymer material to cure or otherwise harden.

[0301] The device 700 may also include a cover element 912 positioned in the channel 921 and defining a portion of the outer side surface of the device 700 (e.g., in conjunction with the outer side surface of the housing 750). The cover element 912 may be formed of glass, sapphire, glass ceramic, plastic, or any other suitable material (e.g., a non-conductive material). The thickness of the cover element 912 may be determined at least in part based on the material used and the effect of the material (and size) on the electromagnetic signal passing through the channel 921. For example, in order to achieve the same or similar electromagnetic performance, the thickness of the cover element 912 may be greater when it is formed of glass than when it is formed of sapphire. If the cover element 912 is formed of sapphire, a spacer layer (e.g., plastic, epoxy, or other suitable material) may be included between the cover element 912 and an adhesive (e.g., adhesive 924) that secures the cover to the device 700.

[0302] The cover element 912 may include a mask layer 914, which may be applied to the rear surface or the front surface of the cover element 912. As shown, the mask layer 914 is applied to the rear surface of the cover element 912. The mask layer 914 may be an ink, dye, film, paint, coating, or other material, and may be visible through the cover element 912. The mask layer 914 may be opaque. The mask layer 914 may also be a single layer, or it may include multiple sub-layers.

[0303] Cover element 912 may be secured to housing 750 via adhesive 916, and sealing material 918 may be positioned over the seam between insert 920 and the walls of channel 921. Adhesive 916 may also adhere cover element 912 to insert 920.

[0304] Sealing material 918 may be polyurethane or any other suitable sealing material and may be configured to prevent or limit the ingress of liquids (e.g., water, sweat, etc.) and / or other contaminants through the seams into device 700. Sealing material 918 may be applied as a continuous sheet to the surfaces of insert 920 and the housing surrounding insert 920. A middle portion of sealing material 918 may then be removed (e.g., by laser ablation or another suitable technique) to reveal the surface of insert 920 to which adhesive 916 may be applied. Adhesive 916 may be a film, a liquid, or any other suitable adhesive.

[0305] The channel 921 may include a recessed portion 923 that receives a portion of the sealing material 918. Specifically, the recessed portion 923 may be configured such that the seam between the insert 920 and the housing material is substantially flat or planar, thereby defining a flat surface on which the sealing material 918 is applied. The recessed portion 923 may be formed by machining using a T-slot drill bit.

[0306] Fig. 9B7 is an exploded view of the side-firing antenna 734 showing additional details of the configuration of the antenna 734 and its components and the antenna window formed in the side wall of the housing 750. As described above, the side-firing antenna 734 includes a cover element 912, a mask layer 914 (which can be applied to the cover), an adhesive 916, a sealing material 918, an additional cover element 920 (or insert), an adhesive 924, an antenna array 926, a SiP 928, a flexible circuit element 934 (coupled to the antenna array 926 and / or the SiP 928 via an electrical connector 940), a spacer 930, and a bracket 932.

[0307] In some cases, the housing includes a plurality of channels or holes 921 extending through the sidewall of the housing 750 and at least partially defining an antenna window for a side-firing antenna. As shown, the holes 921 can be formed along the bottom surface of the recessed area 925. For example, the cover element 912, the mask layer 914, the adhesive 916, and the sealing material 918 can be positioned within the recessed area 925.

[0308] Each channel or hole 921 may include its own insert 920 and may be associated with a single antenna element in the antenna array 926. More specifically, for each corresponding passage 921, the antenna array 926 may include a corresponding antenna element aligned with the passage. In this way, the channel acting as a waveguide for the antenna element can guide electromagnetic signals to and from each antenna element. The channel 921 may be separated from the adjacent channel by a rib 948. The rib 948 may be formed by removing material from the housing 750 to define the channel and the rib. Therefore, the rib 948 may be integral with the rest of the housing member in which the channel is formed (e.g., formed by the same material block as the rest of the housing member). In other cases, the rib may be a separate component attached to the housing 750. In some cases, the rib may be omitted, and a single hole or channel may be defined by a sidewall to facilitate antenna operation (e.g., transmitting and receiving electromagnetic signals through the sidewall of the housing 750).

[0309] The device 700 may also include a set of anchoring members 942. The anchoring members 942 may include alignment features (e.g., posts) configured to engage with corresponding alignment features (e.g., blind holes) in the housing 750. When engaged with the housing 750, the anchoring members 942 may provide surfaces and / or other features that guide or align components of the side-firing antenna 734 at a target location and / or position.

[0310] A ground path may be defined from the housing 750 to the electrical components of the side-firing antenna 734 (e.g., the antenna array 926 and the SiP 928) to provide an electrical ground to the side-firing antenna 734. For example, a fastener 936, which may be conductive, may be threaded into the housing 750, thereby conductively coupling the fastener 936 to the housing 750 (which may define an electrical ground plane for the device 700). The flexible circuit element 934 may include a grounding and attachment ear 938, which may include a hole through the flexible circuit element and a conductive material around or near the hole. The fastener 936 extends through the hole of the grounding and attachment ear 938 and contacts the conductive material of the grounding and attachment ear 938 when the fastener 936 is installed, thereby conductively coupling the conductive material of the grounding and attachment ear 938 (which may be conductively coupled to or otherwise define the electrical ground of the flexible circuit element 934) to the housing 750. In this way, a ground path may be established between the flexible circuit element 934 and the housing 750. The conductive material of the ground and attachment ears 938 may also contact one of the anchor members 942, which in turn is conductively coupled to the housing 750. Thus, a ground path from the flexible circuit element 934 to the housing may also be defined by or via the anchor members 942.

[0311] The fasteners 936 may be any suitable fasteners, such as screws, and may also hold in place the components of the side-firing antenna 734. More specifically, the bracket 932, held in place by the fasteners 936, may capture and hold the components of the antenna 734 between itself and the housing 750. The bracket 932 may also act as a heat sink or otherwise be used to spread and / or dissipate heat from the antenna components.

[0312] Fig. 10A is a partially exploded view of a first (front transmit) millimeter wave antenna 730 (also referred to as an antenna module). The front transmit antenna 730 may include four antenna elements 1002, 1004, 1006, and 1008. The antenna elements 1002, 1004, 1006, and 1008 may be directional antenna elements that define a radiation pattern having its highest gain along a primary transmission direction, such as relative to Fig. 8A The main transmission directions of antenna elements 1002, 1004, 1006 and 1008 may be parallel to each other and may extend through the front cover of the device (or any cover or wall of the device under which the antenna elements are located).

[0313] Antenna elements 1002, 1004, 1006, and 1008 may be formed of a dielectric material such as zirconium oxide (or another suitable ceramic or other material). In some cases, the antenna elements may be formed of a material having a dielectric constant (also referred to as a relative dielectric constant) greater than about 20. In some cases, the dielectric constant is between about 21 and about 24, or between about 27 and about 30. Where antenna elements 1002, 1004, 1006, and 1008 are ceramic, they may be referred to as ceramic posts.

[0314] The four directional antenna elements of the front transmitting antenna 730 may include two first directional antenna elements 1002, 1004 configured to operate at a first frequency band (e.g., 28 GHz), and two second directional antenna elements 1006, 1008 configured to operate at a second frequency band (e.g., 39 GHz). The size and shape of the antenna elements may define the resonant frequency or frequency band of the antenna elements. Thus, for example, the first antenna elements 1002, 1004 may have dimensions different from (e.g., larger than) the second antenna elements 1006, 1008 in the x- and y-dimensions, so that the first antenna elements and the second antenna elements have different resonant frequencies, thereby communicating at different frequency bands. In some cases, the x- and y-dimensions of the first antenna elements 1002, 1004 are about 1.1 mm×about 1.1 mm, and the x- and y-dimensions of the second antenna elements 1006, 1008 are about 0.8 mm×about 0.8 mm.

[0315] The antenna elements of the front transmit antenna 730 may include conductive contact pads, such as conductive contact pads 1012, 1014 on antenna element 1008. (Although not separately labeled, similar conductive contact pads may also be provided on other antenna elements 1002, 1004, and 1006.) The conductive contact pads may be configured to conductively couple the antenna element to other antenna circuits (e.g., via conductors in the circuit board 740). For example, the conductive contact pads may be soldered to the circuit board 740.

[0316] The conductive contact pads may be formed by metallizing the antenna element, such as by electroplating, metal deposition (e.g., plasma vapor deposition, chemical vapor deposition), or any other suitable technique. In some cases, a metal or conductive film is applied to the antenna element to form the conductive contact pads. In some cases, the height of the conductive contact pads in the z dimension may affect the tuning of the antenna element (e.g., the resonant frequency of the antenna element, the efficiency of the antenna element, etc.). In some cases, other dimensions (e.g., thickness, width) of the conductive contact pads may also be different between different antenna elements. Although only two conductive contact pads are visible on each antenna element, the invisible side of the antenna element may also include a conductive contact pad (e.g., opposite to the visible conductive contact pad). In some cases where four conductive contact pads are provided, only two conductive contact pads (e.g., two non-parallel contact pads) are used to conductively couple the antenna element to other antenna circuits.

[0317] Each antenna element may have two polarizations, with the conductive contact pads providing signals to and from the antenna element for different polarizations. For example, the first conductive contact pad 1012 may be configured to excite the second antenna element 1008 according to a first polarization, while the second conductive contact pad 1014 may be configured to excite the second antenna element 1008 according to a second polarization (e.g., orthogonal to the first polarization). This configuration may allow each antenna element to simultaneously transmit and / or receive two separate electromagnetic signals.

[0318] As described above, the first antenna elements 1002, 1004 may operate at a different frequency than the second antenna elements 1006, 1008. Using multiple antenna elements for each frequency may facilitate techniques such as beamforming. To facilitate beamforming operations, antenna elements sharing the same frequency may be spaced a specific distance from each other. For example, the first antenna elements 1002, 1004 may be spaced a distance 1005, and the second antenna elements 1006, 1008 may be spaced a distance 1007, which may be different from the distance 1005 (e.g., less than or greater than the distance 1005). In some cases, the distance (e.g., gap) between the antenna elements is not uniform. The specific distance may be defined based at least in part on the frequency at which the antenna elements operate, the operating parameters of the wireless communication protocol, and the like.

[0319] Antenna elements 1002, 1004, 1006, and 1008 may be at least partially encapsulated or packaged in a cover structure 1010. Cover structure 1010 may be a molded polymer material (e.g., a fiber reinforced polymer), and the cover structure may provide structural support for the antenna elements. Cover structure 1010 may be molded around the antenna elements after the antenna elements are attached to circuit board 740, or the cover structure may be formed separately and then attached to circuit board 740 (before or after the antenna elements are connected to circuit board 740). In some cases, cover structure 1010 contacts substantially all surfaces of the antenna elements. In some cases, cover structure 1010 defines air gaps between adjacent antenna elements, such as by defining one or more cavities within cover structure 1010. Fig. 10C An exemplary front transmitting antenna is shown having a cover structure 1010 that defines air gaps between adjacent antenna elements.

[0320] Fig. 10B Another example of a front transmitting antenna 1020 is shown. In this example, instead of metalizing the antenna element to create conductive contact pads, conductive contacts 1026 may be attached to a circuit substrate 1028 (which may be similar to circuit board 740 and may be a flexible circuit element having conductive traces or other suitable conductors or conductor groups). Antenna element 1024, which may not contain conductive contact pads but is otherwise similar to antenna elements 1002, 1004, 1006, and 1008, may be coupled to circuit substrate 1028 after conductive contacts 1026 are attached to circuit substrate 1028. Conductive contacts 1026 may be attached to circuit substrate 1028 before antenna element 1024 is attached to circuit substrate 1028 and before cover structure 1022 (which may be similar to cover structure 1010) is attached or formed around antenna element 1024. Alternatively, the conductive contacts 1026 may be integral with the cover structure 1022 (e.g., by insert molding the cover structure 1022 around the conductive contacts 1026 to at least partially encapsulate the conductive contacts 1026), and then the cover structure 1022 with the conductive contacts 1026 may be attached to the circuit substrate 1028. The conductive contacts 1026 may have different sizes, and these sizes may at least partially define or affect the tuning of the antenna element. For example, the height of the conductive contact 1026 in the z dimension (e.g., the height of the portion of the conductive contact 1026 that contacts the side of the antenna element) may affect the tuning of the antenna element (e.g., the resonant frequency of the antenna element, the efficiency of the antenna element, etc.). Therefore, the conductive contacts 1026 on the antenna element configured to operate at one frequency may have different sizes than the conductive contacts on the antenna element configured to operate at a different frequency. In some cases, other dimensions (e.g., thickness, width) of the conductive contacts 1026 may also be different between different antenna elements.

[0321] Fig. 10C 1037 is a partially exploded view of another exemplary (front transmitting) millimeter wave antenna 1037. The front transmitting antenna 1037 may include an antenna element 1034 (which may be an embodiment of other antenna elements described herein, such as antenna elements 1002, 1004, 1006, and 1008). The front transmitting antenna 1037 may also include a covering structure 1030, which may be similar in material and function to other covering structures described herein, such as covering structures 1010, 1022. The covering structure 1030 may define air gaps 1031 between adjacent antenna elements 1034. Since air has a lower dielectric constant than many materials (such as plastics that may form the covering structure 1030), the air gaps 1031 may help reduce the average or effective dielectric constant between the antenna elements. In some cases, the presence of the air gap 1031 and its size and shape may improve the operation of the antenna compared to a covering structure without the air gap. The air gap 1031 may also allow the spacing between antenna elements 1034 to be reduced compared to a solid cover structure, thereby allowing the overall size of the antenna 1037 to be smaller compared to other configurations.

[0322] Antenna 1037 may be formed by a molding process. For example, the antenna element subassembly may be formed by a process in which conductive contacts 1038 (which may be an embodiment of conductive contacts 1026) and antenna element 1034 are placed in a first mold such that conductive contacts 1038 contact antenna element 1034 at a target location and position (e.g., as shown in FIG. 1 ). Fig. 10A 10B). A first polymer material may then be introduced into the first mold to partially encapsulate the conductive contacts 1038 and at least partially surround the antenna element 1034. The first polymer material may be allowed to cure or otherwise harden to form a retaining structure 1036. The retaining structure may secure the conductive contacts 1038 in place and in contact with the antenna element 1034.

[0323] The antenna element subassembly may then be placed into a second mold along with the mounting tabs 1032, and a second polymer material (which may be different from the first polymer material and may be injected at a temperature below the melting or softening temperature of the first polymer material) may be injected into the second mold to form the cover structure 1030. The second polymer material may be allowed to cure or otherwise harden, thereby holding the antenna element subassembly together and in its intended orientation and position (e.g., with appropriate spacing between antenna elements 1034). The mounting tabs 1032 may be configured to engage screws or other fasteners to help hold the antenna 1037 in the desired position in the device.

[0324] like Fig. 10CAs shown, the retention structure 1036 can define an aperture 1039 extending through the retention structure 1036 and exposing the conductive contacts 1038. Fig. 10C 1039 , but each retaining structure 1036 may define one hole for each conductive contact 1038 that the retaining structure at least partially encloses. These holes may be caused by the application of tools during the first molding operation, which apply forces to the conductive contacts 1038 to maintain the conductive contacts 1038 in contact with the antenna element 1034 during the molding operation. After the first polymer material is introduced into the first mold (and optionally after curing and / or hardening the first polymer material), the tools can be removed to reveal the holes 1039. These holes can be used to inspect the antenna element subassembly. For example, a measurement tool (e.g., a laser) can be directed through the holes onto the conductive contacts 1038 and onto the exposed surface of the antenna element 1034 to determine the position difference. If the position difference of a given conductive member is greater than the thickness of the conductive member, it can be assumed that there is an air gap between the conductive member and the surface of the antenna element 1034 that the conductive member is intended to contact. If the position difference is too large (e.g., if there may be an air gap), the antenna element subassembly may be rejected.

[0325] Fig. 10D is a side view of antenna 1037. Fig. 10D As shown, the width of the air gap 1031 is non-uniform, and the size of the air gap can be selected based on the effect of the air gap on antenna performance, tuning, and / or other characteristics. For example, because the dielectric properties of the material between the antenna elements can affect the operation of the antenna, the size of the air gap 1031 can be selected to produce a desired dielectric property (e.g., average or effective dielectric constant) between the antenna elements.

[0326] Fig. 10E A bottom view of antenna 1037 is shown. Fig. 10E As shown, retention structure 1036 extends around antenna element 1034 and holds conductive contacts 1038 in place against antenna element 1034. Additionally, conductive contacts 1038 are exposed along the bottom of antenna 1037 so that they can be conductively coupled to another component, such as circuit substrate 1028.

[0327] Other techniques can also be used to produce millimeter wave antennas, such as FIG. 10A to FIG. 10EThe techniques described herein. For example, a clamshell-like covering structure may be formed prior to inserting the antenna element. The antenna element (or antenna element subassembly) may then be introduced into position, and the clamshell-like covering structure may be closed to at least partially enclose the antenna element (or antenna element subassembly). As another example, the conductive contacts and covering structure (and optionally the retaining structure and mounting tabs) may be formed together as a covering structure subassembly (e.g., by insert molding), and the antenna element may then be introduced (e.g., press-fit) into an opening defined in the covering structure subassembly.

[0328] As described above, portions of a device's metal or conductive housing can be used as antenna elements to send and receive wireless signals. More specifically, portions of a device's metal or conductive housing can be used as radiating elements of an antenna. For example, Figure 7 An exemplary device 700 is shown that uses a metal housing member to define an antenna element for use in the sub-6 GHz spectrum. Figure 7 In addition to the sub-6 GHz antenna described above, the metal housing structure can also be used to define antenna elements for other frequencies and / or protocols. Fig.11 is a schematic diagram of a portion of a housing 1100 formed from a plurality of conductive housing components joined together using joining elements. Fig.11 Also schematically shown are exemplary connection points on the housing member at which feed lines and / or ground lines may be conductively coupled to the housing member to carry electromagnetic signals from the housing member to other antenna circuits (and from the antenna circuits to the housing member).

[0329] like Fig.11 As shown, housing 1100 may include a first housing member 1102 that defines a portion of a first side surface 1142 and a first corner surface 1150 and a portion of a second side surface 1144. First housing member 1102 is structurally coupled to second housing member 1104 via a first engagement element 1114. As described above, engagement elements such as engagement element 1114 may be formed of a polymer material (e.g., a fiber reinforced polymer) that may structurally engage the housing members while also providing sufficient electrical isolation between the housing members to allow the housing members to function as antenna elements.

[0330] The housing 1100 also includes a second housing member 1104 that defines a portion of a second side surface 1144 and is structurally coupled to a third housing member 1106 via a second engagement element 1116. The third housing member 1106 defines a portion of a second side surface 1144 and a second corner surface 1152.

[0331] Third housing member 1106 further defines a portion of third housing side surface 1146 and is structurally connected to fourth housing member 1108 via third joining element 1118. Fourth housing member 1108 further defines a portion of third side surface 1146, third corner surface 1154, and a portion of fourth side surface 1148.

[0332] The fourth housing member 1108 is coupled to the fifth housing member 1110 via the fourth joining element 1120. The fifth housing member 1110 defines a portion of the fourth side surface 1148 and is coupled to the sixth housing member 1112 via the fifth joining element 1122. The sixth housing member 1112 defines a portion of the fourth side surface 1148, a fourth corner surface 1156, and a portion of the first side surface 1142. The sixth housing member 1112 is structurally connected to the first housing member 1102 via the sixth joining element 1125.

[0333] Each of the engagement elements of the housing 1100 may define a portion of the exterior surface of the housing 1100. Thus, the exterior surface of the housing 1100 may be completely or substantially completely defined by the housing members and the engagement elements.

[0334] To operate as an antenna element, the housing member of housing 1100 can be conductively coupled to an antenna circuit, an electrical ground plane, etc. The specific location of the connection points on the housing member and the size and shape of the housing member can at least partially define the parameters of the antenna element. Exemplary antenna parameters can include resonant frequency, range, radiation pattern, efficiency, bandwidth, directivity, gain, etc.

[0335] Fig.11 Exemplary locations of connection points of the feed and ground wires to the housing members are shown. For example, the feed and ground wires may be conductively coupled to the first housing member 1102 at connection points 1124-1, 1124-2, thereby facilitating wireless communication via the first housing member 1102.

[0336] The feed line and the ground line may be conductively coupled to the second housing member 1104 at connection points 1128-1, 1128-2 and optionally at connection points 1126-1, 1126-2. The portion of the second housing member 1104 between or near the connection points 1126-1, 1126-2 may function as one antenna element, while the portion of the second housing member 1104 between or near the connection points 1128-1, 1128-2 may function as another independent antenna element (e.g., although defined by the same housing member 1102, the other antenna element may send and receive electromagnetic signals independently of the antenna element located between the connection points 1126-1, 1126-2). Although Fig.11Connection points 1126-1, 1126-2 are shown, but in some implementations such as Figure 7 These connection points may be omitted in the device 700 which uses conductive elements on the circuit board in that corner of the device as antenna elements rather than using housing components.

[0337] The feed and ground wires may be conductively coupled to the third housing member 1106 at connection points 1130-1, 1130-2, and conductively coupled to the fourth housing member 1108 at connection points 1132-1, 1132-2 and connection points 1134-1, 1134-2. The fourth housing member 1108 may define different antenna element configurations depending on which feed and ground wires are used at a given time. For example, in a first mode, connection points 1132-1, 1132-2 are used so that the fourth housing member 1108 is configured to communicate via a first communication protocol (or frequency), and in a second mode, connection points 1134-1, 1134-2 are used so that the fourth housing member 1108 is configured to communicate via a second communication protocol (of a frequency) different from the first communication protocol.

[0338] The feed line and the ground line can be conductively coupled to the fifth housing member 1110 at the connection points 1136-1, 1136-2 and at the connection points 1138-1, 1138-2. Similar to the configuration of the second housing member 1104, the portion of the fifth housing member 1110 located between or near the connection points 1136-1, 1136-2 can act as one antenna element, and the portion of the fifth housing member 1110 located between or near the connection points 1138-1, 1138-2 can act as another independent antenna element (for example, although defined by the same housing member 1110, the other antenna element can send and receive electromagnetic signals independently of the antenna element located between the connection points 1136-1, 1136-2). The feed line and the ground line can also be conductively coupled to the sixth housing member 1112 at the connection points 1140-1, 1140-2.

[0339] As described above, the housing components of the device housing described herein can be used to form multiple groups of antennas, where each group of antennas communicates via a different communication protocol or frequency band. For example, the housing may define multiple antennas in a first MIMO antenna array or group (e.g., for a 4G communication protocol) and multiple antennas in a second MIMO antenna array (e.g., for a 5G communication protocol). In one non-limiting exemplary configuration, the antenna elements defined by connection points 1124, 1130, 1132, 1134, and 1140 may be configured to operate as part of a first MIMO antenna array (e.g., for a 4G communication protocol), while the antenna elements defined by connection points 1126 (if provided), 1128, 1136, and 1138 may be configured to operate as part of a second MIMO antenna array (e.g., for a 5G communication protocol). For any given antenna group, it is not necessary that the antenna elements in the group are all housing components. For example, a second MIMO antenna array or group may use internal antennas (e.g., antennas 708, Figure 7 ) as one of the antennas in a 4×4 MIMO array.

[0340] As described above, the conductive housing components that can act as the radiating structure of the antenna or antenna system can be coupled together in structure via a bonding element. The bonding element can be formed of a polymer material or other dielectric material, and the bonding element can provide sufficient electrical isolation between the housing components to facilitate the use of the housing components as the radiating structure of the antenna. In some cases, the bonding element includes one, two or more molded elements that are molded into the gaps between the housing components and bonded to the housing components. Since the bonding element structurally holds the housing components together, it is preferred to perform a strong bond between the bonding element and the housing components. Therefore, the housing component may include or define a structure and / or feature portion to which the bonding element is bonded so as to hold the bonding element to the housing component, thereby holding the housing components together.

[0341] Fig. 12A An exemplary housing component 1200 is shown that includes features with which an engagement element may engage. Fig. 12A The portion of the housing member shown may correspond generally to Figure 7 Area 12A-12A in.

[0342] Housing member 1200 may be formed from or include a conductive material, such as stainless steel, aluminum, metal alloys, etc., and may be conductively coupled to antenna circuitry (e.g., via feed and / or ground lines, as described above) to serve as a radiating structure for the device. Fig. 12A The portion of the housing member 1200 shown may abut and / or engage the engagement element, such as Fig. 12B shown.

[0343] The housing member 1200 defines a first interlocking feature 1202 that extends inwardly (eg, toward the interior of the device) from a sidewall 1201 defined by the housing member 1200. The first interlocking feature 1202 may extend from an inner side 1205 of the housing member 1200, where the inner side 1205 is opposite the outer side 1203.

[0344] The sidewall 1201 can define an exterior surface of a device of which the housing member 1200 is a part. The first interlocking feature 1202 can define a first hole 1204 and one or more second holes 1206. When the engagement element is formed by injecting or otherwise molding a moldable material against the housing member 1200, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1202 and can flow into and optionally through the first hole 1204 and the second hole 1206. By at least partially encapsulating the interlocking feature 1202 and flowing into and / or through the first hole 1204 and the second hole 1206, the engagement element can be structurally interlocked with the housing member 1200, thereby securely retaining the engagement element to the housing member 1200.

[0345] The housing member 1200 may also define a second interlocking feature, such as a recessed portion 1210, which may be a recessed portion, a cavity, or other similar feature that is recessed relative to the end surface 1208 of the housing member 1200. The end surface 1208 of the housing member 1200 may be a portion of the housing member 1200 that extends closest to another housing member to which the housing member 1200 is coupled via an engagement element. The end surface 1208 may be offset from the end surface 1209 defined by the first interlocking feature 1202. More specifically, the end surface 1209 may be recessed relative to the end surface 1208 (e.g., in a direction perpendicular to the end surfaces 1208, 1209).

[0346] The recess 1210 may have a depth between about 100 microns and about 1000 microns, and may have a width between about 100 microns and about 400 microns (e.g., Fig. 12A ) and a length between about 750 microns and about 3000 microns (e.g., as shown in FIG. Fig. 12ADimensions from top to bottom shown). In some cases, the housing member 1200 may also define holes along the end surface 1208 and / or the end surface 1209. The holes may be formed on the end surfaces 1208 and / or 1209, and may also be formed on the surface of the recessed portion 1210. The hole may be a different structure from the recessed portion 1210. For example, the recessed portion 1210 may have a length dimension greater than about 1000 microns and a width dimension greater than about 100 microns, while the hole may have a length and / or width dimension less than about 10 microns. Similarly, the recessed portion 1210 may have a depth greater than about 100 microns, while the hole may have a depth less than about 10 microns. In some cases, the hole is formed by chemical etching, sandblasting, laser or plasma etching, etc. The material of the joining element may extend or flow into the hole during the formation of the joining element, and engage and / or interlock with the hole to fix the joining element to the housing member 1200. In some cases, the holes are formed after the recess 1210 is formed, so that the holes exist on the surface of the recess 1210. In other cases, the holes are formed before the recess 1210 is formed, so that the surface of the recess 1210 does not contain holes, or has a different surface morphology and / or topography than the end surface on which the holes are formed (for example, the end surface 1208 may have holes by chemical etching, while the recess 1210 may have machine marks of a machining process). In some cases, the maximum dimension of the hole (for example, length, width, depth) is at least one order of magnitude smaller than the maximum dimension of the recess 1210 (for example, length, width, depth).

[0347] The housing member 1200 may define a flange portion 1207 that is adjacent to and / or extends along a peripheral side of a top module (which may include a cover member, a display, a touch sensing component, etc.). In some cases, a second interlocking feature 1210 (e.g., a recess, as shown) is positioned in the flange portion 1207 to strengthen the portion of the joint along the side of the top module. More specifically, the flange portion 1207 may define a cantilever that extends away from the first interlocking feature 1202, and the second interlocking feature 1210 may provide a supplemental interlocking engagement with a joining element to help prevent or limit the flange portion 1207 from interlocking with the joining element (e.g., Fig. 12B The flange may be moved in a certain direction (e.g., Fig. 12A In some embodiments, the second interlocking feature 1210 may be an elongated recess or channel having a longitudinal axis extending parallel to the outer side surface of the shell member (e.g., along the same direction as the flange extending from the first interlocking feature 1202).

[0348] When the moldable material flows into place (e.g., between the shell member 1200 and another shell member) to form the joint element, the moldable material can flow into the recess 1210 and at least partially fill the recess 1210, thereby forming a corresponding protrusion in the moldable material. When the moldable material is subsequently cured or otherwise hardened, the protrusion and recess 1210 of the joint element interlock with each other. The interlocking between the recess 1210 and the protrusion can help prevent the separation of the joint element and the shell member 1200. In addition, the position of the recess 1210 relative to the external surface defined by the sidewall 1201 can help improve the structural rigidity of the joint, and help maintain the alignment (and mechanical coupling) between the shell member 1200, the joint element and the adjacent shell member in the case of a fall or other impact event. For example, although the first interlocking feature 1202 can provide basic structural strength to the interface between the joint element and the shell member 1200, its position is more inward (e.g., relatively closer to the internal volume of the shell) than the recess 1210. In contrast, a more outwardly positioned recess 1210 (eg, relatively closer to the exterior surface of the housing member 1200) may improve the strength and stability of the alignment between the exterior surface of the housing member and the engagement element.

[0349] Fig. 12B It is along Fig. 12A 12B-12B in FIG. 12A and 12B-12B in FIG. 12B are partial cross-sectional views of a housing member 1200 (joined to another housing member 1216 via a joining element 1212). The joining element 1212 may be positioned between and in contact with an end surface 1208 of the housing member 1200 and a corresponding end surface 1217 of the housing member 1216. The joining element 1212 may also extend into and interlock with a recess 1210 of the housing member 1200 and a recess 1214 defined by the housing member 1216. In addition to the mechanical interlock between the joining element 1212 and the recesses 1210, 1214 (and / or other retaining structures and / or interlocking features), the moldable material of the joining element 1212 may form a chemical bond or other adhesive bond with the material of the housing members 1200, 1216.

[0350] The outer surfaces of the joining element 1212 and the shell members 1200, 1216 may define a smooth, continuous outer surface 1213 of the shell. For example, any gaps, seams, or other interruptions along the outer surface 1213 of the shell between the joining element 1212 and the shell members 1200, 1216 may not be detectable via touch and / or the naked eye. For example, a fingernail sliding along the outer surface 1213 may not hook the seam between the joining element 1212 and the shell members 1200, 1216. In some cases, any gaps, seams, or other interruptions between the joining element 1212 and the shell members 1200, 1216 may be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in depth, length, offset, and / or other dimensions). The interlock between the engagement element 1212 and the recesses 1210, 1214 can help prevent or inhibit relative movement between the housing components 1200, 1216 and the engagement element 1212, such as when these components move in a vertical direction (eg, Fig. 12B Thus, the recesses 1210, 1214 can help maintain a substantially seamless texture and appearance between the engagement element 1212 and the housing members 1200, 1216.

[0351] Fig. 12C Another exemplary housing member 1220 is shown including a feature with which an engagement element may engage. The housing member 1220 may be formed from or include a conductive material, such as stainless steel, aluminum, a metal alloy, etc., and may be conductively coupled to an antenna circuit (e.g., via a feed and / or ground line, as described above) to act as a radiating structure of the device. Fig. 12C The portion of the housing member 1220 shown may abut and / or engage the engagement element, such as Fig.12D shown.

[0352] The housing member 1220 defines a first interlocking feature 1222 that extends inwardly (e.g., toward the interior of the device) from a sidewall 1221 defined by the housing member 1220. The first interlocking feature 1222 can extend from the inner side of the housing member 1220 (e.g., similar to the inner side 1205, Fig. 12A ), wherein the inner side is opposite to the outer side (e.g., similar to the outer side 1203, Fig. 12A ).

[0353] The sidewall 1221 can define an exterior surface of a device of which the housing member 1220 is a part. The first interlocking feature 1222 can define a first hole 1224 and one or more second holes 1226. When the engagement element is formed by injecting or otherwise molding a moldable material against the housing member 1220, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1222 and can flow into and optionally through the first hole 1224 and the second hole 1226. By at least partially encapsulating the interlocking feature 1222 and flowing into and / or through the first hole 1224 and the second hole 1226, the engagement element can be structurally interlocked with the housing member 1220, thereby securely retaining the engagement element to the housing member 1220.

[0354] The shell member 1220 may also define a protruding feature 1230, which may be a post, a pin, or have any other suitable shape or configuration that protrudes or extends from an end surface 1228 of the shell member 1220. The end surface 1228 of the shell member 1220 may be the portion of the shell member 1220 that extends closest to another shell member other than the protruding feature 1230, and the shell member 1220 is coupled to the other shell member via a joining element.

[0355] The protruding feature 1230 can be FIG. 12A to FIG. 12B 1220 and the recessed portion in the moldable material formed around the protruding feature 1230. For example, when the moldable material flows into place (e.g., between the shell member 1220 and another shell member) to form the joining element, the moldable material can flow around the protruding feature 1230 to at least partially encapsulate the protruding feature 1230. When the moldable material is subsequently cured or otherwise hardened, the protruding feature 1230 and the recessed portion in the moldable material formed around the protruding feature 1230 interlock with each other. The interlock between the protruding feature 1230 and the moldable material can help prevent separation of the joining element and the shell member 1220. In addition, the position of the protruding feature 1230 relative to the exterior surface defined by the sidewall 1221 can help improve the structural rigidity of the joint and help maintain the alignment (and mechanical coupling) between the shell member 1220, the joining element, and the adjacent shell member in the event of a drop or other impact event. For example, while the first interlocking feature 1222 can provide basic structural strength to the interface between the engagement element and the housing member 1220, it is located further inward (e.g., relatively closer to the interior volume of the housing) than the protruding feature 1230. In contrast, the protruding feature 1230 located further outward (e.g., relatively closer to the exterior surface of the housing member 1220) can improve the strength and stability of the alignment between the exterior surface of the housing member and the engagement element.

[0356] In some cases, the housing member 1220 may also define holes along the end surface 1228 and / or the end surface 1229. The holes may be formed on the end surfaces 1228 and / or 1229, and may also be formed on the surface of the protruding feature 1230. The holes may be a different structure from the protruding feature 1230. For example, the protruding feature 1230 protrudes a distance greater than about 100 microns and may have a length and width dimension greater than about 100 microns, while the hole may have a depth, length and / or width dimension less than about 10 microns. In some cases, the hole is formed by chemical etching, sandblasting, laser or plasma etching, etc. The material of the joining element may extend or flow into the hole during the formation of the joining element, and engage and / or interlock with the hole to fix the joining element to the housing member 1220. In some cases, the hole is formed after the protruding feature 1230 is formed, so that the hole exists on the surface of the protruding feature 1230. In other cases, the surface of protruding feature 1230 is free of pores or has a different surface morphology and / or topography than the end surface on which the pores are formed. In some cases, the maximum dimension (e.g., length, width, depth) of the pores is at least one order of magnitude smaller than the maximum dimension (e.g., length, width, depth) of protruding feature 1230.

[0357] Fig.12D It is along Fig. 12C 12D-12D in FIG. 12A-12D of FIG. 12B , a partial cross-sectional view of housing member 1220 (joined to another housing member 1225 via joining element 1232). Joining element 1232 may be positioned between and in contact with housing members 1220, 1225. Joining element 1232 may also at least partially (and optionally completely) encapsulate protruding feature 1230. As shown in FIG. Fig.12D As can be seen in , the protruding feature 1230 can extend and / or be adjacent to two offset surfaces. For example, relative to the shell member 1220, the two offset surfaces include the end surface 1228 and the additional end surface 1229. The protruding feature 1230 can extend a first distance from the end surface 1228 and a second (greater) distance from the additional end surface 1229. A similar structure can be used on the shell member 1225 (e.g., a protruding feature 1236 extending a first distance from the end surface 1238 and a second (greater) distance from the additional surface 1234). Thus, as Fig.12DAs shown, end surfaces 1228, 1238 can be closer together than additional end surfaces 1229, 1234 (and the ends of protruding features 1230, 1236 can be the portions of shell members 1220, 1225 that are closest together). In addition to the mechanical interlock between engagement element 1232 and protruding features 1230, 1236 (and any other retaining structures and / or interlocking features), the moldable material of engagement element 1232 can form a chemical bond or other adhesive bond with the material of shell members 1220, 1225.

[0358] The outer surfaces of the engaging element 1232 and the shell members 1220, 1225 may define a smooth, continuous outer surface 1223 of the shell. For example, any gaps, seams, or other interruptions along the outer surface 1223 of the shell between the engaging element 1232 and the shell members 1220, 1225 may not be detectable via touch and / or the naked eye. For example, a fingernail sliding along the outer surface 1223 may not hook the seam between the engaging element 1232 and the shell members 1220, 1225. In some cases, any gaps, seams, or other interruptions between the engaging element 1232 and the shell members 1220, 1225 may be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in depth, length, offset, and / or other dimensions). The interlock between the engagement element 1232 and the housing components 1220, 1225 can help prevent or inhibit relative movement between the housing components 1220, 1225 and the engagement element 1232, such as when these components move in a vertical direction (eg, Fig.12D Thus, the protruding features 1230, 1236 can help maintain a substantially seamless texture and appearance between the engagement element 1232 and the housing members 1220, 1225.

[0359] In some cases, different types of structures can be used to enhance or otherwise increase the strength and / or structural integrity of the coupling between the housing member and the engagement element. Fig.12E An exemplary cross-sectional view of a housing is shown, which includes a coupling element 1243 and a protruding feature 1244 (eg, FIG. 12C to FIG. 12D ) and defining a recessed portion 1249 (as shown FIG. 12A to FIG. 12B1241). The use of protruding features 1244 and recessed portions 1249 can help increase the average or overall distance between the closest portions of first shell member 1240 and second shell member 1241. In particular, because one or both of shell members 1240, 1241 can be used as radiating components of the antenna system, it may be desirable to increase the distance between shell members to reduce capacitive coupling or other electromagnetic effects caused by the proximity of two conductive components. By positioning the recessed portion opposite the protrusion, the structural benefits of the protrusion (and the recessed portion) can be achieved while also providing a greater distance between the closest surfaces of shell members 1240, 1241 (e.g., compared to a configuration with two protruding features).

[0360] Fig.12F A portion of an exemplary device 1251 is depicted, showing another exemplary configuration of housing components and engagement elements that can be used to structurally couple the housing components. For example, a first housing member 1250 can be coupled to a second housing member 1252 via an engagement element 1254. Similar to other engagement elements described herein, the engagement element 1254 can be formed by injecting or otherwise introducing a moldable material (e.g., a polymer material) into a gap between the first housing member 1250 and the second housing member 1252. The first housing member 1250 can define a first interlocking feature 1253 extending inwardly (e.g., toward the interior of the device) from a sidewall 1259 of the first housing member 1250, and the second housing member 1252 can define a second interlocking feature 1256 extending inwardly (e.g., toward the interior of the device) from a sidewall 1257 of the second housing member 1252. The engagement element 1254 encloses the first interlocking feature 1253 and the second interlocking feature 1256 that can be at least partially enclosed. For example, when the moldable material is injected or otherwise introduced into the gap between the first shell member 1250 and the second shell member 1252, the moldable material may at least partially encapsulate the first interlocking feature 1253 and the second interlocking feature 1256 (including flowing into any recesses or holes, and flowing around any protrusions defined by or on the first interlocking feature 1253 and the second interlocking feature 1256). In some cases, the moldable material (e.g., which forms the engagement element 1254) may cover the top surface of the first interlocking feature 1253 and the second interlocking feature 1256, so that the moldable material extends up to the interior surface of the sidewalls 1257, 1259.

[0361] After the moldable material cures or otherwise hardens to form the engagement element, the engagement element physically interlocks with the first and second interlocking features 1253, 1256, thereby securing the first and second housing members 1250, 1252 together.

[0362] like Fig.12F As shown, the first housing member 1250 defines a first end surface 1266, and the second housing member 1252 defines a second end surface 1264. The first end surface 1266 and the second end surface 1264 can be substantially parallel to each other and can be substantially perpendicular to the exterior surfaces of the sidewalls 1257, 1259. The first interlocking feature 1253 extending inwardly from the sidewall 1259 (e.g., generally toward the interior of the device) can define a first angled surface 1260. The angled surface 1260 can be generally angled away from the gap between the first housing member 1250 and the second housing member 1252. The second interlocking feature 1256 can define a second angled surface 1262, which can extend generally toward the gap between the first housing member 1250 and the second housing member 1252. Therefore, the first angled surface 1260 and the second angled surface 1262 can be non-parallel to the first end surface 1266 and the second end surface 1264. Additionally, the first angled surface 1260 and the second angled surface 1262 may be continuous with the first end surface 1266 and the second end surface 1264. The first end surface 1266 and the second end surface 1264 and the angled surfaces 1260, 1262 may define a passage between the first shell member 1250 and the second shell member 1252, and the engagement element 1254 may at least partially (and optionally completely) fill the passage defined by the first end surface 1266 and the second end surface 1264 and the angled surfaces 1260, 1262.

[0363] The angled configuration of the first interlocking feature 1253 and the second interlocking feature 1256 allows the structural components within the device to be repositioned to make room for other components. For example, by angling the second interlocking feature 1256 to the right (e.g., Fig.12F ), additional space can be provided for another component 1299 (e.g., a logic board, a processor, etc.) to the left of the second interlocking feature 1256. Thus, the other component 1299 can be positioned closer to the side wall 1257 (and further to the right) than if the second interlocking feature 1256 extends vertically from the housing member 1252.

[0364] The first angled surface 1260 and the second angled surface 1262 can also improve the strength, stiffness or other structural characteristics of the interlock between the first shell member 1250 and the second shell member 1252 by providing a more complex geometry with which the engagement element ultimately engages and interlocks. In addition, because the first angled surface 1260 and the second angled surface 1262 extend at similar (or identical) angles (e.g., relative to the end surfaces 1266, 1264), a greater distance can be maintained between the first shell member 1250 and the second shell member 1252 (compared to angled surfaces that are angled toward each other or have a greater angle difference relative to the end surfaces). In other words, the substantially parallel angled surfaces 1260, 1262 can improve the strength and / or stability of the shell structure without reducing the minimum distance between the shell members. Because bringing the shell elements closer together can increase the capacitive coupling between the shell members, and thus can adversely affect the antenna performance, a larger distance between the shell components may be advantageous. The angled surfaces of the interlocking feature can thus achieve improved strength while maintaining sufficient antenna performance.

[0365] Figure 12G Another portion of an exemplary device 1251 is depicted, showing another exemplary configuration of housing components and engagement elements that can be used to structurally couple the housing components. For example, a first housing member 1250 can be coupled to a third housing member 1280 via an engagement element 1270. Similar to other engagement elements described herein, the engagement element 1270 can be formed by injecting or otherwise introducing a moldable material (e.g., a polymer material) into a gap between the first housing member 1250 and the third housing member 1280. The first housing member 1250 can define a first interlocking feature 1271 extending inwardly (e.g., toward the interior of the device) from a sidewall 1259 of the first housing member 1250, and the third housing member 1280 can define a second interlocking feature 1272 extending inwardly (e.g., toward the interior of the device) from a sidewall 1281 of the third housing member 1280. The engagement element 1270 encloses the first interlocking feature 1271 and the second interlocking feature 1272 that can be at least partially enclosed. For example, when the moldable material is injected or otherwise introduced into the gap between the first housing member 1250 and the third housing member 1280, the moldable material may at least partially encapsulate the first interlocking feature 1271 and the second interlocking feature 1272 (including flowing into any recesses or holes, and flowing around any protrusions defined by or on the first interlocking feature 1271 and the second interlocking feature 1272). In some cases, the moldable material (e.g., which forms the engagement element 1270) may cover the top surfaces of the first interlocking feature 1271 and the second interlocking feature 1272, such that the moldable material extends up to the interior surfaces of the sidewalls 1259, 1281.

[0366] Similar to Fig.12F In the configuration shown, the first housing member 1250 can define a first end surface 1278, and the third housing member 1280 can define a second end surface 1279, wherein these end surfaces define a gap between the first housing member and the third housing member. The first end surface 1278 and the second end surface 1279 can be substantially parallel to each other and can be substantially perpendicular to the exterior surfaces of the side walls 1259, 1281. The first interlocking feature 1271 extending inwardly from the side wall 1259 (e.g., generally toward the interior of the device) can define a first angled surface 1276. The angled surface 1276 can be generally angled away from the gap between the first housing member 1250 and the third housing member 1280. The second interlocking feature 1272 can define a second angled surface 1277, which can extend generally toward the gap between the first housing member 1250 and the third housing member 1280. Thus, the first angled surface 1276 and the second angled surface 1277 may not be parallel to the first end surface 1278 and the second end surface 1279. Additionally, the first angled surface 1276 and the second angled surface 1277 may be continuous with the first end surface 1278 and the second end surface 1279. The first end surface 1278 and the second end surface 1279 and the angled surfaces 1276, 1277 may define a passage between the first shell member 1250 and the third shell member 1280, and the engagement element 1270 may at least partially (and optionally completely) fill the passage defined by the first end surface 1278 and the second end surface 1279 and the angled surfaces 1276, 1277.

[0367] The first and second interlocking features 1271, 1272 may also include tabs 1273, 1274 that may remain exposed or otherwise accessible through the engagement element 1270 even after the interlocking features are at least partially enclosed by the engagement element 1270. Electronic components such as antenna circuits may be conductively coupled to the housing members 1250, 1280 (the housing members may be conductive) such that the housing members 1250, 1280 may operate as radiating members of an antenna system.

[0368] The angled configuration of the first interlocking feature 1271 and the second interlocking feature 1272 allows structural components within the device to be repositioned to make room for other components. For example, by angling the second interlocking feature 1272 upward (e.g., Figure 12G As shown), additional space can be provided for another component (e.g., a camera module) below the second interlocking feature 1272. For example, Figure 12GAn exemplary frame member 1283 to which a camera module may be attached is shown. The upward angle of the second interlocking feature 1272 provides a space in which the shoulder region of the frame member 1283 may be positioned. Figure 12G The orientation shown), the frame member 1283 would have to be positioned in the lower portion of the device, which could result in wasted space. Therefore, by configuring the first interlocking feature 1271 and the second interlocking feature 1272 to have angled surfaces (and more generally, to protrude from the sidewall at a non-perpendicular angle), other components can be positioned in desired locations and there can be greater flexibility in where other components can be positioned within the housing.

[0369] As described above, interlocking features (such as first interlocking feature 1271 and second interlocking feature 1272) can be used to facilitate conductive coupling between the conductive housing member and the antenna circuit. Figure 12G As described above, the antenna circuit may be conductively coupled to the housing members 1250 , 1280 via the lugs 1273 , 1274 (the lugs may be or may include threaded holes). Fig.12H A portion of a device 1251 is shown, illustrating how an antenna circuit may be conductively coupled to the tabs 1273, 1274, and in particular, how a flexible circuit element may be conductively coupled to the tabs 1273, 1274 despite the complex geometry and small available space at the corners of the device. Fig.12H The housing of device 1251 is shown without the engagement elements in place.

[0370] like Fig.12HAs shown, the antenna connection assembly 1290 can be used to conductively couple the housing members 1250, 1280 to the antenna circuit. The antenna connection assembly 1290 may include a flexible circuit element 1284 and a connector assembly 1289. The connector assembly 1289 may include conductors 1286, 1285 at least partially encapsulated in a polymer frame. For example, the conductors 1286, 1285 can be insert molded with the polymer material of the frame to form the connector assembly 1289. The connector assembly 1289 can be structurally and conductively coupled to the first interlocking feature 1271 and the second interlocking feature 1272 via conductive fasteners 1287, 1288 (e.g., screws, bolts, threaded fasteners, posts, rivets, welds, solder, etc.). The conductive fasteners 1287, 1288 can be conductively coupled to the conductors 1286, 1285, which in turn are conductively coupled (e.g., soldered) to the conductive traces of the flexible circuit element 1284. The conductive traces of the flexible circuit element 1284 may also be conductively coupled to the antenna circuit of the device. Thus, a conductive path may be defined from the interlocking features 1271, 1272, through the conductors 1286, 1285 in the connector assembly 1289, and through the flexible circuit element 1284, to the antenna circuit elsewhere in the device. The connector assembly 1289 may be configured such that the lugs 1273, 1274 are conductively coupled to the flexible circuit, which are located on top of the interlocking features and in a plane generally perpendicular to the sidewalls of the device, and the flexible circuit is generally flat and located in a plane parallel to the sidewalls of the device (and slotted into the narrow gap between the frame member 1283 and the housing member 1280). Without the connector assembly, interconnecting the flexible circuit element with the lugs may require bending the flexible circuit into a different plane, which may stress the flexible circuit and may damage the flexible circuit. In addition, there may not be room in the device to accommodate the required bend radius to facilitate bending or flexing the flexible circuit element. Thus, connector assembly 1289 can facilitate connections between components that are located in or along a vertical plane (or otherwise facing different directions).

[0371] The devices described herein include touch-sensitive displays, also referred to as touch screen displays. In such cases, the display components and touch sensor components may be layered or otherwise integrated to form an assembly that may be positioned beneath a transparent cover. In order to facilitate the display and touch sensing functions, electrical signals must be transferred to and from the display and touch sensing layers to other components, such as processors and other circuits (whose size and / or shape may not be suitable for fitting into the layered structure of the display stack). Therefore, flexible circuit elements having flexible conductive traces or other conductors may be used to interconnect the layers of the display stack with the processor and other circuits. Fig.13A and 13BAn exemplary configuration of a flexible circuit element for interconnecting layers in a display stackup is shown. Fig. 13C An exemplary integration of a display stackup (which may include touch sensor components) in a device is shown.

[0372] For example, Fig.13A A cover 1300 (which may be an embodiment of cover 102, 202, 302, 402, 502, or any other cover described herein) and a display stack 1302 are shown. Display stack 1302 may include display layers (e.g., LED layers, OLED layers, electrode layers, polarizers, etc.) and touch sensor layers (e.g., capacitive electrode layers, spacers, etc.). Display stack 1302 may define a recessed area 1304 that may define an area for positioning an input / output device so that display stack 1302 does not cover or otherwise interfere with the input / output device.

[0373] Because the display stackup 1302 includes a display layer and a touch sensor layer that need to be interconnected with other circuits, each set of layers includes a flexible circuit element extending from a side of the display stackup 1302. Specifically, the display layer may include or be coupled to a flexible circuit element 1306 extending from a first side (e.g., a short side) of the display stackup 1302, and the touch sensor layer may include a flexible circuit element 1308 extending from a second side (e.g., a long side) of the display stackup 1302. By having the two flexible circuit elements 1306, 1308 extend from different sides of the display stackup 1302, the overall size of the display stackup 1302 may be reduced relative to having the two flexible circuit elements 1306, 1308 extend from the same side of the display stackup 1302. For example, if the two flexible circuit elements extend from the same side (e.g., a short side), one element may have to wrap around over the other element, thereby extending the size of the display stackup 1302 along that side. Additionally, the flexible circuit elements may need to be physically spaced apart from each other, requiring the outer ring to be separated from the inner ring by an air gap or other space, which may further increase the size of the display stackup 1302 along that side.

[0374] Although the display stackup 1302 includes a touch sensor layer on a different substrate than the display layer (e.g., thereby requiring different flexible circuit elements to be conductively coupled to the different layers), Fig. 13BThe display stack 1312 may have an integrated (on-cell) touch sensing system. For example, an electrode array integrated into an OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functionality. The electrodes may be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along an exterior surface of the cover 1310. Thus, instead of providing separate flexible circuit elements extending from different sides of the display stack, the display stack 1312 may include a shared flexible circuit element 1316 that includes conductive traces for both display and touch sensing functionality (in some cases, some or all of the conductive traces may be used for both display and touch sensing functionality).

[0375] Fig. 13C A partial cross-sectional view of device 1320 is shown. Device 1320 may include housing member 1324, rear cover 1326, and cover 1322, which is coupled to frame member 1328. Device 1320, housing member 1324, cover 1322, rear cover 1326, and frame member 1328 may be embodiments of or otherwise correspond to other examples of these devices and components described herein. Details of these devices and / or components may also apply to Fig. 13C The devices and / or components shown and for the sake of brevity will not be repeated here.

[0376] Device 1320 includes display stack 1330 coupled to cover 1322 via adhesive stack 1334. Display stack 1330 can be attached to cover 1322 before cover 1322 is attached to frame member 1328. In some cases, frame member 1328 can bend or otherwise deflect during the assembly process so that annular region 1352 of display stack 1330 can pass through frame member 1328 (e.g., flange portion, such as flange portion 629, Fig. 6A) without contacting the frame member 1328. The frame member 1328 can be manually deflected by a tool, and the frame member is allowed to return to an undeflected state after the cover 1322 is secured to the frame member 1328 via an adhesive, as described herein. The frame member 1328 can be configured so that the deflection of the frame member 1328 during assembly is less than the elastic limit of the frame member 1328. The frame member 1328 can be metal (e.g., stainless steel, aluminum, or another suitable metal). The frame member 1328 can be a continuous, generally rectangular metal ring extending around the perimeter of the display stack 1330. In some cases, the continuous ring includes a polymer member or segment that is structurally coupled to one or more metal members. For example, the frame member 1328 may include a metal member that defines a first portion of the generally rectangular ring (e.g., at least a portion of each of the three sides of the rectangle), and a polymer member that is structurally coupled to the ends of the metal member and defines the remainder of the generally rectangular ring.

[0377] The display stack 1330 may include a display element 1333 for generating a graphical output. In some cases, the display element 1333 may include components of an OLED display. For example, the display element 1333 may include a cathode layer, an electron transport layer, a blocking layer, an emission layer, a hole transport layer, a hole injection layer, an anode, and a substrate. The display element 1333 may also include a filter, a polarizer, a thin film transistor, and the like. The display element 1333 may be coupled to a flexible circuit element 1332 or other suitable substrate. Although an OLED display is described, the display element may be any suitable type of display, such as an LCD display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, and the like.

[0378] Adhesive stack 1334 may be or may include an optically transparent adhesive that adheres display stack 1330 (or its components) to cover 1322. Adhesive stack 1334 may be a single substantially uniform adhesive layer, or it may include multiple layers and / or multiple materials. For example, adhesive stack 1334 may include a light-transmitting polymer layer positioned between two adhesive layers (e.g., a top adhesive layer adhered to cover 1322 and a bottom adhesive layer adhered to display stack 1330). In some cases, a multilayer adhesive stack 1334 (e.g., having two adhesive layers on opposite sides of a polymer layer) may have increased stiffness compared to a single-layer adhesive stack of the same size. Therefore, multilayer adhesive stack 1334 may be made thinner than a single-layer adhesive stack while maintaining the same or similar stiffness as a single-layer adhesive stack.

[0379] The image quality of the display can be affected by the flatness of the layers of the display stack and / or display elements. For example, a warped display layer can produce a wavy pattern or other visible effects, which can reduce the function of the display (e.g., making it ineffective in producing images or other graphical outputs). In order to provide a dimensionally stable structure and help maintain the flatness of the display components, the display stack 1330 can include a rigid structure in the display stack. For example, the display stack 1330 can include a first rigid structure 1336, which can include a metal layer (also referred to as a metal plate). The metal layer can support the display element 1333 and / or the flexible circuit element 1332, and impart structural support, rigidity, and flatness to the display element 1333 and / or the flexible circuit element 1332. The first rigid structure 1336 can have the same or substantially the same front-facing area as the display element 1333 (e.g., the first rigid structure 1336 can have a front-facing area greater than 90% of the front-facing area of ​​the display element 1333). The first rigid structure 1336 can also include one or more additional layers, such as one or more foam layers, one or more adhesive layers, and / or one or more polymer layers.

[0380] The display stack 1330 may also include a second rigid structure 1340, which may include a metal layer (also referred to as a metal plate). The metal layer of the second rigid structure 1340 may support the display element 1333 and / or the flexible circuit element 1332 and impart structural support, rigidity, and flatness to the display element 1333 and / or the flexible circuit element 1332. The second rigid structure 1340 may have a smaller front-facing area than the first rigid structure 1336. For example, the second rigid structure 1340 may be positioned only (or substantially only) in an area (e.g., an overlap area 1335) over which the flexible circuit element 1332 is superimposed. The front-facing areas of both the overlap area 1335 and the second rigid structure 1340 may be less than 50% of the front-facing area of ​​the display element 1333, and optionally less than 30% of the front-facing area of ​​the display element 1333.

[0381] The display stack 1330 may include a compliant structure 1338 between a first rigid structure 1336 and a second rigid structure 1340. The compliant structure 1338 may be or include a foam layer, one or more adhesives, etc. The compliant structure 1338 may be configured to absorb energy generated by an impact, a drop event, etc., thereby reducing the possibility of damage to components of the display stack 1330.

[0382] The display stack 1330 may also include a third rigid structure 1360. The third rigid structure may be positioned on the same side of the flexible circuit element 1332 as the processor 1350, which may be a display integrated circuit that interacts with another processor of the device 1320 and controls the display stack 1330 to generate a graphical output via the display stack 1330. The processor 1350 may also receive and / or process signals from a touch sensing component (such as an electrode that facilitates a capacitance-based touch sensing function) integrated with the display stack 1330. In some cases, the processor 1350 may be a different type of circuit element, such as a memory module. The third rigid structure 1360 may be or may include a metal layer (also referred to as a metal plate). The third rigid structure 1360 may reinforce the flexible circuit element 1332 surrounding the processor 1350, where small, potentially fragile electrical interconnects may be positioned. The third rigid structure 1360 may help inhibit bending or other deformation in the area near the electrical interconnects, and thus may help prevent damage to the device and improve the reliability of the device.

[0383] The first rigid structure 1336, the second rigid structure 1340, and the third rigid structure 1360 are described as including a metal layer. The metal layer may be formed of stainless steel, aluminum, etc. The metal layer may have a thickness of about 120 microns, about 100 microns, about 70 microns, or any other suitable size. In some cases, the metal layer may have a thickness between about 120 microns and about 60 microns, or between about 65 microns and about 95 microns. In some cases, the rigid member may be formed of or include a polymer, a composite material (e.g., carbon fiber), or other suitable material.

[0384] The display stack 1330 may also include a shield 1346 covering the processor 1350. The shield 1346 may be or may be formed of or may include metal or another suitable material (e.g., a polymer material, a composite material, etc.). The shield 1346 may protect (and optionally shield) the processor 1350 from contacting other components within the device 1320 in the event of a drop, impact event, or other type of event that may cause components of the device 1320 to shift, deflect, bend, or otherwise move relative to each other. The compliant member 1342 may be positioned between the shield 1346 and the flexible circuit element 1332 and the processor 1350, and may be configured to absorb energy generated by the device 1320 being dropped or otherwise subjected to an impact or other high energy event. The compliant member 1342 may be attached to the shield 1346 and the flexible circuit element 1332 and the processor 1350 via an adhesive.

[0385] Potting material 1348 may be applied to flexible circuit element 1332 and processor 1350 along the perimeter of processor 1350. Potting material 1348 may be an epoxy, adhesive, or another suitable material that can be applied to flexible circuit element 1332 and processor 1350 in a flowable state and then allowed to at least partially cure or harden. When cured, potting material 1348 may contact and bond to both flexible circuit element 1332 and at least a portion of the sides of processor 1350 (and optionally at least a portion of each of the perimeter sides). In some cases, potting material 1348 surrounds the outer perimeter of processor 1350.

[0386] Potting material 1348 can help prevent electrical interconnects (e.g., solder joints, wires, traces, etc.) between flexible circuit element 1332 and processor 1350 from breaking or being damaged during a drop, impact, or other potentially damaging event. Potting material 1348 can also locally increase the stiffness of flexible circuit element 1332, further helping to inhibit damage to processor 1350 and / or the electrical interconnects. Cover 1344 (e.g., a metal foil, a polymer sheet, etc.) can at least partially cover processor 1350 and potting material 1348, and can provide an additional layer of protection to processor 1350.

[0387] As described above, the display element may include various electrically active layers and components that need to be electrically interconnected to other electronic components, processors, circuit elements, etc. Because such layers (e.g., anode and cathode layers of an OLED display) may be sandwiched between other layers, a flexible circuit element 1332 (e.g., a flexible circuit board) may be wrapped around the sides of the display stack 1330 at a curved or annular region 1352 to electrically couple the electrically active layers (e.g., TFT layers, electrode layers, etc.) and / or touch sensing layers (such as one or more electrode layers that facilitate capacitive touch sensing and may be integrated with the display element 1333) of the display element to the processor 1350 of the display stack 1330. More specifically, the flexible circuit element 1332 may include conductive traces that interconnect the electronic components of the display layers (e.g., cathode and anode layers, electrode layers of touch and / or force sensors, on-cell touch sensing layers, etc.) to other electrical traces, connectors, processors, or other electronic components mounted on the flexible circuit element 1332.

[0388] In some cases, potting material 1356 (e.g., epoxy, foam, or other material or component) can be disposed within annular region 1352 to help provide structure to flexible circuit element 1332 at annular region 1352 and to help prevent flexible circuit element 1332 from deforming due to drops, impacts, etc. For example, if device 1320 is dropped onto housing member 1324, housing member 1324 can force frame member 1328 against annular region 1352 of flexible circuit element 1332. Potting material 1356 can help prevent such impacts from causing flexible circuit element 1332 to break, crush, bend, deform, or otherwise become damaged at annular region 1352.

[0389] The display stack 1330 may also include a strain reduction layer 1354 that may be applied to the flexible circuit element 1332 along the exterior at the annular region 1352. The strain reduction layer 1354 may be an epoxy, adhesive, polymer, or other suitable material. The strain reduction layer 1354 may increase the stiffness of the flexible circuit element 1332 along the annular region 1352 and may hold or form the flexible circuit element 1332 to a desired bend radius (e.g., a maximum possible bend radius given the length of the annular region 1352 and the geometry of the display stack 1330). The strain reduction layer 1354 may also help provide structure to the flexible circuit element 1332 at the annular region 1352 and help prevent the flexible circuit element 1332 from deforming due to drops, impacts, etc.

[0390] After the flexible circuit element 1332 is folded to form the annular region 1352, a potting material 1356 may be applied to the display stack 1330. For example, after the circuit element 1332 is folded and the second rigid structure 1340 is attached to the first rigid structure 1336 (e.g., via the compliant structure and one or more adhesive layers), a flowable material such as a curable epoxy may be injected into the annular region 1352. The flowable material may be at least partially hardened to provide the structural reinforcement described above.

[0391] In some cases, potting material 1356 may be applied to display stackup 1330 prior to folding flexible circuit element 1332 . Fig.13D A portion of device 1320 is shown in which flexible circuit element 1332 is in an expanded configuration and in which potting material 1356 is positioned on flexible circuit element 1332 to be folded into a Fig. 13CThe configuration shown is in a position to define the annular region 1352. The potting material 1356 can be applied in a flowable state, and the flexible circuit element 1332 can be folded (e.g., along an axis) to define the annular region 1352 (e.g., as shown by arrow 1361) while the potting material 1356 is still in an at least partially flowable state. Then, after the annular region 1352 is formed, the potting material 1356 can be at least partially hardened. Fig.13D As shown, the strain reduction layer 1354 may be positioned on the flexible circuit element 1332 before the flexible circuit element 1332 is folded to form the annular region 1352 .

[0392] Fig.14A An exemplary arrangement of cameras in device 1400 is shown. Fig.14A The device 1400 may correspond to a corner of a device (e.g., device 300) with a cover and display (and optionally other components) removed to show the arrangement of cameras. The device 1400 may include a first camera module 1402 (which may be an implementation of the first camera 361 or otherwise correspond to the first camera 361, Figure 3 ), a second camera module 1404 (which may be an implementation of the second camera 362 or otherwise correspond to the second camera 362, Figure 3 ) and a third camera module 1406 (which may be an implementation of the third camera 363 or otherwise correspond to the third camera 363, Figure 3 ). Fig.14A Any camera shown in FIG. 10 (or elsewhere in this document) may include an image stabilization system that helps maintain a clear image (e.g., reducing the effects of camera shake on the image) by sensing movement of the device and moving one or more components of the camera in a manner that at least partially compensates for (and / or counteracts) the movement of the device.

[0393] Fig.14A Also shown is a depth sensor 1414 (which may be Figure 3 Depth sensor 365 or Figure 5 An embodiment of the depth sensor 565 or otherwise corresponding to Figure 3 Depth sensor 365 or Figure 5 The device 1400 may include a depth sensor 565) and a microphone module 1412. The microphone module 1412 may be positioned over or otherwise acoustically coupled to an opening in the housing of the device 1400 to allow the microphone module 1412 to capture sound.

[0394] The device 1400 may also include a bracket member 1410 (also referred to herein as a camera bracket) to which the first camera module 1402, the second camera module 1404, and the third camera module 1406 may be coupled. The bracket member (or camera bracket) 1410 may define a corresponding receptacle for each respective camera module. Each receptacle may define an opening for optical components of a camera module. The receptacle may be defined by a flange or sidewall that at least partially surrounds the camera module. The bracket member 1410 may be configured to fix the relative positions of the camera modules and the depth sensor module.

[0395] The device 1400 may also include a frame member 1408 to which the bracket member 1410 and the depth sensor 1414 may be attached. The frame member 1408 may define a wall structure 1407, which in turn defines a first container area 1411 and a second container area 1413. As described herein, one or more cameras (which may be mounted to the bracket member 1410) may be positioned in the first container area, and the depth sensor module 1414 may be positioned in the second container area 1413. The wall structure 1407 may define the second container area 1413 by extending completely around the second container area 1413 or partially around the second container area 1413 (as shown). For example, the wall structure 1407 may define a wall segment 1439 that defines a free end. The free end may be arranged to be spaced apart from other portions of the wall structure 1407 to define a gap or opening in the wall structure 1407.

[0396] The frame member 1408 may be configured to fix the relative position of the camera module (which in turn is coupled to and held aligned by the bracket member 1410) and the depth sensor module 1414. The frame member 1408 may be configured to fix the relative position of the camera module and the depth sensor module 1414 in one or more directions. For example, the relative position and / or orientation of the camera modules 1402, 1404, 1406 and the depth sensor module 1414 may be important to ensure proper operation of the features and / or functions of the camera modules 1402, 1404, 1406 and the depth sensor module 1414. In some cases, it may be necessary or desirable for the optical axes of one or more of the camera modules 1402, 1404, 1406 and the depth sensor module 1414 to be parallel or converge at a predetermined distance from the device 1400. As another example, it may be necessary or desirable that the offset (e.g., offset along the optical axis) between one or more of the camera modules 1402, 1404, 1406 and the depth sensor module 1414 be fixed at a predetermined distance. Such alignment and positioning may be necessary or desirable to provide functions such as camera focus assistance, depth mapping, image processing, etc., and the use of a common structure (such as a frame member 1408) that can be coupled to both the depth sensor module 1414 and the camera modules 1402, 1404, 1406 (via the bracket member 1410) can help establish and maintain the desired alignment and positioning. Notably, the frame member 1408 can establish and maintain any desired alignment, positioning, orientation, offset, or other spatial parameter that enables the optical system to function properly. In some cases, frame member 1408 is used to align camera modules 1402, 1404, 1406 and depth sensor module 1414 in a plane parallel to interior surface 1436 of rear cover 1432, while out-of-plane alignment is provided by interior surface 1436 of rear cover 1432 (e.g., in an up-down direction, such as FIG. 14C to FIG. 14D In some cases, such as when the depth sensor module 1414 is adhered or otherwise attached to the interior surface 1436 of the rear cover 1432 and the sides of the depth sensor module 1414 are not in close contact with the wall structure 1407 of the frame member 1408, the frame member 1408 is not used as an alignment datum or reference for the depth sensor module 1414.

[0397] In some cases, the frame member 1408 does not serve as a reference for aligning the depth sensor module 1414. For example, in some cases, the frame member 1408 does not define a mounting surface (e.g., a surface parallel to or in contact with the interior surface of the rear cover 1432) in the container area where the depth sensor module 1414 is located. In this case, the wall structure of the frame member 1408 can extend partially or completely around the open bottom container area in which the depth sensor module 1414 is located. Therefore, in this configuration, the depth sensor module 1414 can be coupled to the interior surface of the rear cover 1432 so that the interior surface of the rear cover 1432 defines a reference surface for aligning and fixing the depth sensor module 1414.

[0398] The frame member 1408 can be coupled to other housing components or structures of the device 1400, such as a rear cover (e.g., Figure 3 The rear cover 372, Figure 5 The frame member 1408 may be used as a datum or reference surface for the bracket member 1410 and / or the depth sensor module 1414.

[0399] Fig. 14B 14 is a partially exploded view of device 1400 showing details of frame member 1408, depth sensor module 1414, microphone module 1412, and housing 1422. Housing 1422 may include rear cover 1432, which may be formed of glass, glass ceramic, ceramic, sapphire, or other suitable material. Rear cover 1432 may define sensor array area 1433, which may correspond to a protrusion along the rear surface of the rear cover (e.g., Figure 1B , Figure 1D The size, shape and position of the protrusions 137 and 151 in the figure.

[0400] The rear cover 1432 may define or include camera windows 1424, 1426, 1428, 1430, and 1409 in the sensor array area 1433. The camera windows 1424, 1426, 1428, 1430, and 1409 may be at least partially transparent (or may include or surround an at least partially transparent cover) to provide suitable optical access through the rear cover 1432 for the first camera module 1402, the second camera module 1404, and the third camera module 1406, the depth sensor module 1414, and the flash. The camera windows 1424, 1426, 1428, 1430, and 1409 may be integral with the rear cover 1432 (e.g., transparent areas of the same piece of material as the rest of the rear cover 1432), or the camera windows may include or be defined by a transparent cover, insert, lens, or other component or structure. In some cases, some of the windows are integral with rear cover 1432, while other windows include or are defined by separate components or structures.

[0401] Rear cover 1432 may also define a microphone aperture 1435 in sensor array region 1433. Microphone aperture 1435 may extend through rear cover 1432 to provide an acoustic path to the external environment for microphone module 1412. In some cases, a waterproof membrane and / or mesh material (e.g., a screen) may be positioned in microphone aperture 1435 or otherwise cover the microphone aperture to prevent liquids and / or other contaminants from entering the microphone aperture.

[0402] The frame member 1408 can be coupled to the rear cover 1432 in the sensor array area 1433 and along the interior surface of the rear cover. For example, the frame member 1408 can be attached to the interior surface of the rear cover 1432 via adhesive 1420. In some cases, as described herein, the frame member 1408 can be welded to a camera trim structure coupled to the rear cover 1432. The microphone module 1412 can also be attached to the rear cover 1432 via adhesive 1421. The depth sensor module 1414 can also be attached to the rear cover 1432 (e.g., the interior surface of the rear cover 1432) via adhesive 1418. In some cases, such as with respect to FIG. 14C to FIG. 14D As described above, the position of the depth sensor module 1414 in the device 1400 can be defined by the interface between the depth sensor module 1414 and the rear cover 1432. The adhesives 1418, 1420, 1421 can be any suitable adhesive, such as a pressure sensitive adhesive (PSA), a heat sensitive adhesive (HSA), an adhesive film, an ...

Claims

1. A mobile phone, comprising: a housing structure at least partially defining an interior volume of the mobile phone and defining a plurality of radiating elements of a first antenna group configured to operate in a first frequency band, and comprising: A first conductive member, the first conductive member defining: at least a portion of a first side surface of the mobile phone; and a first radiating element of the first antenna group; a second conductive member coupled to the first conductive member and defining: at least a portion of a second side surface of the mobile phone; and a second radiating element of the first antenna group; and a third conductive member coupled to the second conductive member and defining a first aperture and a second aperture, the first aperture and the second aperture at least partially defining an antenna window; a first non-conductive covering element positioned in the first hole; a second non-conductive covering element positioned in the second hole; a front cover coupled to the housing structure and defining a front surface of the mobile phone; a rear cover coupled to the housing structure and defining a rear surface of the mobile phone; a display positioned below the front cover; and A second antenna group is configured to operate in a second frequency band different from the first frequency band, the second antenna group comprising: a first directional antenna defining a first radiation pattern extending across a front surface of the mobile phone; a second directional antenna defining a second radiation pattern extending across a rear surface of the mobile phone; and A third directional antenna is positioned within the interior volume and defines a third radiation pattern extending through the antenna window of the third conductive member.

2. The mobile phone according to claim 1, wherein: The first directional antenna, the second directional antenna, and the third directional antenna are configured to operate in a frequency band between 25 GHz and 39 GHz.

3. The mobile phone according to claim 1, wherein: The first antenna group defines a first multiple-input multiple-output antenna array, and The second antenna group defines a second multiple-input multiple-output antenna array.

4. The mobile phone according to claim 1, wherein: The first radiation pattern extends along a first main transmission direction; The second radiation pattern extends along a second main transmission direction, which is different from the first main transmission direction, and The third radiation pattern extends along a third main transmission direction, which is different from the first main transmission direction and different from the second main transmission direction.

5. The mobile phone according to claim 4, wherein: The first antenna gain of the first directional antenna is highest along the first main transmission direction, The second antenna gain of the second directional antenna is highest along the second main transmission direction, and The third antenna gain of the third directional antenna is highest along the third main transmission direction.

6. The mobile phone according to claim 4, wherein: The second main transmission direction is orthogonal to the first main transmission direction, and the second main transmission direction is orthogonal to the third main transmission direction.

7. The mobile phone according to claim 1, wherein: The third directional antenna comprises: a first directional antenna element configured to operate at a first frequency; and A second directional antenna element is configured to operate at a second frequency that is different from the first frequency.

8. The mobile phone according to claim 7, wherein: The second directional antenna comprises: a third directional antenna element configured to operate at the first frequency; and A fourth directional antenna element is configured to operate at the second frequency.

9. A portable electronic device comprising: a housing structure defining a plurality of radiating elements of a first antenna group configured to operate in a first frequency band, and comprising: a first metallic member defining at least a portion of a first side surface of the portable electronic device and defining a first radiating element of the first antenna group; a second metallic member defining at least a portion of a second side surface of the portable electronic device and defining a second radiating element of the first antenna group; and a third metal member defining at least a portion of a third side surface of the portable electronic device and defining an antenna window, the antenna window defining: a first hole extending through the third metal member; and a second hole extending through the third metal member; a display at least partially located within the housing structure; a front cover coupled to the housing structure and defining a front surface of the portable electronic device; a rear cover coupled to the housing structure and defining a rear surface of the portable electronic device; and A second antenna group is configured to operate in a second frequency band different from the first frequency band, the second antenna group comprising: a first directional antenna positioned within the portable electronic device and defining a first radiation pattern extending across the rear surface of the portable electronic device along a first primary transmission direction; a second directional antenna, the second directional antenna being positioned within the portable electronic device and defining a second radiation pattern, the second radiation pattern extending through the antenna window of the third metal member along a second main transmission direction, the second directional antenna comprising: a first directional antenna element configured to operate at a first frequency in the second frequency band and to define a fifth radiation pattern extending through the first aperture; and A second directional antenna element is configured to operate at a second frequency in the second frequency band and to define a sixth radiation pattern extending through the second aperture, the second frequency being different from the first frequency.

10. The portable electronic device according to claim 9, wherein: The antenna window also defines: a third aperture extending through the third metal member; and a fourth hole extending through the third metal member, and The second directional antenna also includes: a third directional antenna element configured to operate at the first frequency and to define a third radiation pattern extending through the third aperture; and A fourth directional antenna element is configured to operate at the second frequency and to define a fourth radiation pattern extending through the fourth aperture.

11. The portable electronic device according to claim 9, wherein: The first hole defines a first waveguide, and The second hole defines a second waveguide.

12. The portable electronic device according to claim 11, wherein: The portable electronic device further comprises: a first non-conductive covering element in the first hole; and A second non-conductive covering element is provided in the second hole.

13. The portable electronic device according to claim 12, wherein: the portion of the side surface of the portable electronic device is a first portion of the side surface of the portable electronic device, the third metal member defining a recessed area having a bottom surface, The first hole and the second hole are formed along the bottom surface of the recessed area, and The portable electronic device also includes a third non-conductive covering element in the recessed area and defining a second portion of the side surface of the portable electronic device.

14. The portable electronic device according to claim 13, wherein: The first non-conductive covering element and the second non-conductive covering element are bonded to the third non-conductive covering element.

15. A portable electronic device comprising: A housing structure defining at least a portion of a peripheral side wall of the portable electronic device and a plurality of radiating elements of a first antenna group configured to operate in a first frequency band, the housing structure comprising A first conductive member, the first conductive member defining: at least a portion of a first side surface of the portable electronic device; and a first radiating element of the first antenna group; a second conductive member coupled to the first conductive member and defining: at least a portion of a second side surface of the portable electronic device; and a second radiating element of the first antenna group; and a third conductive member coupled to the second conductive member and defining a first aperture extending therethrough and a second aperture extending therethrough; a front cover coupled to the housing structure and defining a front surface of the portable electronic device; a rear cover coupled to the housing structure and defining a rear surface of the portable electronic device; a display positioned below the front cover; and A second antenna group is configured to operate in a second frequency band different from the first frequency band, the second antenna group comprising: a first directional antenna defining a first radiation pattern extending through the front cover along a first primary transmission direction that is perpendicular to the front surface of the portable electronic device; and A second directional antenna, the second directional antenna comprising: a first directional antenna element defining a second radiation pattern extending through the first aperture along a second main transmission direction, the second main transmission direction being perpendicular to the first main transmission direction; and A second directional antenna element defines a third radiation pattern extending through the second aperture along the second main transmission direction.

16. The portable electronic device according to claim 15, wherein: The first directional antenna element is configured to operate at a first frequency in the second frequency band; and The second directional antenna element is configured to operate at a second frequency in the second frequency band.

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