Solder ball feeding mechanism and solder ball soldering device

Abstract

This application discloses a solder ball feeding mechanism and a solder ball soldering apparatus. The solder ball feeding mechanism includes a first substrate and a ball-separating disc. The first substrate has an inlet and a plurality of feeding channels inside. One end of each feeding channel is located below the inlet, and the feeding channels extend in different directions to the bottom of the first substrate and form a plurality of outlets along a first circumference. The ball-separating disc is rotatably disposed below the first substrate and has a plurality of ball-separating holes spaced apart along the first circumference. Each ball-separating hole can be rotated to pass below the outlets. The solder ball feeding mechanism and solder ball soldering apparatus proposed in this application can improve the efficiency of solder ball feeding by setting multiple feeding channels.

Description

Technical Field

[0001] This invention relates to the field of laser welding technology, and in particular to a solder ball feeding mechanism and a solder ball welding device. Background Technology

[0002] Soldering is very common in industrial production. With the development of technology and the rapid rise in labor costs, automatic soldering machines have replaced the traditional manual soldering method with electric soldering irons, becoming the main direction of soldering technology development. Currently, the solder ball feeding mechanism in solder ball welding equipment is mostly connected to a solder ball storage cylinder through a feeding substrate. The solder ball storage cylinder feeds the solder balls into the solder ball conveying channel inside the feeding substrate and transports them to the ball distribution plate. However, using this solder ball feeding mechanism is prone to channel blockage, which prevents the solder balls from being transported to the ball distribution plate properly. Furthermore, the solder balls transported to the ball distribution plate are unevenly distributed, resulting in an imbalance of the ball distribution plate and poor solder ball feeding efficiency. Summary of the Invention

[0003] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes a solder ball feeding mechanism and a solder ball soldering device, which improves the efficiency of solder ball feeding by setting up several feeding channels.

[0004] In a first aspect, this application discloses a solder ball feeding mechanism, comprising:

[0005] The first substrate has a feed inlet and a plurality of feeding channels inside the first substrate. One end of each of the feeding channels is located below the feed inlet, and the feeding channels extend in different directions to the bottom of the first substrate and form a plurality of discharge outlets along the first circumference.

[0006] The ball-splitting disc is rotatably disposed below the first substrate. The ball-splitting disc has a plurality of ball-splitting holes spaced apart along the first circumferential line. Each ball-splitting hole can be rotated to pass below the discharge port.

[0007] The solder ball feeding mechanism according to the first aspect of this application has at least the following beneficial effects: by setting a plurality of feeding channels inside the first substrate, one end of each feeding channel is connected to the inlet, and the feeding channels extend in different directions to the bottom of the first substrate to form a plurality of outlets, the solder balls enter from the inlet and randomly enter a feeding channel. When multiple solder balls are fed sequentially, the solder balls randomly slide into different feeding channels and come out of different outlets and are placed at different positions on the ball-separating disc, ensuring that solder balls are fed to different positions on the ball-separating disc, so that the ball-separating disc can operate in a balanced manner, while avoiding the blockage of the channel caused by only one feeding channel during use, which would affect the feeding efficiency of the solder balls. Setting a plurality of feeding channels improves the feeding efficiency of the solder balls.

[0008] According to some embodiments of the first aspect of this application, the first substrate has a receiving groove, the feeding channel is disposed at the bottom of the receiving groove, and the starting ends of a plurality of the feeding channels form a unloading platform, which is disposed directly below the inlet.

[0009] According to some embodiments of the first aspect of this application, the ball-splitting disc is provided with a plurality of ball-splitting holes at intervals along the first circumferential direction, and each ball-splitting hole can be rotated to pass below the discharge port.

[0010] According to some embodiments of the first aspect of this application, a second substrate is also included. The second substrate is provided with a first laser input channel and a solder ball input channel. The ball-splitting disc is disposed on the second substrate. The ball-splitting holes can all be rotated to pass above one end of the solder ball input channel. The first substrate is provided with a second laser input channel at a position corresponding to the first laser input channel. The first laser input channel and the second laser input channel are in communication.

[0011] According to some embodiments of the first aspect of this application, a rotating shaft is further included, which passes through the first substrate and one end of the rotating shaft is connected to the ball-splitting disc for driving the ball-splitting disc to rotate.

[0012] According to some embodiments of the first aspect of this application, the bottom of the first substrate is provided with a ball supply groove along the first circumferential direction, and a plurality of the discharge ports are located on the ball supply groove.

[0013] According to some embodiments of the first aspect of this application, a solder ball guide tube is also included, the solder ball guide tube being disposed on the first substrate, the solder ball guide tube being provided with a feeding port, the feeding port being connected to the inlet.

[0014] According to some embodiments of the first aspect of this application, the first substrate includes a cover plate, the cover plate being disposed above the feeding channel, and the feed inlet being disposed on the cover plate.

[0015] According to some embodiments of the first aspect of this application, a sealing member is further included, the sealing member being disposed around the outside of the ball-shaped disc, and the two end surfaces of the sealing member being respectively attached to the first substrate and the second substrate.

[0016] Secondly, this application discloses a solder ball soldering apparatus, comprising: a solder ball feeding mechanism as described in any embodiment of the first aspect.

[0017] The solder ball soldering apparatus according to the second aspect of this application has at least the following beneficial effects: by setting a plurality of feeding channels inside the first substrate, one end of each feeding channel is connected to the inlet, and the feeding channels extend in different directions to the bottom of the first substrate to form a plurality of outlets, the solder balls enter from the inlet and randomly enter a feeding channel. When multiple solder balls are fed sequentially, the solder balls randomly enter different feeding channels and enter the dispensing mechanism at different outlets. The solder balls enter the solder ball input channel on the dispensing mechanism, enter the soldering nozzle seat through the solder ball input channel, and drip onto the product to be soldered. The laser sequentially irradiates the solder balls attached to the product to be soldered through the second laser input channel and the first laser input channel, thereby soldering the solder balls onto the product to be soldered. Setting a plurality of feeding channels improves the efficiency of solder ball feeding, thereby improving the efficiency of soldering.

[0018] According to some embodiments of the second aspect of this application, the material distribution mechanism includes a second substrate, a ball-distributing disc, and a rotating shaft. The first laser input channel and the solder ball input channel are disposed on the second substrate. The rotating shaft passes through the first substrate, and one end of the rotating shaft is connected to the ball-distributing disc for driving the ball-distributing disc to rotate. The ball-distributing disc is disposed on the second substrate and located below the discharge port.

[0019] According to some embodiments of the second aspect of this application, the ball-separating disc is provided with a plurality of ball-separating holes spaced apart along the first circumferential direction, and each ball-separating hole can be rotated to pass below the discharge port and above the solder ball input channel.

[0020] According to some embodiments of the second aspect of this application, a sealing member is further included, the sealing member being disposed around the outside of the ball-shaped disc, and the upper and lower surfaces of the sealing member being respectively attached to the first substrate and the second substrate.

[0021] According to some embodiments of the second aspect of this application, a laser window is also included, the laser window being disposed on the first substrate and located at one end of the second laser input channel away from the second substrate.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] Additional aspects and advantages of this application will become apparent and readily understood in conjunction with the following description of the embodiments, in which:

[0024] Figure 1 This is a schematic diagram of the structure of a solder ball soldering apparatus according to some embodiments of this application;

[0025] Figure 2 This is an exploded view of a solder ball soldering apparatus according to some embodiments of this application;

[0026] Figure 3 This is an exploded view of the first substrate of some embodiments of this application;

[0027] Figure 4 This is a schematic diagram of the structure of the first substrate from another perspective of some embodiments of this application.

[0028] The attached icons are numbered as follows:

[0029] First substrate 100, feeding channel 101, discharge port 102, ball feeding groove 103, second laser input channel 104, receiving groove 105, unloading platform 106, board cover 110, feeding port 111, solder ball guide tube 200, feeding port 210, second substrate 310, first laser input channel 311, solder ball input channel 312, ball separating disc 320, ball separating hole 321, rotating shaft 330, soldering nozzle seat 400, sealing element 500, laser window plate 600. Detailed Implementation

[0030] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0031] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] In the description of this application, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0033] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0034] Firstly, referring to Figures 1 to 4This application provides a solder ball feeding mechanism, including: a first substrate 100 and a ball-separating disc 320. The first substrate 100 is provided with an inlet 111 and a plurality of feeding channels 101 inside the first substrate 100. One end of the plurality of feeding channels 101 is connected to the inlet 111, and the plurality of feeding channels 101 extend in different directions to the bottom of the first substrate 100 and form a plurality of outlets 102. The ball-separating disc 320 is rotatably disposed below the first substrate 100. The ball-separating disc 320 is provided with a plurality of ball-separating holes 321 spaced along a first circumferential line. The ball-separating holes 321 can all be rotated to pass under the outlets 102. Solder balls enter through the inlet 111 and randomly enter one of the feeding channels 101. When multiple solder balls are fed sequentially, they randomly enter different feeding channels 101 and exit through different outlets 102, placing them at different positions on the ball-separating disc 320. This ensures that solder balls are fed to different positions on the ball-separating disc 320, allowing the ball-separating disc 320 to operate in a balanced manner. At the same time, it avoids the blockage caused by having only one feeding channel 101 during use, which would affect the feeding efficiency of the solder balls. Setting up several feeding channels 101 improves the feeding efficiency of the solder balls.

[0035] Specifically, two feeding channels 101 are provided on the first substrate 100. One end of the two feeding channels 101 is connected to the inlet 111. The two feeding channels 101 extend in two different directions and extend to the bottom of the second substrate 310 to form two different outlets 102. Solder balls enter the feeding channels 101 from the inlet 111. The solder balls randomly select one of the two feeding channels 101 for transport. The solder balls come out at the outlet 102 of the corresponding feeding channel 101 and are placed on the ball-separating plate 320 located below the outlet 102. Of course, the first substrate 100 may also be provided with three or four feeding channels 101, etc. Those skilled in the art can design according to actual applications, and this application does not limit this.

[0036] Reference Figure 2 and Figure 3 The first substrate 100 has a receiving groove 105, and the feeding channel 101 is disposed in the receiving groove 105. The starting ends of several feeding channels 101 form a feeding platform 106. The feeding platform 106 is disposed directly below the feeding port 111. Solder balls fall from the feeding port 111 to the feeding platform 106. The feeding platform 106 is set to prevent the falling solder balls from directly damaging the feeding channel 101 and to protect the feeding channel 101. The solder ball randomly selects a feeding channel 101 and comes out from the outlet 102 of the corresponding feeding channel 101 and is placed on the ball-separating disc 320 located below the outlet 102.

[0037] Reference Figure 2 and Figure 3 The solder ball feeding mechanism provided in this application embodiment also includes a solder ball guide cylinder 200. The solder ball guide cylinder 200 is disposed on the first substrate 100. The solder ball guide cylinder 200 is provided with a feeding port 210, which is connected to the inlet port 111. The solder ball guide cylinder 200 is also provided with a connection port. In use, the connection port can be connected to a solder storage cylinder or a solder ball making device, etc. That is, the solder ball is fed by an external feeding device through the solder ball guide cylinder 200. The feeding port 210 is connected to the inlet port 111. The solder ball located inside the solder ball guide cylinder 200 is transported from the feeding port 210 to the inlet port 111, so that the solder ball is transported to the first substrate 100 and then randomly enters the feeding channel 101 for subsequent soldering feeding.

[0038] refer to Figure 4 The bottom of the first substrate 100 is provided with a ball supply groove 103 along the first circumferential line. Several discharge ports 102 are located on the ball supply groove 103. The ball supply groove 103 is used to accommodate solder balls transported from the feed port 111. The solder balls fall into the ball separation holes 321 on the ball separation disc 320. At the same time, the ball supply groove 103 plays a limiting role for the sliding solder balls to prevent them from falling to other places and failing to accurately fit into the ball separation holes 321 on the ball separation disc 320, which would affect the subsequent soldering of the products to be soldered and affect work efficiency.

[0039] It is understandable that the ball supply groove 103 is an arc-shaped groove with a rotation angle greater than 180 degrees. The angle of the ball supply groove 103 determines the capacity of the solder balls. The larger the design angle of the ball supply groove 103, the more ball-separating holes 321 on the ball-separating disc 320 can be covered, so that the solder balls can be well assembled on the ball-separating holes 321, thereby improving the feeding efficiency of the solder balls.

[0040] Reference Figures 1 to 3 The first substrate 100 also includes a cover 110, which is disposed above the feeding channel 101. The cover 110 and the first substrate 100 can be detachably connected. Specifically, the cover 110 can be detachably closed onto the receiving groove 105. When the solder ball feeding is not smooth, the cover 110 can be removed to check several feeding channels 101 and solve the problem of the feeding channel 101. At the same time, the cover 110 can be removed after use to clean and maintain the feeding channel 101, thereby improving the service life of the solder ball feeding mechanism.

[0041] Reference Figure 1 and Figure 2The solder ball feeding mechanism provided in this application embodiment also includes a second substrate 310. The second substrate 310 is provided with a first laser input channel 311 and a solder ball input channel 312. The ball-splitting disc 320 is disposed on the second substrate 310. The first substrate 100 is provided with a second laser input channel 104 at the position corresponding to the first laser input channel 311. The first laser input channel 311 and the second laser input channel 104 are connected.

[0042] Reference Figure 2 The ball-separating disc 320 is provided with a number of ball-separating holes 321 at intervals along the first circumference. The ball-separating holes 321 can be rotated to pass below the discharge port 102 and above one end of the solder ball input channel 312. Specifically, the ball-separating holes 321 are located below the ball supply groove 103, so that the solder balls can fall into the ball-separating holes 321 just as they come out of the discharge port 102. The rotating shaft 330 drives the ball-separating disc 320 to rotate. The ball-separating holes 321 equipped with solder balls pass through the solder ball input channel 312, and the solder balls slide from the ball-separating holes 321 into the solder ball input channel 312, realizing the feeding and transportation of solder balls.

[0043] Reference Figure 1 and Figure 2 The solder ball feeding mechanism provided in this application embodiment also includes a rotating shaft 330, which passes through the first substrate 100. One end of the rotating shaft 330 is connected to the ball-splitting disc 320, and the end of the rotating shaft 330 away from the second substrate 310 is connected to a drive motor. The drive motor drives the rotating shaft 330 to rotate, thereby the rotating shaft 330 drives the ball-splitting disc 320 to rotate.

[0044] Reference Figure 2 The solder ball welding mechanism provided in this application embodiment also includes a sealing member 500. The sealing member 500 is disposed around the outside of the ball-splitting disc 320, and the upper and lower surfaces of the sealing member 500 are respectively attached to the first substrate 100 and the second substrate 310. The sealing member 500 can seal the space between the first substrate 100 and the second substrate 310 and protect the ball-splitting disc 320.

[0045] Secondly, referring to Figures 1 to 4This application also provides a solder ball soldering apparatus, including a solder ball feeding mechanism according to any embodiment of the first aspect. Solder balls enter from the inlet 111 and randomly enter a feeding channel 101. When multiple solder balls are fed sequentially, they randomly enter different feeding channels 101 and exit from different outlets 102, placing them at different positions on the ball-separating disc 320. This ensures that solder balls are fed to different positions on the ball-separating disc 320, allowing the ball-separating disc 320 to operate in a balanced manner. It also avoids channel blockage caused by having only one feeding channel 101 during use, thus affecting the solder ball feeding efficiency. By setting up several feeding channels 101, the efficiency of solder ball feeding is improved.

[0046] It is understood that the solder ball welding apparatus provided in this application embodiment also includes a welding nozzle holder 400. The welding nozzle holder 400 is disposed on the material distribution structure and is connected to the first laser input channel 311 and the solder ball input channel 312. The rotating shaft 330 drives the ball distribution disc 320 to rotate, so that the solder balls slide down to the welding nozzle holder 400 in sequence and drip from the welding nozzle holder 400 to the welding point of the product to be welded. The laser irradiates the solder balls attached to the product to be welded in sequence through the second laser input channel 104 and the first laser input channel 311, thereby realizing the welding of the solder balls to the product to be welded.

[0047] Reference Figure 1 and Figure 2 The solder ball welding apparatus provided in this application embodiment also includes a laser window 600. The laser window 600 is disposed on the first substrate 100 and located at one end of the second laser input channel 104 away from the second substrate 310. It is used to focus and bend the laser to form a high-intensity laser to weld the solder ball. At the same time, it prevents the solder ball from forming solder vapor and escaping from the second laser input channel 104 during the welding process, which would affect the physical and mental health of the workers.

[0048] The present application is described below with reference to a specific embodiment. The solder ball welding device includes a first substrate 100, a second substrate 310, a rotating shaft 330, a ball-separating disc 320, a sealing element 500, a solder ball guide tube 200, a welding nozzle seat 400, and a laser window 600. The ball-separating disc 320 is disposed at the center of the second substrate 310. The second substrate 310 is provided with a solder ball input channel 312 and a first laser channel. Both the solder ball input channel 312 and the first laser channel are located on the second substrate 310. On the same side of 10 and adjacent to each other, the ball-splitting disc 320 is provided with 30 ball-splitting holes 321 spaced apart along the first circumferential line. The ball-splitting holes 321 are used to assemble solder balls and transport solder balls to the solder ball input channel 312. A sealing member 500 is provided on the outer side of the ball-splitting disc 320. The first substrate 100 is disposed on the sealing member 500 and is in contact with the sealing member 500. The sealing member 500 can seal the space between the first substrate 100 and the second substrate 310 and perform [operation / function] on the ball-splitting disc 320. For protection, a rotating shaft 330 passes through the center of the first substrate 100. One end of the rotating shaft 330 has a connecting post. Correspondingly, the ball-splitting disc 320 has a positioning hole that matches the connecting post. An external motor drives the rotating shaft 330 to rotate, thereby causing the ball-splitting disc 320 to rotate. The first substrate 100 has a second laser input channel 104, located above the first laser input channel 311. The first substrate 100 also has... A feed inlet 111 is provided, and two feeding channels 101 extending in different directions are opened from the feed inlet 111. A ball feeding groove 103 is provided at the bottom of the first substrate 100 along the direction of the first circumference. The feeding port of the feeding channel 101 is located on the ball feeding groove 103, which is directly above the ball separating hole 321. A solder ball guide cylinder 200 is provided above the feed inlet 111. The soldering nozzle seat 400 has an open structure at both ends and is located at the bottom of the second substrate 310 and communicates with the solder ball input channel 312 and the first laser channel. The laser window 600 is located above the first laser input channel 311. The solder ball guide cylinder 200... Solder balls are fed into the inlet 111 and slide onto the feeding channel 101. They then randomly select one feeding channel 101 to slide down from the outlet 102 onto the ball-separating hole 321 of the ball-separating disc 320. An external motor drives a rotating shaft 330, which in turn rotates the ball-separating disc 320. Each ball-separating hole 321 at the outlet 102 assembles a solder ball. When the ball-separating disc passes through the solder ball input channel 312, it slides into the soldering nozzle holder 400 and is positioned at the corresponding soldering point of the product to be soldered. The laser beam is concentrated by irradiating the laser window 600 and sequentially passes through the second laser input channel 104, the first laser input channel 311, and the inside of the soldering nozzle holder 400 to irradiate the solder balls of the product to be soldered, thus completing the soldering process. The use of multiple feeding channels 101 improves the efficiency of solder ball feeding.This improves welding efficiency.

[0049] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A solder ball feeding mechanism, characterized in that, include: The first substrate has a feed inlet and a plurality of feeding channels inside the first substrate. One end of each of the feeding channels is located below the feed inlet, and the feeding channels extend in different directions to the bottom of the first substrate and form a plurality of discharge outlets along the first circumference. The ball-splitting disc is rotatably disposed below the first substrate. The ball-splitting disc is provided with a plurality of ball-splitting holes spaced apart along the first circumferential line. Each ball-splitting hole can be rotated to pass below the discharge port. Wherein, the bottom of the first substrate is provided with a ball supply groove along the first circumferential line, and a plurality of the discharge ports are located on the ball supply groove; The first substrate has a receiving groove, the feeding channel is located at the bottom of the receiving groove, and the starting ends of several feeding channels form a discharge platform, which is located directly below the inlet.

2. The solder ball feeding mechanism according to claim 1, characterized in that, It also includes a second substrate, which has a first laser input channel and a solder ball input channel. The ball-splitting disc is disposed on the second substrate. The ball-splitting holes can all be rotated to pass over one end of the solder ball input channel. The first substrate has a second laser input channel at the position corresponding to the first laser input channel. The first laser input channel and the second laser input channel are connected.

3. The solder ball feeding mechanism according to claim 1, characterized in that, It also includes a rotating shaft, which passes through the first substrate and one end of the rotating shaft is connected to the ball-splitting disc for driving the ball-splitting disc to rotate.

4. The solder ball feeding mechanism according to claim 1, characterized in that, It also includes a solder ball guide tube, which is disposed on the first substrate and has a feeding port that is connected to the inlet.

5. The solder ball feeding mechanism according to claim 1, characterized in that, The first substrate includes a cover plate, which is disposed above the feeding channel, and the feed inlet is disposed on the cover plate.

6. The solder ball feeding mechanism according to claim 2, characterized in that, It also includes a sealing element, which is wrapped around the outside of the ball-shaped disc, and the two end surfaces of the sealing element are respectively attached to the first substrate and the second substrate.

7. A solder ball soldering device, characterized in that, include: The solder ball feeding mechanism as described in any one of claims 1 to 6.

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