Auxiliary system for electronic packaging device

By utilizing the pressure component's pressing and lifting actions during the ball supply assembly's movement, the gap problem caused by substrate warping is solved, ensuring that solder balls accurately fall into the ball-planting mesh and improving the ball-planting yield.

WO2026060737A1PCT designated stage Publication Date: 2026-03-26SHANGHAI TECHSENSE CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2026-03-26

AI Technical Summary

Technical Problem

When the substrate warps, existing ball-mounting machines create gaps between the substrate and the ball-mounting stencil, causing solder balls to leak into the gaps, resulting in poor ball-mounting performance and reduced ball-mounting yield.

Method used

The ball-feeding assembly uses a pressure component on the advancing side to press down the ball-planting mesh, while the pressure component on the opposite side lifts it up, ensuring that the ball-planting mesh adheres to the substrate. By using a pressure component on the advancing side of the ball-feeding assembly to press down the ball-planting mesh, and a pressure component on the opposite side to lift it up, complete adhesion between the ball-planting mesh and the substrate is achieved.

Benefits of technology

This improved the ball placement yield, ensuring that all solder balls could correctly fall into the mesh of the ball placement net, thus increasing the success rate of ball placement.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN2024121615_26032026_PF_FP_ABST
    Figure CN2024121615_26032026_PF_FP_ABST
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Abstract

An auxiliary system for an electronic packaging device, comprising a ball feed mechanism, a ball feed assembly (400), and auxiliary tooling, wherein the ball feed assembly (400) is disposed above the ball feed mechanism, and the ball feed assembly (400) delivers a target component to a placement site of the ball feed mechanism; the auxiliary tooling comprises a pressure assembly disposed on each of a leading side and a trailing side of the ball feed assembly relative to a direction of motion thereof. While the ball feed assembly (400) is in motion, the pressure assembly on the leading side of the ball feed assembly (400) presses downward to exert pressure on the ball feed mechanism, while the pressure assembly on the side of the ball feed assembly (400) opposite to the direction of motion is raised. During a ball spreading process, the pressure assembly on the leading side of the ball feed assembly (400) is driven by a cylinder (652) to descend and press a solder ball stencil (200), while the pressure assembly on the side opposite to the direction of motion is driven by the cylinder (652) to rise and separate from the solder ball stencil (200), so that the solder ball stencil (200) at the placement site is in flush contact with a substrate, thereby ensuring solder balls are properly seated in apertures of the solder ball stencil (200), and therefore improving ball placement yield.
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Description

Auxiliary system for electronic packaging equipment TECHNICAL FIELD

[0001] The present application relates to the technical field of ball placement machine, in particular, to an auxiliary system for electronic packaging equipment. BACKGROUND

[0002] Ball placement technology is a key electronic packaging technology for electrical connection between integrated circuit chip and printed circuit board (PCB), which is a process of precisely placing a ball (usually a solder alloy) on the ball placement site of the chip.

[0003] Ball placement machine is a special equipment for performing ball placement process. It usually has an automated feeding system, a precise heating and cooling system, a precise position control system and a quality control system. The ball placement machine needs to have flexibility to adapt to different packaging types (such as ball number, ball diameter, pitch, etc.) and different specifications of chips. Therefore, modern ball placement machines usually have adjustable parameters and process settings to meet the needs of different customers and applications.

[0004] In the prior art, if the substrate is warped, a gap will be generated between the substrate and the ball placement steel mesh, causing the tin balls to leak between the gap and resulting in defects, poor ball placement effect, and a large decrease in ball placement yield, which needs to be improved.

[0005] SUMMARY

[0006] In view of the defects in the prior art, the purpose of the present application is to provide an auxiliary system for electronic packaging equipment.

[0007] According to the auxiliary system for electronic packaging equipment provided by the present application, the auxiliary system comprises a ball supply mechanism, a ball supply assembly and an auxiliary tool, the ball supply assembly is arranged above the ball supply mechanism, and the ball supply assembly provides a ball placement component to a ball placement site of the ball supply mechanism; the auxiliary tool comprises a pressure assembly arranged on both sides of the ball supply assembly in the direction of movement of the ball supply assembly, and in the process of movement of the ball supply assembly, the ball supply assembly on the advancing side of the ball supply assembly is pressed downward to apply pressure to the ball supply mechanism, and the pressure assembly on the back side of the ball supply assembly is lifted up.

[0008] Preferably, the ball supply mechanism comprises a ball placement mesh and a substrate, the substrate is arranged below the ball placement mesh, and the point of the ball placement component arranged on the substrate coincides with the mesh of the ball placement mesh to form a ball placement site for accommodating the ball placement component; the downward pressure applied by the pressure assembly acts on the ball placement mesh to make the ball placement mesh adhere to the substrate.

[0009] Preferably, the pressure assembly comprises one or more of a plunger assembly, a roller assembly and a roller assembly.

[0010] Preferably, the ball supply assembly comprises a conveying device and a ball supply device, the conveying device drives the ball supply device to move in a plane above the ball supply mechanism; the ball supply device stores and provides the implanting member to the implanting site of the ball supply mechanism.

[0011] Preferably, the ball supply device comprises a ball box, a ball storage groove and a ball outlet, the ball box is configured with an internal space for storing the implanting member, the internal space of the ball box is communicated with the ball storage groove, and the lowermost opening of the ball box is the ball outlet.

[0012] Preferably, the uppermost opening of the ball storage groove is connected with a ball inlet pipe, the upper end of the ball inlet pipe extends into the internal space of the ball box by a certain height; a vibrating device is installed on the ball box, and the vibrating device drives the implanting member in the ball box to jump.

[0013] Preferably, the auxiliary tool further comprises a support for installing the pressure assembly, and at least one group of supports is arranged on the front and back of the ball supply assembly in the moving direction of the ball supply assembly; any group of the supports gradually approaches the ball outlet of the ball supply assembly from top to bottom, and the bottom of any group of the supports is configured to install one or more of the plunger assembly, the roller assembly and the roller drum assembly.

[0014] Preferably, the auxiliary tool further comprises a cylinder seat and a cylinder, the cylinder seat is arranged on the ball supply assembly, the cylinder is obliquely installed on the cylinder seat, and the supports are connected with the output end of the cylinder.

[0015] Preferably, the inclination angle of the output shaft of the cylinder is the same as the inclination angle of the supports.

[0016] Preferably, a plurality of plunger assemblies are arranged on the supports in a direction perpendicular to the moving direction of the ball supply assembly; a plurality of roller assemblies are arranged on the supports in a direction perpendicular to the moving direction of the ball supply assembly; and the shaft of the roller drum assembly installed on the supports is perpendicular to the moving direction of the ball supply assembly.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] 1. In the ball laying process, the pressure assembly on one side of the advancing direction of the ball supply assembly is driven by the cylinder to descend to press the ball implanting net, and the pressure assembly on the opposite side is driven by the cylinder to ascend to separate from the ball implanting net, so that the ball implanting net is completely attached to the substrate, thereby ensuring that all the solder balls can correctly fall into the mesh of the ball implanting net, and improving the ball implanting yield. BRIEF DESCRIPTION OF DRAWINGS

[0019] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0020] Figure 1 is an exploded view of the ball box assembly embodying the present invention.

[0021] Figure 2 is a front view of the ball box assembly embodying the present invention.

[0022] Figure 3 is a perspective view of embodiment one embodying the present invention.

[0023] Figure 4 is a side view of embodiment one embodying the present invention.

[0024] Figure 5 is an enlarged view of the plunger position in Figure 4.

[0025] Figure 6 is an installation view of the plunger embodying embodiment one of the present invention.

[0026] Figure 7 is a structure view of the ball box embodying the present invention with an elastic baffle added beside the ball outlet.

[0027] Figure 8 is an enlarged view of the side view of the ball outlet position embodying the present invention.

[0028] Figure 9 is a structure view of embodiment two embodying the present invention with an elastic roller.

[0029] Figure 10 is a structure view of embodiment three embodying the present invention with an elastic roller.

[0030] Figure 11 is an installation view of the elastic roller embodying embodiment three of the present invention.

[0031] In the figures: ball net 200 plunger assembly 621 ball supply assembly 400 plunger head 622 ball box 410 roller assembly 623 ball storage groove 411 elastic baffle 625 cover plate 413 ball outlet 412 support 640 insertion hole 414 vertical rod 641 ball inlet pipe 415 horizontal rod 642 horizontal drive mechanism 420 air cylinder base 650 inclined installation surface 651 support slide 423 air cylinder 652 lifting drive mechanism 430 vibrator 660 DETAILED DESCRIPTION

[0032] The application will be described in detail below with reference to specific embodiments. The following embodiments will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the application. These are within the scope of protection of the application.

[0033] It needs to be emphasized that the implant member of the present application can be a columnar structure or a spherical structure, and the equipment of the technical solution of the present application is especially suitable for spherical implant members, and can also be suitable for columnar implant members.

[0034] Embodiment one

[0035] As shown in FIGS. 1-8, an auxiliary system for electronic packaging equipment according to the present application includes a ball feeding mechanism, a ball feeding assembly 400, and an auxiliary tool. The ball feeding assembly 400 is arranged above the ball feeding mechanism, and the ball feeding assembly 400 provides implant members to implant sites of the ball feeding mechanism. The auxiliary tool includes pressure assemblies arranged on both sides of the ball feeding assembly 400 in the direction of movement of the ball feeding assembly 400. During the movement of the ball feeding assembly 400, the ball feeding assembly 400 on the advancing side is pressed downward to exert pressure on the ball feeding mechanism, and the pressure assembly on the back side of the ball feeding assembly 400 is lifted up.

[0036] Specifically, the ball feeding mechanism includes a ball mounting net 200 and a substrate. The substrate is arranged below the ball mounting net 200, and the point of the implant member on the substrate coincides with the mesh of the ball mounting net 200 to form an implant site for accommodating the implant member. The downward pressure exerted by the pressure assembly acts on the ball mounting net 200, so that the ball mounting net 200 is attached to the substrate.

[0037] More specifically, the substrate is stably installed below the ball mounting net 200 by a supporting device. The present application proposes a feasible way to support the substrate, which does not constitute a specific limitation to the content to be protected by the present application: the supporting platform is supported by four supporting legs. The supporting platform has an opening. The ball mounting net 200 is fixed in the opening. The ball mounting net 200 is preferably a steel net, and of course other materials can also be used.

[0038] The supporting device is arranged below the ball mounting net 200 and includes a fixed plate, a carrier plate arranged below the fixed plate, a supporting plate arranged below the carrier plate, and four guide columns. The fixed plate is arranged below the ball mounting net 200 and is fixed at both ends of the supporting platform. The four guide columns are vertically fixedly connected between the fixed plate and the supporting plate. The carrier plate is provided with four linear bearings. The four linear bearings are sleeved on the four guide columns to enable the carrier plate to be lifted along the guide columns. The fixed plate has a hole in the middle. The carrier plate has a loading platform for positioning and placing the substrate at a position corresponding to the hole. The roots of the four guide columns are provided with limiting pads made of rubber.

[0039] The lower surface of the carrier plate is provided with a handle. The carrier plate can be lifted by holding the handle, so that the substrate on the carrier plate is lifted to the lower surface of the ball placement net 200 through the hole of the fixed plate. When the substrate is located on the lower surface of the ball placement net 200, the carrier plate can be fixed with the fixed plate by using bolts, so that the substrate can be stably located on the lower surface of the ball placement net 200 during ball placement. In this embodiment, the lifting of the carrier plate is realized in a manual manner. In addition to this scheme, the lifting of the carrier plate can also be driven in a manner driven by a motor or an air cylinder 652 to realize the automation of the supporting device.

[0040] The ball supply assembly 400 comprises a conveying device and a ball supply device, the conveying device drives the ball supply device to move in a plane above the ball placement mechanism, and the ball supply device stores and provides the implanting member to the implanting site of the ball placement mechanism.

[0041] The ball supply device comprises a ball box 410, a ball storage groove 411, and a ball outlet 412. The ball box 410 is configured with an internal space for storing the implanting member. The internal space of the ball box 410 is in communication with the ball storage groove 411. The lowermost opening of the ball box 410 is the ball outlet 412. The uppermost opening of the ball storage groove 411 is connected with a ball inlet pipe 415. The upper end of the ball inlet pipe 415 extends into the internal space of the ball box 410 by a certain height. A vibration device is installed on the ball box 410. The vibration device drives the implanting member in the ball box 410 to jump. Specifically, the ball box 410 is provided with the ball storage groove 411 at the bottom. The bottom of the ball storage groove 411 is provided with the ball outlet 412. The top opening of the ball storage groove 411 is provided with a cover plate 413. The cover plate 413 is spacedly provided with jack plugs 414. Each jack plug 414 is fixed with the ball inlet pipe 415. The ball inlet pipe 415 is connected with the external ball supply device. The ball supply device can inject the implanting member into the ball storage groove 411 through the ball inlet pipe 415. Preferably, the ball storage groove 411 of the ball box 410 is a reverse trapezoidal narrow groove, and the ball outlet 412 is a narrow opening. The width of the ball outlet 412 is between 1 mm and 2 mm.

[0042] The conveying device comprises a horizontal driving mechanism 420 and a lifting driving mechanism 430. The horizontal driving mechanism 420 comprises a horizontal sliding rail 421, a horizontal linear module, and a support sliding plate 423. The horizontal sliding rail 421 and the horizontal linear module are fixed on the support platform and are separately arranged on the two sides of the opening. The support sliding plate 423 is arranged at one end of the horizontal sliding rail 421 and at the other end of the horizontal linear module. The support sliding plate 423 is provided with a through hole. The through hole can pass above the hole of the fixed plate under the sliding of the support sliding plate 423.

[0043] The lifting drive mechanism 430 is fixed to the support slide plate 423 and located on one side of the hole. The ball box 410 is installed on the lifting drive mechanism 430 and located above the hole. Under the lifting drive of the lifting drive mechanism 430, the ball box 410 can pass through the hole so that the ball outlet 412 reaches above the ball planting net 200. The lifting drive mechanism 430 is a vertical linear module.

[0044] Both the horizontal linear module and the vertical linear module are motor-driven linear modules. Since they are existing technologies and can be purchased directly from the market, their specific structures will not be described in detail here.

[0045] The pressure assembly is configured to move along with the ball supply assembly 400 on the ball supply mechanism. The relative movement of the pressure assembly and the upper surface of the ball supply mechanism includes translation and / or rolling. The pressure assembly includes one or more of the following: plunger assembly 621, roller assembly 623, and roller assembly 624.

[0046] The auxiliary fixture also includes a bracket 640 for mounting the pressure assembly, with at least one set of brackets 640 on each of the front and rear sides of the ball supply assembly 400 in the direction of movement. The auxiliary fixture also includes a cylinder seat 650 and a cylinder 652. The cylinder seat 650 is mounted on the ball supply assembly 400, and the cylinder 652 is mounted at an angle on the cylinder seat 650. The bracket 640 is connected to the output end of the cylinder 652. The tilt angle of the output shaft of the cylinder 652 is the same as the tilt angle of the bracket 640. Each set of brackets 640 gradually approaches the ball outlet 412 of the ball supply assembly 400 from top to bottom.

[0047] The bottom of any set of brackets 640 is configured to mount one or more of the following: plunger assembly 621, roller assembly 623, and roller assembly 624. Specifically, this embodiment uses plunger assembly 621 as an example to illustrate the pressure component:

[0048] The bottom of any bracket 640 is configured for mounting plunger assemblies 621, of which multiple plunger assemblies 621 are spaced apart on the bracket 640 in a direction perpendicular to the movement direction of the ball supply assembly 400. Each plunger assembly 621 includes a resilient plunger with a spherical plunger head 622 that presses against the ball-feeding net 200 under the action of an internal spring. The resilient plunger is commercially available.

[0049] The support 640 comprises two vertical rods 641 and a horizontal rod 642 connected between the lower ends of the two vertical rods 641. The support slide plate 423 is provided with a cylinder seat 650 on each side of the ball box 410. The cylinder seat 650 is provided with a plurality of inclined mounting surfaces 651 which are high on the inner side and low on the outer side. A cylinder 652 is mounted on each of the inclined mounting surfaces 651. The upper end of the vertical rod 641 is connected to the cylinder 652. The elastic plungers are arranged and fixed on the horizontal rod 642, and the plunger heads 622 are downward. In this embodiment, the cylinders 652 and the support 640 are both inclined mounting due to the adoption of the inclined mounting surfaces 651. Finally, the plunger heads 622 of the elastic plungers are inclinedly mounted on the two sides of the ball box 410 in a manner of deflecting towards the ball box 410. The outer walls of the front and rear sides of the ball box 410 are inclined walls with the bottom inclined inward. The thickness of the front and rear walls of the ball box 410 at the ball outlet 412 is 1.2mm to 1.8mm. This makes the plunger heads 622 of the plunger assemblies 621 as close to the ball outlet 412 as possible (i.e. the elastic force point is as close to the ball laying point as possible). In order to ensure the linearity and uniformity of the force point, as many elastic plungers as possible are arranged on the two sides of the ball laying box 410.

[0050] It should be noted that the elastic plungers of the technical solution of the present application are arranged as much as possible in the length direction of the horizontal rod 642. The number and size of the elastic plungers can be selected according to the actual working condition. The more the number of the elastic plungers, the more reasonable the arc-shaped deformation can be achieved when the elastic plungers are pressed on the ball planting net 200, and the situation that a single hole is pressed out of the crimping point can be avoided.

[0051] In this embodiment, the driving mechanism of the support 640 adopts the cylinder 652. Of course, other driving mechanisms can also be adopted, such as a motor-driven linear module.

[0052] The plunger assemblies 621 can be lifted and lowered under the synchronous driving of the two cylinders 652 on the same side. During the ball laying process, the plunger assemblies 621 on one side in the advancing direction are lowered under the driving of the cylinder 652 to press the ball planting net 200. The plunger assemblies 621 on the opposite side are raised under the driving of the cylinder 652 to be separated from the ball planting net 200. During the ball laying process, the plunger assemblies 621 on one side in the advancing direction are lowered to press the ball planting net 200 by means of the elastic force, so that the ball planting net 200 is completely attached to the substrate.

[0053] Further, a vibration device is further included, and the vibration device acts on the ball box 410. The vibration device comprises a vibrator 660, and the vibrator 660 is further mounted on the top of the ball box 410. Through the vibration of the vibrator 660, the solder balls in the ball box 410 can be made to jump, which can effectively improve the ball laying yield.

[0054] The positioning groove of the carrier has a vacuum suction hole. The substrate is positioned in the positioning groove of the carrier and is sucked by the vacuum, and is fixed by a buckle or a bolt lock or the like.

[0055] Preferably, the ball supply assembly 400 is provided with elastic flaps 625 on both sides of the ball outlet 412 along the moving direction of the ball supply assembly 400, which are in contact with the upper surface of the ball mounting net 200. Specifically, the elastic flaps 625 are additionally arranged on both sides of the ball outlet 412 of the ball box 410. Specifically, the elastic flaps 625 are fixed on the outer walls on both sides of the ball box 410, the end heads of which protrude beyond the lower surface of the ball box 410 and are bent inwardly to be in contact with the ball mounting net 200. The elastic flaps 625 can prevent the implanting member from leaking from the side during the ball mounting process. The elastic flaps 625 are made of stainless steel or spring steel.

[0056] As can be seen from the above detailed description, the electronic packaging device of the present application can adapt to the ball mounting work on the warped substrate, and can avoid the gap between the substrate and the ball mounting net 200 during the ball mounting process, so as to ensure that all the solder balls can correctly fall into the mesh holes of the ball mounting net 200, thereby improving the ball mounting yield.

[0057] It should be noted that the technical scheme of the present application can be used not only for the ball mounting of the substrate, but also for the ball mounting of other products, such as the ball mounting of chips or wafers.

[0058] Embodiment Two

[0059] Based on Embodiment One, according to the electronic packaging device provided by the present application, the present specific embodiment is further described by taking the pressure assembly as the roller assembly 623 as an example:

[0060] As shown in FIG. 9, the present specific embodiment adopts the roller assembly 623 instead of the plunger assembly 621 in Embodiment One, and the other structures are the same as those in Embodiment One, which will not be described herein. The roller assembly 623 is arranged in multiple numbers on the support 640 along the direction perpendicular to the moving direction of the ball supply assembly 400, and the roller assembly 623 comprises an elastic roller composed of an elastic telescopic column and a roller mounted at the lower end of the elastic telescopic column. The elastic roller can also be directly purchased from the market.

[0061] Similarly, during the ball mounting process, the elastic rollers on one side in the advancing direction are driven to descend by the air cylinder 652 to press the ball mounting net 200, and the elastic rollers on the opposite side are driven to ascend by the air cylinder 652 to be separated from the ball mounting net 200.

[0062] Embodiment Three

[0063] Based on Embodiment One, according to the electronic packaging device provided by the present application, the present specific embodiment is further described by taking the pressure assembly as the roller assembly 624 as an example:

[0064] As shown in FIG. 10 and FIG. 11, the present embodiment adopts a roller assembly 624 instead of the plunger assembly 621 in the first embodiment, the roller assembly 624 is installed on the bracket 640 in axial perpendicular to the moving direction of the ball feeding assembly 400, the roller assembly 624 includes an elastic roller connected between the lower ends of two vertical rods 641. The elastic roller can be directly purchased from the market, and the surface of the elastic roller is provided with an elastic coating, which can be rubber or plastic.

[0065] The roller assembly 624 can also preferably adopt a hollow roller, which can be made of metal, and the hollow structure of the metal itself can be used to act on the ball planting net 200 to achieve the arc-shaped deformation of the ball planting net 200 when it is pressed, and the single hole cannot be pressed out.

[0066] Similarly, during the ball laying process, the elastic roller on the side of the advancing direction is lowered to press the ball planting net 200 under the drive of the air cylinder 652, and the roller on the opposite side is raised to separate from the ball planting net 200 under the drive of the air cylinder 652.

[0067] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0068] The specific embodiments of the present application are described above. It should be understood that the present application is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essential content of the present application. The embodiments of the present application and the features in the embodiments can be arbitrarily combined with each other without conflict.

Claims

1. An auxiliary system for an electronic packaging apparatus, characterized by The application relates to a ball-supplying mechanism, a ball-supplying assembly and an auxiliary tool, wherein the ball-supplying assembly is arranged above the ball-supplying mechanism and provides implanting members to the implanting site of the ball-supplying mechanism; The auxiliary tool comprises pressure assemblies arranged on both sides of the movement direction of the ball-supplying assembly, wherein the pressure assembly on the advancing side of the ball-supplying assembly exerts pressure on the ball-supplying mechanism during the movement of the ball-supplying assembly, and the pressure assembly on the back side of the ball-supplying assembly is lifted.

2. The auxiliary system for electronic packaging equipment of claim 1, wherein, The ball-supplying mechanism comprises a ball-implanting net and a base plate, wherein the base plate is arranged below the ball-implanting net, the point position of the implanting member on the base plate is coincided with the mesh of the ball-implanting net to form the implanting site for accommodating the implanting member; The downward pressure exerted by the pressure assembly acts on the ball-implanting net to make the ball-implanting net adhere to the base plate.

3. The auxiliary system for electronic packaging equipment of claim 1, wherein, The pressure assembly comprises one or more of a plunger assembly, a roller assembly and a roller drum assembly.

4. The auxiliary system for electronic packaging equipment of claim 1, wherein, The ball-supplying assembly comprises a conveying device and a ball-supplying device, wherein the conveying device drives the ball-supplying device to move in a plane above the ball-supplying mechanism; The ball-supplying device stores and provides the implanting member to the implanting site of the ball-supplying mechanism.

5. The auxiliary system for electronic packaging equipment of claim 4, wherein, The ball-supplying device comprises a ball box, a ball storage groove and a ball outlet, wherein the ball box is arranged with an internal space for storing the implanting member, the internal space of the ball box is communicated with the ball storage groove, and the lowermost opening of the ball box is the ball outlet.

6. The auxiliary system for electronic packaging equipment of claim 5, wherein, The uppermost opening of the ball storage groove is connected with a ball inlet pipe, and the upper end of the ball inlet pipe extends into the internal space of the ball box by a certain height; The ball box is provided with a vibrating device, and the vibrating device drives the implanting member in the ball box to jump.

7. The auxiliary system for electronic packaging equipment of claim 1, wherein, The auxiliary tool further comprises a bracket for mounting the pressure assembly, and the bracket is provided with at least one group on both sides of the movement direction of the ball-supplying assembly. Any group of the bracket gradually approaches the ball outlet of the ball-supplying assembly from top to bottom, and the bottom of any group of the bracket is arranged with one or more of the plunger assembly, the roller assembly and the roller drum assembly.

8. The auxiliary system for electronic packaging equipment of claim 7, wherein, The auxiliary tool further comprises a cylinder seat and a cylinder, wherein the cylinder seat is arranged on the ball-supplying assembly, the cylinder is obliquely arranged on the cylinder seat, and the bracket is connected with the output end of the cylinder.

9. The auxiliary system for electronic packaging equipment of claim 8, wherein, The inclination angle of the output shaft of the cylinder is the same as the inclination angle of the bracket.

10. The auxiliary system for electronic packaging equipment of claim 7, wherein, The plunger assembly is arranged with multiple plunger assemblies on the bracket in a direction perpendicular to the movement direction of the ball-supplying assembly. The roller assembly is arranged with multiple roller assemblies on the bracket in a direction perpendicular to the movement direction of the ball-supplying assembly. The roller drum assembly is arranged on the bracket in a direction perpendicular to the movement direction of the ball-supplying assembly.

Citation Information

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