Radiator, battery pack and electrical equipment

Abstract

The present application relates to the technical field of battery pack devices, and in particular discloses a radiator, a battery pack and an electrical device, including: a shell and a phase change material. The shell is provided with a closed hollow cavity, and the phase change material is provided in the hollow cavity. When the phase change material does not undergo phase change, the phase change material does not exceed 95% of the volume of the hollow cavity. Through the above-mentioned method, the present application can, when the temperature of the heating element on the battery management system board (BMS board) rises and reaches the phase change temperature of the phase change material, the phase change material undergoes phase change, absorbs the heat generated by the heating element on the BMS board, greatly improves the heat dissipation of the BMS board, reduces the probability of damage to the components on the BMS due to excessive temperature rise of the BMS board, and at the same time, can reduce the phase change material from overflowing from the shell when the phase change occurs, thereby affecting the heat dissipation effect of the radiator.

Description

Technical Field

[0001] The present application and the technical field of battery pack devices particularly relate to a radiator, a battery pack and an electrical device. Background Art

[0002] Currently, the market is increasingly demanding on the charging and driving performance of two-wheeled electric vehicles (EVs). Consequently, the battery packs of these EVs are trending towards fast charging and high-rate discharge. Battery packs typically include a battery pack control component, a battery management system board (BMS board), and a radiator. The radiator is typically mounted on the BMS board and typically utilizes the radiator's natural convection cooling principle to dissipate heat from the BMS board. Natural convection refers to the convection heat transfer phenomenon caused by density differences due to uneven temperatures in the fluids involved in the heat exchange. However, radiators that utilize this principle often have poor cooling effects on the BMS board. Summary of the Invention

[0003] The inventors of this application discovered that during fast charging and high-rate discharge, the heat-generating components on the battery pack control module (BMS) board of a two-wheeled electric vehicle (EV) experience high temperature rises. Since the BMS board is typically located in a closed environment within the battery pack, where gas flow is very slow, conventional radiators often fail to achieve adequate heat dissipation. In light of these issues, this application provides a radiator, battery pack, and electrical equipment to address the issue of poor heat dissipation from radiators.

[0004] According to one aspect of the present application, a heat sink is provided, comprising: a shell having a closed hollow cavity; a phase change material disposed in the hollow cavity, wherein when the phase change material does not undergo phase change, the phase change material does not exceed 95% of the volume of the hollow cavity.

[0005] In an optional manner, the phase change material does not exceed 90%-95% of the volume of the hollow cavity.

[0006] In an optional manner, the phase change temperature of the phase change material is 60 degrees Celsius to 180 degrees Celsius. The phase change material absorbs the heat generated by the heating element during the phase change, thereby reducing the temperature of the heating element.

[0007] In an optional manner, the phase change temperature of the phase change material is 90 degrees Celsius to 180 degrees Celsius. The phase change material undergoes phase change to absorb heat generated by the heating element or heat from the environment.

[0008] In an optional manner, the phase change temperature of the phase change material is 90 degrees Celsius to 150 degrees Celsius, and the phase change material undergoes a phase change to absorb heat generated by the heating element.

[0009] In an optional manner, the phase change temperature of the phase change material is 130 degrees Celsius to 150 degrees Celsius. The phase change material undergoes phase change to absorb heat generated by the heating element or heat from the environment.

[0010] In an optional manner, the phase change enthalpy value of the phase change material is greater than 60 J / g, which means that each gram of the phase change material can absorb more than 60 joules of energy when the phase change occurs.

[0011] In an optional manner, the phase change enthalpy of the phase change material ranges from 80 J / g to 250 J / g, which means that each gram of the phase change material can absorb 80 joules to 250 joules of energy when a phase change occurs.

[0012] In an optional manner, the phase change enthalpy value of the phase change material ranges from 150 J / g to 250 J / g, indicating that each gram of the phase change material can absorb 150 joules to 250 joules of energy when a phase change occurs, and each gram of the phase change material absorbs more energy at this time.

[0013] In an optional embodiment, the inner surface of the shell extends toward the hollow cavity with a first tooth plate, which can increase the contact area with the phase change material, that is, the contact area between the phase change material and the shell is increased, thereby improving the efficiency of the phase change material in absorbing heat during phase change.

[0014] In an optional manner, a boss is provided on the outer surface of the shell; the heat conducting plate is provided with a recess, the boss is inserted into the recess, and the boss is used to increase the contact area with the heat dissipated component and improve the heat dissipation of the heat dissipation component by the radiator.

[0015] In an optional manner, the shell includes a first shell, a second shell and a third shell; the second shell is arranged at the first end of the first shell, and the third shell is arranged at the second end of the first shell, and the first shell, the second shell and the third shell are enclosed to form a closed hollow cavity.

[0016] In an optional manner, the heat sink includes a packaging film, which covers the phase change material and limits the flow of the phase change material.

[0017] According to another aspect of an embodiment of the present application, a battery pack is provided, comprising: a battery cell assembly comprising a plurality of stacked battery cells; a battery control assembly electrically connected to the battery cells, and a radiator as described above, the radiator being installed on the battery control assembly and being used to dissipate heat from the battery control assembly.

[0018] In an optional embodiment, the battery control assembly includes a circuit board; the battery pack includes a heat conducting plate, one surface of the heat conducting plate is attached to the outer surface of the shell, and the other surface of the heat conducting plate is attached to the heating element on the circuit board.

[0019] According to another aspect of the embodiments of the present application, there is provided an electric device comprising the battery pack as described above.

[0020] The beneficial effects of the present application include: Different from the prior art, the present application provides a housing and a phase change material, wherein the housing is provided with a closed hollow cavity, and the phase change material is placed in the hollow cavity. When the phase change material does not undergo a phase change, the phase change material does not exceed 95% of the volume of the hollow cavity. With this configuration, when the temperature of the heating components on the BMS board rises and reaches the phase change temperature of the phase change material, the phase change material undergoes a phase change, absorbing the heat generated by the heating components on the BMS board, thereby improving the heat dissipation of the BMS board and reducing the probability of damage to the components on the BMS board due to excessive temperature rise of the BMS board. At the same time, the phase change material does not exceed 95% of the volume of the hollow cavity, which can reduce the phase change material from overflowing from the housing when the phase change occurs and affecting the heat dissipation effect of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To more clearly illustrate the specific embodiments of this application or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0022] Figure 1 This is an exploded schematic diagram of the overall structure of the radiator according to an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the overall structural assembly of the radiator according to an embodiment of the present application;

[0024] Figure 3 This is a partial structural diagram of an embodiment of the radiator of the present application;

[0025] Figure 4 This is a partial structural diagram of another embodiment of the radiator of the present application;

[0026] Figure 5 yes Figure 2 A side sectional view of

[0027] Figure 6 This is a partial structural diagram of an embodiment of the radiator of the present application;

[0028] Figure 7 This is a schematic diagram of the assembly structure of an embodiment of the radiator of the present application;

[0029] Figure 8 This is an exploded schematic diagram of the overall structure of another embodiment of the radiator of the present application;

[0030] Figure 9 This is a schematic diagram of the overall structural assembly of another embodiment of the radiator of the present application;

[0031] Figure 10 This is a schematic diagram of the partial structural assembly of another embodiment of the radiator of the present application;

[0032] Figure 11 This is an exploded schematic diagram of the overall structure of a battery pack according to another embodiment of the present application;

[0033] Figure 12 It is a schematic diagram of the partial structure of a battery pack according to another embodiment of the present application.

[0034] Description of the drawings: 10, shell; 10a, hollow cavity; 101, first tooth plate; 102, second tooth plate; 103, boss; 104, first shell; 104a, first opening; 105, second shell; 106, third shell; 107, fourth shell; 107a, first receiving cavity; 1071, second opening; 20, phase change material; 30, battery cell assembly; 40, battery control assembly; 401, circuit board; 50, heat conduction plate; 60, battery casing; 70, first cover plate; 80, second cover plate; 90, packaging film. DETAILED DESCRIPTION

[0035] In order to facilitate understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0037] See also Figure 1The heat sink 01 includes a housing 10 and a phase change material 20. The phase change material 20 is disposed in the housing 10. The phase change material undergoes a phase change when the external temperature reaches the phase change temperature of the phase change material, and can absorb high external heat to reduce the external temperature.

[0038] The heat sink 01 further includes a packaging film 90, which covers the phase change material 20 and restricts the flow of the phase change material 20. Preferably, the packaging film 90 includes an aluminum-plastic film, but is not limited to the use of aluminum-plastic film packaging.

[0039] For the above-mentioned housing 10, as Figure 1 and Figure 2 As shown, the housing 10 is provided with a closed hollow cavity 10a for accommodating the phase change material 20. The housing 10 also has high thermal conductivity. The housing 10 is made of, but not limited to, aluminum. Other materials, such as copper, are also acceptable as long as the housing 10 has high thermal conductivity. Preferably, the thickness of the housing 10 is 0.5 mm to 4 mm.

[0040] In some embodiments, as Figure 1 and Figure 3 As shown, the inner surface of the shell 10 extends toward the hollow cavity 10a with a first tooth plate 101, and the first tooth plate 101 can increase the contact area with the phase change material 20, that is, the contact area between the phase change material 20 and the shell 10 is increased, thereby improving the efficiency of the phase change material 20 in absorbing heat during phase change.

[0041] In some embodiments, as Figure 1 and Figure 4 As shown, the outer surface of the housing 10 has second fins 102 extending away from the hollow cavity 10a. The second fins 102 can increase the contact area between the housing 10 and the outside air, improve the heat dissipation efficiency of the housing 10, and utilize the principle of natural convection to dissipate heat from the housing 10. In other embodiments, the second fins 102 can be connected to other cooling plates or coolants to dissipate heat.

[0042] In some embodiments, the housing 10 is provided with a boss 103 , and the boss 103 is used to increase the contact area with the heat dissipation component, thereby improving the heat dissipation of the heat sink 01 to the heat dissipation component.

[0043] In some embodiments, as Figure 1 and Figure 5As shown, the shell 10 includes a first shell 104, a second shell 105 and a third shell 106. The hollow cavity 10a penetrates the first shell 104 from the first end of the first shell 104 to the second end of the first shell 104. The second shell 105 is arranged at the first end of the first shell 104, and the third shell 106 is arranged at the second end of the first shell 104, so as to close the two ends of the hollow cavity 10a and form a closed hollow cavity 10a.

[0044] In some embodiments, the second shell 105 and the third shell 106 may be fixed to the first shell 104 by screw connection, but is not limited to screw connection. Other fixing methods may also be used, such as welding or other seamless connection fixing methods.

[0045] In some embodiments, as Figure 6 and Figure 7 As shown, the first housing 104 has a first opening 104a, the phase change material 20 is disposed in the first housing 104 through the first opening 104a, and the packaging film 90 covers the phase change material 20. Preferably, the packaging film 90 covers the outer surface of the phase change material 20 and seals the phase change material 20 therein, thereby limiting the movement of the phase change material 20. The first housing 104 closes the first opening 104a, thereby limiting the flow of the phase change material 20 in the first housing 104.

[0046] In some embodiments, as Figures 8-10 As shown, the shell 10 includes a fourth shell 107, and the fourth shell 107 is provided with a first receiving cavity 107a and a second opening 1071 connected to the first receiving cavity 107a. The first receiving cavity 107a can be used to receive the phase change material 20, and the phase change material 20 is arranged in the fourth shell 107 through the second opening 1071. The packaging film 90 is attached to the fourth shell 107 and the phase change material 20 to limit the flow of the phase change material 20 in the fourth shell 107.

[0047] For the above-mentioned phase change material 20, Figure 1 As shown, the phase change material 20 is disposed within the hollow cavity 10a. Preferably, the phase change material 20 is a solid phase change material 20. When the phase change material 20 is not undergoing a phase change, the phase change material 20 does not exceed 95% of the volume of the hollow cavity 10a. This reduces the amount of phase change material 20 overflowing from the housing 10 during a phase change, thereby reducing the heat dissipation effect of the heat sink. Preferably, when the ambient temperature is between 20°C and 30°C, the phase change material 20 does not exceed 95% of the volume of the hollow cavity 10a.

[0048] The phase change material does not undergo a phase change when the ambient temperature is lower than its phase change temperature. For example, if the ambient temperature is 25 degrees Celsius and the phase change temperature is 60 degrees Celsius, the phase change material is in a non-phase change state because the ambient temperature is lower than its phase change temperature. Furthermore, the phase change temperature refers to the critical temperature at which a substance transitions between different phases, such as the temperature required for a phase change material to change from a solid to a liquid, gas, or melt.

[0049] In some embodiments, the phase change temperature of the phase change material 20 is 60 degrees Celsius to 180 degrees Celsius. The phase change material 20 undergoes phase change to absorb heat generated by the heating element or heat in the surrounding environment, thereby reducing the temperature of the heating element.

[0050] In some embodiments, the phase change temperature of the phase change material 20 is 90 degrees Celsius to 180 degrees Celsius. The phase change material 20 undergoes phase change, absorbs heat generated by the heating element or heat in the surrounding environment, and reduces the temperature of the heating element.

[0051] In some embodiments, the phase change temperature of the phase change material 20 is 90 degrees Celsius to 150 degrees Celsius. The phase change material 20 undergoes phase change to absorb heat generated by the heating element or heat in the surrounding environment, thereby reducing the temperature of the heating element.

[0052] In some embodiments, the phase change temperature of the phase change material 20 is 130 degrees Celsius to 150 degrees Celsius. The phase change material 20 undergoes phase change, absorbs heat generated by the heating element or heat in the surrounding environment, and reduces the temperature of the heating element.

[0053] In some embodiments, the phase change enthalpy of the phase change material 20 is greater than 60 J / g, which means that each gram of the phase change material 20 can absorb more than 60 joules of energy when the phase change occurs.

[0054] In some embodiments, the phase change enthalpy of the phase change material 20 ranges from 80 J / g to 250 J / g, which means that each gram of the phase change material 20 can absorb 80 joules to 250 joules of energy when the phase change occurs.

[0055] In some embodiments, the phase change enthalpy of the phase change material 20 ranges from 150 J / g to 250 J / g, indicating that each gram of the phase change material 20 can absorb 150 joules to 250 joules of energy during phase change. Each gram of the phase change material 20 absorbs more energy at this time.

[0056] In the embodiment of the present application, a housing 10 and a phase change material 20 are provided. The housing 10 is provided with a closed hollow cavity 10a. The phase change material 20 is provided within the hollow cavity 10a. When the phase change material 20 is not undergoing a phase change, the phase change material 20 does not exceed 95% of the volume of the hollow cavity 10a. With this arrangement, when the temperature of the heat-generating components on the BMS board rises and reaches the phase change temperature of the phase change material 20, the phase change material 20 undergoes a phase change, absorbing the heat generated by the heat-generating components on the BMS board, thereby improving the heat dissipation of the BMS board and reducing the probability of damage to the components on the BMS board due to excessive temperature rise of the BMS board. At the same time, the phase change material 20 does not exceed 95% of the volume of the hollow cavity 10a, which can reduce the possibility of the phase change material 20 overflowing from the housing 10 when the phase change occurs, thereby affecting the heat dissipation effect of the radiator.

[0057] The present application also provides an embodiment of a battery pack 100, such as Figure 11 、 12 As shown, the battery pack 100 includes a cell assembly 30, a battery control assembly 40, a heat conducting plate 50, a battery housing 60, a first cover plate 70, a second cover plate 80, and the aforementioned heat sink 01. The cell assembly 30, the battery control assembly 40, and the heat conducting plate 50 are all disposed within the battery housing 60. The first cover plate 70 covers one end of the battery housing 60, and the second cover plate 80 covers the other end of the battery housing 60. The battery control assembly 40 is electrically connected to the cell assembly 30. The heat sink 01 is mounted on the battery control assembly 40 and is used to dissipate heat from the battery control assembly 40. The function and structure of the heat sink 01 can be found in the above embodiments and will not be described in detail here.

[0058] For the above-mentioned battery cell assembly 30 and battery control assembly 40, as Figure 11 and Figure 12 As shown, the battery cell assembly 30 includes a plurality of stacked battery cells (not shown), and the battery control assembly 40 is electrically connected to the battery cells. The battery cell assembly 30 can be used for charging and discharging, and the battery control assembly 40 is used to control the charging and discharging of the battery cell assembly 30 and protect the battery cell assembly 30.

[0059] In some embodiments, the battery control component 40 includes a circuit board 401, which can be used to stabilize the voltage of the battery pack and protect the normal operation of the battery pack. At the same time, when the battery pack is in the discharge process, the circuit board 401 will detect the voltage of the battery cell. When the battery cell power is too low, the output of power will be stopped to protect the battery cell. When the battery pack is in the charging process, when the battery is fully charged, the circuit board 401 can automatically disconnect the charging circuit to prevent the battery cell from being overcharged and damaged.

[0060] For the above-mentioned heat conducting plate 50, as Figure 11 and Figure 12As shown, one surface of the heat conducting plate 50 is attached to the outer surface of the housing 10, and the other surface of the heat conducting plate 50 is attached to the heating element to dissipate heat from the heating element. It is understood that the material used to make the heat conducting plate 50 can be a thermal interface material such as a thermally conductive silicone pad, thermally conductive silicone grease, or thermally conductive mud.

[0061] In some embodiments, there are two heat conducting plates 50 , which are respectively arranged on both sides of the boss 103 , thereby increasing the contact area between the heat conducting plates 50 and the radiator housing 10 , improving heat conduction to the heating element, and effectively protecting the heating element.

[0062] In some embodiments, the heat conducting plate 50 is provided with a recess (not marked), which is used for plugging into the boss 103 on the shell 10, thereby increasing the contact area between the heat conducting plate 50 and the radiator shell 10, improving heat conduction to the heating element, and effectively protecting the heating element.

[0063] For the battery housing 60, the first cover plate 70 and the second cover plate 80, as shown in FIG. Figure 11 As shown, the battery housing 60 is provided with a second receiving cavity and a third opening (not shown) connected to the second receiving cavity. The first cover plate 70 is provided on one end of the battery housing 60, and the second cover plate 80 is provided on the other end of the battery housing 60. The second receiving cavity forms a closed chamber. The second receiving cavity can be used to accommodate the battery cell assembly, the battery control assembly 40, and the heat conducting plate 50. The battery housing 60 can reduce the contact between the internal components of the battery pack and external components, limit external dust, and reduce the probability of external components causing short circuits in the internal components of the battery pack.

[0064] The present application also provides an embodiment of an electrical device, which includes the above-mentioned battery pack. The electrical device includes but is not limited to two-wheeled electric vehicles, energy storage equipment, handheld power tools, etc. The function and structure of the battery pack can be referred to the above-mentioned embodiments and will not be described in detail here.

[0065] In addition, this application also provides relevant tests when the phase change temperature and phase change enthalpy of the phase change material are different values. The specific test process is as follows:

[0066] Test materials: battery pack, MOS tube (heat-generating component), multi-channel thermometer, ordinary gear fin heat sink, radiator, thermal conductive silicone pad. The battery pack includes battery module, battery control component BMS board and shell assembly.

[0067] Comparative Example 1: No heat dissipation measures were taken for the heat-generating component MOS tube.

[0068] Comparative Example 2: An ordinary fin heat sink is fixed to the BMS board with bolts and located above the two rows of MOS tubes. The fin heat sink is connected to the two rows of MOS tubes via two thermally conductive silicone pads. The heat generated by the MOS tubes during charging and dissipating is introduced into the fin heat sink through the thermally conductive silicone pads and dissipated by natural convection.

[0069] MOS tube temperature rise test method: Place the battery pack in a 25°C constant temperature box and let it stand for 1 hour to allow the battery pack to reach a constant temperature. Then, the battery pack is charged at a constant current of 45A to a total voltage of 83V, and then charged at a constant voltage of 83V to a current of 0.5A. The battery pack is then allowed to stand for 2 hours, and then discharged at a constant current of 130A to a total voltage of 60V. During the charging and discharging process of the battery pack, a multi-channel thermometer is used to monitor the temperature of the MOS tube throughout the process.

[0070] Phase change material overflow test method: Place the radiator in a 150°C high temperature box and keep it for 120 hours. Then take the radiator out of the high temperature box and observe whether the phase change material in the radiator overflows from the packaging gap.

[0071] In one embodiment of the present application, Group A, a heat sink is bolted to the BMS board and positioned above two rows of MOS tubes. The heat sink is connected to the two rows of MOS tubes via two thermally conductive silicone pads. Heat generated by the MOS tubes during charging and discharging is transferred to the heat sink via the thermally conductive silicone pads. Simultaneously, the heat sink absorbs most of the heat through phase change heat storage and dissipates some heat through natural convection. The ends of the first shell of the heat sink are bolted to the second and third shells for encapsulation. Phase change material fills 95% of the volume of the hollow cavity. The phase change enthalpy of the phase change material in the heat sink is fixed at 200 J / g, and the phase change temperatures are 50°C, 60°C, 90°C, 130°C, 150°C, 180°C, and 190°C, respectively.

[0072] In one embodiment of the present application, Group B, a heat sink is bolted to the BMS board and located above two rows of MOS tubes. The heat sink is connected to the two rows of MOS tubes via two thermally conductive silicone pads. The heat generated by the MOS tubes during charging and discharging is transferred to the heat sink via the thermally conductive silicone pads. Simultaneously, the heat sink absorbs most of the heat through phase change heat storage and dissipates some heat through natural convection. The first shell of the heat sink is bolted to the second and third shells for encapsulation. The phase change material fills 95% of the volume of the hollow cavity. The phase change temperature of the phase change material is fixed at 130°C, and the phase change enthalpy values ​​are 50 J / g, 60 J / g, 80 J / g, 100 J / g, 150 J / g, and 250 J / g, respectively.

[0073] In Group C of one embodiment of the present application, a radiator is fixed to the BMS board via bolts and is located above two rows of MOS tubes. The radiator is connected to the two rows of MOS tubes via two thermally conductive silicone pads. The heat generated by the MOS tubes during the charging and discharging process is transferred to the radiator via the thermally conductive silicone pads. At the same time, the radiator absorbs most of the heat through phase change heat storage and dissipates some of the heat through natural convection. The two ends of the first shell of the radiator are connected and encapsulated with the second and third shells via bolts. The phase change temperature in the radiator is fixed at 130°C, and the phase change enthalpy is fixed at 200 J / g. The phase change material in the radiator fills 100%, 98%, 96%, and 90% of the hollow cavity, respectively.

[0074] The test parameters and test results are shown in Table 1.

[0075] Table 1

[0076]

[0077]

[0078] The test results in Table 1 show that in Example A, the phase change temperature of the phase change material is in the range of 50°C-190°C. Compared with the example without taking heat dissipation measures, the phase change material has a significant heat dissipation effect on the heat-generating component MOS tube when the phase change temperature is in the range of 60°C-180°C.

[0079] The experimental data from Example A shows that within the phase change temperature range of 60°C to 180°C, the MOS tube temperature is lower than that of the MOS tubes in Comparative Examples 1 and 2. This indicates that during this phase, the phase change material absorbs more heat, and the heat sink's heat dissipation effect is more pronounced. Specifically, within the phase change temperature range of 90°C to 180°C, the heat sink's heat dissipation effect gradually improves, ultimately reaching a good level, with the heat sink achieving its peak heat dissipation effect at 130°C. Similarly, within the phase change temperature range of 90°C to 150°C, the heat sink's heat dissipation effect gradually improves, ultimately reaching a good level, with the heat sink achieving its peak heat dissipation effect at 130°C. Furthermore, within the phase change temperature range of 130°C to 150°C, the heat sink's heat dissipation effect is superior to that in other ranges.

[0080] The experimental data from Example B shows that as the phase change enthalpy of the phase change material increases, the temperature drop of the MOS tube gradually increases. Compared with A4 in Example A, the temperature drop of the MOS tube gradually increases with the increase in the phase change enthalpy of the phase change material, indicating that the heat dissipation effect of the heat sink is getting better and better. Specifically, in the range of 80 J / g-150 J / g, the temperature drop of the MOS tube gradually increases with the increase in the phase change enthalpy of the phase change material, indicating that the heat dissipation effect of the heat sink is good. At the same time, the temperature drop of the MOS tube in this range is more significant than in other ranges.

[0081] From the experimental data in Example C group, it can be seen that when the phase change material encapsulation occupies 90% of the volume of the hollow cavity, the phase change material is not easy to overflow from the packaging gap, and compared with A4 in Example A group, it can be seen that when the proportion of the hollow cavity encapsulated by the phase change material is 90%-95%, the phase change material is not easy to overflow from the packaging gap, and the phase change material can dissipate heat normally at this time.

[0082] The heat dissipation effect of the heat sink is generally better than that of the fin heat sink. The heat dissipation effect of the heat sink is related to the phase change temperature and phase change enthalpy of the phase change material. In Example Group B, the heat sink B4 has a more obvious heat dissipation effect. That is, the phase change temperature is 130°C, the phase change enthalpy is 250 J / g, and the proportion of hollow cavities in the phase change material potting is 95%. At this time, the MOS tube temperature drops by 45°C, the heat sink cooling effect is significant, and there is no phase change material overflow.

[0083] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A battery pack, characterized in that: include; A battery cell assembly, comprising a plurality of stacked battery cells; a battery control assembly, electrically connected to the battery cell; and A heat sink comprising a housing and a phase change material, wherein the housing is provided with a closed hollow cavity; The phase change material is disposed in the hollow cavity, and when the phase change material does not undergo phase change, the phase change material does not exceed 95% of the volume of the hollow cavity; the radiator is used to dissipate heat from the battery control assembly; The housing is provided with a boss; The battery control assembly includes a circuit board; The battery pack further includes a heat conducting plate located above the circuit board, one surface of the heat conducting plate is attached to the outer surface of the boss, and the other surface of the heat conducting plate is attached to the heating element on the circuit board.

2. The battery pack according to claim 1, wherein: The phase change material does not exceed 90%-95% of the volume of the hollow cavity.

3. The battery pack according to claim 1, wherein: The phase change temperature of the phase change material is 60 degrees Celsius to 180 degrees Celsius.

4. The battery pack according to claim 1, wherein: The phase change temperature of the phase change material is 130 degrees Celsius to 150 degrees Celsius.

5. The battery pack according to claim 1, wherein: The phase change enthalpy value of the phase change material is greater than 60 J / g.

6. The battery pack according to any one of claims 1 to 5, characterized in that: The housing includes a first housing, a second housing and a third housing; The second shell is arranged at the first end of the first shell, and the third shell is arranged at the second end of the first shell. The first shell, the second shell and the third shell form a closed hollow cavity.

7. The battery pack according to any one of claims 1 to 5, characterized in that: A packaging film is included, and the packaging film covers the phase change material.

8. An electrical device, characterized in that: Comprising a battery pack as described in any one of claims 1 to 7.

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