A multi-path radio frequency circuit for PCB circuit board

Abstract

The present invention discloses a multi-path radio frequency circuit applied to a PCB circuit board, including a high-frequency main splitter connected to a high-frequency circuit and a plurality of N-level high-frequency sub-splitters, wherein the high-frequency main splitter RF SPLITER IC is connected to 1 to m secondary high-frequency sub-splitters, each secondary high-frequency sub-splitter is connected to 1 to m tertiary high-frequency sub-splitters, until each N-1-level high-frequency sub-splitter is connected to 1 to m N-level high-frequency sub-splitters, and each N-level high-frequency sub-splitter is connected to 1 to m high-frequency connectors. The present invention pioneers the design of a single high-frequency circuit path to achieve the function of multiple paths and multiple path high-frequency interface connectors for selection and use, provides multiple user interface effects in a variety of network devices, and produces a design that achieves the commonality of combined use of a variety of machine interfaces.

Description

Technical Field

[0001] The invention belongs to the technical field of communication equipment, and relates to a radio frequency circuit of a PCB circuit board, and specifically to a multi-path radio frequency circuit applied to a PCB circuit board. Background Art

[0002] Network communication has been booming all over the world, especially the application of wireless high-frequency network has been developing more rapidly. The characteristics of network communication are fast, timely and accurate, but the inevitable problem is that it is prone to failure. Once a failure occurs, it is very likely to cause the paralysis of the entire communication system. For existing high-frequency lines, they often only focus on the application of a single interface or function, and cannot be applied more widely. If the single interface of the high-frequency line is damaged, the platform machine will lose its own application function. If there is a multi-functional design, the platform machine can avoid the occurrence of the effective mode of the platform machine. The multi-functional design of the high-frequency line can also be applied to different environmental interface conditions to enable the machine to exert powerful performance. Therefore, this patent mainly focuses on the transformation of the high-frequency circuit with a single interface function on the market. Summary of the invention

[0003] Purpose of the invention: The purpose of the present invention is to provide a multi-path radio frequency circuit applied to a PCB circuit board in view of the deficiencies in the prior art.

[0004] Technical solution: The multi-path radio frequency line applied to a PCB circuit board described in the present invention includes a high-frequency main splitter and a plurality of N-level high-frequency sub-splitters connected to the high-frequency line. The high-frequency main splitter RF SPLITERIC is connected to 1 to m secondary high-frequency sub-splitters, each secondary high-frequency sub-splitter is connected to 1 to m tertiary high-frequency sub-splitters, until each N-1-level high-frequency sub-splitters is connected to 1 to m N-level high-frequency sub-splitters, and each N-level high-frequency sub-splitters is connected to 1 to m high-frequency connectors.

[0005] Furthermore, to facilitate the path selection of the control signal, the high-frequency main splitter and each high-frequency sub-splitter are connected to a high-frequency path controller.

[0006] Further, as a preferred embodiment, the high-frequency main splitter RF SPLITTERIC 1 is connected to the first-level high-frequency sub-splitter RF SPLITTER IC 2 through path A, and is connected to the first-level high-frequency sub-splitter RF SPLITTERIC 3 through path B. The high-frequency main splitter RF SPLITTERIC 1 is connected to a high-frequency path controller Controller A, the first-level high-frequency sub-splitter RF SPLITTERIC 2 is connected to a high-frequency path controller ControllerB, and the first-level high-frequency sub-splitter RFSPLITTER IC 3 is connected to Controller C; the first-level high-frequency sub-splitter RF SPLITTER IC2 is connected to the high-frequency connector RF Connector C through path C, and is connected to the high-frequency connector RF Connector D through path D; the first-level high-frequency sub-splitter RF SPLITTER IC 3 is connected to the high-frequency connector RF Connector E through path E, and is connected to the high-frequency connector RF Connector F through path F.

[0007] Further, as a preferred implementation, the RF Connector C is an RF female SMA type connector; the RF Connector D is an RF female TNC type connector; the RF Connector E is an RF MXC type connector; and the RF Connector E is an RF IPEX type connector.

[0008] Beneficial effects: The present invention innovatively transforms the existing single high-frequency line path design into a multi-path design through the present invention's design scheme to achieve the functions of multiple paths and multiple path high-frequency interface connectors for selection and use, providing multiple user interface effects in a variety of network devices, and creating a design that achieves the commonality of combined use of a variety of machine interfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 The overall circuit connection diagram designed for the present invention. DETAILED DESCRIPTION

[0010] The technical solution of the present invention is described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the embodiments.

[0011] Embodiment: A multi-path radio frequency line applied to a PCB circuit board, a high-frequency main splitter RF SPLITTER IC 1 is connected to a first-level high-frequency sub-splitter RF SPLITTER IC 2 through path A, and is connected to a first-level high-frequency sub-splitter RF SPLITTER IC 3 through path B, the high-frequency main splitter RF SPLITTER IC 1 is connected to a high-frequency path controller Controller A, the first-level high-frequency sub-splitter RF SPLITTER IC 2 is connected to a high-frequency path controller Controller B, and the first-level high-frequency sub-splitter RF SPLITTER IC 3 is connected to Controller C; the first-level high-frequency sub-splitter RF SPLITTER IC 2 is connected to a high-frequency connector RF Connector C through path C, and is connected to a high-frequency connector RF Connector D through path D; the first-level high-frequency sub-splitter RF SPLITTER IC 3 is connected to a high-frequency connector RF Connector E through path E, and is connected to a high-frequency connector RF Connector F through path F. In this embodiment, RF Connector C is an RF female SMA type connector; RF Connector D is an RF female TNC type connector; RF Connector E is an RF MXC type connector; and RF Connector E is an RF IPEX type connector.

[0012] The present invention innovatively transforms the existing single high-frequency line path design into a multi-path and multi-path high-frequency interface connector that can be selected for use through the design of the present invention, providing multiple user interface effects in a variety of network devices, and creating a design that achieves the commonality of combined use of a variety of machine interfaces.

[0013] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and details may be made without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A multi-path radio frequency circuit applied to a PCB circuit board, characterized in that: It includes a high-frequency main splitter connected to the high-frequency line and a number of N-level high-frequency sub-splitters. The high-frequency main splitter RF SPLITER IC is connected to 1~m secondary high-frequency sub-splitters, each secondary high-frequency sub-splitter is connected to 1~m tertiary high-frequency sub-splitters, until each N-1-level high-frequency sub-splitter is connected to 1~m N-level high-frequency sub-splitters, and each N-level high-frequency sub-splitter is connected to 1~m high-frequency connectors; The high-frequency main splitter and each high-frequency auxiliary splitter are connected to a high-frequency path controller; The high-frequency main splitter RF SPLITTER IC 1 is connected to the first-level high-frequency sub-splitter RF SPLITTER IC2 through path A, and is connected to the first-level high-frequency sub-splitter RF SPLITTER IC 3 through path B. The high-frequency main splitter RF SPLITTER IC 1 is connected to a high-frequency path controller Controller A, the first-level high-frequency sub-splitter RF SPLITTER IC 2 is connected to a high-frequency path controller Controller B, and the first-level high-frequency sub-splitter RF SPLITTER IC 3 is connected to Controller C; the first-level high-frequency sub-splitter RF SPLITTER IC 2 is connected to the high-frequency connector RF Connector C through path C, and is connected to the high-frequency connector RF Connector D through path D; the first-level high-frequency sub-splitter RF SPLITTER IC 3 is connected to the high-frequency connector RF Connector E through path E, and is connected to the high-frequency connector RF Connector F through path F; The RF Connector C is an RF female SMA type connector; the RF Connector D is an RF female TNC type connector; the RF Connector E is an RF MXC type connector; RFConnector E is the RF IPEX type connector model.

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