A carrying device and a detection device

Abstract

A carrying device and detection equipment, the carrying device includes a substrate member, a support member and a carrying member; the substrate member is provided with a positioning through-hole for the carrying member to move through; the support member is movably connected to the substrate member, and is used to support the workpiece to be carried above the positioning through-hole when moving in a direction close to the positioning through-hole; the carrying member is used to approach the workpiece to be carried through the positioning through-hole to achieve the support and fixation of the workpiece to be carried, thereby driving the workpiece to be carried relative to the support member and / or the substrate member. Since the carrying member can move independently relative to the support member and / or the substrate member, the workpiece to be carried can be constrained on the movement trajectory of the carrying member by using the support member, and the support and fixation of the workpiece to be carried can be completed when the carrying member passes by; there is no need to set any structural components or mechanisms on the carrying member for picking up and placing the workpiece to be carried, which can not only reduce the load of the carrying member itself, but also create conditions for improving its load-bearing performance by improving and optimizing the structure of the carrying member.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a carrying device and a detection device. Background Art

[0002] As is well known, during the manufacturing and testing of wafers, integrated chips, flat-panel displays, and other micro or precision semiconductor devices, a carrier (i.e., a chuck) is often required to support and secure the semiconductor devices. This carrier, in turn, allows for the transfer of the semiconductor devices' positions or workstations. In the prior art, carriers typically employ the following structural forms.

[0003] 1. An opening structure is provided on the carrying plate of the carrying device to match a grasping device such as a robot, so that the robot can place the workpiece on the carrying plate or remove the workpiece from the carrying plate through the opening structure; the setting of the opening structure often affects the structure and performance of the carrying plate itself, such as flatness, and it is easy to reduce the carrying effect on the workpiece. For example, when carrying and fixing the wafer, the carrying plate itself needs to maintain a high flatness (or flatness) to ensure that the wafer it carries has a high flatness. Otherwise, the wafer is prone to warping, sagging, or even breakage due to uneven force on the wafer, which is not conducive to the manufacturing and testing of the wafer.

[0004] 2. A liftable support mechanism is provided on the carrier plate of the carrier device, so as to move the wafer away from or closer to the carrier plate through the support mechanism, thereby completing the wafer taking and placing operation with the cooperation of a grasping device such as a robot; however, the provision of such a support mechanism not only increases the structural complexity of the carrier plate itself, but also has an adverse effect on the load-bearing capacity of the carrier plate itself. Summary of the Invention

[0005] The main technical problem solved by the present invention is to provide a load-bearing device and a detection device using the load-bearing device, so as to achieve the purpose of optimizing the structure and improving the load-bearing performance.

[0006] According to a first aspect, an embodiment provides a carrying device, comprising a substrate member, a support member, and a carrying member, wherein:

[0007] The substrate member is provided with a positioning through hole, and the positioning through hole is used for allowing the carrier to move through the substrate member;

[0008] The support member is arranged on the base member and is movably connected to the base member so as to move toward or away from the positioning through hole. The support member is used to abut against the workpiece to be loaded when moving toward the positioning through hole, so as to support the workpiece to be loaded above the positioning through hole.

[0009] The carrier is used to approach or move away from the workpiece to be carried via the positioning through hole, and when approaching the workpiece to be carried, it can carry and fix the workpiece to be carried, thereby driving the workpiece to be carried to move relative to the support member and / or the base member.

[0010] In one embodiment, the carrier is a circular or regular polygonal disc structure, the substrate is defined with a circular track distributed around the center line of the carrier, there are at least three support members distributed around the center line of the carrier, and the support members can be controllably moved to the circular track so that when the support members abut against the workpiece to be carried, the center of the workpiece to be carried coincides with the center of the circular track.

[0011] In one embodiment, the support member includes a positioning member, and the positioning member includes a radial portion and an axial portion. The radial portion is distributed along the radial direction of the circular trajectory, and the radial portion is movably connected to the substrate member, and is used to support the surface edge of the workpiece to be carried adjacent to the side of the substrate member; the axial portion is distributed along the axial direction parallel to the circular trajectory, and one end of the axial portion adjacent to the substrate member is connected to the end of the radial portion away from the circular trajectory, and is used to abut against the circumferential surface of the workpiece to be carried.

[0012] In one embodiment, the positioning member further includes a first guide slide portion, which is provided on a surface of the radial portion facing away from the axial portion along the radial direction of the circular trajectory, and the base member is provided with a second guide slide portion, which is slidably connected to the first guide slide portion along the radial direction of the circular trajectory.

[0013] and / or

[0014] The positioning member further includes a first locking portion, and the base plate member is provided with a second locking portion. The first locking portion cooperates with the second locking portion to lock the positioning member at a preset position of the base plate member.

[0015] In one embodiment, at least one of the supporting members further comprises a positioning driving member, wherein a power end of the positioning driving member is coupled to the positioning member for driving the positioning member to move closer to or away from the circular trajectory.

[0016] In one embodiment, the substrate member includes a substrate portion and a base ring portion, the positioning through holes are distributed through the substrate portion, and the base ring portion is arranged around the edge of the positioning through holes; the end face of the base ring portion away from the substrate portion is used to support the surface edge of the side of the loaded workpiece adjacent to the substrate member, and / or is used to be movably connected to the support member.

[0017] In one embodiment, the end surface of the base ring portion away from the substrate portion is provided with a plurality of supporting bosses, and the supporting bosses are used to support the surface edge of the workpiece adjacent to the substrate portion and / or to be movably connected to the supporting member.

[0018] In one embodiment, the carrier comprises:

[0019] A carrying base, used to approach or move away from a workpiece to be carried via the positioning through hole; and

[0020] A plurality of vacuum holes are evenly distributed on the bearing surface of the bearing substrate, and the vacuum holes are used to communicate with a vacuum source to generate an adsorption force, thereby adsorbing and fixing the workpiece to be carried on the bearing substrate.

[0021] In one embodiment, the carrier further includes an annular flange, which is arranged around the edge of the carrier base and is used to enclose a vacuum cavity on the carrier base; a plurality of vacuum holes are located in the vacuum cavity to generate a negative pressure effect in the vacuum cavity.

[0022] In one embodiment, the carrier also includes a plurality of supporting protrusions evenly distributed in the vacuum cavity, the height of the annular flange is greater than or equal to the height of the supporting protrusions, and the vacuum hole is located in the gap formed by at least two adjacent supporting protrusions, so that the workpiece to be carried is offset from the supporting protrusions when the workpiece to be carried is adsorbed.

[0023] In one embodiment, a carrier driving member is further included, wherein the power end of the carrier driving member is coupled to the carrier, and is used to drive the carrier to move the workpiece to be carried relative to the support member and / or the substrate member, so that the workpiece to be carried is close to or away from the support member.

[0024] According to the second aspect, an embodiment provides a detection device, comprising a detection device and the carrying device described in the first aspect; wherein, a detection functional position is defined along the movement trajectory of the carrying member, and the detection device is used to detect the workpiece when the carrying member drives the workpiece to move to the detection functional position.

[0025] According to the above embodiment, a carrying device includes a substrate member, a support member and a carrying member; the substrate member is provided with a positioning through-hole for the carrying member to move through; the support member is movably connected to the substrate member, and is used to support the workpiece to be carried above the positioning through-hole when moving in a direction close to the positioning through-hole; the carrying member is used to approach the workpiece to be carried through the positioning through-hole to achieve the support and fixation of the workpiece to be carried, thereby driving the workpiece to be carried relative to the support member and / or the substrate member. Since the carrying member can move independently relative to the support member and / or the substrate member, the workpiece to be carried can be constrained on the movement trajectory of the carrying member by using the support member, and the support and fixation of the workpiece to be carried can be completed when the carrying member passes by; there is no need to set any structural components or mechanisms on the carrying member for picking up and placing the workpiece to be carried, which can not only reduce the load of the carrying member itself, but also create conditions for improving its load-bearing performance by improving and optimizing the structure of the carrying member. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a carrying device according to an embodiment after the carrying member moves through the substrate member.

[0027] Figure 2 This is a structural schematic diagram of a carrying device according to an embodiment when the carrying member is in an initial state.

[0028] Figure 3 This is a schematic diagram of the structural decomposition of a carrying device after removing the carrying member in one embodiment.

[0029] Figure 4 for Figure 3 Schematic diagram of the enlarged local structure of area A in the middle.

[0030] Figure 5 Schematic diagram of the planar structure of a carrying device according to an embodiment.

[0031] Figure 6 The figure is a schematic diagram of the front side structure of a carrier of a carrier device according to an embodiment.

[0032] Figure 7 Schematic diagram of the back structure of a carrying component of a carrying device in one embodiment.

[0033] Figure 8 This is a schematic diagram of the structural assembly of a carrying device in another embodiment.

[0034] Figure 9 A schematic structural diagram of a correction plate used in conjunction with a carrying device according to one embodiment.

[0035] Figure 10 The figure is a schematic planar structural diagram of a carrying device in an embodiment when a correction plate is used.

[0036] In the picture:

[0037] 10. Base plate member; 11. Base plate portion; 12. Base ring portion; 13. Second guide slide portion; 14. Second locking portion; 15. Support boss; 20. Support member; 21. Positioning member; 21-1. Radial portion; 21-2. Axial portion; 21-3. First guide slide portion; 21-4. First locking portion; 22. Positioning drive member; 30. Support member; 31. Support base; 32. Annular flange; 33. Vacuum hole; 34. Supporting protrusion; 35. Connecting hole; a. Positioning through hole; A. Correction disk; A1. Storage groove. DETAILED DESCRIPTION

[0038] The present invention will be further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions, and for those skilled in the art, it is not necessary to describe these related operations in detail. They will fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0039] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0040] Component numbers used herein, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0041] The term "center" used in this article refers to the center of the geometric shape of each component, which can be a center point or a center line; therefore, "center coincidence" can be understood as the center point or center line coincidence.

[0042] Example 1

[0043] Please refer to Figures 1 to 8 A carrying device provided in an embodiment is mainly used to carry and fix the components to be carried, so as to ultimately achieve the purpose of carrying the components to be carried. It is mainly composed of a substrate component 10, a support component 20 and a carrying component 30; wherein, the components to be carried include but are not limited to wafers, integrated chips, flat panel display devices and other miniature and precision semiconductor devices or non-semiconductor components, which are described below respectively.

[0044] See also Figures 1 to 5The substrate member 10 is mainly used to provide a structural space or structural foundation for the assembly and movement of the support member 20. It is usually arranged in a preset fixed spatial environment, such as on processing equipment, testing equipment and other equipment; a positioning through-hole a is provided on the substrate member 10 in a vertical direction. The size of the positioning through-hole a is slightly larger than the size of the carrier 30, so as to provide a structural channel for the movement of the carrier 30, so that the carrier 30 can move from the lower side of the support member 20 to the upper side of the substrate member 20 through the positioning through-hole a. In this embodiment, the substrate member 10 is mainly composed of a substrate portion 11 and a base ring portion 12; wherein, the substrate portion 11 can be used to fix the entire substrate member 10 in a preset spatial environment, and the positioning through-holes a are distributed along the vertical direction through the substrate portion 11; the base ring portion 12 is a closed-loop structure, which is detachably arranged around the edge of the positioning through-hole a, and the end face of the base ring portion 12 away from the substrate portion 11 can support the bottom edge of the workpiece to be loaded, so as to support and mount the workpiece to be loaded on the positioning through-hole a. Above the substrate part 10, or using the end face as a structural part for the support member 20 to move and connect to the substrate part 10, so as to construct a structural channel with a certain height on the substrate part 11 through the base ring part 12 and the positioning through hole a, so that the support member 20 can support the wafer according to a certain height difference and set it on the upper side of the substrate part 10 (or the positioning through hole a), and then after the carrier 30 moves through the structural channel, it can carry and fix the wafer, so as to finally drive the wafer to detach from the support member 20 and realize the carrying of the wafer.

[0045] In other embodiments, the base ring portion 12 can also be assembled with the base plate portion 11 in a non-detachable manner, or the two can be integrally formed by machining, 3D printing, or other processing methods. Figure 8 Alternatively, the base ring portion 12 can be omitted, and the substrate portion 11 with the positioning through hole a can be directly used as the substrate member 10. By selecting the structural structure and dimensional parameters of the support member 20, the support member 20 can support the wafer at a certain height difference and mount it above the positioning through hole a. Of course, the substrate portion 11 can also be omitted, and the base ring portion 12 can be directly used as the substrate member 10, and the space enclosed by the base ring portion 12 can be used as the positioning through hole a.

[0046] See also Figures 1 to 5 and Figure 8The support member 20 mainly plays the role of supporting and positioning the workpiece to be loaded, so that the workpiece to be loaded can be supported and mounted on the upper side of the substrate member 10 (specifically the positioning through hole a), so that the workpiece to be loaded can be supported and fixed when the carrier 30 approaches the workpiece to be loaded; there are multiple support members 20, such as two, three, four or more, and multiple support members 20 are arranged on the substrate member 10 and distributed around the positioning through hole a. At the same time, the support member 20 is configured to be able to move relative to the substrate member 10, such as by connecting a driving mechanism or configuring a transmission structure in an automatic or manual manner, so that the support member 20 can move in a direction close to or away from the positioning through hole a, thereby adjusting the relative position relationship of each support member 20 on the substrate member 10 or the relative position between the support member 20 and the positioning through hole a, so that the support member 20 can adapt to and undertake the support of workpieces to be loaded of different sizes and shapes, thereby achieving the effect of positioning and supporting the workpiece to be loaded.

[0047] In one embodiment, a guide sliding structure (such as a guide rail structure or a slide groove structure) or a screw transmission structure corresponding to the support member 20 can be provided on the end surface of the base ring portion 12 away from the substrate portion 11, so that the support member 20 and the substrate portion 10 are structurally combined to establish a motion connection relationship between the support member 20 and the substrate portion 10, thereby completing the motion control of the support member 20 in a manually driven manner. In another embodiment, if the base ring portion 12 is omitted, a driving mechanism such as a cylinder or a linear driving mechanism composed of a micro motor + a screw transmission mechanism can be provided on the substrate portion 11, and the power end of the driving mechanism is coupled to the support member 20. A motion connection relationship can also be established between the support member 20 and the substrate portion 10, thereby driving the support member 20 to move in the space above the positioning through hole a to complete the support of the workpiece to be carried.

[0048] See also Figure 1 、 Figure 2 、 Figure 5 、 Figure 6 and Figure 7The carrier 30 primarily serves to securely support the workpiece to be loaded, thereby enabling the workpiece to be transported. It is configured to at least be capable of vertical movement relative to the substrate 10 (and / or the support 20). (Of course, depending on actual needs, such as when processing or testing the workpiece is required, the carrier 30 may also be capable of rotational or translational movement relative to the substrate 10.) In a specific implementation, the carrier 30 is controlled to be raised and lowered, allowing it to pass through the positioning through-hole a from the bottom side of the substrate 10 and then move to the top side of the substrate 10, thereby approaching the workpiece supported on the support 20. This allows the workpiece to be secured and supported by means such as adsorption, clamping, or gripping, freeing it from the constraints of the support 20. Furthermore, the workpiece is driven to move relative to the support 20 (and / or the substrate 10) (e.g., raising and lowering, rotating, or translating), thereby enabling the workpiece to be transported, allowing subsequent processing, manufacturing, and process testing of the workpiece.

[0049] In this embodiment, the carrier 30 is mainly based on the vacuum adsorption principle, and the vacuum adsorption force generated is used to achieve the support and fixation of the workpiece to be carried; Figure 6 The carrier 30 includes a carrier base 31, an annular flange 32 and a plurality of vacuum holes 33; wherein the carrier base 31 is the basic structure of the carrier 30, and its contour shape can be actually selected according to the contour shape of the workpiece to be carried. For example, when the workpiece to be carried is a wafer, since the wafer is usually round, the contour shape of the carrier base 31 can be a centrally symmetrical figure, such as a circle or a regular polygon; for example, when the contour shape of the workpiece to be carried is a regular or irregular geometric figure, the shape of the carrier base 31 is preferably the same as the shape of the workpiece to be carried, so as to create conditions for uniform force application to the entire area of ​​the workpiece to be carried; the annular flange 32 is arranged around the edge of the carrier base 31 to The carrier substrate 31 encloses a vacuum cavity; multiple vacuum holes 33 are evenly distributed on the carrier surface of the carrier substrate 31 and located within the vacuum cavity. By connecting the vacuum holes 33 to a vacuum source, such as a vacuum pump, a negative pressure effect can be generated within the area enclosed by the vacuum cavity, enabling the entire carrier 30 to generate an adsorption force. In particular, when a workpiece to be loaded, including a wafer, is stacked and placed on the carrier substrate 31, and the surface of the annular flange 32 abuts against the surface of the workpiece to be loaded, the vacuum cavity is effectively sealed, thereby forming a sealed chamber between the workpiece to be loaded and the carrier 30, thereby firmly adsorbing and fixing the workpiece to be loaded to the carrier substrate 31. In other embodiments, the annular flange 32 can be omitted, and the adsorption force generated by the vacuum holes 33 can be used to directly adsorb and fix the workpiece to be loaded to the carrier substrate 31.

[0050] To sum up, the workpiece to be carried is supported and fixed by the cooperation between the support member 20 and the carrier 30. Since the support member 20 is arranged on the substrate member 10, there is no direct structural relationship between it and the carrier 30, so that the carrier 30 can move independently of the support member 20 (together with the substrate member 10); therefore, the workpiece to be carried only needs to be constrained by the support member 20 on the movement trajectory of the carrier 30 in a supporting and erected manner, and the support and fixation of the workpiece to be carried and the subsequent carrying operation can be directly completed by manipulating the carrier 30. On the one hand, there is no need to set any structural components or mechanisms on the carrier 30 to facilitate the placement of the workpiece to be loaded or for pre-positioning the workpiece to be loaded, such as an opening structure, a liftable support mechanism, etc., which can not only simplify the structure of the carrier 30 and reduce the load of the carrier 30 itself, but also create favorable conditions for improving the structural characteristics of the carrier 30 itself, such as flatness, to ensure the loading and carrying effect; on the other hand, in the case of multiple support members 20, the center of the workpiece to be loaded can be adjusted and positioned by using the support member 20, so that the center of the workpiece to be loaded can eventually coincide with the center of the carrier 30, thereby increasing the effective contact area between the carrier 30 and the workpiece to be loaded, so that the carrier 30 can apply force to the workpiece to be loaded in a centered and uniform manner, thereby avoiding a series of problems such as warping, sagging, or even breakage of the workpiece in local areas due to uneven force after the workpiece to be loaded is loaded and fixed.

[0051] For one example, see Figure 5(In the figure, the double-headed dotted arrow represents the movement direction or trajectory of the support member 20, and the dotted circle represents the circular trajectory described below), the carrier 30 is a disc-shaped structure, and its contour shape is a centrally symmetrical figure, such as a circle or a regular polygon; based on the shape structure of the carrier 30, a circular trajectory for distribution around the center line of the carrier 30 can be defined on the substrate member 10, and the circular trajectory can be virtual or a marking line actually marked on the substrate member 10; when the carrier 30 moves through the positioning through hole a to a position where it can carry and fix the workpiece to be carried, the center of the circular trajectory coincides with the center of the carrier 30, which can be understood as: when the carrier 30 is circular, the circular trajectory is the contour trajectory of the carrier 30 at this time; when the carrier 30 is a regular polygon, the circular trajectory is the circumscribed circle trajectory or the inscribed circle trajectory of the carrier 30 at this time. Accordingly, at least three support members 20 should be configured on the substrate member 10. In the initial state, the at least three support members 20 should be distributed around the center line of the carrier 30. By controlling the position of each support member 20, when each support member 20 moves to a circular trajectory, it is equivalent to making the center of the geometric area enclosed by each support member 20 overlap with the center of the circular trajectory, thereby making the center of the geometric area overlap with the center of the carrier 30. In this way, the center of the workpiece to be loaded can be determined by using each support member 20, so that the center of the workpiece to be loaded can eventually coincide with the center of the carrier 30. Specifically, after each support member 20 is adjusted to the circular trajectory, the position positioning of the support member 20 is realized. Then, when the workpiece to be loaded is placed in the geometric area surrounded by each support member 20 by a grasping device such as a robot, the abutment relationship between each support member 20 and the workpiece to be loaded can be used to jointly constrain the workpiece to be loaded so that the center of the workpiece to be loaded falls on the center line of the carrier 30; finally, the carrier 30 moves through the positioning through hole a and approaches the workpiece to be loaded to finally complete the loading and fixing of the workpiece to be loaded. The center of the carrier 30 will naturally coincide with the center of the workpiece to be loaded, thereby ensuring that the carrier 30 can evenly load the workpiece to be loaded and maximize the contact area between the two, effectively avoiding a series of problems caused by uneven force on the workpiece to be loaded, especially avoiding warping, sagging, or even breakage in local areas of the wafer, creating favorable conditions for wafer manufacturing, testing, and improving the quality of finished wafers.

[0052] In one embodiment, the aforementioned circular trajectory can be determined by the cooperation between relevant components. For example, a correction device that matches the shape and size of the workpiece to be carried can be configured to correct the position of each support member 20 so that each support member 20 is located on the same circular trajectory, thereby making the center of the geometric area enclosed by each support member 20 coincide with the center of the circular trajectory. Figure 9 and Figure 10 ,in, Figure 10 The dashed, one-way arrow in the middle represents the direction of movement of the support member 20. The dashed circle represents a circular trajectory or the contour trajectory of the calibration disk A described below. The dotted circle represents the carrier 30. The calibration device includes a calibration disk A having a centrally symmetrical outline, such as a circle or a regular polygon. The contour of the workpiece to be carried is centrally symmetrical to match the calibration disk A. A receiving groove A1 having a shape and dimensions identical or similar to those of the carrier 30 can be provided on the surface of the calibration disk A. The center of the receiving groove A1 coincides with the center of the calibration disk A. Thus, when calibrating and positioning each support member 20, the carrier 30 can be pre-controlled to move through the positioning through-hole a into the area enclosed by each support member 20. The calibration disk A is then placed on the carrier 30 and received within the receiving groove A1, so that the center of the carrier 30 coincides with the center of the calibration disk A. Subsequently, the support members 20 are adjusted so that each support member 20 abuts against the edge of the correction disk A. Based on the characteristics of the contour shape of the correction disk A, if the contour shape of the correction disk A is a circle, the contour trajectory of the correction disk A is the aforementioned circular trajectory. If the contour shape of the correction disk A is a regular polygon, when each support member 20 abuts against the edge line of the correction disk A, the inscribed circle trajectory of the correction disk A is the aforementioned circular trajectory. When each support member 20 abuts against the corners of the correction disk A, the circumscribed circle trajectory of the correction disk A is the aforementioned circular trajectory. Thus, the abutment relationship between each support member 20 and the correction disk A can be used to determine the aforementioned circular trajectory, the geometric area enclosed by each support member 20, and the specific position of each support member 20, so that the center of the geometric area, the center of the correction disk A, and the center of the carrier 30 coincide with each other. Finally, the calibration plate A is removed, and the workpiece to be loaded is placed in the geometric area surrounded by the supporting members 20 . After being supported and constrained by the supporting members 20 , the center of the workpiece to be loaded coincides with the center of the carrier 30 .

[0053] In some embodiments, the correction disk A can be used to initialize and correct the positioning of each support member 20. Since the center of the geometric area enclosed by each support member 20 has coincided with the center of the carrier 30, when the carrying device is actually used, each support member 20 can be controlled to adjust its position with the same displacement amount, so that the size of the geometric area can be adjusted without changing the center of the aforementioned geometric area, thereby adapting to workpieces of different sizes to be loaded, ensuring that the center of the corresponding workpiece to be loaded can eventually coincide with the center of the carrier 30 under the constraint of the support member 20.

[0054] For one example, see Figure 3 and Figure 4The support member 20 includes a positioning member 21, which is mainly used to abut against the workpiece to be loaded to constrain the center position of the workpiece to be loaded. The positioning member 21 includes a radial portion 21-1 and an axial portion 21-2; wherein the radial portion 21-1 is used to support the surface edge of the workpiece to be loaded adjacent to the substrate member 10, and is distributed along the radial direction of the circular trajectory, and is movably connected to the substrate member 10 (such as the end face of the base ring portion 12 away from the substrate portion 11) (such as a sliding connection, a screw transmission connection based on a threaded structure, etc.); the axial portion 21-2 is mainly used to abut against the circumferential surface of the workpiece to be loaded, and is distributed along the axial direction parallel to the circular trajectory, and one end of the axial portion 21-2 adjacent to the substrate member 10 is connected to the end of the radial portion 21-1 away from the circular trajectory. In this way, after each support member 20 is adjusted to a circular trajectory, a geometric area can be formed on the upper side of the positioning through hole a, the center of which coincides with the center line of the carrier 30. After the workpiece to be loaded is placed in the geometric area, the radial portion 21-1 of each positioning member 21 will support the edge of the workpiece to be loaded from the bottom side of the workpiece to be loaded, and the axial portion 21-2 will abut against the circumference of the workpiece to be loaded, thereby constraining the workpiece to be loaded within the geometric area, that is, supporting the workpiece to be loaded so that the center of the workpiece to be loaded coincides with the center of the geometric area; in the loading and fixing stage, the carrier 30 completes the loading and fixing of the workpiece to be loaded by coinciding with the center of the workpiece to be loaded, and then can drive the workpiece to be loaded to move in the vertical direction, and after leaving the geometric area, perform lifting, translation, rotation and other carrying actions, or directly drive the workpiece to be loaded to rotate within the geometric area with its center line as the axis.

[0055] For one example, see Figure 3 and Figure 4, the positioning member 21 also includes a first guide sliding portion 21-3 and a first locking portion 21-4; accordingly, a second guide sliding portion 13 and a second locking portion 14 are provided on the substrate member 10 (such as the end surface of the base ring portion 12 away from the substrate portion 11); wherein the first guide sliding portion 21-3 is arranged on the surface of the radial portion 21-1 away from the axial portion 21-2 along the radial direction of the circular trajectory, and one of the first guide sliding portion 21-3 and the second guide sliding portion 13 can be a slide rail structure and the other can be a slide groove structure, and the alignment relationship between the first guide sliding portion 21-3 and the second guide sliding portion 13 can be used between the positioning member 21 and the substrate member 10 along the circular trajectory. A linear sliding connection is established in the radial direction of the circular track. By driving the positioning member 21 to move relative to the substrate member 10, the positioning member 21 can be moved toward or away from the positioning through hole a (or the circular track). The first locking portion 21-4 can be arranged on both sides of the radial portion 21-1 or the axial portion 21-2 along the circumferential direction of the circular track, or directly on the radial portion 21-1 or the axial portion 21-2 along the axial direction parallel to the circumferential track. The first locking portion 21-4 can be a through-hole structure, such as a circular or elongated through-hole structure. The second locking portion 14 corresponds to the first locking portion 21-4, such as a slot structure or a blind hole structure. In this way, the positioning member 21 can be manually or automatically driven to move to a predetermined position (such as the aforementioned circular track) under the action of the guide slide. The positioning member 21 can then be locked in position using hardware such as screws by utilizing the alignment between the first locking portion 21-4 and the second locking portion 14, thereby achieving positioning and locking of the positioning member 21. In another embodiment, the first locking portion 21 - 4 and the second locking portion 14 may be omitted, and the positioning of the positioning member 21 may be achieved by configuring the first guide sliding portion 21 - 3 and the second guide sliding portion 13 as a damping sliding structure.

[0056] For one example, see Figure 8 and combined Figures 1 to 4The support member 20 also includes a positioning drive member 22, which is mainly used to drive the positioning member 21 to approach or move away from the circular trajectory (it can also be understood as moving in the direction of approaching or moving away from the positioning through hole a), so that the positioning member 21 can automatically move to a preset position; the positioning drive member 22 can adopt power devices such as cylinders, motors, etc. according to actual conditions, and its body can be selectively fixedly connected to the substrate member 10 (such as the substrate part 11), and the power end of the positioning drive member 22 is coupled to the positioning member 21 (such as directly connecting the power end of the cylinder to the positioning member 21, or the power shaft of the motor is connected to the positioning member 21 by means of a screw drive); in specific implementation, the base ring part 12 can be omitted or other structural parts can be used to replace the base ring part 12 to support and guide the positioning member 21. In addition, the configuration of the positioning drive member 22 can be selected according to actual needs. For example, all support members 20 are equipped with positioning drive members 22, so that the positioning member 21 can be regulated through the same management and regulation of each positioning drive member 22, or some support members 20 are equipped with positioning drive members 22, and the positioning member 21 can be regulated in a combined manual and automatic manner.

[0057] For one example, see Figures 1 to 4 A groove is provided on the substrate member 10 (specifically, the substrate portion 11) around the positioning through hole a, and the base ring portion 12 is structurally combined with the substrate portion 11 in a detachable manner through the groove. The base ring portion 12 is in the shape of a circular ring, and a plurality of supporting bosses 15 are provided on the end surface of the base ring portion 12 away from the substrate portion 11. Each supporting boss 15 corresponds to a support member 20 (specifically, a positioning member 21) to provide a structural basis for the corresponding support member 20 to be movably connected to the base ring portion 12. First, the base ring portion 12 is in the shape of a ring, which allows the initial positions of the support members 20 to be located on the same circular trajectory as much as possible, which helps to reduce the difficulty of controlling the displacement of the support members 20, thereby conveniently and quickly adjusting the positions of the support members 20 so that the support members 20 are located on the same circular trajectory as soon as possible; second, the support members 20 are structurally supported by the support bosses 15, which can avoid direct contact between the workpiece to be carried and the substrate member 10 (especially the base ring portion 12), and prevent the substrate member 10 from interfering with the placement position of the workpiece to be carried, so that the center of the workpiece to be carried can be determined by only using the support members 20 to constrain and position the workpiece to be carried. In another embodiment, please refer to Figure 1 and Figure 2There may not be a direct structural connection between the support member 20 and the base ring portion 12. For example, the support member 20 may be preset on the outer periphery of the contour of the base ring portion 12, and the support boss 15 may be used to pre-accept the workpiece to be loaded, and then the support member 20 is driven along the gap between two adjacent support bosses 15 to approach and abut against the workpiece to be loaded, so that the workpiece to be loaded is translated within the plane where the top surface of the support boss 15 is located; when all the support members 20 are on the same circular trajectory, the final positioning of the workpiece to be loaded can be completed.

[0058] For one example, see Figure 6 The carrier 30 also includes a plurality of supporting protrusions 34 for the workpiece to be carried to rest against. The plurality of supporting protrusions 34 are evenly distributed on the carrying surface of the carrier base 31 and are located in the vacuum slot cavity. The end of the supporting protrusion 34 that contacts the workpiece to be carried can adopt a hemispherical structure to achieve point contact and smooth contact with the workpiece to be carried; with the surface of the carrier base 31 as a reference, the height of the annular flange 32 is equal to the height of the supporting protrusion 34, and the vacuum hole 33 is located in the gap formed by at least two adjacent supporting protrusions 34; in this way, when carrying the workpiece to be carried, including the wafer, the surface of the workpiece to be carried can be simultaneously against the supporting protrusions 34 and the annular flange 32, and then the adsorption force generated by the vacuum hole 33 can be used to make the workpiece to be carried firmly rest against the supporting protrusions 34 and the annular flange 32, thereby completing the adsorption-type carrying and fixing of the workpiece to be carried. Using evenly distributed supporting protrusions 34 to support the workpiece to be loaded can not only create conditions for improving the flatness of the carrier 30 itself, but also form a full-area point contact effect between the carrier 30 and the surface of the workpiece to be loaded, which is beneficial to reducing scratches and damage to the workpiece to be loaded; at the same time, the adsorption force generated by the evenly distributed vacuum holes 33 and the cooperation of the supporting protrusions 34 can ensure the uniformity of the force on the workpiece to be loaded, avoiding problems such as warping and sagging in local areas due to uneven force on the workpiece to be loaded, thereby helping to improve the flatness of the workpiece to be loaded, so that it can better adapt to the process requirements of manufacturing, testing and other processes.

[0059] In another embodiment, the height of the annular flange 32 may also be greater than the height of the supporting protrusion 34. In this case, when the shape of the annular flange 32 is the same as the contour shape and similar size of the workpiece to be carried, including the wafer, the workpiece to be carried can be pressed downward toward the supporting base 31, so that the circumferential surface of the workpiece to be carried can be attached to and contacted with the inner circumferential wall of the annular flange 34 and abut against the supporting protrusion 34, thereby forming a closed vacuum chamber between the workpiece to be carried and the carrier 30, thereby finally completing the carrying and fixation of the workpiece to be carried.

[0060] In one embodiment, the vacuum holes 33 are distributed throughout the supporting base 31, and the end of the vacuum hole 33 away from the annular flange 32 is connected to the vacuum source through a pipeline to create conditions for the vacuum hole 33 to generate adsorption force. Figure 7 A vacuum pipeline is set inside the supporting base 31, and the vacuum hole 33 passes through the side surface of the supporting base 31 adjacent to the annular flange 32 to the vacuum pipeline. At the same time, a connecting hole 35 is set on the side surface of the supporting base 31 away from the annular flange 34, so that it is connected to the vacuum hole 33 through the vacuum pipeline, so that the vacuum source can be directly connected to the connecting hole 35 through the pipeline, and a complete flow channel can be established between the vacuum hole 33, the vacuum pipeline and the connecting hole 35, so that the vacuum hole 33 can finally have the conditions to generate adsorption force.

[0061] One embodiment provides a carrying device, which also includes a carrying drive component, which can be constructed according to actual conditions by combining power devices such as cylinders and motors with existing devices such as mechanical transmission modules and linear sliding modules; wherein the power end of the carrying drive component is coupled to the carrying component 30 (specifically the carrying base 11) so as to drive the carrying component 30 away from or close to the workpiece to be carried and to enable the carrying component 30 to drive the workpiece to be carried relative to the support component 20 or the base component 10 to move, such as lifting movement, rotational movement, translational movement, etc.

[0062] It should be noted that Figure 1 、 Figure 2 、 Figure 8 and Figure 9 The carrier 30 shown in FIG. 3 is a simplified diagram, in which the supporting protrusions 34 and the vacuum holes 33 are omitted.

[0063] Example 2

[0064] Combine Figure 1 、 Figure 2 and Figure 5This embodiment provides an inspection device comprising an inspection device and the carrier device described in Example 1. The inspection device is primarily used to inspect a workpiece to be loaded, such as various defects present on the workpiece's surface. In the case of a wafer, the inspection device may be composed of a camera, a brightfield light source, a darkfield light source, and the like. The camera is primarily used to photograph the wafer's surface to obtain an image of the wafer's surface area. The brightfield light source is primarily used to illuminate the wafer's surface so that the camera or observer can observe large defects such as large particles of contaminants, chip misalignment, and pits. The darkfield light source is primarily used to illuminate the wafer's surface so that the camera or observer can observe smaller defects such as small particles of contaminants. In this inspection device, an inspection function position is defined along the motion trajectory of the carrier 30 (e.g., within the space above the entire carrier device). The inspection device may be arranged near this inspection function position. When the carrier 30 drives the workpiece to be loaded to the inspection function position, the inspection device is activated to complete the inspection of the workpiece. Of course, the components of the inspection device may also be modified based on the type of workpiece to be loaded and the actual items to be inspected.

[0065] In another embodiment, other functional positions can be set individually or simultaneously along the movement trajectory of the carrier 30, such as a functional position that can perform processing such as cutting and grinding on the workpiece to be carried, and a corresponding processing device can be set near the functional position so that when the carrier 30 carries the workpiece to be carried to the functional position, the processing device can be used to perform corresponding processing on it.

[0066] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art can make several simple deductions, modifications or substitutions based on the concept of the present invention.

Claims

1. A carrying device, characterized in that: It includes a base plate, a support member and a bearing member, wherein: The base plate is provided with a positioning through hole, and the positioning through hole is used for allowing the bearing member to move through the base plate in the axial direction; At least three support members are arranged on the base member around the center line of the carrier; the support members are movably connected to the base member so as to move toward or away from the positioning through hole in a radial direction; when the support members are controllably moved toward the positioning through hole and abut against the workpiece to be loaded, the center of the workpiece to be loaded coincides with the center line of the carrier, and the workpiece to be loaded is supported above the positioning through hole; The supporting member is used to approach or move away from the workpiece to be loaded supported by the supporting member above the positioning through hole through the positioning through hole, so as to adsorb the workpiece to be loaded when approaching the workpiece to be loaded, thereby achieving the supporting and fixing of the workpiece to be loaded, thereby driving the workpiece to be loaded to move relative to the supporting member and / or the substrate member.

2. The carrying device according to claim 1, characterized in that: The carrier is a circular or regular polygonal disc structure, and a circular track is defined on the substrate for distribution around the center line of the carrier; the support member can be moved to the circular track in a controllable manner so that when it abuts against the workpiece to be carried, the center of the workpiece to be carried coincides with the center of the circular track.

3. The carrying device according to claim 2, characterized in that: The support member includes a positioning member, which includes a radial portion and an axial portion. The radial portion is distributed along the radial direction of the circular trajectory, and the radial portion is movably connected to the substrate member, and is used to support the surface edge of the workpiece to be carried adjacent to the side of the substrate member; the axial portion is distributed along the axial direction parallel to the circular trajectory, and one end of the axial portion adjacent to the substrate member is connected to the end of the radial portion away from the circular trajectory, and is used to abut against the circumferential surface of the workpiece to be carried.

4. The carrying device according to claim 3, characterized in that: The positioning member further includes a first guide slide portion, which is provided on a surface of the radial portion away from the axial portion along the radial direction of the circular trajectory, and the base member is provided with a second guide slide portion, which is slidably connected to the first guide slide portion along the radial direction of the circular trajectory; and / or The positioning member further includes a first locking portion, and the base plate member is provided with a second locking portion. The first locking portion cooperates with the second locking portion to lock the positioning member at a preset position of the base plate member.

5. The carrying device according to claim 3, characterized in that: At least one of the supporting members further comprises a positioning driving member, wherein a power end of the positioning driving member is coupled to the positioning member for driving the positioning member to move closer to or away from the circular trajectory.

6. The carrying device according to claim 1, wherein: The substrate member includes a substrate portion and a base ring portion, the positioning through holes are distributed through the substrate portion, and the base ring portion is arranged around the edge of the positioning through holes; the end face of the base ring portion away from the substrate portion is used to support the surface edge of the side of the loaded workpiece adjacent to the substrate member, and / or is used to be movably connected to the support member.

7. The carrying device according to claim 6, characterized in that: The end surface of the base ring portion away from the substrate portion is provided with a plurality of supporting bosses, and the supporting bosses are used to receive the surface edge of the workpiece adjacent to the substrate portion and / or to be movably connected to the supporting member.

8. The carrying device according to claim 1, wherein: The carrier comprises: A carrying base, used to approach or move away from a workpiece to be carried via the positioning through hole; and A plurality of vacuum holes are evenly distributed on the bearing surface of the bearing substrate, and the vacuum holes are used to communicate with a vacuum source to generate an adsorption force, thereby adsorbing and fixing the workpiece to be carried on the bearing substrate.

9. The carrying device according to claim 8, characterized in that: The carrier also includes an annular flange, which is arranged around the edge of the carrier base and is used to enclose a vacuum cavity on the carrier base; a plurality of vacuum holes are located in the vacuum cavity to generate a negative pressure effect in the vacuum cavity.

10. The carrying device according to claim 9, characterized in that: The carrier also includes a plurality of supporting protrusions evenly distributed in the vacuum cavity, the height of the annular flange is greater than or equal to the height of the supporting protrusions, and the vacuum hole is located in the gap formed by at least two adjacent supporting protrusions, so that when the workpiece to be carried is adsorbed, the workpiece to be carried is offset from the supporting protrusions.

11. The carrying device according to claim 1, wherein: It also includes a carrying drive member, the power end of which is coupled to the carrying member, for driving the carrying member to move the workpiece to be carried relative to the support member and / or the base member, so that the workpiece to be carried is close to or away from the support member.

12. A detection device, characterized in that: It comprises a detection device and a carrying device as described in any one of claims 1-11; wherein, a detection functional position is defined along the movement trajectory of the carrying member, and the detection device is used to detect the workpiece when the carrying member drives the workpiece to move to the detection functional position.

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