An integrated device manufacturing mold and method of manufacturing

Abstract

The application relates to the technical field of circuit board manufacturing, and particularly discloses an integrated device manufacturing die and a manufacturing method, wherein the integrated device manufacturing die comprises an upper die, a lower die and a heating plate; the upper die is movable in the vertical direction, and the lower surface of the upper die is provided with a first heating part; the number and position of the first heating part correspond to the protruding hot-melt columns on the upper surface of the integrated device; the side of the lower die close to the upper die is concavely provided with a containing groove for placing the integrated device; the groove bottom of the containing groove is provided with an avoiding hole, the hot-melt column is inserted into the avoiding hole, the heating plate is arranged at intervals on the side of the lower die away from the upper die, the upper surface of the heating plate is provided with a second heating part, and the second heating part can extend into the avoiding hole; the first heating part and the second heating part are used for hot melting the end part of the hot-melt column to form a limiting part for clamping the integrated device. The integrated device manufacturing die is convenient for the production and manufacturing of the integrated device, and can effectively improve the production quality and speed.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and more particularly to an integrated device manufacturing mold and a method for manufacturing the integrated device. Background Technology

[0002] In the electronics industry, electronic components such as chips and circuit boards are typically connected using soldering (BGA) or conductive adhesive. While soldering offers the advantage of reliable connections, it also has the disadvantage of not being able to be repeatedly disassembled and reassembled. If operational errors occur during the soldering process, or if problems such as poor conductivity arise after soldering, the soldered electronic components can only be reworked with more resources or scrapped outright, resulting in material waste and increased costs. Although conductive adhesive connections are easier to implement and facilitate rework and repair compared to soldering, the conductivity of conductive adhesive is not stable due to some inherent problems and the influence of external factors such as climate, aging, and stress strain. Therefore, electronic components connected using conductive adhesive are prone to circuit interruptions or signal distortion. Summary of the Invention

[0003] One objective of this invention is to provide an integrated device manufacturing mold that facilitates the production and manufacturing of integrated devices and can effectively improve the production quality and speed of integrated devices.

[0004] Another objective of this invention is to provide a method for manufacturing integrated devices that has high production efficiency and allows for repeated assembly and disassembly of the manufactured integrated devices, thereby effectively reducing manufacturing costs.

[0005] To achieve this objective, the embodiments of the present invention adopt the following technical solutions:

[0006] Firstly, an integrated device manufacturing mold is provided, comprising:

[0007] The upper mold is movable in a vertical direction, and a first heating part is provided on the lower surface of the upper mold. The number and position of the first heating part correspond to the hot melt pillars protruding from the upper surface of the integrated device.

[0008] The lower mold has a recessed receiving groove on the side near the upper mold. The integrated device is placed in the receiving groove. The bottom of the receiving groove is provided with a clearance hole corresponding to the hot melt column protruding from the lower surface of the integrated device. The hot melt column is inserted into the clearance hole. The outer peripheral wall of the hot melt column is spaced apart from the hole wall of the clearance hole.

[0009] A heating plate is provided on the side of the lower mold away from the upper mold at intervals. The heating plate can move in the vertical direction. A second heating part is provided on the upper surface of the heating plate. The second heating part corresponds to the hot melt column protruding from the lower surface of the integrated device. The second heating part can extend into the clearance hole.

[0010] The first heating part and the second heating part are used to heat melt the end of the hot melt column to form a limiting part for clamping the integrated device.

[0011] As a preferred embodiment of mold manufacturing for integrated devices, the distance between the outer peripheral wall of the hot melt column and the wall of the clearance hole is not less than 2 mm.

[0012] As a preferred embodiment of the mold for manufacturing integrated devices, the end of the first heating part is recessed into a first groove, and the end of the hot melt column on the upper surface of the integrated device can be inserted into the first groove; and / or,

[0013] The end of the second heating part is recessed with a second groove, and the end of the hot melt column on the lower surface of the integrated device can be inserted into the second groove.

[0014] As a preferred embodiment of the mold for manufacturing integrated devices, the first groove is an arc-shaped groove; and / or, the second groove is an arc-shaped groove.

[0015] As a preferred embodiment of the mold for manufacturing integrated devices, the lower mold is provided with a pressing mechanism, the pressing mechanism including a pressure plate, the end of the pressure plate extending into the receiving groove for selectively pressing the integrated device into the receiving groove.

[0016] As a preferred embodiment of the mold for manufacturing integrated devices, the pressure plate is rotatably mounted on the lower mold via a rotating shaft. A spring is sleeved on the rotating shaft, and the spring always has a tendency to drive the pressure plate toward the bottom of the receiving groove. The end of the pressure plate away from the rotating shaft abuts against the side of the integrated device away from the bottom of the receiving groove.

[0017] As a preferred embodiment of molds for manufacturing integrated devices, a buffer pad is provided on one side of the pressure plate near the bottom of the receiving groove.

[0018] As a preferred embodiment of the mold for manufacturing integrated devices, the mold further includes a controller, which is connected to a first driving member for moving the upper mold, a second driving member for moving the heating plate, the first heating part, and the second heating part.

[0019] As a preferred embodiment of the mold for manufacturing integrated devices, the depth of the receiving groove is not less than the thickness of the integrated device.

[0020] As a preferred embodiment of the mold for manufacturing integrated devices, the bottom of the receiving groove is provided with a buffer layer, and a through hole is opened on the buffer layer corresponding to the avoidance hole, the size of the through hole being not less than the size of the avoidance hole.

[0021] Secondly, a method for manufacturing an integrated device is provided, using an integrated device manufacturing mold as described above, providing an integrated device with hot melt pillars installed, installing the integrated device in a receiving groove of the lower mold of the integrated device manufacturing mold, inserting the hot melt pillars on the lower surface of the integrated device into the clearance holes of the lower mold, moving the upper mold downward and the heating plate upward, and simultaneously performing hot melt treatment on the hot melt pillars on the upper and lower sides of the integrated device to form limiting portions that abut against the surface of the integrated device.

[0022] In a preferred embodiment of the manufacturing method for integrated devices, the size of the limiting portion after the hot melt column is hot melt formed is smaller than the size of the clearance hole.

[0023] As a preferred method for manufacturing integrated devices, a heat-resistant coating is sprayed onto the surface of the lower mold before the integrated device is installed.

[0024] As a preferred method for manufacturing integrated devices, a heat-resistant coating is sprayed onto the inner wall of the clearance hole of the lower mold before the integrated device is installed.

[0025] The beneficial effects of this invention are as follows: by setting an upper mold and a heating plate that can both move in the vertical direction, the heating parts set on the upper mold and the heating plate can simultaneously heat melt the hot melt pillars protruding from opposite sides of the integrated device to form a limiting part that clamps the integrated device, which effectively improves the production efficiency and quality of the integrated device. Attached Figure Description

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a schematic diagram of the state of the integrated device manufacturing mold before hot melting, according to an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the state during the hot melting of the mold for manufacturing integrated devices according to an embodiment of the present invention.

[0029] Figure 3 This is a schematic diagram showing the state of the integrated device manufacturing mold after hot melting, according to an embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the assembly of the lower mold, clamping mechanism, and integrated devices according to an embodiment of the present invention.

[0031] Figure 5This is a cross-sectional view of the structure of the first integrated device according to an embodiment of the present invention.

[0032] Figure 6 This is a cross-sectional view of the structure of a second integrated device according to an embodiment of the present invention.

[0033] Figure 7 This is a cross-sectional schematic diagram of the first heating part according to an embodiment of the present invention.

[0034] Figure 8 This is a cross-sectional schematic diagram of the second heating part according to an embodiment of the present invention.

[0035] In the picture:

[0036] 1. Upper mold; 11. First heating part; 111. First groove; 12. First driving component;

[0037] 2. Lower mold; 21. Receiving groove; 22. Clearance hole; 23. Buffer layer; 231. Through hole;

[0038] 3. Heating plate; 31. Second heating part; 311. Second groove; 32. Second driving component;

[0039] 4. Clamping mechanism; 41. Pressure plate; 42. Rotating shaft; 43. Spring; 44. Buffer pad;

[0040] 5. Integrated device; 51. Device body; 511. Circuit board assembly; 5111. Pad; 512. Connector; 5121. Insulator; 5122. Conductor; 5123. Conductive medium; 52. Hot melt column; 521. Limiting part. Detailed Implementation

[0041] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] like Figure 5 and Figure 6 As shown, the integrated device manufacturing mold of this embodiment of the invention is mainly used to produce integrated devices 5 that are connected and fixed by hot melt pillars 52. After the hot melt pillars 52 of such integrated devices 5 connect the circuit board assembly 511 and the connector 512 of the integrated device 5, they will have protruding parts on opposite sides of the integrated device 5. After hot melting, these protruding parts form limiting parts 521. At this time, the circuit board assembly 511 and the connector 512 are clamped between the two limiting parts 521 to achieve fixation. Specifically, the integrated device 5 includes the following two structures.

[0045] The first type: such as Figure 5As shown, the integrated device 5 includes a device body 51 and a hot melt pillar 52. The device body 51 includes at least two spaced-apart circuit board assemblies 511. A connector 512 is provided between the two circuit board assemblies 511. The connector 512 includes an insulator 5121. A plurality of conductors 5122 are provided on one side of the insulator 5121 near the circuit board assembly 511. The circuit board assembly 511 near the insulator 5121 has pads 5111 in number and position corresponding to the conductors 5122. The conductors 5122 abut against the pads 5111 to achieve electrical conduction. The two conductors 5122 on opposite sides of the insulator 5121 are electrically connected through a conductive medium 5123. A through hole is provided on the device body 51 along its thickness direction. The hot melt pillar 52 is installed in the through hole. The two ends of the hot melt pillar 52 extend to protrude from opposite sides of the device body 51. The ends of the hot melt pillar 52 can be hot melted to form limiting parts 521. The two limiting parts 521 clamp the device body 51. By setting the hot melt post 52, the device body 51 can be fixed by the limiting part 521 formed at the end of the hot melt post 52, so that the circuit board assembly 511 and the connector 512 do not need to be connected by welding and screws, which effectively improves the connection reliability of the circuit board assembly 511 and the connector 512. When the components on the circuit board assembly 511 fail, the limiting part 521 can be removed to separate the circuit board assembly 511 and the connector 512, and then the circuit board assembly 511 can be repaired and the components replaced. After the repair is completed, only a new hot melt post 52 is needed to reconnect the circuit board assembly 511 and the connector 512. The original circuit board assembly 511 and the connector 512 can still be used, which greatly reduces the manufacturing and maintenance costs.

[0046] The second type: such as Figure 6As shown, the integrated device 5 includes a device body 51 and a hot-melt pillar 52. The device body 51 includes two spaced-apart circuit board assemblies 511, and a connector 512 is disposed between the two circuit board assemblies 511. The connector 512 includes an insulator 5121, and a plurality of conductors 5122 are disposed on one side of the insulator 5121 near the circuit board assembly 511. The side of the circuit board assembly 511 near the connector 512 has pads 5111 in number and position corresponding to the conductors 5122. Electrical conduction is achieved by contacting the pad 5111. The two conductors 5122 on opposite sides of the insulator 5121 are electrically connected through the conductive medium 5123. One end of the hot melt pillar 52 is fixed on the insulator 5121, and the other end passes through the through hole in the circuit board assembly 511 and protrudes from the side of the circuit board assembly 511 away from the connector 512. The end of the hot melt pillar 52 can be hot melted after passing through the through hole to form a limiting part 521. The limiting part 521 abuts against the side of the circuit board assembly 511 away from the connector 512. By setting the hot melt post 52, the limiting part 521 formed at the end of the hot melt post 52 can be used to fix the stacked circuit board assembly 511 and connector 512, so as to achieve a reliable connection between the circuit board assembly 511 and connector 512. When the components on the circuit board assembly 511 fail, the limiting part 521 can be removed to separate the circuit board assembly 511 and connector 512, so as to repair and replace the components of the circuit board assembly 511. After the repair is completed, only a new connector 512 needs to be provided or a new hot melt post 52 needs to be installed in the original position of the hot melt post 52 on the connector 512 to reconnect the two circuit board assemblies 511. The original circuit board assembly 511 can still be used, which greatly reduces the manufacturing and maintenance costs.

[0047] Specifically, the circuit board assembly 511 can be a single circuit board or a combination of two or more circuit boards. When the circuit board assembly 511 is a combination of two or more circuit boards, adjacent circuit boards are electrically connected through an adapter board. The through holes on the circuit board assembly 511 penetrate all the circuit boards and the adapter board. The through holes are divided into a first through hole that penetrates the circuit board and a second through hole that penetrates the adapter board. The position and number of the first through holes correspond to the position and number of the second through holes. The hot melt pillar 52 passes through the first and second through holes to connect the circuit board assembly 511 composed of the circuit board and the adapter board.

[0048] The number of circuit boards contained in the circuit board assemblies 511 on both sides of the connector 512 may be equal or unequal, such as... Figure 6As shown, each of the circuit board assemblies 511 on both sides of the connector 512 includes only one circuit board. In other embodiments, the circuit board assemblies 511 on both sides of the connector 512 may each include multiple circuit boards, or one side of the circuit board assembly 511 may include only one circuit board, while the other side may include multiple circuit boards.

[0049] When the circuit board assembly 511 includes multiple circuit boards, the circuit boards located at the non-ends are provided with pads 5111 on both sides, while the outermost circuit board can be provided with pads 5111 only on the side near the adapter plate. The two opposite sides of the adapter plate are provided with multiple first adapter conductive parts. The two corresponding first adapter conductive parts on the opposite sides of the adapter plate are connected through second adapter conductive parts. The first adapter conductive parts abut against the pads 5111 of the corresponding circuit boards to achieve electrical connection.

[0050] Furthermore, a first connecting hole is formed through the insulator 5121. One end of the first connecting hole is connected to a conductor 5122 on one side of the insulator 5121, and the other end is connected to a conductor 5122 on the other side of the insulator 5121. A conductive medium 5123 is disposed within the first connecting hole. Specifically, the conductive medium 5123 adheres to the wall of the first connecting hole and forms a conductive hole. The conductive hole can be a through hole, a buried hole, or a blind hole. Of course, during the formation of the conductive medium 5123, the operator can also choose to fill the entire connecting hole with the conductive medium 5123, i.e., not form a conductive hole. The purpose of doing so is to prevent the etching solution from entering the conductive hole and protect the conductive medium 5123 from being etched.

[0051] A second connecting hole is formed through the adapter plate. One end of the second connecting hole is connected to a first conductive part on one side of the adapter plate, and the other end is connected to a first conductive part on the other side of the adapter plate. The second conductive part is located inside the second connecting hole. Specifically, the second conductive part is attached to the hole wall of the second connecting hole to form a conductive hole. The conductive hole can be a through hole, a buried hole, or a blind hole. Of course, during the formation of the second conductive part, the operator can also choose to fill the entire second connecting hole with the second conductive part, i.e., not form a conductive hole. The purpose of doing so is to prevent the etching solution from entering the conductive hole and protect the second conductive part from being etched.

[0052] Optionally, the insulator 5121 in this embodiment of the invention is made of one or more of the following materials: polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyetheretherketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, and polyethylene glycol urea. Specifically, the insulator 5121 can be a single component, i.e., one of the above-mentioned insulating materials, or it can be a composite of any number of the above-mentioned insulating materials.

[0053] Optionally, the conductive medium 5123 and / or the second conductive adapter in the embodiments of the present invention are preferably copper. Of course, other materials with good conductivity can also be used, such as tin, silver, gold, graphite, copper paste, silver paste, solder paste, carbon nanotubes, etc.

[0054] To improve the stability of the integrated device 5, at least three hot-melt pillars 52 are provided on the device body 51, and the at least three hot-melt pillars 52 form a fixed plane. The at least three hot-melt pillars 52 arranged in a plane can enhance the connection strength between the connector 512 and the circuit board assembly 511, and improve the structural stability of the integrated device 5 connected as one unit.

[0055] In this embodiment, the device body 51 is rectangular, and hot-melt pillars 52 are provided at all four corners of the device body 51. The hot-melt pillars 52 arranged at the four corners are not only stable but also avoid occupying the central area of ​​the circuit board assembly 511, preventing them from obstructing the arrangement of components on the circuit board assembly 511. Furthermore, the edge arrangement of the hot-melt pillars 52 can reduce the probability of damage to components on the circuit board assembly 511 during assembly and disassembly. Of course, the number of hot-melt pillars 52 on the device body 51 is not limited to four, nor is it limited to the four corners; three, five, or even more can be provided, arranged in a triangular, polygonal, or irregular shape. In addition, the shape of the device body 51 is not limited to rectangular; it can also be triangular, pentagonal, or irregular in shape as needed.

[0056] The hot melt pillar 52 can be cylindrical, triangular, square, or other shapes. Correspondingly, the through holes opened on the device body 51 are round, triangular, or square holes. The length of the hot melt pillar 52 is greater than the thickness of the device body 51.

[0057] like Figures 1 to 3As shown, the integrated device manufacturing mold of this embodiment of the invention is used to manufacture any of the integrated devices 5 as described above. The integrated device manufacturing mold includes an upper mold 1, a lower mold 2, and a heating plate 3. The upper mold 1 is movable in a vertical direction. A first heating part 11 is provided on the lower surface of the upper mold 1. The number and position of the first heating parts 11 correspond to the hot melt pillars 52 protruding from the upper surface of the integrated device 5. A receiving groove 21 is recessed on the side of the lower mold 2 near the upper mold 1. The integrated device 5 is placed in the receiving groove 21. The bottom of the receiving groove 21 is provided with a clearance hole 22 corresponding to the hot melt pillars 52 protruding from the lower surface of the integrated device 5. 2. The hot melt column 52 is inserted into the clearance hole 22. The outer peripheral wall of the hot melt column 52 is spaced apart from the hole wall of the clearance hole 22. The heating plate 3 is spaced apart on the side of the lower mold 2 away from the upper mold 1. The heating plate 3 can move vertically. The upper surface of the heating plate 3 is provided with a second heating part 31. The second heating part 31 corresponds to the hot melt column 52 protruding from the lower surface of the integrated device 5. The second heating part 31 can extend into the clearance hole 22. The first heating part 11 and the second heating part 31 are used to heat melt the end of the hot melt column 52 to form a limiting part 521 for clamping the integrated device 5. By setting the upper mold 1 and the heating plate 3, both of which can move vertically, the heating parts provided on the upper mold 1 and the heating plate 3 can simultaneously heat melt the hot melt columns 52 protruding from opposite sides of the integrated device 5 to form the limiting part 521 for clamping the integrated device 5, effectively improving the production efficiency and quality of the integrated device 5.

[0058] The integrated device manufacturing mold also includes a controller (not shown in the figure), which is connected to a first driving member 12 that drives the upper mold 1 to move, a second driving member 32 that drives the heating plate 3 to move, the first heating part 11, and the second heating part 31. The controller enables automated control; that is, the movement of the upper mold 1 and the heating plate 3 can be automatically controlled, and the heating and stopping of the first heating part 11 and the second heating part 31 can also be automatically controlled, reducing operational difficulty and improving operational accuracy.

[0059] In one embodiment, the distance between the outer peripheral wall of the hot melt column 52 and the hole wall of the clearance hole 22 is not less than 2 mm. This design facilitates the separation of the integrated device 5 from the lower mold 2 after the end of the hot melt column 52 is hot melted to form the limiting part 521. The clearance hole 22 is large enough to prevent the hot melt column 52 from sticking to the hole wall of the clearance hole 22 during the hot melting process.

[0060] In this embodiment, the outer surface of the lower mold 2 is coated with a heat-resistant coating, and the interior of the clearance hole 22 is also coated with a heat-resistant coating. During the hot-melt operation of the first heating part 11 and the second heating part 31, the heat resistance requirements for the lower mold 2 and the clearance hole 22 increase, hence the provision of the heat-resistant coating.

[0061] Of course, it is not limited to spraying a heat-resistant coating; the lower mold 2 can also be made of heat-resistant and heat-insulating materials.

[0062] like Figure 7 and 8 As shown, to facilitate the molding of the limiting part 521, a first groove 111 is recessed at the end of the first heating part 11, and the end of the hot melt column 52 on the upper surface of the integrated device 5 can be inserted into the first groove 111. A second groove 311 is recessed at the end of the second heating part 31, and the end of the hot melt column 52 on the lower surface of the integrated device 5 can be inserted into the second groove 311. The first groove 111 and the second groove 311 can cover the end of the hot melt column 52, facilitating the molding of the limiting part 521.

[0063] Specifically, both the first groove 111 and the second groove 311 are arc-shaped grooves. The arc-shaped groove can form an arc-shaped limiting part 521, avoiding sharp corner structures. At the same time, the arc-shaped groove makes it easier for the limiting part 521 to separate from the heating part.

[0064] An anti-adhesion coating can also be provided in the arc groove to prevent the hot melt column 52 from sticking to the heating part during the hot melting process.

[0065] In one embodiment, such as Figure 4 As shown, a pressing mechanism 4 is provided on the lower mold 2. The pressing mechanism 4 includes a pressure plate 41, the end of which extends into the receiving groove 21 to selectively press the integrated device 5 into the receiving groove 21. By providing the pressure plate 41, the position of the integrated device 5 can be limited, preventing the integrated device 5 from loosening and shifting during the hot melting process, and effectively preventing the surface of the integrated device 5 from colliding with the lower mold 2, heating part, and other components during the hot melting process and causing damage.

[0066] Specifically, the pressure plate 41 is rotatably mounted on the lower mold 2 via a rotating shaft 42. A spring 43 is sleeved on the rotating shaft 42. The spring 43 always has a tendency to drive the pressure plate 41 toward the bottom of the receiving groove 21. The end of the pressure plate 41 away from the rotating shaft 42 abuts against the side of the integrated device 5 away from the bottom of the receiving groove 21.

[0067] A buffer pad 44 is provided on one side of the pressure plate 41 near the bottom of the receiving groove 21. By providing the buffer pad 44, rigid contact between the pressure plate 41 and the surface of the integrated device 5 can be prevented, ensuring that the circuit lines and components on the surface of the integrated device 5 are not damaged.

[0068] In one embodiment, the depth of the receiving groove 21 is not less than the thickness of the integrated device 5. This design can use the lower mold 2 to restrict the position of the integrated device 5, because the integrated device 5 is formed by stacking the circuit board assembly 511 and the connector 512. Therefore, the groove wall of the receiving groove 21 also has a certain limiting function.

[0069] In this embodiment, a buffer layer 23 is provided at the bottom of the receiving groove 21, and a through hole 231 is formed on the buffer layer 23 corresponding to the clearance hole 22. The size of the through hole 231 is not smaller than the size of the clearance hole 22. By providing the buffer layer 23, rigid contact between the surface of the integrated device 5 and the bottom of the receiving groove 21 of the lower mold 2 can be prevented, ensuring that the circuit lines and components on the surface of the integrated device 5 are not damaged.

[0070] In other embodiments, a buffer layer 23 can be provided throughout the entire receiving groove 21 to provide more comprehensive protection for the integrated device 5.

[0071] This invention also provides a method for manufacturing an integrated device 5. Using an integrated device manufacturing mold as described in any of the above embodiments, an integrated device 5 with hot melt pillars 52 installed is provided. The integrated device 5 is installed in the receiving groove 21 of the lower mold 2 of the integrated device manufacturing mold, so that the hot melt pillars 52 on the lower surface of the integrated device 5 are inserted into the clearance holes 22 of the lower mold 2, so that the upper mold 1 moves down and the heating plate 3 moves up. At the same time, the hot melt pillars 52 on the upper and lower sides of the integrated device 5 are hot melted to form limiting portions 521 that abut against the surface of the integrated device 5.

[0072] For the integrated device 5 of the first structure, when the integrated device 5 is placed in the receiving groove 21, the lower end of the hot melt column 52 that has not undergone hot melting treatment first abuts against the second heating part 31 of the heating plate 3. The heating plate 3 is used to limit the overall position of the hot melt column 52. At this time, the second heating part 31 is not started to heat. Then the position of the upper mold 1 is adjusted so that the first heating part 11 of the upper mold 1 abuts against the upper end of the hot melt column 52. Then the first heating part 11 and the second heating part 31 are started to heat simultaneously. The two heating parts move relative to each other while heating, so that the limiting part 521 formed at the end of the hot melt column 52 can abut against the opposite two sides of the integrated device 5.

[0073] For the integrated device 5 with the second structure, when the integrated device 5 is placed in the receiving groove 21, the end of the hot melt column 52 above the integrated device 5 that has not undergone hot melting treatment is first pressed against the integrated device 5 by the first heating part 11 of the upper mold 1. At this time, the first heating part 11 is not started to heat. Then the position of the heating plate 3 is adjusted so that the second heating part 31 of the heating plate 3 presses against the end of the hot melt column 52 below the integrated device 5. Then the first heating part 11 and the second heating part 31 are started to heat simultaneously, and the two heating parts move relative to each other while heating, so that the limiting part 521 formed at the end of the hot melt column 52 can abut against the opposite two sides of the integrated device 5.

[0074] In the description herein, it should be understood that the terms "above" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0075] In the description of this specification, references to terms such as "an embodiment" indicate that a specific feature, structure, material, or characteristic associated with that embodiment is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment.

[0076] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0077] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. An integrated device manufacturing mold characterized by, The application relates to an integrated device manufacturing mold. An upper mold is movable in a vertical direction, and a lower surface of the upper mold is provided with first heating parts corresponding to protruding hot melt columns on an upper surface of an integrated device; A lower mold is provided with a containing groove on a side close to the upper mold, the integrated device is arranged in the containing groove, a groove bottom of the containing groove is provided with avoiding holes corresponding to the hot melt columns protruding from a lower surface of the integrated device, the hot melt columns are inserted into the avoiding holes, and an outer peripheral wall of the hot melt columns is arranged in a spaced manner with a hole wall of the avoiding holes; A heating plate is arranged in a spaced manner on a side of the lower mold away from the upper mold, the heating plate is movable in a vertical direction, an upper surface of the heating plate is provided with second heating parts corresponding to the hot melt columns protruding from the lower surface of the integrated device, and the second heating parts can be inserted into the avoiding holes; The first heating parts and the second heating parts are used for hot melting end portions of the hot melt columns to form limiting parts for clamping the integrated device; End portions of the first heating parts are provided with first grooves, and end portions of the hot melt columns on the upper surface of the integrated device can be inserted into the first grooves; and / or end portions of the second heating parts are provided with second grooves, and end portions of the hot melt columns on the lower surface of the integrated device can be inserted into the second grooves; The first grooves are arc grooves; and / or the second grooves are arc grooves.

2. The integrated device manufacturing die of claim 1, wherein, A spacing between the outer peripheral wall of the hot melt columns and the hole wall of the avoiding holes is not less than 2 mm.

3. The integrated device manufacturing die of claim 1, wherein, The lower mold is provided with a pressing mechanism including a pressing plate, end portions of the pressing plate extend into the containing groove, and the integrated device is selectively pressed in the containing groove.

4. The integrated device manufacturing die of claim 3, wherein, The pressing plate is rotatably arranged on the lower mold through a rotating shaft, a spring is sleeved on the rotating shaft, the spring always has a movement tendency of driving the pressing plate to move towards a groove bottom of the containing groove, and an end of the pressing plate away from the rotating shaft abuts against a side of the integrated device away from the groove bottom of the containing groove.

5. The integrated device manufacturing die of claim 3, wherein, A side of the pressing plate close to the groove bottom of the containing groove is provided with a buffer pad.

6. The integrated device manufacturing tool of any one of claims 1 to 5, wherein, A controller is further included, and the controller is connected with a first driving part driving the upper mold to move, a second driving part driving the heating plate to move, the first heating parts and the second heating parts.

7. The integrated device manufacturing die of any one of claims 1 to 5, wherein, A depth of the containing groove is not less than a thickness of the integrated device.

8. The integrated device manufacturing die of any one of claims 1 to 5, wherein, A buffer layer is arranged on the groove bottom of the containing groove, and a via hole is arranged on the buffer layer corresponding to the avoiding hole, and a size of the via hole is not less than a size of the avoiding hole.

9. A method of manufacturing an integrated device, characterized by, An integrated device manufacturing mold is used, the integrated device with the hot melt columns is installed, the integrated device is arranged in a containing groove of a lower mold of the integrated device manufacturing mold, the hot melt columns on a lower surface of the integrated device are inserted into avoiding holes of the lower mold, the upper mold is moved downwards and the heating plate is moved upwards, and the hot melt columns on upper and lower sides of the integrated device are subjected to hot melting treatment to form limiting parts abutting against surfaces of the integrated device.

10. The method of manufacturing an integrated device according to claim 9, wherein, A size of the limiting parts after the hot melt columns are subjected to hot melting forming is less than a size of the avoiding holes.

11. The method of manufacturing an integrated device according to claim 9, wherein, Spraying a heat resistant coating on the surface of the lower mold before installing the integrated device.

12. The method of manufacturing an integrated device according to claim 9, wherein, Spraying a heat resistant coating on the inner wall of the relief hole of the lower mold before installing the integrated device.

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