Display device and binding method thereof

Abstract

The application discloses a display device and a binding method thereof, wherein the display device comprises a display panel and a driving circuit board, the driving circuit board comprises a driving chip, a first pad area and a second pad area which are electrically connected with the driving chip and are bound with the display panel, the first pad area comprises a plurality of first pads, the first pad area comprises at least one bending part, and the second pad area comprises a plurality of second pads; the display panel comprises a third pad area which is bound with the first pad area and a fourth pad area which is bound with the second pad area, the third pad area comprises a plurality of third pads, the third pads correspond to the first pads one by one, the fourth pad area comprises a plurality of fourth pads, and the fourth pads correspond to the second pads one by one. The display device provided by the application can avoid the chip abdominal collapse caused by the binding process in the binding process by arranging the first pad area which comprises at least one bending part, and has a wide application prospect.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display device and its bonding method. Background Technology

[0002] Typically, a display device includes a display panel and a driver circuit board bonded to it. The driver circuit board has input and output pads that connect to the driver chip and is bonded to the display panel via these pads. The transistor array substrate area of ​​the display panel is filled with signal lines and thin-film transistors, and the fan-out lines of the display panel connect the data lines of the array substrate to the output pads of the driver circuit board.

[0003] The pad distribution of the drive circuit board in the prior art is as follows: Figure 1 As shown, the output pads of the driver circuit board are linearly distributed, and the driver chip lacks support. During the bonding process, the driver chip collapses and deforms severely. There is uneven contact between the conductive particles of the anisotropic conductive adhesive film and the pad indentations. Due to the shrinkage and peeling problem of the anisotropic conductive adhesive film and the glass film, the conductive particles in the anisotropic conductive adhesive film are prone to fall off, which may cause misleading communication. Summary of the Invention

[0004] To address at least one of the aforementioned problems, a first aspect of the present invention provides a display device comprising a display panel and a driving circuit board bonded to the display panel, wherein:

[0005] A driver circuit board includes a driver chip, a first pad area and a second pad area electrically connected to the driver chip and bonded to a display panel, wherein the first pad area includes a plurality of first pads and the first pad area includes at least one bend, and the second pad area includes a plurality of second pads.

[0006] The display panel includes a third pad area bound to a first pad area and a fourth pad area bound to a second pad area. The third pad area includes multiple third pads, each corresponding to a first pad. The fourth pad area includes multiple fourth pads, each corresponding to a second pad.

[0007] In some alternative embodiments, the plurality of first pads in the first pad area are arranged in a trapezoidal, triangular, or arc-shaped pattern.

[0008] In some optional embodiments, the driving circuit board further includes a plurality of first pseudo pads located outside the first pad area and the second pad area, and the display panel further includes second pseudo pads corresponding to the first pseudo pads.

[0009] In some optional embodiments, the first pseudo pad is disposed in at least one of a first region near the edge of the first pad area, a second region near the edge of the second pad area, and a third region between the first pad area and the second pad area on the driving circuit board, wherein the first region is less than or equal to a first preset distance from the edge, the second region is less than or equal to the first preset distance from the edge, and the third region is greater than or equal to a second preset distance from the first pad area.

[0010] In some optional embodiments, the plurality of first pads in the first pad area are arranged in a trapezoidal, triangular, or arc shape, and the second pad area is correspondingly arranged to the first pad area. Each second pad extends toward the corresponding first pad so that the distance between each second pad and the corresponding first pad is a preset spacing.

[0011] In some optional embodiments, the driving circuit board further includes a plurality of first pseudo pads disposed on the edge side of the driving circuit board near the first pad area, and the display panel further includes second pseudo pads corresponding to the first pseudo pads, wherein the first area is less than or equal to a first preset distance from the edge side.

[0012] In some optional embodiments, the shape of the second pad is the same as the shape of the corresponding first pad, and the plurality of first pads in the first pad area are arranged in a trapezoidal, triangular or arc shape. The second pad area is correspondingly provided with the first pad area, and the distribution shape of the plurality of second pads in the second pad area is the same as the distribution shape of the plurality of first pads in the first pad area.

[0013] In some alternative embodiments, the display device further includes a flexible circuit board bonded to the display panel.

[0014] The display panel also includes a fifth pad area bonded to the flexible circuit board. The fifth pad area includes multiple fifth pads, which are correspondingly set with the fourth pads. The fifth pads and their corresponding fourth pads are electrically connected by signal lines, and the distance between the signal lines is greater than a third preset distance.

[0015] In some optional embodiments, the first pad area includes a first sub-pad area, the angle between the first sub-pad area and the edge side near the first pad area satisfies a first preset angle range, and the angle between the first pad of the first sub-pad area and the edge side near the first pad area satisfies a second preset angle range.

[0016] In some alternative embodiments, the first pad area includes at least one sub-pad group having a plurality of first pads arranged in a central manner, the spacing between each sub-pad group being smaller than the spacing between the first pad area and the second pad area.

[0017] A second aspect of the present invention provides a bonding method for a display device according to the above embodiments, comprising:

[0018] A driver circuit board and a display panel for a positioning display device, wherein the driver circuit board includes a driver chip, a first pad area and a second pad area electrically connected to the driver chip and bonded to the display panel, wherein the first pad area includes a plurality of first pads and includes at least one bent portion, the second pad area includes a plurality of second pads, the display panel includes a third pad area bonded to the first pad area and a fourth pad area bonded to the second pad area, the third pad area includes a plurality of third pads, each corresponding to a first pad, and the fourth pad area includes a plurality of fourth pads, each corresponding to a second pad.

[0019] The bonding of the driver circuit board and the display panel includes: pressing the first pad area and the third pad area to electrically connect each first pad and the corresponding third pad, and pressing the second pad area and the fourth pad area to electrically connect each second pad and the corresponding fourth pad.

[0020] In some optional embodiments, the display device further includes a flexible circuit board bonded to the display panel. The flexible circuit board includes a plurality of leads. The display panel further includes a fifth pad area bonded to the flexible circuit board. The fifth pad area includes a plurality of fifth pads, which are correspondingly disposed with the fourth pads. The bonding method further includes:

[0021] Align and bind the driver circuit board and flexible circuit board of the display device, including pressing the leads and fifth pad area of ​​the flexible circuit board so that each lead and the corresponding fifth pad are electrically connected.

[0022] The fifth pads in the fifth pad area and the corresponding fourth pads in the fourth pad area are electrically connected using signal lines, and the distance between the signal lines is greater than the third preset distance.

[0023] The beneficial effects of this invention are as follows:

[0024] This invention addresses existing problems by providing a display device and its bonding method. By incorporating a driver circuit board with a first pad area having at least one bend in the display device, the support performance for the driver chip on the driver circuit board is enhanced. This prevents the driver chip from collapsing during the bonding process, avoids driver chip deformation, and prevents uneven pressure indentation between conductive particles of the anisotropic conductive adhesive film and the pad, thereby improving product yield. Furthermore, it reduces the fan-out wiring height of the display device, further reducing the bezel of the display device, and has broad application prospects. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic top view of a driver circuit board in a prior art display device is shown.

[0027] Figure 2a A schematic top view of a display device according to an embodiment of the present invention is shown.

[0028] Figure 2b Showing according to Figure 2a A schematic top view of the display panel in the display device shown.

[0029] Figure 3a Show Figure 2a A schematic enlarged view of the driver circuit board in the display device shown.

[0030] Figure 3b A schematic top view of a drive circuit board according to another embodiment of the present invention is shown.

[0031] Figure 4 This diagram shows a comparison of fan-out routing when the driver circuit board is designed with the output pad area of ​​the prior art and the first pad area of ​​the present invention.

[0032] Figure 5 A schematic top view of a driving circuit board in a display device according to another embodiment of the present invention is shown.

[0033] Figures 6a-6c A schematic top view of a driving circuit board in a display device according to another embodiment of the present invention is shown.

[0034] Figures 7a-7c A schematic top view of a driving circuit board in a display device according to another embodiment of the present invention is shown.

[0035] Figure 8 This diagram illustrates the arrangement direction of the first pads within the first sub-pad area of ​​a display device according to an embodiment of the present invention.

[0036] Figure 9 A schematic top view of a driving circuit board in a display device according to another embodiment of the present invention is shown.

[0037] Figure 10a A schematic top view of a display device according to another embodiment of the present invention is shown.

[0038] Figure 10b Showing according to Figure 10a A schematic top view of the display panel in the display device shown.

[0039] Figures 11a-11b Show Figure 10a A schematic enlarged view showing the relationship between the fifth pad area and the flexible circuit board wiring in two embodiments of the display device.

[0040] Figure 12 A schematic flowchart illustrating a binding method for a display device according to an embodiment of the present invention is shown. Detailed Implementation

[0041] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments and accompanying drawings, further clarifies the invention. Similar components in the drawings are indicated by the same or similar reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of the present invention.

[0042] It should be noted that the terms "having," "comprising," and "including" used in this invention are all open-ended, meaning that when a module is described as "having," "comprising," or "including" a first element, a second element, and / or a third element, it indicates that the module includes other elements in addition to the first, second, and / or third elements. Furthermore, the ordinal numbers "first," "second," and "third" used in this invention are not intended to define a specific order, but only to distinguish between the various parts.

[0043] A first aspect of the present invention provides a display device, comprising a display panel and a driving circuit board bonded to the display panel, wherein:

[0044] A driver circuit board includes a driver chip, a first pad area and a second pad area electrically connected to the driver chip and bonded to a display panel, wherein the first pad area includes a plurality of first pads and the first pad area includes at least one bend, and the second pad area includes a plurality of second pads.

[0045] The display panel includes a third pad area bound to a first pad area and a fourth pad area bound to a second pad area. The third pad area includes multiple third pads, each corresponding to a first pad. The fourth pad area includes multiple fourth pads, each corresponding to a second pad.

[0046] In this embodiment, by providing a driving circuit board including a first pad area with at least one bend in the display device, the support performance of the driving chip in the driving circuit board is enhanced. This avoids the collapse of the driving chip under the bonding process due to the bonding process, avoids deformation of the driving chip, uneven indentation of conductive particles of the anisotropic conductive adhesive film and the pad, and improves product yield. In addition, it can reduce the fan-out wiring height of the display device and further reduce the bezel of the display device, which has broad application prospects.

[0047] In a specific example, refer to Figure 2a As shown, the display device 200 includes a display panel 21 and a driving circuit board 23 bonded to the display panel 21. Those skilled in the art will understand that the display panel 21 includes a display area (see the dashed box in the display panel 21) and a non-display area surrounding the display area, and the driving circuit board 23 is bonded to the non-display area of ​​the display panel 21.

[0048] Combination Figure 3a and Figure 3b As shown, the driver circuit board 23 includes a driver chip 213, a first pad area 223, and a second pad area 233, which are electrically connected to the driver chip 213. Specifically, as... Figure 2a , Figure 3a As shown, the first pad area 223 includes a plurality of first pads, and the second pad area 233 includes a plurality of second pads. Accordingly, as Figure 2b As shown, the display panel 21 includes a third pad area 221 and a fourth pad area 231. The third pad area 221 is correspondingly bound to the first pad area 223, and the fourth pad area 231 is correspondingly bound to the second pad area 233. The third pad area 221 includes multiple third pads, and the fourth pad area 231 includes multiple fourth pads. The third pads correspond one-to-one with the first pads, and the fourth pads correspond one-to-one with the second pads.

[0049] It should be understood that, in order to achieve the bonding between the display panel 21 and the driver circuit board 23, Figure 2a In the first pad area 223, the patterns of the third pad area 221 are identical and overlap, and the patterns of the second pad area 233 and the fourth pad area 231 are identical and overlap. Each third pad in the third pad area 221 is connected to a fan-out line (not shown), and the other end of the fan-out line is connected to a signal line led out from the driving circuit in the display panel. Therefore, the driving chip 213 is electrically connected to the signal line led out from the driving circuit to drive the display panel 21 for display.

[0050] It should be noted that the embodiments of the present invention are described below using a driver circuit board as an example. Those skilled in the art should understand that the third and fourth pad areas on the display panel are respectively matched with the first and second pad areas, and will not be described again below.

[0051] Specifically, refer to Figure 2a and Figure 3a As shown, in this embodiment, the first pad area 223 includes two bent portions 223-1 and 223-2. This configuration enhances the support for the driver chip 213, preventing collapse and deformation of the driver chip's underside and uneven particle indentation during the bonding process, thereby improving product yield.

[0052] In addition, refer to Figure 4 As shown in the figure, (a) illustrates the wiring diagram of the corresponding pads and fan-out lines on the display panel when the output pad area is designed as a linear distribution as in the prior art. (b) illustrates the wiring diagram of the corresponding third pads and fan-out lines on the display panel when the first pad area is designed as in the embodiment of the present invention. As can be seen from the figures, by providing a first pad area 223 including at least one bend, compared to a linear distribution, each first pad in the first pad area 223 has a height difference at the bend position, and correspondingly, each third pad in the third pad area has a height difference at the bend position. Therefore, by utilizing this height difference during fan-out line wiring, the interval between the diagonal segments of the fan-out lines can be minimized, thereby reducing the distance of the straight segments, i.e., the height of the fan-out lines, and thus reducing the bezel of the display panel. For example, under the same design and process conditions for the display panel, compared to a linear distribution, Figure 4 The pad area shown can reduce the bezel of the display panel by approximately 0.5mm.

[0053] Figure 2a and Figure 3a The illustration shows a scenario where the first pad area 223 includes two bends and the plurality of first pads are arranged in a trapezoidal pattern. However, this is merely an example, and this application is not intended to limit the number of bends or the specific arrangement of the first pads. Depending on the need, the first pad area 223 may also include one bend or more than two bends.

[0054] Specifically, when the first pad area 223 has one bend, the multiple first pads in the first pad area 223 are arranged in a triangular shape. When the pad area 233 has two bends, the multiple first pads in the first pad area 223 are arranged in a trapezoidal shape. The bends may not be angled; that is, the multiple first pads in the first pad area 223 may be arranged in an arc shape.

[0055] For example, such as Figure 3bAs shown, the first pad area 223′ may include multiple bends. Those skilled in the art should set the bends according to actual needs, with the design principle of supporting the driver chip. The goal is to avoid the collapse and deformation of the driver chip's underside and uneven particle indentation during the bonding process. This will not be elaborated further here.

[0056] Preferably, the multiple first pads in the first pad area 223 are arranged symmetrically. It can be understood that, for a trapezoidal distribution, the multiple first pads form an isosceles trapezoid, and each first pad is symmetrical with respect to the central axis of this isosceles trapezoid; in other words, this central axis is a straight line perpendicular to the upper base of the trapezoid. For a triangular distribution, the multiple first pads form an isosceles triangle, and each first pad is symmetrical with respect to the central axis of this isosceles triangle; in other words, this central axis is a straight line perpendicular to the base of the triangle. For an arc-shaped distribution, each first pad is symmetrical with respect to the central axis of the arc, and this central axis is a straight line perpendicular to the chord of the arc. This configuration allows the fan-out lines to also be symmetrically arranged, resulting in symmetrical signal voltage drops in the wiring impedance, thereby ensuring a balanced and consistent display effect on the display panel.

[0057] In some alternative embodiments, refer to Figure 5 As shown, the driving circuit board 23 also includes a plurality of first pseudo pads, i.e., dummy pads, located outside the first pad area 223 and the second pad area 233. It should be understood that the display panel also includes second pseudo pads corresponding to the first pseudo pads.

[0058] Reference Figure 5 As shown, the first pseudo pad can be set in a first region on the side of the drive circuit board 23 near the edge of the first pad area, such as region A shown in the figure; it can also be set in a second region on the side of the drive circuit board 23 near the edge of the second pad area, such as region C shown in the figure; or it can be set in a third region between the first pad area and the second pad area of ​​the drive circuit board 23, such as region B shown in the figure.

[0059] Specifically, refer to Figure 5 As shown, the first pseudo pad can be disposed in a third region between the first pad area and the second pad area of ​​the drive circuit board 23, such as region B shown in the figure. Correspondingly, the display panel also includes a correspondingly disposed second pseudo pad.

[0060] By placing the first pseudo-pad in a third region between the first and second pad areas, such as in a blank area near the belly of the driver chip, the support for the belly area of ​​the driver chip can be directly enhanced, significantly improving the collapse and deformation of the driver chip belly caused during bonding, and avoiding poor contact problems caused by uneven conductive particles of the anisotropic conductive adhesive film and pad indentations. The third region is at least a second preset distance from the first pad area. Optionally, this second preset distance is, for example, 250 μm, to ensure sufficient space for test line routing while improving support performance.

[0061] Optionally, multiple first pseudo pads are provided in the blank area between the first pad area and the second pad area, such that the distance between the first pad and the second pad and the first pseudo pad is less than or equal to 400μm. This effectively avoids poor contact caused by the collapse and deformation of the driver chip's underside and uneven particle indentation during the bonding process. Of course, those skilled in the art should understand that this distance is merely exemplary. For different sizes of driver circuit boards and the sizes of driver chips on them, designers can reasonably adjust the distance between the first pad and the second pad as needed. If necessary, multiple rows of first pseudo pads in the third area between the first pad area and the second pad area can be arranged to achieve a good support effect, which will not be elaborated further here.

[0062] Specifically, continue to refer to Figure 5 As shown, the first pseudo pad can also be disposed in a first region on the driving circuit board 23 near the edge of the first pad area, such as region A shown in the figure, or in a second region on the driving circuit board 23 near the edge of the second pad area, such as region C shown in the figure. Correspondingly, the display panel also includes a correspondingly disposed second pseudo pad.

[0063] When the pseudo-pad is placed on the edge side of the drive circuit board 23 near the first pad area, or on the edge side of the drive circuit board 23 near the second pad area, the glass film or anisotropic conductive adhesive film can be prevented from shrinking and peeling off during the bonding process.

[0064] Optionally, multiple first pseudo-pads are provided in a first region near the edge of the first pad area. The distance between the first region and the edge is less than or equal to a first preset distance, for example, 200 μm. By making the distance between the first pseudo-pad and the edge of the driving circuit board near the first pad area less than or equal to 200 μm, the bonding and stability can be effectively improved. That is, by increasing the support force between the first pseudo-pad and the second pseudo-pad provided at the corresponding position on the display panel in the first region, the problem of shrinkage and peeling of the anisotropic conductive film and the glass film can be solved, which can easily lead to the detachment of conductive particles in the anisotropic conductive film and cause misleading communication.

[0065] Optionally, multiple first pseudo-pads are provided in a second region near the edge of the second pad area. The distance between the second region and the edge is less than or equal to a first preset distance, for example, 200 μm. By making the distance between the first pseudo-pads and the edge of the driving circuit board near the second pad area less than or equal to 200 μm, the bonding and stability can be effectively improved. That is, by increasing the support force between the first pseudo-pads and the corresponding second pseudo-pads on the display panel in the second region, the problem of shrinkage and peeling of the anisotropic conductive film and the glass film can be solved, which can easily lead to the detachment of conductive particles in the anisotropic conductive film and cause misleading communication.

[0066] Optionally, multiple first pseudo pads are provided in a first region near the edge of the first pad area and multiple first pseudo pads are provided in a second region near the edge of the second pad area. The distance between the first region and the edge is less than or equal to a first preset distance, for example, 200 μm. By making the distance between the first pseudo pads in the two regions and the corresponding edge of the driving circuit board less than or equal to 200 μm, the bonding and stability can be effectively improved.

[0067] In another specific example, the driver circuit board can further enhance the support for the driver chip's underside by changing the extension length of the second pad in the second pad area. It should be noted that in this example, the specific distribution of the first pad area is still not limited; multiple first pads can be arranged in a trapezoidal, triangular, or arc-shaped pattern.

[0068] Specifically, Figure 6a A driving circuit board 63 according to one embodiment is shown. The driving circuit board includes a first pad area 623 and a second pad area 633. A plurality of first pads in the first pad area 623 are arranged in a trapezoidal shape. The second pad area 623 is correspondingly disposed to the first pad area, and each second pad extends toward its corresponding first pad such that the distance between each second pad and its corresponding first pad is a preset spacing. Optionally, the preset spacing is less than or equal to 400 μm.

[0069] Specifically, Figure 6b A driving circuit board 63' is shown as an embodiment. The driving circuit board includes a first pad area 623' and a second pad area 633'. A plurality of first pads in the first pad area 623' are arranged in a triangular pattern. The second pad area 623' is correspondingly disposed to the first pad area. Each second pad extends toward its corresponding first pad such that the distance between each second pad and its corresponding first pad is a preset spacing. Optionally, the preset spacing is less than or equal to 400 μm.

[0070] Specifically, Figure 6cA driving circuit board 63″ is shown in one embodiment. The driving circuit board includes a first pad area 623″ and a second pad area 633″. A plurality of first pads in the first pad area 623″ are arranged in an arc shape. The second pad area 623″ is correspondingly disposed to the first pad area. Each second pad extends toward the corresponding first pad such that the distance between each second pad and the corresponding first pad is a preset spacing. Optionally, the preset spacing is less than or equal to 400 μm.

[0071] With the above settings, the display device can take advantage of the support capacity of the bending part and the narrow bezel wiring, while the extended second pad, corresponding to the bending trend of the first pad, supports the blank area of ​​the driver chip's abdomen, effectively improving the problems of driver chip abdomen collapse deformation and uneven particle indentation caused during the bonding process.

[0072] In this example, the driver circuit board may further include a plurality of first pseudo pads disposed on the edge side of the driver circuit board near the first pad area. The first area is less than or equal to a first preset distance from the edge side, for example, the first preset distance is 200μm. Of course, the display panel also includes a plurality of corresponding second pseudo pads. By ensuring that the distance between the first pseudo pads and the edge of the driver chip is less than or equal to 200μm, bonding and stability can be effectively improved.

[0073] In another specific example, by setting the distribution of multiple second pads to be consistent with that of multiple first pads and the shape of the second pads to be the same as that of the corresponding first pads, the spacing between the second pad area and the first pad area is reduced by the same preset spacing, thereby enhancing the support between the second pad area and the first pad area and effectively improving the problems of driver chip belly collapse deformation and uneven particle indentation caused during the bonding process.

[0074] Specifically, Figure 7a A driving circuit board 73 according to one embodiment is shown. The driving circuit board includes a first pad area 723 and a second pad area 733. A plurality of first pads in the first pad area 723 are arranged in a trapezoidal shape. The shapes of the second pads are the same as the corresponding shapes of the first pads. The second pad area 733 is correspondingly disposed to the first pad area 723, and the distribution shape of the plurality of second pads in the second pad area 733 is the same as the distribution shape of the plurality of first pads in the first pad area 723. With this arrangement, the three sides of the trapezoidal distribution formed by the plurality of first pads and the trapezoidal distribution formed by the plurality of second pads are respectively parallel. The spacing between the corresponding parallel portions can be set to a preset spacing, for example, less than or equal to 400 μm.

[0075] Specifically, Figure 7bA driving circuit board 73' is shown as an embodiment. The driving circuit board includes a first pad area 723' and a second pad area 733'. A plurality of first pads in the first pad area 723' are arranged in a triangular pattern. The shapes of the second pads are identical to the shapes of their corresponding first pads. The second pad area 733' is correspondingly positioned to the first pad area. Furthermore, the distribution shape of the plurality of second pads in the second pad area 733' is identical to the distribution shape of the plurality of first pads in the first pad area 723'. This arrangement ensures that the two sides of the triangular distribution formed by the plurality of first pads and the triangular distribution formed by the plurality of second pads are respectively parallel. The spacing between the corresponding parallel portions can be set to a preset spacing, for example, less than or equal to 400 μm.

[0076] Specifically, Figure 7c A driving circuit board 73″ is shown in one embodiment. This driving circuit board includes a first pad area 723″ and a second pad area 733′. A plurality of first pads in the first pad area 723″ are arranged in an arc shape. The shapes of the second pads are the same as the corresponding shapes of the first pads. The second pad area 733″ is correspondingly arranged to the first pad area 723″, and the distribution shape of the plurality of second pads in the second pad area 733″ is the same as the distribution shape of the plurality of first pads in the first pad area 723″. Through this arrangement, the arc shape distribution formed by the plurality of first pads is concentric with the arc shape distribution formed by the plurality of second pads. The difference in radii between the two concentric arcs can be set to a preset spacing, for example, less than or equal to 400 μm.

[0077] With the above settings, the display device can utilize the support capacity of the bent portion and the advantages of narrow bezel wiring, while also taking advantage of the bending trend of the second pad area corresponding to the first pad area to support the blank area on the belly of the driver chip, effectively improving the problems of driver chip belly collapse deformation and uneven particle indentation caused during the bonding process.

[0078] Regarding the specific examples above, it should be noted that each bend corresponds to the formation of the first pad area. For the first sub-pad area as a whole, as... Figure 7a and Figure 7b As shown, the angle θ between the first sub-pad area and the edge side near the first pad area satisfies a first preset angle range, which is less than 90°. For each first pad in each first pad area, it is not necessary for them all to be perpendicular to the edge side of the drive circuit board near the first pad area. In the design, as... Figure 8 As shown, due to the bending, forming an angle of less than 90° or greater than 90° relative to the edge side is often more conducive to fan-out routing. In an embodiment of the present invention, the angle φ between the first pad of the first sub-pad area and the edge side near the first pad area satisfies a second preset angle range. This first preset angle range is greater than or equal to 0° and less than or equal to 180°.

[0079] The specific examples above all illustrate a scenario where the first pad area includes a plurality of first pads arranged in a concentrated manner, i.e., a single row of first pads. It should be noted that this application is not intended to limit the first pad area to a single row. In some alternative embodiments, such as... Figure 9 As shown, the multiple first pads in the first pad area can be in multiple rows, that is, the first pad area 223″ includes at least one sub-pad group with multiple first pads arranged in a concentrated manner. However, the spacing between each sub-pad group is smaller than the spacing between the first pad area and the second pad area.

[0080] In addition, Figure 10a Another optional example is shown in Figure 10a The display device 900 shown is Figures 6a-6c and 7a- Figure 7c Extended examples.

[0081] Specifically, in the display device 900, in addition to the display panel 91 and the driving circuit board 93 bonded to the display panel 91, it also includes a flexible circuit board 95 bonded to the display panel 91. (Refer to...) Figure 10b As shown, the display panel 91 also includes a fifth pad area 951 bonded to the flexible circuit board 95. Similarly, the flexible circuit board 95 includes a pad area 915 with the same shape and arrangement as the fifth pad area 951, which will not be described in detail here.

[0082] Specifically, the fifth pad area 951 includes a plurality of fifth pads, which are correspondingly arranged with the fourth pads. Because the fourth pads correspond one-to-one with the second pads on the driver circuit board, the distribution and shape of the plurality of fourth pads in the fourth pad area are the same as the plurality of second pads in the second pad area. Based on this arrangement, when a fifth pad is electrically connected to its corresponding fourth pad via a signal line (e.g., an OLB signal line), such as... Figure 11a and Figure 11b As shown, the signal lines can be led from either the side of the fourth pad area away from the fifth pad area 951, or from the side of the fourth pad area closer to the fifth pad area 951, with the distance between the signal lines greater than the third preset distance. This sets the fourth pad area as follows: Figure 11a The multiple fourth pads are arranged in an arc shape in the fourth pad area 933″ and as shown. Figure 11b When the multiple fourth pads shown are arranged in a trapezoidal pattern in the fourth pad area 933, the routing space is increased. In other words, the distance between each signal line is increased due to the increased routing space, that is, the distance from each signal line to other signal lines is increased, which makes it easier to route OLB traces and simplifies the design for designers, regardless of whether the multiple fifth pads are arranged in a straight line or in a trapezoidal pattern.

[0083] Based on the same inventive concept, referring to Figure 12 , Figure 2a and Figure 2b As shown, embodiments of the present invention also provide a bonding method using a display device as described in the above embodiments, comprising:

[0084] S1, aligning the driving circuit board and display panel of the display device, wherein the driving circuit board includes a driving chip, a first pad area and a second pad area electrically connected to the driving chip and bound to the display panel, wherein the first pad area includes a plurality of first pads and the first pad area includes at least one bent portion, the second pad area includes a plurality of second pads, the display panel includes a third pad area bound to the first pad area and a fourth pad area bound to the second pad area, the third pad area includes a plurality of third pads, the third pads correspond one-to-one with the first pads, and the fourth pad area includes a plurality of fourth pads, the fourth pads correspond one-to-one with the second pads;

[0085] S2, bonding the driver circuit board and the display panel, includes: pressing the first pad area and the third pad area to make each first pad and the corresponding third pad electrically connected, and pressing the second pad area and the fourth pad area to make each second pad and the corresponding fourth pad electrically connected.

[0086] In this embodiment, by setting the display device to include a driving circuit board with a first pad area having at least one bend, the support performance of the driving chip in the driving circuit board is enhanced, thereby avoiding the collapse of the driving chip belly due to the bonding process during bonding, avoiding deformation of the driving chip and uneven particle indentation, improving product yield, and reducing the fan-out wiring height of the display device, further reducing the bezel of the display device, which has broad application prospects.

[0087] In some alternative embodiments, further combined Figure 10a and 10b , Figure 11a and 11b As shown, the display device also includes a flexible circuit board bonded to the display panel. The flexible circuit board includes multiple leads. The display panel also includes a fifth pad area bonded to the flexible circuit board. The fifth pad area includes multiple fifth pads, which are correspondingly arranged with the fourth pads. The bonding method further includes:

[0088] Align and bind the driver circuit board and flexible circuit board of the display device, including pressing the leads and fifth pad area of ​​the flexible circuit board so that each lead and the corresponding fifth pad are electrically connected.

[0089] The fifth pads in the fifth pad area and the corresponding fourth pads in the fourth pad area are electrically connected using signal lines, and the distance between the signal lines is greater than the third preset distance.

[0090] This invention addresses existing problems by providing a display device and its bonding method. By including a driver circuit board with a first pad area having at least one bend in the display device, the support performance for the driver chip in the driver circuit board is enhanced. This avoids driver chip collapse due to bonding process, prevents driver chip deformation, and avoids uneven pressure indentation between conductive particles of the anisotropic conductive adhesive film and the pad, thus improving product yield. Furthermore, it reduces the fan-out wiring height of the display device, further reducing the bezel of the display device, and has broad application prospects.

[0091] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A display device, characterized in that, Includes a display panel and a driver circuit board bonded to the display panel, wherein: The driving circuit board includes a driving chip, a first pad area and a second pad area electrically connected to the driving chip and bound to the display panel, wherein the first pad area includes a plurality of first pads and the first pad area includes at least one bent portion, and the second pad area includes a plurality of second pads. The display panel includes a third pad area bound to the first pad area and a fourth pad area bound to the second pad area. The third pad area includes multiple third pads, each corresponding to one of the first pads. The fourth pad area includes multiple fourth pads, each corresponding to one of the second pads. The first pads in the first pad area are arranged in a trapezoidal, triangular, or arc shape. The second pad area is correspondingly set to the first pad area. Each second pad extends toward the corresponding first pad so that the distance between each second pad and the corresponding first pad is the same preset spacing, thereby using the extended second pads to support the blank area on the abdomen of the driver chip. The preset spacing is less than or equal to 400μm.

2. The display device according to claim 1, characterized in that, The driving circuit board also includes a plurality of first pseudo pads located outside the first pad area and the second pad area, and the display panel also includes second pseudo pads corresponding to the first pseudo pads.

3. The display device according to claim 2, characterized in that, The first pseudo pad is disposed in at least one of a first region near the edge of the first pad area, a second region near the edge of the second pad area, and a third region between the first pad area and the second pad area on the driving circuit board, wherein the first region is less than or equal to a first preset distance from the edge, the second region is less than or equal to the first preset distance from the edge, and the third region is greater than or equal to a second preset distance from the first pad area.

4. The display device according to claim 1, characterized in that, The driving circuit board further includes a plurality of first pseudo pads disposed in a first region on the edge side of the driving circuit board near the first pad area, and the display panel further includes second pseudo pads corresponding to the first pseudo pads, wherein the first region is less than or equal to a first preset distance from the edge side.

5. The display device according to claim 1 or 4, characterized in that, The display device also includes a flexible circuit board bonded to the display panel. The display panel further includes a fifth pad area bonded to the flexible circuit board. The fifth pad area includes a plurality of fifth pads, which are correspondingly arranged with the fourth pads. The fifth pads and the corresponding fourth pads are electrically connected by signal lines, and the distance between the signal lines is greater than a third preset distance.

6. The display device according to claim 1, characterized in that, The first pad area includes a first sub-pad area. The angle between the first sub-pad area and the edge side near the first pad area satisfies a first preset angle range, and the angle between the first pad of the first sub-pad area and the edge side near the first pad area satisfies a second preset angle range.

7. The display device according to claim 1, characterized in that, The first pad area includes at least one sub-pad group having a plurality of first pads arranged in a concentrated manner, wherein the spacing between each sub-pad group is smaller than the spacing between the first pad area and the second pad area.

8. A bonding method using a display device as described in any one of claims 1-7, characterized in that, include: A driver circuit board and a display panel for a positioning display device, wherein the driver circuit board includes a driver chip, a first pad area and a second pad area electrically connected to the driver chip and bound to the display panel, wherein the first pad area includes a plurality of first pads and includes at least one bent portion, the second pad area includes a plurality of second pads, the display panel includes a third pad area bound to the first pad area and a fourth pad area bound to the second pad area, the third pad area includes a plurality of third pads, each corresponding to one of the first pads, and the fourth pad area includes a plurality of fourth pads, each corresponding to one of the second pads; Binding the driver circuit board and the display panel includes: pressing the first pad area and the third pad area to electrically connect each first pad and the corresponding third pad, and pressing the second pad area and the fourth pad area to electrically connect each second pad and the corresponding fourth pad.

9. The binding method according to claim 8, characterized in that, The display device further includes a flexible circuit board bonded to the display panel, the flexible circuit board including a plurality of leads, and the display panel further includes a fifth pad area bonded to the flexible circuit board, the fifth pad area including a plurality of fifth pads, the fifth pads being correspondingly arranged with the fourth pads, and the bonding method further including: Align and bind the driver circuit board and flexible circuit board of the display device, including pressing each lead and the fifth pad area of ​​the flexible circuit board so that each lead and the corresponding fifth pad are electrically connected. Each fifth pad in the fifth pad area and the corresponding fourth pad in the fourth pad area are electrically connected using signal lines, and the distance between the signal lines is greater than a third preset distance.

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