Stereoscopic imaging equipment for confined spaces

Abstract

According to some embodiments, a stereoscopic imaging device includes a tubular housing configured to be inserted into a confined space and including a hole therethrough. The device also includes a first image sensor and a second image sensor, the first image sensor and the second image sensor being adjacently mounted on a common sensor circuit substrate sized to be accommodated within the hole, each image sensor including a photosensitive element on a face, the photosensitive element being oriented to capture respective images of an object field from different perspective viewpoints to generate 3D image data. The device includes processing circuit substrates, each of which includes a processing circuit for processing signals from the image sensors and whose size corresponds to the size of the sensor circuit substrate. The circuit substrates are connected via flexible interconnects that carry signals between the processing circuits and facilitate folding the circuit substrates in a back-to-back configuration such that each successive circuit substrate is stacked axially behind the previous circuit substrate within the hole.

Description

Technical Field

[0001] The present disclosure relates generally to stereoscopic imaging, and more particularly to an arrangement for housing imaging and processing elements within a housing of a stereoscopic imaging device suitable for imaging within confined spaces. Background Art

[0002] Small format image sensors capable of generating high resolution video signals are now available at low cost. For example, 1 / 7 inch (<4 mm) sensors capable of producing full HD video are now available. A pair of 1 / 7 inch image sensors can be placed adjacent to each other to capture images from different perspective viewpoints for generating 3D image information while being small enough to fit within a 10 mm diameter tubular bore. However, the image signals generated by CMOS image sensors typically have low signal levels and are therefore susceptible to interference if transmitted via a cable to a remotely located host system. Therefore, the image signals typically need to be processed at or very close to the image sensor before being transmitted to the host system.

[0003] There remains a need for processing circuitry having dimensions and aspects comparable to those of small format image sensors for imaging in confined spaces. Summary of the invention

[0004] According to some embodiments, a stereoscopic imaging device is provided. The device includes a tubular housing configured to be inserted into a confined space, the tubular housing including a hole extending through the housing. The device also includes a first image sensor and a second image sensor, the first image sensor and the second image sensor are adjacently mounted on a common sensor circuit substrate of a size suitable for being accommodated in the hole, each image sensor includes a plurality of photosensitive elements on a face, the plurality of photosensitive elements are configured to capture respective images of an object field from different perspective viewpoints to generate image data including three-dimensional information. The device further includes a plurality of processing circuit substrates, each of which includes an image signal processing circuit, the size of each processing circuit substrate substantially corresponding to the size of the sensor circuit substrate, the image signal processing circuit is configured to process the signal generated by the image sensor to generate an image data stream at an output on one of the processing circuit substrates, the image data stream being configured to be transmitted to a host system. The sensor circuit substrate and multiple processing circuit substrates are connected via a flexible interconnect, which is configured to carry signals between image signal processing circuits on each of the processing circuit substrates, and the flexible interconnect facilitates folding the circuit substrates in a back-to-back configuration, wherein each consecutive circuit substrate is axially stacked behind the previous circuit substrate within the hole of the tubular housing.

[0005] The sensor circuit substrate and the plurality of processing circuit substrates may be connected end-to-end via flexible interconnects to facilitate folding the processing circuit substrates in a back-to-back z-fold configuration.

[0006] Each of the image sensors may include imaging optics disposed in front of a respective face of each of the image sensors and configured to capture light from the object field to form an image on the respective image sensor.

[0007] The sensor circuit substrate may be mounted within the bore of the tubular housing at an angle so that faces of the image sensor are oriented at an angle to the longitudinal axis of the bore to capture light from an off-axis object field.

[0008] The sensor circuit substrate is pivotally mounted within the bore of the tubular housing to allow faces of the image sensor to be oriented at an angle to the longitudinal axis of the bore to capture light from an off-axis object field.

[0009] The apparatus may include an actuator disposed within the aperture and configured to cause pivotal movement of the sensor circuit substrate within a range of angles relative to the longitudinal axis.

[0010] The angular range may include angles between about 0° and about 30° relative to the longitudinal axis.

[0011] The actuator may include one of a linear piezoelectric actuator, a rotary piezoelectric motor, or a control linkage.

[0012] The sensor circuit substrate can be mounted within the aperture such that the faces of the image sensor are oriented substantially perpendicular to the longitudinal axis of the aperture, and the device can further include at least one beam steering element responsive to a control signal, the beam steering element being configured to cause a change in optical properties to allow selective changing of the angle of the object field relative to the longitudinal axis.

[0013] The sensor circuit substrate can be mounted within the aperture so that the faces of the image sensor are oriented substantially perpendicular to the longitudinal axis of the aperture, and the device can further include at least one prism disposed at an end of the aperture, the at least one prism being configured to capture light from an object field oriented at an angle to the longitudinal axis and direct the light onto the faces of the image sensor.

[0014] The image signal processing circuitry may be configured to produce a single data stream representative of images captured by each of the image sensors, and the output may include a single coaxial connector disposed on one of the plurality of processing circuit substrates distally relative to the sensor circuit substrates.

[0015] The image signal processing circuit can be configured to process the image signal from each of the image sensors respectively to produce a first data stream and a second data stream, each data stream representing an image captured by one of the image sensors, and the output can include a first coaxial connector and a second coaxial connector, which are arranged on a processing circuit substrate located distally relative to the sensor circuit substrate among the multiple processing circuit substrates.

[0016] The tubular housing may be attached to a distal end of an elongated sheath including a bore extending through the sheath, and the output may be connected to a cable extending along the bore of the elongated sheath for connection to a host system.

[0017] The elongated sheath may include a flexible articulated portion that facilitates movement of the tubular housing within a confined space when actuated by a host system.

[0018] The apparatus may include a plurality of optical fibers extending through the bore of the elongated sheath and the bore of the tubular housing and terminating at an end of the tubular housing, the plurality of optical fibers being configured to direct light from a distally located light source to illuminate the object field.

[0019] The sensor circuit substrate and the processing circuit substrate may be sized to occupy a central portion of the aperture, and the plurality of optical fibers may be routed through a peripheral portion of the aperture relative to the circuit substrates.

[0020] The tubular housing may have a generally circular cross-section.

[0021] The bore of the tubular housing may have a diameter of approximately 10 mm.

[0022] The stereoscopic imaging device may be used in a robotic surgery system.The tubular housing may be configured to be inserted into a body cavity of a patient.

[0023] The image signal processing circuitry may include circuitry configured to provide image processing functionality for conditioning image signals generated by the respective image sensors and circuitry configured to convert the conditioned image signals into a data stream suitable for transmission to a host system.

[0024] According to some embodiments, a stereoscopic imaging device is provided, comprising a tubular housing configured to be inserted into a confined space, the tubular housing comprising a hole extending through the housing, at least a portion of the tubular housing being bendable. The device also includes a first image sensor and a second image sensor, the first image sensor and the second image sensor being mounted adjacently on a common sensor circuit substrate of a size suitable for being received within the hole, each image sensor including a plurality of photosensitive elements on a face, the plurality of photosensitive elements being oriented to capture respective images of an object field from different perspective viewpoints to generate image data including three-dimensional information. The device further includes a plurality of processing circuit substrates, each of which includes an image signal processing circuit, the extent of each of the processing circuit substrates generally corresponding to the extent of the sensor circuit substrate, the image signal processing circuit being configured to process signals generated by the image sensors to generate an image data stream at an output on one of the processing circuit substrates for transmission to a host system. The sensor circuit substrate and the plurality of processing circuit substrates are connected via a flexible interconnect, the flexible interconnect being configured to carry signals between the image signal processing circuits on each of the processing circuit substrates, the flexible interconnect facilitating the bending of the processing circuit substrate within the hole of the tubular housing.

[0025] Other aspects and features will become apparent to those of ordinary skill in the art from the following description of the specifically disclosed embodiments read in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the accompanying drawings illustrating the disclosed embodiments,

[0027] Figure 1 is a partially cut-away front perspective view of a stereoscopic imaging device according to a first disclosed embodiment;

[0028] Figure 2 yes Figure 1 a rear perspective view of a portion of the stereoscopic imaging apparatus shown;

[0029] Figure 3 Yes Figure 1 A perspective view of an imaging mirror of a stereoscopic imaging device is shown;

[0030] Figure 4 A side view of a stereoscopic imaging device according to another disclosed embodiment;

[0031] Figure 5 yes Figure 4 Another side view of the stereoscopic imaging device is shown with the image sensor circuit substrate in the deployed position;

[0032] Figure 6 is a side view of a stereoscopic imaging device according to another disclosed embodiment;

[0033] Figure 7 It is manufactured Figure 1 A perspective view of a sensor circuit substrate and a plurality of circuit substrates of a stereoscopic imaging device shown; and

[0034] Figure 8 is a rear perspective view of another embodiment of a stereoscopic imaging device. DETAILED DESCRIPTION

[0035] refer to Figure 1 , a stereoscopic imaging device according to a first disclosed embodiment is generally shown at 100. The device 100 includes a tubular housing 102 having a hole 104 extending through the housing. The tubular housing 102 is configured to be inserted into a confined space, such as a body cavity of a patient. In the illustrated embodiment, the tubular housing 102 has a generally circular cross-section and may have a diameter of approximately 10 millimeters in one embodiment.

[0036] The device 100 also includes a first image sensor 106 and a second image sensor 108, which are mounted adjacently on a common sensor circuit board or substrate 110 sized to be received within the aperture 104. The image sensor 106 includes a plurality of photosensitive elements 112 on a face 114, while the image sensor 108 includes a plurality of photosensitive elements 116 on a face 118. The faces 114 and 118 are oriented to capture respective images of an object field 120 from different perspective viewpoints to generate image data including three-dimensional information. Each of the image sensors 106 and 108 has a respective imaging optic 150, 152 disposed in front of the faces 114 and 118 and operably configured to capture light from the object field 120 to form an image on the respective image sensor. In this embodiment, the image sensors 106 and 108 are mounted on the sensor circuit substrate 110 such that the faces 114 and 118 are in a common plane but are separated by an inter-sensor center spacing dimension D. Image sensors 106 and 108 may be implemented using CMOS image sensors, which generally have lower cost and lower operating power requirements than charge coupled device sensors (CCDs).

[0037] Device 100 further includes a plurality of processing circuit boards or substrates 122, 124, 126, and 128, each of which carries image signal processing circuitry. Figure 1In the illustrated embodiment, the circuit substrates 122, 124, 126, and 128 have an extent that generally corresponds to the sensor circuit substrate 110 and fits within the aperture when oriented perpendicular to the longitudinal axis 154. In some cases, the shape and / or size of the circuit substrate substantially matches the shape and / or size of the sensor circuit substrate. In the illustrated embodiment, each of the plurality of circuit substrates 122 to 128 includes image signal processing circuitry in the form of respective integrated circuits 130, 132, 134, and 136 that are configured to provide image processing functionality for conditioning image signals generated by the respective image sensors 106 and 108 and converting the conditioned image signals into data streams for transmission back to the host system. In one embodiment, the integrated circuits 130, 132, 134, and 136 may be implemented using an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other large scale integrated circuits.

[0038] refer to Figure 2 , the device 100 is shown in a perspective view with the tubular housing 102 omitted. The circuit substrate 128 has output connectors 200 and 202 for connecting to respective transmission cables for transmitting image data streams associated with the image sensors 106 and 108 back to the host system ( Figure 1 and 2 In the illustrated embodiment, output connectors 200 and 202 are implemented as coaxial cable connectors operable to transmit a 3G Serial Digital Interface (SDI) serial data stream to a host system via a coaxial cable. The processing circuitry on circuit substrates 122 to 128 thus formats the image data into a serial data stream for transmission.

[0039] The sensor circuit substrate 110 and the plurality of circuit substrates 122 to 128 are connected end-to-end via flexible interconnects 138, 140, 142, and 144, which carry signals between image signal processing circuits on each of the processing circuit substrates 122 to 128. The flexible interconnects 138 to 144 also facilitate folding the circuit substrates 122 to 128 in a back-to-back z-fold configuration, such that each successive circuit substrate is stacked axially behind the previous circuit substrate within the aperture 104 of the tubular housing 102. The circuit substrates 122 to 128 may be arranged in planes parallel to one another. The centers of each of the circuit substrates may be aligned linearly.

[0040] refer to Figure 3, an imaging scope for insertion into a confined space is generally shown at 300. In the illustrated embodiment, the tubular housing 102 can be attached to a distal end 302 of an elongated sheath 304 having an aperture 306 extending through the sheath. The device 100 and the elongated sheath 304 together constitute the imaging scope 300. The imaging scope 300 includes a first cable 308 and a second cable 310 extending through the aperture 306 and connected to output connectors 200 and 202 that carry image signals along the elongated sheath 304 to a proximal end 312 of the sheath. The cables 308 and 310 are connected to inputs 314 and 316 of a host system 318.

[0041] In this embodiment, the device 100 also includes a plurality of optical fibers 320 extending through the bore 306 of the elongated sheath 304 and the bore 104 of the tubular housing 102. The optical fibers receive light from a distally located illumination source 322 that is directed along the optical fibers to a distal end 324 of the tubular housing 102. The optical fibers 320 may be routed peripherally within the tubular housing 102 of the device 100 and terminate at the distal end 324 in upper and lower illumination windows 326, 328 for illuminating the object field 120. The sensor circuit substrate 110 and the processing circuit substrates 122-128 may be sized to occupy a central portion of the bore 104, and the plurality of optical fibers 320 may be routed through a peripheral portion of the bore relative to the circuit substrates.

[0042] In this embodiment, the sheath 304 also includes a flexible articulated portion 332 that facilitates movement of the tubular housing 102 within a confined space when actuated by the host system 318 to orient the imaging optics 150 and 152 to illuminate and observe a desired portion of the object field 120. In one embodiment, the flexible articulated portion 332 may be generally configured as disclosed in commonly owned Patent Cooperation Treaty patent publication WO2014201538 filed on December 20, 2013, which is incorporated herein by reference in its entirety.

[0043] Reference again Figure 1 , while the circuit substrates 122-128 are disposed generally perpendicular to a longitudinal axis 154 passing through the aperture 104, the sensor circuit substrate 110 is mounted at an angle α of approximately 30° relative to the longitudinal axis 154. The resulting angled image sensors 106 and 108 capture light from an object field 120 that is off-axis relative to the longitudinal axis 154. An off-axis object field 120 may be advantageous in embodiments such as robotic surgery, where it is desirable to deploy the device 100 to prevent encroachment on the working volume of surgical instruments introduced into a confined space.

[0044] refer to Figure 4Another embodiment of a stereoscopic imaging device is shown generally in cross-section at 400. Device 400 includes sensor circuit substrate 110, image sensors 106 and 108, imaging optics 150 and 152, and generally as Figure 1 122 to 128 of the configuration shown. However, in this embodiment, the sensor circuit substrate 110 is mounted for pivotal movement (extending into the page) about an axis 402. The device 400 also includes an actuator 404 that is operably configured to advance or retract a rod 406 to cause angular movement of the sensor circuit substrate 110 about the axis 402. Figure 5 As shown, the sensor circuit substrate 110 of the device 400 has been pivoted to a fully deployed position at an angle of approximately 30° relative to the longitudinal axis 154 .

[0045] In one embodiment, actuator 404 may be implemented using a linear piezoelectric motor that receives a drive signal via a cable (not shown) extending through hole 104. The drive signal may be generated at host system 318 to cause rod 406 to move forward or backward in steps to facilitate positioning the sensor within a range of angles. This has the advantage of being able to orient image sensors 106 and 108 at any one of a range of angles α relative to longitudinal axis 154 by generating an appropriate drive signal to cause actuator 404 to move through a predetermined number of steps. In one embodiment, the range of angles α may include angles between about 0° and about 30° relative to longitudinal axis 154.

[0046] In other embodiments, the actuator may be implemented using any other microactuator, such as a rotary piezoelectric motor or a SQUIGGLE motor (available from New Scale Technologies, Inc., New York). In another embodiment, movement of the sensor circuit substrate 110 may be actuated by pushing and / or pulling a control linkage passing through the hole 104 (and through the elongated sheath 304, if provided).

[0047] refer to Figure 6 Another embodiment of a stereoscopic imaging device is shown generally in cross-section at 600. Device 600 includes sensor circuit substrate 110, image sensors 106 and 108, imaging optics 150 and 152, and generally as Figure 11. The circuit substrates 122 to 128 of the configuration shown. The sensor circuit substrate 110 is mounted within the aperture 104 such that the faces of the image sensors 106 and 108 are oriented substantially perpendicular to the longitudinal axis 154. In this embodiment, the apparatus 600 further includes a prism 602 disposed in front of the imaging optics 150 and 152. The prism 602 has a selected prism angle so that light is captured from the object field 120 oriented approximately 30° off-axis relative to the longitudinal axis 154. The light captured from the off-axis object field 120 is turned by the prism 602 and becomes substantially aligned with the longitudinal axis 154 before being incident on the faces of the image sensors 106 and 108.

[0048] In other embodiments, an electrically controllable beam steering element may be implemented in place of the prism 602 to facilitate control of the offset angle α in response to a control signal generated by the host system 318. As an example, the prism may be implemented using a beam steering element such as a TP-12-16 liquid prism or a MR-15-30 tunable mirror available from Optotune Switzerland AG.

[0049] refer to Figure 7 , the sensor circuit substrate 110 and the plurality of circuit substrates 122 to 128 may be fabricated as strips as shown, and then folded back to back at the flexible interconnects 138 to 144 for insertion into a substrate such as a Figure 1 1. The sensor circuit substrate 110 and the plurality of processing circuit substrates 122 to 128 are connected end-to-end via flexible interconnects 138 to 144, so that the signal from each of the sensors 106 and 108 must propagate through each of the circuit substrates 122 to 128 before reaching the output.

[0050] In alternative embodiments, the plurality of circuit substrates 122 to 128 may still be manufactured as a whole. Figure 7 128. The strips shown in FIG. 129 are not folded, but can be housed in a longitudinal layout within the tubular housing 102. This configuration would allow the diameter of the tubular housing 102 to be reduced because the image processing circuitry would be spaced apart (via the plurality of circuit substrates 122 to 128) along the length of the tubular housing 102. This longitudinal layout could also allow the plurality of circuit substrates 122 to 128 to be housed within a flexible or bendable portion of the housing (not shown), thereby allowing the image processing circuitry to bend at the flexible interconnects 138 to 144 when the housing is bent.

[0051] Reference again Figure 1, the image data signals generated at each of the image sensors 106 and 108 are passed to the circuit substrate 122 via the sensor circuit substrate 110 and the flexible interconnect 138, and then passed to the circuit substrate 124 via the flexible interconnect 140. In one embodiment, the integrated circuits 130 and 132 on the circuit substrates 122 and 124 perform signal processing and data formatting functions on the image data received from one of the sensors (e.g., sensor 106), while the image data from the other image sensor 108 is simply passed through the circuit substrates 122 and 124. Similarly, the integrated circuits 134 and 136 on the circuit substrates 126 and 128 may perform signal processing and data formatting functions on the image data received from the sensor 108, while the image data from the image sensor 106 is simply passed to the output 200. In other embodiments, the order of processing may be different, for example, signal processing for the image sensor 106 may be performed on the integrated circuit 130 and signal processing for the image sensor 108 may be performed on the integrated circuit 132.

[0052] refer to Figure 8 Another embodiment of a stereoscopic imaging device is generally shown at 800. Device 800 includes a sensor circuit substrate 802 on which image sensors 106 and 108 are mounted, such as Figure 1 However, in this embodiment, the sensor circuit substrate 802 has a first flexible interconnect 820 extending from a lower edge of the sensor circuit substrate 802 and a second flexible interconnect 822 extending from an upper edge of the sensor circuit substrate 802. The additional processing circuit substrates 804, 806, 808, and 810 are arranged back-to-back in a folded configuration. The device 800 further includes an output circuit substrate 812 having an output connector 814 and an output circuit substrate 816 having an output connector 818.

[0053] Image data received from sensor 106 is transmitted to circuit substrate 808 via first flexible interconnect 820 for processing and then transmitted to circuit substrate 810 via flexible interconnect 824 for further processing. Circuit substrates 808 and 810 are positioned back-to-back behind circuit substrate 806. The processed image data is then transmitted to output circuit substrate 812 via flexible interconnect 826, where the output signal is available at output connector 814. Similarly, image data received from sensor 108 is transmitted to circuit substrate 804 via second flexible interconnect 822 for processing and then transmitted to circuit substrate 806 via flexible interconnect 828 for further processing. Circuit substrates 804 and 806 are positioned back-to-back and nested between sensor circuit substrate 802 and circuit substrate 808. The processed image data is then transmitted to output circuit substrate 816 via flexible interconnect 830, where the output signal is available at output connector 818.

[0054] One advantage of the alternative arrangement of circuit substrates in device 800 is that the image data signals generated by sensor 106 are not routed through the same circuit substrate on which signal processing from image sensor 108 is performed. Similarly, the image data signals generated by sensor 108 are not routed through the same circuit substrate on which signal processing from image sensor 106 is performed. If the image signals from image sensor 106 and image sensor 108 are routed in close proximity on the circuit substrate, the likelihood of interference and crosstalk between the signals increases. Image signals from sensors 106 and 108 are particularly susceptible to interference due to having relatively low signal levels. In addition, if the image data signals generated by both sensors 106 and 108 are routed through the same circuit substrate, the layout of the circuit substrate may require tiny vias (vertical interconnect paths) between layers. The need for vias increases the manufacturing complexity associated with the substrate.

[0055] In device 800, image signals from image sensor 106 undergo signal conditioning and data formatting on circuit substrates 808 and 810, and the processed signals are then transmitted to output connector 814 via flexible interconnect 826. The processed signals are generally less susceptible to interference and crosstalk. Image signals from image sensor 108 undergo signal conditioning and data formatting on circuit substrates 804 and 806, and the processed signals are then transmitted to output connector 818 via flexible interconnect 830. In device 800, the circuit substrates are still back-to-back and have a similar overall extent within bore 104 of tubular housing 102, but provide improved separation between the processing paths for the respective image sensors 106 and 108.

[0056] In the above-described embodiments, the image data generated by each image sensor 106 and 108 is processed and formatted into its own separate data stream at the corresponding output connector 200, 202 or 814, 818. The image signal processing circuit is configured to process the image signals from each of the image sensors 106 and 108 to generate a first data stream and a second data stream at the corresponding output connector 200, 202 or 814, 818. Therefore, each data stream represents an image captured by one of the image sensors 106 and 108. Therefore, the first coaxial connector and the second coaxial connector are arranged on the circuit substrate located far away relative to the sensor circuit substrate 110, 802. The transmission of these signals via separate cables 308 and 310 between the device 100, 800 and the host system 318 facilitates high transmission data rates for high-resolution video imaging.

[0057] In other embodiments, the two data streams may be combined into a single data stream and made available at a single output for transmission to the host system 318 via a single cable. The image signal processing circuit may be configured to produce a single data stream combining the images captured by each of the image sensors 106 and 108, and a single output connector may be provided on the output circuit substrate. A suitable data transmission protocol for combining two image data streams from a stereoscopic image sensor is disclosed in commonly owned patent publication US 20180054605 filed on August 15, 2017, which is incorporated herein by reference in its entirety.

[0058] The disclosed embodiments described above are able to take full advantage of the small image sensor formats currently available to provide stereoscopic imaging within a pinhole housing. The disclosed arrangements, dimensions and aspects of the circuit substrate effectively utilize the volume within the housing that is available to accommodate processing circuitry. The disclosed arrangements further facilitate pivoting of the sensor to provide off-axis imaging of the object field.

[0059] While certain embodiments have been described and depicted, these embodiments should be considered illustrative only, and are not to be considered limiting of the disclosed embodiments as construed according to the appended claims.

Claims

1. A stereoscopic imaging device, comprising: a tubular housing configured to be inserted into a confined space, the tubular housing including a bore extending through the housing; a first image sensor and a second image sensor, the first image sensor and the second image sensor being adjacently mounted on a common sensor circuit substrate sized to be received within the aperture, each image sensor comprising a plurality of photosensitive elements on a face, the plurality of photosensitive elements being oriented to capture respective images of an object field from different perspective viewpoints and generate image data including three-dimensional (3D) information; a plurality of processing circuit substrates, each comprising an image signal processing circuit, each processing circuit substrate having a size corresponding to the size of the sensor circuit substrate, the image signal processing circuit being configured to process a signal generated by the image sensor to generate an image data stream at an output on one of the processing circuit substrates, the image data stream being configured to be transmitted to a host system; as well as wherein the sensor circuit substrate and the plurality of processing circuit substrates are connected via a flexible interconnect configured to carry signals between image signal processing circuits on each of the processing circuit substrates, the flexible interconnect facilitating folding of the processing circuit substrates in a back-to-back configuration with each successive processing circuit substrate stacked axially behind a previous processing circuit substrate within the bore of the tubular housing, wherein the processing circuit substrate in the stereoscopic imaging device is arranged such that the image data signal generated by the first image sensor is not routed through the same processing circuit substrate that performs signal processing from the second image sensor, and the image data signal generated by the second image sensor is not routed through the same processing circuit substrate that performs signal processing from the first image sensor, The flexible interconnect comprises a first flexible interconnect and a second flexible interconnect, wherein the first flexible interconnect extends from a lower edge of the sensor circuit substrate and image data received from the first image sensor is transmitted to one of the plurality of processing circuit substrates via the first flexible interconnect for processing, and the second flexible interconnect extends from an upper edge of the sensor circuit substrate and image data received from the second image sensor is transmitted to one of the plurality of processing circuit substrates via the second flexible interconnect for processing.

2. The device according to claim 1, wherein: The sensor circuit substrate and a plurality of processing circuit substrates are connected end-to-end via the flexible interconnects to facilitate folding the processing circuit substrates in a back-to-back z-fold configuration.

3. The device according to claim 1, wherein: Each of the image sensors includes imaging optics disposed in front of a respective facet of each of the image sensors and configured to capture light from the object field to form an image on the respective image sensor.

4. The device according to claim 3, wherein: The sensor circuit substrate is mounted within the bore of the tubular housing at an angle such that the faces of the image sensor are oriented at an angle to a longitudinal axis of the bore to capture light from an off-axis object field.

5. The device according to claim 3, wherein: The sensor circuit substrate is pivotally mounted within the aperture of the tubular housing to allow the faces of the image sensor to be oriented at an angle to a longitudinal axis of the aperture to capture light from an off-axis object field.

6. The apparatus of claim 5, further comprising an actuator disposed within the aperture and configured to cause pivotal movement of the sensor circuit substrate within a range of angles relative to the longitudinal axis.

7. The device according to claim 6, wherein: The angular range includes angles between 0° and 30° relative to the longitudinal axis.

8. The device according to claim 7, wherein: The actuator includes one of a linear piezoelectric actuator, a rotary piezoelectric motor, or a control linkage.

9. The device according to claim 3, wherein: The sensor circuit substrate is mounted within the aperture so that the faces of the image sensor are oriented perpendicular to the longitudinal axis of the aperture, and wherein the device further comprises at least one beam steering element responsive to a control signal, the beam steering element being configured to cause a change in an optical property to allow selectively changing the angle of the object field relative to the longitudinal axis.

10. The device according to claim 3, wherein: The sensor circuit substrate is mounted within the aperture such that the faces of the image sensor are oriented perpendicular to a longitudinal axis of the aperture, and wherein the device further comprises at least one prism disposed at an end of the aperture, the at least one prism being configured to capture light from an object field oriented at an angle to the longitudinal axis and direct the light onto the faces of the image sensor.

11. The device according to claim 1, wherein: The image signal processing circuit is configured to generate a single data stream representing an image captured by each of the image sensors, and wherein the output comprises a single coaxial connector disposed on one of the plurality of processing circuit substrates that is distal relative to the sensor circuit substrates.

12. The device according to claim 1, wherein: The image signal processing circuit is configured to process the image signal from each of the image sensors, respectively, to generate a first data stream and a second data stream, each data stream representing an image captured by one of the image sensors, and wherein the output comprises a first coaxial connector and a second coaxial connector, the first coaxial connector and the second coaxial connector being disposed on one of the plurality of processing circuit substrates that is distally located relative to the sensor circuit substrate.

13. The apparatus according to claim 1, wherein: The tubular housing is attached to a distal end of an elongated sheath including a bore extending through the sheath, and wherein the output is connected to a cable extending along the bore of the elongated sheath to connect to the host system.

14. The device according to claim 13, wherein: The elongated sheath includes a flexible articulated portion that facilitates movement of the tubular housing within the confined space when actuated by the host system.

15. The apparatus of claim 14, further comprising a plurality of optical fibers extending through the bore of the elongated sheath and the bore of the tubular housing and terminating at an end of the tubular housing, the plurality of optical fibers being configured to direct light from a distally located light source to illuminate the object field.

16. The device according to claim 15, wherein: The sensor circuit substrate and the processing circuit substrate are sized to occupy a central portion of the aperture, and wherein the plurality of optical fibers are routed through a peripheral portion of the aperture relative to the sensor circuit substrate and the processing circuit substrate.

17. The apparatus according to claim 1, wherein: The tubular housing includes a circular cross-section.

18. The apparatus according to claim 17, wherein: The bore of the tubular housing has a diameter of 10 mm.

19. The apparatus according to claim 1, wherein: The image signal processing circuitry includes circuitry configured to provide image processing functionality for conditioning the image signals generated by the respective image sensors and circuitry configured to convert the conditioned image signals into a data stream suitable for transmission to the host system.

20. A robotic surgical system comprising the apparatus according to claim 1, wherein: The tubular housing is configured to be inserted into a body cavity of a patient.

21. A stereoscopic imaging device, comprising: a tubular housing configured to be inserted into a confined space, the tubular housing including a bore extending through the housing, at least a portion of the tubular housing being bendable; a first image sensor and a second image sensor, the first image sensor and the second image sensor being adjacently mounted on a common sensor circuit substrate sized to be received within the aperture, each image sensor comprising a plurality of photosensitive elements on a face, the plurality of photosensitive elements being oriented to capture respective images of an object field from different perspective viewpoints to generate image data including three-dimensional (3D) information; a plurality of processing circuit substrates, each comprising an image signal processing circuit, each of the processing circuit substrates having a size corresponding to the size of the sensor circuit substrate, the image signal processing circuit being configured to process a signal generated by the image sensor to generate an image data stream at an output on one of the processing circuit substrates for transmission to a host system; as well as wherein the sensor circuit substrate and the plurality of processing circuit substrates are connected via a flexible interconnect configured to carry signals between image signal processing circuits on each of the processing circuit substrates, the flexible interconnect facilitating bending of the processing circuit substrate within the aperture of the tubular housing, wherein the processing circuit substrate in the stereoscopic imaging device is arranged such that the image data signal generated by the first image sensor is not routed through the same processing circuit substrate that performs signal processing from the second image sensor, and the image data signal generated by the second image sensor is not routed through the same processing circuit substrate that performs signal processing from the first image sensor, The flexible interconnect comprises a first flexible interconnect and a second flexible interconnect, wherein the first flexible interconnect extends from a lower edge of the sensor circuit substrate and image data received from the first image sensor is transmitted to one of the plurality of processing circuit substrates via the first flexible interconnect for processing, and the second flexible interconnect extends from an upper edge of the sensor circuit substrate and image data received from the second image sensor is transmitted to one of the plurality of processing circuit substrates via the second flexible interconnect for processing.

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