A packaging device and method for a coaxial laser emitter

Abstract

The present invention relates to the field of optical fiber communication technology, and particularly to a packaging device and a packaging method for a coaxial laser emitter. The packaging device includes a header, a heat sink, and a laser emitter, and the heat sink and the laser emitter are disposed on the header; a gold layer is provided on the heat sink, and the gold layer includes a first gold plating layer, a second gold plating layer, and a third gold plating layer that are all mounted on the heat sink. The second gold plating layer is disposed between the first gold plating layer and the third gold plating layer, and the laser emitter is disposed on the second gold plating layer. A pin assembly is disposed through the header, and the pin assembly includes a positive pin and a negative pin. The first gold plating layer is connected to the positive pin, and the positive electrode of the laser emitter is connected to the first gold plating layer through a first gold wire group. The second gold plating layer is connected to the third gold plating layer through a second gold wire group, and the third gold plating layer is connected to the negative pin. The present application can achieve the definition of two circuit directions of the laser emitter.

Description

Technical Field

[0001] The present invention relates to the technical field of optical fiber communication, and particularly relates to a packaging device and a packaging method for a coaxial laser emitter. Background Art

[0002] With the rapid development of optical fiber communication technology, especially the rapid development of high-speed local area networks, fiber optic access networks, and cable television systems, the application of optical devices such as optical emission devices in optical fiber systems is also more extensive. Optical communication devices are the basis for constructing optical communication systems and networks. With the continuous warming of market demand, the investment in the optical device module industry has been continuously expanding, and products have been continuously upgraded, playing a crucial role in promoting the advancement of informatization.

[0003] In the process of replacement, the structure of optical communication devices is developing towards the trend of increasingly fine processes, more flexible functionality, higher speeds, and lower losses. The coaxial laser emission TO-CAN device, as one of the main packaging forms of optical communication devices within the mainstream 25G rate, has become the mainstream in the optical device market due to the advantages of coaxial devices such as easy manufacturing, cost advantages, good airtightness, and stable reliability.

[0004] However, the laser circuit in the current coaxial laser emission TO-CAN structure device has a single direction and is not flexible enough to meet the diverse needs of customers. Summary of the Invention

[0005] In view of the above technical problems, the present application provides a packaging device and a packaging method for a coaxial laser emitter, defining the feasibility of two circuit directions of the laser emitter to meet the diverse needs of customers.

[0006] A packaging device for a coaxial laser emitter includes a header, a heat sink, and a laser emitter, and the heat sink and the laser emitter are disposed on the header;

[0007] A gold layer is disposed on the heat sink, and the gold layer includes a first gold plating layer, a second gold plating layer, and a third gold plating layer that are all mounted on the heat sink. The second gold plating layer is disposed between the first gold plating layer and the third gold plating layer, and the laser emitter is disposed on the second gold plating layer;

[0008] A pin assembly is disposed through the header, and the pin assembly includes a positive pin and a negative pin. The first gold plating layer is connected to the positive pin, the positive electrode of the laser emitter is connected to the first gold plating layer through the first gold wire group, the second gold plating layer is connected to the third gold plating layer through the second gold wire group, and the third gold plating layer is connected to the negative pin.

[0009] Preferably, it further includes two third gold wire groups. One of the third gold wire groups 603 is used to connect between the first gold plating layer and the positive diode pin, and the other third gold wire group is used to connect between the third gold plating layer and the negative diode pin. Each third gold wire group includes four gold wires.

[0010] Preferably, the first gold wire group includes one gold wire, and the second gold wire group includes three gold wires.

[0011] Preferably, a gold ball is provided at the welding point of one of the gold wires in the second gold wire group and the second gold plating layer.

[0012] Preferably, a monitoring detector is further provided on the base. The monitoring detector is arranged in the backlight direction of the laser emitter.

[0013] Preferably, the pin assembly further includes a detector pin, and the detector pin is connected to the monitoring detector.

[0014] Preferably, it further includes a tube cap. The tube cap is covered on the base to form a sealed space for accommodating the components installed on the base;

[0015] The heat sink, the laser emitter and the monitoring detector are accommodated in the sealed space.

[0016] Preferably, a tube tongue is further provided on the base. The heat sink and the laser emitter are mounted on the side of the tube tongue close to the central axis of the base.

[0017] Preferably, it further includes a semiconductor refrigerator. The semiconductor refrigerator is mounted between the tube tongue and the heat sink.

[0018] A packaging method for a coaxial laser emitter includes the following steps:

[0019] S1: Paste the detector gasket on the base with die bonding silver glue. After pasting, put it into an electrothermal blast drying oven and bake it at a preset temperature for a preset first time;

[0020] S2: Paste the monitoring detector on the detector gasket with die bonding silver glue. After pasting, put it into an electrothermal blast drying oven and bake it at a preset temperature for a preset second time;

[0021] S3: Paste the laser emitter and the heat sink on the tube tongue by means of eutectic gold-tin soldering;

[0022] S4: Connect the positive electrode of the laser emitter to the first gold plating layer with the first gold wire group, connect the second gold plating layer to the third gold plating layer with the second gold wire group, connect the first gold plating layer to the positive pin with the third gold wire group, connect the third gold plating layer to the negative pin with the third gold wire group, connect the first gold plating layer to the positive pin, and connect the third gold plating layer to the negative pin;

[0023] S5: Put the tube cap into an electrothermal blast drying oven for high-temperature baking, and then weld the tube cap to the tube base through a resistance sealing and soldering process.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The encapsulation device of the coaxial laser emitter provided by the present invention includes a tube base, a heat sink and a laser emitter arranged on the tube base. The positions of the left and right pins are fixed, and the left and right pins can be defined as the positive electrode or the negative electrode, that is, the positive pin and the negative pin. A gold layer is arranged on the heat sink, and the gold layer is divided into three pieces. The laser emitter is adjusted to be arranged on the middle second gold plating layer. The first gold plating layer is connected to the positive pin, and the third gold plating layer is connected to the negative pin. After changing the positive and negative polarities of the left and right pins, only the positions of the first gold wire group on the laser emitter and the second gold wire group on the second gold plating layer need to be adjusted so that the positive electrode of the laser emitter is connected to the first gold plating layer through the first gold wire group, and the second gold plating layer is connected to the third gold plating layer through the second gold wire group. When the laser emitter is powered and operates normally, two circuit directions of the laser emitter can be defined. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 It is the first structural schematic diagram of the encapsulation device of the coaxial laser emitter provided by the embodiment of the present invention;

[0028] Figure 2 It is the second structural schematic diagram of the encapsulation device of the coaxial laser emitter provided by the embodiment of the present invention;

[0029] Figure 3 It is the overall external schematic diagram of the encapsulation device of the coaxial laser emitter provided by the embodiment of the present invention.

[0030] Illustration: Tube base 1, heat sink 2, laser emitter 3, monitoring detector 4, detector gasket 5, gold wire 6, tube cap 7;

[0031] The first pin 101, the second pin 102, the tongue 103, and the detector pin 104;

[0032] The gold layer 201, the first gold plating layer 2011, the second gold plating layer 2012, and the third gold plating layer 2013;

[0033] The first gold wire group 601, the second gold wire group 602, and the third gold wire group 603. Detailed implementation manners

[0034] To make the objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] In the description of the present invention, it should be understood that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component.

[0036] In addition, the terms "long", "short", "inner", "outer", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have this specific orientation or be constructed and operated in this specific orientation, and thus should not be construed as a limitation of the present invention.

[0037] The technical solutions of the present invention will be further described below with reference to the accompanying drawings and through specific implementation manners.

[0038] Embodiment 1

[0039] Please refer to Figures 1 to 3 , this embodiment discloses a packaging device for a coaxial laser emitter. The packaging device includes a header 1, a heat sink 2, and a laser emitter 3. The heat sink 2 and the laser emitter 3 are disposed on the header 1;

[0040] A gold layer 201 is provided on the heat sink 2. The gold layer 201 includes a first gold plating layer 2011, a second gold plating layer 2012, and a third gold plating layer 2013. The first gold plating layer 2011, the second gold plating layer 2012, and the third gold plating layer 2013 are on the same plane and are all provided on the heat sink 2. The second gold plating layer 2012 is provided between the first gold plating layer 2011 and the third gold plating layer 2013. The laser emitter 3 is provided on the second gold plating layer 2012;

[0041] A pin assembly is penetrated through the header 1. The pin assembly includes a positive pin and a negative pin. The gold wire 6 includes a first gold wire group 601, a second gold wire group 602, and a third gold wire group 603. The first gold plating layer 2011 is connected to the positive pin. The positive electrode of the laser emitter 3 is connected to the first gold plating layer 2011 through the first gold wire group 601. The second gold plating layer 2012 is connected to the third gold plating layer 2013 through the second gold wire group 602. The third gold plating layer 2013 is connected to the negative pin.

[0042] Specifically, there are two implementation cases in this application.

[0043] The first case: The first pin 101 is connected to the positive electrode, that is, the first pin 101 is the positive pin, and the second pin 102 is connected to the negative electrode, that is, the second pin 102 is the negative pin;

[0044] The current flows from the first pin 101 to the first gold plating layer 2011, and then successively flows to the positive electrode of the laser emitter 3 -> the negative electrode of the laser emitter 3 -> the second gold plating layer 2012 -> the third gold plating layer 2013, and finally returns to the second pin 102 to form a path circuit, so that the laser emitter 3 is powered and operates normally.

[0045] The second case: The second pin 102 is connected to the positive electrode, that is, the second pin 102 is the positive pin, and the first pin 101 is connected to the negative electrode, that is, the first pin 101 is the negative pin;

[0046] The current flows from the second pin 102 to the third gold plating layer 2013, and then successively flows to the positive electrode of the laser emitter 3 -> the negative electrode of the laser emitter 3 -> the second gold plating layer 2012 -> the first gold plating layer 2011, and finally returns to the first pin 101 to form a path circuit, so that the laser emitter 3 is powered and operates normally.

[0047] It should be noted that the materials of the first gold plating layer 2011, the second gold plating layer 2012, and the third gold plating layer 2013 are the same and belong to the same component. The gold layer 201 is divided into a three-piece type. The first, second, and third are only for facilitating the description of this solution.

[0048] The positions of the first pin 101 and the second pin 102 are fixed. A gold layer 201 is provided on the heat sink 2. The gold layer 201 is divided into three parts. The laser emitter 3 is arranged on the middle second gold plating layer 2012. The first gold plating layer 2011 is connected to the positive pin, and the third gold plating layer 2013 is connected to the negative pin. After changing the positive and negative polarities of the first pin 101 and the second pin 102, only the positions of the first gold wire group 601 on the laser emitter 3 and the second gold wire group 602 on the second gold plating layer 2012 need to be adjusted, so that the positive electrode of the laser emitter 3 is connected to the first gold plating layer 2011 through the first gold wire group 601, and the second gold plating layer 2012 is connected to the third gold plating layer 2013 through the second gold wire group 602, then the feasibility of defining two circuit directions can be achieved.

[0049] The first pin 101 and the second pin 102 are multi-polar, making the packaging device of the coaxial laser emitter have higher compatibility in the fiber optic transmission system and meeting the customer's requirements for the polarity of the pins. In addition, the structure is simple and practical, ensuring the transmission efficiency of the electrical signal and not increasing the device cost.

[0050] In this embodiment, there are also two third gold wire groups 603. One of the third gold wire groups 603 is used to connect the first gold plating layer 2011 and the positive pin, and the other third gold wire group 603 is used to connect the third gold plating layer 2013 and the negative pin. The third gold wire groups 603 on both sides are designed with symmetrical wire arrangement, ensuring the transmission efficiency of the electrical signal. In this application, the third gold wire group 603 includes four gold wires.

[0051] In an alternative embodiment, an incoming wire position is set at the positive end of the laser emitter 3. The first gold wire group 601 includes one gold wire. The second gold wire group 602 includes three gold wires to ensure the transmission efficiency of the electrical signal.

[0052] In an alternative embodiment, a gold ball is provided at the welding point of one of the gold wires of the second gold wire group 602 and the second gold plating layer 2012. The gold ball can prevent the welding point from falling off, and the other gold wires are directly welded to connect the gold layers. The gold wires in the first gold wire group 601 do not have gold balls and are directly welded, thereby reducing the high-frequency impedance and increasing the transmission efficiency, and further improving the performance of the heat sink 2 and the laser 3.

[0053] A monitoring detector 4 is also provided on the base 1, and the monitoring detector 4 is arranged in the backlight direction of the laser emitter 3. When the laser emitter 3 is powered on and emits light forward, due to the scattering of light, a part of the light will be scattered to the backlight side. The photosensitive surface of the monitoring detector 4 will receive these optical signals, convert them into electrical signals and transmit these electrical signals to the control terminal. The control terminal can thus control the magnitude of the current applied to the laser emitter 3 according to the detection result of the monitoring detector 4. In addition, the control terminal can judge whether the laser emitter 3 is in a normal state according to the electrical signal transmitted by the monitoring detector 4, so as to ensure the transmission effect of the optical signal.

[0054] In an alternative embodiment, the pin assembly further includes a detector pin 104, and the detector pin 104 is connected to the monitoring detector 4 to export the electrical signal converted by the monitoring detector 4 to the control terminal. In the present application, a detector gasket 5 is further provided between the contact surface of the monitoring detector 4 and the base 1.

[0055] In the present application, the encapsulation device further includes a tube cap 7. The tube cap 7 is covered on the base 1 and forms a sealed space for accommodating the components mounted on the base 1. The heat sink 2, the laser emitter 3 and the monitoring detector 4 are accommodated in the sealed space. The tube cap 7 includes a lens, and the lens is used for transmitting the signal light emitted by the laser emitter 3.

[0056] In an alternative embodiment, a tube tongue 103 is further provided on the base 1. A silver paste is applied at a good position on the side of the tube tongue 103 close to the central axis of the base 1, and the heat sink 2 and the laser emitter 3 are mounted on the side where the silver paste has been applied.

[0057] In an alternative embodiment, the encapsulation device further includes a thermoelectric cooler, and the thermoelectric cooler 2 serves as a cooling and heat dissipation component of the encapsulation device. The thermoelectric cooler is mounted between the tube tongue 103 and the heat sink 2.

[0058] In summary, the encapsulation device of the coaxial laser emitter in this embodiment includes a heat sink 2, and a gold layer 201 is provided on the heat sink 2. The gold layer 201 is divided into three pieces. The laser emitter 3 is arranged on the middle second gold-plated layer 2012. By changing the positive and negative poles of the first pin 101 and the second pin 102, only the positions of the first gold wire group 601 and the second gold wire group 602 need to be adjusted, so that the positive pole of the laser emitter 3 is connected to the first gold-plated layer 2011 through the first gold wire group 601, and the second gold-plated layer 2012 is connected to the third gold-plated layer 2013 through the second gold wire group 602, thereby realizing the feasibility of defining two circuit flow directions of the laser emitter 3. The device design of this embodiment makes the laser emitter 3 have higher compatibility in the fiber optic transmission system.

[0059] Embodiment Two

[0060] For the encapsulation device of the coaxial laser emitter in Embodiment 1, Embodiment 2 provides a method for encapsulating a coaxial laser emitter, which specifically includes the following steps:

[0061] S1: Paste the detector gasket 5 on the header 1 by die bonding silver glue, and after pasting, put it into an electrothermal blast drying oven and bake it at a preset temperature for a preset first time. Optionally, bake it at a high temperature of 170 °C for 1 hour;

[0062] S2: Paste the monitoring detector 4 on the detector gasket 5 by die bonding silver glue, and after pasting, put it into an electrothermal blast drying oven and bake it at a preset temperature for a preset second time. Optionally, bake it at a high temperature of 170 °C for 1 hour;

[0063] S3: Paste the laser emitter 3 and the heat sink 2 on the header tongue 103 by eutectic gold-tin soldering;

[0064] S4: Connect the positive electrode of the laser emitter 3 to the first gold plating layer 2011 with the first gold wire group 601, connect the second gold plating layer 2012 to the third gold plating layer 2013 with the second gold wire group 602, connect the first gold plating layer 2011 to the positive pin with the third gold wire group 603, connect the third gold plating layer 2013 to the negative pin with the third gold wire group 603, connect the first gold plating layer 2011 to the positive pin, and connect the third gold plating layer 2013 to the negative pin;

[0065] S5: Put the tube cap 7 into an electrothermal blast drying oven for high-temperature baking, and then weld the tube cap 7 to the header 1 through a resistance sealing and soldering process. Optionally, bake it at a high temperature of 150 °C for 3 hours.

[0066] The encapsulation of the coaxial laser emitter is completed through steps S1, S2, S3, S4, and S5.

[0067] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the present invention in each embodiment.

Claims

1. A packaging device for a coaxial laser emitter, characterized in that, It includes a header (1), a heat sink (2) and a laser emitter (3), and the heat sink (2) and the laser emitter (3) are arranged on the header (1); A gold layer (201) is arranged on the heat sink (2). The gold layer (201) includes a first gold-plated layer (2011), a second gold-plated layer (2012) and a third gold-plated layer (2013) which are all mounted on the heat sink (2). The second gold-plated layer (2012) is arranged between the first gold-plated layer (2011) and the third gold-plated layer (2013), and the laser emitter (3) is arranged on the second gold-plated layer (2012); A pin assembly is arranged through the header (1). The pin assembly includes a first pin (101) and a second pin (102); When the first pin (101) is a positive pin and the second pin (102) is a negative pin, the first gold-plated layer (2011) is connected to the positive pin. The positive electrode of the laser emitter (3) is connected to the first gold-plated layer (2011) through a first gold wire group (601). The second gold-plated layer (2012) is connected to the third gold-plated layer (2013) through a second gold wire group (602), and the third gold-plated layer (2013) is connected to the negative pin; When the first pin (101) is a negative pin and the second pin (102) is a positive pin, the third gold-plated layer (2013) is connected to the positive pin. The positive electrode of the laser emitter (3) is connected to the third gold-plated layer (2013) through a first gold wire group (601). The second gold-plated layer (2012) is connected to the first gold-plated layer (2011) through a second gold wire group (602), and the first gold-plated layer (2011) is connected to the negative pin.

2. The encapsulation device of the coaxial laser emitter according to claim 1, characterized in that It further includes two third gold wire groups (603). One of the third gold wire groups (603) is used to connect the first gold-plated layer (2011) and the first pin (101), and the other third gold wire group (603) is used to connect the third gold-plated layer (2013) and the second pin (102). The third gold wire group (603) includes four gold wires.

3. The encapsulation device of the coaxial laser emitter according to claim 1, characterized in that, The first gold wire group (601) includes one gold wire, and the second gold wire group (602) includes three gold wires.

4. The encapsulation device of the coaxial laser emitter according to claim 3, characterized in that, A gold ball is provided at the welding point of one of the gold wires of the second gold wire group (602) and the second gold-plated layer (2012).

5. The encapsulation device of the coaxial laser emitter according to claim 1, characterized in that A monitoring detector (4) is further arranged on the header (1), and the monitoring detector (4) is arranged in the backlight direction of the laser emitter (3).

6. The encapsulation device of the coaxial laser emitter according to claim 5, characterized in that, The pin assembly further includes a detector pin (104), and the detector pin (104) is connected to the monitoring detector (4).

7. The encapsulation device of the coaxial laser emitter according to claim 5, characterized in that, It further includes a tube cap (7). The tube cap (7) covers the header (1) to form a sealed space for accommodating the components mounted on the header (1); The heat sink (2), the laser emitter (3) and the monitoring detector (4) are accommodated in the sealed space.

8. The encapsulation device of the coaxial laser emitter according to claim 1, characterized in that, A tube tongue (103) is further provided on the tube socket (1), and the heat sink (2) and the laser emitter (3) are mounted on the side surface of the tube tongue (103) close to the central axis of the tube socket (1).

9. The encapsulation device of the coaxial laser emitter according to claim 1, characterized in that, It further includes a semiconductor refrigerator, and the semiconductor refrigerator is mounted between the tube tongue (103) and the heat sink (2).

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