Wafer bonder

Abstract

The application relates to the technical field of wafer production equipment, and discloses a wafer bonder. The wafer bonder comprises a base, an upper cover, a first carrier and a second carrier, the base is provided with a containing cavity with an open top surface, and the upper cover can close or open the opening of the containing cavity. The first carrier is fixedly arranged in the containing cavity, the first carrier is provided with a first positioning groove matched with a backing sheet, and the groove bottom of the first positioning groove is provided with a relief hole. The second carrier is arranged in the containing cavity in a lifting mode, the second carrier is provided with a second positioning groove matched with a wafer coated with bonding glue, the second positioning groove is concentric with the first positioning groove, the second carrier can drive the wafer to ascend and make the wafer contact the backing sheet, the second carrier can pass through the relief hole, so that the backing sheet abuts against the upper cover and the wafer is bonded with the backing sheet. The wafer bonder provided by the application has the advantages of simple structure, small size, convenient operation and use, and high working reliability, and can guarantee the concentricity between the wafer and the backing sheet.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production equipment, and particularly relates to a wafer bonder. BACKGROUND

[0002] After the front surface of a wafer is processed, the back surface of the wafer needs to be thinned according to process requirements. In the thinning process, in order to avoid affecting the subsequent processing procedure of the wafer or causing damage to the wafer, the wafer is usually bonded to a backing sheet. This method is referred to as wafer bonding.

[0003] In the prior art, a wafer bonder is usually used to bond the wafer and the backing sheet. In order to facilitate the thinning process, the wafer and the backing sheet bonded together should meet the concentricity requirement. The existing wafer bonder usually uses a complex concentric alignment system for alignment, which leads to a complex structure of the device, high cost, and poor work reliability.

[0004] Therefore, there is an urgent need for a new wafer bonder to solve the above technical problems. SUMMARY

[0005] The present application aims to provide a wafer bonder which is simple in structure, small in size, easy to operate, and high in work reliability.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] A wafer bonder comprises:

[0008] a base and an upper cover, the base is provided with a containing cavity with an opening on the top surface, and the upper cover can close or open the opening of the containing cavity;

[0009] a first carrier fixedly arranged in the containing cavity, the first carrier is provided with a first positioning groove matched with a backing sheet to accommodate the backing sheet, and the groove bottom of the first positioning groove is provided with a relief hole;

[0010] a second carrier arranged in the containing cavity in a lifting manner, the second carrier is provided with a second positioning groove matched with a wafer coated with bonding glue to accommodate the wafer, and the second positioning groove is concentric with the first positioning groove, the second carrier can drive the wafer to ascend and make the wafer contact with the backing sheet, and the second carrier can pass through the relief hole to make the backing sheet abut against the upper cover and make the wafer bond with the backing sheet.

[0011] As a preferred scheme of the wafer bonder, the sidewall of the first positioning groove comprises a first flat edge portion and a first arc-shaped portion, the flat edge of the backing sheet can abut against the first flat edge portion, and the arc edge of the backing sheet can abut against the first arc-shaped portion; and / or

[0012] The sidewall of the second positioning groove comprises a second flat edge portion and a second arc-shaped portion, the flat edge of the wafer is capable of abutting against the second flat edge portion, and the arc edge of the wafer is capable of abutting against the second arc-shaped portion.

[0013] As a preferred solution of the wafer bonding machine, the sidewall of the second positioning groove is a slope, and the second positioning groove is open.

[0014] As a preferred solution of the wafer bonding machine, a heating plate is arranged in the second carrier to heat the wafer.

[0015] As a preferred solution of the wafer bonding machine, a first driver is fixedly arranged in the accommodating cavity, and a driving end of the first driver is connected with the second carrier to drive the second carrier to lift.

[0016] As a preferred solution of the wafer bonding machine, the accommodating cavity comprises an upper accommodating cavity and a lower accommodating cavity which are connected in communication, the upper cover is capable of closing or opening an opening of the upper accommodating cavity, the first carrier is fixedly arranged in the upper accommodating cavity, the second carrier is arranged in the upper accommodating cavity in a liftable manner, and the first driver is fixedly arranged in the lower accommodating cavity.

[0017] As a preferred solution of the wafer bonding machine, the base comprises an upper base and a lower base, the upper base is detachably stacked on the lower base, the upper accommodating cavity is arranged on the upper base, and the lower accommodating cavity is arranged on the lower base.

[0018] As a preferred solution of the wafer bonding machine, a first supporting column is further arranged, a bottom end of the first supporting column is connected with the upper base, and the first carrier is arranged at a top end of the first supporting column; and / or

[0019] The wafer bonding machine further comprises a second supporting column, a bottom end of the second supporting column is connected with a driving end of the first driver, the second supporting column is slidably arranged through the upper base, and the second carrier is arranged at a top end of the second supporting column.

[0020] As a preferred solution of the wafer bonding machine, a second driver is further arranged, the second driver is fixedly arranged on the base, and a driving end of the second driver is connected with the upper cover to drive the upper cover to lift.

[0021] As a preferred solution of the wafer bonding machine, a guide column is further arranged, an upper end of the guide column is fixedly connected with the upper cover, a guide groove is arranged on the base, and the guide column is slidably arranged in the guide groove.

[0022] As a preferred scheme of the wafer bonding machine, the upper cover is provided with a cooling liquid inlet and a cooling liquid outlet, and the inside of the upper cover is provided with a cooling channel, and the cooling liquid can flow into the cooling channel from the cooling liquid inlet and then flow out from the cooling liquid outlet.

[0023] As a preferred scheme of the wafer bonding machine, the upper cover is provided with an adhesive table, and the backing sheet can abut against the adhesive table.

[0024] As a preferred scheme of the wafer bonding machine, a vacuum pump is further included, and the vacuum pump is communicated with the accommodating cavity through a vacuum pipe to vacuumize the accommodating cavity.

[0025] The wafer bonding machine provided by the present application has the following beneficial effects:

[0026] The wafer bonding machine provided by the present application can place the backing sheet in the first positioning groove of the first loading table and place the wafer coated with bonding glue in the second positioning groove of the second loading table. Since the first positioning groove and the second positioning groove are concentric, the wafer and the backing sheet can be concentrically aligned. The wafer can be brought into contact with the backing sheet by driving the wafer to rise by the second loading table. The wafer and the backing sheet can be driven to rise together by continuously driving the wafer to rise by the second loading table, so that the backing sheet abuts against the upper cover. The wafer and the backing sheet can be bonded under the abutting pressure of the upper cover. The wafer bonding machine provided by the present application has the advantages of simple structure, small size, convenient operation and use, and high working reliability, and can ensure the concentricity between the wafer and the backing sheet. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of the contents of the embodiments of the present application and the drawings.

[0028] Figure 1 is a structural schematic view of the wafer bonding machine provided by the present application at a first angle;

[0029] Figure 2 is a structural schematic view of the first loading table in the wafer bonding machine provided by the present application;

[0030] Figure 3 is an assembly relationship schematic view of the second loading table and the first driver in the wafer bonding machine provided by the present application;

[0031] Figure 4 is a structural schematic view of the wafer bonding machine provided by the present application without the upper cover;

[0032] Figure 5 is a structure diagram of the inside of a lower base in a wafer bonding machine provided by an embodiment of the present application;

[0033] Figure 6 is a structure diagram of the wafer bonding machine at a second angle provided by an embodiment of the present application;

[0034] Figure 7 is a structure diagram of an upper base in a wafer bonding machine provided by an embodiment of the present application;

[0035] Figure 8 is a structure diagram of an upper cover in a wafer bonding machine provided by an embodiment of the present application.

[0036] In the figure:

[0037] 1-base; 11-upper base; 111-upper accommodating cavity; 12-lower base; 121-lower accommodating cavity; 13-guiding groove;

[0038] 2-upper cover; 21-cooling liquid inlet; 22-cooling liquid outlet; 23-adhesion table;

[0039] 3-first carrier; 31-first positioning groove; 311-first flat edge part; 312-first arc-shaped part; 32-avoidance hole;

[0040] 4-second carrier; 41-first positioning groove; 411-second flat edge part; 412-second arc-shaped part;

[0041] 5-first driver;

[0042] 61-first supporting column; 62-second supporting column;

[0043] 7-second driver;

[0044] 8-guiding column;

[0045] 91-vacuum pump; 92-vacuum pipe;

[0046] 10-electric control box. DETAILED DESCRIPTION

[0047] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects reached more clear, the technical solutions of the embodiments of the present application will be further described in detail below with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0048] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for descriptive purposes and are used to distinguish different structures or components, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0049] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or it can be detachable connection; it can be mechanical connection, or it can be electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] As shown in Figures 1-3 The present embodiment provides a wafer bonding machine, which comprises a base 1, an upper cover 2, a first carrier 3 and a second carrier 4. The base 1 is provided with a containing cavity with a top opening, and the upper cover 2 can close or open the opening of the containing cavity. The first carrier 3 is fixedly arranged in the containing cavity, and the first carrier 3 is provided with a first positioning groove 31 matched with a liner to accommodate the liner. The bottom of the first positioning groove 31 is provided with a relief hole 32. The second carrier 4 is arranged in the containing cavity in a lifting manner, and the second carrier 4 is provided with a second positioning groove 41 matched with a wafer coated with bonding glue to accommodate the wafer. The second positioning groove 41 is concentric with the first positioning groove 31. The second carrier 4 can drive the wafer to rise and make the wafer contact with the liner. The second carrier 4 can pass through the relief hole 32, so that the liner abuts against the upper cover 2 and the wafer is bonded with the liner.

[0051] The wafer bonding machine provided by the present embodiment can place the liner in the first positioning groove 31 of the first carrier 3 and place the wafer coated with bonding glue in the second positioning groove 41 of the second carrier 4. Since the first positioning groove 31 is concentric with the second positioning groove 41, the wafer and the liner can be concentrically aligned. The wafer can be brought into contact with the liner by driving the wafer to rise by the second carrier 4. The wafer and the liner can be driven to rise together by continuing to rise by the second carrier 4, so that the liner abuts against the upper cover 2. The wafer is bonded with the liner under the abutting pressure of the upper cover 2. The wafer bonding machine provided by the present embodiment has simple structure, small size, is convenient to operate and use, and can ensure the concentricity between the wafer and the liner, and has high working reliability.

[0052] Preferably, as shown in the embodiment, the sidewall of the first positioning groove 31 comprises a first flat edge part 311 and a first arc-shaped part 312, the flat edge of the pad can abut against the first flat edge part 311, and the arc edge of the pad can abut against the first arc-shaped part 312. Through the cooperation of the first flat edge part 311 and the first arc-shaped part 312, the position accuracy of the pad in the first positioning groove 31 can be ensured. Figure 2

[0053] Preferably, as shown in the embodiment, the sidewall of the second positioning groove 41 comprises a second flat edge part 411 and a second arc-shaped part 412, the flat edge of the wafer can abut against the second flat edge part 411, and the arc edge of the wafer can abut against the second arc-shaped part 412. Through the cooperation of the second flat edge part 411 and the second arc-shaped part 412, the position accuracy of the wafer in the second positioning groove 41 can be ensured. Figure 3

[0054] Preferably, in the embodiment, the sidewall of the second positioning groove 41 is a slope, and the second positioning groove 41 is in an open state. The slope can play a guiding role, so that the wafer slides along the slope into the second positioning groove 41 and fits with the groove bottom of the second positioning groove 41.

[0055] Preferably, the second carrier 4 provided in the embodiment is provided with a heating plate to heat the wafer. By providing the heating plate, the wafer can be heated, so that the wafer and the pad can be better bonded, and the bonding quality can be ensured.

[0056] Specifically, as shown in the embodiment, the wafer bonding machine provided in the embodiment further comprises a first driver 5, the first driver 5 is fixedly arranged in the accommodating cavity, and a driving end of the first driver 5 is connected with the second carrier 4 to drive the second carrier 4 to ascend and descend. That is, the first driver 5 is used to realize the ascending and descending of the second carrier 4. Specifically, in the embodiment, the first driver 5 is a pneumatic cylinder. Figure 3 Preferably, as shown in the embodiment, the accommodating cavity comprises an upper accommodating cavity 111 and a lower accommodating cavity 121 which are connected in communication, the upper cover 2 can close or open the opening of the upper accommodating cavity 111, the first carrier 3 is fixedly arranged in the upper accommodating cavity 111, the second carrier 4 is arranged in the upper accommodating cavity 111 in a liftable manner, and the first driver 5 is fixedly arranged in the lower accommodating cavity 121. Dividing the accommodating cavity into the upper accommodating cavity 111 and the lower accommodating cavity 121 two chambers is more conducive to ensuring the cleanliness of the upper accommodating cavity 111 and the wafer in the upper accommodating cavity 111.

[0057] Figure 4 Figure 5 Specifically, as shown in the embodiment, the accommodating cavity comprises an upper accommodating cavity 111 and a lower accommodating cavity 121 which are connected in communication, the upper cover 2 can close or open the opening of the upper accommodating cavity 111, the first carrier 3 is fixedly arranged in the upper accommodating cavity 111, the second carrier 4 is arranged in the upper accommodating cavity 111 in a liftable manner, and the first driver 5 is fixedly arranged in the lower accommodating cavity 121. Dividing the accommodating cavity into the upper accommodating cavity 111 and the lower accommodating cavity 121 two chambers is more conducive to ensuring the cleanliness of the upper accommodating cavity 111 and the wafer in the upper accommodating cavity 111.

[0058] Specifically, as shown in the embodiment, the accommodating cavity comprises an upper accommodating cavity 111 and a lower accommodating cavity 121 which are connected in communication, the upper cover 2 can close or open the opening of the upper accommodating cavity 111, the first carrier 3 is fixedly arranged in the upper accommodating cavity 111, the second carrier 4 is arranged in the upper accommodating cavity 111 in a liftable manner, and the first driver 5 is fixedly arranged in the lower accommodating cavity 121. Dividing the accommodating cavity into the upper accommodating cavity 111 and the lower accommodating cavity 121 two chambers is more conducive to ensuring the cleanliness of the upper accommodating cavity 111 and the wafer in the upper accommodating cavity 111. Figure 4 Figure 5 ​​​​​As shown, the base 1 provided by the embodiment includes an upper base 11 and a lower base 12, the upper base 11 is detachably stacked on the lower base 12, an upper accommodating cavity 111 is arranged on the upper base 11, and a lower accommodating cavity 121 is arranged on the lower base 12. The detachable arrangement of the upper base 11 can facilitate the installation of the first driver 5, so that the first driver 5 can be conveniently installed in the lower accommodating cavity 121. Specifically, in the embodiment, the height of the upper base 11 is less than the height of the lower base 12.

[0059] Preferably, as Figure 2 In combination Figure 4 As shown, the wafer bonding machine provided by the embodiment further includes a first support column 61, the bottom end of the first support column 61 is connected with the upper base 11, and the first carrier 3 is arranged at the top end of the first support column 61. That is, the first carrier 3 is installed in the upper accommodating cavity 111 of the upper base 11 through the first support column 61. Further, the number of the first support column 61 is multiple, and the multiple first support columns 61 are uniformly distributed along the circumference of the first carrier 3. Through the cooperation of the multiple first support columns 61, the stability of the first carrier 3 is facilitated to be ensured.

[0060] Preferably, as Figures 3-5 As shown, the wafer bonding machine provided by the embodiment further includes a second support column 62, the bottom end of the second support column 62 is connected with the driving end of the first driver 5, the second support column 62 slidably penetrates through the upper base 11, and the second carrier 4 is arranged at the top end of the second support column 62. The first driver 5 can drive the second support column 62 to ascend and descend, and make the second support column 62 drive the second carrier 4 to ascend and descend.

[0061] Preferably, as Figure 6 As shown, the wafer bonding machine provided by the embodiment further includes a second driver 7, the second driver 7 is fixedly arranged on the base 1, and the driving end of the second driver 7 is connected with the upper cover 2 to drive the upper cover 2 to ascend and descend. Through the driving of the second driver 7, the upper cover 2 can be lifted to open the accommodating cavity, so as to facilitate the feeding and discharging; through the driving of the second driver 7, the upper cover 2 can be buckled on the upper base 11, so as to close the accommodating cavity, so as to facilitate the bonding of the wafer and the backing sheet. Specifically, in the embodiment, the second driver 7 is a pneumatic cylinder.

[0062] Preferably, as Figure 6 And Figure 7As shown, the wafer bonding machine provided by the embodiment further comprises a guide column 8, the upper end of the guide column 8 is fixedly connected with the upper cover 2, the base 1 is provided with a guide groove 13, and the guide column 8 is slidably arranged in the guide groove 13. Through the cooperation of the guide column 8 and the guide groove 13, the accuracy of the lifting path of the upper cover 2 and the stability of the lifting are facilitated to be ensured. Specifically, in the embodiment, the guide groove 13 is arranged on the upper base 11 and the lower base 12, and the guide column 8 is slidably arranged in the guide groove 13 on the upper base 11 and the guide groove 13 on the lower base 12. Preferably, the number of the guide column 8 is two, and the two guide columns 8 are respectively located on the two sides of the second driver 7.

[0063] As shown, Figure 6 As shown, the wafer bonding machine provided by the embodiment further comprises a vacuum pump 91 and a vacuum pipe 92, the vacuum pump 91 is communicated with the containing cavity through the vacuum pipe 92, so as to vacuumize the containing cavity. Through the cooperation of the vacuum pump 91 and the vacuum pipe 92, the containing cavity can be vacuumized, so that the bonding process of the wafer and the liner is carried out in a vacuum environment, so as to avoid the generation of air bubbles.

[0064] The wafer bonding machine provided by the embodiment further comprises an electric control box 10, which is arranged on the outer wall of the base 1. Optionally, the electric control box 10 comprises a control module and a control button, so as to control the wafer bonding machine. Optionally, the electric control box 10 further comprises a buzzer, which can prompt the working state of the wafer bonding machine.

[0065] Preferably, in the embodiment, as shown, Figure 8 The upper cover 2 is provided with a cooling liquid inlet 21 and a cooling liquid outlet 22, and the inside of the upper cover 2 is provided with a cooling channel. The cooling liquid can flow into the cooling channel from the cooling liquid inlet 21 and then flow out from the cooling liquid outlet 22. When the wafer and the liner are bonded to form a bonded wafer, the cooling liquid will be introduced into the cooling channel, so that the bonded wafer can be quickly cooled to room temperature.

[0066] Optionally, the upper cover 2 is provided with a bonding table 23, and the liner can abut against the bonding table 23. Under the abutting pressure of the bonding table 23, the liner and the wafer are facilitated to be fully and firmly bonded.

[0067] The working process of the wafer bonding machine provided by the embodiment is as follows:

[0068] (1) The second driver 7 drives the upper cover 2 to rise, and opens the upper containing cavity 111;

[0069] (2) The wafer coated with bonding glue is placed into the second positioning groove 41 on the second loading table 4, and the flat edge of the wafer abuts against the second flat edge part 411, and the arc edge of the wafer abuts against the second arc part 412;

[0070] (3) The first driver 5 drives the second carrier 4 to descend, so that the height of the second carrier 4 is lower than the height of the first carrier 3;

[0071] (4) The liner is placed into the first positioning groove 31 of the first carrier 3, and the flat edge of the liner is abutted against the first flat edge part 311, and the arc edge of the liner is abutted against the first arc part 312;

[0072] (5) The second driver 7 drives the upper cover 2 to descend, so that the upper containing cavity 111 is closed;

[0073] (6) The vacuum pump 91 is started to vacuumize the upper containing cavity 111 and the lower containing cavity 121;

[0074] (7) The heating plate in the second carrier 4 starts to heat, so that the wafer is heated to 150℃;

[0075] (8) The first driver 5 drives the second carrier 4 to ascend until the liner abuts against the bonding platform 23;

[0076] (9) The liner is kept abutting against the bonding platform 23 for five minutes, so that the wafer is bonded with the liner and a bonding sheet is formed;

[0077] (10) The heating plate in the second carrier 4 stops heating;

[0078] (11) The cooling liquid is introduced into the cooling channel of the upper cover 2, so that the bonding sheet is cooled to room temperature;

[0079] (12) The first driver 5 drives the second carrier 4 to descend, so that the bonding sheet falls into the first positioning groove 31 of the first carrier 3;

[0080] (13) The upper containing cavity 111 and the lower containing cavity 121 are broken vacuum;

[0081] (14) The upper cover 2 is opened, and the buzzer prompts that the work is completed.

[0082] Note that the above is only the preferred embodiment of the present application and the technical principle applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A wafer bonder characterized by comprising: The application relates to a substrate bonding device, which comprises a base (1) and an upper cover (2), the base (1) is provided with a containing cavity with an open top surface, the upper cover (2) can close or open the containing cavity; a first carrier (3) is fixedly arranged in the containing cavity, the first carrier (3) is provided with a first positioning groove (31) matched with a substrate to accommodate the substrate, the groove bottom of the first positioning groove (31) is provided with a relief hole (32); a second carrier (4) is arranged in the containing cavity in a lifting mode, the second carrier (4) is provided with a second positioning groove (41) matched with a wafer coated with bonding glue to accommodate the wafer, the second positioning groove (41) is concentric with the first positioning groove (31), the second carrier (4) can drive the wafer to ascend and make the wafer contact with the substrate, the second carrier (4) can pass through the relief hole (32) to make the substrate abut against the upper cover (2) and make the wafer adhere to the substrate; the sidewall of the first positioning groove (31) comprises a first flat edge part (311) and a first arc-shaped part (312), the flat edge of the substrate can abut against the first flat edge part (311), and the arc edge of the substrate can abut against the first arc-shaped part (312); and / or the sidewall of the second positioning groove (41) comprises a second flat edge part (411) and a second arc-shaped part (412), the flat edge of the wafer can abut against the second flat edge part (411), and the arc edge of the wafer can abut against the second arc-shaped part (412). The sidewall of the second positioning groove (41) is a slope, and the second positioning groove (41) is in an open state. A heating plate is arranged in the second carrier (4) to heat the wafer. A first driver (5) is further arranged in the containing cavity in a fixed mode, a driving end of the first driver (5) is connected with the second carrier (4) to drive the second carrier (4) to ascend and descend. The containing cavity comprises an upper containing cavity (111) and a lower containing cavity (121) connected with each other, the upper cover (2) can close or open the opening of the upper containing cavity (111), the first carrier (3) is fixedly arranged in the upper containing cavity (111), the second carrier (4) is arranged in the upper containing cavity (111) in a lifting mode, and the first driver (5) is fixedly arranged in the lower containing cavity (121). The base (1) comprises an upper base (11) and a lower base (12), the upper base (11) is detachably stacked on the lower base (12), the upper containing cavity (111) is arranged on the upper base (11), and the lower containing cavity (121) is arranged on the lower base (12).

2. The wafer bonding machine of claim 1, wherein, A first supporting column (61) is further arranged, a bottom end of the first supporting column (61) is connected with the upper base (11), and the first carrier (3) is arranged at a top end of the first supporting column (61); and / or 3. The wafer bonding machine of claim 1, wherein, ​ 4. The wafer bonding machine of claim 1, wherein, ​ 5. The wafer bonding machine of claim 4, wherein, ​ 6. The wafer bonding machine of claim 5, wherein, ​ 7. The wafer bonding machine of claim 6, wherein, ​ The wafer bonding machine further comprises a second supporting column (62), a bottom end of the second supporting column (62) is connected with a driving end of the first driver (5), the second supporting column (62) is slidably arranged through the upper base (11), and the second carrier (4) is arranged at a top end of the second supporting column (62).

8. The wafer bonding machine according to any one of claims 1 to 7, characterized in that, Further comprising a second driver (7), the second driver (7) is fixedly arranged on the base (1), a driving end of the second driver (7) is connected with the upper cover (2) to drive the upper cover (2) to ascend and descend.

9. The wafer bonding machine of claim 8, wherein, Further comprising a guide column (8), an upper end of the guide column (8) is fixedly connected with the upper cover (2), a guide groove (13) is arranged on the base (1), and the guide column (8) is slidably arranged in the guide groove (13).

10. The wafer bonding machine according to any one of claims 1 to 7, wherein, The upper cover (2) is provided with a cooling liquid inlet (21) and a cooling liquid outlet (22), an inner part of the upper cover (2) is provided with a cooling channel, and cooling liquid can flow into the cooling channel from the cooling liquid inlet (21) and then flow out from the cooling liquid outlet (22).

11. The wafer bonding machine according to any one of claims 1 to 7, wherein The upper cover (2) is provided with an adhesive table (23), and the backing sheet can abut against the adhesive table (23).

12. The wafer bonding machine of any of claims 1-7, wherein, Further comprising a vacuum pump (91) and a vacuum pipe (92), the vacuum pump (91) is communicated with the containing cavity through the vacuum pipe (92) to vacuumize the containing cavity.

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