Tin boiler device and tinning equipment

Abstract

The invention discloses a tin boiler device and tin-plating equipment. The tin boiler device comprises: a box body, which is used to contain liquid tin; a heating mechanism, which is arranged at the bottom of the box body and is used to heat the tin to keep the tin in a liquid state; a liquid supply cavity, which is formed in the box body, and the liquid supply cavity has an overflow edge that can make the liquid tin flow out in a waterfall shape; a pumping mechanism, which is used to supply the liquid tin in the bottom of the box body into the liquid supply cavity so that the liquid tin flows out from the overflow edge to tin the pins of the chip; wherein: a communicating vessel structure is defined in the liquid supply cavity, and a reciprocating curved and extended flow channel is formed in the communicating vessel structure so that the liquid tin passes through the flow channel and flows out from the overflow edge.

Description

Technical Field

[0001] The invention relates to the technical field of chip manufacturing, and in particular to a tin boiler device and tinning equipment. Background Art

[0002] The tinning equipment is used to provide soldering for the pins of the chip. Specifically, a tin boiler is installed on the working platform of the tinning equipment. The tin boiler is used to make liquid tin flow out in a waterfall-like manner so that the pins of the chip located on one side are attached with tin. However, the tin boiler in the prior art has the following defects:

[0003] 1. The liquid tin surges upward, so that the liquid tin cannot flow out evenly from the side of the tin boiler, which leads to the tin not being able to adhere evenly and fully to the pins.

[0004] 2. The residue in the liquid tin can easily adhere to the pins of the chip along with the liquid tin, thereby increasing the defective rate. Summary of the invention

[0005] In view of the above-mentioned technical problems existing in the prior art, an embodiment of the present invention provides a tin boiler device and tinning equipment.

[0006] In order to solve the above technical problems, the technical solution adopted in the embodiments of the present invention is:

[0007] A tin boiler device, comprising:

[0008] A box body, which is used to contain liquid tin;

[0009] A heating mechanism, which is arranged at the bottom of the box body and is used to heat the tin to keep the tin in a liquid state;

[0010] A liquid supply cavity is formed in the box body, and the liquid supply cavity has an overflow edge that enables liquid tin to flow out in a waterfall shape;

[0011] A pumping mechanism is used to supply the liquid tin at the bottom of the box body into the liquid supply cavity so that the liquid tin flows out from the overflow edge to tin the pins of the chip; wherein:

[0012] A communicating vessel structure is defined in the liquid supply cavity, and a flow channel extending and bending back and forth is formed in the communicating vessel structure so that liquid tin passes through the flow channel and flows out from the overflow edge.

[0013] Preferably, the liquid supply chamber is defined by the partition, the first side plate and the second side plate; wherein:

[0014] The partition is horizontally placed above the heating mechanism, the first side plate and the second side plate are vertically arranged, and the liquid supply cavity is located between the first side plate and the second side plate; wherein:

[0015] The upper end of the first side plate forms the overflow edge.

[0016] Preferably, the first side plate has a lower lip portion extending laterally, an upper lip portion is formed above the lower lip portion, and the lower lip portion and the upper lip portion define a liquid outlet, through which the liquid tin flows out.

[0017] Preferably, the upper end of the second side plate is higher than the upper end of the first side plate, the second side plate and the top of the box body define a debris removal opening, and a filter is provided on the outer side of the second side plate.

[0018] Preferably, the liquid supply chamber is provided with a first spoiler and a second spoiler, the first spoiler defines a first bend of the flow channel in the liquid supply chamber, the second spoiler defines a second bend of the flow channel in the liquid supply chamber, the first bend is located above the second bend, and the liquid tin passes through the first bend and the second bend in sequence.

[0019] Preferably, a liquid supply hole is provided on the partition;

[0020] The pumping mechanism comprises:

[0021] An impeller is installed in the embedding groove at the bottom of the partition;

[0022] A guide groove, which is opened at the bottom of the partition and communicates with the embedding groove and the liquid supply hole;

[0023] A power mechanism is used to drive the impeller to rotate so that the liquid tin passes through the guide groove and the liquid supply hole and is supplied into the liquid supply cavity.

[0024] Preferably, the heating mechanism comprises a plurality of heating tubes arranged in parallel.

[0025] Preferably, a liquid replenishing joint is also provided on the top of the box body to compensate the consumed liquid tin for the box body.

[0026] Preferably, an outer cover is further provided outside the box body, a bottom plate is further provided at the bottom of the outer cover, and the edge of the bottom plate has an upward turn-up edge to form a liquid receiving groove.

[0027] The invention also discloses a tin-plating device, characterized in that it comprises the above-mentioned tin boiler device.

[0028] Compared with the prior art, the tin boiler device and tin-plating equipment disclosed in the present invention have the following beneficial effects:

[0029] 1. A communicating vessel structure is constructed by a spoiler in the liquid supply cavity, which is conducive to the liquid level of the liquid tin rising steadily so as to flow out evenly from the liquid outlet.

[0030] 2. The liquid outlet is defined by the upper lip and the lower lip, which makes the flow of liquid tin more balanced in the width direction of the liquid outlet.

[0031] 3. The liquid outlet defined by the upper lip and the lower lip has a certain flow-limiting effect on the liquid tin, so that the liquid tin entering the liquid supply cavity can partially overflow from the impurity removal port at the upper end of the second side plate, thereby allowing the filter to filter out the residue in the liquid tin.

[0032] 4. The impeller and guide groove of the pumping mechanism are formed at the bottom of the partition, thereby greatly reducing the occupied space, and the design is compact and ingenious.

[0033] 5. The edge of the bottom plate has an upward flange to form a liquid receiving groove, which is used to receive splashed or overflowed liquid tin.

[0034] This summary of various implementations or examples of the technology described in this disclosure is not a comprehensive disclosure of the entire scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In the drawings, which are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar parts. The accompanying drawings generally illustrate various embodiments by way of example and not limitation, and together with the specification and claims, are used to illustrate the embodiments of the invention. When appropriate, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Such embodiments are illustrative and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method.

[0036] Figure 1 A schematic diagram of the three-dimensional structure of a tin boiler device provided in an embodiment of the present invention from one viewing angle.

[0037] Figure 2 A schematic diagram of the three-dimensional structure of the tin boiler device provided in an embodiment of the present invention from another perspective.

[0038] Figure 3 A three-dimensional cross-sectional view of a tin boiler device provided by an embodiment of the present invention.

[0039] Figure 4 A schematic diagram of the three-dimensional structure of the tin boiler device provided in an embodiment of the present invention with the outer cover removed.

[0040] Figure 5 This is a schematic diagram of the three-dimensional structure of the tin boiler device provided in an embodiment of the present invention without the box body.

[0041] Reference numerals:

[0042] 10-housing; 20-liquid supply chamber; 21-first side plate; 211-overflow edge; 22-second side plate; 221-impurity removal port; 231-lower lip; 232-upper lip; 24-liquid outlet; 25-filter; 31-first spoiler; 32-second spoiler; 40-partition; 41-liquid supply hole; 50-heating tube; 61-impeller; 62-drive shaft; 63-motor; 70-outer cover; 80-liquid replenishment connector; 90-chassis; 91-liquid receiving tank. DETAILED DESCRIPTION

[0043] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0044] In order to keep the following description of the embodiments of the present invention clear and concise, detailed descriptions of well-known functions and well-known components are omitted.

[0045] The embodiment of the invention discloses a tin boiler device, which is used in a working platform for installing tin-plating equipment.

[0046] like Figures 1 to 5 As shown, the tin boiler device includes: a box body 10, an outer cover 70, a heating mechanism, a bottom plate 90, a partition plate 40, a first side plate 21, a second side plate 22, a first spoiler 31, a second spoiler 32, a filter screen 25 and a pumping mechanism.

[0047] The edge of the bottom plate 90 has an upward flange so that the bottom plate 90 forms a liquid receiving groove 91 . The outer cover 70 is disposed on the bottom plate 90 , and the box body 10 is located inside the outer cover 70 .

[0048] The heating mechanism is disposed at the bottom of the box body 10. Specifically, the heating mechanism includes a plurality of heating tubes 50 arranged in parallel. The heating tubes 50 heat the metal tin so that the metal tin is always in liquid state.

[0049] The partition 40 is disposed in the box body 10 and is located above the heating mechanism. A liquid supply hole 41 is formed on the partition 40 . An embedding groove and a guide groove connecting the embedding groove and the liquid supply hole 41 are formed at the bottom of the partition 40 .

[0050] The pumping mechanism includes: an impeller 61, a transmission shaft 62 and a motor 63; the impeller 61 is arranged in an embedded groove at the bottom of the partition 40, and the motor 63 is located outside the outer cover 70. The motor 63 drives the impeller 61 to rotate through the transmission shaft 62 so that the liquid tin at the bottom of the box body 10 is supplied to the top of the partition 40 through the liquid supply hole 41 under the guidance of the guide groove.

[0051] The first side plate 21 and the second side plate 22 are arranged vertically and spaced apart. A liquid supply cavity 20 is defined between the first side plate 21 and the second side plate 22 . Liquid tin passes through the liquid supply hole 41 and enters the liquid supply cavity 20 .

[0052] The first spoiler 31 and the second spoiler 32 are arranged in the liquid supply chamber 20. Specifically, the first spoiler 31 defines a first bend of the flow channel in the liquid supply chamber 20, and the second spoiler 32 defines a second bend of the flow channel in the liquid supply chamber 20. The first bend is located above the second bend, and the liquid tin passes through the first bend and the second bend in the flow channel in sequence.

[0053] An overflow edge 211 is formed at the upper end of the first side plate 21 , and the liquid tin entering the liquid supply chamber 20 passes through the first curved portion and the overlapping curved portion in sequence and flows out from the overflow edge 211 at the upper end of the first side plate 21 and flows down in a waterfall shape.

[0054] The upper end of the first side plate 21 is expanded to form a lower lip 231 . The upper end of the lower lip 231 is formed with an upper lip 232 . The upper lip 232 and the lower lip 231 together define a liquid outlet 24 . The liquid outlet 24 is oriented to face downward.

[0055] The upper end of the second side plate 22 is higher than the upper end of the first side plate 21, and the upper end of the second side plate 22 and the top of the box body 10 define a de-impurity port 221, and a filter screen 25 is provided on the outer side of the second side plate 22. Under the limitation of the flow cross section of the liquid outlet 24, the liquid level of the liquid tin entering the liquid supply chamber 20 in the flow channel between the first spoiler 31 and the second side plate 22 rises, so that the liquid tin overflows from the de-impurity port 221, and the residue in the liquid tin (with a density lower than that of the liquid tin) floats on the liquid surface and overflows from the liquid supply chamber 20, and the filter screen 25 filters the residue.

[0056] A liquid replenishing joint 80 is also provided on the top of the box body 10 , through which liquid tin is injected into the box body 10 to compensate for the consumed tin.

[0057] The advantages of the tin boiler device provided by the present invention are:

[0058] 1. A communicating vessel structure is constructed by the spoiler in the liquid supply chamber 20 , which is conducive to the liquid level of the liquid tin rising steadily so as to flow out evenly from the liquid outlet 24 .

[0059] 2. The liquid outlet 24 is defined by the upper lip 232 and the lower lip 231 , which makes the flow of liquid tin more balanced in the width direction of the liquid outlet 24 .

[0060] 3. The liquid outlet 24 defined by the upper lip 232 and the lower lip 231 has a certain flow-limiting effect on the liquid tin, so that the liquid tin entering the liquid supply cavity 20 can partially overflow from the impurity removal port 221 at the upper end of the second side plate 22, thereby allowing the filter screen 25 to filter out the residue in the liquid tin.

[0061] 4. The impeller 61 and the guide groove of the pumping mechanism are formed at the bottom of the partition 40, thereby greatly reducing the occupied space, and the design is compact and ingenious.

[0062] 5. The edge of the bottom plate 90 has an upwardly turned edge to form a liquid receiving groove 91, which is used to receive splashed or overflowed liquid tin.

[0063] The invention also discloses a tin-plating device, characterized in that it comprises the above-mentioned tin boiler device.

[0064] In addition, although exemplary embodiments have been described in the present invention, the scope includes any and all embodiments based on the present invention with equivalent elements, modifications, omissions, combinations (e.g., various embodiments intersecting schemes), adaptations or changes. The elements in the claims will be interpreted broadly based on the language adopted in the claims, and are not limited to the examples described in this specification or during the implementation of this application, and their examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0065] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. For example, a person of ordinary skill in the art can use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the present invention. This should not be interpreted as an intention that a disclosed feature that is not required to be protected is necessary for any claim. On the contrary, the subject matter of the present invention may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently used as a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present invention should be determined with reference to the attached claims and the full scope of equivalent forms granted by these claims.

[0066] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A tin boiler device, characterized in that: include: A box body, which is used to contain liquid tin; A heating mechanism, which is arranged at the bottom of the box body and is used to heat the tin to keep the tin in a liquid state; A liquid supply cavity is formed in the box body, and the liquid supply cavity has an overflow edge that enables liquid tin to flow out in a waterfall shape; A pumping mechanism is used to supply the liquid tin at the bottom of the box body into the liquid supply cavity so that the liquid tin flows out from the overflow edge to tin the pins of the chip; wherein: A communicating vessel structure is defined in the liquid supply cavity, and a flow channel extending and bending back and forth is formed in the communicating vessel structure so that liquid tin passes through the flow channel and flows out from the overflow edge; The liquid supply chamber is defined by a partition, a first side plate and a second side plate; wherein: The partition is horizontally placed above the heating mechanism, the first side plate and the second side plate are vertically arranged, and the liquid supply cavity is located between the first side plate and the second side plate; wherein: The upper end of the first side plate forms the overflow edge; The first side plate has a lower lip portion extending laterally, an upper lip portion is formed above the lower lip portion, and the lower lip portion and the upper lip portion define a liquid outlet, and liquid tin flows out through the liquid outlet; The upper end of the second side plate is higher than the upper end of the first side plate, the second side plate and the top of the box body define a debris removal opening, and a filter is provided on the outer side of the second side plate; The liquid supply chamber is provided with a first spoiler and a second spoiler, the first spoiler defines a first bend of the flow channel in the liquid supply chamber, the second spoiler defines a second bend of the flow channel in the liquid supply chamber, the first bend is located above the second bend, and the liquid tin passes through the first bend and the second bend in sequence.

2. The tin boiler device according to claim 1, characterized in that: The partition plate is provided with a liquid supply hole; The pumping mechanism comprises: An impeller is installed in the embedding groove at the bottom of the partition; A guide groove, which is opened at the bottom of the partition and communicates with the embedding groove and the liquid supply hole; A power mechanism is used to drive the impeller to rotate so that the liquid tin passes through the guide groove and the liquid supply hole and is supplied into the liquid supply cavity.

3. The tin boiler device according to claim 1, characterized in that: The heating mechanism includes a plurality of heating tubes arranged in parallel.

4. The tin boiler device according to claim 1, characterized in that: The top of the box body is also provided with a liquid replenishing joint for compensating the consumed liquid tin for the box body.

5. The tin boiler device according to claim 1, characterized in that: An outer cover is also arranged outside the box body, and a bottom plate is also arranged at the bottom of the outer cover. The edge of the bottom plate has an upward turning edge to form a liquid receiving groove.

6. A tinning equipment, characterized in that: Comprising a tin boiler device as claimed in any one of claims 1 to 5.

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