Refrigeration equipment and hoods

Abstract

The present application discloses a refrigeration device and a range hood, the refrigeration device comprising: a semiconductor refrigeration chip, comprising a heating end and a cooling end; a first heat exchange component, comprising a first heat exchanger and a first fan, the first heat exchanger is thermally connected to the heating end, and the first fan is used to generate a heat dissipation airflow flowing through the first heat exchanger; a cold storage component is thermally connected to the cooling end and is used to store the cold generated by the cooling end of the semiconductor refrigeration chip; a second heat exchange component, comprising a second heat exchanger and a second fan, the second heat exchanger is thermally connected to the cold storage component, and the second fan is used to generate a cooling airflow flowing through the second heat exchanger; a controller is used to control the second fan to delay starting relative to the first fan and the semiconductor refrigeration chip. The refrigeration device provided by the present application can reduce costs.

Description

Technical Field

[0001] The present application relates to the field of electrical equipment technology, and in particular to a refrigeration device and a range hood. Background Art

[0002] In summer, the kitchen environment is hot and stuffy, which can easily cause human discomfort. To address this problem, range hoods equipped with refrigeration systems have emerged. Range hoods equipped with refrigeration systems are easy to accept in terms of product form and can complement each other in terms of functional realization. Therefore, this direction is an important direction for future kitchen environment refrigeration. Currently, the refrigeration systems installed on range hoods include compressor refrigeration systems and semiconductor refrigeration systems. Among them, semiconductor refrigeration systems have the advantages of simple structure and overall light weight.

[0003] The inventors of this application have discovered that, although semiconductor refrigeration systems have many advantages, they also have problems of high cost and large size. Therefore, how to reduce their cost and size is the key to whether semiconductor refrigeration systems can be widely used. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a refrigeration device and a range hood that can reduce costs.

[0005] To solve the above technical problems, a technical solution adopted in the present application is: providing a refrigeration device, comprising: a semiconductor refrigeration chip, comprising a heating end and a cooling end; a first heat exchange component, comprising a first heat exchanger and a first fan, the first heat exchanger is thermally connected to the heating end, and the first fan is used to generate a heat dissipation airflow flowing through the first heat exchanger; a cold storage component, thermally connected to the cooling end, and used to store the cold generated by the cooling end of the semiconductor refrigeration chip; a second heat exchange component, comprising a second heat exchanger and a second fan, the second heat exchanger is thermally connected to the cold storage component, and the second fan is used to generate a cooling airflow flowing through the second heat exchanger; a controller is used to control the delayed start of the second fan relative to the first fan and the semiconductor refrigeration chip.

[0006] In order to solve the above technical problem, another technical solution adopted in the present application is: to provide a range hood including the above range hood.

[0007] The beneficial effect of the present application is that the refrigeration device of the present application controls the second fan to start delayed relative to the first fan and the semiconductor refrigeration chip by setting a controller, so that the refrigeration device can store cold in advance before refrigeration. Compared with the prior art, when cooling immediately, the temperature difference between the heating end and the cooling end of the semiconductor refrigeration chip is large. The present application can avoid this defect, thereby improving the refrigeration efficiency of the semiconductor refrigeration chip, reducing the number of semiconductor refrigeration chips by multiples of time, and achieving the purpose of saving volume and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0009] Figure 1 It is a structural schematic diagram of an embodiment of a refrigeration device of the present application;

[0010] Figure 2 yes Figure 1 Schematic diagram of the structure of the conductive part;

[0011] Figure 3 yes Figure 1 A schematic diagram of the structure of the first heat exchanger;

[0012] Figure 4 It is a structural schematic diagram of another embodiment of the refrigeration device of the present application;

[0013] Figure 5 It is a structural schematic diagram of an embodiment of the range hood of the present application. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0015] First of all, it should be noted that the refrigeration device in the present application can be used for various refrigeration equipment that requires refrigeration, such as range hoods, and is not limited here.

[0016] See also Figure 1 , Figure 1 The refrigeration device 1000 includes a semiconductor refrigeration chip 1100, a first heat exchange component 1200, a cold storage component 1300, a second heat exchange component 1400 and a controller (not shown).

[0017] The semiconductor refrigeration chip 1100 includes a heating end 1101 and a cooling end 1102. In the present embodiment, the heating end 1101 and the cooling end 1102 are arranged relative to each other. When the semiconductor refrigeration chip 1100 is working, heat transfer will occur between the heating end 1101 and the cooling end 1102: heat is transferred from the cooling end 1102 to the heating end 1101, so that the temperature of the cooling end 1102 decreases and the temperature of the heating end 1101 increases.

[0018] The first heat exchange assembly 1200 includes a first heat exchanger 1210 and a first fan 1220. The first heat exchanger 1210 is thermally connected to the heating end 1101. The first fan 1220 is used to generate a heat dissipation airflow flowing through the first heat exchanger 1210. Specifically, the heat generated by the heating end 1101 of the semiconductor refrigeration chip 1100 is transferred to the first heat exchanger 1210 to increase the temperature of the first heat exchanger 1210. After the first fan 1220 is working, the heat dissipation airflow generated by the first fan 1220 exchanges heat with the first heat exchanger 1210 to take away the heat on the first heat exchanger 1210, thereby realizing heat dissipation for the heating end 1101.

[0019] The cold storage component 1300 is thermally connected to the cooling end 1102 and is used to store the cold energy generated by the cooling end 1102 of the semiconductor cooling chip 1100. Specifically, the cold storage component 1300 can first store the cold energy generated by the cooling end 1102 without losing it.

[0020] The second heat exchange assembly 1400 includes a second heat exchanger 1410 and a second fan 1420. The second heat exchanger 1410 is thermally connected to the cold storage assembly 1300. The second fan 1420 is used to generate a refrigeration airflow flowing through the second heat exchanger 1410. Specifically, the cold energy stored in the cold storage assembly 1300 is transferred to the second heat exchanger 1410 to reduce the temperature of the second heat exchanger 1410. After the second fan 1420 is working, the refrigeration airflow generated by the second fan 1420 exchanges heat with the second heat exchanger 1410 to take away its cold energy. At the same time, the temperature of the refrigeration airflow is reduced. Finally, the refrigeration airflow with a reduced temperature is blown to the external space to achieve the purpose of reducing the ambient temperature.

[0021] The controller is used to control the second fan 1420 to start up later than the first fan 1220 and the semiconductor refrigeration chip 1100. Specifically, the controller controls the second fan 1420 to start up after controlling the first fan 1220 and the semiconductor refrigeration chip 1100 to start up.

[0022] In this embodiment, before the second fan 1420 is started, the cold energy generated by the refrigeration end 1102 can only be transferred to the second heat exchanger 1410 but cannot be transferred to the outside, that is, the cold energy generated by the refrigeration end 1102 is always stored in the cold storage component 1300. At this time, the refrigeration device 1000 is in a cold storage state. After the second fan 1420 is started, the refrigeration airflow generated by the second fan 1420 can absorb the cold energy on the second heat exchanger 1410 and blow it to the outside to achieve the refrigeration purpose. At this time, the refrigeration device 1000 is in a refrigeration state.

[0023] That is to say, by setting a controller, the refrigeration device 1000 controls the second fan 1420 to start delayed relative to the first fan 1220 and the semiconductor refrigeration chip 1100, so that the refrigeration device 1000 can store cold in advance before cooling. Compared with the prior art, when cooling immediately, the temperature difference between the heating end 1101 and the cooling end 1102 of the semiconductor refrigeration chip 1100 is larger. In the present application, since the cooling end 1102 is in contact with the cold storage component 1300, compared with direct contact with the wind to be cooled, the temperature of the cooling end 1102 will not be immediately reduced, thereby avoiding the defects in the prior art, thereby improving the refrigeration efficiency of the semiconductor refrigeration chip 1100, and reducing the number of semiconductor refrigeration chips 1100 by multiples of time, thereby achieving the purpose of saving volume and cost.

[0024] Continue reading Figure 1 The cold storage assembly 1300 includes a cold storage box 1310 , a conductive member 1320 , a pipeline 1330 and a circulating pump 1340 .

[0025] The cold storage tank 1310 is used to store cold storage agent; the conductive element 1320 forms thermal contact with the refrigeration end 1102; the pipeline 1330 connects the cold storage tank 1310 and the conductive element 1320; the circulating pump 1340 is used to pump the cold storage agent along the pipeline 1330 to circulate between the cold storage tank 1310 and the conductive element 1320.

[0026] After the semiconductor refrigeration chip 1100 and the first fan 1220 are started and before the second fan 1420 is started, the cold energy generated by the refrigeration end 1102 is transferred to the conductive element 1320. At the same time, the circulating pump 1340 pumps the refrigerant along the pipeline 1330 to circulate between the refrigerant box 1310 and the conductive element 1320 so that the refrigerant absorbs the cold energy on the conductive element 1320, thereby achieving the purpose of storing cold energy.

[0027] The coolant may be water, and the inner and / or outer sides of the coolant box 1310 and the pipeline 1330 are wrapped with insulation materials to reduce heat leakage of the coolant.

[0028] Continue reading Figure 1, the second heat exchanger 1410 is disposed on the pipeline 1330. Specifically, a liquid flow channel (not shown) for the flow of the refrigerant is provided inside the second heat exchanger 1410, and the refrigerant can flow through the second heat exchanger 1410. In other embodiments, the second heat exchanger 1410 may not be disposed on the pipeline 1330, for example, it may be thermally connected to the refrigerant tank 1310 or the conductive member 1320 and other components. In this case, although the refrigerant cannot flow through the second heat exchanger 1410, the second heat exchanger 1410 can also output the cold in the refrigerant assembly 1300.

[0029] Continue reading Figure 1 The pipeline 1330 includes a first pipeline 1331 for transporting the coolant from the cold storage tank 1310 to the conductive member 1320 and a second pipeline 1332 for transporting the coolant from the conductive member 1320 to the cold storage tank 1310, wherein the circulating pump 1340 is arranged on the first pipeline 1331 and the second heat exchanger 1410 is arranged on the second pipeline 1332.

[0030] When the refrigeration device 1000 is in a cold storage state, the coolant starts from the cold storage tank 1310 under the drive of the circulation pump 1340, passes through the circulation pump 1340, the conductive element 1320 and the second heat exchanger 1410 in sequence, and finally returns to the cold storage tank 1310. At the same time, when the refrigeration device 1000 is in a cooling state, the coolant flows in the same direction as before.

[0031] See also Figure 2 The conductive member 1320 includes a conductive body 1321, a first joint 1322 and a second joint 1323 arranged in a block shape, wherein the conductive body 1321 forms thermal contact with the refrigeration end 1102, and a liquid flow channel (not shown) is arranged inside the conductive body 1321, the first joint 1322 and the second joint 1323 are arranged at both ends of the liquid flow channel, and are connected to the cold storage tank 1310 through a first pipeline 1331 and a second pipeline 1332 respectively.

[0032] The conductive member 1320 is made of a material with excellent thermal conductivity, such as metal (such as copper, aluminum, etc.). To ensure the service life, the surface of the conductive member 1320 may be coated with an anti-corrosion material. To ensure good thermal contact between the semiconductor cooling chip 1100 and the conductive member 1320, the cooling end 1102 is connected to the conductive member 1320 through thermal conductive silicone.

[0033] At the same time, since the heat of the heating end 1101 of the semiconductor refrigeration chip 1100 is approximately equal to the sum of the cooling capacity of the cooling end 1102 and the input electric power, in this embodiment, in order to improve the heat dissipation effect, the heat exchange efficiency of the first heat exchanger 1210 is set to be greater than the heat exchange efficiency of the second heat exchanger 1410.

[0034] In one application scenario, the first heat exchanger 1210 is a heat pipe heat exchanger, and the second heat exchanger 1410 is a tube-fin heat exchanger or a microchannel heat exchanger. Figure 1 and Figure 3 In this application scenario, the first heat exchanger 1210 includes a substrate 1211 , heat dissipation fins 1212 and a heat pipe 1213 .

[0035] The substrate 1211 is in contact with the heating end 1101 of the semiconductor refrigeration chip 1100; there are multiple heat dissipation fins 1212, and the multiple heat dissipation fins 1212 are arranged at intervals on a side surface of the substrate 1211 away from the semiconductor refrigeration chip 1100, and the extension direction of the multiple heat dissipation fins 1212 is parallel to the flow direction of the heat dissipation airflow; the heat pipe 1213 connects the substrate 1211 and the multiple heat dissipation fins 1212.

[0036] Specifically, the extension direction of the heat sink 1212 is set to be parallel to the flow direction of the heat sink airflow, which can improve the heat dissipation effect. At the same time, the heat pipe 1213 can transfer the heat generated by the heating end 1101 of the semiconductor refrigeration chip 1100 to the heat sink 1212 through the phase change process of the liquid in the pipe, and then the heat is taken away by the heat sink airflow, thereby improving the heat dissipation performance.

[0037] At the same time, in order to further improve the heat dissipation performance, one end of the heat pipe 1213 connected to the heat dissipation fins 1212 is inserted into multiple heat dissipation fins 1212. In one application scenario, one end of the heat pipe 1213 inserted into multiple heat dissipation fins 1212 is connected to the multiple heat dissipation fins 1212 by interference fit.

[0038] At the same time, in order to ensure good thermal contact between the semiconductor refrigeration chip 1100 and the substrate 1211, the heating end 1101 is connected to the substrate 1211 through thermally conductive silicone.

[0039] In this embodiment, the controller is further connected to the circulation pump 1340, and sets the speed of the circulation pump 1340 to medium speed when the first fan 1220 and the semiconductor refrigeration chip 1100 are started, and adjusts the speed of the circulation pump 1340 after the second fan 1420 is started, and the medium speed is between the maximum speed and the minimum speed of the circulation pump 1340.

[0040] Specifically, in the cold storage stage, the circulating pump 1340 rotates at a fixed speed to make the refrigerant flow at a fixed flow rate to store cold. In the refrigeration stage, considering factors such as the temperature of the ambient wind, the user's demand for refrigeration, and the temperature change of the refrigerant, the temperature of the refrigerating airflow needs to change according to the actual situation. Therefore, the flow rate of the refrigerant is adjusted by adjusting the speed of the circulating pump 1340, thereby achieving the temperature of the refrigerating airflow.

[0041] In one application scenario, the refrigeration device 1000 further includes a first temperature sensor (not shown), which is used to detect the temperature of the refrigeration airflow. The controller adjusts the speed of the circulation pump 1340 according to the comparison result between the temperature of the refrigeration airflow and a preset temperature threshold.

[0042] By detecting the temperature of the refrigeration airflow and adjusting the speed of the circulation pump 1340, the temperature of the refrigeration airflow can meet the user's requirements for refrigeration temperature, thereby improving the customer experience. The preset temperature threshold can be set by the user as the desired refrigeration temperature.

[0043] In another application scenario, after the second fan 1420 is started, the controller first reduces the rotation speed of the circulation pump 1340 , and then gradually increases the rotation speed of the circulation pump 1340 over time.

[0044] At the beginning of the refrigeration stage, the cold capacity of the refrigerant is sufficient. If the speed of the circulating pump 1340 is kept unchanged at this time, the temperature of the refrigerating air flow will be low, specifically lower than the refrigerating temperature expected by the user (preset temperature threshold). Therefore, the speed of the circulating pump 1340 is first reduced to prevent the temperature of the refrigerating air flow from being too low. Then, as the refrigerating air flow gradually takes away the cold in the refrigerant, the temperature of the refrigerating air flow will gradually increase. At the same time, in the process of increasing the temperature of the refrigerating air flow, if it is found that the temperature of the refrigerating air flow is equal to the refrigerating temperature expected by the user, the circulating pump 1340 is controlled to maintain the current speed. Then, as the cold capacity of the refrigerant is lost, the temperature of the refrigerating air flow will gradually increase. At this time, the temperature of the refrigerating air flow exceeds the temperature expected by the user. Therefore, in order to minimize the gap between the temperature of the refrigerating air flow and the temperature expected by the user, the controller gradually increases the speed of the circulating pump 1340 over time until it reaches the maximum speed of the circulating pump 1340. Finally, before the user shuts down, the circulating pump 1340 will continue to rotate at the maximum speed.

[0045] In this embodiment, the controller increases the cooling power of the semiconductor refrigeration chip 1100 after the second fan 1420 is started.

[0046] Specifically, after the second fan 1420 is started, since the cold energy will be lost to the outside, the demand for cold energy is greater than in the cold storage stage. Therefore, by increasing the cooling power of the semiconductor refrigeration chip 1100, that is, ensuring that the cooling power of the semiconductor refrigeration chip 1100 is greater in the cooling stage than in the cold storage stage, the user's demand for cold energy can be guaranteed.

[0047] In this embodiment, the controller gradually increases the cooling power of the semiconductor refrigeration chip 1100 over time after the second fan 1420 is started.

[0048] Specifically, after the second fan 1420 is started, as time goes by, the cold energy of the refrigerant is gradually lost to the outside, and the temperature of the cooling airflow will gradually increase and exceed the temperature expected by the user. In order to minimize the difference between the temperature of the cooling airflow and the temperature expected by the user, the controller gradually increases the cooling power of the semiconductor refrigeration chip 1100 over time to ensure that the semiconductor refrigeration chip 1100 generates more and more cold energy to meet the needs of the user.

[0049] In this embodiment, the refrigeration device 1000 further includes a second temperature sensor (not shown), which is used to detect the ambient temperature. The controller controls the refrigeration power of the semiconductor refrigeration chip 1100 according to the ambient temperature before the second fan 1420 is started.

[0050] Specifically, during the cold storage stage, by controlling the cooling power of the semiconductor refrigeration chip 1100 according to the ambient temperature, the cold storage component 1300 can store an appropriate amount of cold, avoiding the phenomenon of storing too much or too little cold, thereby achieving the purpose of saving energy and improving user experience.

[0051] In this embodiment, the refrigeration device 1000 further includes a control panel (not shown), and the controller starts the first fan 1220 and the semiconductor refrigeration chip 1100 in response to the reservation instruction received by the control panel, and further starts the second fan 1420 in response to the refrigeration instruction received by the control panel.

[0052] In one application scenario, when the user needs the refrigeration device 1000 to store cold, the user enters a reservation instruction on the control panel, and the refrigeration device 1000 starts to store cold. When the user needs the refrigeration device 1000 to cool, the user enters a cooling instruction on the control panel, and the refrigeration device 1000 starts to cool.

[0053] In another application scenario, the user inputs a reservation instruction on the control panel, and then the refrigeration device 1000 starts to store cold. At the same time, after the preset time for receiving the reservation instruction is reached, the refrigeration device 1000 automatically performs refrigeration. That is, at this time, the refrigeration device 1000 defaults to receiving the refrigeration instruction without the user having to input the refrigeration instruction again.

[0054] The refrigeration device 1000 in this embodiment can establish a communication connection with the mobile terminal in a wired or wireless manner, so that the user can remotely set the cold storage time and the refrigeration time of the refrigeration device 1000.

[0055] In this embodiment, the control panel counts the reception time of the cooling instruction to obtain the first scheduled time, and the controller further sets the second scheduled time before the first scheduled time as the start time of the first fan 1220 and the semiconductor refrigeration chip 1100.

[0056] Specifically, the control panel uses big data to analyze the reception time of previous refrigeration instructions, and obtains the pattern of the user's use of the refrigeration device 1000 for refrigeration, thereby inferring that the user will use the refrigeration device 1000 for refrigeration at the first scheduled time. For example, the user will use the refrigeration device 1000 for refrigeration at 11 o'clock every day (the first scheduled time), and further set the second scheduled time before the first scheduled time as the cold storage time. Subsequently, the refrigeration device 1000 will automatically start to store cold at the second scheduled time, thereby realizing the automation and intelligence of the refrigeration device 1000.

[0057] In one application scenario, in addition to counting the time of receiving the cooling instruction, the control panel also counts the time of receiving the reservation instruction, so as to obtain the time interval between the user's cold storage and cooling, and then set the second reservation time based on the counted first reservation time and the time interval.

[0058] In other embodiments, the refrigeration device 1000 may not include a control panel, but instead include a timer (not shown). In this case, the controller starts the first fan 1220 and the semiconductor refrigeration chip 1100 at the first scheduled time according to the timing result of the timer, and further starts the second fan 1420 at the second scheduled time according to the timing result of the timer.

[0059] Specifically, the user sets the cold storage time and cooling time of the refrigeration device 1000 in a countdown form in advance, for example, cold storage starts after 5 hours and cooling starts after 5.5 hours, and then the timer starts timing, and the controller controls the operation of the refrigeration device 1000 according to the timing result of the timer.

[0060] In another embodiment, the refrigeration device 1000 may include a control panel and a timer at the same time, which is not limited here.

[0061] See also Figure 4 , Figure 4 It is a structural schematic diagram of another embodiment of the refrigeration device of the present application. Different from the above embodiment, in order to further improve the refrigeration performance of the refrigeration device 2000, the number of semiconductor refrigeration chips 2100 is at least two, and at least two semiconductor refrigeration chips 2100 are arranged in sequence along the flow direction of the refrigerant, wherein the flow direction of at least part of the heat dissipation airflow is opposite to the flow direction of the refrigerant.

[0062] Generally speaking, for the semiconductor refrigeration chip 2100, the greater the temperature difference between the cooling end 2102 and the heating end 2101, the lower the working efficiency and the more energy consumed. Therefore, for the requirements of economy and work efficiency, it is usually required that the temperature difference between the heating end 2101 and the cooling end 2102 of the semiconductor refrigeration chip 2100 does not exceed 30 degrees Celsius. Therefore, in the present embodiment, the flow direction of the heat dissipation airflow that sequentially performs heat exchange with the heating end 2101 of each semiconductor refrigeration chip 2100 is opposite to the flow direction of the refrigerant that sequentially performs heat exchange with the cooling end 2102 of each semiconductor refrigeration chip 2100. When the specifications of each semiconductor refrigeration chip 2100 are exactly the same, such a setting can make the temperature of the cooling end 2102 of each semiconductor refrigeration chip 2100 sequentially decrease along the flow direction of the refrigerant, and the temperature of the heating end 2101 of each semiconductor refrigeration chip 2100 sequentially increase along the flow direction of the heat dissipation airflow. That is to say, at this time, the overall temperature of each semiconductor refrigeration chip 2100 sequentially decreases along the flow direction of the refrigerant, thereby ensuring that the temperature difference at both ends of each semiconductor refrigeration chip 2100 meets the requirements.

[0063] In this embodiment, during operation, the cooling power of each semiconductor refrigeration chip 2100 decreases sequentially along the flow direction of the refrigerant.

[0064] Specifically, since the temperature of the refrigerant gradually decreases after passing through the cooling end 2102 of each semiconductor refrigeration chip 2100 in sequence, along the flow direction of the refrigerant, the semiconductor refrigeration chip 2100 at the front end needs to process a higher temperature of the refrigerant than the semiconductor refrigeration chip 2100 at the rear end. Therefore, the refrigeration power of each semiconductor refrigeration chip 2100 is set to decrease in sequence along the flow direction of the refrigerant, that is, along the flow direction of the refrigerant, the semiconductor refrigeration chip 2100 at the front end has a stronger refrigeration capacity than the semiconductor refrigeration chip 2100 at the rear end, thereby achieving the purpose of saving energy.

[0065] In this embodiment, during operation, the temperature of the cooling end 2102 of each semiconductor refrigeration chip 2100 decreases successively along the flow direction of the refrigerant, and the temperature of the heating end 2101 of each semiconductor refrigeration chip 2100 increases successively in the opposite direction of the flow direction of the refrigerant. Through such an arrangement, the temperature difference between the heating end 2101 and the cooling end 2102 of each semiconductor refrigeration chip 2100 can meet the requirements.

[0066] At the same time, in this embodiment, the heating ends 2101 of at least two semiconductor refrigeration chips 2100 can be thermally connected to the same first heat exchanger 2210 (such as Figure 4 As shown), it can also be thermally connected to different first heat exchangers 2210, which is not limited here.

[0067] See also Figure 5 The present application also provides a range hood 3000, comprising a refrigeration device 3100 in any of the above-mentioned embodiments, wherein the specific structure of the refrigeration device 3100 can be found in the above-mentioned embodiments and will not be described in detail here.

[0068] The cooling airflow in the refrigeration device 3100 is eventually blown toward the user, and the heat dissipation airflow is eventually blown away from the user.

[0069] In summary, the refrigeration device provided in the present application can improve the refrigeration efficiency of semiconductor refrigeration chips by realizing advance cold storage, reduce the number of semiconductor refrigeration chips by multiples of time, and achieve the purpose of saving volume and cost.

[0070] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A refrigeration device, It is characterized in that include: Semiconductor refrigeration chip, including a heating end and a cooling end; A first heat exchange assembly, comprising a first heat exchanger and a first fan, wherein the first heat exchanger is thermally connected to the heating end, and the first fan is used to generate a heat dissipation airflow flowing through the first heat exchanger; A cold storage component, thermally connected to the refrigeration end and used to store the cold energy generated by the refrigeration end of the semiconductor refrigeration chip; A second heat exchange component, comprising a second heat exchanger and a second fan, the cold energy stored in the cold storage component is transferred to the second heat exchanger, and the second fan is used to generate a refrigeration airflow flowing through the second heat exchanger; A controller, used for controlling the second fan to start up with a delay relative to the first fan and the semiconductor refrigeration chip; Wherein, the cold storage component comprises: A cold storage box, used for storing a cold storage agent; A conductive member, forming thermal contact with the refrigeration end; A pipeline connecting the cold storage tank and the conducting member, wherein the second heat exchanger is arranged on the pipeline; A circulation pump, used for pumping the coolant along the pipeline to circulate between the cool storage tank and the conductive member; The controller is further connected to the circulation pump, and sets the speed of the circulation pump to a medium speed when the first fan and the semiconductor refrigeration chip are started, and performs variable speed adjustment on the circulation pump after the second fan is started, wherein the medium speed is between the maximum speed and the minimum speed of the circulation pump; Wherein, after the second fan is started, the controller first reduces the rotation speed of the circulation pump, and then gradually increases the rotation speed of the circulation pump over time.

2. The refrigeration device according to claim 1, It is characterized in that The pipeline includes a first pipeline for transporting the coolant from the cool storage tank to the conductive member and a second pipeline for transporting the coolant from the conductive member to the cool storage tank, wherein the circulation pump is arranged on the first pipeline, and the second heat exchanger is arranged on the second pipeline.

3. The refrigeration device according to claim 2, It is characterized in that The number of the semiconductor refrigeration chips is at least two, and the at least two semiconductor refrigeration chips are arranged in sequence along the flow direction of the refrigerant, wherein the flow direction of at least part of the heat dissipation airflow is opposite to the flow direction of the refrigerant.

4. The refrigeration device according to claim 3, It is characterized in that During operation, the refrigeration power of each semiconductor refrigeration chip decreases in sequence along the flow direction of the refrigerant.

5. The refrigeration device according to claim 3, It is characterized in that During operation, the temperature of the cooling end of each semiconductor refrigeration chip decreases in sequence along the flow direction of the refrigerant, and the temperature of the heating end of each semiconductor refrigeration chip increases in sequence in the opposite direction of the flow direction of the refrigerant.

6. The refrigeration device according to claim 2, It is characterized in that The conductive member includes a conductive body arranged in a block shape, a first joint and a second joint, wherein the conductive body forms thermal contact with the refrigeration end, and a liquid flow channel is arranged inside the conductive body, the first joint and the second joint are arranged at both ends of the liquid flow channel, and are connected to the cold storage tank through the first pipeline and the second pipeline respectively.

7. The refrigeration device according to claim 1, It is characterized in that The refrigeration device further includes a first temperature sensor, which is used to detect the temperature of the refrigeration airflow. The controller performs speed adjustment on the circulation pump according to a comparison result between the temperature of the refrigeration airflow and a preset temperature threshold.

8. The refrigeration device according to claim 1, It is characterized in that The controller increases the cooling power of the semiconductor refrigeration chip after the second fan is started.

9. The refrigeration device according to claim 1, It is characterized in that The controller gradually increases the cooling power of the semiconductor refrigeration chip over time after the second fan is started.

10. The refrigeration device according to claim 1, It is characterized in that The refrigeration device further includes a second temperature sensor, which is used to detect the ambient temperature. The controller controls the refrigeration power of the semiconductor refrigeration chip according to the ambient temperature before the second fan is started.

11. The refrigeration device according to claim 1, It is characterized in that The refrigeration device further includes a control panel, and the controller starts the first fan and the semiconductor refrigeration chip in response to a reservation instruction received by the control panel, and further starts the second fan in response to a refrigeration instruction received by the control panel.

12. The refrigeration device according to claim 11, It is characterized in that The control panel counts the reception time of the refrigeration instruction to obtain a first scheduled time, and the controller further sets a second scheduled time before the first scheduled time as the start time of the first fan and the semiconductor refrigeration chip.

13. The refrigeration device according to claim 1, It is characterized in that The refrigeration device further includes a timer, and the controller starts the first fan and the semiconductor refrigeration chip at a first scheduled time according to a timing result of the timer, and further starts the second fan at a second scheduled time according to the timing result of the timer.

14. The refrigeration device according to claim 1, It is characterized in that The heat exchange efficiency of the first heat exchanger is greater than the heat exchange efficiency of the second heat exchanger.

15. The refrigeration device according to claim 1, It is characterized in that The first heat exchanger is a heat pipe heat exchanger, the second heat exchanger is a tube-fin heat exchanger or a microchannel heat exchanger, and the heat pipe heat exchanger includes: A substrate in contact with the heating end of the semiconductor refrigeration chip; A plurality of heat dissipation fins are arranged at intervals on a surface of the substrate away from the semiconductor refrigeration chip, and the extension direction of the plurality of heat dissipation fins is parallel to the flow direction of the heat dissipation airflow; A heat pipe connects the substrate and the plurality of heat dissipation fins.

16. A range hood, It is characterized in that Comprising a refrigeration device as claimed in any one of claims 1 to 15.

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