Electronic device

Abstract

An electronic device includes a substrate and a plurality of first bumps. The first bumps are disposed on the substrate and are arranged in a first bump column. Each first bump has opposite first and second ends. A center of the first end of the first bump is on a first axis. A center of the second end of the respective first bump is at an X A (1+β A Y A ), where X A is a first axis coordinate of the center of the first end of the respective first bump with respect to the second axis, Y A is a second axis coordinate of the center of the second end of the respective first bump with respect to the first axis, and β A is a slope coefficient of the respective first bump. In this way, when mismatches occur between the bumps of two electronic devices to be joined, the bumps can flexibly respond to deformation of the substrate of one of the electronic devices.

Description

Technical Field

[0001] The present invention relates to an electronic device, and in particular to an electronic device comprising a bump for electrical connection. Background Art

[0002] An electronic device, such as a liquid crystal display (LCD) device or an organic light emitting diode (OLED) device, may include an array substrate having a display area and a non-display area surrounding the display area. The array substrate can be used as a circuit board for individually driving the pixels of the electronic device. Gate wiring for transmitting scan signals, data wiring for transmitting image signals, thin film transistors (TFTs), and various organic or inorganic insulating layers can be provided on the array substrate. Each TFT includes a gate electrode forming a portion of the gate wiring, a semiconductor layer forming a channel with the gate electrode, and a source electrode and a drain electrode forming a portion of the data wiring. The TFT can be used as a switching device.

[0003] Conductive wires may be provided in the non-display area surrounding the display area. These conductive wires may be connected to gate lines or data lines in the display area. The conductive wires may extend in various shapes and may also be connected to pads in a pad unit beneath the array substrate. A driver integrated circuit may be provided in the pad unit. The driver integrated circuit may apply drive signals to the gate and data lines. The driver integrated circuit may include a plurality of bumps that align with the pads of the pad unit and provide drive signals to the pads.

[0004] In the latest trend of manufacturing flexible displays, array substrates can be formed from flexible materials such as polyimide. However, the dimensions of the flexible array substrate may change during the manufacturing process before the pad unit is formed, resulting in misalignment between the bumps of the driver integrated circuit and the pads of the pad unit.

[0005] Therefore, how to provide an electronic device that can solve the above problems is one of the issues that the industry is eager to invest research and development resources to solve. Summary of the Invention

[0006] In view of this, an object of the present invention is to provide an electronic device that can solve the above-mentioned problem.

[0007] To achieve the above object, according to one embodiment of the present invention, an electronic device includes a substrate and a plurality of first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. The center of the first end of the first bump is on a first axis. For each first bump, the center of the second end of the corresponding one of the first bumps is X with respect to a first axis perpendicular to the first axis. A (1+β A YA ), where X A is the first axis coordinate of the center of the first end of the corresponding one of the first protrusions relative to the second axis, Y A is the second axis coordinate of the center of the second end of the corresponding one of the first protrusions relative to the first axis, and β A is the slope coefficient of the corresponding one of the first bumps.

[0008] In one or more embodiments of the present invention, the slope coefficient of one of the first bumps is the same as the slope coefficient of another of the first bumps.

[0009] In one or more embodiments of the present invention, a slope coefficient of one of the first bumps is different from a slope coefficient of another of the first bumps.

[0010] In one or more embodiments of the present invention, a slope coefficient of one of the first bumps is smaller than a slope coefficient of another of the first bumps. The one of the first bumps is closer to the second axis than the other of the first bumps.

[0011] In one or more embodiments of the present invention, the slope coefficient decreases as the first bump gets closer to the second axis.

[0012] In one or more embodiments of the present invention, the farther the first protrusion is from the second axis, the more inclined it is relative to the second axis.

[0013] In one or more embodiments of the present invention, the centers of the first ends of the first protrusions are arranged equidistantly or unequally.

[0014] In one or more embodiments of the present invention, the second axis is located at the center of two adjacent first protrusions.

[0015] In one or more embodiments of the present invention, the second axis passes through the first end and the second end of one of the first protrusions.

[0016] In one or more embodiments of the present invention, the first protrusion is symmetrical with respect to the second axis.

[0017] In one or more embodiments of the present invention, the electronic device further includes a plurality of second bumps disposed on the substrate and arranged in second bump rows. At least a portion of the second bumps are aligned with the first bumps to form a plurality of bump rows.

[0018] In one or more embodiments of the present invention, each second protrusion has a first end and a second end opposite to each other. The center of the first end of the second protrusion in the corresponding row of protrusions is X with respect to the first axis coordinate of the second axis. B (1+β B Y B ), where XB Y is the first axis coordinate of the center of the first end of the first protrusion in the corresponding one of the protrusion rows relative to the second axis, B is the second axis coordinate of the center of the first end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β B is the slope coefficient of the first bump in the corresponding one of the bump rows.

[0019] In one or more embodiments of the present invention, the first axis coordinate of the center of the second end of the second bump in the corresponding one of the bump rows relative to the second axis is X B (1+β C Y C ), where Y C is the second axis coordinate of the center of the second end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β C is the slope coefficient of the second bump in the corresponding one of the bump rows.

[0020] In one or more embodiments of the present invention, the slope coefficients of the first bumps and the second bumps in corresponding ones of the bump rows are the same.

[0021] In one or more embodiments of the present invention, the slope coefficients of the first bump and the second bump in corresponding ones of the bump rows are different.

[0022] In one or more embodiments of the present invention, each second protrusion has a first end and a second end opposite to each other. The center of the first end of the second protrusion in the corresponding row of protrusions has a first axis coordinate relative to the second axis (X B +S)(1+β B Y B ), where X B Y is the first axis coordinate of the center of the first end of the first protrusion in the corresponding one of the protrusion rows relative to the second axis, B is the second axis coordinate of the center of the first end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β B and S are the slope coefficient and offset value of the second bump in corresponding ones of the bump rows, respectively.

[0023] In one or more embodiments of the present invention, the offset value of the second bump in one of the bump rows is different from the offset value of the second bump in the other of the bump rows.

[0024] In one or more embodiments of the present invention, the number of the first bumps is different from the number of the second bumps.

[0025] In one or more embodiments of the present invention, two second bumps outside the bump row are arranged at opposite ends of the second bump column.

[0026] In one or more embodiments of the present invention, the second protrusion is symmetrical with respect to the second axis.

[0027] In summary, in the electronic device of the present invention, the inclination of the bumps varies based on the first end of the bumps relative to the reference line (i.e., the second axis). This allows the bumps to flexibly respond to deformation of the substrate of one of the two electronic devices to be bonded when a mismatch occurs. Specifically, in response to substrate expansion, the other electronic device is moved a certain distance along the reference line. As a result of the expansion, the bumps of the other electronic device can be aligned with the bumps on the deformed substrate. This improves bonding reliability.

[0028] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To make the above and other objects, features, advantages and embodiments of the present invention more apparent, the accompanying drawings are described as follows:

[0030] Figure 1 1 is a plan view illustrating an electronic device according to some embodiments of the present invention;

[0031] Figure 2 A plan view illustrating a configuration of bumps according to some embodiments of the present invention;

[0032] Figure 3 A plan view illustrating a configuration of bumps according to some embodiments of the present invention;

[0033] Figure 4 A plan view illustrating a configuration of bumps according to some embodiments of the present invention;

[0034] Figure 5 A plan view illustrating a configuration of bumps according to some embodiments of the present invention;

[0035] Figure 6 FIG2 is a plan view illustrating a bump configuration according to some embodiments of the present invention.

[0036]

Explanation of symbols

[0037] 100: Display panel

[0038] 110,210:Substrate

[0039] 111: Joint

[0040] 112: Gate drive unit

[0041] 113: Power supply unit

[0042] B: Bump

[0043] C: Bump row

[0044] R1: first bump row

[0045] R2: Second bump row

[0046] L1: First axis

[0047] L2: Second axis

[0048] IC: Data driver integrated circuit

[0049] DA: Display Area

[0050] NA: Non-display area

[0051] PX: Pixel

[0052] GL: Gate Line

[0053] DL: data line

[0054] X: first direction

[0055] Y: Second direction DETAILED DESCRIPTION

[0056] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not essential. Furthermore, to simplify the drawings, some well-known and conventional structures and components are depicted in simplified schematic form.

[0057] Please refer to Figure 1 . Figure 1 FIG2 is a plan view of an electronic device according to some embodiments of the present invention. Figure 1As shown, one of the electronic devices may be a display panel 100 including a substrate 110 (e.g., an array substrate). The substrate 110 includes a display area DA and a non-display area NA. The display area DA may be an area for displaying an image. The display area DA may include pixels PX arranged in a matrix. Each pixel PX may be provided with a display element for displaying an image and a thin film transistor (TFT) electrically connected to the display element. The display element may be, for example, an organic light emitting diode (OLED). The pixels PX may be defined by gate lines GL and data lines DL intersecting the gate lines GL. The gate lines GL may extend in a first direction X, and the data lines DL may extend in a second direction Y intersecting the first direction X. The first direction X may correspond to the direction of the columns of the pixels PX, and the second direction Y may correspond to the direction of the rows of the pixels PX.

[0058] The non-display area NA may be an area where no image is displayed and may surround the display area DA. The non-display area NA may also be an area adjacent to or arranged along an edge of the substrate 110. In the non-display area NA, a bonding portion 111, a gate driving unit 112, and a power supply unit 113 may be provided.

[0059] Another electronic device may be a data driver integrated circuit (IC). The bonding portion 111 may be a region where the data driver integrated circuit (IC) that applies a data signal voltage to the data lines DL is mounted. The data driver integrated circuit (IC) may be a chip on glass (COG) mounted on the bonding portion 111 on the substrate 110. That is, the bonding portion 111 may be a COG bonding unit. Alternatively, in response to substrate 110 being formed of a flexible material, the bonding portion 111 may be a chip on plastic (COP) bonding unit.

[0060] The gate driving unit 112 may be disposed on a side of the substrate 110 perpendicular to the side on which the data driver integrated circuit IC is disposed. The gate driving unit 112 may provide a gate signal voltage to the gate lines GL and may sequentially scan the pixels PX. The power supply unit 113 may be disposed on a side of the substrate 110 opposite to the side on which the gate driving unit 112 is disposed. The power supply unit 113 may provide a power supply voltage required to drive the pixels PX.

[0061] The bonding portion 111 may include a plurality of pads arranged in one direction. The data driving integrated circuit IC may include a substrate 210 and a plurality of bumps B disposed on the substrate 210. The bumps B (refer to Figure 2 ) respectively correspond to the pads of the joint portion 111. That is, the bumps B of the data driver integrated circuit IC can be connected to the pads of the joint portion 111 one to one. The relationship between the pads of the joint portion 111 and the bumps B of the data driver integrated circuit IC will be described below. Figure 2 describe.

[0062] Please refer to Figure 2 . Figure 2 FIG2 is a plan view illustrating the configuration of bumps according to some embodiments of the present invention. Figure 2 As shown, the bumps B are arranged in a first bump row R1 and a second bump row R2. Each bump B has a first end (i.e., an upper end) and a second end (i.e., a lower end) opposite to each other. The center of the first end of the bump B in the first bump row R1 is on the first axis L1. In some embodiments, for each bump B in the first bump row R1, the center of the second end of the corresponding bump B is X relative to the first axis L2 perpendicular to the first axis L1. A (1+β A Y A ), where X A Y is the first axis coordinate of the center of the first end of the corresponding one of the protrusions B relative to the second axis L2, A is the second axis coordinate of the center of the second end of the corresponding one of the bumps B relative to the first axis L1, and β A is the slope coefficient of the corresponding one of the bumps B.

[0063] like Figure 2 As shown, taking the nth bump B in the first bump row R1 arranged along the second axis L2 as an example, the first axis coordinate of the center of the first end of the nth bump B relative to the second axis L2 is X 1_n The first axis coordinate of the center of the second end of the nth bump B relative to the second axis L2 is X 2_n .X 2_n Equal to X 1_n (1+β n Y 2_n ), where Y 2_n is the second axis coordinate of the center of the second end of the n-th bump B relative to the first axis L1, and β n is the slope coefficient of the nth bump B.

[0064] In some embodiments, in the first bump row R1, the slope coefficient of one of the bumps B is the same as the slope coefficient of another of the bumps B. Taking the (n-1)th bump B and the nth bump B in the first bump row R1 arranged along the second axis L2 as an example, the (n-1)th bump B may have a slope coefficient β n-1 , and its slope coefficient β of the nth bump B n same.

[0065] In some embodiments, in the first bump row R1, the slope coefficient of one of the bumps B is different from the slope coefficient of another of the bumps B. For example, the (n-1)th bump B in the first bump row R1 arranged from the second axis L2 may have a slope coefficient β n-1 , which is different from the slope coefficient β of the nth bump B in the first bump row R1 arranged from the second axis L2 n .

[0066] In some embodiments, in the first bump row R1, the slope coefficient of one of the bumps B is smaller than the slope coefficient of the other bump B, and the one of the bumps B is closer to the second axis L2 than the other bump B. Taking the (n-1)th bump B and the nth bump B in the first bump row R1 arranged about the second axis L2 as an example, the nth bump B is closer to the second axis L2 than the (n-1)th bump B, and the slope coefficient β of the nth bump B is n Less than the slope coefficient β of the (n-1)th bump B n-1 .

[0067] In some embodiments, the farther the bumps B in the first bump row R1 are from the second axis L2 , the more inclined they are relative to the second axis L2 .

[0068] Furthermore, in some embodiments, the slope coefficient decreases as the bumps B in the first bump row R1 get closer to the second axis L2. This bump configuration can prevent the bump B closest to the second axis L2 (ie, the first bump B) from tilting too much.

[0069] In some embodiments, the centers of the first ends of the bumps B in the first bump row R1 are arranged at equal intervals. In some embodiments, the centers of the first ends of the bumps B in the first bump row R1 are arranged at non-equidistant intervals.

[0070] In some embodiments, the bumps B in the first bump row R1 are symmetrical with respect to the second axis L2 , but the invention is not limited thereto.

[0071] like Figure 2 As shown, the bumps B in the second bump row R2 are aligned with the bumps B in the first bump row R1 to form a plurality of bump rows C. The first axis coordinate of the center of the first end of the corresponding bump B in the second bump row R2 relative to the second axis L2 is X B (1+β B Y B ), where X B Y is the first axis coordinate of the center of the first end of the corresponding bump B in the first bump row R1 relative to the second axis L2, Bis the second axis coordinate of the center of the first end of the corresponding bump B in the bump row C and in the second bump column R2 relative to the first axis L1, and β B is the slope coefficient of the corresponding bump B in the bump row C and in the second bump column R2.

[0072] like Figure 2 As shown, taking the n-th bump B in the first bump column R1 and the n-th bump B in the second bump column R2 (in the same bump row C) arranged along the second axis L2 as an example, the center of the first end of the n-th bump B in the second bump column R2 relative to the first axis coordinate of the second axis L2 is X 3_n .X 3_n Equal to X 1_n (1+β n Y 3_n ), where X 1_n Y is the first axis coordinate of the center of the first end of the n-th bump B in the first bump row R1 relative to the second axis L2, 3_n is the second axis coordinate of the center of the first end of the n-th bump B in the second bump row R2 relative to the first axis L1, and β n is the slope coefficient of the nth bump B in the first bump row R1. Thus, the centers of the first and second ends of the nth bump B in the first bump row R1 and the center of the first end of the nth bump B in the second bump row R2 are aligned.

[0073] Furthermore, in some embodiments, the first axis coordinate of the center of the second end of the bump B in the corresponding one of the bump rows C relative to the second axis L2 is X B (1+β C Y C ), where Y C is the second axis coordinate of the center of the second end of the bump B in the corresponding bump row C and in the second bump column R2 relative to the first axis L1, and β C is the slope coefficient of the corresponding bump B in the bump row C and in the second bump column R2.

[0074] like Figure 2 As shown, taking the n-th bump B in the first bump row R1 and the n-th bump B in the second bump row R2 arranged along the second axis L2 as an example, the center of the second end of the n-th bump B in the second bump row R2 relative to the first axis coordinate of the second axis L2 is X 4_n .X 4_n Equal to X 1_n (1+β n Y 4_n ), where Y 4_nis the second axis coordinate of the center of the second end of the n-th bump B in the second bump row R2 relative to the first axis L1. Thus, the centers of the first and second ends of the n-th bump B in the first bump row R1 and the centers of the first and second ends of the n-th bump B in the second bump row R2 are aligned.

[0075] In some embodiments, the slope coefficients of the corresponding bumps B in the bump row C are the same. For example, the n-th bump B in the first bump row R1 arranged from the second axis L2 may have a slope coefficient β n_1 , and the n-th bump B in the second bump column R2 arranged from the second axis L2 may have a slope coefficient β n_1 Different slope coefficients β n_2 .

[0076] In some embodiments, as Figure 2 As shown, the second axis L2 is located at the center of two adjacent bumps B in the first bump row R1 and the center of two adjacent bumps B in the first bump row R1, but the present invention is not limited thereto. Figure 3 . Figure 3 FIG2 is a plan view illustrating the configuration of bumps according to some embodiments of the present invention. Figure 3 As shown, the second axis L2 passes through the first and second ends of a bump B in the first bump row R1 and the first and second ends of a bump B in the second bump row R2.

[0077] In some embodiments, as Figure 2 As shown, the number of bumps B in the first bump row R1 is the same as the number of bumps B in the second bump row R2, but the present invention is not limited thereto. Figure 4 . Figure 4 FIG2 is a plan view illustrating the configuration of bumps according to some embodiments of the present invention. Figure 4 As shown, the number of bumps B in the first bump column R1 is different from the number of bumps B in the second bump column R2. Specifically, the bumps B in the second bump column R2 are arranged at opposite ends of the second bump column R2 except for the bump rows C.

[0078] Please refer to Figure 5 . Figure 5 FIG2 is a plan view illustrating the configuration of bumps according to some embodiments of the present invention. Figure 5 As shown, the bumps B in the first bump column R1 are aligned with Figure 2 The first axis coordinate of the center of the first end of the corresponding bump B in the second bump row R2 relative to the second axis L2 is (X B +S)(1+β B Y B ), where XB Y is the first axis coordinate of the center of the first end of the bump B in the corresponding bump row C and the first bump column R1 relative to the second axis L2, B is the second axis coordinate of the center of the first end of the bump B in the corresponding bump row C and in the second bump row R2 relative to the first axis L1, and β B S and S are the slope coefficient and displacement value of the corresponding bump B in the bump row C and in the second bump column R2, respectively.

[0079] like Figure 5 As shown, taking the n-th bump B in the first bump row R1 and the n-th bump B in the second bump row R2 arranged along the second axis L2 as an example, the center of the first end of the n-th bump B in the second bump row R2 relative to the first axis coordinate of the second axis L2 is X 3_n .X 3_n Equal to (X 1_n +S 1_n )(1+β n Y 3_n ), where X 1_n Y is the first axis coordinate of the center of the first end of the n-th bump B in the first bump row R1 relative to the second axis L2, 3_n is the second axis coordinate of the center of the first end of the n-th bump B in the second bump row R2 relative to the first axis L1, β n is the slope coefficient of the nth bump B in the first bump row R1, S 1_n is the offset value of the n-th bump B in the second bump row R2.

[0080] Furthermore, in some embodiments, the first axis coordinate of the center of the second end of the bump B in the corresponding one of the bump rows C relative to the second axis L2 is (X B +S)(1+β C Y C ), where Y C is the second axis coordinate of the center of the second end of the bump B in the corresponding bump row C and in the second bump column R2 relative to the first axis L1, and β C is the slope coefficient of the corresponding bump B in the bump row C and in the second bump column R2.

[0081] like Figure 5 As shown, taking the n-th bump B in the first bump row R1 and the n-th bump B in the second bump row R2 arranged along the second axis L2 as an example, the center of the second end of the n-th bump B in the second bump row R2 relative to the first axis coordinate of the second axis L2 is X 4_n .X 4_n Equal to (X 1_n +S 1_n)(1+β n Y 4_n ), where Y 4_n is the second axis coordinate of the center of the second end of the n-th bump B in the second bump row R2 relative to the first axis L1.

[0082] In some embodiments, the offset value of the bump B in one of the bump rows C and in the second bump column R2 is the same as the offset value of the bump B in the other of the bump rows C and in the second bump column R2, and this bump configuration can be made by Figure 5 Indicated.

[0083] In some embodiments, the corresponding bumps B in the first bump row R1 and the bumps B in the second bump row R2 have the same slope coefficient. Figure 5 As shown, the n-th bump B in the first bump column R1 and the n-th bump B in the second bump column R2 arranged from the second axis L2 have the same slope coefficient β n , but the present invention is not limited thereto.

[0084] In some embodiments, the corresponding bumps B in the first bump row R1 and the bumps B in the second bump row R2 have different slope coefficients. Figure 6 . Figure 6 FIG2 is a plan view illustrating the configuration of bumps according to some embodiments of the present invention. Figure 6 As shown, the first axis coordinate of the center of the first end of the n-th bump B in the first bump row R1 relative to the second axis L2 is X 1_n The first axis coordinate of the center of the second end of the nth bump B relative to the second axis L2 is X 2_n .X 2_n Equal to X 1_n (1+β n_1 Y 2_n ), where Y 2_n is the second axis coordinate of the center of the second end of the n-th bump B relative to the first axis L1, β n_1 is the slope coefficient of the n-th bump B in the first bump row R1. The first axis coordinate of the center of the first end of the n-th bump B in the second bump row R2 relative to the second axis L2 is X 3_n .X 3_n Equal to (X 1_n +S 1_n )(1+β n_ 2Y 3_n ), where Y 3_n is the second axis coordinate of the center of the first end of the n-th bump B in the second bump row R2 relative to the first axis L1, β n_2is the slope coefficient of the nth bump B in the second bump row R1, S 1_n is the offset value of the n-th bump B in the second bump row R2. The first axis coordinate of the center of the second end of the n-th bump B in the second bump row R2 relative to the second axis L2 is X 4_n .X 4_n Equal to (X 1_n +S 1_n )(1+β n_2 Y 4_n ), where Y 4_n is the second axis coordinate of the center of the second end of the nth bump B in the second bump row R2 relative to the first axis L1. It can be seen that the slope coefficient β of the bump B in the first bump row R1 is n_1 Different from the slope coefficient β of bump B in the second bump row R2 n_2 .

[0085] In some embodiments, the offset value of the bump B in one of the bump rows C and in the second bump column R2 is different from the offset value of the bump B in the other of the bump rows C and in the second bump column R2, and the bump configuration can be made by Figure 6 Indicated.

[0086] In some embodiments, any of the above-mentioned bump configurations may also include one or more additional bump columns in addition to the first bump column R1 and the second bump column R2, and the bumps B in the one or more additional bump columns may be flexibly arranged below the second bump column R2 according to any arrangement rules described in the above-mentioned embodiments.

[0087] In some embodiments, the joint portion 111 and the data driver integrated circuit IC include pads or bumps B that can be formed in the same bump configuration, and the joint portion 111 and the data driver integrated circuit IC can flexibly respond to deformation of the substrate 110 of the display panel 100. In some embodiments, the bumps B of the data driver integrated circuit IC can be coupled to the pads of the joint portion 111 via an anisotropic conductive film (ACF), thereby enabling electrical signals to be exchanged with each other. In response to expansion of the substrate 110, the bumps B of the data driver integrated circuit IC can be aligned with the pads of the joint portion 111 (which has deformed due to the expansion of the substrate 110) by moving the data driver integrated circuit IC downward in the Y direction (parallel to the second axis). As a result, the data driver integrated circuit IC can be aligned with the joint portion 111 and properly mounted on the substrate 110. On the other hand, in response to contraction of the substrate 110, the bumps B of the data driver integrated circuit IC can be aligned with the pads of the joint portion 111 (which has deformed due to the contraction of the substrate 110) by moving the data driver integrated circuit IC upward in the Y direction by a certain distance. Therefore, the data driver integrated circuit IC can be aligned with the joint portion 111 and can be properly mounted on the substrate 110. In order to facilitate the connection between the pad of the joint portion 111 and the bump B of the data driver integrated circuit IC, the pad of the joint portion 111 can be formed to have a shorter side and a longer longer side than the bump B of the data driver integrated circuit IC. That is, the size of the pad of the joint portion 111 can be larger than the size of the bump B of the data driver integrated circuit IC. The pad of the joint portion 111 can be formed to have a longer side than the bump B of the data driver integrated circuit IC to ensure the movement of the data driver integrated circuit IC in the Y direction.

[0088] From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that in the electronic device of the present invention, the inclination of the bump changes based on the first end of the bump relative to the reference line (i.e., the second axis). In this way, when a mismatch occurs between the bumps of two electronic devices to be joined, these bumps can flexibly respond to the deformation of the substrate of one of the electronic devices. Specifically, in response to the expansion of the substrate, by moving the other electronic device a certain distance along the reference line, as a result of the expansion, the bumps of the other electronic device can be aligned with the bumps on the deformed substrate. Thereby, the bonding reliability can be improved.

[0089] Although the present invention has been disclosed above in terms of embodiments, this is not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. An electronic device, characterized in that: Include: a substrate; and A plurality of first bumps are disposed on the substrate and arranged in a first bump row, each of the first bumps having a first end and a second end opposite to each other, the centers of the first ends of the first bumps being on a first axis, and the centers of the first ends of the first bumps being arranged at non-equidistant intervals. For each of the first protrusions, a center of the second end of a corresponding one of the first protrusions relative to a first axis perpendicular to the first axis is X. A (1+β A Y A ), where X A is a first axis coordinate of the center of the first end of the corresponding one of the first protrusions relative to the second axis, Y A is a second axis coordinate of the center of the second end of the corresponding one of the first protrusions relative to the first axis, and β A is a slope coefficient of the corresponding one of the first bumps.

2. The electronic device according to claim 1, wherein: The slope coefficient of one of the first bumps is the same as the slope coefficient of another of the first bumps.

3. The electronic device according to claim 1, wherein: The slope coefficient of one of the first bumps is different from the slope coefficient of another of the first bumps.

4. The electronic device according to claim 3, wherein: The slope coefficient of one of the first bumps is smaller than the slope coefficient of the other of the first bumps, and the one of the first bumps is closer to the second axis than the other of the first bumps.

5. The electronic device according to claim 3, wherein: The slope coefficients decrease as the first protrusions get closer to the second axis.

6. The electronic device according to claim 1, wherein: The farther the first protrusions are from the second axis, the more inclined they are relative to the second axis.

7. The electronic device according to claim 1, wherein: The second axis is located at the center of two adjacent first protrusions.

8. The electronic device according to claim 1, wherein: The second axis passes through the first end and the second end of one of the first protrusions.

9. The electronic device according to claim 1, wherein: The first protrusions are symmetrical with respect to the second axis.

10. The electronic device according to claim 1, wherein: The system further comprises a plurality of second bumps which are disposed on the substrate and arranged in a second bump row. At least a portion of the second bumps are aligned with the first bumps to form a plurality of bump rows.

11. The electronic device according to claim 10, wherein: Each of the second protrusions has a first end and a second end opposite to each other. A first axis coordinate of a center of the first end of the second protrusion in a corresponding one of the protrusion rows relative to the second axis is X B (1+β B Y B ), where X B is a first axis coordinate of the center of the first end of the first bump in the corresponding one of the bump rows relative to the second axis, Y B is a second axis coordinate of the center of the first end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β B is a slope coefficient of the first bump in the corresponding one of the bump rows.

12. The electronic device according to claim 11, wherein: A first axis coordinate of a center of the second end of the second protrusion in the corresponding one of the protrusion rows relative to the second axis is X B (1+β C Y C ), where Y C is a second axis coordinate of the center of the second end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β C is a slope coefficient of the second bump in the corresponding one of the bump rows.

13. The electronic device according to claim 11, wherein: The slope coefficients of the first bump and the second bump in the corresponding one of the bump rows are the same.

14. The electronic device according to claim 11, wherein: The slope coefficients of the first bump and the second bump in the corresponding one of the bump rows are different.

15. The electronic device according to claim 10, wherein: Each of the second protrusions has a first end and a second end opposite to each other. A first axis coordinate of a center of the first end of the second protrusion in a corresponding one of the protrusion rows relative to the second axis is (X B +S)(1+β B Y B ), where X B is a first axis coordinate of the center of the first end of the first bump in the corresponding one of the bump rows relative to the second axis, Y B is a second axis coordinate of the center of the first end of the second protrusion in the corresponding one of the protrusion rows relative to the first axis, and β B and S are respectively a slope coefficient and an offset value of the second bump in the corresponding one of the bump rows.

16. The electronic device according to claim 15, wherein: The offset value of the second bump in one of the bump rows is different from the offset value of the second bump in the other of the bump rows.

17. The electronic device according to claim 10, wherein: A quantity of the first bumps is different from a quantity of the second bumps.

18. The electronic device according to claim 17, wherein: The second bumps are arranged at two opposite ends of the second bump column outside the bump rows.

19. The electronic device according to claim 10, wherein: The second protrusions are symmetrical with respect to the second axis.

Images