Temperature pressure sensor assembly

By using the conductive part as an injection molding insert in the base, the problem of complex and costly sensor assembly is solved, achieving the effect of simplified assembly and improved detection accuracy.

CN113108828BActive Publication Date: 2025-11-18ZHEJIANG SANHUA INTELLIGENT CONTROLS CO LTD
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Patent Information

Application Number
CN202010446693.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-05-22
Publication Date
2025-11-18
Estimated Expiration
2040-05-22

AI Technical Summary

Technical Problem

In the existing technology, the assembly of temperature sensors and pressure sensors is complex and costly.

Method used

The base is injection molded with the conductive part as an injection insert, and the base covers part of the conductive part, which simplifies the assembly process, protects the conductive part, and improves the accuracy of testing.

Benefits of technology

This reduces assembly difficulty, improves the detection accuracy of temperature sensing elements, and lowers production costs.

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Abstract

The application provides a temperature pressure sensor assembly, which comprises a circuit module, a pressure sensing element, a base and a temperature sensing element. The base has a first surface and a second surface arranged oppositely, and is provided with a channel, a first port and a second port communicated with the channel, the first port is located on the second surface, and the second port is located on the first surface. The pressure sensing element has a third surface and a fourth surface arranged oppositely, and the third surface is arranged to face the first surface of the base. The circuit module is located on the side of the fourth surface of the pressure sensing element. The temperature sensing element comprises a conductive part and a head part connected with the conductive part and used for sensing the temperature of a fluid, and the head part is located on the side of the second surface of the base. The conductive part is electrically connected with the circuit module and the head part, wherein the base is injection molded with the conductive part as an injection molded insert, and the base covers at least part of the conductive part. The temperature pressure sensor assembly provided by the application is simple to assemble.
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Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a temperature and pressure sensor assembly. Background Technology

[0002] like Figure 1 As shown, the sensor assembly 100 in the related art includes a rectangular pressure sensor element 130, electronic circuitry 120, and a temperature sensor element 170. The sensor assembly 100 delivers fluid to the surface of the pressure sensor element 130 through an inlet opening 175 of an open, liquid-tight channel, and isolates the temperature sensor 170 and the wire 160 from the fluid through a closed, liquid-tight channel. The wire 160 extends within an elongated tubular element 165 and passes laterally through a hole in the base to connect to the circuit board 120.

[0003] In related technologies, the temperature sensor is placed inside a tubular element with its ends closed. The temperature sensor and its relatively slender leads need to be assembled into the tubular element 165, which involves a complex assembly process and high production costs. Summary of the Invention

[0004] This application provides a temperature and pressure sensor assembly with good detection performance, and a simple structure that is easy to assemble.

[0005] To achieve the above objectives, this application adopts the following technical solution: a temperature and pressure sensor assembly, comprising a circuit module, a pressure sensing element, a base, and a temperature sensing element. The base has a first surface and a second surface disposed opposite to each other. The base is provided with a channel and a first port and a second port communicating with the channel. The first port is located on the second surface, and the second port is located on the first surface. The pressure sensing element has a third surface and a fourth surface disposed opposite to each other. The third surface faces the first surface of the base, and at least a portion of the third surface forms a pressure sensing area for contact with a fluid. The circuit module is located on the side where the fourth surface of the pressure sensing element is located, and the circuit module is electrically connected to the pressure sensing element. The temperature sensing element includes a conductive part and a head connected to the conductive part for detecting the fluid temperature. The head is located on the side where the second surface of the base is located. The conductive part is electrically connected to the circuit module and the head. The base is injection molded with the conductive part as an injection molding insert, and the base covers at least a portion of the conductive part.

[0006] The temperature and pressure sensor assembly provided in this application has a base injection molded with the conductive part as an injection molding insert, and the base covers at least a portion of the conductive part. This helps to protect the conductive part, increase the accuracy of temperature sensing element detection, and reduce the assembly difficulty of the temperature and pressure sensor assembly, resulting in a simple overall product structure. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the structure of a temperature and pressure sensor assembly in related technologies;

[0008] Figure 2 This is a diagram illustrating the usage status of the temperature and pressure sensor assembly of this application in a pipeline.

[0009] Figure 3 This is a three-dimensional assembly diagram of the temperature and pressure sensor components of this application;

[0010] Figure 4 This is an exploded perspective view of the temperature and pressure sensor assembly of this application;

[0011] Figure 5 This is an exploded perspective view of the temperature and pressure sensor assembly of this application from another angle;

[0012] Figure 6 This is a perspective view of the base in the temperature and pressure sensor assembly of this application;

[0013] Figure 7 for Figure 6 Top view;

[0014] Figure 8 for Figure 6 A bottom view;

[0015] Figure 9 For along Figure 8 A cross-sectional view along line AA.

[0016] Figure 10 For the temperature and pressure sensor assembly of this application along Figure 8 A cross-sectional view along line AA.

[0017] Figure 11 This diagram shows the connection status of the metal connector between the circuit module and the temperature sensing element.

[0018] Figure 12 for Figure 11 The main view;

[0019] Figure 13 for Figure 1 The main view;

[0020] Figure 14 For along Figure 13 A cross-sectional view along the BB line;

[0021] Figure 15 for Figure 14 Enlarged view of part of the image;

[0022] Figure 16 for Figure 1 Side view;

[0023] Figure 17 For along Figure 16 A cross-sectional view along the CC line;

[0024] Figure 18 This is a perspective cross-sectional view of the temperature and pressure sensor assembly of this application;

[0025] Figure 19 This is another perspective cross-sectional view of the temperature and pressure sensor assembly of this application. Detailed Implementation

[0026] Please refer to Figures 2 to 19 The temperature and pressure sensor assembly 100 provided in this application can be installed in various valves, such as in the electronic expansion valve of a thermal management system, to detect the pressure and temperature parameters of the refrigerant. It can also be installed in some pipelines to detect the pressure and temperature parameters of the fluid.

[0027] Please refer to Figure 2 The temperature and pressure sensor assembly 100 is disposed on the wall of the pipe 200, the pipe 200 having a direction for fluid to flow in a first direction (i.e., Figure 14 The diagram shows a closed, liquid-tight channel 201 for transverse flow. The temperature and pressure sensor assembly 100 of this application includes a circuit module 2, a pressure sensing element 4, a base 5, and a temperature sensing element 6. The base 5 has a first surface 501 and a second surface 502 arranged opposite to each other. The base 5 is provided with a channel 7, a first port 71 located on the second surface 502, and a second port 72 located on the first surface 501. Both the first port 71 and the second port 72 are connected to the channel 7. The first port 71 can serve as a fluid inlet, and the second port 72 can serve as a fluid outlet. That is, fluid can be guided from the first port 71 to the second port 72, making it easier for the fluid to reach the pressure sensing element 4 for pressure detection. The number of channels 7 can be one, two, or more, and correspondingly, the first port 71 and the second port 72 connected to the channels 7 can also appear in pairs.

[0028] The pressure sensing element 4 has a third surface 41 and a fourth surface 42 disposed opposite to each other. The third surface 41 faces the first surface 501 of the base 5, and at least a portion of the third surface 41 forms a pressure sensing area 40 for contact with the fluid. The circuit module 2 is located on the side where the fourth surface 42 of the pressure sensing element 4 is located and is electrically connected to the pressure sensing element 4. The pressure sensing element 4 senses the fluid pressure through the pressure sensing area 40, and the pressure signal can be converted into an electrical signal by the circuit module 2 and then transmitted to an external receiving unit. The temperature sensing element 6 includes a conductive part and a head 61 connected to the conductive part for sensing the fluid temperature. The head 61 is located on the side where the second surface 502 of the base 5 is located.

[0029] The conductive part passes through the base 5 and connects to the circuit module 2. The conductive part is electrically connected to the circuit module 2 and the head 61. The base 5 is injection molded with the conductive part as an injection molding insert, and the base 5 covers at least a portion of the conductive part, thus tightly encasing at least a portion of the conductive part. The portion of the conductive part encased by the base 5 is in direct contact with the base 5. In a specific embodiment, the base 5 is formed by injection molding using the conductive part as an injection molding insert, achieving at least a portion of the conductive part being encased by the base 5. The integrated structure formed by the conductive part and the base helps protect the conductive part from direct contact with the fluid, thus making it more corrosion-resistant and less prone to deformation, which helps increase the accuracy of temperature sensing element detection.

[0030] In some embodiments, the head 61 of the temperature sensing element 6 can be exposed to the environment, allowing direct contact with the fluid. In other embodiments, the head 61, like the conductive part, can be an injection-molded insert, with the head 61 partially or completely encased in a base. The base 5 can be an insulating material with good thermal conductivity, allowing the fluid temperature to be transferred to the head 61 via the base. In some other embodiments, the head 61 can also be enclosed in other components, thus protecting the head 61. In practice, the head 61 can be a pre-encapsulated thermistor with an outer resin-based composite material that possesses a certain degree of corrosion resistance. Therefore, the head 61 can directly contact the fluid, thereby shortening the temperature detection response time and improving the sensitivity of temperature signal detection.

[0031] Please refer to Figure 11 and Figure 12 The conductive part includes a metal connector 8 and a pin 62 integrally extending from the head 61. The metal connector 8 includes a first portion 81 for connecting to the pin 62, a second portion 82 for connecting to the circuit module 2, and a third portion 83 connecting the first portion 81 and the second portion 82. The third portion 83 is enclosed in the base 5 and embedded within the base 5, while the first portion 81 and the second portion 82 are exposed outside the base 5. At least a portion of the first portion 81 is soldered to the pin 62. At least a portion of the second portion 82 is soldered to the circuit module 2.

[0032] In some embodiments, the first part 81 and the pin 62 are coated with an anti-corrosion coating, so that the first part 81 and the pin 62 exposed outside the base 5 are not easily corroded, and the stability of the product and the accuracy of temperature signal detection are not easily affected.

[0033] Please refer to Figures 4 to 10The base 5 includes a second end 52, which includes a laterally extending flat bottom 521 and a longitudinally extending annular wall 522 extending from the outer edge of the flat bottom 521. The flat bottom 521 and the annular wall 522 enclose a receiving space 520, in which the pressure sensing element 4 is at least partially received. The channel 7 is located on the flat bottom 521. The second end 52 serves to form a pressure chamber between the base 5 and the pressure sensing element 4 after the fluid passes through the channel 7, and also provides containment and protection for the pressure sensing element 4. The pressure sensing element 4 can be fixed in the receiving space 520 of the base 4 by means of circumferential sealing or bottom sealing.

[0034] Please refer to Figure 11 , Figure 12 and Figure 15 The third part 83 includes a laterally extending middle section 831 and a first section 832 and a second section 833 formed by bending from both ends of the middle section 831. The first section 832 extends longitudinally and connects to the first part 81, and the second section 833 extends longitudinally and connects to the second part 82. The first part 81 is exposed at the bottom of the plate, and the second part 82 is exposed at the annular wall 522. This structural arrangement of the metal connector 8 ensures that the metal connector 8 bypasses the pressure sensing element 4, thereby avoiding interference with the sensitive area 40 of the pressure sensing element 4, ensuring the accuracy of the pressure sensing element 4. It also facilitates the overall miniaturization of the product.

[0035] Please refer to Figures 4 to 10 The base 5 includes a first end 51, which includes a first arcuate wall 511 and a second arcuate wall 512 spaced apart from each other and facing each other. The first arcuate wall 511 and the second arcuate wall 512 are located on the other side of the bottom 521 of the plate away from the annular wall 52. The first part 81 and the pin 62 are surrounded by the first arcuate wall 511 and the second arcuate wall 512, so that the first end 51 has a protective function for the first part 81 and the pin 62.

[0036] The first surface 501 is the surface of the bottom 521 of the flat plate facing the receiving space 520, and the second surface 502 is the surface surrounded by the first arc-shaped wall 511 and the second arc-shaped wall 512.

[0037] The maximum distance between the first arc-shaped wall 511 and the second arc-shaped wall 512 is less than the maximum radial distance of the annular wall 522. The lateral dimension of the first end 51 is smaller than the lateral dimension of the second end 52 because the temperature sensing element 6 is arranged in the longitudinal direction of the channel 7, while the pressure sensing element 4 is arranged in the lateral direction facing the channel 7.

[0038] Please refer to Figure 4 , Figure 5 , Figure 10 andFigure 15 The temperature and pressure sensor assembly 100 of this application includes a housing 9 fitted over a base 5. The housing 9 includes a laterally extending support platform 90, a longitudinally extending sidewall 91, and a protrusion 92 bent from the inner top edge of the sidewall 91. In some embodiments, the housing 9 also includes a protective cover 93 extending longitudinally from the side of the support platform 90 opposite to the sidewall 91. The protective cover 93 may be located around the first end 51 of the base 5, thereby protecting the base 5 and its internal components. The head 61 of the temperature sensor 6 may be partially or entirely located outside the protective cover 93, or entirely located inside the protective cover 93; this application does not limit this. The housing 9 is made of metal; the purpose of using metal is to facilitate the processing of the flange to form the protrusion 92, reducing the molding difficulty. Please refer to... Figure 14 and Figure 17 In some embodiments of this application, the temperature sensing element 6 extends beyond the housing 9 by a certain length and is exposed within the closed liquid-tight channel 201, i.e., a portion of the head 61 extends beyond the protective cover 93. This allows the temperature sensing element 6 to sense temperature more promptly and fully. In other embodiments, the temperature sensing element 6 may also be shorter than the housing 9. Since the fluid passes through the channel 7 to reach the pressure sensing element 4 and senses pressure changes, even if the temperature sensing element 6 is shorter than the housing 9, it can still sense the fluid temperature signal before the pressure sensing element 4 senses the pressure signal.

[0039] Please refer to Figure 14 A first sealing element 31 is provided between the pressure sensing element 4 and the base 5, and a second sealing element 32 is provided between the base 5 and the housing 9. In specific implementation, the temperature and pressure sensor assembly 100 is installed on the wall of the pipe 200, and a third sealing element 33 is provided between the housing 9 and the pipe wall of the pipe 200. That is, at the opening in the pipe wall used to install the temperature and pressure sensor assembly 100, the third sealing element 33 seals the space between the housing 9 and the pipe wall, thus forming a closed liquid-tight channel 201 in the pipe 200 that allows lateral fluid flow. Through the first sealing element 31 between the pressure sensing element 4 and the base 5, and the second sealing element 32 between the base 5 and the housing 9, the chamber formed by this temperature and pressure sensor assembly for detecting fluid temperature and pressure is also a closed chamber that allows longitudinal fluid flow. Please refer to [reference needed]. Figure 4 , Figure 10 and Figure 15The temperature and pressure sensor assembly 100 of this application also includes a cover 1 for shielding the circuit module 2. The cover 1 includes a main body 11 and a protrusion 12 formed on the periphery of the main body 11. The specific assembly and forming process between the cover 1, the base 5, and the housing 9 is as follows: the protrusion 92 first extends longitudinally in the same vertical state as the side wall 91. After the protrusion 12 of the cover 1 and the annular wall 522 of the base 5 are at least partially aligned and joined in the longitudinal direction, it is inserted into the cylindrical space enclosed by the side wall 91. At this time, the vertical protrusion 92 is pressed inward by a tool to form a flanged, transverse protrusion 92. Therefore, the protrusion 12 and the annular wall 522 are clamped and positioned between the support platform 90 and the protrusion 92, so the cover 1 can be stably installed relative to the base 5 and the housing 9 without falling off.

[0040] Please refer to Figure 4 , Figures 10 to 12 The circuit module 2 includes a first substrate 21, a plurality of electronic components 22 mounted on the first substrate 21, a second substrate 23 connected to the first substrate 21 via a flexible circuit board, and a plurality of electronic components 22 mounted on the second substrate 23. The first substrate 21 and the second substrate 23 are arranged opposite to each other and spaced apart.

[0041] Circuit module 2 processes the pressure signal sensed by pressure sensing element 4 and the temperature signal sensed by temperature sensing element 6 according to a certain logic algorithm, converting the collected temperature and pressure signals into corresponding voltage values. Since circuit module 2 is protected inside cover 1, in order to transmit the temperature and voltage values ​​to the outside, the temperature and pressure sensor assembly 100 of this application also includes several metal plates 10 embedded in cover 1. The metal plates 10 have an outer end 101 exposed on the outside of cover 1 and an inner end 102 exposed on the inside of cover 1. First substrate 21 is fixed to the fourth surface 42 of pressure sensing element 4 and connected to the conductive part. Specifically, the first substrate 21 is connected to the second part 82 of metal connector 8. Several pins extend from the fourth surface 42 of pressure sensing element 4. Several small holes are provided on the first substrate 21, through which the pins pass. The pins are then fixed by spot welding, and the first substrate 21 and pressure sensing element 4 are fixed together. The second substrate 23 is connected to the inner end 102. Specifically, each metal sheet 10 has a pointed tip protruding from the inside of the cover 1. The second substrate 23 has a corresponding small hole, and the pointed tip passes through the hole of the second substrate 23. The pointed tip is then fixed by spot welding, and the second substrate 23 is fixed on the cover 1.

[0042] In other embodiments of this application, the temperature and pressure sensor assembly 100 further includes a metal post 13 embedded in the cover 1. The metal post 13 can be used to connect to the grounding terminal of an external circuit board, thereby protecting the circuit module 2 and achieving the function of grounding to prevent circuit board breakdown.

[0043] The head 61 of the temperature sensing element 6 in this application can be encapsulated with a corrosion-resistant material. The conductive part of the temperature sensing element 6 is seamlessly embedded into the base 5 through an injection molding process, which helps to protect the conductive part from corrosion. In some embodiments, the temperature sensing element 6 can be located directly below the pressure sensing element 4, which helps to achieve a compact and miniaturized product structure, thus ensuring product consistency.

[0044] The above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. The understanding of this specification should be based on those skilled in the art. For example, the directional descriptions such as "front", "back", "left", "right", "up", and "down" are important. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.

Claims

1. A temperature and pressure sensor assembly (100), characterized in that: The device includes a circuit module (2), a pressure sensing element (4), a base (5), and a temperature sensing element (6). The base (5) has a first surface (501) and a second surface (502) arranged opposite to each other. The base (5) is provided with a channel (7) and a first port (71) and a second port (72) communicating with the channel (7). The first port (71) is located on the second surface (502), and the second port (72) is located on the first surface (501). The pressure sensing element (4) has a third surface (41) and a fourth surface (42) arranged opposite to each other. The third surface (41) is disposed facing the first surface (501) of the base (5). At least a portion of the area forms a pressure sensing area (40) for contact with the fluid. The circuit module (2) is located on the side of the fourth surface (42) of the pressure sensing element (4), and the circuit module (2) is electrically connected to the pressure sensing element (4). The temperature sensing element (6) includes a conductive part and a head (61) connected to the conductive part and used for sensing the fluid temperature. The head (61) is located on the side of the second surface (502) of the base (5). The conductive part is electrically connected to the circuit module (2) and the head (61). The base (5) is injection molded with the conductive part as an injection molding insert, and the base (5) covers at least a portion of the conductive part. The device includes a laterally extending plate bottom (521) and a longitudinally extending annular wall (522) from the outer edge of the plate bottom (521). The conductive part includes a metal connector (8) and pins (62) integrally extending from the head (61). The metal connector (8) includes a first portion (81) exposed on the plate bottom (521), a second portion (82) exposed on the annular wall (522), and a third portion (83) integrally connected between the first portion (81) and the second portion (82). The third portion (83) includes a middle section (831) extending laterally and a first section (832) formed by bending from both ends of the middle section (831). The first segment (832) extends in the longitudinal direction and is integrally connected with the first part (81), the second segment (833) extends in the longitudinal direction and is integrally connected with the second part (82), the first part (81) is welded and fixed to the pin (62), the second part (82) is welded and fixed to the circuit module (2), and the third part (83) is embedded in the base (5); the circuit module (2) includes a first substrate (21), the first substrate (21) is fixed to the fourth surface (42) of the pressure sensing element (4), and the first substrate (21) of the circuit module (2) is connected to the second part (82) of the metal connector (8).

2. The temperature and pressure sensor assembly (100) according to claim 1, characterized in that: The head (61) is exposed to the environment to come into contact with fluid, and the first part (81) and the second part (82) are exposed outside the base (5).

3. The temperature and pressure sensor assembly (100) according to claim 2, characterized in that: The first part (81) and the pin (62) are both coated with an anti-corrosion coating.

4. The temperature and pressure sensor assembly (100) according to claim 2, characterized in that: The bottom (521) of the plate and the annular wall (522) enclose a receiving space (520), the pressure sensing element (4) is at least partially received in the receiving space (520), the channel (7) is provided at the bottom (521) of the plate, and the first surface (501) is the surface of the bottom (521) of the plate facing the receiving space (520).

5. The temperature and pressure sensor assembly (100) according to claim 4, characterized in that: The base (5) includes a first end (51), which includes a first arcuate wall (511) and a second arcuate wall (512) spaced apart from each other and facing each other. The first arcuate wall (511) and the second arcuate wall (512) are located on the other side of the bottom of the plate (521) away from the annular wall (52). At least a portion of the first part (81) and the pin (62) are surrounded by the first arcuate wall (511) and the second arcuate wall (512). The second surface (502) is a surface surrounded by the first arcuate wall (511) and the second arcuate wall (512).

6. The temperature and pressure sensor assembly (100) according to claim 5, characterized in that: The maximum distance between the first arc-shaped wall (511) and the second arc-shaped wall (512) is less than the maximum radial distance of the annular wall (522).

7. The temperature and pressure sensor assembly (100) according to claim 4, characterized in that: The temperature and pressure sensor assembly (100) also includes a housing (9) sleeved outside the base (5), a first sealing element (31) is provided between the pressure sensing element (4) and the base (5), and a second sealing element (32) is provided between the base (5) and the housing (9).

8. The temperature and pressure sensor assembly (100) according to claim 7, characterized in that: The temperature and pressure sensor assembly (100) further includes a cover (1) for shielding the circuit module (2) and a plurality of metal sheets (10) embedded in the cover (1). The metal sheets (10) have an outer end (101) exposed to the outside of the cover (1) and an inner end (102) exposed to the inside of the cover (1). The circuit module (2) further includes a second substrate (23) connected to the first substrate (21) via a flexible circuit board. The first substrate (21) and the second substrate (23) are disposed opposite each other in at least a portion of their areas. The circuit module (2) further includes a plurality of electronic components (22) distributed on the first substrate (21) and the second substrate (23). The second substrate (23) is fixed to the inside of the cover (1). The inner end (102) of the metal sheet (10) is electrically connected to the second substrate (23).

9. The temperature and pressure sensor assembly (100) according to claim 8, characterized in that: The cover (1) includes a main body (11) and a protrusion (12) formed on the periphery of the main body (11). The shell (9) includes a laterally extending support platform (90), a longitudinally extending sidewall (91), and a protrusion (92) bent inward from the top inner edge of the sidewall (91). The protrusion (12) and the annular wall (522) are at least partially aligned in the longitudinal direction, and the protrusion (12) and the annular wall (522) are together clamped and positioned between the support platform (90) and the protrusion (92).

Citation Information

Patent Citations

  • Temperature and pressure sensor assembly

    CN212363278U