An infrared detector assembly signal transmission device and method

Abstract

The present application belongs to the technical field of infrared camera data acquisition and imaging detection, and discloses an infrared detector assembly signal transmission device and method, which comprises a signal transmission module, a first interface protection module, a second interface protection module and an information acquisition circuit module. The infrared detector assembly signal transmission device is used for acquiring the output signal of a large-scale detector in an infrared camera, can conveniently realize the acquisition of a low-noise signal of an imaging camera based on a large-scale infrared detector, and improves the signal integrity. The present application has high integration, is convenient to install, test and maintain, has good signal integrity, realizes low-noise signal transmission, and reduces the system base noise of a large field of view infrared camera to 0.3 mV, about 60% lower than before application, and reduces the weight by 60% compared with the traditional shielding transmission method of a lead extension line.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of infrared camera data acquisition and imaging detection, and particularly relates to an infrared detector assembly signal transmission device and method. BACKGROUND

[0002] At present, using a large field of view infrared camera for imaging detection on the ground is a hot spot in the current remote sensing imaging field. The commonly used detection scheme is to mount the infrared camera on a flying vehicle (satellite, airplane, etc.) for ground observation, or to use the infrared camera for air detection from the ground to realize ground observation through high-resolution imaging.

[0003] With the development of remote sensing imaging technology, the spatial resolution and time resolution of imaging are increasingly required, which requires further increase in the scale of the detector and further improvement in the frame frequency of imaging, and the readout frequency and tap number of the signal output of the detector Dewar assembly are also improved, which means that the rate of signal acquisition is sharply increased.

[0004] For an infrared camera using a large-scale infrared detector, since the output signal of the detector assembly is an analog signal and the number of taps for transmission is large, it is difficult to improve the integration on the output interface. The traditional method is to lead out hundreds of terminal posts on the Dewar interface, and then transmit the signals through external dispersed leads. However, the existing method ignores the characteristics of the structure of the infrared camera detector assembly, and directly leads out the signals for transmission. The signals transmitted include the multi-channel analog signals output by the detector, the detector driving signals, the detector power supply and bias, etc., resulting in a large number of leads, complex signals, serious signal crosstalk and difficult electromagnetic compatibility. On the other hand, since the infrared detector interface space is often small, electronic assembly and connection are difficult, testing is difficult, troubleshooting is difficult, and fault repair is difficult. Therefore, a new infrared detector assembly signal transmission method is urgently needed.

[0005] Through the above analysis, the problems and defects of the prior art are as follows:

[0006] (1) For an infrared camera using a large-scale infrared detector, since the output signal of the detector assembly is an analog signal and the number of taps for transmission is large, it is difficult to improve the integration on the output interface.

[0007] (2) The existing method ignores the characteristics of the structure of the infrared camera detector assembly, and directly leads out the signals for transmission. The signals transmitted include the multi-channel analog signals output by the detector, the detector driving signals, the detector power supply and bias, etc., resulting in a large number of leads, complex signals, serious signal crosstalk and difficult electromagnetic compatibility.

[0008] (2) The existing method ignores the characteristics of the structure of the infrared camera detector assembly, and directly leads out the signals for transmission. The signals transmitted include the multi-channel analog signals output by the detector, the detector driving signals, the detector power supply and bias, etc., resulting in a large number of leads, complex signals, serious signal crosstalk and difficult electromagnetic compatibility.

[0009] (3) Due to the small space of the infrared detector interface, electronic assembly is difficult, testing is difficult, troubleshooting is difficult, and fault repair is difficult.

[0010] The difficulty of solving the above problems and defects is: the infrared imaging system based on large-scale detectors is often applied in the field of aerospace, the space resource is limited, the detector and the optical system are often small in assembly space, it is difficult to place the signal acquisition circuit nearby, a long lead-out line is needed, the long lead-out line is not only heavy, difficult to maintain and test, but also leads to poor transmission quality of the analog signal output by the detector, serious crosstalk, thereby degrading the system performance, in addition, the end lead-out line of the detector assembly does not have a fixed carrier for bearing power supply and bias voltage filtering circuit, which will seriously affect the signal-to-noise ratio of the detector assembly, and generally, the signal-to-noise ratio is one of the core indicators of the detector assembly.

[0011] The significance of solving the above problems and defects is: after adopting the signal transmission device, the signal-to-noise ratio of the detector assembly of the infrared imaging system based on large-scale detectors will be obviously improved, the interface integration will be greatly improved, the signal integrity will be optimized, the maintenance and testing will be more convenient and fast, and the consistency between multiple sets of the same type of infrared detector assembly signal transmission devices will be better. SUMMARY

[0012] In view of the problems existing in the prior art, the present application provides an infrared detector assembly signal transmission device and method.

[0013] The present application is implemented as follows: an infrared detector assembly signal transmission device, the infrared detector assembly signal transmission device comprises: a signal transmission module, a first interface protection module, a second interface protection module and an information acquisition circuit module.

[0014] The signal transmission module is used for realizing the electrical connection between the detector assembly and the information acquisition circuit, one end of the signal transmission module is connected to the electrical signal interface of the detector assembly, and the other end of the signal transmission module is connected to the information acquisition circuit module.

[0015] The first interface protection module is used for the electromagnetic shielding and mechanical fixing of the signal transmission module at the detector assembly end.

[0016] The second interface protection module is used for the electromagnetic shielding and mechanical fixing of the signal transmission module at the information acquisition circuit end.

[0017] The information acquisition circuit module is used for providing the power supply, bias voltage and driving signal required by the detector assembly, filtering, isolation, impedance matching and analog-digital conversion processing of the analog signal output by the detector.

[0018] Further, the first interface protection module is connected with the signal transmission module through a line, the signal transmission module is connected with the second interface protection module through a line, and the second interface protection module is connected with the signal acquisition circuit module through a line.

[0019] Further, the signal transmission module comprises a plurality of layers of rigid-flex printed circuit boards stacked up and down, a connector at the end of the detector assembly, a connector at the end of the information acquisition circuit, a detector power supply and bias voltage filter circuit.

[0020] Further, the plurality of layers of rigid-flex printed circuit boards only have rigid circuit boards at the two ends of the interface, and the middle part is a flexible circuit board; the flexible circuit board is divided into two pieces stacked up and down, and has four layers; the first layer and the fourth layer are large-area ground layers, which are used for shielding and reducing ground impedance; the second layer and the third layer are wiring layers, which are used for transmission of detector driving signals, detector power supply and bias voltage, and detector output analog signals; when wiring, the bias voltage and the detector output analog signals are isolated from the detector driving signals and the power supply circuit through partition wiring and ground lines; the detector output analog signals are isolated from each other through ground lines, and the analog signals between the second layer and the third layer are staggered.

[0021] Further, the detector power supply and bias voltage filter circuit is a decoupling filter circuit composed of a 220 mu F tantalum capacitor and a 0.1 mu F ceramic capacitor in parallel.

[0022] Further, the first interface protection module comprises two split aluminum alloy adapter mounting covers, which are provided with mounting screw holes and two latch positioning holes; the two mounting covers cover the connector at the end of the rigid-flex printed circuit board and the detector assembly, are buckled and mounted, and are fastened through screws; the first interface protection module is mounted on the detector assembly through the positioning latch, so that the lead pins of the detector assembly are tightly connected with the information transmission module, and then the installation of the first interface protection module is completed through screw fastening.

[0023] Further, the second interface protection module comprises two split aluminum alloy adapter mounting covers, which are provided with mounting screw holes and two latch positioning holes; the two mounting covers cover the connector at the end of the rigid-flex printed circuit board and the information acquisition circuit, are buckled and mounted, and are fastened through screws; the second interface protection module is mounted on the information acquisition circuit module structure through the positioning latch, so that the lead pins of the information transmission module connector are tightly connected with the information acquisition circuit module, and then the installation of the second interface protection module is completed through screw fastening.

[0024] Further, the information acquisition circuit module comprises a signal filtering, isolation, impedance matching and analog-digital conversion circuit, a detector power supply and bias voltage circuit, and a detector timing drive circuit.

[0025] Further, the filter circuit is a first-order RC low-pass filter circuit; the isolation and impedance matching circuit is a follower array built by a high-bandwidth high-impedance operational amplifier, realizing impedance transformation and signal isolation; the analog-digital conversion circuit is realized by a high-speed analog-digital conversion chip; the detector power supply and bias voltage circuit is realized by an LDO with low noise and small ripple; and the detector timing driving circuit is generated by an FPGA and output by a driving chip.

[0026] Another object of the present application is to provide an infrared detector assembly signal transmission method using the infrared detector assembly signal transmission device, which comprises the following steps:

[0027] Step one, install the information transmission module, install the detector assembly end connector and the information acquisition circuit end connector on the upper and lower stacked multi-layer rigid-flex printed circuit board, and install the detector power supply and bias voltage filter circuit on the rigid circuit board at the detector assembly end of the rigid-flex board;

[0028] Step two, connect the first interface protection module with the information transmission module, cover the rigid circuit board of the aforementioned rigid-flex printed circuit board and the connector connected with the detector assembly end with two split aluminum alloy adaptive mounting covers, set screw holes on the aluminum alloy adaptive mounting cover, and set through holes on the rigid circuit board, and fasten by screw;

[0029] Step three, install the first interface protection module on the detector assembly by positioning the latch, tightly connect the lead pins of the detector assembly with the information transmission module, and then fasten the first interface protection module and the detector assembly by screw, to complete the installation of the first interface protection module;

[0030] Step four, connect the second interface protection module with the information transmission module, cover the aforementioned rigid-flex printed circuit board and the connector at the information acquisition circuit end with two split aluminum alloy adaptive mounting covers, and fasten by screw;

[0031] Step five, install the signal isolation circuit and the analog-digital conversion circuit on the information acquisition circuit board, install the RC filter and the follower array, realize impedance transformation and signal isolation, and complete the analog-digital conversion of the analog signal;

[0032] Step six, install the second interface protection module on the information acquisition circuit by positioning the latch, tightly connect the lead pins of the signal transmission module with the information acquisition circuit module, and then fasten by screw, to complete the installation of the second interface protection module;

[0033] Step seven, the information acquisition circuit module is powered on, outputs the detector timing drive, the detector power supply voltage and the bias voltage, filters, isolates and analog-digital converts the received detector signal.

[0034] In combination with all the technical solutions described above, the infrared detector assembly signal transmission device provided by the present application has the advantages and positive effects that: the infrared detector assembly signal transmission device provided by the present application is used for acquiring the output signal of a large-scale detector in an infrared camera, can conveniently realize the acquisition of a low-noise signal of an imaging camera based on a large-scale infrared detector, and improves the signal integrity. The present application has high integration, is convenient to install, test and maintain, has good signal integrity, realizes low-noise transmission of the signal, and the system base noise of a large field of view infrared camera using the device is reduced to 0.3 mV, which is about 60% lower than before the application, and the weight is about 60% lower than the traditional method of shielding transmission by using a lead extension line. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creating any creative labor on the basis of these drawings.

[0036] Figure 1 is a flow chart of the infrared detector assembly signal transmission method provided by the embodiments of the present application.

[0037] Figure 2 is a structural schematic diagram of the infrared detector assembly signal transmission device provided by the embodiments of the present application.

[0038] In the figure: 2-1, first interface protection module; 2-2, detector assembly end connector; 2-3, power supply and bias voltage filtering circuit; 2-4, multi-layer rigid-flexible combination board; 2-5, information acquisition circuit end connector; 2-6, second interface protection module; 2-7, signal isolation circuit; 2-8, information acquisition module. Among them, 2-2, 2-3, 2-4, 2-5 constitute a signal transmission module.

[0039] Figure 3 is a structural diagram of the information transmission module provided by the embodiments of the present application.

[0040] In the figure: 3-1, hard board area of the rigid-flexible combination board at the detector assembly end; 3-2, power supply and bias voltage filtering circuit; 3-3, detector assembly end connector; 3-4, information acquisition end connector; 3-5, hard board area of the rigid-flexible combination board at the information acquisition end; 36, flexible board area of the rigid-flexible combination board, the flexible board is an even number of layers of PCB with more than 2 layers, the top layer and the bottom layer are designed as analog ground signal layers, and the inner layer signals are shielded electromagnetically.

[0041] Figure 4 is the first interface protection module structure diagram provided by the embodiment of the application;

[0042] In the figure: 4-1, the upper protection cover of the two-piece split type aluminum alloy adaptive installation cover, with a plug hole; 4-2, the positioning plug; 4-3, the lower protection cover of the two-piece split type aluminum alloy adaptive installation cover; 4-4, the hard plate area of the rigid-flexible combination plate at the detector assembly end; 4-5, the connector at the detector assembly end; 4-6, fastener A, 5 M2.5*6 screws, used for fastening 4-3 and 4-4; 4-7, fastener B, 4 M3*10 screws, used for fastening 4-1, 4-3 and 4-8; 4-8, the detector assembly shell.

[0043] Figure 5 is the first interface protection module installation cross-sectional view provided by the embodiment of the application;

[0044] In the figure: 5-1, the upper protection cover of the two-piece split type aluminum alloy adaptive installation cover, with a plug hole; 5-2, the positioning plug; 5-3, the lower protection cover of the two-piece split type aluminum alloy adaptive installation cover; 5-4, the hard plate area of the rigid-flexible combination plate at the detector assembly end; 5-5, the connector at the detector assembly end; 5-6, the flexible plate outlet of the rigid-flexible combination plate, with a 1mm deep groove opening on the upper and lower cover plates; 5-7, the detector assembly shell; 5-8, fastener A, 5 M2.5*6 screws, used for fastening 5-3 and 5-4.

[0045] Figure 6 is the second interface protection module structure diagram provided by the embodiment of the application;

[0046] In the figure: 6-1, the upper protection cover of the two-piece split type aluminum alloy adaptive installation cover, with a plug hole; 6-2, the positioning plug; 6-3, the lower protection cover of the two-piece split type aluminum alloy adaptive installation cover; 6-4, the hard plate area of the rigid-flexible combination plate at the information acquisition module end; 6-5, the connector at the information acquisition module end; 6-6, fastener A, 5 M2.5*6 screws, used for fastening 6-3 and 6-4; 6-7, the information acquisition module structure; 6-8, the information acquisition module circuit board; 6-9, fastener B, 4 M3*10 screws, used for fastening 6-1, 6-3 and 6-7.

[0047] Figure 7 is the second interface protection module installation cross-sectional view provided by the embodiment of the application;

[0048] In the figure: 7-1, the upper protective cover of the two-piece split type aluminum alloy adaptive installation cover, with a latch hole; 7-2, the positioning latch; 7-3, the lower protective cover of the two-piece split type aluminum alloy adaptive installation cover; 7-4, the hard plate area of the rigid-flexible combination plate at the information acquisition module end; 7-5, the information acquisition module end connector; 7-6, the flexible plate outlet of the rigid-flexible combination plate, each of the upper and lower cover plates has a 1mm deep groove opening; 7-7, the information acquisition module structure; 7-8, the information acquisition module circuit board; 7-9, fastener A, 5 M2.5x6 screws, used for fastening 7-3 and 7-4.

[0049] Figure 8 is the information acquisition circuit module block diagram provided by the embodiment of the present application;

[0050] In the figure: 8-1, the detector output analog signal filtering circuit; 8-2, the detector output signal isolation and impedance matching circuit; 8-3, the analog-digital conversion circuit; 8-4, the detector timing drive circuit; 8-5, the detector power supply and bias voltage circuit; 8-6, the connector at the information acquisition circuit end.

[0051] Figure 9 is the circuit diagram of the infrared detector assembly signal transmission device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical scheme and advantages of the present application clearer and more apparent, the present application will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0053] In view of the problems existing in the prior art, the present application provides an infrared detector assembly signal transmission device, a computer program and a medium, which will be described in detail below with reference to the accompanying drawings.

[0054] As shown in Figure 1 The infrared detector assembly signal transmission method provided by the embodiment of the present application includes the following steps:

[0055] S101, install and connect the information transmission module, install the detector assembly end connector and the information acquisition circuit end connector on the upper and lower stacked multi-layer rigid-flexible combination printed circuit board, and install the detector power supply and bias voltage filtering circuit on the rigid circuit board at the detector assembly end of the rigid-flexible combination plate;

[0056] S102, connecting the first interface protection module with the information transmission module, covering the rigid circuit board of the rigid-flexible combined printed circuit board and the connector connected with the detector assembly end with two split aluminum alloy adaptive installation covers, setting threaded holes on the aluminum alloy adaptive installation cover, setting through holes on the rigid circuit board, and fastening through screws; S103, installing the first interface protection module on the detector assembly through the positioning bolt, so that the lead-out pin of the detector assembly is tightly connected with the information transmission module, then fastening the first interface protection module and the detector assembly through screws, and completing the installation of the first interface protection module;

[0057] S104, connecting the second interface protection module with the information transmission module, covering the connector at the information acquisition circuit end of the rigid-flexible combined printed circuit board with two split aluminum alloy adaptive installation covers, and fastening through screws;

[0058] S105, installing the signal isolation circuit and the analog-digital conversion circuit on the information acquisition circuit board, installing the RC filter and the follower array, performing impedance conversion and signal isolation, and completing analog-digital conversion of the analog signal;

[0059] S106, installing the second interface protection module on the information acquisition circuit through the positioning bolt, so that the lead-out pin of the signal transmission module is tightly connected with the information acquisition circuit module, then fastening through screws, and completing the installation of the second interface protection module;

[0060] S107, powering on the information acquisition circuit module, outputting the detector timing drive, the detector power supply voltage and the bias voltage, and performing filtering, isolation and analog-digital conversion processing on the received detector signal.

[0061] As shown in Figure 9 , the present application provides an infrared detector assembly signal transmission device circuit diagram, as shown in Figure 9 , the circuit is a principle diagram. The information acquisition board provides appropriate power supply voltage and bias voltage for the infrared detector, the FPGAXC2V3000 generates a logic timing, and the timing drive circuit 74LV245 provides appropriate timing for the infrared detector. These power supply voltage, bias voltage and timing signal are sent to the infrared detector circuit through the second interface protection module, the information transmission module and the first interface protection module, wherein the voltage power supply and the bias voltage signal are at the first protection module, and pass through the decoupling circuit composed of the tantalum capacitor 220μF and the ceramic capacitor 0.1μF in parallel Figure 9The switching control of the power supply voltage and bias voltage is issued by the computer, parsed by the FPGA, and then executed by the relay. The analog electrical signal output by the infrared detector passes through the first interface protection module, the signal transmission module, and the second interface protection module, and is then connected to the information acquisition circuit module. In the information acquisition circuit module, it is first filtered by a first-order low-pass filter circuit with a cutoff frequency of approximately 86MHz composed of RC components, then by an isolation and impedance transformation circuit composed of an AD8041 and a single-ended to differential chip, and finally converted into a digital signal by an analog-to-digital converter circuit. This digital signal is then sent from the FPGA to the computer via the PCI bus for receiving, storing, displaying, and analyzing.

[0062] The technical solution of the present invention will be further described below with reference to the embodiments.

[0063] Example 1

[0064] like Figure 2 As shown, the infrared detector assembly signal transmission device of the present invention includes a signal transmission module, a first interface protection module, a second interface protection module, and an information acquisition circuit module. The signal transmission module realizes the electrical connection between the detector assembly and the information acquisition circuit; one end is connected to the electrical signal interface of the detector assembly, and the other end is connected to the information acquisition circuit module. The first interface protection module is used for electromagnetic shielding and mechanical fixation of the signal transmission module at the detector assembly end. The second interface protection module is used for electromagnetic shielding and mechanical fixation of the signal transmission module at the information acquisition circuit end. The information acquisition circuit module provides the power supply, bias voltage, and drive signal required by the detector assembly, and is used for filtering, isolating, impedance matching, and analog-to-digital conversion of the analog signal output by the detector.

[0065] The first interface protection module is connected to the signal transmission module via a line. The signal transmission module is connected to the second interface protection module via a line. The second interface protection module is connected to the signal acquisition circuit module via a line.

[0066] like Figure 3 As shown, the signal transmission module includes a multi-layer rigid-flex printed circuit board stacked on top of each other, a connector for the detector assembly, a connector for the information acquisition circuit, and a detector power supply and bias voltage filtering circuit.

[0067] The rigid-flexible combined printed circuit board has rigid circuit boards only at the interfaces of two ends, and a flexible circuit board in the middle, the flexible circuit board is divided into two pieces of upper and lower parts and has four layers, the first layer and the fourth layer are large-area ground layers for shielding and reducing ground impedance, the second layer and the third layer are wiring layers for transmission of detector driving signals, detector power supply and bias voltage, and detector output analog signals, during wiring, the bias voltage and the detector output analog signals are partitioned and wired with the detector driving signals and the power supply circuit, and are isolated by ground wires to avoid interference of the bias voltage and the detector output analog signals, the detector output analog signals are also isolated from each other by the ground wires, and the analog signals between the second and third layers of PCBs are staggered to avoid mutual crosstalk; the detector power supply and bias voltage filter circuit is a decoupling filter circuit composed of a 220μF tantalum capacitor and a 0.1μF ceramic capacitor in parallel.

[0068] As shown in Figures 4-5 the first interface protection module includes two split aluminum alloy adapter mounting covers, provided with mounting screw holes and two latch positioning holes, the two mounting covers cover the aforementioned rigid-flexible combined printed circuit board and the connector of the detector assembly end, are buckled and mounted, and are fastened by screws; the first interface protection module is mounted on the detector assembly by positioning latches, so that the lead pins of the detector assembly are tightly connected with the information transmission module, and then the installation of the first interface protection module is completed by screw fastening;

[0069] As shown in Figures 6-7 the second interface protection module includes two split aluminum alloy adapter mounting covers, provided with mounting screw holes and two latch positioning holes, the two mounting covers cover the aforementioned rigid-flexible combined printed circuit board and the connector of the information acquisition circuit end, are buckled and mounted, and are fastened by screws; the second interface protection module is mounted on the information acquisition circuit module structure by positioning latches, so that the lead pins of the information transmission module are tightly connected with the information acquisition circuit module, and then the installation of the second interface protection module is completed by screw fastening;

[0070] As shown in Figure 8 the information acquisition circuit module includes a signal filter, isolation, impedance matching and analog-digital conversion circuit, a detector power supply and bias voltage circuit, and a detector timing drive circuit. Among them, the filter circuit 1 is a first-order RC low-pass filter circuit; the isolation and impedance matching circuit 2 is mainly a follower array built by a high-bandwidth high-impedance operational amplifier, so as to perform impedance transformation and signal isolation; the analog-digital conversion circuit 3 is mainly realized by a high-speed analog-digital conversion chip; the detector power supply and bias voltage circuit 5 is mainly realized by an LDO with low noise and small ripple; and the detector timing drive circuit 4 is mainly realized by a FPGA to generate a driving timing and output by a driving chip.

[0071] Embodiment 2

[0072] The infrared detector assembly signal transmission method provided by the embodiment of the application comprises the following steps:

[0073] S1, the applied detector assembly is a 4000-element long linear array detector, which is spliced by 8 512-element sub-modules, the output tap number is 32, the driving timing is 7-way, the power supply and bias voltage are 5-way. The information transmission module is installed on the upper and lower stacked multi-layer rigid-flexible printed circuit board, and the detector assembly terminal connector and the information acquisition circuit terminal connector are installed on the rigid-flexible printed circuit board. The detector terminal connector is RM322-206-211-5570 of AIRBORN company, the information acquisition terminal connector is RM352-206-311-5570 of AIRBORN company, and the detector power supply and bias voltage filter capacitor is installed on the rigid-flexible printed circuit board, and each filter capacitor is connected in parallel with 220 mu F tantalum capacitor and 0.1 mu F ceramic capacitor, and a total of 8 filter capacitors are arranged;

[0074] S2, the first interface protection module is connected with the information transmission module, and the rigid circuit board of the rigid-flexible printed circuit board and the connector connected with the detector assembly are covered by two split aluminum alloy adaptive mounting covers. Threaded holes are arranged on the aluminum alloy adaptive mounting cover, and through holes are arranged on the rigid circuit board, and the rigid circuit board is fastened by 5 M2.5*6 screws, and the flexible circuit board is led out through the protection cover outlet;

[0075] S3, the first interface protection module is installed on the detector assembly by the positioning pin, so that the lead pins of the detector assembly are tightly connected with the information transmission module, and then the first protection interface is fixed to the shell of the detector assembly by 4 M3*10 screws, so that the installation of the first interface protection module is completed.

[0076] S4, the second interface protection module is connected with the information transmission module, and the rigid-flexible printed circuit board and the connector at the information acquisition circuit end are covered by two split aluminum alloy adaptive mounting covers, and the mounting is buckled and fastened by 5 M2.5*6 screws;

[0077] S5, the signal isolation circuit and the analog-digital conversion circuit are installed on the information acquisition circuit board, the RC filter and the follower array are installed, the operating amplifier signal of the follower is AD8041 of Analog Device company, the number is 32, the impedance conversion and signal isolation are carried out, and the analog-digital conversion of the analog signal is completed;

[0078] S6, the second interface protection module is installed on the information acquisition circuit by the positioning pin, so that the lead pins of the transmission module are tightly connected with the information acquisition circuit module, and then the second interface protection circuit is installed by fastening 4 M3*10 screws.

[0079] S7, the information acquisition circuit module is powered on, outputs the 7-way detector timing drive, 5-way detector power supply and bias voltage, reads out the frequency of 8MHz, and processes the received detector signal through filtering, isolation, impedance matching, analog-digital conversion and the like.

[0080] Embodiment 3

[0081] The infrared detector assembly signal transmission method provided by the embodiment of the application comprises the following steps:

[0082] S1, the applied detector assembly is a 4000 element x 8 element quasi-plane array detector, the output tap number is 16, the driving timing is 5-way, the power supply and bias voltage are 5-way. The information transmission module is installed and connected with the detector assembly terminal connector and the information acquisition circuit terminal connector on the upper and lower stacked multi-layer rigid-flex printed circuit board, the detector terminal connector is RM322-206-211-5570 of AIRBORN company, the information acquisition terminal connector is RM352-206-311-5570 of AIRBORN company, and the detector power supply and bias voltage filter capacitor is installed on the rigid-flex board, each filter capacitor is connected in parallel with 220 mu F tantalum capacitor and 0.1 mu F ceramic capacitor, and a total of 8-way filter capacitors are arranged;

[0083] S2, the first interface protection module is connected with the information transmission module, the rigid-flex printed circuit board and the connector at the detector assembly end are covered by two split aluminum alloy adaptive installation covers, and the split aluminum alloy adaptive installation covers are installed and connected through 5 M2.5x6 screws;

[0084] S3, the first interface protection module is installed on the detector assembly through the positioning bolt, so that the lead-out pin of the detector assembly is tightly connected with the information transmission module, and then the first protection interface is fixed to the detector assembly shell through 4 M3x10 screws, so that the installation of the first interface protection module is completed;

[0085] S4, the second interface protection module is connected with the information transmission module, the rigid-flex printed circuit board and the connector at the information acquisition circuit end are covered by two split aluminum alloy adaptive installation covers, and the split aluminum alloy adaptive installation covers are installed and connected through 5 M2.5x6 screws;

[0086] S5, the signal isolation circuit and the analog-digital conversion circuit are installed on the information acquisition circuit board, the RC filter and the follower array are installed, the operating amplifier signal of the follower is AD8041 of Analog Device company, the number is 16, impedance conversion and signal isolation are performed, and analog-digital conversion of the analog signal is completed;

[0087] S6, install the second interface protection module on the information acquisition circuit through the positioning bolt, so that the transmission module lead pin is tightly connected with the information acquisition circuit module, and then the installation of the second interface protection circuit is completed through the fastening of the four M3x10 screws;

[0088] S7, the information acquisition circuit module is powered on, outputs the 5-way detector timing drive, 5-way detector power supply and bias voltage, and reads out the frequency of 12MHz, filters, isolates, impedance matches, analog-digital converts and processes the received detector signal.

[0089] After the above example is implemented, the infrared detector signal after analog-digital conversion is transmitted to the computer through the PCI bus, and the infrared signal is stored, read, displayed or analyzed and processed by using some algorithms by the image processing software on the computer. The noise statistics of the infrared system is completed on the software. By selecting 400 continuous image data before and after the example is implemented respectively, the noise mean values before and after the example is implemented are obtained.

[0090] Before and after the above embodiment, the comparison of the system equivalent input noise, the information transmission module weight and the electronic assembly cycle is shown in Table 1.

[0091] Table 1 Comparison of system equivalent input noise, information transmission module weight and electronic assembly cycle before and after the example is implemented

[0092]

[0093] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any modification, equivalent replacement and improvement within the technical range disclosed by the present application and within the spirit and principles of the present application should be covered within the protection scope of the present application.

Claims

1. A signal transmission device for an infrared detector assembly, characterized in that, The infrared detector assembly signal transmission device comprises a signal transmission module, a first interface protection module, a second interface protection module and an information acquisition circuit module. The signal transmission module is used for realizing electrical connection of the detector assembly and the information acquisition circuit, and is connected to the electrical signal interface of the detector assembly at one end and to the information acquisition circuit module at the other end. The first interface protection module is used for electromagnetic shielding and mechanical fixing of the signal transmission module at the detector assembly end. The second interface protection module is used for electromagnetic shielding and mechanical fixing of the signal transmission module at the information acquisition circuit end. The information acquisition circuit module is used for providing power supply, bias voltage and driving signal required by the detector assembly, filtering, isolating, impedance matching and analog-digital conversion processing of the analog signal output by the detector. The signal transmission module comprises a plurality of layers of rigid-flexible combined printed circuit boards stacked in an up-down manner, connector plugs at the detector assembly end and the information acquisition circuit end, and detector power supply and bias voltage filter circuits. The rigid-flexible combined printed circuit boards only have rigid circuit boards at the two ends of the interface, and the middle part is a flexible circuit board. The flexible circuit board is divided into two pieces stacked in an up-down manner and has four layers. The first layer and the fourth layer are large-area ground layers used for shielding and reducing ground impedance. The second layer and the third layer are wiring layers used for transmission of detector driving signals, detector power supply and bias voltage and detector output analog signals. During wiring, the bias voltage and the detector output analog signals are isolated from the detector driving signals and the power supply circuit by partition wiring and ground lines. The detector output analog signals are isolated from each other by ground lines, and the analog signals between the second layer and the third layer are arranged in an interleaved manner.

2. The infrared detector assembly signal transmission device of claim 1, wherein, The detector power supply and bias voltage filter circuit is a decoupling filter circuit composed of a 220 mu F tantalum capacitor and a 0.1 mu F ceramic capacitor in parallel.

3. The infrared detector assembly signal transmission device of claim 1, wherein, The first interface protection module comprises two split aluminum alloy adapter mounting covers provided with mounting screw holes and two latch positioning holes. The two mounting covers cover the rigid-flexible combined printed circuit board and the connector plug at the detector assembly end, are buckled and mounted, and are fastened by screws. The first interface protection module is mounted on the detector assembly by the positioning latch, so that the lead pins of the detector assembly are tightly connected to the information transmission module, and then the installation of the first interface protection module is completed by screw fastening.

4. The infrared detector assembly signal transmission device of claim 1, wherein, The second interface protection module comprises two split aluminum alloy adapter mounting covers provided with mounting screw holes and two latch positioning holes. The two mounting covers cover the rigid-flexible combined printed circuit board and the connector plug at the information acquisition circuit end, are buckled and mounted, and are fastened by screws. The second interface protection module is mounted on the information acquisition circuit module structure by the positioning latch, so that the lead pins of the connector plug of the information transmission module are tightly connected to the information acquisition circuit module, and then the installation of the second interface protection module is completed by screw fastening.

5. The infrared detector assembly signal transmission device of claim 1, wherein, The information acquisition circuit module comprises signal filtering, isolating, impedance matching and analog-digital conversion circuits, detector power supply and bias voltage circuits and detector timing driving circuits.

6. The infrared detector assembly signal transmission device of claim 5, wherein, The filter circuit is a first-order RC low-pass filter circuit; the isolation and impedance matching circuit is a follower array built by a high-bandwidth and high-impedance operational amplifier, which realizes impedance transformation and signal isolation; the analog-digital conversion circuit is realized by a high-speed analog-digital conversion chip; the detector power supply and bias voltage circuit is realized by an LDO with low noise and small ripple; and the detector timing drive circuit is generated by an FPGA and output by a drive chip.

7. An infrared detector assembly signal transmission method using the infrared detector assembly signal transmission device according to any one of claims 1 to 6, characterized by, The infrared detector assembly signal transmission method comprises the following steps: Step one, install the information transmission module, install the detector assembly terminal connector and the information acquisition circuit terminal connector on the upper and lower stacked multi-layer rigid-flex printed circuit board, and install the detector power supply and bias voltage filter circuit on the rigid circuit board at the detector assembly end of the rigid-flex board; Step two, connect the first interface protection module with the information transmission module, cover the rigid circuit board of the rigid-flex printed circuit board and the connector connected with the detector assembly end with two split aluminum alloy adaptive mounting covers, set screw holes on the aluminum alloy adaptive mounting cover, and set through holes on the rigid circuit board and fasten them with screws; Step three, install the first interface protection module on the detector assembly by positioning the latch, tightly connect the lead pins of the detector assembly with the information transmission module, and then fasten the first interface protection module and the detector assembly with screws to complete the installation of the first interface protection module; Step four, connect the second interface protection module with the information transmission module, cover the aforementioned rigid-flex printed circuit board and the connector at the information acquisition circuit end with two split aluminum alloy adaptive mounting covers, and fasten them with screws; Step five, install the signal isolation circuit and the analog-digital conversion circuit on the information acquisition circuit board, install the RC filter and the follower array, perform impedance transformation and signal isolation, and complete the analog-digital conversion of the analog signal; Step six, install the second interface protection module on the information acquisition circuit by positioning the latch, tightly connect the lead pins of the signal transmission module with the information acquisition circuit module, and then fasten them with screws to complete the installation of the second interface protection module; Step seven, power on the information acquisition circuit module, output the detector timing drive, detector power supply voltage and bias voltage, and perform filtering, isolation and analog-digital conversion processing on the received detector signal.

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