A pad parameter calibration and correction method, device, computer equipment and storage medium

Abstract

The present application belongs to the technical field of PCB circuit board design, and relates to a pad parameter verification and correction method, comprising receiving a pad file verification and correction instruction, scanning a pad file in a database according to the verification and correction instruction; obtaining the scanned pad file, and sequentially judging whether the pad parameter information of the pad file is complete; if the pad parameters are complete, obtaining a verification rule, verifying the pad parameters according to the verification rule, and ending the verification if the verification passes, and correcting the erroneous pad parameters in the pad file according to the verification rule if the verification fails; if the pad parameters of the pad file are incomplete, obtaining a verification rule, directly correcting the missing pad parameters in the pad file according to the verification rule, and then performing verification and correction according to the verification rule. The present application also provides a pad parameter verification and correction device, a computer device, and a storage medium. The present application can efficiently and accurately check whether the pad parameters are complete and correct, and correct the pad parameters with problems in real time.

Description

Technical Field

[0001] The present application relates to the technical field of PCB circuit board design, and in particular to a pad parameter calibration and correction method, device, computer equipment, and storage medium. Background Art

[0002] As PCB design complexity continues to increase, the technical requirements for PCB designers are also increasing accordingly. However, humans cannot execute tasks with the same precision and error-free accuracy as machines. Consequently, fatigue or negligence can lead to data loss when creating footprints during PCB design, resulting in unusable PCBs produced according to the design files and causing financial losses to the company. Given the large amount of design data in a project, manual inspection of footprints becomes difficult, time-consuming, inefficient, and inaccurate. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to solve the problem that the current manual inspection of whether there are problems with the package pads is time-consuming and inefficient.

[0004] In order to solve the above technical problems, the present application provides a pad parameter calibration and correction method, comprising:

[0005] Receive a pad file verification and correction instruction, and scan the pad files in the database according to the verification and correction instruction;

[0006] Obtain the scanned pad files, and determine in turn whether the pad parameter information of each pad file is complete;

[0007] If the pad parameters of the pad file are complete, obtaining a verification rule, and verifying the pad parameters of the pad file according to the verification rule; if the verification passes, ending the verification or verifying the remaining pad files; if the verification fails, correcting the incorrect pad parameters in the pad file according to the verification rule;

[0008] If the pad parameters of the pad file are incomplete, obtaining the verification rule, adding the missing pad parameters in the pad file according to the verification rule, and after the pad parameters are complete, verifying the pad parameters of the pad file according to the verification rule, and ending the verification or verifying the remaining pad files if the verification passes, and correcting the erroneous pad parameters in the pad file according to the verification rule if the verification fails;

[0009] The pad file after pad parameter correction processing is completed is updated into the database.

[0010] Furthermore, the obtaining verification rules includes:

[0011] Obtaining a pad type corresponding to the pad file, wherein the pad type includes an SMD type and a DIP type;

[0012] Obtain corresponding verification rules according to the pad type.

[0013] Further, if the pad type determined is the SMD type, verifying the pad parameters of the pad file according to the verification rule includes:

[0014] Get the BEGIN LAYER layer parameters, SOLDER LAYER layer parameters and PASTE LAYER layer parameters of the pad file;

[0015] It is determined whether the SOLDER LAYER layer parameter is not less than the BEGIN LAYER layer parameter and whether the PASTE LAYER layer parameter is equal to the BEGIN LAYER layer parameter.

[0016] Furthermore, if the verification fails, correcting the incorrect pad parameters in the pad file according to the verification rules includes:

[0017] If the SOLDER LAYER layer parameter is less than the BEGIN LAYER layer parameter, the SOLDER LAYER layer parameter is adjusted according to the BEGIN LAYER layer parameter so that the SOLDER LAYER layer parameter is not less than the BEGIN LAYER layer parameter; if the PASTE LAYER layer parameter is not equal to the BEGIN LAYER layer parameter, the PASTE LAYER layer parameter is adjusted according to the BEGIN LAYER layer parameter so that the PASTE LAYER layer parameter is equal to the BEGIN LAYER layer parameter.

[0018] The directly correcting the pad parameters missing in the pad file according to the verification rules includes:

[0019] According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters and the PASTE LAYER layer parameters are added so that the SOLDER LAYER layer parameter data is not less than the BEGIN LAYER layer parameter data and the PASTE LAYER layer parameter data is equal to the BEGIN LAYER layer parameter data.

[0020] Further, if the pad type determined is a DIP type, verifying the pad parameters of the pad file according to the verification rule includes:

[0021] Get the pad drilling aperture parameters, BEGIN LAYER layer data and SOLDER LAYER layer data of the pad file;

[0022] Determining at least one preset threshold corresponding to the pad drilling aperture parameter, the preset threshold being used to determine a parameter range to which the pad drilling aperture parameter belongs, verifying the BEGIN LAYER layer parameter based on the parameter range, and determining whether a difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is equal to a first preset difference corresponding to the parameter range;

[0023] The SOLDER LAYER layer parameter is verified according to the BEGIN LAYER layer parameter to determine whether a difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is equal to a second preset difference.

[0024] Furthermore, the step of verifying the pad parameters of the pad file according to the verification rules further includes:

[0025] Get the ANTI PAD parameters, DEFAUL INTERNAL parameters and END LAYER layer parameters in the pad file;

[0026] The ANTI PAD parameter, DEFAUL INTERNAL parameter and ENDLAYER layer parameter are checked according to the BEGIN LAYER layer parameter to determine whether the difference between the ANTI PAD parameter and the BEGIN LAYER layer parameter is equal to a third preset difference, and to determine whether the DEFAUL INTERNAL parameter or the END LAYER layer parameter is equal to the BEGIN LAYER layer parameter.

[0027] Furthermore, if the verification fails, correcting the incorrect pad parameters in the pad file according to the verification rules includes:

[0028] If the difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is not equal to the first preset difference corresponding to the parameter range, adjusting the BEGIN LAYER layer parameter according to the pad drilling aperture parameter so that the difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is equal to the first preset difference corresponding to the parameter range;

[0029] If the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is not equal to the second preset difference, adjusting the SOLDER LAYER layer parameter according to the BEGIN LAYER layer parameter so that the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is equal to the second preset difference;

[0030] If the difference between the ANTI PAD parameter and the BEGIN LAYER parameter is not equal to the third preset difference, adjusting the ANTI PAD parameter according to the BEGIN LAYER parameter so that the difference between the ANTI PAD parameter and the BEGIN LAYER parameter is equal to the third preset difference;

[0031] If the DEFAUL INTERNAL parameter or the END LAYER layer parameter is not equal to the BEGIN LAYER layer parameter, the DEFAUL INTERNAL parameter or the END LAYER layer parameter is adjusted according to the BEGIN LAYER layer parameter so that the DEFAUL INTERNAL layer parameter or the END LAYER layer parameter is equal to the BEGIN LAYER parameter.

[0032] The directly correcting the pad parameters missing in the pad file according to the verification rules includes:

[0033] According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters, the ANTIPAD parameters, the DEFAUL INTERNAL parameters and the END LAYER layer parameters are added so that the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to the first preset difference corresponding to the parameter range, and the difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to the second preset difference, and the difference between the ANTI PAD parameters and the BEGIN LAYER layer parameters is equal to the third preset difference, and at the same time, the DEFAUL INTERNAL parameters or the END LAYER layer parameters are equal to the BEGIN LAYER layer parameters.

[0034] In order to solve the above technical problems, the embodiment of the present application further provides a pad parameter calibration and correction device, which adopts the following technical solution:

[0035] A receiving module is used to receive pad file verification and correction instructions;

[0036] A scanning module, configured to scan pad files in a database according to the verification and correction instructions;

[0037] a verification and correction module, for obtaining the scanned pad file, and determining in turn whether the pad parameter information of each pad file is complete; if the pad parameters of the pad file are complete, obtaining a verification rule, and verifying the pad parameters of the pad file according to the verification rule; if the verification is passed, ending the verification or verifying the remaining pad files; if the verification fails, correcting the erroneous pad parameters in the pad file according to the verification rule; if the pad parameters of the pad file are incomplete, obtaining a verification rule, and adding the missing pad parameters in the pad file according to the verification rule; after the pad parameters are complete, verifying the pad parameters of the pad file according to the verification rule; if the verification is passed, ending the verification or verifying the remaining pad files; if the verification fails, correcting the erroneous pad parameters in the pad file according to the verification rule;

[0038] An updating module, configured to update the pad file after pad parameter correction processing is completed into the database;

[0039] The receiving module, scanning module, checking and correcting module and updating module are connected in sequence, and the updating module is connected to the database.

[0040] In order to solve the above technical problems, an embodiment of the present application also provides a computer device, which includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements the steps of the pad parameter verification and correction method as described above.

[0041] In order to solve the above technical problems, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the pad parameter verification and correction method described above are implemented.

[0042] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0043] By adopting the above scheme, it is possible to scan pad files and determine the integrity of the pad parameters of the scanned pad files. Incomplete pad parameters can be completed, and the complete pad parameters can be verified using verification rules. The pad parameters that failed the verification can be corrected and the corrected parameters can be updated to the database. Compared with existing methods, the efficiency of pad parameter inspection is improved, and the processing of problematic pad parameters through verification rules improves the accuracy of pad parameters, thereby improving the accuracy of PCB design documents. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the solutions in this application, a brief introduction will be given below to the drawings required for use in the description of the embodiments of this application. Obviously, the drawings described below are some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0045] Figure 1 is an exemplary system architecture diagram to which the present application may be applied;

[0046] Figure 2 This is a flow chart of an embodiment of a pad parameter verification and correction method of the present application;

[0047] Figure 3 This is a structural diagram of an embodiment of a pad parameter calibration and correction device of the present application;

[0048] Figure 4 It is a structural diagram of an embodiment of a computer device of the present application.

[0049] Reference numerals: 301 - receiving module, 302 - scanning module, 303 - verification and correction module, 304 - updating module, 41 - memory, 42 - processor, 43 - network interface. DETAILED DESCRIPTION

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0051] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0053] like Figure 1As shown, system architecture 100 may include terminal devices 101, 102, 103, a network 104, and a server 105. Network 104 is a medium for providing communication links between terminal devices 101, 102, 103 and server 105. Network 104 may include various connection types, such as wired or wireless communication links or fiber optic cables.

[0054] Users can use terminal devices 101, 102, and 103 to interact with server 105 via network 104 to receive or send messages, etc. Various communication client applications can be installed on terminal devices 101, 102, and 103, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social platform software, etc.

[0055] Terminal devices 101, 102, and 103 can be various electronic devices with display screens and support web browsing, including but not limited to smartphones, tablet computers, e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III), MP4 (Moving Picture Experts Group Audio Layer IV), laptop computers, desktop computers, etc.

[0056] The server 105 may be a server that provides various services, such as a background server that provides support for web pages displayed on the terminal devices 101 , 102 , and 103 .

[0057] It should be noted that the pad parameter verification and correction method provided in the embodiment of the present application is generally executed by a server. Accordingly, the total pad parameter verification and correction device is generally set in the server.

[0058] It should be understood that Figure 1 The number of terminal devices, networks and servers in the embodiment is merely illustrative. Any number of terminal devices, networks and servers may be provided as required.

[0059] refer to Figure 2 , shows a flow chart of an embodiment of a method for verifying and correcting pad parameters according to the present application. In this embodiment, the pad parameter verification and correction method is run in an electronic device, and the pad parameter verification and correction method includes the following steps:

[0060] Step S1: receiving a pad file verification and correction instruction, and scanning pad files in a database according to the verification and correction instruction.

[0061] In this embodiment, the calibration and correction instructions for calibrating the pad file can be received via a wired connection or a wireless connection. It should be noted that the wireless connection method may include but is not limited to a 3G / 4G connection, a WiFi connection, a Bluetooth connection, a WiMAX connection, a Zigbee connection, a UWB (ultra wideband) connection, and other wireless connection methods currently known or to be developed in the future.

[0062] According to the received pad file verification and correction instruction, a scanning operation will be performed, that is, scanning the pad files in the database.

[0063] Step S2: Obtain the scanned pad files and determine in turn whether the pad parameter information of each pad file is complete.

[0064] In this embodiment, by obtaining the pad file scanned in step S1, the pad file contains pad parameters, and whether the pad parameter information of each pad file is complete will be judged in turn. The judgment process is to judge the multiple pad parameters in the pad file in sequence. If one pad parameter is incomplete, the judgment operation will be terminated.

[0065] Step S3: If the pad parameters of the pad file are complete, obtain the verification rules, and verify the pad parameters of the pad file according to the verification rules. If the verification passes, end the verification or verify the remaining pad files. If the verification fails, correct the incorrect pad parameters in the pad file according to the verification rules.

[0066] In this embodiment, when performing step S2 of this application, if each pad parameter in the pad file is complete, it is determined that the pad parameters in the pad file are complete, and then the verification rules are obtained, and the pad parameters of the pad file are verified according to the verification rules.

[0067] In an embodiment of the present invention, pad files can be divided into different types, and the verification rules corresponding to each type of pad file are different. Therefore, in some embodiments, the method first obtains the pad type corresponding to the pad file in the process of obtaining the verification rules. For example, the pad types in this application include SMD type and DIP type, and then obtains the corresponding verification rules according to the type of the pad file.

[0068] In this embodiment, if the pad type determined is an SMD type, the pad parameters of the pad file are verified according to the verification rules, including: obtaining the BEGIN layer parameters, SOLDER LAYER layer parameters and PASTE LAYER layer parameters in the pad file, the BEGIN layer parameters refer to the top layer, that is, the part layer, the SOLDER LAYER layer parameters refer to the solder mask layer, and the PASTE LAYER layer is the solder paste protective layer, that is, the soldering layer; and then judging whether the SOLDER LAYER layer parameters are not less than the BEGIN LAYER layer parameters and judging whether the PASTE LAYER layer parameters are equal to the BEGIN LAYER layer parameters based on the obtained parameters.

[0069] If the SOLDER LAYER layer parameters are not less than the BEGIN LAYER layer parameters and the PASTE LAYER layer parameters are equal to the BEGIN LAYER layer parameters, the verification is passed and the verification will end or the verification steps will be performed on the remaining pad files. Conversely, if the SOLDER LAYER layer parameters are less than the BEGIN LAYER layer parameters and the PASTE LAYER layer parameters are not equal to the BEGIN LAYER layer parameters, the verification fails, which means that there are incorrect pad parameters and the incorrect pad parameters in the pad file need to be corrected according to the verification rules.

[0070] In an embodiment of the present invention, correcting erroneous pad parameters in a pad file according to a verification rule includes: if the SOLDER LAYER layer parameter is less than the BEGIN LAYER layer parameter, adjusting the SOLDER LAYER layer parameter according to the BEGIN LAYER layer parameter so that the SOLDER LAYER layer parameter is not less than the BEGIN LAYER layer parameter; if the PASTE LAYER layer parameter is not equal to the BEGIN LAYER layer parameter, adjusting the PASTE LAYER layer parameter according to the BEGIN LAYER layer parameter so that the PASTE LAYER layer parameter is equal to the BEGIN LAYER layer parameter for correction.

[0071] In this embodiment, if the pad type determined is a DIP type, the verifying the pad parameters of the pad file according to the verification rules includes: obtaining pad drilling aperture parameters, BEGIN LAYER layer data, and SOLDER LAYER layer data of the pad file; then, based on at least one preset threshold value corresponding to the pad drilling aperture parameter, the preset threshold value is used to determine the parameter range to which the pad drilling aperture parameter belongs, verifying the BEGIN LAYER layer parameters based on the parameter range, and determining whether the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameter is equal to the first preset difference corresponding to the parameter range; and verifying the SOLDER LAYER layer parameters according to the BEGIN LAYER layer parameters, and determining whether the difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to the second preset difference.

[0072] In a further embodiment, the verifying of the pad parameters of the pad file according to the verification rules also includes: after obtaining the pad drilling aperture parameters, BEGIN LAYER layer data and SOLDER LAYER layer data of the pad file, it is also necessary to determine whether the PASTE LAYER layer parameters are empty. If not, the verification fails, and the PASTELAYER layer parameters need to be cleared during subsequent correction; if it is empty, the verification passes, because the pad with the hole does not require a steel mesh (the PASTELAYER layer parameters are used to indicate the pad structure).

[0073] The following is an example using specific numerical values. In this embodiment, four preset thresholds are provided, namely 12mil, 20mil, 30mil, and 40mil. According to these four preset thresholds, five parameter ranges can be obtained, namely, the pad drilling aperture parameter is less than 12mil, the pad drilling aperture parameter is not less than 12mil and less than 20mil, the pad drilling aperture parameter is not less than 20mil and less than 30mil, the pad drilling aperture parameter is not less than 30mil and less than 40mil, and the pad drilling aperture parameter is not less than 40mil.

[0074] In this embodiment, each parameter range corresponds to a first preset difference, for example, when the pad drilling aperture parameter is less than 12 mil, the corresponding first preset difference is 12 mil, when the pad drilling aperture parameter is not less than 12 mil and less than 20 mil, the corresponding first preset difference is 16 mil, when the pad drilling aperture parameter is not less than 20 mil and less than 30 mil, the corresponding first preset difference is 20 mil, when the pad drilling aperture parameter is not less than 30 mil and less than 40 mil, the corresponding first preset difference is 24 mil, and when the pad drilling aperture parameter is not less than 40 mil, the corresponding first preset difference is 30 mil. That is, when the pad drilling aperture parameter is less than 12mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 12mil; when the pad drilling aperture parameter is not less than 12mil and less than 20mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 16mil; when the pad drilling aperture parameter is not less than 20mil and less than 30mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 20mil; when the pad drilling aperture parameter is not less than 30mil and less than 40mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 24mil; when the pad drilling aperture parameter is not less than 40mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 30mil. During the verification, if the difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is equal to the first preset difference corresponding to the parameter range, the verification for this step is passed; otherwise, if the BEGIN LAYER layer parameter is not satisfied, the verification is passed. If the difference between the LAYER layer parameters and the pad drilling aperture parameters is equal to the first preset difference corresponding to the parameter range, the BEGIN LAYER layer parameters will be corrected in accordance with the above-mentioned verification rules in combination with the drilling aperture size parameters.

[0075] In this embodiment, if the second preset difference is 4 mil in this embodiment, then during verification, if the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is equal to 4 mil, the verification for this step is passed; otherwise, if the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is not equal to 4 mil, the SOLDER LAYER layer parameter will be corrected in accordance with the above-mentioned verification rules in combination with the BEGIN LAYER layer parameter.

[0076] After the above-mentioned verification and correction operations, it also includes: obtaining the ANTI PAD parameters, DEFAULINTERNAL parameters and END LAYER layer parameters in the pad file, ANTI PAD is the anti-electric margin, which is used to prevent the pin from being connected to other networks, DEFAUL INTERNAL is the inner layer of the pad, and END LAYER is the bottom layer of the PAD; according to the BEGIN LAYER layer parameters, the ANTI PAD layer parameters, DEFAUL INTERNAL parameters and END LAYER layer parameters are verified to determine whether the difference between the ANTIPAD parameters and the BEGIN LAYER layer parameters is equal to a third preset difference, and to determine whether the DEFAULINTERNAL parameters or the END LAYER layer parameters are equal to the BEGIN LAYER layer parameters.

[0077] In this embodiment, the third preset threshold is 20 mil. That is, if the difference between the ANTI PAD parameter and the BEGIN LAYER parameter is equal to 20 mil and the DEFAUL INTERNAL parameter or the END LAYER parameter is equal to the BEGIN LAYER parameter, then this step passes the verification. Conversely, if the difference between the ANTI PAD parameter and the BEGIN LAYER parameter is equal to 20 mil or the DEFAUL INTERNAL parameter or the END LAYER parameter is not equal to the BEGIN LAYER parameter, the ANTI PAD parameter, DEFAULINTERNAL parameter, and END LAYER parameter will be corrected according to the above verification rules.

[0078] If all the above steps are verified, the verification will end or the verification steps will be performed on the remaining pad files. If the verification is completed, you can exit directly.

[0079] Step S4: If the pad parameters of the pad file are incomplete, obtain the verification rules, add the missing pad parameters in the pad file according to the verification rules, and after the pad parameters are complete, verify the pad parameters of the pad file according to the verification rules. If the verification passes, end the verification or verify the remaining pad files. If the verification fails, correct the erroneous pad parameters in the pad file according to the verification rules.

[0080] In this embodiment, if it is determined in step S2 that the pad parameters are incomplete, verification rules are also obtained. The verification rules are consistent with the verification rules when the pad parameters are complete, and the corresponding verification rules are also obtained according to the pad type.

[0081] In this embodiment, when the pad type determined to be an SMD type, the corresponding verification rule is consistent with the verification rule described above, wherein the correction of the pad parameters missing in the pad file directly using the verification rule includes:

[0082] According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters and the PASTE LAYER layer parameters are added so that the SOLDER LAYER layer parameter data is not less than the BEGIN LAYER layer parameter data and the PASTE LAYER layer parameter data is equal to the BEGIN LAYER layer parameter data.

[0083] After adding the missing parameters, the pad parameters are complete. The complete pad parameters will be verified and corrected according to the verification rules, which is the same as the steps when the pad parameters of the above pad file are complete, so they will not be repeated here.

[0084] In this embodiment, when the pad type determined to be a DIP type, the corresponding verification rules are consistent with the verification rules described above, wherein the correction of the pad parameters missing in the pad file directly using the verification rules includes:

[0085] According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters, the ANTIPAD parameters, the DEFAUL INTERNAL parameters and the END LAYER layer parameters are added so that the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to the first preset difference corresponding to the parameter range, and the difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to the second preset difference, and the difference between the ANTI PAD parameters and the BEGIN LAYER layer parameters is equal to the third preset difference, and at the same time, the DEFAUL INTERNAL parameters or the END LAYER layer parameters are equal to the BEGIN LAYER layer parameters.

[0086] Continuing with the numerical example in the above embodiment, after adding the missing parameters, the added pad parameters satisfy: when the pad drilling aperture parameter is less than 12 mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 12 mil; when the pad drilling aperture parameter is not less than 12 mil and less than 20 mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 16 mil; when the pad drilling aperture parameter is not less than 20 mil and less than 30 mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 20 mil; when the pad drilling aperture parameter is not less than 30 mil and less than 40 mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 24 mil; when the pad drilling aperture parameter is not less than 40 mil, the BEGIN LAYER layer parameter is equal to the drilling aperture size parameter plus 30 mil; and the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter satisfies the SOLDER in the embodiment of the present application. The difference between the LAYER layer parameter and the BEGIN LAYER layer parameter is equal to 4 mil; accordingly, the difference between the ANTI PAD parameter and the BEGIN LAYER layer parameter satisfies in the embodiment of the present application that the difference between the ANTI PAD parameter and the BEGIN LAYER layer parameter is equal to 20 mil; and at the same time, the DEFAUL INTERNAL parameter or the END LAYER layer parameter is equal to the BEGIN LAYER layer parameter.

[0087] It should be noted that the numerical examples in the above embodiments are only used for illustrative purposes and do not constitute a specific limitation on the scope of protection of the present invention. The preset thresholds, first preset differences, second preset differences, third preset differences, etc. in the above embodiments may be other values, which will not be elaborated here.

[0088] Step S5, updating the pad file after the pad parameter correction processing is completed into the database.

[0089] That is, when a pad parameter is verified and corrected, the pad parameter is saved to the database and a text file is created to record the file name of the next pad. After the verification and correction of all pad files are completed, the pad files recorded in the text file are replaced one by one, that is, the corrected pad files are updated to the database.

[0090] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When executed, the program can include the processes in the above-described method embodiments. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0091] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0092] By adopting the above method and going through the above steps, after first receiving the pad verification and correction instruction, the pad file in the database is scanned. After obtaining the scanned pad file, the integrity is judged. Here, it will be divided into two categories, and processing them separately can improve processing efficiency. If it is complete, the verification rules are obtained and the parameters are verified according to the verification rules. If the verification fails, the correction is performed according to the verification rules. If the parameters are incomplete, there is one more step than when the parameters are complete. That is, before the correction is performed, the missing parameters must be added according to the verification rules. By setting the verification rules, the accuracy of the reviewed parameters is improved. After the correction is performed, the parameters are updated and saved in the database. The entire solution improves the accuracy of the pad design documents and improves the detection efficiency.

[0093] refer to Figure 3 , as a response to the above Figure 2 The present application provides an embodiment of a device for checking and correcting pad parameters. Figure 2 Corresponding to the method embodiment shown, the device can be specifically applied to various electronic devices.

[0094] like Figure 3 As shown, the pad verification and correction device 300 of this embodiment includes: a receiving module 301, a scanning module 302, a verification and correction module 303 and an updating module 304.

[0095] The receiving module 301 is used to receive a pad file verification and correction instruction;

[0096] The scanning module 302 is used to scan the pad files in the database according to the verification and correction instructions;

[0097] The verification and correction module 303 is used to obtain the scanned pad files, and determine whether the pad parameter information of each pad file is complete in turn. If the pad parameters of the pad file are complete, a verification rule is obtained, and the pad parameters of the pad file are verified according to the verification rule. If the verification passes, the verification is ended or the remaining pad files are verified. If the verification fails, the erroneous pad parameters in the pad file are corrected according to the verification rule. If the pad parameters of the pad file are incomplete, a verification rule is obtained, and the missing pad parameters in the pad file are added according to the verification rule. After the pad parameters are complete, the pad parameters of the pad file are verified according to the verification rule. If the verification passes, the verification is ended or the remaining pad files are verified. If the verification fails, the erroneous pad parameters in the pad file are corrected according to the verification rule.

[0098] The updating module 304 is used to update the pad file after the pad parameter correction process is completed into the database;

[0099] The receiving module 301 , the scanning module 302 and the checking and correcting module 303 are connected in sequence, and the updating module 304 is connected to the checking and correcting module 303 .

[0100] In this embodiment, through the coordinated use of the receiving module 301, the scanning module 302, the verification and correction module 303 and the update module 304, the receiving module 301 first receives the pad file verification and correction instruction from the front end, and then the scanning module 302 scans the pad file in the database according to the verification and correction instruction, and then the verification and correction module 303 first determines the integrity of the pad file parameter information based on the pad file scanned by the scanning module 302. If each pad parameter in the pad file is complete, it is determined that the pad parameters in the pad file are complete, and then the verification rules are obtained, and the pad parameters of the pad file are verified according to the verification rules. The verification rules are classified according to the type of the pad file, and different types of pads correspond to different types of verification rules. Therefore, in some embodiments, in the process of obtaining the verification rules, the method first obtains the pad type corresponding to the pad file, such as the pad type in this application includes two types of SMD type and DIP type, and then obtains the corresponding verification rules according to the type of the pad file. If the pad type determined is an SMD type, the verifying the pad parameters of the pad file according to the verification rules includes: obtaining the BEGIN layer parameters, SOLDER LAYER layer parameters and PASTE LAYER layer parameters in the pad file; and then judging whether the SOLDER LAYER layer parameters are not less than the BEGIN LAYER layer parameters and judging whether the PASTELAYER layer parameters are equal to the BEGIN LAYER layer parameters based on the obtained parameters. If the pad type determined to be a DIP type is determined, the corresponding verification rule is as follows: obtaining pad drilling aperture parameters, BEGIN LAYER layer data, and SOLDER LAYER layer data of the pad file; then determining at least one preset threshold corresponding to the pad drilling aperture parameters, the preset threshold being used to determine a parameter range to which the pad drilling aperture parameters belong; verifying the BEGIN LAYER layer parameters based on the parameter range, and determining whether a difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to a first preset difference corresponding to the parameter range; and verifying the SOLDER LAYER layer parameters based on the BEGIN LAYER layer parameters, and determining whether a difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to a second preset difference., if the verification is passed, the verification is ended or the remaining pad files are verified. If the verification fails, the erroneous pad parameters in the pad file are corrected according to the verification rules; if it is judged that the pad parameters of the pad file are incomplete, the verification rules are also obtained. First, the pad type corresponding to the pad file is obtained. For example, the pad types in this application include SMD type and DIP type. Then, the corresponding verification rules are obtained according to the type of the pad file. The missing pad parameters in the pad file are directly added according to the above verification rules. After the pad parameters are complete, the pad parameters of the pad file are verified according to the verification rules. If the verification is passed, the verification is ended or the remaining pad files are verified. If the verification fails, the erroneous pad parameters in the pad file are corrected according to the verification rules.

[0101] After the pad parameters of all pad files are verified and corrected, the updating module 304 updates the pad files after the pad parameter correction process into the database.

[0102] By adopting the above-mentioned device, a receiving module is used to receive the pad verification and correction instructions. After receiving the instructions, the scanning module is used to scan the pad files in the database. After obtaining the scanned pad files, the verification and correction module performs integrity judgment. Here, it will be divided into two categories, and separate processing can improve processing efficiency. If it is complete, the verification rules are obtained, and the parameters are verified according to the verification rules. If the verification fails, correction is performed according to the verification rules; if the parameters are incomplete, there is one more step than the case where the processing parameters are complete, that is, the missing parameters need to be added according to the verification rules before correction. By setting the verification rules, the accuracy of the review parameters is improved. After the correction processing, the update module updates the parameters to the database for storage. The entire device improves the accuracy of the pad design document and improves the detection efficiency.

[0103] See Figure 4 , the embodiment of the present application also provides a computer device, Figure 4 This is a basic structural block diagram of the computer device in this embodiment.

[0104] Specifically, the computer device 4 includes a memory 41, a processor 42, and a network interface 43 that are interconnected through a system bus. It should be noted that the figure only shows a computer device 4 with components 41-43, but it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented instead. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0105] The computer device may be a desktop computer, notebook computer, PDA, cloud server, etc. The computer device may interact with the user via a keyboard, mouse, remote control, touchpad, or voice control device.

[0106] The memory 41 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 41 can be an internal storage unit of the computer device 4, such as the hard disk or memory of the computer device 4. In other embodiments, the memory 41 can also be an external storage device of the computer device 4, such as a plug-in hard disk equipped on the computer device 4, a smart memory card (SMC), a secure digital (SD) card, a flash memory card, etc. Of course, the memory 41 can also include both the internal storage unit of the computer device 4 and its external storage device. In this embodiment, the memory 41 is generally used to store the operating system and various application software installed on the computer device 4, such as the program code of a pad parameter verification and correction method. In addition, the memory 41 can also be used to temporarily store various types of data that have been output or are to be output.

[0107] In some embodiments, the processor 42 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip. The processor 42 is generally used to control the overall operation of the computer device 4. In this embodiment, the processor 42 is used to execute program code stored in the memory 41 or process data, such as executing the program code of the pad parameter calibration method.

[0108] The network interface 43 may include a wireless network interface or a wired network interface. The network interface 43 is generally used to establish a communication connection between the computer device 4 and other electronic devices.

[0109] The present application also provides a computer-readable storage medium, which stores a pad parameter verification and correction program. The pad parameter verification and correction program can be executed by at least one processor to enable the at least one processor to perform the steps of the above-mentioned pad parameter verification and correction method.

[0110] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0111] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A pad parameter calibration and correction method, characterized in that: The steps include: Receive a pad file verification and correction instruction, and scan the pad files in the database according to the verification and correction instruction; Obtain the scanned pad files, and determine in turn whether the pad parameter information of each pad file is complete; If the pad parameters of the pad file are complete, a verification rule is obtained, and the pad parameters of the pad file are verified according to the verification rule. If the verification passes, the verification is ended or the remaining pad files are verified. If the verification fails, the incorrect pad parameters in the pad file are corrected according to the verification rule, wherein the obtaining of the verification rule includes: obtaining a pad type corresponding to the pad file, wherein the pad type includes an SMD type and a DIP type, and obtaining a corresponding verification rule according to the pad type; Wherein, if the pad type determined is the SMD type, verifying the pad parameters of the pad file according to the verification rule includes: obtaining BEGIN LAYER layer parameters, SOLDER LAYER layer parameters, and PASTELAYER layer parameters of the pad file; determining whether the SOLDER LAYER layer parameters are not less than the BEGIN LAYER layer parameters and determining whether the PASTE LAYER layer parameters are equal to the BEGIN LAYER layer parameters; Wherein, if it is determined that the pad type is a DIP type, the verifying the pad parameters of the pad file according to the verification rules includes: obtaining pad drilling aperture parameters, BEGIN LAYER layer data and SOLDER LAYER layer data of the pad file; determining at least one preset threshold corresponding to the pad drilling aperture parameter, the preset threshold being used to determine the parameter range to which the pad drilling aperture parameter belongs, verifying the BEGIN LAYER layer parameters based on the parameter range, and determining whether the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to a first preset difference corresponding to the parameter range; verifying the SOLDER LAYER layer parameters according to the BEGIN LAYER layer parameters, and determining whether the difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to a second preset difference; If the pad parameters of the pad file are incomplete, obtaining the verification rule, adding the missing pad parameters in the pad file according to the verification rule, and after the pad parameters are complete, verifying the pad parameters of the pad file according to the verification rule, and ending the verification or verifying the remaining pad files if the verification passes, and correcting the erroneous pad parameters in the pad file according to the verification rule if the verification fails; The pad file after pad parameter correction processing is completed is updated into the database.

2. The pad parameter calibration and correction method according to claim 1, wherein: If the verification fails, correcting the incorrect pad parameters in the pad file according to the verification rules includes: If the SOLDER LAYER layer parameter is less than the BEGIN LAYER layer parameter, adjusting the SOLDER LAYER layer parameter according to the BEGIN LAYER layer parameter so that the SOLDER LAYER layer parameter is not less than the BEGIN LAYER layer parameter; if the PASTE LAYER layer parameter is not equal to the BEGIN LAYER layer parameter, adjusting the PASTE LAYER layer parameter according to the BEGIN LAYER layer parameter so that the PASTE LAYER layer parameter is equal to the BEGIN LAYER layer parameter; The directly correcting the pad parameters missing in the pad file according to the verification rules includes: According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters and the PASTELAYER layer parameters are added so that the SOLDER LAYER layer parameter data is not less than the BEGIN LAYER layer parameter data, and the PASTE LAYER layer parameter data is equal to the BEGIN LAYER layer parameter data.

3. The pad parameter calibration and correction method according to claim 1, wherein: The pad parameters of the pad file are checked according to the check rule and further include: Get the ANTIPAD parameters, DEFAUL INTERNAL parameters and END LAYER layer parameters in the pad file; The ANTIPAD parameter, DEFAUL INTERNAL parameter and END LAYER layer parameter are checked according to the BEGIN LAYER layer parameter to determine whether the difference between the ANTIPAD parameter and the BEGIN LAYER layer parameter is equal to a third preset difference, and to determine whether the DEFAUL INTERNAL parameter or the END LAYER layer parameter is equal to the BEGINLAYER layer parameter.

4. The pad parameter calibration and correction method according to claim 3, wherein: If the verification fails, correcting the incorrect pad parameters in the pad file according to the verification rules includes: If the difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is not equal to the first preset difference corresponding to the parameter range, adjusting the BEGIN LAYER layer parameter according to the pad drilling aperture parameter so that the difference between the BEGIN LAYER layer parameter and the pad drilling aperture parameter is equal to the first preset difference corresponding to the parameter range; If the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is not equal to the second preset difference, adjusting the SOLDER LAYER layer parameter according to the BEGIN LAYER layer parameter so that the difference between the SOLDER LAYER layer parameter and the BEGIN LAYER layer parameter is equal to the second preset difference; If the difference between the ANTIPAD parameter and the BEGIN LAYER parameter is not equal to the third preset difference, adjusting the ANTIPAD parameter according to the BEGIN LAYER parameter so that the difference between the ANTIPAD parameter and the BEGIN LAYER parameter is equal to the third preset difference; If the DEFAUL INTERNAL parameter or the END LAYER layer parameter is not equal to the BEGIN LAYER layer parameter, adjusting the DEFAUL INTERNAL parameter or the END LAYER layer parameter according to the BEGIN LAYER layer parameter so that the DEFAUL INTERNAL layer parameter or the END LAYER layer parameter is equal to the BEGIN LAYER parameter; The directly correcting the pad parameters missing in the pad file according to the verification rules includes: According to the verification rules, the missing parameters in the BEGIN LAYER layer parameters, the SOLDER LAYER layer parameters, the ANTIPAD parameters, the DEFAUL INTERNAL parameters and the END LAYER layer parameters are added so that the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to the first preset difference corresponding to the parameter range, and the difference between the SOLDER LAYER layer parameters and the BEGIN LAYER layer parameters is equal to the second preset difference, and the difference between the ANTIPAD parameters and the BEGIN LAYER layer parameters is equal to the third preset difference, and at the same time, the DEFAUL INTERNAL parameters or the END LAYER layer parameters are equal to the BEGIN LAYER layer parameters.

5. A pad parameter calibration and correction device, characterized in that: include: A receiving module is used to receive pad file verification and correction instructions; A scanning module, configured to scan pad files in a database according to the verification and correction instructions; The calibration and correction module is used to obtain the scanned pad file, and judge whether the pad parameter information of each pad file is complete in turn. If the pad parameters of the pad file are complete, the calibration rule is obtained, and the pad parameters of the pad file are verified according to the calibration rule. If the calibration passes, the calibration ends or the remaining pad files are verified. If the calibration fails, the erroneous pad parameters in the pad file are corrected according to the calibration rule. If the pad parameters of the pad file are incomplete, the calibration rule is obtained, and the missing pad parameters in the pad file are added according to the calibration rule. After the pad parameters are complete, the pad file is corrected according to the calibration rule. The pad parameters are checked, and if the check is passed, the check is ended or the remaining pad files are checked. If the check is not passed, the erroneous pad parameters in the pad file are corrected according to the check rules, wherein the obtaining of the check rules includes: obtaining the pad type corresponding to the pad file, wherein the pad type includes SMD type and DIP type, and obtaining the corresponding check rules according to the pad type; wherein, if the pad type obtained is the SMD type, the checking of the pad parameters of the pad file according to the check rules includes: obtaining the BEGIN LAYER layer parameters, SOLDER LAYER layer parameters and PASTE LAYER layer parameters; judging whether the SOLDER LAYER layer parameters are not less than the BEGIN LAYER layer parameters and judging whether the PASTE LAYER layer parameters are equal to the BEGIN LAYER layer parameters; wherein, if the pad type determined is a DIP type, the pad parameters of the pad file according to the verification rules are verified, including: obtaining pad drilling aperture parameters, BEGIN LAYER layer data and SOLDER LAYER layer data of the pad file; determining at least one preset threshold corresponding to the pad drilling aperture parameter, the preset threshold being used to determine the parameter range to which the pad drilling aperture parameter belongs, verifying the BEGIN LAYER layer parameters based on the parameter range, and judging whether the difference between the BEGIN LAYER layer parameters and the pad drilling aperture parameters is equal to the first preset difference corresponding to the parameter range; verifying the SOLDER LAYER layer parameters according to the BEGIN LAYER layer parameters, and judging whether the SOLDER LAYER layer parameters are equal to the BEGIN LAYER layer parameters. Whether the difference of LAYER layer parameters is equal to the second preset difference; An updating module, configured to update the pad file after pad parameter correction processing is completed into the database; The receiving module, scanning module, checking and correcting module and updating module are connected in sequence, and the updating module is connected to the database.

6. A computer device, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the steps of the pad parameter verification and correction method according to any one of claims 1 to 4 are implemented.

7. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the pad parameter verification and correction method according to any one of claims 1 to 4.

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