Substrate conveying device and substrate processing system having the same

Abstract

A substrate conveying device and a substrate processing system having the same are provided. The substrate conveying device can prevent the temperature of the conveying robot from rising by arranging a cooling plate around the conveying robot. The substrate conveying device comprises: a conveying unit for conveying the substrate; and a cooling plate for controlling the temperature of the conveying unit, wherein the cooling plate is separated from the side of the conveying unit to form a side wall, or is arranged in close contact with the side of the conveying unit.

Description

Technical Field

[0001] The present invention relates to a substrate conveying device for conveying a substrate and a substrate processing system having the same, and more particularly to a substrate conveying device arranged between a plurality of process chambers and a substrate processing system having the same. Background Art

[0002] Semiconductor elements can be manufactured by forming a predetermined pattern on a substrate. When forming a predetermined pattern on a substrate, a plurality of processes such as a deposition process, a photolithography process, an etching process, and a cleaning process can be continuously performed in a factory (FAB).

[0003] When manufacturing semiconductor devices, multiple processes may be performed in separate chambers, and the substrate may be transported to each chamber by a transport robot. Summary of the invention

[0004] Technical issues solved

[0005] The transport robot can use the LM guide system (Linear Motion Guide System) when transporting substrates (e.g., wafers). However, when the transport robot moves on the LM track to transport the substrate to the process chamber, the temperature of the transport robot may rise due to the heat generated by the motor drive.

[0006] In addition, in order to transport the substrate to each process chamber, a transport robot may be arranged between multiple process chambers. However, since the process chambers may reach a high temperature state to perform a predetermined process, the temperature of the transport robot may also rise due to the process chambers.

[0007] As described above, when the surface temperature of the transport robot rises, the driving performance of the transport robot may be affected, such as causing the transport robot to make abnormal movements during driving, and the life of the transport robot may be shortened.

[0008] The problem to be solved by the present invention is to provide a substrate transport device and a substrate processing system having the same. In the substrate transport device, a cooling plate is provided around the transport robot to prevent the temperature of the transport robot from rising.

[0009] The subject of the present invention is not limited to the above-mentioned subject, and those skilled in the art can clearly understand other subjects not mentioned through the following description.

[0010] Workaround

[0011] One aspect of the substrate conveying device of the present invention for solving the above-mentioned problems is that it includes: a conveying unit for conveying a substrate; and a cooling plate for controlling the temperature of the conveying unit, wherein the cooling plate is separated from the side of the conveying unit or is attached to the side of the conveying unit.

[0012] A channel for cooling water to flow may be provided inside the cooling plate.

[0013] The cooling plate may include: a first plate member; a second plate member combined with the first plate member; and a channel formed in a space between the first plate member and the second plate member and through which cooling water flows.

[0014] The channel may be provided as a tube inserted into a space between the first plate member and the second plate member, or as a groove formed on at least one surface of at least one of the first plate member and the second plate member.

[0015] When the groove is formed on the first plate member, the groove may be formed on a surface of the first plate member that contacts the second plate member when the first plate member and the second plate member are combined.

[0016] When the groove is formed on the second plate member, the groove may be formed on a surface of the second plate member that contacts the first plate member when the first plate member and the second plate member are combined.

[0017] At least one of a thermal compound, a thermal pad and a thermal grease may be disposed on the channel.

[0018] The channel can be formed in a zigzag pattern.

[0019] The first plate member and / or the second plate member may be manufactured by using a substance that releases cool air to the outside as a material.

[0020] The cooling plate may further include a pump which supplies cooling water to the channel, and a valve which opens and closes the channel to control the flow of the cooling water.

[0021] A cooling plate may also be provided below the transport unit.

[0022] When the cooling plate is disposed in close contact with the side of the conveying unit, the cooling plate may be disposed by combining a first protrusion formed on the cooling plate and a second protrusion formed on the conveying unit, and the first protrusion and the second protrusion may have different heights.

[0023] When the cooling plate is disposed in contact with the side surface of the conveying unit, the cooling plate may be disposed by combining a protrusion formed on either the cooling plate or the conveying unit with a groove formed on the other, and the protrusion and the groove may have the same height.

[0024] The cooling water may be process cooling water (PCW).

[0025] The substrate conveying device may further include: a guide rail providing a moving path of the conveying unit; and a support block coupled to an upper portion of the guide rail, supporting the conveying unit, and sliding along the guide rail.

[0026] Another aspect of the substrate conveying device of the present invention for solving the above-mentioned problems is that it includes: a conveying unit for conveying the substrate; and a cooling plate for controlling the temperature of the conveying unit, wherein the cooling plate is separated from the side of the conveying unit to form a side wall, or is arranged in close contact with the side of the conveying unit, and a channel for cooling water to flow is provided inside the cooling plate, and at least one of thermal paste, thermal pad and thermal grease is provided on the channel.

[0027] One aspect of the substrate processing system of the present invention for solving the above-mentioned problems is that it includes: a first process chamber, which is used to process the substrate; a second process chamber, which is used to process the substrate; and a substrate conveying device, which includes a conveying unit and a cooling plate, the conveying unit conveys the substrate between the first process chamber and the second process chamber, and the cooling plate controls the temperature of the conveying unit, wherein the cooling plate is separated from the side of the conveying unit to form a side wall, or is arranged in contact with the side of the conveying unit.

[0028] Specific details of other embodiments are included in the description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a plan view schematically showing the internal structure of a substrate processing system including a substrate transfer device.

[0030] Figure 2 It is shown Figure 1 A three-dimensional diagram of the specific structure of the substrate transport device shown.

[0031] Figure 3 FIG. 1 is a plan view schematically showing a substrate transfer device having a cooling plate according to an embodiment of the present invention.

[0032] Figure 4 FIG. 1 is a cross-sectional view schematically showing a substrate transfer device having a cooling plate according to an embodiment of the present invention.

[0033] Figure 51 is a perspective view showing a specific structure of a cooling plate constituting a substrate transfer device according to an embodiment of the present invention.

[0034] Figure 6 It shows the composition Figure 5 A first exemplary diagram of various arrangements of the pipe components of the cooling plate is shown.

[0035] Figure 7 It shows the composition Figure 5 A second exemplary diagram showing various configurations of the pipe components of the cooling plate is shown.

[0036] Figure 8 FIG. 1 is a reference diagram for explaining the performance of a substrate transfer apparatus having a cooling plate according to an embodiment of the present invention.

[0037] Fig. 9 FIG. 1 is a cross-sectional view schematically showing a substrate transfer device having a cooling plate according to another embodiment of the present invention.

[0038] Fig.10 1 is a first exemplary diagram for explaining various coupling modes between a conveying unit and a cooling plate constituting a substrate conveying device according to an embodiment of the present invention.

[0039] Fig.11 FIG. 1 is a second exemplary diagram for explaining various coupling modes between the transfer unit and the cooling plate constituting the substrate transfer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The advantages and features of the present invention, and methods for achieving them will become clear by referring to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of forms that are different from each other, and these embodiments are provided only to make the present invention fully disclosed and to fully inform the scope of the invention to those of ordinary skill in the art to which the present invention belongs, and the present invention is limited only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0041] When an element or layer is referred to as being “on” or “over” another element or layer, this includes not only the case where it is directly above the other element or layer, but also the case where other layers or elements are interposed therebetween. Conversely, when an element is referred to as being “directly on” or “directly above,” it means that no other element or layer is interposed therebetween.

[0042] Spatially relative terms such as "below", "beneath", "lower", "above", "upper", etc. can be used to easily describe the relationship between one element or constituent element and another element or constituent element as shown in the figure. Spatially relative terms should be understood to include the directions shown in the drawings and the terms of different directions of the elements when they are in use or in operation. For example, when the elements shown in the drawings are turned over, an element described as being "below" or "beneath" another element can be located "above" another element. Therefore, the exemplary term "below" can include both below and above directions. Elements can also face other directions, and thus, spatially relative terms can be interpreted based on the orientation.

[0043] Although the terms first, second, etc. are used to describe various elements, constituent elements, and / or sections, it is obvious that these elements, constituent elements, and / or sections are not limited to these terms. These terms are only used to distinguish one element, constituent element, or section from another element, constituent element, or section. Therefore, within the scope of the technical concept of the present invention, the first element, first constituent element, or first section mentioned below may obviously also be the second element, second constituent element, or second section.

[0044] The terms used in this specification are used to describe the embodiments and are not intended to limit the present invention. In this specification, unless otherwise specified in the text, the singular form also includes the plural form. The "comprises" and / or "comprising" used in the specification does not exclude the existence or addition of one or more other constituent elements, steps, actions and / or elements in addition to the mentioned constituent elements, steps, actions and / or elements.

[0045] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification can be used as the meanings commonly understood by ordinary technicians in the technical field to which the present invention belongs. In addition, unless otherwise clearly defined, the terms defined in the general dictionary should not be interpreted or over-interpreted in an idealized manner.

[0046] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals regardless of the figure numbers, and repeated descriptions thereof will be omitted.

[0047] When the temperature of a transfer robot that transfers substrates between a plurality of process chambers rises, the driving performance of the transfer robot may be degraded and the life of the transfer robot may be shortened.

[0048] Although airflow may be used to cool the transfer robot, since a substrate processing system having a plurality of process chambers and a transfer robot is operated in a vacuum state, there is a problem that the cooling method using airflow is difficult to apply.

[0049] The present invention provides a substrate processing system and a substrate conveying device of the system. The substrate processing system can prevent the temperature of the conveying robot (for example, the surface temperature of the conveying robot, the internal temperature of the conveying robot, etc.) from rising by setting a cooling plate around the conveying robot.

[0050] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and the like.

[0051] Figure 1 It is a plan view schematically showing the internal structure of a substrate processing system including a substrate transfer device.

[0052] according to Figure 1 The substrate processing system 100 may be configured to include a graduation module 110 and a process module 120 .

[0053] The indexing module 110 and the process module 120 may be arranged in sequence along one direction. In the present embodiment, the direction in which the indexing module 110 and the process module 120 are arranged is defined as a first direction 10. In addition, a direction perpendicular to the first direction 10 when viewed from above is defined as a second direction 20, and a direction perpendicular to a plane including the first direction 10 and the second direction 20 is defined as a third direction 30.

[0054] The indexing module 110 is disposed in front of the process module 120. The indexing module 110 may be configured to include a loading port 111 and a transfer frame 112.

[0055] The loading port 111 is used to place a carrier 130 for receiving a substrate. The loading port 111 may be provided in plurality in front of the transfer frame 112 , and the plurality of loading ports 111 may be arranged in a row along the second direction 20 .

[0056] Figure 1 4 shows a case where four loading ports 111 are provided in the indexing module 110. However, the present embodiment is not limited thereto. The number of loading ports 111 may also be increased or decreased according to conditions such as the process efficiency and the footprint of the process processing module 120.

[0057] The carrier 130 is used to receive a plurality of substrates (eg, wafers), and may have a slot (not shown) therein configured to support the edge of the substrate.

[0058] A plurality of slits may be provided along the third direction 30. At this time, the substrates may be stacked in a state of being spaced apart from each other along the third direction 30 and positioned within the carrier 130. For example, the carrier 130 may be implemented as a Front Opening Unified Pod (FOUP).

[0059] The transfer frame 112 is used to transfer the substrate between the carrier 130 placed at the loading port 111 and the buffer unit 121. The transfer frame 112 may be configured to include an index rail 113 and an index robot 114.

[0060] The indexing track 113 is used to provide a path for the indexing robot 114 to move. The indexing track 113 may be arranged such that its length direction is parallel to the second direction 20.

[0061] The indexing robot 114 is used to directly transport the substrate and can be disposed on the indexing track 113 and can move linearly along the second direction 20 on the indexing track 113 .

[0062] The indexing robot 114 may be configured to include a first base 114 a , a first body 114 b and an indexing arm 114 c , wherein the first base 114 a may be configured to be movable along the indexing track 113 .

[0063] The first body 114b may be combined with the first base 114a. The first body 114b may be configured to be movable on the first base 114a along the third direction 30. In addition, the first body 114b may also be configured to be rotatable on the first base 114a.

[0064] The indexing arm 114c may be combined with the first body 114b and may be configured to be able to move forward and backward relative to the first body 114b. The indexing arm 114c may be provided in plurality on the first body 114b, and the plurality of indexing arms 114c may be configured to be driven separately.

[0065] The plurality of indexing arms 114c may be stacked and arranged in a state of being spaced apart from each other along the third direction 30. Some of the plurality of indexing arms 114c may be used to transport the substrate from the process treatment module 120 to the carrier 130, while the other may be used to transport the substrate from the carrier 130 to the process treatment module 120. By configuring the plurality of indexing arms 114c as described above, it is possible to obtain an effect of preventing particles generated from the substrate before the process treatment from being attached to the substrate after the process treatment during the process of the indexing robot 114 transporting the substrate in and out.

[0066] The process treatment module 120 may be configured to include a buffer unit 121 , a substrate transfer device 122 , and a process chamber 123 .

[0067] The buffer unit 121 is used to provide a space for the substrate to stay before being transported between the conveying frame 112 and the substrate conveying device 122. To this end, the buffer unit 121 may be disposed between the conveying frame 112 and the substrate conveying device 122.

[0068] The buffer unit 121 may be provided with a slit (not shown) for placing the substrate inside. The buffer unit 121 may be provided with a plurality of slits, and the plurality of slits may be provided spaced apart from each other along the third direction 30. In addition, in the buffer unit 121, the surface opposite to the transfer frame 112 and the surface opposite to the substrate conveying device 122 may be opened.

[0069] The substrate conveying device 122 is used to convey the substrate between the buffer unit 121 and the process chamber 123. The substrate conveying device 122 may be configured to include a guide rail and a conveying unit. Figure 2 The substrate transport device 122 is described in more detail.

[0070] In addition, the substrate transport device 122 may also transport the substrate between two different process chambers 123 .

[0071] The substrate conveying device 122 may be arranged so that its length direction is parallel to the first direction 10. At this time, a plurality of process chambers 123 may be arranged on both sides of the substrate conveying device 122 along the second direction 20, respectively, and a plurality of process chambers 123 may also be arranged on each side of the substrate conveying device 122 along the first direction 10.

[0072] The plurality of process chambers 123 may be stacked on each other. That is, the plurality of process chambers 123 may be arranged in an X*Y arrangement on one side of the substrate conveying device 122. Wherein X is a natural number greater than or equal to 1, which means the number of process chambers 123 arranged in a row along the first direction 10, and Y is a natural number greater than or equal to 1, which means the number of process chambers 123 arranged in a row along the third direction 30.

[0073] For example, when four process chambers 123 are provided on one side of the substrate transfer device 122, the four process chambers 123 may be arranged in a 2*2 arrangement, and when six process chambers 123 are provided on one side of the substrate transfer device 122, the six process chambers 123 may be arranged in a 3*2 arrangement.

[0074] In addition, the number of the process chambers 123 may be increased or decreased. In addition, the process chambers 123 may be provided only on one side of the substrate transfer device 122 , or a single layer of process chambers 123 may be provided on one side or both sides of the substrate transfer device 122 .

[0075] In the present embodiment, the process chamber 123 may be implemented as an etching chamber for etching a substrate, but the present embodiment is not limited thereto. The process chamber 123 may also be implemented as a cleaning chamber for cleaning a substrate.

[0076] Next, the substrate conveying device 122 will be described. Figure 2 It is shown Figure 1 A three-dimensional diagram of the specific structure of the substrate transport device shown.

[0077] according to Figure 2 The substrate conveying device 122 may be configured to include a conveying unit 210 , a guide rail 220 , and a supporting block 230 .

[0078] The substrate transport device 122 is used to transport a substrate W (eg, a wafer). The substrate transport device 122 may transport the substrate between the buffer unit 121 and the process chamber 123 , or between a first chamber that is any one of the plurality of process chambers 123 and a second chamber that is another one of the plurality of process chambers 123 .

[0079] The first chamber and the second chamber may both be implemented as etching chambers. However, the present embodiment is not limited thereto. Any one of the first chamber and the second chamber may also be implemented as an etching chamber, and the other chamber may be implemented as a cleaning chamber.

[0080] The transport unit 210 performs linear motion between the buffer unit 121 and the process chamber 123 or between the first chamber and the second chamber to transport the substrate W. The transport unit 210 may be implemented as a transport robot.

[0081] The transport unit 210 may be disposed on the guide rail 220. The transport unit 210 may linearly move along the first direction 10 on the guide rail 220 in a state where the substrate W is loaded.

[0082] The transport unit 210 may be configured to include a second base 211 , a second body 212 , a driving member 213 , and an arm member 214 .

[0083] The second base 211 is in a flat plate form and can be disposed below the conveying unit 210. The second base 211 can be configured to be movable in the first direction 10 along the guide rail 220.

[0084] The second base 211 may be disposed on the support block 230. At this time, the second base 211 may have a tube inside to electrically connect the support block 230 with the motor.

[0085] The pipeline inside the second base 211 can be formed using a conductive material (for example, a metal such as copper). However, the present embodiment is not limited thereto. A transmission line can also be provided inside the second base 211 to electrically connect the support block 230 to the motor.

[0086] The second base 211 may be disposed on a plurality of support blocks 230 spaced apart at a predetermined interval. As an example, the second base 211 may be disposed on four support blocks 230 spaced apart at a predetermined interval in the first direction 10 and the second direction 20.

[0087] The second body 212 constitutes a main body of the conveying unit 210 and can be combined with the second base 211. The second body 212 can be configured to support the driving member 213 and the arm member 214.

[0088] The driving component 213 is used to move the arm component 214 to a predetermined position. The driving component 213 can be configured to be rotatable on the second body 212 toward the second direction 20. In addition, the driving component 213 can also be configured to be able to rise and fall along the third direction 30 on the second body 212.

[0089] The arm part 214 is used to load the substrate W, and can unload the substrate W to a predetermined position according to the control of the driving part 213 .

[0090] A single arm member 214 may be provided on the driving member 213. In this case, the arm member 214 may be coupled and provided to the upper surface of the driving member 213 from the side. However, the present embodiment is not limited thereto. A plurality of arm members 214 may also be provided on the driving member 213.

[0091] When a plurality of arm members 214 are provided on the driving member 213, they can be arranged in a stacked state in the up-down direction (i.e., the third direction 30) on the side of the driving member 213 in a state of being spaced apart from each other. When a plurality of arm members 214 are provided on the driving member 213, they can also be arranged in a state of being arranged in the left-right direction (i.e., the first direction 10 or the second direction 20) on the side of the driving member 213.

[0092] When a plurality of arm components 214 are provided on the driving component 213 , some of the plurality of arm components 214 may be used to transport the substrate from the buffer unit 121 to the process chamber 123 , while others may be used to transport the substrate from the process chamber 123 to the buffer unit 121 .

[0093] The guide rail 220 is used to provide a path for the conveying unit 210 to move. The guide rail 220 may be arranged such that its length direction is the first direction 10, and may be arranged as a pair of rails 221, 222, that is, a first rail 221 and a second rail 222.

[0094] The support block 230 is coupled to the upper portion of the guide rail 220. The support block 230 may be configured to be slidable in the first direction 10 along the guide rail 220. The transport unit 210 may be disposed on the support block 230.

[0095] A plurality of support blocks 230 may be provided on the guide rail 220. At this time, a plurality of support blocks 230 may be provided on the first rail 221 and the second rail 222 constituting the guide rail 220, respectively.

[0096] When a plurality of support blocks 230 are respectively provided on the first rail 221 and the second rail 222, the same number of support blocks 230 may be provided on the first rail 221 and the second rail 222. For example, two support blocks 230 may be respectively provided on the first rail 221 and the second rail 222.

[0097] The support block 230 may include a first block 231, a second block 232, a third block 233, and a fourth block (not shown). The first block 231 and the second block 232 may be disposed on the first rail 221 and may be spaced apart in the first direction 10. The third block 233 and the fourth block may be disposed on the second rail 222 and may be spaced apart in the first direction 10 similarly to the first block 231 and the second block 232.

[0098] The third block 233 may be formed at a position corresponding to the first block 231. That is, the third block 233 may be formed at a position parallel to the first block 231 in the second direction 20. Figure 2 Although not shown, the second block 232 and the fourth block may also be formed in the same form as the first block 231 and the third block 233 .

[0099] In the above description, the substrate conveying device 122 is defined as being used to convey the substrate between the buffer unit 121 and the process chamber 123 (or between the first chamber and the second chamber). However, the present embodiment is not limited thereto. Obviously, the transfer frame 112 for conveying the substrate between the carrier 130 placed at the loading port 111 and the buffer unit 121 may also be implemented as the substrate conveying device.

[0100] The substrate transfer device 122 may include a cooling plate located around the transfer unit 210 to control the temperature of the transfer unit 210. This will be described below.

[0101] Figure 3 is a plan view schematically showing a substrate transport device having a cooling plate according to an embodiment of the present invention, and Figure 4 FIG. 1 is a cross-sectional view schematically showing a substrate transfer device having a cooling plate according to an embodiment of the present invention.

[0102] according to Figure 3 and Figure 4 The substrate transfer device 122 may be configured to include a transfer unit 210 , a guide rail 220 , a cooling plate 310 , a pump 320 , a cooling channel 330 , and a valve 340 .

[0103] Reference above Figure 2 The conveying unit 210 and the guide rail 220 are described, and thus a detailed description thereof will be omitted. Figure 3 and Figure 4 Although not shown, the substrate transport device 122 may also be configured to include a support block 230 .

[0104] The cooling plate 310 is used to control the temperature of the transport unit 210 (e.g., the surface temperature of the transport unit 210, the internal temperature of the transport unit 210, etc.). The cooling plate 310 may be provided with a cooling channel 330 for cooling water (coolant) to flow therethrough, and the cooling plate 310 may control the temperature of the transport unit 210 by the cooling water flowing through the cooling channel 330.

[0105] like Figure 5 As shown, the cooling plate 310 may be configured to include a first plate member 410 , a tube member 420 , and a second plate member 430 . Figure 5 1 is a perspective view showing a specific structure of a cooling plate constituting a substrate transfer device according to an embodiment of the present invention.

[0106] A body is used to constitute the main body of the cooling plate 310. The body may be formed by combining the first plate member 410 and the second plate member 430.

[0107] The first plate member 410 is disposed at one side of the tube member 420. The first plate member 410 may be formed to cover one side of the tube member 420 and may be configured to be formed of an appropriate material so as to be able to release cool air emitted from the tube member 420 to the outside.

[0108] The second plate member 430 is disposed on the other side of the tube member 420. The second plate member 430 may be formed to cover the other side of the tube member 420, and may be formed to be combined with the first plate member 410 to seal the tube member 420. Similar to the first plate member 410, the second plate member 430 may also be configured to be formed of an appropriate material to be able to release the cold air emitted from the tube member 420 to the outside.

[0109] The pipe member 420 is used to provide a passage through which cooling water can flow. The pipe member 420 may be disposed inside the cooling plate 310 and may be disposed to prevent its outer shape from being exposed to the outside through the first plate member 410 and the second plate member 430 .

[0110] like Figure 6 As shown, the pipe member 420 may be provided in a zigzag shape in the direction from top to bottom (ie, the negative third direction 30) inside the cooling plate 310. However, the present embodiment is not limited thereto. Figure 7 As shown, the tube member 420 may be disposed in a zigzag configuration in a direction from one side to the other side (ie, the first direction 10 ). Figure 6 It shows the composition Figure 5 The first exemplary diagram of various configurations of the pipe components of the cooling plate shown in FIG. Figure 7 It shows the composition Figure 5 A second exemplary diagram showing various configurations of the pipe components of the cooling plate is shown.

[0111] In addition, the cooling plate 310 may not have the additional pipe member 420 , but a groove that can be used as a channel for cooling water to flow may be formed on at least one of the first plate member 410 and the second plate member 430 .

[0112] In addition, in this embodiment, in order to improve the cooling efficiency of the cooling plate 310, a thermal compound may be applied on the surface of the tube member 420 or a thermal pad may be installed on the surface of the tube member 420. In addition, in this embodiment, thermal grease may also be applied on the surface of the tube member 420.

[0113] Refer again Figure 3 Provide explanation.

[0114] The cooling plate 310 may be disposed on the side of the conveying unit 210. The cooling plate 310 may be disposed on both sides of the conveying unit 210, or may be disposed on only one side of the conveying unit 210.

[0115] When the cooling plate 310 is disposed on the side of the conveying unit 210 as described above, Figure 8As shown, even if high-temperature heat 510 is released from the plurality of process chambers 123 disposed at both sides of the conveying unit 210 , the temperature of the conveying unit 210 can be prevented from rising by the cooling plate 310 . Figure 8 FIG. 1 is a reference diagram for explaining the performance of a substrate transfer apparatus having a cooling plate according to an embodiment of the present invention.

[0116] In addition, if Fig. 9 As shown, the cooling plate 310 may be disposed not only at the side of the conveying unit 210 , but also below the conveying unit 210 . Fig. 9 FIG. 1 is a cross-sectional view schematically showing a substrate transfer device having a cooling plate according to another embodiment of the present invention.

[0117] Refer again Figure 3 Provide explanation.

[0118] The pump 320 is used to supply cooling water to the cooling channel 330. The pump 320 may be disposed outside the cooling plate 310, and supplies cooling water to the cooling channel 330 (ie, the pipe member 420) formed to extend toward the inside of the cooling plate 310.

[0119] The cooling channel 330 is used to provide a path for cooling water to flow. The cooling channel 330 can be connected to the pump 320, and can be formed inside the cooling plate 310 through an inlet (coolant in) 331 and an outlet (coolant out) 332 located inside the cooling plate 310. The cooling water supplied by the pump 320 can flow through the cooling channel 330 provided inside the cooling plate 310 in the form of a pipe member 420 and be discharged to the outside. In this embodiment, process cooling water (PCW) can be used as cooling water.

[0120] The valve 340 is used to control the flow of cooling water. The valve 340 can be disposed on the cooling channel 330 and control the flow of cooling water by opening and closing the cooling channel 330.

[0121] In addition, in this embodiment, the cooling plate 310 is not limited to Figure 3 As shown, the cooling plate 310 is arranged in a state of being separated from the conveying unit 210 by a predetermined distance. For example, the cooling plate 310 may also be arranged to be attached to the side of the conveying unit 210. When the cooling plate 310 is arranged to fit the side of the conveying unit 210 as described above, the cooling efficiency can be improved by the cooling plate 310.

[0122] When the cooling plate 310 is formed in contact with the side surface of the conveying unit 210, Fig.10As shown, the cooling plate 310 may be coupled to the side of the conveyor unit 210 using a first protrusion 610 formed on the side of the conveyor unit 210 and a second protrusion 620 formed on the side of the cooling plate 310 .

[0123] At this time, the second protrusion 620 may be formed on a side of the cooling plate 310 opposite to a side of the conveyor unit 210 , and may be formed at different heights from each other to cross the first protrusion 610 . Fig.10 1 is a first exemplary diagram for explaining various coupling modes between a conveying unit and a cooling plate constituting a substrate conveying device according to an embodiment of the present invention.

[0124] However, the present embodiment is not limited thereto. Fig.11 As shown, when the cooling plate 310 is formed in contact with the side of the conveying unit 210, the cooling plate 310 can also be coupled to the side of the conveying unit 210 by using the third protrusion 630 formed on the side of the conveying unit 210 and the groove 640 formed on the side of the cooling plate 310. At this time, the third protrusion 630 can be inserted into the groove 640, so that the cooling plate 310 is coupled to the side of the conveying unit 210. Fig.11 FIG. 1 is a second exemplary diagram for explaining various coupling modes between the transfer unit and the cooling plate constituting the substrate transfer device according to an embodiment of the present invention.

[0125] In addition, although not shown, in this embodiment, the cooling plate 310 can be coupled to the side of the conveying unit 210 by using a groove formed on the side of the conveying unit 210 and a fourth protrusion formed on the side of the cooling plate 310, and the cooling plate 310 can also be coupled to the side of the conveying unit 210 by bolting, welding, etc.

[0126] Reference above Figures 3 to 11 , describes a substrate transport device 122 according to various embodiments of the present invention. TM By installing the cooling plate 310 on the left / right side or below the conveying unit 210, a cooling effect on the heat generated by the conveying unit 210 can be obtained by utilizing the thermal radiation phenomenon.

[0127] The cooling plate 310 may be installed below, on the left or right side, or all of the below / left or right sides of the travel axis of the conveyor unit 210 as appropriate. In addition, the cooling plate 310 may play a role in suppressing the temperature rise caused by the process chamber 123 .

[0128] The cooling plate 310 may be configured as a structure in which cooling water (coolant) can flow. The cooling plate 310 may be formed as a structure in which cooling water can flow using an additional pipe, or a coolant path (Coolant Path) may be formed using a groove inside the plate.

[0129] When cooling water is injected into the cooling plate 310 using a pipe, thermal efficiency is very important. To this end, the thermal efficiency between the plate and the pipe can be improved by applying a thermal compound on a cooling pipe formed inside the cooling plate 310. Alternatively, the thermal efficiency can be improved by installing a thermal pad on the cooling pipe. Alternatively, the thermal efficiency can be improved by applying thermal grease on the cooling pipe.

[0130] The present invention also proposes a method for installing the transport unit 210 and the cooling plate 310 for achieving efficient heat exchange.

[0131] like Fig.10 As shown, in order to improve the heat exchange effect, the cooling plate 310 and the body (robot body) of the conveying unit 210 can be in a structure in which the wings intersect each other. Through the wing structure, the intersection area between the cooling plate 310 and the body of the conveying unit 210 can be maximized, thereby maximizing the heat exchange effect.

[0132] like Figure 6 and Figure 7 As shown, the cooling plate 310 may be structured so that cooling water circulates therein. The cooling water may utilize PCW supplied in a semiconductor production line.

[0133] Although the embodiments of the present invention are described above with reference to the accompanying drawings, it will be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing its technical ideas or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all aspects and not restrictive.

Claims

1. A substrate conveying device, comprising: A transport unit, used for transporting a substrate; as well as A cooling plate for controlling the temperature of the transport unit, In which, the cooling plate is arranged in contact with the side of the conveying unit, and the cooling plate is arranged by combining a first protrusion formed on the cooling plate and a second protrusion formed on the conveying unit, and the first protrusion and the second protrusion have different heights, or the cooling plate is arranged by combining a protrusion formed on either the cooling plate or the conveying unit and a groove formed on the other, and the protrusion and the groove have the same height.

2. The substrate transport device according to claim 1, wherein: A channel for cooling water to flow is provided inside the cooling plate.

3. The substrate transport device according to claim 1, wherein: The cooling plate comprises: a first plate member; a second plate member coupled to the first plate member; and A channel is formed in a space between the first plate member and the second plate member and allows cooling water to flow.

4. The substrate transport device according to claim 3, wherein: The passage is provided as a tube inserted into a space between the first plate member and the second plate member, or as a groove formed on at least one surface of at least one of the first plate member and the second plate member.

5. The substrate transport device according to claim 4, wherein: When the groove is formed on the first plate member, the groove is formed on a surface of the first plate member that contacts the second plate member when the first plate member and the second plate member are combined.

6. The substrate transport device according to claim 4, wherein: When the groove is formed on the second plate member, the groove is formed on a surface of the second plate member that contacts the first plate member when the first plate member and the second plate member are combined.

7. The substrate transporting device according to claim 3, wherein: At least one of thermal conductive paste, thermal conductive pad and thermal conductive grease is arranged on the channel.

8. The substrate transporting device according to claim 3, wherein: The channel is formed in a zigzag shape.

9. The substrate transporting device according to claim 3, wherein: The first plate member and / or the second plate member is manufactured by using, as a material, a substance that releases cool air emitted from the passage to the outside.

10. The substrate transporting device according to claim 3, wherein: The cooling plate further comprises: a pump that supplies the cooling water to the channel; and A valve opens and closes the passage to control the flow of the cooling water.

11. The substrate transporting device according to claim 1, wherein: The cooling plate is also arranged below the conveying unit.

12. The substrate conveying device according to claim 2, wherein: The cooling water is process cooling water.

13. The substrate transporting device according to claim 1, further comprising: A guide track, providing a moving path for the transport unit; as well as The supporting block is combined with the upper part of the guide rail, supports the conveying unit, and slides along the guide rail.

14. A substrate conveying device, comprising: A transport unit, used for transporting a substrate; as well as A cooling plate for controlling the temperature of the transport unit, The cooling plate is arranged to fit the side of the conveying unit, and the cooling plate is arranged by combining a first protrusion formed on the cooling plate and a second protrusion formed on the conveying unit, and the first protrusion and the second protrusion have different heights, or the cooling plate is arranged by combining a protrusion formed on either the cooling plate or the conveying unit and a groove formed on the other, and the protrusion and the groove have the same height. A channel for cooling water to flow is provided inside the cooling plate, and At least one of thermal conductive paste, thermal conductive pad and thermal conductive grease is arranged on the channel.

15. A substrate processing system, comprising: A first process chamber, for processing a substrate; A second process chamber, used for processing the substrate; as well as The substrate transport device comprises a transport unit and a cooling plate, wherein the transport unit transports the substrate between the first process chamber and the second process chamber, and the cooling plate controls the temperature of the transport unit. In which, the cooling plate is arranged in contact with the side of the conveying unit, and the cooling plate is arranged by combining a first protrusion formed on the cooling plate and a second protrusion formed on the conveying unit, and the first protrusion and the second protrusion have different heights, or the cooling plate is arranged by combining a protrusion formed on either the cooling plate or the conveying unit and a groove formed on the other, and the protrusion and the groove have the same height.

16. The substrate processing system according to claim 15, wherein: A channel for cooling water to flow is provided inside the cooling plate.

17. The substrate processing system according to claim 16, wherein: At least one of thermal conductive paste, thermal conductive pad and thermal conductive grease is arranged on the channel.

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