An integrated LED chip for use in high-density transparent display screens

Abstract

The present invention provides an integrated LED chip, which is applied to a high-density transparent display screen, and includes: a substrate, a driver chip, an LED epitaxial wafer, and a package body; the substrate is welded on the high-density transparent display screen through a pad, and the driver chip and the LED epitaxial wafer are both arranged on the substrate, wherein the driver chip and the LED epitaxial wafer are electrically connected through the substrate. The driver chip includes a power module and a driver unit; the power module is a voltage converter, and an external 12V wide voltage is connected to the VCC end of the driver chip, and the voltage converter converts the 12V wide voltage into 5V as the input voltage of the driver unit; the driver unit includes an LED driver module and a current regulating module, and the current regulating module is used to adjust the size of the LED driving current. The problem that the entire transparent display screen cannot be lit due to the increase in line resistance caused by the increase in the transparent display screen and the increase in display density is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of high-density transparent display, and in particular to an integrated LED chip applied to a high-density transparent display screen. Background Art

[0002] With the rapid development of the chip industry, there are more and more types of chips, and chip products have been used in all aspects of our lives. As a major branch, LED chips are mostly used in transparent displays. People's requirements for transparent displays are mainly large area and high display density. However, traditional LED chips cannot meet these requirements, because the power supply voltage of traditional LED chips is 5V. When the display area is large and the required display density is high, the line resistance of the display is too large, and the 5V voltage cannot drive the entire high-density transparent display. Therefore, a new LED chip is urgently needed to solve these problems. Summary of the invention

[0003] According to the above-mentioned technical problem that due to the large area, high display density and large line resistance of the transparent display screen, a higher wide voltage input is required to fully drive the entire transparent display screen, but the driving voltage of the traditional LED chip can only be 5V, an integrated LED chip is provided. The present invention adopts a power supply module to convert the 12V wide voltage into a 5V input voltage to power the drive unit to prevent the chip from burning. Alternatively, a current adjustment method is adopted to use a low current to realize the lighting of a high-density transparent display screen. The integrated LED chip of the high-density transparent display screen can well meet the current requirements of people for LED chips.

[0004] The technical means adopted by the present invention are as follows:

[0005] An integrated LED chip is used on a high-density transparent display screen, and its structure includes a substrate, a driver chip, and an LED epitaxial wafer; the substrate is welded on the high-density transparent display screen through a welding pad, and the driver chip and the LED epitaxial wafer are both arranged on the substrate, wherein the driver chip and the LED epitaxial wafer are electrically connected through the substrate.

[0006] Furthermore, the driving chip includes a power supply module and a driving unit; the power supply module is a voltage converter, the external 12V wide voltage is connected to the VCC terminal of the driving chip, and the voltage converter converts the 12V wide voltage into 5V as the input voltage of the driving unit; the driving unit includes an LED driving module and a current regulation module, and the current regulation module is used to adjust the size of the LED driving current.

[0007] Furthermore, the driver chip and LED epitaxial wafer are both soldered at corresponding positions of the substrate in a flip-chip manner; that is, the connection wires of the driver chip and the LED epitaxial wafer are all laid flat on the substrate and are respectively connected to the corresponding soldering pins of the driver chip and the LED epitaxial wafer.

[0008] Furthermore, the driver chip and the LED epitaxial wafer are connected by flying wires; that is, the interface on the driver chip is connected to the LED epitaxial wafer through flying wires, and the corresponding interface on the driver chip is respectively connected to the positive and negative poles of the power supply and the data input interface through flying wires.

[0009] Furthermore, a packaging body is also provided on the integrated LED chip, and the packaging body is provided on the substrate and bonded to the substrate via a highly transparent optical adhesive.

[0010] Furthermore, the LED epitaxial wafer includes LED epitaxial wafer R, LED epitaxial wafer G, and LED epitaxial wafer B.

[0011] Compared with the prior art, the present invention has the following advantages:

[0012] The integrated LED chip provided by the present invention has a power module that converts a power supply voltage with a wide voltage input range of 9-36V into a voltage required by a driving unit of 5V. The driving unit includes an LED driving module and a current regulating module, and the current regulating module is used to adjust the magnitude of the LED driving current, and use a low current to drive the entire high-density transparent display screen, thereby solving the problem that the entire transparent display screen cannot be lit due to the increase in line resistance caused by the increase in the transparent display screen and the increase in display density.

[0013] Based on the above reasons, the present invention can be widely promoted in the fields of high-density transparent display screens and the like. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 The figure is a schematic diagram of applying the integrated LED chip of the present invention to a high-density transparent display screen.

[0016] Figure 2 Schematic diagram of the chip pad and circuit structure of the transparent display.

[0017] Figure 3 This is a schematic diagram of the FPC pad and circuit structure of the transparent display.

[0018] Figure 4 A top view of an integrated LED chip provided in an embodiment of the present invention.

[0019] Figure 5This is a front view of the integrated LED chip provided by an embodiment of the present invention.

[0020] Figure 6 A top view of an integrated LED chip provided in another embodiment of the present invention.

[0021] Figure 7 This is a front view of an integrated LED chip provided by another embodiment of the present invention.

[0022] Figure 8 This is a structural block diagram of the driver chip of the present invention.

[0023] Fig. 9 This is a schematic diagram of the pins of a 4-pin LED chip of the present invention.

[0024] Fig.10 This is a schematic diagram of the circuit routing of the 4-pin LED chip of the present invention.

[0025] In the figure: 1. substrate; 2. driver chip; 2-1. power module; 2-2. driver unit; 3. LED epitaxial wafer; 3-1. LED epitaxial wafer R; 3-2. LED epitaxial wafer G; 3-3. LED epitaxial wafer B; 4. solder pad; 5. package body; 6. high-transparency optical adhesive; 7. high-density transparent display screen; 7-1. FPC connector solder pad; 7-2. micro-wire solid line; 7-3. micro-conductive grid line; 7-4. pin solder pad; 7-5. insulation area; 7-6. FPC connector. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, the numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0030] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0031] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below their position devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0032] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0033] like Figure 1-3 As shown, an integrated LED chip provided by the present invention is applied to a high-density transparent display screen 7, and the high-density transparent display screen 7 includes a micro-conductor solid circuit 7-2, a micro-conductive grid circuit 7-3, and an FPC connector 7-6; wherein, the micro-conductive grid circuit 7-3 is connected to the high-density transparent display screen 7, the micro-conductor solid circuit 7-2 is arranged at the edge of the high-density transparent display screen 7, one end of the micro-conductor solid circuit 7-2 is connected to the micro-conductive grid circuit 7-3, and the other end is connected to the FPC connector pad 7-1, and the FPC connector pad 7-1 is used to mount the FPC connector 7-6. An insulating area 7-5 is also provided on the high-density transparent display screen 7 to prevent short circuits between the pins. The high-density transparent display screen 7 can work normally with a voltage input in a wide voltage input range of 9-36V. Since the area on the transparent display screen is large, the dot spacing is dense, and the grid resistance from the bottom to the top is relatively large, a chip with a wide voltage input is required to achieve this.

[0034] like Figure 4-7 As shown, the present invention provides an integrated LED chip, including: a substrate 1, a driver chip 2, and an LED epitaxial wafer 3; the substrate 1 is welded on a high-density transparent display screen 7 through a welding pad 4, and the driver chip 2 and the LED epitaxial wafer 3 are both arranged on the substrate 1, wherein the driver chip 2 and the LED epitaxial wafer 3 are electrically connected through the substrate 1.

[0035] When specifically implemented, as a preferred embodiment of the present invention, Figure 8-9As shown, the driver chip 2 includes a power module 2-1 and a driver unit 2-2; the power module 2-1 is a voltage converter, the external 12V voltage is connected to the VCC terminal of the driver chip 2, and the voltage converter converts the 12V wide voltage into 5V as the input voltage of the driver unit 2-2; the driver unit 2-2 includes an LED driver module and a current regulation module, and the current regulation module is used to adjust the size of the LED drive current. The specific working principle is as follows:

[0036] Embodiment 1:

[0037] Assuming that the LED chip is mounted on a traditional flexible transparent display, the spacing between the two columns of lights is fixed, the overall width of the grid remains unchanged, and the resistance R remains unchanged, there are two cases:

[0038] Case 1: P = U * I, the traditional power supply voltage U1 = 5V, the power supply voltage U2 = 12V, the number of LED chips that can be driven by the traditional voltage is N1, the power of the LED chip remains unchanged, It is concluded that the input current I2 at this time satisfies the conventional input current I1 by I2=0.417I1. The number of LED chips that can be driven by the voltage at this time is N2=2.4N1.

[0039] Conclusion 1: A larger area of ​​flexible transparent display can be controlled to display normally.

[0040] Case 2: Assuming the static drive current I 模块 For traditional control lamp lighting current I RGB0 0.1 times of the current, adjust to the low current range I RGB1 isI RGB0 0.2 times of the current, adjust to the middle current range I RGB2 isI RGB0 0.4 times of the current, adjust to the high current range I RGB3 Equal to I RGB0 . From I=I 模块 +I RGB , the number of LED chips driven by the traditional input current is N0, it can be concluded that: the traditional input current I0 = 1.1I RGB0 ; Adjust the input current to the low current range I1 = 0.3I RGB0 ; Adjust the input current to the medium current range I2 = 0.5I RGB0 ; Adjust the input current to high current range I3 = 1.1I RGB0 Similarly, it can be concluded that when the current is adjusted to the low level, the number of LED chips that can be driven is N1 = 3.67N0; when the current is adjusted to the medium level, the number of LED chips that can be driven is N2 = 2.2N0; when the current is adjusted to the high level, the number of LED chips that can be driven is N3 = N0.

[0041] Conclusion 2: A larger area of ​​flexible transparent display can be controlled to display normally.

[0042] Embodiment 2:

[0043] Assume that the LED chip is mounted on a high-density transparent display screen, that is, the spacing between the two rows of lights becomes narrower, and the area of ​​the high-density transparent display screen remains unchanged. According to the resistance equivalent formula R = ρ * L / S, assuming that the dot spacing changes from 20 to 10, S becomes equivalent to 0.5S, and R 密 =2R 传 In order to ensure that the input voltage of the LED chip remains unchanged, the voltage of the equivalent wire on the transparent display screen remains unchanged. I 密 =0.5I 传 Among them, R 密 is the resistance of the equivalent wire of the high-density transparent display, R 传 is the resistance of the equivalent wire of the traditional flexible transparent display, I 密 is the current that can normally light up the entire high-density transparent display, I 传 The current is enough to normally light up the entire traditional flexible transparent display.

[0044] Conclusion 3: A smaller current is needed to drive the normal display of the entire high-density transparent display.

[0045] Case 3: P = U * I, the traditional power supply voltage U1 = 5V, the power supply voltage U2 = 12V, the number of LED chips that can be driven by the traditional voltage is N1, the power of the LED chip remains unchanged, It is concluded that the input current I2 at this time and the traditional input current I1 directly satisfy I2=0.417I1, It is concluded that the number of LED chips that can be driven by the voltage at this time is N2 = 2.4N1. The equivalent resistance of the metal grid of the LED chip farthest from the power input becomes larger, so the voltage drop on the metal grid becomes larger. Therefore, the use of a wide voltage input can ensure the normal operation of the LED chip. This improves the display density of traditional flexible transparent displays and can be applied to high-density transparent displays.

[0046] Case 4: Assuming the static drive current I 模块 For traditional control lamp lighting current I RGB0 0.1 times of the current, adjust to the low current range I RGB1 isI RGB0 0.2 times of the current, adjust to the middle current range I RGB2 isI RGB0 0.4 times of the current, adjust to the high current range I RGB3 Equal to I RGB0 . From I=I 模块 +IRGB , the number of LED chips driven by the traditional input current is N0, and the traditional input current I0=1.1I RGB0 ; Adjust the input current to the low current range I1 = 0.3I RGB0 ; Adjust the input current to the medium current range I2 = 0.5I RGB0 ; Adjust the input current to high current range I3 = 1.1I RGB0 Similarly, it can be concluded that when the current is adjusted to the low range, the number of LED chips that can be driven is N1 = 3.67N0; when the current is adjusted to the medium range, the number of LED chips that can be driven is N2 = 2.2N0; when the current is adjusted to the high range, the number of LED chips that can be driven is N3 = N0.

[0047] Conclusion 4: The display density of traditional flexible transparent displays is improved and can be applied to high-density transparent displays.

[0048] In a specific implementation, as a preferred embodiment of the present invention, the LED epitaxial wafer 3 includes an LED epitaxial wafer R3-1, an LED epitaxial wafer G3-2, and an LED epitaxial wafer B3-3.

[0049] In this embodiment, continue to refer to Figure 4-7 The driver chip 2 and the LED epitaxial wafer 3 are both soldered at corresponding positions of the substrate 1 in a flip-chip manner; that is, the connection wires of the driver chip 2 and the LED epitaxial wafer 3 are all laid flat on the substrate 1 and are respectively connected to the corresponding soldering pins of the driver chip 2 and the LED epitaxial wafer 3.

[0050] In this embodiment, continue to refer to Figure 4-7 The driver chip 2 and the LED epitaxial wafer 3 are connected by flying wires; that is, the R, G, and B interfaces on the driver chip 2 are connected to the LED epitaxial wafer R3-1, the LED epitaxial wafer G3-2, and the LED epitaxial wafer B3-3 through flying wires, and the corresponding interfaces on the driver chip 2 are respectively connected to the positive and negative poles of the power supply and the data input interface through flying wires.

[0051] When implementing the invention, as a preferred embodiment of the invention, continue to refer to Figure 4-7 The integrated LED chip is further provided with a package 5, which is disposed on the substrate 1 and attached to the substrate 1 via a highly transparent optical adhesive 6. In this embodiment, the package 5 is in a cup-shaped or baffle structure.

[0052] like Fig.10As shown in the figure, the data transmission process of the integrated LED chip applied to the high-density transparent display screen provided by the embodiment of the present invention is provided. In this embodiment, the driving unit is powered by converting the 12V wide voltage into the 5V LED chip input voltage to prevent the chip from burning. The external 12V voltage is connected to the VCC end of the LED chip, and the 12V voltage is converted into a 5V voltage to drive the LED chip through the power module 2-1. In this way, the number of LED chips can be increased by 2.4 times, and the display density is increased. The data is input from the SDI end of the LED chip and passes through the conversion return to zero code, current detection and other functions set by the internal program of the module driver. After it is correct, the LED lamp is lit and output from the SDO end of the LED chip to enter the next LED chip.

[0053] Continue to see Fig.10 In this embodiment, the high-density transparent display screen is lit by using low current by adjusting the current. The external voltage is connected to the VCC terminal of the driver chip 2. When the data is input to the driver chip 2, the last 8 bits of data are current information. When the LED driver module detects the low current gear, the current is adjusted to I RGB1 ; When the LED driver module detects the medium current range, it adjusts the current to I RGB2 ; When the LED driver module detects the high current gear, it adjusts the current to I RGB3 The normal display of high-density transparent display screen can be achieved by adjusting to the minimum current.

[0054] Continue to see Fig.10 In this embodiment, the 12V wide voltage can be converted into a 5V LED chip input voltage to power the LED driver module and the current can be adjusted at the same time to light up a transparent display screen with a larger area and higher display density with a larger voltage and a lower current.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated LED chip, characterized in that: The invention is applied to a high-density transparent display screen, and uses a power supply module to convert a 12V wide voltage into a 5V input voltage to supply power to a driving unit to prevent the chip from burning and to increase the display density of the display screen, or uses a current adjustment method to use a low current to light up the high-density transparent display screen; the invention comprises: a substrate (1), a driving chip (2), and an LED epitaxial wafer (3); the substrate (1) is welded to the high-density transparent display screen through a welding pad (4), and the driving chip (2) and the LED epitaxial wafer (3) are both arranged on the substrate (1), wherein the driving chip (2) and the LED epitaxial wafer (3) are electrically connected through the substrate (1); The driving chip (2) comprises a power module (2-1) and a driving unit (2-2); the power module (2-1) is a voltage converter, an external 12V wide voltage is connected to the VCC terminal of the driving chip (2), and the voltage converter converts the 12V wide voltage into 5V as the input voltage of the driving unit (2-2); the driving unit (2-2) comprises an LED driving module and a current regulating module, and the current regulating module is used to adjust the magnitude of the LED driving current; The integrated LED chip is also provided with a packaging body (5), which is arranged on the substrate (1) and adhered to the substrate (1) via a highly transparent optical adhesive (6).

2. The integrated LED chip according to claim 1, characterized in that: The driver chip (2) and the LED epitaxial wafer (3) are both soldered to corresponding positions of the substrate (1) in a flip-chip manner; that is, the connection wires of the driver chip (2) and the LED epitaxial wafer (3) are all laid flat on the substrate (1) and are respectively connected to the corresponding soldering pins of the driver chip (2) and the LED epitaxial wafer (3).

3. The integrated LED chip according to claim 2, characterized in that: The driver chip (2) and the LED epitaxial wafer (3) are connected by flying wires; that is, the interface on the driver chip (2) is connected to the LED epitaxial wafer (3) by flying wires, and the corresponding interface on the driver chip (2) is respectively connected to the positive and negative electrodes of the power supply and the data input interface by flying wires.

4. The integrated LED chip according to claim 1, characterized in that: The LED epitaxial wafer (3) comprises an LED epitaxial wafer R (3-1), an LED epitaxial wafer G (3-2), and an LED epitaxial wafer B (3-3).

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