Display device

Abstract

A display device includes a display substrate including a display area and a pad area located around the display area; a plurality of light emitting elements located on the display area of the display substrate; a plurality of pads located on the pad area of the display substrate and connected to the plurality of light emitting elements; a flexible film attached to the display substrate; a plurality of lead lines provided on the flexible film; and an anisotropic conductive film provided between the display substrate and the flexible film. The anisotropic conductive film is provided between each of the plurality of pads and a corresponding lead line of the plurality of lead lines that overlap each other, thereby forming an electrical connection therebetween. The flexible film has a light transmittance of 60% or more with respect to a visible light wavelength range.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Korean Patent Application No. 10-2019-0179861, filed on December 31, 2019, in the Korean Intellectual Property Office, the contents of which are hereby incorporated by reference in its entirety. TECHNICAL FIELD

[0003] The disclosure relates to a display device, and more particularly, to a display device having a window for non-destructively monitoring a curing process of an anisotropic conductive film. BACKGROUND

[0004] A display device is a device for visually displaying data. The display device includes a substrate divided into a display area and a non-display area. A plurality of pixels are disposed on the substrate in the display area, and a plurality of pads or the like are disposed on the substrate in the non-display area. A flexible film (chip on film (COF)) having a driving circuit or the like is coupled to the plurality of pads to transmit a driving signal to the pixels.

[0005] The flexible film can include a plurality of leads coupled to the plurality of pads, and the leads can be bonded to the pads separated from each other. The bonding can be performed through an anisotropic conductive film (ACF) disposed between the leads and the pads. SUMMARY

[0006] Aspects of the disclosure provide a display device capable of measuring a curing degree of an anisotropic conductive film that bonds a printed circuit film to a display panel without peeling the printed circuit film.

[0007] However, aspects of the disclosure are not limited to the aspects set forth herein. The above and other aspects of the disclosure will become more apparent by describing in detail the disclosure given below.

[0008] According to an exemplary embodiment of the inventive concept, a display device includes a display substrate including a display area and a pad area located around the display area; a plurality of light emitting elements located on the display area of the display substrate; a plurality of pads located on the pad area of the display substrate and connected to the plurality of light emitting elements; a flexible film attached to the display substrate; a plurality of leads disposed on the flexible film; and an anisotropic conductive film disposed between the display substrate and the flexible film. The anisotropic conductive film is disposed between each of the plurality of pads and a corresponding lead of the plurality of leads overlapping each other, thereby forming an electrical connection therebetween. The flexible film has a light transmittance of 60% or more with respect to a visible light wavelength range.

[0009] The display device further includes an insulating resin provided on the flexible film. The flexible film includes a window portion provided between two of the plurality of lead lines adjacent to each other in a plan view. The insulating resin is provided between the two of the plurality of lead lines adjacent to each other without overlapping the window portion.

[0010] In the plan view, the window portion is surrounded by the insulating resin.

[0011] The insulating resin includes an opening therethrough in a thickness direction. The opening is provided so as to overlap the window portion.

[0012] A portion of the anisotropic conductive film fills the opening of the insulating resin.

[0013] The insulating resin includes an optically opaque insulating material.

[0014] The opening has the same planar shape and size as the window portion.

[0015] The flexible film includes transparent polyimide (PI) or transparent cyclo-olefin polymer (COP).

[0016] The anisotropic conductive film is prepared by a UV curing or thermal curing process.

[0017] The portion of the anisotropic conductive film is visible through the window portion, and the window portion is configured to pass light used to measure a degree of curing of the anisotropic conductive film subjected to a curing process.

[0018] According to an example embodiment of the present inventive concept, a display device includes a display substrate including a display area and a pad area located around the display area; a plurality of light emitting elements located on the display area; a plurality of pads located on the pad area and connected to the plurality of light emitting elements; a flexible film attached to the display substrate; a plurality of lead lines provided on the flexible film; an insulating resin provided on the flexible film; and an anisotropic conductive film provided between the display substrate and the flexible film, wherein the anisotropic conductive film is provided between each of the plurality of pads and a corresponding one of the plurality of lead lines so as to overlap each other, thereby forming an electrical connection therebetween. The flexible film includes a first opening as a window portion. The first opening passes through the flexible film and the first opening is provided between two of the plurality of lead lines adjacent to each other in a plan view. The insulating resin is provided between the two of the plurality of lead lines adjacent to each other without overlapping the window portion.

[0019] In the plan view, the window portion is surrounded by the insulating resin.

[0020] The insulating resin includes a second opening therethrough in a thickness direction, and the second opening is disposed to overlap the first opening.

[0021] A portion of the anisotropic conductive film fills the second opening of the insulating resin.

[0022] The insulating resin includes an optically opaque insulating material, and the second opening has the same planar shape and size as the first opening.

[0023] According to an exemplary embodiment of the inventive concept, a display device includes a display substrate including a display area and a pad area located around the display area; a plurality of light emitting elements located on the display area; a plurality of pads located on the pad area and connected to the plurality of light emitting elements; a flexible film attached to the display substrate; a plurality of lead lines provided on the flexible film, the flexible film including a first opening as a window portion between two lead lines adjacent to each other in a plan view, and the first opening passing through the flexible film; a filling resin filling the first opening of the flexible film; and an anisotropic conductive film provided between the display substrate and the flexible film, wherein the anisotropic conductive film is provided between each pad of the plurality of pads and a corresponding lead line of the plurality of lead lines to overlap each other, thereby forming an electrical connection therebetween.

[0024] The filling resin has a light transmittance greater than that of the flexible film.

[0025] The display device further includes an insulating resin provided on the flexible film. The insulating resin is provided between two lead lines adjacent to each other without overlapping the window portion.

[0026] The insulating resin includes a second opening therethrough in a thickness direction, and the second opening is disposed to overlap the filling resin filling the first opening.

[0027] The insulating resin includes an optically opaque insulating material, and the second opening has the same planar shape and size as the filling resin.

[0028] According to the display device according to the embodiment of the disclosure, the degree of curing of the anisotropic conductive film bonding the printed circuit film to the display panel can be measured without peeling the printed circuit film, thereby improving the yield.

[0029] Effects of the disclosure are not limited to the above-mentioned effects, and other effects not described herein will become apparent to those skilled in the art from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above and other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:

[0031] Figure 1 is a plan view of a display device according to an exemplary embodiment;

[0032] Figure 2 is a cross-sectional view of the display device of Figure 1

[0033] Figure 3 is an enlarged plan view of a portion of a display panel;

[0034] Figure 4 is an enlarged plan view of a portion of a printed circuit film;

[0035] Figure 5 is a display panel of Figure 3 Figure 4 is a plan view of a printed circuit film attached to the display panel of

[0036] Figure 6 is a cross-sectional view taken along line I-I' of Figure 5

[0037] Figure 7 is a schematic view showing measurement of a degree of curing of an anisotropic conductive film through a window portion;

[0038] Figures 8 to 10 is a modified plan view of a window portion;

[0039] Figure 11 is an enlarged plan view showing a portion of a printed circuit film according to an exemplary embodiment;

[0040] Figure 12 is a plan view showing a printed circuit film according to an exemplary embodiment and a display panel according to the above-described embodiment attached to each other;

[0041] Figure 13 is a cross-sectional view of the printed circuit film and the display panel of Figure 12

[0042] Figure 14 is an enlarged plan view showing a portion of a printed circuit film according to an exemplary embodiment;

[0043] Figure 15 is a plan view showing a printed circuit film according to an exemplary embodiment and a display panel according to the above-described embodiment attached to each other;

[0044] Figure 16 is a cross-sectional view of the printed circuit film and the display panel of Figure 15 ​​​​a cross-sectional view of a printed circuit film and a display panel; and

[0045] Figures 17 to 23 is according to Figure 16 a modified cross-sectional view. DETAILED DESCRIPTION

[0046] The specific structure and function described herein of the embodiments of the present application are disclosed only for illustrative purposes of the embodiments of the present application. The present application can be implemented in many different forms without departing from the spirit and essential characteristics of the present application. Therefore, the embodiments of the present application are disclosed only for illustrative purposes, and the embodiments of the present application should not be construed as limiting the present application. That is, the present application is limited only by the scope of the claims.

[0047] It will be understood that when an element is referred to as being associated with or connected with another element, it can be directly associated or connected with the other element, or intervening elements can be present between them. In contrast, it will be understood that when an element is referred to as being directly associated with or connected with another element, there are no intervening elements present between them. Other expressions similar to "between" and "directly between" such as "adjacent to" or "directly adjacent to" should be interpreted in the same way.

[0048] Throughout the specification, the same reference numerals will refer to the same or similar components.

[0049] It will be understood that, although the terms "first", "second", "third", and the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element", "a first component", "a first region", "a first layer", or "a first portion" discussed below can be named a second element, a second component, a second region, a second layer, or a second portion without departing from the teachings herein.

[0050] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, "one," "a," or "the" are open-ended transitional phrases that do not limit the quanti ty to one unless the context clearly dictates otherwise. For example, "an element" is the same as "at least one element." "At least one" is not to be construed as limiting "one" or "a." "Or" means "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and / or "comprising," or "includes" and / or "including" when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0051] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" can be used herein to describe one element's or another's relationship to another element as illustrated in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. The exemplary term "lower" can therefore encompass both an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. The exemplary terms "below" or "beneath" can, therefore, encompass both an orientation of "below" and "above," depending on the particular orientation of the figure.

[0052] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings.

[0053] Figure 1 is a plan view of a display device according to an exemplary embodiment. Figure 2 is Figure 1 is a sectional view of the display device of

[0054] The display device 1 is a device for displaying moving images or still images. The display device 1 can be used as a display screen of various products such as a television, a notebook computer, a monitor, a billboard, and an Internet of Things, and portable electronic devices such as a mobile phone, a smart phone, a tablet personal computer (tablet PC), a smart watch, a watch phone, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation system, and an ultra-mobile PC (UMPC).

[0055] Referring to Figure 1 and Figure 2 The display device 1 can include a display panel 100 configured to display an image, a printed circuit film 300 connected to the display panel 100, and a main circuit board 500 connected to the printed circuit film 300.

[0056] The display panel 100 can be, for example, an organic light emitting display panel. In the following embodiments, a case where an organic light emitting display panel is used as the display panel 100 will be described as an example, but the present disclosure is not limited thereto, and other types of display panels such as a liquid crystal display (LCD) panel, a quantum dot organic light emitting display (QD-OLED) panel, a quantum dot liquid crystal display (QD-LCD) panel, a quantum nano emitting display (QNED) panel, and a micro LED panel can be used as the display panel 100.

[0057] The display panel 100 includes a display area DA having a plurality of pixel areas and a non-display area (i.e., a non-pixel area) NA disposed around the display area DA. In a plan view, the display area DA can have a rectangular shape including a right angle or a rounded corner. The display area DA can have a short side and a long side. The short side of the display area DA can be a side extending in a first direction DR1. The long side of the display area DA can be a side extending in a second direction DR2. However, the planar shape of the display area DA is not limited to a rectangular shape, but can have a circular shape, an elliptical shape, or various other shapes. The non-display area NA can be disposed adjacent to the short side and the long side of the display area DA. For example, the edges of the non-display area NA can be formed to surround all sides of the display area DA. However, the present disclosure is not limited thereto, and the non-display area NA can be disposed adjacent to opposite short sides or opposite long sides of the display area DA.

[0058] The non-display area NA of the display panel 100 further includes a panel pad area P_PA. For example, the panel pad area P_PA can be disposed near one short side of the display area DA, but the present disclosure is not limited thereto. The panel pad area P_PA can be disposed near opposite short sides of the display area DA, or can be disposed near opposite short sides and opposite long sides of the display area DA.

[0059] The display panel 100 can include a first member (i.e., a display substrate) 101, a plurality of light emitting elements of a display area DA disposed on the first member 101, and a plurality of pads PAD of a non-display area NA. The display panel 100 can include a plurality of insulating layers and a plurality of conductive layers. A detailed stack structure of the display panel 100 will be described later. The first member 101 can be a rigid substrate including glass or quartz, etc. In some embodiments, the first member 101 can be a plastic substrate including a plastic material. In some embodiments, the first member 101 can be a film including polyimide (PI).

[0060] The printed circuit film 300 can include a second member (or a flexible base film or a flexible film) 310 and a driving integrated circuit 390 disposed on the second member 310. The second member 310 can include an insulating material. The second member 310 can include a material having a high light transmittance with respect to visible light. The second member 310 can include a material having a light transmittance of 60% or more with respect to visible light. For example, the light transmittance of the second member 310 with respect to visible light can be a light transmittance of between 70% and 90%. The second member 310 can include transparent polyimide (PI) or transparent cyclo olefin polymer (COP). The transparent polyimide (PI) can be formed by replacing some monomers constituting the polyimide (PI) with fluorine atoms (F - ). For example, the transparent polyimide (PI) can also include fluorine atoms (F - ).

[0061] The printed circuit film 300 can include a first circuit area CA1 having a first side attached to a panel pad area P_PA of the display panel 100, a second circuit area CA2 disposed on a second side of the first circuit area CA1 opposite the first side in a second direction DR2, and a third circuit area CA3 disposed on a side of the second circuit area CA2 in the second direction DR2, and the main circuit board 500 is attached to the third circuit area CA3. The driving integrated circuit 390 can be disposed on one surface of the second circuit area CA2 of the printed circuit film 300. The driving integrated circuit 390 can be, for example, a data driving integrated circuit, and can be implemented as a data driving chip by using a chip on film (COF) method.

[0062] The main circuit board 500 can include a circuit pad area attached to the third circuit area CA3 of the printed circuit film 300. A plurality of circuit pads can be disposed on the circuit pad area of the main circuit board 500 and connected to the circuit leads 330 disposed on the third circuit area CA3 of the printed circuit film 300.

[0063] Referring to Figure 2The display device 1 further includes a panel under sheet 200 disposed below the display panel 100. The panel under sheet 200 can be attached to a rear surface of the display panel 100. The panel under sheet 200 includes at least one functional layer. The functional layer can be a layer that performs a heat dissipation function, an electromagnetic shielding function, a grounding function, a cushioning function, a rigidity enhancement function, a support function, and / or a digitizing function. The functional layer can be a sheet layer, a film layer, a thin layer, a coating layer, a panel, or a plate, etc. One functional layer can be formed of a single layer, or a stack of multiple thin films or coating layers. The functional layer can be, for example, a support substrate, a heat dissipation layer, an electromagnetic shielding layer, an impact absorbing layer, or a digitizer, etc.

[0064] The printed circuit film 300 can be bent downward in the third direction DR3, as shown in FIG. 3B. The other side of the printed circuit film 300 and the main circuit board 500 can be located below the panel under sheet 200. The lower surface of the panel under sheet 200 can be bonded to the main circuit board 500 by an adhesive layer, but the present disclosure is not limited thereto. Figure 2

[0065] The display panel 100 can include a first member 101, a plurality of conductive layers, a plurality of insulating layers for insulating them, and an organic layer EL, etc. The organic layer EL, the anode ANO and the cathode CAT described later can constitute a light emitting element. A plurality of light emitting elements can be provided, and the light emitting elements can be located in the display area DA.

[0066] The first member 101 is disposed on the entire area of the display area DA and the non-display area NA. A buffer layer 102 can be disposed on the first member 101. The buffer layer 102 can be used to prevent moisture and oxygen from penetrating through the first member 101 from the outside. The buffer layer 102 can include any one of a silicon nitride (SiN x ) layer, a silicon oxide (SiO2) layer, and a silicon oxynitride (SiO x N y ) layer.

[0067] A semiconductor layer 105 can be disposed on the buffer layer 102. The semiconductor layer 105 forms a channel of a thin film transistor. The semiconductor layer 105 is disposed in each pixel of the display area DA. In some embodiments, the semiconductor layer 105 can also be disposed in the non-display area NA in some cases. The semiconductor layer 105 can include a source / drain region and an active region. The semiconductor layer 105 can include polysilicon.

[0068] ​A first insulating layer 111 can be disposed on the semiconductor layer 105. The first insulating layer 111 can be disposed over an entire surface of the first member 101. The first insulating layer 111 can be a gate insulating layer having a gate insulating function. The first insulating layer 111 can include a silicon compound or a metal oxide, etc. For example, the first insulating layer 111 can include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, or titanium oxide, etc. These can be used alone or in combination with each other.

[0069] A first conductive layer 120 can be disposed on the first insulating layer 111. The first conductive layer 120 can include a gate electrode GE of a thin film transistor TFT and a first electrode CE1 of a storage capacitor Cst. Although not shown, the first conductive layer 120 can further include a gate signal wiring. The gate signal wiring can be arranged to pass through the display area DA and the panel pad area P_PA. The gate signal wiring can be connected to a pad PAD of a third conductive layer 140 which will be described later. The first conductive layer 120 can include at least one metal selected from a group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductive layer 120 can be a single layer or a multi-layer stack of the above-described materials.

[0070] A second insulating layer 112 can be disposed on the first conductive layer 120. The second insulating layer 112 can insulate the first conductive layer 120 from a second conductive layer 130. The second insulating layer 112 can be selected from the above-described materials of the first insulating layer 111. In the panel pad area P_PA, the second insulating layer 112 can further include a plurality of contact holes partially exposing a top surface of the gate signal wiring. An electrical connection can be made between the pad PAD which will be described later and the gate signal wiring through the contact holes.

[0071] A second conductive layer 130 can be disposed on the second insulating layer 112. The second conductive layer 130 can include a second electrode CE2 of the storage capacitor Cst. The material of the second conductive layer 130 can be selected from the above-described materials of the first conductive layer 120. The first electrode CE1 of the storage capacitor Cst and the second electrode CE2 of the storage capacitor Cst can form a capacitor with the second insulating layer 112 disposed therebetween.

[0072] A third insulating layer 113 can be disposed on the second conductive layer 130. The third insulating layer 113 can include at least one of the above-described materials of the first insulating layer 111. In some embodiments, the third insulating layer 113 can include an organic insulating material. The organic insulating material can be selected from the exemplary materials of a first via layer VIA1 which will be described later.

[0073] A third conductive layer 140 can be disposed on the third insulating layer 113. The third conductive layer 140 can include a source electrode SE, a drain electrode DE, a high voltage electrode ELVDDE, and a pad PAD. The third conductive layer 140 can include at least one selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The third conductive layer 140 can be a single layer made of the above-described material. In the case of not being limited thereto, the third conductive layer 140 can be a multi-layer stack. For example, the third conductive layer 140 can have a stack structure of Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, or Ti / Cu. In an exemplary embodiment, the third conductive layer 140 can include Ti / Al / Ti.

[0074] The pad PAD of the third conductive layer 140 can be disposed to overlap the gate signal wiring of the first conductive layer 120 in the thickness direction and can be electrically connected to the gate signal wiring through the contact hole of the second insulating layer 112.

[0075] A plurality of pads PAD can be disposed. The plurality of pads PAD can be spaced apart from each other in the first direction DR1. Each pad PAD can be disposed to extend from a first end of the panel pad area P_PA to a second end of the panel pad area P_PA opposite the first end in the second direction DR2. Each pad PAD can be connected to the gate signal wiring and can be connected to the display area DA.

[0076] A first via layer VIA1 or a fourth insulating layer can be disposed on the third conductive layer 140. The first via layer VIA1 or the fourth insulating layer can include an organic insulating material or an inorganic insulating material. The organic insulating material can include at least one selected from the group consisting of acrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, and benzocyclobutene (BCB). The inorganic insulating material can include at least one of the constituent materials of the first insulating layer 111 described above.

[0077] As shown in FIG. 1B, the first via layer VIA1 can expose a top surface of the pad PAD in the panel pad area P_PA. The exposed pad PAD can be electrically connected to the printed circuit film 300 through anisotropic conductive film ACF. Figure 2

[0078] ​The printed circuit film 300 further includes a lead 320 on one surface of the first circuit area CA1 of the second member 310 and a circuit lead 330 on one surface of the third circuit area CA3 of the second member 310. The lead 320 can be electrically connected to the pad PAD. In an exemplary embodiment, the lead 320 can be electrically connected to the top surface of the exposed pad PAD by anisotropic conductive film ACF. As Figure 6 As shown in FIG. 19B, the anisotropic conductive film ACF can include a bonding resin layer BSR and conductive balls CB distributed in the bonding resin layer BSR.

[0079] The lead 320 and the circuit lead 330 can each include a metallic material. The lead 320 and the circuit lead 330 can each include at least one metal selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). In the illustrated embodiment, the lead 320 can include copper (Cu) and gold (Au).

[0080] A driving integrated circuit 390 can be disposed on the second circuit area CA2 of the second member 310. The driving integrated circuit 390 can be electrically connected to the lead 320 and the circuit lead 330.

[0081] Meanwhile, the printed circuit film 300 can further include an insulating resin SR disposed on the second member 310. The insulating resin SR can function to prevent short-circuiting between adjacent leads 320. In addition, the insulating resin SR can function to prevent short-circuiting between adjacent circuit leads 330. As shown in FIG. 19B, the insulating resin SR can expose a portion of the lead 320 that overlaps the pad PAD, and can cover and protect the remaining portion except for the portion. The portion of the lead 320 exposed by the insulating resin SR can be electrically connected to the pad PAD by the anisotropic conductive film ACF. Figure 2

[0082] Figure 3 is an enlarged plan view of a portion of a display panel. Figure 4 is an enlarged plan view of a portion of a printed circuit film. Figure 5 is a plan layout view of a display panel of Figure 3 and a printed circuit film attached to the display panel of Figure 4 Figure 6 is a cross-sectional view taken along line I-I' of Figure 5 Figure 7 is a schematic view showing a degree of curing of an anisotropic conductive film measured through a window portion.

[0083] In Figure 6 ​​​In the middle, in order to simplify the description, the assembly between the first member 101 and the pad PAD is omitted, and the pad PAD is shown as being directly located on the first member 101.

[0084] Referring to Figures 3 to 7 The plurality of pads PAD can be disposed in the panel pad area P_PA. The pads PAD can be arranged along the first direction DR1. Although Figure 3 A plurality of pads PAD arranged along the first direction DR1 are shown as being arranged in one pad row, but the disclosure is not limited thereto. The plurality of pads PAD can be arranged in a plurality of pad rows. In the following description, a case where the plurality of pads PAD form one pad row is described as an example. The gate signal line SL1 can electrically connect the pad PAD to the light emitting element of the display area DA. The pad PAD can have a greater width in the first direction DR1 than the gate signal line SL1.

[0085] The anisotropic conductive film ACF can be disposed on the plurality of pads PAD. The planar anisotropic conductive film ACF can cover and overlap the pad row formed by the plurality of pads PAD. The pad PAD can be connected to the display area DA through the gate signal line SL1. The planar shape of the pad PAD can be rectangular. The anisotropic conductive film ACF can be disposed to extend in the second direction DR2 from one short side of each of the plurality of pads PAD adjacent to the display area DA to the other short side opposite the one short side, and can be disposed to extend in the first direction DR1 from the leftmost pad PAD to the rightmost pad PAD.

[0086] The anisotropic conductive film ACF is not cured before the display panel 100 and the printed circuit film 300 are joined to each other, but can be thermally cured or cured using ultraviolet light after the printed circuit film 300 is disposed on the display panel 100.

[0087] A window portion WP located between the leads 320 adjacent to each other in a plan view can be defined in the second member 310. For example, the window portion WP can be disposed between the leads 320 adjacent to each other in a plan view. The window portion WP can be configured to measure a degree of curing of the anisotropic conductive film ACF after the printed circuit film 300 is attached to the display panel 100, as described below.

[0088] In a plan view, the lead 320 can have a rectangular shape. The planar shape of the lead 320 can be substantially the same as the planar shape of the pad PAD.

[0089] The lead wire 320 can be connected to the drive integrated circuit 390 through a lead wire connection wiring SL2. The lead wire connection wiring SL2 can be integrally formed with the lead wire 320. The lead wire 320 can have a greater width than the lead wire connection wiring SL2 in the first direction DR1.

[0090] The insulating resin SR can be further provided on the second member 310. The insulating resin SR can function to prevent short-circuiting between adjacent lead wires 320. The insulating resin SR can include an opaque insulating resin. The insulating resin SR can include an optically opaque insulating resin.

[0091] The insulating resin SR can surround another short side and long sides of the lead wire 320 opposite to one short side of the lead wire 320 located at an end side of the printed circuit film 300 in a plan view, in addition to the one short side. The insulating resin SR can further include an opening portion (i.e., an opening) OP passing therethrough in a thickness direction. The opening portion OP can pass completely through the insulating resin SR in the thickness direction. The opening portion OP of the insulating resin SR can be completely surrounded by the insulating resin material of the insulating resin SR. The opening portion OP of the insulating resin SR can be provided between the lead wires 320 adjacent to each other in a plan view. The opening portion OP of the insulating resin SR can be provided to overlap with the window portion WP defined in the second member 310 in the thickness direction. The opening portion OP can not overlap with the lead wire 320 in the thickness direction.

[0092] In an exemplary embodiment, the planar shape of the window portion WP can be a rectangular shape. The planar size of the window portion WP can be smaller than the planar size of the adjacent lead wires 320. The planar shape of the window portion WP can be substantially the same as the planar shape of the opening portion OP of the insulating resin SR. Further, the planar size of the window portion WP can be substantially the same as the planar size of the opening portion OP of the insulating resin SR. In an exemplary embodiment, the window portion WP and the opening portion OP of the insulating resin SR can be provided to completely overlap with each other in the thickness direction and have the same area.

[0093] The insulating resin SR can be in contact with the side surface of the lead wire 320. The insulating resin SR can be in contact with the anisotropic conductive film ACF. The surface height (with respect to the second member 310) of the insulating resin SR can be the same as the surface height (with respect to the second member 310) of the lead wire 320. However, the present application is not limited thereto. In an exemplary embodiment, the surface height (with respect to the second member 310) of the insulating resin SR can be greater or smaller than the surface height (with respect to the second member 310) of the lead wire 320.

[0094] The lead wire 320 on the second member 310 and one surface of the second member 310 on which the insulating resin SR is provided can be partially exposed by the insulating resin SR. The portion that is partially exposed by the insulating resin SR can be the opening portion OP. The opening portion OP and the window portion WP defined in the second member 310 can overlap each other, as described above. In the window portion WP, one surface of the second member 310 can be in contact with the anisotropic conductive film ACF.

[0095] The window portion WP of the second member 310 and the opening portion OP of the insulating resin SR can be disposed to overlap the anisotropic conductive film ACF in the thickness direction.

[0096] The second member 310 and the first member 101 can be bonded to each other by the bonding resin layer BSR of the anisotropic conductive film ACF.

[0097] The degree of curing of the anisotropic conductive film ACF can be a main index for showing whether the display panel 100 and the printed circuit film 300 are bonded to each other. Although not limited thereto, when the degree of curing of the anisotropic conductive film ACF is about 70% or more, about 80% or more, or about 90% or more, it can be determined that the bonding reliability of the display panel 100 and the printed circuit film 300 is good.

[0098] To measure the degree of curing of the anisotropic conductive film ACF, Figure 7 The degree of curing measurement apparatus 600 illustrated in FIG. 6 can be disposed above the printed circuit film 300 bonded to the display panel 100. The degree of curing measurement apparatus 600 can include a light transmission unit 610 that emits first light L1 toward the anisotropic conductive film ACF through the window portion WP and a light reception unit 620 that receives second light L2 reflected from the anisotropic conductive film ACF through the window portion WP. The degree of curing measurement apparatus 600 can be a Fourier transform infrared spectrometer (FTIR). The lights L1, L2 can be laser light in an infrared or near-infrared band.

[0099] If the second member 310 includes a material having a low light transmittance, the light L1, L2 transmitted and received by the curing degree measurement apparatus 600 can hardly pass through the window portion WP to reach the anisotropic conductive film ACF. In this case, after the bonding of the display panel 100 and the printed circuit film 300 is completed, the curing degree of the anisotropic conductive film ACF can be measured on a sample basis by removing the printed circuit film 300 from the display panel 100 (destructive inspection). However, after the display panel 100 is removed from the printed circuit film 300, the cured anisotropic conductive film ACF can lose adhesion or cohesion, and thus, the printed circuit film 300 can not be able to be bonded again to the display panel 100 using the cured anisotropic conductive film ACF. In the destructive inspection, a decrease in productivity can occur due to at least the number of samples.

[0100] In the display apparatus 1 according to the exemplary embodiment, the second member 310 includes a material having a high light transmittance with respect to visible light. Thus, after the bonding of the printed circuit film 300 and the display panel 100 is completed, the curing degree of the anisotropic conductive film ACF can be easily measured through the window portion WP without removing the printed circuit film 300 from the display panel 100 (non-destructive inspection). Thus, a decrease in the overall yield of products can be prevented. Further, because the measurement is performed without performing a step of removing the printed circuit film 300 in some samples of products in which the bonding of the display panel 100 and the printed circuit film 300 is completed and a step of removing the printed circuit film 300 in some samples during a step of measuring the curing degree of the anisotropic conductive film ACF, the measurement time of the curing degree can be shortened.

[0101] Hereinafter, a display apparatus according to an exemplary embodiment will be described. In the following embodiments, components identical to those of the above-described embodiments are indicated by identical reference numerals, and the description thereof will be omitted or simplified.

[0102] Figures 8 to 10 is a modified plan view of the window portion.

[0103] Figure 8 The embodiment of Figure 4 differs from the embodiment of

[0104] Figure 9 The embodiment of Figure 4 differs from the embodiment of Figure 4 the opening portion OP of the insulating resin SR of Figure 9 has a rectangular shape with rounded corners in a plan view, while

[0105] Figure 10 Implementation examples and Figure 4 The difference in the embodiments is that the insulating resin SR has multiple openings OP. In an exemplary embodiment, the multiple openings OP are arranged along the second direction DR2, and the multiple openings OP are arranged together between adjacent leads 320.

[0106] Figure 11 This is an enlarged plan view showing a portion of a printed circuit film according to an exemplary embodiment. Figure 12 This is a plan view showing the printed circuit film according to an exemplary embodiment and the display panel according to the above embodiment, which are attached to each other. Figure 13 yes Figure 12 Cross-sectional view of the printed circuit film and display panel.

[0107] Reference Figures 11 to 13 The difference between the printed circuit film 300_1 according to this embodiment and the printed circuit film 300 according to the above embodiment is that the second member 310_1 is perforated in the thickness direction in the window portion WP of the second member 310_1 of the printed circuit film 300_1.

[0108] For example, in the window portion WP of the second member 310_1 of the printed circuit film 300_1 according to this embodiment, the second member 310_1 may be perforated in the thickness direction. The window portion WP may overlap with the opening portion OP of the insulating resin SR. The opening portion OP may have a planar shape and size substantially the same as the planar shape and size of the window portion WP of the second member 310_1. However, the invention is not limited thereto. In an exemplary embodiment, the window portion WP may be larger or smaller in area than the opening portion OP. In an exemplary embodiment, the window portion WP and the opening portion OP may have different shapes.

[0109] Similar to the embodiments described above, the second component 310_1 according to this embodiment may include a material with high light transmittance. However, without being limited thereto, because the second component 310_1 according to this embodiment is removed by perforation in the window portion WP, unlike the second component 310 of the above embodiments, the second component 310_1 according to this embodiment may include an opaque insulating material. For example, the second component 310_1 may include polyimide (PI), fluorine-containing (F... - It is at least one of polyimide (PI), cyclic olefin polymer (COP), polyesterimide (PEI) or cyclic olefin copolymer (COC).

[0110] In the display device according to the present embodiment, the second member 310_1 is perforated in the window portion WP, and thus is removed. Accordingly, by extracting a few samples after the junction of the printed circuit film 300_1 and the display panel 100 is completed, the degree of cure of the anisotropic conductive film ACF disposed in the corresponding area in an overlapping manner can be easily measured through the window portion WP without removing the printed circuit film 300_1 from the display panel 100 (non-destructive inspection). Accordingly, it is possible to prevent a decrease in the overall yield of products. Further, since the measurement is performed without performing the step of removing the printed circuit film 300_1 in some product samples in which the junction of the display panel 100 and the printed circuit film 300_1 is completed and the step of removing the printed circuit film 300_1 in some samples during the step of measuring the degree of cure of the anisotropic conductive film ACF, it is possible to shorten the measurement time of the degree of cure.

[0111] Figure 14 FIG. 1 is a plan view showing a portion of a printed circuit film according to an exemplary embodiment. Figure 15 FIG. 2 is a plan layout view showing a printed circuit film according to an exemplary embodiment and a display panel according to the above-described embodiment attached to each other. Figure 16 FIG. 3 is a cross-sectional view of the printed circuit film and the display panel of FIG. 2. Figure 15 FIG. 4 is a cross-sectional view of the printed circuit film and the display panel of FIG. 1.

[0112] Referring to FIG. 1, Figures 14 to 16 , the present embodiment is different from the embodiment of Figures 11 to 13 in that the printed circuit film 300_2 further includes a filling member FM filling the window portion WP of the second member 310_1.

[0113] In the exemplary embodiment, the display device according to the present embodiment can further include the filling member FM of the printed circuit film 300_2 to fill the window portion WP of the second member 310_1. The filling member FM can be a material having a higher light transmittance than the second member 310_1. The filling member FM can be, for example, an insulating resin having a light transmittance greater than that of the second member 310_1.

[0114] The filling member FM can be in contact with the side surface of the second member 310_1 in the window portion WP. In a plan view, the filling member FM can be disposed to overlap the window portion WP, and the filling member FM can be disposed to overlap the opening portion OP of the insulating resin SR. The filling member FM can have exactly the same planar shape and size as the window portion WP and the opening portion OP of the insulating resin SR. However, the present application is not limited thereto. In the exemplary embodiment, the filling member FM filling the window portion WP can be larger or smaller in area than the opening portion OP. In the exemplary embodiment, the filling member FM filling the window portion WP and the opening portion OP can have different shapes from each other.

[0115] In the present embodiment, the filling member FM can have the same surface height as one surface and the other surface of the second member 310_1. The filling member FM can be formed by filling the window portion WP and then polishing the first surface of the filling member FM adjacent to one surface of the second member 310_1 and the second surface of the filling member FM adjacent to the other surface of the second member 310_1, before the second member 310_1 is bonded to the first member 101.

[0116] In some embodiments, when one surface of the second member 310_1 is disposed on the stage and the filling member FM is filled in the window portion WP of the second member 310_1, the first surface of the filling member FM in contact with the stage can have the same surface height as the one surface of the second member 310_1, but the second surface of the filling member FM can not have the same surface height as the other surface of the second member 310_1. When the second surface protrudes from the other surface, they can have the same surface height by polishing.

[0117] Figures 17 to 22 is a cross-sectional view according to Figure 16 a modification thereof.

[0118] Reference is made to Figure 17 which differs from the embodiment of Figure 16 in that the first surface is aligned to have the same surface height as the one surface and the second surface protrudes from the other surface.

[0119] Reference is made to Figure 18 which differs from the embodiment of Figure 17 in that, contrary to Figure 17 the second surface is aligned to have the same surface height as the other surface and the first surface protrudes from the one surface.

[0120] Reference is made to Figure 19 which differs from the embodiment of Figure 16 in that the first surface and the second surface respectively protrude from the one surface and the other surface.

[0121] Reference is made to Figure 20 which differs from the embodiment of Figure 16 in that the first surface is aligned to have the same surface height as the one surface but the second surface is recessed towards the first surface (thus having a concave shape in the figure) compared to the other surface.

[0122] Reference is made to Figure 21 which differs from the embodiment of Figure 20 in that, contrary to Figure 20In contrast, the second surface is aligned to have the same surface height as said other surface, but the first surface is recessed (thus having a concave shape in the figure) towards the second surface compared to said one surface.

[0123] With reference to Figure 22 , the difference with the embodiment of Figure 16 is that the first surface and the second surface are respectively recessed (thus having a concave shape in the figure) compared to said one surface and said other surface.

[0124] With reference to Figure 23 , the difference with the embodiment of Figure 16 is that the surface height of the second surface is greater than the surface height of said other surface, and the filling member FM extends (spreads) to said other surface of the adjacent second member 310_1.

[0125] While embodiments of the application have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible without departing from the scope and spirit of the application as disclosed in the accompanying claims.

Claims

1. A display device, comprising: A display substrate includes a display area and a pad area surrounding the display area; Multiple light-emitting elements are located on the display area of ​​the display substrate; Multiple pads are located on the pad area of ​​the display substrate and connected to the multiple light-emitting elements; A flexible film is attached to the display substrate; Multiple leads are disposed on the flexible membrane; An insulating resin is disposed on the flexible membrane; as well as An anisotropic conductive film is disposed between the display substrate and the flexible film. The anisotropic conductive film is disposed between each of the overlapping pads and a corresponding lead of the plurality of leads, thereby forming an electrical connection between them. The flexible film has a transmittance of 60% or greater relative to the visible light wavelength range. The flexible membrane includes a window portion disposed between two adjacent leads in a planar view, and The insulating resin is disposed between the two adjacent leads without overlapping the window portion.

2. The display device according to claim 1, wherein, The anisotropic conductive film is prepared by ultraviolet light curing or thermal curing process. A portion of the anisotropic conductive film is visible through the window portion, and the window portion is configured to allow light to pass through for measuring the degree of curing of the anisotropic conductive film after the curing process.

3. The display device according to claim 1, in, In the plan view, the window portion is surrounded by the insulating resin.

4. The display device according to claim 3, in, The insulating resin includes an opening extending through it in the thickness direction, and The opening is configured to overlap with the window portion.

5. The display device according to claim 4, in, A portion of the anisotropic conductive film fills the opening in the insulating resin.

6. The display device according to claim 5, in, The insulating resin includes optically opaque insulating materials.

7. The display device according to claim 6, in, The opening has the same planar shape and size as the window portion.

8. The display device according to claim 7, in, The flexible membrane comprises a transparent polyimide or a transparent cyclic olefin polymer.

9. A display device, comprising: A display substrate includes a display area and a pad area surrounding the display area; Multiple light-emitting elements are located on the display area; Multiple pads are located on the pad area and connected to the multiple light-emitting elements; A flexible film is attached to the display substrate; Multiple leads are disposed on the flexible membrane; An insulating resin is disposed on the flexible membrane; as well as An anisotropic conductive film is disposed between the display substrate and the flexible film, wherein the anisotropic conductive film is disposed between each of the plurality of overlapping pads and a corresponding lead of the plurality of leads, thereby forming an electrical connection therebetween. The flexible membrane includes a first opening that serves as a window portion. The first opening passes through the flexible membrane and is positioned in the plan view between two adjacent leads. The insulating resin is disposed between the two adjacent leads without overlapping the window portion.

10. A display device, comprising: A display substrate includes a display area and a pad area surrounding the display area; Multiple light-emitting elements are located on the display area; Multiple pads are located on the pad area and connected to the multiple light-emitting elements; A flexible film is attached to the display substrate; Multiple leads are disposed on the flexible membrane, wherein the flexible membrane includes a first opening as a window portion located between two adjacent leads in a plan view, and the first opening extends through the flexible membrane; Fill the first opening of the flexible membrane with resin; An anisotropic conductive film is disposed between the display substrate and the flexible film, wherein the anisotropic conductive film is disposed between each of the plurality of overlapping pads and a corresponding lead of the plurality of leads, thereby forming an electrical connection therebetween; and An insulating resin is disposed on the flexible membrane, wherein the insulating resin is disposed between the two adjacent leads without overlapping the window portion.

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