Pickup assembly for microphone and bone conduction microphone and electronic product

Abstract

The present invention discloses a sound pickup assembly for a microphone, comprising: a cylindrical conductive ring, a diaphragm, a mass block, and a plate; the diaphragm is stretched tight on one end face of the cylindrical conductive ring; the mass block is pasted at the center of the diaphragm, and an exhaust structure is provided on one side of the mass block that is in contact with the diaphragm, and the exhaust structure is configured to exhaust the gas between the mass block and the diaphragm; the plate and the diaphragm are insulated to form a variable capacitor; the plate and the cylindrical conductive ring are located on different sides of the diaphragm. The present invention improves the vibration pickup effect of the microphone by arranging a mass block on the sound pickup assembly and an exhaust structure on the mass block.

Description

Technical Field

[0001] The present invention relates to the technical field of microphones, and more particularly to a sound pickup assembly for a microphone, a bone conduction microphone and an electronic product. Background Art

[0002] The electret microphone is a type of microphone that uses a variable capacitor as a sound pickup component, while the electret bone conduction microphone uses bone conduction technology to collect sound through a variable capacitor. The sound waves are transmitted to the microphone through the vibration of the bones. This microphone eliminates the traditional sound wave transmission step and can achieve clear sound restoration in noisy environments.

[0003] The sound transmission effect of the electret bone conduction microphone depends largely on the pickup component and the internal structure of the microphone. Since the bone conduction microphone transmits sound through the bones, the pickup component needs to shield the part of the sound wave transmission to achieve a better sound transmission effect, but the current effect of shielding the sound wave transmission of the bone conduction microphone is not ideal. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution to the above-mentioned technical problems.

[0005] According to a first aspect of the present invention, there is provided a sound pickup assembly for a microphone, comprising:

[0006] Cylindrical conductive ring,

[0007] A diaphragm, the diaphragm being stretched tight on one end surface of the cylindrical conductive ring;

[0008] A mass block, wherein the mass block is attached to the center of the diaphragm, and an exhaust structure is provided on a side of the mass block that is attached to the diaphragm, wherein the exhaust structure is configured to exhaust gas between the mass block and the diaphragm;

[0009] A pole plate is insulated from the diaphragm to form a variable capacitor; the pole plate and the columnar conductive ring are located on different sides of the diaphragm.

[0010] Optionally, the exhaust structure comprises at least one exhaust hole.

[0011] Optionally, at least a portion of the exhaust hole extends to an edge of the mass block.

[0012] Optionally, the number of the exhaust holes is three, and the three exhaust holes are evenly distributed on the mass block in the form of an equilateral triangle.

[0013] Optionally, pressure equalizing holes are provided through the mass block and the diaphragm, and the pressure equalizing holes are configured to balance the air pressure on both sides of the diaphragm.

[0014] According to a second aspect of the present invention, there is provided a bone conduction microphone, comprising:

[0015] housing, circuit boards, and pickup assemblies;

[0016] The pickup assembly comprises a diaphragm, a mass block and a plate; the mass block is attached to the center of the diaphragm, and the plate and the diaphragm are insulated to form a variable capacitor;

[0017] The circuit board and the shell are bonded to form a closed cavity, and an air leakage hole is provided on the circuit board or the shell, and the air leakage hole is a through hole;

[0018] The sound pickup assembly is fixedly arranged in the cavity, and the diaphragm divides the cavity into a front cavity and a rear cavity; the sound pickup assembly is connected to the housing and the circuit board respectively.

[0019] Optionally, the pickup assembly is configured as the pickup assembly of the first aspect.

[0020] Optionally, the electrode plate is arranged on a side of the diaphragm to which the mass block is bonded.

[0021] Optionally, the pickup assembly forms a front connection or a back connection with the housing and the circuit board;

[0022] The front connection is configured such that the diaphragm is connected to the circuit board via the cylindrical conductive ring, and the electrode plate is connected to the housing;

[0023] The back-pole connection is configured such that the diaphragm is connected to the housing via the cylindrical conductive ring, and the electrode plate is connected to the circuit board.

[0024] Optionally, in the case of the front connection, an insulator is provided between the cylindrical conductive ring and the diaphragm and the housing.

[0025] Optionally, in the back-pole connection, the electrode plate is connected to the circuit board via a conductor, and the conductor is a gate ring.

[0026] Optionally, an insulator is provided between the electrode plate, the gate ring and the outer shell.

[0027] According to a third aspect of the present invention, there is provided an electronic product comprising the bone conduction microphone according to the second aspect.

[0028] One technical effect of the present invention is that by arranging a mass block on the pickup assembly and arranging an exhaust structure on the mass block, bubbles are less likely to be generated between the mass block and the diaphragm when they are bonded together, making the diaphragm flatter and significantly improving the vibration pickup effect when used in a microphone.

[0029] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0031] Figure 1 It is a schematic diagram of the bonding between the diaphragm and the mass block in this application.

[0032] Figures 2a to 5b It is a schematic diagram of various positions of the diaphragm, mass block and cylindrical conductive ring in this application.

[0033] Figures 6 to 8 Schematic diagram of the front-mounted bone conduction microphone in this application.

[0034] Figures 9 and 10 Schematic diagram of the back-pole bone conduction microphone in this application.

[0035] Description of reference numerals:

[0036] 1-pickup assembly; 11-columnar conductive ring; 12-diaphragm; 13-mass block; 131-exhaust structure; 132-pressure equalizing hole; 14-plate; 15-conductor; 16-gasket; 2-housing; 21-first air leakage hole; 22-dustproof net; 3-circuit board; 31-second air leakage hole; 4-cavity; 5-insulator; 6-EMI component; 7-FET or ASIC. DETAILED DESCRIPTION

[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0039] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0040] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0041] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] The sound pickup component 1 is an important component of the microphone, which is used to convert the sound received by the microphone into a current or voltage signal for transmission. In the electret bone conduction microphone, the sound pickup component 1 is a variable capacitor composed of a diaphragm 12, a mass block 13 and a plate 14. The vibration of the sound will be transmitted to the mass block 13 through the vibration of the bone. The mass block 13 causes the effective capacitance between it and the plate 14 to change through the amplitude of the diaphragm 12, that is, the voltage on the diaphragm 12 or the plate 14 changes, and then converted into a current signal and transmitted, so that the sound form can be transmitted and preserved. Among them, in this application, the effective capacitance refers to the variable capacitance caused by bone conduction vibration; sound pickup can be understood as the process of picking up the vibration transmitted by the bone and converting this vibration into a current signal.

[0043] According to a first aspect of the present invention, there is provided a sound pickup assembly 1 for a microphone, comprising: a cylindrical conductive ring 11, a diaphragm 12, a mass 13, and a plate 14; the diaphragm 12 is stretched tight on one end face of the cylindrical conductive ring 11; the mass 13 is adhered to the center of the diaphragm 12, and a venting structure 131 is provided on one side of the mass 13 that is in contact with the diaphragm 12, and the venting structure 131 is configured to discharge gas between the mass 13 and the diaphragm 12; the plate 14 is insulated from the diaphragm 12 to form a variable capacitor; the plate 14 and the cylindrical conductive ring 11 are located on different sides of the diaphragm 12.

[0044] like Figures 1 to 5b As shown, in the pickup assembly 1 provided in this embodiment, the diaphragm 12 is tightened and fixed on the cylindrical conductive ring 11. After the vibration of the diaphragm 12 is converted into an electrical signal, it can be directly derived from the cylindrical conductive ring 11. In practical applications, the cylindrical conductive ring 11 can be directly connected to other devices, and the diaphragm 12 does not need to be fixed on other devices, so that the pickup assembly 1 can be directly assembled in the electronic product as a whole, eliminating the complicated assembly steps. Among them, the material of the diaphragm 12 can be PI, PPS, PET, etc., and then the above-mentioned material is plated with nickel or gold on one side or both sides. The vibration characteristics of the diaphragm 12 are guaranteed, and the vibration signal can be well transmitted, thereby improving the vibration pickup effect. In addition, the cylindrical conductive ring 11 can be made by stretching, stamping, etching and other processes, which can be selected according to the assembly space requirements of the pickup assembly 1. The cylindrical conductive ring 11 is generally made of conductive materials such as metal, and its shape is preferably circular, but it can be selected according to the application scenario, and this application does not limit this.

[0045] In this embodiment, the mass block 13 is arranged at the center of the diaphragm 12, so that the vibration effect and amplitude change in the maximum amplitude area of ​​the diaphragm 12 can be more obvious and easier to capture, and the vibration amplitude converted into a current signal is also stronger, and the transmitted vibration signal is also more accurate. The mass block 13 and the diaphragm 12 can be bonded and fixed together by a sticky material such as glue or double-sided tape. Since the sticky material itself may contain bubbles, or during the bonding process, the mass block 13 and the diaphragm 12 are not tightly fitted, it is easy to cause bubbles or bulges to form on the part of the diaphragm 12 bonded with the mass block 13, thereby affecting the vibration effect of the diaphragm 12; in addition, in order to make the product structure lighter and thinner, the vibration space left for the diaphragm 12 is often relatively limited, and the bubbles or bulges on the diaphragm 12 are easy to touch the surrounding devices in the limited vibration space, causing the diaphragm 12 to pick up other vibration forms, affecting the vibration pickup effect. Or the bubbles or bulges touch the plate 14 during the vibration of the diaphragm 12, causing the variable capacitor formed by the plate 14 and the diaphragm 12 to fail, resulting in poor sound transmission effect. In addition, bubbles may also affect the bonding strength between the diaphragm 12 and the mass block 13 .

[0046] In order to solve the above problems, the present embodiment sets an exhaust structure 131 on the side of the mass block 13 close to the diaphragm 12. The exhaust can be in the shape of a hole or other shapes. A plurality of these exhaust structures 131 can be set, and the specific selection is based on the size of the mass block 13 or the bubble content of the adhesive material, etc., and the present embodiment does not limit this. The exhaust structure 131 can absorb the bulge or bubbles on the diaphragm 12, that is, when the mass block 13 is bonded to the diaphragm 12, the air in those bubbles or bulges can be discharged from the diaphragm 12 through the exhaust structure 131, so that the fit between the two is tighter and smoother, thereby improving the vibration pickup effect of the pickup assembly 1, and improving the vibration transmission performance and accuracy. In addition, the firmness of the bonding between the diaphragm 12 and the mass block 13 can be improved, and its service life can be extended.

[0047] Optionally, the exhaust structure 131 includes at least one exhaust hole.

[0048] In the present embodiment, the exhaust structure 131 is an exhaust hole, which can be a blind hole or a through hole. The specific selection can be made according to the exhaust requirements. In order to eliminate the bubbles on the diaphragm 12 as much as possible, there can be more choices for the number of exhaust holes, such as two, three, or even more. However, the more exhaust holes, the better. The specific selection needs to be made based on the size of the mass block 13, the exhaust requirements, the properties of the viscous substance, and the like. The exhaust structure 131 is set to be hole-shaped. On the one hand, it is easy to implement in manufacturing. On the other hand, the hole-shaped exhaust structure 131 can be more easily arranged evenly on the mass block 13, so that the center of the mass block 13 does not deviate from the center of the diaphragm 12 to ensure the vibration pickup effect.

[0049] Optionally, at least a portion of the exhaust hole extends to an edge of the mass block 13 .

[0050] As shown in FIG2 , during the bonding process between the diaphragm 12 and the mass block 13, if there are many bubbles and the number of exhaust holes is limited or the exhaust holes are blind holes, the bubbles are discharged slowly. At this time, extending at least a portion of the exhaust holes to the edge of the mass block 13 (for example, a bean sprout shape) can guide the gas entering the exhaust holes to be discharged as quickly as possible, thereby improving the exhaust performance.

[0051] Optionally, the number of the exhaust holes is three, and the three exhaust holes are evenly distributed on the mass block 13 in the form of an equilateral triangle.

[0052] In this embodiment, when the number of exhaust holes is three, the exhaust effect is guaranteed and the production is convenient. The evenly distributed exhaust holes also ensure that the center of gravity of the mass block 13 does not deviate from the center of the diaphragm 12, thereby improving production efficiency and ensuring the vibration pickup effect.

[0053] Optionally, pressure equalizing holes 132 are provided through the mass block 13 and the diaphragm 12 , and the pressure equalizing holes 132 are configured to balance the air pressure on both sides of the diaphragm 12 .

[0054] During the vibration of the diaphragm 12, if the gas pressure on both sides of the diaphragm 12 (the front cavity and the rear cavity) is unbalanced, the vibration of the diaphragm 12 will be disturbed by the airflow. In addition, under the influence of the ambient temperature, the diaphragm 12 will also expand or contract, resulting in poor vibration pickup effect of the diaphragm 12. An equalizing hole 132 is set on the diaphragm 12 and the mass block 13. The equalizing hole 132 penetrates the diaphragm 12 and the mass block 13 at the same time, which can balance the air pressure on both sides of the diaphragm 12, improve the accuracy of the diaphragm 12 picking up sound, and shield the interference of airflow. It is worth noting that it is not easy to make an equalizing hole 132 that is too small on the mass block 13, and an equalizing hole 132 on the diaphragm 12 that is too large will affect the vibration effect of the diaphragm 12. Therefore, if necessary, the equalizing holes 132 on the diaphragm 12 and the mass block 13 can be set as two through holes of different sizes to balance the properties of the mass block 13 and the diaphragm 12.

[0055] In the bone conduction microphone in the prior art, the diaphragm 12 receives a lot of vibration interference from external airflow or sound while receiving the bone conduction vibration, resulting in poor sound transmission effect.

[0056] The present invention also provides a bone conduction microphone that can optimize the sound transmission effect, which includes: a shell 2, a circuit board 3 and a pickup assembly 1; the pickup assembly 1 includes a diaphragm 12, a mass block 13 and a plate 14; the mass block 13 is pasted at the center of the diaphragm 12, and the plate 14 is insulated from the diaphragm 12 to form a variable capacitor; the circuit board 3 and the shell 2 are bonded to form a closed cavity 4, and an air leakage hole is provided on the circuit board 3 or the shell 2, and the air leakage hole is a through hole; the pickup assembly 1 is fixedly arranged in the cavity 4, and the diaphragm 12 separates the cavity 4 into a front cavity and a rear cavity; the pickup assembly 1 is connected to the shell 2 and the circuit board 3 respectively.

[0057] The bone conduction microphone provided in this embodiment has a structure in which the housing 2 and the circuit board 3 form a closed cavity 4, and the sound pickup component 1 is arranged in the cavity 4, dividing the cavity 4 into a front cavity and a rear cavity. The position relationship of the sound pickup component 1 in the cavity 4 is different, and microphones with different transmission effects can be obtained. At the same time, the vent holes (such as those provided on the circuit board 3 or the housing 2) are provided. Figure 6 , Figure 7 , Fig. 9 As shown, the first air leakage hole 21 is provided on the housing 2; Figure 8 and Fig.10 As shown, the second air vent 31 provided on the circuit board 3 can not only balance the pressure difference inside and outside the microphone, but also increase acoustic suppression, and offset the vibration in the form of sound waves such as the environment transmitted into the microphone, so as to enhance the effect of the diaphragm 12 picking up mechanical vibrations (bone conduction vibrations) and enhance the sound transmission effect. The pickup assembly 1 is connected to the housing 2 and the circuit board 3 respectively, which means that the diaphragm 12 is connected to the housing 2, and the electrode 14 is connected to the circuit board 3, or the diaphragm 12 is connected to the circuit board 3, and the electrode 14 is connected to the housing 2. When the diaphragm 12 or the electrode 14 is connected to the housing 2, it is in a grounded state; when the diaphragm 12 or the electrode 14 is connected to the circuit board 3, the change in the capacitance formed by the diaphragm 12 and the electrode 14 can be converted into an electrical signal and transmitted to the circuit board 3. Through the above process, the microphone can transmit the vibration transmitted by bone conduction more completely and accurately.

[0058] Optionally, the sound pickup assembly is configured as the sound pickup assembly described in the first aspect of the present application.

[0059] In this embodiment, since the bone conduction microphone adopts a pickup assembly 1 provided with an exhaust structure 131, bubbles are not easily generated when the diaphragm 12 and the mass block 13 are fitted together, thereby improving the adhesion of the mass block 13 and preventing the generated bubbles from affecting the vibration of the diaphragm, thereby improving the sound transmission effect of the bone conduction microphone.

[0060] Optionally, the electrode plate 14 is disposed on a side of the diaphragm 12 to which the mass block 13 is bonded.

[0061] like Figures 2a to 5b As shown, the diaphragm 12, mass block 13 and cylindrical conductive ring 11 of the pickup assembly 1 used in the bone conduction microphone of the present application can have at least the following positional relationships. For example, the mass block 13 and the cylindrical conductive ring 11 are located on the same side of the diaphragm 12 (e.g. Figure 2a , 2b , 4a, 4b), wherein the cylindrical conductive ring 11 can be made by a stretching process (as shown in Figure 2a , 2b As shown), the mass block 13 may also be provided with a pressure equalizing hole 132 (as shown Figure 2b , 4b ). For another example, the mass block 13 and the cylindrical conductive ring 11 are located on different sides of the diaphragm 12 (eg Figure 3a , 3b , 5a, 5b), wherein the cylindrical conductive ring 11 can be made by etching or stamping process (as shown in Figure 5a , 5b As shown), the mass block 13 may also be provided with a pressure equalizing hole 132 (as shown Figure 3b , 5b ). In addition, the diaphragm and the plate need to be insulated, such as Figures 6 to 10 As shown, a gasket 16 can be added between the two to play a supporting role on the one hand and to achieve an insulating effect on the other hand.

[0062] In this embodiment, the electrode plate 14 of the sound pickup assembly 1 used in the bone conduction microphone is arranged on the side of the diaphragm 12 to which the mass block 13 is bonded. Figures 7 to 10 As shown. In this arrangement, the mass block 13 on the diaphragm 12 is closer to the plate 14, which can effectively increase the effective capacitance, reduce the ineffective capacitance, and thus improve the sensitivity of the bone conduction microphone. Specifically, the diaphragm 12 and the plate 14 form a parallel plate capacitor (i.e., a variable capacitor), and the diaphragm 12 and the mass block 13 form one pole of the parallel plate capacitor, and the plate 14 is the other pole of the parallel plate capacitor. At this time, after the diaphragm 12 picks up the vibration, the central part of the diaphragm 12 vibrates, while the edge part hardly vibrates, then the capacitance change caused by the vibrating part is the effective capacitance, and bonding the mass block 13 at the center of the diaphragm 12 will further increase the vibration of the central part of the diaphragm 12, and most of the capacitance of the parallel plate capacitor is concentrated between the mass block 13 and the plate 14, and the mass block 13 and the plate 14 are on the same side of the diaphragm 12, and the distance between the two is relatively close, so that the effective capacitance is greatly improved, further improving the sensitivity of the entire product.

[0063] Optionally, the pickup assembly 1 forms a front connection or a back connection with the housing 2 and the circuit board 3; the front connection is configured such that the diaphragm 12 is connected to the circuit board 3 through the columnar conductive ring 11, and the pole plate 14 is connected to the housing 2; the back connection is configured such that the diaphragm 12 is connected to the housing 2 through the columnar conductive ring 11, and the pole plate 14 is connected to the circuit board 3.

[0064] In this embodiment, the connection modes of the sound pickup assembly 1 with the housing 2 and the circuit board 3 include at least the following two types, namely, the front type and the back type.

[0065] For front connection, please refer to Figures 6 to 8 The positional relationship between the diaphragm 12 and the plate 14 in this connection mode is that the diaphragm 12 is arranged above the plate 14, and the diaphragm 12 of the pickup assembly 1 (one pole of the variable capacitor) is connected to the circuit board 3 through the cylindrical conductive ring 11, which can transmit the voltage signal of the variable capacitor, and the plate 14 of the pickup assembly 1 (the other pole of the variable capacitor) is connected to the housing 2 to achieve grounding. Among them, the upper part of the diaphragm 12 is the rear cavity, and the lower part is the front cavity. The space of the rear cavity is larger. At this time, the positional relationship between the diaphragm 12, the mass block 13 and the cylindrical conductive ring 11 can be adopted Figures 2a to 3b In the structure shown, the cylindrical conductive ring 11 is made by a stretching process and has a relatively high thickness. It can not only be used as a connecting device between the diaphragm 12 and the circuit board 3, but also serve as a supporting member to support the internal structure of the product, thus saving the internal space of the product.

[0066] Back-pole connection can refer to Figures 9 and 10 In this connection mode, the positional relationship between the diaphragm 12 and the plate 14 is that the plate 14 is arranged above the diaphragm 12, the plate 14 of the pickup assembly 1 is connected to the circuit board 3, and the voltage signal of the variable capacitor can be transmitted, and the diaphragm 12 of the pickup assembly 1 is connected to the housing 2 through the cylindrical conductive ring 11 to achieve grounding. Among them, the upper part of the diaphragm 12 is the rear cavity, and the lower part is the front cavity, and the space of the front cavity is small. At this time, the positional relationship between the diaphragm 12, the mass block 13 and the cylindrical conductive ring 11 can be adopted Figures 4a to 5b In the structure shown, the cylindrical conductive ring 11 can be made by etching or stamping, and its thickness is relatively thin, which not only saves materials but also enables the grounding of the diaphragm 12.

[0067] In the above two connection methods, preferably, the mass block 13 can be arranged on different sides of the diaphragm 12 and the cylindrical conductive ring 11, and at the same time, the mass block 13 and the diaphragm 12 are provided with a pressure equalizing hole 132. The electrode plate 14 is arranged on the side of the diaphragm 12 where the mass block 13 is arranged (such as Figures 7 to 10As shown in the figure, the effective capacitance of the variable capacitor is increased, the sensitivity of the product to picking up vibration is improved, and the sound transmission effect of the bone conduction microphone is optimized. The arrangement of the pressure equalizing hole 132 and the air leakage hole (the first air leakage hole 21 or the second air leakage hole 31) can open up the front cavity and the rear cavity, improve the vibration sensitivity, and reduce the acoustic sensitivity.

[0068] Optionally, in the case of the front connection, an insulator 5 is provided between the cylindrical conductive ring 11 and the diaphragm 12 and the housing 2 .

[0069] In the front connection, the diaphragm 12 is connected to the circuit board 3 through a conductive ring, and the electrode plate 14 is connected to the housing 2 and grounded. Insulation measures need to be taken between the diaphragm 12 and the housing 2 to prevent the diaphragm 12 from being connected to the housing 2 and grounded, which causes the variable capacitor to fail. The insulator 5 in this embodiment is configured to be able to insulate the diaphragm 12 from the housing 2, and there is no restriction on the material and form of the insulator 5. For example, a cavity 4 is provided between the diaphragm 12 and the housing 2, and an insulating gas, such as air, is contained in the cavity 4, so that the purpose of insulation can be well achieved. In addition, materials such as insulating gaskets can also be provided.

[0070] Optionally, in the back-pole connection, the electrode plate 14 is connected to the circuit board 3 via a conductor 15 , and the conductor 15 is a gate ring.

[0071] In the back-pole connection, the diaphragm 12 is connected to the housing 2 through a thinner cylindrical conductive ring 11, and the electrode 14 is connected to the circuit board 3. At this time, the back cavity space where the electrode 14 is located is larger, and a gate ring can be set to achieve connection with the circuit board 3. At this time, the gate ring can not only serve as a conductor 15 to transmit the voltage on the electrode 14, but also as a support for the internal structure of the product, saving internal space.

[0072] Optionally, an insulator 5 is provided between the electrode plate 14 and the gate ring and the housing 2 .

[0073] In this embodiment, in contrast to the front connection, the plate 14 is connected to the circuit board 3, and insulation is required between the plate 14 and the housing 2. An insulator 5 is provided between the two to prevent the plate 14 from being connected to the housing 2 and causing the variable capacitor to fail. The material and form of the insulator 5 are not limited in this embodiment.

[0074] In addition, when an air leak hole is provided on the housing 2, a dustproof net 22 is provided on the air leak hole. The first air leak hole 21 on the housing 2 can, on the one hand, balance the gas pressure inside and outside the cavity 4 to prevent the diaphragm 12 from being damaged by the air pressure, and on the other hand, the environmental noise transmitted to the inside of the microphone can be discharged through the first air leak hole 21, thereby reducing the sensitivity of the diaphragm 12 to the air flow vibration, and improving the ability of the sound pickup component 1 to pick up mechanical vibration (i.e., bone conduction vibration), thereby reducing the interference of environmental noise and improving the bone conduction effect of the bone conduction microphone. The dustproof net 22 is provided on the air leak hole, which can prevent environmental dust from entering the product while improving the bone conduction effect and affecting the functions of various components inside the product.

[0075] In addition, if a second vent hole 31 is provided on the circuit board 3 , in order to prevent the second vent hole 31 on the circuit board 3 from being blocked under the influence of ambient temperature and humidity, the second vent hole 31 may be drilled or metallized as a through hole.

[0076] refer to Figures 6 to 10 For the above-mentioned bone conduction microphones, an EMI element 6 (EMI refers to the interference of electronic products to other surrounding electronic products) can be set inside to reduce EMI (electromagnetic) interference; FET or ASIC 7 (FET is a field effect transistor, ASIC is a special application integrated circuit) is set to amplify the circuit, so that the microphone can achieve a more accurate sound transmission effect.

[0077] The present invention also provides an electronic product, comprising the polar body bone conduction microphone described in the present application.

[0078] In this embodiment, the electronic product includes any one of the bone conduction microphones in this application. The electronic product using the above microphone can accurately transmit the sound vibration of bone conduction, better shield the vibration transmission of environmental noise, and improve the overall user experience performance of the product. In addition, the microphone in this application is small in size and has few components, which can greatly save the internal space of the electronic product and realize the thinness of the electronic product. In this embodiment, the electronic product can be headphones, mobile phones, tablets, etc., and this application does not limit this.

[0079] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0080] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A sound pickup assembly for a microphone, characterized in that: include: Cylindrical conductive ring, A diaphragm, the diaphragm being stretched tight on one end surface of the cylindrical conductive ring; A mass block, wherein the mass block is attached to the center of the diaphragm, and an exhaust structure is provided on a side of the mass block that is attached to the diaphragm, wherein the exhaust structure is configured to exhaust gas between the mass block and the diaphragm; A pole plate is insulated from the diaphragm to form a variable capacitor; the pole plate and the columnar conductive ring are located on different sides of the diaphragm.

2. A sound pickup assembly according to claim 1, characterized in that: The exhaust structure includes at least one exhaust hole.

3. A sound pickup assembly according to claim 2, characterized in that: At least a portion of the exhaust hole extends to an edge of the mass block.

4. A sound pickup assembly according to claim 2, characterized in that: The number of the exhaust holes is three, and the three exhaust holes are evenly distributed on the mass block in the form of an equilateral triangle.

5. The sound pickup assembly according to claim 1, characterized in that: The mass block and the diaphragm are penetrated with pressure equalizing holes, and the pressure equalizing holes are configured to balance the air pressure on both sides of the diaphragm.

6. A bone conduction microphone, characterized in that: include: A housing, a circuit board and a pickup assembly, wherein the pickup assembly is configured as the pickup assembly according to any one of claims 1 to 5; The pickup assembly comprises a diaphragm, a mass block and a plate; the mass block is attached to the center of the diaphragm, and the plate and the diaphragm are insulated to form a variable capacitor; The circuit board and the shell are bonded to form a closed cavity, and an air leakage hole is provided on the circuit board or the shell, and the air leakage hole is a through hole; The sound pickup assembly is fixedly arranged in the cavity, and the diaphragm divides the cavity into a front cavity and a rear cavity; the sound pickup assembly is connected to the housing and the circuit board respectively.

7. The bone conduction microphone according to claim 6, characterized in that: The pole plate is arranged on the side of the diaphragm to which the mass block is bonded.

8. The bone conduction microphone according to claim 6, characterized in that: The pickup assembly forms a front connection or a back connection with the housing and the circuit board; The front connection is configured such that the diaphragm is connected to the circuit board via the cylindrical conductive ring, and the electrode plate is connected to the housing; The back-pole connection is configured such that the diaphragm is connected to the housing via the cylindrical conductive ring, and the electrode plate is connected to the circuit board.

9. The bone conduction microphone according to claim 8, characterized in that: In the case of the front connection, an insulator is provided between the columnar conductive ring and the diaphragm and the housing.

10. The bone conduction microphone according to claim 8, characterized in that: In the back-pole connection, the electrode plate is connected to the circuit board through a conductor, and the conductor is a gate ring.

11. The bone conduction microphone according to claim 10, characterized in that: An insulator is arranged between the pole plate, the gate ring and the shell.

12. An electronic product, characterized in that: A bone conduction microphone comprising any one of claims 6 to 11.

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