Thunder core circuit board, Thunder core circuit board processing technology and digital electronic detonator

Abstract

The embodiments of the present invention provide a thunder core circuit board, a processing technology of the thunder core circuit board and a digital electronic detonator, which relate to the technical field of pyrotechnics manufacturing. The thunder core circuit board, the processing technology of the thunder core circuit board and the digital electronic detonator include a circuit board body and a chip ignition resistor, two solid metallized holes are arranged on the end face of one end of the circuit board body, and a soldering pad is formed on the side wall of the end face of the circuit board body, and the chip ignition resistor is connected to the soldering pad; when the chip ignition resistor is used to dip gunpowder, a sufficient amount of gunpowder can be dipped, and when the chip ignition resistor releases electric sparks, it can contact more gunpowder to enhance the ignition effect.

Description

Technical Field

[0001] The present invention relates to the technical field of pyrotechnics manufacturing, and in particular to a pyrotechnics circuit board, a processing technology of the pyrotechnics circuit board and a digital electronic detonator. Background Art

[0002] Electronic detonators, also known as digital electronic detonators, digital detonators or industrial digital electronic detonators, are electric detonators that use electronic control modules to control the detonation process. The electronic control module is placed inside the digital electronic detonator and has the functions of detonation delay time control and detonation energy control. It has a built-in detonator identity information code and detonation password, can test its own functions and performance as well as the electrical properties of the detonator ignition element, and can communicate with the detonation controller and other external control equipment. It is a dedicated circuit module.

[0003] Among them, the core part of the electronic detonator is used to contact the gunpowder, but the amount of gunpowder that can be dipped into the core part is limited, and the ignition effect is not good. Summary of the invention

[0004] The purpose of the present invention includes, for example, providing a lightning core circuit board, which can make the lightning core part of the electronic detonator contact the gunpowder over a large area, thereby enhancing the ignition effect.

[0005] The purpose of the present invention also includes providing a processing technology for a lightning core circuit board, which can make the lightning core part of the electronic detonator contact the gunpowder over a large area, thereby enhancing the ignition effect.

[0006] The purpose of the present invention also includes providing a digital electronic detonator, which can make the core part of the electronic detonator contact the gunpowder over a large area to enhance the ignition effect.

[0007] The embodiments of the present invention can be implemented as follows:

[0008] An embodiment of the present invention provides a Leixin circuit board, which includes:

[0009] Circuit board body and chip ignition resistor;

[0010] Two solid metallized holes are arranged on the end surface of one end of the circuit board body, and a solder pad is formed on the side wall of the end surface of the circuit board body;

[0011] The chip ignition resistor is connected to the pad.

[0012] Optionally, the circuit board body includes a first plate body and a second plate body, the first plate body and the second plate body are connected, and the solid metallized hole is arranged on an end surface of the second plate body away from the first plate body.

[0013] Optionally, in a plane parallel to the main surface of the circuit board, the cross-sectional shapes of the two solid metallized holes are both arc-shaped, and the radius of curvature of the arc segments of the two solid metallized holes is 0.1 mm-0.3 mm.

[0014] Optionally, the center distance between two solid metallized holes is 1.2 mm-1.6 mm.

[0015] Optionally, the thickness of the circuit board body is 1.25mm-2.0mm.

[0016] An embodiment of the present invention further provides a processing technology of a Leixin circuit board, the processing technology comprising:

[0017] Two through holes are formed on the surface of the substrate near one end thereof;

[0018] metallizing the two through holes;

[0019] Filling the metallized through hole with conductive metal to form a solid metallized hole;

[0020] Cutting the substrate along the two solid metallized holes in a plane perpendicular to the surface of the substrate, so that the side surfaces of the solid metallized holes after cutting form the pads, and the substrate after cutting forms the circuit board body;

[0021] The chip ignition resistor is connected to the pad of the substrate.

[0022] Optionally, the step of filling the metallized through hole with a conductive metal to form a solid metallized hole includes: the conductive metal includes a conductive paste.

[0023] Optionally, the step of filling the metallized through hole with conductive metal to form a solid metallized hole includes: electroplating the metallized through hole or filling the metallized through hole with conductive paste.

[0024] Optionally, the substrate is cut along the two solid metallized holes in a plane perpendicular to the surface of the substrate, and the side surfaces of the solid metallized holes after cutting form the solder pads, and the substrate after cutting forms the circuit board body, comprising: cutting the substrate by milling to form the solder pads.

[0025] An embodiment of the present invention further provides a digital electronic detonator, comprising a detonator core circuit board.

[0026] The beneficial effects of the Leixin circuit board of the embodiment of the present invention include, for example:

[0027] A solid metallized hole is arranged on one end face of the circuit board body and a soldering pad is formed on the side wall of the end face of the circuit board body, and finally a chip ignition resistor is connected to the soldering pad; when the chip ignition resistor is used to dip gunpowder, a sufficient amount of gunpowder can be dipped, and when the chip ignition resistor releases electric sparks, it can contact more gunpowder, thereby enhancing the ignition effect.

[0028] The beneficial effects of the processing technology of the Leixin circuit board according to the embodiment of the present invention include, for example:

[0029] A through hole is opened on the substrate, and then the through hole is metallized, and then a conductive paste is filled into the through hole or the through hole is electroplated to form a solid metallized hole, and then the solid metallized hole is cut off to form a pad, and the chip ignition resistor is connected to the pad; when the chip ignition resistor is used to dip gunpowder, a sufficient amount of gunpowder can be dipped, and when the chip ignition resistor releases electric sparks, it can contact more gunpowder to enhance the ignition effect.

[0030] A digital electronic detonator in an embodiment of the present invention adopts the above-mentioned detonator core circuit board, and the beneficial effects of the digital electronic detonator are the same as the beneficial effects of the above-mentioned detonator core circuit board, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 This is a schematic diagram of the structure of the pad portion of the Leixin circuit board used to show the embodiment of the present application;

[0033] Figure 2 for Figure 1 A magnified view of part A;

[0034] Figure 3 This is a schematic diagram of the structure of the Leixin circuit board with a chip ignition resistor attached in an embodiment of the present application;

[0035] Figure 4 This is a schematic diagram of the structure of the substrate before cutting off the solid metallized hole in the embodiment of the present application.

[0036] Icon: 100 - circuit board body; 110 - first board body; 120 - second board body; 121 - solid metallized hole; 122 - soldering pad; 200 - chip ignition resistor. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0042] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0043] The designers of the present invention found that in the related art, the chip ignition resistor is attached to the surface of the circuit board; when dipping in gunpowder, since the chip ignition resistor is set on one side of the circuit board, it is not easy for the chip ignition resistor to dip into the gunpowder on the other side of the circuit board; in addition, when the chip ignition resistor releases electric sparks, the amount of gunpowder that the electric sparks can contact is also relatively limited.

[0044] It should be noted that the chip ignition resistor mentioned in the present invention is the name used in the component industry; in the blasting industry, the chip ignition resistor is also called a lightning core resistor; according to the processing technology, the chip ignition resistor can also be called a chip resistor or a wafer resistor; the present invention uses a chip ignition resistor as an example for explanation.

[0045] Please refer to Figure 1 , Figure 2 This embodiment provides a Leixin circuit board, combined with Figure 3 , including a circuit board body 100 and a chip ignition resistor 200, two solid metallized holes 121 are arranged on the end surface of one end of the circuit board body 100, and a soldering pad 122 is formed on the side wall of the end surface of the circuit board body 100, and the chip ignition resistor 200 is connected to the soldering pad 122. Specifically, the chip ignition resistor 200 is soldered on the soldering pad 122, and the chip ignition resistor 200 is connected to the internal circuit of the circuit board body 100 through the soldering pad 122.

[0046] Furthermore, the circuit board body 100 includes a first plate body 110 and a second plate body 120, the first plate body 110 and the second plate body 120 are connected, and a solid metallized hole 121 is arranged on the end surface of the second plate body 120 away from the first plate body 110; optionally, the first plate body 110 and the second plate body 120 are both in the shape of a rectangular parallelepiped, and the length direction of the first plate body 110 is consistent with the length direction of the second plate body 120; the first plate body 110 and the second plate body 120 are integrally formed, and the plate surface of the first plate body 110 is flush with the plate surface of the second plate body 120; it should be noted that the plate surface of the first plate body 110 refers to the two surfaces of the first plate body 110 that are opposite to each other along the thickness direction of the first plate body 110, and the plate surface of the second plate body 120 refers to the two surfaces of the second plate body 120 that are opposite to each other along the thickness direction of the second plate body 120, and the end surface of the second plate body 120 away from the first plate body 110 is perpendicular to the plate surface of the second plate body 120.

[0047] Furthermore, the cross-sectional shape of the two solid metallized holes 121 in a plane parallel to the surface of the circuit board main body 100 can be an arc, and the radius of curvature of the arc segment of the two solid metallized holes 121 is 0.1mm-0.3mm. For example, the radius of curvature of the arc segment of the two solid metallized holes 121 can be 0.1mm, 0.15mm or 0.3mm.

[0048] Furthermore, the center distance between the two solid metallized holes 121 is 1.2 mm-1.6 mm; it should be noted that the center distance between the two solid metallized holes 121 refers to the center distance between the center points of the two solid metallized holes 121. For example, the center distance between the two solid metallized holes 121 can be 1.2 mm, 1.3 mm or 1.6 mm.

[0049] Furthermore, the thickness of the circuit board body 100 is 1.25 mm-2.0 mm; for example, the thickness of the circuit board body 100 may be 1.25 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm or 2.0 mm.

[0050] The width of the chip ignition resistor 200 is less than or equal to 1.3 mm. For example, the width of the chip ignition resistor 200 may be 1.2 mm or 1.3 mm. The width of the chip ignition resistor 200 is smaller than the thickness of the circuit board body 100 , which enables the chip ignition resistor 200 to be more easily soldered on the pad 122 .

[0051] Optionally, the size of the chip ignition resistor 200 provided in this embodiment is 0805 (i.e., length * width = 2mm * 1.25mm). The above data on the radius of curvature of the arc segment of the solid metallized hole 121, the center distance between the two solid metallized holes 121, the thickness of the circuit board body 100, etc. are all for supporting a 0805-sized solder pad 122; in other embodiments, for solder pads of other sizes, a 0603 (i.e., length * width = 1.5mm * 0.75mm) chip ignition resistor, or a 0402 (i.e., length * width = 1.0mm * 0.5mm) chip ignition resistor, or a non-standard chip ignition resistor can also be used. As long as the same technical effect can be achieved, they are all within the protection scope of the present application.

[0052] According to a Leixin circuit board provided in this embodiment, the working principle of the Leixin circuit board is:

[0053] By setting a solid metallized hole 121 on the end face of the second plate body 120 away from the first plate body 110, and forming a soldering pad 122 on the end face side wall of the circuit board body 100, the chip ignition resistor 200 is soldered on the soldering pad 122 to form a loop with the internal circuit of the circuit board; when dipping in gunpowder, the chip ignition resistor 200 is facing downward to contact the gunpowder, and the gunpowder can be gathered on the end face of the second plate body 120 where the chip ignition resistor 200 is set, and then the gunpowder can be more fully wrapped on the chip ignition resistor 200; in addition, when the chip ignition resistor 200 releases sparks, the sparks can contact a sufficient amount of gunpowder, and the ignition effect is better.

[0054] The Leixin circuit board provided in this embodiment has at least the following advantages:

[0055] 1) By arranging the chip ignition resistor 200 on the front side wall of the circuit board body 100, when the chip ignition resistor 200 is facing downward to contact the gunpowder, the gunpowder can gather on the end surface of the circuit board body 100 to wrap the chip ignition resistor 200, so that the chip ignition resistor 200 can easily contact more gunpowder;

[0056] 2) Since the chip ignition resistor 200 is disposed at the end of the circuit board body 100, when the chip ignition resistor 200 releases sparks, the sparks can contact more gunpowder, resulting in a better ignition effect.

[0057] Combination Figure 4This embodiment also provides a processing technology of a Leixin circuit board, which is used to process the Leixin circuit board. The processing technology includes:

[0058] S1. Two through holes are opened on the surface of the substrate near one end thereof;

[0059] S2, metallizing the two through holes;

[0060] S3, filling the metallized through hole with conductive metal to form a solid metallized hole 121;

[0061] S4, cutting the substrate along the two solid metallized holes 121 in a plane perpendicular to the surface of the substrate, forming pads 122 on the sides of the cut solid metallized holes 121, and forming the circuit board body 100 after the substrate is cut;

[0062] S5. Connect the chip ignition resistor 200 to the pad 122 of the substrate.

[0063] Optionally, in step S1, the substrate is in the shape of an elongated strip, the two through holes are symmetrically arranged along the width direction of the substrate, and the cross-sectional shape of the two through holes is circular or elliptical, or may be other shapes.

[0064] In step S2, metallizing the two through holes means: first depositing a conductive layer (seed layer) on the inner wall of the through hole and then electroplating copper to thicken it. Common processes for processing the seed layer include copper deposition and black hole, and organic conductive glue, sputtering and other processes can also be used.

[0065] In step S3, the conductive metal may be filled by electroplating or by metal conductive paste. Electroplating is preferably copper electroplating. The metal conductive paste may be silver conductive paste or copper conductive paste.

[0066] In step S4, the substrate may be cut by milling or other processing methods that can achieve the same effect, and the cut substrate forms the circuit board body 100; it should be noted that the surface of the substrate refers to the two opposite board surfaces along the thickness direction of the substrate.

[0067] In step S5 , the chip ignition resistor 200 and the substrate may be connected by welding, and the chip ignition resistor 200 is welded to the pad 122 to form a Leixin circuit board.

[0068] This embodiment also provides a digital electronic detonator, including the above-mentioned detonator core circuit board; specifically, the detonator core circuit board is arranged in the digital electronic detonator, and the detonator core circuit board with the chip ignition resistor 200 is the detonator core part of the digital electronic detonator.

[0069] In summary, the embodiments of the present invention provide a thunder core circuit board, a processing technology for thunder core circuit boards and a digital electronic detonator, by opening a through hole on a substrate, metalizing the through hole and then filling the through hole with conductive paste or electroplating to fill the through hole, forming a solid metallized hole 121, then cutting the substrate along the solid metallized hole 121 to form a soldering pad 122, and finally soldering the chip ignition resistor 200 on the soldering pad 122 to form a thunder core circuit board; when the chip ignition resistor 200 is used to dip in gunpowder, a sufficient amount of gunpowder can be dipped, and when the chip ignition resistor 200 releases electric sparks, it can contact more gunpowder to enhance the ignition effect.

[0070] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A processing technology for a Leixin circuit board, characterized in that: include: Two through holes are formed on the surface of the substrate near one end thereof; metallizing the two through holes; Filling the metallized through hole with conductive metal to form a solid metallized hole; Cutting the substrate along the two solid metallized holes in a plane perpendicular to the surface of the substrate, forming pads on the sides of the solid metallized holes after cutting, and forming a circuit board body after cutting; Welding a chip ignition resistor onto the pad of the substrate, wherein the chip ignition resistor is used to dip into gunpowder and ignite when releasing an electric spark; The cross-sectional shapes of the two solid metallized holes in a plane parallel to the main surface of the circuit board are both arc-shaped, and the radius of curvature of the arc segments of the two solid metallized holes is 0.1 mm-0.3 mm; The center distance between the two solid metallized holes is 1.2 mm-1.6 mm.

2. The processing technology of the Leixin circuit board according to claim 1 is characterized in that: The step of filling the metallized through hole with a conductive metal to form a solid metallized hole includes: the conductive metal includes a conductive paste.

3. The processing technology of the Leixin circuit board according to claim 2 is characterized in that: The step of filling the metallized through hole with conductive metal to form a solid metallized hole includes: electroplating the metallized through hole or filling the metallized through hole with conductive paste.

4. The processing technology of the Leixin circuit board according to claim 1 is characterized in that: The step of cutting the substrate along the two solid metallized holes in a plane perpendicular to the surface of the substrate, forming the solder pads on the sides of the solid metallized holes after cutting, and forming the circuit board body from the cut substrate includes: cutting the substrate by milling to form the solder pads.

5. A Leixin circuit board, characterized in that: It is manufactured by the processing technology of the Leixin circuit board described in any one of claims 1-4.

6. A digital electronic detonator, characterized in that: Including the Leixin circuit board as described in claim 5.

Images