Small-size intelligent 5g module
By highly integrating the baseband unit and the radio frequency unit through a two-layer circuit design architecture, the size and scalability issues of 5G modules are solved, enabling miniaturization and convenient development of the modules, which are suitable for a variety of application scenarios.
Patent Information
- Application Number
- CN202110521184.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-05-13
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2041-05-13
AI Technical Summary
Existing 5G modules have poor hardware scalability, high design complexity, difficulty in reducing module size, risks associated with circuit routing, limited application scenarios, and high complexity in secondary development.
It adopts a two-layer circuit design architecture, highly integrating the baseband unit and the radio frequency unit as the core parts, while the data interface, power management and antenna parts are designed separately. It adopts a simplified and open hardware framework of RISC, with physical layer design, providing rich interfaces and convenience for secondary development.
It significantly reduces module size by 30%, lowers PCB costs, has good scalability and ease of secondary development, supports multi-tasking operation and remote upgrades, and is suitable for a variety of application scenarios.
Smart Images

Figure CN113162651B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of 5G modules, in particular to a small-size intelligent 5G module. BACKGROUND
[0002] With the increasing demand for 5G modules in various industries and the increasing richness of application scenarios, the size of 5G modules is required to be smaller and the interfaces are required to be richer and more convenient development platforms.
[0003] Most of the existing technical solutions adopt a general integrated hardware architecture, that is, a data processing unit, a radio frequency, an antenna, a power management and an interface are integrated into one module unit. The limitation of such a design scheme is poor hardware architecture expansibility, large design complexity, difficult overall size reduction of the module, limited application scenarios and certain risks in circuit wiring work. For example, small requirements such as the need to increase or modify an interface require the overall modification of the module circuit, resulting in increased modification complexity. SUMMARY
[0004] The technical problem to be solved by the application is to provide a small-size intelligent 5G module in view of the above defects of the prior art.
[0005] The technical solution adopted by the application to solve the technical problem is:
[0006] A small-size intelligent 5G module is constructed, which comprises a 5G module circuit board, and two layers of circuit design frameworks are arranged on the 5G module circuit board. One of the two layers of circuit design frameworks is provided with a core unit, and the other is provided with a general unit. The core unit comprises a baseband unit and / or a radio frequency unit. The general unit comprises one or more of power management, an antenna unit and an interface.
[0007] The small-size intelligent 5G module comprises a 5G module circuit board, and a plurality of PIN pins are arranged around the 5G module circuit board, and a plurality of grounding pins are arranged in the middle of the 5G module circuit board.
[0008] The small-size intelligent 5G module further comprises a 5G module software system, and the 5G module software system comprises an application layer, an algorithm layer, an AP layer, a protocol layer and a Firmware driving layer.
[0009] The small-size intelligent 5G module comprises an application layer, an algorithm layer, an AP layer, a protocol layer and a Firmware driving layer, and one or more of the layers provide a development interface for secondary development and an external instruction interface for user debugging and diagnosis.
[0010] The small-size intelligent 5G module, wherein one or more of the application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer provide an IOT-oriented multi-task running architecture, a FOTA / OTA remote upgrade development interface and a dynamic function interface function.
[0011] The small-size intelligent 5G module, wherein the application layer is a functional unit for application function development of each vertical industry of 5G, including one or more of CPE, vehicle-mounted, video, notebook computer industry software functions.
[0012] The small-size intelligent 5G module, wherein the algorithm layer implements core algorithms for industry applications of 5G, including one or more of energy-saving algorithms for low-power operation of the module, V2X algorithms for 5G vehicle networking and automatic driving, face recognition payment algorithms for 5G new retail industry, video compression algorithms for 4K / 8K video transmission and coding, and routing algorithms based on cloud architecture for realizing super-large user access and fast routing of 5G CPE.
[0013] The small-size intelligent 5G module, wherein the AP layer is responsible for implementing software basic functions of the module, including one or more of AT instructions, file management and debugging diagnosis, and is compatible with running in the kernels of Windows, Linux and Android operating systems.
[0014] The small-size intelligent 5G module, wherein the protocol layer is responsible for implementing and optimizing each protocol stack, including one or more of 3G / 4G / 5G communication protocol stack optimization, SNMP network management, SSL / TLS and IPSEC encryption protocol stack function implementation.
[0015] The small-size intelligent 5G module, wherein the Firmware driving layer is responsible for driving each chip and interface unit in the driving module to run in the operating system kernel.
[0016] The application has the advantages that: the scheme adopts an innovative two-layer circuit design architecture, highly integrates a baseband unit for processing wireless data and a radio frequency unit for processing radio frequency data as core parts, separately designs a data interface, power management and an antenna part, adopts a RISC simplified open hardware design framework, isolates the radio frequency circuit from the power management circuit, adopts a physically completely layered design, completely solves the signal interference between circuits, and greatly reduces the size of the module. Compared with most 5G modules in the industry, the surface area is reduced by nearly 30%, the PCB cost is greatly reduced, good extensibility and secondary development convenience are achieved. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:
[0018] Figure 1 This is a block diagram illustrating the two-layer circuit design principle of a small-sized intelligent 5G module according to a preferred embodiment of the present invention.
[0019] Figure 2 This is a circuit diagram of the core unit of a small-sized intelligent 5G module according to a preferred embodiment of the present invention;
[0020] Figure 3 This is a general-purpose unit circuit diagram of a small-sized intelligent 5G module according to a preferred embodiment of the present invention;
[0021] Figure 4 This is a schematic diagram of the pin design of a small-sized intelligent 5G module circuit board according to a preferred embodiment of the present invention;
[0022] Figure 5 This is a block diagram illustrating the architecture principle of a small-sized intelligent 5G module software system according to a preferred embodiment of the present invention. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, a clear and complete description will be provided below in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the protection scope of the present invention.
[0024] The preferred embodiment of the present invention is a small-sized intelligent 5G module, such as... Figure 1 As shown, see also Figures 2-5 The system includes a 5G module circuit board 1, which has a two-layer circuit design architecture. The two-layer circuit design architecture includes a core unit 10 on one layer and a general-purpose unit 11 on the other layer. The core unit 10 includes a baseband unit and / or a radio frequency unit. The general-purpose unit 11 includes one or more of power management, antenna unit, and interface.
[0025] The scheme adopts an innovative two-layer circuit design architecture, highly integrates the baseband unit for processing wireless data and the radio frequency unit for processing radio frequency data as core parts, separately designs the data interface, power management and antenna part, adopts a RISC simplified open hardware design framework, isolates the radio frequency circuit from the power management circuit, adopts a physically completely layered design, completely solves the signal interference between circuits, and greatly reduces the size of the module. Compared with most 5G modules in the industry, the surface area is reduced by nearly 30%, the PCB cost is greatly reduced, good extensibility and secondary development convenience are achieved;
[0026] The 5G communication module using the scheme has a size of 30*34*2.3mm, which is almost the smallest 5G module in the industry, integrates 3G / 4G / 5G frequency bands, meets sub 6GHz spectrum, NSA and SA networking mode and 4*4MIMO and other leading functions;
[0027] An optional core module embodiment of the 5G module is shown in Figure 2 The left side is a baseband BB module, and the right side is a radio frequency RF module. The baseband BB design includes a modem, a DSP processor, an A7 processor, a RAM / ROM management module, a control signal module and an interface, etc. The RF radio frequency design includes a transceiver, a PA and an LNA, etc. Core components provide 4*4MINO receiving channels and 2 antenna rotating transmission channel designs.
[0028] Preferably, a plurality of PIN pins are designed around the 5G module circuit board, and a plurality of grounding pins are designed in the middle of the 5G module circuit board. The scheme adopts an innovative design in the module packaging design, adopts an LGA and LCC fusion scheme, designs dozens of pin pins around the module, and designs the middle of the module as a ground. While designing a super-small module size, a large number of signal pins are provided to meet the 5G function requirements of most application scenarios. An optional specific embodiment is shown in Figure 4 In the bottom pin definition, 202 pin pins are provided, the middle part of the module is a grounding part, the periphery of the module adopts an innovative pin pin design, provides RGMII, SDIO, GPIO, USB, Mini-PCIE, SIM and other rich interface signal pin designs, and provides innovative pin pins for RJ45 and WIFI external interfaces. The pin pins are connected, and signal connection and power management interface designs are provided.
[0029] Preferably, the small-size intelligent 5G module further includes a 5G module software system, and the 5G module software system includes an application layer, an algorithm layer, an AP layer, a protocol layer and a Firmware driving layer.
[0030] The software architecture of the existing module basically adopts a full-stack protocol layer integration mode, including a function application layer, an algorithm layer, an AP layer, a protocol layer and a Firmware driving layer; the full-stack software design architecture of the module has great limitations in secondary function development, because there is no platform API interface and software protocol stack multi-layer structure isolation, and the rapid customization function development demand of the industry customers needs to be modified from the software application layer to the driver, which increases the development complexity;
[0031] In the aspect of software architecture, the present solution innovatively designs a five-layer software development layer architecture with good expansibility, a remote upgrade open interface, a dynamic function loading and an IOT-oriented multi-task running architecture, and other industry-leading solutions to meet the functional requirements of Android system industry application application scenarios such as vehicle-mounted, CPE and POS.
[0032] Preferably, one or more of the application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer provide development interfaces for secondary development and external instruction interfaces for user debugging and diagnosis; preferably, one or more of the application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer provide an IOT-oriented multi-task running architecture, a FOTA / OTA remote upgrade development interface and a dynamic function interface function.
[0033] The application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer each can be designed to provide API function interfaces and AT instructions for secondary development, wherein the BSP and Firmware layer have interfaces with the Android system kernel, and at the same time, provide innovative functions such as an IOT-oriented multi-task running architecture and a FOTA / OTA remote upgrade development interface and a dynamic function interface, which brings good secondary development convenience to customers using the products of the present solution, and at the same time, makes the products of the present solution have good robustness and high performance.
[0034] Preferably, the application layer is oriented to the application function development of each vertical industry of 5G, including one or more industry software functions of CPE, vehicle-mounted, video, notebook computer.
[0035] Preferably, the algorithm layer implements core algorithms for 5G industry applications, including one or more of energy-saving algorithms for low-power operation of the module, V2X algorithms for 5G vehicle networking and automatic driving, face recognition payment algorithms for 5G new retail industry, video compression algorithms for 4K / 8K video transmission and coding, and routing algorithms based on cloud architecture for realizing super large user access and fast routing of 5G CPE.
[0036] Preferably, the AP layer is responsible for the module to realize the basic functions of software, including one or more basic functions of AT instructions, file management and debugging and diagnosis, and is compatible with the kernel of Windows, Linux and Android operating systems.
[0037] Preferably, the protocol layer is responsible for the implementation and optimization of various protocol stacks, including one or more of the functions of 3G / 4G / 5G communication protocol stack optimization, SNMP network management, SSL / TLS and IPSEC encryption protocol stack.
[0038] Preferably, the Firmware driver layer is responsible for driving each chip and interface unit in the driver module to run in the operating system kernel.
[0039] It should be understood that those skilled in the art can make improvements or changes according to the above description, and all these improvements and changes shall belong to the protection scope of the appended claims of the present application.
Claims
1. A small-size intelligent 5G module, characterized in that, Including 5G module circuit board, two layers of circuit design framework are arranged on the 5G module circuit board;One of the two layers is provided with a core unit, and the other is provided with a general unit;The core unit includes a baseband unit and / or a radio frequency unit;The general unit includes one or more of power management, antenna unit, interface;The left of the core unit is a baseband BB module, and the right is a radio frequency RF module;The baseband BB module includes modem, DSP processor, A7 processor, RAM / ROM management module, control signal module and interface;The radio frequency RF module includes transceiver, PA and LNA, provides 4*4MIMO receiving channel and 2 antenna rotating transmission channel design;A plurality of PIN pins are designed around the 5G module circuit board, and a plurality of grounding pins are designed in the middle of the 5G module circuit board.
2. The small-size intelligent 5G module according to claim 1, wherein, The small size intelligent 5G module further includes a 5G module software system, which includes an application layer, an algorithm layer, an AP layer, a protocol layer and a Firmware driving layer.
3. The small-size intelligent 5G module according to claim 2, wherein, One or more of the application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer provide development interface for secondary development calling and external instruction interface for user debugging and diagnosis.
4. The small-size intelligent 5G module according to claim 2, wherein, One or more of the application layer, the algorithm layer, the AP layer, the protocol layer and the Firmware driving layer provide IOT multi-task running architecture, FOTA / OTA remote upgrade development interface and dynamic function interface function.
5. The small-size intelligent 5G module according to claim 2, wherein, The application layer is a functional unit for application function development of each vertical industry of 5G, including one or more of CPE, vehicle-mounted, video, notebook computer industry software function. 6.The small-size intelligent 5G module according to claim 2, wherein, The algorithm layer realizes core algorithm for 5G industry application, including one or more of energy-saving algorithm for module low-power operation, V2X algorithm for 5G vehicle networking and automatic driving, face recognition payment algorithm for 5G new retail industry, video compression algorithm for 4K / 8K video transmission and coding, routing algorithm based on cloud architecture for realizing super large user access and fast routing of 5G CPE.
7. The small-sized intelligent 5G module according to claim 2, wherein, The AP layer is responsible for realizing software basic function of the module, including one or more of AT instruction, file management and debugging and diagnosis, and is compatible with the kernel of Windows, Linux and Android three operating systems. 8.The small-size intelligent 5G module of claim 2, wherein, The protocol layer is responsible for realizing each protocol stack and optimization, including one or more of 3G / 4G / 5G communication protocol stack optimization, SNMP network management, SSL / TLS and IPSEC encryption protocol stack function realization. 9.The small-size intelligent 5G module of claim 2, wherein, The Firmware driving layer is responsible for driving each chip and interface unit in the driving module to run in the operating system kernel.
Citation Information
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