Upper cover of the optical element drive mechanism

Abstract

The present invention discloses an upper cover of an optical element driving mechanism, which includes the upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball bearing, a bottom circuit board, and a base. The upper spring movably connects the carrier to the upper cover, the lower spring movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount a chip and is movably connected to the base via a ball bearing. The carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move. The upper cover is provided with a magnetic metal sheet, the magnetic metal sheet is fixedly connected to the upper cover, and the magnet group is mounted on the side of the magnetic metal sheet. The present invention realizes optical zoom and optical image stabilization through the movement of different components, thereby solving the problem of blurred photos caused by hand shaking during shooting.

Description

Technical Field

[0001] The present invention relates to the field of optical driving, and in particular to an upper cover of an optical element driving mechanism. Background Art

[0002] With the advancement of technology, many electronic devices today (such as smartphones and digital cameras) now have photo or video recording capabilities. These devices are becoming increasingly common, and are increasingly designed for convenience and slimmer weight, offering users more options. However, current mobile phone cameras sometimes produce blurry images, meaning the images are not clear, or even exhibit ghosting or blurring. These issues, in addition to occasional loss of focus (i.e., the camera fails to focus properly), are largely due to subtle shake during exposure.

[0003] Generally speaking, this slight shaking phenomenon often occurs when holding a camera, causing the camera lens to deviate, resulting in a degradation of the image quality captured by the image sensor. Therefore, the demand for the development of anti-shake technology functions has been relatively high in recent years.

[0004] However, most of the existing technologies achieve optical zoom and optical image stabilization functions through the movement of the same component (carrier). The movement range of the carrier is limited by weight, volume, etc., and cannot effectively solve the problem of blurry photos caused by hand shaking during shooting. Summary of the Invention

[0005] The purpose of the present invention is to provide an upper cover of an optical element driving mechanism, so as to realize optical zoom and optical image stabilization through the movement of different components, thereby solving the problem of blurry photos caused by hand shaking during shooting.

[0006] In order to solve the above problems, according to one aspect of the present invention, an optical element driving mechanism is provided, which includes an upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball, a bottom circuit board and a base, the upper spring movably connects the carrier to the upper cover, the lower spring movably connects the carrier to the base, the bottom circuit board is installed on the base and fixedly connected to the base, the base is used to install a chip and is movably connected to the base through the ball, wherein the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, the magnet group is fixedly installed on the upper cover and cooperates with the first group of coils to drive the carrier to move and cooperates with the second group of coils to drive the base to move.

[0007] In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, a central opening of the upper cover is provided in the middle of the upper cover to cooperate with the optical element, a magnet mounting portion is provided around the central opening of the upper cover, the magnet group is installed on the magnet mounting portion, the upper cover embedded metal sheet includes a magnet matching portion, the magnet matching portion is provided on the magnet mounting portion and is arranged above the magnet group.

[0008] In one embodiment, the upper cover embedded metal sheet further includes a sensor connecting portion, a circuit lead-in portion, and an external circuit connecting portion, and the external circuit connecting portion and the circuit lead-in portion are electrically connected to the sensor connecting portion.

[0009] In one embodiment, the upper cover is provided with a magnetic metal sheet, the magnetic metal sheet is fixedly connected to the upper cover, and the magnet group is installed on the side of the magnetic metal sheet.

[0010] In one embodiment, the upper cover is provided with four magnetic metal sheets, which are respectively fixedly mounted on the inner walls of the four side portions of the upper cover, and the magnet group includes four magnets which are respectively fixedly mounted on the sides of the four magnetic metal sheets.

[0011] In one embodiment, the magnetic metal sheet includes a main plate-shaped portion, a snap-fit ​​portion extending from the top of the main plate-shaped portion to one side, and an embedded portion extending from the top of the main plate-shaped portion to the other side, the embedded portion is embedded in the upper cover to fix the magnetic metal sheet to the upper cover, and the snap-fit ​​portion is used to clamp the magnet group.

[0012] In one embodiment, the base is provided with a base-embedded metal sheet and a ball mounting groove, the ball is mounted in the ball mounting groove, the base-embedded metal sheet is arranged in the base and is provided with a ball coupling portion, the ball coupling portion is arranged in the ball mounting groove of the base and contacts the ball.

[0013] In one embodiment, the carrier is provided with a damping rubber groove, and an avoidance hole is provided on the inner side of the ball joint of the metal sheet embedded in the base, and an upward extending protrusion is provided adjacent to the avoidance hole. The protrusion cooperates with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to cushion the movement of the carrier.

[0014] In one embodiment, the base embedded metal sheet is provided with four protruding pieces, and the carrier is provided with four damping rubber grooves, and one protruding piece is provided in each damping rubber groove.

[0015] In one embodiment, the base forms a rectangular structure as a whole and includes a bottom plate and side portions extending upward from the four sides of the bottom plate. A base center hole is formed in the middle of the bottom plate to cooperate with the lens, and protrusions are formed at the four corners of the bottom plate, and the protrusions cooperate with the upper cover; a magnet avoidance hole is provided on the inner side of the side portion, and the magnet avoidance hole corresponds to the second group of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second group of coils in the circuit board.

[0016] According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism, the optical element driving mechanism comprising the upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball bearing, a bottom circuit board and a base.

[0017] The upper spring piece movably connects the carrier and the upper cover, the lower spring piece movably connects the carrier and the base, the bottom circuit board is installed on the base and fixedly connected to the base, the base is used to install the chip and is movably connected to the base via the ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly installed on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move, wherein the upper cover is also provided with an upper cover embedded metal sheet.

[0018] In one embodiment, a central opening is provided in the middle of the upper cover to cooperate with the optical element, a magnet mounting portion is provided around the central opening of the upper cover, the magnet group is installed on the magnet mounting portion, and the metal sheet embedded in the upper cover includes a magnet matching portion, which is provided on the magnet mounting portion and arranged above the magnet group.

[0019] In one embodiment, the upper cover embedded metal sheet further includes a sensor connecting portion, a circuit lead-in portion, and an external circuit connecting portion, and the external circuit connecting portion and the circuit lead-in portion are electrically connected to the sensor connecting portion.

[0020] In one embodiment, the magnet matching portion is independent of the sensor connecting portion, the circuit leading portion and the external circuit connecting portion.

[0021] In one embodiment, one end of the circuit lead-in portion is electrically connected to the sensor connecting portion, and the other end of the circuit lead-in portion is electrically connected to the upper spring piece.

[0022] In one embodiment, one end of the circuit lead-in portion connected to the upper spring and one end connected to the sensor connecting portion are lower in height than a middle main body portion of the circuit lead-in portion.

[0023] In one embodiment, the upper cover embedded metal sheet includes four magnet matching parts, and the magnet group includes four magnets, and the four magnet matching parts are respectively located above the four magnets.

[0024] In one embodiment, the metal sheet embedded in the upper cover includes two circuit lead-in portions, which are arranged at diagonal positions and are electrically connected to the two circuit access portions of the upper spring sheet, respectively.

[0025] In one embodiment, the external circuit connection portion is bent 180 degrees to connect to the sensor connection portion, and one of the magnet matching portions is disposed in an area surrounded by the bent external circuit connection portion.

[0026] In one embodiment, an upper spring fixing portion is provided on the inner surface of the upper cover, and the circuit lead-in portion of the metal sheet embedded in the base is located inside the upper spring fixing portion.

[0027] According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism, the optical element driving mechanism comprising the upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball bearing, a bottom circuit board and a base.

[0028] The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount the chip and is movably connected to the base via the ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move, wherein

[0029] The upper cover is provided with a magnetic metal sheet, the magnetic metal sheet is fixedly connected to the upper cover, and the magnet group is installed on the side of the magnetic metal sheet.

[0030] In one embodiment, the upper cover is provided with four magnetic metal sheets, which are respectively fixedly mounted on the inner walls of the four side portions of the upper cover, and the magnet group includes four magnets which are respectively fixedly mounted on the sides of the four magnetic metal sheets.

[0031] In one embodiment, the magnetic metal sheet includes a main plate-shaped portion, a snap-fit ​​portion extending from the top of the main plate-shaped portion to one side, and an embedded portion extending from the top of the main plate-shaped portion to the other side, the embedded portion is embedded in the upper cover to fix the magnetic metal sheet to the upper cover, and the snap-fit ​​portion is used to clamp the magnet group.

[0032] In one embodiment, two buckle parts are formed on the top of the main plate portion as a whole, and the embedded part is formed by extending from a position between the two buckle parts to the other side.

[0033] In one embodiment, the snap-on portion and the embedded portion first extend upward from the top of the main plate portion for a certain distance and then extend to both sides respectively, wherein the upward protruding height of the snap-on portion is lower than the upward protruding height of the embedded portion.

[0034] In one embodiment, the embedded portion extends vertically upward a first distance d1 and then extends in the first direction, and the buckle portion extends vertically upward a second distance d2 and then extends in the second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction.

[0035] In one embodiment, the height of the main plate portion of the magnetic metal sheet is smaller than the height of the magnet, and when the magnet is mounted on the magnetic metal sheet, a portion of the bottom of the magnet extends out of the magnetic metal sheet.

[0036] In one embodiment, a central opening is provided in the middle of the upper cover to cooperate with the optical element, a magnet mounting portion is provided around the central opening of the upper cover, and the magnet group is mounted on the magnet mounting portion.

[0037] In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, the upper cover embedded metal sheet includes a magnet matching portion, and the magnet matching portion is provided on the magnet mounting portion and arranged above the magnet group.

[0038] In one embodiment, an upper spring fixing portion is provided on the inner surface of the upper cover, and the metal sheet embedded in the upper cover includes a circuit lead-in portion, and the circuit lead-in portion is provided in the upper spring fixing portion.

[0039] According to another aspect of the present invention, a base of an optical element driving mechanism is further provided, the optical element driving mechanism comprising an upper cover, an upper spring, a magnet group, a carrier, a lower spring, the base, a ball bearing, a bottom circuit board and a base.

[0040] The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount the chip and is movably connected to the base via the ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move, wherein

[0041] The base is provided with a base embedded metal sheet and a ball mounting groove, the ball is installed in the ball mounting groove, the base embedded metal sheet is arranged in the base and is provided with a ball coupling portion, the ball coupling portion is arranged in the ball mounting groove of the base and contacts the ball.

[0042] In one embodiment, each corner of the lower surface of the base is provided with a ball mounting groove, and the base embedded metal sheet is provided with a ball coupling portion at a position corresponding to each ball mounting groove.

[0043] In one embodiment, an avoidance hole is provided on the inner side of the ball joint of the metal sheet embedded in the base, and an upward extending protrusion is provided adjacent to the avoidance hole. The protrusion cooperates with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to cushion the movement of the carrier.

[0044] In one embodiment, the base embedded metal sheet is provided with four protruding pieces, and the carrier is provided with four damping rubber grooves, and one protruding piece is provided in each damping rubber groove.

[0045] In one embodiment, the ball coupling portion is configured as a rectangular sheet, the length and width of the rectangular sheet being equal to or greater than the diameter of the ball.

[0046] In one embodiment, the ball coupling portion is configured as a circular thin sheet, and the diameter of the circular thin sheet is equal to or greater than the diameter of the ball.

[0047] In one embodiment, the base is formed as a whole into a rectangular structure and includes a bottom plate and side portions extending upward from the four sides of the bottom plate. A base center hole is formed in the middle of the bottom plate to cooperate with the lens, and protrusions are formed at the four corners of the bottom plate, and the protrusions cooperate with the upper cover.

[0048] In one embodiment, a lower spring fixing column is provided on the inner side of the protruding portion and is integrally extended upward from the bottom plate. The lower spring fixing column is fixedly connected to the lower spring.

[0049] In one embodiment, a magnet avoidance hole is provided on the inner side of the side portion, and the magnet avoidance hole corresponds to the second group of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second group of coils in the circuit board.

[0050] In one embodiment, the magnet group includes four magnets, and the base is provided with four magnet avoidance holes surrounding the center hole of the base.

[0051] According to another aspect of the present invention, a carrier of an optical element driving mechanism is further provided, the optical element driving mechanism comprising an upper cover, an upper spring, a magnet group, the carrier, a lower spring, a base, a ball bearing, a bottom circuit board and a base.

[0052] The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount the chip and is movably connected to the base via the ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move, wherein

[0053] The base is provided with a base embedded metal sheet, and the carrier is provided with a damping rubber groove, the base embedded metal sheet is provided with a protruding piece, and the protruding piece is installed in the damping rubber groove.

[0054] In one embodiment, a plurality of carrier damping adhesive grooves are provided at the bottom of the carrier, and the plurality of carrier damping adhesive grooves are evenly arranged around the central opening of the carrier.

[0055] In one embodiment, the carrier is provided with a lens mounting hole for mounting the lens, and four carrier side portions and four carrier corner portions are formed around the lens mounting hole. The upper surface of the carrier is movably connected to the upper cover via an upper spring sheet, and the lower surface of the carrier is movably connected to the base via the lower spring sheet.

[0056] In one embodiment, an upper spring connecting column is provided on the upper surface of the carrier, and the upper spring carrier fixing portion of the upper spring is fixedly connected to the upper spring connecting column.

[0057] In one embodiment, a coil mounting groove is provided around the carrier, and a first set of coils is provided in the coil mounting groove. The first set of coils corresponds to the magnet group to drive the carrier to move along the optical axis when the first set of coils is energized.

[0058] In one embodiment, the upper surface of the carrier is further provided with an integrally upwardly protruding carrier upper limit portion to prevent the upper surface of the carrier from directly colliding with the upper cover during movement.

[0059] In one embodiment, a side sensor magnet mounting groove is further provided on the side of the carrier, and the side sensor magnet mounting groove is used to install a side sensor magnet and cooperate with a side sensor to detect the displacement of the carrier in the optical axis direction.

[0060] In one embodiment, a winding post is further provided on a side of the carrier, and ends of the first group of coils are arranged on the winding post.

[0061] In one embodiment, the carrier damping adhesive groove is provided at the bottom of the carrier and extends upwards for a certain distance, and the width of the carrier damping adhesive groove is greater than the width of the protruding piece of the embedded metal sheet of the base.

[0062] In one embodiment, the lower surface of the carrier is further provided with a carrier lower limiting portion extending downwardly to prevent the lower surface of the carrier from directly colliding with the base during movement.

[0063] The optical element driving mechanism of the present application realizes optical image stabilization by driving the chip movement through the base, and creatively utilizes ball bearings in the dynamic chip solution. Since the base and the base are connected by ball bearings, the strength of the entire component can be enhanced, and by arranging metal sheets and gaskets in the ball bearing mounting grooves and ball bearing mounting portions for installing the balls, the balls do not directly contact the base and the base, but contact the metal sheets and gaskets, thereby reducing the wear of the base and the base and extending the service life of the mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a three-dimensional diagram of an optical element driving mechanism according to an embodiment of the present invention.

[0065] Figure 2 yes Figure 1 A three-dimensional view of the base.

[0066] Figure 3 yes Figure 1 Bottom view of the base.

[0067] Figure 4 yes Figure 1 A three-dimensional view of the metal sheet embedded in the base.

[0068] Figure 5 yes Figure 1 Bottom view of the circuit board.

[0069] Figure 6 yes Figure 1 A three-dimensional view of the base.

[0070] Figure 7 yes Figure 1 A top view of an assembly formed by mounting a circuit board on a base.

[0071] Figure 8 yes Figure 1 A stereoscopic image of a carrier.

[0072] Figure 9 It is a top view of the assembly formed by the upper spring installed on the carrier.

[0073] Figure 10A This is a bottom view of the upper cover with the upper cover embedded metal sheet installed.

[0074] Figure 10B It is a three-dimensional diagram of the metal sheet embedded in the upper cover.

[0075] Figure 11 FIG. 1 is a bottom view of a lens driving mechanism according to an embodiment of the present invention, wherein the base, the pedestal and the circuit board are not installed.

[0076] Figure 12 FIG. 1 is a top view of a lens driving mechanism according to an embodiment of the present invention.

[0077] Figure 13 yes Figure 12 A cross-sectional view of the lens drive mechanism taken along line AA.

[0078] Figure 14 yes Figure 12 A cross-sectional view of the lens drive mechanism taken along line CC.

[0079] Figure 15 yes Figure 1 A top view of the carrier and base.

[0080] Figure 16 yes Figure 15 A sectional view of the component taken along line BB.

[0081] Figure 17-18 3D images of a magnet metal sheet with magnets installed thereon according to an embodiment of the present invention are taken from different perspectives.

[0082] Figure 19 This is a three-dimensional diagram of a magnet metal sheet without magnets installed according to an embodiment of the present invention. DETAILED DESCRIPTION

[0083] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0084] In the following description, for the purpose of illustrating the various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0085] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0086] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but words such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and should not be understood as restrictive terms.

[0087] The present application generally relates to an optical element driving mechanism that can be used in terminal products such as mobile phones and tablet computers to cooperate with lenses to achieve functions such as taking photos and recording videos. The optical element driving mechanism may include an upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball bearing, a bottom circuit board, and a base. The upper spring movably connects the carrier to the upper cover, the lower spring movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount a chip and is movably connected to the base via a ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move, for example, along the optical axis to achieve optical zoom, and cooperates with the second set of coils to drive the base to move, for example, in a plane perpendicular to the optical axis or rotate around two mutually perpendicular axes perpendicular to the optical axis to achieve optical image stabilization. Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that these embodiments are exemplary and are intended to help understand the present invention.

[0088] Figure 1 FIG is a perspective view of an optical element driving mechanism 100 according to an embodiment of the present invention. Figure 1As shown, the optical element driving mechanism 100 includes an upper cover 10, a metal sheet 11 embedded in the upper cover, an upper spring 20, a magnet group 30, an electronic component 31, a carrier 40, a lower spring 50, a base 60, a metal sheet 61 embedded in the base, a ball 70, a gasket 71, a circuit board 80 and a base 90. The upper cover embedded metal sheet 11 is arranged in the upper cover 10, the base embedded metal sheet 61 is arranged in the base 60, the electronic component 31 is arranged on the inner surface of the upper cover 10 and is circuit-connected with the upper cover embedded metal sheet 11, the carrier 40 is used to carry optical elements such as a camera and is movably mounted on the base 60, the circuit board is fixedly mounted on the base 90, wherein the carrier 40 is provided with a first group of coils, and the circuit board 80 is provided with a second group of coils, the base 90 is used to install the imaging chip and is movably connected to the base 60 through the ball bearing 70, the base 90 and the carrier 40 are movably connected through the lower spring 50, the upper cover 10 and the carrier 40 are movably connected through the upper spring 20, the magnet group 30 is arranged on the base 60 and cooperates with the first group of coils to drive the carrier 40 to move along the optical axis to realize functions such as autofocus, and cooperates with the second group of coils to drive the base 90 to move in a plane perpendicular to the optical axis or rotate around two mutually perpendicular axes perpendicular to the optical axis to realize optical image stabilization function.

[0089] The movement mode of the optical element driving device of the present application is different from that of conventional optical element driving devices. Conventional optical element driving devices achieve optical zoom by driving the carrier to move along the optical axis and achieve optical image stabilization by driving the carrier to move in a plane perpendicular to the optical axis. However, the present application achieves optical zoom by driving the carrier to move along the optical axis and achieves optical image stabilization by driving the chip on the base to move in a plane perpendicular to the optical axis. The chip here mainly refers to the imaging chip. Since the moving parts of the zoom are different from the moving parts of the optical image stabilization, a wider range of movement can be achieved, achieving better zoom and image stabilization effects, thereby obtaining better imaging quality.

[0090] Furthermore, the base of the present application is connected to the substrate via ball bearings. In other words, the base is supported on the substrate via ball bearings. Therefore, the base can achieve a wider range of motion relative to the substrate and the carrier connected to the base, achieving better anti-shake performance. Furthermore, connecting the base to the substrate and the carrier connected to the base via ball bearings can avoid hysteresis, resulting in stable imaging and fast imaging time. The ball bearings can be made of, for example, ceramic or rigid materials.

[0091] Figure 2 yes Figure 1 A perspective view of the base 60, Figure 3 yes Figure 1 A bottom view of the base 60. Figure 2-3As shown, the base 60 is generally rectangular and includes a bottom plate 62 and side portions 63 extending upward from the sides of the bottom plate 62. A center hole 621 is formed in the center of the bottom plate 62 to accommodate the lens. The four corners of the bottom plate 62 form base protrusions 622. Lower spring fixing posts 623 extending upward from the bottom plate 62 are located inside the base protrusions 622 to securely connect the lower spring. Magnet clearance holes 631 are provided inside the side portions 63. Magnet clearance holes 631 align with the second coil group within the circuit board 80 and the lower surface of the magnet group 50, allowing the lower surface of the magnet group 50 to directly face the second coil group within the circuit board, providing greater anti-shake driving force.

[0092] Reference Figure 3 Each corner of the lower surface of the base 60 is provided with a ball mounting groove 632, and the ball 70 is mounted in the ball mounting groove 632. Figure 1-3 As shown, in this embodiment, the magnet group 50 includes a total of four magnets. Correspondingly, the base 60 is provided with four magnet avoidance holes 631 surrounding the base center hole 621. However, those skilled in the art will appreciate that in other embodiments, the magnet group 50 may include two magnets, three magnets, etc., and correspondingly, three or four magnet avoidance holes may be provided on the base 60. In other words, this document does not limit the number of magnets included in the magnet group 50 and the number of magnet avoidance holes, and an appropriate number of magnets and magnet avoidance holes may be selected according to specific circumstances.

[0093] Figure 4 This is a three-dimensional diagram of a base embedded metal sheet 61 according to an embodiment of the present application. Figure 4 As shown, a base-embedded metal sheet 61 is disposed within the base 60 and has ball-engaging portions 611 at its four corners. The ball-engaging portions 611 are disposed within the ball-mounting grooves 632 of the base 60 and contact the balls 70. Optionally, the ball-engaging portions 611 are rectangular, with the length and width of the rectangular sheet roughly equal to or slightly larger than the diameter of the balls, or circular, with the diameter of the circular sheet roughly equal to or larger than the diameter of the balls. A material-reducing hole 612 is provided on the inner side of the ball-engaging portion 611, and an upwardly extending protrusion 613 is provided adjacent to the material-reducing hole 612. The protrusion 613 engages with and extends into the damping rubber groove at the bottom of the carrier 40, providing a buffering effect on the movement of the carrier 40.

[0094] Figure 5This is a bottom view of the circuit board 80. The circuit board 80 is mounted on the base 90 and forms a rectangular structure as a whole. The four corners of the rectangular structure form notches 83 to avoid the ball mounting portion of the base 60. The middle of the circuit board 80 is provided with a circuit board center hole 81. The circuit board center hole 81 cooperates with the base center hole 621 of the base 60 and is provided with multiple circuit conducting portions 82 along the periphery. One surface of the circuit board 80 may also be provided with one or more electronic components 31 (see Figure 1 ), the electronic component 31 can be electrically connected to the circuit conducting portion 82, and the circuit board 80 is also provided with a base positioning hole 85, which cooperates with the circuit board positioning column on the base 90 to fix the circuit board 80 to the upper surface of the base 90.

[0095] Figure 6 FIG is a perspective view of a base 90 according to an embodiment of the present application. Figure 6 As shown, the base 90 is formed as a whole into a rectangular structure and has a chip mounting hole 91 in the middle for mounting a chip. The chip mainly refers to an imaging chip. The light entering through the optical element generates an image on the chip. The four corners of the base 90 are provided with ball mounting parts 92. The ball mounting parts 92 cooperate with the ball mounting grooves 632 on the base 60 to mount the balls 70. The balls 70 are arranged in the ball mounting grooves 632 and the ball mounting parts 92. It should be noted that the ball mounting parts 92 here are only terms used for convenience of description. Specifically, they can be in the form of grooves, sinks, round holes, etc. A gasket 71 is provided in each ball mounting part 92. The gasket 71 can be made of the same material as the metal sheet 61 embedded in the base.

[0096] Figure 7 FIG. 8 is a top view of an assembly formed by mounting a circuit board 80 on a base 90. Figure 7 As shown, the four notches 83 of the circuit board 80 avoid the ball mounting portion 92 of the base 90 , and the positioning holes 85 of the circuit board 80 cooperate with the positioning columns 93 on the base 90 , thereby fixing the circuit board 80 on the base 90 .

[0097] Figure 8 40 is a perspective view of the carrier 40. Figure 8 As shown, the carrier 40 is provided with a lens mounting hole 41 for mounting a lens, and four carrier side portions and four carrier corner portions are formed around the lens mounting hole 41. The surface of the carrier 40 facing the housing is defined as the upper surface, and the surface facing the base is defined as the lower surface. The upper surface of the carrier 40 is movably connected to the upper cover 10 via the upper spring 20, and the lower surface of the carrier 40 is movably connected to the base 60 via the lower spring 50. Specifically, the upper surface of the carrier 40 is provided with an upper spring connecting post 42, and the upper spring carrier fixing portion 22 of the upper spring 20 is fixedly connected to the upper spring connecting post 42.

[0098] A coil mounting groove 47 is provided around the carrier 40 (see Figure 16 ), the first set of coils 46 are arranged in the coil mounting groove 47 (refer to Figure 13 ), the first set of coils 46 corresponds to the magnet set 50 to drive the carrier 40 to move along the optical axis when the first set of coils 46 is energized. The upper surface of the carrier 40 is also provided with an integrally upwardly extending carrier upper limit portion 43, which prevents the carrier 40 from directly colliding with the upper cover 10 during movement. The side of the carrier 40 is also provided with a side sensor magnet mounting groove 44, which is used to install the side sensor magnet and cooperate with the side sensor to detect the displacement of the carrier 40 in the optical axis direction. The lower surface of the carrier 40 is also provided with a damping rubber groove 45 with an opening toward the base and extending upward along the optical axis. Damping rubber is installed in the damping rubber groove 45 and accommodates the protruding piece 613 on the embedded metal sheet 61 of the base. The present application creatively cooperates with the damping rubber groove 45 by the protruding piece 613 of the embedded metal sheet 61 of the base to provide a good buffering effect on the movement of the carrier.

[0099] Figure 9 FIG. 4 is a top view of an assembly formed by mounting the upper spring 20 on the carrier 40. Figure 9 As shown, the upper spring 20 is provided with an upper cover fixing portion 21 and an upper spring carrier fixing portion 22. The upper cover fixing portion 21 and the upper spring carrier fixing portion 22 are movably connected via an upper spring elastic portion 23. The upper cover fixing portion 21 is fixedly connected to the upper cover 10, and the upper spring carrier fixing portion 22 is fixedly connected to the upper spring connecting column 42 of the carrier 40. The upper spring 20 is also provided with a coil connecting portion 24. The coil connecting portion 24 is electrically connected to the first set of coils on the carrier 40, while the upper cover connecting portion 21 is electrically connected to the upper cover embedded metal sheet 20. Thus, the current from the upper cover embedded metal sheet is introduced through the upper spring 20 to the first set of coils on the carrier, thereby driving the carrier 40 to move along the optical axis.

[0100] Figure 10A FIG. 1 is a bottom view of the upper cover 10 with the upper cover embedded metal sheet 11 installed. Figure 10A As shown, the upper cover embedded metal sheet 11 is disposed within the upper cover 10. Upper spring fixing portions 13 are provided at the four corners of the upper cover 10, and the upper cover fixing portion 21 of the upper spring 20 is fixed to the upper spring fixing portions 13. The upper cover embedded metal sheet 11 is provided with a circuit lead-in portion 111. This circuit lead-in portion 111 is disposed within the upper spring fixing portion 13 of the upper cover 10 and electrically connected to the upper spring 20, thereby directing current from the upper cover embedded metal sheet 11 to the upper spring 20. The upper cover embedded metal sheet 11 is also provided with an external circuit connection portion 112. The external circuit connection portion 112 extends outward from the outer periphery of the upper cover 11 and is used to connect to an external circuit. The external circuit connection portion 112 is electrically connected to the circuit lead-in portion 111, thereby directing external current to the upper spring 20 through the upper cover embedded metal sheet 11.

[0101] Figure 10B 1 is a three-dimensional diagram of the metal sheet 11 embedded in the upper cover. Figure 10B As shown, the upper cover embedded metal sheet 11 is embedded in the upper cover 10 to increase the strength of the upper cover 10 as a whole. The upper cover embedded metal sheet 11 as a whole includes a magnet matching part 113, a sensor connecting part 114, a circuit leading-in part 111 and an external circuit connecting part 112. The four magnet matching parts 113 are arranged above the magnet group 30 and are independent of the sensor connecting part 114, the circuit leading-in part 111 and the external circuit connecting part 112. The sensor connecting part 114 is electrically connected to the sensor, and the external circuit connecting part 112 and the circuit leading-in part 111 are electrically connected to the sensor connecting part 114. Among them, one end of the circuit lead-in part 111 is connected to the sensor connecting part 114, and the other end is electrically connected to the upper spring piece 20. Preferably, the end of the circuit lead-in part 111 connected to the upper spring piece 20 and the end connected to the sensor connecting part 114 are lower than the middle main part of the circuit lead-in part 111 in the height direction, that is, the two ends of the circuit lead-in part 111 are sunken relative to the entire upper cover embedded metal sheet 11 to be electrically connected to the upper spring piece 20 and the sensor connecting part 114.

[0102] Figure 11 FIG. 1 is a bottom view of a lens drive mechanism according to an embodiment of the present invention, wherein the base, the pedestal and the circuit board are not installed. Figure 11 As shown, the lower spring 50 is provided with a base fixing portion 51 and a lower spring carrier fixing portion 52, and the base fixing portion 51 and the lower spring carrier fixing portion 52 are movably connected via the lower spring elastic portion 53. The base fixing portion 51 is fixedly connected to the base 60, and the lower spring carrier fixing portion 52 is fixedly connected to the lower surface of the carrier 40, thereby movably connecting the carrier 40 and the base 60 via the lower spring 50. Figure 11 It can be clearly seen that the lower surface of the carrier 40 is provided with a damping rubber groove 45 extending along the optical axis direction. The damping rubber groove 45 is used to install the damping rubber and cooperate with the protruding piece 613 of the embedded metal sheet 61 of the base, that is, the protruding piece 613 of the embedded metal sheet 61 of the base extends into the damping rubber groove 45, wherein the size of the protruding piece 613 is preferably set to be smaller than the size of the damping rubber groove 45, so that the protruding piece 613 can move in the damping rubber groove 45.

[0103] Figure 12 FIG. 1 is a top view of a lens driving mechanism 100 according to an embodiment of the present invention. Figure 13 yes Figure 12 A cross-sectional view of the lens drive mechanism taken along line AA, Figure 14 yes Figure 12 A cross-sectional view of the lens drive mechanism taken along line CC, Figure 15 This is a top view of the carrier and the base. Figure 16 yes Figure 15 A cross-sectional view of a component taken along line BB. Figure 12-16 As shown, a first set of coils 46 is mounted on the carrier 40. The magnet assembly 30 is fixedly mounted within the upper cover 10 and arranged opposite the first set of coils 46. The upper surface of the carrier 40 is movably connected to the upper cover 10 via an upper spring 20, and the lower surface of the carrier 40 is movably connected to the base 60 via a lower spring 50. The circuit board 80 is fixedly mounted on the base 90 and internally includes a second set of coils 86. The second set of coils 86 is arranged below the magnet assembly 30 and cooperates with the magnet assembly 30 to drive the base 90 and, in turn, the chip to move when power is applied, for example, in a plane perpendicular to the optical axis or around mutually perpendicular axes in a plane perpendicular to the optical axis, thereby achieving optical image stabilization. The base 90 also has a bottom sensor 92, located below the second set of coils and the magnet assembly 50, to detect displacement of the assembly consisting of the carrier, upper cover, and base in a direction perpendicular to the optical axis.

[0104] Reference Figure 14 The base 60 and the base 90 are connected via the ball bearing 70. Specifically, the ball bearing 70 is mounted within the ball bearing mounting portion 92 of the base 90 and the ball bearing mounting groove 632 of the base 60. The space formed by the ball bearing groove 632 and the ball bearing mounting portion 92 is larger than the size of the ball bearing 70, allowing the ball bearing 70 to roll freely within the ball bearing groove 632 and the ball bearing mounting portion 92. The ball bearing 70 contacts the ball bearing engaging portion 611 of the base embedded metal sheet 61 and the gasket 71 of the ball bearing mounting portion 92 within the ball bearing mounting groove 632, respectively. When the second set of coils 86 in the circuit board 80 is energized, it forms electromagnetic induction with the magnet assembly 50, driving the base 90 to move the chip (not shown). Since the base 90 and the base 60 are connected via the ball bearing 70, the movement of the ball bearing 70 causes relative movement between the base 60 and the carrier 40 connected thereto and the base 90, thereby achieving the optical image stabilization function.

[0105] Reference Figure 13 and combined Figure 16 When energized, the first coil 46 cooperates with the magnet assembly 50 and, through the Ampere force, drives the carrier 40 to move relative to the base 60 along the optical axis, achieving optical zoom. Because the protrusion 63 of the base's embedded metal sheet extends into the damping rubber groove 45 and is surrounded by the damping rubber (not shown), it provides better cushioning against carrier movement.

[0106] The optical element driving mechanism of the present application realizes optical image stabilization by driving the chip movement through the base, and creatively utilizes ball bearings in the dynamic chip solution. Since the base and the base are connected by ball bearings, the strength of the entire component can be enhanced, and by arranging metal sheets and gaskets in the ball bearing mounting grooves and ball bearing mounting portions for installing the balls, the balls do not directly contact the base and the base, but contact the metal sheets and gaskets, thereby reducing the wear of the base and the base and extending the service life of the mechanism.

[0107] Refer to the following Figure 17-19 The magnetic metal sheet 32 ​​of the upper cover 10 according to one embodiment of the present application is introduced. Figure 17-18 A perspective view showing a magnet metal sheet 32 ​​with magnets mounted thereon from different perspectives, Figure 19 3D is a perspective view of a magnet metal sheet 32 ​​without magnets installed. Figure 17-19 As shown, the magnetic metal sheet 32 ​​is arranged on the outside of the magnet 30. The magnetic metal sheet 32 ​​is fixedly mounted on the inner walls of the four side portions of the upper cover 10, and the magnet 30 is fixedly mounted on the inner surface of the magnetic metal sheet 32. Specifically, the magnetic metal sheet 32 ​​includes a main plate-shaped portion 321, a snap-fit ​​portion 322 extending from the top of the main plate-shaped portion 321 to one side, and an embedded portion 323 extending from the top to the other side. The embedded portion 323 is embedded in the upper cover 10, and the snap-fit ​​portion 322 clamps the magnet 30. Two snap-fit ​​portions 322 are formed on the top of the main plate-shaped portion 321 as a whole, and the embedded portion 323 extends from the position between the two snap-fit ​​portions 322 to the other side. The height of the upward projection of the snap-fit ​​portion 322 is lower than the height of the upward projection of the embedded portion 323. That is, the embedded portion 323 extends vertically upward by a first distance d1 and then extends in the first direction, and the snap-fit ​​portion 322 extends vertically upward by a second distance d2 and then extends in the second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction. By utilizing the magnetic metal sheet 32, on the one hand, it plays a role in regularizing the magnetic field. On the other hand, because the present application creatively fixes the magnet to the upper cover, rather than installing the magnet on the base as is conventionally done, the provision of the magnetic metal sheet 32 ​​can better secure the magnet 30 to the upper cover 10.

[0108] While the preferred embodiments of the present invention have been described in detail above, it should be understood that, after reading the above teachings of the present invention, those skilled in the art may make various changes or modifications to the present invention. Such equivalents also fall within the scope of the claims appended hereto.

Claims

1. An optical element driving mechanism, characterized in that: The optical element driving mechanism includes an upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball, a bottom circuit board and a base. The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount the chip and is movably connected to the base via the ball bearing, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move to achieve the optical zoom function, and cooperates with the second set of coils to drive the base to move to achieve the optical image stabilization function, wherein The upper cover is provided with a magnetic metal sheet, the magnetic metal sheet is fixedly connected to the upper cover, and the magnet group is installed on the side of the magnetic metal sheet; The upper cover is further provided with an upper cover embedded metal sheet, which is arranged in the upper cover and includes a sensor connection portion, a circuit introduction portion and an external circuit connection portion, and the external circuit connection portion and the circuit introduction portion are electrically connected to the sensor connection portion; The middle part of the upper cover is provided with an upper cover central opening for cooperating with the optical element, and a magnet mounting portion is provided around the upper cover central opening, and the magnet group is mounted on the magnet mounting portion; The metal sheet embedded in the upper cover includes a magnet matching portion, which is provided on the magnet mounting portion and arranged above the magnet group, and is independent of the sensor connection portion, the circuit introduction portion and the external circuit connection portion; The four corners of the upper cover are provided with upper spring fixing parts, and the upper cover fixing parts of the upper spring are fixed to the upper spring fixing parts; The circuit introduction portion is arranged in the upper spring piece fixing portion of the upper cover, one end of the circuit introduction portion is electrically connected to the sensor connecting portion, and the other end of the circuit introduction portion is electrically connected to the upper spring piece; One end of the circuit lead-in portion connected to the upper spring and one end connected to the sensor connecting portion are lower in height than the middle main body portion of the circuit lead-in portion; The external circuit connection portion extends out of the outer periphery of the upper cover and is used to connect to an external circuit. The external circuit connection portion is electrically connected to the circuit lead-in portion.

2. The optical element driving mechanism according to claim 1, wherein: The upper cover is provided with four magnetic metal sheets, which are respectively fixedly mounted on the inner walls of the four side portions of the upper cover. The magnet group includes four magnets which are respectively fixedly mounted on the side surfaces of the four magnetic metal sheets.

3. The optical element driving mechanism according to claim 1, wherein: The magnetic metal sheet includes a main plate-shaped portion, a snap-on portion extending from the top of the main plate-shaped portion to one side, and an embedded portion extending from the top of the main plate-shaped portion to the other side. The embedded portion is embedded in the upper cover to fix the magnetic metal sheet to the upper cover, and the snap-on portion is used to clamp the magnet group.

4. The optical element driving mechanism according to claim 3, wherein: Two buckle parts are formed on the top of the main plate portion as a whole, and the embedded part is formed by extending from a position between the two buckle parts to the other side.

5. The optical element driving mechanism according to claim 3, wherein: The buckle portion and the embedding portion first extend upward from the top of the main plate portion for a certain distance and then extend to both sides respectively, wherein the upward protruding height of the buckle portion is lower than the upward protruding height of the embedding portion.

6. The optical element driving mechanism according to claim 3, wherein: The embedded portion extends vertically upward by a first distance d1 and then extends in a first direction, and the buckle portion extends vertically upward by a second distance d2 and then extends in a second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction.

7. The optical element driving mechanism according to claim 3, wherein: The height of the main plate portion of the magnetic metal sheet is smaller than the height of the magnet. When the magnet is mounted on the magnetic metal sheet, a portion of the bottom of the magnet extends out of the magnetic metal sheet.

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