processing device

By using a transparent material chuck worktable and upper and lower imaging units combined with image processing technology in the processing device, the problem of difficulty in recognizing the correspondence between the front and back side images was solved, thus achieving the effect of simplifying operation.

CN113211660BActive Publication Date: 2025-12-16DISCO CORP
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Patent Information

Application Number
CN202110140620.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-02-04
Filing Date
2021-02-02
Publication Date
2025-12-16
Estimated Expiration
2041-02-02

AI Technical Summary

Technical Problem

In processing equipment, existing technologies cannot effectively resolve the correspondence between the front and back images of the workpiece, leading to difficulties for operators.

Method used

The design incorporates a transparent material area on the chuck worktable, combined with upper and lower shooting units, and uses image processing technology to consistently display the orientation of the rear and front side images on the display device.

Benefits of technology

It simplifies the operator's identification of the correspondence between the front and back side images, reducing the operational burden.

✦ Generated by Eureka AI based on patent content.

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    Figure CN113211660B_ABST
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Abstract

Provided is a processing apparatus that reduces the burden on an operator in a case where the operator performs work while observing an image displayed on a display apparatus. The processing apparatus includes: a chuck table including a plate-shaped holding member having a prescribed area formed of a transparent material from one face to the other face; a processing unit that processes a workpiece; a first imaging unit provided above the chuck table that acquires a front image on the back side; a second imaging unit provided below the chuck table that acquires a front image on the front side; a display apparatus that displays at least either of an image on the back side imaged by the first imaging unit and an image on the front side imaged by the second imaging unit; and a control unit that performs image processing on either of the front image on the back side and the front image on the front side and displays the image on the display apparatus in a state of being flipped in a prescribed direction so as to make the orientations of the front image on the back side and the front image on the front side coincide.
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Description

TECHNICAL FIELD

[0001] The present application relates to a processing apparatus that processes a back surface side of a workpiece in a state where the workpiece whose front surface side is formed with a prescribed pattern is held by the front surface side. BACKGROUND

[0002] A semiconductor device chip for an electronic device such as a mobile phone, a personal computer, or the like is manufactured, for example, by processing a wafer (workpiece) that is a disc-shaped wafer formed of a semiconductor material such as silicon. A plurality of division intended lines are provided on a front surface side of the workpiece, and a device such as an IC (Integrated Circuit), an LSI (Large Scale Integration), a MEMS (Micro Electro Mechanical Systems), or the like is formed in each region divided by the plurality of division intended lines.

[0003] In order to manufacture a device chip from the workpiece, for example, after the workpiece is thinned to a prescribed thickness by grinding the back surface side of the workpiece, the workpiece is cut along each division intended line, thereby dividing the workpiece into a device unit to manufacture the device chip.

[0004] A cutting apparatus is used in a cutting process of cutting the workpiece, and the cutting apparatus has a cutting unit in which a cutting tool is attached to one end of a main shaft, and a chuck table that holds the workpiece by suction. In a normal cutting process, first, the front surface side of the workpiece is made to face upward, and the back surface side of the workpiece is held by suction by the chuck table.

[0005] After the back surface side is held, the front surface side of the workpiece is imaged by a first camera provided above the chuck table, thereby performing alignment. The first camera has an imaging element such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor for imaging a subject by visible light.

[0006] Alignment is performed by position correction of the workpiece or the like according to a result of imaging the front surface side of the workpiece on which an alignment mark or the like is formed by the first camera. After the alignment, the workpiece is cut along each division intended line by the cutting tool.

[0007] However, in recent years, along with diversification of devices, the workpiece is sometimes cut from the back side thereof (for example, refer to Patent Document 1). In this case, since the front side of the workpiece is arranged downward and held by the chuck table, even if the back side of the workpiece is imaged by the first camera provided above the chuck table, the alignment mark or the like cannot be imaged.

[0008] Therefore, a cutting device has been developed, which has a chuck table formed of a material transparent to visible light and a second camera for visible light arranged below the chuck table (for example, refer to Patent Document 2).

[0009] If the second camera is used, the front side of the workpiece can be imaged from below the chuck table in a state where the front side of the workpiece is held by the chuck table. Therefore, even in a case where the back side of the workpiece is made to face upward and the front side of the workpiece is held by the chuck table, the front side can be observed.

[0010] Patent Document 1: Japanese Patent Application Publication No. 2006-140341

[0011] Patent Document 2: Japanese Patent Application Publication No. 2010-87141

[0012] However, in a case where the image of the front side obtained by the second camera and the image of the back side obtained by the first camera are directly displayed on a display device such as a liquid crystal display, the image of the front side is displayed in a state of being flipped leftward or rightward or upward or downward compared with the image of the back side.

[0013] As a result, for example, the left direction of the image of the front side corresponds to the right direction of the image of the back side. Therefore, it is not easy for the operator to grasp the correspondence relation between the front side and the back side, which becomes a burden on the operator. SUMMARY

[0014] The present application was accomplished in view of the above problems, and has an object to provide a machining device which displays an image obtained by imaging a workpiece from below a chuck table on a display device, and which can reduce a burden on an operator in a case where the operator performs work while observing the displayed image.

[0015] According to one embodiment of the present application, there is provided a processing apparatus including: a chuck table including a plate-shaped holding member including one face and another face located on the opposite side of the one face, and having a prescribed region formed of a transparent material from the one face to the another face; a processing unit that processes a workpiece in a state where a front face side of the workpiece is held by the one face of the chuck table and a back face side of the workpiece is exposed upward, the workpiece having a prescribed pattern on the front face side; a first imaging unit having a first imaging element, the first imaging unit being disposed above the chuck table, and acquiring an image of the back face side; a second imaging unit having a second imaging element, the second imaging unit being disposed below the chuck table, and acquiring an image of the front face side in a region corresponding to a region imaged by the first imaging unit in a thickness direction of the workpiece; a display device that displays at least either of the image of the back face side acquired by the first imaging unit and the image of the front face side acquired by the second imaging unit; and a control unit having a storage device storing a program for performing image processing, and a processor that processes an image according to the program, the control unit performing image processing on either of the image of the back face side and the image of the front face side, and displaying the image on the display device in a state where the image is flipped in a prescribed direction, so as to make the orientations of the image of the back face side and the image of the front face side coincide.

[0016] According to another embodiment of the present application, there is provided a processing apparatus including: a chuck table including a plate-shaped holding member including one face and another face located on the opposite side of the one face, and having a prescribed region formed of a transparent material from the one face to the another face; a processing unit that processes a workpiece in a state where a front face side of the workpiece is held by the one face of the chuck table and a back face side of the workpiece is exposed upward, the workpiece having a prescribed pattern on the front face side; a first imaging unit having a first imaging element, the first imaging unit being disposed above the chuck table, and acquiring an image of the back face side; a third imaging unit having a third imaging element, the third imaging unit being disposed below the chuck table, and acquiring a mirror image of the front face side in a region corresponding to a region imaged by the first imaging unit in a thickness direction of the workpiece; and a display device that displays at least either of the image of the back face side acquired by the first imaging unit and the image of the front face side acquired by the third imaging unit.

[0017] It is preferable that the processing apparatus further has a control section having a storage device in which a program for performing image processing is stored and a processor that processes an image according to the program, and the control section performs image processing on both the front image of the back side and the mirror image of the front side and displays them on the display apparatus in a state of being flipped in a prescribed direction so as to make the orientations of the front image of the back side and the mirror image of the front side coincide.

[0018] According to another aspect of the present application, there is provided a processing apparatus, wherein the processing apparatus has: a chuck table including a plate-shaped holding member including one face and another face on the opposite side of the one face, and having a prescribed region formed of a transparent material from the one face to the another face; a processing unit that processes a work in a state where a front side of the work is held by the one face of the chuck table and a back side of the work is exposed upward, wherein the work has a prescribed pattern on the front side; a fourth imaging unit having a fourth imaging element, the fourth imaging unit being disposed above the chuck table, and acquiring a mirror image of the back side; a second imaging unit having a second imaging element, the second imaging unit being disposed below the chuck table, and acquiring a front image of the front side in a region corresponding to a region imaged by the fourth imaging unit in a thickness direction of the work; and a display apparatus that displays at least any one of an image of the back side acquired by the fourth imaging unit and an image of the front side acquired by the second imaging unit.

[0019] It is preferable that the processing apparatus further has a control section having a storage device in which a program for performing image processing is stored and a processor that processes an image according to the program, and the control section performs image processing on both the front image of the back side and the mirror image of the front side and displays them on the display apparatus in a state of being flipped in a prescribed direction so as to make the orientations of the front image of the back side and the mirror image of the front side coincide.

[0020] According to another aspect of the present invention, a processing apparatus is provided, comprising: a chuck table including a plate-shaped holding member having one side and another side located opposite to the one side, and having a defined area formed of a transparent material from the one side to the other side; a processing unit that processes the workpiece with its front side held by the one side of the chuck table and its back side exposed upwards, wherein the workpiece has a defined pattern on the front side; a fourth imaging unit having a fourth imaging element disposed above the chuck table to obtain a mirror image of the back side; and a third imaging unit having a third imaging element. The third imaging unit is disposed below the chuck worktable and acquires a mirror image of the front side in an area corresponding to the area captured by the fourth imaging unit in the thickness direction of the workpiece; a display device displays at least any image of the back side image acquired by the fourth imaging unit and the front side image acquired by the third imaging unit; and a control unit having a storage device storing a program for performing image processing and a processor for processing images according to the program, the control unit performing image processing on any image of the back side mirror and the front side mirror and displaying them on the display device in a state of being flipped in a predetermined direction so that the orientation of the back side mirror and the front side mirror is aligned.

[0021] Preferably, the image on the front side is displayed together with the image on the back side on the display device.

[0022] Alternatively, preferably, the processing unit is a cutting unit or a laser irradiation unit. The cutting unit has a spindle and a cutting tool is mounted at one end of the spindle. The laser irradiation unit has a laser oscillator that generates a laser beam and a focusing lens that focuses the laser beam emitted from the laser oscillator.

[0023] In one aspect of the present invention, the chuck table of the processing apparatus has a defined area formed of a transparent material from one side to the other. A first imaging unit is provided above the chuck table to acquire a positive image of the back side. Furthermore, a second imaging unit is provided below the chuck table, which acquires a positive image of the front side in a region corresponding to the area photographed by the first imaging unit in the thickness direction of the workpiece.

[0024] The processing apparatus also includes a display device and a control unit. The display device displays at least any one of the rear-side image acquired by the first imaging unit and the front-side image acquired by the second imaging unit.

[0025] The control unit processes any image from either the rear-side or front-side positive image and displays it on the display device in a flipped state according to a specified direction, so that the orientation of the rear-side and front-side positive images is consistent. This makes it easier for the operator to grasp the correspondence between the front and rear sides, thus reducing the operator's workload. Attached Figure Description

[0026] Figure 1 It is a three-dimensional diagram of the cutting device.

[0027] Figure 2 It is a three-dimensional view of the workpiece unit.

[0028] Figure 3 It is a 3D view of the chuck, worktable, etc.

[0029] Figure 4 It is a partial sectional side view of the chuck, worktable, etc.

[0030] Figure 5 yes Figure 4 A magnified view of region A.

[0031] Figure 6 It is an enlarged 3D view of the Z-axis moving mechanism, etc.

[0032] Figure 7 (A) is an example of a frontal view image. Figure 7 (B) is an example of an image of the front side that has been flipped in a specified direction.

[0033] Figure 8 (A) is an example of a method for displaying the image on the front side and the image on the back side. Figure 8 (B) is another example of a method of displaying the image on the front side and the image on the back side.

[0034] Figure 9 This is a diagram showing the cutting process.

[0035] Figure 10 This is a diagram illustrating the incision inspection process.

[0036] Figure 11 This is a diagram showing the lower camera unit, etc., of the first modified example.

[0037] Figure 12 This is a diagram showing the upper camera unit, etc., of the second modified example.

[0038] Figure 13 This is a diagram showing the lower camera unit, upper camera unit, etc. of the third modified example.

[0039] Figure 14 It is a 3D diagram of a laser processing device.

[0040] Label Explanation

[0041] 2: Cutting device; 4: Base; 4a, 4b, 4d: Openings; 4c: Support structure; 6: Box; 10: Chuck table; 11: Workpiece; 11a: Front side; 11b: Back side; 11c: Cutting groove; 12: Holding component; 12a: One face; 12b: Another face; 12c1: First suction path; 12c2: Second suction path; 12c3: Intersection; 12d: Opening; 12e: Outer peripheral suction path; 12f: Suction path; 13: Predetermined dividing line; 14: Suction source; 15: Device; 16: Frame; 16a: Opening; 16b: Pulley section; 17: Belt; 18: X-axis moving table; 18a: Base plate; 18b: Side plate; 18c: Top plate; 18d: Space; 19: Frame; 20: X-axis guide rail; 20a: X-axis linear scale; 21: Workpiece unit; 22: X-axis ball screw; 23a, 23b: Image; 24: X-axis pulse motor; 26: X-axis moving mechanism; 28: Transmission belt; 30: Rotary drive source; 30a: Pulley; 32: Y-axis moving mechanism; 34: Y-axis guide rail; 36: Y-axis moving worktable; 38: Y-axis ball screw; 40: Y-axis pulse motor; 42: Z-axis moving mechanism; 42a: Support structure; 44: Z-axis guide rail; 46: Z-axis moving plate; 48: Z-axis ball screw; 50: Z-axis pulse motor 52: Electric motor; 54: Support arm; 54: Lower imaging unit; 54a: Mirror; 54b: Reflector unit; 56: Low-magnification camera; 56a: Illumination device; 58: High-magnification camera; 58a: Illumination device; 60: Machining unit moving mechanism; 62: Y-axis guide rail; 64: Y-axis moving plate; 66: Y-axis ball screw; 68: Y-axis pulse motor; 70: Z-axis moving plate; 72: Z-axis guide rail; 74: Z-axis ball screw; 76: Z-axis pulse motor; 78: Cutting unit; 80: Spindle housing; 82a: Spindle; 82b: Cutting tool; 84: Upper imaging unit; 84a: Support arm; 84b: Camera; 8 4c: Mirror; 84d: Reflector unit; 86: Cleaning unit; 88: Cleaning worktable; 90: Nozzle; 92: Touch panel; 94: Control unit; 96: Storage device; 98: Marker; 100: Circuit; 104: Laser processing device; 106: Stationary base; 108: Y-axis moving worktable; 110: Y-axis guide rail; 110a: Y-axis scale; 112: Y-axis ball screw; 114: Y-axis pulse motor; 116: Y-axis moving mechanism; 118: Column; 120: Housing; 122: Laser irradiation unit; 122a: Laser oscillator; 124: Irradiation head; 124a: Focusing lens; A: Area; L: Laser beam. Detailed Implementation

[0042] An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view of the cutting device 2 according to the first embodiment. Additionally, in Figure 1 In the diagram, a portion of the structural elements is shown using a function block diagram. Furthermore, the X-axis (machining feed direction), Y-axis (indexing feed direction), and Z-axis (vertical direction, infeed feed direction) used in the following description are perpendicular to each other.

[0043] The cutting device (machining device) 2 has a base 4 that supports various structural elements. An opening 4a is formed at the front corner (+Y direction) of the base 4, and a box lift (not shown) is installed within this opening 4a. Multiple workpieces 11 (see reference) are placed on the upper surface of the box lift. Figure 2 Box 6.

[0044] The workpiece 11 is, for example, a disk-shaped wafer formed from a semiconductor material such as silicon. However, there are no limitations on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate formed from other semiconductor, ceramic, resin, metal, or other materials may also be used as the workpiece 11.

[0045] like Figure 2 As shown, the front side 11a of the workpiece 11 is divided into multiple regions by intersecting predetermined dividing lines (spacers) 13. In each region of the front side 11a, devices such as ICs (Integrated Circuits) 15 and alignment marks are formed. Figure 7 (A) marked 98), etc. However, there are no restrictions on the type, quantity, shape, structure, size, or arrangement of the device 15. It is also possible not to form the device 15 on the workpiece 11.

[0046] A strip (scribing strip) 17 with a diameter larger than that of the workpiece 11 is adhered to the front side 11a of the workpiece 11. The strip 17 is formed of a transparent material that allows visible light to pass through. The strip 17 has, for example, a laminated structure having a substrate layer and an adhesive layer (paste layer).

[0047] The substrate layer is formed, for example, of polyolefin (PO). The adhesive layer is formed, for example, of an adhesive resin such as an ultraviolet (UV) curable acrylic resin. The adhesive layer side of the strip 17 is adhered to the front side 11a of the workpiece 11.

[0048] A ring-shaped frame 19 made of metal is fixed to the outer periphery of the belt 17. In this way, the workpiece 11 is stored in the box 6 as a workpiece unit 21 supported by the frame 19 via the belt 17. Figure 2 This is a three-dimensional view of the workpiece unit 21.

[0049] like Figure 1As shown, an opening 4b, which is longer in the X-axis direction, is formed behind the opening 4a (in the -Y direction). A disc-shaped chuck stage 10 is disposed in the opening 4b. In addition, an annular frame suction plate (not shown) is provided on the outer periphery of the chuck stage 10, and suction ports are discretely formed along the circumferential direction on the frame suction plate.

[0050] Here, refer to Figures 3 to 5 A more detailed description is provided for the chuck worktable 10, etc. Figure 3 It is a 3D view of the chuck worktable 10, etc. Figure 4 This is a partial sectional side view of the chuck table 10, etc. However, in Figure 4 For convenience, the shadow has been omitted. Figure 5 yes Figure 4 A magnified view of region A. Figure 5 In the diagram, a portion of the structural elements is shown using a functional block diagram.

[0051] The chuck table 10 has a disc-shaped (plate-shaped) retaining member 12. The retaining member 12 includes a generally flat surface 12a and another surface 12b located on the opposite side of the surface 12a (see reference). Figure 5 The retaining component 12 is formed of a transparent material that allows visible light to pass through, such as soda glass, borosilicate glass, or quartz glass.

[0052] Multiple flow paths are formed inside the retaining member 12. In this embodiment, when the retaining member 12 is viewed from the Z-axis direction, a first linear attraction path 12c1 is formed that traverses the central axis of the disk. In addition, a second linear attraction path 12c2 is formed in the XY plane direction that is perpendicular to the first attraction path 12c1.

[0053] The first attraction path 12c1 and the second attraction path 12c2 intersect at point 12c3 located on the central axis of the disk and are connected to each other. Multiple openings 12d are formed on the outer periphery of a surface 12a in a manner that separates them in the circumferential direction. Each opening 12d extends from one surface 12a to a predetermined depth without reaching another surface 12b.

[0054] An opening 12d is formed at both ends of the first attraction path 12c1 and the second attraction path 12c2. Each opening 12d is connected in the circumferential direction by an outer peripheral attraction path 12e formed at a predetermined depth on the outer periphery of the retaining member 12.

[0055] An attraction path 12f extending radially is formed on the outer periphery of the opening 12d, and an attraction source 14, such as an injector, is connected to the attraction path 12f (see reference). Figure 5When the suction source 14 is activated to generate negative pressure, negative pressure is generated at the opening 12d. Therefore, one surface 12a functions as a holding surface that attracts and holds the workpiece unit 21 (workpiece 11).

[0056] Furthermore, in the flow paths of the holding member 12, such as the first attraction path 12c1, the second attraction path 12c2, the opening 12d, the outer peripheral attraction path 12e, and the attraction path 12f, a portion of the incident light is scattered or reflected. Therefore, when viewed from one surface 12a or the other surface 12b, there are cases where the flow paths of the holding member 12 are translucent to visible light but not completely transparent, or opaque.

[0057] However, the designated area of ​​the retaining component 12, excluding the flow path, is transparent from one surface 12a to the other surface 12b. Specifically, the area divided into four parts by the first attraction path 12c1 and the second attraction path 12c2 and located radially inside the retaining component 12 compared to the outer peripheral attraction path 12e is transparent from one surface 12a to the other surface 12b.

[0058] A cylindrical frame 16 made of a metal material such as stainless steel is provided on the outer periphery of the retaining component 12. An opening 16a is formed in the upper part of the frame 16 (see reference). Figure 5 The retaining component 12 is configured to close the opening 16a.

[0059] like Figure 3 and Figure 4 As shown, the frame 16 is supported by an X-axis movable stage 18. The X-axis movable stage 18 includes a rectangular base plate 18a when viewed from the Z-axis direction. One front end (+Y direction) of the base plate 18a is connected to the lower end of a rectangular side plate 18b when viewed from the Y-axis direction.

[0060] The upper end of the side plate 18b is connected to the front end of the top plate 18c, which has the same rectangular shape as the bottom plate 18a when viewed from the Z-axis direction. A space 18d is formed between the bottom plate 18a and the top plate 18c, open at one end in the rear (-Y direction) and at both ends in the X-axis direction.

[0061] Below the base plate 18a (in the -Z direction), a pair of X-axis guide rails 20, approximately parallel to the X-axis direction, are provided so that the base plate 18a can slide. The pair of X-axis guide rails 20 are fixed to the upper surface of the stationary base (not shown).

[0062] An X-axis linear scale 20a is provided adjacent to the X-axis guide rail 20 for detecting the position of the X-axis moving stage 18 in the X-axis direction. Additionally, a reading head (not shown) is provided on the lower surface of the X-axis moving stage 18.

[0063] When the X-axis moving stage 18 moves, the position (coordinates) of the X-axis moving stage 18 and the amount of movement in the X-axis direction are calculated by using the reading head to detect the scale of the X-axis linear scale 20a.

[0064] A nut portion (not shown) is provided on the lower surface of the base plate 18a of the X-axis moving worktable 18, and an X-axis ball screw 22 that is approximately parallel to the X-axis guide rail 20 is rotatably connected to the nut portion.

[0065] An X-axis pulse motor 24 is connected to one end of the X-axis ball screw 22. If the X-axis ball screw 22 is rotated by the X-axis pulse motor 24, the X-axis moving table 18 moves along the X-axis guide rail 20 in the X-axis direction. The X-axis guide rail 20, X-axis ball screw 22, X-axis pulse motor 24, etc. constitute the X-axis moving mechanism 26 that moves the X-axis moving table 18.

[0066] On the upper surface of the top plate 18c of the X-axis moving stage 18, the frame 16 is supported on the top plate 18c in a manner that allows it to rotate about a rotation axis that is approximately parallel to the Z-axis direction. The frame 16 includes a cylindrical side, namely a pulley portion 16b. When the frame 16 is supported by the X-axis moving stage 18, the pulley portion 16b is located above the top plate 18c.

[0067] A rotary drive source 30, such as an electric motor, is installed on the side plate 18b of the X-axis moving worktable 18. A pulley 30a is installed on the rotating shaft of the rotary drive source 30. A rotating annular belt (drive belt 28) is suspended on the pulley 30a and the pulley section 16b.

[0068] When the rotary drive source 30 is activated to rotate the pulley 30a, the frame 16 rotates about a rotation axis that is approximately parallel to the Z-axis direction through the force transmitted via the transmission belt 28. By controlling the rotation of the pulley 30a, the chuck table 10 can be rotated at any angle around the rotation axis.

[0069] A Y-axis moving mechanism 32 is provided on the extension line of the X-axis moving mechanism 26 in the X-axis direction. The Y-axis moving mechanism 32 has a pair of Y-axis guide rails 34 that are approximately parallel to the Y-axis direction. The pair of Y-axis guide rails 34 are fixed to the upper surface of the stationary base (not shown).

[0070] A Y-axis movable worktable 36 is slidably mounted on the Y-axis guide rail 34. A nut portion (not shown) is provided on the lower surface of the Y-axis movable worktable 36, and a Y-axis ball screw 38, which is approximately parallel to the Y-axis guide rail 34, is rotatably connected to the nut portion.

[0071] A Y-axis pulse motor 40 is connected to one end of the Y-axis ball screw 38. If the Y-axis ball screw 38 is rotated by the Y-axis pulse motor 40, the Y-axis moving table 36 moves along the Y-axis guide rail 34 in the Y-axis direction.

[0072] A Y-axis linear scale (not shown) is provided adjacent to the Y-axis guide rail 34 for detecting the position of the Y-axis moving stage 36 in the Y-axis direction. Additionally, a reading head (not shown) is provided on the lower surface of the Y-axis moving stage 36.

[0073] When the Y-axis moving table 36 moves, the position (coordinates) of the Y-axis moving table 36 and the amount of movement in the Y-axis direction are calculated by using the reading head to detect the scale of the Y-axis linear scale.

[0074] A Z-axis moving mechanism 42 is provided on the upper surface of the Y-axis moving worktable 36. Figure 6 This is an enlarged perspective view of the Z-axis moving mechanism 42, etc. The Z-axis moving mechanism 42 has a support structure 42a fixed to the upper surface of the Y-axis moving worktable 36.

[0075] A pair of Z-axis guide rails 44, approximately parallel to the Z-axis direction, are fixed to the side of the X-axis movable worktable 18 of the support structure 42a. A Z-axis movable plate 46 is slidably mounted on the Z-axis guide rails 44.

[0076] A nut portion (not shown) is provided on the back side of the Z-axis moving plate 46 (the side of the Z-axis guide rail 44), and a Z-axis ball screw 48 that is approximately parallel to the Z-axis guide rail 44 is rotatably connected to the nut portion.

[0077] A Z-axis pulse motor 50 is connected to one end of the Z-axis ball screw 48. If the Z-axis ball screw 48 is rotated by the Z-axis pulse motor 50, the Z-axis moving plate 46 moves along the Z-axis guide rail 44 in the Z-axis direction.

[0078] A Z-axis linear scale (not shown) is provided adjacent to the Z-axis guide rail 44, and a reading head (not shown) is provided on the side of the Z-axis guide rail 44 of the Z-axis moving plate 46. When the Z-axis moving plate 46 moves, the reading head is used to detect the scale of the Z-axis linear scale to calculate the position (coordinates) of the Z-axis moving plate 46 in the Z-axis direction.

[0079] A lower imaging unit (second imaging unit) 54 is fixed on the Z-axis moving plate 46 via a support arm 52 that is longer in the X-axis direction. In this embodiment, the lower imaging unit 54 includes a low-magnification camera 56 and a high-magnification camera 58.

[0080] The low-magnification camera 56 and the high-magnification camera 58 each have a specified optical system such as a lens and an imaging element such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor (second imaging element).

[0081] The lower imaging unit 54 is positioned below the chuck table 10 and is positioned opposite the other surface 12b in such a way that the optical axes of each lens are substantially perpendicular to the other surface 12b of the holding member 12.

[0082] An illumination device 56a is provided on the side of the low-magnification camera 56 to illuminate a subject (e.g., workpiece 11) located above it with visible light. Similarly, an illumination device 58a is also provided on the side of the high-magnification camera 58.

[0083] When photographing the workpiece 11 using the lower imaging unit 54, the X-axis moving stage 18 is moved towards the Y-axis moving stage 36, and the lower imaging unit 54 is positioned in space 18d. Then, the workpiece 11, positioned on one surface 12a of the holding member 12, is photographed from below.

[0084] In this way, an upright image (i.e., the image actually observed) can be obtained from the front 11a side. Furthermore, the lower imaging unit 54 may not necessarily have both a low-magnification camera 56 and a high-magnification camera 58. The lower imaging unit 54 may also have only one camera with a specified magnification.

[0085] Here, return Figure 1 The other structural elements of the cutting device 2 will be described below. A retractable corrugated dustproof and dripproof cover is installed on the top plate 18c of the X-axis moving table 18 in the +X and -X directions, covering the opening 4b.

[0086] A gate-shaped support structure 4c is provided above the opening 4b and spans the opening 4b. Two machining unit moving mechanisms (indexing feed unit and infeed feed unit) 60 are provided on one side of the support structure 4c located on the side of the opening 4a.

[0087] Each processing unit's moving mechanism 60 shares a pair of Y-axis guide rails 62 fixed to one side of the support structure 4c and approximately parallel to the Y-axis direction. Two Y-axis moving plates 64 are mounted on the Y-axis guide rails 62 in a manner that allows them to slide independently of each other.

[0088] A nut portion (not shown) is provided on one side of the Y-axis moving plate 64 located on the support structure 4c side. A Y-axis ball screw 66, which is approximately parallel to the Y-axis guide rail 62, is rotatably connected to the nut portion. In addition, the nut portion of each Y-axis moving plate 64 is connected to a different Y-axis ball screw 66.

[0089] A Y-axis pulse motor 68 is connected to one end of each Y-axis ball screw 66. If the Y-axis ball screw 66 is rotated by the Y-axis pulse motor 68, the Y-axis moving plate 64 moves along the Y-axis guide rail 62 in the Y-axis direction.

[0090] On the opposite side of each Y-axis movable plate 64, located on the other side of the support structure 4c, a pair of Z-axis guide rails 72, approximately parallel to the Z-axis direction, are respectively provided. Z-axis movable plates 70 are slidably mounted on the Z-axis guide rails 72.

[0091] A nut portion (not shown) is provided on one side of the Z-axis moving plate 70 located on the support structure 4c side, and a Z-axis ball screw 74 parallel to the Z-axis guide rail 72 is rotatably connected to the nut portion.

[0092] A Z-axis pulse motor 76 is connected to one end of the Z-axis ball screw 74. If the Z-axis ball screw 74 is rotated by the Z-axis pulse motor 76, the Z-axis moving plate 70 moves along the Z-axis guide rail 72 in the Z-axis direction.

[0093] A cutting unit (machining unit) 78 is provided at the lower part of the Z-axis moving plate 70. The cutting unit 78 has a cylindrical spindle housing 80. A cylindrical spindle 82a (see reference) is rotatably housed inside the spindle housing 80. Figure 9 Part of ).

[0094] A rotary drive mechanism (not shown) such as a servo motor is connected to one end of the spindle 82a to rotate the spindle 82a. In addition, a cutting tool 82b with a ring-shaped cutting edge is mounted on the other end of the spindle 82a.

[0095] An upper imaging unit (first imaging unit) 84 is connected to the lower part of the Z-axis moving plate 70, adjacent to the cutting unit 78. The upper imaging unit 84 has a prescribed optical system such as a lens and an imaging element (first imaging element).

[0096] The upper imaging unit 84 is located above the chuck table 10 and is positioned opposite one surface 12a of the holding member 12 with the optical axis of the lens approximately perpendicular to the surface 12a. The upper imaging unit 84 captures an image of the back side 11b of the workpiece 11 held by the surface 12a on the front side 11a. In this way, a positive image of the back side 11b can be obtained.

[0097] An opening 4d is provided on the opposite side of opening 4a, relative to opening 4b. A cleaning unit 86 for cleaning the workpiece 11 after cutting is provided in opening 4d. The cleaning unit 86 includes a cleaning table 88 for attracting and holding the workpiece 11 and a nozzle 90 with a spray port arranged opposite to the cleaning table 88.

[0098] A housing (not shown) is mounted on the base 4, and a touch panel (display device) 92, which serves as both an input and display unit, is mounted on the front side of the housing. The touch panel 92 displays images captured by at least one of the lower imaging unit 54 and the upper imaging unit 84, processing conditions, GUI (Graphical User Interface), etc.

[0099] Alternatively, the input section and the display section can be separated. In this case, instead of the touch panel 92, a display device such as a video monitor or computer screen and an input device such as a keyboard or mouse serving as a user interface can be provided on the side of the front of the housing.

[0100] The cutting device 2 has a control unit 94, which controls the suction source 14, the X-axis moving mechanism 26, the rotary drive source 30, the Y-axis moving mechanism 32, the Z-axis moving mechanism 42, the lower imaging unit 54, the processing unit moving mechanism 60, the upper imaging unit 84, the cutting unit 78, the touch panel 92, etc.

[0101] The control unit 94 may be composed of, for example, a computer, which includes: a processing device such as a processor (CPU); a main storage device such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and ROM (Read Only Memory); and auxiliary storage devices such as flash memory, hard disk drives, and solid-state drives.

[0102] The auxiliary storage device stores software containing a prescribed program. This software causes the processing device and other components to operate, thereby realizing the function of the control unit 94. Furthermore, a portion of the auxiliary storage device functions as a storage device 96, which stores a program that causes the control unit 94 to perform prescribed image processing.

[0103] The storage device 96 stores a program for image processing that flips an image in a specified direction. Through image processing, the image on the front side 11a is flipped, for example, along the X-axis (left-right flip). A simple example of an algorithm for flipping an image in the X-axis direction will be explained.

[0104] Consider the case where the coordinates of the four corners of the image are (x1, y1), (x1, y2), (x2, y1), and (x2, y2). In this case, the pixel values ​​at (x1, y1) and (x2, y1) are swapped relative to ((x1+x2) / 2, y1).

[0105] The same operation is performed on pixels at other coordinates relative to the straight line parallel to the Y-axis passing through (x1+x2) / 2, thereby enabling the image to be flipped in the X-axis direction. However, this is not limited to this example; other algorithms that flip the image in a specified direction can also be used.

[0106] In addition, the storage device 96 stores a program for image processing such as pattern matching. This program is known, and it is used to extract a predetermined pattern formed on the front side 11a from an image on the front side 11a.

[0107] The prescribed pattern includes, for example, the dividing line 13, the component 15, the mark 98, and the circuit 100 (see reference). Figure 7 The outline of (A), etc. In addition, mark 98 is sometimes also called alignment mark, key pattern, target pattern, etc.

[0108] Figure 7 (A) is an example of an image from the front 11a side. In the case where the front 11a side image captured by the lower imaging unit 54 and the rear 11b side image captured by the upper imaging unit 84 are directly displayed on the touch panel 92, Figure 7 The frontal image 11a shown in (A) is flipped in the X-axis direction compared to the frontal image 11b.

[0109] As a result, for example, the left direction of the image on the front side 11a corresponds to the right direction of the image on the back side 11b, making it difficult for the operator to grasp the correspondence between the front side 11a and the back side 11b. This becomes a burden for the operator of the cutting device 2.

[0110] In this embodiment, the control unit 94 performs image processing on the front image 11a so that the orientation of the front image on the back side 11b and the front image on the front side 11a are aligned, and displays the front image on the touch panel 92 in a state of being flipped relative to the X-axis direction (a predetermined direction) (i.e., a mirrored state).

[0111] Figure 7 (B) is an example of an image on the front side 11a that has been flipped in a specified direction in a manner consistent with the orientation of the image on the back side 11b. Figure 7 (B) is Figure 7 (A) is a mirror image. For example... Figure 7 As shown in (B), the front image of the front 11a side is displayed on the touch panel 92 in a mirror state.

[0112] Therefore, the operator can see the front 11a side in the same way that the back 11b (upper surface) can see the front 11a (lower surface) through the workpiece 11. As a result, it is easy to grasp the correspondence between the front 11a side and the back 11b side, thereby reducing the operator's workload.

[0113] The images on the front 11a side and the back 11b side can also be selectively displayed on the touch panel 92, and the image on the front 11a side can also be displayed on the touch panel 92 together with the image on the back 11b side.

[0114] For example, an image 23b containing the area of ​​the cutting groove (cut) formed on the back side 11b and an image 23a of the area on the front side 11a corresponding to this area on the back side 11b in the thickness direction of the workpiece 11 are simultaneously displayed on the touch panel 92 (see reference). Figure 8 (A)).

[0115] Furthermore, the positions of the upper imaging unit 84 and the lower imaging unit 54 relative to the chuck table 10 are controlled by the control unit 94. Therefore, in the workpiece 11 held on one surface 12a of the chuck table 10, a predetermined area on the back side 11b and the area on the front side 11a corresponding to that area can be determined.

[0116] Figure 8 (A) is an example of a display method in which a mirror image 23a on the front 11a side and a front image 23b on the back 11b side are displayed on the touch panel 92, respectively. By displaying the images 23a and 23b together, it is easier to perform cut inspection compared to displaying the images 23a and 23b one at a time.

[0117] In addition, images 23a and 23b may not necessarily be identical. Figure 8 Displayed in the same arrangement as (A). Figure 8 (B) is another example of the display method of image 23a on the front 11a side and image 23b on the back 11b side.

[0118] like Figure 8As shown in (B), the image 23b on the back side 11b can also be displayed on a portion of the image 23a on the front side 11a. Of course, other display methods can also be used as long as the operator can observe both image 23a and image 23b simultaneously.

[0119] Alternatively, the mirror image of the front side 11a can be set as image 23a, and the image of the front image of the front side 11a can be set as image 23b. Image 23a and image 23b can then be compared... Figure 8 The image is displayed on the touch panel 92 as shown in (A). Alternatively, the image of the front view 11a can be set as image 23a, and the image of the mirror view 11a can be set as image 23b.

[0120] Next, use Figure 9 , Figure 10 The processing method for the workpiece 11 will be described. First, the workpiece unit 21 is placed on one surface 12a of the chuck table 10 with its back side 11b exposed to the side and upward (placement process (S10)).

[0121] After the loading step (S10), the suction source 14 is activated to hold the front side 11a of the workpiece 11 across the belt 17 using a surface 12a, and the frame 19 is held using a frame suction plate (not shown) (holding step (S20)). After the holding step (S20), a teaching step (S30) is performed.

[0122] In the teaching process (S30), for example, while the operator is looking for the mark 98 on the front 11a side, the operator is looking for the mark 98 on the front 11a side, and the operator is looking for the mark 98 on the front 11a side, while the operator is looking for the mark 98 on the front 11a side, ...

[0123] After the desired marker 98 is found, an image of the front side 11a, including the marker 98, is acquired using the lower imaging unit 54. The shape, coordinates, etc. of the marker 98 are stored in, for example, a storage device 96 as a template for pattern matching.

[0124] Furthermore, the distance between the marker 98 and the center line of the pre-division line 13, as well as the distance between two adjacent pre-division lines 13 in the Y-axis direction (interval spacing), are stored in the storage device 96. Additionally, the stored coordinates are XY coordinates with the aforementioned intersection point 12c3 as the origin.

[0125] After the teaching process (S30), the workpiece 11 is aligned (alignment process (S40)). In the alignment process (S40), the operator performs the operation while the image obtained by converting the frontal image 11a side captured by the lower shooting unit 54 into a mirror image is displayed on the touch panel 92 in real time.

[0126] In the alignment process (S40), firstly, an image of the front side 11a is obtained using the lower imaging unit 54 (e.g., a low-magnification camera 56) at multiple mutually separated locations on a predetermined dividing line 13 along the X-axis direction.

[0127] Then, in the images of the front 11a side obtained at multiple locations, a pattern identical to the mark 98 stored as a template is detected through prescribed processing such as pattern matching. Based on the pattern identical to the detected mark 98, the offset of the predetermined dividing line 13 in the θ direction around the central axis of the holding member 12 is determined.

[0128] Then, the rotary drive source 30 is activated to rotate the transmission belt 28 by a predetermined amount, thereby correcting the offset in the θ direction of the predetermined dividing line 13. This positions the predetermined dividing line 13 approximately parallel to the X-axis direction. Furthermore, in the alignment process (S40), other prescribed processing and operations besides the θ-direction correction can also be performed.

[0129] After the alignment process (S40), the workpiece 11 is cut (processed) (cutting process (S50)). Figure 9 This is a diagram showing the cutting process (S50). In the cutting process (S50), firstly, the high-speed rotating cutting tool 82b is positioned on the extension line of the predetermined dividing line 13.

[0130] At this point, the lower end of the cutting tool 82b is positioned between the front side 11a and the back side 11b of the workpiece 11. Then, the chuck table 10 and the cutting tool 82b are moved relative to each other along the X-axis direction by the X-axis moving mechanism 26.

[0131] Thus, the workpiece 11 is partially cut (machined) from the back side 11b to a predetermined depth (i.e., half-cut) in the thickness direction of the workpiece 11 by the cutting tool 82b, and a cutting groove 11c is formed along the predetermined dividing line 13.

[0132] Furthermore, the cutting in the cutting process (S50) is not limited to half-cutting. In the cutting process (S50), the workpiece 11 can also be cut by cutting from the back side 11b to the front side 11a (i.e., full cut).

[0133] After cutting the workpiece 11 along a predetermined dividing line 13 parallel to the X-axis, the cutting tool 82b is positioned on the extension of the adjacent predetermined dividing line 13 along the Y-axis by indexing the cutting unit 78. Then, the workpiece 11 is cut along the predetermined dividing line 13 in the same manner.

[0134] After cutting the workpiece 11 along all the predetermined dividing lines 13 parallel to the first direction, the rotary drive source 30 is activated to rotate the chuck table 10 by 90 degrees. Then, the second direction, which is perpendicular to the first direction, is positioned parallel to the X-axis direction, and the workpiece 11 is cut along all the predetermined dividing lines 13 parallel to the second direction.

[0135] After the cutting process (S50), a cut inspection process (S60) is performed. Figure 10 This diagram illustrates the cut inspection process (S60). In the cut inspection process (S60), images are taken of the area on the back side 11b, including the cutting groove 11c, and the area on the front side 11a, which corresponds to this area in the thickness direction of the workpiece 11.

[0136] Furthermore, the front view of the back side 11b is displayed as image 23b, and the mirror image of the front side 11a is displayed as image 23a on the touch panel 92. As a result, it is easy to grasp the correspondence between the front side 11a and the back side 11b, thus reducing the burden on the operator during cut inspection.

[0137] In this embodiment, the image of the front side 11a is processed to generate a mirror image, but the image of the back side 11b can also be processed to generate a mirror image. In this case, the image of the front side 11a is displayed as image 23a, and the mirror image of the back side 11b is displayed as image 23b on the touch panel 92.

[0138] Next, the first modified example will be described. In the first modified example, the upper imaging unit 84 acquires a positive image of the back side 11b, and the lower imaging unit 54 (the third imaging unit) acquires a mirror image of the front side 11a.

[0139] Furthermore, the control unit 94 does not perform flipping processing on the images on the back side 11b and the front side 11a, so that both are displayed on the touch panel 92. Figure 11 This is a diagram showing the lower imaging unit 54, etc., of the first modified example.

[0140] In addition, Figure 11For convenience, the side plate 18b is omitted. In the lower imaging unit 54 of the first modification, a low-magnification camera 56 and a high-magnification camera 58, each having a lens and an imaging element (third imaging element), are arranged between the two ends of the support arm 52 in the longitudinal direction.

[0141] The optical axes of the lenses of both the low-magnification camera 56 and the high-magnification camera 58 are arranged approximately parallel to the X-axis. Additionally, each camera is equipped with illumination devices 56a and 58a, but these are not shown in the illustrations.

[0142] A reflector unit 54b is provided at the front end of the support arm 52. The reflector unit 54b has a mirror surface 54a that is tilted at 45 degrees relative to the X-axis in the XZ plane and guides the reflected light from the front side 11a to the low-magnification camera 56 and the high-magnification camera 58.

[0143] Each camera captures an image of the front 11a side reflected in the mirror by the reflector unit 54b, and the lower imaging unit 54 can obtain an image of the front 11a side that has been flipped in the X-axis direction (i.e., a mirror image). Furthermore, the mirror image of the front 11a side and the upright image of the back 11b side are directly displayed on the touch panel 92.

[0144] Therefore, the operator can see the front 11a side as if looking through the workpiece 11 from the back 11b, making it easier to grasp the correspondence between the front 11a side and the back 11b side. This reduces the operator's workload.

[0145] Alternatively, the mirror unit 54b can also be disposed between the lens and the imaging element in both the low-magnification camera 56 and the high-magnification camera 58. In this case, each lens is arranged such that its optical axis is along the Z-axis direction.

[0146] Alternatively, in the first variation, the control unit 94 may be used to perform image processing. For example, the control unit 94 performs image processing on both the front image on the back 11b side and the mirror image on the front 11a side in such a way that the orientation of the front image on the back 11b side and the mirror image on the front 11a side are aligned, and displays them on the touch panel 92 in a state where they have been flipped in a predetermined direction.

[0147] Therefore, the operator can see the back side 11b just as they can see the back side 11b through the workpiece 11 from the front side 11a, making it easier to grasp the correspondence between the front side 11a and the back side 11b. This reduces the operator's workload.

[0148] Next, the second modified example will be described. In the second modified example, the upper imaging unit 84 (the fourth imaging unit) acquires a mirror image of the back side 11b, and the lower imaging unit 54 (the second imaging unit) acquires a frontal image of the front side 11a.

[0149] Furthermore, the control unit 94 does not perform flipping processing on the images on the back side 11b and the front side 11a, so that both are displayed on the touch panel 92. Figure 12 This is a diagram showing the upper imaging unit 84, etc., in the second modified example. Additionally, in Figure 12 For convenience, side panel 18b has been omitted.

[0150] In the second modified example, the upper imaging unit 84 has a camera 84b disposed between the two ends of the support arm 84a along its length. The camera 84b has a lens and an imaging element (fourth imaging element). The optical axis of the lens of the camera 84b is arranged approximately parallel to the X-axis direction.

[0151] A reflector unit 84d is provided at the front end of the support arm 84a. The reflector unit 84d has a mirror surface 84c that is tilted at 45 degrees relative to the X-axis in the XZ plane and guides the reflected light from the rear side 11b to the camera 84b.

[0152] The camera 84b takes a picture of the back side 11b reflected in the mirror by the mirror unit 84d, and the upper imaging unit 84 can obtain an image of the back side 11b that has been flipped in the X-axis direction (i.e., a mirror image).

[0153] Furthermore, the mirror image of the back side 11b and the front image of the front side 11a are directly displayed on the touch panel 92. The operator can see the back side 11b just as they would see the back side 11b through the workpiece 11 from the front side 11a, making it easy to grasp the correspondence between the front side 11a and the back side 11b. Therefore, the operator's workload is reduced.

[0154] Alternatively, the mirror unit 84d can also be disposed between the lens and the imaging element of the camera 84b. In this case, the lens is configured such that its optical axis is along the Z-axis.

[0155] In the second variation, the control unit 94 may also be used to perform image processing. For example, the control unit 94 performs image processing on both the mirror image on the back side 11b and the positive image on the front side 11a in such a way that the orientation of the mirror image on the back side 11b and the positive image on the front side 11a are aligned, and displays them on the touch panel 92 in a state where they have been flipped in a predetermined direction.

[0156] Therefore, the operator can see the front 11a side as if looking through the workpiece 11 from the back 11b, making it easier to grasp the correspondence between the front 11a side and the back 11b side. This reduces the operator's workload.

[0157] Next, the third variation will be described. In the third variation, the upper imaging unit 84 (the fourth imaging unit) obtains a mirror image of the back side 11b, and the lower imaging unit 54 (the third imaging unit) also obtains a mirror image of the front side 11a.

[0158] Furthermore, after the control unit 94 performs a flipping process on either the image on the back side 11b or the front side 11a, it displays both on the touch panel 92. Figure 13 This diagram shows the lower imaging unit 54, the upper imaging unit 84, etc., of the third modified example. Additionally, in Figure 13 For convenience, side panel 18b has been omitted.

[0159] The lower imaging unit 54 of the third variation is the same as that of the first variation, and the upper imaging unit 84 of the third variation is the same as that of the second variation. Image processing is performed on any image from the mirror image of the rear side 11b and the mirror image of the front side 11a, and the image is displayed on the touch panel 92 in a flipped state according to a predetermined direction.

[0160] For example, the touch panel 92 displays a mirror image of the front 11a side obtained by the lower shooting unit 54 and a front image of the back 11b side obtained by the upper shooting unit 84, which is flipped in the X-axis direction by image processing.

[0161] Additionally, for example, the touch panel 92 displays a frontal image of the front 11a side obtained by the lower shooting unit 54 and a rear image of the back 11b side obtained by the upper shooting unit 84, which are both flipped in the X-axis direction by image processing.

[0162] That is, the images on the back side 11b and the front side 11a are displayed on the touch panel 92 with the same orientation. This makes it easy for the operator to understand the correspondence between the front side 11a and the back side 11b, thus reducing the operator's workload.

[0163] Additionally, similar to the first and second modifications, the mirror units 54b and 84d can also be disposed between the lens and the imaging element. In this case, each lens is arranged such that its optical axis is along the Z-axis direction.

[0164] Next, the second embodiment will be described. In the second embodiment, a laser processing apparatus (processing apparatus) 104 is used instead of a cutting apparatus 2 to process the workpiece 11. However, the above-described placement process (S10) to alignment process (S40) are performed in the same manner as in the first embodiment.

[0165] Figure 14 This is a perspective view of the laser processing apparatus 104 according to the second embodiment. Furthermore, structural elements identical to those in the cutting apparatus 2 of the first embodiment are labeled with the same reference numerals. Hereinafter, the differences from the cutting apparatus 2 will be mainly described.

[0166] In the laser processing apparatus 104, a lower imaging unit 54 is fixed on a stationary base 106. Alternatively, the lower imaging unit 54 can be configured to move along either the X-axis or the Y-axis.

[0167] An X-axis movable stage 18 is disposed on a stationary base 106. The X-axis movable stage 18 is configured such that the lower imaging unit 54 can enter the space 18d from the area of ​​the X-axis movable stage 18 located on the opposite side of the side plate 18b.

[0168] The X-axis movable stage 18 is slidably mounted on a pair of X-axis guide rails 20. The pair of X-axis guide rails 20 are fixed on the Y-axis movable stage 108.

[0169] A nut portion (not shown) is provided on the lower surface of the base plate 18a of the X-axis moving worktable 18, and an X-axis ball screw 22 that is approximately parallel to the X-axis guide rail 20 is rotatably connected to the nut portion.

[0170] An X-axis pulse motor 24 is connected to one end of the X-axis ball screw 22. If the X-axis ball screw 22 is rotated by the X-axis pulse motor 24, the X-axis moving table 18 moves along the X-axis guide rail 20 in the X-axis direction.

[0171] The Y-axis movable stage 108, which supports the X-axis movable stage 18, is slidably mounted on a pair of Y-axis guide rails 110 fixed to the upper surface of the stationary base 106. A Y-axis scale 110a, used for detecting the position of the Y-axis movable stage 108 in the Y-axis direction, is provided adjacent to the Y-axis guide rails 110.

[0172] A nut portion (not shown) is provided on the lower surface of the Y-axis moving worktable 108, and a Y-axis ball screw 112, which is approximately parallel to the Y-axis guide rail 110, is rotatably connected to the nut portion. A Y-axis pulse motor 114 is connected to one end of the Y-axis ball screw 112.

[0173] If the Y-axis ball screw 112 is rotated by the Y-axis pulse motor 114, the Y-axis moving table 108 moves along the Y-axis guide rail 110 in the Y-axis direction. The Y-axis guide rail 110, the Y-axis ball screw 112, the Y-axis pulse motor 114, etc. constitute the Y-axis moving mechanism 116 that moves the Y-axis moving table 108.

[0174] A column 118 is provided adjacent to the lower imaging unit 54, protruding upward from the upper surface of the stationary base 106. A housing 120 having an elongated portion approximately parallel to the X-axis direction is provided on the column 118.

[0175] At least a portion of a laser irradiation unit 122 is provided in the housing 120. The laser irradiation unit 122 includes a laser oscillator 122a, which generates a pulsed laser beam having a wavelength absorbed by the workpiece 11 or a wavelength transmitted through the workpiece 11.

[0176] An irradiation head 124, including a focusing lens 124a, is provided at the front end of the laser irradiation unit 122 in the X-axis direction. The laser beam emitted from the laser oscillator 122a is focused by the focusing lens 124a and irradiates downward from the irradiation head 124.

[0177] exist Figure 14 In the diagram, a dashed arrow indicates the laser beam L irradiating downwards from the irradiation head 124. Additionally, the aforementioned upward imaging unit 84 is provided at the front end of the housing 120, adjacent to the irradiation head 124.

[0178] The control unit 94 in the second embodiment is the same as in the first embodiment, and displays a mirror image of the front 11a side flipped in the X-axis direction and a front image of the back 11b side on the touch panel 92. This makes it easy to grasp the correspondence between the front 11a side and the back 11b side, thus reducing the workload of the operator.

[0179] In addition, the structure and method of the above embodiments can be implemented with appropriate modifications without departing from the purpose of the present invention. For example, the first to third modifications can also be applied in the laser processing apparatus 104.

[0180] Furthermore, in the above embodiments and variations, the case where the image on the front side 11a is flipped in the X-axis direction has been described. However, depending on the structure of the processing apparatus containing a mirror surface tilted at 45 degrees relative to the X-axis on the XZ plane, it is also possible to flip it in the Y-axis direction (a predetermined direction). Additionally, the mirror units 54b and 84d can replace the mirror surfaces 54a and 84c with other alternatives such as lenses capable of generating mirror images, which are separately provided from the camera.

Claims

1. A processing apparatus, characterized in that, The processing device has the following features: A chuck worktable includes a plate-shaped retaining member having one side and another side located on the opposite side of the one side, and having a defined area formed of a transparent material from the one side to the other side; A processing unit processes a workpiece with its front side held by one face of the chuck table and its back side exposed upwards, wherein the workpiece has a predetermined pattern on its front side. The first imaging unit has a first imaging element, which is disposed above the chuck worktable to obtain a frontal image of the back side; The second imaging unit has a second imaging element, which is disposed below the chuck worktable and obtains a frontal image of the front side in the area corresponding to the area captured by the first imaging unit in the thickness direction of the workpiece. A display device that displays an image of the rear side captured by the first imaging unit and an image of the front side captured by the second imaging unit; and The control unit includes a storage device storing a program for performing image processing and a processor for processing images according to the program. The control unit processes any image from the back-side front image and the front-side front image and displays it on the display device in a state where it is flipped in a predetermined direction so that the orientation of the back-side front image and the front-side front image is aligned. The control unit causes the image on the rear side to be displayed together with the image on the front side in a non-overlapping manner on the display device.

2. A processing apparatus, characterized in that, The processing device has the following features: A chuck worktable includes a plate-shaped retaining member having one side and another side located on the opposite side of the one side, and having a defined area formed of a transparent material from the one side to the other side; A processing unit processes a workpiece with its front side held by one face of the chuck table and its back side exposed upwards, wherein the workpiece has a predetermined pattern on its front side. The first imaging unit has a first imaging element, which is disposed above the chuck worktable to obtain a frontal image of the back side; A third imaging unit, having a third imaging element, is disposed below the chuck worktable and acquires a mirror image of the front side in an area corresponding to the area imaged by the first imaging unit in the thickness direction of the workpiece; and The display device displays the image of the rear side acquired by the first imaging unit and the image of the front side acquired by the third imaging unit together in a non-overlapping manner.

3. The processing apparatus according to claim 2, characterized in that, The processing apparatus also includes a control unit, which has a storage device storing a program for executing image processing and a processor for processing images according to the program. The control unit performs image processing on both the front image and the back image, and displays them on the display device in a flipped state in a predetermined direction so that the orientation of the front image and the back image is aligned.

4. A processing apparatus, characterized in that, The processing device has the following features: A chuck worktable includes a plate-shaped retaining member having one side and another side located on the opposite side of the one side, and having a defined area formed of a transparent material from the one side to the other side; A processing unit processes a workpiece with its front side held by one face of the chuck table and its back side exposed upwards, wherein the workpiece has a predetermined pattern on its front side. The fourth imaging unit has a fourth imaging element, which is disposed above the chuck worktable to obtain a mirror image of the back side; A second imaging unit, having a second imaging element, is disposed below the chuck worktable and acquires a frontal image of the workpiece in a region corresponding to the area captured by the fourth imaging unit in the thickness direction of the workpiece; and The display device displays the image of the rear side acquired by the fourth imaging unit and the image of the front side acquired by the second imaging unit together in a non-overlapping manner.

5. The processing apparatus according to claim 4, characterized in that, The processing apparatus also includes a control unit, which has a storage device storing a program for executing image processing and a processor for processing images according to the program. The control unit performs image processing on both the mirror image on the back side and the upright image on the front side, and displays them on the display device in a state of being flipped in a predetermined direction, so that the orientation of the mirror image on the back side and the upright image on the front side are aligned.

6. A processing apparatus, characterized in that, The processing device has the following features: A chuck worktable includes a plate-shaped retaining member having one side and another side located on the opposite side of the one side, and having a defined area formed of a transparent material from the one side to the other side; A processing unit processes a workpiece with its front side held by one face of the chuck table and its back side exposed upwards, wherein the workpiece has a predetermined pattern on its front side. The fourth imaging unit has a fourth imaging element, which is disposed above the chuck worktable to obtain a mirror image of the back side; The third imaging unit has a third imaging element. The third imaging unit is disposed below the chuck worktable and obtains a mirror image of the front side in the area corresponding to the area photographed by the fourth imaging unit in the thickness direction of the workpiece. A display device that displays an image of the rear side captured by the fourth imaging unit and an image of the front side captured by the third imaging unit; and The control unit includes a storage device storing a program for executing image processing and a processor for processing images according to the program. The control unit processes any image from the rear-side mirror and the front-side mirror and displays it on the display device in a flipped state in a predetermined direction so that the orientation of the rear-side mirror and the front-side mirror is aligned. The control unit causes the image on the rear side to be displayed together with the image on the front side in a non-overlapping manner on the display device.

7. The processing apparatus according to any one of claims 1 to 6, characterized in that, This processing unit is either a cutting unit or a laser irradiation unit. The cutting unit has a spindle, and a cutting tool is mounted at one end of the spindle. The laser irradiation unit has a laser oscillator that generates a laser beam and a focusing lens that focuses the laser beam emitted from the laser oscillator.

Citation Information

Patent Citations

  • Dividing method of wafer

    JP2006140341A

  • Processing apparatus

    JP2010087141A

  • A machining device

    CN101714499A

  • Processing device

    CN112908891A

  • Dicing method

    JP2013258237A