A micro positive pressure control device for substation box-type equipment

By designing a micro-positive pressure control device for box-type equipment, using components such as heating plates, semiconductor refrigeration sheets and fans, a micro-positive pressure environment and local gas circulation are formed, which solves the problem of difficult control of internal humidity and temperature of box-type equipment in the prior art, and achieves the effect of rapid dehumidification and moisture discharging and safe operation.

CN113224669BActive Publication Date: 2025-04-01UHV CO OF STATE GRID NINGXIA ELECTRIC POWER CO LTD +1
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Patent Information

Application Number
CN202110486589.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-04-30
Publication Date
2025-04-01
Estimated Expiration
2041-04-30

AI Technical Summary

Technical Problem

The prior art is difficult to effectively control the humidity and temperature inside the box-type equipment, resulting in safety hazards such as equipment aging, reduced insulation strength, and breakdown.

Method used

A micro-positive pressure control device is designed, including control components and sensors. Through components such as heating plates, semiconductor refrigeration plates, condensing plates and fans, a micro-positive pressure environment is formed, which blocks the invasion of external humid air, and achieves uniform distribution of temperature and humidity through local gas circulation.

Benefits of technology

Effectively block the invasion of humid air in the atmospheric environment into the equipment, quickly dehumidify and drive away moisture, prevent equipment aging, reduce insulation strength and other safety hazards, and ensure safe operation of the power grid.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a micro-positive pressure control device for a box-type equipment in a transformer substation, comprising: a control component and a sensor, wherein the control component comprises: a control box, a first air duct, a second air duct, a drain pipe, a control circuit board, a heating plate, a condensation plate, a semiconductor refrigeration sheet, a water accumulation box, a first fan, a second fan, a third fan and a fourth fan, wherein the lower ends of the condensation plate and the semiconductor refrigeration sheet face the water inlet of the water accumulation box, the water outlet of the water accumulation box passes through the bottom wall of the control box and is connected with the water inlet of one end of the drain pipe, and the other end of the drain pipe extends out of the housing of the box-type equipment in the transformer substation; the first fan is installed at the air inlet of the first air duct, and the air inlet surface of the first fan abuts one end of the heating plate; the second fan is installed at the air outlet of the second air duct, and the air outlet surface of the second fan abuts the other end of the heating plate; the air outlet surface of the third fan faces the upper end of the control circuit board, and the air inlet surface of the fourth fan faces the condensation plate, so that a micro-positive pressure environment is formed to achieve rapid dehumidification.
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Description

Technical Field

[0001] The invention relates to the technical field of transformer substation safety, and in particular to a micro positive pressure control device for transformer substation box-type equipment. Background Art

[0002] In power systems and industrial sites, electrical box-type equipment is the most common. There are many secondary wirings in the control cabinet and the distance between each device is short. If it operates in a high humidity environment for a long time, it is easy to corrode the internal precision components and equipment, causing the equipment to mold and the metal parts to rust, and accelerate the aging and damage of the equipment. Secondly, it will destroy the insulation between the live parts of the electrical equipment, easily causing short circuits and breakdowns, causing equipment damage, and even casualties and abnormal power grid events. Therefore, the requirements for the operating conditions of the internal environment of the box-type equipment are relatively high.

[0003] There are generally the following reasons for the high humidity in the internal environment of box-type equipment: 1. The atmospheric humidity is high and the ambient temperature changes dramatically. Water vapor will quickly invade the connection between the bottom of the box and the cable channel, and even form a large area of ​​water accumulation (condensation) on the box wall; 2. The cabinet is installed in the basement, and the indoor humidity is high. The temperature inside the cabinet is lower than the ambient temperature, which is conducive to the gathering of water vapor; 3. The cabinet seal is aging. After the precipitation ends, water vapor naturally evaporates, rises with the hot air, and quickly enters the box through the air gap and gathers.

[0004] In order to ensure the safe and stable operation of the power grid system, the long life of electrical equipment and the safety and reliability of the entire cycle. The power system has high requirements for constant temperature, moisture resistance, and condensation prevention in the cabinet. During the operation of traditional box-type equipment, it is difficult to keep the internal environment closed and at a constant temperature. Auxiliary systems need to be loaded to ensure the stability of the internal environment during operation. The existing dehumidification heating device is generally used in offline mode, mostly using heating plates and heating fans as environmental interference methods, and the original design intention is state quantity control. It starts when the humidity and temperature reach the threshold value, which not only prolongs the recovery time of the internal environment, but also because the hot and humid air cannot be effectively guided, the control effect is not ideal. Summary of the invention

[0005] The embodiment of the present invention provides a micro positive pressure control device for a substation box-type equipment to solve the problem that the prior art has an unsatisfactory effect on the environment control inside the substation box-type equipment.

[0006] The embodiment of the present invention discloses the following technical solution:

[0007] A micro-positive pressure control device for a box-type equipment in a substation, comprising: a control component and a sensor, wherein the sensor is arranged on the inner wall at the top of the outer shell of the box-type equipment in the substation; the control component comprises: a control box, a first air duct, a second air duct, a drain pipe, and a control circuit board, a heating plate, a condensation plate, a semiconductor refrigeration sheet, a water accumulation box, a first fan, a second fan, a third fan and a fourth fan installed in the control box, wherein the control circuit board is electrically connected to the sensor, the heating plate, the semiconductor refrigeration sheet, the first fan, the second fan, the third fan and the fourth fan respectively; the control box is installed in the box-type equipment in the substation, the heating plate, the semiconductor refrigeration sheet and the condensation plate are stacked in sequence and are all located below the control circuit board, the lower ends of the condensation plate and the semiconductor refrigeration sheet are directly opposite to the water inlet of the water accumulation box, and the water outlet of the water accumulation box passes through the bottom wall of the control box and is connected to the drain The water inlet at one end of the water pipe is connected, and the other end of the drain pipe extends out of the shell of the substation box-type equipment; the air inlet of the first air duct and the air outlet of the second air duct are respectively connected to the first openings of the opposite side walls of the control box, and the air outlet of the first air duct and the air inlet of the second air duct are respectively connected to the second openings of the opposite side walls of the substation box-type equipment, the first fan is installed at the air inlet of the first air duct, and the air outlet surface of the first fan faces the air inlet of the first air duct, and the air inlet surface of the first fan abuts one end of the heating plate; the second fan is installed at the air outlet of the second air duct, and the air inlet surface of the second fan faces the air outlet of the second air duct, and the air outlet surface of the second fan abuts the other end of the heating plate; the third fan is located above the control circuit board, and the air outlet surface of the third fan faces the upper end of the control circuit board, and the air inlet surface of the fourth fan faces the condensation plate.

[0008] Further: a plurality of ventilation holes are arranged on one side wall of the first air duct and the second air duct.

[0009] Further: ventilation filter cotton is provided on the inner surface of the side wall where the ventilation holes of the first air duct and the second air duct are located.

[0010] Furthermore, the micro-positive pressure control device for substation box-type equipment also includes: an antenna, one end of which is electrically connected to the communication chip on the control circuit board, and the other end of the antenna extends out of the control box.

[0011] Furthermore, the communication chip is selected from at least one of the following: RS485 chip, NB-ITO chip, LOAR chip, 4G chip and 5G chip.

[0012] Further: the air outlet of the first air duct and the air inlet of the second air duct are respectively covered with a check valve.

[0013] Further: the second opening of one side wall of the substation box-type equipment connected to the air outlet of the first air duct is higher than the second opening of the other side wall of the substation box-type equipment connected to the air inlet of the second air duct.

[0014] Furthermore: the heating plate and the semiconductor refrigeration sheet, as well as the semiconductor refrigeration sheet and the condensation plate are bonded by silicone.

[0015] Further: the sensor includes a capacitive temperature and humidity sensor and a physical water droplet comprehensive perception sensor.

[0016] The micro-positive pressure control device for substation box-type equipment in the embodiment of the present invention can solve the problem that it is difficult to form an absolutely sealed environment for substation box-type equipment due to aging of sealing facilities of old equipment and inconsistent industrial processing levels. A micro-positive pressure environment is formed inside the substation box-type equipment, which can effectively block the invasion of humid air in the atmospheric environment into the substation box-type equipment, achieve the effect of rapid dehumidification and moisture removal, and effectively prevent safety hazards such as aging of equipment in the cabinet, reduced insulation strength, breakdown of secondary terminals, mildew of materials, and rust of metal structural parts, thereby ensuring the safe operation of the power grid; forming local gas circulation, forming an effective and reasonable airflow distribution, making the temperature and humidity evenly distributed, and completely avoiding blind spots in temperature and humidity monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0018] Figure 1 2 is a schematic structural diagram of a micro-positive pressure control device for a box-type equipment in a substation according to an embodiment of the present invention;

[0019] Figure 2 It is a partial structural schematic diagram of a micro positive pressure control device for a substation box-type equipment according to an embodiment of the present invention;

[0020] Figure 3 It is a bottom view of a heating plate, a condensing plate and a semiconductor refrigeration plate of a micro-positive pressure control device for a substation box-type device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] The embodiment of the present invention discloses a micro-positive pressure control device for a substation box-type equipment. Micro-positive pressure means that the air pressure inside the substation box-type equipment is slightly greater than the air pressure outside the substation box-type equipment. Figures 1 to 3 As shown, the micro-positive pressure control device includes: a control component and a sensor. The sensor is arranged on the inner wall at the top of the outer shell of the substation box-type equipment 1 (not shown in the figure). Specifically, the sensor includes a capacitive temperature and humidity sensor and a physical water droplet comprehensive sensing sensor. The capacitive temperature and humidity sensor can detect the temperature and humidity of the environment inside the substation box-type equipment. For example, the model of the capacitive temperature and humidity sensor is DRWS-01. The physical water droplet comprehensive sensing sensor can monitor the condensation inside the substation box-type equipment. For example, the model of the physical water droplet comprehensive sensing sensor is WLSD-01.

[0023] The control assembly includes: a control box 2, a first air duct 3, a second air duct 4, a drain pipe 5, and a control circuit board 6, a heating plate 7, a condensing plate 8, a semiconductor cooling sheet 9, a water accumulation box 10, a first fan 11, a second fan 12, a third fan 13 and a fourth fan 14 installed in the control box 2. The above components can be installed in the control box 2 in any suitable existing manner, for example, a bolt and nut fixing connection manner, an adhesive manner, etc. The control circuit board 6 is electrically connected to the sensor, the heating plate 7, the semiconductor cooling sheet 9, the first fan 11, the second fan 12, the third fan 13 and the fourth fan 14 respectively.

[0024] The control box 2 is installed in the substation box-type equipment 1 and can be installed in a suitable position in any suitable manner, for example, a bolt and nut fixed connection method. Specifically, the control circuit board 6 has an MCU chip. The MCU chip controls the operation of the heating plate 7, the semiconductor cooling plate 9, the first fan 11, the second fan 12, the third fan 13 and the fourth fan 14. For example, when the ambient humidity is greater than the set humidity or the month-on-month humidity is close to the historical humidity peak, the MCU chip can control the corresponding components to start dehumidification.

[0025] The heating plate 7, the semiconductor refrigeration sheet 9 and the condensation plate 8 are stacked in sequence and are all located below the control circuit board 6. Preferably. The heating plate 7 and the condensation plate 8 can both be accordion-shaped, and the heating plate 7 and the semiconductor refrigeration sheet 9, as well as the semiconductor refrigeration sheet 9 and the condensation plate 8 are bonded by silicone. The lower ends of the condensation plate 8 and the semiconductor refrigeration sheet 9 are directly opposite to the water inlet of the water collection box 10. The water outlet of the water collection box 10 passes through the bottom wall of the control box 2 and is connected to the water inlet of one end of the drain pipe 5, and the other end of the drain pipe 5 extends out of the outer shell of the substation box-type equipment 1.

[0026] The first fan 11 is installed at the air inlet of the first air duct 3, and the air outlet surface of the first fan 11 faces the air inlet of the first air duct 3. The air inlet surface of the first fan 11 abuts one end of the heating plate 7. The second fan 12 is installed at the air outlet of the second air duct 4, and the air inlet surface of the second fan 12 faces the air outlet of the second air duct 4. The air outlet surface of the second fan 12 abuts the other end of the heating plate 7. The air inlet of the first air duct 3 and the air outlet of the second air duct 4 are respectively connected to the first openings of the opposite side walls of the control box 2, and the air outlet of the first air duct 3 and the air inlet of the second air duct 4 are respectively connected to the second openings of the opposite side walls of the substation box-type equipment 1. The two first openings can be located at the same height. The second opening of one side wall of the substation box-type equipment 1 connected to the air outlet of the first air duct 3 is higher than the second opening of the other side wall of the substation box-type equipment 1 connected to the air inlet of the second air duct 4, thereby forming two high and low air ducts, which are convenient for hot air to be discharged upward. The second opening may be a labyrinth design, such as an opening formed by a ventilation channel with multiple bends, so as to filter out dust and impurities in the air to a certain extent. The above structure enables the second fan 12 to blow air in the direction of the first fan 11, and the first fan 11 exhausts air, forming an air flow channel.

[0027] The third fan 13 is located above the control circuit board 6, and the air outlet of the third fan 13 faces the upper end of the control circuit board 6. The air inlet of the fourth fan 14 faces the condensation plate 8. The above structure allows the third fan 13 to blow a light breeze (i.e., a small amount of wind) toward the fourth fan 14, and the fourth fan 14 exhausts air, forming another air flow channel.

[0028] In addition, a plurality of ventilation holes 15 are provided on one side wall of the first air duct 3 and the second air duct 4, which further assist in forming a micro-positive pressure environment. Preferably, ventilation filter cotton is provided on the inner surface of the side wall where the ventilation holes 15 of the first air duct 3 and the second air duct 4 are located. The ventilation filter cotton can initially condense moisture in the air, assist in reducing the humidity of the environment inside the substation box-type equipment 1, and at the same time ensure the cleanliness of the internal operating conditions of the substation box-type equipment 1.

[0029] Specifically, the air outlet of the first air duct 3 and the air inlet of the second air duct 4 are respectively covered with a check valve 16. The starting pressure of the check valve 16 can be obtained according to the flow of the ventilation hole 15 and the power of the first fan 11 and the second fan 12, while ensuring the slight positive pressure of the internal environment, avoiding explosive damage to the substation box-type equipment 1 due to excessive pressure, and preventing water vapor in the air from invading the substation box-type equipment 1 in reverse.

[0030] Preferably, the micro-positive pressure control device also includes: an antenna 17. One end of the antenna 17 is electrically connected to the communication chip on the control circuit board 6. The other end of the antenna 17 extends out of the control box 2. Specifically, the communication chip is selected from at least one of the following: RS485 chip, NB-ITO chip, LOAR chip, 4G chip and 5G chip, so that high-speed transmission of signals can be achieved through a variety of communication methods, and the transmission distance can reach 5000m visually. The signal can penetrate steel-concrete buildings, steel structures and other buildings, and has strong anti-interference ability, which can realize the interconnection between power production station equipment, and can also be connected to a remote control terminal, mobile phone or tablet computer. The relevant equipment can be monitored anytime and anywhere through the APP, and the automatic internal and external network transmission function of all abnormal signals can be realized.

[0031] The device is used as follows:

[0032] When the sensor detects that the humidity rises or the temperature fluctuates, the control circuit board 6 starts the first fan 11 , the second fan 12 , the third fan 13 , the fourth fan 14 , the heating plate 7 and the semiconductor condensing sheet 9 . Under the action of the third fan 13 and the fourth fan 14, the humid air flows to the vicinity of the semiconductor condensation sheet 9, the semiconductor condensation sheet 9 cools the humid air to cool it into water, and the condensation plate 8 absorbs water vapor to form dew droplets, which enter the water accumulation box 10 and are then discharged through the drain pipe 5, so as to reduce the water vapor in the air in the substation box-type equipment 1, so that the relative humidity and the absolute humidity are reduced at the same time, and condensation is prevented from reaching the dew point and causing condensation; at the same time, the heating plate 7 heats the humid air to dry it, and the dried air is discharged from the air outlet of the first air duct 3 through the air duct formed by the third fan 13 and the fourth fan 14 to discharge hot air, thereby forming a directional flow of air in the substation box-type equipment 1, accelerating the gas circulation and flow in the substation box-type equipment 1, reducing the local water vapor accumulation in a certain area, and reducing the possibility of condensation formation; a hot air belt is formed in the substation box-type equipment 1, thereby quickly forming a slightly positive pressure environment in the substation box-type equipment 1, isolating external water vapor, and preventing external water vapor from entering the cabinet. Due to the design of the ventilation holes 15 on the first air duct 3 and the second air duct 4 , the substation box-type equipment 1 is further formed into a slightly positive pressure environment state, isolating external water vapor and preventing external water vapor from entering the substation box-type equipment 1 .

[0033] In addition, when the sensor detects a temperature change, the control circuit board 6 can only start the heating plate 7, the first fan 11 and the second fan 12. The heating plate 7 is heated, and the hot air is discharged through the gas flow channel formed by the first fan 11 and the second fan 12, forming a local circulation in the substation box-type equipment 1, accelerating the circulation and flow of gas in the substation box-type equipment 1, reducing the local water vapor accumulation in a certain area, reducing the possibility of condensation formation, and ensuring the absolute positive pressure of the environment in the substation box-type equipment 1 relative to the atmospheric environment.

[0034] In summary, the micro-positive pressure control device for substation box-type equipment in the embodiment of the present invention can solve the problem that it is difficult to form an absolutely sealed environment for substation box-type equipment due to aging of sealing facilities of old equipment and inconsistent industrial processing levels. The micro-positive pressure environment inside the substation box-type equipment can effectively block the invasion of humid air in the atmospheric environment into the substation box-type equipment, achieve the effect of rapid dehumidification and moisture removal, and effectively prevent safety hazards such as aging of equipment in the cabinet, reduced insulation strength, breakdown of secondary terminals, mildew of materials, and rust of metal structural parts, thereby ensuring the safe operation of the power grid; forming local gas circulation, forming an effective and reasonable airflow distribution, making the temperature and humidity evenly distributed, and completely avoiding blind spots in temperature and humidity monitoring.

[0035] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A micro positive pressure control device for substation box-type equipment, characterized in that: include: A control component and a sensor, wherein the sensor is arranged on the inner wall of the top of the housing of the substation box-type equipment; The control assembly includes: a control box, a first air duct, a second air duct, a drain pipe, and a control circuit board, a heating plate, a condensing plate, a semiconductor cooling sheet, a water accumulation box, a first fan, a second fan, a third fan and a fourth fan installed in the control box, wherein the control circuit board is electrically connected to the sensor, the heating plate, the semiconductor cooling sheet, the first fan, the second fan, the third fan and the fourth fan respectively; The control box is installed in the substation box-type equipment, the heating plate, the semiconductor cooling sheet and the condensing plate are stacked in sequence and are all located below the control circuit board, the lower ends of the condensing plate and the semiconductor cooling sheet are directly opposite to the water inlet of the water accumulation box, the water outlet of the water accumulation box passes through the bottom wall of the control box and is connected to the water inlet of one end of the drain pipe, and the other end of the drain pipe extends out of the housing of the substation box-type equipment; The air inlet of the first air duct and the air outlet of the second air duct are respectively connected to the first openings of the opposite side walls of the control box, the air outlet of the first air duct and the air inlet of the second air duct are respectively connected to the second openings of the opposite side walls of the substation box-type equipment, the first fan is installed at the air inlet of the first air duct, and the air outlet surface of the first fan faces the air inlet of the first air duct, and the air inlet surface of the first fan abuts one end of the heating plate; the second fan is installed at the air outlet of the second air duct, and the air inlet surface of the second fan faces the air outlet of the second air duct, and the air outlet surface of the second fan abuts the other end of the heating plate; a plurality of ventilation holes are arranged on one side wall of the first air duct and the second air duct; the air outlet of the first air duct and the air inlet of the second air duct are respectively covered with a check valve; The third fan is located above the control circuit board, and an air outlet surface of the third fan faces the upper end of the control circuit board, and an air inlet surface of the fourth fan faces the condensation plate.

2. The micro-positive pressure control device for substation box-type equipment according to claim 1 is characterized in that: Ventilation filter cotton is arranged on the inner surface of the side wall where the ventilation holes of the first air duct and the second air duct are located.

3. The micro positive pressure control device for substation box-type equipment according to claim 1 is characterized in that: Also includes: An antenna, one end of which is electrically connected to the communication chip on the control circuit board, and the other end of which extends out of the control box.

4. The micro-positive pressure control device for substation box-type equipment according to claim 3 is characterized in that: The communication chip is selected from at least one of the following: RS485 chip, NB-ITO chip, LOAR chip, 4G chip and 5G chip.

5. The micro-positive pressure control device for substation box-type equipment according to claim 1 is characterized in that: The second opening of one side wall of the substation box-type equipment connected to the air outlet of the first air duct is higher than the second opening of the other side wall of the substation box-type equipment connected to the air inlet of the second air duct.

6. The micro-positive pressure control device for substation box-type equipment according to claim 1 is characterized in that: The heating plate and the semiconductor refrigeration sheet, as well as the semiconductor refrigeration sheet and the condensation plate are bonded by silicone.

7. The micro-positive pressure control device for substation box-type equipment according to claim 1 is characterized in that: The sensors include: a capacitive temperature and humidity sensor and a physical water droplet comprehensive sensing sensor.

Citation Information

Patent Citations

  • Micro-positive pressure control device for box-type equipment of transformer substation

    CN215378137U