A device and method for identifying object contour based on temperature difference

Abstract

The present invention relates to a device and method for identifying the contour of an object based on temperature difference. The device and method for identifying the contour of an object based on temperature difference of the present invention are as follows: an array temperature sensor is arranged on the back of a storage platform, and an object to be measured is arranged on the front of the storage platform. When the surface of the object to be measured contacts the front of the storage platform, a temperature difference area equal to the contact area of ​​the object to be measured is formed on the front and back of the storage platform. The array temperature sensor detects the temperature of the back of the storage platform through the temperature sensor unit therein, and then obtains the contour map of the surface of the object to be measured according to the temperature difference of each temperature sensor unit through the data processing element. The device and method for identifying the contour of an object based on temperature difference of the present invention detects the temperature change of the contact area between the storage platform and the object to be measured through the array temperature sensor, generates a temperature state distribution map, and thus obtains the contour map of the object in the contact area.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature sensor equipment, and in particular to a device and method for identifying the contour of an object based on temperature difference. Background Art

[0002] The contour feature of an object is one of the important features used to describe the object. The purpose of object contour recognition is to detect the size of the object and apply the corresponding algorithm to draw the contour of the object through computer software. The recognition of the object contour mainly relies on optical methods for measurement. The optical method mainly uses light illumination. The light is illuminated by the object to be measured. After the light is reflected by the object to be measured, it is captured and imaged by the camera system, thereby obtaining the contour shape image of the object to be measured. In daily life and production, it is usually necessary to identify the contour of the heated object and judge the temperature change of the heated object within the contour range.

[0003] The existing method of detecting contours by optical methods is that when the surface reflectivity of the detected object is poor, the detection effect is seriously affected by the characteristics of the object, and in a heated environment, the optical detection instrument and the camera system are also easily damaged. Summary of the invention

[0004] Based on this, the present invention provides a device and method for identifying the contour of an object based on temperature difference, which can detect the temperature changes in the contact area between the storage platform and the detected object through an array temperature sensor, generate a temperature state distribution diagram, and thus obtain the contour diagram of the object in the contact area.

[0005] In a first aspect, the present invention provides a device for identifying the contour of an object based on temperature difference, comprising a placement table, an array temperature sensor and a data processing element, wherein the array temperature sensor is arranged on the back side of the placement table, the front side of the placement table is used to contact the surface of the object to be measured having a temperature difference between the placement table and the placement table, and the thermal conductivity of the placement table in a direction perpendicular to the array temperature sensor is greater than the thermal conductivity of the placement table in a direction parallel to the array temperature sensor;

[0006] When the surface of the object to be measured contacts the front side of the platform, a temperature gradient field pointing from the back side of the platform to the front side is formed inside the platform, and a temperature difference area is formed on the back side of the platform, and the size of the temperature difference area is consistent with the contact area between the platform and the object to be measured;

[0007] The array temperature sensor comprises a substrate, a plurality of through holes are arranged on the substrate, a temperature sensor unit is arranged in each of the through holes, and the temperature sensor unit is used to detect the temperature of the back surface of the storage table;

[0008] The data processing element is used to obtain the temperature detected by each of the temperature sensor units, and obtain a contour map of the surface of the measured object according to the temperature difference of each of the temperature sensor units.

[0009] Since there is a temperature difference between the placement platform and the object to be measured, when the placement platform contacts the object to be measured, a temperature difference area is formed at the contact position due to heat transfer. Since the longitudinal thermal conductivity of the placement platform is greater than the transverse thermal conductivity, a temperature gradient field is formed inside the placement platform, so that a temperature difference area with the same shape as the contact area is formed on the back side of the placement platform. The temperature difference on the back side of the placement platform is detected by an array temperature sensor, and a contour map of the object surface is generated by a data processing element.

[0010] Furthermore, the data processing element is used to generate a temperature state distribution diagram according to the temperature difference of each temperature sensor unit, and obtain a contour diagram of the surface of the measured object according to the temperature state distribution diagram.

[0011] The temperature parameters are converted into a contour map of the surface of the measured object through data processing components.

[0012] Furthermore, the temperature difference between the storage platform and the object to be measured is greater than 10 degrees.

[0013] The temperature difference between the storage platform and the object being measured is greater than 10 degrees, ensuring the accuracy of the array temperature sensor detection.

[0014] Furthermore, the thermal conductivity of the placement platform in a direction perpendicular to the array-type temperature sensor is more than ten times the thermal conductivity of the placement platform in a direction parallel to the array-type temperature sensor.

[0015] Eliminate the influence of heat conduction in the direction of the storage platform parallel to the array temperature sensor.

[0016] Further, the temperature sensor unit includes a conductive temperature-sensitive element, a first metal electrode and a second metal electrode;

[0017] The first electrode is disposed at one end of the through hole, and the second metal electrode is disposed at the other end of the through hole and seals the through hole together with the first metal electrode;

[0018] The conductive temperature-sensitive element is disposed between the first metal electrode and the second metal electrode, and is connected to the first metal electrode and the second metal electrode.

[0019] The temperature change causes the resistance of the conductive temperature-sensitive element to change, and the specific parameters of the temperature are determined by detecting the current between the first metal electrode and the second metal electrode.

[0020] Furthermore, the array temperature sensor is closely attached to or embedded on the reverse side of the storage table;

[0021] The first metal electrode is connected to the surface of the reverse side of the storage platform.

[0022] The heat is transferred to the conductive temperature-sensitive element through the first metal electrode, causing the resistance of the conductive temperature-sensitive element to change.

[0023] Furthermore, the conductive temperature-sensitive element is made of a material with a negative temperature coefficient, and the resistance of the conductive temperature-sensitive element decreases as the temperature increases.

[0024] As the temperature increases, the resistance of the conductive temperature-sensitive element decreases. The temperature is determined by measuring the current.

[0025] In a second aspect, the present invention provides a method for identifying an object contour based on temperature difference, comprising the following steps:

[0026] Providing a platform, and placing an object to be measured having a temperature difference with the platform on the front surface of the platform, so that a temperature difference area is formed at a position where the platform contacts the object to be measured;

[0027] Through the thermal conductivity of the placement table, a temperature gradient field pointing from the back side of the placement table to the front side is formed in the placement table, and a temperature difference area with the same size as the contact area between the placement table and the object to be measured is formed on the back side of the placement table;

[0028] An array temperature sensor is provided, and the array temperature sensor is arranged on the back of the storage table, wherein the array temperature sensor comprises a substrate, a plurality of through holes are opened on the substrate, and a temperature sensor unit is arranged in each of the through holes;

[0029] Acquire the temperature parameter collected by each temperature sensing unit in the array temperature sensor;

[0030] A temperature state distribution diagram is generated by a data processing element, and the temperature state distribution diagram is converted into a contour diagram of the surface of the measured object.

[0031] Furthermore, the array temperature sensor is closely attached to or embedded on the reverse side of the storage platform, and the first metal electrode is in contact with the reverse side of the storage platform.

[0032] Furthermore, it is defined that the thermal conductivity of the placement platform in a direction perpendicular to the array temperature sensor is more than ten times the thermal conductivity of the placement platform in a direction parallel to the array temperature sensor.

[0033] In order to better understand and implement the technical solution of the present invention, the following describes the technical solution of the present invention in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of a device for identifying an object contour based on temperature difference in one embodiment of the present invention;

[0035] Figure 2 A schematic diagram of placing an object to be measured in a device for identifying an object contour based on temperature difference in one embodiment of the present invention;

[0036] Figure 3 A schematic diagram of the front contact area of ​​a storage platform of an apparatus for identifying an object contour based on temperature difference in one embodiment of the present invention;

[0037] Figure 4 A schematic diagram of the temperature difference area on the back side of a storage platform of a device for identifying the contour of an object based on temperature difference in one embodiment of the present invention;

[0038] Figure 5 A schematic diagram of an array temperature sensor substrate in a device for identifying an object contour based on temperature difference in one embodiment of the present invention;

[0039] Figure 6 is a cross-sectional view of a device for identifying an object contour based on temperature difference in one embodiment of the present invention;

[0040] Figure 7 FIG. 4 is a schematic diagram of a device for identifying an object contour based on temperature difference in one embodiment of the present invention.

[0041] Figure numerals: 1-placement table; 101-contact area; 102-temperature difference area; 2-array temperature sensor; 201-substrate; 202-temperature sensor unit; 2021-conductive temperature sensitive element; 2022-first metal electrode; 2023-second metal electrode; 203-through hole; 3-object to be measured; 4-data processing element. DETAILED DESCRIPTION

[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings, rather than all of the contents.

[0043] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0045] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0046] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0047] In addition, in the description of this application, unless otherwise specified, "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0048] Several specific embodiments are given below to describe the technical solution of the present application in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0049] See also Figure 1 , which is a schematic diagram of a device for identifying an object contour based on temperature difference according to an embodiment of the present invention. In this embodiment, the device for identifying an object contour based on temperature difference includes a placement table 1, an array temperature sensor 2 and a data processing element 4. The array temperature sensor 2 is arranged on the back side of the placement table 1, and the front side of the placement table 1 is used to place a measured object 3. There is a certain temperature difference between the measured object 3 and the placement table 1.

[0050] like Figure 2 and Figure 3 As shown, in one embodiment, the object 3 to be measured is taken as a cylindrical structure for example. When the object 3 to be measured is set on the front of the placement table 1, the bottom of the object 3 to be measured contacts the surface of the front of the placement table 1 to form a contact area 101. The shape of the contact area 101 is the same as the shape of the bottom of the object 3 to be measured. In this embodiment, the temperature of the placement table 1 is higher than the temperature of the object 3 to be measured. Preferably, the temperature difference between the placement table 1 and the object 3 to be measured is greater than 10 degrees. At the contact area 101, heat is transferred from the placement table 1 to the object 3 to be measured. At this time, the contact area 101 is lower than the temperature of other areas on the surface of the front of the placement table 1, and thus the contact area 101 becomes a low-temperature area.

[0051] like Figure 4 As shown, in the above embodiment, when the placement table 1 is placed horizontally, the thermal conductivity of the placement table 1 in the vertical direction is greater than the thermal conductivity in the horizontal direction. Preferably, the thermal conductivity of the placement table 1 in the vertical direction is greater than 0.34w / m·k and less than or equal to 8.5w / m·k, and the thermal conductivity in the horizontal direction is ≤0.34w / m·k. When the contact area 101 is a low temperature area, the heat on the placement table 1 migrates to the low temperature area. Since the thermal conductivity of the placement table 1 in the vertical direction is much greater than the thermal conductivity in the horizontal direction, a temperature gradient field is formed in the vertical direction inside the placement table 1 pointing from the back side of the placement table 1 to the front side. The heat on the back side of the placement table 1 moves toward the front side of the placement table 1, thereby forming a temperature difference area 102 on the back side of the placement table 1. In this embodiment, the temperature difference area 102 is specifically a low temperature area, and the temperature difference area 102 is consistent in size with the contact area 101 between the placement table 1 and the object 3 to be measured. In other examples, the temperature of the placement platform 1 may be lower than the temperature of the object to be measured 3 , and the contact area 101 and the temperature difference area 102 also become high temperature areas.

[0052] like Figure 5 and Figure 6In one embodiment, the array temperature sensor 2 is embedded on the reverse side of the storage table 1. The array temperature sensor 2 includes a base 201 and a temperature sensor unit 202. The base 201 is a square plate structure. A plurality of circular through holes 203 are provided on the base 201. The through holes 203 are preferably arranged in an array with equal spacing on the base 201. A temperature sensor unit 202 is provided inside each through hole 203. In other examples, the base 201 can be set to other shapes as needed, and the shape of the through hole 203 can also be changed to match the shape of the temperature sensor unit 202.

[0053] The temperature sensor unit 202 includes a conductive temperature-sensitive element 2021, a first metal electrode 2022 and a second metal electrode 2023. The first metal electrode 2022 is arranged at the upper end of the through hole 203 and closes the top opening of the through hole 203. The second metal electrode 2023 is arranged at the lower end of the through hole 203 and closes the bottom opening of the through hole 203. The conductive temperature-sensitive element 2021 is arranged between the first metal electrode 2022 and the second metal electrode 2023. The first metal electrode 2022 is connected to the top of the conductive temperature-sensitive element 2021, and the second metal electrode 2023 is connected to the lower end of the conductive temperature-sensitive element 2021. Since the array temperature sensor 2 is embedded in the reverse side of the placement table 1, in this embodiment, the first metal electrode 2022 is connected to the reverse surface of the placement table 1.

[0054] In the above embodiment, the conductive temperature-sensitive element 2021 is an electronic component made of a conductive temperature-sensitive material whose resistance changes with temperature. The conductive temperature-sensitive element 2021 is used to directly convert temperature changes into resistance changes. The first metal electrode 2022 and the second metal electrode 2023 are made of heat-conducting materials. The first metal electrode 2022 and the second metal electrode 2023 are used to conduct electric charges and heat to the conductive temperature-sensitive element 2021, thereby causing the resistance of the conductive temperature-sensitive element 2021 to change.

[0055] like Figure 6As shown, in one embodiment, each group of temperature sensor units 202 is connected to an external circuit through a group of wires. Specifically, the first metal electrode 2022 is connected to the positive electrode of the power supply VCC through a wire arranged on the upper surface of the substrate 201, and the second metal electrode 2023 is connected to the negative electrode of the power supply VCC through a wire arranged on the lower surface of the substrate 201. The first metal electrode 2022 is connected to the second metal electrode 2023 via the conductive temperature-sensitive element 2021 thereunder. The first metal electrode 2022, the second metal electrode 2023, the conductive temperature-sensitive element 2021 and the power supply VCC form a complete power supply circuit through the wire. At the same time, a current detection element can also be provided in the power supply circuit. When the conductive temperature-sensitive element 2021 detects a temperature change, thereby changing the resistance, the current in the power supply circuit will also change accordingly. By detecting the current change in the power supply circuit, the temperature can be detected.

[0056] In the above embodiment, the power source VCC is a DC power source. In other examples, it can also be an AC power source or other different power supply forms.

[0057] like Figure 1 and Figure 7 As shown, in one embodiment, each group of temperature sensor units 202 and the power supply VCC connected thereto form a complete power supply circuit, and the current data generated on each circuit are all imported into the data processing element 4. After the data processing element 4 obtains the temperature detected by each temperature sensor unit 202, it generates a temperature state distribution diagram according to the temperature difference of each temperature sensor unit 202. The data processing element 4 further analyzes and draws the temperature state distribution diagram into a contour diagram of the contact surface between the measured object 3 and the placement table 1. In other examples, the data processing element 4 can be a component that can convert temperature parameters into a temperature state distribution diagram and a contour diagram, such as an FPGA circuit board and a computer.

[0058] Preferably, the wire connecting the temperature sensor unit 202 is made of carbon fiber material. In other examples, the wire may also be made of metal material, such as copper wire, gold wire, etc., or may be a conductive film formed by sputtering, etc.

[0059] Preferably, when the spacing between the through holes 203 arranged in the array decreases and the number of the through holes 203 further increases, the spatial resolution of the temperature sensor unit 3 increases accordingly, and the temperature spatial distribution state measured by the measured object 3 in a certain space is also more accurate.

[0060] In one embodiment, the conductive temperature-sensitive element 2021 is made of a conductive temperature-sensitive material with a negative temperature coefficient, that is, as the detected temperature of the conductive temperature-sensitive element 2021 increases, its own resistance decreases.

[0061] In one embodiment, the conductive temperature-sensitive element 2021 is made of a carbon-based material, and the carbon-based material includes at least one of the following: carbon fiber, carbon slurry, carbon particles, etc. The carbon-based material has the characteristics of high conductivity, low cost, excellent stability, etc.

[0062] In one embodiment, the first metal electrode 2022 and the second metal electrode 2023 are solid structures, and the first metal electrode 2022 and the second metal electrode 2023 are respectively embedded in the upper opening and the lower opening of the through hole 203, and close the through hole 203. Preferably, the first metal electrode 2022 and the second metal electrode 2023 can also be formed by curing the conductive paste.

[0063] In one embodiment, the substrate 201 is an insulating material to avoid affecting the detection accuracy due to the conductivity of the substrate. Preferably, the substrate 201 can be a rigid insulating material. The substrate 201 serves as a supporting part to support each group of temperature sensor units 3 for temperature detection. The substrate 201 can also be made of a flexible insulating material. The flexible insulating material allows the substrate 201 to be set on a specific curved surface to ensure a good measurement effect on a non-planar object to be measured.

[0064] Preferably, the substrate 201 may be a flexible circuit board. Figure 1 , Figure 4 and Figure 6 The wires connected to each group of the first metal electrodes 2022 and the second metal electrodes 2023 may be wires disposed inside the substrate 201 .

[0065] When the device for identifying the contour of an object based on temperature difference in this embodiment is used to detect the contour of an object:

[0066] First, a placement table 1 is provided, and the placement table 1 is preheated so that the temperature of the placement table 1 is higher than the temperature of the object 3 to be measured, and the temperature difference between the placement table 1 and the object 3 to be measured is ensured to be greater than 10 degrees.

[0067] Then, the array temperature sensor 2 is embedded on the reverse side of the placement table 1 , and the first metal electrode 2022 is connected to the reverse side surface of the placement table.

[0068] The object to be measured 3 is then placed on the front surface of the platform 1 , so that a contact area 101 is formed between the bottom of the object to be measured 3 and the front surface of the platform 1 .

[0069] Since the thermal conductivity of the platform 1 in the vertical direction is much greater than that in the horizontal direction, under the influence of heat transfer, the contact area 101 forms a low-temperature area, and the shape of the contact area 101 with a lower temperature is the same as the bottom shape of the object 3 to be measured.

[0070] Since the thermal conductivity of the placing table 1 in the vertical direction is relatively large, a temperature gradient field is formed in the placing table 1 in the vertical direction, so that a temperature difference area 102 having the same size as the contact area 101 is formed on the reverse side of the placing table 1, and the temperature difference area 102 is also a low temperature area.

[0071] The temperature difference of the surface on the back side of the placement table 1 is detected by the array temperature sensor 2, and an electrical signal is generated and transmitted to the data processing element 4. The data processing element 4 converts the collected temperature data into a temperature state distribution diagram, and obtains a contour diagram of the contact part between the object 3 under test and the placement table 1 according to the temperature state distribution diagram.

[0072] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A device for identifying the contour of an object based on temperature difference, characterized in that: include: A storage platform, an array temperature sensor and a data processing element, wherein the array temperature sensor is arranged on the back side of the storage platform, the front side of the storage platform is used to contact the surface of the object to be measured with a temperature difference between the storage platform and the storage platform, and the thermal conductivity of the storage platform in a direction perpendicular to the array temperature sensor is more than ten times greater than the thermal conductivity of the storage platform in a direction parallel to the array temperature sensor; When the surface of the object to be measured contacts the front side of the platform, a temperature gradient field pointing from the back side of the platform to the front side is formed inside the platform, and a temperature difference area is formed on the back side of the platform, and the size of the temperature difference area is consistent with the contact area between the platform and the object to be measured; The array temperature sensor comprises a substrate, a plurality of through holes are arranged on the substrate, a temperature sensor unit is arranged in each of the through holes, and the temperature sensor unit is used to detect the temperature of the back surface of the storage table; The data processing element is used to obtain the temperature detected by each of the temperature sensor units, and generate a temperature state distribution diagram according to the temperature difference of each of the temperature sensor units, and then obtain a contour diagram of the surface of the measured object according to the temperature state distribution diagram.

2. The device for identifying the contour of an object based on temperature difference according to claim 1, characterized in that: The temperature difference between the storage platform and the object to be measured is greater than 10 degrees.

3. The device for identifying the contour of an object based on temperature difference according to claim 2, characterized in that: The temperature sensor unit includes a conductive temperature-sensitive element, a first metal electrode and a second metal electrode; The first metal electrode is disposed at one end of the through hole, and the second metal electrode is disposed at the other end of the through hole and seals the through hole together with the first metal electrode; The conductive temperature-sensitive element is disposed between the first metal electrode and the second metal electrode, and is connected to the first metal electrode and the second metal electrode.

4. The device for identifying the contour of an object based on temperature difference according to claim 3, characterized in that: The array temperature sensor is closely attached to or embedded on the reverse side of the storage table; The first metal electrode is connected to the surface of the reverse side of the storage platform.

5. The device for identifying the contour of an object based on temperature difference according to claim 4, characterized in that: The conductive temperature-sensitive element is made of a material with a negative temperature coefficient, and the resistance of the conductive temperature-sensitive element decreases as the temperature increases.

6. A method for identifying the contour of an object based on temperature difference, characterized in that: The steps include: Providing a platform, and placing an object to be measured having a temperature difference with the platform on the front surface of the platform, so that a temperature difference area is formed at a position where the platform contacts the object to be measured; An array temperature sensor is provided, and the array temperature sensor is arranged on the back of the storage table, wherein the array temperature sensor comprises a substrate, a plurality of through holes are opened on the substrate, and a temperature sensor unit is arranged in each of the through holes; The thermal conductivity of the placement platform in a direction perpendicular to the array temperature sensor is limited to be more than ten times the thermal conductivity of the placement platform in a direction parallel to the array temperature sensor, so that a temperature gradient field pointing from the back side of the placement platform to the front side is formed in the placement platform, and a temperature difference area with the same size as the contact area between the placement platform and the object to be measured is formed on the back side of the placement platform; Acquire the temperature parameter collected by each temperature sensor unit in the array temperature sensor; A temperature state distribution diagram is generated by a data processing element, and the temperature state distribution diagram is converted into a contour diagram of the surface of the measured object.

7. The method for identifying the contour of an object based on temperature difference according to claim 6, characterized in that: The array temperature sensor is arranged on the reverse side of the storage table, comprising: The array temperature sensor is closely attached to or embedded on the back surface of the storage table.

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