Display devices

Abstract

A display device is provided, comprising: a display panel including a display area for displaying an image and a pad area disposed on at least one side of the display area; and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes a plurality of connection pads, a first measurement pad, and a second measurement pad. The plurality of connection pads are arranged in a first direction and are inclined relative to a reference line extending in a second direction different from the first direction. The first measurement pad is disposed adjacent to a first side of the plurality of connection pads, and the second measurement pad is disposed adjacent to a second side of the plurality of connection pads. The plurality of connection pads are located between the first measurement pad and the second measurement pad.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0017287, filed on February 13, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device capable of improving connection reliability between a flexible circuit film and a display panel. Background Art

[0004] Various types of display devices may be used to provide image information, and the display device may include a display panel for displaying an image and a flexible circuit film combined with the display panel and for providing a driving signal to the display panel. The display panel may include a display area in which an image may be displayed, and a panel pad may be provided in the periphery of the display area to provide a driving signal to a display unit on which an image may be displayed.

[0005] Furthermore, the display pads may be electrically connected to the flexible circuit film to receive drive signals through the flexible circuit film. The flexible circuit film may include connection pads that may be arranged to correspond to the panel pads. Due to process errors in the flexible circuit film, misalignment may occur between the connection pads and the display pads.

[0006] It should be understood that this background technology section is intended, in part, to provide useful context for understanding the technology. However, this background technology section may also include ideas, concepts, or realizations that were not known or understood by those skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Summary of the Invention

[0007] The present disclosure provides a display device in which connection reliability between a flexible circuit film and a display panel can be improved.

[0008] Embodiments provide a display device that may include: a display panel including a display area displaying an image and a pad area provided at least at one side of the display area; and a flexible circuit film electrically connected to the pad area.

[0009] In an embodiment, the flexible circuit film may include a plurality of connection pads and first and second measurement pads. The plurality of connection pads may be arranged in a first direction and tilted relative to a reference line extending in a second direction different from the first direction.

[0010] In an embodiment, the first measurement pad may be disposed adjacent to a first side of the plurality of connection pads, and the second measurement pad may be disposed adjacent to a second side of the plurality of connection pads. The plurality of connection pads may be disposed between the first measurement pad and the second measurement pad.

[0011] In an embodiment, the flexible circuit film may include dummy pads disposed adjacent to the plurality of connection pads, wherein the dummy pads may be inclined with respect to a reference line.

[0012] In an embodiment, the dummy pad may include: a first dummy pad, arranged between the first measurement pad and a connection pad that is first arranged in the first direction among the multiple connection pads; and a second dummy pad, arranged between the second measurement pad and a connection pad that is last arranged in the first direction among the multiple connection pads.

[0013] In an embodiment, the dummy pads may include a first dummy pad disposed adjacent to the first measurement pad and a second dummy pad disposed adjacent to the second measurement pad.

[0014] In an embodiment, the first measurement pad and the second measurement pad may be parallel to the reference line.

[0015] In an embodiment, the plurality of connecting pads may include: a first connecting pad group having a first slope relative to a reference line and including a first connecting pad arranged at a first side of the reference line; and a second connecting pad group having a second slope relative to the reference line and including a second connecting pad arranged at a second side of the reference line.

[0016] In an embodiment, the plurality of connecting pads may further include: a third connecting pad group having a third slope relative to the reference line and arranged between the reference line and the first connecting pad group; and a fourth connecting pad group having a fourth slope relative to the reference line and arranged between the reference line and the second connecting pad group.

[0017] In an embodiment, the first slope may be greater than the third slope, and the second slope may be greater than the fourth slope.

[0018] In an embodiment, each of the first and second measurement pads may have a rectangular shape or a square shape in a plan view.

[0019] In an embodiment, the display panel may include a plurality of display pads disposed in the pad region to correspond to the plurality of connection pads, wherein the plurality of display pads may be inclined with respect to the reference line.

[0020] In an embodiment, the display device may further include a driving chip disposed on the flexible circuit film, the driving chip outputting a driving signal for driving the display panel, wherein the driving signal may be provided to the display panel through a plurality of connection pads.

[0021] In an embodiment, the film package may include a base film, a plurality of connection pads, a plurality of test pads, and a first measurement pad and a second measurement pad. The base film may include a test area and a cutting area. The plurality of connection pads may be arranged in the cutting area of ​​the base film, and the plurality of test pads may be arranged in the test area of ​​the base film. The plurality of connection pads may be arranged in a first direction and may be tilted relative to a reference line extending in a second direction different from the first direction. The plurality of test pads may be electrically connected to the plurality of connection pads.

[0022] In an embodiment, the first measurement pad may be provided in the test area of ​​the base film and disposed adjacent to the connection pad disposed first in the first direction among the plurality of connection pads. The second measurement pad may be provided in the test area of ​​the base film and disposed adjacent to the connection pad disposed last in the first direction among the plurality of connection pads. The first measurement pad and the second measurement pad may be provided between the plurality of test pads and the plurality of connection pads.

[0023] In an embodiment, the cutting area may be defined by a cutting line, the first and second measurement pads may be separated from the cutting line by a first interval, the plurality of test pads may be separated from the cutting line by a second interval, and the first interval may be smaller than the second interval.

[0024] In an embodiment, the first interval may be greater than about 0 μm and less than about 500 μm.

[0025] In an embodiment, the first measurement pad and the second measurement pad may be parallel to the reference line.

[0026] In an embodiment, the film package may include a base film, a plurality of connection pads, a plurality of test pads, and first and second measurement pads. The base film may include a test area and a cutting area.

[0027] In an embodiment, a plurality of connection pads may be provided in the cutting region of the base film, and a plurality of test pads may be provided in the test region of the base film. The plurality of connection pads may be arranged in a first direction and may be inclined relative to a reference line extending in a second direction different from the first direction. The plurality of test pads may be electrically connected to the plurality of connection pads.

[0028] In an embodiment, the first measurement pad may be provided in the cutting region of the base film and adjacent to the connection pad that is first provided in the first direction among the plurality of connection pads. The second measurement pad may be provided in the cutting region of the base film and adjacent to the connection pad that is last provided in the first direction among the plurality of connection pads.

[0029] In an embodiment, the film package may further include a dummy pad disposed adjacent to the plurality of connecting pads, wherein the dummy pad may be inclined with respect to the reference line.

[0030] In an embodiment, the dummy pads may include a first dummy pad disposed between the first measurement pad and the first connection pad, and a second dummy pad disposed between the second measurement pad and the last connection pad.

[0031] In an embodiment, the dummy pads may include a first dummy pad disposed adjacent to the first measurement pad and a second dummy pad disposed adjacent to the second measurement pad.

[0032] In an embodiment, the first measurement pad and the second measurement pad may be parallel to the reference line. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments and, together with the description, serve to explain the principles of the present disclosure. In the drawings:

[0034] Figure 1 is a perspective view of a display device according to an embodiment;

[0035] Figure 2 is an exploded perspective view of a display device according to an embodiment;

[0036] Figure 3A is a plan view of a display module according to an embodiment;

[0037] Figure 3B yes Figure 3A An exploded plan view of the display panel and the flexible circuit film shown in FIG;

[0038] Figure 4 Yes Figure 3B An enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film shown in FIG;

[0039] Figure 5A is a plan view showing a combined state of a display panel and a flexible circuit film according to an embodiment;

[0040] Figure 5B is a plan view showing a combined state of a display panel and a flexible circuit film according to another embodiment;

[0041] Figure 5C is a plan view showing a combined state of a display panel and a flexible circuit film according to still another embodiment;

[0042] Figure 6is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment;

[0043] Figure 7A is a plan view of a film package according to an embodiment;

[0044] Figure 7B Among them Figure 7A An enlarged plan view of the AA portion of the image;

[0045] Figure 7C Among them Figure 7A An enlarged plan view of the BB portion of the image;

[0046] Figure 8A is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment;

[0047] Figure 8B is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment;

[0048] Figure 9A is a plan view of a film package according to an embodiment;

[0049] Figure 9B Among them Figure 9A An enlarged plan view of a portion CC of which is enlarged;

[0050] Figure 9C Among them Figure 9B An enlarged plan view of a portion EE of the device; and

[0051] Figure 10 is a graph comparing a process error of a film package according to an embodiment with a process error of a conventional film package. DETAILED DESCRIPTION

[0052] Hereinafter, embodiments will be explained in detail with reference to the accompanying drawings.

[0053] For the purpose of describing the embodiments of the present disclosure, parts irrelevant to the description may not be provided, and the same reference numerals denote the same elements throughout the specification.

[0054] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression "at least one of a, b, and c" means: only a; only b; only c; both a and b; both a and c; both b and c; all of a, b, and c, or variations thereof.

[0055] The terms "and" and "or" can be used in conjunction or disjunction and can be understood as equivalent to "and / or." In the specification and claims, for the purposes of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of..." For example, "at least one of A and B" can be understood to mean "A, B, or A and B."

[0056] It should be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims.

[0057] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0058] It should also be understood that the terms “comprises” and / or “comprising”, “includes” and / or “including”, “have” and / or “having” used in this specification may specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not preclude the presence or addition of other features, integers, steps, operations, elements, parts and / or any combination thereof.

[0059] When a layer, film, zone, substrate or region or element is referred to as being “on” another layer, film, zone, substrate or region or element, it can be directly on this other layer, film, zone, substrate or region or element, or there can be an intervening layer, film, zone, substrate or region or element between them. On the contrary, when a layer, film, zone, substrate or region or element is referred to as being “directly” on another layer, film, zone, substrate or region or element, there can be no intervening layer, film, zone, substrate or region or element between them. In addition, when a layer, film, zone, substrate or region or element is referred to as being “below” another layer, film, zone, substrate or region or element, it can be directly below this other layer, film, zone, substrate or region or element, or there can be an intervening layer, film, zone, substrate or region or element between them. On the contrary, when a layer, film, zone, substrate or region or element is referred to as being “directly” on another layer, film, zone, substrate or region or element, there can be no intervening layer, film, zone, substrate or region or element between them. Furthermore, "on" or "upper" may include positioning above or below an object and does not necessarily mean a direction based on gravity.

[0060] For ease of description, spatially relative terms such as "below," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship between one element or component and another element or component as shown in the accompanying drawings. It should be understood that the spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, where the device shown in the accompanying drawings is turned over, a device positioned "below" or "below" another device may be placed "above" the other device. Thus, the illustrative term "below" can include both a lower position and an upper position. The device may also be oriented in other directions, and thus the spatially relative terms may be interpreted differently depending on the orientation.

[0061] For the convenience of explanation, the sizes of the components in the drawings may be exaggerated. In other words, since the sizes and thicknesses of the components in the drawings are arbitrarily shown for the convenience of explanation, the following embodiments are not limited thereto.

[0062] In addition, the term "overlap" or "overlapping" means that the first object can be above or below the second object or on one side of the second object, and conversely, the second object can be above or below the first object or on one side of the first object. In addition, the term "overlap" can include layers, stacks, facing or facing, extending throughout, covering or partially covering or any other appropriate terms as those of ordinary skill in the art will appreciate and understand. The terms "facing" and "facing" mean that the first element can be directly or indirectly opposite to the second element. In the case where a third element is inserted between the first element and the second element, the first element and the second element can be understood to be indirectly opposite to each other, although the first element and the second element are still facing each other. When an element is described as "not overlapping" or "not overlapping" with another element, this can include elements being spaced apart from each other, offset from each other, or arranged side by side with each other or any other appropriate terms as those of ordinary skill in the art will appreciate and understand.

[0063] In this specification, expressions such as "A and / or B" mean A, B, or A and B. In addition, expressions such as "at least one of A and B" mean A, B, or A and B.

[0064] In the following embodiments, when a component is referred to as "on a plane," it is understood that the component is viewed from the top, and when a component is referred to as "on a schematic cross-section," it is understood that the component is vertically cut and viewed from the side.

[0065] It should be understood that when a layer, region, or component is referred to as being “connected” or “coupled” to another layer, region, or component, it may be “directly connected” or “directly coupled” to the other layer, region, or component and / or may be “indirectly connected” or “indirectly coupled” to the other layer, region, or component with other layers, regions, or components interposed therebetween. For example, it should be understood that when a layer, region, or component is referred to as being “electrically connected” or “electrically coupled” to another layer, region, or component, it may be “directly electrically connected” or “directly electrically coupled” to the other layer, region, or component, or it may be “indirectly electrically connected” or “indirectly electrically coupled” to the other layer, region, or component with other layers, regions, or components interposed therebetween.

[0066] In addition, when an element is referred to as being “in contact” or “contacted” with another element, the element can be “electrically in contact” or “physically in contact” with the other element, or “indirectly in contact” or “directly in contact” with the other element.

[0067] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation of the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0068] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0069] As used herein, the term "unit" or "module" refers to a structure or element as shown in the drawings and as described in the specification. However, the present disclosure is not limited thereto. The term "unit" or "module" is not limited to those shown in the drawings.

[0070] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the embodiments pertain. In addition, it should be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0071] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0072] Figure 1 is a perspective view of a display device according to an embodiment, and Figure 2 is an exploded perspective view of a display device according to an embodiment.

[0073] refer to Figure 1 and Figure 2 The display device DD may be a device activated by an electrical signal. The display device DD may include various types of devices. For example, within the spirit and scope of the present disclosure, the display device DD may be applied to electronic devices such as smart watches, computers (such as tablets and laptops), and smart TVs.

[0074] The display device DD may display an image IM toward a third direction DR3 on a display surface IS that may be parallel to the first direction DR1 and the second direction DR2. The display surface IS on which the image IM may be displayed may correspond to a front surface of the display device DD. The image IM may include still images as well as moving images.

[0075] In an embodiment, based on the direction in which the image IM can be displayed, a front surface (or upper surface) and a rear surface (or lower surface) of each member can be defined. The front surface and the rear surface can be opposite to each other in the third direction DR3, and the normal directions of the front surface and the rear surface can be parallel to the third direction DR3.

[0076] The separation distance between the front surface and the rear surface of the display device DD in the third direction DR3 may correspond to the thickness of the display device DD in the third direction DR3. On the other hand, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and may be changed to other directions or refer to other directions.

[0077] The display device DD may detect an external input applied from the outside. The external input may include various types of input provided from outside the display device DD. The external input may be provided in various types.

[0078] For example, the external input may include an external input applied closely to the display device DD or applied adjacent to the display device DD at a specified distance (e.g., hovering), as well as contact with a part of the user's body (e.g., a hand). Within the spirit and scope of the present disclosure, for example, the user input may be of various types, such as force, pressure, temperature, or light.

[0079] The front surface of the display device DD (i.e., the display surface IS) can be divided into a transmissive area TA and a bezel area BZA. The transmissive area TA can be an area in which an image IM can be displayed. A user can visually recognize the image IM through the transmissive area TA. In an embodiment, the transmissive area TA is shown as having a generally rectangular shape with rounded edges. However, this is merely an example, and the transmissive area TA can have various shapes and is not limited to any one embodiment.

[0080] The bezel area BZA may be adjacent to the transmissive area TA. The bezel area BZA may have a predetermined color. The bezel area BZA may surround the transmissive area TA or may be adjacent to the transmissive area TA. Thus, the shape of the transmissive area TA may be substantially defined by the bezel area BZA. However, this is merely an example, and the bezel area BZA may be disposed adjacent to only one side of the transmissive area TA. The display device DD according to the embodiment may include various embodiments and is not limited to any one embodiment.

[0081] like Figure 2 As shown in FIG, the display device DD may include a window WM, a display module DM, and a housing EDC. The display module DM may include a display panel DP and an input sensing unit ISP.

[0082] The window WM may be made of a transparent material that can transmit images. For example, within the spirit and scope of the present disclosure, the window WM may be formed of glass, sapphire, plastic, etc. The window WM is shown as having a single layer, but embodiments are not limited thereto. The window WM may include multiple layers. In addition, although not shown, the frame area BZA of the display device DD may be substantially provided as an area in which a material of a prescribed color may be printed in one area of ​​the window WM. As an example, the window WM may include a shading pattern that can define the frame area BZA. The shading pattern may be a colored organic film and may be formed, for example, by a coating technique.

[0083] The display panel DP according to the embodiment may be a liquid crystal panel DP or a light-emitting display panel, but is not particularly limited thereto. For example, the light-emitting display panel may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods.

[0084] The display panel DP may be flexible. Herein, "flexible" may include any bendable property, ranging from a fully foldable structure to a structure that is bendable at a few nanometers. For example, the display panel DP may be a curved display panel or a foldable display panel. Alternatively, the display panel DP may be rigid.

[0085] according to Figure 2, the input sensing unit ISP may be directly provided on the display panel DP. According to an embodiment, the input sensing unit ISP may be formed or provided on the display panel DP in a continuous process. In other words, when the input sensing unit ISP is directly provided on the display panel DP, an adhesive film may not be provided between the input sensing unit ISP and the display panel DP. However, the embodiment is not limited thereto. In other words, an adhesive film may be provided between the input sensing unit ISP and the display panel DP. The input sensing unit ISP may not be manufactured in a continuous process with the display panel DP, and after being manufactured by a process separate from the display panel DP, may be fixed to the top surface of the display panel DP by an adhesive film.

[0086] The display panel DP may generate an image, and the input sensing unit ISP may acquire coordinate information about an external input (eg, a touch event).

[0087] The display module DM can display an image based on an electrical signal and transmit and receive information about an external input. The display module DM may include an active area AA and a non-active area NAA. The active area AA may include an area from which an image provided by the display module DM may be transmitted.

[0088] The non-active area NAA may be adjacent to the active area AA. For example, the non-active area NAA may surround the active area AA or may be adjacent to the active area AA. However, this is merely an example, and the non-active area NAA may have various shapes and is not limited to any one embodiment. Depending on the embodiment, the active area AA of the display module DM may correspond to at least a portion of the transmissive area TA.

[0089] The display module DM may include a main circuit board MCB, a flexible circuit film FCB, and a driving chip DIC.

[0090] The main circuit board MCB may be electrically connected to the flexible circuit film FCB to be electrically connected to the display panel DP. The main circuit board MCB may include a driving element. The driving element may include a circuit unit that can drive the display panel DP.

[0091] The flexible circuit film FCB may be electrically connected to the display panel DP to electrically connect the display panel DP and the main circuit board MCB. The driving chip DIC may be mounted on the flexible circuit film FCB.

[0092] The driver chip DIC may include a driver element, such as a data driver circuit, that can drive the pixels of the display panel DP. The number of flexible circuit films FCB according to the embodiment is shown as one, but the embodiment is not limited thereto. A plurality of flexible circuit films FCB may be provided to electrically connect to the display panel DP.

[0093] Figure 2 A structure in which the driver chip DIC can be mounted on the flexible circuit film FCB is shown, but embodiments are not limited thereto. For example, the driver chip DIC can be directly mounted on the display panel DP. For example, the portion of the display panel DP where the driver chip DIC can be mounted can be bent and disposed on the rear side of the display module DM.

[0094] The input sensing unit ISP may be electrically connected to the main circuit board MCB via a flexible circuit film FCB. However, the embodiment is not limited thereto. In other words, the display module DM may include a separate flexible circuit film that may electrically connect the input sensing unit ISP to the main circuit board MCB.

[0095] The housing EDC can accommodate the display module DM. The housing EDC can be combined with the window WM to enhance the appearance of the display device DD. The housing EDC can absorb external impacts and prevent foreign matter and moisture from penetrating the display module DM, protecting the components housed within the housing EDC. Furthermore, the housing EDC can be provided in a manner that incorporates a receiving member.

[0096] Within the spirit and scope of the present disclosure, the display device DD according to the embodiment may include: an electronic module, including various multi-functional modules that can operate the display module DM; a power supply module, which can provide the power required for all operations of the display device DD; a bracket, which is connected to the display module DM and / or the housing EDC or connected to the display module DM and / or the housing EDC to divide the internal space of the display device DD, etc.

[0097] Figure 3A is a plan view of a display panel according to an embodiment. Figure 3B yes Figure 3A Exploded plan view of the display panel and flexible circuit film shown in .

[0098] refer to Figure 3A and Figure 3B The display panel DP may include an active area AA in which an image may be displayed and a non-active area NAA surrounding or adjacent to the active area AA. Pixels may be arranged in the active area AA. The non-active area NAA may include a pad area PDA in which a panel pad D-PD (also referred to as a display pad) may be arranged.

[0099] The pad area PDA may be a portion electrically connected to the flexible circuit film FCB and may include panel pads D-PD that may electrically connect the flexible circuit film FCB to the display panel DP. The panel pads D-PD may be electrically connected to corresponding pixels. Connection lines CL that may electrically connect the pixels to the panel pads D-PD may be provided in the non-active area NAA.

[0100] The active area AA may allow an image to be displayed therein and may be parallel to a plane defined by the first direction DR1 and the second direction DR2. For example, the display panel DP may be parallel to a plane defined by the third direction DR3 ( Figure 2 For convenience of explanation, a direction in which an image is provided on the display device DD may be defined as an upper direction, and an opposite direction to the upper direction may be defined as a lower direction.

[0101] The pad area PDA may be provided on at least one side of the active area AA. The pad area PDA may be an area in which the flexible circuit film FCB may be combined with the display panel DP. The display panel DP may be electrically connected to external electronic components such as the flexible circuit film FCB, the main circuit board MCB (e.g., the display panel DP), and the like through the panel pads D-PD provided in the pad area PDA. Figure 2 shown in ) etc.

[0102] The panel pads D-PD in the pad area PDA may be arranged or arranged in a first direction DR1. The panel pads D-PD may be inclined relative to a virtual reference line RL, which may be parallel to a second direction DR2 perpendicular to the first direction DR1. The reference line RL may be a virtual center line passing through the center of the pad area PDA. As an example, the panel pads D-PD may include a first pad group D-PG1 and a second pad group D-PG2. The first pad group D-PG1 may be arranged at a first side of the reference line RL, and the second pad group D-PG2 may be arranged at a second side of the reference line RL. Figure 3B In the embodiment of the present invention, the first side may be the left side of the reference line RL, and the second side may be the right side of the reference line RL. For ease of description, in the following description, the first side will be referred to as the left side, and the second side will be referred to as the right side. However, the first side and the second side are not limited thereto and may refer to the upper side and the lower side depending on the viewing direction.

[0103] The panel pads D-PD1 of the first pad group D-PG1 may be inclined at a first slope relative to the reference line RL, and the panel pads D-PD2 of the second pad group D-PG2 may be inclined at a second slope relative to the reference line RL. The first slope may correspond to an angle formed by an extension direction of the panel pads D-PD1 of the first pad group D-PG1 and an extension direction of the reference line RL, and the second slope may correspond to an angle formed by an extension direction of the panel pads D-PD2 of the second pad group D-PG2 and an extension direction of the reference line RL. In this specification, the value of the first slope and the value of the second slope may be positive values ​​and may correspond to acute angles.

[0104] The extension direction of the panel pads D-PD1 of the first pad group D-PG1 and the extension direction of the panel pads D-PD2 of the second pad group D-PG2 may cross or intersect each other. The absolute values ​​of the first slope and the second slope may be the same or substantially the same, and in this case, the first pad group D-PG1 and the second pad group D-PG2 may be symmetrically arranged based on the reference line RL.

[0105] The display panel DP may include a first alignment mark AM11 and a second alignment mark AM12. Figure 3B , a structure is shown by way of example in which the first alignment mark AM11 and the second alignment mark AM12 can be connected to the panel pads OM-PD1 and OM-PD2, and the panel pads OM-PD1 and OM-PD2 are positioned or set at the outermost of the panel pads D-PD, but the embodiment is not limited thereto. In other words, the first alignment mark AM11 and the second alignment mark AM12 can be positioned separately from the panel pad D-PD. The first alignment mark AM11 and the second alignment mark AM12 can align the display panel DP and the flexible circuit film FCB in the bonding process described later. As an example, a structure in which two alignment marks AM11 and AM12 can be provided to the display panel DP is described, but the number of alignment marks AM11 and AM12 is not limited thereto.

[0106] The panel pad D-PD may be formed to include a metal such as copper (Cu), silver (Ag), and gold (Au) or a metal oxide. For example, the panel pad D-PD may be formed to include at least one transparent metal oxide of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc tin oxide (ZTO), or antimony tin oxide (ATO).

[0107] refer to Figure 3A and Figure 3B The flexible circuit film FCB may include a connection pad C-PD, a first measurement pad M-PD1, and a second measurement pad M-PD2. The connection pad C-PD may be arranged or disposed in a first direction DR1 and may be inclined with respect to a reference line RL.

[0108] The connection pads C-PD may be arranged to correspond to the panel pads D-PD. The connection pads C-PD may include a first connection pad group C-PG1 and a second connection pad group C-PG2. The connection pads C-PD1 of the first connection pad group C-PG1 may be arranged to correspond to the panel pads D-PD1 of the first pad group D-PG1, and the connection pads C-PD2 of the second connection pad group C-PG2 may be arranged to correspond to the panel pads D-PD2 of the second pad group D-PG2.

[0109] The first measurement pad M-PD1 may be disposed adjacent to a first side of the connection pad C-PD, and the second measurement pad M-PD2 may be disposed adjacent to a second side of the connection pad C-PD. As an example, the first measurement pad M-PD1 may be disposed adjacent to the connection pad that is first positioned or disposed in the first direction DR1 among the connection pads C-PD1 of the first connection pad group C-PG1. The second measurement pad M-PD2 may be disposed adjacent to the connection pad that is last positioned or disposed in the first direction DR1 among the connection pads C-PD2 of the second connection pad group C-PG2. Therefore, the connection pad C-PD may be disposed between the first measurement pad M-PD1 and the second measurement pad M-PD2.

[0110] Here, the distance between the first measurement pad M-PD1 and the second measurement pad M-PD2 may be defined as a pitch Pt of the flexible circuit film FCB in the first direction DR1 (see Figure 4 , hereinafter referred to as a practical pitch). The practical pitch Pt of the flexible circuit film FCB may be a value to be used in a bonding process of the flexible circuit film FCB and the display panel DP, which will be described later.

[0111] The flexible circuit film FCB may include a dummy pad DM-PD disposed outside or adjacent to the connection pad C-PD. The dummy pad DM-PD may have a shape inclined relative to the reference line RL. As an example, the dummy pad DM-PD may include a first dummy pad DM-PD1 disposed adjacent to the first measurement pad M-PD1, and a second dummy pad DM-PD2 disposed adjacent to the second measurement pad M-PD2. The first dummy pad DM-PD1 may be parallel to the connection pad C-PD1 of the first connection pad group C-PG1, and the second dummy pad DM-PD2 may be parallel to the connection pad C-PD2 of the second connection pad group C-PG2.

[0112] The first and second measurement pads M-PD1 and M-PD2 and the connection pad C-PD may be disposed between the first and second dummy pads DM-PD1 and DM-PD2.

[0113] The flexible circuit film FCB may include a third alignment mark AM21 and a fourth alignment mark AM22. The third alignment mark AM21 and the fourth alignment mark AM22 may be provided or disposed at positions corresponding to the first alignment mark AM11 and the second alignment mark AM12, and may be aligned with the first alignment mark AM11 and the second alignment mark AM12 during the bonding process of the display panel DP and the flexible circuit film FCB.

[0114] In the following, reference will be made to Figures 4 to 5CThe bonding process of the display panel DP and the flexible circuit film FCB is described.

[0115] Figure 4 Yes Figure 3B An enlarged plan view of the panel pads of the display panel and the connection pads of the flexible circuit film shown in FIG. Figure 5A is a plan view showing a combined state of a display panel and a flexible circuit film according to an embodiment, Figure 5B is a plan view showing a combined state of a display panel and a flexible circuit film according to another embodiment, and Figure 5C is a plan view showing a combined state of a display panel and a flexible circuit film according to still another embodiment.

[0116] refer to Figure 4 To bond the display panel DP to the flexible circuit film FCB, the panel pads D-PD of the display panel DP and the connection pads C-PD of the flexible circuit film FCB can first be aligned. The panel pads D-PD and the connection pads C-PD can be aligned using the first and second alignment marks AM11 and AM12 of the display panel DP and the third and fourth alignment marks AM21 and AM22 of the flexible circuit film FCB. In other words, the displacements between the first and second alignment marks AM11 and AM12 of the display panel DP and the third and fourth alignment marks AM21 and AM22 of the flexible circuit film FCB can be aligned in the second direction DR2.

[0117] Even though the connection pads C-PD and the panel pads D-PD may be designed to correspond to each other, the displacement between the connection pads C-PD and the panel pads D-PD in the first direction DR1 may not match. For example, the flexible circuit film FCB may shrink or expand in the first direction DR1 due to the influence of temperature and humidity during the manufacturing process. The actual pitch Pt of the flexible circuit film FCB may be smaller or larger than the reference pitch Pr (see Figures 5A to 5C Here, the actual pitch Pt may be defined as a distance between the first measurement pad M-PD1 and the second measurement pad M-PD2.

[0118] The size of the actual pitch Pt may be compared with the size of the reference pitch Pr, and based on the comparison result, a correction value ΔY (hereinafter, Y-axis correction value) of the flexible circuit film FCB in the second direction DR2 may be calculated.

[0119] like Figure 5A As shown in , in the case where the actual pitch Pt and the reference pitch Pr may be the same in size, the Y-axis correction value ΔY may be substantially 0. In other words, the display panel DP and the flexible circuit film FCB may be bonded at a preset Y-axis position.

[0120] However, if Figure 5BAs shown in FIG, in the case where the actual pitch Pt may be smaller than the reference pitch Pr, the Y-axis correction value ΔY may have a positive value. In other words, the flexible circuit film FCB may move within the display panel DP along the second direction DR2 (for example, near the active area AA of the display panel DP (see FIG). Figure 3A ). Therefore, in the manufacturing process, if the actual pitch Pt may be smaller than the reference pitch Pr due to shrinkage of the flexible circuit film FCB, the connection pads C-PD may be combined with the panel pads D-PD accordingly. The Y-axis correction value ΔY may be set to the point at which the connection pads C-PD can maximize overlap with the corresponding panel pads D-PD.

[0121] like Figure 5C As shown in , in the case where the actual pitch Pt may be greater than the reference pitch Pr, the Y-axis correction value ΔY may have a negative value. In other words, the flexible circuit film FCB may move outside the display panel DP along the second direction DR2 (for example, in a direction away from the active area AA of the display panel DP). Therefore, in the manufacturing process, even if the actual pitch Pt may be greater than the reference pitch Pr due to the expansion of the flexible circuit film FCB, the connection pads C-PD may be combined with the panel pads D-PD accordingly. The Y-axis correction value ΔY may be set to the point where the connection pads C-PD can maximize the overlap with the corresponding panel pads D-PD.

[0122] Here, the Y-axis correction value ΔY may be determined based on the difference between the actual pitch Pt and the reference pitch Pr. If the actual pitch Pt may not be accurately measured, the Y-axis correction value ΔY may be incorrect, and thus, misalignment may occur between the flexible circuit film FCB and the display panel DP.

[0123] According to the present disclosure, the actual pitch Pt can be defined as the interval between the first measurement pad M-PD1 and the second measurement pad M-PD2. The measurement pads M-PD1 and M-PD2, which can measure the actual pitch Pt, can be provided or disposed on the flexible circuit film FCB. Therefore, the actual pitch Pt of the flexible circuit film FCB can be accurately measured. As a result, misalignment between the flexible circuit film FCB and the display panel DP can be prevented.

[0124] Figure 6 is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment.

[0125] refer to Figure 6 , the panel pad D-PD of the display panel DP according to the embodiment may be inclined with respect to a virtual reference line RL, and the virtual reference line RL may be parallel to a second direction DR2 perpendicular to the first direction DR1.

[0126] As an example, the panel pads D-PD may include a first pad group D-PG1, a second pad group D-PG2, a third pad group D-PG3, and a fourth pad group D-PG4. The first pad group D-PG1 and the third pad group D-PG3 may be disposed on a first side of the reference line RL, and the second pad group D-PG2 and the fourth pad group D-PG4 may be disposed on a second side of the reference line RL. Figure 6 , the first side may be defined as a left side of the reference line RL, and the second side may be defined as a right side of the reference line RL.

[0127] The panel pads D-PD1 of the first pad group D-PG1 may be inclined at a first slope relative to the reference line RL, and the panel pads D-PD3 of the third pad group D-PG3 may be inclined at a third slope relative to the reference line RL. The first slope may correspond to the angle formed by the extension direction of the panel pads D-PD1 of the first pad group D-PG1 and the extension direction of the reference line RL, and the third slope may correspond to the angle formed by the extension direction of the panel pads D-PD3 of the third pad group D-PG3 and the extension direction of the reference line RL. The magnitude of the first slope may be different from the magnitude of the third slope. For example, if the separation distance between the first pad group D-PG1 and the reference line RL is greater than the separation distance between the third pad group D-PG3 and the reference line RL, the first slope may be greater than the third slope. In other words, the panel pads D-PD3 of the third pad group D-PG3 may have a more inclined shape relative to a horizontal line perpendicular to the reference line RL (i.e., a line parallel to the first direction DR1) than the panel pads D-PD1 of the first pad group D-PG1.

[0128] The panel pads D-PD2 of the second pad group D-PG2 may be inclined at a second slope relative to the reference line RL, and the panel pads D-PD4 of the fourth pad group D-PG4 may be inclined at a fourth slope relative to the reference line RL. The second slope may correspond to the angle formed by the extension direction of the panel pads D-PD2 of the second pad group D-PG2 and the extension direction of the reference line RL, and the fourth slope may correspond to the angle formed by the extension direction of the panel pads D-PD4 of the fourth pad group D-PG4 and the extension direction of the reference line RL. The magnitude of the second slope may be different from the magnitude of the fourth slope. For example, if the separation distance between the second pad group D-PG2 and the reference line RL is greater than the separation distance between the fourth pad group D-PG4 and the reference line RL, the second slope may be greater than the fourth slope. In other words, the panel pads D-PD4 of the fourth pad group D-PG4 may have a shape that is more inclined relative to a horizontal line perpendicular to the reference line RL (i.e., a line parallel to the first direction DR1) than the panel pads D-PD2 of the second pad group D-PG2.

[0129] According to an embodiment, the flexible circuit film FCB may include a connection pad C-PD and first and second measurement pads M-PD1 and M-PD2.

[0130] The connection pads C-PD may be arranged to correspond to the panel pads D-PD. The connection pads C-PD may include a first connection pad group C-PG1, a second connection pad group C-PG2, a third connection pad group C-PG3, and a fourth connection pad group C-PG4. The third connection pad group C-PG3 may be arranged between the reference line RL and the first connection pad group C-PG1, and the fourth connection pad group C-PG4 may be arranged between the reference line RL and the second connection pad group C-PG2.

[0131] The connection pads C-PD1 of the first connection pad group C-PG1 may be arranged to correspond to the panel pads D-PD1 of the first pad group D-PG1, and the connection pads C-PD2 of the second connection pad group C-PG2 may be arranged to correspond to the panel pads D-PD2 of the second pad group D-PG2. The connection pads C-PD3 of the third connection pad group C-PG3 may be arranged to correspond to the panel pads D-PD3 of the third pad group D-PG3, and the connection pads C-PD4 of the fourth connection pad group C-PG4 may be arranged to correspond to the panel pads D-PD4 of the fourth pad group D-PG4.

[0132] The first measurement pad M-PD1 may be disposed adjacent to a first side of the connection pad C-PD, and the second measurement pad M-PD2 may be disposed adjacent to a second side of the connection pad C-PD. As an example, the first measurement pad M-PD1 may be disposed adjacent to the connection pad that is first positioned or disposed in the first direction DR1 among the connection pads C-PD1 of the first connection pad group C-PG1. The second measurement pad M-PD2 may be disposed adjacent to the connection pad that is last positioned or disposed in the first direction DR1 among the connection pads C-PD2 of the second connection pad group C-PG2. Therefore, the connection pad C-PD may be disposed between the first measurement pad M-PD1 and the second measurement pad M-PD2.

[0133] Here, the distance between the first measurement pad M-PD1 and the second measurement pad M-PD2 may be defined as a pitch Pt (hereinafter referred to as an actual pitch) of the flexible circuit film FCB in the first direction DR1. Figures 4 to 5C A process in which the actual pitch Pt of the flexible circuit film FCB may be used in the bonding process of the flexible circuit film FCB and the display panel DP is described, and thus, it is omitted to avoid redundancy.

[0134] exist Figure 6, a structure is shown in which two connection pad groups with different slopes can be respectively provided on the first and second sides of the reference line RL, but the embodiment is not limited thereto. In other words, three or more connection pad groups with different slopes can be provided on the first side of the reference line RL, and three or more connection pad groups with different slopes can be provided on the second side of the reference line RL.

[0135] Figure 7A is a plan view showing a film package according to an embodiment, Figure 7B Among them Figure 7A An enlarged plan view of portion AA is enlarged, and Figure 7C Among them Figure 7B An enlarged plan view in which portion BB is enlarged.

[0136] refer to Figure 4 、 7A to 7C , the film package FPG according to the embodiment may include a base film BF, a connection pad C-PD, a test pad T-PD, and first and second measurement pads M-PD1 and M-PD2.

[0137] Within the spirit and scope of the present disclosure, the base film BF may include a polymer material such as polyimide, polyester, etc. The base film BF may be flexible. When the base film BF is viewed in a plan view, sprocket holes SH may be arranged or provided in the edge of the base film BF along the second direction DR2.

[0138] The base film BF may include a first region and a second region. A cutting line CLL may be provided between the first region and the second region to define the first region. The cutting line CLL may be a virtual line. Figure 7A Only one first region is shown, but a plurality of first regions may be provided to the film package FPG, and the first regions may be arranged or disposed along the second direction DR2. The first region may be cut along the cutting line CLL and used as a flexible circuit film (eg, Figure 4 Hereinafter, the first area may be referred to as a cutting area CLA.

[0139] The second region may include a test area TSA. The test area TSA may be disposed adjacent to the cutting area CLA in the second direction DR2.

[0140] Connection pads C-PD may be provided on the cutting area CLA of the base film BF. The connection pads C-PD may be arranged or disposed in a first direction DR1 and may extend in a direction intersecting or intersecting the first direction DR1. For example, the connection pads C-PD may be inclined relative to a virtual reference line RL extending in a second direction DR2 perpendicular to the first direction DR1.

[0141] Test pads T-PD may be provided on the test area TSA of the base film BF. The test pads T-PD may be electrically connected to the connection pads C-PD, respectively. For example, the test pads T-PD may be electrically connected to the corresponding connection pads C-PD via extension lines extending from one or more ends of the connection pads C-PD.

[0142] The first measurement pad M-PD1 and the second measurement pad M-PD2 may be disposed on the cutting area CLA of the base film BF. The first measurement pad M-PD1 may be disposed adjacent to the connection pad C-PD that is located or disposed first in the first direction DR1. The second measurement pad M-PD2 may be disposed adjacent to the connection pad C-PD that is located or disposed last in the first direction DR1. Therefore, the connection pad C-PD may be disposed between the first measurement pad M-PD1 and the second measurement pad M-PD2.

[0143] Here, the distance between the first measurement pad M-PD1 and the second measurement pad M-PD2 can be measured to obtain the pitch Pt (hereinafter referred to as the actual pitch) of the flexible circuit film FCB in the first direction DR1. The actual pitch Pt of the flexible circuit film FCB can be used during the bonding process of the flexible circuit film FCB and the display panel DP.

[0144] The film package FPG may include a first dummy pad DM-PD1 and a second dummy pad DM-PD2 disposed outside or adjacent to the connection pad C-PD. The first dummy pad DM-PD1 may be disposed adjacent to the first measurement pad M-PD1, and the second dummy pad DM-PD2 may be disposed adjacent to the second measurement pad M-PD2. For ease of explanation, Figure 7B and Figure 7C Only the second measurement pad M-PD2 and the second dummy pad DM-PD2 are shown, but the first measurement pad M-PD1 and the first dummy pad DM-PD1 may have similar structures.

[0145] The second dummy pad DM-PD2 may extend parallel to the connection pad C-PD2 of the second connection pad group C-PG2. In other words, the second dummy pad DM-PD2 may have a shape inclined with respect to the reference line RL.

[0146] The second measurement pad M-PD2 may be disposed between the second dummy pad DM-PD2 and the connection pad C-PD2 of the second connection pad group C-PG2 However, the position of the second measurement pad M-PD2 is not limited thereto.

[0147] Hereinafter, other embodiments of the first measurement pad M-PD1 and the second measurement pad M-PD2 will be described in detail.

[0148] Figure 8A is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment, and Figure 8B : is an enlarged plan view of a panel pad of a display panel and a connection pad of a flexible circuit film according to an embodiment. Figure 8A and Figure 8B The components shown in Figures 3A to 5C The same elements as those shown in FIG. 1 are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0149] refer to Figure 8A According to an embodiment, the flexible circuit film FCB may include connection pads C-PD, first and second dummy pads DM-PD1 and DM-PD2, and first and second measurement pads M-PD1 and M-PD2.

[0150] The connection pad C-PD may be disposed between the first measurement pad M-PD1 and the second measurement pad M-PD2. The first dummy pad DM-PD1 may be disposed adjacent to the first connection pad in the first direction DR1 among the connection pads C-PD, and the second dummy pad DM-PD2 may be disposed adjacent to the last connection pad in the first direction DR1 among the connection pads C-PD.

[0151] The connection pads C-PD may have a shape inclined relative to the reference line RL. The connection pads C-PD may be divided into a first connection pad group C-PG1 including connection pads C-PD1 having a first slope relative to the reference line RL and a second connection pad group C-PG2 including connection pads C-PD2 having a second slope relative to the reference line RL.

[0152] The first dummy pad DM-PD1 may have a shape substantially parallel to the reference line RL or inclined with respect to the reference line RL. Figure 8A A structure is shown in which the first dummy pad DM-PD1 may be inclined at a first slope with respect to the reference line RL, but the structure is not limited thereto. The first dummy pad DM-PD1 may be disposed substantially parallel to the reference line RL.

[0153] The first measurement pad M-PD1 may be disposed between the first dummy pad DM-PD1 and the first connection pad group C-PG1. The first measurement pad M-PD1 may be disposed substantially parallel to the reference line RL. The first measurement pad M-PD1 may have a substantially rectangular shape extending in the second direction DR2.

[0154] The second dummy pad DM-PD2 may be substantially parallel to the reference line RL or inclined relative to the reference line RL. Figure 8A A structure is shown in which the second dummy pad DM-PD2 may be inclined at a second slope with respect to the reference line RL, but the structure is not limited thereto. The second dummy pad DM-PD2 may be disposed substantially parallel to the reference line RL.

[0155] The second measurement pad M-PD2 may be disposed between the second dummy pad DM-PD2 and the second connection pad group C-PG2. The second measurement pad M-PD2 may be disposed substantially parallel to the reference line RL. The second measurement pad M-PD2 may have a substantially rectangular shape extending in the second direction DR2.

[0156] Here, the distance between the first measurement pad M- PD1 and the second measurement pad M- PD2 may be defined as an actual pitch Pt1 of the flexible circuit film FCB.

[0157] refer to Figure 8B The first measurement pad M-PD1 may be disposed outside the first dummy pad DM-PD1. The first measurement pad M-PD1 may be disposed substantially parallel to the reference line RL. The first measurement pad M-PD1 may have a substantially rectangular shape extending in the second direction DR2.

[0158] The second measurement pad M-PD2 may be disposed outside the second dummy pad DM-PD2, may be disposed substantially parallel to the reference line RL, and may have a substantially rectangular shape extending in the second direction DR2.

[0159] The position of the first measurement pad M-PD1 and the position of the second measurement pad M-PD2 may not be limited to Figure 8A and Figure 8B For example, the first measurement pad M-PD1 may be positioned or disposed between the first dummy pads DM-PD1, and the second measurement pad M-PD2 may be positioned or disposed between the second dummy pads DM-PD2.

[0160] Here, the distance between the first measurement pad M-PD1 and the second measurement pad M-PD2 may be defined as the actual pitch Pt2 of the flexible circuit film FCB. In the case where the first measurement pad M-PD1 and the second measurement pad M-PD2 may be disposed outside compared to the dummy pads DM-PD1 and DM-PD2, Figure 8B The actual spacing Pt2 can be greater than Figure 8A The actual spacing Pt1.

[0161] Figure 9A is a plan view of a film package according to an embodiment, Figure 9B Among them Figure 9A An enlarged plan view of a portion CC is enlarged, Figure 9C Among them Figure 9B The enlarged plan view of part EE is enlarged. Figures 9A to 9C The components shown in 7A to 7C The same elements as those shown in FIG. 1 are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0162] refer to Figures 9A to 9C The film package FPG according to the embodiment may include a base film BF, a connection pad C-PD (refer to Figure 4 ), a test pad T-PD, and a first measurement pad M-PD3 and a second measurement pad M-PD4. However, the present disclosure is not limited thereto, and the first measurement pad and the second measurement pad may include other reference numerals within the spirit and scope of the present disclosure.

[0163] The connection pads C-PD may be disposed on the cutting area CLA of the base film BF. The connection pads C-PD may be arranged or disposed in a first direction DR1 and may extend in a direction intersecting or intersecting the first direction DR1. For example, the connection pads C-PD may be inclined relative to a virtual reference line RL extending in a second direction DR2 perpendicular to the first direction DR1.

[0164] The test pads T-PD may be provided on the test area TSA of the base film BF. The test pads T-PD may be electrically connected to the connection pads C-PD, respectively. For example, the test pads T-PD may be electrically connected to the corresponding connection pads C-PD via extension lines extending from one or more ends of the connection pads C-PD.

[0165] The first measurement pad M-PD3 and the second measurement pad M-PD4 may be disposed on the test area TSA of the base film BF. For example, the first measurement pad M-PD3 and the second measurement pad M-PD4 may be disposed between the test pad T-PD and the connection pad C-PD. The first measurement pad M-PD3 and the second measurement pad M-PD4 may be disposed closer to the connection pad C-PD than to the test pad T-PD.

[0166] The interval between the first measurement pad M-PD3 and the second measurement pad M-PD4 and the connection pad C-PD can be defined as a first interval d1, and the interval between the test pad T-PD and the connection pad C-PD can be defined as a second interval d2. The first interval d1 can be defined as the interval between the first measurement pad M-PD3 and the second measurement pad M-PD4 and the cutting line CLL. The first interval d1 may be smaller than the second interval d2. Here, the second interval d2 may be defined as the shortest distance between the test pad T-PD and the connection pad C-PD. As an example, the first interval d1 may have a value greater than about 0 μm and less than about 500 μm.

[0167] In order to accurately measure the flexible circuit film FCB (see Figure 2 ), the first measurement pad M-PD3 and the second measurement pad M-PD4 may be arranged to be closest to the cutting line CLL.

[0168] like Figures 9A to 9C As shown in FIG, the first measurement pad M-PD3 and the second measurement pad M-PD4 may have a substantially rectangular shape extending in the second direction DR2. However, the shapes of the first measurement pad M-PD3 and the second measurement pad M-PD4 are not limited thereto. The first measurement pad M-PD3 and the second measurement pad M-PD4 may have a substantially square shape and have a greater width than the connection pad C-PD in the first direction DR1.

[0169] Figure 10 is a graph comparing the process error of the film package according to the embodiment with the process error of the existing film package. Figure 10 , the first graph G1 shows the distance between the first comparison measurement pad and the second comparison measurement pad (not shown) when the first comparison measurement pad and the second comparison measurement pad can be positioned or set outside compared to the test pad T-PD. The second graph G2 shows the distance between the first measurement pad M-PD3 and the second measurement pad M-PD4 when the first measurement pad M-PD3 and the second measurement pad M-PD4 can be positioned or set at a point having a first interval d1 from the cutting line CLL (refer to FIG. Figure 9A In the first graph G1, the first and second comparison measurement pads may be separated from the cutting line CLL by an interval of about 6 mm to about 7 mm, and in the second graph G2, the first and second measurement pads M-PD3 and M-PD4 may be separated from the cutting line CLL by an interval of about 300 μm.

[0170] refer to Figure 10 , Flexible Circuit Film FCB (see Figure 3A) can be within the reference range Rf. Here, the actual spacing can be defined as the connection pad C-PD (see Figure 3B ) is a distance between a first connection pad and a last connection pad in the reference range Rf. As an example, a minimum value LSL of the reference range Rf may be approximately 43978.7 μm, and a maximum value USL may be approximately 43992.7 μm.

[0171] According to the first curve graph G1, in a case where the first comparison measurement pad and the second comparison measurement pad can be positioned or set on the outside compared to the test pad T-PD, in all ten measurements, except the first measurement, the measured distance between the first comparison measurement pad and the second comparison measurement pad in nine measurements showed a value outside the reference range Rf or adjacent to the reference range Rf.

[0172] However, according to the second graph G2, when the first measurement pad M-PD3 and the second measurement pad M-PD4 can be separated from the cutting line CLL by approximately 300 μm, in all ten measurements, the distance between the first measurement pad M-PD3 and the second measurement pad M-PD4 shows a value within the reference range Rf.

[0173] In other words, since the first and second measurement pads M-PD3 and M-PD4 may be closer to the cutting line CLL, the distance between the first and second measurement pads M-PD3 and M-PD4 shows substantially the same value as the actual pitch of the flexible circuit film FCB.

[0174] In the case where the first measurement pad M-PD3 and the second measurement pad M-PD4 can be set outside the cutting line CLL or adjacent to the cutting line CLL, the first measurement pad M-PD3 and the second measurement pad M-PD4 can be set between the test pad T-PD and the connection pad C-PD and set closer to the cutting line CLL than to the test pad T-PD.

[0175] Therefore, an error between an actual pitch of the flexible circuit film FCB and a measured distance between the first and second measurement pads M-PD3 and M-PD4 may be minimized, and thus, misalignment between the flexible circuit film FCB and the display panel DP may be prevented.

[0176] According to this embodiment, a measurement pad capable of measuring the actual pitch of the flexible circuit film can be provided or set to the flexible circuit film, thereby accurately measuring the actual pitch of the flexible circuit film. In the case where the measurement pad capable of measuring the actual pitch of the flexible circuit film can be set outside or adjacent to the cutting line, the measurement pad can be set between the test pad and the cutting line, thereby measuring a value close to the actual pitch of the flexible circuit film.

[0177] Therefore, misalignment between the flexible circuit film and the display panel can be prevented, and thus connection reliability between the flexible circuit film and the display panel can be improved.

[0178] Although the embodiments have been described, it should be understood that the present disclosure should not be limited to these embodiments, but various changes and modifications may be made by one skilled in the art within the spirit and scope of the present disclosure as claimed in the appended claims.

Claims

1. Display device, including: The display panel includes a display area for displaying an image and a pad area at least provided on one side of the display area; as well as A flexible circuit film is electrically connected to the pad area, the flexible circuit film comprising: a plurality of connection pads arranged in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction; a first measurement pad disposed adjacent to a first side of the plurality of connection pads in the first direction; and a second measurement pad disposed adjacent to a second side of the plurality of connection pads in the first direction; wherein the plurality of connection pads are arranged between the first measurement pad and the second measurement pad, and wherein the distance between the first measurement pad and the second measurement pad is measured as the actual pitch of the flexible circuit film, In the bonding process of the display panel and the flexible circuit film, the actual distance is used to correct the position of the flexible circuit film in the second direction.

2. The display device according to claim 1, wherein The flexible circuit film comprises: a dummy pad, disposed adjacent to the plurality of connection pads, Wherein, the dummy pad is inclined relative to the reference line.

3. The display device according to claim 2, wherein The dummy pad includes: a first dummy pad disposed between the first measurement pad and a connection pad disposed first in the first direction among the plurality of connection pads; and The second dummy pad is disposed between the second measurement pad and a connection pad that is last disposed in the first direction among the plurality of connection pads.

4. The display device according to claim 2, wherein The dummy pad includes: a first dummy pad, disposed adjacent to the first measurement pad; and The second dummy pad is disposed adjacent to the second measurement pad.

5. The display device according to claim 2, wherein The first measurement pad and the second measurement pad are parallel to the reference line.

6. The display device according to claim 1, wherein The plurality of connection pads include: a first connection pad group having a first slope with respect to the reference line and comprising a first connection pad disposed at a first side of the reference line; and The second connection pad group has a second slope with respect to the reference line and includes second connection pads disposed at a second side of the reference line.

7. The display device according to claim 6, wherein The plurality of connection pads further include: a third connection pad group having a third slope relative to the reference line and disposed between the reference line and the first connection pad group; and The fourth connection pad group has a fourth slope relative to the reference line and is disposed between the reference line and the second connection pad group.

8. The display device according to claim 7, wherein The first slope is greater than the third slope, and The second slope is greater than the fourth slope.

9. The display device according to claim 1, wherein Each of the first measurement pad and the second measurement pad has a rectangular shape in a plan view.

10. The display device according to claim 1, wherein The display panel includes a plurality of display pads, and the plurality of display pads are arranged in the pad region to correspond to the plurality of connection pads. Wherein, the plurality of display pads are inclined relative to the reference line.

11. The display device according to claim 1 , further comprising: A driving chip is provided on the flexible circuit film, and the driving chip outputs a driving signal for driving the display panel. The driving signal is provided to the display panel through the plurality of connecting pads.

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