Chip flip packaging equipment and chip flipping method

Abstract

The present application discloses a chip flip-chip packaging device and a chip flip-chip method. The chip flip-chip packaging device includes a binding platform and a gripping member arranged opposite to the binding platform, the binding platform is used to fix the target binding object, the gripping member is used to grip the chip and attach the chip to the target binding object, and the gripping member is provided with a gripping surface on the side facing the binding platform, and the gripping surface is used to carry the chip; the chip flip-chip packaging device also includes a first horizontal sensor, a first driving member and a controller, the first horizontal sensor is embedded in the gripping member, and is used to detect the horizontality of the gripping surface, the first driving member is used to drive the gripping member to move and / or rotate, the controller couples the first driving member and the first horizontal sensor, and the controller is used to control the first driving member according to the detection value of the first horizontal sensor. The chip flip-chip packaging device provided by the present application does not require manual operation during the process of debugging the chip horizontality, thereby realizing the automation of the horizontality debugging of the chip flip-chip packaging device.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip flip packaging device and a chip flip method. Background Art

[0002] Semiconductor chips are widely used in various electronic products, and are generally packaged using flip-chip packaging equipment. In the prior art, the semiconductor chip flip-chip packaging equipment cannot synchronously detect the levelness index of the flip-chip semiconductor chip during the process of flip-chip packaging on the target binding object. The tester needs to repeatedly debug and calibrate the flip-chip packaging equipment to make the semiconductor chip to be packaged reach the levelness index. Therefore, the debugging and calibration process of the flip-chip packaging equipment is difficult to automate. Summary of the invention

[0003] In view of the fact that the existing chip flip packaging equipment cannot realize automation in the debugging process of the chip level, the present application provides a chip flip packaging equipment. The chip flip packaging equipment includes a level sensor and a driving component. The level sensor is used to detect the level of the gripping component in the chip flip packaging equipment. The driving component can drive and adjust the level of the gripping component in the chip flip packaging equipment, so that the chip flip packaging equipment can realize automatic debugging of the chip level, saving labor costs. The present application also provides a chip flipping method.

[0004] In a first aspect, the present application provides a chip flip packaging device. The chip flip packaging device includes a binding platform and a gripper disposed opposite to the binding platform, the binding platform is used to fix a target binding object, the gripper is used to grip a chip and attach the chip to the target binding object, the gripper is provided with a gripping surface on one side facing the binding platform, and the gripping surface is used to carry the chip;

[0005] The chip flip-chip packaging equipment also includes a first horizontal sensor, a first driving member and a controller. The first horizontal sensor is embedded in the gripping member and is used to detect the horizontality of the gripping surface. The first driving member is used to drive the gripping member to move and / or rotate. The controller is coupled to the first driving member and the first horizontal sensor. The controller is used to control the first driving member according to the detection value of the first horizontal sensor.

[0006] In an embodiment of the present application, the gripping member in the chip flip-chip packaging equipment is provided with a first horizontal sensor and a first driving member. The first driving member can adjust the horizontality of the gripping member according to the detection data of the first horizontal sensor to ensure the horizontality of the gripping surface. During this process, there is no need for testers to debug and calibrate the chip flip-chip packaging equipment, thereby realizing the automation of the chip flip-chip packaging equipment and saving labor costs.

[0007] In one embodiment, the first driving member includes a motor and a driving rod, one end of the driving rod is connected to the motor, and the other end of the driving rod is connected to the gripping member, and the motor is used to drive the driving rod to move.

[0008] In the embodiment of the present application, the motor is used to drive the driving rod to move, so that the first driving member can drive the grabbing member to move in various directions, thereby being able to more accurately adjust the horizontality of the chip.

[0009] In one embodiment, the flip chip packaging device further includes a carrying surface, the carrying surface is used to carry the first level sensor, and the carrying surface is parallel to the grabbing surface.

[0010] In an embodiment of the present application, the gripping surface is parallel to the bearing surface of the first horizontal sensor, so that the horizontal value detected by the first horizontal sensor can represent the horizontality of the gripping surface, and the chip is installed on the gripping surface, so that the horizontality of the gripping surface is the same as the horizontality of the chip, so that the horizontal value detected by the first horizontal sensor can reflect the horizontality of the chip grasped by the gripping member.

[0011] In one embodiment, the binding platform is provided with a binding surface on one side facing the grabbing member, and when the target binding object is fixed to the binding platform, one side of the target binding object is attached to the binding surface, and the other side faces the grabbing member;

[0012] The chip flip packaging equipment also includes a second level sensor and a second driving member. The second level sensor is embedded in the binding platform and is used to detect the horizontality of the binding surface. The controller couples the second driving member and the second level sensor. The controller is used to control the second driving member according to the detection value of the second level sensor to ensure the horizontality of the binding surface.

[0013] In the embodiment of the present application, the binding platform in the chip flip packaging device is provided with a second level sensor and a second driving member, and the second driving member can adjust the level of the binding platform according to the detection data of the second level sensor to ensure the level of the binding surface. In the embodiment of the present application, not only the level of the gripping surface is ensured, but also the level of the binding platform is ensured, that is, not only the level of the chip is ensured, but also the level of the target binding object is ensured, thereby further improving the level of the chip when it is packaged in the target binding object.

[0014] In one embodiment, the chip flip-chip packaging equipment also includes a three-dimensional imaging sensor, which is embedded in the binding platform, and the sensing surface of the three-dimensional imaging sensor is exposed relative to the binding platform; when the chip is attached to the target binding object, the sensing surface of the three-dimensional imaging sensor faces the chip.

[0015] In the embodiment of the present application, the chip flip packaging equipment also includes a three-dimensional imaging sensor, which can correct the horizontality of the chip relative to the target binding object before the chip is bound and solidified on the target binding object, so as to avoid the chip relative to the target binding object not meeting the requirements after the chip is bound and solidified on the target binding object, thereby avoiding material waste and improving the yield rate of the chip packaged by the chip flip packaging equipment. In addition, in the embodiment of the present application, the chip flip packaging equipment does not require manual operation in the debugging and correction process of the chip, realizing the automation of the chip flip packaging equipment debugging and correction process of the chip.

[0016] In one embodiment, the three-dimensional imaging sensor includes a light emitting end and a light receiving end spaced apart from the light emitting end, the light emitting end is used to emit detection light to the object to be measured, and the light receiving end is used to receive the detection light reflected back by the object to be measured.

[0017] In this embodiment, the three-dimensional imaging sensor is a TOF camera sensor, so that the chip flip-chip packaging equipment uses the emerging three-dimensional imaging technology to measure the distance between the working surface of the chip and the mounting surface of the target binding object, so as to avoid the situation where the first horizontal sensor and the second horizontal sensor both meet the horizontality requirement, but the distance between the working surface of the chip and the mounting surface of the target binding object still exceeds the standard and cannot maintain the same horizontal plane. At this time, the horizontal target values ​​of the first horizontal sensor and the second horizontal sensor are set for deviation compensation through the measurement value of the TOF camera sensor to ensure that the working surface of the measured chip and the mounting surface of the target binding object are in the same horizontal plane, thereby effectively ensuring that the horizontality of the chip installed on the target binding object meets the standard and improving the reliability of the chip flip-chip packaging equipment.

[0018] In a second aspect, the present application provides a chip flipping method. The chip flipping method is used to bind and package the chip to a target binding object, and the method includes:

[0019] Grab the chip;

[0020] A first level sensor automatically detects the level of the chip;

[0021] When the level of the chip does not reach the first target level value, the first driving member automatically adjusts the level of the chip.

[0022] In an embodiment of the present application, in the chip packaging method, the first level sensor can automatically detect the levelness of the packaged chip, and the first driving member can automatically adjust the chip whose levelness has not reached the target value according to the detection value of the first level sensor, so as to ensure that the levelness of the chip is within the target value range before the chip is bound and solidified on the target binding object, and in the process of measuring and adjusting the chip levelness, there is no need for testers to debug the chip flip-chip packaging equipment, thereby realizing the automation of chip levelness debugging of the chip packaging method and saving labor costs.

[0023] In one embodiment, before the first level sensor automatically detects the levelness of the chip and after grabbing the chip, the method further includes:

[0024] The chip is placed in the area to be bound so that the chip and the target binding object are arranged opposite to each other.

[0025] In this embodiment, the chip packaging method adjusts the levelness of the chip when the chip is in the area to be bound, so as to avoid the problem of low chip binding efficiency caused by adjusting the levelness of the chip too early. For example, the levelness of the chip is adjusted to the first target level value before the chip enters the area to be bound, but the levelness of the chip may still change during the process of transferring the chip to the area to be bound. Therefore, the levelness of the chip needs to be readjusted, so that the chip packaging method needs to adjust the levelness of the chip multiple times, resulting in low efficiency of the chip packaging method.

[0026] In one embodiment, before the first level sensor automatically detects the levelness of the chip, the method further includes:

[0027] The second level sensor automatically detects the level of the target binding object;

[0028] When the level of the target binding object does not reach the second target level value, the second driving member automatically adjusts the level of the target binding object so that the level of the target binding object reaches the second target level value.

[0029] In one embodiment, after the first driving member automatically adjusts the horizontality of the chip, the method further includes:

[0030] When the level of the chip reaches the first target level value, and the level of the target binding object reaches the second target level value, the chip is bound and packaged in the target binding object.

[0031] In the embodiment of the present application, the flip-chip method can not only automatically detect the horizontality of the chip, but also automatically detect the horizontality of the target binding object of the chip. After ensuring the horizontality of the chip and the target binding object, the chip is bound and packaged on the target binding object, thereby avoiding the horizontality of the chip not meeting the requirement when it is flipped and fixed on the target binding object, thereby further improving the horizontality of the chip when it is packaged in the target binding object, and further improving the yield of the chip packaging method.

[0032] In one embodiment, after the first driving member automatically adjusts the horizontality of the chip, the method further includes:

[0033] Detecting a flatness difference between a working surface of the chip and a mounting surface of the target binding object, wherein the working surface of the chip is a side of the chip facing the target binding object, and the mounting surface of the target binding object is a side of the target binding object attached to the binding platform;

[0034] When the flatness difference is greater than a target difference, the levelness of the chip or the target binding object is adjusted so that the flatness difference reaches the target difference.

[0035] In one embodiment, the flatness difference between the working surface of the chip and the mounting surface of the target binding object is detected by a TOF camera sensor. For example, the distance between the working surface of the chip and the mounting surface of the target binding object is detected respectively, and the flatness difference between the working surface and the mounting surface is obtained by obtaining multiple distances between the working surface and the mounting surface.

[0036] In this embodiment, the flatness difference between the working surface of the chip and the mounting surface of the target binding object is detected to avoid the situation where the first horizontal sensor and the second horizontal sensor both meet the horizontality requirement, but the flatness between the working surface of the chip and the mounting surface of the target binding object still exceeds the standard and cannot maintain the same horizontal plane. At this time, the horizontal target values ​​of the first horizontal sensor and the second horizontal sensor are set for deviation compensation through the measurement value of the TOF camera sensor to ensure that the working surface of the measured chip and the mounting surface of the target binding object are in the same horizontal plane, thereby effectively ensuring that the horizontality of the chip installed on the target binding object meets the standard and improving the reliability of the chip flip-chip packaging equipment.

[0037] It is understandable that before the chip is bound and packaged in the target binding object, the levelness of the chip relative to the target binding object has met the requirements, so as to avoid the situation where the levelness of the chip relative to the target binding object does not meet the requirements after the chip is bound and packaged in the target binding object, thereby causing waste of raw materials.

[0038] In one embodiment, the method further comprises:

[0039] When the flatness difference is less than or equal to the target difference, the chip is bound and packaged on the target binding object.

[0040] In an embodiment of the present application, before the chip is bound and cured on the target binding object, the levelness of the chip relative to the target binding object is corrected to avoid the situation where the levelness of the chip relative to the target binding object does not meet the requirements after the chip is bound and cured on the target binding object, thereby avoiding waste of materials and improving the yield of the chip packaging method. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying any creative work.

[0042] Figure 1 is a schematic structural diagram of a chip flip-chip packaging device provided in an embodiment of the present application;

[0043] Figure 2 yes Figure 1 The exploded structure diagram of the packaging assembly in the first embodiment is shown;

[0044] Figure 3 yes Figure 2 A schematic diagram of the structure of the package assembly shown in a working state;

[0045] Figure 4 yes Figure 3 A schematic diagram of the structure shown at another angle;

[0046] Figure 5 yes Figure 1 The structural schematic diagram of the packaging assembly in the second embodiment is shown;

[0047] Figure 6 yes Figure 5 A schematic cross-sectional view of the structure shown;

[0048] Figure 7 yes Figure 6 An enlarged schematic diagram of the structure A portion shown;

[0049] Figure 8 is a schematic flow chart of a chip packaging method provided by the present application in a first embodiment;

[0050] Fig. 9 is a schematic flow chart of a chip packaging method provided by the present application in a second embodiment;

[0051] Fig.10It is a schematic flow chart of the chip packaging method provided by the present application in the third embodiment. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0053] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of a chip flip packaging device provided in an embodiment of the present application. The embodiment of the present application provides a chip flip packaging device 100. The chip flip packaging device 100 includes a housing 101 and a packaging component 102. The packaging component 102 of the chip flip packaging device 100 is used to bind the chip to a target binding object. For example, when the chip is a sensor in a camera module and the target binding object is a circuit board or a ceramic substrate, the chip flip packaging device 100 is used to bind the sensor to the circuit board or the ceramic substrate.

[0054] The packaging component 102 is located in the housing 101. The housing 101 can keep the chip binding process in a closed state, avoiding the external environment from interfering with the chip packaging process, thereby improving the reliability of chip packaging.

[0055] Please also read Figure 2 and Figure 3 , Figure 2 yes Figure 1 The exploded structure diagram of the package assembly 102 in the first embodiment is shown; Figure 3 yes Figure 2 The schematic diagram of the structure of the packaging component 102 in a working state is shown. The packaging component 102 includes a binding platform 21 and a gripper 22 arranged opposite to the binding platform 21. That is, the chip flip packaging device 100 has a binding platform 21 and a gripper 22 arranged opposite to the binding platform 21. Among them, the packaging component 102 is located in the housing 101, that is, the binding platform 21 and the gripper 22 are both located in the housing 101.

[0056] The binding platform 21 is used to fix the target binding object 10. The grabbing member 22 is used to grab the chip 20 and attach the chip 20 to the target binding object 10. Figure 3 As shown, the target binding object 10 is fixed on the binding platform 21 , and the chip 20 is fixed on the grabbing member 22 .

[0057] The grabber 22 can act as a manipulator to grab the chip 20 in the storage area of ​​the chip 20 and transfer the grabbed chip 20 to the area to be bound of the chip 20. It can be understood that the storage area of ​​the chip 20 and the area to be bound of the chip 20 are spaced apart.

[0058] The packaging assembly 102 further includes a first level sensor 23, a first driving member 24 and a controller (not shown in the figure). That is, the chip flip packaging device 100 further includes a first level sensor 23, a first driving member 24 and a controller. The first level sensor 23 is embedded in the gripping member 22 to detect the levelness of the gripping member 22.

[0059] Among them, Figure 3 As shown, a gripping surface 221 is provided on one side of the gripping member 22 facing the binding platform 21. The gripping surface 221 is used to carry the chip 20. That is, when the gripping member 22 grabs the chip 20, one side of the chip 20 is attached to the gripping surface 221. The horizontality can represent the angle difference between the gripping surface 221 and the horizontal plane.

[0060] It can be understood that the first level sensor 23 detecting the level of the gripping member 22 is equivalent to detecting the level of the gripping surface 221. Since when the gripping member 22 grips the chip 20, the chip 20 is carried on the gripping surface 221, so that the level of the chip 20 is the same as the level of the gripping surface 221, in the embodiment of the present application, the first level sensor 23 can be used to detect the level of the chip 20.

[0061] The first driving member 24 is used to drive the grabbing member 22 to move and / or rotate. The controller is coupled to the first driving member 24 and the first level sensor 23. The controller is used to control the first driving member 24 according to the detection value of the first level sensor 23.

[0062] It can be understood that the level value detected by the first level sensor 23 can be transmitted to the controller, and the controller can calculate the received level value and output a control signal to the driving member, so that the driving member drives the grabbing member 22 to move, so as to adjust the level of the grabbing member 22. That is, the controller is used to control the direction in which the first driving member 24 drives the grabbing member 22 to move according to the detection value of the first level sensor 23, so that the level of the grabbing member 22 reaches the target value.

[0063] On the one hand, in the embodiment of the present application, the gripping member 22 in the chip flip-chip packaging device 100 is provided with a first horizontal sensor 23 and a first driving member 24. The first driving member 24 can adjust the horizontality of the gripping member 22 according to the detection data of the first horizontal sensor 23 to ensure the horizontality of the gripping surface 221. During this process, there is no need for testers to debug the chip flip-chip packaging device 100, thereby realizing the automation of the chip flip-chip packaging device 100 for debugging the chip 20 horizontality and saving labor costs.

[0064] On the other hand, in the embodiment of the present application, the chip flip-chip packaging device 100 does not need to be repeatedly debugged and calibrated. Instead, the levelness of the chip 20 is adjusted before the chip 20 is packaged and cured, thereby avoiding the phenomenon that the levelness of the chip 20 does not meet the requirements after the chip 20 is packaged and cured, thereby improving the yield of the chip 20 packaged by the chip flip-chip packaging device 100 and avoiding material waste.

[0065] In one embodiment, the controller is connected to the first level sensor 23 via a cable, and the controller is also connected to the driving member via a cable. Signals between the controller and the first level sensor 23 and between the controller and the driving member are transmitted via the cable.

[0066] When the controller receives the detection value of the first horizontal sensor 23, it first judges the detection value of the first horizontal sensor 23. When the controller judges that the detection value is not within the first target horizontal value range, that is, when the horizontality of the chip 20 deviates, the controller calculates the offset of the first driving member 24 based on the deviation.

[0067] In the embodiment of the present application, when the levelness of the chip 20 deviates, the controller calculates the offset of the first driving member 24 corresponding to the deviation, so as to avoid the controller still calculating the offset of the first driving member 24 when the levelness of the chip 20 meets the requirements, thereby reducing the operation of the controller. It can be understood that when the levelness of the chip 20 meets the requirements, the controller calculates that the offset of the first driving member 24 is zero.

[0068] Please continue reading Figure 2 and Figure 3 In one embodiment, the first driving member 24 includes a motor 241 and a driving rod 242. The motor 241 is used to drive the driving rod 242 to move. The motor 241 can drive the grabbing member 22 to move in the left and right directions and the up and down directions, so that the grabbing member 22 can move in all directions. One end of the driving rod 242 is connected to the motor 241. The other end of the driving rod 242 is connected to the inside of the grabbing member 22.

[0069] It can be understood that the driving rod 242 is located on a side of the motor 241 close to the gripping member 22, and the driving rod 242 is connected to the gripping member 22. In the embodiment of the present application, the motor 241 drives the driving rod 242 to move, so that the first driving member 24 can drive the gripping member 22 to move in various directions, thereby being able to more accurately adjust the levelness of the chip 20.

[0070] Furthermore, a binding surface 211 is provided on one side of the binding platform 21 facing the gripping member 22. When the target binding object 10 is fixed to the binding platform 21, one side of the target binding object 10 is attached to the binding surface 211, and the other side faces the gripping member 22. The flip chip packaging device 100 also includes a second horizontal sensor 25 and a second driving member 26. The second horizontal sensor 25 is embedded in the binding platform 21, and is used to detect the horizontality of the binding surface 211. The controller couples the second driving member 26 and the second horizontal sensor 25. The controller is used to control the second driving member 26 according to the detection value of the second horizontal sensor 25 to ensure the horizontality of the binding surface 211.

[0071] It can be understood that in the embodiment of the present application, the binding platform 21 and the grabbing member 22 are separate and independent components. The first driving member 24 is used to adjust the grabbing member 22 according to the horizontality of the grabbing member 22 to ensure the horizontality of the grabbing surface 221, and the second driving member 26 is used to adjust the binding platform 21 according to the horizontality of the binding surface 211 to ensure the horizontality of the binding surface 211.

[0072] In the embodiment of the present application, the binding platform 21 in the chip flip-chip packaging device 100 is provided with a second level sensor 25 and a second driving member 26. The second driving member 26 can adjust the level of the binding platform 21 according to the detection data of the second level sensor 25 to ensure the level of the binding surface 211. In the embodiment of the present application, not only the level of the gripping surface 221 is ensured, but also the level of the binding platform 21 is ensured, that is, not only the level of the chip 20 is ensured, but also the level of the target binding object 10 is ensured, thereby further improving the level of the chip 20 when it is packaged in the target binding object 10.

[0073] Among them, in the embodiment of the present application, the example in which the binding platform 21 and the grabbing member 22 of the chip flip-chip packaging device 100 are both provided with a horizontal sensor and a driving member is used for description. In other embodiments, the binding platform 21 may not be provided with a horizontal sensor and a driving member, and only a horizontal sensor and a driving member are provided in the grabbing member 22. For example, when the binding platform 21 is fixed relative to the grabbing member 22, that is, the target binding object 10 fixed to the binding platform 21 is fixed relative to the chip 20, at this time, only the horizontality of the grabbing member 22 is adjusted to adjust the horizontality of the chip 20 when it is bound to the target binding object 10.

[0074] For further information, please refer to Figure 3 and Figure 4 , Figure 4 yes Figure 3 The structure shown is a schematic diagram of the structure at another angle. The chip flip packaging device 100 also includes a carrying surface 110. The carrying surface 110 is used to carry the first horizontal sensor 23. The carrying surface 110 is parallel to the gripping surface 221. It can be understood that the first horizontal sensor 23 is parallel to the gripping surface 221.

[0075] Among them, the gripping surface 221 is parallel to the carrying surface 110 carrying the first horizontal sensor 23, so that the horizontal value detected by the first horizontal sensor 23 can represent the horizontality of the gripping surface 221, and the chip 20 is installed on the gripping surface 221, so that the horizontality of the gripping surface 221 is the same as the horizontality of the chip 20, so that the horizontal value detected by the first horizontal sensor 23 can reflect the horizontality of the gripping member 22 grasping the chip 20.

[0076] In the embodiment of the present application, the level value checked by the first level sensor 23 is equivalent to the level of the gripping surface 221 . Since the chip 20 is installed on the gripping surface 221 , the level value detected by the first level sensor 23 can represent the level of the gripping member 22 gripping the chip 20 .

[0077] like Figure 4 As shown, in one embodiment, the first horizontal sensor 23 is located on a side of the gripping surface 221 away from the binding platform 21. It can be understood that the first horizontal sensor 23 is located on a side of the gripping member 22 away from the binding platform 21.

[0078] In the embodiment of the present application, the first horizontal sensor 23 is located on the side opposite to the gripping surface 221, leaving space for the gripping member 22 facing the binding platform 21, so as to prevent the first horizontal sensor 23 from interfering with the movement of the gripping member 22 when the gripping member 22 attaches the chip 20 to the target binding object 10, thereby ensuring the reliability of the chip flip-chip packaging device 100.

[0079] For further information, see Figures 5 to 7 , Figure 5 yes Figure 1 The structure diagram of the packaging component 102 in the second embodiment is shown in FIG. Figure 6 yes Figure 5 A schematic cross-sectional view of the structure shown; Figure 7 yes Figure 6 The enlarged structural diagram of the structure A part is shown. The following mainly describes the difference between this embodiment and the first embodiment, and most of the technical contents of this embodiment that are the same as the first embodiment will not be repeated in the following text.

[0080] The flip chip packaging device 100 further includes a 3D imaging sensor 27. The 3D imaging sensor 27 is embedded in the binding platform 21, and the sensing surface of the 3D imaging sensor 27 is exposed relative to the binding platform 21. When the chip 20 is attached to the target binding object 10, the sensing surface of the 3D imaging sensor 27 faces the chip 20.

[0081] When the chip 20 is to be bound and cured on the target binding object 10, the three-dimensional imaging sensor 27 can perform a three-dimensional scan on the surface of the chip 20 and the target binding object 10 to detect the level of the chip 20 relative to the target binding object 10. For example, the three-dimensional imaging sensor 27 can perform a three-dimensional scan on the chip 20 and the target binding object 10 to obtain the distance between the surface of the chip 20 and the surface of the target binding object 10, and then determine the level of the chip 20 relative to the target binding object 10.

[0082] Among them, Figure 7 As shown, the chip 20 is accommodated in the accommodating space in the target binding object 10 , which indicates that the chip 20 is in the waiting area for binding, and the chip 20 is waiting to be bound and cured on the target binding object 10 .

[0083] It can be understood that when the first driving member 24 and the second driving member 26 drive the gripping member 22 and the binding platform 21 to move respectively, it is the debugging process of the chip flip packaging device 100 flipping the chip 20 on the target binding object 10, and the three-dimensional imaging sensor 27 is the calibration process when the chip flip packaging device 100 flips the chip 20 on the target binding object 10. The calibration process is before the chip 20 is bound and cured on the target binding object 10.

[0084] In the second embodiment of the present application, the chip flip packaging device 100 further includes a three-dimensional imaging sensor 27, which can correct the level of the chip 20 relative to the target binding object 10 before the chip 20 is bound and cured on the target binding object 10, so as to avoid the chip 20 relative to the target binding object 10 not meeting the level requirement after the chip 20 is bound and cured on the target binding object 10, thereby avoiding waste of materials and improving the yield of the chip 20 packaged by the chip flip packaging device 100. In addition, in the second embodiment of the present application, the chip flip packaging device 100 does not require manual operation for the debugging and calibration process of the chip 20, thus realizing the automation of the debugging and calibration process of the chip 20 by the chip flip packaging device 100.

[0085] In one embodiment, the three-dimensional imaging sensor 27 is used to monitor the distance between the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10. Figure 7 As shown, the working surface 201 of the chip 20 is the side of the chip 20 facing the target binding object 10, and the mounting surface 301 of the target binding object 10 is the side of the target binding object 10 attached to the binding platform 21. That is, the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10 have the same orientation, both facing the three-dimensional imaging sensor 27.

[0086] It is understandable that the working surface 201 of the chip 20 is arranged opposite to the gripping surface 221. When the chip 20 is a sensor in a camera module, the working surface 201 of the chip 20 is a photosensitive surface; when the target binding object 10 is a circuit board, the mounting surface 301 of the target binding object 10 is the surface for mounting various electronic components on the circuit board.

[0087] The controller is coupled to the three-dimensional imaging sensor 27. The controller determines whether the levelness of the chip 20 relative to the target binding object 10 meets the standard according to the distance between the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10. If the controller determines that the distance exceeds the standard, the controller calculates the adjustment amount required by the first driving member 24 and / or the second driving member 26, and sends the adjustment signal to the first driving member 24 and / or the second driving member 26 to correct the levelness of the chip 20 relative to the target binding object 10.

[0088] It can be understood that in this embodiment, after the controller determines that the chip 20 is level with respect to the target binding object 10, it performs pressing and shaping to bind and solidify the chip 20 to the target binding object 10, thereby avoiding the waste of materials due to the chip 20 being level not up to standard after being bound and solidified to the target binding object 10, thereby improving the yield rate of chip 20 packaged by the chip 20 binding packaging equipment.

[0089] In one embodiment, the three-dimensional imaging sensor 27 is a TOF camera sensor. The three-dimensional imaging sensor 27 includes a light emitting end (not marked in the figure) and a light receiving end (not marked in the figure) spaced apart from the light emitting end. The light emitting end is used to emit detection light to the object to be measured. The light receiving end is used to receive the detection light reflected by the object to be measured. The controller couples the light emitting end and the light receiving end, and the controller calculates the distance between the three-dimensional imaging sensor 27 and the object to be measured based on the time difference between the detection light reflected by the object to be measured received by the receiving end and the detection light emitted by the light emitting end.

[0090] The object to be detected can be the working surface 201 of the chip 20, or the mounting surface 301 of the target binding object 10. The light emitting end is used to emit a plurality of detection light beams so that the detection light beams are irradiated on the working surface 201 of the chip 20 and part of the mounting surface 301 of the target binding object 10. The controller can obtain the distance between the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10 according to the distances between the three-dimensional imaging sensor 27 and the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10, respectively.

[0091] In this embodiment, the three-dimensional imaging sensor 27 is a TOF camera sensor, so that the chip flip-chip packaging equipment 100 uses the emerging three-dimensional imaging technology to measure the distance between the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10, so as to avoid the situation where the first horizontal sensor 23 and the second horizontal sensor 25 both meet the horizontality requirement, but the flatness between the working surface 201 of the chip 20 and the mounting surface 301 of the target binding object 10 still exceeds the standard and cannot maintain the same horizontal plane. At this time, the horizontal target values ​​of the first horizontal sensor 23 and the second horizontal sensor 25 are set for deviation compensation through the measurement value of the TOF camera sensor, so as to ensure that the working surface 201 of the measured chip 20 and the mounting surface 301 of the target binding object 10 are located in the same horizontal plane, thereby effectively ensuring that the horizontality of the chip 20 installed on the target binding object 10 meets the standard, thereby improving the reliability of the chip flip-chip packaging equipment.

[0092] The following is a detailed introduction to a chip packaging method provided by the present application in conjunction with the aforementioned chip flip packaging device. In other embodiments, the chip packaging method can also be used for chip flip packaging devices different from the aforementioned embodiments.

[0093] See also Figure 8 , Figure 8 1 is a flow chart of the chip packaging method provided by the present application in the first embodiment. The chip packaging method is used to bind and package the chip to a target binding object. For example, when the chip is a sensor in a camera module and the target binding object is a circuit board or a ceramic substrate, the chip packaging method is used to bind and package the sensor to the circuit board or the ceramic substrate.

[0094] The chip packaging method includes:

[0095] S110: Grab the chip.

[0096] Among them, the chip flip packaging equipment is provided with a gripper. The gripper can act as a manipulator to grab and transfer the chip. It can be understood that the chip flip packaging equipment is provided with a binding platform, which is used to fix the target binding object.

[0097] S120: The first level sensor automatically detects the level of the chip.

[0098] The first level sensor is embedded in the gripper. When the gripper grabs the chip, the chip is fixed to the gripper. Since the first level sensor is embedded in the gripper, the first level sensor can detect the level of the gripper, thereby detecting the level of the chip. It can be understood that the level of the chip automatically detected by the first level sensor can be transmitted to the controller in the chip flip packaging device, so that the controller sends a control signal for the next step.

[0099] In one embodiment, before the first level sensor automatically detects the levelness of the chip, the chip is placed in the area to be bound so that the chip and the target binding object are arranged opposite to each other. That is, when the chip is in the area to be bound, the chip and the target binding object are arranged opposite to each other.

[0100] In this embodiment, the chip packaging method adjusts the levelness of the chip when the chip is in the area to be bound, so as to avoid the problem of low chip binding efficiency caused by adjusting the levelness of the chip too early. For example, the levelness of the chip is adjusted to the first target level value before the chip enters the area to be bound, but the levelness of the chip may still change during the process of transferring the chip to the area to be bound. Therefore, the levelness of the chip needs to be readjusted, so that the chip packaging method needs to adjust the levelness of the chip multiple times, resulting in low efficiency of the chip packaging method.

[0101] In other embodiments, the chip flip-chip packaging equipment detects the horizontality of the gripping member in real time during operation, and when the controller determines that the chip is gripped, the detection value is sent to the controller.

[0102] S130: When the levelness of the chip does not reach the first target level value, the first driving member automatically adjusts the levelness of the chip.

[0103] The first target level value is a range value, not a fixed value. For example, the first target level value indicates that the level is within the range of 0 to 0.5 degrees. The first level sensor in the chip flip packaging device can determine whether the level of the chip is within the first target level value range based on the acquired level of the chip. If it is not within the first target level value range, it means that the level of the chip has not reached the first target level value.

[0104] When the level of the chip does not reach the first target level, the chip flip packaging device can determine the movement amount of the mobile chip through calculation, and automatically adjust the level of the chip through the first driving member so that the level of the chip reaches the first target level. It can be understood that in the process of detecting and adjusting the level of the chip, the chip flip packaging device is automatically operated without manual operation.

[0105] S140: When the levelness of the chip reaches a first target level value, the chip is bound and packaged in a target binding object.

[0106] It can be understood that before the chip is bound and packaged in the target binding object, the level of the chip reaches a range of the first target level value.

[0107] In an embodiment of the present application, the chip packaging method can automatically detect the levelness of the packaged chip, and automatically adjust the chip whose chip levelness has not reached the target value, so as to ensure that the levelness of the chip is within the target value range before the chip is bound and solidified on the target binding object, and during the measurement and adjustment of the chip levelness, there is no need for testers to debug the chip flip-chip packaging equipment, thereby realizing the automation of chip levelness debugging by the chip packaging method and saving labor costs.

[0108] On the other hand, the chip packaging method does not detect the level of the chip after the chip is bound and solidified on the target binding object, but the first driving component automatically adjusts the level of the chip to the target value before the chip is bound, packaged and solidified on the target binding object, so as to avoid the chip level not meeting the requirements after the package is solidified, thereby improving the yield of the chip packaging method and avoiding waste of materials.

[0109] See also Fig. 9 , Fig. 9 1 is a flow chart of the chip packaging method provided by the present application in the second embodiment. The following mainly describes the difference between this embodiment and the previous embodiment, and most of the technical contents that are the same as those in the previous embodiment will not be repeated.

[0110] The chip packaging method includes:

[0111] S210: Grab the chip.

[0112] The specific steps included in S210 refer to the aforementioned S110.

[0113] S220: The second level sensor automatically detects the level of the target binding object.

[0114] It can be understood that before the second level sensor automatically detects the level of the target binding object, the chip packaging method further includes fixing the target binding object to the binding table.

[0115] S230: When the levelness of the chip does not reach the second target level value, the second driving member automatically adjusts the levelness of the target binding object so that the levelness of the target binding object reaches the second target level value.

[0116] The second target level value can be the same as the first target level value or different from the first target level value. This step can automatically adjust the level of the target binding object to ensure that the level of the target binding object meets the requirements before the chip is flip-chip packaged on the target binding object, thereby further ensuring that the level of the chip meets the requirements when it is flip-chip packaged on the target binding object.

[0117] S240: The first level sensor automatically detects the level of the chip.

[0118] The specific steps included in S240 refer to the aforementioned S120.

[0119] The order in which the second level sensor automatically detects the level of the target binding object and the first level sensor automatically detects the level of the chip is not specifically limited in the embodiments of the present application. For example, in one embodiment, when the chip binding packaging device detects that the chip is installed on the chip binding packaging device, the first level sensor starts to automatically detect the level of the chip; when the chip binding packaging device detects that the target binding object is installed on the chip binding packaging device, the second level sensor starts to automatically detect the level of the target binding object.

[0120] In this application, the order of step S240 and step S220 is not specifically limited. It is understandable that in other embodiments, the chip packaging method can simultaneously automatically detect the levelness of the chip and the levelness of the target binding object by the first level sensor.

[0121] S250: When the levelness of the chip does not reach the first target level value, the first driving member automatically adjusts the levelness of the chip.

[0122] The specific steps included in S250 refer to the aforementioned S130.

[0123] In this application, the order of step S250 and step S230 is not specifically limited. It is understandable that in other embodiments, the chip packaging method can simultaneously drive the first driver to automatically adjust the horizontality of the chip and the horizontality of the target binding object. For example, the first driver of the chip flip packaging device drives the first driver to automatically adjust the horizontality of the chip, and the second driver of the chip flip packaging device drives to adjust the horizontality of the target binding object. The first driver and the second driver are independent of each other and can work simultaneously or alternately.

[0124] S260: When the level of the chip reaches a first target level value, and the level of the target binding object reaches a second target level value, the chip is bound and packaged in the target binding object.

[0125] It can be understood that in the chip packaging method provided by the present application, before the chip is bound and packaged on the target binding object, the chip flip-chip packaging equipment has automatically adjusted the horizontality of the chip and the horizontality of the target binding object to the required horizontality, so as to avoid the situation where the level of the chip relative to the target binding object does not meet the requirements after the chip is bound and packaged on the target binding object, thereby causing waste of raw materials.

[0126] In the embodiment of the present application, the flip-chip method not only automatically detects the horizontality of the chip, but also automatically detects the horizontality of the target binding object of the chip. After ensuring the horizontality of the chip and the target binding object, the chip is bound and packaged on the target binding object, thereby avoiding the situation where the horizontality of the chip does not meet the requirement when it is flipped and fixed on the target binding object, thereby further improving the horizontality of the chip when it is packaged on the target binding object, and further improving the yield of the chip packaging method.

[0127] See also Fig.10 , Fig.10 1 is a flow chart of the chip packaging method provided by the present application in the third embodiment. The following mainly describes the difference between this embodiment and the previous embodiment, and most of the technical contents that are the same as those in the previous embodiment are not repeated.

[0128] The chip packaging method includes:

[0129] S310: Grab the chip.

[0130] The specific steps included in S310 refer to the aforementioned S110.

[0131] S320: The first level sensor automatically detects the levelness of the chip.

[0132] The specific steps included in S320 refer to the aforementioned S120.

[0133] S330: When the levelness of the chip does not reach the first target level value, the first driving member automatically adjusts the levelness of the chip.

[0134] The specific steps included in S330 refer to the aforementioned S130.

[0135] S340: Detect the flatness difference between the working surface of the chip and the mounting surface of the target binding object.

[0136] The working surface of the chip is the side of the chip facing the target binding object. The mounting surface of the target binding object is the side of the target binding object attached to the binding platform. It can be understood that the working surface of the chip and the mounting surface of the target binding object are in the same direction.

[0137] S350: When the flatness difference is greater than the target difference, adjust the levelness of the chip or the target binding object so that the flatness difference reaches the target difference.

[0138] In one embodiment, the chip packaging method includes performing a three-dimensional scanning of the surface of the chip and the target binding object by a three-dimensional imaging sensor to detect the horizontality of the chip relative to the target binding object. For example, the three-dimensional imaging sensor performs a three-dimensional scanning of the chip and the target binding object to obtain the distance between the surface of the chip and the surface of the target binding object, and determines the horizontality of the chip relative to the target binding object.

[0139] It can be understood that automatically detecting the levelness of the chip by the first level sensor and automatically adjusting the levelness of the chip by the first driving member are early debugging steps for the chip in the chip packaging method. Detecting the distance between the working surface of the chip and the mounting surface of the target binding object and adjusting the levelness of the chip relative to the target binding object according to the distance are correction steps before the chip is bound and fixed to the target binding object in the chip packaging method. The correction process is before the chip is bound and solidified on the target binding object.

[0140] In an embodiment of the present application, before the chip is bound and cured on the target binding object, the levelness of the chip relative to the target binding object is corrected to avoid the situation where the levelness of the chip relative to the target binding object does not meet the requirements after the chip is bound and cured on the target binding object, thereby avoiding waste of materials and improving the yield of the chip packaging method.

[0141] It can be understood that the flatness difference between the working surface of the chip and the mounting surface of the target binding object is detected to avoid the situation where the first horizontal sensor and the second horizontal sensor both meet their respective horizontality requirements, but the flatness between the working surface of the chip and the mounting surface of the target binding object still exceeds the standard and cannot maintain the same horizontal plane. At this time, the horizontal target values ​​of the first horizontal sensor and the second horizontal sensor are set for deviation compensation through the measurement value of the TOF camera sensor to ensure that the working surface of the measured chip and the mounting surface of the target binding object are in the same horizontal plane, thereby effectively ensuring that the flatness of the chip installed on the target binding object meets the standard and improving the reliability of the chip flip-chip packaging equipment.

[0142] In one embodiment, the chip packaging method includes emitting detection light to the object to be detected, for example, the working surface of the chip and the mounting surface of the target binding object, receiving the detection light reflected by the object to be detected, and calculating the distance between the working surface of the chip and the mounting surface of the target binding object according to the time difference between the detection light reflected by the object to be detected and the detection light emitted by the light emitting end. It can be understood that the distance between the working surface of the chip and the mounting surface of the target binding object is obtained by three-dimensional imaging technology.

[0143] In this embodiment, the distance between the working surface of the chip and the mounting surface of the target binding object is measured by the emerging technology of three-dimensional imaging, which improves the accuracy of measuring the distance between the working surface of the chip and the mounting surface of the target binding object, thereby improving the reliability of the chip flip-chip method.

[0144] S360: When the spacing is less than or equal to the target spacing, the chip is bound and packaged to the target binding object.

[0145] It is understandable that before the chip is bound and packaged in the target binding object, the levelness of the chip relative to the target binding object has met the requirements, so as to avoid the situation where the levelness of the chip relative to the target binding object does not meet the requirements after the chip is bound and packaged in the target binding object, thereby causing waste of raw materials.

[0146] The above is a detailed introduction to the implementation methods of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above implementation methods is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A chip flip packaging device, characterized in that: It comprises a binding platform and a grabbing piece arranged opposite to the binding platform, the binding platform is used to fix the target binding object, the grabbing piece is used to grab the chip and attach the chip to the target binding object, the grabbing piece is provided with a grabbing surface on the side facing the binding platform, the grabbing surface is used to carry the chip, the binding platform is provided with a binding surface on the side facing the grabbing piece, when the target binding object is fixed to the binding platform, one side of the target binding object is attached to the binding surface, and the other side faces the grabbing piece; The flip chip packaging device further includes a first level sensor, a first driving member and a controller, wherein the first level sensor is embedded in the gripping member and is used to detect the level of the gripping surface, the first driving member is used to drive the gripping member to move and / or rotate, the controller is coupled to the first driving member and the first level sensor, the controller is used to control the first driving member according to the detection value of the first level sensor, and the controller is further used to calculate the offset of the first driving member when it is determined that the detection value of the first level sensor is not within the first target level value range; The chip flip packaging equipment further includes a second level sensor and a second driving member, wherein the second level sensor is embedded in the binding platform and is used to detect the levelness of the binding surface, and the controller is coupled to the second driving member and the second level sensor, and the controller is used to control the second driving member according to the detection value of the second level sensor to ensure the levelness of the binding surface; The flip chip packaging device further comprises a three-dimensional imaging sensor, which is embedded in the binding platform, and a sensing surface of the three-dimensional imaging sensor is exposed relative to the binding platform. When the chip is attached to the target binding object, the sensing surface of the three-dimensional imaging sensor faces the chip; The three-dimensional imaging sensor includes a light emitting end and a light receiving end spaced apart from the light emitting end, the light emitting end is used to emit detection light to the object to be measured, the light receiving end is used to receive the detection light reflected by the object to be measured, the controller couples the light emitting end and the light receiving end, and the controller is used to calculate the distance between the three-dimensional imaging sensor and the object to be measured based on the time difference between the light receiving end receiving the detection light reflected by the object to be measured and the light emitting end emitting the detection light.

2. The flip chip packaging equipment according to claim 1, characterized in that: The first driving member includes a motor and a driving rod, one end of the driving rod is connected to the motor, and the other end of the driving rod is connected to the grasping member, and the motor is used to drive the driving rod to move.

3. The flip chip packaging equipment according to claim 1, characterized in that: The flip chip packaging device further includes a carrying surface, the carrying surface is used to carry the first level sensor, and the carrying surface is parallel to the grabbing surface.

4. A chip packaging method for binding and packaging a chip to a target binding object, characterized in that: The method comprises: Grab the chip; The second level sensor automatically detects the level of the target binding object; When the level of the target binding object does not reach the second target level value, the second driving member automatically adjusts the level of the target binding object so that the level of the target binding object reaches the second target level value; A first level sensor automatically detects the level of the chip; When the level of the chip does not reach a first target level value, the first driving member automatically adjusts the level of the chip, and when the level of the chip is not within the first target level value range, calculates the offset of the first driving member; The method further comprises: The surface of the chip and the target binding object is scanned in three dimensions by a three-dimensional imaging sensor to detect the horizontality of the chip relative to the target binding object; The distance between the working surface of the chip and the mounting surface of the target binding object is calculated by emitting detection light to the object to be measured, receiving the detection light reflected by the object to be measured, and calculating the distance between the working surface of the chip and the mounting surface of the target binding object according to the time difference between the detection light reflected by the object to be measured and the detection light emitted by the light emitting end.

5. The method according to claim 4, characterized in that After grabbing the chip, the method further includes: The chip is placed in the area to be bound so that the chip and the target binding object are arranged opposite to each other.

6. The method according to claim 4, characterized in that After the first driving member automatically adjusts the horizontality of the chip, the method further includes: When the level of the chip reaches the first target level value, and the level of the target binding object reaches the second target level value, the chip is bound and packaged in the target binding object.

7. The method according to claim 4 or 5, characterized in that After the first driving member automatically adjusts the horizontality of the chip, the method further includes: Detecting the flatness difference between the working surface of the chip and the mounting surface of the target binding object, wherein the working surface of the chip is the side of the chip facing the target binding object, and the mounting surface of the target binding object is the side of the target binding object attached to the binding platform; When the flatness difference is greater than a target difference, the levelness of the chip or the target binding object is adjusted so that the flatness difference reaches the target difference.

8. The method according to claim 7, characterized in that The method further comprises: When the flatness difference is less than or equal to the target difference, the chip is bound and packaged on the target binding object.

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