Semiconductor device and method for manufacturing semiconductor device

Abstract

A semiconductor device and a method for manufacturing the semiconductor device. A semiconductor device includes: a stacked structure having a plurality of insulating layers and a plurality of conductive layers alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure penetrating the hard mask pattern and the stacked structure; a plurality of insulating patterns interposed between the plurality of insulating layers and the channel structure, wherein the insulating patterns protrude further toward the channel structure than sidewalls of the hard mask pattern; and a memory layer interposed between the stacked structure and the channel structure, wherein the memory layer fills a space between the plurality of insulating patterns.

Description

Technical Field

[0001] Various embodiments relate generally to electronic devices, and more particularly, to a semiconductor device and a method for manufacturing the semiconductor device. Background Art

[0002] A nonvolatile memory device retains stored data even in the absence of power. Due to the limitation of increasing the integration density of a two-dimensional nonvolatile memory device in which memory cells are formed in a single layer over a substrate, a three-dimensional nonvolatile memory device in which memory cells are stacked in a vertical direction over a substrate has been proposed.

[0003] A three-dimensional nonvolatile memory device may include interlayer insulating layers and gate electrodes alternately stacked with each other and a channel layer passing through the interlayer insulating layers and the gate electrodes, and memory cells may be stacked along the channel layer. Various structures and manufacturing methods have been developed to improve the operational reliability of the three-dimensional nonvolatile memory device. Summary of the invention

[0004] According to an embodiment, a semiconductor device may include: a stacked structure having a plurality of insulating layers and a plurality of conductive layers alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure penetrating the hard mask pattern and the stacked structure; a plurality of insulating patterns interposed between the insulating layers and the channel structures, wherein the insulating patterns protrude farther toward the channel structures than side walls of the hard mask patterns; and a memory layer interposed between the stacked structure and the channel structure, wherein the memory layer fills a space between the plurality of insulating patterns.

[0005] According to an embodiment, a method for manufacturing a semiconductor device may include the following steps: forming a stacked structure having a plurality of first material layers and a plurality of second material layers alternately stacked on each other; forming a hard mask pattern on the stacked structure; forming a first opening penetrating the stacked structure and the hard mask pattern; forming a plurality of insulating patterns on each second material layer, wherein the insulating patterns protrude farther into the first opening than side walls of the hard mask patterns; forming a memory layer in the first opening to fill a space between the plurality of insulating patterns; and forming a channel structure in the memory layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figures 1A to 1D is a diagram showing a structure of a semiconductor device according to an embodiment;

[0007] FIG. 2A to FIG. 2D is a diagram showing a structure of a semiconductor device according to an embodiment;

[0008] FIG. 3A to FIG. 3D is a diagram showing a structure of a semiconductor device according to an embodiment;

[0009] Figure 4A and Figure 4B is a diagram showing a structure of a semiconductor device according to an embodiment;

[0010] FIG. 5A to FIG. 5E is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0011] FIG. 6A to FIG. 6D is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0012] FIG. 7A to FIG. 7D is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0013] FIG. 8A to FIG. 8C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0014] Fig.9A and Fig. 9B is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0015] Fig. 10A and Fig. 10B is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0016] FIG. 11A to FIG. 11C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0017] FIG. 12A to FIG. 12C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0018] FIG. 13A to FIG. 13C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0019] FIG. 14A to FIG. 14C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0020] Fig.15A and Fig. 15B is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0021] Fig.16A and Fig. 16B is a diagram showing a method for manufacturing a semiconductor device according to an embodiment;

[0022] Fig.17 is a block diagram showing a configuration of a memory system according to an embodiment;

[0023] Fig.18 is a block diagram showing a configuration of a memory system according to an embodiment;

[0024] Fig.19 is a block diagram showing a configuration of a computing system according to an embodiment; and

[0025] Fig. 20 is a block diagram illustrating a computing system according to an embodiment. DETAILED DESCRIPTION

[0026] Only specific structural or functional descriptions of examples of implementations of the concepts disclosed in this specification are shown to describe examples of implementations according to the concepts, and examples of implementations according to the concepts may be implemented in various forms, but the descriptions are not limited to the examples of implementations described in this specification.

[0027] It will be understood that although the terms "first", "second", "third", etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element in some embodiments may be referred to as the second element in other embodiments.

[0028] In addition, it will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0029] Various embodiments relate to a semiconductor device having a stable structure and improved characteristics and a method of manufacturing the semiconductor device.

[0030] Figures 1A to 1D is a diagram showing a structure of a semiconductor device according to an embodiment. Figures 1B to 1D yes Figure 1A An enlarged view of area A is shown.

[0031] Reference Figure 1A , a semiconductor device according to an embodiment may include a stack structure ST, a hard mask pattern HM, a channel structure CH, an insulating pattern 13 , and a memory layer M.

[0032] The stacked structure ST may include conductive layers 11 and insulating layers 12 alternately stacked on each other. The conductive layer 11 may be a gate electrode of a selection transistor, a memory cell, etc. The conductive layer 11 may include a conductive material such as polysilicon, tungsten, or a metal. The insulating layer 12 may be provided to insulate the stacked conductive layers 11 from each other. The insulating layer 12 may include an insulating material such as an oxide or a nitride.

[0033] The hard mask pattern HM may be located on the stack structure ST. The hard mask pattern HM may include a material having an etch selectivity with respect to the insulating layer 12. The hard mask pattern HM may include a nitride, a carbon-based material, or a combination thereof.

[0034] The channel structure CH may pass through the stacked structure ST and the hard mask pattern HM. The channel structure CH may extend in the direction in which the conductive layer 11 and the insulating layer 12 are stacked. The direction in which the conductive layer 11 and the insulating layer 12 are stacked may be a second direction II. The channel structure CH may include a channel layer 17, and may also include at least one of a gap filling layer 18 and a capping layer 19. The channel layer 17 may be a region in which a channel such as a selection transistor or a memory cell is formed. The channel layer 17 may include a semiconductor material such as silicon or germanium or a nanostructure such as nanodots, nanotubes, or graphene. The gap filling layer 18 may be formed in a space defined by the channel layer 17 and may include an insulating material such as an oxide. The capping layer 19 may be coupled to the channel layer 17 and may include a conductive material such as polysilicon.

[0035] The insulating patterns 13 may be interposed between the insulating layers 12 and the channel structures CH. The insulating patterns 13 may correspond to the insulating layers 12, respectively, and may be located at substantially the same level as the insulating layers 12. The insulating patterns 13 may directly contact the insulating layers 12.

[0036] The insulating pattern 13 may include an insulating material such as an oxide. The insulating pattern 13 and the insulating layer 12 may be formed by different methods. Therefore, the insulating pattern 13 and the insulating layer 12 may have different material properties. For example, material properties such as dielectric constant, dielectric strength, density, etching rate, thermal stability, composition, and nitrogen concentration may be different between the insulating pattern 13 and the insulating layer 12.

[0037] The insulating layer 12 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. The insulating pattern 13 may be formed by an oxidation process. Since the oxidation process may be performed at a higher temperature than the deposition process, the layer formed by the oxidation process may have better material properties than the layer formed by the deposition process. The insulating pattern 13 may have a higher dielectric strength, a lower etching rate, and a higher thermal stability than the insulating layer 12, and may have fewer defects than the insulating layer 12. In addition, the insulating pattern 13 may include a material having a high etching selectivity relative to nitride or polysilicon.

[0038] The hard mask pattern HM may include a first side wall SW1. The first side wall SW1 may be a surface defined by an etching process. Each conductive layer 11 may include a second side wall SW2. The second side wall SW2 may correspond to the first side wall SW1. In a cross section defined by a first direction I and a second direction II intersecting the first direction I, the second side wall SW2 may be located on a first extension line EXL1 of the first side wall SW1. The second direction II may be a direction perpendicular to the first direction I. The first side wall SW1 and the second side wall SW2 may be flat.

[0039] Each insulating pattern 13 may include a third sidewall SW3. The third sidewall SW3 may protrude farther toward the channel structure CH than the first sidewall SW1 of the hard mask pattern HM. The third sidewall SW3 may protrude farther toward the channel structure CH than the first extension line EXL1 of the first sidewall SW1. The third sidewall SW3 may protrude farther toward the channel structure CH than the second sidewall SW2. The third sidewall SW3 may be a surface defined by an oxidation process. The third sidewall SW3 may include a curved surface.

[0040] Each insulating layer 12 may include a fourth side wall SW4. The fourth side wall SW4 may be an etched surface or a surface defined by an oxidation process. The fourth side wall SW4 may be an interface IF between the insulating layer 12 and the insulating pattern 13. The fourth side wall SW4 may be spaced farther from the channel structure CH than the first side wall SW1 and the second side wall SW2. The interface IF may be spaced farther from the fifth side wall SW5 of the channel structure CH than the first side wall SW1 and the second side wall SW2.

[0041] The memory layer M may be interposed between the stacked structure ST and the channel structure CH, and may fill the space between the insulating patterns 13. The memory layer may include at least one of a barrier layer 14, a data storage layer 15, and a tunnel insulating layer 16. The tunnel insulating layer 16 may surround the sidewalls of the channel structure CH. The tunnel insulating layer 16 may be a layer that allows charges to tunnel through FN tunneling, etc., and may include an insulating material such as an oxide or a nitride. The data storage layer 15 may surround the tunnel insulating layer 16. The data storage layer 15 may include a floating gate, a charge trapping material, polysilicon, a nitride, a variable resistance material, a phase change material, a nanostructure, etc. The barrier layer 14 may surround the data storage layer 15. The barrier layer 14 may prevent charges from moving to the conductive layer 11, and may include a high-k material such as aluminum oxide (e.g., Al2O3).

[0042] The data storage layer 15 may be interposed between the channel structure CH and the stack structure ST, and may extend to the first sidewall SW1 of the hard mask pattern HM. The data storage layer 15 may have a thickness that varies based on its region. The thickness may be a thickness measured in the first direction I. The data storage layer 15 may include a first region R1 corresponding to the conductive layer 11 and a second region R2 corresponding to the insulating pattern 13. The first region R1 may be a memory cell region, and the second region R2 may be a space region between adjacent memory cells. The first region R1 may have a thickness greater than that of the second region R2 (W1>W2).

[0043] The data storage layer 15 may have a flat inner wall adjacent to the channel structure CH and an uneven outer wall adjacent to the stack structure ST. The first region R1 may include a protrusion that protrudes farther toward the stack structure ST than the second region R2, and the protrusion may protrude between adjacent insulating patterns 13. The surface of the first region R1 may have a shape corresponding to the shape of the second side wall SW2 of each conductive layer 11 and may be flat. The surface of the second region R2 may have a shape corresponding to the shape of the third side wall SW3 of each insulating pattern 13 and may include a curved surface.

[0044] According to the structure as described above, the memory cell or the selection transistor may be located at each intersection of the channel structure CH and the conductive layer 11. The memory cells and the selection transistors sharing the channel structure CH may form a single memory string. The memory string may include at least one drain selection transistor, a memory cell, and at least one source selection transistor.

[0045] Reference Figures 1B to 1D , each insulating pattern 13 may include a first surface S1 facing the insulating layer 12 and a second surface S2 facing the channel structure CH. Each of the first surface S1 and the second surface S2 may include a curved surface. The first surface S1 may contact the insulating layer 12, and the second surface S2 may contact the barrier layer 14. The second surface S2 may correspond to Figure 1A The third side wall SW3 is shown.

[0046] The thickness of each conductive layer 11 and the thickness of each insulating layer 12 in the second direction II may be the same or different. Each conductive layer 11 may have a thickness greater than that of each insulating layer 12.

[0047] Each insulating pattern 13 may include a first portion P1 and a second portion P2. The first portion P1 may be interposed between adjacent conductive layers 11. The second portion P2 may protrude further toward the channel structure CH than the second sidewall SW2. The second portion P2 may protrude further toward the channel structure CH than the first sidewall SW1. The first portion P1 may have a third width W3 in the second direction II. When the first surface S1 includes a curved surface, the third width W3 may be the width of the first portion P1 in the interface between the first portion P1 and the second portion P2. The third width W3 may be substantially the same as the width of each insulating layer 12. The second portion P2 may have a fourth width W4 in the second direction II. When the second surface S2 includes a curved surface, the fourth width W4 may be the width of the second portion P2 in the interface between the first portion P1 and the second portion P2. The fourth width W4 may be substantially the same as or may be different from the width of each insulating layer 12.

[0048] Reference Figure 1B , the second portion P2 may have a width greater than the first portion P1 (W4>W3). The second portion P2 may extend in the second direction II and may partially overlap the conductive layer 11. Each insulating pattern 13 may have a mushroom shape. Figure 1C , the second portion P2 may have substantially the same width as the first portion P1 (W4=W3). Figure 1D , the second portion P2 may have a width (W4) smaller than the first portion P1. <W3)。

[0049] According to the above structure, the third sidewall SW3 of each insulating pattern 13 may protrude farther toward the channel structure CH than the first sidewall SW1 of the hard mask pattern HM. In addition, the first region R1 of the data storage layer 15 may have a thickness greater than the second region R2 of the data storage layer 15 (W1>W2). Therefore, according to the above structure, the movement of charges between memory cells that share the channel structure CH and the memory layer M and are adjacent to each other in the second direction II may be alleviated. In addition, according to the above structure, data retention characteristics may be improved, and interference between stacked memory cells may be reduced.

[0050] FIG. 2A to FIG. 2D is a diagram showing a structure of a semiconductor device according to an embodiment. FIG. 2B to FIG. 2D yes Figure 2A An enlarged view of region B is shown. Hereinafter, any repeated description of the components already mentioned above will be omitted.

[0051] Reference Figure 2A , the semiconductor device may include a stack structure ST, a hard mask pattern HM, a channel structure CH, an insulating pattern 13' and a memory layer M'. The hard mask pattern HM may include a material having an etching selectivity with respect to the insulating layer 12. The hard mask pattern HM may include nitride, a carbon-based material or a combination thereof.

[0052] The insulating pattern 13' may be interposed between the insulating layer 12 and the channel structure CH. The third side wall SW3 of each insulating pattern 13' may protrude farther toward the channel structure CH than the first side wall SW1 of the hard mask pattern HM. The second side wall SW2 of each conductive layer 11 may be located on an extension line of the first side wall SW1. The third side wall SW3 may protrude farther toward the channel structure CH than the second side wall SW2. The fourth side wall SW4 of each insulating layer 12 may be spaced farther from the channel structure CH than the first side wall SW1. The sixth side wall SW6 of each of the data storage patterns 15A and 15B may be located on a second extension line EXL2 of the third side wall SW3.

[0053] The memory layer M' may be interposed between the stacked structure ST and the channel structure CH. The memory layer M' may fill the space between the insulating patterns 13'. The memory layer M' may include at least one of the first barrier pattern 14A, the second barrier pattern 14B, the first data storage pattern 15A, the second data storage pattern 15B, and the tunnel insulating layer 16. The first barrier pattern 14A and the second barrier pattern 14B may be interposed between the conductive layer 11 and the first data storage pattern 15A and the second data storage pattern 15B, respectively. The first barrier pattern 14A and the second barrier pattern 14B may be separated from each other. The first barrier pattern 14A may be located between the insulating patterns 13' and may be separated from each other. The second barrier pattern 14B may extend to the first side wall SW1 of the hard mask pattern HM. The first data storage pattern 15A and the second data storage pattern 15B may be interposed between the tunnel insulating layer 16 and the first barrier pattern 14A and the second barrier pattern 14B, respectively. The first data storage pattern 15A and the second data storage pattern 15B may be separated from each other. The first data storage pattern 15A may be located between the insulating patterns 13' and may be separated from each other. The second data storage pattern 15B may extend to the first sidewall SW1 of the hard mask pattern HM.

[0054] Reference FIG. 2B to FIG. 2D Each insulating pattern 13' may include a first surface S1 facing the insulating layer 12 and a second surface S2 facing the channel structure CH. The first surface S1 may include a curved surface, and the second surface S2 may include a flat surface. The second surface S2 may include a curved surface and a flat surface. In addition, the second surface S2 may contact the tunnel insulating layer 16.

[0055] Reference Figure 2B , the second portion P2 may have a width greater than that of the first portion P1 (W4>W3). Figure 2C , the second portion P2 may have substantially the same width as the first portion P1 (W4=W3). Figure 2D , the second portion P2 may have a width (W4) smaller than the first portion P1. <W3)。

[0056] According to the above structure, the third sidewall SW3 of each insulating pattern 13' may protrude farther toward the channel structure CH than the first sidewall SW1 of the hard mask pattern HM. In addition, the first data storage pattern 15A may be located between the insulating patterns 13' and may be separated from each other. Therefore, according to the above structure, the movement of charges between the memory cells that share the channel structure CH and the memory layer M' and are adjacent to each other in the second direction II may be alleviated. In addition, according to the above structure, the data retention characteristics may be improved, and the interference between the stacked memory cells may be reduced.

[0057] Figure 3A and Figure 3B is a diagram showing a structure of a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0058] Reference Figure 3A and Figure 3B , the semiconductor device may include a stacked structure ST, a hard mask pattern HM, a channel structure CH, an insulating pattern 23 or 23', and a memory layer M or M'. The stacked structure ST may include a conductive layer 21 and an insulating layer 22 alternately stacked on each other. The hard mask pattern HM may be located on the stacked structure ST. The hard mask pattern HM may include an oxide, a carbon-based material, or a combination thereof.

[0059] The channel structure CH may pass through the stack structure ST and the hard mask pattern HM. The channel structure CH may include a channel layer 27 , and may further include at least one of a gap-filling layer 28 and a capping layer 29 .

[0060] The second sidewall SW2 of each conductive layer 21 may protrude further toward the channel structure CH than the first sidewall SW1 of the hard mask pattern HM. A step may be formed in the boundary between the hard mask pattern HM and the stacked structure ST due to misalignment between the first sidewall SW1 and the second sidewall SW2 in the first direction I, and since the memory layer M or M' and the channel layer 27 are formed along the step, a sidewall step of the channel structure CH may be caused. A portion of the channel structure CH passing through the hard mask pattern HM may have an eighth width W8, and a portion of the channel structure CH passing through the stacked structure ST may have a seventh width W7. The eighth width W8 may be greater than the seventh width W7. Each of the seventh width W7 and the eighth width W8 may be a width measured in the first direction I or may be a diameter of the channel structure CH. Therefore, the sidewall of the channel structure CH may have a step.

[0061] The second sidewall SW2 may protrude farther toward the channel structure CH than the fourth sidewall SW4 of each insulating layer 22. The fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1 or may be spaced farther from the channel structure CH than the first sidewall SW1.

[0062] Reference Figure 3A , the memory layer M may be interposed between the stack structure ST and the channel structure CH. The memory layer M may include at least one of a barrier layer 24, a data storage layer 25, and a tunnel insulating layer 26. The data storage layer 25 may include a first region R1 and a second region R2 having different thicknesses from each other. The first region R1 may include a protrusion protruding between adjacent insulating patterns 23.

[0063] The insulating pattern 23 may be interposed between the insulating layer 22 and the channel structure CH. Each insulating pattern 23 may include a first surface S1 facing the insulating layer 22 and a second surface S2 facing the channel structure CH. Each of the first surface S1 and the second surface S2 may include a curved surface. Each insulating pattern 23 may include a first portion P1 and a second portion P2. The first portion P1 and the second portion P2 may have substantially the same width as each other or different widths from each other. The insulating pattern 23 may have a width similar to that of the reference pattern 23. Figures 1B to 1D A shape similar to one of the insulating patterns 13 described above or referring to Figures 1B to 1D A combination of shapes of the insulating pattern 13 is described.

[0064] The third sidewall SW3 of each insulation pattern 23 may protrude farther toward the channel structure CH than the first sidewall SW1. The third sidewall SW3 may protrude farther toward the channel structure CH than the second sidewall SW2.

[0065] Reference Figure 3B , the memory layer M' may be interposed between the stack structure ST and the channel structure CH. The memory layer M' may include at least one of a first barrier pattern 24A, a second barrier pattern 24B, a first data storage pattern 25A, a second data storage pattern 25B, and a tunnel insulating layer 26. The first barrier pattern 24A may be located between the insulating patterns 23' and may be separated from each other. The second barrier pattern 24B may extend to the first sidewall SW1 of the hard mask pattern HM. The first data storage pattern 25A may be located between the insulating patterns 23' and may be separated from each other. The second data storage pattern 25B may extend to the first sidewall SW1 of the hard mask pattern HM.

[0066] The insulating pattern 23' may be interposed between the insulating layer 22 and the channel structure CH. Each insulating pattern 23' may include a first surface S1 facing the insulating layer 22 and a second surface S2 facing the channel structure CH. The first surface S1 may include a curved surface, and the second surface S2 may include a flat surface. Each insulating pattern 23' may include a first portion P1 and a second portion P2. The first portion P1 and the second portion P2 may have substantially the same width as each other or different widths from each other. The insulating pattern 23' may have a width similar to that of the reference FIG. 2B to FIG. 2D A shape similar to one of the insulating patterns 13' described above or referring to FIG. 2B to FIG. 2DA combination of shapes of the insulating pattern 13 ′ is described.

[0067] The third sidewall SW3 of each insulating pattern 23' may protrude further toward the channel structure CH than the first sidewall SW1. The third sidewall SW3 may protrude further toward the channel structure CH than the second sidewall SW2. The sixth sidewall SW6 of each first data storage pattern 25A may be located on the second extension line EXL2 of the third sidewall SW3.

[0068] According to reference Figure 3A and Figure 3B According to the structure described above, the second side wall SW2 of each conductive layer 21 may protrude farther toward the channel structure CH than the first side wall SW1 of the hard mask pattern HM. In addition, the third side wall SW3 of each insulating pattern 23 or 23' may protrude farther toward the channel structure CH than the second side wall SW2 of each conductive layer 21. Therefore, according to the above structure, data retention characteristics may be improved, and interference between stacked memory cells may be reduced.

[0069] Reference Figure 3C and Figure 3D , the semiconductor device according to an embodiment may further include a first material pattern 20. The first material pattern 20 may be interposed between the channel structure CH and the hard mask pattern HM. The first material pattern 20 may be interposed between the memory layer M or M′ and the hard mask pattern HM.

[0070] The first material pattern 20 may include a material having a high etching selectivity with respect to the insulating layer 22. The insulating layer 22 may include an oxide, and the first material pattern 20 may include a nitride. Both the first material pattern 20 and the hard mask pattern HM may include a nitride, and the first material pattern 20 may have a high etching selectivity with respect to the hard mask pattern HM. The hard mask pattern HM may be a nitride having a dopant such as carbon.

[0071] The channel structure CH may pass through the stack structure ST and the hard mask pattern HM. The channel structure CH may include a channel layer 27 and may further include at least one of a gap-filling layer 28 and a capping layer 29 .

[0072] The second side walls SW2 of each conductive layer 21 may protrude farther toward the channel structure CH than the first side walls SW1 of the hard mask pattern HM. The side walls SW2″ of the first material pattern 20 may be located on an extension line of the second side walls SW2. The memory layer M or M′ and the channel layer 27 may be formed along the side walls SW2″ of the first material pattern 20. Therefore, a portion of the channel structure CH that passes through the hard mask pattern HM may have an eighth width W8′. In addition, since the first material pattern 20 may compensate for the distance between the first side walls SW1 and the second side walls SW2, the first material pattern 20 may prevent steps from being generated on the side walls of the channel structure CH in the boundary between the hard mask pattern HM and the stacked structure ST.

[0073] Reference Figure 3C The memory layer 24 may include at least one of a barrier layer 24, a data storage layer 25, and a tunnel insulating layer 26. The data storage layer 25 may include a protrusion protruding between the insulating patterns 23. The insulating pattern 23 may have a thickness similar to that of the reference pattern 23. Figures 1B to 1D A shape similar to one of the insulating patterns 13 described above or referring to Figures 1B to 1D The third sidewall SW3 of each insulating pattern 23 may protrude further toward the channel structure CH than the first sidewall SW1. The third sidewall SW3 may protrude further toward the channel structure CH than the second sidewall SW2 and the sidewall SW2″ of the first material pattern 20.

[0074] Reference Figure 3D The memory layer M' may include at least one of a first barrier pattern 24A, a second barrier pattern 24B, a first data storage pattern 25A, a second data storage pattern 25B, and a tunnel insulating layer 26. The insulating pattern 23' may have a FIG. 2B to FIG. 2D A shape similar to one of the insulating patterns 13' described above or referring to FIG. 2B to FIG. 2D A combination of the shapes of the insulating patterns 13' described. The third side wall SW3 of each insulating pattern 23' may protrude farther toward the channel structure CH than the first side wall SW1. The third side wall SW3 may protrude farther toward the channel structure CH than the second side wall SW2 and the side wall SW2" of the first material pattern 20. The sixth side wall SW6 of each first data storage pattern 25A may be located on the second extension line EXL2 of the third side wall SW3.

[0075] According to reference Figure 3C and Figure 3DAccording to the structure described above, the second side wall SW2 of each conductive layer 21 may protrude farther toward the channel structure CH than the first side wall SW1 of the hard mask pattern HM. In addition, the third side wall SW3 of each of the insulating patterns 23 or 23' may protrude farther toward the channel structure CH than the second side wall SW2 of each conductive layer 21. Therefore, the first data storage patterns 25A may be separated from each other. Therefore, according to the above structure, the data retention characteristics may be improved, and the interference between the stacked memory cells may be reduced.

[0076] Figure 4A and Figure 4B is a diagram showing a structure of a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0077] Reference Figure 4A and Figure 4B , the semiconductor device may include a stacked structure ST, a hard mask pattern HM, a channel structure CH, an insulating pattern 33 or 33', and a memory layer M or M'. The stacked structure ST may include a conductive layer 31 and an insulating layer 32 alternately stacked on each other. The hard mask pattern HM may be located on the stacked structure ST. The channel structure CH may pass through the stacked structure ST and the hard mask pattern HM. The channel structure CH may include a channel layer 37, and may also include at least one of a gap filling layer 38 and a capping layer 39.

[0078] The insulating pattern 33 or 33' may be interposed between the insulating layer 32 and the channel structure CH. The insulating pattern 33 or 33' and the insulating layer 32 may be formed by different deposition methods. In addition, the insulating pattern 33 or 33' and the insulating layer 32 may have different material properties. For example, material properties such as nitrogen concentration, etching rate, thermal stability, and dielectric strength may be different.

[0079] The insulating layer 32 may be formed by a chemical vapor deposition (CVD) method. The insulating layer 32 may be deposited at a relatively high speed at a relatively high temperature. The insulating pattern 33 or 33' may be formed by a selective deposition method or an atomic layer deposition (ALD) method. The insulating pattern 33 or 33' may be deposited at a relatively low speed at a relatively low temperature. Therefore, the insulating layer 32 may have a film that is superior to the insulating pattern 33 or 33'. The insulating pattern 33 or 33' may have lower thermal stability, lower dielectric strength, and higher etching rate than the insulating layer 32.

[0080] The third side wall SW3 of each of the insulating patterns 33 or 33' may protrude farther toward the channel structure CH than the first side wall SW1. The third side wall SW3 may protrude farther toward the channel structure CH than the second side wall SW2. The second side wall SW2 of each conductive layer 31 may be located on the first extension line EXL1 of the first side wall SW1 of the hard mask pattern HM. The fourth side wall SW4 of each insulating layer 32 may be located on the first extension line EXL1 of the first side wall SW1.

[0081] Reference Figure 4A , the memory layer M may be interposed between the stack structure ST and the channel structure CH. The memory layer M may include at least one of a barrier layer 34, a data storage layer 35, and a tunnel insulating layer 36. The data storage layer 35 may include a first region R1 and a second region R2 having different thicknesses from each other. The first region R1 may include a protrusion protruding between adjacent insulating patterns 33.

[0082] Each insulating pattern 33 may include a first surface S1 facing the insulating layer 32 and a second surface S2 facing the channel structure CH. The first surface S1 may be flat and may be located on the first extension line EXL1 of the first sidewall SW1. The second surface S2 may be a surface defined by a deposition process and may include a curved surface.

[0083] Reference Figure 4B , the memory layer M' may be interposed between the stack structure ST and the channel structure CH. The memory layer M' may include at least one of a first barrier pattern 34A, a second barrier pattern 34B, a first data storage pattern 35A, a second data storage pattern 35B, and a tunnel insulating layer 36. The first barrier pattern 34A may be located between the insulating patterns 33' and may be separated from each other. The second barrier pattern 34B may extend to the first side wall SW1 of the hard mask pattern HM. The first data storage pattern 35A may be located between the insulating patterns 33' and may be separated from each other. The second data storage pattern 35B may extend to the first side wall SW1 of the hard mask pattern HM.

[0084] Each insulating pattern 33' may include a first surface S1 facing the insulating layer 32 and a second surface S2 facing the channel structure CH. Each of the first surface S1 and the second surface S2 may include a plane. The first surface S1 may be flat, and the second surface S2 may include a curved surface and a plane.

[0085] The sixth side wall SW6 of each of the first and second data storage patterns 35A and 35B may be located on the second extension line EXL2 of the third side wall SW3 .

[0086] According to the above structure, the third side wall SW3 of the insulating pattern 33 or 33' may protrude farther toward the channel structure CH than the second side wall SW2 of each conductive layer 31. Therefore, according to the above structure, the movement of charges between the memory cells that share the channel structure CH and the memory layer M or M' and are adjacent to each other in the second direction II may be alleviated. In addition, according to the above structure, the data retention characteristics may be improved, and the interference between the stacked memory cells may be reduced.

[0087] FIG. 5A to FIG. 5E is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0088] Reference Figure 5A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 41 and second material layers 42 alternately stacked with each other. The first material layers 41 and the second material layers 42 may be stacked in the second direction II. The first material layers 41 and the second material layers 42 may be formed by a deposition process such as a chemical vapor deposition (CVD) process.

[0089] The first material layer 41 may include a material having a high etching selectivity relative to the second material layer 42. For example, the first material layer 41 may include a sacrificial material such as a nitride, and the second material layer 42 may include an insulating material such as an oxide. In other examples, the first material layer 41 may include a conductive material such as polysilicon or tungsten, and the second material layer 42 may include an insulating material such as an oxide.

[0090] Subsequently, a hard mask pattern 43 may be formed on the stacked structure ST. The hard mask pattern 43 may include a material having an etching selectivity relative to the second material layer 42. The hard mask pattern 43 may include a nitride, a carbon-based material, or a combination thereof. The hard mask pattern 43 may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 43 may be defined by the first opening OP1. The first sidewall SW1 may be an etching surface and may be flat. The hard mask pattern 43 may be formed by forming a hard mask layer on the stacked structure ST and then patterning the hard mask layer. The first opening OP1 may have a uniform width or a width that decreases from an upper portion toward a lower portion of the first opening OP1.

[0091] Subsequently, the second opening OP2 may be formed through the stack structure ST. The second opening OP2 may be formed by etching the stack structure ST using the hard mask pattern 43 as an etch barrier. The second opening OP2 may be coupled to the first opening OP1.

[0092] The second opening OP2 may pass through the stacked structure ST in the second direction II. The second opening OP2 may have a uniform width or a width that decreases from the upper portion toward the lower portion of the second opening OP2. The second side wall SW2 of each first material layer 41 and the fourth side wall SW4 of each second material layer 42 may be defined by the second opening OP2. The second side wall SW2 and the fourth side wall SW4 may be etched surfaces and may be flat. The second side wall SW2 and the fourth side wall SW4 may be located on the first extension line EXL1 of the first side wall SW1.

[0093] Reference Figure 5B , a third opening OP3 may be formed by selectively etching the second material layer 42. The third opening OP3 may be connected to the second opening OP2. The fourth sidewall SW4' of each second material layer 42 may be redefined by the third opening OP3. The fourth sidewall SW4' may be retracted from the first extension line EXL1 and may be spaced farther from the second opening OP2 than the second sidewall SW2. The fourth sidewall SW4' may be an etched surface and may be a flat surface or a curved surface.

[0094] Subsequently, seed patterns 44 may be formed in the third opening OP3, respectively. The seed pattern 44 may include silicon and may be a polysilicon layer. The seed pattern 44 may be formed using a deposition process and an etching process. First, a seed material may be formed to fill the third opening OP3. The seed material may be formed using a deposition process. The seed material may be conformally formed along the inner surface of each of the first opening OP1, the second opening OP2, and the third opening OP3. Subsequently, the seed pattern 44 may be formed by etching the seed material. The seed pattern 44 may be formed by etching portions of the seed material formed in the first opening OP1 and the second opening OP2. The seed patterns 44 may be separated from each other.

[0095] Reference Figure 5C , insulating patterns 44A may be formed on the second material layer 42. The insulating patterns 44A may protrude further into the second opening OP2 than the first sidewall SW1. The third sidewall SW3 of each insulating pattern 44A may protrude further into the second opening OP2 than the first extension line EXL1.

[0096] The insulating pattern 44A may be formed by oxidizing the seed pattern 44. The insulating pattern 44A formed by the oxidation method may have different material properties compared to the second material layer 42 formed by the deposition method. The insulating pattern 44A may have a higher dielectric strength, a lower etching rate, and a higher thermal stability than the second material layer 42. The insulating pattern 44A may have fewer defects than the second material layer 42. The insulating pattern 44A may have a higher etching selectivity than the second material layer 42 and a high etching selectivity relative to nitride or polysilicon.

[0097] The fourth side wall SW4″ of each second material layer 42 may be redefined by an oxidation process. When the seed pattern 44 is oxidized, portions of each second material layer 42 may be oxidized simultaneously. The fourth side wall SW4″ may be retracted from the first extension line EXL1. The fourth side wall SW4″ may be spaced farther from the second opening OP2 than the second side wall SW2. The fourth side wall SW4″ may have a flat surface or a curved surface.

[0098] Each insulating pattern 44A may include a first portion P1 interposed between adjacent first material layers 41 and a second portion P2 protruding farther toward the second opening OP2 than the second sidewall SW2. The first portion P1 may include a first surface S1 contacting the second material layer 42, and the second portion P2 may include a second surface S2 facing the first surface S1. Each of the first surface S1 and the second surface S2 may include a curved surface. The second surface S2 may correspond to the third sidewall SW3.

[0099] Reference Figure 5D , a memory layer M and a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The memory layer M may include at least one of a barrier layer 45, a data storage layer 46, and a tunnel insulating layer 47. The channel structure CH may include at least one of a channel layer 48, a gap filling layer 49, and a capping layer 50.

[0100] First, a barrier layer 45 may be formed in the first opening OP1 and the second opening OP2. The barrier layer 45 may be formed along the inner surfaces of the first opening OP1 and the second opening OP2 and along the second surface S2 of each protruding insulating pattern 44A. Subsequently, a data storage layer 46 may be formed on the inner surface of the barrier layer 45. The data storage layer 46 may be formed using a deposition process and an etching process. After the data storage material is deposited on the barrier layer 45, the data storage material is etched. Therefore, a data storage layer 46 having a flat inner surface and an uneven outer surface may be formed. The data storage layer 46 may fill the space between the insulating patterns 44A and may include a protrusion protruding between the insulating patterns 44A. Subsequently, a tunnel insulating layer 47 may be formed on the inner surface of the data storage layer 46. Subsequently, after a channel layer 48 is formed on the inner surface of the tunnel insulating layer 47, a gap filling layer 49 may be formed in the space defined by the channel layer 48. Subsequently, after the gap filling layer 49 is partially etched, a capping layer 50 may be formed.

[0101] Reference Figure 5E, the first material layer 41 may be replaced by the third material layer 51. For example, in the case where the first material layer 41 includes a sacrificial material and the second material layer 42 includes an insulating material, the first material layer 41 may be replaced by a conductive layer. After removing the first material layer 41 and then forming an additional memory layer or a barrier layer, the conductive layer may be formed. In other examples, in the case where the first material layer 41 includes a conductive material and the second material layer 42 includes an insulating material, the first material layer 41 may be silicided.

[0102] The third sidewall SW3 of each insulation pattern 44A may protrude further toward the channel structure CH than the seventh sidewall SW7 of each third material layer 51. The seventh sidewall SW7 may correspond to the second sidewall SW2 of each first material layer 41. The seventh sidewall SW7 may be located on the first extension line EXL1.

[0103] In addition, since the insulating pattern 44A protrudes further than the first extension line EXL1, the data storage layer 46 can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0104] FIG. 6A to FIG. 6D is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0105] Reference Fig. 6A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 61 and second material layers 62 alternately stacked on each other. The first material layers 61 and the second material layers 62 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. Subsequently, a hard mask pattern 63 may be formed on the stacked structure ST. The hard mask pattern 63 may include a material having an etching selectivity with respect to the second material layer 62. The hard mask pattern 63 may include a nitride, a carbon-based material, or a combination thereof. The hard mask pattern 63 may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 63 may be defined by the first opening OP1.

[0106] Subsequently, the second opening OP2 may be formed through the stack structure ST using the hard mask pattern 63 as an etch barrier. The second sidewall SW2 of each first material layer 61 may be defined by the second opening OP2. The second sidewall SW2 may be located on the first extension line EXL1 of the first sidewall SW1.

[0107] Subsequently, the third opening OP3 may be formed by selectively etching the second material layer 62. The fourth sidewall SW4' of each second material layer 62 may be defined by the third opening OP3. The fourth sidewall SW4' may be spaced farther from the second opening OP2 than the first sidewall SW1.

[0108] Subsequently, seed patterns 64 may be formed in the third openings OP3, respectively. The seed patterns 64 may include silicon and may be a polysilicon layer. Figure 5B As described above, the seed pattern 64 may be formed by a deposition process and an etching process. In addition, the size of the seed pattern 64 may be increased by growing a seed material on the seed pattern 64 through a selective growth process. According to this embodiment, the seed pattern 64 may have a larger size than that according to the above reference Figure 5B The seed pattern of the described embodiment has a larger size. The seed pattern 64 may protrude further into the second opening OP2 than the first extension line EXL1.

[0109] Reference Figure 6B , insulating patterns 64A may be formed on the second material layers 62, respectively. The third side walls SW3 of each insulating pattern 64A may protrude further into the second opening OP2 than the first extension line EXL1. The insulating patterns 64A may be formed by oxidizing the seed pattern 64. The insulating patterns 64A formed by the oxidation process may have different material properties compared to the second material layers 62 formed by the deposition process. The fourth side walls SW4″ of each second material layer 62 may be retracted from the first extension line EXL1 by the oxidation process.

[0110] Each insulating pattern 64A may include a first portion P1 interposed between adjacent first material layers 61 and a second portion P2 protruding farther toward the second opening OP2 than the second sidewall SW2. The first portion P1 may include a first surface S1 contacting the second material layer 62, and the second portion P2 may include a second surface S2 facing the first surface S1. Each of the first surface S1 and the second surface S2 may include a curved surface. The second surface S2 may correspond to the third sidewall SW3.

[0111] Reference Figure 6C , a barrier layer 65 may be formed in the first opening OP1 and the second opening OP2. The barrier layer 65 may be formed along the inner surfaces of the first opening OP1 and the second opening OP2. Subsequently, a data storage layer 66 may be formed on the inner surface of the barrier layer 65. The data storage layer 66 may be formed along the inner surface of the barrier layer 65 and may fill the space between the insulating patterns 64A.

[0112] Reference Fig.6D, a first data storage pattern 66A, a second data storage pattern 66B, a first barrier pattern 65A, and a second barrier pattern 65B may be formed by etching the data storage layer 66 and the barrier layer 65. When the data storage layer 66 and the barrier layer 65 are etched, a portion of each insulating pattern 64B may be etched. The second portion P2 may be partially etched, and the etched second portion P2' may include a second surface S2'. The second surface S2' may include a plane, or may include a plane and a curved surface. The second surface S2' may correspond to the third sidewall SW3'.

[0113] The first barrier pattern 65A and the second barrier pattern 65B may be interposed between the first material layer 61 and the first data storage pattern 66A and the second data storage pattern 66B, respectively. The first barrier pattern 65A and the second barrier pattern 65B may be separated from each other. The first barrier pattern 65A may be located between the insulating patterns 64B and may be separated from each other. The second barrier pattern 65B may extend to the first side wall SW1 of the hard mask pattern 63. The first data storage pattern 66A and the second data storage pattern 66B may be interposed between the tunnel insulating layer 67 and the first barrier pattern 65A and the second barrier pattern 65B, respectively. The first data storage pattern 66A and the second data storage pattern 66B may be separated from each other. The first data storage pattern 66A may be located between the insulating patterns 64B and may be separated from each other. The second data storage pattern 66B may extend to the first side wall SW1. The sixth side wall SW6 of each of the first data storage pattern 66A and the second data storage pattern 66B may be located on the second extension line EXL2 of the third side wall SW3'.

[0114] Subsequently, a channel structure CH may be formed in the first and second openings OP1 and OP2. The channel structure CH may include a channel layer 68, a gap filling layer 69, and a capping layer 70. Subsequently, the first material layer 61 may be replaced by a third material layer 71. The third material layer 71 may be a metal layer, a silicide layer, or the like.

[0115] The third sidewall SW3' of each insulation pattern 64B may protrude further toward the channel structure CH than the seventh sidewall SW7 of each third material layer 71. The seventh sidewall SW7 may correspond to the second sidewall SW2 of each first material layer 61. The seventh sidewall SW7 may be located on the first extension line EXL1.

[0116] According to the above-described manufacturing method, the first data storage pattern 66A and the second data storage pattern 66B separated from each other can be easily formed. In addition, since the insulating pattern 64B protrudes farther toward the second opening OP2 than the first extension line EXL1, the first data storage pattern 66A and the second data storage pattern 66B can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0117] FIG. 7A to FIG. 7D is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0118] Reference Fig. 7A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 81 and second material layers 82 alternately stacked on each other. The first material layers 81 and the second material layers 82 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. Subsequently, a hard mask pattern 83 may be formed on the stacked structure ST. The hard mask pattern 83 may include an oxide, a carbon-based material, or a combination thereof. The hard mask pattern 83 may include a first opening OP1. The first sidewall SW1 of the hard mask pattern 83 may be defined by the first opening OP1.

[0119] Subsequently, a second opening OP2 may be formed through the stack structure ST. The second opening OP2 may be formed by etching the stack structure ST using the hard mask pattern 83 as an etching barrier. The second sidewall SW2 of each first material layer 81 and the fourth sidewall SW4 of each second material layer 82 may be defined by the second opening OP2. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1.

[0120] Subsequently, first material patterns 92 may be formed on the first material layers 81, respectively. The first material patterns 92 may be selectively grown on the first material layers 81, respectively. The first material patterns 92 may be formed after performing a surface treatment to accelerate the growth of the first material on the surface of each first material layer 81 or performing a surface treatment to hinder the growth of the first material on the surface of each second material layer 82.

[0121] The first material pattern 92 may include a material having a high etching selectivity with respect to the second material layer 82. The first material pattern 92 may include the same material as or a similar material to the first material layer 81. The first material pattern 92 may include a nitride. The second sidewall SW2' of each first material pattern 92 may protrude further into the second opening OP2 than the first sidewall SW1 and the fourth sidewall SW4.

[0122] Reference Figure 7B , each seed pattern 84 may be formed between adjacent first material patterns 92. The seed pattern 84 may include silicon and may be a polysilicon layer. The seed patterns 84 may be separated from each other. Figure 7B Although not shown in FIG. 8 , during the etching process after the deposition process of the seed material, the seed material may remain on the sidewalls of the hard mask pattern 83. According to this embodiment, the seed pattern may also be formed on the sidewalls of the hard mask pattern 83.

[0123] Reference Figure 7C, insulating patterns 84A may be formed on the second material layer 82. The insulating patterns 84A may protrude further into the second opening OP2 than the first sidewall SW1. The third sidewall SW3 of each insulating pattern 84A may protrude further into the second opening OP2 than the first extension line EXL1.

[0124] The insulating pattern 84A may be formed by selectively oxidizing the seed pattern 84. The insulating pattern 84A formed by the oxidation process may have different material properties compared to the second material layer 82 formed by the deposition process. The position of the fourth side wall SW4' of each second material layer 82 may be changed by the oxidation process. The fourth side wall SW4' may be located on the first extension line EXL1, or may be retracted from the first extension line EXL1. The fourth side wall SW4' may be spaced farther from the second opening OP2 than the second side wall SW2.

[0125] Each insulating pattern 84A may include a first surface S1 contacting the second material layer 82 and a second surface S2 facing the first surface S1. Each of the first surface S1 and the second surface S2 may include a curved surface. The second surface S2 may correspond to the third side wall SW3, and the first surface S1 may correspond to the fourth side wall SW4'.

[0126] Reference Fig.7D , a memory layer M and a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The memory layer M may include at least one of a barrier layer 85, a data storage layer 86, and a tunnel insulating layer 87. The channel structure CH may include at least one of a channel layer 88, a gap filling layer 89, and a capping layer 90.

[0127] Subsequently, the first material layer 81 and the first material pattern 92 may be replaced by a third material layer 91. The third material layer 91 may include a metal layer, a silicide layer, or the like.

[0128] The seventh side wall SW7 of each third material layer 91 may protrude farther toward the channel structure CH than the first side wall SW1. Each insulating pattern 84A may include a first portion P1 interposed between adjacent third material layers 91 and a second portion P2 protruding farther toward the channel structure CH than the seventh side wall SW7. The third side wall SW3 of each insulating pattern 84A may protrude farther toward the channel structure CH than the first side wall SW1 and the seventh side wall SW7.

[0129] According to the above manufacturing method, the data storage layer 86 having a thickness varying based on its area can be easily formed. In addition, since the third material layer 91 and the insulating pattern 84A protrude farther than the first extension line EXL1, the data storage layer 86 can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0130] FIG. 8A to FIG. 8C is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0131] Reference Fig. 8A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 101 and second material layers 102 alternately stacked on each other. The first material layers 101 and the second material layers 102 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. Subsequently, a hard mask pattern 103 may be formed on the stacked structure ST. The hard mask pattern 103 may include an oxide, a carbon-based material, or a combination thereof. The hard mask pattern 103 may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 103 may be defined by the first opening OP1.

[0132] Subsequently, the hard mask pattern 103 may be used as an etching barrier to form a second opening OP2 passing through the stacked structure ST. The second sidewall SW2 of each first material layer 101 and the fourth sidewall SW4 of each second material layer 102 may be defined by the second opening OP2. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1. Subsequently, the first material patterns 112 may be formed on the first material layers 101, respectively. The second sidewall SW2' of each first material pattern 112 may protrude further into the second opening OP2 than the first sidewall SW1 and the fourth sidewall SW4.

[0133] Subsequently, each seed pattern 104 may be formed between adjacent first material patterns 112. The seed pattern 104 may include silicon, and may be a polysilicon layer. The size of the seed pattern 104 may be increased by selectively growing a seed material on the seed pattern 104. The seed pattern 104 may protrude further into the second opening OP2 than the first extension line EXL1.

[0134] Reference Figure 8B , insulating patterns 104A may be formed on the second material layers 102, respectively. The third sidewall SW3 of each insulating pattern 104A may protrude further into the second opening OP2 than the first extension line EXL1. The insulating pattern 104A may be formed by oxidizing the seed pattern 104. The insulating pattern 104A formed by the oxidation process may have different material properties compared to the second material layer 102 formed by the deposition process. The fourth sidewall SW4' of each second material layer 102 may be retracted from the first extension line EXL1 by the oxidation process.

[0135] Subsequently, a barrier layer 105 may be formed in the first and second openings OP1 and OP2. Subsequently, a data storage layer 106 may be formed on an inner surface of the barrier layer 105. The data storage layer 106 may be formed along an inner surface of the barrier layer 105 and fill a space between the insulating patterns 104A.

[0136] Reference Figure 8C , a first data storage pattern 106A, a second data storage pattern 106B, a first barrier pattern 105A, and a second barrier pattern 105B may be formed by etching the data storage layer 106 and the barrier layer 105. Subsequently, a tunnel insulating layer 107 may be formed in the first opening OP1 and the second opening OP2. Thus, a memory layer M' may be formed.

[0137] When the data storage layer 106 and the barrier layer 105 are etched, a portion of each insulating pattern 104B may be etched. The second surface S2 of the second portion P2 may include a plane, or may include a plane and a curved surface. The second surface S2 may correspond to the third sidewall SW3'.

[0138] The first barrier pattern 105A may be located between the insulating patterns 104B and may be separated from each other. The second barrier pattern 105B may extend to the first sidewall SW1 of the hard mask pattern 103. The first data storage pattern 106A may be located between the insulating patterns 104B and may be separated from each other. The second data storage pattern 106B may extend to the first sidewall SW1. The sixth sidewall SW6 of each of the first data storage pattern 106A and the second data storage pattern 106B may be located on the second extension line EXL2 of the third sidewall SW3'.

[0139] Subsequently, a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The channel structure CH may include a channel layer 108, a gap filling layer 109, and a capping layer 110. Subsequently, the first material layer 101 and the first material pattern 112 may be replaced by a third material layer 111. The third material layer 111 may include a metal layer, a silicide layer, and the like.

[0140] The seventh sidewall SW7 of each third material layer 111 may protrude farther toward the channel structure CH than the first sidewall SW1. Each insulating pattern 104B may include a first portion P1 interposed between adjacent third material layers 111 and a second portion P2 protruding farther toward the channel structure CH than the seventh sidewall SW7. The third sidewall SW3' of each insulating pattern 104B may protrude farther toward the channel structure CH than the first sidewall SW1 and the seventh sidewall SW7.

[0141] According to the above-described manufacturing method, the first data storage pattern 106A and the second data storage pattern 106B separated from each other can be easily formed. In addition, since the insulating pattern 104B protrudes farther than the first extension line EXL1, the first data storage pattern 106A and the second data storage pattern 106B can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0142] Fig.9A and Fig. 9B is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0143] Reference Fig.9A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 81 and second material layers 82 alternately stacked on each other. The first material layers 81 and the second material layers 82 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. The first material layer 81 may include a nitride, and the second material layer 82 may include an oxide.

[0144] Subsequently, a hard mask pattern 83' may be formed on the stacked structure ST. The hard mask pattern 83' may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 83' may be defined by the first opening OP1. The hard mask pattern 83' may include a nitride and an impurity (e.g., carbon). The first material layer 81 may include a material having a higher etching selectivity than the hard mask pattern 83'. The first material layer 81 may include a silicon nitride (SiNx) layer, and the hard mask pattern 83' may include a silicon nitride carbon (SiCN) layer.

[0145] Subsequently, a second opening OP2 may be formed through the stack structure ST. The second opening OP2 may be formed by etching the stack structure ST using the hard mask pattern 83' as an etch barrier. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1.

[0146] Subsequently, first material patterns 92 may be selectively formed on the first material layers 81, respectively. Since the hard mask pattern 83' includes nitride, the first material pattern 92' may be formed on the first sidewall SW1 of the hard mask pattern 83'. The first material pattern 92 formed on the first material layer 81 contacting the hard mask pattern 83' and the first material pattern 92' formed on the hard mask pattern 83' may be a single layer coupled to each other.

[0147] The first material patterns 92 and 92' may include a material having a high etching selectivity relative to the second material layer 82 and the hard mask pattern 83'. The first material patterns 92 and 92' may include a material substantially the same as or similar to the first material layer 81. The first material patterns 92 and 92' may include nitride. The second side wall SW2' of each first material pattern 92 and the side wall SW2" of the first material pattern 92' may protrude farther into the second opening OP2 than the first side wall SW1 and the fourth side wall SW4. Therefore, the width of the first opening OP1 may be reduced. In addition, the width of the portion of the second opening OP2 corresponding to each first material layer 81 may be reduced.

[0148] Subsequently, each seed pattern 84 may be formed between adjacent first material patterns 92 and 92'. The seed pattern 84 may include silicon, and may be a polysilicon layer. The seed patterns 84 may be separated from each other.

[0149] Reference Fig. 9B , insulating patterns 84A may be formed on the second material layer 82, respectively. The insulating patterns 84A may be formed by selectively oxidizing the seed pattern 84. The insulating patterns 84A formed by the oxidation process may have different material properties compared to the second material layer 82 formed by the deposition process. The insulating patterns 84A may protrude further into the second opening OP2 than the first sidewall SW1. The sidewall SW3 of each insulating pattern 84A may protrude further into the second opening OP2 than the first extension line EXL1.

[0150] Subsequently, a memory layer M and a channel structure CH may be formed in the first and second openings OP1 and OP2. The memory layer M may include at least one of a barrier layer 85, a data storage layer 86, and a tunnel insulating layer 87. The channel structure CH may include at least one of a channel layer 88, a gap filling layer 89, and a capping layer 90.

[0151] Subsequently, the first material layer 81 and the first material pattern 92 may be replaced by the third material layer 91. After forming a slit (not shown) passing through the hard mask pattern 83' and the stacked structure ST, and then etching the first material layer 81 and the first material pattern 92 exposed by the slit, the third material layer 91 may be formed in the area where the first material layer 81 is removed. Since the first material layer 81 is selectively etched, the hard mask pattern 83' may not be etched, and the first material pattern 92' may not be exposed. Therefore, the first material pattern 92' may remain between the memory layer M and the hard mask pattern 83'. Alternatively, an area of ​​the first material pattern 92' adjacent to the first material pattern 92 may be partially etched, and the third material layer 91 may fill the etched area of ​​the first material pattern 92' or the gap may be defined as the etched area of ​​the first material pattern 92'. The sidewall SW2" of the first material pattern 92' may be located on the extension line of the seventh sidewall SW7.

[0152] According to the above-described manufacturing method, the widths of the first opening OP1 and the second opening OP2 may be reduced using the first material patterns 92 and 92' In addition, the data storage layer 86 having a thickness varying based on its area may be easily formed.

[0153] Fig. 10A and Fig. 10B is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0154] Reference Fig. 10A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 101 and second material layers 102 alternately stacked on each other. The first material layers 101 and the second material layers 102 may be formed by a deposition method such as a chemical vapor deposition (CVD) method. The first material layer 101 may include a nitride, and the second material layer 102 may include an oxide.

[0155] Subsequently, a hard mask pattern 103' may be formed on the stacked structure ST. The hard mask pattern 103' may include nitride and impurities (e.g., carbon). The first material layer 101 may include a material having a higher etching selectivity than the hard mask pattern 103'. The hard mask pattern 103' may include a first opening OP1. The first sidewall SW1 of the hard mask pattern 103' may be defined by the first opening OP1.

[0156] Subsequently, the hard mask pattern 103' may be used as an etching barrier to form a second opening OP2 through the stacked structure ST. The second sidewall SW2 of each first material layer 101 and the fourth sidewall SW4 of each second material layer 102 may be defined by the second opening OP2. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1.

[0157] Subsequently, a first material pattern 112 may be selectively formed on the first material layer 101. Since the hard mask pattern 103' includes nitride, the first material pattern 112' may be formed on the first sidewall SW1 of the hard mask pattern 103'.

[0158] Subsequently, a seed pattern 104 may be formed between the first material patterns 112 and 112 ′. The size of the seed pattern 104 may be increased by selectively growing a seed material on the seed pattern 104.

[0159] Reference Fig. 10B, insulating patterns 104B may be formed on the second material layer 102, respectively. The sidewall SW3' of each insulating pattern 104B may protrude further into the second opening OP2 than the first extension line EXL1. The insulating pattern 104B may be formed by oxidizing the seed pattern 104. The insulating pattern 104B formed by the oxidation process may have different material properties compared to the second material layer 102 formed by the deposition process.

[0160] Subsequently, a memory layer M' and a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The memory layer M' may include at least one of a first data storage pattern 106A, a second data storage pattern 106B, a first barrier pattern 105A, a second barrier pattern 105B, and a tunnel insulating layer 107. The channel structure CH may include a channel layer 108, and may further include at least one of a gap filling layer 109 and a capping layer 110.

[0161] Subsequently, the first material layer 101 and the first material pattern 112 may be replaced by the third material layer 111. The first material pattern 112' may remain between the memory layer M' and the hard mask pattern 103'. The sidewall SW2' of the first material pattern 112' may be located on an extension line of the seventh sidewall SW7.

[0162] According to the above-described manufacturing method, the widths of the first and second openings OP1 and OP2 may be reduced using the first material patterns 112 and 112 ′. In addition, the first and second data storage patterns 106A and 106B separated from each other by the insulating pattern 104B may be easily formed.

[0163] FIG. 11A to FIG. 11C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment. FIG. 5A to FIG. 5E The insulating pattern 44A described above with reference to FIG. 6A to FIG. 6D The insulating pattern 64A described above with reference to FIG. 7A to FIG. 7D , Fig.9A and Fig. 9B The insulating pattern 84A described above or the FIG. 8A to FIG. 8C , Fig. 10A and Fig. 10B This embodiment can be applied when the insulating patterns 104A and 104B are described.

[0164] Reference Fig.11A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 1 and second material layers 2 alternately stacked on each other. Subsequently, a hard mask pattern (not shown) having a first opening may be formed on the stacked structure ST. Subsequently, a second opening OP2 may be formed through the stacked structure ST using the hard mask pattern as an etching barrier.

[0165] Subsequently, the third opening OP3 may be formed by selectively etching the second material layer 2. The third opening OP3 may be connected to the second opening OP2. Subsequently, seed patterns 3 may be formed in the third openings OP3, respectively. The seed patterns 3 may fill the third openings OP3 completely or partially, respectively. Each seed pattern 3 may have substantially the same thickness T1 as each second material layer 2.

[0166] Reference Fig. 11B , a seed material may be selectively grown from the seed pattern 3 by a selective growth process. The seed material may be grown from the surface of each seed pattern 3. Therefore, the seed pattern 3A may further protrude into the second opening OP2. Each seed pattern 3A may include a first portion P1 interposed between adjacent first material layers 1 and a second portion P2 protruding further toward the second opening OP2 than the sidewall of each first material layer 1. The second portion P2 may have a thickness greater than that of each second material layer 2 (T2>T1).

[0167] Reference Fig. 11C , the insulating pattern 3B may be formed by oxidizing the seed pattern 3A. Each insulating pattern 3B may include a first portion P1' interposed between adjacent first material layers 1 and a second portion P2' protruding further toward the second opening OP2 than the sidewall of each first material layer 1. The second portion P2' may have a thickness greater than that of each second material layer 2 (T3>T1). In addition, the insulating pattern 3B may protrude further into the second opening OP2 than the first material layer 1.

[0168] According to the above-described process, the size of the insulating pattern 3B may be easily adjusted. The insulating pattern 3B may further protrude into the second opening OP2 by selectively growing the seed material.

[0169] FIG. 12A to FIG. 12C is a diagram showing a method for manufacturing a semiconductor device according to an embodiment. According to an embodiment, the adjustment of the above reference FIG. 5A to FIG. 5E The insulating pattern 44A described above with reference to FIG. 6A to FIG. 6D The insulating pattern 64A described above with reference to FIG. 7A to FIG. 7D , Fig.9A and Fig. 9B The insulating pattern 84A described above or the FIG. 8A to FIG. 8C , Fig. 10A and Fig. 10B A method of sizing the insulating patterns 104A and 104B is described.

[0170] Reference Fig. 12A, a stacked structure ST can be formed. The stacked structure ST may include a first material layer 1 and a second material layer 2 that are alternately stacked with each other. Subsequently, a second opening OP2 can be formed through the stacked structure ST. Subsequently, a third opening OP3 can be formed by selectively etching the second material layer 2. Subsequently, seed patterns 4 can be formed in the third opening OP3, respectively.

[0171] Referring to Fig. 12B , a seed material can be selectively grown from the seed pattern 4 through a selective growth process. Thus, the seed pattern 4A can further protrude into the second opening OP2. Each seed pattern 4A may include a first portion P1 interposed between adjacent first material layers 1 and a second portion P2 that protrudes further toward the second opening OP2 than the sidewalls of each first material layer 1. The size of the second portion P2 can be adjusted by adjusting the amount of the seed material to be grown. The second portion P2 may have a thickness less than that of each second material layer 2 (T4 < T1).

[0172] Referring to Fig. 12C , an insulating pattern 4B can be formed by oxidizing the seed pattern 4A. Each insulating pattern 4B may include a first portion P1' interposed between adjacent first material layers 1 and a second portion P2' that protrudes further toward the second opening OP2 than the sidewalls of each first material layer 1. The second portion P2' may have a thickness less than that of each second material layer 2 (T5 < T1). In addition, the insulating pattern 4B may protrude further into the second opening OP2 than the first material layer 1.

[0173] According to the above process, the size of the insulating pattern 4B can be adjusted by adjusting the amount of the seed material to be selectively grown.

[0174] FIG. 13A to FIG. 13C is a diagram showing a method of manufacturing a semiconductor device according to an embodiment. According to an embodiment, a method of adjusting the size of the insulating pattern 44A described above with reference to FIG. 5A to FIG. 5E described above, the insulating pattern 64A described above with reference to FIG. 6A to FIG. 6D described above, FIG. 7A to FIG. 7D , Fig.9A and Fig. 9B described above, or the insulating pattern 84A described above with reference to FIG. 8A to FIG. 8C , Fig. 10A and Fig. 10B described above, or the insulating patterns 104A and 104B described above with reference to

[0175] Referring to Fig.13A, a stacked structure ST may be formed. The stacked structure ST may include a first material layer 1 and a second material layer 2 alternately stacked with each other. Subsequently, a second opening OP2 may be formed through the stacked structure ST. Subsequently, a third opening OP3 may be formed by selectively etching the second material layer 2. Subsequently, seed patterns 5A may be formed in the third openings OP3, respectively. When forming the seed pattern 5A, the size of the seed pattern 5A may be adjusted by selectively growing a seed material through a selective growth process.

[0176] Reference Fig. 13B The insulating pattern 5B may be formed by oxidizing the seed pattern 5A. The insulating pattern 5B may include a first portion P1 interposed between adjacent first material layers 1 and a second portion P2 protruding further than the sidewalls of each first material layer 1 toward the second opening OP2.

[0177] Reference Fig. 13C , the size of the insulating pattern 5C may be adjusted. The size of the insulating pattern 5C may be reduced by etching the insulating pattern 5C. The size of the insulating pattern 5C may be reduced by etching the second portion P2' of the insulating pattern 5C protruding into the second opening OP2 during the etching process.

[0178] According to the above-described process, the size of the insulating pattern 5C may be adjusted through an additional etching process.

[0179] FIG. 14A to FIG. 14C is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0180] Reference Fig.14A , a stacked structure ST may be formed. The stacked structure ST may include first material layers 121 and second material layers 122 alternately stacked with each other. The first material layers 121 and the second material layers 122 may be formed by a deposition process such as a chemical vapor deposition (CVD) process. The first material layer 121 may include a material having a high etching selectivity relative to the second material layer 122.

[0181] Subsequently, a hard mask pattern 123 may be formed on the stack structure ST. The hard mask pattern 123 may include oxide, nitride, a carbon-based material, or a combination thereof. The hard mask pattern 123 may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 123 may be defined by the first opening OP1.

[0182] Subsequently, a second opening OP2 may be formed through the stack structure ST. The second opening OP2 may be formed by etching the stack structure ST using the hard mask pattern 123 as an etching barrier. The second sidewall SW2 of each first material layer 121 and the fourth sidewall SW4 of each second material layer 122 may be defined by the second opening OP2. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1.

[0183] Reference Fig. 14B , insulating patterns 124 protruding further into the second openings OP2 than the sidewalls SW1 of the hard mask patterns 123 may be formed on the second material layers 122, respectively. The insulating patterns 124 may be formed by selectively depositing an insulating material on the second material layers 122. The insulating patterns 124 may be formed after performing a surface treatment to accelerate the growth of insulating materials on the surfaces of the respective second material layers 122 or performing a surface treatment to hinder the growth of insulating materials on the surfaces of the respective first material layers 121.

[0184] The insulating pattern 124 may include a material having a high etching selectivity with respect to the first material layer 121. The insulating pattern 124 and the second material layer 122 may include substantially the same material. The sidewall SW3 of each insulating pattern 124 may protrude further into the second opening OP2 than the first extension line EXL1. The insulating patterns 124 may be separated from each other.

[0185] Each insulating pattern 124 may include a first surface S1 contacting the second material layer 122 and a second surface S2 facing the first surface S1. The first surface S1 may include a plane and may be flat. The second surface S2 may include a curved surface. The first surface S1 may correspond to the fourth side wall SW4, and the second surface S2 may correspond to the third side wall SW3.

[0186] The insulating pattern 124 and the second material layer 122 may be formed by different deposition methods. For example, when the deposition method is performed, conditions such as deposition temperature and deposition speed may be different. Therefore, the insulating pattern 124 and the second material layer 122 may have different material properties. For example, material properties such as nitrogen concentration, etching rate, thermal stability, and dielectric strength may be different.

[0187] The second material layer 122 may be formed by a chemical vapor deposition (CVD) method. The second material layer 122 may be formed at a relatively high temperature and at a relatively high deposition rate compared to the insulating pattern 124. The insulating pattern 124 may be formed by a selective deposition method or an atomic layer deposition (ALD) method. The insulating pattern 124 may be formed at a relatively low temperature and at a relatively low deposition rate compared to the second material layer 122. Therefore, the second material layer 122 may have an excellent film compared to the insulating pattern 124. The insulating pattern 124 may have lower thermal stability, lower dielectric strength, higher etching rate, etc. compared to the second material layer 122.

[0188] In addition, since the first material layer 121 and the second material layer 122 are alternately deposited when the stacked structure ST is formed, a substance (e.g., nitrogen) of the first material layer 121 may diffuse into the second material layer 122. Therefore, the second material layer 122 may contain nitrogen and its composition may change. On the other hand, when the insulating pattern 124 is deposited, nitrogen may not be introduced, and the change in the composition of the insulating pattern 124 may be relatively small compared to the second material layer 122.

[0189] Reference Fig. 14C , a memory layer M and a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The memory layer M may include at least one of a barrier layer 125, a data storage layer 126, and a tunnel insulating layer 127. The channel structure CH may include at least one of a channel layer 128, a gap filling layer 129, and a capping layer 130.

[0190] Subsequently, the first material layer 121 may be replaced by the third material layer 131. The third material layer 131 may include a metal layer, a silicide layer, etc. The seventh side wall SW7 of each third material layer 131 may be located on the first extension line EXL1 of the first side wall SW1. The third side wall SW3 of each insulating pattern 124 may protrude further toward the channel structure CH than the first side wall SW1, the fourth side wall SW4, and the seventh side wall SW7.

[0191] In addition, since the insulating pattern 124 protrudes further than the first extension line EXL1, the data storage layer 126 can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0192] Fig.15A and Fig. 15B is a diagram illustrating a method of manufacturing a semiconductor device according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0193] Reference Fig.15A, a stack structure ST may be formed. The stack structure ST may include first material layers 141 and second material layers 142 alternately stacked with each other. The first material layers 141 and the second material layers 142 may be formed by a deposition process such as a chemical vapor deposition (CVD) process.

[0194] Subsequently, a hard mask pattern 143 may be formed on the stack structure ST. The hard mask pattern 143 may include oxide, nitride, a carbon-based material, or a combination thereof. The hard mask pattern 143 may include a first opening OP1. A first sidewall SW1 of the hard mask pattern 143 may be defined by the first opening OP1.

[0195] Subsequently, a second opening OP2 may be formed through the stack structure ST. The second opening OP2 may be formed by etching the stack structure ST using the hard mask pattern 143 as an etching barrier. The second sidewall SW2 of each first material layer 141 and the fourth sidewall SW4 of each second material layer 142 may be defined by the second opening OP2. The second sidewall SW2 and the fourth sidewall SW4 may be located on the first extension line EXL1 of the first sidewall SW1.

[0196] Subsequently, insulating patterns 144 that protrude further into the second opening OP2 than the sidewalls SW1 of the hard mask patterns 143 may be formed on the second material layers 142, respectively. The insulating patterns 144 may be formed by selectively depositing an insulating material on the second material layers 142. The sidewalls SW3 of each insulating pattern 144 may protrude further into the second opening OP2 than the first extension lines EXL1. The insulating patterns 144 and the second material layers 142 may be formed by different deposition methods and may have different material properties.

[0197] Reference Fig. 15B , a memory layer M' and a channel structure CH may be formed in the first opening OP1 and the second opening OP2. First, after forming a barrier layer and a data storage layer in the first opening OP1 and the second opening OP2, a first data storage pattern 146A, a second data storage pattern 146B, a first barrier pattern 145A, and a second barrier pattern 145B may be formed by etching the data storage layer and the barrier layer. When the data storage layer and the barrier layer are etched, a portion of the insulating pattern 144 may be etched. The etched insulating pattern 144A may include a third side wall SW3' each having a plane. The sixth side wall SW6 of each of the first data storage pattern 146A and the second data storage pattern 146B may be located on the second extension line EXL2 of the third side wall SW3'.

[0198] Subsequently, a channel structure CH may be formed in the first opening OP1 and the second opening OP2. The channel structure CH may include at least one of a channel layer 148, a gap filling layer 149, and a capping layer 150. Subsequently, the first material layer 141 may be replaced by a third material layer 151. The third material layer 151 may include a metal layer, a silicide layer, etc. The seventh side wall SW7 of each third material layer 151 may be located on a first extension line EXL1 of the first side wall SW1. The third side wall SW3' may protrude further toward the channel structure CH than the first side wall SW1, the fourth side wall SW4, and the seventh side wall SW7.

[0199] According to the above-described manufacturing method, the first data storage pattern 146A and the second data storage pattern 146B separated from each other can be easily formed. In addition, since the insulating pattern 144A protrudes farther than the first extension line EXL1, the first data storage pattern 146A and the second data storage pattern 146B can be easily formed without extending the width or diameter of the second opening OP2 in the first direction I.

[0200] Fig.16A and Fig. 16B is a diagram showing a method for manufacturing a semiconductor device according to an embodiment. FIG. 14A to FIG. 14C The insulating pattern 124 described above or the Fig.15A and Fig. 15B This embodiment can be applied when the insulating pattern 144 is described.

[0201] Reference Fig.16A , a stack structure ST may be formed. The stack structure ST may include first material layers 1 and second material layers 2 alternately stacked with each other. Subsequently, a second opening OP2 may be formed through the stack structure ST.

[0202] Subsequently, insulating patterns 6 may be formed on the second material layers 2, respectively. The insulating patterns 6 may be formed by selectively depositing insulating materials on the surfaces of the respective second material layers 2. The size of the insulating patterns 6 may be adjusted according to the amount of insulating material to be deposited. The respective insulating patterns 6 may be deposited to have a thickness greater than that of the respective second material layers 2 (T6>T1), a corresponding thickness of the respective second material layers 2 (T6=T1), or a thickness less than that of the respective second material layers 2 (T6>T1). <T1)。

[0203] Reference Fig. 16B , the size of the insulating pattern 6 can be reduced. The insulating pattern 6A having a reduced thickness T7 can be formed by etching the insulating pattern 6. The thickness of each insulating pattern 6A can be adjusted to be greater than the thickness of each second material layer 2 (T7>T1), to correspond to the thickness of each second material layer 2 (T7=T1), or to be less than the thickness of each second material layer 2 (T7>T1). <T1)。

[0204] According to the above-described process, the size of the insulating pattern 6A can be easily adjusted. In addition, the protrusion degree of the insulating pattern 6A into the second opening OP2 can be adjusted.

[0205] Fig.17 is a block diagram showing a configuration of a memory system 1000 according to an embodiment.

[0206] Reference Fig.17 , the memory system 1000 may include a memory device 1200 and a controller 1100 .

[0207] The memory device 1200 may be used to store data information in various data formats such as text format, graphic format, and software code format. The memory device 1200 may be a non-volatile memory device. In addition, the memory device 1200 may have the above reference Figures 1A to 16B The memory device 1200 can be referred to above. Figures 1A to 16B The memory device 1200 is manufactured by the manufacturing method described above. According to an embodiment, the memory device 1200 may include: a stacked structure having an insulating layer and a conductive layer alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure passing through the hard mask pattern and the stacked structure; an insulating pattern interposed between the insulating layer and the channel structure and protruding further toward the channel structure than the sidewall of the hard mask pattern; and a memory layer interposed between the stacked structure and the channel structure and filling the space between the insulating patterns. Since the memory device 1200 is configured and manufactured in the same manner as described above, its detailed description will be omitted.

[0208] The controller 1100 may be coupled to the host and the memory device 1200 and may be configured to access the memory device 1200 in response to a request from the host. For example, the controller 1100 may control a read operation, a write operation, an erase operation, and a background operation of the memory device 1200.

[0209] The controller 1100 may include a random access memory (RAM) 1110 , a central processing unit (CPU) 1120 , a host interface 1130 , an error correction code (ECC) circuit 1140 , a memory interface 1150 , and the like.

[0210] The RAM 1110 may be used as an operation memory of the CPU 1120, a cache memory between the memory device 1200 and the host, a buffer memory between the memory device 1200 and the host, etc. The RAM 1110 may be replaced by a static random access memory (SRAM), a read only memory (ROM), etc.

[0211] The CPU 1120 may control the overall operation of the controller 1100. For example, the CPU 1120 may operate firmware such as a flash translation layer (FTL) stored in the RAM 1110.

[0212] The host interface 1130 may interface with the host. For example, the controller 1100 may communicate with the host through at least one of various interface protocols such as a universal serial bus (USB) protocol, a multimedia card (MMC) protocol, a peripheral component interconnect (PCI) protocol, a high-speed PCI (PCI-E) protocol, an advanced technology attachment (ATA) protocol, a serial ATA protocol, a parallel ATA protocol, a small computer interface (SCSI) protocol, an enhanced minidisk interface (ESDI) protocol, an integrated drive electronics (IDE) protocol, a proprietary protocol, etc.

[0213] The ECC circuit 1140 may detect and correct errors in data read from the memory device 1200 using an error correction code (ECC).

[0214] The memory interface 1150 may interface with the memory device 1200. For example, the memory interface 1150 may include a NAND interface or a NOR interface.

[0215] The controller 1100 may further include a buffer memory (not shown) for temporarily storing data. The buffer memory may be used to temporarily store data transmitted to an external device through the host interface 1130 or data transmitted from the memory device 1200 through the memory interface 1150. In addition, the controller 1100 may further include a ROM storing code data for interfacing with the host.

[0216] Since the memory system 1000 according to the embodiment includes the memory device 1200 having improved integration density and characteristics, the integration density and characteristics of the memory system 1000 may also be improved.

[0217] Fig.18 1 is a block diagram showing a configuration of a memory system 1000 ′ according to an embodiment. Hereinafter, any repeated description of components already mentioned above will be omitted.

[0218] Reference Fig.18 , the memory system 1000' may include a memory device 1200' and a controller 1100. In addition, the controller 1100 may include a RAM 1110, a CPU 1120, a host interface 1130, an ECC circuit 1140, a memory interface 1150, and the like.

[0219] The memory device 1200' may be a non-volatile memory device. In addition, the memory device 1200' may have a Figures 1A to 16B The structure described above can be Figures 1A to 16B The memory device 1200' may be manufactured by the manufacturing method described above. According to an embodiment, the memory device 1200' may include: a stacked structure having an insulating layer and a conductive layer alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure passing through the hard mask pattern and the stacked structure; an insulating pattern interposed between the insulating layer and the channel structure and protruding further toward the channel structure than the sidewall of the hard mask pattern; and a memory layer interposed between the stacked structure and the channel structure and filling the space between the insulating patterns. Since the memory device 1200' is configured and manufactured in the same manner as described above, its detailed description will be omitted.

[0220] In addition, the memory device 1200' may be a multi-chip package having a plurality of memory chips. The plurality of memory chips may be divided into a plurality of groups, which may communicate with the controller 1100 through the first channel CH1 to the kth channel CHk, respectively. In addition, the memory chips included in a single group may communicate with the controller 1100 through a common channel. The memory system 1000' may be modified so that a single memory chip may be connected to a single channel.

[0221] Since the memory system 1000' according to the embodiment includes the memory device 1200' having improved integration density and characteristics, the integration density and characteristics of the memory system 1000' may also be improved. In addition, since the memory device 1200' is formed as a multi-chip package, the data storage capacity and driving speed of the memory system 1000' may be enhanced.

[0222] Fig.19 2 is a block diagram showing a configuration of a computing system 2000 according to an embodiment. Hereinafter, any repeated description of the components already mentioned above will be omitted.

[0223] Reference Fig.19 , the computing system 2000 may include a memory device 2100, a CPU 2200, a RAM 2300, a user interface 2400, a power supply 2500, a system bus 2600, and the like.

[0224] The memory device 2100 may store data provided via the user interface 2400, data processed by the CPU 2200, etc. In addition, the memory device 2100 may be electrically coupled to the CPU 2200, the RAM 2300, the user interface 2400, the power supply 2500, etc. through the system bus 2600. For example, the memory device 2100 may be coupled to the system bus 2600 via a controller (not shown), or alternatively, directly coupled to the system bus 2600. When the memory device 2100 is directly coupled to the system bus 2600, the function of the controller may be performed by the CPU 2200 and the RAM 2300.

[0225] The memory device 2100 may be a nonvolatile memory device. Figures 1A to 16B The structure described above can be Figures 1A to 16B The memory device 2100 is manufactured by the manufacturing method described above. According to an embodiment, the memory device 2100 may include: a stacked structure having an insulating layer and a conductive layer alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure passing through the hard mask pattern and the stacked structure; an insulating pattern inserted between the insulating layer and the channel structure and protruding further toward the channel structure than the sidewall of the hard mask pattern; and a memory layer inserted between the stacked structure and the channel structure and filling the space between the insulating patterns. Since the memory device 2100 is configured and manufactured in the same manner as described above, its detailed description will be omitted.

[0226] In addition, as mentioned above Fig.18 As depicted, the memory device 2100 may be a multi-chip package having a plurality of memory chips.

[0227] The computing system 2000 having the above configuration may be configured as one of various elements of an electronic device such as a computer, an ultra mobile PC (UMPC), a workstation, a netbook, a personal digital assistant (PDA), a portable computer, a web tablet computer, a wireless phone, a mobile phone, a smart phone, an e-book, a portable multimedia player (PMP), a game console, a navigation device, a black box, a digital camera, a three-dimensional television, a digital audio recorder, a digital audio player, a digital photo recorder, a digital photo player, a digital video recorder, a digital video player, a device capable of sending / receiving information in a wireless environment, one of various electronic devices for forming a home network, one of various electronic devices for forming a computer network, one of various electronic devices for forming an information communication network, an RFID device, and the like.

[0228] As described above, since the computing system 2000 according to the embodiment includes the memory device 2100 having improved integration density and characteristics, the characteristics of the computing system 2000 may also be improved.

[0229] Fig. 20 is a block diagram illustrating a computing system 3000 according to an embodiment.

[0230] Reference Fig. 20 , the computing system 3000 may include a software layer including an operating system 3200 , an application 3100 , a file system 3300 , and a translation layer 3400 . In addition, the computing system 3000 may include a hardware layer such as a memory device 3500 .

[0231] The operating system 3200 may manage software resources and hardware resources of the computing system 3000. The operating system 3200 may control program execution of the central processing unit. The application 3100 may include various application programs executed by the computing system 3000. The application 3100 may be a utility program executed by the operating system 3200.

[0232] The file system 3300 may refer to a logical structure configured to manage data and files present in the computing system 3000. The file system 3300 may organize files or data to be stored in the memory device 3500 according to a given rule. The file system 3300 may be determined according to the operating system 3200 used in the computing system 3000. For example, when the operating system 3200 is a system based on Microsoft Windows, the file system 3300 may be a file allocation table (FAT), an NT file system (NTFS), etc. In addition, when the operating system 3200 is a system based on Unix / Linux, the file system 3300 may be an extended file system (EXT), a Unix file system (UFS), a journaled file system (JFS), etc.

[0233] Fig. 20 The operating system 3200, the application 3100, and the file system 3300 are shown as separate blocks. However, the application 3100 and the file system 3300 may be included in the operating system 3200.

[0234] In response to a request from the file system 3300, the translation layer 3400 may translate an address into a form suitable for the memory device 3500. For example, the translation layer 3400 may translate a logical address generated by the file system 3300 into a physical address of the memory device 3500. Mapping information of the logical address and the physical address may be stored in an address translation table. For example, the translation layer 3400 may be a flash translation layer (FTL), a universal flash link layer (ULL), etc.

[0235] The memory device 3500 may be a nonvolatile memory device. Figures 1A to 16B The structure described above can be Figures 1A to 16BThe memory device 3500 is manufactured by the manufacturing method described above. According to an embodiment, the memory device 3500 may include: a stacked structure having an insulating layer and a conductive layer alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure passing through the hard mask pattern and the stacked structure; an insulating pattern interposed between the insulating layer and the channel structure and protruding further toward the channel structure than the sidewall of the hard mask pattern; and a memory layer interposed between the stacked structure and the channel structure and filling the space between the insulating patterns. Since the memory device 3500 is configured and manufactured in the same manner as described above, its detailed description will be omitted.

[0236] The computing system 3000 having the above configuration may be divided into an operating system layer operating in an upper region and a controller layer operating in a lower region. The application 3100, the operating system 3200, and the file system 3300 may be included in the operating system layer and may be driven by an operating memory of the computing system 3000. The conversion layer 3400 may be included in the operating system layer or the controller layer.

[0237] As described above, since the computing system 3000 according to the embodiment includes the memory device 3500 having improved integration density and characteristics, the characteristics of the computing system 3000 may also be improved.

[0238] According to the present disclosure, a semiconductor device having a stable structure and improved reliability can be provided. In addition, a method of manufacturing a semiconductor device can be simplified, making the process less difficult and the manufacturing cost lower.

[0239] CROSS-REFERENCE TO RELATED APPLICATIONS

[0240] This application claims the priority benefit of Korean Patent Application No. 10-2020-0021284 filed on February 20, 2020, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference.

Claims

1. A semiconductor device, comprising: a stacked structure having a plurality of insulating layers and a plurality of conductive layers alternately stacked on each other; a hard mask pattern on the stacked structure; a channel structure penetrating the hard mask pattern and the stacked structure; a plurality of insulating patterns directly contacting sidewalls of the plurality of insulating layers and interposed between the plurality of insulating layers and the channel structure, wherein the insulating patterns protrude further toward the channel structure than the sidewalls of the hard mask patterns; and a memory layer interposed between the stacked structure and the channel structure, wherein the memory layer fills the space between the plurality of the insulating patterns, Wherein, the memory layer includes a barrier layer and a tunnel insulating layer, and Wherein, at least a portion of the barrier layer is disposed between the insulating pattern and the tunnel insulating layer.

2. The semiconductor device according to claim 1, wherein The insulating pattern and the insulating layer have different material properties.

3. The semiconductor device according to claim 1, wherein Each of the insulating patterns includes a first surface facing each of the insulating layers and a second surface facing the channel structure, and Wherein, each of the first surface and the second surface comprises a curved surface.

4. The semiconductor device according to claim 1, wherein Each of the insulating patterns includes a first surface facing each of the insulating layers and a second surface facing the channel structure, and Wherein, the first surface comprises a curved surface, and the second surface comprises a flat surface.

5. The semiconductor device according to claim 1, wherein Each of the insulating patterns includes a first portion interposed between the plurality of the conductive layers and a second portion protruding further than a sidewall of each of the conductive layers.

6. The semiconductor device according to claim 5, wherein: The width of the second portion is greater than the width of the first portion.

7. The semiconductor device according to claim 5, wherein: The width of the second portion is the same as the width of the first portion.

8. The semiconductor device according to claim 5, wherein The width of the second portion is smaller than the width of the first portion.

9. The semiconductor device according to claim 5, wherein: A width of the second portion of each of the insulating patterns is different from a width of each of the insulating layers.

10. The semiconductor device according to claim 1, wherein The memory layer includes a data storage layer surrounding a sidewall of the channel structure, the data storage layer extending to a sidewall of the hard mask pattern, and Wherein, the data storage layer includes protrusions protruding between the plurality of insulating patterns.

11. The semiconductor device according to claim 1, wherein The memory layer comprises: a plurality of first data storage patterns, the plurality of first data storage patterns being located between the plurality of insulating patterns and separated from each other; and a second data storage pattern extending to a sidewall of the hard mask pattern.

12. The semiconductor device according to claim 1, wherein The sidewalls of each of the conductive layers are located on the extension lines of the sidewalls of the hard mask patterns.

13. The semiconductor device according to claim 1, wherein An interface between each of the insulating layers and each of the insulating patterns is positioned to be spaced farther apart than a sidewall of the hard mask pattern and a sidewall of the channel structure.

14. A method for manufacturing a semiconductor device, the method comprising the steps of: forming a stacked structure having a plurality of first material layers and a plurality of second material layers alternately stacked on each other; forming a hard mask pattern on the stacked structure; forming a first opening penetrating the stacked structure; forming an insulating pattern on a sidewall of each of the second material layers, wherein the insulating pattern directly contacts each of the second material layers and protrudes further into the first opening than a sidewall of the hard mask pattern; forming a memory layer filling spaces between the plurality of the insulating patterns in the first opening; and forming a channel structure in the memory layer, Wherein, the memory layer includes a barrier layer and a tunnel insulating layer, and Wherein, at least a portion of the barrier layer is disposed between the insulating pattern and the tunnel insulating layer.

15. The method according to claim 14, wherein: The step of forming the insulating pattern comprises the following steps: forming a plurality of second openings by selectively etching the second material layer; forming seed patterns in each of the plurality of second openings; and The insulating pattern is formed by oxidizing the seed pattern.

16. The method according to claim 15, wherein: The step of forming the insulating pattern further includes the step of selectively growing a seed material from the seed pattern.

17. The method according to claim 15, wherein: The step of forming the insulating pattern further includes the step of reducing a size of the insulating pattern by etching the insulating pattern.

18. The method according to claim 14, wherein: The step of forming the memory layer includes the step of forming a data storage layer surrounding a sidewall of the channel structure, the data storage layer extending to a sidewall of the hard mask pattern and having a protrusion protruding between the plurality of the insulating patterns.

19. The method according to claim 18, wherein: The step of forming the memory layer further includes the step of forming a plurality of first data storage patterns located between the plurality of insulating patterns and separated from each other and a second data storage pattern extending to a sidewall of the hard mask pattern by etching the data storage layer.

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