Mounting device and mounting method

Abstract

Provided are an installation device and an installation method, which realize stable high-precision installation and full installation position accuracy measurement inspection in the installation device without cost increase and productivity reduction in face-up installation in which the electrode surface of the substrate and the electrode surface of the chip component face the same direction. Specifically, provided are an installation device and an installation method, which, after the chip component and the substrate are aligned, lower the installation head holding the chip component in the vertical direction relative to the substrate, and after the chip component is closely attached to the substrate, the control unit causes the recognition mechanism to start the recognition action of the chip recognition mark and the substrate recognition mark in parallel, recognize the chip recognition mark and the substrate recognition mark in the installation state in which the chip component is closely attached to the substrate through the installation head, and calculate the installation position accuracy of the chip component and the substrate.

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method for mounting a chip component on a substrate, and particularly to a mounting device and a mounting method for performing face-up mounting in which an electrode surface of the substrate and an electrode surface of the chip component face the same direction. Background Art

[0002] As installation methods for installing chip components such as semiconductor chips on substrates such as wiring substrates, there are known methods of face-down installation in which the electrode surface of the chip component is installed opposite to the electrode surface of the substrate, and face-up installation in which the electrode surface of the substrate and the electrode surface of the chip component are installed in the same direction.

[0003] In any installation method, high-precision alignment is required for mounting the chip component at a specified position on the substrate, and identification marks for alignment are attached to the chip component and the substrate. Here, the chip component is aligned at a specified position on the substrate in order to mount the positional relationship between the electrodes of the substrate and the electrodes of the chip component according to the specified accuracy. Regardless of whether it is face-down mounting or face-up mounting, the position of the identification mark in the substrate and the chip component is configured based on the electrode position, and is generally attached to the electrode surface side where the relative position is clear.

[0004] Here, in Fig. 22 An example of face-up mounting is shown in FIG. In chip component C, as Fig. 22 As shown in (a), generally, two chip component identification marks (hereinafter referred to as chip identification marks) are configured, namely, the first chip identification mark AC1 and the second chip identification mark AC2 (in Fig. 22 On the other hand, on the substrate S, generally two substrate identification marks (hereinafter referred to as substrate identification marks) are arranged, namely, a first substrate identification mark AS1 and a second substrate identification mark AS2 ( Fig. 22 Here, during alignment, the positional offset (position and angle in the substrate surface direction) relative to the specified mounting position is calculated based on the positional relationship between the chip identification first mark AC1 and the substrate identification first mark AS1, and the positional relationship between the chip identification first mark AC2 and the substrate identification second mark AS2, and the relative position is corrected for mounting ( Fig. 22 (b)).

[0005] In addition, regardless of whether the installation is face-down or face-up, the chip component held is crimped from the upper side by the mounting head and mounted on the substrate. Therefore, in face-down installation in which the electrodes of the substrate and the chip component are mounted opposite to each other, a method is known to directly observe the substrate identification mark and the chip identification mark at the same time by using an upper and lower dual-field camera. On the other hand, in face-up installation in which the electrodes of the substrate and the chip component are mounted in the same direction, since the electrode surface of the chip component is in close contact with the mounting head, the following method is proposed: a transparent component or the like is used in the portion of the mounting head that holds the chip component, so that each identification mark can be observed through the mounting head, so that the identification mark of the chip component can be directly observed for alignment. (For example, Patent Document 1, Patent Document 2)

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: International Publication No. 2003 / 041478

[0009] Patent Document 2: Japanese Patent Application Publication No. 2017-208522 Summary of the invention

[0010] Problems to be solved by the invention

[0011] As semiconductor components have become increasingly dense, multi-electrode polarized, and have become increasingly narrow in pitch, mounting devices are required to perform mounting with higher precision than before without significantly increasing costs or reducing productivity, and from the perspective of quality management, all mounting positions are required to be inspected for mounting position accuracy. However, Patent Document 2 does not mention inspections for mounting position accuracy in mounting states.

[0012] Furthermore, measuring the mounting position accuracy using another device after the mounting process is completed is associated with increased costs, and when a defect in mounting position accuracy occurs, it takes time to notice the defect, so there is also a problem of delay in corrective action.

[0013] The present invention is completed in view of the above-mentioned problems, and provides a mounting device and a mounting method, which can achieve high-precision mounting without increasing costs and reducing productivity in face-up mounting where the electrode surface of the substrate and the electrode surface of the chip component face the same direction.

[0014] Means for solving problems

[0015] In order to solve the above-mentioned problems, the invention described in technical solution 1 provides a mounting device, which mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment face up in a posture in which the chip identification mark and the substrate identification mark are facing upward, wherein the mounting device comprises: a substrate carrier, which holds the substrate; a mounting head, which holds the chip component; a lifting unit, which lifts and lowers the mounting head in a vertical direction relative to the substrate; an identification mechanism, which can identify the chip identification mark and the substrate identification mark from the upper side of the mounting head through the mounting head and can move in the in-plane direction of the substrate; and a control unit, which is connected to the identification mechanism and has a function of controlling the chip identification mark and the substrate identification mark obtained from the identification mechanism according to the chip identification mark and the substrate identification mark obtained from the identification mechanism. The mounting device has the function of calculating the positional offset between the chip component and the substrate based on the position information of the substrate identification mark, and driving the mounting head and / or the substrate carrier for alignment according to the positional offset. The mounting device has the following functions: after the chip component and the substrate are aligned by the identification mechanism, the mounting head holding the chip component is lowered in the vertical direction relative to the substrate. After the chip component is in close contact with the substrate, the control unit enables the identification mechanism to start identifying the chip identification mark and the substrate identification mark in parallel, and identifies the chip identification mark and the substrate identification mark in the installation state where the chip component is in close contact with the substrate through the mounting head, and calculates the mounting position accuracy of the chip component and the substrate.

[0016] The invention described in Technical Solution 2 provides a mounting device, which, in the mounting device described in Technical Solution 1, has the following function: after the chip component is tightly attached to the substrate, in the recognition action of the chip identification mark and the substrate identification mark for calculating the mounting position accuracy, which is performed in parallel through the mounting head, the chip identification mark and the substrate identification mark are recognized simultaneously in such a way that the center of the optical axis of the recognition mechanism is located near the midpoint of the chip identification mark and the substrate identification mark.

[0017] The invention described in Technical Solution 3 provides an installation device, which, in the installation device described in Technical Solution 2, has the following functions: feeding back the calculated result of the installation position accuracy to the installation position, and automatically correcting and adjusting the installation position.

[0018] The invention described in Technical Solution 4 provides a mounting device, which mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment face up in a posture in which the chip identification mark and the substrate identification mark are facing upward, wherein the mounting device comprises: a substrate carrier, which holds the substrate; a mounting head, which holds the chip component and presses it onto the substrate; a lifting unit, which lifts and lowers the mounting head in a vertical direction relative to the substrate; and an identification mechanism, which can identify the chip identification mark and the substrate identification mark from the upper side of the mounting head through the mounting head and can move in the in-plane direction of the substrate, and the chip holding portion that holds the chip component as a component of the mounting head uses a light-transmitting material, and the chip holding portion has a through hole for identifying the chip identification mark and the substrate identification mark.

[0019] The invention described in technical solution 5 provides a mounting device, in which, in the mounting device described in technical solution 4, the chip holding part that holds the chip is formed of glass or ceramics, has a thickness of 1 mm, and has a transmittance of visible light and infrared light of more than 50%.

[0020] The invention described in Technical Solution 6 provides an installation method, which installs a chip component having a chip identification mark for alignment on a substrate having a substrate identification mark for alignment, wherein the installation method has the following steps: an alignment step, in a state where the chip component is configured with a gap set with the substrate, the chip identification mark and the substrate identification mark are identified from the same direction via a mounting head that holds the chip component, so that the relative position relationship between the chip component and the substrate matches; an installation step, in which the chip component is installed by being pressed against the substrate; and an installation accuracy measurement and inspection step, in which when the chip component is in an installation state in close contact with the substrate, the chip identification mark and the substrate identification mark are identified from the same direction via the mounting head, and the relative position relationship between the chip component and the substrate is calculated. After the chip component is in close contact with the substrate, the installation step and the installation accuracy measurement and inspection step are performed in parallel.

[0021] The invention described in Technical Solution 7 provides an installation method. In the installation method described in Technical Solution 6, in the installation accuracy measurement and inspection process, the chip identification mark and the substrate identification mark are simultaneously identified in such a way that the center of the optical axis of an identification mechanism that can identify the chip identification mark and the substrate identification mark from the upper side of the mounting head through the mounting head is located near the midpoint of the chip identification mark and the substrate identification mark.

[0022] The invention described in Technical Solution 8 provides an installation method, in which, in the installation method described in Technical Solution 7, the result of the installation position accuracy calculated by the installation accuracy measurement inspection process is fed back to the installation position, and the installation position is automatically corrected and adjusted.

[0023] Effects of the Invention

[0024] According to the present invention, in face-up installation in which the electrode surface of the substrate and the electrode surface of the chip component face the same direction, the following installation device and installation method can be implemented: all installation position accuracy measurements and inspections can be performed within the installation device without increased costs and reduced productivity, and installation can be performed stably and with high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 (a) is a diagram showing the appearance of a mounting device according to an embodiment of the present invention, Figure 1 (b) is a diagram showing the appearance and components of the mounting device viewed from another angle.

[0026] Figure 2 It is a diagram for explaining the positional relationship when the chip component and the substrate are aligned in the mounting device according to the embodiment of the present invention.

[0027] Figure 3 This is a diagram for explaining a state in which position information of a first recognition mark on a substrate is acquired when aligning a chip component with a substrate in the mounting apparatus according to the embodiment of the present invention.

[0028] Figure 4 This is a diagram for explaining a state in which position information of a first identification mark of a chip is acquired when aligning a chip component with a substrate in the mounting device according to the embodiment of the present invention.

[0029] Figure 5 This is a diagram for explaining a state in which position information of a second identification mark of a chip is acquired when aligning a chip component with a substrate in the mounting device according to the embodiment of the present invention.

[0030] Figure 6 This is a diagram for explaining a state in which position information of a second recognition mark on a substrate is acquired when aligning a chip component with a substrate in the mounting apparatus according to the embodiment of the present invention.

[0031] Figure 7 It is a diagram for explaining the measurement of mounting accuracy after the mounting process of mounting chip components on a substrate is completed in the mounting device according to the embodiment of the present invention.

[0032] Figure 8This is a diagram for explaining a state in which a mounting head descends and a chip component is brought into close contact with a substrate in a mounting step of mounting a chip component on a substrate in the mounting apparatus according to the embodiment of the present invention.

[0033] Fig. 9 This is a diagram illustrating the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing the state of obtaining position information of the first identification mark of the substrate.

[0034] Fig.10 This is a diagram illustrating the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing the state of obtaining the position information of the first identification mark of the chip.

[0035] Fig.11 This figure is a figure for explaining the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a figure showing the state of obtaining the position information of the second identification mark of the chip.

[0036] Fig.12 This is a diagram illustrating the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing the state of obtaining position information of the second identification mark of the substrate.

[0037] Fig.13 The figure is a diagram for explaining the installation accuracy measurement at the installation process stage of installing a chip component on a substrate in the installation device involved in the embodiment of the present invention, and is a diagram showing an image example of a shooting unit that simultaneously obtains the position information of the first identification mark of the substrate and the first identification mark of the chip in the same field of view when performing the installation accuracy measurement.

[0038] Fig.14 This figure is a diagram for explaining the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing the state of simultaneously obtaining position information of the first identification mark of the substrate and the first identification mark of the chip.

[0039] Fig.15This figure is a diagram for explaining the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component on a substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing the state of simultaneously obtaining the position information of the second identification mark of the substrate and the second identification mark of the chip.

[0040] Fig.16 This is a diagram illustrating face-up mounting to an embedded substrate. Fig.16 (a) is a diagram showing a state where a chip component is separated from a substrate. Fig.16 (b) is a diagram showing a state where the chip component is aligned with the substrate and mounted.

[0041] Fig.17 It is a diagram showing a state when positioning of an embedded substrate and a chip component is performed in the mounting device according to the embodiment of the present invention.

[0042] Fig.18 This figure is a figure for explaining the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate during the mounting process of mounting a chip component onto an embedded substrate in the mounting device involved in an embodiment of the present invention, and is a figure showing the state where the position information of the first identification mark of the substrate and the first identification mark of the chip are obtained simultaneously.

[0043] Fig.19 It is a diagram illustrating the measurement of mounting accuracy in a state where a mounting head descends and the chip component is in close contact with the substrate in the mounting process of mounting a chip component onto an embedded substrate in the mounting device involved in an embodiment of the present invention, and is a diagram showing a state where position information of the second identification mark of the substrate and the second identification mark of the chip are obtained simultaneously.

[0044] Fig. 20 FIG. 1 is a diagram for explaining a through hole used for aligning a chip component with a substrate in a modified example of an embodiment of the present invention. Fig. 20 (a) is an example in which the through holes of the heater section and the accessory tool are arranged to match the positions of the respective identification marks. Fig. 20 (b) is an example in which the through hole of the heater portion is provided so as to be able to cope with the entire specification size range and the through hole of the accessory tool is provided in a shape including a close identification mark.

[0045] Fig.21 1 is a diagram for explaining a through hole provided in an accessory tool in a modified example of an embodiment of the present invention. Fig.21 (a) is an example in which the through holes are arranged to match the positions of the respective identification marks. Fig.21 (b) is an example in which the through-holes are provided in a shape including the adjacent identification marks.

[0046] Fig. 22 This is a diagram for explaining the face-up installation. Fig. 22 (a) is a diagram showing a state where a chip component is separated from a substrate. Fig. 22 (b) is a diagram showing a state where the chip component is aligned with the substrate and mounted. DETAILED DESCRIPTION

[0047] Embodiments of the present invention will be described using the drawings. Figure 1 (a) is a diagram showing the appearance of a mounting device 1 in an embodiment of the present invention, Figure 1 (b) is from Figure 1 (a) is an external view from different angles, and also describes the components including the control system.

[0048] The mounting device 1 is a device for aligning the chip component C with the substrate S and mounting it face-up, and the chip identification first mark AC1 and the chip identification second mark AC2 marked on the chip component C and the substrate identification first mark AS1 and the substrate identification second mark AS2 marked on the substrate S are used for the alignment. Specifically, the mounting device 1 mounts the chip component C on the substrate S after correcting the positional relationship between the chip identification first mark AC1 and the substrate identification first mark AS1 and the positional relationship between the chip identification second mark AC2 and the substrate identification second mark AS2 to within the allowable range.

[0049] The chip component C is generally mounted on the substrate S via a thermosetting adhesive. The thermosetting adhesive is usually provided on the side of the chip component C opposite to the electrode surface (the surface where the chip identification mark exists), but may also be provided on the substrate S side.

[0050] The mounting device 1 includes a substrate stage 2 , an elevating and pressing unit 3 , a mounting head 4 , a recognition mechanism 5 , and a control unit 10 as components.

[0051] The substrate stage 2 has a function of holding the substrate S and moving the substrate S in the in-plane direction (in the XY plane). Here, when holding the substrate S, a vacuum adsorption method is suitable, but it is not limited to this, and an electrostatic adsorption method may also be used.

[0052] The lifting and pressing unit 3 preferably has the function of moving the mounting head 4 in the vertical direction (Z direction) of the substrate S and the function of adjusting the pressure of the mounting head 4 on the chip component C, and has the function of adjusting the angle of the mounting head 4 in the rotation direction with the Z direction as the axis.

[0053] The mounting head 4 holds the chip component C and presses it onto the substrate S. The mounting head 4 includes a head body 40, a heater unit 41, and an accessory tool 42 as components. The head body 40 is connected to the lifting and pressing unit 3, and a heater unit 41 is arranged on the lower side. The heater unit 41 has a heating function, and heats the chip component C via the accessory tool 42. In addition, the heater unit 41 has a function of adsorbing and holding the accessory tool 42 using a decompression flow path not shown. The accessory tool 42 is a chip holding part that adsorbs and holds the chip component C. The accessory tool 42 that matches the shape of the chip component C is selected and adsorbed and held on the heater unit 41.

[0054] In the present invention, the substrate identification mark and the chip identification mark are marks for observation through the mounting head 4. Therefore, in the present embodiment, the accessory tool 42 is formed by a transparent component. In order to be able to observe the substrate identification mark and the chip identification mark, the heater portion 41 needs to be formed by a transparent component or an opening portion needs to be provided. In the present embodiment, a through hole 41H is provided. Here, the through hole 41H can also be provided corresponding to the position of each substrate identification mark and chip identification mark, but in order to avoid the need for replacement according to the shape of the chip component, it is preferably set to a hole shape that can cope with the entire size specification range. In addition, a space is required in the mounting head 4 for the image acquisition unit 50 that can enter to observe the substrate identification mark and the chip identification mark. In the present embodiment, as Figure 1 Set the head space 40V as shown. That is, Figure 1 In the mounting device 1 , the head main body 40 is a structure composed of a side plate and a top plate provided on the heater portion 41 .

[0055] The recognition mechanism 5 is used to recognize the positions of the substrate recognition mark and the chip recognition mark through the mounting head 4 that has passed through the accessory tool 42 and the heater unit 41 to obtain position information. In this embodiment, the recognition mechanism 5 includes an image acquisition unit 50, an optical system 52, and a shooting unit 53 connected to the optical system 52 as components. The image acquisition unit 50 is arranged on the upper part of the recognition object to be acquired by the shooting unit 53, and the recognition object is included in the field of view. The image acquisition unit 50 has a function of changing the direction of the optical path through the reflection unit 510, and the optical system 52 has an optical lens and has a function of magnifying the image in order to obtain high resolution.

[0056] The recognition mechanism 5 is movable in the head space 40V along the in-plane direction of the substrate S (and the chip component C) by a driving mechanism (not shown). In addition, the recognition mechanism 5 is preferably movable in the vertical direction (Z direction) of the substrate S in order to adjust the focus position relative to each recognition mark.

[0057] The mounting head 4 is configured to be independently movable in a direction perpendicular to the substrate S, and the size of the head space 40V is designed so that even if the mounting head 4 moves in the perpendicular direction, it will not interfere with the recognition mechanism 5 that has entered the head space 40V.

[0058] The control unit 10 controls the operation of the mounting device 1 , and is connected to the substrate stage 2 , the lifting and pressing unit 3 , the mounting head 4 , and the recognition mechanism 5 .

[0059] The control unit 10 substantially includes a CPU and a storage device as main components, is connected to various devices via an interface as needed, and can perform calculations using acquired data and output corresponding to the calculation results through a built-in program.

[0060] The control unit 10 is connected to the substrate stage 2 , and has a function of controlling the substrate stage 2 to hold and release the substrate S, and to move the substrate S in the in-plane direction.

[0061] The control unit 10 is connected to the lifting and pressing unit 3 and has a function of controlling the driving of the mounting head 4 in a direction perpendicular to the substrate S (Z direction), the driving in a rotation direction about the Z direction, and the pressing force.

[0062] The control unit 10 is connected to the mounting head 4 , and has a function of controlling the suction holding and release of the chip component C by the attachment tool 42 and the heating temperature of the heater unit 41 .

[0063] The control unit 10 is connected to the recognition mechanism 5, and has the function of controlling the drive along the in-plane direction of the substrate S (and the chip component C) and the drive in the direction (Z direction) perpendicular to the substrate S, and controlling the imaging unit 53 to obtain image data. Furthermore, the control unit 10 has an image processing function, and has the function of obtaining the position of the recognition object in the image obtained by the imaging unit 53.

[0064] The following, Figure 1 A description will be given of a step of aligning the substrate S and the chip component C performed by the mounting apparatus 1 shown.

[0065] First, in the pre-alignment process, the control unit 10 causes the substrate stage 2 to hold the substrate S, and causes the mounting head 4 to hold the chip component C. At this time, the substrate S is arranged within the specified range of the substrate stage 2, and the chip component C is held within the specified range of the accessory tool 42. That is, the chip component C and the substrate S are roughly aligned. Therefore, it is possible to observe any of the substrate identification first mark AS1, the substrate identification second mark AS2, the chip identification first mark AC1, and the chip identification second mark AC2 through the mounting head 4 through the through hole 41H of the heater 41 and the accessory tool 42.

[0066] Figures 3 to 6 It is a diagram for explaining the alignment process, and is a diagram showing the process of obtaining the position information of the substrate recognition mark and the chip recognition mark.

[0067] first, Figure 3 The process of obtaining the position information of the first substrate identification mark AS1 of the substrate S is shown. Figure 3 (a) is a view of the mounting device 1 viewed from the Y direction, Figure 3 (b) is a (partial perspective) view of the mounting device 1 as viewed from the X direction. Figure 3 (a) and Figure 3 The relationship shown in (b) is Figures 4 to 6 The same is true in (and further, in Figures 7 to 12 ,as well as Figure 14 to Figure 15 , Figures 17 to 19 The same is true in ).

[0068] exist Figure 3 In the embodiment, the control unit 10 lowers the mounting head 4 so that the chip component C is close to the substrate S. In this state, Figure 2 As shown, a gap D is ensured between the substrate S and the chip component C so that the two can move relative to each other in the in-plane direction without interfering with each other.

[0069] exist Figure 3 In the embodiment, the control unit 10 controls the driving unit of the recognition mechanism 5 so that the substrate recognition first mark AS1 is located near the center of the optical axis of the image acquisition unit 50. In this state, the XY position information of the image acquisition unit 50 is stored in the control unit 10. In addition, the control unit 10 controls the imaging unit 53 to capture the substrate recognition first mark AS1 in a focused state, and obtains and stores the XY position information of the substrate recognition first mark AS1 within the field of view through the image processing function.

[0070] Next, the control unit 10 controls the driving unit of the identification mechanism 5, such as Figure 4 As shown, the recognition mechanism 5 is moved in the XY plane so that the chip recognition first mark AC1 is located near the center of the field of view of the image acquisition unit 50. At this time, the distance from the image acquisition unit 50 to the chip recognition first mark AC1 is different from the distance to the substrate recognition first mark AS1, so the focus of the image acquired by the imaging unit 53 is not aligned. Therefore, in this embodiment, the recognition mechanism 5 is moved in the direction perpendicular to the substrate S (Z direction) according to the difference in height between the substrate recognition first mark AS1 and the chip recognition first mark AC1.

[0071] exist Figure 4In the state, the XY position information of the image acquisition unit 50 is stored in the control unit 10. In addition, the control unit 10 controls the shooting unit 53 to shoot the chip recognition first mark AC1 in the state of focusing, and obtains and stores the XY position information of the chip recognition first mark AC1 in the field of view through the image processing function.

[0072] Next, the control unit 10 controls the driving unit of the identification mechanism 5, such as Figure 5 As shown, the recognition mechanism 5 is moved in the XY plane so that the second chip recognition mark AC2 is located near the center of the field of view of the image acquisition unit 50. At this time, the distance from the image acquisition unit 50 to the second chip recognition mark AC2 is the same as the distance to the first chip recognition mark AC1, so there is no need to move the recognition mechanism 5 in the direction perpendicular to the substrate S (Z direction) for focus adjustment.

[0073] exist Figure 5 In the state, the XY position information of the image acquisition unit 50 is stored in the control unit 10. In addition, the control unit 10 controls the shooting unit 53 to shoot the chip recognition second mark AC2 in the state of focusing, and through the image processing function, the XY position information of the chip recognition second mark AC2 in the field of view is obtained and stored.

[0074] Afterwards, the control unit 10 controls the driving unit of the identification mechanism 5, such as Figure 6 As shown, the recognition mechanism 5 is moved in the XY plane so that the substrate recognition second mark AS2 is located near the center of the field of view of the image acquisition unit 50. At this time, in order to align the focus, the recognition mechanism 5 is moved in the direction perpendicular to the substrate S (Z direction) according to the difference in height between the chip recognition second mark AC2 and the substrate recognition second mark AS2.

[0075] exist Figure 6 In the state, the XY position information of the image acquisition unit 50 is stored in the control unit 10. In addition, the control unit 10 controls the imaging unit 53 to capture the substrate recognition second mark AS2 in the state of being in focus, and obtains and stores the XY position information of the substrate recognition second mark AS2 in the field of view through the image processing function.

[0076] Thus, in this embodiment, the relative positional relationship between the substrate recognition mark and the chip recognition mark can be obtained based on the XY positional information of the recognition mechanism 5 and the XY positional information of the recognition mark in the field of view of the image acquired by the imaging unit 53. In addition, since the positional information is obtained by performing imaging and recognition with the focus on each substrate recognition mark and chip recognition mark, highly accurate positional information can be obtained.

[0077] The control unit 10 calculates and obtains the positional deviation amount between the substrate S and the chip component C based on the relative position information obtained as described above.

[0078] Then, in order to correct the position offset, the control unit 10 calculates the correction movement amount of the substrate S and the chip component C within the substrate surface, drives the substrate carrier 2 and / or the mounting head 4 in the direction within the substrate surface, and aligns the substrate S and the chip component C in such a way that the position offset is within the allowable range.

[0079] After the alignment of the substrate S and the chip component C is completed, the installation process begins. In the installation process, the control unit 10 lowers the installation head 4, so that the chip component C is closely attached to the substrate S, and is installed with a specified pressure. At this time, the heater unit 41 of the installation head 4 is used to heat the thermosetting adhesive between the substrate S and the chip component C, thereby fixing the chip component C on the substrate S. After the specified time of pressure heating, the installation head 4 releases the adsorption and holding of the chip component C and rises, and the installation process is completed.

[0080] In addition, from the perspective of quality control, it is required to perform all installation position accuracy measurements after the installation process is completed. However, using other equipment to measure the installation position accuracy after the installation process is completed will increase costs. In addition, when poor installation position accuracy occurs, it takes time to notice the poor quality, so there will be a delay in corrective measures. Therefore, the following functions are added: Figure 7 As shown, using the recognition mechanism 5 of the mounting device 1, after the mounting process is completed, the position information of the substrate recognition first mark AS1 and the chip recognition first mark AC1, and the position information of the substrate recognition second mark AS2 and the chip recognition second mark AC2 are obtained in the same manner as in the alignment process, and the mounting position accuracy in the state where the chip component C has been mounted on the substrate S is obtained. With this method, no other device other than the mounting device is required, and there is no increase in cost.

[0081] However, measuring the mounting position accuracy using the recognition mechanism 5 of the mounting device 1 after the mounting process is completed increases the operation time for the mounting position accuracy measurement, and thus is accompanied by a significant decrease in productivity, especially when performing a full mounting position accuracy measurement inspection.

[0082] Therefore, in the present invention, the structure that the chip identification mark and the substrate identification mark can be identified through the mounting head 4, and the positional relationship between the substrate S and the chip component C is determined at the stage where the chip component C is in close contact with the substrate S, is focused on, and the position information of each substrate identification mark and the chip identification mark is obtained at the stage in the mounting process to measure and inspect the mounting position accuracy. That is, the chip component C held and pressurized by the mounting head 4 is fixed at the stage where it is in close contact with the substrate S held by the substrate carrier 2, and this state is maintained by curing the adhesive. Based on this situation, the measurement of the mounting position accuracy is started at the stage in the mounting process, and the two processes are carried out in parallel, thereby achieving full mounting accuracy measurement and inspection without increasing costs or reducing productivity.

[0083] Hereinafter, an embodiment in which the mounting position accuracy measurement is performed in parallel with the mounting process using the mounting device 1 will be described. Figure 8 The figure shows a state in which the mounting device 1 lowers the mounting head 4 during the mounting process to make the chip component C closely attached to the substrate S. The mounting accuracy measurement inspection process in this embodiment can be started immediately after the mounting head 4 is lowered and the chip component C is just in close contact with the substrate S. Here, it can be judged whether the chip component C is in close contact with the substrate S by a pressure sensor or a displacement sensor not shown in the figure.

[0084] Fig. 9 The process of obtaining the position information of the first substrate identification mark AS1 of the substrate S during the mounting process of placing the chip component C in close contact with the substrate S by the mounting device 1 is shown. Figure 3 The alignment process shown is the same.

[0085] The subsequent installation accuracy measurement and inspection process will be as follows: Figures 10 to 12 As shown, the same as the alignment process, according to Figures 9 to 12 The control unit 10 calculates the mounting position accuracy based on the relative position relationship between the first substrate identification mark AS1 and the first chip identification mark AC1, and the relative position relationship between the second substrate identification mark AS2 and the second chip identification mark AC2 obtained under the state of being mounted on the substrate S. That is, the control unit 10 compares the situation where the chip component C is accurately mounted at the specified position of the substrate S with the position information actually obtained by the recognition performed using the recognition mechanism 5, with respect to the relative position relationship between the first substrate identification mark AS1 and the first chip identification mark AC1, and the position relationship between the second substrate identification mark AS2 and the second chip identification mark AC2, and calculates the mounting position accuracy of the chip component C relative to the substrate S.

[0086] exist Figures 3 to 6In the alignment process, the recognition mechanism 5 ends when the substrate recognition second mark AS2 is recognized, so it is most effective to start the mounting position accuracy measurement inspection process from the substrate recognition second mark AS2. In addition, the recognition mechanism 5 is independent of the mounting head 4, so even if the mounting head 4 is lowered between the alignment process and the mounting process, the positional relationship between the image acquisition unit 50 and the substrate recognition second mark AS2 does not change, so there is no need for focus adjustment.

[0087] Furthermore, when the time required for the mounting accuracy measurement and inspection process is longer than the time required for the mounting process, the mounting head 4 rises during the mounting accuracy measurement and inspection process, but since the recognition mechanism 5 is independent of the mounting head 4, the distance between the image acquisition unit 50 and each recognition object does not change, and thus the operation of the recognition mechanism 5 is not affected by the position of the mounting head 4. That is, when the time of the mounting process (the time from when the mounting head 4 descends and the chip component C just comes into close contact with the substrate S to when the mounting head 4 rises and is completed) ≥ the time of the mounting position accuracy measurement and inspection process, the full number of mounting position measurement and inspections can be performed without a decrease in productivity.

[0088] In addition, when the chip component C is in close contact with the substrate S, Figure 2 The gap D in the image becomes zero, and the height difference between the substrate identification mark and the chip identification mark in the vertical direction becomes "the thickness TC of the chip component C". That is, if the chip thickness TC becomes smaller, the height difference between the substrate identification mark and the chip identification mark in the vertical direction also becomes smaller. Here, if the height difference between the substrate identification mark and the chip identification mark in the vertical direction is within the depth of field of the imaging unit 53, it means that it can be captured as shown in FIG. Fig.13 As shown, both the substrate recognition first mark AS1 and the chip recognition first mark AC1 are clearly and simultaneously photographed.

[0089] That is, when the chip thickness TC is small and the height difference between the substrate identification mark in the mounted state and the chip identification mark in the vertical direction is within the depth of field of the imaging unit 53, as shown in FIG. Fig.14 As shown, the image acquisition unit 50 is set near the midpoint of the substrate identification first mark AS1 and the chip identification first mark AC1, and the imaging unit 53 can simultaneously capture and identify both identification marks within the focal depth and within the same field of view. Fig.15As shown, if the substrate identification second mark A2 and the chip identification second mark AC2 are also photographed and identified at the same time, the number of photographs can be halved, so the time required for the installation position accuracy measurement inspection process can be greatly shortened. Therefore, by adding such a function, the time of the installation process (the time from the time when the mounting head 4 descends and the chip component C just comes into close contact with the substrate S to the time when the mounting head 4 rises) ≥ the time of the installation position accuracy measurement inspection process is established, and the possibility of performing all the installation position accuracy measurement inspections without reducing productivity becomes extremely high.

[0090] If the mounting position accuracy can be obtained in the mounting process using the imaging unit 53, it is possible to perform a correction operation for the displacement of the mounting position caused by the change of the optical axis position of the imaging unit 53 accompanying the environmental change, the change of the optical axis inclination, or the change of the inclination of the lifting and pressing unit 3. That is, in the alignment process in which the substrate recognition mark and the chip recognition mark are aligned by imaging the imaging unit 53, although the position displacement amount of the calculation result is within the allowable range, if there is a position displacement in the mounting position accuracy measurement result of imaging the substrate recognition mark and the chip recognition mark using the imaging unit 53, it can be easily determined that the change of the optical axis position of the imaging unit 53, the change of the optical axis inclination, or the change of the inclination of the lifting and pressing unit 3 has occurred, and by always automatically performing the correction operation, the mounting position of the chip component C relative to the substrate S can be prevented from being displaced and can be always stably installed within the allowable range of the specified position.

[0091] In this way, the mounting position accuracy is calculated and obtained at a stage in the mounting process, and is fed back to the mounting position so that the mounting position is always automatically corrected and adjusted. This allows for very stable and high-precision mounting without increased costs or reduced productivity.

[0092] In particular, when installing chip component C on a component embedded substrate (embedded substrate), the function of simultaneously photographing the substrate identification mark and the chip identification mark within the focal depth and the same field of view is extremely effective. Fig.16 (a) and Fig.17 When mounting the chip component C in the recessed portion SC of the substrate S having the recessed portion SC shown in FIG. Fig.16 As in (b), the height is approximately the same. Fig.18 As shown, the vertical distances from the image acquisition unit 50 of the recognition mechanism to the first substrate recognition mark AS1 and the first chip recognition mark AC1 are approximately the same, making it easy to simultaneously capture images with both recognition marks in focus within the same field of view. Fig.19 The same is true for the case of the second substrate recognition mark A2 and the second chip recognition mark AC2 shown.

[0093] In addition, if the condition is such that the upper surface of the substrate S and the upper surface of the chip component C are at the same height, the height difference between the substrate identification mark and the chip identification mark in the vertical direction becomes zero, and a clearer image can be obtained. Therefore, it is most suitable for grasping the changes in the optical axis position of the shooting unit 53, the changes in the optical axis inclination, or the changes in the inclination of the lifting and pressing unit 3, etc. and always automatically correcting and adjusting the installation position, and can realize a high-precision installation device with higher stability and reliability.

[0094] In the embodiments described so far, the accessory tool 42 is formed of a transparent component, so that the chip identification mark and the substrate identification mark can be observed through the mounting head 4. However, when high-precision mounting is to be achieved, a high-quality component is required as a transparent component. That is, when the transparent component has optical defects or geometric tolerances, slight errors in position information may occur due to image blurring, image deformation, refractive index changes, etc. Here, the optical defects are tiny gaps, impurity mixing, thermal deformation, etc., and the geometric tolerances are surface roughness, dimensional tolerance, parallelism, etc. Therefore, when the accessory tool 42 is composed of a transparent component, in order to cope with high-precision (specifically, sub-micron precision) alignment, a high-quality component, that is, an expensive component, which suppresses optical defects and geometric tolerances is required as a transparent component.

[0095] Therefore, as another embodiment of the present invention, in Fig. 20 2 shows the structure of an accessory tool 42 that can perform positioning with sub-micron accuracy at a relatively low cost. Fig. 20 The accessory tool 42 is provided with a through hole capable of observing the substrate identification mark and the chip identification mark, Fig. 20 (a) is a structure provided with through holes corresponding to respective identification marks, Fig. 20 (b) has a through hole having a shape including both the substrate identification mark and the chip identification mark that are adjacent to each other. Fig.21 (a) and Fig.21 (b) shows only the Fig. 20 (a) and Fig. 20 (b) corresponds to the appearance of the accessory tool 42, Fig.21 (a) is provided with a through hole 42HS that matches the position of the substrate identification mark and a through hole 42HC that matches the position of the chip identification mark, respectively. Fig.21 (b) A through hole 42H having a shape including the substrate recognition mark and the chip recognition mark close to each other is provided.

[0096] Here, the heater unit 41 can also be provided corresponding to the position of each substrate identification mark and chip identification mark. Fig. 20(a) shows such an example. Fig. 20 In (a), the heater portion 41 is provided with a through hole 41HS that matches the position of the substrate recognition mark and a through hole 41HC that matches the position of the chip recognition mark.

[0097] In addition, even when a through hole is provided in the accessory tool 42, it is preferable that the accessory tool 42 has light transmissivity. Fig. 20 In the example (b), the chip identification first mark AC1, the chip identification second mark AC2, the substrate identification first mark AS1, and the substrate identification second mark AS2 are photographed only by the light passing through the through hole 42H, so it is not possible to obtain sufficient light and it is difficult to obtain a clear image, which will have an adverse effect on the alignment accuracy. On the other hand, if the accessory tool 42 is light-transmissive, in addition to the light passing through the through hole 42H, light from the periphery passing through the inner wall of the through hole 42H can also be obtained, so it is easy to obtain the light amount for obtaining a clear image. In addition, since the image can be obtained through the through hole 42H, it is not affected by the optical defects or geometric tolerances of the components of the accessory tool 42, and a clear image can be obtained.

[0098] In addition, the light transmittance required for the accessory tool 42 does not mean general transparency. Even if there is turbidity caused by refraction or scattering of light, it is sufficient as long as the light transmittance allows the brightness of light to pass through. Therefore, the material is not limited to glass or quartz, and can also be a translucent ceramic such as alumina. However, in order to transmit the amount of light suitable for clearly and accurately photographing the chip identification mark and the substrate identification mark, a material with a transmittance of visible light and infrared light of 50% or more is preferred at a thickness of 1 mm, and a material with a transmittance of visible light or infrared light of 80% or more is more preferred.

[0099] As the structure of providing a through hole in the light-transmitting accessory tool as described above, by providing Figure 1 The mounting device 1 shown in the figure can perform sub-micron precision alignment, but it can also be applied to mounting devices with structures different from the mounting device 1. Since the structure is a structure in which through holes are provided in the light-transmitting material, it is possible to obtain images that are equal to or better than those using expensive transparent materials at a relatively low cost, so even if the mounting precision calculation during installation as performed in the mounting device 1 is not performed, the mounting precision can be improved.

[0100] Description of symbols

[0101] 1: Mounting device; 2: Substrate carrier; 3: Lifting and pressing unit; 4: Mounting head; 5: Identification mechanism; 10: Control unit; 40: Head body; 40V: Head space; 41: Heater unit; 41H, 41HC, 41HS: Through hole; 42: Accessory tool; 42H, 42HC, 42HS: Through hole; 50: Image acquisition unit; 52: Optical system; 53: Shooting unit; 510: Reflection unit; C: Chip component; S: Substrate; AC1, AC2: Chip identification marks; AS1, AS2: Substrate identification marks; D: Gap between chip component and substrate during alignment; TC: Thickness of chip component; TS: Thickness of substrate; SC: Concave portion of substrate.

Claims

1. A mounting device, which fixes a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment via an adhesive in a state where the chip identification mark and the substrate identification mark face the same direction, wherein: The mounting device has: A substrate carrier, which holds the substrate; A mounting head, which holds the chip component so that the chip component is closely attached to the substrate and pressurized; A lifting unit that lifts the mounting head in a vertical direction relative to the substrate, the lifting unit being disposed just above the chip component held by the mounting head so as to suppress the action of a moment when pressurizing the chip component; an identification mechanism, which is located on the upper side of the mounting head and moves independently of the movement of the mounting head, and identifies the combination of the chip identification mark and the substrate identification mark at a plurality of locations; as well as a control unit connected to the recognition mechanism, having a function of calculating the positional offset between the chip component and the substrate based on information obtained from the recognition mechanism, and a function of driving the mounting head and / or the substrate stage for alignment based on the positional offset, The mounting device has the following functions: after the chip component and the substrate are aligned using the identification mechanism, the mounting head holding the chip component is lowered in a vertical direction relative to the substrate, and after the chip component is closely attached to the substrate, In parallel with the mounting head applying pressure to the chip component, the identification mechanism begins to identify the chip identification mark and the substrate identification mark, identifies the combination of the chip identification mark and the substrate identification mark when the chip component is installed tightly on the substrate at multiple locations, and calculates the installation position accuracy of the chip component and the substrate.

2. The mounting device according to claim 1, wherein: The mounting device has the following function: in the identification action of the chip identification mark and the substrate identification mark for calculating the mounting position accuracy which starts in parallel after the chip component is tightly attached to the substrate, the chip identification mark and the substrate identification mark are simultaneously identified in such a way that the center of the optical axis of the identification mechanism is located near the midpoint of the chip identification mark and the substrate identification mark.

3. The mounting device according to claim 2, wherein: The mounting device has the following functions: feeding back the calculated result of the mounting position accuracy to the mounting position, and automatically correcting and adjusting the mounting position.

4. A mounting device, which mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment face-up in a posture where the chip identification mark and the substrate identification mark face upward, wherein: The mounting device has: A substrate carrier, which holds the substrate; A mounting head that holds the chip component and presses it onto the substrate; A lifting unit that enables the mounting head to be lifted and lowered in a vertical direction relative to the substrate; as well as an identification mechanism capable of identifying the chip identification mark and the substrate identification mark from above the mounting head through the mounting head and capable of moving in the in-plane direction of the substrate, A through hole for the identification mechanism to identify the chip identification mark and the substrate identification mark is provided in a chip holding portion that is a component of the mounting head and holds the chip component. In order to provide the amount of light required for the recognition mechanism to recognize the chip recognition mark and the substrate recognition mark, the chip holding portion is made of a light-transmitting material. The recognition mechanism can directly recognize the chip recognition mark and the substrate recognition mark from the through hole without passing through the light-transmissive chip holding portion.

5. The mounting device according to claim 4, wherein: The chip holding portion for holding the chip is formed of glass or ceramics, has a thickness of 1 mm, and has a transmittance of visible light and infrared light of 50% or more.

6. A mounting method, wherein a chip component having a chip identification mark for alignment is mounted on a substrate having the substrate identification mark for alignment via an adhesive in a state where the chip identification mark and the substrate identification mark face the same direction, wherein: The installation method has the following steps: an alignment step of identifying the chip identification mark and the substrate identification mark in a state where the chip component is arranged with a gap between the chip component and the substrate, so that the relative position relationship between the chip component and the substrate is matched; A mounting step of placing the chip component in close contact with the substrate and applying pressure to fix it; as well as The mounting accuracy measurement and inspection process includes: when the chip component is in a state of being closely attached to the substrate, identifying the combination of the chip identification mark and the substrate identification mark at multiple locations, and calculating the relative positional relationship between the chip component and the substrate. At the stage where the chip component is in close contact with the substrate, the installation process and the installation accuracy measurement and inspection process are carried out in parallel, and the result of the installation position accuracy calculated by the installation accuracy measurement and inspection process is fed back to the installation position when the next chip component is installed, and the installation position is automatically corrected and adjusted.

7. The installation method according to claim 6, wherein: In the mounting accuracy measurement and inspection process, the chip identification mark and the substrate identification mark are identified simultaneously in such a way that the optical axis center of the identification mechanism that identifies the chip identification mark and the substrate identification mark is located near the midpoint of the chip identification mark and the substrate identification mark.

Images