Photoelectric Sensors

Abstract

The present invention provides a photoelectric sensor, which relates to the technical field of photoelectric sensors. The photoelectric sensor comprises a circuit board, the upper surface of the circuit board is provided with four groups of pin connection points, the top of the circuit board is fixedly connected to a photoelectric sensor body through a connection block, and the top of the photoelectric sensor body is fixedly connected to an optical filter. The four groups of pin connection points provided on the upper surface of the circuit board are welded and packaged with the bottom of the photoelectric sensor body, and the optical filter on the top can further increase the reliability of the connection, so that the reliability of the device after connection is relatively high.

Description

Technical Field

[0001] The present invention relates to the technical field of photoelectric sensors, in particular to photoelectric sensors. Background Art

[0002] Photoelectric sensor is a device that converts light signal into electrical signal. Its working principle is based on photoelectric effect. Photoelectric effect refers to the phenomenon that when light shines on certain substances, the electrons of the substances absorb the energy of photons and produce corresponding electrical effects. According to the different photoelectric effect phenomena, photoelectric effect can be divided into three categories: external photoelectric effect, internal photoelectric effect and photovoltaic effect. Photoelectric devices include phototubes, photomultiplier tubes, photoresistors, photodiodes, phototransistors, photocells, etc.

[0003] Photoelectric sensors are relatively precise, and the traditional welding method has poor reliability, resulting in a high overall component failure rate. The present invention provides a photoelectric sensor structure with relatively high welding reliability. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the present invention provides a photoelectric sensor, which solves the problem that the conventional welding method has poor reliability and causes a high overall component failure rate.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a photoelectric sensor includes a circuit board, the upper surface of the circuit board is provided with four groups of pin connection points, the top of the circuit board is fixedly connected to a photoelectric sensor body through a connecting block, and the top of the photoelectric sensor body is fixedly connected to a filter.

[0008] Preferably, a bottom pad is fixedly connected to the bottom of the circuit board, and the position of the bottom pad corresponds to the installation position of the photoelectric sensor body.

[0009] Preferably, a groove is formed at the bottom of the optical filter, and the photoelectric sensor body is embedded in the groove.

[0010] Preferably, the bottom of the filter is fixedly connected to the upper surface of the circuit board.

[0011] Preferably, the photoelectric sensor body comprises a sensor element, the bottom of which is fixedly connected with a W-shaped block, and a side embedding opening of the W-shaped block is provided with pins, wherein the number of the pins is set to four and arranged in a T-shaped pattern.

[0012] Preferably, an upper mounting opening is provided at the bottom of the W-shaped block, a lower mounting opening is provided at the top of the circuit board, the connecting block is embedded in the upper mounting opening and the lower mounting opening, and the pin connection point corresponds to the position of the pin.

[0013] Preferably, the circuit board is a flexible circuit board.

[0014] (III) Beneficial effects

[0015] The present invention provides a photoelectric sensor having the following beneficial effects:

[0016] 1. The present invention provides four groups of pin connection points on the upper surface of the circuit board and welds them to the bottom of the photoelectric sensor body for packaging. The filter on the top can further increase the reliability of the connection, so that the reliability of the device after connection is relatively high.

[0017] 2. The present invention, by providing a W-shaped block, separates four pins, which can correspond to four groups of pin connection points provided at the bottom, thereby avoiding mixing of the lines therebetween and increasing the reliability of the connection.

[0018] 3. The present invention provides a groove at the bottom of the filter, and the photoelectric sensor body is embedded in the groove, which can play an anti-interference role for the photoelectric sensor body and increase the reliability of the operation of the photoelectric sensor body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the installation structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 3 It is a front structural schematic diagram of the present invention;

[0022] Figure 4 It is a side structural schematic diagram of the present invention;

[0023] Figure 5 This is a pin connection diagram of the photoelectric sensor.

[0024] Among them, 1. circuit board; 2. bottom pad; 3. connection block; 4. photoelectric sensor body; 401. W-shaped block; 402. pin; 403. sensor element; 5. filter. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Embodiment 1:

[0027] like Figure 1-5 As shown, an embodiment of the present invention provides a photoelectric sensor, including a circuit board 1, wherein four groups of pin connection points are arranged on the upper surface of the circuit board 1, and the specific positions are in a field shape corresponding to the positions of the pins 402. The top of the circuit board 1 is fixedly connected to a photoelectric sensor body 4 through a connecting block 3, an upper mounting opening is provided at the bottom of the Wang-shaped block 401, and a lower mounting opening is provided at the top of the circuit board 1. The connecting block 3 is embedded in the upper mounting opening and the lower mounting opening, and the circuit board 1 and the Wang-shaped block 401 can be connected more tightly. The pin connection points correspond to the positions of the pins 402, and the top of the photoelectric sensor body 4 is fixedly connected to a filter 5, and a groove opening is provided at the bottom of the filter 5. The photoelectric sensor body 4 is embedded in the groove opening, and the filter 5 covers the outside of the photoelectric sensor body 4, which can play an anti-interference role.

[0028] The bottom of the optical filter 5 is fixedly connected to the upper surface of the circuit board 1 , which can increase the connection reliability of the optical filter 5 , and at the same time, the photoelectric sensor body 4 pressed inward is also connected more firmly.

[0029] A bottom pad 2 is fixedly connected to the bottom of the circuit board 1. The position of the bottom pad 2 corresponds to the installation position of the photoelectric sensor body 4. The bottom pad 2 can increase the strength of the installation position of the circuit board 1 to prevent it from being deformed.

[0030] The photoelectric sensor body 4 includes a sensor element 403 , the bottom of which is fixedly connected to a W-shaped block 401 , and a pin 402 is provided in the side embedding opening of the W-shaped block 401 . There are four pins 402 arranged in a field shape, which can limit the positions of the four pins 402 .

[0031] The circuit board 1 is a flexible circuit board.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Photoelectric sensor, characterized in that: It includes a circuit board (1), on the upper surface of the circuit board (1), four groups of pin connection points are provided. The top of the circuit board (1) is fixedly connected with a photoelectric sensor body (4) through a connection block (3), and a filter (5) is fixedly connected to the top of the photoelectric sensor body (4); The photoelectric sensor body (4) includes a sensor element (403). A king-shaped block (401) is fixedly connected to the bottom of the sensor element (403). Pins (402) are arranged in the side insertion openings of the king-shaped block (401). The number of the pins (402) is four, arranged in a cross shape. An upper mounting opening is formed at the bottom of the king-shaped block (401), and a lower mounting opening is formed at the top of the circuit board (1). The connection block (3) is embedded in the upper and lower mounting openings. The positions of the pin connection points correspond to those of the pins (402). The circuit board (1) is a flexible circuit board; A groove opening is formed at the bottom of the filter (5). The photoelectric sensor body (4) is embedded in the groove opening. The bottom of the filter (5) is fixedly connected to the upper surface of the circuit board (1).

2. The photoelectric sensor according to claim 1, characterized in that: A bottom backing plate (2) is fixedly connected to the bottom of the circuit board (1). The position of the bottom backing plate (2) corresponds to the installation position of the photoelectric sensor body (4).

Images