Electronic assembly with cable module

Abstract

An electronic assembly (502) includes an electronic package (506) connected to a host circuit board (510). The electronic assembly includes an interposer assembly (508) electrically connected to the electronic package. The electronic assembly includes a cable module (504) coupled to an upper separable interface of the interposer assembly. The electronic assembly includes a carrier assembly (800) configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block (802) and a carrier cover (804) configured to hold at least one interposer assembly and at least one cable module. The carrier assembly holds the cable module and module contacts (575) are electrically connected to upper mating interfaces (626) of interposer contacts (600). The carrier assembly holds lower mating interfaces (628) of the interposer contacts to be electrically connected to upper package contacts (566) of the electronic package. The carrier assembly is individually removable from the electronic package to separate the interposer assembly from the electronic package.

Description

Technical Field

[0001] The main topic of this article is electronic components. Background Technology

[0002] A continuing trend is toward smaller, lighter, and higher-performance communication components and higher-density systems, such as those used in Ethernet switches or other system components. Typically, a system includes receptacle connectors mounted to a main board. The receptacle connectors receive electronic packages, such as ASICs. Electrical signals are routed between the ASIC and the main board through the receptacle connectors. The electrical signals then travel along traces on the main board to another component, such as a transceiver connector. Long electrical paths through the main board degrade the system's electrical performance. Additionally, the wiring between the receptacle connectors and other components on the main board occupies board space. Conventional systems struggle to meet the signal and power output from electronic packages due to the need for smaller size and a greater number of conductors while maintaining good electrical performance throughout the system.

[0003] A reliable electronic component for high-speed data signaling in data communication systems is still needed. Summary of the Invention

[0004] According to the present invention, an electronic component is provided, comprising an electronic package including a package substrate having an upper surface and a lower surface. The electronic package includes an integrated circuit component mounted to the upper surface of the package substrate. The electronic package includes a lower package contact electrically connected to the integrated circuit component and configured for electrical connection to a main circuit board. The electronic package includes an upper package contact electrically connected to the integrated circuit component. The electronic component includes an inserter assembly electrically connected to the electronic package. Each inserter assembly includes an array of inserter contacts. The inserter contacts are compressible. Each inserter contact has an upper mating interface and a lower mating interface. The lower mating interface of the inserter contact mates with the upper package contact. The inserter assembly defines a separable interface with the electronic package. The electronic component includes a cable module coupled to the upper separable interface of the inserter assembly. Each cable module includes a cable module substrate having module contacts and a cable, the cable terminating at the cable module substrate and electrically connected to the module contacts. The electronic component includes a carrier assembly configured to be coupled to the upper surface of the electronic package. Each carrier assembly includes a carrier base and a carrier cover. Each carrier assembly is configured to hold at least one inserter assembly and at least one cable module between the carrier base and the carrier cover. The carrier assembly holds the cable module electrically connected to the upper mating interface of the inserter contacts via module contacts. The carrier assembly holds the lower mating interface of the inserter contacts electrically connected to the upper package contacts of the electronic package. The carrier assembly can be removed separately from the electronic package to detach the inserter assembly from the electronic package. Attached Figure Description

[0005] Figure 1 This is a perspective view of a communication system with electronic components according to an exemplary embodiment.

[0006] Figure 2 This is an exploded view of a communication system and electronic components according to an exemplary embodiment.

[0007] Figure 3 This is a perspective view of an electronic component according to an exemplary embodiment.

[0008] Figure 4 This is a perspective view of the optical module of an electronic component according to an exemplary embodiment.

[0009] Figure 5 This is a perspective view of the optical module compression member of an electronic component according to an exemplary embodiment.

[0010] Figure 6 This is a perspective view of an inserter assembly of an electronic component according to an exemplary embodiment.

[0011] Figure 7 This is a side view of a portion of an inserter component according to an exemplary embodiment.

[0012] Figure 8 This is a side view of the inserter component according to an exemplary embodiment.

[0013] Figure 9 This is a perspective view of a portion of an electronic component according to an exemplary embodiment.

[0014] Figure 10 This is a perspective view of a portion of an electronic component according to an exemplary embodiment.

[0015] Figure 11 This is a flowchart illustrating the assembly of electronic components according to an exemplary embodiment.

[0016] Figure 12 This is a cross-sectional view showing a portion of a communication system according to an exemplary embodiment, comprising electronic components.

[0017] Figure 13 This is a cross-sectional view of a part of a communication system according to an exemplary embodiment.

[0018] Figure 14 This is a cross-sectional view of a part of a communication system according to an exemplary embodiment.

[0019] Figure 15 This is a cross-sectional view of a part of a communication system according to an exemplary embodiment.

[0020] Figure 16 This is a perspective view of a part of a communication system according to an exemplary embodiment.

[0021] Figure 17 This is a cross-sectional view of a part of a communication system according to an exemplary embodiment.

[0022] Figure 18 This is a top perspective view of a communication system with electronic components according to an exemplary embodiment.

[0023] Figure 19 This is a perspective view of a communication system according to an exemplary embodiment.

[0024] Figure 20 This is a cross-sectional view of a communication system according to an exemplary embodiment.

[0025] Figure 21 This is an exploded view of a communication system according to an exemplary embodiment.

[0026] Figure 22 This is an exploded view of a communication system according to an exemplary embodiment.

[0027] Figure 23 This is an exploded view of an electronic component according to an exemplary embodiment.

[0028] Figure 24 This is a top view of a portion of an electronic package according to an exemplary embodiment.

[0029] Figure 25 This is a bottom perspective view of the carrier component according to an exemplary embodiment.

[0030] Figure 26 This is a top view of an electronic component according to an exemplary embodiment.

[0031] Figure 27 This is a side view of an electronic component according to an exemplary embodiment.

[0032] Figure 28 This is a top view of a portion of an electronic component according to an exemplary embodiment.

[0033] Figure 29 This is a side view of a portion of an electronic component according to an exemplary embodiment.

[0034] Figure 30 This is a top view of a portion of an electronic component according to an exemplary embodiment.

[0035] Figure 31 This is a side view of a portion of an electronic component according to an exemplary embodiment. Detailed Implementation

[0036] Figure 1 This is a perspective view of a communication system 100 having electronic components 102 according to an exemplary embodiment. Figure 2 This is an exploded view of a communication system 100 and electronic components 102 according to an exemplary embodiment. Electronic components 102 include a cable module 104. Figure 2 ), which is achieved through inserter component 108 ( Figure 2 Electrically connected to the electronic package 106 ( Figure 2 Electronic component 102 is electrically connected to main circuit board 110, for example, using receptacle connector 112. In various other embodiments, electronic component 102 is mounted directly to main circuit board 110 without using receptacle connector 112. In an exemplary embodiment, compression assembly 114 is used to load electronic component 102 into receptacle connector 112 to electrically connect electronic package 106 to receptacle connector 112. For example, compression hardware 116, such as threaded fasteners, may be coupled to pad 118 below main circuit board 110 to connect main circuit board 110 and electronic component 102 to compression assembly 114. In an exemplary embodiment, communication system 100 includes a heat sink (not shown) configured to dissipate heat from electronic package 106 and / or cable module 104.

[0037] In various embodiments, the electronic package 106 is an integrated circuit component, such as an ASIC. However, the electronic package 106 can be another type of communication component. Cable modules 104 are directly coupled to the ASIC via an inserter assembly 108 independent of the main circuit board 110. For example, high-speed data signals are transmitted between the electronic package 106 and the cable modules 104 via the inserter assembly 108, without crossing the main circuit board 110. In exemplary embodiments, multiple cable modules 104 are coupled to the electronic package 106. For example, the cable modules 104 may be disposed on multiple sides of the integrated circuit or other communication element of the electronic package 106. In the illustrated embodiment, the cable modules 104 are disposed on all four sides of the integrated circuit. In alternative embodiments, other arrangements are possible. The cable modules 104 are individually clamped or compressed against the inserter assembly 108, thus allowing for individual service and removal from the electronic package 106.

[0038] The receptacle connector 112 includes a receptacle frame 120 having a receptacle opening 122. The receptacle connector 112 includes a receptacle substrate 124 received in the receptacle opening 122. In the illustrated embodiment, the receptacle frame 120 surrounds the receptacle opening 122 on all four sides. In alternative embodiments, the receptacle frame 120 may have different shapes. The bottom of the receptacle substrate 124 is mounted to the main circuit board 110 at a board interface. For example, the receptacle substrate 124 may be electrically connected to the main circuit board 110 via a ball grid array (BGA), a pad grid array (LGA), or another mating interface. The receptacle connector 112 includes a receptacle contact 126 at the top of the receptacle substrate 124. In an exemplary embodiment, the receptacle contact 126 is a compressible contact, such as a spring beam, configured to be electrically connected to the electronic package 106. When a compression assembly 114 is mounted to the main circuit board 110, the compression assembly 114 can compress the receptacle contact 126. In an exemplary embodiment, the receptacle connector 112 includes a guide member 128 to guide the mating of the electronic package 106 with the receptacle connector 112. For example, the guide member 128 may guide pins extending from the top of the receptacle frame 120. In alternative embodiments, other types of guide members may be used.

[0039] Compression assembly 114 is coupled to the top of electronic assembly 102 to mechanically and electrically connect electronic assembly 102 to receptacle connector 112. Compression assembly 114 includes a load plate 130, which is coupled to pad 118 via compression hardware 116. Load plate 130 transmits compression load to electronic assembly 102. In an exemplary embodiment, compression assembly 114 includes a compression member 132 that engages load plate 130. Compression member 132 is coupled to compression hardware 116. In the illustrated embodiment, compression member 132 is a spring member configured to transmit spring force from compression hardware 116 to load plate 130. In alternative embodiments, other types of compression members may be used. In the illustrated embodiment, compression member 132 is disposed on all four sides of load plate 130; however, in alternative embodiments, compression member 132 may be coupled to other areas of load plate 130.

[0040] During assembly, the load plate 130 presses down against the electronic component 102 to press the electronic package 106 against the receptacle contact 126. The electronic package 106 compresses the receptacle contact 126. The load plate 130 may compress the integrated circuit or substrate against the electronic package. In an exemplary embodiment, the load plate 130 may compress against the cable module 104. The load plate 130 may press the cable module 104 into the inserter assembly 108. The compressive force from the load plate 130 can be transmitted to the receptacle contact 126 by the compressive force applied to each cable module 104. In an exemplary embodiment, the load plate 130 may be thermally coupled to the cable module 104. The load plate 130 may define a heat sink for dissipating heat from the cable module 104. The load plate 130 may be thermally coupled to the integrated circuit or other components of the electronic package 106. The load plate 130 may dissipate heat from the integrated circuit or other components of the electronic package 106. Optionally, a heat sink (not shown) may be thermally coupled to the load plate 130. In various other embodiments, the load plate 130 may include fins and other heat dissipation fins extending therefrom to dissipate heat directly into the air or environment surrounding the communication system 100. In various other embodiments, heat pipes, cooling plates, or other heat dissipation structures may be thermally coupled to the load plate 130 to dissipate heat from the load plate 130.

[0041] Figure 3 This is a perspective view of an electronic component 102 according to an exemplary embodiment. The electronic component 102 includes an electronic package 106 supporting a plurality of cable modules 104. An inserter assembly 108 electrically connects the cable modules 104 to the electronic package 106. In an exemplary embodiment, the electronic component 102 includes a cable module compression member 140 for coupling the cable modules 104 to the electronic package 106. The cable module compression member 140 compresses the inserter assembly 108 between the cable modules 104 and the electronic package 106.

[0042] In an exemplary embodiment, inserter assembly 108 defines a separable mating interface. For example, each inserter assembly 108 includes a separable mating interface, such as a compressible interface. Thus, cable module 104 can be removable or replaceable. For example, during a testing process, each cable module 104 can be independently tested and adjusted or replaced to ensure the electronic components function correctly with the receptacle connector 112 (e.g., Figure 1(As shown) it functions normally before assembly. Each inserter assembly 108 may include a separable mating interface, such as a compressible interface. The contacts of the inserter assembly 108 may be compressible cylindrical contacts, such as conductive elastomer contacts. In other embodiments, the contacts of the inserter assembly 108 may be stamped contacts, such as those including a spring beam. The spring beam may be disposed at the top and / or bottom of the inserter assembly 108. In alternative embodiments, the contacts may be press-fit contacts, solder contacts, or other types of contacts. In various embodiments, multiple inserter assemblies 108 are mounted to the electronic package 106. For example, each cable module 104 is mounted to a separate inserter assembly 108. In alternative embodiments, multiple cable modules 104 may be mounted to a single inserter assembly 108. For example, a separate inserter assembly 108 may be disposed along each side of the electronic package 106. In another embodiment, a single inserter assembly is configured to extend along all four sides of the electronic package 106.

[0043] Electronic package 106 includes a package substrate 150 having an upper surface 152 and a lower surface 154. Electronic package 106 includes an integrated circuit component 156 mounted to the upper surface 152 of the package substrate 150. The integrated circuit component 156 may be a chip, ASIC, processor, memory module, or other component mounted on top of the package substrate 150. In the illustrated embodiment, the integrated circuit component 156 is rectangular and approximately centered on the package substrate 150; however, in alternative embodiments, the integrated circuit component 156 may have other shapes or positions. In an exemplary embodiment, the package substrate 150 includes positioning features 158 for positioning relative to a socket connector 112 (e.g., Figure 2 (As shown) Positioning electronic package 106. In the illustrated embodiment, positioning feature 158 is an opening through the package substrate 150. In alternative embodiments, other types of positioning features may be used, such as channels, recesses, extensions, tabs, pillars, pins, etc.

[0044] Package substrate 150 includes edges 160 extending around its periphery. In the illustrated embodiment, package substrate 150 is a rectangular shape with four vertical edges. In alternative embodiments, package substrate 150 may have other shapes including more or fewer edges 160. Integrated circuit component 156 is mounted to package substrate 150 at component mounting region 162, which may be approximately centered between the edges 160. Package substrate 150 includes package contacts (not shown) at component mounting region 162 for electrically connecting integrated circuit component 156 to package substrate 150. Package contacts may be pads, traces, vias, etc.

[0045] The packaging substrate 150 includes a lower package contact (not shown) on its lower surface 154. The lower package contact is used to electrically connect the electronic package 106 to a receptacle connector 112. For example, the lower package contact is electrically connected to a corresponding receptacle contact 126 (e.g., ...). Figure 2 (As shown). In an exemplary embodiment, power and low-speed data signals are transmitted between the package substrate 150 and the receptacle connector 112 via lower package contacts. High-speed data signals can also be transmitted via lower package contacts. The lower package contacts are electrically connected to the integrated circuit component 156 via corresponding package contacts. In an exemplary embodiment, the lower package contacts may be approximately centered along the lower surface 154, for example, directly below the component mounting region 162.

[0046] The package substrate 150 includes upper package contacts (not shown) on its upper surface 152. These upper package contacts are used to electrically connect the electronic package 106 to the cable module 104 via the inserter assembly 108. In an exemplary embodiment, high-speed data signals are transmitted between the package substrate 150 and the cable module 104 via the upper package contacts. The upper package contacts are electrically connected to the integrated circuit component 156 via corresponding package contacts. In an exemplary embodiment, the upper package contacts are disposed around the outer periphery of the package substrate 150. In an exemplary embodiment, the package substrate 150 includes a mounting region 164 surrounding the outer periphery of the package substrate 150. The inserter assembly 108 and the cable module 104 are coupled to the package substrate 150 at the mounting region 164. The mounting region 164 is located between the integrated circuit component 156 and the edge 160 at the component mounting region 162. In the illustrated embodiment, the mounting region 164 is disposed along all four sides of the integrated circuit component 156 to achieve short electrical traces to / from the integrated circuit component 156 (improved signal integrity).

[0047] Electronic component 102 has a high channel density for data communication and power distribution to integrated circuit component 156. For example, data channels are disposed on the upper surface 152 and lower surface 154 of package substrate 150. A subset of data signals (e.g., low-speed and / or sideband data signals) is routed through the bottom of electronic package 106 to main circuit board 110, and a subset of data signals (e.g., high-speed data signals) is routed through the top of electronic package 106 to cable module 104. Increasing the number of data channels to integrated circuit component 156 enhances performance and design efficiency. Furthermore, by routing high-speed data signals directly to cable module 104 instead of routing them through main circuit board 110, the performance of communication system 100 is enhanced. In an exemplary embodiment, cable module 104 is coupled to electronic package 106 at multiple locations (e.g., on the four sides of the chip) to increase the density of communication system 100 and shorten the electrical path of communication system 100. By routing the data channels to the top of the package substrate 150 for digital-to-analog conversion and removing them via cable modules 104, this arrangement reduces the number of interfaces required along the bottom of the package substrate 150. Cable modules 104 can be individually separated from the electronic package 106 using inserter assembly 108. Each cable module 104 has its own compression fit using a corresponding cable module compression member 140. Cable module compression members 140 can be removed to service individual cable modules 104, such as adjusting or replacing cable modules 104 after testing.

[0048] Figure 4 This is a perspective view of a cable module 104 according to an exemplary embodiment. The cable module 104 includes a cable module housing 170 having a cavity 172 for receiving a cable module substrate 174 and an optical engine 176 (shown in dashed lines). The cable module 104 includes one or more optical cables 178 extending from a rear portion 183 of the cable module housing 170. The optical cables 178 terminate at the optical engine 176 and / or the cable module substrate 174. In various embodiments, the optical cables 178 may be fiber optic cables and may be directly attached or detachable.

[0049] Cable module substrate 174 extends between the front portion 181 and the rear portion 183 of cable module 104. Cable module substrate 174 is disposed at the bottom 185 of cable module 104. Cable module substrate 174 extends between the sides 187 and 189 of cable module 104. Cable module substrate 174 may be a printed circuit board or other suitable material for routing electrical traces. Cable module substrate 174 includes module contacts (not shown) configured for electrical connection to inserter assembly 108 (e.g., ...). Figure 3(As shown). For example, the module contacts may be pads on the bottom of the cable module substrate 174. In an exemplary embodiment, the cable module substrate 174 includes positioning features 180 configured to position the cable module 104 relative to the inserter assembly 108. In the illustrated embodiment, the positioning feature 180 is an opening, such as a hole in the cable module substrate 174. In alternative embodiments, other types of positioning features 180 may be provided, such as protrusions or pins extending from the cable module substrate 174. In alternative embodiments, the positioning feature 180 may be disposed on another structure, such as the cable module housing 170.

[0050] Optical Engine 176 (in) Figure 4 (Shown in dashed lines) Connected to the cable module substrate 174, for example, to the top of the cable module substrate 174. The optical engine 176 processes electrical data signals. In an exemplary embodiment, the optical engine 176 includes an electro-optical converter configured to convert between electrical signals and optical signals. The optical engine 176 may include other electrical components.

[0051] In an exemplary embodiment, cable module 104 includes a cable module heat sink 182 for dissipating heat from optical engine 176. The cable module heat sink 182 extends from cable module housing 170. In an exemplary embodiment, the cable module heat sink 182 may be integral with the cable module housing 170. For example, the cable module housing 170 may be molded or otherwise formed to include the cable module heat sink 182. The cable module heat sink 182 may be a conductive thermoplastic material. In an alternative embodiment, the cable module heat sink 182 may be separable from and detachable from the cable module housing 170, for example, detachably coupled to the cable module housing 170. The cable module heat sink 182 may be made of a different material than the cable module housing 170, for example, made of metal. In the illustrated embodiment, the cable module heat sink 182 is disposed on top 184 of the cable module housing 170. The cable module heat sink 182 includes a thermal interface 186 configured to thermally couple to another heat transfer component, such as load plate 130 (e.g., Figure 1 (As shown). Optionally, the thermal interface 186 may be compressible and / or deformable to engage heat transfer components. The cable module heat sink 182 may include plates, such as staggered plates that can move relative to each other. In an alternative embodiment, the cable module heat sink 182 may include heat transfer fins or other heat dissipation elements.

[0052] Figure 5 This is a perspective view of a cable module compression member 140 according to an exemplary embodiment. The cable module compression member 140 includes a biasing member 190 configured to engage a cable module 104 (e.g., ...). Figure 3(As shown) to press downward against the cable module 104. In the illustrated embodiment, the cable module compression member 140 is a spring clip configured to connect to the cable module 104 and the electronic package 106 (as shown) Figure 3 (As shown). In alternative embodiments, other types of compression elements may be used.

[0053] The cable module compression member 140 includes an upper arm 192 and a lower arm 194. The lower arm 194 is configured to engage an electronic package 106. The upper arm 192 defines a biasing member 190, which is configured to engage the cable module 104. In an exemplary embodiment, the upper arm 192 includes an opening 196 configured to receive a cable module heat sink 182 (e.g., Figure 4 (As shown). In an exemplary embodiment, the lower arm 194 includes an opening 198 configured to receive the optical cable 178 (as shown). Figure 4 (As shown). In an alternative embodiment, the cable module compression member 140 may have other shapes.

[0054] Figure 6 This is a perspective view of an inserter assembly 108 according to an exemplary embodiment. The inserter assembly 108 includes an array of inserter contacts 200 held together by a support plate 202, and the inserter assembly 108 includes an inserter frame 204 that holds the support plate 202 and the inserter contacts 200.

[0055] In an exemplary embodiment, the inserter frame 204 is a multi-piece frame having an upper frame member 206 and a lower frame member 208. A support plate 202 is sandwiched between the upper frame member 206 and the lower frame member 208. In the illustrated embodiment, the inserter frame 204 extends around the outer periphery of the inserter assembly 108, for example, along all four sides of the support plate 202. In alternative embodiments, the inserter frame 204 may have other shapes. The inserter frame 204 includes openings 210 in the upper frame member 206 and the lower frame member 208. The openings 210 receive inserter contacts 200.

[0056] In an exemplary embodiment, the inserter frame 204 includes an upper positioning pin 212 and a lower positioning pin 214. The upper positioning pin 212 extends upward from the upper frame member 206. The upper positioning pin 212 is used to position the cable module 104 (e.g., ...) relative to the inserter assembly 108. Figure 4 (As shown). The upper positioning pin 212 receives the positioning feature 180 on the cable module 104 (e.g., Figure 4 As shown, the cable module 104 is positioned relative to the inserter frame 204 and the inserter contact 200. A lower positioning pin 214 extends downward from the lower frame member 208. The lower positioning pin 214 is used relative to the electronic package 106 (e.g., Figure 3(As shown) Positioning inserter assembly 108. Lower positioning pin 214 receives the substrate 150 (e.g., Figure 3 (As shown) the inserter frame 204 and inserter contact 200 are positioned relative to the package substrate 150. In an alternative embodiment, other types of positioning features besides positioning pins 212, 214 may be used.

[0057] Figure 7 This is a side view of a portion of the inserter assembly 108, showing a support plate 202 and a plurality of inserter contacts 200. In an exemplary embodiment, the support plate 202 is a thin film having an upper surface 220 and a lower surface 222. The support plate 202 includes openings 224 therethrough to hold corresponding inserter contacts 200. The support plate 202 is made of an insulating material, such as polyimide, to electrically isolate the inserter contacts 200 from each other.

[0058] Insertor contacts 200 are held by support plates 202. In an exemplary embodiment, insertor contacts 200 include compressible contacts, such as conductive polymer pillars. Each insertor contact 200 includes an upper mating interface 226 and a lower mating interface 228. The upper mating interface 226 is located above the upper surface 220 of the support plate 202, and the lower mating interface 228 is located below the lower surface 222 of the support plate 202. Insertor contacts 200 are compressible between the upper mating interface 226 and the lower mating interface 228. Optionally, the upper mating interface 226 and the lower mating interface 228 may be planar interfaces oriented parallel to each other. Optionally, the upper side 230 and the lower side 232 of the insertor contact 200 may be tapered. For example, the sides 230, 232 may not be oriented parallel to the upper mating interface 226 and the lower mating interface 228. The upper and lower portions of the insertor contact 200 may be conical, such as truncated cones. In alternative embodiments, other types of inserter contacts 200 may be used.

[0059] Figure 8 This is a side view of the inserter component 108 according to an exemplary embodiment. Figure 8 The figure illustrates an inserter frame 204, showing an upper frame member 206 and a lower frame member 208. An upper positioning pin 212 extends from the upper frame member 206. A lower positioning pin 214 extends from the lower frame member 208. Optionally, the upper positioning pin 212 may be aligned with the lower positioning pin 214. In an alternative embodiment, the upper positioning pin 212 may be offset relative to the lower positioning pin 214.

[0060] Figure 9This is a perspective view of a portion of an electronic assembly 102 according to an exemplary embodiment, showing one of an inserter assembly 108 prepared to mate with an electronic package 106. The package substrate 150 includes a plurality of upper package contacts 166 on its upper surface 152. The upper package contacts 166 are arranged in an array complementary to the array of inserter contacts 200. The package contacts 166 may be signal contacts and / or ground contacts and / or power contacts.

[0061] The package substrate 150 includes an inserter positioning feature 168 for positioning an inserter assembly 108 relative to the electronic package body 106. In the illustrated embodiment, the inserter positioning feature 168 is an opening in the package substrate 150 configured to receive a lower positioning pin 214 of the inserter assembly 108. In alternative embodiments, other types of positioning features, such as tabs, pillars, etc., may be used.

[0062] In an exemplary embodiment, the inserter positioning feature 168 and the lower positioning pin 214 are arranged to allow the inserter assembly 108 to engage in different orientations. For example, as Figure 9 As shown, the inserter assembly 108 can be mounted in a first orientation. With the lower positioning pin 214 receiving in a different inserter positioning feature 168, the inserter assembly 108 can be mounted in a second orientation, rotated 180° from the first orientation. The inserter assembly 108 can be flipped upside down or inverted to a third orientation and coupled to the package substrate 150 (or can then be rotated 180° to a fourth orientation). The inserter contacts 200 and the upper package contacts 166 are arranged to accommodate different mating orientations. In an alternative embodiment, the inserter positioning feature 168 and the lower positioning pin 214 can be oriented for keying mating of the inserter assembly 108 with the electronic package 106 in a single orientation.

[0063] Figure 10 This is a perspective view of a portion of an electronic assembly 102 according to an exemplary embodiment, showing one of a cable module 104 prepared to mate with a corresponding inserter assembly 108 and an electronic package 106. Positioning features 180 of the cable module 104 are aligned with upper positioning pins 212 to position the cable module 104 relative to the inserter assembly 108. A cable module substrate 174 is configured to be coupled to an inserter contact 200 of the inserter assembly 108. For example, cable module contacts on the bottom surface of the cable module substrate 174 are aligned and coupled to corresponding inserter contacts 200. The cable module substrate 174 electrically connects the inserter contacts 200 to an optical engine 176. The optical engine 176 connects an optical fiber 178 to the inserter contacts 200 via the cable module substrate 174.

[0064] Cable modules 104 are arranged in cable module groups 191. The optical fibers 178 of each cable module 104 within cable module group 191 extend in a common direction (e.g., from the same side of the electronic enclosure 106). Cable modules 104 are mounted to the electronic enclosure 106 such that the front 181 and rear 183 of the cable modules 104 within each cable module group 191 are aligned. The sides 187, 189 of the cable modules 104 within cable module group 191 face each other and can be close to each other.

[0065] Figure 11 This is a flowchart illustrating the assembly of electronic component 102 according to an exemplary embodiment. At 300, an electronic package 106 is provided, which includes an integrated circuit component 156 and an upper package contact 166 on the upper surface 152 of a package substrate 150. At 302, an inserter assembly 108 is coupled to the package substrate 150. At 304, a cable module 104 is coupled to the inserter assembly 108. In the illustrated embodiment, an optical fiber 178 extends generally horizontally from the electronic package 106, thereby limiting the height of the electronic component 102.

[0066] At 306, the cable module compression member 140 is coupled to the cable module 104. For example, the cable module compression member 140 is clamped onto the cable module 104. The upper arm 192 of the cable module compression member 140 engages the top 184 of the corresponding cable module housing 170. The lower arm 194 engages the lower surface 154 of the encapsulation substrate 150. The cable module compression member 140 compresses the cable module 104 downward against the inserter assembly 108. The optical cable 178 extends from the sides of the electronic package 106, for example, all four sides of the electronic package 106. In an exemplary embodiment, the cable module compression member 140 has sufficient compressive force to compress the inserter contact 200. For example, the cable module 104 is pressed downward by the bias member 190 of the cable module compression member 140 to compress the inserter contact 200 between the cable module 104 and the electronic package 106. In an exemplary embodiment, the upper arm 192 engages the top 184 of the cable module housing 170 at multiple locations, such as around the entire outer periphery of the top 184, to diffuse compressive force around the entire cable module 104. In an exemplary embodiment, an opening 196 in the upper arm 192 receives the cable module heat sink 182. In an exemplary embodiment, an opening 198 in the lower arm 194 receives the optical fiber 178.

[0067] At 308, electronic component 102 is fully assembled. In an exemplary embodiment, electronic component 102 can be tested, for example, to test the electrical connection between each of cable module 104 and inserter assembly 108 and / or to test the electrical connection between inserter assembly 108 and each of electronic package 106, and the testing can be performed before electronic component 102 is assembled with receptacle connector 112, for example, in a testing apparatus, such as before shipping or selling electronic component 102.

[0068] Figure 12 This is a cross-sectional view of a portion of a communication system 100, showing an electronic component 102 connected to a receptacle connector 112 and a main circuit board 110. During assembly, the receptacle connector 112 is electrically connected to the main circuit board 110 at a board interface. A receptacle frame 120 is mounted to the top of the main circuit board 110. A receptacle substrate 124 is received in a receptacle opening 122 and electrically connected to the main circuit board 110. In an exemplary embodiment, the receptacle substrate 124 is connected to the main circuit board 110 using a BGA, LGA, or the like. The receptacle frame 120 positions the receptacle substrate 124 relative to the main circuit board 110.

[0069] During assembly, electronic component 102 is coupled to receptacle connector 112. For example, package substrate 150 is mounted on top of receptacle frame 120. Electronic component 102 is configured to electrically connect package substrate 150 to receptacle contacts 126. In an exemplary embodiment, receptacle connector 112 includes a stop member 136 on top of receptacle substrate 124. Stop member 136 supports electronic package 106 relative to receptacle substrate 124, for example, to limit compression of receptacle contacts 126 when electronic package 106 is coupled to receptacle connector 112.

[0070] In the illustrated embodiment, the receptacle contact 126 is a spring beam extending from the top of the receptacle substrate 124 to define a mating interface that mates with the electronic package 106. The spring beam is compressible to maintain the electrical connection between the receptacle contact 126 and the electronic package 106. In an exemplary embodiment, a compression assembly 114 is used to compress the electronic component 102 into the receptacle connector 112. The compression assembly 114 presses the electronic component 102 downward to compress the receptacle contact 126.

[0071] In an exemplary embodiment, the electronic package 106 includes a lower package contact 148 along the lower surface 154 of the package substrate 150. The lower package contact 148 is electrically connected to a corresponding receptacle contact 126. In the illustrated embodiment, the lower package contact 148 is a contact pad disposed on the lower surface 154 of the package substrate 150. The lower package contact 148 is electrically connected to a package contact 146 of the electronic package 106. The package contact 146 is disposed on an upper surface 152. The package contact 146 is electrically connected to an integrated circuit component 156. In an exemplary embodiment, power and low-speed data signals are transmitted between the lower package contact 148 and the corresponding package contact 146. In an exemplary embodiment, an upper package contact 166 is electrically connected to the corresponding package contact 146. In various embodiments, the upper package contact 166 may be electrically connected to the corresponding lower package contact 148. For example, power may be supplied to the cable module 104 along a trace between the corresponding upper package contact 166 and the lower package contact 148.

[0072] During assembly, the cable module compression member 140 is coupled to the cable module 104 to press the cable module 104 downward. In an exemplary embodiment, the lower arm 194 receives in a recess 138 at the top of the receptacle frame 120, allowing the encapsulation substrate 150 to rest on the top of the receptacle frame 120. The cable module compression member 140 forms a reliable electrical connection between the cable module 104 and the inserter assembly 108, and a reliable electrical connection between the inserter assembly 108 and the encapsulation substrate 150. The inserter contact 200 is compressed between the cable module 104 and the encapsulation substrate 150. The upper mating interface 226 of the inserter contact 200 is electrically connected to the cable module contact 175 at the bottom of the cable module substrate 174. The lower mating interface 228 of the inserter contact 200 is electrically connected to the upper encapsulation contact 166 at the upper surface 152 of the encapsulation substrate 150. The optical engine 176 provides an interface between the cable module substrate 174 and the optical fiber 178.

[0073] During assembly, compression assembly 114 is used to compress electronic component 102 against receptacle connector 112. For example, load plate 130 may compress against integrated circuit component 156. In an exemplary embodiment, load plate 130 defines a heat sink configured to dissipate heat from integrated circuit component 156. Load plate 130 is loaded via compression member 132 (e.g., by pressing it downwards). Compression member 132 is compressed downwards using compression hardware 116 threaded to pad 118. As compression hardware 116 tightens, compression member 132 compresses downwards and presses against load plate 130. Similarly, load plate 130 presses downwards against electronic component 102. In an exemplary embodiment, compression assembly 114 is used to compress cable module 104 against inserter assembly 108. For example, load plate 130 may press downwards against cable module compression member 140 and / or cable module housing 170 and / or cable module heat sink 182 to press cable module 104 downwards into inserter assembly 108. In an exemplary embodiment, the load plate 130 is thermally bonded to the cable module heat sink 182 to dissipate heat from the cable module 104. The load plate 130 serves as a heat sink for the cable module 104. The load plate 130 provides clamping force for the electronic components 102 to the receptacle connector 112 and provides clamping force for the plurality of cable modules 104. The load plate 130 defines a single, uniform heat sink surface for the cable modules 104 while allowing separate and discrete forces to be applied to the cable modules 104 to compress the inserter assembly 108.

[0074] Figure 13 This is a cross-sectional view of a portion of a communication system 100 according to an exemplary embodiment. In the illustrated embodiment, the cable module compression member 140 includes cable module compression hardware 142 coupled to a biasing member 190 to provide a downward biasing force on the biasing member 190. For example, the cable module compression hardware 142 engages an upper arm 192 to press downward against the upper arm 192. The downward pressure on the upper arm 192 is transmitted to the cable module 104 to press the cable module 104 against the inserter assembly 108. In an exemplary embodiment, the communication system 100 includes a heat sink 131 coupled to or integrated with a load plate 130.

[0075] Figure 14 This is a cross-sectional view of a portion of a communication system 100 according to an exemplary embodiment. In the illustrated embodiment, the cable module compression member 140 does not have a lower arm 194 (e.g., Figure 12(As shown). The cable module compression member 140 utilizes the cable module compression hardware 142 to press downwards onto the upper arm 192. In an exemplary embodiment, the cable module compression hardware 142 is received in the threaded insert 144. As the compression hardware 142 is tightened into the threaded insert 144, the upper arm 192 provides a downward biasing force on the cable module 104 to press the cable module 104 against the inserter assembly 108.

[0076] Figure 15 This is a cross-sectional view of a portion of a communication system 100 according to an exemplary embodiment. In the illustrated embodiment, the cable module compression member 140 does not have a lower arm 194 (e.g., Figure 12 (As shown). The cable module compression member 140 utilizes a spring member 145, such as a coil spring, between the cable module compression hardware 142 and the upper arm 192 of the biasing member 190. As the compression hardware 142 is tightened, the coil spring is compressed downward and pushed against the upper arm 192, which provides a downward biasing force on the cable module 104 to press the cable module 104 against the inserter assembly 108.

[0077] Figure 16 This is a perspective view of a portion of a communication system 100 according to an exemplary embodiment, showing an alternative cable module compression member 240 for compressing the cable module 104 against the inserter assembly 108. Figure 17 This is a cross-sectional view of a communication system 100, including a cable module compression member 240.

[0078] Each cable module compression member 240 includes a biasing member 290 that engages the top of the cable module 104. In the illustrated embodiment, the biasing member 290 includes a plate 292 that engages the top of the cable module 104 and an extension 294 extending from the plate 292. The plate 292 includes an opening 296 for receiving a cable module heat sink 182. The extension 294 includes an opening 298 for receiving the cable module compression hardware 242. In the illustrated embodiment, the cable module compression hardware 242 includes a threaded fastener 244 having a spring member 246 that is caught between a head 248 of the threaded fastener 244 and the biasing member 290. The spring member 246 presses the biasing member 290 downward against the cable module 104. In the illustrated embodiment, the threaded fastener 244 is threaded to a socket frame 120.

[0079] In an exemplary embodiment, an electronic component is provided, comprising an electronic package including a package substrate having an upper surface and a lower surface, the electronic package including an integrated circuit component mounted to the upper surface of the package substrate, the electronic package including a lower package contact electrically connected to the integrated circuit component and configured to be electrically connected to a main circuit board, and an upper package contact electrically connected to the integrated circuit component; an inserter assembly including an array of inserter contacts, the inserter contacts being compressible, each inserter contact having an upper mating interface and a lower mating interface, the lower mating interface of the inserter contact mating with the upper package contact; a cable module coupled to the upper surface of the package substrate, each cable module including a cable module substrate having module contacts and an optical engine, the optical engine being mounted to the cable module substrate and electrically connected to the module contacts, the cable modules being mounted to the inserter assembly such that the module contacts are electrically connected to the upper mating interfaces of the inserter contacts, each cable module including an optical fiber terminated to the optical engine; and a cable module compression member coupled to the cable modules, the cable module compression member compressing the compressible inserter contacts between the cable modules and the electronic package.

[0080] In various embodiments, the cable module compression member includes a spring clip that compresses the cable module against an inserter assembly. In various embodiments, the cable module compression member includes a spring clip with an upper arm and a lower arm, the upper arm engaging the cable module and the lower arm engaging the lower surface of the encapsulation substrate to compress the cable module against an inserter contact. In various embodiments, the cable module compression member includes a compression plate and compression hardware that engages and presses the compression plate downwards onto the cable module. In various embodiments, the cable module compression member includes a spring element and compression hardware that engages the spring element and presses the spring element downwards into the cable module.

[0081] In an exemplary embodiment, a communication system is provided, comprising a receptacle connector including a receptacle frame having a receptacle opening for receiving a receptacle substrate, the receptacle substrate including receptacle contacts that are compressible, the receptacle connector being configured to be mounted to a main circuit board, the receptacle substrate being electrically connected to the main circuit board at a board interface; and an electronic assembly coupled to the receptacle connector, the electronic assembly including an electronic package including a package substrate having an upper surface and a lower surface, the electronic package including an integrated circuit component mounted to the upper surface of the package substrate, the electronic package including a lower package contact electrically connected to the integrated circuit component, the lower package contact being electrically connected to the receptacle contacts, the electronic package including an upper package contact electrically connected to the integrated circuit component, the electronic assembly including an inserter assembly, and the receptacle assembly including an inserter contact. The array of heads includes compressible inserter contacts, each inserter contact having an upper mating interface and a lower mating interface, the lower mating interface of the inserter contact mates with an upper package contact, an electronic component including cable modules coupled to an upper surface of a package substrate, each cable module including a cable module substrate having module contacts and an optical engine, the optical engine being mounted to the cable module substrate and electrically connected to the module contacts, the cable modules being mounted to an inserter assembly such that the module contacts are electrically connected to the upper mating interface of the inserter contacts, each cable module including at least one optical fiber terminated to the optical engine; and a compression assembly including a load plate mounted to the electronic component, the compression assembly including a compression member engaging the load plate to press the load plate downward, the load plate being coupled to the electronic package to compress a receptacle contact and electrically connect a lower package contact to the receptacle contact.

[0082] In various embodiments, a load plate engages the cable module to compress the cable module downward toward the inserter assembly. In various embodiments, the cable module includes a cable module heat sink that dissipates heat from the optical engine; the load plate is thermally conductive and engages the optical module heat sink of each cable module to dissipate heat from the cable module heat sink. In various embodiments, receptacle contacts transmit power and low-speed signals between the main circuit board and the electronic package, while the inserter assembly transmits high-speed signals between the electronic package and the cable module.

[0083] Figure 18 This is a top perspective view of a communication system 500 having electronic components 502 according to an exemplary embodiment. Figure 19 This is a perspective view of a communication system 500 according to an exemplary embodiment. Figure 20 This is a cross-sectional view of a communication system 500 according to an exemplary embodiment. The communication system 500 can be used in a communication network such as a network switch. For example, electronic components 502 can be disposed in the rack or tray of the network switch.

[0084] Electronic component 502 includes cable module 504, which is connected via inserter assembly 508. Figure 20Electrically connected to the electronic package 506 ( Figure 20 The electronic component 502 is electrically connected to the main circuit board 510 using a receptacle connector 512. In various other embodiments, the electronic component 502 is mounted directly to the main circuit board 510 without using the receptacle connector 512. In an exemplary embodiment, a compression assembly 514 is used to load the electronic component 502 into the receptacle connector 512 to electrically connect the electronic package 506 to the receptacle connector 512. For example, compression hardware 516 (e.g., a spring-loaded threaded fastener) may be coupled to one or more pads 518 (e.g., a first pad 518a above the main circuit board 510 and a second pad 518b below the main circuit board 510) to couple the compression assembly 514 to the main circuit board 510 and the electronic component 502.

[0085] In an exemplary embodiment, the communication system 500 includes a heat transfer device 700 to dissipate heat from the electronic package 506 and / or the cable module 504. In the illustrated embodiment, the heat transfer device 700 includes a cold plate 702 thermally coupled to the electronic component 502. A coolant line 704 may be thermally coupled to the cold plate 702 to dissipate heat from it. In alternative embodiments, other types of heat transfer devices 700 may be used, such as heat sinks. Heat sinks may include fins and other heat dissipation elements extending therefrom to dissipate heat directly to the air or environment surrounding the communication system 500. In an exemplary embodiment, the electronic component 502 includes a thermal bridge 710 disposed between the heat transfer device 700 and the cable module 504. The thermal bridge 710 thermally couples the heat transfer device 700 to the cable module 504. In an exemplary embodiment, the thermal bridge 710 is compressible to form a compressible, separable interface between the heat transfer device 700 and the cable module 504. The thermal bridge 710 may be formed of a plurality of staggered stacked plates. In alternative embodiments, other types of thermal bridges 710 may be used.

[0086] In various embodiments, the electronic package 506 is an integrated circuit component, such as an ASIC. However, the electronic package 506 can be another type of communication component. Cable modules 504 are electrically connected to the electronic package 506 via an inserter assembly 508 independent of the main circuit board 510. For example, high-speed data signals are transmitted between the electronic package 506 and the cable modules 504 via the inserter assembly 508, without crossing the main circuit board 510. In exemplary embodiments, multiple cable modules 504 are coupled to the electronic package 506. For example, cable modules 504 may be disposed on multiple sides of the integrated circuit or other communication element of the electronic package 506. In the illustrated embodiment, cable modules 504 are disposed on all four sides of the integrated circuit. For example, cables from cable modules 504 may extend in north, south, east, and west directions. In alternative embodiments, other arrangements are possible, wherein cable modules may be attached to, for example, one side, two sides (opposite or adjacent to each other), or three sides of the integrated circuit. The cable module 504 is clamped or compressed against the inserter assembly 508 and can be serviced separately and removed from the electronic package 506.

[0087] Figure 21 This is an exploded view of a communication system 500 according to an exemplary embodiment. Figure 22 This is an exploded view of a communication system according to an exemplary embodiment. Figure 21 and Figure 22 A receptacle connector 512 mounted to a main circuit board 510 and an electronic component 502 prepared for connection to the receptacle connector 512 are shown. A heat transfer device 700 is prepared for connection to the electronic component 502 to dissipate heat from the electronic component 502. For example, the heat transfer device 700 may be used to dissipate heat from a cable module 504 and / or an electronic package 506.

[0088] The receptacle connector 512 includes a receptacle substrate 524. The receptacle substrate 524 may be held by a receptacle frame. In various embodiments, the receptacle frame may be defined by one of a pad 518, such as a pad above a main circuit board 510. The bottom of the receptacle substrate 524 is configured to mount to the main circuit board 510 at a board interface. For example, the receptacle substrate 524 may be electrically connected to the main circuit board 510 via a ball grid array (BGA), a pad grid array (LGA), or another mating interface. The receptacle connector 512 includes receptacle contacts 526, for example, at the top of the receptacle substrate 524. In an exemplary embodiment, the receptacle contacts 526 are compressible contacts, such as spring beams, configured to be electrically connected to an electronic package 506. When a compression assembly 514 is mounted to the main circuit board 510, the compression assembly 514 may compress the receptacle contacts 526. In an exemplary embodiment, the receptacle connector 512 includes a guide member 528 to guide mating of the electronic package 506 with the receptacle connector 512. For example, guide member 528 can be an edge, surface, post, pin, socket, opening, or other type of guide member.

[0089] Compression assembly 514 is coupled to the top of electronic component 502 to mechanically and electrically connect electronic component 502 to receptacle connector 512. Compression assembly 514 includes compression hardware 516. Compression assembly 514 may include other components, such as a load plate actuated by compression hardware 516, to compress electrical component 502 against receptacle connector 512. Cold plate 702 may define the load plate, configured to press down against electronic component 502 and receptacle connector 512. Cold plate 702 transfers compression load from compression hardware 516 to electronic component 502. In alternative embodiments, a separate load plate may be provided. In an exemplary embodiment, compression hardware 516 includes spring-loaded threaded fasteners configured to transfer spring force to the load plate or directly to electronic component 502. In alternative embodiments, other types of compression members may be used. During assembly, electronic component 502 is pressed down to force electronic package 506 against receptacle contact 526. In an exemplary embodiment, cold plate 702 may be compressed against cable module 504. The cold plate 702 can press the cable module 504 into the inserter assembly 508. The compressive force from the cold plate 702 can be transmitted to the socket contact 526 by the compressive force applied to each cable module 504.

[0090] Electronic assembly 502 includes an electronic package 506 and multiple cable modules 504 electrically connected to the electronic package 506. Insertor assembly 508 ( Figure 22The cable module 504 is electrically connected to the electronic package 506. A thermal bridge 710 is thermally coupled to the cable module 504. In an exemplary embodiment, the electronic assembly 502 includes a carrier assembly 800 for coupling the cable module 504 to the electronic package 506. The carrier assembly 800 compresses an inserter assembly 508 between the cable module 504 and the electronic package 506. In an exemplary embodiment, each carrier assembly 800 holds multiple cable modules 504, multiple thermal bridges 710, and multiple inserter assemblies 508. The carrier assembly 800 is used to mount multiple cable modules 504 as a unit to the electronic package 506. The carrier assembly 800 positions the cable modules 504 and inserter assemblies 508 relative to each other to guide engagement with the electronic package 506. The carrier assembly 800 can be individually mounted to and removed from the electronic package 506, for example, for repair or replacement, without disassembling the entire electronic assembly 502.

[0091] In an exemplary embodiment, inserter assembly 508 defines a separable mating interface. For example, each inserter assembly 508 includes an upper separable mating interface, such as a compressible interface. Thus, cable module 504 can be removable or replaceable. For example, during a testing process, each cable module 504 can be independently tested and adjusted or replaced to ensure that electronic component 502 functions correctly before assembly with the receptacle connector. Each inserter assembly 508 may include a lower separable mating interface, such as a compressible interface. The contacts of inserter assembly 508 may be compressible cylindrical contacts, such as conductive elastomer contacts. In other embodiments, the contacts of inserter assembly 508 may be stamped contacts, such as those including a spring beam. The spring beam may be disposed at the top and / or bottom of inserter assembly 508. In alternative embodiments, the contacts may be press-fit contacts, solder contacts, or other types of contacts. In various embodiments, multiple inserter assemblies 508 are mounted to carrier assembly 800 and coupled to corresponding cable modules 504. In an alternative embodiment, a single inserter assembly 508 may be disposed in the carrier assembly 800 for cooperating with multiple cable modules 504.

[0092] Electronic package 506 includes a packaging substrate 550 having an upper surface 552 and a lower surface 554. Electronic package 506 includes an integrated circuit component 556 mounted to the upper surface 552 of the packaging substrate 550. The integrated circuit component 556 may be a chip, ASIC, processor, memory module, or other component mounted on top of the packaging substrate 550. In the illustrated embodiment, the integrated circuit component 556 is rectangular and approximately centered on the packaging substrate 550; however, in alternative embodiments, the integrated circuit component 556 may have other shapes or positions. In an exemplary embodiment, the packaging substrate 550 includes positioning features 558 (such as...). Figure 23As shown, the positioning feature 558 is used to position the electronic package 506 relative to the socket connector 512. In the illustrated embodiment, the positioning feature 558 is an opening through the package substrate 550 that receives fasteners such as compression hardware 516. In alternative embodiments, other types of positioning features may be used, such as channels, recesses, extensions, tabs, posts, pins, etc.

[0093] The package substrate 550 includes edges 560 extending around its periphery. In the illustrated embodiment, the package substrate 550 is a rectangular shape with four vertical edges. In alternative embodiments, the package substrate 550 may have other shapes including more or fewer edges 560. An integrated circuit component 556 is mounted to the package substrate 550 at a component mounting region 162, which may be approximately centered between the edges 560. The package substrate 550 includes package contacts (not shown) at the component mounting region 562 for electrically connecting the integrated circuit component 556 to the package substrate 550. The package contacts may be pads, traces, vias, etc.

[0094] The package substrate 550 includes a lower package contact (not shown) on its lower surface 554. The lower package contact is used to electrically connect the electronic package 506 to a receptacle connector 512. For example, the lower package contact is electrically connected to a corresponding receptacle contact 526. In an exemplary embodiment, power and low-speed data signals are transmitted between the package substrate 550 and the receptacle connector 512 via the lower package contact. High-speed data signals can also be transmitted via the lower package contact. The lower package contact is electrically connected to the integrated circuit component 556 via a corresponding package contact. In an exemplary embodiment, the lower package contact may be approximately centered along the lower surface 554, for example, directly below the component mounting region 562.

[0095] The packaging substrate 550 includes an upper packaging contact 566 (e.g., on its upper surface 552) on the upper surface 552 of the packaging substrate 550. Figure 24(As shown). The upper package contact is used to electrically connect the electronic package 506 to the cable module 504 via the inserter assembly 508. In an exemplary embodiment, high-speed data signals are transmitted between the package substrate 550 and the cable module 504 via the upper package contact 566. The upper package contact 566 is electrically connected to the integrated circuit component 556 via a corresponding package contact. In an exemplary embodiment, the upper package contact 566 is disposed around the outer periphery of the package substrate 550. In an exemplary embodiment, the package substrate 550 includes a mounting region 564 surrounding the outer periphery of the package substrate 550. The inserter assembly 508 and the cable module 504 are coupled to the package substrate 550 at the mounting region 564. The mounting region 564 is located between the integrated circuit component 556 and the edge 560 at the component mounting region 562. In the illustrated embodiment, the mounting region 564 is disposed along all four sides of the integrated circuit component 556 to achieve short electrical traces to / from the integrated circuit component 556 (improved signal integrity).

[0096] Electronic component 502 has a high channel density for data communication and power distribution to integrated circuit component 556. For example, data channels are disposed on the upper surface 552 and lower surface 554 of package substrate 550. A subset of data signals (e.g., low-speed and / or sideband data signals) is routed through the bottom of electronic package 506 to main circuit board 510, and a subset of data signals (e.g., high-speed data signals) is routed through the top of electronic package 506 to cable module 504. Increasing the number of data channels to integrated circuit component 556 enhances performance and design efficiency. Furthermore, by directly routing high-speed data signals to cable module 504 instead of routing them through main circuit board 510, the performance of communication system 500 is enhanced. In an exemplary embodiment, cable module 504 is coupled to electronic package 506 at multiple locations (e.g., on the four sides of the chip) to increase the density of communication system 500 and shorten the electrical path of communication system 500. By routing the data channels to the top of the package substrate 550 for cable module 504 removal, this arrangement reduces the number of interfaces required along the bottom of the package substrate 550. In various embodiments, cable module 504 may be an optical module with an optical engine for digital-to-optical conversion. In alternative embodiments, cable module 504 may be an electrical module with electrical conductors (e.g., copper conductors). Cable module 504 can be detached from electronic package 506 using inserter assembly 508. Each cable module 504 has its own compression fit force using a corresponding carrier assembly 800. Carrier assembly 800 can be removed to service cable module 504, such as adjusting or replacing cable module 504 after testing.

[0097] Figure 23 This is an exploded view of electronic component 502 according to an exemplary embodiment. Figure 23 One and another carrier assemblies 800 mounted to an electronic package 506 are shown in an exploded view, illustrating a cable module 504, an inserter assembly 508, and a thermal bridge 710. A package substrate 550 is also shown, mounted to a pad 518. The pad 518 provides structural support for the package substrate 550 to prevent warping. The pad 518 may define a receptacle connector 512 (e.g., Figure 21 The frame (shown). For example, pad 518 may include an opening or recess for receiving receptacle connector 512 to position package substrate 550 relative to receptacle connector 512.

[0098] Cable module 504 includes cable module housing 570, which has a receiving cable module substrate 574 (e.g., Figure 25 The cavity (shown). In various embodiments, cable module 504 may be an optical module with an optical engine within housing 570 to process data signals. In an exemplary embodiment, the optical engine includes an electro-optical converter configured to convert between electrical signals and optical signals. The optical engine may include other electrical components.

[0099] The cable module housing 570 extends between the front portion 581 and the rear portion 583 of the cable module 504. The cable module housing 570 also extends between the sides 587 and 589 of the cable module 504. The cable module substrate 574 (as shown) Figure 25 (As shown) is disposed at the bottom 582 of the cable module 504. The cable module 504 includes one or more cables 578 extending from the rear 583 of the cable module housing 570. In various embodiments, the cable 578 may be an optical fiber cable. In other various embodiments, the cable 578 may be a power cable, for example, comprising a copper conductor. In various embodiments, the cable may be a coaxial cable or a biaxial cable. The cable 578 may be coupled to the cable module substrate 574 (or an optical engine, if provided).

[0100] Thermal bridge 710 is configured to engage cable module housing 570 to dissipate heat from cable module 504. For example, thermal bridge 710 may be coupled to the top 584 of cable module housing 570. Each thermal bridge 710 includes thermal interfaces 585, 586 for connection to heat transfer device 700 (e.g., Figure 1The thermal bridge 710 (shown) interfaces with the cable module 504. The thermal bridge 710 can be a molded or die-cast component, for example, made of metal or a thermally conductive polymer material. Optionally, thermal interfaces 585, 586 can be compressible and / or deformable for engaging the heat transfer device 700 and / or the cable module 504. In various other embodiments, the thermal bridge 710 may include plates such as staggered plates that are movable relative to each other to make the thermal bridge compressible and / or conformable to the heat transfer device 700 and / or the cable module 504. In alternative embodiments, the thermal bridge 710 may include a block or base, and heat transfer fins or other heat dissipation elements extending from the base.

[0101] The carrier assembly 800 includes a carrier base 802 and a carrier cover 804 configured to be coupled to the carrier base 802. A cable module 504, an inserter assembly 508, and a thermal bridge 710 are configured to be sandwiched between the carrier base 802 and the carrier cover 804. Compression hardware 516 is used to secure the carrier cover 804 and the carrier base 802 to the electronic package 506 and / or the pad 518. The carrier assembly 800 can be biased or pressed downward by the compression hardware 516 to press the thermal bridge 710 into thermal contact with the cable module 504 and to press the cable module 504 into the inserter assembly 508.

[0102] The carrier base block 802 includes a platform 810 having an upper surface 812 and a lower surface 814. The platform 810 holds a cable module 504, an inserter assembly 508, and a thermal bridge 710. The platform 810 is configured to be coupled to the upper surface 552 of a package substrate 550. The platform 810 includes an inserter assembly opening 816 passing through it. The inserter assembly opening 816 is separated by a base block positioning rail 818. The base block positioning rail 818 defines a recess that receives the cable module 504, the inserter assembly 508, and the thermal bridge 710. The base block positioning rail 818 is used to guide or position the cable module 504, the inserter assembly 508, and the thermal bridge 710 relative to each other and relative to the inserter assembly opening 816. The carrier base block 802 includes an opening 820 for receiving compression hardware 516. The carrier base block 802 includes a fastener opening 822 for receiving a fastener 824. Fastener 824 is used to secure carrier cover 804 to carrier base block 802.

[0103] The carrier cover 804 includes a plate 840 having an upper surface 842 and a lower surface 844. The lower surface 844 is configured to be coupled to the upper surface 812 of the carrier base block 802. The carrier cover 804 includes a carrier cover opening 846 aligned with the inserter assembly opening 816. The carrier cover opening 846 is formed by a cover positioning rail 848. The carrier cover opening 846 receives a thermal bridge 710. The thermal bridge 710 extends through the carrier cover opening 846 such that a thermal interface 585 is located above the upper surface 842 for interface connection with the heat transfer device 700. The cover positioning rail 848 is used to position the thermal bridges 710 relative to each other for interface connection with the cable module 504.

[0104] During assembly, inserter assembly 508 is located in inserter assembly opening 816, for example, between base block positioning rails 818. Cable assembly 504 is received above the corresponding inserter assembly 508 in the opening 816 between the base block positioning rails 818. Thermal bridge 710 is located above cable assembly 504. Once inserter assembly 508, cable module 504, and thermal bridge 710 are stacked in carrier base block 802, carrier cover 804 is placed on thermal bridge 710 and coupled to carrier base block 802. Cable module 504, inserter assembly 508, and thermal bridge 710 are sandwiched between carrier cover 804 and carrier base block 802. Carrier cover 804 holds cable module 504, inserter assembly 508, and thermal bridge 710 within carrier assembly 800. Carrier assembly 800 groups multiple cable assemblies 504 together for operation and mating with electronic package 506. The carrier assembly 800 is used to connect multiple cable modules 504, inserter assemblies 508, and thermal bridges 710 as units to the electronic package 504. The carrier assembly 800 maintains the relative position of the inserter assemblies 508 so that the inserter assemblies 508 are aligned with the upper package contacts 566 of the electronic package 506.

[0105] For further reference Figure 24 This is a top view of a portion of an electronic package 506, which includes upper package contacts 566 disposed in various package mounting regions 564. The upper package contacts 566 are electrically connected to an integrated circuit component 556 via corresponding package contacts (e.g., traces). In an exemplary embodiment, the upper package contacts 566 are disposed around the outer periphery of a package substrate 550. An inserter assembly 508 and a cable module 504 are coupled to the package substrate 550 at the mounting regions 564. In the illustrated embodiment, the mounting regions 564 are disposed along all four sides of the integrated circuit component 556 to provide short electrical traces to / from the integrated circuit component 556 (improved signal integrity). In various embodiments, the upper package contacts 566 are contact pads. In other various embodiments, the upper package contacts 566 may be compressible contacts, such as spring contacts. The inserter assembly 508 compresses hardware 516 ( Figure 23Compression abuts against the upper package contact 566.

[0106] In an exemplary embodiment, the package substrate 550 includes a positioning feature 558 for positioning a carrier assembly 800 relative to an electronic package 506. The positioning feature 558 is an opening through the package substrate 550 that receives a fastener, such as compression hardware 516. In the illustrated embodiment, the positioning feature 558 is located near an edge or corner, such as the two edges of a side mounting region 564. In alternative embodiments, other types of positioning features may be used. In an exemplary embodiment, the package substrate includes an inserter positioning feature 559 for positioning an inserter assembly 508 relative to the electronic package 506. The inserter positioning feature 559 is an opening in the package substrate 550 that receives positioning features of the carrier assembly 800 and / or the inserter assembly 508 to position the inserter assembly 508 relative to the mounting region 564 and the upper package contact 566. The positioning feature 559 is located near the mounting region 564. In alternative embodiments, other types of inserter positioning features 559 may be used.

[0107] Figure 25 This is a bottom perspective view of the carrier component 800 according to an exemplary embodiment. Figure 25 One of the inserter assemblies 508 removed from the carrier assembly 800 is shown to illustrate a portion of the cable module 504. The cable module 504 includes a cable module substrate 574. The cable module substrate 574 may be a printed circuit board or other suitable material for routing electrical traces. The cable module substrate 574 includes module contacts 575 configured for electrical connection to the inserter assembly 508. For example, the module contacts 575 may be a pad on the bottom of the cable module substrate 574.

[0108] Insertor assemblies 508 are coupled to the bottom of platform 810, for example, in inserter assembly opening 816. Rails 818 position the inserter assemblies 508 relative to each other. Each inserter assembly 508 includes an array of inserter contacts 600 held together by support plate 602. Inserter assembly 508 includes an inserter frame 604 that holds the support plate 602 and the inserter contacts 600.

[0109] In an exemplary embodiment, the support plate 602 is a thin film having an upper surface and a lower surface. The support plate 602 may include openings therethrough to hold corresponding inserter contacts 600. The support plate 602 is made of an insulating material, such as polyimide, to electrically isolate the inserter contacts 600 from each other. In an exemplary embodiment, the inserter contacts 600 include compressible contacts, such as conductive polymer pillars. Each inserter contact 600 includes an upper mating interface and a lower mating interface. The upper mating interface is located above the upper surface of the support plate 602, and the lower mating interface is located below the lower surface of the support plate 602. The inserter contacts 600 are compressed between the upper and lower mating interfaces. Optionally, the upper and lower mating interfaces may be planar interfaces oriented parallel to each other. Optionally, the sides of the inserter contacts 600 may be tapered. For example, the sides may not be oriented parallel to the upper and lower mating interfaces. The upper and lower portions of the inserter contacts 600 may be conical, such as truncated cones. In alternative embodiments, other types of inserter contacts 600 may be used.

[0110] In an exemplary embodiment, the inserter frame 604 includes an inserter positioning feature 606. The inserter positioning feature 606 may be a recess or opening formed in the inserter frame 604. The inserter positioning feature 606 is configured to engage a carrier positioning feature 860 of the carrier assembly 800. For example, the carrier positioning feature 860 may be a pin or post extending from the carrier base 802. The carrier positioning feature 860 is configured to attach to an inserter positioning feature 559 of the electronic package 506 to position the carrier assembly 800 and the inserter assembly 508 relative to the package substrate 550. Optionally, some carrier positioning features 860 may be longer and extend beyond the bottom and / or the inserter assembly 508 to insert into the package substrate 550, and some carrier positioning features 860 may be shorter, for example, flush with the bottom of the inserter assembly 508 or recessed relative to the inserter assembly 508.

[0111] In an exemplary embodiment, the carrier assembly 800 includes a carrier positioning feature 862. The carrier positioning feature 862 extends from the bottom of the platform 810. For example, the carrier positioning feature 862 may be a pin or post extending from the carrier base 802. The carrier positioning feature 862 is configured to engage with an inserter positioning feature 559 of the electronic package 506 to position the carrier assembly 800 and the inserter assembly 508 relative to the package substrate 550.

[0112] Figure 26 This is a top view of the electronic component 502 according to an exemplary embodiment. Figure 27 This is a side view of the electronic component 502 according to an exemplary embodiment. The carrier assembly 800 holds the cable module 504 and the inserter assembly 508 for electrical connection with the electronic package 506. A thermal bridge 710 is exposed at the top for connection with the heat transfer device 700 (such as...). Figure 1 (As shown) Interface connection. The carrier assembly 800 compresses the cable module 504 and inserter assembly 508 against the electronic package 506 at a compressible, detachable interface. For example, compression hardware 516 is used to press the carrier assembly 800 downward, which compresses the cable module 504 and inserter assembly 508.

[0113] Figure 28 This is a top view of a portion of the electronic component 502 according to an exemplary embodiment. Figure 29 This is a side view of a portion of the electronic component 502 according to an exemplary embodiment. Figure 28 and Figure 29 A cable module 504 is shown as an optical module. In the illustrated embodiment, each side of the electronic component 502 includes eight cable modules 504; however, in alternative embodiments, more or fewer cable modules 504 may be provided. The cable module 504 is shown without a carrier component 800 (e.g., Figure 26-27 (As shown). Cable 578 is an optical fiber cable. Cable module 504 includes an optical engine for converting between optical and electrical signals.

[0114] Figure 30 This is a top view of a portion of the electronic component 502 according to an exemplary embodiment. Figure 31 This is a side view of a portion of the electronic component 502 according to an exemplary embodiment. Figure 30 and Figure 31 A cable module 504 is shown as an electrical module. In the illustrated embodiment, each side of the electronic component 502 includes eight cable modules 504; however, in alternative embodiments, more or fewer cable modules 504 may be provided. The cable module 504 is shown without a carrier component 800 (such as...). Figure 26-27 (As shown). Cable 578 is a power cable, such as a coaxial cable, biaxial cable, ribbon cable, etc.

Claims

1. An electronic component (502), comprising: An electronic package (506) includes a package substrate (550) having an upper surface (552) and a lower surface (554), the electronic package including an integrated circuit component (556) mounted to the upper surface of the package substrate, the electronic package including a lower package contact (548) electrically connected to the integrated circuit component and configured to be electrically connected to a main circuit board (510), and the electronic package including an upper package contact (566) electrically connected to the integrated circuit component. An inserter assembly (508) electrically connected to the electronic package, each inserter assembly including an array of inserter contacts (600) which are compressible, each inserter contact having an upper mating interface (626) and a lower mating interface (628), the lower mating interface of the inserter contact mating with the upper package contact, the inserter assembly defining a separable interface with the electronic package; A cable module (504) is connected to the upper detachable interface of the inserter assembly. Each cable module includes a cable module base plate (574) having module contacts (575) and a cable (578) terminated to the cable module base plate and electrically connected to the module contacts; and A carrier assembly (800) configured to be coupled to the upper surface of the electronic package, each carrier assembly including a carrier base (802) and a carrier cover (804), each carrier assembly configured to compressibly hold at least one inserter assembly and at least one cable module between the carrier base and the carrier cover, the carrier assembly holding the cable module with the module contacts electrically connected to the upper mating interface of the inserter contacts, the carrier assembly holding the lower mating interface of the inserter contacts electrically connected to the upper package contacts of the electronic package, the carrier assembly being removable separately from the electronic package to detach the inserter assembly from the electronic package.

2. The electronic component (502) of claim 1, wherein the inserter component (508) and the cable module (504) are sandwiched between the carrier base (802) and the carrier cover (804).

3. The electronic component (502) of claim 1, wherein the carrier base (802) includes an inserter assembly opening (816) that holds the inserter assembly (508) in a fixed position to engage with the electronic package (506), and the carrier base includes positioning features (860, 862) for positioning the cable module (504) in a fixed position to engage with the inserter assembly.

4. The electronic component (502) of claim 1 further includes a thermal bridge (710) thermally coupled to the cable module (504), the carrier component (800) maintaining thermal communication between the thermal bridge and the cable module, the carrier cover (804) including a carrier cover opening (846) for receiving the thermal bridge, the thermal bridge passing through the carrier cover for thermal interface connection with the cable module and the heat transfer device.

5. The electronic assembly (502) of claim 1, wherein each carrier assembly (800) holds a plurality of the inserter assemblies (508) and a plurality of the cable modules (504).

6. The electronic component (502) of claim 1, wherein the carrier component (800) further comprises compression hardware (516) coupled to the electronic package (506), the compression hardware being configured to compress the inserter contact (600) against the upper package contact (566) of the electronic package.

7. The electronic component (502) of claim 1, wherein the carrier substrate (802) includes carrier guide pins extending from the bottom of the carrier substrate to position the carrier substrate relative to the packaging substrate (550).

8. The electronic component (502) of claim 1, wherein the carrier substrate (802) includes an inserter guide pin that engages the inserter assembly (508) to position the inserter assembly relative to the carrier substrate, the inserter guide pin extending from the bottom of the carrier substrate to engage the package substrate (550) and position the carrier substrate relative to the package substrate.

9. The electronic component (502) of claim 1, wherein the inserter contact (600) comprises a conductive polymer pillar held in the array by a support plate (840), the upper mating interface (626) being located above the support plate and the lower mating interface (628) being located below the support plate.

10. The electronic component (502) of claim 1, wherein the upper mating interface (626) is compressible and the lower mating interface (628) is compressible.

11. The electronic assembly (502) of claim 1, wherein the inserter assembly (508) includes an inserter frame (204) holding a support plate (202) that holds each of the inserter contacts (600) in the array, the inserter frame including a lower positioning pin that engages the package substrate (550) to position the inserter assembly relative to the upper package contact (566), and the inserter frame including an upper positioning pin (212) that engages the cable module (504) to position the cable module relative to the inserter contacts.

12. The electronic component (502) of claim 1, wherein the cable module (504) includes a cable module housing (504) holding the cable module substrate (574) and an optical engine (176) coupled to the cable module substrate, the cable module housing being held between a corresponding carrier base and the carrier cover.

13. The electronic component (502) of claim 1, wherein the packaging substrate (550) includes an edge surrounding the periphery of the packaging substrate, the packaging substrate including a mounting region (562) between the integrated circuit component and the edge, each mounting region receiving one of the carrier components, each of the carrier components including a plurality of the cable modules and a plurality of the inserter components.

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