Semiconductor module

Abstract

Suppress the generation of cracks and voids (pores) when molding the resin of the housing of the semiconductor module. In the semiconductor module (1) including the semiconductor element (3), it is configured as follows: the semiconductor module (1) includes a housing (13) for housing the semiconductor element (3), and an installation hole (17) is integrally formed with the housing by resin molding. The installation hole (17) is used to mount the printed circuit board (4) on the upper surface of the housing (13) using a self-tapping screw (18). The entire installation hole (17) is formed in a cylindrical shape, and the tip of the installation hole (17) is formed in a hemispherical shape.

Description

Technical Field

[0001] The present invention relates to a semiconductor module including semiconductor elements. Background Art

[0002] A semiconductor module has a substrate provided with semiconductor elements such as an IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and an FWD (Free Wheeling Diode), and is used for a converter device or the like.

[0003] Such a semiconductor module includes a housing for mounting the substrate. The housing is formed by resin molding such as injection molding. Molten resin is filled into a cavity space formed inside a mold, and the resin is cured to form a molded product. As a mounting unit for mounting the substrate on the housing of such a semiconductor device, a unit having a threaded seat in which a metal columnar member is embedded is known (for example, refer to Patent Document 1).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2001-36003 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, for the housing of Patent Document 1, it is necessary to separately prepare a metal threaded seat from the housing, which not only increases the component cost but also requires a lot of effort for mounting the threaded seat. In addition, as shown in Figure 5 , when the mounting hole 70 is integrally resin-molded with the housing 50, a corner 70b is formed at the end 70a of the mounting hole 70, and the mounting hole 70 is used to mount the printed circuit board 4 using a self-tapping screw 18. Therefore, when the housing 50 is resin-molded with the mounting hole 70 integrally formed with the housing 50, there is a case where resin remains near the end 70a of the mounting hole 70. Moreover, during resin molding, the outside of the housing 50 cools first and the inside cools later. As a result, the housing 50 is stretched by the shrinkage difference between the outside and the inside of the housing 50. Thereby, cracks 81 may be formed in the details inside the housing 50 or voids (pores) 82 may be generated.

[0009] When cracks 81 and voids 82 are generated near the mounting hole 70, there is a possibility that if the mounting hole 70 is tapped using the self-tapping screw 18, the strength will be insufficient and the housing may be damaged when the self-tapping screw 18 is tightened. In addition, when cracks 81 and voids 82 are generated near the mounting hole 70, if the mounting hole 70 is tapped using the self-tapping screw 18, there is a possibility that the thread teeth formed by thread cutting during tapping may break, torque loss may occur before reaching the specified torque, and the self-tapping screw 18 may rotate idly.

[0010] The present invention has been completed in view of the above problems, and one of its objects is to provide a semiconductor module capable of suppressing the generation of cracks and voids (pores) when molding the housing of a resin-molded semiconductor module.

[0011] Solution to the problem

[0012] In one aspect of the semiconductor module including a semiconductor element according to the present embodiment, the semiconductor module includes a housing for accommodating the semiconductor element, and a mounting hole is integrally formed with the housing by resin molding. The mounting hole is used to mount a printed circuit board on the upper surface of the housing using a screw. The entire mounting hole is formed in a cylindrical shape, and the top end of the mounting hole is formed in a hemispherical shape.

[0013] Effect of the invention

[0014] According to the present invention, a semiconductor module can be provided that can suppress the generation of cracks and voids (pores) when molding the housing of a semiconductor device. Description of the drawings

[0015] Figure 1 It is a cross-sectional schematic view showing an example of a semiconductor device including the semiconductor module according to the present embodiment.

[0016] Figure 2 It is a top view showing an example of the housing of the semiconductor module according to the present embodiment.

[0017] Figure 3 It shows a cross-sectional view taken along the line a-a' in the thickness direction Figure 2 and observed from the arrow direction of the shown housing.

[0018] Figure 4 It shows Figure 3 an enlarged view of a cross-sectional view of the shown mounting hole.

[0019] Figure 5 It is a view showing an example of a conventional housing formed by resin molding. Detailed description of the invention

[0020] Hereinafter, a semiconductor device to which the present invention can be applied will be described.Figure 1 It is a schematic cross-sectional view showing an example of the semiconductor device 100 including the semiconductor module 1 of the present embodiment. In addition, the semiconductor device shown below is merely an example and is not limited thereto, and can be appropriately changed. In this specification, a top view refers to the case of observing the semiconductor device from a direction perpendicular to the insulating circuit board.

[0021] The semiconductor device 100 is applied to power conversion devices such as power modules, for example. As Figure 1 shown, it is constituted by mounting an insulating circuit board 2 on the semiconductor module 1. The semiconductor module 1 includes a substrate 12, semiconductor elements 3, and a housing 13. The substrate 12 is a heat sink. The semiconductor elements 3 are disposed on the upper surface of the insulating circuit board 2, and the housing 13 surrounds the insulating circuit board 2 and the semiconductor elements 3. The insulating circuit board 2 is disposed on the upper surface of the substrate 12. In addition, the semiconductor module 1 is mounted on an external device 11 such as a cooler to form a structure.

[0022] The external device 11 is constituted by a cooler such as a radiator, a heat sink, or a water-cooling jacket, for example, and has a rectangular shape in a top view. The external device 11 has a smooth joint surface that is joined to the semiconductor module 1 on its upper surface. The external device 11 is formed of a metal such as copper or aluminum, or an alloy containing one or more of these metals, and its surface is subjected to, for example, an electroplating process. In addition, in the above-described embodiment, an example in which the external device 11 is constituted by a cooler has been described, but it is not limited thereto. For example, it may be constituted by an unillustrated unit.

[0023] The substrate 12 functions as a heat sink, and an electroplating process is applied to the surface of a metal plate such as copper. For example, it has a rectangular shape in a top view. The substrate 12 has a smooth joint surface that is joined to the insulating circuit board 2 on its upper surface.

[0024] The insulating circuit board 2 is constituted by laminating a metal layer and an insulating layer, and is formed in a rectangular shape in a top view that is smaller than the upper surface of the substrate 12. Specifically, the insulating circuit board 2 includes an insulating board 20 having an upper surface (one side surface) and a lower surface (the other side surface) opposite to the upper surface, a first metal layer 21 formed on the upper surface of the insulating board 20, and a second metal layer 22 formed on the lower surface of the insulating board 20. The thicknesses of the insulating board 20, the first metal layer 21, and the second metal layer 22 may be the same or different from each other.

[0025] The insulating board 20 is formed of an insulator such as ceramic, and the first metal layer 21 and the second metal layer 22 are formed of copper foil, for example. The first metal layer 21 constitutes a circuit layer that is electrically connected to the semiconductor elements. The first metal layer 21 has a plane, and a predetermined circuit pattern is disposed on the upper surface of the insulating board 20. Specifically, the outer edge portion of the first metal layer 21 is located at a position slightly inside the outer edge portion of the insulating board 20.

[0026] The second metal layer 22 has a plane and has a substantially overall rectangular shape in a top view covering the lower surface of the insulating board 20. Specifically, the outer edge portion of the second metal layer 22 is located at a position slightly inside the outer edge portion of the insulating board 20. The lower surface of the second metal layer 22 of the insulating circuit board 2 is joined to the upper surface of the substrate 12.

[0027] The insulating circuit board 2 configured as such is formed of, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. In addition, the insulating board 20 can also be formed of ceramic materials such as alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), etc. The insulating circuit board 2 is disposed, for example, at the center of the upper surface of the substrate 12.

[0028] A semiconductor element 3 is disposed on the upper surface of the first metal layer 21 of the insulating circuit board 2. The semiconductor element 3 is formed of, for example, a semiconductor substrate such as silicon (Si) or silicon carbide (SiC). The semiconductor element 3 is, for example, rectangular in a top view (square shape). Three semiconductor elements 3 are disposed substantially at the center on the first metal layer 21. The semiconductor elements 3 are respectively disposed on the first metal layer 21 by means of a bonding material such as solder S. Thereby, the semiconductor elements 3 are electrically connected to the first metal layer 21. In addition, the number and the disposed position of the semiconductor elements 3 are not limited thereto and can be appropriately changed.

[0029] In addition, as the semiconductor element 3, switching elements such as IGBT (Insulated Gate Bipolar Transistor) and power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and diodes such as FWD (FreeWheeling Diode) are used. In addition, as the semiconductor element 3, an RC (Reverse Conducting)-IGBT in which an IGBT and an FWD are integrated, an RB (ReverseBlocking)-IGBT having sufficient withstand voltage against a reverse bias voltage, etc. can also be used.

[0030] The housing 13 is a frame that accommodates the insulating circuit board 2 and the semiconductor element 3. The housing 13 is formed of a synthetic resin molded by injection molding, and surrounds the outer peripheral side of the insulating circuit board 2. The housing 13 and the cover described later are composed of a thermoplastic resin. As such resins, there are PPS resin, PBT resin, PBS resin, PA resin or ABS resin, etc. In addition, fillers, etc. can also be added to these resins as needed. The lower surface of the housing 13 is opposite to the upper surface of the substrate 12, and the housing 13 is bonded to the insulating circuit board 2 using a bonding material (adhesive) not shown in the figure.

[0031] The housing 13 is arranged around the insulating circuit board 2 and the semiconductor element 3, and defines a space filled with a sealing resin 15 described later. The housing 13 is formed into a square ring shape in a plan view corresponding to the outer shape of the substrate 12, and stands upright along the thickness direction (vertical direction) of the insulating circuit board 2. An external terminal 14 is embedded in each side of the predetermined square ring shape of the housing 13. The external terminal 14 is formed into a letter L shape in a cross-sectional view, one end protruding from the inner wall surface of the housing 13, and the other end protruding from the upper surface of the housing 13. The external terminal 14 is integrated with the housing 13 by, for example, insert molding. The details of the housing 13 will be described later.

[0032] The three semiconductor elements 3 are electrically connected by the wiring member W. In addition, a part of the semiconductor elements 3 is electrically connected to one external terminal 14 via the wiring member W. Furthermore, the other external terminal 14 is electrically connected to the first metal layer 21 via the wiring member W.

[0033] In addition, each of the above-mentioned wiring components W uses a conductive wire. The material of the conductive wire can be any one of gold, copper, aluminum, gold alloy, copper alloy, aluminum alloy, or a combination thereof. In addition, components other than conductive wires can also be used as wiring components. For example, a tape or a lead frame can be used as a wiring component.

[0034] The inner space of the housing 13 divided by the housing 13 is sealed by a sealing resin 15. Specifically, the sealing resin 15 seals the insulating circuit board 2, the semiconductor element 3, the wiring member W, and a part of the external terminal 14 on the inner side of the housing 13. The sealing resin 15 can use epoxy resin or silicone. The sealing resin 15 is filled into the housing 13 until the height at which the wiring member W is buried. After the sealing resin 15 is filled, a cover 16 is installed above the sealing resin 15. The cover 16 covers the insulating circuit board 2 and the semiconductor element 3 to protect the inside of the housing 13.

[0035] Figure 2 It is a plan view showing an example of the case 13 of the semiconductor module 1 according to the present embodiment. Figure 3 It is cut along the a-a' line in the thickness direction Figure 2A cross-sectional view of the shown housing as viewed from the arrow direction. Figure 4 Indicates Figure 3 An enlarged view of a cross-sectional view of the shown mounting hole.

[0036] Mounting holes 17a, 17b, 17c, and 17d for mounting a printed circuit board 4 using screws are formed near the outer edge corners of the housing 13. The mounting holes 17a, 17b, 17c, and 17d are respectively formed at positions corresponding to through holes 28 formed in the printed circuit board 4. When it is not necessary to particularly distinguish and describe the mounting holes 17a, 17b, 17c, and 17d, hereinafter, they are referred to as "mounting holes 17". The mounting holes 17 are integrally formed with the housing 13.

[0037] The mounting holes 17 are formed as screw holes for self-tapping screws 18. The self-tapping screws 18 are tightened in the mounting holes 17 through the through holes 28 of the printed circuit board 4, thereby fixing the printed circuit board 4 on the housing 13. The overall shape of the mounting holes 17 is formed in a cylindrical shape and is circular when viewed from above. The cylinder includes not only a shape with a circular bottom surface but also a frustum of a cone with a slightly inclined shape. Before mounting the printed circuit board 4 using the self-tapping screws 18, the inside of the mounting holes 17 is not thread-cut and no thread teeth are formed. When mounting the printed circuit board 4 using the self-tapping screws 18, the inside of the mounting holes 17 is thread-cut by the self-tapping screws 18 to form thread teeth. In addition, the diameter d1 of the mounting holes 17 is formed to be 1.0 mm or more and 5.0 mm or less. Preferably, it is formed to be 2.0 mm or more and 3.0 mm or less.

[0038] The end portions 19 of the mounting holes 17 are formed in a hemispherical shape. Preferably, the end portions 19 are formed in a rounded corner shape (Japanese: R shape) corresponding to the radius of the hole diameter. The hemispherical shape includes not only the shape cut by a plane passing through the center of the sphere but also the shape cut by a plane not passing through the center of the sphere. In addition, the sphere includes not only the shape of a regular sphere but also the shape of an ellipsoid. In addition, the rounded corner shape corresponding to the radius of the hole diameter means the spatial shape formed by the dimension of the radius r of the mounting hole 17 at the end portion 19 of the mounting hole 17. The dimension of the radius r of the mounting hole 17 is calculated based on the diameter d1 of the mounting hole 17. Thus, even when the mounting holes 17 are integrally formed with the housing 13, during resin molding, the resin material flows smoothly along the rounded corners of the end portions 19, and therefore, it is possible to suppress the generation of cracks 81 (refer to Figure 5 ) and voids (pores) 82 (refer to Figure 5 ) inside the housing 13. Moreover, by means of the rounded corners of the end portions 19, it is possible to prevent stress concentration at the end portions 19 and suppress the generation of cracks 81 and voids 82 inside the housing 13.

[0039] In addition, it is possible to suppress the generation of cracks 81 and voids 82 inside the housing 13, particularly near the mounting holes 17. As a result, even when tapping the mounting holes 17 with self-tapping screws 18, it is possible to prevent the thread teeth formed by thread cutting during tapping from chipping due to insufficient strength caused by the cracks 81 and voids 82. Therefore, it is possible to suppress the generation of torque loss and prevent the self-tapping screws 18 from idling. As a result, it is possible to suppress breakage of the housing 13 when tightening the self-tapping screws 18.

[0040] Each of the mounting holes 17a, 17b, 17c, and 17d is disposed in the mounting hole seats 23a, 23b, 23c, and 23d. When it is not necessary to particularly distinguish and describe the mounting hole seats 23a, 23b, 23c, and 23d, they are hereinafter referred to as "mounting hole seats 23".

[0041] The mounting hole seat 23 is formed with a protruding portion 30 that protrudes upward from the upper surface 29 of the housing around the mounting hole seat 23. The dimension d2 around the protruding portion 30 is formed to be 0.5 mm or more and 4.0 mm or less around the mounting hole 17. Preferably, it is formed to be 1.0 mm or more and 2.0 mm or less. In addition, the height dimension d3 from the upper surface 29 of the housing to the upper end of the protruding portion 30 is formed to be 1.0 mm or more and 4.0 mm or less. Preferably, it is formed to be 1.5 mm or more and 2.0 mm or less. The upper surface of the protruding portion 30 formed in the mounting hole seat 23 contacts the lower surface of the printed circuit board 4 to fix the printed circuit board 4 to the housing 13.

[0042] In addition, as Figure 4 shown, the length dimension d4 of the mounting hole 17 from the upper end of the protruding portion 30 of the mounting hole seat 23 to the end portion 19 is formed to be longer than the length dimension d5 of the self-tapping screw 18. The thickness dimension d6 of the housing 13 from the end portion 19 of the mounting hole 17 to the lower end 13a of the housing 13 is formed to be a specified first dimension or more. For example, the thickness dimension d6 is formed to be 1.0 mm or more and 6.00 mm or less. Preferably, the thickness dimension d6 is formed to be 1.5 mm or more and 4.0 mm or less. More preferably, the thickness dimension d6 is formed to be 2.0 mm or more and 3.0 mm or less.

[0043] Similarly, as Figure 2As shown, the thickness dimension d7 from the self - mounting hole 17 of the housing 13 to the side end 13b of the housing 13 is formed to be equal to or greater than a specified second dimension. For example, the thickness dimension d7 is formed to be 0.5 mm or more and 4.0 mm or less. Preferably, the thickness dimension d7 is formed to be 0.5 mm or more and 2.0 mm or less. More preferably, the thickness dimension d7 is formed to be 0.5 mm or more and 1.5 mm or less. Thus, when resin - molding the housing 50, it is possible to prevent the resin from staying near the end 19 of the mounting hole 17, and suppress the occurrence of cracks 81 or voids 82 in the details within the housing 50. Moreover, the strength of the housing 13 itself can be improved, and it is possible to prevent the thread teeth formed by tapping from chipping. Therefore, it is possible to suppress the generation of torque loss and prevent the self - tapping screw 18 from idling. Thus, it is possible to suppress the breakage of the housing 13 when tightening the self - tapping screw 18.

[0044] Device holes 24a, 24b, 24c, 24d for mounting an external device 11 are formed at the outer peripheral corner portions of the housing 13. Hereinafter, when it is not necessary to particularly distinguish and describe the device holes 24a, 24b, 24c, 24d, they are referred to as "device holes 24". A connecting member such as a bolt is thread - fastened to the external device 11 through the device holes 24a, 24b, 24c, 24d, so that the external device 11 is mounted on the lower surface of the semiconductor module 1.

[0045] As Figure 2 As shown, a gate G is provided at one end 27a of the housing 13. Preferably, the gates G are respectively provided at positions on both sides of one end 27a of the housing 13, that is, positions corresponding to the device hole seats 25c, 25d. The housing 13 is resin - molded from a resin material injected through the gate G at one end 27a of the housing 13. In this case, mounting holes 17a, 17b are formed at the other end 27b of the housing 13. In addition, mounting holes 17c, 17d are formed at one end 27a of the housing 13. When the resin material flows during resin molding, near the mounting holes 17c, 17d formed near the gate G, there is a tendency for the resin to flow completely uniformly. In contrast, near the mounting holes 17a, 17b formed far from the gate G, there is a tendency for air to be involved in the flow and for voids and air holes to be easily generated. Even when the mounting holes 17a, 17b are formed far from the gate G, during resin molding, the resin material flows smoothly along the rounded corners of the end 19, so that it is also possible to suppress the generation of voids and air holes within the housing 13. Moreover, the gates G are provided at positions on both sides of one end 27a of the housing 13. Therefore, during resin molding, it is possible to make the resin material flow smoothly along the frame of the housing 13 straight toward the other end 27b, and suppress the generation of voids and air holes within the housing 13.

[0046] The device holes 24a, 24b, 24c, 24d are arranged in the device hole seats 25a, 25b, 25c, 25d. When there is no need to particularly distinguish and describe the device hole seats 25a, 25b, 25c, 25d, they are hereinafter referred to as "device hole seat 25". As Figure 2 shown, the thickness dimension d8 of the housing 13 from the device hole seat 25 to the side end 13b of the housing 13 is formed to be the same as the thickness dimension d7 of the housing 13 from the mounting hole 17 to the side end 13b. In addition, as Figure 4 shown, the lower end (end portion) 19 of the mounting hole 17 is formed at a position deeper than the upper surface of the device hole seat 25. As Figure 2 shown, the mounting hole 17 is arranged at a position closer to the inside than the device hole seat 25 in the longitudinal direction of the housing 13 in a plan view. That is, the device hole seat 25 is arranged at a position closer to the end portions (one end 27a, the other end 27b) than the mounting hole 17 in the longitudinal direction of the housing 13 in a plan view.

[0047] The thickness dimension d9 of the device hole seat 25 is formed to be larger than the thickness dimension d6 of the housing 13 from the end portion 19 of the mounting hole 17 to the lower end 13a of the housing 13. The thickness dimension d9 of the device hole seat 25 is formed to be 2.0 mm or more and 8.0 mm or less. Preferably, it is formed to be 3.0 mm or more and 6.0 mm or less.

[0048] Here, the case of the device hole seat 25 where the gate G is provided at one end 27a of the housing 13 will be described. First, the case where the gate G is provided at Figure 4 the right side R of the housing 13 and the resin material flows from the gate G provided at the right side R, that is, the case where the mounting hole 17 is close to the gate G will be described. The resin material flowing from the gate G provided at the right side R passes through the device hole seat 25 with a narrow flow path for the resin material to flow, and collides with the end portion 19 of the mounting hole 17 at a relatively high speed. In this case, if there is no fillet at the end portion 19 of the mounting hole 17, the resin material collides with the end portion 19 at a relatively high speed, so that the resin material becomes turbulent and voids are likely to be generated. On the other hand, in the present embodiment, the resin material flowing from the gate G flows smoothly along the fillet of the end portion 19, so that the generation of voids and air holes can be suppressed.

[0049] In addition, for the case where the gate G is provided at Figure 4The case where the resin material flows from the gate G provided on the left side L of the housing 13 of the semiconductor module 1 and the mounting hole 17 is away from the gate G will be described. The resin material flowing from the gate G provided on the left side L moves away from the gate G near the mounting hole 17. Therefore, the resin viscosity increases during the period when the resin material flows from the gate G to the mounting hole 17. In this case, if the end 19 of the mounting hole 17 has no rounded corner, the flow rate of the resin material further decreases near the end 19, and voids and air holes are likely to be generated in the device hole seat 25 in front of it. On the other hand, in the present embodiment, the resin material flows smoothly along the rounded corner of the end 19. Therefore, it is possible to suppress the decrease in the resin velocity and the generation of voids and air holes.

[0050] As Figure 4 shown, the inner diameter d1 on the end 19 side of the mounting hole 17 is formed to be slightly smaller than the diameter d10 of the self-tapping screw 18. In addition, the inner diameter d11 of the inlet 26 of the mounting hole 17 is formed to be larger than the inner diameter d1 on the end 19 side of the mounting hole 17. Thus, when the self-tapping screw 18 is screwed into the mounting hole 17, it is easy for the operator to screw the self-tapping screw 18 into the mounting hole 17. Therefore, it is possible to improve the working efficiency in manufacturing the semiconductor module 1.

[0051] In addition, as Figure 2 shown, the external terminal 14 includes at least an input terminal 14a for P(+), an input terminal 14b for N(−), an output terminal 14c for UVW, a control terminal 14d of the semiconductor module 1, and an emission terminal 14e for a temperature sensor in the housing 13. As Figure 2 shown, the input terminal 14a for P(+) is arranged at one end 27a of the housing 13, the input terminal 14b for N(−) is arranged at the other end 27b of the housing 13, the output terminal 14c for UVW is arranged on the upper side of the housing 13 in a top view, the control terminal 14d is arranged on the lower side of the housing 13 in a top view, and the emission terminal 14e is arranged at the upper right of the housing 13 in a top view. One end of each of the input terminal 14a, the input terminal 14b, the output terminal 14c, the control terminal 14d, and the emission terminal 14e constituting the external terminal 14 protrudes from the inner wall surface of the housing 13, and on the other hand, the other end of each protrudes from the upper surface of the housing 13.

[0052] In addition, the present invention is not limited to the above-described embodiments and can be implemented with various modifications. In the above-described embodiments, the sizes, shapes, functions, etc. of the structural elements illustrated in the attached drawings are not limited thereto, and can be appropriately changed within the range of achieving the effects of the present invention. In addition, as long as it does not deviate from the scope of the purpose of the present invention, it can be appropriately changed and implemented.

[0053] In the semiconductor module 1 of the above-described embodiment, four mounting holes 17 are formed, but it is not limited thereto, and at least one or more may be formed. Further, in the semiconductor module 1 of the above-described embodiment, the device hole 24 is integrally resin-molded with the housing 13, but it is not limited thereto, and it may be formed separately from the housing 13.

[0054] Industrial applicability

[0055] As described above, the present invention has an effect of being able to suppress the generation of cracks and voids when resin-molding the housing of a semiconductor module, and is particularly useful for a method of manufacturing a semiconductor module.

[0056] This application is based on Japanese Patent Application No. 2019-144576 filed on August 6, 2019. The entire content thereof is incorporated herein.

Claims

1. A semiconductor module, comprising a semiconductor element, characterized in that: The semiconductor module includes a housing for accommodating the semiconductor element, An installation hole is integrally formed with the housing by resin molding, and the installation hole is used to mount a printed circuit board on the upper surface of the housing using screws, The semiconductor module is formed with a device hole seat for the device hole for mounting an external device, The installation hole is arranged at a position closer to the inside than the device hole seat in the length direction of the housing when viewed from above, A gate is provided at a position corresponding to the device hole seat, The whole of the installation hole is formed in a cylindrical shape, and the top end of the installation hole is formed in a hemispherical shape, The housing is resin molded using a resin material injected from the gate.

2. The semiconductor module according to claim 1, characterized in that: The installation hole is a screw hole for a self-tapping screw.

3. The semiconductor module according to claim 2, characterized in that: The length dimension of the installation hole is longer than the length dimension of the self-tapping screw.

4. The semiconductor module according to any one of claims 1 to 3, characterized in that: The installation hole is arranged at the other end of the housing.

5. The semiconductor module according to any one of claims 1 to 3, characterized in that: The lower end of the installation hole is formed at a position deeper than the upper surface of the device hole seat.

6. The semiconductor module according to claim 4, characterized in that: The lower end of the installation hole is formed at a position deeper than the upper surface of the device hole seat.

7. The semiconductor module according to any one of claims 1 to 3, characterized in that: The printed circuit board is mounted on the housing using a self-tapping screw through the installation hole.

8. The semiconductor module according to claim 4, characterized in that: The printed circuit board is mounted on the housing using a self-tapping screw through the installation hole.

9. The semiconductor module according to claim 5, characterized in that: The printed circuit board is mounted on the housing using a self-tapping screw through the installation hole.

10. The semiconductor module according to claim 1, characterized in that: The gate is provided at the device hole seat at one end of the housing, The lower end of the installation hole is formed at a position deeper than the upper surface of the device hole seat, The thickness of the device hole seat is larger than the thickness of the housing from the end of the installation hole to the lower end of the housing, The thickness of the device hole seat is 2.0 mm or more and 8.0 mm or less, The thickness of the housing from the end of the installation hole to the lower end of the housing is 1.0 mm or more and 6.00 mm or less.

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