Positioning method and positioning device

Abstract

A positioning method and a positioning device are provided. In this positioning method, a sheet-like body (CP) is positioned at a specified position by utilizing the surface tension of a liquid. In this positioning method, the following processes are implemented: a supporting process, in which the sheet-like body (CP) is supported by a hydrophilic portion (12F) of a supporting surface (12A), where the supporting surface (12A) is provided with the hydrophilic portion (12F) having hydrophilicity; a liquid supply process, in which a liquid is supplied to the hydrophilic portion (12F); and a liquid recovery process, in which the liquid is recovered from the hydrophilic portion (12F).

Description

Technical Field

[0001] The present invention relates to a positioning method and a positioning device. Background Art

[0002] There is known a positioning method for positioning a plurality of sheet-like bodies at a prescribed position by utilizing the surface tension of a liquid (for example, refer to Patent Document 1: Japanese Patent Laid-Open No. 2010-245452).

[0003] In the positioning method described in Patent Document 1, water (liquid) is applied onto a hydrophilic film 31a (hydrophilic portion) formed on the upper surface (support surface) of a support substrate 31 (support member), and a chip 20 (sheet-like body) is disposed on the hydrophilic portion. After positioning the sheet-like body at a prescribed position by the surface tension of the liquid in the hydrophilic portion, since it is necessary to wait until the liquid in the hydrophilic portion evaporates and the sheet-like body is supported on the support surface, there is a disadvantage in that the processing ability per unit time is low. Summary of the Invention

[0004] An object of the present invention is to provide a positioning method and a positioning device capable of preventing a decrease in processing ability per unit time.

[0005] The present invention employs the following technical solutions.

[0006] 1. A positioning method for positioning a sheet-like body at a prescribed position by utilizing the surface tension of a liquid, characterized by performing the following steps:

[0007] A support step of supporting the sheet-like body by a hydrophilic portion of a support surface, wherein the support surface is provided with the hydrophilic portion having hydrophilicity;

[0008] A liquid supply step of supplying a liquid to the hydrophilic portion;

[0009] A liquid recovery step of recovering the liquid from the hydrophilic portion.

[0010] 2. The positioning method according to 1, wherein

[0011] in the liquid supply step, the liquid is supplied to the hydrophilic portion through a flow path provided inside a support member having the support surface.

[0012] 3. The positioning method according to 1 or 2, wherein

[0013] in the liquid supply step, the liquid recovered from the hydrophilic portion in the liquid recovery step is supplied to the hydrophilic portion again.

[0014] 4. A positioning device for positioning a sheet-like body at a prescribed position by utilizing the surface tension of a liquid, characterized by comprising:

[0015] A support member having a hydrophilic portion with hydrophilicity on a support surface, and supporting the sheet-like body through the hydrophilic portion of the support surface;

[0016] A liquid supply member that supplies liquid to the hydrophilic portion;

[0017] A liquid recovery member that recovers the liquid from the hydrophilic portion.

[0018] According to the present invention, since the liquid is recovered from the hydrophilic portion in the support surface, it is not necessary to wait for the liquid on the hydrophilic portion to evaporate until the sheet-like body is supported on the support surface, and thus it is possible to prevent the processing capacity per unit time from decreasing.

[0019] Moreover, if the liquid is supplied to the hydrophilic portion through a flow path provided inside the support member having the support surface, the liquid can be reliably supplied to the hydrophilic portion.

[0020] Furthermore, if the liquid recovered from the hydrophilic portion is supplied to the hydrophilic portion again, the consumption of the liquid can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A It is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.

[0022] Figure 1B It is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.

[0023] Figure 1C It is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.

[0024] Figure 1D It is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.

[0025] Figure 1E It is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, Figures 1A to 1E an embodiment of the present invention will be described.

[0027] It should be noted that the X-axis, Y-axis, and Z-axis in the present embodiment are in an orthogonal relationship, the X-axis and Y-axis are axes in a specified plane, and the Z-axis is an axis orthogonal to the specified plane. In addition, in the present embodiment, when the direction is represented based on the case seen from the front direction parallel to the Y-axis, "up" is the arrow direction of the Z-axis and "down" is the opposite direction, "left" is the arrow direction of the X-axis and "right" is the opposite direction, and "front" is parallel to the Y-axis Figures 1A to 1E ... Figures 1A to 1EThe "front" is in the forward direction and the "rear" is the opposite direction.

[0028] The positioning device EA of the present invention is a device that positions a semiconductor chip (hereinafter simply referred to as "chip") CP in the form of a sheet at a specified position by using the surface tension of a liquid LQ such as water or an ethanol solution. It includes: a support member 10 having a hydrophilic portion 12F with hydrophilicity on a support surface 12A, and supporting the chip CP through the hydrophilic portion 12F of the support surface 12A; a liquid supply member 20 that supplies the liquid LQ to the hydrophilic portion 12F; a liquid recovery member 30 that recovers the liquid LQ from the hydrophilic portion 12F; and is arranged near a separation member 40 that applies tension to an adhesive sheet AS to which a plurality of chips CP are attached to expand the mutual interval of these chips CP and a peeling member 50 that peels the adhesive sheet AS from the chip CP.

[0029] The support member 10 includes a direct-acting motor 11 as a driving device and a stage 12 as a support member. The stage 12 is supported on an output shaft 11A of the direct-acting motor 11 and has a support surface 12A that can be adsorbed and held by a decompression member 23 such as a decompression pump or a vacuum generator. In the case of the present embodiment, the decompression member 23 has a structure shared by the support member 10 and the liquid recovery member 30.

[0030] The stage 12 includes a recess 12B provided on the upper surface, a flow path 12C provided inside the stage 12 and communicating with the recess 12B, and a porous member 12D such as a porous resin disposed in the recess 12B and having its upper surface as the support surface 12A.

[0031] On the support surface 12A, as Figure 1A shown in the figure marked AA, a hydrophobic portion 12E having hydrophobicity is formed in a lattice pattern, and the hydrophilic portion 12F is divided by the hydrophobic portion 12E.

[0032] In the present embodiment, the hydrophobic portion 12E is a structure in which a waterproof material 12G such as an adhesive or a resin is coated on the inner surface of a groove formed in a lattice pattern on the support surface 12A. Through a rough surface forming member such as rough surface machining or spraying machining, the hydrophilic portion 12F has a structure in which a rough surface treatment for forming a non-smooth rough surface is performed.

[0033] The liquid supply member 20 includes a box body 21 for storing the liquid LQ, a pressurizing member 22 such as a pressure pump or a turbine, a pressure reducing member 23, a switching valve 24 for switching the communication state between the pressurizing member 22 and the pressure reducing member 23 and the box body 21, and a switching valve 25 that is connected to the flow path 12C via the pipe 25A and switches the communication position between the flow path 12C and the box body 21 between the upper part and the bottom part of the box body 21. It is structured to supply the liquid LQ to the hydrophilic part 12F through the flow path 12C provided inside the stage 12 having the support surface 12A. It should be noted that the box body 21 is communicated with the switching valve 25 via the pressurizing side pipe 21A and the pressure reducing side pipe 21B.

[0034] The liquid recovery member 30 has the same structure as the liquid supply member 20 and is structured to recover the liquid LQ from the hydrophilic part 12F through the flow path 12C provided inside the stage 12 having the support surface 12A.

[0035] The separation member 40 includes a plurality of direct-acting motors 41 as driving devices and a holding mechanism, that is, a chuck cylinder 42 as a driving device. The chuck cylinder 42 is supported on the output shaft 41A of each direct-acting motor 41 and has a pair of holding claws 42A.

[0036] The peeling member 50 includes a linear motor 51 as a driving device and a holding mechanism, that is, a chuck cylinder 52 as a driving device. The chuck cylinder 52 is supported on the slider 51A of the linear motor 51 and has a pair of holding claws 52A.

[0037] The operation of the above positioning device EA will be described. It should be noted that the following processes implemented by the positioning device EA are implemented in the manufacturing method of a semiconductor device having the chip CP.

[0038] First, with respect to the positioning device EA in which each component is arranged at the initial position shown in Figure 1A , a user (hereinafter simply referred to as "user") of the positioning device EA, a handling member (not shown) such as an articulated robot or a belt conveyor transports a plurality of chips CP attached to the adhesive sheet AS to a specified position above the stage 12. The separation member 40 drives the direct-acting motor 41 and the chuck cylinder 42, and as shown by the double-dot chain line in Figure 1A , holds the adhesive sheet AS by a pair of holding claws 42A. Next, the separation member 40 drives the direct-acting motor 41, and as shown in Figure 1B , applies tension to the adhesive sheet AS to increase the mutual interval between the plurality of chips CP (separation process). At this time, the mutual intervals of the respective chips CP are increased in such a manner that they are respectively opposed to the hydrophilic parts 12F of the support surface 12A.

[0039] After that, the support member 10 drives the direct-acting motor 11, as shown in Figure 1BAs shown, after raising the stage 12 to bring the support surface 12A into contact with the chip CP, the pressure reducing member 23 is driven to start the adsorption holding (supporting process) of the chip CP on the support surface 12A. Next, the separating member 40 drives the chuck cylinder 42 to release the holding of the adhesive sheet AS on the holding claws 42A, and then the supporting member 10 drives the direct-acting motor 11 to lower the stage until the adhesive sheet AS reaches a specified height position to the left of the chuck cylinder 52.

[0040] Then, the peeling member 50 drives the linear motor 51 and the chuck cylinder 52 to grip the right end portion of the adhesive sheet AS by a pair of holding claws 52A. Next, the supporting member 10 drives the direct-acting motor 11 to lower the stage 12 to its initial position, and the peeling member 50 drives the linear motor 51. As Figure 1C shown, the chuck cylinder 52 is moved to the left to peel the adhesive sheet AS from the chip CP (peeling process).

[0041] If the adhesive sheet AS is peeled from all the chips CP, after the peeling member 50 stops driving the linear motor 51, it drives the chuck cylinder 52 to release the holding of the adhesive sheet AS on the holding claws 52A, and makes it fall into a recovery member (not shown) such as a recovery box or a recovery bag located below the peeled adhesive sheet AS. After that, the supporting member 10 stops driving the pressure reducing member 23 to release the adsorption holding of the chip CP on the support surface 12A, and the liquid supply member 20 drives the switching valves 24 and 25. As Figure 1D shown, after connecting the recess 12B and the pressurizing member 22 via the pressurizing side pipe 21A, the pressurizing member 22 is driven to increase the pressure inside the box 21. Thus, the liquid LQ is supplied to the hydrophilic portion 12F of the support surface 12A through the pressurizing side pipe 21A, the switching valve 25, the pipe 25A, the flow path 12C, and the porous member 12D (liquid supply process). After the liquid LQ is supplied to the hydrophilic portion 12F, the liquid LQ rises in the hydrophilic portion 12F. As Figure 1D shown, the chip CP is lifted up. If the chip CP is lifted up by the liquid LQ, the chip CP is positioned at a specified position by the surface tension of the liquid LQ as shown by the double-dot dash line in Figure 1D .

[0042] Next, the liquid supply member 20 stops driving the pressurizing member 22, and the liquid recovery member 30 drives the switching valves 24 and 25. As Figure 1EAs shown, after the concave portion 12B is communicated with the pressure reducing member 23 via the pressure reducing side pipe 21B, the pressure reducing member 23 is driven to reduce the pressure inside the box body 21. Thereby, the liquid LQ on the hydrophilic portion 12F of the support surface 12A is recovered into the box body 21 through the porous member 12D, the flow path 12C, the pipe 25A, the switching valve 25, and the pressure reducing side pipe 21B (liquid recovery process). After the liquid LQ on the hydrophilic portion 12F is recovered, the chip CP abuts against the support surface 12A, and the adsorption and holding of the chip CP on the support surface 12A starts. At this time, each chip CP is positioned at a specified position and at a specified angle, and is supported on the support surface 12A in a state of being positioned at the specified position. It should be noted that the liquid LQ recovered from the hydrophilic portion 12F in the liquid recovery process is supplied to the hydrophilic portion 12F again in the next liquid supply process.

[0043] Next, the support member 10 stops driving the pressure reducing member 23. After releasing the adsorption and holding of the chip CP on the support surface 12A, a transfer member (not shown) transfers the chip CP from the support surface 12A and stacks it on a lead frame, a substrate, or the like (stacking process). Next, after all the chips CP are transferred from the support surface 12A, each member drives its respective driving device to return each component to its initial position, and then the above-described same process is repeated.

[0044] According to the above embodiment, since the liquid LQ is recovered from the hydrophilic portion 12F in the support surface 12A, it is not necessary to wait for the liquid LQ on the hydrophilic portion 12F to evaporate until the chip CP is supported on the support surface 12A, and thus it is possible to prevent the processing capacity per unit time from decreasing.

[0045] As described above, the optimal structures, methods, etc. for implementing the present invention have been disclosed above, but the present invention is not limited thereto. That is, the present invention mainly particularly illustrates and describes specific embodiments, but those skilled in the art can implement various deformations in the shape, material, quantity, and other detailed structures of the above-described embodiments without departing from the scope of the technical idea and purpose of the present invention. In addition, the descriptions that limit the above-described shape, material, etc. are exemplary descriptions for facilitating the understanding of the present invention, and are not intended to limit the content of the present invention. Therefore, the descriptions of the names of some or all of the components that exceed these limitations of the shape, material, etc. are included in the present invention.

[0046] For example, the support member 10 can adsorb and hold the chip CP on the support surface 12A through a pressure reducing member independent of the liquid recovery member 30, or can adsorb and hold the chip CP without passing through the support surface 12A after the liquid recovery process.

[0047] The hydrophobic part 12E can be formed by attaching a hydrophobic sheet, film, tape, etc. to the support surface 12A, or by performing a surface treatment or coating that exhibits a hydrophobic effect on the support surface 12A.

[0048] The hydrophilic part 12F can be formed by attaching a hydrophilic sheet, film, tape, etc. to the support surface 12A, or by performing a surface treatment or coating that exhibits a hydrophilic effect on the support surface 12A.

[0049] The liquid supply member 20 can supply the liquid LQ from the outside of the stage 12 to the support surface 12A through a nozzle, a hose, etc., and it is also possible not to supply the liquid LQ recovered from the hydrophilic part 12F again to the hydrophilic part 12F in the liquid recovery process.

[0050] The liquid recovery member 30 can be separately provided from the liquid supply member 20. In this case, it can share the flow path 12C of the stage 12 with the liquid supply member 20 and recover the liquid LQ from the flow path 12C, or a flow path for recovery different from the flow path 12C can be provided on the stage 12, and the liquid LQ can be recovered from the flow path for recovery.

[0051] The separation member 40 can apply tension to the adhesive sheet AS, for example, in the vertical direction, or in four directions of right, left, front, and rear, two directions of right and left, three directions of left front, left rear, and right, or in five or more directions including components in the front, rear, left, and right directions to expand the mutual interval of the chips CP. Also, in the case of using a frame member such as an annular frame integrated with the chips CP via the adhesive sheet AS, by supporting the frame member, tension can be applied to the adhesive sheet AS to expand the mutual interval of the chips CP. Or, tension can be applied to the adhesive sheet AS attached to a semiconductor wafer (hereinafter simply referred to as "wafer") that can be singulated into multiple chips CP by a fragile layer physically or chemically formed by a laser irradiation device or a chemical solution application device, etc., or a groove or notch formed by a cutting tool, etc., so as to divide the wafer into multiple chips CP and expand the mutual interval of the chips CP.

[0052] The positioning device EA of the present invention may or may not be provided with the separation member 40. In the case where the separation member 40 is not provided, the mutual interval of the chips CP can be expanded by other devices.

[0053] The positioning device EA of the present invention may or may not be provided with a peeling member 50. In the case where the peeling member 50 is not provided, the adhesive sheet AS can be peeled by other devices, or the adhesive sheet AS can be cut along the gaps between the multiple chips CP by a cutting tool or the like or by blowing gas through a gas blowing member such as a nozzle, so that the cut adhesive sheet AS remains attached to the chips CP.

[0054] The positioning device EA may include a pasting member that attaches the adhesive sheet AS to the chip CP or the wafer by a pressing member such as a pressing roller, may also include a laser irradiation device or a cutting member such as a cutter that cuts the wafer into individual chips CP, may further include an integrating member that integrates the chip CP or the wafer with the frame member via the adhesive sheet AS, and may also transport a plurality of chips CP not attached to the adhesive sheet AS by a transport member (not shown) and place them on the hydrophilic portion 12F of the support surface 12A.

[0055] The liquid LQ used in the positioning device EA is not particularly limited as long as it has a certain surface tension. For example, it may be an alcohol solution containing ethanol, propanol, glycerol, etc.

[0056] In the foregoing embodiment, multiple chips CP are exemplified for positioning as a sheet-like body, but a single chip CP may also be used as the sheet-like body.

[0057] Either the support process or the liquid supply process may be implemented first. The liquid supply process may be implemented after the support process, or the support process may be implemented after the liquid supply process. When the support process is implemented after the liquid supply process, the chip CP can be peeled off from the adhesive sheet AS while maintaining the mutual interval of the chip CP by another device, and the peeled chip CP can be transferred to the support surface 12A after the implementation of the liquid supply process and be supported.

[0058] The lamination process or the recovery process may or may not be implemented.

[0059] In addition to the annular frame, the frame member may be non-annular (with unconnected outer peripheries) or circular, elliptical, polygonal, or other shapes.

[0060] The components and processes in the present invention are not limited as long as they can achieve the actions, functions, or processes described for these components and processes, and are not at all limited to the configurations or processes of a single embodiment shown in the foregoing embodiment. For example, as long as the support process is a process of supporting a sheet-like body by the hydrophilic portion of a support surface provided with a plurality of hydrophilic portions having hydrophilicity, any process is acceptable. Referring to the common general knowledge in the art at the time of application, as long as it is within the technical scope, it is not limited by anything (the same applies to other components and processes).

[0061] The material, type, shape, etc. of the adhesive sheet AS or the sheet-like body are not particularly limited. For example, the adhesive sheet AS or the sheet-like body may be circular, elliptical, polygonal, or other shapes, and the adhesive sheet AS may be a pressure-sensitive adhesive type, a heat-sensitive adhesive type, or other adhesive forms. Also, such an adhesive sheet AS may, for example, have a single-layer structure with only an adhesive layer, a structure with an intermediate layer between the base material and the adhesive layer, a three-layer or more structure such as a covering layer on the upper surface of the base material, etc. Additionally, it may be a structure such as a so-called double-sided adhesive sheet where the base material can be peeled off from the adhesive layer, and the double-sided adhesive sheet may have a structure with a single layer or multiple layers of intermediate layers or a single-layer or multi-layer structure without an intermediate layer. And, as the sheet-like body, for example, it may be a semiconductor chip such as a food, a resin container, a silicon semiconductor chip, or a semiconductor compound chip, an information recording substrate such as a circuit board, an optical disc, etc., a single body such as a glass plate, a steel plate, pottery, a wooden board, or resin, or a composite formed by two or more of them, and can target any form of components or articles, etc. It should be noted that the adhesive sheet AS can be replaced with a functional or purpose-based name, for example, any sheet, film, tape, etc. such as an information recording label, a decorative label, a protective sheet, a cutting tape, a chip bonding film, a bonding tape, a resin sheet for forming a recording layer.

[0062] Based on the driving devices in the foregoing embodiments being able to adopt electric devices such as rotary motors, linear motors, linear motors, single-axis robots, multi-joint robots with two or more joints, etc., and transmission devices such as cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc., driving devices that directly or indirectly combine them can be adopted.

[0063] In the said embodiment, when pressing a pressing member such as a pressing roller or a pressing head or an object to be pressed called a pressing part, a structure that can replace or be used together with the above example structure can be adopted, such as components like rollers, round bars, scrapers, rubber, resin, sponge, etc. or a structure that presses by blowing gaseous substances such as air or gas. The pressing member can also be composed of deformable components such as rubber or resin, or can also be composed of non-deformable components; when supporting (holding) a supported part (held part) such as a supporting (holding) member or a supporting (holding) part, gripping members such as jaws and chuck cylinders, Coulomb force, adhesives (adhesive sheets, adhesive tapes), adhesives (adhesive sheets, adhesive tapes), magnetic force, Bernoulli adsorption, suction adsorption, driving devices, etc. can be used to support (hold) the supported part; when cutting a cut part such as a cutting member or a cutting part or forming a cut groove or a cutting line on the cut part, a structure that can replace or be used together with the above example structure can be adopted, such as a cutting tool, a laser cutting machine, an ion beam, fire, heat, water pressure, a heating wire, blowing through gas or liquid, etc. to perform cutting or a suitable driving device can be combined to move the cutting part to perform cutting.

Claims

1. A positioning method that positions a sheet-like body at a specified position by utilizing the surface tension of a liquid. Characterized in that: The following steps are implemented: A supporting step of adsorbing and supporting the sheet-like body attached to the adhesive sheet through the hydrophilic part of the supporting surface, wherein the hydrophilic part with hydrophilicity is provided on the supporting surface; A peeling step of peeling the adhesive sheet from the sheet-like body adsorbed and supported by the supporting surface; A liquid supply step of releasing the adsorption and support of the sheet-like body from which the adhesive sheet has been peeled and supplying liquid to the hydrophilic part; A liquid recovery step of recovering the liquid from the hydrophilic part.

2. A positioning device that positions a sheet-like body at a specified position by utilizing the surface tension of a liquid. Characterized in that: It comprises: A supporting member that has a hydrophilic part with hydrophilicity on the supporting surface and adsorbs and supports the sheet-like body attached to the adhesive sheet through the hydrophilic part of the supporting surface; A peeling member that peels the adhesive sheet from the sheet-like body adsorbed and supported by the supporting surface; A liquid supply member that releases the adsorption and support of the sheet-like body from which the adhesive sheet has been peeled and supplies liquid to the hydrophilic part; A liquid recovery member that recovers the liquid from the hydrophilic part.

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