Light emitting diode module and system having the same

Abstract

In one embodiment, a light-emitting diode module (1) comprises a carrier (2) and a plurality of light-emitting diodes (3). There are a variety of light-emitting diode types. The light-emitting diodes (3) can be electrically controlled individually or in groups independently of one another. The light-emitting diodes (3) each have a first and a second electrical contact (31, 32). The carrier (2) comprises a plurality of electrically conductive main layers (21 ... 24), between which electrically insulating intermediate layers (25) are respectively present. The contacts (31, 32) of the light-emitting diodes (3) are arranged on one of the first main layers (21) on the carrier top side (20). Starting from the first contact (31), the electrical vias (4) are each connected to the last main layer (24) directly on the carrier bottom side (26). Starting from the second contact (32), the electrical vias (4) each terminate on the second-to-last main layer (23), wherein the second-to-last main layer (23) is located within the carrier (2).

Description

Technical Field

[0001] A light emitting diode module is specified. Furthermore, a system having such a light emitting diode module is specified. Summary of the invention

[0002] The object to be achieved is to specify a light-emitting diode module in which the individually controllable light-emitting diodes can be cooled effectively and electrical contact can be made.

[0003] The object is further achieved by a light-emitting diode module having the features of the invention. Preferred developments are the subject of the following description.

[0004] According to at least one embodiment, the light emitting diode module comprises a carrier. The carrier is, for example, a multilayer circuit board. The carrier has a carrier top side. The carrier top side is opposite to the carrier bottom side.

[0005] According to at least one embodiment, the light emitting diode module comprises a plurality of light emitting diodes. Depending on the application, there are one or preferably two or more different light emitting diode types. The light emitting diode types differ in their spectral emission characteristics.

[0006] The light-emitting diode types differ in different light-emitting diode chips and / or different luminescent materials, by means of which a wavelength conversion of the radiation of the light-emitting diode chip can be carried out within the relevant light-emitting diode. The individual light-emitting diodes of a light-emitting diode type can each contain exactly one or more light-emitting diode chips.

[0007] According to at least one embodiment, the light-emitting diodes can be electrically controlled individually or in groups independently of one another. If the light-emitting diodes are electrically combined into groups, these groups preferably each have only a relatively small number of light-emitting diodes, preferably a maximum of 20 light-emitting diodes or eight light-emitting diodes or four light-emitting diodes or two light-emitting diodes. Preferably, each light-emitting diode can be electrically controlled independently of the other light-emitting diodes. The light-emitting diodes are electrically wired and connected accordingly by means of a carrier.

[0008] According to at least one embodiment, the light-emitting diodes each have a first electrical contact and a second electrical contact. The respective associated light-emitting diodes are electrically contacted and preferably mechanically fixed at the electrical contacts. In particular, the first and second electrical contacts of the relevant light-emitting diodes are the only electrical and optionally mechanical contacts of these light-emitting diodes.

[0009] According to at least one embodiment, the carrier comprises a plurality of electrically conductive main layers. The main layers are formed, for example, by copper layers. Preferably, the main layers are structured such that conductor tracks and / or electrical contact surfaces can be formed within the relevant main layer from an electrically conductive material, in particular from copper. The main layers are preferably each electrically separated from one another in a layer-like manner by electrically insulating intermediate layers. The main layers are numbered starting at the carrier top and in a row toward the carrier bottom.

[0010] According to at least one embodiment, the first and second electrical contacts of the light emitting diode are arranged on the first main layer of the carrier on the upper side of the carrier. For example, the light emitting diode is soldered or conductively glued to the first main layer with the first and second contacts. That is, the first and second electrical contacts of the light emitting diode are preferably located directly on the first main layer, apart from a connecting means such as solder or glue.

[0011] According to at least one embodiment, the first contact of the light-emitting diode is connected to the last main layer by means of an electrical via. The via thus starts from the first main layer and extends to the last main layer. The last main layer is preferably located directly on the carrier bottom side.

[0012] According to at least one embodiment, the via for the first contact starts from the first contact when viewed in a top view. That is, the first contact and the via preferably partially or completely overlap in a top view. Alternatively, this means that the spacing between the first contact and the associated via, when viewed in a top view toward the upper side of the carrier, is at most 10% or 20% or 50% of the average side length of the light-emitting diode associated with the relevant first contact. That is, the via for the first contact is located directly below the first contact or at least close to the first contact when viewed in a top view. Effective heat removal of the light-emitting diode is obtained by means of the via for the first contact.

[0013] According to at least one embodiment, the electrical vias starting from the second contact of the light-emitting diode each terminate on the second-to-last main layer. The second-to-last main layer is located within the carrier. The second-to-last main layer is the main layer closest to the last main layer. In a top view toward the upper side of the carrier, the second contact can partially or completely cover the associated electrical via or have a small spacing with the via. The relevant embodiments for the first contact are correspondingly applicable to the via at the second contact. Since the via at the second contact terminates close to the lower side of the carrier, the heat removal of the light-emitting diode through the carrier is improved.

[0014] In at least one embodiment, the light-emitting diode module comprises a carrier or a plurality of light-emitting diodes. In this case, there are at least two different types of light-emitting diodes. The light-emitting diodes can be electrically controlled independently of each other individually or in groups. The light-emitting diodes each have an electrical first and a second contact. The carrier comprises a plurality of electrically conductive main layers, between which electrically insulating intermediate layers are respectively present. The contacts of the light-emitting diodes are arranged on one of the first main layers on the upper side of the carrier. Starting from the first contact, the electrical vias are each connected to the last main layer directly on the lower side of the carrier. Starting from the second contact, the electrical vias each terminate at the second-to-last main layer, wherein the second-to-last main layer is located within the carrier.

[0015] In the light-emitting diode module described here, preferably the following light-emitting diodes are used, which have a size similar to the associated light-emitting diode chip when viewed in a top view. Such light-emitting diodes are also referred to as CSPs, which represent chip-scale packages (Chip Sized Package). The light-emitting diodes are preferably regularly arranged, in particular in a matrix-like grid consisting of rows and columns. Depending on the application, the light-emitting diodes preferably have one or more common anodes or common cathodes. Row- and / or column-based matrix wiring is also conceivable. The light-emitting diodes should and can be electrically controlled individually, in particular via corresponding driver ICs.

[0016] For example, each light-emitting diode can be individually driven by means of a common or a few common switchable sources, in particular as anodes, and by means of a plurality of individual open collector outputs of a controller IC. As a carrier, a printed circuit board, also referred to as a PCB or printed circuit board, is preferably used. For cost reasons, there are ideally as few conductor track layers, such as copper layers, as possible on the carrier.

[0017] Each light-emitting diode preferably has two electrical contacts, which are designed to be thermally conductive. The first and second contacts are located opposite each other when viewed from the bottom of the associated light-emitting diode. An imaginary logical longitudinal axis of the associated light-emitting diode can extend through the two contacts, even if the width of the light-emitting diode is greater than its length. The light-emitting diodes can be arranged in rows or columns so that all longitudinal axes of the light-emitting diodes of the corresponding rows and columns lie on a common straight line.

[0018] Since the vias are arranged in the carrier directly below the contacts of the light-emitting diode or only slightly offset relative to the contacts, the waste heat of the light-emitting diode can be effectively conducted through the carrier to the last and second to last main layer. As a result, the waste heat can also be conducted via the second contacts to the vicinity of the lowest main layer, so that effective heat dissipation can be achieved via the large heat-conducting surface at the vias.

[0019] The inner main layer of the carrier preferably has a region consisting of anode vias and cathode vias below the region with the light-emitting diodes. All cathode vias or anode vias are preferably connected to conductor tracks, which, when viewed in a top view toward the upper side of the carrier, lead outward from the interior of the region with the light-emitting diodes. Preferably, all anode vias or cathode vias lead downward without conductor tracks and are connected to a large-area common anode contact surface. All electrical contact surfaces are preferably present on the lowermost main layer for electrical contacting and mounting the light-emitting diode module from the outside.

[0020] Preferably, there are exactly one, exactly two or exactly four different types of light-emitting diodes, which emit in different colors or color temperatures. The light-emitting diodes are preferably arranged so that by rotating the module, another color and / or light-emitting diode type is moved to a specific position. That is to say, in the case of two colors, by rotating by 180°, and in the case of four colors, by rotating by 90°, for example, a specific angle of the light-emitting diode module is established for each emission color. In other words, by correspondingly rotating the light-emitting diode module, different configurations with different emission characteristics can be obtained. As a result, in particular a plurality of identical light-emitting diode modules can be present in a common system in a differently arranged manner.

[0021] Preferably, the light-emitting diodes are driven completely rotationally symmetrically via the electrical contact surfaces on the carrier, so that the conductor routing on the mounting platform and the structure of the control unit do not need to be significantly changed when the light-emitting diode module is mounted in a differently rotated manner. The symmetry of the connection surfaces of the light-emitting diode module is preferably geometrically and electrically logically derived.

[0022] At least one common contact for the anode or cathode is present on the underside of the carrier of the light-emitting diode module, preferably in the center of the module below the area with the light-emitting diodes, in order to achieve effective heat dissipation. All light-emitting diodes are preferably cooled similarly and effectively. As a result, the contact process is not unnecessarily complicated and the thermal behavior of the light-emitting diodes during operation is similar.

[0023] When viewed in plan view, the cathode contacts can be arranged outside around the center of the module. In this case, adjacent cathode contacts are associated with light-emitting diodes having different anode contacts. This allows different control units to be used, in particular control units with one current output and with two current outputs.

[0024] Preferably, the positions of the light-emitting diodes on the carrier are selected rotationally symmetrically, while the types of light-emitting diodes are preferably arranged in an anti-rotationally symmetrical manner. That is, light-emitting diodes with different emission characteristics preferably overlap exactly when rotated at a symmetrical angle. For example, the original chessboard pattern is thus rotationally symmetrical, while a chessboard pattern cut in the center and mirror-symmetrical in the lower half about a vertical axis is considered to be anti-rotationally symmetrical by 180°.

[0025] Thus, in the light-emitting diode module described here, a via for each light-emitting diode extends from one of the contacts directly to the last copper layer of the carrier. A second via for a second contact of the light-emitting diode extends to the penultimate copper layer. In the region of the vias belonging to the light-emitting diode contacts, the electrical conductor tracks preferably extend parallel to one another, which refers to logical parallelism and does not necessarily have to be exactly geometrical parallelism.

[0026] The conductor tracks are preferably distributed over an even number of main layers, for example, over two copper layers in the case of 16 light-emitting diodes. The two conductor track main layers are preferably configured mirror-symmetrically and / or rotationally symmetrically relative to each other. In particular, this refers to logical symmetry, not necessarily to exact geometric symmetry. Preferably, there is a rotational symmetry of 180°. The electrical contact surface on the bottom main layer preferably maintains its spatial and logical association with respect to the position of the light-emitting diode contact portion when rotating 180° in the case of two light-emitting diode types or when rotating 90° in the case of four light-emitting diode types.

[0027] The light-emitting diode module is used to effectively utilize the central main layer for the electrical and thermal connection of the light-emitting diodes. As a result, more space can be achieved on the first main layer for possible additional functions. The minimum required number of main layers for the conductor track routing and for the electrical contacting of the light-emitting diodes is achieved, so that a cost-effective carrier can be used. In addition, the maximum possible heat conduction from the first main layer to the last main layer can be achieved in the vertical direction. In addition, the best possible heat dissipation of the second light-emitting diode contact from the first main layer to the second-to-last main layer can be achieved.

[0028] The additional control possibilities and the increased overview during the routing and formation of the conductor tracks result in less effort, so that the probability of errors during the production or formation of the conductor tracks can be reduced. The rotationally symmetrical usability of the light-emitting diode modules makes it possible to effectively superimpose different colors in a system consisting of a plurality of light-emitting diode modules by means of corresponding imaging optics.

[0029] According to at least one embodiment, the carrier comprises between four and eight main layers, limit values ​​included. In particular, there are exactly four or exactly six main layers, particularly preferably there are exactly four main layers.

[0030] According to at least one embodiment, two or more adjacent main layers each have an electrical conductor track. The main layer is preferably an inner main layer. In particular, the vias associated with the second contacts can be electrically controlled independently of one another by means of the conductor tracks.

[0031] According to at least one embodiment, the second main layer and the penultimate main layer, and therefore in particular the third main layer, each have electrical conductor tracks. The second and third main layers are the inner main layers. It is possible that only the second and third main layers contain electrical conductor tracks. That is to say, the main layers on the carrier top side and on the carrier bottom side may not have conductor tracks. Accordingly, all inner main layers may be provided with conductor tracks.

[0032] According to at least one embodiment, the vias associated with the second contacts are electrically controllable independently of one another by means of the conductor tracks of the second and third main layers. That is, the electrical wiring within the carrier is preferably carried out only via the inner main layers, in particular only via the second and third main layers.

[0033] According to at least one embodiment, the conductor tracks of the second main layer and the penultimate main layer are configured point-symmetrically or mirror-symmetrically to one another. This is visible when the corresponding main layers are placed next to one another and viewed in a top view. The mirror-symmetry and point-symmetry can be geometrically maintained or only for the logical electrical structure of the conductor tracks.

[0034] According to at least one embodiment, the light emitting diodes are arranged along one or more rows. The first and second contacts of the light emitting diodes in a particular row are preferably arranged along a straight line. In each row of light emitting diodes there is preferably exactly one row of electrical contacts.

[0035] According to at least one embodiment, the conductor tracks do not intersect at least one row of light-emitting diodes. As a result, the conductor tracks can extend between adjacent rows, but not between or under light-emitting diodes within a particular row. As a result, electrical contacts, light-emitting diodes and associated vias can be placed closely side by side within a row.

[0036] According to at least one embodiment, the carrier comprises two or more electrical contact surfaces on the carrier bottom side and / or on the carrier top side for externally electrically connecting the first contacts of the light-emitting diodes. Alternatively, there is only one electrical contact surface for electrically connecting all first contacts on the carrier bottom side.

[0037] According to at least one embodiment, a plurality of electrical contact surfaces are present on the underside of the carrier. Each of these contact surfaces is designed for a first contact, so that for each contact surface, a plurality of vias starting from the first contact terminate at the respective electrical contact surface. The vias for the first contact can pass completely through the carrier and / or extend without interruption from the first main layer to the last main layer.

[0038] According to at least one embodiment, the carrier has a plurality of electrical contact surfaces on the carrier bottom side and / or on the carrier top side for electrically connecting the second contacts of the light-emitting diodes individually or in groups externally. In particular, there is a one-to-one correspondence between these contact surfaces and the second contacts.

[0039] According to at least one embodiment, the electrical contact areas for the second contacts are located next to the light-emitting diodes in a plan view toward the carrier underside. The contact areas for external electrical contacting of the second contacts are each electrically connected to at least one inner main layer of the carrier by means of at least one electrical via.

[0040] Thus, the current path to the second contact is preferably realized via corresponding vias directly on the second contact, via the inner main layer and via electrical vias on the outer electrical contact surface toward the electrical contact surface. In this case, all vias can extend perpendicularly or approximately perpendicularly to the carrier top and / or carrier bottom.

[0041] According to at least one embodiment, the light-emitting diodes are arranged in an anti-point symmetrical manner when viewed in a plan view toward the upper side of the carrier. Thus, each light-emitting diode of the first light-emitting diode type can be mapped into one of the light-emitting diodes of the second light-emitting diode type by means of point symmetry. For all light-emitting diodes, there is preferably exactly one common symmetry point for the point symmetry. Preferably, there are exactly two different light-emitting diode types.

[0042] According to at least one embodiment, the contact surfaces of the second contacts for the light-emitting diodes are oriented and arranged point-symmetrically with respect to one another, wherein the light-emitting diodes are arranged anti-point-symmetrically with respect to one another. That is, there is a point symmetry between the associated light-emitting diodes and between the contact surfaces for the second contacts associated with the light-emitting diodes. In this embodiment, the two point symmetries have the same, common point of symmetry.

[0043] However, depending on the application, it may also be advantageous if the two symmetry points do not coincide when viewed from above. Thus, the matrix with the LED chips can be arranged at one end of the elongated module and the contact surface can be positioned at the other end. This can be preferred in particular in modules with large LED chip areas in order to be able to place the LED chip areas of a plurality of modules closely side by side. Nevertheless, the above-mentioned advantages resulting from the point symmetry remain unchanged.

[0044] The contact surface and the associated light-emitting diode can be at different distances from the symmetry point and have different rotation angles about the symmetry point with respect to a reference line passing through the symmetry point.

[0045] According to at least one embodiment, the light-emitting diodes are arranged in an anti-mirror symmetrical manner when viewed in a top view toward the upper side of the carrier, so that each light-emitting diode of the first light-emitting diode type can be mapped into one of the light-emitting diodes of the second light-emitting diode type by means of mirror symmetry. This can also apply to the third and fourth light-emitting diode types. In particular, however, there are exactly two light-emitting diode types. It is possible that there is exactly one mirror line. The mirror line is preferably oriented perpendicular to the row along which the light-emitting diodes are arranged.

[0046] According to at least one embodiment, the contact surface, in particular the contact surface for the second contact, and the associated light emitting diode have the same symmetry point when viewed in a plan view toward the carrier top. This applies in particular to point symmetry.

[0047] According to at least one embodiment, the overall system of light-emitting diodes can be divided into four quadrants of equal size when viewed in a plan view toward the carrier top. The quadrants have an equal number of light-emitting diodes.

[0048] According to at least one embodiment, all quadrants of the overall system can be mapped into one another by means of a translation or by means of a combination of translation and rotation. That is, the quadrants can be designed identically in terms of the arrangement of the LEDs and the distribution of the LED types or identically except for the rotation.

[0049] According to at least one embodiment, exactly one of the two light-emitting diode types is formed by a plurality of light-emitting diodes for generating warm white light. The other light-emitting diode type is formed by a plurality of light-emitting diodes for generating cold white light. The two light-emitting diode types preferably have the same number of light-emitting diodes. Warm white in particular refers to a coherent color temperature of 2000K to 5000K of the emitted light, and cold white light in particular refers to white light with a coherent color temperature of more than 5000K up to 8500K.

[0050] According to at least one embodiment, the light-emitting diode module has exactly four different light-emitting diode types. Preferably, there are a plurality of light-emitting diodes for each light-emitting diode type. In particular, there are light-emitting diode types for generating red light, light-emitting diode types for generating green light, and light-emitting diode types for generating blue light. Furthermore, there may be light-emitting diode types for generating cyan light, also referred to as lagoon light, and / or for generating yellow light.

[0051] Blue light is particularly light having a dominant wavelength between 420 nm and 480 nm inclusive. Cyan light is particularly light having a dominant wavelength greater than 480 nm and up to 515 nm, green is light having a dominant wavelength greater than 515 nm and up to 550 nm. Yellow light is light having a dominant wavelength greater than 550 nm up to 585 nm inclusive, red light is light having a dominant wavelength greater than 585 nm up to 650 nm inclusive.

[0052] According to at least one embodiment, the light-emitting diodes are each a surface-mountable component, that is to say that all electrical contacts of the light-emitting diode are located on a single side of the light-emitting diode that preferably faces the carrier.

[0053] According to at least one embodiment, the light emitting diode module comprises at least eight or twelve light emitting diodes. Alternatively or additionally, there are at most 300 or 144 or 64 or 36 light emitting diodes per light emitting module. Preferably, the number of light emitting diodes is 16.

[0054] According to at least one embodiment, the average side length of the light-emitting diodes, when viewed in a plan view toward the upper side of the carrier, is respectively greater than the average side length of the light-emitting diode chips of the associated light-emitting diodes, and is at most 3 times, 2 times, 1.5 times, or 1.1 times greater. That is, the light-emitting surface of the light-emitting diode chip can be approximately the same size as the surface of the associated light-emitting diode. As a result, a high luminous density can be achieved within the center of the module in which the light-emitting diodes are arranged on the carrier, and the light-emitting diodes can be arranged closely side by side with respect to their light-emitting surfaces.

[0055] Furthermore, a system having one or more light-emitting diode modules is proposed. Features for the system are also disclosed for the light-emitting diode module and vice versa.

[0056] In at least one embodiment, the system comprises one or more control units, for example formed by a microcontroller IC. The light-emitting diodes can be controlled independently of one another individually or in groups by means of associated control units. There can be a one-to-one association between light-emitting diode modules and control units.

[0057] According to at least one embodiment, at least one control unit is arranged spaced apart from an associated carrier. Alternatively, it is possible that the control unit is arranged on or at the carrier or is also integrated in the carrier. That is, the carrier can optionally have an embedded microchip for the control unit.

[0058] According to at least one embodiment, the system comprises a plurality of light emitting diode modules. The light emitting diode modules can be combined into one or more assemblies. For example, there are a plurality of assemblies with 2×2 light emitting diode modules.

[0059] According to at least one embodiment, the system comprises one or more optical devices. There is preferably a one-to-one correspondence between components and optical devices. The optical device is, for example, a lens, such as a converging lens or a Fresnel lens.

[0060] According to at least one embodiment, the system is installed in a motor vehicle as an interior lighting device. For example, the system is a reading light in a car. The reading light can be associated with an individual seat, so that the system described here can exist for each seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] The light emitting diode module described here and the system described here are explained in detail below based on the exemplary embodiments with reference to the drawings. The same reference numerals here describe the same elements in the various drawings. However, the relationships that are in proportion are not shown here, but rather individual elements may be shown exaggeratedly for a better understanding.

[0062] The accompanying drawings show:

[0063] Figure 1 and 2 shows a schematic perspective sectional view of an exemplary embodiment of a light-emitting diode module described herein;

[0064] Figure 3 shows a schematic sectional view of a carrier for a light-emitting diode module described here;

[0065] Figure 4 and 5 A schematic top view and a schematic bottom view show an exemplary embodiment of a light-emitting diode module described herein;

[0066] Figure 6 A schematic diagram showing the relationship between electrical contact areas and light-emitting diodes of an exemplary embodiment of a light-emitting diode module described here;

[0067] Figure 7 and 8 A schematic plan view of a conductor track structure of an inner main layer for an exemplary embodiment of a light-emitting diode module described here;

[0068] Fig. 9 A schematic cross-sectional view shows an exemplary embodiment of a light-emitting diode for a light-emitting diode module described herein;

[0069] Fig.10 shows a schematic top view of a panel with a light-emitting diode module described herein;

[0070] Fig.11 A schematic perspective view showing a light emitting diode module and a panel;

[0071] Fig.12 and 13 shows a schematic perspective view of an exemplary embodiment of a light-emitting diode module described herein;

[0072] Fig.14 and 15 A schematic top view of an exemplary embodiment of a light-emitting diode module and an associated system described here is shown;

[0073] Fig.16 and 17 shows a schematic wiring diagram of the main layer located inside for an exemplary embodiment of a light-emitting diode module described here;

[0074] Fig.18 and 19 shows a schematic perspective view of an exemplary embodiment of a light-emitting diode module described herein;

[0075] Fig. 20 shows a schematic top view of an exemplary embodiment of a light-emitting diode module described herein;

[0076] Fig.21 shows a schematic top view of an exemplary embodiment of a system having a plurality of light-emitting diode modules described herein;

[0077] Fig. 22 and 23 shows a schematic wiring diagram of the main layer located inside for an exemplary embodiment of a light-emitting diode module described here;

[0078] Fig.24 A schematic sectional view of a motor vehicle having an exemplary embodiment of the system described herein; and

[0079] Figures 25 to 27 A schematic top view of an exemplary embodiment of a system described here is shown. DETAILED DESCRIPTION

[0080] exist Figure 1 and 21 shows a schematic three-dimensional sectional view of an embodiment of a light-emitting diode module 1. The light-emitting diode module 1 comprises a carrier 2. The carrier 2 comprises four main layers 21, 22, 23, 24, which are made of a structured electrically conductive material, in particular copper. The first main layer 21 is located directly on the carrier top 20 and the fourth main layer 24 is located directly on the carrier bottom 26. The main layers 21, 24 on the main sides 20, 26 are structured into electrical contact surfaces 27.

[0081] A second main layer 22 and a third main layer 23 are located within the carrier 2. The main layers 22, 23 are structured as conductor tracks. The numbering of the main layers 21, 22, 23, 24 is carried out from the carrier top 20 to the carrier bottom 26. Between adjacent main layers 21, 22, 23, 24 there is an electrically insulating intermediate layer 25, which is composed of fiber-reinforced epoxy, for example.

[0082] On the carrier top 20 there are light emitting diodes 3W emitting warm white light and light emitting diodes 3K emitting cold white light. The light emitting diodes 3W, 3K are arranged, for example, in a regular 4×4 matrix. The electrical contacts 31, 32 of the light emitting diodes 3K, 3W face the carrier top 20. The light emitting diodes 3K, 3W can preferably be electrically controlled individually.

[0083] Two large contact surfaces 27 are present on the carrier underside 26, in particular for the anodes of the light-emitting diodes 3K, 3W. One half of the light-emitting diodes 3K, 3W is respectively associated with the two large contact surfaces 27. In order to ensure the correct orientation of the light-emitting diode module 1 during installation, at least one of the large contact surfaces 27 can have a structuring as a position marking 59, as is also possible in all other exemplary embodiments.

[0084] The first contacts 31 are each located above a via 4 extending continuously from the first main layer 21 to the last main layer 24. This results in an effective thermal connection of the first contacts 31 to the last main layer 24. The second contacts 32 are located above an electrical via 4 extending to the second-to-last main layer 23 and thus to the vicinity of the last main layer 24. As a result, the thermal resistance from the second contacts 32 to the carrier underside 26 is also relatively low.

[0085] The main layers 21, 22, 23, 24 are based on copper, for example. The thickness of the main layers 21, 22, 23, 24 is, for example, between 15 μm and 50 μm, inclusive. The diameter of the via is, for example, between 50 μm and 120 μm, inclusive. The metallized flange surrounding the via 4 has, for example, a width of at least 30 μm and / or a maximum of 120 μm. The two outer intermediate layers 25 are preferably relatively thin, in particular having a thickness between 10 μm and 40 μm, inclusive, for example, approximately 30 μm. The middle intermediate layer 25 preferably has a greater thickness, for example, between 60 μm and 0.2 mm, inclusive. For better solderability, the contact surface 27 can be provided with a metal coating, which is, for example, composed of NiAu and has a thickness of 7 μm. The total thickness of the carrier 2 is preferably between 0.2 mm and 1 mm, inclusive, in particular 0.5 mm. The via 4 can be partially or completely filled with metal, such as copper, and is preferably designed for a current of at least 30 mA and / or at most 0.5 A. The abovementioned values ​​can also apply individually or in combination to all other exemplary embodiments.

[0086] exist Figure 3 Schematically shows the structure of the carrier 2. The outer main layers 21, 24 can be structured as contact surfaces 27. The inner main layers 22, 23 preferably each have a structured metallization 28, so that a conductor track can be formed. The metallization 28 can be flattened by means of an electrically insulating layer 29, so that the central main layers 22, 23 always have a constant thickness and the intermediate layer 25 can be laminated, for example. The vias 4 can establish electrical connections of different depths between different main layers 21, 22, 23, 24.

[0087] exist Figure 4 and 5 The schematic top view and the schematic bottom view are shown in Figure 1 and 2 . Exemplary dimensions for the carrier 2 and for the placement of the light-emitting diodes 3K, 3W are shown. The dimensions shown can be used individually or in combination. Preferably, the dimensions are given relative to one another with a tolerance of at most 2 times, 1.5 times or 1.2 times.

[0088] exist Figure 6 , the electrical association between the contact surfaces 27 and the light-emitting diodes 3W, 3K is shown. The contact surfaces 27 for the cathode contacts are numbered C1 to C16, and the light-emitting diodes are numbered L1 to L16. Thus, the light-emitting diode L1 is associated with the cathode contact C1 and the anode contact A1, etc. Eight light-emitting diodes are associated with each of the two contact surfaces 27 for the anodes, the anode contacts being abbreviated with A.

[0089] The two types of light emitting diodes 3W and 3K are arranged in anti-point symmetry with respect to the midpoint and the symmetry point 35 of the carrier 2. For example, the light emitting diode L1 emitting cold white light is arranged in anti-point symmetry with respect to the light emitting diode L16 emitting warm white light, the light emitting diode L10 emitting cold white light is arranged in anti-point symmetry with respect to the light emitting diode L7 emitting warm white light, and so on. The anode contact surfaces associated with the light emitting diodes are also arranged in anti-point symmetry. In addition, the light emitting diodes are arranged in anti-point symmetry with respect to the midpoint and the symmetry point 35 of the carrier 2. Figure 6 The mirror axis 36 extending horizontally through the symmetry point 35 is arranged in a mirror-inverted manner.

[0090] Thus, for example, the contact surface C1 belonging to the light-emitting diode L1 is arranged point-symmetrically with respect to the contact surface C16 of the light-emitting diode L16. Correspondingly, the contact surface C10 of the light-emitting diode L10 is arranged point-symmetrically with respect to the contact surface C7 of the light-emitting diode L7, etc. That is to say, the light-emitting diodes of these light-emitting diode types arranged in an anti-point-symmetrical manner have cathode contacts arranged correspondingly point-symmetrically.

[0091] The light emitting diodes 3W, 3K are arranged in four quadrants, wherein the quadrants are of the same size. Figure 6 The lower middle quadrant and the two upper quadrants are each merged via a translation. The assignment of the contact surfaces C1 to C16 to the cathode does not occur in the same quadrant as the arrangement of the light-emitting diodes 3W, 3K. At least within the respective quadrant, adjacent cathode contact surfaces C1 to C16 are alternately associated with two contact surfaces 27 for the anode contact.

[0092] exist Figure 7 and 8 Schematically shows the structured parts of the main layers 22 and 23 located in the interior. All contacts of the light-emitting diodes arranged in row R are located in a straight line, and the same applies to the corresponding light-emitting diodes. With the help of printed conductors 5, the corresponding contact surfaces are connected to the corresponding electrical contact surfaces via vias 4.

[0093] The conductor tracks 5 do not intersect the row R. The conductor tracks 5 are as short as possible. Furthermore, if viewed in a top view and side by side, Figure 7 The conductor structure is relative to Figure 8 The structure of is mirror-symmetrical. Thus, within the row R, the vias 4 can be placed closely side by side.

[0094] exist Fig. 9 Schematically in sectional view, an exemplary embodiment of a light emitting diode 3 is illustrated in FIG. The light emitting diode 3 comprises a light emitting diode chip 30, which is based on the material system AlInGaN, for example. The light emitting diode chip 30 is mounted on contacts 31, 32. The contacts 31, 32 can be formed by relatively thick metallizations.

[0095] It is possible for the contacts 31, 32 to be embedded in the potting body 33. A phosphor layer 34 may be present on the side of the LED chip 30 facing away from the contacts 31, 32. The total area of ​​the LED 3 corresponds approximately to the total area of ​​the LED chip 30 when viewed in plan view.

[0096] exist Fig.10 , a panel 9 is illustrated, which comprises a plurality of light emitting diode modules 1. Each light emitting diode module 1 has a relatively small lateral dimension. For example, the lateral dimension is respectively in the range of 5 mm. The panel 9 can be divided into the light emitting modules 1, for example, by means of sawing.

[0097] exist Fig.11 2 illustrates that a light-emitting diode module 1 having a plurality of regions of light-emitting diodes 3 arranged closely next to one another can also be produced from a panel 9 .

[0098] exist Figures 12 to 17 Another embodiment of a light emitting diode module 1 is shown in FIG. The light emitting diode module 1 has four light emitting diodes of different types. Thus, there are light emitting diodes 3G emitting green light, light emitting diodes 3R emitting red light, light emitting diodes 3B emitting blue light, and light emitting diodes 3C emitting cyan light.

[0099] The light-emitting diodes are arranged in four quadrants which can be mapped to one another by means of a translation, see in particular Fig.12 and 14 At each corner of a quadrant and also at each corner of the overall system of light-emitting diodes there is a light-emitting diode emitting a different color.

[0100] Especially from Fig.13 As can be seen in the figure, there are four large contact surfaces 27 as anode contacts and four small contact surfaces 27 for controlling each emission color on the bottom side 26. That is, the individual colors can be electrically controlled independently of each other. In each quadrant, there is in particular just one contact surface 27 as anode contact.

[0101] exist Fig.15 , the system 10 comprises four light emitting diode modules 1. The light emitting diode modules 1 are arranged rotated 90° relative to each other. This allows effective color mixing across the system 10. Instead of a linear arrangement of the light emitting diode modules 1, the light emitting diode modules 1 can also be arranged in a regular 2×2 matrix.

[0102] Fig.16 and 17 The schematic wiring of the light-emitting diodes in two inner main layers 22 , 23 is shown. The conductor tracks 5 again do not intersect the individual rows R. All light-emitting diode chips of a specific emission color are preferably electrically wired in a single main layer 22 , 23 .

[0103] exist Figures 18 to 23 In the embodiment, there are also four LED types, similar to Figures 13 to 17 Two light-emitting diodes of each of the four light-emitting diodes of a light-emitting diode type are electrically arranged together. This results in a total of eight groups of light-emitting diodes that can be controlled independently of one another. The arrangement of the light-emitting diodes on the carrier top 20 is similar to Figures 12 to 14 .

[0104] In the corner regions of the four quadrants, preferably two cathode contacts are present for a specific emission color. In turn, preferably one common anode contact surface is present in each quadrant.

[0105] The wiring of the light emitting diodes in the two inner main layers 22, 23 is Fig. 22 and 23 The light emitting diodes can be grouped in a range that spans the main layers 22 and 23. Thus, for example, the upper right contact surface of the group for emitting green light is connected to the associated light emitting diode via the second main layer 22 and via the third main layer 23. The vias 4 are correspondingly configured so that the required main layers 21, 22, 23, 24 are locally electrically connected to one another.

[0106] exist Fig.24 , the system 10 comprises a plurality of light emitting diode modules 1, for example in a 2×2 matrix. The system 10 further comprises an optical device 8, which is preferably arranged together downstream of the light emitting diode modules 1. Such an optical device 8 can also be present in all other embodiments of the system 10. In addition, there are one or more control units 6 for driving the light emitting diode modules 1.

[0107] The system 10 is installed in a motor vehicle 11, such as a car. The system 10 is, for example, a reading light, which is associated with each seat in the motor vehicle 11. One of the systems 10 can be present at each seat. To simplify the illustration, only a single system 10 is shown.

[0108] exist Fig.25 and 26 Schematically shows other embodiments of the system 10. The system 10 comprises a control unit 6, which is associated with the light emitting diode module 1. The light emitting diode module 1 is for example combined with Figure 1 , 2 4 to 8. A common mounting carrier as a mounting platform for the light emitting diode module 1 and for the control unit 6 is not shown.

[0109] according to Fig.25The control unit 6 has a DC output terminal DC and 16 open collector output terminals OC. The DC output terminal DC is associated with the two larger anode contact surfaces. The 16 output terminals OC are respectively associated with one of the smaller contact surfaces for the cathode contact of the light emitting diode.

[0110] exist Fig.26 , the control unit 6 has two switchable DC outputs DC and for this purpose has only eight open collector outputs OC. The two larger contact surfaces for the anode contacts are each connected to one of the DC outputs DC. The smaller cathode contact surfaces are arranged so that preferably adjacent cathode contact surfaces along a line continuing along the edge can be associated with only one of the outputs OC.

[0111] The two cathode contact surfaces associated with the common output OC are each associated with one of the two larger contact surfaces for the anode contact, so that the light-emitting diodes can be individually controlled. This can be achieved in particular by means of Figures 6 to 8 The circuit structure shown in is implemented.

[0112] By using a plurality of anode contact areas, a control unit 6 of simpler construction can be used, so that the system 10 can be produced more cost-effectively.

[0113] As is also possible in all exemplary embodiments, the light emitting diode module 1 and the control unit 6 are mounted on a mounting carrier (not shown), for example a further printed circuit board.

[0114] exist Fig. 27 In the embodiment, the system 10 has only two of the light emitting diode modules 1, which are for example Figure 1 and 2 Configuration The two light emitting diode modules 1 are arranged next to each other rotated by 180° relative to each other.

[0115] Unless otherwise stated, the components shown in the figures preferably follow each other directly in the order in which they are given. Layers that do not touch each other in the figures are preferably spaced apart from each other. If the lines are shown parallel to each other, the corresponding surfaces are preferably also oriented parallel to each other. Likewise, unless otherwise stated, the relative positions of the components shown to each other are exactly depicted in the drawings.

[0116] The invention described here is not limited by the description based on the exemplary embodiments. Rather, the invention includes any new features and any combination of features, which in particular includes any combination of features in the exemplary embodiments, even if the features or the combination themselves are not presented in detail in the exemplary embodiments.

[0117] This application claims the priority of German patent application 10 2019 102 953.8, the disclosure content of which is incorporated herein by reference.

[0118] Reference numerals list

[0119] 1 LED module

[0120] 2 Carrier

[0121] 20 Carrier upper side

[0122] 21..24 Conductive main layer

[0123] 25 Electrically insulating intermediate layer

[0124] 26 Carrier bottom side

[0125] 27 Electrical contact surface

[0126] 28 Metallization

[0127] 29 Electrical insulation layer

[0128] 3. Light Emitting Diode

[0129] 30 LED chips

[0130] 31 first electrical contact

[0131] 32 second electrical contact portion

[0132] 33 potting body

[0133] 34 Luminescent material layer

[0134] 35 Symmetrical point / midpoint

[0135] 36 Mirror axis

[0136] 4 Electrical vias

[0137] 5 Electrical conductor tracks

[0138] 59 Position markers

[0139] 6 Control unit

[0140] 7 Components

[0141] 8 Optical Devices

[0142] 9 Panel

[0143] 10 System

[0144] 11 Motor Vehicles

[0145] A.. Anode contact number... C.. Cathode contact number... L.. LED number... DC, OC DC channel, output channel R row

Claims

1. A light-emitting diode module (1), comprising a carrier (2) and a plurality of light-emitting diodes (3), wherein - there are at least two different light emitting diode types, - the light-emitting diodes (3) can be electrically controlled individually or in groups independently of one another, - the light-emitting diodes (3) each have a first electrical contact and a second electrical contact (31, 32), The carrier (2) comprises a plurality of electrically conductive main layers (21, 22, 23, 24), between which there are respectively electrically insulating intermediate layers (25), - the contacts (31, 32) of the light-emitting diode (3) are arranged on a first of the main layers (21) on the carrier top side (21), - starting from all first contacts (31), the electrical vias (4) each extend directly toward the last of the main layers (24) directly at the carrier underside (26) and are directly connected to the last main layer (24), - starting from all second contacts (32), the electrical vias (4) each extend directly towards the penultimate of the main layers (23) and terminate at the penultimate main layer (23), the penultimate main layer being located within the carrier (2), and The second main layer (22) and the penultimate main layer (23) of the main layers each have an electrical conductor track (5), and the vias (4) associated with the second contact (32) can be electrically controlled independently of each other by means of the conductor tracks (5) of the second main layer (22) and the penultimate main layer.

2. The light-emitting diode module (1) according to the preceding claim, wherein the vias (4) starting from the contacts (31, 32) are partially or completely covered by the associated contacts (31, 32) in a plan view, There are between four and eight main layers (21, 22, 23, 24) including the boundary values.

3. The light-emitting diode module (1) according to the preceding claim, The carrier (2) comprises exactly four main layers (21, 22, 23, 24).

4. The light-emitting diode module (1) according to any one of the preceding claims, The conductor tracks (5) of the second main layer (22) and of the penultimate main layer are designed to be mirror-symmetrical when placed next to one another and viewed in plan view.

5. The light-emitting diode module (1) according to any one of the preceding claims, The light-emitting diodes (3) are arranged along at least one row (R), so that the contact parts (31, 32) of the light-emitting diodes (3) in the at least one row (R) are arranged along a straight line, The conductor track (5) and the at least one row (R) do not intersect.

6. The light-emitting diode module (1) according to any one of the preceding claims, The carrier (2) comprises at least on the carrier underside (26) two or more electrical contact areas (27) for externally electrically contacting a first contact (31) of the light-emitting diode (3), A plurality of vias (4) starting from the first contact portion (31) terminate at each contact surface (27) for the first contact portion (31).

7. The light-emitting diode module (1) according to any one of the preceding claims, The carrier (2) comprises, at least on the carrier underside (26), a plurality of electrical contact surfaces (27) for individually and externally electrically contacting the second contacts (32) of the light-emitting diodes (3), The electrical contact areas (27) for the second contacts (32) are located next to the light-emitting diodes (3) when viewed in plan view and are each electrically connected to an inner main layer (22, 23) of the carrier (2) by means of at least one electrical via (4).

8. The light-emitting diode module (1) according to any one of the preceding claims, The light-emitting diodes (3) are arranged in an anti-point-symmetrical manner when viewed from above, so that each light-emitting diode (3) of the first light-emitting diode type can be mapped into a light-emitting diode (3) of the second light-emitting diode type by means of point symmetry. There is precisely one common symmetry point (35) for point symmetry for all light-emitting diodes (3).

9. The light emitting diode module (1) according to the two preceding claims, The contact surfaces (27) for second contacts (32) of light-emitting diodes (3) arranged anti-point-symmetrically with respect to one another are also arranged point-symmetrically with respect to one another.

10. The light-emitting diode module (1) according to any one of the preceding claims, In this case, the contact surface (27) for the second contact (32) and the associated light-emitting diode (3) show the same point of symmetry when viewed in a plan view toward the carrier top (21).

11. The light-emitting diode module (1) according to any one of the preceding claims, The light-emitting diodes (3) are arranged in an anti-mirror-symmetrical manner when viewed in a plan view, so that each light-emitting diode (3) of the first light-emitting diode type can be mapped into a light-emitting diode (3) of the second light-emitting diode type by means of mirror-symmetry, There is exactly one mirror axis (36).

12. The light-emitting diode module (1) according to any one of the preceding claims, In this case, the overall system of light-emitting diodes (3) can be divided into four quadrants of equal size when viewed in plan view, so that all quadrants can be mapped into one another by means of a translation or by means of a combination of translation and rotation.

13. The light-emitting diode module (1) according to any one of the preceding claims, Precisely one of the two light-emitting diode types is formed by a plurality of light-emitting diodes (3W) for generating warm white light, and the other light-emitting diode type is formed by a plurality of light-emitting diodes (3K) for generating cool white light.

14. The light emitting diode module (1) according to any one of claims 1 to 11, Exactly one of the four LED types is formed by a plurality of LEDs (3R) for generating red light, one LED type is formed by a plurality of LEDs (3G) for generating green light, one LED type is formed by a plurality of LEDs (3C) for generating cyan light, and the remaining LED types are formed by a plurality of LEDs (3B) for generating blue light.

15. The light-emitting diode module (1) according to any one of the preceding claims, The light emitting diodes (3) are each surface mountable. wherein the light-emitting diode module (1) comprises between 8 and 144 light-emitting diodes (3), inclusive, In this case, the average side length of the light-emitting diodes (3) is greater than the average side length of the light-emitting diode chips (30) of the associated light-emitting diodes (3), and is at most three times greater, when viewed in plan view.

16. A system (10) comprising at least one light-emitting diode module (1) according to any one of the preceding claims and at least one control unit (6), wherein the light emitting diodes (3) can be individually controlled by means of the control unit (6), and The control unit (6) is arranged spaced apart from the carrier (2).

17. System (10) according to the preceding claim, comprising a plurality of light emitting diode modules (1), The light emitting diode module (1) is composed of a plurality of components (7). wherein the system (10) further comprises a plurality of optical devices (8) and each of the components (7) is associated with one of the optical devices (8), and The system (10) is installed in a motor vehicle as an interior lighting device.

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