Connector, test equipment and wafer testing method

Abstract

The present application discloses a connector, a testing device and a wafer testing method, wherein the connector includes a connecting portion and a mounting portion, wherein the connecting portion includes a plurality of bearing surfaces, each of which can be used to bear a sample to be tested, and the mounting portion is at least partially located between all the bearing surfaces, and the extension direction of the mounting portion includes a component parallel to any bearing surface. The design provides a plurality of bearing surfaces on the connecting portion of the connector, each of which can be used to connect with the sample to be tested for tensile stress testing. Compared with the related art in which only one bearing surface is provided on the connector for the sample to be tested to connect for tensile stress testing, after the improvement, the plurality of bearing surfaces on the connecting portion of the same connector can be switched for use, which increases the number of times the same connector can be used for tensile stress testing, thereby improving the consumables utilization rate of the connector and achieving the purpose of significantly reducing production costs.

Description

Technical Field

[0001] The present application relates to the technical field of tensile testing, and in particular to a connector, a testing device, and a wafer testing method. Background Art

[0002] In order to improve the reliability of the sample to be tested, a tensile stress test will be performed on the bonding strength between the film layers of the sample to be tested. For example, the sample to be tested can be first bonded and fixed to the connecting piece with adhesive, and then the connecting piece is installed on the tensile stress testing equipment. The tensile stress testing equipment is then started. The tensile stress testing equipment applies tensile force to the sample to be tested until the different film layers of the sample to be tested are just separated. At this time, the value measured by the tensile stress testing equipment is the maximum tensile stress that the sample to be tested can withstand.

[0003] Since connectors are consumables in tensile stress testing, how to improve the utilization rate of connector consumables has become an urgent problem to be solved. Summary of the invention

[0004] The embodiments of the present application provide a connector, a testing device, and a wafer testing method, which can effectively improve the utilization rate of consumables of the connector and significantly reduce production costs.

[0005] In a first aspect, an embodiment of the present application provides a connecting member for connecting to a sample to be tested and for detecting the tensile stress of the sample to be tested; the connecting member includes a connecting portion and a mounting portion, the connecting portion includes a plurality of bearing surfaces, each bearing surface can be used to bear the sample to be tested, the mounting portion is at least partially located between all the bearing surfaces, and an extension direction of the mounting portion includes a component parallel to any bearing surface.

[0006] Based on the connector of the embodiment of the present application, multiple bearing surfaces are arranged on the connecting part of the connector, and each bearing surface can be used to connect with the sample to be tested for tensile stress testing. Compared with the connector in the related art in which only one bearing surface is arranged on the connector for connecting the sample to be tested for tensile stress testing, after the improvement, the multiple bearing surfaces on the connecting part of the same connector can be switched for use, which increases the number of times the same connector can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connector and achieving the purpose of significantly reducing production costs.

[0007] In some embodiments, the mounting portion is a mounting hole that passes through the connecting portion.

[0008] Based on the above embodiments, by designing the mounting portion as a mounting hole that passes through the connecting portion, the connecting member can be rotated relative to the test equipment to adjust the bearing surface connected to the sample to be tested, and the connection with the test equipment is achieved through the mounting hole, thereby reducing the difficulty of switching the bearing surface of the connecting portion.

[0009] In some embodiments, a plurality of bearing surfaces are sequentially connected end to end on the connecting portion, or the connecting portion further comprises a plurality of connecting surfaces, and the plurality of connecting surfaces are sequentially and staggeredly connected with the plurality of bearing surfaces on the connecting portion.

[0010] Based on the above embodiments, by designing the arrangement of multiple bearing surfaces on the connecting part to be connected end to end in sequence, on the one hand, the difficulty of processing multiple bearing surfaces on the connecting part of the connecting piece is reduced, and on the other hand, the bearing surface of the connecting part can be switched every time the connecting part rotates a certain angle, thereby reducing the difficulty of switching the bearing surface of the connecting part; by designing multiple connecting surfaces and the arrangement of multiple bearing surfaces on the connecting part to be staggered in sequence, after the staggered bearing surfaces are polished for many times, the connecting surface connecting two adjacent bearing surfaces on the connecting part may be completely polished off, and finally the connecting part may be polished into a situation where multiple bearing surfaces are connected in sequence. At this time, the connecting part can continue to be used to connect the sample to be tested for tensile stress testing, thereby further improving the utilization rate of consumables of the connecting part, so as to further reduce the production cost.

[0011] In some embodiments, the plurality of bearing surfaces include a first bearing surface and a second bearing surface opposite to each other, and a third bearing surface and a fourth bearing surface opposite to each other, each of the third bearing surface and the fourth bearing surface intersects with the first bearing surface and the second bearing surface.

[0012] Based on the above embodiment, by arranging four bearing surfaces on the connecting portion, namely the first bearing surface, the second bearing surface, the third bearing surface and the fourth bearing surface, the four bearing surfaces can all be used to connect with the sample to be tested, and each bearing surface can be used for at least one tensile stress test, so that one connecting component can be used for at least four tensile stress tests, thereby greatly improving the utilization rate of consumables of the connecting component and greatly reducing the production cost.

[0013] In some embodiments, the first bearing surface and the second bearing surface are parallel to each other, the third bearing surface and the fourth bearing surface are parallel to each other, and the third bearing surface is perpendicular to the first bearing surface.

[0014] Based on the above embodiments, by designing the first bearing surface and the second bearing surface opposite to each other to be parallel to each other, the third bearing surface and the fourth bearing surface to be parallel to each other, and the third bearing surface is perpendicular to the first bearing surface, the connecting portion has a rectangular block structure, thereby further reducing the processing difficulty of the connecting portion.

[0015] In some embodiments, the distance between the first bearing surface and the second bearing surface is a1, and a1 satisfies the condition: 2.0≤a1≤8.0mm; and / or the distance between the third bearing surface and the fourth bearing surface is a2, and a2 satisfies the condition: 2.0≤a2≤8.0mm.

[0016] Based on the above embodiment, when the spacing a1 between the first bearing surface and the second bearing surface, and the spacing a2 between the third bearing surface and the fourth bearing surface meet the above conditional expression, when the connecting portion has multiple bearing surfaces, the consumables utilization rate of the connecting member is optimized, thereby greatly reducing the production cost; when the spacing a1 between the first bearing surface and the second bearing surface, and the spacing a2 between the third bearing surface and the fourth bearing surface exceed the lower limit of the above conditional expression, the spacing a1 between the first bearing surface and the second bearing surface, and the spacing a2 between the third bearing surface and the fourth bearing surface are too small, although the connecting portion has multiple bearing surfaces, the bearing surfaces of the connecting portion are The number of times the bearing surface can be used for tensile stress testing is small, resulting in a low utilization rate of consumables of the connector, which is not conducive to reducing production costs; when the spacing a1 between the first bearing surface and the second bearing surface and the spacing a2 between the third bearing surface and the fourth bearing surface exceed the upper limit of the above conditional expression, the spacing a1 between the first bearing surface and the second bearing surface and the spacing a2 between the third bearing surface and the fourth bearing surface are too large. Although the connecting part has multiple bearing surfaces and each bearing surface of the connecting part can be used for tensile stress testing a large number of times, the size of each bearing surface of the connecting part is too large, far exceeding the size of the sample to be tested, resulting in waste of connecting part materials.

[0017] In some embodiments, the distance a1 between the first bearing surface and the second bearing surface is equal to 5 mm, and the distance a2 between the third bearing surface and the fourth bearing surface is equal to 5 mm.

[0018] Based on the above embodiment, by reasonably setting the distance a1 between the first bearing surface and the second bearing surface, and reasonably setting the distance a2 between the third bearing surface and the fourth bearing surface, when a1=5mm and a2=5mm, it can be ensured that the bearing surfaces on the connecting part can be used for tensile stress a large number of times, and it can be ensured that the size of the bearing surfaces on the connecting part will not cause waste of connecting member materials.

[0019] In some embodiments, the mounting portion is a mounting hole that passes through the connecting portion, the axis of the mounting hole is parallel to the first bearing surface, and along a direction perpendicular to the first bearing surface, the spacing between the outer tangent surface of the mounting hole parallel to and adjacent to the first bearing surface and the first bearing surface is c, and c satisfies the condition: 0.8mm≤c≤3.2mm.

[0020] Based on the above embodiment, by reasonably setting the spacing c between the first bearing surface and the outer section of the mounting hole, and the larger c is, the more times the first bearing surface can be used for tensile stress testing, when the spacing c between the first bearing surface and the outer section of the mounting hole satisfies the above conditional expression, it can effectively ensure that the first bearing surface of the connecting part can be used for tensile stress testing more times, so that the consumables utilization rate of the connecting part is optimal, thereby greatly reducing the production cost; when the spacing c between the first bearing surface and the outer section of the mounting hole exceeds the lower limit of the above conditional expression, the first bearing surface of the connecting part can be used for tensile stress testing less times, resulting in the consumables utilization rate of the connecting part is still low, which is not conducive to reducing production costs; when the spacing c between the first bearing surface and the outer section of the mounting hole exceeds the upper limit of the above conditional expression, although the first bearing surface of the connecting part can be used for tensile stress testing more times, the size of the first bearing surface of the connecting part is too large, far exceeding the size of the sample to be tested, resulting in waste of connecting part materials.

[0021] In a second aspect, an embodiment of the present application provides a testing device, which includes a fixture and a connecting member, at least one of the connecting members is the above-mentioned connecting member, and is detachably connected to the fixture through the mounting portion of the connecting member.

[0022] Based on the test equipment in the embodiment of the present application, the test equipment has the above-mentioned connecting part, the connecting part has multiple bearing surfaces, and is detachably connected to the fixture through the mounting part, and the bearing surface connected to the sample to be tested can be switched by rotation, so that each bearing surface on the connecting part can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connecting part and achieving the purpose of reducing production costs; the detachable connection between the connecting part and the fixture of the test equipment facilitates the replacement of scrapped connecting parts, thereby enhancing the practicality of the test equipment.

[0023] In some of the embodiments, the testing device further comprises a connecting column, the mounting portion of the connecting piece is a mounting hole penetrating the connecting portion, and the connecting column is plugged into and matched with the mounting hole of the connecting piece to achieve relative fixation of the position between the connecting piece and the fixture.

[0024] Based on the above embodiments, the relative fixation of the position between the connecting member and the clamp is achieved by plugging and fitting the connecting column and the mounting hole, which greatly reduces the difficulty of installing and disassembling the connecting member and the clamp.

[0025] In some of the embodiments, the fixture includes a clamp that is detachably connected to the test equipment, the clamp includes two oppositely arranged clamping ends, each of the two clamping ends is provided with a plug hole, the connecting member is located between the two clamping ends, and the connecting column passes through each plug hole in the two clamping ends and the mounting hole of the connecting part.

[0026] Based on the above embodiment, the connection stability between the connector and the clamp is enhanced by clamping the connector between the two clamping ends of the clamp, and passing the connecting column through the plug-in hole on one clamping end in turn, and then passing through the mounting hole on the connector and out of the plug-in hole on the other clamping end.

[0027] In some embodiments, the clamp includes a first clamp and a second clamp, the first clamp and the second clamp are arranged opposite to each other, the connecting member includes a first connecting member and a second connecting member, the connecting column includes a first connecting column and a second connecting column, and the first connecting column is used to achieve relative fixation of the position between the first connecting member and the first clamp, and the second connecting column is used to achieve relative fixation of the position between the second connecting member and the second clamp; wherein, at least one of the multiple bearing surfaces in the first connecting member can be located on a side of the first connecting column away from the second connecting column, and at least one of the multiple bearing surfaces in the second connecting member can be located on a side of the second connecting column away from the first connecting column.

[0028] Based on the above embodiment, the sample to be tested is connected between two mutually adjacent bearing surfaces of the first connecting member and the second connecting member, the first connecting member is fixed to the first clamp by the first connecting column, and the second connecting member is fixed to the second clamp by the second connecting column. Since the first connecting member and the second connecting member both include multiple bearing surfaces, and the multiple bearing surfaces are arranged around the hole axis of the mounting hole, after the first connecting member and the second connecting member are installed, at least one of the multiple bearing surfaces in the first connecting member is located on the side of the first connecting column away from the second connecting column, and similarly, at least one of the multiple bearing surfaces in the second connecting member is located on the side of the second connecting column away from the first connecting column, so that the first connecting member and the second connecting member can be rotated around the direction of the hole axis of their respective mounting holes to realize the switching of different bearing surfaces, so as to facilitate the connection of other samples to be tested, increase the number of times the same connecting member can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connecting member, and achieving the purpose of significantly reducing production costs.

[0029] In a third aspect, an embodiment of the present application provides a wafer testing method, the testing method comprising the following steps:

[0030] The tensile stress of the wafer sample is tested by any of the above-mentioned testing equipments.

[0031] Based on the wafer testing method in the embodiment of the present application, compared with the related art of using the same supporting surface of the same connector to connect wafer samples, by switching between multiple supporting surfaces on the same connector, the number of times the connector is used for tensile stress testing is increased, thereby greatly improving the utilization rate of consumables of the connector.

[0032] In some embodiments, the testing method further comprises the following steps:

[0033] removing the wafer sample from a carrying surface among the plurality of carrying surfaces;

[0034] Another wafer sample is connected to another carrying surface of the plurality of carrying surfaces.

[0035] Based on the above embodiments, by using different bearing surfaces on the connecting member to connect with the wafer sample for tensile stress testing, the efficiency of the tensile stress test of the wafer sample is improved.

[0036] In some embodiments, the testing method further comprises the following steps:

[0037] removing the wafer sample from one of the plurality of carrying surfaces;

[0038] Processing a carrying surface among the plurality of carrying surfaces from which the wafer sample is removed;

[0039] Another wafer sample is connected to a carrying surface among the processed carrying surfaces.

[0040] Based on the above embodiment, the bearing surface that has undergone the tensile stress test is processed to make the surface of the bearing surface smooth so that another wafer sample can be connected to the same bearing surface on the connector, that is, one bearing surface can be used for multiple tensile stress tests to further improve the consumables utilization rate of the connector.

[0041] In some embodiments, the test device further includes a connecting column, the fixture includes a clamp detachably connected to the test device, the clamp includes two clamping ends arranged opposite to each other, and the two clamping ends are provided with plug holes, and the test method further includes the following steps:

[0042] Bonding two opposite surfaces of the wafer sample to the bearing surfaces of two connecting members respectively by means of adhesive;

[0043] The connecting piece is clamped between the two clamping ends;

[0044] Pass the connecting column through one of the plug holes and out of the other plug hole through the mounting portion, so that the bearing surfaces bonded with the wafer sample are arranged facing each other;

[0045] After the test is completed, the connecting post is pulled out from the socket to remove the connecting piece from the fixture.

[0046] Based on the above embodiment, the wafer sample is bonded from two opposite supporting surfaces of the wafer sample through two connecting parts, and the two connecting parts are fixed one by one to the two chucks of the two clamps through two connecting pillars. Each connecting pillar is plugged into and matched with the plug hole of the clamping end of the corresponding chuck and the mounting hole of the connecting part to achieve installation between each connecting part and the corresponding chuck, and disassembly between each connecting part and the corresponding chuck is achieved by pulling out the connecting pillar. The operation is simple, convenient and fast.

[0047] Based on the connector, test equipment and wafer testing method of the embodiments of the present application, multiple bearing surfaces are arranged on the connecting part of the connector, and each bearing surface can be used to connect with the sample to be tested for tensile stress testing. Compared with the related art in which only one bearing surface is arranged on the connector for connecting the sample to be tested for tensile stress testing, after the improvement, the multiple bearing surfaces on the connecting part of the same connector can be switched for use, which increases the number of times the same connector can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connector and achieving the purpose of significantly reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0049] Figure 1 Schematic diagram of the structure of the wafer sample before tensile stress test;

[0050] Figure 2 It is a schematic diagram of the structure of the connecting part before polishing in the related art;

[0051] Figure 3 A cross-sectional view of a connecting member connecting a wafer sample before polishing in the related art;

[0052] Figure 4 This is a schematic diagram of the structure when the wafer sample fails;

[0053] Figure 5 It is a schematic diagram of the structure of the polished connecting piece in the related art;

[0054] Figure 6 It is a cross-sectional view of a polished connector-wafer sample in the related art;

[0055] Figure 7 This is a structural schematic diagram of a case where the mounting portion of the connector in one embodiment of the present application is a mounting hole;

[0056] Figure 8 This is a structural schematic diagram of a case where the mounting portion of a connector in an embodiment of the present application is a convex column;

[0057] Fig. 9 This is a schematic diagram of the structure when the bearing surfaces on the connecting part in one embodiment of the present application are connected end to end in sequence;

[0058] Fig.10This is a structural schematic diagram of a case where the bearing surface and the connecting surface on the connecting portion in one embodiment of the present application are sequentially and staggeredly connected;

[0059] Fig.11 This is a cross-sectional view of a connector connected to a sample to be tested before polishing in one embodiment of the present application;

[0060] Fig.12 This is a cross-sectional view of a polished connector connected to a sample to be tested in one embodiment of the present application;

[0061] Fig.13 This is a schematic diagram of the exploded structure of a testing device in one embodiment of the present application;

[0062] Fig.14 This is a structural schematic diagram of a connecting column in an embodiment of the present application being plugged into a plug hole at a clamping end;

[0063] Fig.15 It is a cross-sectional view of a sample to be tested in one embodiment of the present application after being bonded to the bearing surface of the connecting member via a connecting adhesive layer;

[0064] Fig.16 This is a schematic diagram of a structure in which a connecting piece in one embodiment of the present application is installed in a fixture to detect the tensile stress of a sample to be tested;

[0065] Fig.17 This is a flow chart of a wafer testing method in one embodiment of the present application;

[0066] Fig.18 A flowchart of a wafer testing method in another embodiment of the present application;

[0067] Fig.19 This is a flow chart of a wafer testing method in yet another embodiment of the present application;

[0068] Fig. 20 This is a flow chart of a wafer testing method in yet another embodiment of the present application.

[0069] Reference numerals:

[0070] 10. Connector; 11. Carrying part; 101. First surface; 12. Connecting part; 102. Through hole; 20. Adhesive layer; 30. Wafer sample; 31. First film layer; 32. Second film layer;

[0071] 100, connector; 100a, first connector; 100b, second connector; 110, connector; 111, bearing surface; 1111, first bearing surface; 1112, second bearing surface; 1113, third bearing surface; 1114, fourth bearing surface; 112, connector surface; 120, mounting portion; M, layout direction; 200, connector adhesive layer; 300, sample to be tested; 400, test equipment; 410, fixture; 410a, first fixture; 410b, second fixture; 411, chuck; 4111, clamping end; 41111, plug hole; 420, connector column; 420a, first connector column; 420b, second connector column. DETAILED DESCRIPTION

[0072] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0073] In order to improve the reliability of the sample to be tested, a tensile stress test will be performed on the bonding strength between the film layers of the sample to be tested. The sample to be tested can be first bonded and fixed to the connecting piece 10 with an adhesive layer 20, and then the connecting piece 10 is installed on the tensile stress testing equipment. The tensile stress testing equipment is then started. The tensile stress testing equipment applies tensile force to the sample to be tested until the different film layers of the sample to be tested are just separated. At this time, the value measured by the tensile stress testing equipment is the maximum tensile stress that the sample to be tested can withstand.

[0074] The inventor of the present application found in the research that after the tensile stress test of the sample to be tested is completed, the connector 10 needs to be polished to remove the adhesive layer 20 adhering to the connector 10. Since the thickness of the connector 10 will be thinned after polishing, the number of times the connector 10 can be polished is limited, that is, the number of times the connector 10 can be used is limited. Therefore, how to improve the utilization rate of consumables of the connector 10 has become an urgent problem to be solved.

[0075] For example, there is a specific application scenario as follows: complex stress states will be encountered during wafer production, packaging and use, such as residual stress, thermal stress during thermal processing, shear force during chemical mechanical polishing, impact force on the wafer edge during the dicing process, and bending stress during silicon substrate thinning. These forces will affect the film structure inside the wafer, and ultimately affect the reliability of the chip.

[0076] In order to improve the reliability of the chip, a tensile stress test is performed on the bonding strength between the film layers of the wafer sample 30 in advance. Currently, the method used to quantitatively measure the bonding strength between the film layers is a double cantilever beam test (DCB).

[0077] Please refer to Figure 1 As shown, Figure 1 Schematic diagram of the structure of the wafer sample before tensile stress testing.

[0078] The wafer sample 30 may include a first film layer 31 and a second film layer 32 stacked on each other, and under the action of a certain external force, the first film layer 31 and the second film layer 32 in the wafer sample 30 will be separated from each other. The external force is the maximum tensile stress that the film layers of the wafer sample 30 can withstand.

[0079] In order to improve the accuracy of the measurement result, the wafer sample 30 is usually cut into a standard size (such as 60*3*1.5 mm).

[0080] Please refer to Figure 2-Figure 3 As shown, Figure 2 It is a schematic diagram of the structure of the connecting parts before polishing in the related technology. Figure 3 This is a cross-sectional view of a connecting piece connecting a wafer sample before polishing in the related art.

[0081] Before the tensile stress test is performed, the two connectors 10 are respectively bonded and fixed on two opposite surfaces of the wafer sample 30 and disposed close to the end of the wafer sample 30 by using an adhesive layer 20 (eg, AB adhesive layer).

[0082] The connector 10 includes a bearing portion 11 and a connecting portion 12. The bearing portion 11 is a rectangular block structure. Specifically, the length dimension (L) of the bearing portion 11 may be 4 mm, the width dimension (D) of the bearing portion 11 may be 2.53 mm, and the height dimension (H) of the bearing portion 11 may be 4 mm.

[0083] The connecting portion 12 is perpendicularly connected to one side of the carrying portion 11 along the width direction of the carrying portion 11 , and a through hole 102 is formed in the connecting portion 12 along the length direction of the carrying portion.

[0084] The carrying portion 11 has a first surface 101 for carrying the wafer sample 30 . The first surface 101 is a surface of the carrying portion 11 disposed opposite to the connecting portion 12 .

[0085] like Figure 3-Figure 4 As shown, Figure 4 Schematic diagram of the structure when the wafer sample fails.

[0086] After the two connectors 10 are bonded to the wafer sample 30, the connector 10 is mounted on a tensile stress testing device (not shown) through the through hole 102 on the connecting portion 12. The tensile stress testing device is then started to apply a tensile force to the wafer sample 30 and acts on the end of the wafer sample 30 (such as Figure 3F), until the surfaces of the wafer sample 30 and the connecting member 10 bonded to each other are deformed in directions away from each other until the first film layer 31 of the wafer sample 30 is separated from the second film layer 32 of the wafer sample 30 (as shown in FIG. Figure 4 As shown in the figure), the value measured by the tensile stress testing equipment is the maximum tensile stress that the film layers of the wafer sample 30 can withstand. The test personnel can judge the bonding strength between the film layers of the wafer 30 to be tested based on the tensile stress value.

[0087] After the tensile stress test of the wafer sample 30 is completed, the wafer sample 30 needs to be removed from the connector 10 and the first surface 101 of the carrier portion 11 needs to be polished to remove the adhesive layer 20 adhering to the carrier portion 11, so that the first surface 101 of the carrier portion 11 is smooth in preparation for the next time when another wafer sample 30 is bonded and fixed to the first surface 101 of the carrier portion 11 with the adhesive layer 20.

[0088] like Figure 5-Figure 6 As shown, Figure 5 It is a schematic diagram of the structure of the polished connector in the related art. Figure 6 It is a cross-sectional view of a polished connector-connected wafer sample in the related art.

[0089] After many tests, it was found that the size of the bearing part 11 along its width direction would be reduced by about 1.36mm each time after grinding. Based on the above-mentioned structural shape of the connector 10, its bearing part 11 can be ground about 6 times, that is, the connector 10 with this structural shape can be used for tensile stress test about 7 times. In other words, the thickness of the bearing part 11 will gradually decrease after grinding, resulting in a limited number of grinding times for the connector 10, resulting in a low consumables utilization rate of the connector 10. Therefore, how to improve the consumables utilization rate of the connector 10 has become an urgent problem to be solved.

[0090] It should be noted that the sample to be tested can be but is not limited to the above-mentioned wafer sample 30, the sample to be tested can be all samples that need to be subjected to tensile stress testing, the adhesive layer 20 can be but is not limited to the above-mentioned AB adhesive layer, and the adhesive layer 20 can be all adhesive layers that can achieve a fixed connection between the sample to be tested and the connector 10.

[0091] To solve the above technical problems, please refer to Figure 7-Figure 12 As shown, the first aspect of the present application proposes a connector 100 that can effectively improve the consumable material utilization rate of the connector 100 to significantly reduce production costs.

[0092] The connecting member 100 is used to connect to the sample to be tested 300 and to detect the tensile stress of the sample to be tested 300. The connecting member 100 includes a connecting portion 110 and a mounting portion 120. The connecting portion 110 includes a plurality of bearing surfaces 111. Each bearing surface 111 can be used to bear the sample to be tested 300. The mounting portion 120 is at least partially located between all the bearing surfaces 111, and an extension direction of the mounting portion 120 includes a component parallel to any bearing surface 111.

[0093] Based on the connector 100 of the embodiment of the present application, a plurality of bearing surfaces 111 are provided on the connecting portion 110 of the connector 100, and each bearing surface 111 can be used to connect with the sample 300 to be tested for tensile stress testing. Compared with the connector 10 in the related art in which only one bearing surface (i.e., the first surface 101) is provided for the sample 300 to be tested to be connected for tensile stress testing, after the improvement, the plurality of bearing surfaces 111 on the connecting portion 110 of the same connector 100 can be switched for use, which increases the number of times the same connector 100 can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connector 100 and achieving the purpose of significantly reducing production costs.

[0094] Please refer to Figure 7-Figure 8 As shown, Figure 7 This is a structural schematic diagram of a case where the mounting portion of the connector in one embodiment of the present application is a mounting hole. Figure 8 This is a structural schematic diagram of a case where the mounting portion of a connector in an embodiment of the present application is a convex column.

[0095] The connecting member 100 includes a connecting portion 110 and a mounting portion 120 .

[0096] The connecting part 110 is a component of the connecting member 100 for carrying the sample 300 to be tested. The connecting member 100 includes multiple (two or more) carrying surfaces 111. Each carrying surface 111 can be used to carry the sample 300 to be tested. In other words, the carrying surface 111 is a surface on the connecting part 110 for connecting with the sample 300 to be tested. The sample 300 to be tested can be fixedly connected to the carrying surface 111 of the connecting part 110 through the connecting adhesive layer 200. Specifically, the connecting adhesive layer 200 can be but is not limited to AB adhesive. It should be noted that the specific shape of the carrying surface 111 is not limited here. For example, the carrying surface 111 can be a regular polygon or an irregular polygon.

[0097] The mounting portion 120 serves as a connecting structure in the connector 100 for connecting to a test device (described below). The mounting portion 120 is at least partially located between all the bearing surfaces 111, and an extension direction of the mounting portion 120 includes a component parallel to any bearing surface 111, that is, the extension direction of the mounting portion 120 is not perpendicular to any bearing surface 111 on the connecting portion 110.

[0098] It is understandable that the mounting portion 120 is a connection structure in the connector 100 for connecting to the test equipment. The specific structure of the mounting portion 120 and the specific connection method between the mounting portion 120 and the test equipment can be but are not limited to the following embodiments.

[0099] like Figure 7 As shown, for example, in one embodiment, the mounting portion 120 is a mounting hole that passes through the connecting portion 110. At this time, the mounting portion 120 is completely located between all the bearing surfaces 111. The connector 100 is connected to the test equipment via the mounting hole. Specifically, the mounting hole is a circular hole, and the hole axis of the mounting hole can coincide with the center line of the connecting portion 110. The test equipment has a mounting position that matches the connector 100, and is connected to the connector 100 via the mounting hole. It should be noted that when the mounting portion 120 is a mounting hole that passes through the connecting portion 110, the above-mentioned "extension direction" is the extension direction of the mounting hole. In this design, by designing the mounting portion 120 as a mounting hole that passes through the connecting portion 110, the connector 100 can be rotated relative to the test equipment to adjust the bearing surface 111 connected to the sample 300 to be tested, and realize the connection with the test equipment through the mounting hole, which reduces the difficulty of switching the bearing surface 111 of the connecting portion 110.

[0100] like Figure 8 As shown, for example, in one embodiment, the mounting portion 120 is a convex column that passes through the connecting portion 110 and has both ends extending to the outside of the connecting portion 110. At this time, the portion of the mounting portion 120 that passes through the connecting portion 110 is located between all the bearing surfaces 111, and the connector 100 is connected to the test equipment via both ends of the convex column. Specifically, the cross-section of the convex column is circular, and the test equipment has a mounting position that matches the connecting portion 100, and is connected to the connecting portion 100 via the end of the convex column. It should be noted that when the mounting portion 120 is a convex column that passes through the connecting portion 110, the above-mentioned "extension direction" is the axial direction of the convex column. In this design, by designing the mounting portion 120 as a convex column, the connector 100 can be rotated relative to the test equipment to adjust the bearing surface 111 connected to the sample 300 to be tested, and the connection with the test equipment is realized through the convex column, which also reduces the difficulty of switching the bearing surface 111 of the connecting portion 110.

[0101] In order to reduce the overall processing difficulty of the connector 100, in some embodiments, the connecting portion 110 and the mounting portion 120 are integrally formed. For example, when the mounting portion 120 is a mounting hole that passes through the connecting portion 110 or is a convex column that passes through the connecting portion 110, the connecting portion 110 and the mounting portion 120 can be integrally formed by mold injection molding. The connecting portion 110 and the mounting portion 120 can also be integrally formed by 3D printing.

[0102] Considering that the material of the connector 100 determines the manufacturing cost of a single connector 100 to a certain extent, in order to reduce the manufacturing cost of a single connector 100 while ensuring the supporting strength of the connector 100 for the sample 300 to be tested, in some embodiments, the material of the connecting portion 110 is one of aluminum, magnesium, and titanium, or any alloy thereof. In this design, by designing the material of the connecting portion 110 to be one of aluminum, magnesium, and titanium, or any alloy thereof, on the one hand, the supporting strength of the connector 100 for the sample 300 to be tested can be ensured, and on the other hand, the price of materials such as aluminum, magnesium, and titanium is cheap, which further reduces the production cost of the connector 100.

[0103] Please refer to Figure 9-10 As shown, Fig. 9 This is a schematic diagram of the structure when the bearing surfaces on the connecting part in one embodiment of the present application are connected end to end in sequence. Fig.10 This is a schematic diagram of a structure in which the bearing surface and the connecting surface on the connecting portion of an embodiment of the present application are connected alternately in sequence. Fig.11 This is a cross-sectional view of a polished connector connected to a sample to be tested in one embodiment of the present application. Fig.12 This is a cross-sectional view of a polished connector connected to a sample to be tested in one embodiment of the present application.

[0104] It is understandable that the arrangement of the multiple bearing surfaces 111 on the connecting portion 110 on the connecting portion 110 may be, but is not limited to, the following embodiments.

[0105] like Fig. 9 As shown, for example, in one embodiment, a plurality of bearing surfaces 111 are sequentially connected end to end on the connecting portion 110. In this design, by designing the arrangement of the plurality of bearing surfaces 111 on the connecting portion 110 to be sequentially connected end to end, on the one hand, the difficulty of processing the plurality of bearing surfaces 111 on the connecting portion 110 of the connector 100 is reduced, and on the other hand, the switching of the bearing surfaces 111 of the connecting portion 110 can be realized every time the connecting portion 110 rotates a certain angle, thereby reducing the difficulty of switching the bearing surfaces 111 of the connecting portion 110.

[0106] like Fig.10As shown, for example, in one embodiment, the connection portion 110 further includes a plurality of connection surfaces 112, and the plurality of connection surfaces 112 and the plurality of bearing surfaces 111 are sequentially staggered and connected on the connection portion 110, that is, each bearing surface 111 is connected to and only connects to two connection surfaces 112. In this design, by designing the arrangement of the plurality of connection surfaces 112 and the plurality of bearing surfaces 111 on the connection portion 110 to be sequentially staggered and connected, after the mutually staggered bearing surfaces 111 are polished for multiple times, the connection surface 112 connecting two adjacent bearing surfaces 111 on the connection portion 110 may be completely polished off, and eventually the connection portion 110 may be polished into a situation where the plurality of bearing surfaces 111 are sequentially connected, and at this time, the connection piece 110 can continue to be used to connect the sample 300 to be tested for tensile stress testing, further improving the consumable utilization rate of the connection piece 100, so as to further reduce the production cost.

[0107] Furthermore, when multiple bearing surfaces 111 are connected end to end on the connecting portion 110, it is considered that the number of bearing surfaces 111 determines the consumable utilization rate of the connecting member 100 to a certain extent. For example, under the condition that the production cost of a single connecting member 100 is kept roughly unchanged, the more bearing surfaces 111 there are on the connecting portion 110, the higher the consumable utilization rate of the connecting member 100 may be. In order to improve the consumable utilization rate of the connecting member 100, as Fig. 9 As shown, in one embodiment, the plurality of bearing surfaces 111 include a first bearing surface 1111 and a second bearing surface 1112 opposite to each other, and a third bearing surface 1113 and a fourth bearing surface 1114 opposite to each other, each of the third bearing surface 1113 and the fourth bearing surface 1114 intersects with the first bearing surface 1111 and the second bearing surface 1112, that is, the four bearing surfaces 111 are sequentially connected end to end to form a connection portion 110 of a "tetrahedron" structure. In this design, by arranging four bearing surfaces 111 on the connection portion 110, that is, the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114, the four bearing surfaces 111 can all be used to connect with the sample 300 to be tested, and each bearing surface 111 can be used for at least one tensile stress test, so that one connector 100 can be used for at least four tensile stress tests, which greatly improves the consumable utilization rate of the connector 100 and greatly reduces the production cost.

[0108] Of course, if Figure 7-Figure 8 As shown, in one embodiment, the number of the bearing surfaces 111 on the connecting portion 110 can also be eight, and the eight bearing surfaces 111 are connected end to end in sequence to form a connecting portion 110 with an "octahedron" structure, and each bearing surface 111 can be polished at least once, that is, the connecting component 100 of this structure can provide at least eight tensile stress tests for the sample 300 to be tested.

[0109] Furthermore, when the plurality of bearing surfaces 111 include a first bearing surface 1111, a second bearing surface 1112, a third bearing surface 1113, and a fourth bearing surface 1114, it is considered that the angle between two adjacent bearing surfaces 111 determines the processing difficulty of the connection portion 110 to a certain extent. For example, the smaller the angle between two adjacent bearing surfaces 111, the greater the processing difficulty of the connection portion 110. In order to reduce the processing difficulty of the connection portion 110, as Fig. 9 As shown, in one embodiment, the first bearing surface 1111 and the second bearing surface 1112 are parallel to each other, the third bearing surface 1113 and the fourth bearing surface 1114 are parallel to each other, and the third bearing surface 1113 is perpendicular to the first bearing surface 1111, that is, in the plane where the layout direction M of the bearing surface 111 is located, the cross section formed by the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114 are square. In this design, by designing the first bearing surface 1111 and the second bearing surface 1112 that are opposite to each other to be parallel to each other, the third bearing surface 1113 and the fourth bearing surface 1114 to be parallel to each other, and the third bearing surface 1113 is perpendicular to the first bearing surface 1111, the connecting portion 110 is a rectangular block structure, which further reduces the processing difficulty of the connecting portion 110.

[0110] Of course, in one embodiment, the angle between the first bearing surface 1111 and the third bearing surface 1113 is an acute angle. Specifically, the acute angle can be 60 degrees. That is to say, in the plane where the layout direction M of the bearing surface 111 is located, the cross-section formed by the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114 is a parallelogram.

[0111] like Fig. 9As shown, it can be understood that the size of the bearing surface 111 of the connecting portion 110 also determines the consumable utilization rate of the connecting member 100 to a certain extent. For example, the larger the size of the bearing surface 111 of the connecting portion 110, the lower the consumable utilization rate of the connecting member 100 may be. Under the condition of ensuring that the production cost of a single connecting member 100 remains roughly unchanged, in order to further improve the consumable utilization rate of the connecting member 100, in some embodiments, the spacing between the first bearing surface 1111 and the second bearing surface 1112 is a1, and a1 satisfies the conditional formula: 2.0≤a1≤8.0mm, and / or the spacing between the third bearing surface 1113 and the fourth bearing surface 1114 is a2, and a2 satisfies the conditional formula: 2.0≤a2≤8.0mm. For example, the value of the spacing a1 can be 3mm, 5mm or 7mm, and the value of the spacing a2 can be 2mm, 3mm, 4mm, 5mm, 6mm or 7mm, and the value of the spacing a1 can be equal to or unequal to the value of the spacing a2. In this design, when the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112, and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 meet the above conditional expression, when the connecting portion 110 has multiple bearing surfaces 111, the consumables utilization rate of the connecting member 100 is optimized, thereby greatly reducing the production cost; when the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112, and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 exceed the lower limit of the above conditional expression, the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112, and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 are too small, although the connecting portion 110 has multiple bearing surfaces 111, the bearing surfaces 111 of the connecting portion 110 are too small. The number of times the bearing surface 111 can be used for tensile stress testing is relatively small, resulting in a still low utilization rate of consumables of the connector 110, which is not conducive to reducing production costs; when the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112 and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 exceed the upper limit of the above conditional expression, the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112 and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 are too large. Although the connecting portion 110 has multiple bearing surfaces 111 and each bearing surface 111 of the connecting portion 110 can be used for tensile stress testing a large number of times, the size of each bearing surface 111 of the connecting portion 110 is too large, far exceeding the size of the sample 300 to be tested, resulting in a waste of material of the connector 100.

[0112] Specifically, when the connection portion 110 includes the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114, in one embodiment, the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112 is equal to 5 mm, and the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114 is equal to 5 mm. In this design, by reasonably setting the spacing a1 between the first bearing surface 1111 and the second bearing surface 1112, and reasonably setting the spacing a2 between the third bearing surface 1113 and the fourth bearing surface 1114, when a1=5 mm and a2=5 mm, it can be ensured that the bearing surfaces 111 on the connection portion 110 can be used for tensile stress more times, and it can be ensured that the size of the bearing surfaces 111 on the connection portion 110 will not cause waste of the material of the connection member 100.

[0113] When the mounting portion 120 is a mounting hole that penetrates the connecting portion 110, it is considered that the distance between each bearing surface 111 on the connecting portion 110 and the outer tangent surface of the mounting hole also plays a decisive role in the number of times the connecting member 100 can be polished. For example, the larger the distance between the bearing surface 111 and the outer tangent surface of the mounting hole, the more times the connecting member 100 can be polished, that is, the higher the consumable utilization rate of the connecting member 100. In order to increase the number of times the connecting member 100 can be polished and improve the consumable utilization rate of the connecting member 100, such as Fig.11As shown, in some embodiments, the hole axis of the mounting hole is parallel to the first bearing surface 1111, and along the direction perpendicular to the first bearing surface 1111, the spacing between the outer tangent surface of the mounting hole parallel to and adjacent to the first bearing surface 1111 and the first bearing surface 1111 is c (that is, the difference between the spacing between the hole axis of the mounting hole and the first bearing surface 1111 and the hole radius of the mounting hole is c), and c satisfies the conditional formula: 0.8mm≤c≤3.2mm. For example, the value of the spacing c can be 1.5mm, 2.2mm or 2.9mm, etc. In this design, by reasonably setting the spacing c between the first bearing surface 1111 and the outer tangent surface of the mounting hole, and the larger the c, the more times the first bearing surface 1111 can be used for tensile stress testing, when the spacing c between the first bearing surface 1111 and the outer tangent surface of the mounting hole satisfies the above conditional expression, it can effectively ensure that the first bearing surface 1111 of the connecting portion 110 can be used for tensile stress testing more times, so that the consumables utilization rate of the connecting member 100 is optimal, thereby greatly reducing the production cost; when the spacing c between the first bearing surface 1111 and the outer tangent surface of the mounting hole When the lower limit of the above conditional expression is exceeded, the first bearing surface 1111 of the connecting portion 110 can be used for a smaller number of tensile stress tests, resulting in a still low utilization rate of consumables of the connecting component 100, which is not conducive to reducing production costs; when the spacing c between the first bearing surface 1111 and the circumscribed surface of the mounting hole exceeds the upper limit of the above conditional expression, although the first bearing surface 1111 of the connecting portion 110 can be used for a larger number of tensile stress tests, the size of the first bearing surface 1111 of the connecting portion 110 is too large, far exceeding the size of the sample 300 to be tested, resulting in a waste of material of the connecting component 100.

[0114] Specifically, in one embodiment, the spacing c between the outer tangent surface of the mounting hole that is parallel to and adjacent to the first bearing surface 1111 and the first bearing surface 1111 is 1.8 mm. In this design, by reasonably setting the value of the spacing c, when c=1.8 mm, it can be effectively ensured that each bearing surface 111 on the connecting portion 110 can be used for tensile stress more times.

[0115] Please refer to Figure 13-Figure 16 As shown, the second aspect of the present application proposes a testing device 400 , which can test the tensile stress of the sample 300 to be tested by means of the above-mentioned connecting member 100 , and greatly reduces the consumable utilization rate of the connecting member 100 .

[0116] like Figure 13-14 As shown, Fig.13 This is a schematic diagram of the exploded structure of a testing device in one embodiment of the present application. Fig.14 This is a structural schematic diagram of a connecting column in an embodiment of the present application being plugged into a plug hole at the clamping end. Fig.15 This is a cross-sectional view of a sample to be tested in one embodiment of the present application after being bonded to the bearing surface of the connecting member via a connecting adhesive layer. Fig.16 It is a structural schematic diagram of a connecting member installed in a fixture to detect the tensile stress of a sample to be tested in one embodiment of the present application.

[0117] The testing device 400 includes a fixture 410 and connectors 100 , at least one of the connectors 100 is the above-mentioned connector 100 , and is detachably connected to the fixture 410 through the mounting portion 120 of the connector 100 .

[0118] Based on the test equipment 400 in the embodiment of the present application, the test equipment 400 has the above-mentioned connecting member 100, the connecting member 100 has multiple bearing surfaces 111, and is detachably connected to the fixture 410 through the mounting portion 120, and the bearing surface 111 connected to the sample 300 to be tested can be switched by rotation, so that each bearing surface 111 on the connecting portion 110 can be used for tensile stress testing, thereby improving the consumable utilization rate of the connecting member 100 and achieving the purpose of reducing production costs; the detachable connection between the connecting member 100 and the fixture 410 of the test equipment 400 facilitates the replacement of the scrapped connecting member 100, thereby enhancing the practicality of the test equipment 400.

[0119] The number of connecting members 100 may be one or more (two or more). When the number of connecting members 100 is one, the connecting member 100 is the above-mentioned connecting member 100 with multiple bearing surfaces 111. When the number of connecting members 100 is multiple, at least one connecting member 100 among the multiple connecting members 100 is the above-mentioned connecting member 100 with multiple bearing surfaces 111, and the remaining connecting members 100 may be connecting members 100 in the related art.

[0120] The number of the clamps 410 may be one or more. Of course, no matter how many the clamps 410 are, one clamp 410 is used to connect with the same connector 100 .

[0121] Considering that there may be many intermediate connection structures for realizing the detachable connection between the connector 100 and the fixture 410, for example, the connector 100 and the fixture 410 may be detachably connected by a certain snap-on structure, in order to facilitate the detachable connection between the connector 100 and the fixture 410 when testing a large number of samples 300 to be tested, in some embodiments, the test device 400 further includes a connection column 420, the mounting portion 120 of the connector 100 is a mounting hole that penetrates the connecting portion 110, and the connection column 420 is plugged in with the mounting hole of the connector 100 to realize the relative fixation of the position between the connector 100 and the fixture 410, that is, the connector 100 realizes the detachable connection with the fixture 410 by plugging and unplugging the connection column 420 and the mounting hole. In this design, the relative fixation of the position between the connector 100 and the fixture 410 is realized by plugging and unplugging the connection column 420 and the mounting hole, which greatly reduces the difficulty of installation and removal between the connector 100 and the fixture 410.

[0122] like Figure 13-14 As shown, it can be understood that the fixture 410 is equivalent to a carrier for carrying the connector 100. For connectors 100 of different structural shapes, the specific structure of the fixture 410 will also be different, such as the size of the fixture 410. In some embodiments, the fixture 410 includes a clamp 411 that is detachably connected to the test device 400, and the clamp 411 includes clamping ends 4111 arranged opposite to each other, each of the two clamping ends 4111 is provided with a plug hole 41111, and the connector 100 is located between the two clamping ends 4111. The connecting column 420 passes through each plug hole 41111 in the two clamping ends 4111 and the mounting hole of the connecting portion 110. That is, the connector 100 0 is clamped between the two clamping ends 4111 of the clamping head 411, so that the mounting hole of the connecting member 100 is located between the two plugging holes 41111 of the two clamping ends 4111, and the hole axis of the mounting hole is colinear with the hole axis of the plugging hole 41111, and the connecting column 420 sequentially passes through the plugging hole 41111 on one of the clamping ends 4111, and after passing through the mounting hole on the connecting member 100, it passes through the plugging hole 41111 of the other clamping end 4111. Specifically, the plug hole 41111 on the clamping end 4111 is a round hole, and the hole cross-sectional area of ​​the plug hole 41111 on the clamping end 4111 is equal to the hole cross-sectional area of ​​the mounting hole of the connector 100. The material of the connecting column 420 can be resin or rubber. The connecting column 420 and the plug hole 41111 on the clamping end 4111 and the mounting hole on the connector 100 can be interference-fitted to achieve the relative fixation of the position between the connector 100 and the clamp 411, and the installation and removal of the connector 100 and the clamp 411 can be achieved by plugging and unplugging the connecting column 420. This design enhances the connection stability between the connector 100 and the clamp 410.

[0123] like Figure 15-16 As shown, specifically, in one embodiment, the clamp 410 includes a first clamp 410a and a second clamp 410b, the first clamp 410a and the second clamp 410b are arranged opposite to each other, the connecting member 100 includes a first connecting member 100a and a second connecting member 100b, the connecting column 420 includes a first connecting column 420a and a second connecting column 420b, and the first connecting column 420a is used to achieve the relative fixation of the position between the first connecting member 100a and the first clamp 410a, and the second connecting column 420b is used to achieve the relative fixation of the position between the second connecting member 100b and the second clamp 410b, wherein at least one of the multiple bearing surfaces 111 in the first connecting member 100a can be located at the first connecting column 420a away from the second connecting column 420a. On one side of the connecting post 420b, at least one of the multiple bearing surfaces 111 in the second connecting member 100b can be located on the side of the second connecting post 420b away from the first connecting post 420a, that is, before the next tensile stress test, another sample 300 to be tested can be connected with the bearing surface 111 of the first connecting member 100a located on the side of the first connecting post 420a away from the second connecting post 420b during the previous tensile stress test, and the other sample 300 to be tested can be connected with the bearing surface 111 of the second connecting member 100b located on the side of the second connecting post 420b away from the first connecting post 420a during the previous tensile stress test, thereby realizing the switching of the connection between different bearing surfaces 111 of the same connecting member 100 and the sample 300 to be tested. In this design, the sample 300 to be tested is connected between two mutually adjacent bearing surfaces 111 of the first connecting member 100a and the second connecting member 100b. The first connecting member 100a is fixed to the first fixture 410a through the first connecting column 420a, and the second connecting member 100b is fixed to the second fixture 410b through the second connecting column 420b. Since the first connecting member 100a and the second connecting member 100b both include a plurality of bearing surfaces 111, and the plurality of bearing surfaces 111 are arranged around the hole axis of the mounting hole, after the first connecting member 100a and the second connecting member 100b are installed, the plurality of bearing surfaces 111 in the first connecting member 100a are At least one of the surfaces 111 is located on the side of the first connecting column 420a away from the second connecting column 420b. Similarly, at least one of the multiple bearing surfaces 111 in the second connecting member 100b is located on the side of the second connecting column 420b away from the first connecting column 420a. Therefore, the first connecting member 100a and the second connecting member 100b can be rotated around the direction of the hole axis of their respective mounting holes to realize the switching of different bearing surfaces 111, so as to facilitate the connection of other samples 300 to be tested, increase the number of times the same connecting member 100 can be used for tensile stress testing, thereby improving the utilization rate of consumables of the connecting member 100 and achieving the purpose of significantly reducing production costs.

[0124] Please refer to Figure 17-Figure 20 As shown, the third aspect of the present application proposes a wafer testing method, through which the maximum tensile stress that each wafer sample can withstand can be measured. Of course, it can be understood that the wafer testing method is only a testing method for testing the tensile stress of a wafer sample.

[0125] like Fig.17 As shown, Fig.17 The present invention is a flowchart of a wafer testing method in one embodiment of the present invention.

[0126] The wafer testing method may include the following steps: S220.

[0127] Step S220 , testing the tensile stress of the wafer sample by using the above-mentioned testing equipment 400 .

[0128] Specifically, in step S220, after the above-mentioned testing equipment 400 is started, the testing equipment 400 applies a pulling force to the wafer sample from both sides of the wafer sample. The pulling force acts at the connection between the connector 100 and the wafer sample. The direction of the pulling force is perpendicular to the surface of the wafer sample and points back to the wafer sample.

[0129] In this design, compared with the related art of using the same supporting surface 111 of the same connector 100 to connect wafer samples, by switching the multiple supporting surfaces 111 on the same connector 100, the number of times the connector 100 is used for tensile stress testing is increased, thereby greatly improving the consumables utilization rate of the connector 100.

[0130] like Fig.18 As shown, Fig.18 This is a flow chart of a wafer testing method in another embodiment of the present application.

[0131] Of course, the testing method may also include the following steps: S340 and S360.

[0132] Step S340 , removing the wafer sample from one of the plurality of carrying surfaces 111 .

[0133] Step S360 , connecting another wafer sample to another carrying surface 111 among the plurality of carrying surfaces 111 .

[0134] In this design, different bearing surfaces 111 on the connector 100 are connected to the wafer sample for tensile stress testing, thereby improving the efficiency of the tensile stress test of the wafer sample.

[0135] Specifically, “a bearing surface among the multiple bearing surfaces” here should be understood as the bearing surface 111 on the connector 100 used for connecting with the wafer sample in the last or last tensile stress test.

[0136] In step S340 , the connection adhesive layer 200 (described above) between the wafer sample and the connector 100 may be melted by hot melting to remove the wafer sample after the tensile stress test from the supporting surface 111 of the connector 100 .

[0137] In step S360, the wafer sample is connected to a bearing surface 111 on the connector 100 that is different from the bearing surface 111 of the previous tensile stress test, that is, the bearing surface 111 of the connector 100 is replaced to be connected to another wafer sample for tensile stress testing.

[0138] like Fig.19 As shown, Fig.19 This is a flow chart of a wafer testing method in yet another embodiment of the present application.

[0139] It is understandable that after testing the tensile stress of the wafer sample, in order to ensure the normal testing of other wafer samples, the tested wafer sample needs to be removed from the connector 100, and in order to facilitate the same bearing surface 111 of the same connector 100 to be used for tensile stress testing of wafer samples multiple times, so as to further improve the consumables utilization rate of the connector 100, the testing method can also include the following steps: S440, S460 and S480.

[0140] Step S440 , removing the wafer sample from one of the plurality of carrying surfaces 111 .

[0141] In step S460 , a carrying surface 111 among the plurality of carrying surfaces 111 from which the wafer sample is removed is processed.

[0142] In step S480 , another wafer sample is connected to a carrying surface 111 among the processed carrying surfaces 111 .

[0143] In this design, the carrying surface 111 that has been subjected to the tensile stress test is processed to make the surface of the carrying surface 111 smooth so that another wafer sample can be connected to the same carrying surface 111 on the connector 100, that is, one carrying surface 111 can be used for multiple tensile stress tests to further improve the consumables utilization rate of the connector 100.

[0144] Specifically, “a bearing surface among the multiple bearing surfaces” here should be understood as the bearing surface 111 on the connector 100 used for connecting with the wafer sample in the last or last tensile stress test.

[0145] In step S440 , the connection adhesive layer 200 (described above) between the wafer sample and the connector 100 may be melted by hot melting to remove the wafer sample after the tensile stress test from the supporting surface 111 of the connector 100 .

[0146] In step S460, the bearing surface 111 connected to the wafer sample can be processed immediately after the tensile stress test is completed, or the bearing surface 111 connected to the wafer sample can be processed before the next tensile stress test. There is no limitation on the specific step before which the bearing surface 111 connected to the wafer sample is processed, as long as it does not affect the normal tensile stress test of the wafer sample.

[0147] In step S460 , the carrying surface 111 connected to the wafer sample may be processed by grinding, so that the adhesive layer adhering to the carrying surface 111 is ground off, thereby making the carrying surface 111 smooth for connection with another wafer sample.

[0148] In step S480, another (new) wafer sample is connected to the same bearing surface 111 on the connector 100 as that of the previous tensile stress test, that is, the bearing surface 111 of the connector 100 is not replaced to be connected to another wafer sample and used for the tensile stress test. Of course, the tensile stress test can be the next round of test immediately after the previous round of tensile stress test, or it can be the next round of test after a few rounds of intervals from the previous round of tensile stress test.

[0149] like Fig. 20 As shown, Fig. 20 This is a flow chart of a wafer testing method in yet another embodiment of the present application.

[0150] It is understandable that, for the entire tensile stress test process of the wafer sample, it is also necessary to consider the operation processes such as the installation between the wafer sample and the connector 100, the installation between the connector 100 and the fixture 410, and the disassembly between the connector 100 and the fixture 410. The test device 400 also includes a connecting column 420, and the fixture 410 includes a chuck 411 detachably connected to the test device 400. The chuck 411 includes two oppositely arranged clamping ends 4111, and the two clamping ends 4111 are provided with plug holes 41111. The test method may also include the following steps:

[0151] Step S510 , bonding two opposite surfaces of the wafer sample to the bearing surfaces 111 of the two connecting members 100 respectively by adhesive.

[0152] Step S520 , clamping the connecting member 100 between the two clamping ends 4111 .

[0153] In step S530 , the connecting column 420 is passed through one of the inserting holes 41111 and out of the other inserting hole 41111 via the mounting portion 120 , so that the carrying surfaces 111 bonded with the wafer samples are arranged facing each other.

[0154] Step S550 , after the test is completed, the connecting column 420 is pulled out from the plug hole 41111 to remove the connecting member 100 from the fixture 410 .

[0155] In this design, the wafer sample is bonded from the two opposite supporting surfaces 111 of the wafer sample through two connecting parts 100, and the two connecting parts 100 are fixed one by one to the two chucks 411 of the two clamps 410 through two connecting columns 420. Each connecting column 420 is plugged into and matched with the plug hole 41111 of the clamping end 4111 of the corresponding chuck 411 and the mounting hole of the connecting part 100 to achieve installation between each connecting part 100 and the corresponding chuck 411, and disassembly between each connecting part 100 and the corresponding chuck 411 is achieved by pulling out the connecting column 420. The operation is simple, convenient and fast.

[0156] Specifically, in step S510 , an AB adhesive layer is coated on one of the bearing surfaces 111 of the two connecting members 100 , and then two oppositely disposed surfaces of the wafer sample are respectively bonded to the bearing surfaces 111 of the two connecting members 100 coated with the AB adhesive layer.

[0157] In step S520, the two connecting parts 100 are clamped one by one on the two chucks 411 of the two clamps 410, that is, each connecting part 100 is clamped between the two clamping ends 4111 of the corresponding chuck 411, so that the hole axis of the mounting hole of each connecting part 100 and the hole axis of the plug-in hole 41111 of the corresponding two clamping ends 4111 are on the same straight line.

[0158] In step S530, two connectors 100 are fixed one by one to two chucks 411 of two clamps 410 through two connecting columns 420, that is, each connecting column 420 is plugged into and matched with the plug hole 41111 of the clamping end 4111 of the corresponding chuck 411 and the mounting hole of the connector 100, so as to realize the installation between each connector 100 and the corresponding chuck 411, so that after the two connectors 100 are fixed on the corresponding two clamps 410, the carrying surfaces 111 of the two connectors 100 with the wafer samples bonded thereto are arranged to face each other.

[0159] In step S550 , the two connecting columns 420 are pulled out from the corresponding plug holes 41111 of the clamping ends 4111 and the mounting holes of the connector 100 , and the two connectors 100 are removed from the corresponding two clamps 411 to achieve disassembly between the connector 100 and the clamp 410 .

[0160] It should be noted that, obviously, step S510 and step S520 are for installing the connector 100 and the fixture 510, and step S530 and step S550 are for disassembling the connector 100 and the fixture 410, so step S510 and step S520 should be arranged before step S530 and step S550.

[0161] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0162] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A connector, used to connect with a sample to be tested and to detect the tensile stress of the sample to be tested, characterized in that: The connecting piece comprises: A connecting portion, comprising a plurality of bearing surfaces, each of which can be used to bear the sample to be tested, wherein the sample to be tested is a wafer sample; and The mounting portion is at least partially located between all the bearing surfaces, and the extending direction of the mounting portion includes a component parallel to any of the bearing surfaces.

2. The connector according to claim 1, characterized in that The mounting portion is a mounting hole that passes through the connecting portion.

3. The connector according to claim 1, characterized in that: The multiple bearing surfaces are sequentially connected end to end on the connecting portion; or The connecting portion further comprises a plurality of connecting surfaces, and the plurality of connecting surfaces are sequentially and staggeredly connected with the plurality of bearing surfaces on the connecting portion.

4. The connector according to claim 1, characterized in that The plurality of bearing surfaces include a first bearing surface and a second bearing surface opposite to each other, and a third bearing surface and a fourth bearing surface opposite to each other, and each of the third bearing surface and the fourth bearing surface intersects with the first bearing surface and the second bearing surface.

5. The connector according to claim 4, characterized in that The first bearing surface and the second bearing surface are parallel to each other, the third bearing surface and the fourth bearing surface are parallel to each other, and the third bearing surface is perpendicular to the first bearing surface.

6. The connecting piece according to claim 5, characterized in that: The distance between the first bearing surface and the second bearing surface is a1, and a1 satisfies the condition: 2.0≤a1≤8.0mm; and / or The distance between the third bearing surface and the fourth bearing surface is a2, and a2 satisfies the condition: 2.0≤a2≤8.0mm.

7. The connector according to claim 6, characterized in that The distance a1 between the first bearing surface and the second bearing surface is equal to 5 mm; The distance a2 between the third bearing surface and the fourth bearing surface is equal to 5 mm.

8. The connector according to claim 4, characterized in that The mounting portion is a mounting hole that passes through the connecting portion, and the hole axis of the mounting hole is parallel to the first bearing surface. Along the direction perpendicular to the first bearing surface, the spacing between the outer tangential surface of the mounting hole parallel to and adjacent to the first bearing surface and the first bearing surface is c, and c satisfies the condition: 0.8mm≤c≤3.2mm.

9. A testing device, characterized in that: include: Fixtures; and Connectors, at least one of which is the connector according to any one of claims 1 to 8, and is detachably connected to the clamp through the mounting portion of the connector.

10. The test device according to claim 9, characterized in that The testing device also includes a connecting column, the mounting portion of the connecting member is a mounting hole that passes through the connecting portion, and the connecting column is plug-fitted with the mounting hole of the connecting member to achieve relative fixation of the position between the connecting member and the fixture.

11. The test device according to claim 10, characterized in that The clamp includes a clamp that can be detachably connected to the test equipment, the clamp includes two clamping ends arranged opposite to each other, each of the two clamping ends is provided with a plug hole, the connecting piece is located between the two clamping ends, and the connecting column passes through each of the plug holes in the two clamping ends and the mounting hole of the connecting part.

12. The testing device according to claim 10, characterized in that The clamp comprises a first clamp and a second clamp, and the first clamp and the second clamp are arranged opposite to each other; The connecting member includes a first connecting member and a second connecting member; The connecting column includes a first connecting column and a second connecting column, and the first connecting column is used to achieve relative fixation of the position between the first connecting member and the first clamp, and the second connecting column is used to achieve relative fixation of the position between the second connecting member and the second clamp; Among them, at least one of the multiple bearing surfaces in the first connecting member may be located on a side of the first connecting column away from the second connecting column, and at least one of the multiple bearing surfaces in the second connecting member may be located on a side of the second connecting column away from the first connecting column.

13. A wafer testing method, characterized in that: The test method comprises the following steps: The tensile stress of the wafer sample is tested by the testing equipment described in any one of claims 9 to 12.

14. The testing method according to claim 13, characterized in that: The following steps are also included: removing the wafer sample from a carrying surface among the plurality of carrying surfaces; Another wafer sample is connected to another carrying surface of the plurality of carrying surfaces.

15. The testing method according to claim 13, characterized in that: The following steps are also included: removing the wafer sample from one of the plurality of carrying surfaces; Processing a carrying surface among the plurality of carrying surfaces from which the wafer sample is removed; Another wafer sample is connected to a carrying surface among the processed carrying surfaces.

16. The testing method according to claim 13, characterized in that: The test device further comprises a connecting column, the fixture comprises a clamp detachably connected to the test device, the clamp comprises two clamping ends arranged opposite to each other, and the two clamping ends are provided with plug holes, and the test method further comprises the following steps: Bonding two opposite surfaces of the wafer sample to the bearing surfaces of the two connecting members respectively by adhesive; Clamp the connecting piece between the two clamping ends; Pass the connecting column through one of the plug holes and out of the other plug hole via the mounting portion, so that the carrying surfaces bonded with the wafer sample are arranged facing each other; After the test is completed, the connecting column is pulled out from the plug hole to remove the connecting member from the fixture.

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