A pin-adjustable silicon carbide power device package shell

Abstract

The application discloses a pin-adjustable silicon carbide power device packaging shell, which comprises a packaging shell, at least one insulating partition plate, at least two slide rail structures, at least two sliders and at least two device pins; the packaging shell is internally provided with a silicon carbide chip and is provided with a containing groove in the bottom; the insulating partition plate is horizontally fixed in the containing groove and is fixedly connected with both ends of the containing groove; the slide rail structure is located on the insulating partition plate and the sidewall of the containing groove or on one side of the insulating partition plate; the slider is slidably connected with the slide rail structure; the insulating partition plate separates the two sliders; and the slider is fixedly connected with the device pin. The device pin is connected with the slider, the slider can slide on the slide rail structure, therefore, the device pin connected with the slider can move on the bottom of the packaging shell, the position of the device pin can be adjusted, the use scene is expanded, various application environments and test conditions can be adapted, and the normal use of the device is not affected.

Description

Technical Field

[0001] The present invention belongs to the technical field of microelectronic equipment, and in particular relates to a pin-adjustable silicon carbide power device packaging shell. Background Art

[0002] In recent years, with the continuous advancement of microelectronics technology, the application of Si-based power electronic devices in extreme environments such as high temperature, high voltage, and high humidity has become increasingly limited. Silicon carbide (SiC), a representative third-generation semiconductor material, boasts a bandgap approximately three times that of silicon, a breakdown electric field eight times that of silicon, and a thermal conductivity three times that of silicon, significantly improving the withstand voltage and current density of SiC devices. Due to the differences in the properties of the two materials, the breakdown electric field of SiC is approximately ten times that of Si. Consequently, at the same breakdown voltage, the on-resistance is only 1 / 100 to 1 / 200 of that of Si devices. This significantly reduces conduction and switching losses in SiC devices, improving system efficiency while also making the devices more reliable in harsh environments such as high temperature, high power, and high humidity. Therefore, SiC devices can double the power, temperature, frequency, and radiation resistance of power electronic systems. Furthermore, SiC's higher thermal conductivity can significantly reduce the size and weight of the system's heat dissipation system, thereby achieving higher system efficiency. Therefore, SiC devices are not only widely used in traditional industrial fields such as DC and AC power transmission, uninterruptible power supplies, switching power supplies, industrial control, etc., but also have broad application prospects in new energy sources such as solar energy and wind energy.

[0003] Because SiC devices require fixed pins for different test equipment and application environments, a fixed pin sequence cannot adapt to various application environments and test conditions. This requires appropriate adjustments to test and application conditions, or the production of devices with a pin sequence tailored to the application, which consumes significant time and cost. Alternatively, the pins must be frequently bent to suit test and application conditions, impacting the package's structural strength and device stability. Summary of the Invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a pin-adjustable silicon carbide power device package. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] A pin-adjustable silicon carbide power device package shell comprises: a package shell, at least one insulating partition, at least two slide rail structures, at least two sliders and at least two device pins;

[0006] The packaging shell has a receiving groove at the bottom and a silicon carbide chip arranged inside;

[0007] The insulating partition is horizontally fixed in the receiving groove, and its two ends are fixedly connected to the two ends of the receiving groove;

[0008] The slide rail structure is located on the insulating partition and the side wall of the accommodating groove, or on one side of the insulating partition;

[0009] The slider is slidably connected to the slide rail structure;

[0010] The insulating partition separates the two sliders;

[0011] The slider is fixedly connected to the device pins.

[0012] In one embodiment of the present invention, the slide rail structure is located on the insulating partition and the side wall of the accommodating groove, and the slide rail structure includes: a first slide groove and a second slide groove;

[0013] The first chute is provided on the surface of the insulating partition and extends along the long axis of the insulating partition;

[0014] The second chute is provided on the side wall of the receiving groove and extends along the long axis of the receiving groove;

[0015] The two sliding blocks are respectively slidably connected to the first sliding groove and the second sliding groove.

[0016] In one embodiment of the present invention, the number of the insulating spacers is two, the number of the device pins is three, and the number of the sliders is three.

[0017] In one embodiment of the present invention, the first chute and the second chute have the same structure;

[0018] The first sliding groove is a T-shaped groove structure, including a sliding groove and a sliding opening;

[0019] The sliding opening is provided on the groove wall of the sliding groove;

[0020] The slider is a T-shaped structure, comprising a sliding portion and a connecting portion;

[0021] The sliding portion is slidably connected to the sliding groove;

[0022] One end of the connecting portion is fixedly connected to the sliding portion, and the other end passes through the sliding opening and is fixedly connected to the device pin.

[0023] In one embodiment of the present invention, the slide rail structure is located on one side of the insulating partition, and the slide rail structure includes: at least two slide bars;

[0024] The sliding rod has two ends fixedly connected to the two ends of the accommodating groove;

[0025] The two sliding rods are respectively located on both sides of the insulating partition;

[0026] The sliding block is sleeved on the sliding rod and is slidably connected to the sliding rod.

[0027] In one embodiment of the present invention, the number of the insulating partitions is two, the number of the device pins is three, and the number of the sliding rods is three.

[0028] In one embodiment of the present invention, each of the device pins is connected to an electrode of the silicon carbide chip via a lead;

[0029] The lead wire is wrapped with an insulating layer on the outside.

[0030] Beneficial effects of the present invention:

[0031] The present invention connects the device pins to the slider via the device pins, and the slider can slide on the slide rail structure. Therefore, the device pins connected to the slider can move at the bottom of the packaging shell, thereby adjusting the position of the device pins, expanding the usage scenarios to adapt to various application environments and test conditions without affecting the normal use of the device.

[0032] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic structural diagram of a pin-adjustable silicon carbide power device package provided by an embodiment of the present invention;

[0034] Figure 2 1. It is a bottom view schematic diagram of a pin-adjustable silicon carbide power device package provided by an embodiment of the present invention;

[0035] Figure 3 1 is a bottom view schematic diagram of another pin-adjustable silicon carbide power device package provided by an embodiment of the present invention;

[0036] Figure 4 yes Figure 3 A schematic structural diagram of a stereogram;

[0037] Figure 5 It is a structural schematic diagram of the insulating partition provided by the embodiment of the present invention;

[0038] Figure 6 It is a structural schematic diagram of a slider provided by an embodiment of the present invention;

[0039] Figure 7 This is a schematic diagram of the assembly of the insulating partition and the slider provided by the embodiment of the present invention;

[0040] Figure 8 This is a bottom view of another pin-adjustable silicon carbide power device package provided by an embodiment of the present invention;

[0041] Figure 9 This is a bottom view schematic diagram of another pin-adjustable silicon carbide power device package provided by an embodiment of the present invention.

[0042] Description of reference numerals:

[0043] 10-packaging shell; 11-accommodating groove; 12-silicon carbide chip; 20-insulating partition; 30-slide rail structure; 31-first slide groove; 311-slide groove; 312-slide opening; 32-second slide groove; 33-slide rod; 40-slider; 41-sliding part; 42-connecting part; 50-device pin; 60-lead. DETAILED DESCRIPTION

[0044] The present invention will be further described in detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto.

[0045] Example 1

[0046] See also Figure 1 A pin-adjustable silicon carbide power device package shell includes: a package shell 10, at least one insulating partition 20, at least two slide rail structures 30, at least two sliders 40 and at least two device pins 50. A receiving groove 11 is provided at the bottom of the package shell 10, and a silicon carbide chip 12 is arranged inside the package shell 10. The silicon carbide chip 12 is encapsulated inside the package shell 10. The insulating partition 20 is horizontally fixed in the receiving groove 11, and the two ends of the insulating partition 20 are fixedly connected to the two ends of the receiving groove 11. The insulating partition 20 is parallel to the side wall of the receiving groove 11, and the insulating partition 20 can divide the receiving groove 11 into at least two layers of receiving space. The slide rail structure 30 is located on the insulating partition 20 and on the side wall of the receiving groove 11, or the slide rail structure 30 is located on one side of the insulating partition 20. The slider 40 is slidably connected to the slide rail structure 30. The insulating partition 20 separates the two sliders 40. In this embodiment, the insulating spacer 20 has the function of insulating and isolating the device pins 50. The slider 40 is fixedly connected to the device pins 50.

[0047] In this embodiment, the device pins 50 are connected to the slider 40, and the slider 40 can slide on the slide rail structure 30. Therefore, when the device pins 50 are pushed and pulled, the device pins 50 connected to the slider 40 can move at the bottom of the packaging shell 10, so that the position and distance between the device pins 50 can be adjusted, expanding the usage scenarios to adapt to various application environments and test conditions without affecting the normal use of the device.

[0048] Furthermore, each device pin 50 is connected to an electrode of the silicon carbide chip 12 via a lead 60. The lead 60 is wrapped with an insulating layer. The lead 60 with the insulating layer can insulate the electrodes from each other.

[0049] Example 2

[0050] like Figure 2 As shown, this embodiment is based on the first embodiment and further defines that when the slide rail structure 30 is located on the insulating partition 20 and the side wall of the accommodating groove 11, the slide rail structure 30 includes: a first slide groove 31 and a second slide groove 32.

[0051] The first chute 31 is formed on the surface of the insulating partition 20 and extends along the long axis of the insulating partition 20. The second chute 32 is formed on the sidewall of the receiving groove 11 and extends along the long axis of the receiving groove 11. The first chute 31 and the second chute 32 are parallel to each other, and two sliders 40 are slidably connected to the first chute 31 and the second chute 32, respectively. In this embodiment, a slider 40 is slidably connected to each of the first chute 31 and the second chute 32, and the slider 40 is connected to a device pin 50. By pushing or pulling the device pin 50 or the slider 40, the slider 40 can slide on the first chute 31 or the second chute 32, thereby changing the position of the device pin 50.

[0052] Furthermore, if Figure 3 and Figure 4 As shown, there are two insulating partitions 20, three device pins 50, and three sliders 40. In this embodiment, the two insulating partitions 20 are parallel to each other. There are two insulating partitions 20, and the insulating partitions 20 divide the interior of the receiving groove 11 into a three-layer structure. Each insulating partition 20 is provided with a first sliding groove 31, wherein two sliders 40 are respectively located in the two first sliding grooves 31, and the third slider 40 is located in the second sliding groove 32.

[0053] In a feasible implementation, the number of insulating spacers 20 may be greater than two, and the number of device pins 50 and the number of sliders 40 is one more than the number of insulating spacers 20 .

[0054] In a feasible implementation, the insulating partition 20 separates the two sliders 40. Specifically, the first slide groove 31 and the second slide groove 32 have the same orientation. In this way, the sliders 40 are separated by the insulating partition 20, and the two sliders 40 are not simultaneously set in the same layer of accommodating space between the insulating partition 20 and the side wall of the accommodating groove 11.

[0055] Furthermore, if Figure 5 、 Figure 6 and Figure 7As shown, the first and second slide grooves 31 and 32 have identical structures. The first slide groove 31 is a T-shaped structure, comprising a sliding groove 311 and a sliding opening 312. The sliding opening 312 is defined in the wall of the sliding groove 311. The slider 40 is a T-shaped structure, comprising a sliding portion 41 and a connecting portion 42. The sliding portion 41 is slidably connected to the sliding groove 311. One end of the connecting portion 42 is fixedly connected to the sliding portion 41, and the other end of the connecting portion 42 extends through the sliding opening 312 and is fixedly connected to the device pin 50.

[0056] In this embodiment, the second slide groove 32 also has the same structure as the first slide groove 31. The T-shaped slide groove and the slider 40 cooperate with each other. The slider 40 can slide stably in the slide groove and bear force evenly, thereby improving the reliability of the device.

[0057] Example 3

[0058] like Figure 8 As shown, this embodiment, based on the first embodiment, further specifies that when the slide rail structure 30 is located on one side of the insulating partition 20, the slide rail structure 30 includes at least two slide rods 33. The ends of the slide rods 33 are fixedly connected to the ends of the receiving groove 11. The two slide rods 33 are located on either side of the insulating partition 20. A slider 40 is sleeved on the slide rods 33 and slidably connected to the slider 40. In this embodiment, the slide rail structure 30 is located in at least two layers of receiving space divided by the insulating partition 20 into which the receiving groove 11 is divided. The slide rods 33 are parallel to each other and are located on one side of the insulating partition 20. An insulating partition 20 is located between every two slide rods 33. Each insulating partition 20 has a layer of receiving space on either side, and each layer of receiving space is provided with a slide rod 33 and a slider 40. By pulling the device pin 50 or pushing or pulling the slider 40, the slider 40 can slide on the slide rod 33, thereby changing the position of the device pin 50.

[0059] Furthermore, if Figure 9 As shown, there are two insulating spacers 20, three device pins 50, and three slide bars 33. In this embodiment, there are two insulating spacers 20, which are parallel to each other. The insulating spacers 20 divide the receiving groove 11 into three layers, with a slide bar 33 and a slider 40 disposed in each layer.

[0060] In a feasible implementation, the number of insulating spacers 20 may be greater than two, and the number of sliding bars 33 , device pins 50 , and sliders 40 is one more than the number of insulating spacers 20 .

[0061] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0063] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0064] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0065] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0066] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A pin-adjustable silicon carbide power device package housing, characterized in that: include: A packaging shell (10), at least one insulating partition (20), at least two slide rail structures (30), at least two sliders (40), and at least two device pins (50); The packaging shell (10) has a receiving groove (11) at the bottom, and a silicon carbide chip (12) is arranged inside. The insulating partition (20) is horizontally fixed in the accommodating groove (11), and its two ends are fixedly connected to the two ends of the accommodating groove (11); The slide rail structure (30) is located on the insulating partition (20) and on the side wall of the accommodating groove (11); The slider (40) is slidably connected to the slide rail structure (30); The insulating partition (20) separates the two sliders (40); The slider (40) is fixedly connected to the device pin (50); When the device pins (50) are pushed or pulled, the device pins (50) connected to the slider (40) move at the bottom of the packaging shell (10) to adjust the position and distance between the device pins (50); the number of the insulating partitions (20) is two, the number of the device pins (50) is three, and the number of the sliders (40) is three; The slide rail structure (30) is located on the insulating partition (20) and on the side wall of the accommodating groove (11), and the slide rail structure (30) includes: a first slide groove (31) and a second slide groove (32); The first chute (31) is provided on the surface of the insulating partition (20) and extends along the long axis of the insulating partition (20); The second sliding groove (32) is provided on the side wall of the accommodating groove (11) and extends along the long axis of the accommodating groove (11); The two sliding blocks (40) are respectively slidably connected to the first sliding groove (31) and the second sliding groove (32); The first chute (31) and the second chute (32) have the same structure; The first sliding groove (31) is a T-shaped groove structure, including a sliding groove (311) and a sliding opening (312); The sliding opening (312) is provided on the groove wall of the sliding groove (311); The slider (40) is a T-shaped structure, comprising a sliding portion (41) and a connecting portion (42); The sliding portion (41) is slidably connected to the sliding groove (311); One end of the connecting portion (42) is fixedly connected to the sliding portion (41), and the other end passes through the sliding opening (312) and is fixedly connected to the device pin (50).

2. The pin-adjustable silicon carbide power device package according to claim 1, characterized in that: Each of the device pins (50) is connected to an electrode of the silicon carbide chip (12) via a lead (60); The lead wire (60) is externally wrapped with an insulating layer.

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