Display device

Abstract

Disclosed is a display device with reduced dead space area and low defect rate. The display device includes: a substrate including a display area and a peripheral area; and a first insulating layer disposed over the peripheral area and including a first side surface portion, a second side surface portion, and at least one recessed portion. The first side surface portion includes a side surface aligned with a side surface of the substrate, and the second side surface portion includes a side surface aligned with a side surface of the substrate and partially separated from the first side surface. A first pad is disposed on the first insulating layer, extends to an edge of the substrate, fills the at least one recessed portion, and includes a front surface aligned with the side surface of the substrate.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2020-0037796, filed on March 27, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device, and more particularly, to a display device having a reduced area of dead space and a low defect occurrence rate. Background Art

[0003] Typically, portable devices such as smartphones or laptop computers have a display device as a component. The display device includes a display area that can display an image and a peripheral area outside the display area that cannot display an image. For the display device, it can be advantageous to have a display area of sufficient size to enhance user convenience while reducing the overall size of the portable device by reducing the area of the peripheral area. Even for non-portable devices (such as televisions) that have a display device as a component, it can be advantageous to increase the size of the display area of the display device and reduce the size of the peripheral area. Summary of the Invention

[0004] Since an area of a substrate to which a printed circuit board for applying an electrical signal to a display area is attached is large, the conventional display device has a problem in that the area of the peripheral area is large.

[0005] The disclosure provides technical solutions for multiple problems including the above problems, and provides a display device with reduced dead space area and low defect rate. However, these objects are merely exemplary, and the scope of the disclosure is not limited thereto.

[0006] Additional aspects of the disclosure will be set forth in part in the description which follows, or in part will be obvious from the description, or may be learned by practice of the disclosed embodiments.

[0007] According to one or more embodiments, a display device may include: a substrate including a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral area of the substrate and including: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with a side surface of the substrate; and at least one recessed portion located between the first side surface portion and the second side surface portion; and a first pad disposed on the first insulating layer, extending to an edge of the substrate, and filling the at least one recessed portion. The first pad may include a front end surface aligned with the side surface of the substrate.

[0008] The first insulating layer may further include a plurality of through holes extending in a direction perpendicular to the substrate, and the first pad may fill the plurality of through holes.

[0009] The plurality of through holes may be randomly arranged in a plan view relative to the substrate.

[0010] The first pad may have a shape extending along a long axis of the first pad.The plurality of through holes may be arranged in a zigzag pattern in a direction perpendicular to the long axis of the first pad.

[0011] The plurality of through holes may be arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the first pad passes through at least one of the plurality of through holes.

[0012] The plurality of through holes may be arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes.

[0013] Each of the at least one concave portion may have a slit shape extending in a direction away from the side surface of the substrate.

[0014] The first insulating layer may further include a third side surface portion located between the first side surface portion and the second side surface portion, the third side surface portion including a side surface aligned with the side surface of the substrate, and at least one recessed portion may include: a first recessed portion located between the first side surface portion and the third side surface portion; and a second recessed portion located between the second side surface portion and the third side surface portion.

[0015] The first insulating layer may further include a third side surface portion located between the first side surface portion and the second side surface portion, the third side surface portion including a side surface aligned with the side surface of the substrate, and the at least one recessed portion may include: a first recessed portion located between the first side surface portion and the third side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; and a second recessed portion located between the second side surface portion and the third side surface portion and having a slit shape extending in a direction away from the side surface of the substrate.

[0016] The first recessed portion and the second recessed portion may be parallel to each other.

[0017] The display device may further include a second pad disposed between the substrate and the first pad, contacting the first pad, and including a front end surface aligned with a side surface of the substrate.

[0018] The first insulating layer may be disposed between the first pad and the second pad and cover a side edge of the second pad connected to a front end surface of the second pad.

[0019] The display device may further include: a third pad disposed under the second pad; and a second insulating layer disposed between the third pad and the second pad.

[0020] According to one or more embodiments, a display device may include: a substrate including a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral area of the substrate and including at least one recessed portion in a side surface of the first insulating layer, wherein a portion of the side surface of the first insulating layer other than the portion of the side surface provided with the at least one recessed portion may be aligned with the side surface of the substrate; and a first pad disposed on the first insulating layer, extending to an edge of the substrate, and filling the at least one recessed portion. The first pad may include a front end surface aligned with the side surface of the substrate.

[0021] The first insulating layer may further include a plurality of through holes extending in a direction perpendicular to the substrate, and the first pad may fill the plurality of through holes.

[0022] The plurality of through holes may be randomly arranged in a plan view relative to the substrate.

[0023] The first pad may have a shape extending along a long axis of the first pad, and the plurality of through holes may be arranged in a zigzag pattern in a direction perpendicular to the long axis of the first pad.

[0024] The plurality of through holes may be arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the first pad passes through at least one of the plurality of through holes.

[0025] The plurality of through holes may be arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes.

[0026] Each of the at least one concave portion may have a slit shape extending in a direction away from the side surface of the substrate.

[0027] The display device may further include a second pad disposed between the substrate and the first pad, contacting the first pad, and including a front end surface aligned with a side surface of the substrate.

[0028] The first insulating layer may be disposed between the first pad and the second pad and cover a side edge of the second pad connected to a front end surface of the second pad.

[0029] The display device may further include: a third pad disposed under the second pad; and a second insulating layer located between the third pad and the second pad.

[0030] According to one or more embodiments, a display device may include: a substrate including a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral area of the substrate and including: a first side surface portion including a side surface aligned with the side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through-holes extending in a direction perpendicular to the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the plurality of through-holes and the at least one recessed portion; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate. At least a portion of the plurality of first pads may include a front end surface aligned with the side surface of the substrate.

[0031] The plurality of through holes may be randomly arranged in a plan view relative to the substrate.

[0032] The second pad may have a shape extending along a long axis of the second pad, and the plurality of through holes may be arranged in a zigzag pattern in a direction perpendicular to the long axis of the second pad.

[0033] The plurality of through holes may be arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the second pad passes through at least one of the plurality of through holes.

[0034] The plurality of through holes may be arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes.

[0035] The first insulating layer may cover a side edge of the second pad connected to a front end surface of the second pad.

[0036] The display device may further include: a third pad disposed under the second pad; and a second insulating layer disposed between the third pad and the second pad.

[0037] According to one or more embodiments, a display device may include: a substrate including a display area and a peripheral area adjacent to the display area; a first insulating layer disposed on the peripheral area of the substrate and including: a first side surface portion including a side surface aligned with the side surface of the substrate; a second side surface portion separated from the first side surface portion and including a side surface aligned with the side surface of the substrate; a third side surface portion located between the first side surface portion and the second side surface portion and including a side surface aligned with the side surface of the substrate; a first recessed portion located between the first side surface portion and the second side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; and a second recessed portion located between the second side surface portion and the third side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; a plurality of first pads disposed on the first insulating layer and separated from each other, the plurality of first pads filling at least a portion of the first recessed portion and the second recessed portion; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate. At least a portion of the plurality of first pads may include a front end surface aligned with a side surface of the substrate.

[0038] The first recessed portion and the second recessed portion may be parallel to each other.

[0039] The first insulating layer may cover a side edge of the second pad connected to a front end surface of the second pad.

[0040] The display device may further include: a third pad disposed under the second pad; and a second insulating layer located between the third pad and the second pad.

[0041] Aspects, features, and advantages other than those described above will become apparent and more readily understood through the description of the embodiments, the accompanying drawings, and the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The above and other aspects, features and advantages of certain disclosed embodiments will become more apparent through the following description taken in conjunction with the accompanying drawings, in which:

[0043] Figure 1 is a schematic plan view of a substrate included in a display device according to an embodiment;

[0044] Figure 2 is a schematic perspective view of a portion of a display device according to an embodiment;

[0045] Figure 3 yes Figure 2 a schematic perspective view of a portion of a display device;

[0046] Figure 4 yes Figure 2 A schematic cross-sectional view of a portion of a display device;

[0047] Figure 5 yes Figure 2 A schematic cross-sectional view of a portion of a display device;

[0048] Figure 6 is a schematic plan view of a portion of a display device according to another embodiment;

[0049] Figure 7 It is along Figure 6 A schematic cross-sectional view of the display device taken along line VII-VII;

[0050] Figure 8 is a schematic plan view of a portion of a display device according to another embodiment;

[0051] Figure 9 It is along Figure 8 A schematic cross-sectional view of the display device taken along line IX-IX;

[0052] Figure 10 is a schematic perspective view of a portion of a display device according to another embodiment;

[0053] Figure 11 is a schematic plan view of a portion of a display device according to another embodiment;

[0054] Figure 12 It is along Figure 11 A schematic cross-sectional view of the display device taken along line XII-XII;

[0055] Figure 13 is a schematic plan view of a portion of a display device according to another embodiment; and

[0056] Figure 14 is a schematic plan view of a portion of a display device according to another embodiment. DETAILED DESCRIPTION

[0057] With reference now to embodiment in detail, the example of embodiment is shown in the accompanying drawings, wherein the same reference numerals indicate the same element from time to time. In this regard, embodiment can have different forms and should not be construed as being limited to the description set forth herein. Therefore, below only by describing embodiment with reference to the accompanying drawings, to explain aspect of the present disclosure. As used herein, term "and / or" includes any combination and all combinations of one or more of the relevant listed items. Throughout the disclosure, expression "at least one (kind / person) of a, b and c" or "at least one (kind / person) of a, b or c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or their variations.

[0058] Because various modifications may be applied to the disclosure and may implement one or more embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the disclosure and methods for achieving the effects and features of the disclosure will be apparent with reference to the embodiments described in detail below in conjunction with the drawings. However, the disclosure is not limited to the embodiments disclosed below and may be implemented in various forms.

[0059] Hereinafter, the disclosure will be described in detail by explaining embodiments of the disclosure with reference to the accompanying drawings. Like reference numerals in the accompanying drawings denote like elements, and redundant explanations thereof will be omitted.

[0060] In the following description, it will be understood that when an element such as a layer, film, region, or plate is referred to as being "on" another element, the element may be "directly on" the other element, or intervening elements may be present thereon. In addition, the sizes of elements in the drawings may be exaggerated or reduced for ease of explanation. In other words, since the sizes and thicknesses of elements in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0061] Throughout the specification, when an element is referred to as being “connected” to another element, the element may be “directly connected” to the other element or “indirectly connected” to the other element with one or more intermediate elements interposed therebetween. It will also be understood that when the terms “comprises,” “comprising,” and / or their variations are used in this specification, they or it may specify the presence of stated features, integers, steps, operations, elements, components, and / or any combination thereof, but do not preclude the presence or addition of other features, integers, steps, operations, elements, components, and / or any combination thereof.

[0062] Herein, the term "dead space" may be understood as a space dedicated to accommodating one or more components that perform intended functions individually or in plurality.

[0063] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0064] Figure 1 is a schematic plan view of a substrate 100 included in a display device according to an embodiment. Figure 2 is a schematic perspective view of a portion of a display device according to an embodiment. Figure 3 yes Figure 2 A schematic perspective view of a portion of a display device.

[0065] The display device according to the embodiment may include a substrate 100. Figure 1As shown in , the substrate 100 includes a display area DA and a peripheral area PA located outside the display area DA. The substrate 100 has an upper surface in the +z direction, a lower surface in the -z direction, and side surfaces 100a and 100b connecting the upper and lower surfaces to each other.

[0066] The substrate 100 may include glass, metal, or a polymer resin. When the substrate 100 is flexible or bendable, the substrate 100 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 may have a multilayer structure including two layers each including such a polymer resin and a barrier layer including an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, etc.) between the two layers. However, various modifications may be made.

[0067] The edge of the display area DA may have an overall rectangular shape, a square shape, or a shape similar to a rectangle or square. The substrate 100 may also have an overall rectangular shape, a square shape, or a shape similar to a rectangle or square in a plan view. However, the embodiment is not limited thereto, and various modifications may be made. For example, in a plan view, the substrate 100 and the display area DA may have a curved shape in at least a portion thereof.

[0068] The first insulating layer 131 is provided on the peripheral area PA of the substrate 100 (or in the peripheral area PA of the substrate 100). The first insulating layer 131 may include an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride. The first insulating layer 131 may have a single-layer structure or a multi-layer structure. The first insulating layer 131 may be provided not only on the peripheral area PA of the substrate 100, but also on the display area DA. In this case, the portion of the first insulating layer 131 above the display area DA and the portion of the first insulating layer 131 above the peripheral area PA may be integrally connected to each other or may be separated from each other.

[0069] The first insulating layer 131 includes a first side surface portion 131a, a second side surface portion 131b, and at least one recessed portion RS (see Figure 3). The first side surface portion 131a has a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction). Here, one side surface is aligned with the other side surface means that one side surface and the other side surface form a continuous surface. This also applies to the following embodiments and modifications thereof. The second side surface portion 131b has a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction) and is separated from the first side surface portion 131a. At least one recessed portion RS is between the first side surface portion 131a and the second side surface portion 131b.

[0070] The first pad (also called "pad" or "pad") PD1 (see Figure 2 ) is located on the first insulating layer 131. The first pad PD1 extends to the edge of the substrate 100 to fill at least one recess RS of the first insulating layer 131, and has a front end surface PD1a aligned with the side surface 100a of the substrate 100 (in the +x direction).

[0071] Figure 4 yes Figure 2 A schematic cross-sectional view of a portion of a display device. Figure 4 As shown in FIG, the printed circuit board PCB may be located on the side surface 100a and the lower surface of the substrate 100 (in the +x direction). The printed circuit board PCB may be flexible. For example, the printed circuit board PCB may include a flexible base layer PB formed of a resin and electrodes or wiring PW on the base layer PB. As another example, the printed circuit board PCB may include a flexible printed circuit board electrically connected to the substrate 100 and a rigid printed circuit board electrically connected to the flexible printed circuit board.

[0072] The printed circuit board PCB can generate an electrical signal to be applied to a display device or the like located on the display area DA of the substrate 100, or can transmit an electrical signal to the display area DA. Integrated circuit elements or the like can be located on the printed circuit board PCB. The electrodes or wirings PW of the printed circuit board PCB can be electrically connected to the first pad PD1 on the side surface 100a of the substrate 100 (in the +x direction) through a conductive adhesive PS such as silver (Ag) paste or an anisotropic conductive film. For example, the printed circuit board PCB is electrically connected to the front end surface PD1a of the first pad PD1 aligned with the side surface 100a of the substrate 100 (in the +x direction) (for example, see Figure 2 ). Therefore, the area of the dead space of the display device can be significantly reduced.

[0073] As described above, in the display device according to the embodiment, the first insulating layer 131 has the first side surface portion 131a and the second side surface portion 131b, each of the first side surface portion 131a and the second side surface portion 131b includes a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction) and is spaced apart from each other, and at least one recessed portion RS is between the first side surface portion 131a and the second side surface portion 131b. The first pad PD1 on the first insulating layer 131 (see FIG. Figure 2 ) extends to the edge of the substrate 100 to fill the at least one recessed portion RS of the first insulating layer 131, and has a front surface PD1a aligned with the side surface 100a of the substrate 100 (in the +x direction). Therefore, the area of the front surface PD1a of the first pad PD1 aligned with the side surface 100a of the substrate 100 (in the +x direction) can be substantially increased, and thus, the electrical contact area between the first pad PD1 and the printed circuit board PCB can also be substantially increased. Therefore, the occurrence rate of contact defects between the first pad PD1 and the printed circuit board PCB can be reduced.

[0074] If the first insulating layer 131 does not include at least one recessed portion RS and the first pad PD1 is located only on the first insulating layer 131, the area of the front surface PD1a of the first pad PD1 aligned with the side surface 100a of the substrate 100 (in the +x direction) would be narrow. In this case, the contact resistance between the first pad PD1 and the printed circuit board PCB is high, so that the electrical signals from the printed circuit board PCB are not smoothly transmitted to the display area DA. However, because the first insulating layer 131 includes at least one recessed portion RS and the first pad PD1 fills the at least one recessed portion RS, the area of the front surface PD1a of the first pad PD1 aligned with the side surface 100a of the substrate 100 (in the +x direction) is increased due to the presence of the recessed portion RS. Therefore, the contact resistance between the first pad PD1 and the printed circuit board PCB can be significantly reduced.

[0075] The first insulating layer 131 may further include a third side surface portion 131c, the third side surface portion 131c being between the first side surface portion 131a and the second side surface portion 131b and having a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction). Therefore, the at least one recessed portion RS includes a first recessed portion RS1 between the first side surface portion 131a and the third side surface portion 131c and a second recessed portion RS2 between the second side surface portion 131b and the third side surface portion 131c. The first pad PD1 may fill both the first recessed portion RS1 and the second recessed portion RS2. As shown in FIG. Figure 2 and Figure 3As can be seen, as the number of recessed portions RS of the first insulating layer 131 increases, the area of the front surface PD1a of the first pad PD1, which is aligned with the side surface 100a of the substrate 100 (in the +x direction), increases. Therefore, the contact resistance between the first pad PD1 and the printed circuit board PCB can be effectively reduced.

[0076] In addition to the first pad PD1, the display device according to the embodiment may further include a second pad PD2. Figures 2 to 4 As shown in FIG, the second pad PD2 may be between the substrate 100 and the first pad PD1 and may include a front surface PD2a that contacts the first pad PD1 and is aligned with the side surface 100a of the substrate 100 (in the +x direction). The first insulating layer 131 between the first pad PD1 and the second pad PD2 may cover both side edges of the front surface PD2a (extending along the x-axis) connected to the second pad PD2. In this case, the first insulating layer 131 may be between the first pad PD1 and the second pad PD2, but the first pad PD1 and the second pad PD2 may contact each other through at least one recessed portion RS of the first insulating layer 131. For example, the at least one recessed portion RS of the first insulating layer 131 may expose the upper surface of the second pad PD2 below the first insulating layer 131, and the first pad PD1 may fill the at least one recessed portion RS, thereby contacting the second pad PD2 through the at least one recessed portion RS. In addition to the first pad PD1, the front surface PD2a of the second pad PD2 may also be electrically connected to the printed circuit board PCB via a conductive adhesive PS. Therefore, the electrical signals from the printed circuit board PCB can be smoothly transmitted to the display area DA.

[0077] In addition, the display device may further include a third pad PD3 below the second pad PD2 and a second insulating layer 122 between the third pad PD3 and the second pad PD2. The third pad PD3 may include a front surface PD3a aligned with the side surface 100a of the substrate 100 (in the +x direction). In addition to the first pad PD1 and the second pad PD2, the front surface PD3a of the third pad PD3 may also be electrically connected to the printed circuit board PCB via a conductive adhesive PS. Therefore, electrical signals from the printed circuit board PCB can be smoothly transmitted to the display area DA. If necessary, a through hole or the like is formed in the second insulating layer 122 so that the second pad PD2 can be connected to the third pad PD3.

[0078] Figure 5 yes Figure 2 Schematic cross-sectional view of a portion of a display device. Specifically, Figure 5 yes Figure 2 For reference, for convenience, in Figure 2Only a portion of the display device is shown in FIG. 1 , and if necessary, a planarization layer 140 or a pixel defining layer 150 to be described below may also include a side surface aligned with the side surface 100 a of the substrate 100 (in the +x direction).

[0079] The display element 310 and the first and second thin film transistors 210 and 220 electrically connected to the display element 310 may be located in the display area DA of the substrate 100. Figure 5 , an organic light emitting element is shown as a display element 310 located in the display area DA. It can be understood that the organic light emitting element is electrically connected to the first thin film transistor 210, which means that the pixel electrode 311 is electrically connected to the first thin film transistor 210.

[0080] exist Figure 5 In FIG, in addition to the first thin film transistor 210, the second thin film transistor 220 is also shown in one pixel. Similarly, multiple thin film transistors can be located in one pixel. The first thin film transistor 210 and the second thin film transistor 220 can have similar or identical structures.

[0081] The first thin film transistor 210 may include a first semiconductor layer 211, a first gate electrode 213, a first source electrode 215a, and a first drain electrode 215b. The first semiconductor layer 211 may include amorphous silicon, polycrystalline silicon, or an organic semiconductor material. The first gate electrode 213 may include various conductive materials and may have various layered structures, such as a molybdenum (Mo) layer and an aluminum (Al) layer. The first source electrode 215a and the first drain electrode 215b may also include various conductive materials and may have various layered structures, such as a titanium (Ti) layer and an Al layer.

[0082] In order to ensure insulation between the first semiconductor layer 211 and the first gate electrode 213, a first gate insulating layer 121 may be between the first semiconductor layer 211 and the first gate electrode 213, and the first semiconductor layer 211 includes an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. An interlayer insulating layer 131 may be arranged on the first gate electrode 213. The interlayer insulating layer 131 may include an inorganic material such as silicon oxide, silicon nitride, silicon oxynitride, titanium oxide or aluminum oxide. The first source electrode 215a and the first drain electrode 215b may be arranged on the interlayer insulating layer 131. The insulating layer including the inorganic material may be formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD). This also applies to the following embodiments and modifications thereof.

[0083] The second thin film transistor 220 may include a second semiconductor layer 221 in a manner similar to or identical to the first semiconductor layer 211 of the first thin film transistor 210. However, unlike the first gate electrode 213 disposed on the first gate insulating layer 121, the second gate electrode 223 may be located on the second gate insulating layer 122 covering the first gate electrode 213. The second gate insulating layer 122 may include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. An interlayer insulating layer 131 may cover the second gate electrode 223, and a second source electrode 225a and a second drain electrode 225b may be disposed on the interlayer insulating layer 131.

[0084] If necessary, the second gate electrode 223 may also be located on the first gate insulating layer 121 in the same manner as the first gate electrode 213. In this case, a wiring may be arranged between the first gate insulating layer 121 and the second gate insulating layer 122.

[0085] The buffer layer 110 may be between the substrate 100 and the first and second thin film transistors 210 and 220 having the above-described structures. The buffer layer 110 may include at least one of silicon oxide, silicon nitride, silicon oxynitride, titanium oxide, and aluminum oxide. The buffer layer 110 may enhance the flatness of the upper surface of the substrate 100 or may prevent or minimize the penetration of impurities from the substrate 100 or the like into the first semiconductor layer 211 of the first thin film transistor 210 or the second semiconductor layer 221 of the second thin film transistor 220.

[0086] In addition, the planarization layer 140 may be disposed on the first thin film transistor 210 and the second thin film transistor 220. For example, Figure 5 As shown in , in the case where the organic light emitting element is arranged on the first thin film transistor 210 and the second thin film transistor 220, the planarization layer 140 can substantially planarize the upper portion of the first thin film transistor 210 and the second thin film transistor 220. The planarization layer 140 can be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, benzocyclobutene (BCB) or hexamethyldisiloxane (HMDSO). Figure 5 , the planarization layer 140 is shown to be a single layer. However, the planarization layer 140 may be a multi-layered layer and may be variously modified.

[0087] In the display area DA of the substrate 100, the display element 310 may be located on the planarization layer 140. The display element 310 may be, for example, an organic light emitting element including a pixel electrode 311, an opposite electrode 315, and an intermediate layer 313 disposed between the pixel electrode 311 and the opposite electrode 315 and including an emission layer. Figure 5As shown in FIG, the pixel electrode 311 may contact one of the first source electrode 215 a and the first drain electrode 215 b through the opening formed in the planarization layer 140 and may be electrically connected to the first thin film transistor 210 .

[0088] For a top-emitting display device that emits light to the outside through the counter electrode 315, the pixel electrode 311 can be formed of a metal material with high reflectivity (such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd) and / or copper (Cu). In a bottom-emitting display device that emits light to the outside through the pixel electrode 311, the pixel electrode 311 may include a transparent conductive material capable of transmitting light (such as ITO or IZO) or a semi-transmissive conductive material (such as magnesium (Mg), Ag, or an alloy of Mg and Ag).

[0089] The pixel defining layer 150 may be disposed on the planarization layer 140. The pixel defining layer 150 defines pixels by including an opening corresponding to each sub-pixel, and the opening may be an opening that exposes at least a central portion of the pixel electrode 311. Figure 5 As shown in , the pixel defining layer 150 can prevent arcing, etc., from occurring at the edge of the pixel electrode 311 by increasing the distance between the edge of the pixel electrode 311 and the counter electrode 315 above the pixel electrode 311. The pixel defining layer 150 can be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, or HMDSO.

[0090] The intermediate layer 313 of the organic light emitting element may include a low molecular weight material or a polymer material. In the case where the intermediate layer 313 includes a low molecular weight material, the intermediate layer 313 may have a structure in which a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), etc. are stacked in a single or composite structure, and may be formed by a vacuum deposition method. In the case where the intermediate layer 313 includes a polymer material, the intermediate layer 313 may have a structure including an HTL and an EML. In this case, the HTL may include poly (3,4-ethylenedioxythiophene) (PEDOT), and the EML may include a polymer material such as polyphenylene vinylene (PPV, poly-phenylenevinylene) or a polyfluorene-based material. The intermediate layer 313 may be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), etc. However, the intermediate layer 313 is not limited thereto and may have various structures. The intermediate layer 313 may include an integral layer over the plurality of pixel electrodes 311 , or may include a layer patterned to correspond to each of the pixel electrodes 311 .

[0091] The counter electrode 315 may be arranged on the display area DA to cover the display area DA. For example, the counter electrode 315 for a plurality of organic light-emitting elements may be formed as one element corresponding to the pixel electrode 311. In a top emission display device, the counter electrode 315 may include a transparent conductive material (TCO) capable of transmitting light (such as ITO or IZO) or a semi-transmissive conductive material (such as Mg, Ag, or an alloy of Mg and Ag). In a bottom emission display device, the counter electrode 315 may include a metal material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of Ag, Pd, and / or Cu.

[0092] The opposing electrode 315 covers the display area DA and extends to the peripheral area PA outside the display area DA. The opposing electrode 315 is electrically connected to an electrode power line in the peripheral area PA. The electrode power line may also be referred to as ELVSS.

[0093] Because the organic light emitting element can be easily damaged by external moisture or oxygen, an encapsulation layer (not shown) can cover the organic light emitting element to protect the organic light emitting element. The encapsulation layer can cover the display area DA and can extend to at least a portion of the peripheral area PA. The encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer and the second inorganic encapsulation layer may include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The organic encapsulation layer may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc. In addition, if necessary, such as Figure 2 As shown in FIG, the upper substrate 400 may be positioned on the substrate 100. In this case, the filler 500 may fill the space under the upper substrate 400.

[0094] Data lines, power lines, and the like are arranged in the display area DA of the substrate 100, and various wirings may be located in the peripheral area PA. For example, as described above, electrode power lines and the like may be located in the peripheral area PA. Power lines may be located in the peripheral area PA, and power lines (also referred to as Vdd lines) extending into the display area DA may be electrically connected to the power lines to supply power to the pixels in the display area DA. For example, the power lines may be substantially parallel to the data lines.

[0095] Reference Figures 2 to 4 The first insulating layer 131 and the second insulating layer 122 described above may be Figure 5 The interlayer insulating layer 131 corresponds to the second gate insulating layer 122. For example, Figures 2 to 4 The first insulating layer 131 and Figure 5 The interlayer insulating layer 131 shown in FIG. 1 may be formed as one element. Figures 2 to 4 The first insulating layer 131 shown in FIG. Figure 5 The first insulating layer 131 and the interlayer insulating layer 131 are separated from each other, but the first insulating layer 131 and the interlayer insulating layer 131 may be simultaneously formed of the same material in a manufacturing process of the display device. Figures 2 to 4 The second insulating layer 122 and Figure 5 The second gate insulating layer 122 may be formed as one element. Figures 2 to 4 The second insulating layer 122 shown in FIG. Figure 5 The second gate insulating layer 122 is separated from the first gate insulating layer 122, but may be simultaneously formed of the same material in a process of manufacturing the display device.

[0096] Reference Figures 2 to 4The first pad PD1, the first source electrode 215a, and the first drain electrode 215b described above can be formed simultaneously from the same material. Similarly, the second pad PD2 and the second gate electrode 223 can be formed simultaneously from the same material, and the third pad PD3 and the first gate electrode 213 can be formed simultaneously from the same material. This also applies to the following embodiments and their modifications. As described above, if necessary, the second gate electrode 223 can be located on the first gate insulating layer 121 in the same manner as the first gate electrode 213, and the wiring can be between the first gate insulating layer 121 and the second gate insulating layer 122. In this case, the second pad PD2 and the wiring can be formed simultaneously from the same material.

[0097] In the manufacture of the display device, the following processes may be performed: forming a buffer layer 110, a first gate insulating layer 121, a second gate insulating layer 122, and an interlayer insulating layer 131 on the entire surface of the substrate 100; forming other elements; and then cutting the substrate 100. When cutting the substrate 100, as shown in FIG. Figure 2 As shown in the figure, the front end surface PD1a of the first pad PD1 is aligned with the side surface 100a of the substrate 100 (in the +x direction), so that all of the buffer layer 110, the first gate insulating layer 121, the second gate insulating layer 122 and the interlayer insulating layer 131 can have side surfaces aligned with the side surface 100a of the substrate 100 (in the +x direction).

[0098] Figure 6 is a schematic plan view of a portion of a display device according to another embodiment, Figure 7 It is along Figure 6 Schematic cross-sectional view of the cross section of the display device taken along line VII-VII.

[0099] like Figure 6 and Figure 7 As shown in , the first insulating layer 131 may have through holes TH extending in a direction (+z direction) perpendicular to the substrate 100. In this case, the first pad PD1 on the first insulating layer 131 may fill the plurality of through holes TH. Figure 6 and Figure 7 In the embodiment, each of the through holes TH is shown to have a circular or elliptical shape in a plan view, but the embodiment is not limited thereto. For example, each of the through holes TH may have a quadrilateral shape in a plan view. However, various modifications may be made. The same applies to the following embodiments and their modifications.

[0100] As described above, in the manufacture of the display device, the following processes may be performed: forming the buffer layer 110, the first gate insulating layer 121, the second gate insulating layer 122, and the interlayer insulating layer 131 on the entire surface of the substrate 100; forming other elements; and then cutting the substrate 100. When cutting the substrate 100, as shown in FIG. Figure 2 As shown in , the front end surface PD1a of the first pad PD1 is aligned with the side surface 100a of the substrate 100 (in the +x direction). Figure 2 As shown in , when cutting the substrate 100, the recessed portion RS of the first insulating layer 131 should also be cut so that the front end surface PD1a of the first pad PD1 can have a large area. Therefore, the first insulating layer 131 can have a through hole TH extending in a direction perpendicular to the substrate 100 (+z direction), so that even if the substrate 100 is cut at a substantially arbitrary position, the front end surface PD1a of the first pad PD1 can have a large area. This is because the through hole TH cut out of the through holes TH can be the recessed portion RS of the first insulating layer 131.

[0101] The first pad PD1 may have a shape extending along the long axis (x axis), and the through holes TH of the first insulating layer 131 may be arranged in a zigzag pattern in a direction (y axis direction) perpendicular to the long axis (x axis). Therefore, for example, when cutting along a cutting line parallel to the y axis (such as Figure 6 When the substrate 100 is cut along the second virtual line IL2, even if the position of the cutting line is slightly changed along the x-axis, parts of the plurality of through holes TH can always be cut so that the front end surface PD1a of the first pad PD1 can have a large area.

[0102] The through holes TH may be arranged such that a virtual straight line parallel to the upper surface of the substrate 100 and passing through the first pad PD1 passes through at least one of the through holes TH. Figure 6 , all of the first virtual line IL1, the second virtual line IL2, and the third virtual line IL3, which are parallel to the xy plane and pass through the first pad PD1, pass through at least one of the through holes TH. Therefore, when cutting the substrate 100, even if the positions of the cutting lines are changed, portions of the through holes TH can always be cut, so that the front end surface PD1a of the first pad PD1 can have a large area.

[0103] The through holes TH of the first insulating layer 131 can be arranged so that a virtual plane (yz plane) parallel to the side surface 100a of the substrate 100 (in the +x direction) passes through at least one of the through holes TH. Therefore, even if the position of the side surface 100a to be formed by cutting the substrate 100 during the manufacturing process changes slightly along the x-axis, a portion of the through hole TH can always be cut so that the front end surface PD1a of the first pad PD1 can have a large area. For example, in a plan view relative to the substrate 100, a plurality of through holes TH can be randomly arranged.

[0104] Figure 8 is a schematic plan view of a portion of a display device according to an embodiment, Figure 9 It is along Figure 8Schematic cross-sectional view of the cross section of the display device taken along line IX-IX.

[0105] The first insulating layer 131 of the display device according to the embodiment does not have a through hole TH. Instead, each of the at least one recessed portion RS of the first insulating layer 131 has a slit shape extending in a direction away from the side surface 100a of the substrate 100 (-x direction). The first pad PD1 on the first insulating layer 131 fills the at least one recessed portion RS of the slit shape. Therefore, even in the case where the position of the cutting line changes when cutting the substrate 100 during the manufacturing process, the slit is always cut so that the front end surface PD1a of the first pad PD1 can have a large area. Figure 8 , it is shown that all of the first virtual line IL1 , the second virtual line IL2 , and the third virtual line IL3 which are parallel to the xy plane and pass through the first pad PD1 always pass through at least one concave portion RS of a slit shape.

[0106] In this case, the first insulating layer 131 may include a third side surface portion 131c (eg, see FIG. 131c ) between the first side surface portion 131a and the second side surface portion 131b. Figure 2 ), and may have a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction). Figure 8 As shown in , the at least one recessed portion RS may include a first recessed portion RS1 and a second recessed portion RS2, the first recessed portion RS1 being between the first side surface portion 131a and the third side surface portion 131c and having a slit shape extending in a direction (-x direction) away from the side surface 100a of the substrate 100, and the second recessed portion RS2 being between the second side surface portion 131b and the third side surface portion 131c and having a slit shape extending in a direction (-x direction) away from the side surface 100a of the substrate 100. In this case, the first recessed portion RS1 and the second recessed portion RS2 may be parallel to each other.

[0107] exist Figure 2 and Figure 3 , it is shown that the first insulating layer 131 on the substrate 100 has at least one recessed portion RS on its side surface, and thus all side surfaces of the first insulating layer 131 except the side surface provided with the at least one recessed portion RS are aligned with the side surfaces 100a and 100b of the substrate 100. However, the embodiment is not limited thereto.

[0108] For example, as shown in the schematic perspective view of a portion of the display device according to the embodiment Figure 10 As shown in , all side surfaces of the first insulating layer 131 except for at least one recess RS do not need to be aligned with the side surfaces 100a and 100b of the substrate 100. Figure 10As shown in , the side surface of the first insulating layer 131 (in the -y direction) may not be aligned with the side surface 100b of the substrate 100 (in the -y direction), but may be arranged inside the substrate 100 in a plan view. The side surface of the first insulating layer 131 (in the +x direction) may not need to be aligned with the side surface 100a of the substrate 100 (in the +x direction) in all parts. For example, it may be sufficient if each of the first side surface portion 131a and the second side surface portion 131b of the first insulating layer 131 has a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction), and at least one recessed portion RS is arranged between the first side surface portion 131a and the second side surface portion 131b. The first insulating layer 131 may include a third side surface portion 131c between the first side surface portion 131a and the second side surface portion 131b, and may have a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction), and at least one recessed portion RS may include a first recessed portion RS1 between the first side surface portion 131a and the third side surface portion 131c and a second recessed portion RS2 between the second side surface portion 131b and the third side surface portion 131c.

[0109] Figure 11 is a schematic plan view of a portion of a display device according to an embodiment, Figure 12 It is along Figure 11 A schematic cross-sectional view of a schematic cross-sectional view of a display device taken along line XII-XII.

[0110] In the display device according to the embodiment, the first insulating layer 131 has a first side surface portion 131a, a second side surface portion 131b, at least one recessed portion RS between the first side surface portion 131a and the second side surface portion 131b, and a through hole TH extending in a direction (+z direction) perpendicular to the substrate 100. Each of the first side surface portion 131a and the second side surface portion 131b has a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction).

[0111] The display device according to the embodiment may include a first pad PD1. The first pad PD1 is disposed on the first insulating layer 131, fills at least one recess RS and at least a portion of the through hole TH, and is spaced apart from each other. Figure 11 In the embodiment, each of the first pads PD1 has a diamond shape in a plan view, but the embodiment is not limited thereto. For example, each of the first pads PD1 may have a circular or oval shape in a plan view, or may have a rectangular or square shape. However, various modifications may be made. This also applies to the following embodiments and their modifications.

[0112] The second pad PD2 below the first pad PD1 may contact the first pad PD1 through the through hole TH or the recess RS. The second pad PD2 has a front end surface PD2a aligned with the side surface 100a of the substrate 100 (in the +x direction) (eg, see Figure 2 At least a portion of the first pad PD1 may have a front end surface PD1a aligned with the side surface 100a of the substrate 100 (in the +x direction) (eg, see Figure 2 ).

[0113] Even in the display device according to the embodiment, the recessed portion RS of the first insulating layer 131 may sufficiently secure the area of the pad contacting the front end surface of the printed circuit board PCB.

[0114] like Figure 2 As shown in FIG, when the filler 500 contacts the first pad PD1, a chemical reaction may occur between the filler 500 and the first pad PD1. For example, when the first pad PD1 includes a material such as aluminum and the filler 500 includes glass frit, a so-called hillock phenomenon may occur in which part of the material such as aluminum included in the first pad PD1 melts and protrudes outside the first pad PD1. Figure 2 A short circuit may occur between the first pads PD1 adjacent to and parallel to each other as shown in FIG.

[0115] In the display device according to the embodiment, because the plurality of first pads PD1 are arranged on the second pads PD2 so as to be spaced apart from one another, even if the first pads PD1 include a material that could cause a hillock phenomenon, the total amount of material included in the first pads PD1 arranged on the second pads PD2 can be significantly reduced. Therefore, even if a hillock phenomenon occurs in the first pads PD1, the size of the protrusion protruding from the first pads PD1 can be reduced, so that the protrusion from the first pad PD1 on one second pad PD2 does not reach the first pad PD1 on another second pad PD2 adjacent to the first second pad PD2. Therefore, electrical short circuits between the second pads PD2 arranged parallel to each other can be effectively prevented.

[0116] Although Figure 11 1 shows that one first pad PD1 fills the plurality of through holes TH of the first insulating layer 131, but the embodiment is not limited thereto. For example, one first pad PD1 may fill only one of the through holes TH of the first insulating layer 131, and thus, the first pad PD1 may correspond to the through hole TH in a one-to-one manner.

[0117] In manufacturing the display device, the following processes are performed: forming a buffer layer 110, a first gate insulating layer 121, a second gate insulating layer 122, and an interlayer insulating layer 131 on the entire surface of the substrate 100; forming other elements; and then cutting the substrate 100. Figure 11 As shown in FIG, when the substrate 100 is cut, the front end surface PD1a of the portion of the first pad PD1 can be aligned with the side surface 100a (in the +x direction) of the substrate 100. In this case, even when a substantially arbitrary position on the substrate 100 is cut, the front end surface PD1a of the portion of the first pad PD1 can have a large area.

[0118] To this end, the second pad PD2 may have a shape extending along the long axis (x axis), and the through holes TH of the first insulating layer 131 may be arranged in a zigzag pattern along a direction (y axis direction) perpendicular to the long axis (x axis). Figure 11 When the substrate 100 is cut along the cutting line parallel to the y-axis indicated by the second virtual line IL2, even if the position of the cutting line is slightly changed along the x-axis, part of the through hole TH can always be cut so that the front end surface PD1a of the first pad PD1 can have a large area.

[0119] In addition, the through holes TH may be arranged such that a virtual straight line parallel to the upper surface of the substrate 100 and passing through the second pad PD2 passes through at least one of the plurality of through holes TH. Figure 11 , all of the first virtual line IL1, the second virtual line IL2, and the third virtual line IL3, which are parallel to the xy plane and pass through the second pad PD2, pass through at least one of the through holes TH. Therefore, when cutting the substrate 100, even if the positions of the cutting lines are changed, portions of the through holes TH can always be cut, so that the front end surface PD1a of the first pad PD1 can have a large area.

[0120] The through holes TH of the first insulating layer 131 can be arranged so that a virtual plane (yz plane) parallel to the side surface 100a of the substrate 100 (in the +x direction) passes through at least one of the through holes TH. Therefore, even if the position of the side surface 100a to be formed by cutting the substrate 100 slightly changes along the x-axis during the manufacturing process, a portion of the through hole TH can always be cut so that the front end surface PD1a of the first pad PD1 can have a large area. As another example, the through holes TH can be randomly arranged in a plan view relative to the substrate 100.

[0121] As described above, the first pad PD1 may have various shapes. For example, as shown in the schematic plan view of a portion of the display device according to the embodiment, Figure 13 As shown in FIG, each of the first pads PD1 may have a shape extending along the x-axis in the same manner as the second pad PD2. However, a plurality of first pads PD1 spaced apart from each other in the y-axis direction may be located on one second pad PD2, so that the total amount of material that may cause the hillock phenomenon to occur in the first pad PD1 on one second pad PD2 may be reduced.

[0122] As a schematic plan view of a portion of a display device according to an embodiment Figure 14 As shown in FIG, the first insulating layer 131 may not have a through hole TH. Instead, in the display device according to the embodiment, each of the at least one recessed portion RS of the first insulating layer 131 has a slit shape extending in a direction (-x direction) away from the side surface 100a of the substrate 100. The first pads PD1 spaced apart from each other on the first insulating layer 131 fill the slit-shaped recessed portion RS. Figure 14 The cross section of the display device taken along line IX-IX may be as follows: Figure 9 Shown in.

[0123] Since the display device has the above structure, when the substrate 100 is cut during the manufacturing process, even if the position of the cutting line is changed, the slit can always be cut so that the front end surface PD1a of the first pad PD1 can have a large area. Figure 14 , all of the first, second, and third virtual lines IL1, IL2, and IL3 that are parallel to the xy plane and pass through the first pad PD1 always pass through the slit-shaped recess RS. The amount of material that causes the hillock phenomenon in the first pad PD1 on one second pad PD2 can be reduced.

[0124] In this case, the first insulating layer 131 may include a third side surface portion 131c (eg, see Figure 2 ), the third side surface portion 131c is between the first side surface portion 131a and the second side surface portion 131b and has a side surface aligned with the side surface 100a of the substrate 100 (in the +x direction). Figure 14 As shown in , the at least one recessed portion RS may include a first recessed portion RS1 and a second recessed portion RS2, the first recessed portion RS1 being between the first side surface portion 131a and the third side surface portion 131c and having a slit shape extending in a direction (-x direction) away from the side surface 100a of the substrate 100, and the second recessed portion RS2 being between the second side surface portion 131b and the third side surface portion 131c and having a slit shape extending in a direction (-x direction) away from the side surface 100a of the substrate 100. In this case, the first recessed portion RS1 and the second recessed portion RS2 may be parallel to each other.

[0125] The third pad PD3 (see, for example, Figure 10 ) and the second insulating layer 122 between the third pad PD3 and the second pad PD2 may also be included in the reference Figures 11 to 14 In the described embodiment.

[0126] As described above, according to one or more embodiments, a display device having a reduced dead space area and a low defect rate can be realized. The scope of the disclosure is not limited by this effect.

[0127] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with the side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through holes, each of the plurality of through holes extending in a direction perpendicular to the substrate, spaced apart from the at least one recessed portion, and each of the plurality of through holes positioned within the substrate to be spaced apart from the side surface of the substrate when viewed in a direction perpendicular to the substrate; and a first pad disposed on the first insulating layer, filling the plurality of through holes, extending to an edge of the substrate, and filling the at least one recessed portion, the first pad including a front end surface aligned with the side surface of the substrate, Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

2. The display device according to claim 1, wherein The plurality of through holes are randomly arranged in a plan view relative to the substrate.

3. The display device according to claim 1, wherein The first pad has a shape extending along a long axis of the first pad, and The plurality of through holes are arranged in a zigzag pattern in a direction perpendicular to the long axis of the first pad.

4. The display device according to claim 1, wherein The plurality of through holes are arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the first pad passes through at least one of the plurality of through holes.

5. The display device according to claim 1, wherein The plurality of through holes are arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes.

6. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; and at least one recessed portion located between the first side surface portion and the second side surface portion; and a first pad disposed on the first insulating layer, extending to an edge of the substrate and filling the at least one recess, the first pad including a front end surface aligned with the side surface of the substrate, Herein, each of the at least one recessed portion has a slit shape extending in a direction away from the side surface of the substrate.

7. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; and at least one recessed portion located between the first side surface portion and the second side surface portion; and a first pad disposed on the first insulating layer, extending to an edge of the substrate and filling the at least one recess, the first pad including a front end surface aligned with the side surface of the substrate, The first insulating layer further includes a third side surface portion located between the first side surface portion and the second side surface portion, the third side surface portion including a side surface aligned with the side surface of the substrate, The at least one recessed portion includes: a first recessed portion located between the first side surface portion and the third side surface portion; and a second recessed portion located between the second side surface portion and the third side surface portion, and Each of the at least one concave portion has a shape that is concave in a direction away from the side surface of the substrate.

8. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; and at least one recessed portion located between the first side surface portion and the second side surface portion; and a first pad disposed on the first insulating layer, extending to an edge of the substrate and filling the at least one recess, the first pad including a front end surface aligned with the side surface of the substrate, in, The first insulating layer further includes a third side surface portion located between the first side surface portion and the second side surface portion, the third side surface portion including a side surface aligned with the side surface of the substrate, and The at least one recessed portion includes: a first recessed portion located between the first side surface portion and the third side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; and a second recessed portion located between the second side surface portion and the third side surface portion and having a slit shape extending in the direction away from the side surface of the substrate.

9. The display device according to claim 8, wherein The first concave portion and the second concave portion are parallel to each other.

10. The display device according to claim 1, 6, 7 or 8, further comprising a second pad disposed between the substrate and the first pad, contacting the first pad, and including a front end surface aligned with the side surface of the substrate. The display device according to claim 10 , wherein: The first insulating layer is disposed between the first pad and the second pad and covers a side edge of the second pad connected to the front end surface of the second pad.

12. The display device according to claim 10, further comprising: a third pad, disposed below the second pad; as well as The second insulating layer is disposed between the third pad and the second pad.

13. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer provided over the peripheral region of the substrate and including at least one recessed portion and a plurality of through-holes in a side surface of the first insulating layer, each of the plurality of through-holes extending in a direction perpendicular to the substrate, spaced apart from the at least one recessed portion, and each of the plurality of through-holes positioned so as to be spaced apart from the side surface of the substrate when viewed in a direction perpendicular to the substrate, wherein another portion of the side surface of the first insulating layer other than a portion of the side surface provided with the at least one recessed portion is aligned with the side surface of the substrate; and a first pad disposed on the first insulating layer, filling the plurality of through holes, extending to an edge of the substrate, and filling the at least one recessed portion, the first pad including a front end surface aligned with the side surface of the substrate, Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

14. The display device according to claim 13, wherein: The plurality of through holes are randomly arranged in a plan view relative to the substrate.

15. The display device according to claim 13, wherein The first pad has a shape extending along a long axis of the first pad, and The plurality of through holes are arranged in a zigzag pattern in a direction perpendicular to the long axis of the first pad.

16. The display device according to claim 13, wherein The plurality of through holes are arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the first pad passes through at least one of the plurality of through holes.

17. The display device according to claim 13, wherein: The plurality of through holes are arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes.

18. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and including at least one recessed portion in a side surface of the first insulating layer, wherein another portion of the side surface of the first insulating layer other than a portion of the side surface provided with the at least one recessed portion is aligned with the side surface of the substrate; and a first pad disposed on the first insulating layer, extending to an edge of the substrate and filling the at least one recess, the first pad including a front end surface aligned with the side surface of the substrate, Herein, each of the at least one recessed portion has a slit shape extending in a direction away from the side surface of the substrate. 19 . The display device according to claim 13 , further comprising a second pad disposed between the substrate and the first pad, contacting the first pad, and including a front end surface aligned with the side surface of the substrate.

20. The display device according to claim 19, wherein The first insulating layer is disposed between the first pad and the second pad and covers a side edge of the second pad connected to the front end surface of the second pad.

21. The display device according to claim 19, further comprising: a third pad, disposed below the second pad; as well as The second insulating layer is disposed between the third pad and the second pad.

22. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through holes extending in a direction perpendicular to the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the plurality of through holes and the at least one recess; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate, wherein at least a portion of the plurality of first pads includes a front end surface aligned with the side surface of the substrate, The plurality of through holes are randomly arranged in a plan view relative to the substrate, and Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

23. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through holes extending in a direction perpendicular to the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the plurality of through holes and the at least one recess; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate, wherein at least a portion of the plurality of first pads includes a front end surface aligned with the side surface of the substrate, in, The second pad has a shape extending along the long axis of the second pad, The plurality of through holes are arranged in a zigzag pattern in a direction perpendicular to the long axis of the second pad, and Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

24. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through holes extending in a direction perpendicular to the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the plurality of through holes and the at least one recess; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate, wherein at least a portion of the plurality of first pads includes a front end surface aligned with the side surface of the substrate, wherein the plurality of through holes are arranged such that a virtual straight line parallel to the upper surface of the substrate and passing through the second pad passes through at least one of the plurality of through holes, and Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

25. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with a side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; at least one recessed portion located between the first side surface portion and the second side surface portion; and a plurality of through holes extending in a direction perpendicular to the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the plurality of through holes and the at least one recess; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate, wherein at least a portion of the plurality of first pads includes a front end surface aligned with the side surface of the substrate, wherein the plurality of through holes are arranged such that a virtual plane parallel to the side surface of the substrate passes through at least one of the plurality of through holes, and Each of the at least one recessed portion has a shape of a portion of one of the plurality of through holes.

26. The display device according to claim 22, 23, 24 or 25, wherein: The first insulating layer covers a side edge of the second pad connected to the front end surface of the second pad.

27. The display device according to claim 22, 23, 24 or 25, further comprising: a third pad, disposed below the second pad; as well as The second insulating layer is disposed between the third pad and the second pad.

28. A display device, comprising: a substrate comprising a display area and a peripheral area adjacent to the display area; a first insulating layer disposed over the peripheral region of the substrate and comprising: a first side surface portion including a side surface aligned with the side surface of the substrate; a second side surface portion spaced apart from the first side surface portion and including a side surface aligned with the side surface of the substrate; a third side surface portion located between the first side surface portion and the second side surface portion and including a side surface aligned with the side surface of the substrate; a first recessed portion located between the first side surface portion and the second side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; and a second recessed portion located between the second side surface portion and the third side surface portion and having a slit shape extending in a direction away from the side surface of the substrate; a plurality of first pads disposed on the first insulating layer and spaced apart from each other, the plurality of first pads filling at least a portion of the first concave portion and the second concave portion; and a second pad disposed between the substrate and the plurality of first pads, contacting the plurality of first pads, and including a front end surface aligned with the side surface of the substrate, At least a portion of the plurality of first pads includes a front end surface aligned with the side surface of the substrate.

29. The display device according to claim 28, wherein The first concave portion and the second concave portion are parallel to each other.

30. The display device according to claim 28, wherein The first insulating layer covers a side edge of the second pad connected to the front end surface of the second pad.

31. The display device according to claim 28, further comprising: a third pad, disposed below the second pad; as well as The second insulating layer is disposed between the third pad and the second pad.

Images