Mobile terminals and mid-frame components

Abstract

The present application provides a mobile terminal and a midframe assembly thereof. The midframe assembly is used to support electronic devices within the mobile terminal, the electronic devices including a heat source, and the midframe assembly includes a midframe, one or more heat pipes, and a first vapor chamber. The midframe includes a heat dissipation area corresponding to the heat source, the first vapor chamber is accommodated in the heat dissipation area, and the heat pipes are connected to the first vapor chamber for dissipating heat from the first vapor chamber. The present application improves the heat dissipation performance of the mobile terminal.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a mobile terminal and a middle frame assembly thereof. Background Art

[0002] Existing mobile terminals all dissipate heat through a single heat plate or a single heat pipe. However, as mobile terminals become increasingly intelligent, their main frequency upgrades generate more heat. If the excessive heat cannot be dissipated quickly, this will not only affect the service life of the mobile terminal, but also affect the consumer's intuitive experience. Summary of the Invention

[0003] The embodiments of the present application provide a terminal and a middle frame assembly thereof, which improve the heat dissipation performance of the mobile terminal.

[0004] In the first aspect, the present invention provides a middle frame assembly for carrying electronic devices in a mobile terminal, wherein the electronic devices include a heat source, the middle frame assembly includes a middle frame, one or more heat pipes and a first heat spreader; the middle frame includes a heat dissipation area corresponding to the heat source, and the first heat spreader is accommodated in the heat dissipation area; the first heat spreader can also be fixedly connected to the middle frame through the heat dissipation area, and the specific fixing method is not limited to the following: it can be fixed to the middle frame by bottom welding, side welding, bottom bonding, or fixed to the middle frame by a lap joint structure around the periphery, or connected to the middle frame by a bottom surface fixed with a combination of lap joints and lap joints around the periphery; each of the heat pipes is connected to the first heat spreader (the connection method between the two is not limited to lap welding fixation, welding and sealing after connection, etc.) for dissipating heat from the first heat spreader. The present application connects one end of the heat pipe to the first heat spreader, and the combined heat conduction effect of the two-dimensional extended heat conduction of the first heat spreader and the one-dimensional linear heat conduction of the heat pipe can be utilized to quickly dissipate the heat of the heat source, thereby increasing the service life of the heat source, thereby increasing the service life of the mobile terminal, and improving the user experience of consumers.

[0005] In one possible implementation, at least one of the one or more heat pipes is also connected to a portion of the middle frame whose temperature is lower than that of the first heat spreader. The portion of the middle frame whose temperature is lower than that of the first heat spreader may be an area at the edge of the middle frame, such as the edges on both sides of the middle frame or the bottom edge of the middle frame. In this way, when the mobile terminal is operating normally, since the first heat spreader is fixed on the middle frame, heat can be transferred to the first heat spreader and then to the heat pipe. The heat transferred to the heat pipe can be transferred to the entire middle frame. The heat from the heat source can be conducted to the entire middle frame, and the heat is conducted out through the middle frame. The middle frame has a large area and high heat dissipation efficiency, thereby improving the heat dissipation performance of the entire mobile terminal.

[0006] In one possible implementation, at least one of the one or more heat pipes is connected to the midframe via a thermally conductive medium. The thermally conductive medium may be thermally conductive adhesive or graphite. The thermal conductivity of the thermally conductive adhesive is more than twice that of a conventional adhesive layer, providing excellent thermal conductivity and rapidly transferring heat from the heat pipe to the entire midframe, resulting in high heat dissipation efficiency.

[0007] In one possible implementation, the interior space of at least one of the one or more heat pipes is connected to the interior space of the first vapor chamber to form a heat conduction cavity. The connected heat pipe and first vapor chamber form a larger, more complete heat conduction cavity. The working fluid in the heat conduction cavity travels a longer path and takes longer to complete a heat conduction cycle, allowing heat from the heat source to be transferred to a larger area of ​​the midframe. Heat is then conducted away in a more dispersed manner, resulting in higher heat dissipation efficiency.

[0008] In one possible implementation, at least one of the one or more heat pipes is inserted into the first vapor chamber. In this implementation, the heat pipe overlaps the first vapor chamber, providing improved connectivity between the heat pipe and the first vapor chamber.

[0009] In one possible implementation, the electronic device further includes a battery spaced apart from the heat source, and the midframe further includes a battery placement area corresponding to the battery. The battery placement area includes a first edge and a second edge disposed opposite each other, the heat dissipation area is adjacent to the first edge, and at least one of the one or more heat pipes extends from the heat dissipation area toward the second edge. This allows the heat pipe to extend over a wider range of the midframe, transferring heat from the heat source to a greater distance, thereby improving heat dissipation.

[0010] In one possible implementation, at least one of the one or more heat pipes does not contact the battery. Therefore, when the mobile terminal is operating normally, the mobile terminal generates heat, and the temperature of the portion of the heat pipe connected to the midframe is lower than the first vapor chamber. When the heat pipe is not in contact with the battery, heat is not transferred between the heat pipe and the battery, and the two do not interfere with each other. Furthermore, since the heat pipe bypasses the battery, there is no need to provide space on the battery surface for the heat pipe, which facilitates a thinner design for the mobile terminal.

[0011] In one possible embodiment, the one or more heat pipes include a first heat pipe and a second heat pipe spaced apart, with the first heat pipe surrounding the battery placement area and the second heat pipe partially overlapping the battery placement area. This embodiment enhances heat dissipation by arranging heat pipes both within the battery placement area and around the battery placement area.

[0012] In one possible implementation, the middle frame includes a top, a bottom arranged opposite to the top, and two side walls located at the top and the bottom. The heat dissipation area is located between the first edge of the battery placement area and the top. Other component placement areas are provided between the second edge of the battery placement area and the bottom. The middle frame also includes a second heat spreader, which is fixed to the other component placement areas. At least one of the one or more heat pipes is also connected to the second heat spreader. When the heat source is fixedly placed in the heat dissipation area and other heat sources are fixedly placed on other component placement areas, the heat of the heat source can be conducted to the first heat spreader and then to the heat pipe, and the heat of the other heat sources can be conducted to the second heat spreader and then to the heat pipe. Then, the combined action of the first heat spreader, the second heat spreader, and the heat pipe can quickly dissipate the heat of the heat source and other heat sources, thereby increasing the service life of the heat source and other heat sources, thereby increasing the service life of the mobile terminal and improving the consumer's experience. At the same time, since the first heat spreader and the second heat spreader are fixed on the middle frame, the heat from the heat source and other heat sources can be conducted to the entire middle frame, and the heat is conducted out through the middle frame to achieve the heat dissipation performance of the entire middle frame. The middle frame has a large area and high heat dissipation efficiency, which improves the heat dissipation performance of the entire mobile terminal.

[0013] In one possible implementation, one end of at least one of the one or more heat pipes is overlapped on the first vapor chamber, and the other end of at least one of the one or more heat pipes is overlapped on the second vapor chamber. This embodiment provides a method for connecting the heat pipe to the first and second vapor chambers. The overlap refers to the partial overlap between the heat pipe and the first and second vapor chambers in a direction perpendicular to the first and second vapor chambers. This connection structure is stable and reliable.

[0014] In one possible implementation, at least one of the one or more heat pipes extends along the periphery of the battery placement area, and at least a portion of the heat pipe is located within the gap between the battery placement area and the side wall of the middle frame. The gap between the battery placement area and the side wall of the middle frame is an idle space. In this application, a portion of the heat pipe is accommodated within the gap between the battery placement area and the side wall of the middle frame, that is, a portion of the heat pipe is accommodated within the idle space. This not only utilizes the idle space, but also eliminates the need to set up new space within the mobile terminal to accommodate the heat pipe, thereby avoiding increasing the size of the mobile terminal.

[0015] In one possible implementation, at least one of the one or more heat pipes is in contact with the surface of the battery. This allows heat from the battery to be transferred to the heat pipe and then to the entire midframe, allowing the midframe to dissipate heat from the battery, resulting in a large heat dissipation area and improved heat dissipation.

[0016] In one possible implementation, the one or more heat pipes include at least a first heat pipe and a second heat pipe spaced apart from each other, and both the first heat pipe and the second heat pipe are disposed around the battery placement area. When both the first heat pipe and the second heat pipe are disposed around the battery placement area, the space between the battery placement area and the sidewall is utilized, and neither heat pipe overlaps the battery placement area, thereby not affecting the thickness of the midframe. When a battery is placed in the mobile terminal, the heat pipes do not overlap with the battery, thereby not affecting the thickness of the mobile terminal.

[0017] In one possible implementation, at least one of the one or more heat pipes includes at least a first heat pipe and a second heat pipe that are spaced apart, the first heat pipe surrounds the battery placement area, and the second heat pipe overlaps the battery placement area. In this way, the heat dissipation effect of the two heat pipes can be utilized, and the area of ​​the middle frame that can be used for heat dissipation is larger, the heat dissipation effect is good, and the heat of the heat source can be dissipated more quickly, thereby increasing the service life of the heat source, thereby increasing the service life of the mobile terminal and improving the consumer's experience; the space between the battery placement area and the side wall of the middle frame and other spaces can also be effectively utilized. Moreover, this method of overlapping the second heat pipe on the battery placement area facilitates the installation of the second heat pipe and is convenient for operation, and the second heat pipe can be used to dissipate the heat of the battery.

[0018] In one possible implementation, the middle frame is provided with a first cutout area and a third cutout area, the third cutout area is formed at the bottom of the first cutout area, the first heat spreader is embedded in the first cutout area, at least one of the one or more heat pipes is partially embedded in the third cutout area, at least one of the one or more heat pipes in the third cutout area is stacked with the first heat spreader, the first cutout area is a groove or a hole, and the second cutout area is a groove or a hole. In this embodiment, some of the heat pipes are located between the first heat spreader and the heat source, and when the first and second cutout areas are groove structures, the openings of the first and second cutout areas are toward the side of the middle frame away from the heat source, and the heat source, the heat pipes, and the first heat spreader are separated by the middle frame, and the middle frame is used to support the heat source.

[0019] In one possible implementation, the middle frame is provided with a first cutout area, a second cutout area, and a third cutout area, the first heat spreader is embedded in the first cutout area, the second heat spreader is embedded in the second cutout area, and at least one of the one or more heat pipes is embedded in the third cutout area, the first cutout area is a groove or a hole, the second cutout area is a groove or a hole, and the third cutout area is a groove or a hole. This way of embedding the heat spreader and the heat pipe in the cutout area does not increase the thickness of the middle frame, and the mobile terminal can be thinner. It can be understood that the first cutout area, the second cutout area, and the third cutout area can be set at the same time in one embodiment. In other embodiments, one or two of the three cutout areas can also be selectively selected, depending on the specific structural configuration in the mobile terminal. For example, in some places, there is a gap between electronic components for the heat pipe to be placed, so there is no need to set a third cutout area. This architecture is conducive to the overall thin design of the mobile terminal and can reduce the weight of the mobile terminal.

[0020] In one possible implementation, at least one of the one or more heat pipes is connected to the first vapor chamber, meaning that their internal spaces are connected to each other to form a larger heat conduction cavity. The connected heat pipe and the first vapor chamber form a larger and complete heat conduction cavity internally. The working medium in the heat conduction cavity has a longer path and takes longer time to complete a heat conduction cycle, which can transfer the heat from the heat source to a larger area of ​​the middle frame. The heat is conducted away in a more dispersed manner, and the heat dissipation efficiency is high. The heat pipe and the second vapor chamber can also be set to a connected structure.

[0021] In a possible implementation, the thickness of the first vapor chamber increases in steps, and / or the thickness of the second vapor chamber increases in steps, so as to be suitable for electronic devices with a height that decreases in steps.

[0022] In a possible implementation, the number of heat pipes, first vapor chambers, and second vapor chambers is not limited to one, and may be two or more, and is configured according to specific heat dissipation requirements in the mobile terminal.

[0023] In one possible implementation, a thermally conductive film is provided on the outer surface of at least one of the one or more heat pipes, the first vapor chamber, and the second vapor chamber. The provision of the thermally conductive film allows heat from the heat pipe and the vapor chamber to be transferred out of the environment more quickly.

[0024] In one possible implementation, the middle frame is provided with a groove, the first vapor chamber is accommodated within the groove, and the first vapor chamber is secured to the bottom of the groove via thermally conductive adhesive. In a specific embodiment, the middle frame includes a first overlapping edge extending into the groove, the first vapor chamber includes a third overlapping edge, and the first overlapping edge is secured by overlapping engagement with the third overlapping edge.

[0025] It is understandable that the middle frame may further include a second overlapping edge for fixing the second vapor chamber. The first vapor chamber includes a third overlapping edge, and the first overlapping edge overlaps the third overlapping edge, so that the first vapor chamber is fixed to the heat dissipation area, and the first overlapping edge and the third overlapping edge can be fixed by welding. Similarly, the second vapor chamber may include a fourth overlapping edge, and the second overlapping edge overlaps the fourth overlapping edge, so that the second vapor chamber is fixed to the other component placement area. This fixing method is not only easy to implement, but also has a good fixing effect.

[0026] Specifically, in one embodiment, in a scheme in which the first heat spreader and the middle frame are fixedly connected by overlapping edges, the grooves opened on the middle frame can be holes. When the grooves are holes, the middle frame does not have a part for supporting the first heat spreader, but the connection between the first heat spreader and the middle frame can be achieved through overlapping edges.

[0027] In other embodiments, the first slot defined in the middle frame can also be in the form of a blind hole, that is, the first slot is not a hole. In this way, a portion of the structure on the middle frame can be called a bearing portion, which can be used to support the first vapor chamber. The first vapor chamber is fixed to the bearing portion of the middle frame via thermally conductive adhesive. In this embodiment, to reduce the thickness of the thermally conductive adhesive, the connection between the first vapor chamber and the middle frame becomes less strong after the thickness of the thermally conductive adhesive decreases. To protect the strength and reliability of the connection, an overlapping structure can also be provided. That is, the first overlapping edge on the middle frame cooperates with the third overlapping edge on the first vapor chamber to enhance the reliability of the connection between the first vapor chamber and the middle frame. In this embodiment, the first vapor chamber and the middle frame are fixed together through the cooperation of thermally conductive adhesive and the overlapping structure.

[0028] In one possible implementation, at least one of the one or more heat pipes extends between the electronic components, and / or at least one of the one or more heat pipes extends between the electronic components and the boundary of the midframe. In this way, not only can the gaps between the electronic components and the gaps between the electronic components and the boundary of the midframe be used to accommodate the heat pipes, but there is no need to add new space for accommodating the heat pipes, and there is no need to increase the thickness of the mobile terminal.

[0029] The present application provides a mobile terminal, comprising a mainboard and the above-mentioned middle frame, wherein the mainboard comprises the electronic device, the mainboard is installed in the middle frame, and the heat source of the mainboard is arranged in the heat dissipation area of ​​the middle frame. The heat on the mobile terminal can be quickly dissipated, thereby increasing the service life of the mobile terminal and improving the user experience of the consumer. At the same time, since the first heat sink is fixed to the middle frame, the heat from the heat source can be conducted to the entire middle frame, and the heat is conducted away through the middle frame to achieve the heat dissipation performance of the entire middle frame. The middle frame has a large area and high heat dissipation efficiency, thereby improving the heat dissipation performance of the entire mobile terminal.

[0030] In one possible implementation, the mobile terminal further includes a screen, a mainboard, a battery and a battery cover, the middle frame further includes a battery placement area corresponding to the battery, the battery placement area is arranged on one side of the heat dissipation area, the screen and the mainboard are respectively installed on opposite sides of the middle frame, the heat source of the mainboard is arranged in the heat dissipation area of ​​the middle frame, the battery is electrically connected to the mainboard, the battery is located on the side of the mainboard away from the middle frame, and the battery is located in the battery placement area, the battery cover is installed on the middle frame, and the battery cover fixes the mainboard and the battery in the middle frame.

[0031] In one possible implementation, the heat pipe has a wire groove on its outer surface for securing the internal wires of the mobile terminal. The wires are used to electrically connect the electronic components within the mobile terminal. For example, the wires are used to electrically connect the electronic components within the heat dissipation area with the electronic components within the other component placement area. The wire groove on the heat pipe surface can serve as a carrier for the wires, thereby securing the wires within the heat pipe's wire groove, thereby fixing the wires in place, preventing damage to the wires due to shaking, and extending the service life of the mobile terminal.

[0032] In a second aspect, the present application further provides a mobile terminal, comprising a mainboard and a middle frame assembly as described in any one of the foregoing items, wherein the heat source is provided on the mainboard, and the mainboard is mounted on the middle frame.

[0033] In a third aspect, the present application further provides a heat dissipation assembly, comprising at least one heat spreader and at least one heat pipe in the first aspect and various implementations of the first aspect, wherein the connection method of the at least one heat spreader and the at least one heat pipe can be referred to the aforementioned aspects and implementations and will not be repeated here. The heat dissipation assembly provided in this aspect can be combined with the middle frame in the mobile terminal as described in the aforementioned aspects to achieve better heat dissipation. In other implementations, it can also be combined with other components of other devices to achieve better heat dissipation.

[0034] In summary, this application connects one end of the heat pipe to the first vapor chamber, utilizing the combined thermal conductivity of the vapor chamber's two-dimensional extended heat conduction and the heat pipe's one-dimensional linear heat conduction to quickly dissipate heat from the heat source, thereby increasing the service life of the heat source, and thereby increasing the service life of the mobile terminal, improving the user experience for consumers. Furthermore, because the first vapor chamber is fixed to the middle frame, the heat from the heat source can be conducted to the entire middle frame, which then conducts the heat away, achieving the heat dissipation performance of the entire middle frame. The middle frame has a large area and high heat dissipation efficiency, improving the heat dissipation performance of the entire mobile terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0036] Figure 1a is a schematic cross-sectional view of a mobile terminal provided by an embodiment of the present invention;

[0037] Figure 1b is another cross-sectional schematic diagram of a mobile terminal provided by an embodiment of the present invention;

[0038] Figure 2 is a schematic top view of a middle frame in a middle frame assembly provided by an embodiment of the present invention;

[0039] Figure 3 is a schematic top view of a first structure of a middle frame assembly provided by an embodiment of the present invention;

[0040] Figure 4 is a schematic top view of a second structure of a middle frame assembly provided by an embodiment of the present invention;

[0041] Figure 5 is a cross-sectional schematic diagram of the overlap between the heat pipe and the first vapor chamber;

[0042] Figure 6 is a cross-sectional schematic diagram showing the heat pipe being connected to the first vapor chamber;

[0043] Figure 7 is a cross-sectional schematic diagram showing that the thickness of the first vapor chamber increases in steps;

[0044] Figure 8 is a schematic top view of a third structure of a middle frame provided by an embodiment of the present invention;

[0045] Figure 9 2 is a cross-sectional schematic diagram of a heat pipe overlapping a first vapor chamber and a second vapor chamber;

[0046] Figure 10 is a cross-sectional schematic diagram showing the heat pipe being connected to the first vapor chamber and the second vapor chamber;

[0047] Figure 11 is a schematic top view of a fourth structure of a middle frame assembly provided by an embodiment of the present invention;

[0048] Figure 12 is a top view schematically illustrating a fifth structure of a middle frame assembly provided by an embodiment of the present invention;

[0049] Figure 13 1 is a top view schematic diagram of a sixth structure of a middle frame assembly provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0051] See also Figure 1a 、 Figure 1b and Figure 2 , Figure 1a and Figure 1b The following are cross-sectional schematic diagrams of two mobile terminals provided in embodiments of the present invention. Mobile terminals include, but are not limited to, tablet computers, mobile phones, watches, e-readers, remote controls, personal computers (PCs), laptops, in-vehicle devices, network televisions, and wearable devices. The mobile terminal may include a motherboard 10, a screen 20, a battery 30, a midframe assembly 40, and a battery cover 110.

[0052] The motherboard 10 may include a variety of electronic devices, among which some electronic devices (such as various processors) will generate relatively large amounts of heat during operation and usually require heat dissipation treatment (such as installing some radiators). These electronic devices are referred to as heat sources in this application.

[0053] like Figure 1b As shown, the middle frame assembly 40 may include a middle frame 401, a heat pipe 60 and a first vapor chamber (VC) 70. The middle frame 401 is an internal bracket of the device and can be used to carry the screen 20, the motherboard 10 and other electronic components. The screen 20 and the motherboard 10 are respectively installed on the opposite sides of the middle frame 401. The battery 30 and the motherboard 10 are located on the same side of the middle frame 401. The battery 30 is electrically connected to the motherboard 10. The battery cover 110 and the middle frame 401 form an accommodating space. The motherboard 10, the battery 30 and other electronic components are accommodated in the accommodating space. Other electronic components may be cameras, buttons, speakers, etc. The material of the middle frame 401 may be a metal material with a certain hardness, such as aluminum alloy.

[0054] The present application integrates the heat pipe 60 and the first heat spreader 70 on the middle frame 401 to form the middle frame assembly 40 to improve the heat dissipation performance of the mobile terminal. Both the heat spreader and the heat pipe have a vacuum heat conduction cavity, the inner wall of the heat conduction cavity has a capillary structure, and is injected with a working fluid, which can be pure water. The working principles of two-phase heat dissipation components such as VC and heat pipes are similar, including four main steps: conduction, evaporation, convection, and solidification. Taking the heat spreader as an example, the following is explained: the heat generated by the heat source enters the heat spreader through heat conduction. The working fluid near the heat source absorbs the heat and quickly vaporizes, taking away a large amount of heat at the same time; then, using the latent heat of steam, when the steam in the plate diffuses from the high-pressure area (i.e., high-temperature area) to the low-pressure area (i.e., low-temperature area), when the steam contacts the inner wall with a lower temperature, it will quickly condense into a liquid and release heat energy; the working fluid condensed into a liquid returns to the heat source through the capillary force of the microstructure, thereby completing a heat conduction cycle and forming a two-way circulation system in which the working fluid coexists in two phases, vapor and liquid. The vapor chamber has a larger area than a heat pipe, allowing for two-dimensional heat conduction. Heat pipes are relatively narrow, allowing for one-dimensional linear heat conduction, specifically along the direction of the heat pipe's extension. Heat pipes are typically made of metal, such as aluminum or copper. Vapor chambers are also typically made of metal, such as copper.

[0055] In the present application, the physical parameters of the heat pipe 60 and the heat spreader (such as the first heat spreader 70) can be the same, or at least one physical parameter can be different, such as different shell material combinations, different internal working fluid materials, different capillary structures (capillary layer cross-sectional area), etc., one or more of the working fluid mass (i.e., the filling amount of the working fluid), the type of working fluid, the tube material of the heat pipe 60 (which can be copper or aluminum) and the thickness.

[0056] like Figure 2 As shown, Figure 2 The top view of the middle frame 401 in one embodiment of the present application is shown. The middle frame 401 includes a top 401a, a bottom 401b opposite to the top 401a, and two opposite side walls 401c and 401d located between the top 401a and the bottom 401b. The top 401a, the bottom 401b, and the two side walls 401c refer to the four edges of the outer periphery of the middle frame (from the top 401a to the bottom 401b). Figure 2The schematic diagram shown shows four sides, which are actually the outer surfaces of the middle frame from a three-dimensional perspective. These four surfaces are the border surfaces connecting the screen and the back cover of the mobile terminal). Taking a mobile phone as an example, the mobile terminal has a roughly rectangular middle frame, and the two side walls 401c are the long sides of the middle frame. The middle frame 401 may include a heat dissipation area 402 corresponding to the heat source 101, a battery placement area 403 corresponding to the battery 30, and other component placement areas 404. The heat dissipation area 402 is located between the battery placement area 403 and the top 401a, and the other component placement areas 404 are located between the battery placement area 403 and the bottom 401b. In other embodiments, the heat dissipation area 402 may also be located between the battery placement area 403 and a side wall 403a.

[0057] The heat dissipation area 402 is used to provide a portion of space for installing one or more heat sinks (such as VCs or heat pipes) to dissipate heat from the heat source. For example, the heat dissipation area 402 can be a cutout area on the middle frame 401, that is, an area where part of the middle frame material has been cut out. Specifically, part of the middle frame material can be cut out to form a "groove", or all of the middle frame material can be cut out to form a "hole". Of course, in other embodiments, the material on the heat dissipation area 402 can also be left uncut. To achieve a thin design for the mobile terminal, a hole can be drilled in the middle frame 401. The hole area can be used to accommodate a heat source on the motherboard (such as a processor), and then a VC can be installed on the heat source to dissipate heat from the heat source. The heat dissipation area 402 can also be a solid area on the middle frame 401 without a hole, but can be slotted to accommodate a heat source or VC (for example, by slotting both the front and back sides to accommodate both the VC and the heat source, or by slotting only one side to accommodate either the VC or the heat source). In other embodiments, neither holes nor grooves may be formed, or both holes and grooves may be formed (there may be both grooves and holes in one area, or the grooves and holes may be arranged at intervals). Similarly, the battery placement area 403 and the other component placement area 404 may also be hollowed-out areas or solid areas on the middle frame 401, or a combination of these two areas. Among them, the "groove" in this application refers to a recessed structure that does not pass through the middle frame, and the shape is not limited (for example, it can be rectangular, square, circular or various irregular shapes); the "hole" in this application (which can also be understood as a "hole" or "opening") is a structure formed by passing through the middle frame, and the shape is also not limited.

[0058] The battery placement area 403 is surrounded by a first edge 403a, a second edge 403b, a third edge 403c, and a fourth edge 403d. The heat dissipation area 402 is located between the first edge 403a and the top 401a of the battery placement area 403. A other component placement area 404 is provided between the second edge 403b and the bottom 401b of the battery placement area 403. A gap 50 is provided between the battery placement area 403 and the side wall 401c of the middle frame 401. Usually, electronic devices are not arranged between the battery placement area 403 and the side wall 401c of the middle frame 401. The present application utilizes this gap 50 to arrange the heat pipe 60 to improve the heat dissipation performance.

[0059] Specifically, a first gap 501 is defined between the third edge 403c and the first sidewall 401c, and a second gap 502 is defined between the fourth edge 403d and the second sidewall 401d. Slots or holes may be provided in the middle frame 401 at the locations of the first gap 501 and the second gap 502. A hole is a through-hole formed by hollowing out the middle frame. The purpose of providing the slots and holes may be to achieve a thinner design for the mobile terminal or to reduce the weight of the middle frame 401. However, to ensure the rigidity of the middle frame 401, slots or holes may be provided at appropriate locations, and thickness may be retained at appropriate locations to ensure the overall rigidity of the middle frame 401, making it less susceptible to deformation and capable of supporting electronic devices.

[0060] See also Figure 3 , Figure 3 What is shown is a schematic diagram of the top structure of the middle frame assembly 40. The first heat spreader 70 is accommodated in the heat dissipation area 402. Specifically, the first heat spreader 70 can be fixedly connected to the middle frame 401 at the heat dissipation area 402. The specific fixing method is not limited to the following: it can be fixed to the middle frame 401 by bottom welding, fixed to the middle frame 401 by side welding, fixed to the middle frame 401 by bottom bonding, or fixed to the middle frame 401 by a lap joint structure around the periphery, or connected to the middle frame 401 by a bottom surface fixed combined with a lap joint around the periphery. The heat pipe 60 is connected to the first heat spreader 70 for dissipating heat from the first heat spreader 70. The connection method between the two is not limited to lap welding fixation, welding and sealing after connection, etc. The thickness of the first heat spreader 70 can be less than or equal to 0.8 mm, and the nominal diameter of the heat pipe 60 can be less than or equal to 8 mm. In order to meet the requirements of the mobile terminal to be thinner, the thickness of the heat pipe 60 can be less than or equal to 0.6 mm. The small-sized heat pipe 60 can extend between electronic devices or between the electronic devices and the side walls of the middle frame 401, utilizing the space between the electronic devices and the gap between the electronic devices and the side walls of the middle frame 401, improving the heat dissipation performance while also facilitating the miniaturization of the mobile terminal. The thickness of the first heat spreader 70 can be the same as or different from the thickness of the heat pipe 60. The heat pipe 60 can be made into unequal thicknesses, unequal widths, bends, and form step differences, etc., depending on the specific usage scenario.

[0061] The present application connects one end of the heat pipe 60 to the first heat spreader 70. The combined heat conduction effect of the two-dimensional extended heat conduction of the heat spreader and the one-dimensional linear heat conduction of the heat pipe 60 can be utilized to quickly dissipate the heat of the heat source 101, thereby increasing the service life of the heat source 101 and reducing the temperature of the heat source. This in turn increases the service life of the mobile terminal and reduces the temperature during use, thereby improving the user experience of the consumer. At the same time, the first heat spreader 70 can be fixed to the middle frame 401. For example, the first heat spreader 70 can be fixedly connected to the middle frame 401 by welding. The heat from the heat source 101 can be conducted to the entire middle frame 401 through the first heat spreader 70. The heat is then conducted away through the middle frame 401. The middle frame assembly 40 has a large area and high heat dissipation efficiency, thereby improving the heat dissipation performance of the entire mobile terminal.

[0062] In the present application, the fixing methods of the first vapor chamber 70 in the heat dissipation area 402 include but are not limited to the following two methods.

[0063] The first type: the heat dissipation area 402 is a hole. In this way, even if the thickness of the first heat spreader 70 is relatively thick, the hole can accommodate the thicker first heat spreader 70, and the first heat spreader 70 will not increase the thickness of the middle frame assembly 40. Moreover, the setting of the hole can maximize the first heat spreader 70 without increasing the thickness of the middle frame assembly 40. At the same time, in order to better dissipate heat and fix, the first heat spreader 70 can also be fixed to the middle frame 401 through an overlapping structure. Specifically: the middle frame 401 includes a first overlapping edge 401a, and the first overlapping edge 401a extends toward the hole. The first heat spreader 70 includes a third overlapping edge 70a, and the third overlapping edge 70a is protruding from the periphery of the first heat spreader 70. The first overlapping edge 401a overlaps the third overlapping edge 70a. At the overlapping point of the two, they can be fixed by welding or by glue, so that the first heat spreader 70 is fixed on the middle frame 401 (see Figure 1b The first vapor chamber is further configured to connect to a heat source and dissipate heat from the heat source, for example, by using a thermally conductive adhesive.

[0064] The second method is: the heat dissipation area 402 is a groove, that is, the heat dissipation area 402 still retains a certain thickness of the middle frame material to support the first heat sink 70. The first heat sink 70 is embedded in the groove and can be fixed to the bottom wall of the groove using thermal conductive adhesive. That is, the first heat sink 70 and the middle frame 401 are fixed by thermal conductive adhesive. This fixing structure requires a thicker thermal conductive adhesive. In another embodiment, the thermal conductive adhesive can be set as a thinner layer. At the same time, an overlapping structure is set on the middle frame 401 and an overlapping structure is set at the edge of the first heat sink 70. The overlapping structure of the middle frame 401 (see the overlapping structure of the first fixing method for details) cooperates with the overlapping structure of the first heat sink to form an overlapping fixing scheme. This overlapping fixing scheme, combined with the thermal conductive adhesive, fixes the first heat sink 70 to the middle frame 401. This method of embedding the first heat sink 70 in the groove does not increase the thickness of the middle frame assembly 40, so the middle frame assembly 40 can be thinner, and the mobile terminal can be thinner. It can be understood that the heat dissipation area 402 is also used to connect to the heat source to dissipate heat from the heat source. For example, the connection is performed by means of thermally conductive adhesive, and the heat generated by the heat source is first conducted to the heat dissipation area 402 in the middle frame, and then dissipated through the first heat spreader fixed on the heat dissipation area 402.

[0065] In this application, there is at least one heat pipe 60 and at least one first heat spreader 70. One or more heat spreaders can be selected based on actual engineering design requirements (such as internal space structure layout, heat dissipation requirements, etc.). Figure 3 In the illustrated implementation, there is one heat pipe 60 and one vapor chamber (i.e., the first vapor chamber 70). It is understood that when there are multiple heat pipes 60 or multiple vapor chambers, the heat dissipation area of ​​the midframe assembly 40 can be increased, resulting in higher heat dissipation efficiency. In one of the embodiments below, a single heat pipe 60 and a single vapor chamber (the first vapor chamber 70) will be used for illustration.

[0066] The connection between the heat pipe 60 and the first vapor chamber 70 will be described in detail below.

[0067] Please continue reading Figure 3 , Figure 3 The middle frame assembly 40 shown includes a middle frame 401, a heat pipe 60, and a heat spreader (first heat spreader 70). The heat pipe 60 includes a first section 60a and a second section 60b arranged opposite to the first section 60a. The first section 60a and the second section 60b refer to a section of the heat pipe 60 extending from one end to the other in the opposite direction. Specifically, Figure 3In the illustrated embodiment, the heat pipe includes two ends: a first segment 60a connected to a first vapor chamber 70, and a second segment 60b as a free end that can be fully or partially connected to other devices that are relatively cool relative to the first vapor chamber (such as a midframe, battery, or other electronic components). In another embodiment, the heat pipe 60 can also have multiple branches and thus multiple ends. In this case, there will be more segments, some of which can be connected to the first vapor chamber 70, while others can be connected to other devices that are relatively cool relative to the first vapor chamber.

[0068] When the heat source 101 generates heat during operation, the heat can first be transferred to the first heat spreader 70 (assuming that the heat dissipation area 402 is a hole, the first heat spreader 70 is connected to the heat source through the hole, or the first heat spreader 70 is placed in the hole and connected to the heat source). The heat on the first heat spreader 70 can be transferred along the first section 60a of the heat pipe 60 to the second section 60b. The second section 60b is relatively far away from the heat source 101. The second section 60b can dissipate the heat more quickly, and then the heat from the heat source 101 can be conducted to the entire heat pipe 60, completing a heat conduction cycle within the entire heat pipe 60. The heat dissipation area is large, the heat dissipation efficiency is high, and the heat dissipation performance of the entire mobile terminal is improved. It can be understood that when the heat generated by the heat source 101 is small, the heat can be transferred to a position between the first section 60a and the second section 60b, and a heat conduction cycle can be completed. In addition, when the first heat spreader 70 and the middle frame 401 are fixed by some heat-conducting means (such as welding or bonding with thermally conductive adhesive), the heat on the first heat spreader 70 can also be transferred to the entire middle frame 401, and further dissipated through the middle frame 401.

[0069] In other embodiments, the heat pipe 60 and the heat spreader (such as the first heat spreader 70) can be fixed to the middle frame 401 (such as Figure 1b As shown), the heat generated by the operation of the heat source 101 can first be transferred to the first section 60a of the heat pipe 60, and the first section 60a of the heat pipe 60 transfers the heat to the first heat spreader 70, and transfers the heat to the second section 60b of the heat pipe 60. In other embodiments, since the heat source 101 may include electronic devices of different heights, the taller electronic devices can directly contact the first heat spreader 70, and a gap can be formed between the smaller electronic devices and the first heat spreader 70. The heat pipe 60 can be set at the position of this gap. The first section 60a of the heat pipe 60 and the first heat spreader 70 can both contact the heat source 101. In this way, the heat generated by the operation of the heat source 101 can be simultaneously transferred to the first section 60a of the heat pipe and the first heat spreader 70. In this way, the heat pipe 60 can be arranged in a smaller space to transfer heat to the area of ​​the mobile terminal that does not generate heat. At the same time, the two-dimensional heat conduction of the first heat spreader 70 can be used, which has a good heat conduction effect, and the heat can be transferred to the area with lower temperature in the mobile terminal through the second section 60b of the heat pipe 60.

[0070] The present application combines the heat pipe 60 with the first heat spreader 70, and transfers heat to the lower temperature area in the mobile terminal through the second section 60b of the heat pipe, thereby achieving efficient heat dissipation. The heat pipe 60 extends from the heat dissipation area 402 toward the second edge 403b. In other words, the heat pipe 60 extends from the first edge 403a to the second edge 403b of the battery placement area 403, and the second section 60b of the heat pipe 60 can be located between the first edge 403a and the second edge 403b ( Figure 3 As shown). It is understandable that the second section 60b of the heat pipe 60 may also go beyond the second edge 403b and be located in other component placement areas 404 (such as Figure 4 As shown), it can be understood that the gap between the battery placement area 403 and the side wall 401c of the middle frame 401 and the other component placement area 404 can be regarded as areas with lower temperatures, and the temperatures of these two places are lower than the temperature at the heat dissipation area 402.

[0071] Please continue reading Figure 3 , Figure 3 The heat pipe 60 is shown extending along the periphery of the battery placement area 403. The periphery of the battery placement area 403 can be between the battery placement area 403 and the sidewall of the middle frame 401, or between the battery placement area 403 and the heat dissipation area 403. When the heat pipe 60 extends along the periphery of the battery placement area 403, the heat pipe 60 does not overlap with the battery placement area 403, and does not affect the thickness of the middle frame assembly 40. When a battery is placed in the mobile terminal, the heat pipe 60 does not come into contact with the battery, and does not affect the thickness of the mobile terminal.

[0072] Specifically, the heat pipe 60 is connected to a portion of the middle frame 40 whose temperature is lower than that of the first heat spreader 70, and is not in contact with the battery. That is, when the mobile terminal is operating normally, the mobile terminal generates heat, and the temperature of the portion of the heat pipe 60 connected to the middle frame 401 is lower than that of the first heat spreader 70. The portion of the middle frame 401 whose temperature is lower than that of the first heat spreader 70 can be the portion of the middle frame 401 on the side away from the first heat spreader 401, that is, the heat pipe 60 is also connected to the side of the middle frame 401 away from the first heat spreader 401. The heat dissipation area of ​​the middle frame 401 is large and the heat dissipation efficiency is high. Moreover, when the heat pipe 60 is not in contact with the battery, the heat on the heat pipe 60 and the battery will not be transferred to each other. The heat pipe 60 does not overlap with the battery and will not affect the thickness of the mobile terminal. It can be understood that the first heat spreader 70 is used to dissipate heat for the heat source 101, such as for dissipating heat for the CPU. The portion of the middle frame assembly 40 whose temperature is lower than that of the first heat spreader 70 can be located in the bottom area of ​​the mobile terminal, or in the area close to the boundary of the middle frame assembly 40. These areas can be used to place antennas, buttons, speakers, etc. When the mobile terminal is operating normally, the temperature of these areas is lower than that of the first heat spreader 70. The heat pipe 60 can be connected to these areas, or to the components on these areas.

[0073] In one embodiment, the gap 50 between the battery placement area 403 and the side wall 401c of the middle frame 401 is an idle space, and part of the heat pipe 60 can be accommodated in the gap 50 between the battery placement area 403 and the side wall 401c of the middle frame 401, that is, part of the heat pipe 60 is accommodated in the idle space. This not only utilizes the idle space, but also does not require setting up new space in the mobile terminal to accommodate the heat pipe 60, thereby not increasing the volume of the mobile terminal. In other embodiments, there is a large gap between the battery placement area 403 and the top 401a of the middle frame 401, such as the gap between electronic components. Part of the heat pipe 60 can be accommodated in the gap between these electronic components and extend in the gap. The gap can be on the side of the middle frame 40 corresponding to the motherboard 10.

[0074] See also Figure 5-Figure 6 , Figure 5-Figure 6 The connection relationship between the heat pipe 60 and the first vapor chamber 70 is shown. The connection relationship between the heat pipe 60 and the first vapor chamber 70 includes but is not limited to the following three types.

[0075] The first one: Figure 5 As shown, the heat pipe 60 overlaps the first heat spreader 70 in a direction perpendicular to the surface of the first heat spreader 70. Specifically, the first section 60a is overlapped to the first heat spreader 70 in a direction perpendicular to the first heat spreader 70, that is, the first section 60a is located outside the first heat spreader 70 and overlaps with part of the first heat spreader 70. The two can be connected by a thermal conductive adhesive to increase the thermal conductivity. The overlapping connection between the heat pipe 60 and the first heat spreader 70 can transfer the heat transferred from the heat source 101 to the first heat spreader 70 to the heat pipe 60 by heat conduction, which not only can quickly transfer heat, but also the connection method between the heat pipe 60 and the first heat spreader 70 is simple and easy to operate. In a specific implementation method, the same working fluid can be provided in the heat pipe 60 and the first heat spreader 70. Of course, different working fluids can be provided in the heat pipe 60 and the first heat spreader 70. For example, a first working fluid can be provided in the heat pipe 60, and a second working fluid can be provided in the first heat spreader 70. The first working fluid is different from the second working fluid. For example, the first working fluid can be methanol, R134A, acetone, etc., and the second working fluid can be water, etc. The heat pipe 60 and the first heat spreader 70 can be connected by a heat conducting medium. The heat conducting medium can be a thermal conductive glue or a graphite material. The thermal conductivity of the thermal conductive glue can reach more than 1W / mK. The thermal conductivity of the thermal conductive glue is more than twice the thermal conductivity of the ordinary adhesive layer, and has good thermal conductivity.

[0076] The second type: Figure 6As shown, the heat pipe 60 is connected to the first heat spreader 70. Specifically, a first cavity 7 is provided in the first heat spreader 70, a second cavity 6 is provided in the heat pipe 60, and the first section 60a extends into the interior of the first heat spreader 70. A hole can be punched in the first heat spreader 70, and the first section 60a of the heat pipe 60 is extended into the hole and sealed and fixed by welding. The solution of the first section 60a extending into the first heat spreader 70 can connect the internal space of the first heat spreader 70 with the internal space of the heat plate 60, forming a complete and larger heat conduction cavity. Figure 6 As shown, the connected heat pipe and the first vapor chamber form a larger and complete heat conduction cavity internally. The capillary structure a in the first vapor chamber 70 is connected to the capillary structure b in the heat pipe 60. The working medium in the heat conduction cavity has a longer path and takes longer to complete a heat conduction cycle. This allows the heat from the heat source to be transferred to a larger area of ​​the middle frame, and the heat is conducted away in a more dispersed manner, resulting in high heat dissipation efficiency. It can be understood that when the first vapor chamber 70 and the heat pipe 60 are connected, it is equivalent to extending the conduction path of the heat-conducting medium in the heat conduction cavity. This allows for temperature equalization between the heat source concentrated area and the lower temperature area in the terminal. This architecture achieves better temperature equalization.

[0077] The third type: the first section 60a is connected to the side of the first heat spreader 70. The first heat spreader 70 and the first section 60a can be fixed by welding through other connecting parts, or the first section 60a can be fixedly connected to the overlapping edge set at the outer edge of the first heat spreader 70.

[0078] In this application, the heights of the electronic components in the mobile terminal may vary, such as the heights of the components forming the heat source 101, which makes some areas of the middle frame 40 thicker and some areas thinner. Therefore, the thickness of the heat spreader in this application may also be uneven. For example, see Figure 7 The first heat spreader 70 includes three parts of unequal thickness. The first cavity 7 in the first heat spreader 70 is also distributed in a state of unequal volume. A capillary structure a is provided in the first cavity 7, and the capillary structure a is distributed in a stepped manner. A plurality of support columns are also distributed in the first cavity 7 of the first heat spreader 70 to support the first cavity 7 to prevent the first heat spreader 70 from deforming and reducing the internal space of the first cavity. In this embodiment, the thickness of the first heat spreader 70 increases in a stepped manner, which can be adapted to electronic devices with a stepped height decrease. This can also gradually increase the volume of the flow cavity inside the first heat spreader 70, expand the flow range of the working medium, and achieve better heat dissipation. It is understandable that the uneven thickness of the first heat spreader 70 can be in other ways, such as the thickness of the first heat spreader 70 is uniformly staggered in height or unevenly staggered in height to correspond to electronic devices of different heights. The thickness of the first heat spreader 70 can also decrease linearly or increase linearly. The thickness of the first vapor chamber 70 of the present application is determined according to the height of the electronic device in a specific usage environment.

[0079] The present application can realize the use of two-phase components (heat pipe 60 and heat spreader) of different thicknesses in different areas; the use of two-phase components (heat pipe 60 and heat spreader) of different widths in different areas, and realize the flexible layout of the two-phase components (heat pipe 60 and heat spreader) on the mobile terminal middle frame 40.

[0080] See also Figure 8 , Figure 8 This is another schematic diagram of the structure of the middle frame assembly 40 from a top view, which shows that the middle frame assembly 40 includes a heat pipe 60 and two heat spreaders (a first heat spreader 70 and a second heat spreader 80). The second heat spreader 80 is fixed to the other component placement area 404, and the heat pipe 60 connects the first heat spreader 70 and the second heat spreader 80. In this embodiment, the first section 60a of the heat pipe 60 is fixedly connected to the first heat spreader 70, and the second section 60b of the heat pipe 60 is fixedly connected to the second heat spreader 80, that is, when the heat source is fixedly placed in the heat dissipation area 402 and the other heat sources are fixedly placed on the other component placement area 404, the heat of the heat source can be conducted to the first heat spreader 70 and conducted to the heat pipe 60, and the heat of the other heat sources can be conducted to the second heat spreader 80 and conducted to the heat pipe 60, and then the combined effect of the first heat spreader 70, the second heat spreader 80 and the heat pipe 60 can quickly dissipate the heat of the heat source and other heat sources, thereby increasing the service life of the mobile terminal and improving the consumer's experience.

[0081] See also Figure 9 , Figure 9 A method of connecting the first and second heat spreaders 70 and 80 by the heat pipe 60 is shown. The first heat spreader 70 includes a first top surface 701 and a first bottom surface 702 arranged opposite to the first top surface 701, and the second heat spreader 80 includes a second top surface 801 and a second bottom surface 802 arranged opposite to the second top surface 801. The methods of connecting the first and second heat spreaders 70 and 80 by the heat pipe 60 include but are not limited to the following four methods: the heat pipe 60 connects the first top surface 701 and the second top surface 801; the heat pipe 60 bends to connect the first top surface 701 and the second bottom surface 802; the heat pipe 60 bends to connect the first bottom surface 702 and the second top surface 801 ( Figure 9); The heat pipe 60 connects the first bottom surface 702 and the second bottom surface 802. The above four methods of connecting the heat pipe 60 to the first heat spreader 70 and the second heat spreader 80 can all achieve the purpose of transferring heat from the heat source 101 and other heat sources 102 to the first heat spreader 70, the second heat spreader 80 and the heat pipe 60, as well as to the entire middle frame 40. Which method is selected specifically depends on the actual usage requirements. The working fluids in the heat pipe 60, the first heat spreader 70 and the second heat spreader 80 can be the same or different. For example, a first working fluid is provided in the heat pipe 60, a second working fluid is provided in the first heat spreader 70, and a third working fluid is provided in the second heat spreader 80. At least one of the first working fluid, the second working fluid and the third working fluid is different. The first working fluid, the second working fluid and the third working fluid can be one, two or three of methanol, R134A, acetone or water.

[0082] See also Figure 10 , Figure 10 A way of communicating the heat pipe 60 with the first heat spreader 70 and the second heat spreader 80 is shown. The internal space of the heat pipe 60, the internal space of the first heat spreader 70 and the internal space of the second heat spreader 80 together form a heat conduction cavity. Specifically, the heat pipe 60 can be communicated with one of the first heat spreader 70 and the second heat spreader 80, or the heat pipe 60 is communicated with the first heat spreader 70 and the second heat spreader 80. The communication method is the same as the communication method between the heat pipe 60 and the first heat spreader 70 mentioned above, and this application will not go into details here. The heat pipe 60, the first heat spreader 70 and the second heat spreader 80 after being connected form a larger and complete heat conduction cavity inside. The working medium in the heat conduction cavity has a longer path and a longer time to complete a heat conduction cycle, and the heat from the heat source can be transferred to a larger area of ​​the middle frame 40. The heat is conducted out in a more dispersed manner, and the heat dissipation efficiency is high.

[0083] The way the second heat spreader 80 is fixed to the middle frame 401 in the other component placement area 404 can be the same as the way the first heat spreader is fixed to the middle frame 401 in the heat dissipation area 402. A first groove, a second groove and a third groove can be set on the middle frame 401, the first groove is set at the heat dissipation area 402, the second groove is set at the other component placement area 404, the first heat spreader 70 is embedded in the first groove, the second heat spreader 80 is embedded in the second groove, and the heat pipe 60 is set in the third groove. This way of embedding the heat spreader and the heat pipe in the groove does not increase the thickness of the middle frame 401 in this way, and the mobile terminal can be thinner. It can be understood that the first groove, the second groove and the third groove can be set at the same time in one embodiment. In other embodiments, one or two of the three grooves can also be selectively selected according to the specific structural configuration in the mobile terminal. For example, in some places, there is just a gap between the electronic components for the heat pipe to be placed, so there is no need to set a third groove.

[0084] Of course, it is understandable that the middle frame 401 is provided with a first groove and a third groove, the third groove is formed at the bottom of the first groove, the first heat spreader 70 is embedded in the first groove, the heat pipe 60 is partially embedded in the third groove, and the heat pipe 60 in the groove is stacked with the first heat spreader 70. In this embodiment, part of the heat pipe 60 is located between the first heat spreader 70 and the heat source 101, and the openings of the first groove and the third groove are facing the side of the middle frame 401 away from the heat source 101. The heat source 101 and the heat pipe 60 and the first heat spreader 70 are separated by the middle frame 401, and the middle frame 401 is used to support the heat source 101. In this way, the heat of the heat source 101 will first be transferred to the middle frame 401 opposite to the heat source 101, and then transferred to the first heat spreader 70, the heat pipe 60 and the rest of the middle frame 401, so that the heat of the mobile terminal can be quickly dissipated.

[0085] In other embodiments, "holes" may be used to replace one or more "slots", that is, the first slot, the second slot and the third slot may be in the form of "holes", and these three slots may also be designed as a structure in which part of them are slots and part of them are holes.

[0086] See also Figure 11 , a wire groove 608 is provided on the outer surface of the heat pipe 60. The wire groove 608 is used to fix the wires inside the mobile terminal. The wires are used to electrically connect the electronic devices in the heat dissipation area 402 and the electronic devices in other component placement areas. Specifically, the heat source can be a plurality of high-power devices such as a CPU or GPU, and other heat sources can be heat sources such as screen sound generation and screen drive. The above-mentioned heat sources and other heat sources need to be connected through wires, and the wire groove 608 on the surface of the heat pipe 60 can serve as a carrier for the wires, so that the wires can be fixed in the wire groove 608 of the heat pipe 60, thereby fixing the position of the wires, avoiding damage to the wires due to shaking, and improving the service life of the mobile terminal. The specific method of providing the wire groove 608 on the surface of the heat pipe 60 can be to form a groove on the outer surface of the heat pipe 60 by machining, or to weld a structure for fixing the wires on the outer surface of the heat pipe 60, such as a hook similar to a wiring harness, and the wire groove 608 can be formed in the hook.

[0087] In a specific embodiment, the outer surfaces of the heat pipe 60 and the vapor chambers (first vapor chamber 70 and second vapor chamber 80) are provided with a thermally conductive film. The thermally conductive film can be made of graphene. The provision of the thermally conductive film allows the heat from the heat pipe and the vapor chamber to be transferred out of the environment more quickly.

[0088] A specific embodiment in which the middle frame assembly 40 includes two heat pipes 60 and a vapor chamber (a first vapor chamber 70 ) will be described below.

[0089] See also Figure 12 , Figure 12 It is another schematic diagram of the top structure of the middle frame assembly 40. In this embodiment, the heat pipe 60 includes at least a first heat pipe 603 and a second heat pipe 604 that are spaced apart, and the first heat pipe 603 and the second heat pipe 604 are both arranged around the battery placement area 403. The arrangement of the two heat pipes 60 has a good heat dissipation effect, which can dissipate the heat of the heat source more quickly, thereby increasing the service life of the heat source, thereby increasing the service life of the mobile terminal and improving the consumer's experience. When the first heat pipe 603 and the second heat pipe 604 are both arranged around the battery placement area 403, the gap between the battery placement area 403 and the third side wall 401c and the fourth side wall 401d is utilized. The two heat pipes 60 will not overlap with the battery placement area 403, and will not affect the thickness of the middle frame 40. When a battery is placed in the mobile terminal, the heat pipe 60 will not overlap with the battery, and will not affect the thickness of the mobile terminal.

[0090] In a specific implementation, the first section 60a of the first heat pipe 603 is accommodated between the top 401a and the battery placement area 403, and is close to the third edge 403c. The second section 60b of the first heat pipe 603 extends to the first gap 501 between the third edge 403c and the third side wall 401c. The second heat pipe 604 is also partially accommodated between the top 401a and the battery placement area 403, and is close to the fourth edge 403d. The second heat pipe 604 partially extends to the second gap 502 between the fourth edge 403d and the fourth side wall 401.

[0091] See also Figure 13 , Figure 13 Another schematic diagram of the top view of the middle frame 40 assembly is shown. There are still two heat pipes 60 shown in this figure. The second heat pipe 604 surrounds the battery placement area 403, and the first heat pipe 603 overlaps the battery placement area 403. When the space between the battery placement area 403 and the side wall 401c of the middle frame 401 is not enough to accommodate two heat pipes 60, one of the heat pipes 60 can be overlapped on the battery placement area 403. In this way, the heat dissipation effect of the two heat pipes 60 can be utilized, and the area of ​​the middle frame 401 that can be used for heat dissipation is larger, the heat dissipation effect is good, and the heat of the heat source can be dissipated more quickly, which increases the service life of the heat source, thereby increasing the service life of the mobile terminal and improving the consumer's experience. The space between the battery placement area 403 and the third side wall 401c and the fourth side wall 401d of the middle frame 401 and other spaces can also be effectively utilized. Moreover, the manner in which the first heat pipe 603 overlaps the battery placement area 403 facilitates installation of the first heat pipe 603 and facilitates operation, and the first heat pipe 603 can be used to dissipate heat from the battery.

[0092] Specifically, when the first heat pipe 603 overlaps the battery placement area 403, the first heat pipe 603 is connected to the surface of the battery, so that the heat on the battery can also be transferred to the first heat pipe 603, and then transferred to the entire middle frame 401, thereby realizing the heat dissipation of the battery by the middle frame 401, with a large heat dissipation area and good heat dissipation effect.

[0093] In another embodiment, the middle frame assembly 40 may include two heat pipes 60 and two vapor chambers, such as a first heat pipe 603, a second heat pipe 604, a first vapor chamber 70, and a second vapor chamber 80. The first vapor chamber 70 is fixed to the heat dissipation area 402, and the second vapor chamber 80 is fixed to the other component placement area 404. The first heat pipe 603 and the second heat pipe 604 both surround the battery placement area 403. The first section 60a of the first heat pipe 603 is connected to the first vapor chamber 70, and the second section 60b of the first heat pipe 603 is connected to the second vapor chamber 80. The first section 60a of the second heat pipe 604 is connected to the first vapor chamber 70, and the second section 60b of the second heat pipe 604 is connected to the second vapor chamber 80.

[0094] Of course, in other implementations, there may be more heat pipes 60 and heat spreaders, such as a third heat spreader, a third heat pipe 60, etc. More heat spreaders connected to heat pipes 60 can achieve heat dissipation over a larger area.

[0095] At least one heat pipe 60 of the one or more heat pipes 60 provided in the present application extends between electronic devices, and / or at least one heat pipe 60 of the one or more heat pipes extends between the electronic device and the boundary of the middle frame 401. The electronic device may be a backlight module, battery, CPU, camera, button, speaker, etc. in the terminal. Figure 13 As shown, the first heat pipe 603 extends between the electronic components, which can be understood as extending between the battery and the backlight module stacked with the battery. The second heat pipe 604 extends between the electronic components and the middle frame boundary, which can be understood as extending between the battery and the middle frame boundary. The above-mentioned middle frame assembly 40 and the mobile terminal of the present application realize the comprehensive heat conduction effect of the heat pipe 60 and the heat spreader, enhance the heat dissipation effect, and improve the consumer experience.

[0096] The above disclosure is only a preferred embodiment of the present application, and certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present invention are still within the scope covered by the application.

Claims

1. A middle frame assembly for carrying electronic devices in a mobile terminal, wherein the electronic devices include a heat source, characterized in that: The middle frame assembly includes a middle frame, one or more heat pipes and a first heat spreader, wherein the first heat spreader has a two-dimensional extended thermal conductivity, and the heat pipe has a one-dimensional linear thermal conductivity; The middle frame includes a heat dissipation area corresponding to the heat source, and the first heat sink is accommodated in the heat dissipation area for dissipating heat from the heat source; The one or more heat pipes are connected to the first vapor chamber for dissipating heat from the first vapor chamber; The interior space of the heat pipe and the interior space of the first vapor chamber are independent of each other, and the outer surface of the heat pipe and the outer surface of the first vapor chamber overlap each other; or the interior space of the heat pipe and the interior space of the first vapor chamber are connected, and one end of the heat pipe is inserted into the interior of the first vapor chamber; A wire groove is provided on the outer surface of at least one of the one or more heat pipes. The wire groove is used to fix the internal wires of the mobile terminal. The wires are used to electrically connect electronic devices in the mobile terminal.

2. The middle frame assembly according to claim 1, characterized in that: At least one of the one or more heat pipes is further connected to a portion of the middle frame whose temperature is lower than that of the first vapor chamber.

3. The middle frame assembly according to claim 2, characterized in that: At least one heat pipe among the one or more heat pipes is connected to the middle frame via a heat conducting medium.

4. The middle frame assembly according to claim 1, characterized in that: The one or more heat pipes are connected to the first vapor chamber via a heat conducting medium.

5. The middle frame assembly according to claim 1, characterized in that: The electronic device also includes a battery, and the middle frame also includes a battery placement area corresponding to the battery, the battery placement area includes a first edge and a second edge arranged opposite to each other, the heat dissipation area is adjacent to the first edge, and at least one of the one or more heat pipes extends from the heat dissipation area toward the second edge.

6. The middle frame assembly according to claim 5, characterized in that: At least one of the one or more heat pipes is not in contact with the battery.

7. The middle frame assembly according to claim 6, characterized in that: The middle frame includes a top, a bottom arranged opposite to the top, and two side walls located at the top and the bottom. A gap is formed between the battery placement area and the side walls, and at least one of the one or more heat pipes extends into the gap.

8. The middle frame assembly according to claim 6, characterized in that: At least one of the one or more heat pipes is in contact with a surface of the battery.

9. The middle frame assembly according to claim 5, characterized in that: The one or more heat pipes include a first heat pipe and a second heat pipe that are spaced apart. The first heat pipe surrounds the battery placement area, and the second heat pipe partially overlaps the battery placement area.

10. The middle frame assembly according to claim 5, characterized in that: The middle frame includes a top, a bottom arranged opposite to the top, and two side walls located at the top and the bottom. The heat dissipation area is located between the first edge of the battery placement area and the top. Other component placement areas are provided between the second edge of the battery placement area and the bottom. The middle frame also includes a second heat spreader, which is fixed to the other component placement areas. At least one of the one or more heat pipes is also connected to the second heat spreader.

11. The middle frame assembly according to claim 10, characterized in that: The middle frame is provided with a first cutout area, a second cutout area and a third cutout area, the first heat spreader is embedded in the first cutout area, the second heat spreader is embedded in the second cutout area, at least one heat pipe of the one or more heat pipes is embedded in the third cutout area, the first cutout area is a groove or a hole, the second cutout area is a groove or a hole, and the third cutout area is a groove or a hole.

12. The middle frame assembly according to claim 11, characterized in that: One end of at least one of the one or more heat pipes is overlapped on the first vapor chamber, and the other end of at least one of the one or more heat pipes is overlapped on the second vapor chamber.

13. The middle frame assembly according to any one of claims 1 to 10, characterized in that: The middle frame is provided with a hole, the middle frame includes a first overlapping edge extending toward the inside of the hole, the first heat spreader includes a third overlapping edge, and the first overlapping edge overlaps the third overlapping edge to fix the first heat spreader to the middle frame.

14. The middle frame assembly according to claim 13, characterized in that: The first overlapping edge and the third overlapping edge are fixed by welding.

15. The middle frame assembly according to any one of claims 1 to 10, characterized in that: The middle frame is provided with a groove, the first heat spreader is accommodated in the groove, and the first heat spreader is fixed to the bottom of the groove by thermal conductive glue.

16. The middle frame assembly according to claim 15, characterized in that: The middle frame includes a first overlapping edge extending toward the groove, the first heat spreader includes a third overlapping edge, and the first overlapping edge is overlapped and fixed with the third overlapping edge.

17. The middle frame assembly according to any one of claims 1 to 10, characterized in that: The middle frame is provided with a first cutout area and a third cutout area, the third cutout area is formed at the bottom of the first cutout area, the first heat spreader is embedded in the first cutout area, at least one of the one or more heat pipes is partially embedded in the third cutout area, and at least one of the one or more heat pipes in the portion in the third cutout area is stacked with the first heat spreader, the first cutout area is a groove or a hole, and the third cutout area is a groove or a hole.

18. The middle frame assembly according to claim 1, characterized in that: At least one heat pipe among the one or more heat pipes extends between the electronic devices, and / or at least one heat pipe among the one or more heat pipes extends between the electronic devices and a boundary of the middle frame.

19. A mobile terminal, characterized in that: It comprises a mainboard and a middle frame assembly as described in any one of claims 1 to 18, wherein the heat source is provided on the mainboard, and the mainboard is mounted on the middle frame.

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