Heat transfer member and electronic device including the same

Abstract

An electronic device for improving heat transfer is provided. The electronic device includes: a housing; a display mounted on at least one surface of the housing; a battery; a support member disposed adjacent to a rear surface of the display and supporting the display; a printed circuit board on which electronic components are mounted; a shielding cover surrounding at least a portion of the electronic components; a shielding structure disposed on an outer surface of the shielding cover to shield the electronic components; and a first heat transfer member disposed on an outer surface of the shielding structure and including a local area facing at least one electronic component among a plurality of electronic components mounted on the printed circuit board and another local area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

Description

Technical Field

[0001] The present disclosure generally relates to heat transfer components and electronic devices including the same. Background Art

[0002] Advances in mobile technology are leading to increased demand for more compact and lightweight portable terminals (eg, smartphones) that maximize user portability and convenience and integrate components in a smaller space for higher performance.

[0003] As electronic components used in electronic devices provide higher performance and capabilities, they typically generate more heat, affecting nearby components and degrading overall performance.

[0004] For example, an electronic device may have a main circuit board that is elongated in the length direction of the electronic device, such as in the shape of the letter "I". At least a portion of a battery positioned adjacent to the main circuit board may be flush with the main circuit board. When at least a portion of the battery is flush with the I-shaped main circuit board, the increase in the size of the main circuit board may impose limitations on the available space for placing the battery. As viewed from above the electronic device, the I-shaped main circuit board may be sized to correspond to the mounting area of ​​the electronic components. Therefore, placing a larger capacity battery compromises the miniaturization of the mounting area of ​​the electronic components of the electronic device.

[0005] In order to place a larger battery in an electronic device, a half printed circuit board (PCB) may be used, ie, a PCB that occupies approximately half of the overall size of the display.

[0006] In order to avoid a significant reduction in the installation space of electronic components, a stacked PCB structure can be used to ensure additional installation area for electronic components. If an electronic device utilizes a semi-PCB and a stacked PCB, the main heat-generating components of the electronic device (such as an application processor (AP) or a fifth-generation (5G) modem) may be arranged close to each other on the main circuit board. Therefore, the heat generated when the electronic device is running may be concentrated in one part of the electronic device (such as the top), which may cause performance degradation of the electronic device. Therefore, heat dissipation and cooling of the heat source may be required.

[0007] In addition, 5G antennas and radio frequency integrated circuits (RFICs) for 5G communications may be mounted in modules separate from heat sources mounted on the main circuit board. Therefore, they may require separate coolers. Summary of the invention

[0008] Technical issues

[0009] The present disclosure is designed to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below.

[0010] According to one aspect of the present disclosure, a heat dissipation structure is provided that can effectively transfer heat generated from a portion (eg, a top portion) of an electronic device to another portion (eg, a bottom portion) of the electronic device where the temperature is relatively low.

[0011] According to another aspect of the present disclosure, a heat dissipation structure is provided, which can cool a modular heat source in an electronic device by transferring, diffusing, scattering or releasing heat generated from the heat source.

[0012] Solutions to the problem

[0013] According to one aspect of the present disclosure, there is provided an electronic device, which includes: a housing; a display mounted on at least one surface of the housing; a battery; a support member disposed adjacent to a rear surface of the display and supporting the display; a printed circuit board on which electronic components are mounted; a shielding cover surrounding at least a portion of the electronic components; a shielding structure disposed on an outer surface of the shielding cover to shield the electronic components; and a first heat transfer member disposed on an outer surface of the shielding structure and including a local area facing at least one electronic component among a plurality of electronic components mounted on the printed circuit board and another local area bent and facing another electronic component among the plurality of electronic components mounted on the printed circuit board.

[0014] According to another aspect of the present disclosure, an electronic device is provided, the electronic device comprising: a housing, comprising a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, a support member arranged between the front plate and the rear plate to form a space, a first area and a second area, the first area dividing the space along a length direction from one end of the support member, the second area being positioned adjacent to the first area and dividing the space parallel to the first area; a printed circuit board, a plurality of electronic components being mounted on the printed circuit board, the printed circuit board being arranged in the first area and comprising a first printed circuit board on which a first plurality of electronic components are mounted and a second printed circuit board at least partially overlapping the first printed circuit board and electrically connected to the first printed circuit board; a battery arranged in the second area; and a first heat transfer member, comprising a local area facing at least one electronic component among the first plurality of electronic components mounted on the first printed circuit board and at least another local area being bent and facing another electronic component among the first plurality of electronic components mounted on the first printed circuit board.

[0015] Advantageous Effects of the Invention

[0016] As is apparent from the foregoing description, according to various embodiments, use of a heat dissipation member and an electronic device including the same can effectively transfer heat generated from various electronic components of the electronic device to a relatively low temperature portion.

[0017] According to one embodiment, the electronic device can use a heat sink and / or heat transfer material located adjacent to the antenna module to effectively release heat generated from the antenna module (e.g., a 5G antenna module). The heat sink includes a low dielectric constant material to prevent the efficiency of the wireless communication signal from being reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 An electronic device in a network environment according to an embodiment is shown;

[0020] Figure 2A shows a front perspective view of an electronic device according to an embodiment;

[0021] Figure 2B shows a rear perspective view of an electronic device according to an embodiment;

[0022] Figure 2C An exploded perspective view showing an electronic device according to an embodiment;

[0023] Figure 3 An electronic device in a network environment including multiple cellular networks according to an embodiment is shown;

[0024] Figure 4A An electronic device including an antenna module according to an embodiment is shown;

[0025] Figure 4B Shown along Figure 4A An electronic device including an antenna module intercepted by line CC';

[0026] Figure 4C Shown along Figure 4A An electronic device including an antenna module intercepted by line D-D';

[0027] Figure 4D Shown along Figure 4A An electronic device including an antenna module intercepted by line EE';

[0028] Figure 5A A cross-sectional view showing an electronic device according to an embodiment;

[0029] Figure 5B A cross-sectional view showing an electronic device according to an embodiment;

[0030] Figure 6 shows the heat distribution and heat diffusion direction of components of an electronic device according to an embodiment;

[0031] Figure 7 shows a heat sink located on a rear surface of a display according to an embodiment;

[0032] Figure 8 showing a third heat transfer member located on a top surface of a support member according to an embodiment;

[0033] Fig. 9 A support member according to an embodiment is shown;

[0034] Fig.10 shows a second heat transfer member located on the rear surface of the support member (or on the top surface of the battery) according to one embodiment;

[0035] Fig.11 showing a first heat transfer member located on a top surface of at least one electronic component mounted on a PCB according to an embodiment;

[0036] Fig.12 A heat sink located on a rear surface of a wireless charging antenna according to an embodiment is shown;

[0037] Fig.13 A clad sheet according to an embodiment is shown;

[0038] Fig.14 shows an arrangement of an electronic component, a shielding structure and a first heat transfer member according to an embodiment;

[0039] Fig.15A shows a first heat transfer member according to an embodiment;

[0040] Fig. 15B shows a front view of a first heat transfer member according to an embodiment;

[0041] Fig. 15C shows a side view of a first heat transfer member according to an embodiment;

[0042] Fig.16 An antenna module and a low dielectric constant heat sink according to an embodiment are shown;

[0043] Fig.17A FIG. 1 shows a mounting structure of a vertically mounted antenna module according to an embodiment;

[0044] Fig. 17B illustrates a vertically mounted antenna module according to an embodiment;

[0045] Fig. 17C A cross-sectional view showing a mounting structure of a vertically mounted antenna module according to an embodiment;

[0046] Fig.18A PCB of a horizontally mounted antenna module according to an embodiment is shown;

[0047] Fig.19 illustrates a vertically mounted antenna module and mounting portion according to an embodiment; and

[0048] Fig. 20 A thermal analysis simulation of a heat transfer member and an electronic device including the heat transfer member according to an embodiment is shown. DETAILED DESCRIPTION

[0049] Various embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. In the following description, specific details such as detailed configuration and components are provided only to help fully understand these embodiments. Therefore, it should be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure.

[0050] Also, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

[0051] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0052] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0053] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may process or calculate various data. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an AP) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0054] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) other than the main processor 121, or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0055] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0056] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0057] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0058] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0059] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0060] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound through the input device 150, or output sound through the sound output device 155 or an external electronic device (e.g., the electronic device 102 (e.g., a speaker or earphone)) directly or wirelessly connected to the electronic device 101.

[0061] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0062] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0063] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0064] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0065] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0066] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0067] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0068] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication through the established communication channel. The communication module 190 may include one or more CPs that can operate independently from the processor 120 (e.g., AP) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0069] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. Then, a signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components (e.g., RFIC) other than the radiator may be further formed as a part of the antenna module 197.

[0070] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0071] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. The first external electronic device 102 and the second external electronic device 104 may each be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0072] Figure 2A A front perspective view of an electronic device according to an embodiment is shown. Figure 2B A rear perspective view of an electronic device according to an embodiment is shown.

[0073] Reference Figure 2A and Figure 2B , the electronic device 200 includes a housing 210 having a first (or front) surface 210A, a second (or rear) surface 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. Optionally, the housing may represent a Figure 2AThe structure of the first surface 210A, the second surface 210B and the side surface 210C. At least part of the first surface 210A can have a substantially transparent front plate 202 (e.g., a glass plate or polymer plate including various coatings). The second surface 210B can be formed by a substantially opaque rear plate 211. The rear plate 211 can be formed by laminated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (SUS) or magnesium) or a combination of at least two thereof. The side surface 210C can be formed by a side frame structure (or "side member") 218, which is connected to the front plate 202 and the rear plate 211 and includes metal and / or polymer. The rear plate 211 and the side frame plate 218 can be formed integrally together and include the same material (e.g., metal, such as aluminum).

[0074] The front plate 202 includes two first areas 110D on two long edges of the front plate 202, which extend seamlessly and curvedly from the first surface 210A to the rear plate 211. Figure 2A As shown, the rear plate 211 includes two second areas 210E on two long edges, which extend seamlessly and curvedly from the second surface 210B to the front plate 202. The front plate 202 (or the rear plate 211) may include only one of the first areas 210D (or the second areas 210E). Optionally, the first area 210D or the second area 210E may be partially excluded. In the side view of the electronic device 200, for the side without the first area 210D or the second area 210E, the side frame structure 218 may have a first thickness (or width), and for the side with the first area 210D or the second area 210E, the side frame structure 218 may have a second thickness less than the first thickness.

[0075] The electronic device 200 includes a display 220, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting device 206, and connector holes 208 and 209. Alternatively, the electronic device 200 may not include at least one of the components (e.g., the key input device 217 or the light emitting device 206), or additional components may be added.

[0076] Figure 2C An exploded perspective view of an electronic device according to an embodiment is shown.

[0077] Reference Figure 2C, the electronic device 200 includes a front panel 202, a display 220, a support member 230 (or a first support member) (e.g., a bracket), a PCB 250, a battery (BAT), an antenna 260, a second support member 270 (e.g., a clad metal (SUS / copper (Cu) / SUS layer) material) and a rear panel 280. Optionally, the electronic device 200 may not include at least one of the components, or additional components may be added.

[0078] The support member 230 may be disposed inside the electronic device 200 to be connected to the side frame structure 231 or to be integrated with the side frame structure 231 . Figure 2C An example is shown in which the side frame structure 231 is integrally formed with the support member 230. The support member 230 may have a placement portion 232 formed to correspond to the size of the display 220. The display 220 may be coupled to one surface 230a of the support member 230, and the PCB 250 may be coupled to the opposite surface 230b of the support member 230. The support member 230 may include a rigid portion to support at least a portion of the PCB. The support member 230 may be formed of, for example, a metal and / or a non-metal material (e.g., a polymer).

[0079] The support member 230 may contact the rear surface of the display 220 and support at least a portion of the display 220. The support member 230 may support at least a portion of the PCB 250 on a surface different from a surface contacting the display 220.

[0080] Various electronic components (eg, a processor, a memory, and / or an interface) may be mounted on the PCB 250 .

[0081] The processor may include, for example, one or more of a central processing unit, an application processor (AP), a graphics processing device (GPU), an image signal processing (ISP), a sensor hub processor, or a communication processor (CP). The memory may include, for example, a volatile or non-volatile memory. The interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0082] At least a portion of the front surface of the electronic device may have a substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various coatings). The rear surface of the electronic device may be formed by a rear plate 280 that is substantially opaque (e.g., laminated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, SUS, or magnesium), or a combination of at least two thereof). The side surface of the electronic device may be formed by a side frame structure 231 coupled to the front plate 202 and the rear plate 280 and include metal and / or polymer.

[0083] The side frame structure 231 may be integral with the support member 230. The rear panel 280 and the side frame panel 231 may be integrally formed together and include the same material (eg, metal such as aluminum).

[0084] The display 220 may be exposed through a portion of the front plate 202. The edge of the display 220 may be formed to be substantially the same in shape as an adjacent outer edge of the front plate 202. The interval between the outer edge of the display 220 and the outer edge of the front plate 202 may be maintained substantially uniform to give the display 220 a larger exposed area.

[0085] The electronic device 200 may include various elements for transferring heat generated from the inside of the electronic device to a relatively low temperature place. For example, the electronic device 200 may include at least one heat transfer member.

[0086] The electronic device may include a first heat transfer member 240. At least a partial area of ​​the first heat transfer member 240 may be disposed to face at least one electronic component among a plurality of electronic components mounted on the PCB 250, and at least another partial area that is bent may be disposed to face another electronic component among the plurality of electronic components mounted on the PCB 250. The first heat transfer member 240 may be shaped to cover at least a portion of the PCB 250.

[0087] The electronic device may include a second heat transfer member 235 disposed to face at least one surface (e.g., 230b) of the support member 230. The second heat transfer member 235 may be disposed between the support member 230 and the battery. At least a portion of the first heat transfer member 240 may be disposed parallel to the second heat transfer member 235 along the length direction of the electronic device.

[0088] The housing may include a first region (eg Figure 2C The first area is divided into a space from one end of the support member 230 along the length direction. The PCB 250 is disposed in the first area. The housing may include a second area (eg Figure 2CThe second area is located adjacent to the first area and divides the space in parallel with the first area. A battery for power supply is arranged in the second area. The housing may include a second area (e.g. Figure 2C The third region (e.g. Figure 2C An auxiliary PCB (eg, a PCB on which an interface is formed) is formed in the third region.

[0089] The first heat transfer member 240 may be disposed in a region corresponding to at least a portion of the first area S1 , and the second heat transfer member 235 may be disposed in a region S2 corresponding to at least a portion of the second area.

[0090] The electronic device may further include a third heat transfer member 234 disposed on a surface 230a of the support member 230 opposite to a surface 230b on which the second heat transfer member 235 is disposed. The third heat transfer member 234 may be disposed between the display 220 and the support member 230. The third heat transfer member 234 may be disposed in an area corresponding to at least a portion of the first area and at least a portion of the second area.

[0091] The electronic device 200 may include at least one heat sink and / or at least one heat transfer material.

[0092] A heat sink 221 (or film or plate) formed of Cu or a high thermal conductivity carbon-based material (eg, carbon black, graphene, carbon nanotubes, graphite, etc.) may be disposed on the rear surface of the display 220. The electronic device 200 may further include other heat sinks and / or heat transfer materials.

[0093] The battery can supply power to at least one component of the electronic device 200. The battery can include a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. The battery can be housed in a housing. At least a portion of the battery can be disposed on a substantially same plane as the PCB 250 (e.g., flush with the PCB 250). The battery can be integrally formed inside the electronic device 200. Optionally, the battery can be detachably disposed in the electronic device 200.

[0094] The antenna 260 may be disposed between the back plate 280 and the battery. The antenna 260 may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 260 may perform short-range communication with an external device, or may wirelessly transmit or receive power for charging. The antenna structure may be formed by a portion or combination of the placement portion 232 and / or the side frame structure 231 constituting the support member 230.

[0095] The electronic device 200 may include an antenna module 290. For example, a portion of the antenna module 290 may be implemented to send or receive radio waves with different characteristics (referred to as radio waves of frequency bands A and B) to achieve multiple input multiple output (MIMO). As another example, a portion of the antenna module 290 may be configured to simultaneously send or receive radio waves with the same characteristics (referred to as radio waves of frequencies A1 and A2 in frequency band A) to achieve diversity. Another portion of the antenna module 290 may be configured to simultaneously send or receive radio waves with the same characteristics (referred to as radio waves of frequencies B1 and B2 in frequency band B) to achieve diversity. Two antenna modules may be included. Alternatively, the electronic device 200 may include four antenna modules to achieve both MIMO and diversity. The electronic device 200 may include only one antenna module 290.

[0096] Considering the transmission and reception characteristics of radio waves, when one antenna module is disposed at a first position of the printed circuit board 250, another antenna module may be disposed at a second position spaced apart from the first position of the printed circuit board 250. As another example, one antenna module and another antenna module may be disposed in consideration of a distance therebetween according to diversity characteristics.

[0097] The antenna module 290 may include a wireless communication circuit to process radio waves sent or received in a high frequency band (e.g., 6 GHz or higher and 300 GHz or lower). The conductive plate of the antenna module 290 may be formed by a conductive plate of a dipole structure extending in one direction or a patch-type radiating conductor. A plurality of conductive plates may be arranged to form an antenna array. A chip (e.g., an integrated circuit (IC) chip) in which a portion of the wireless communication circuit is implemented may be disposed on a surface opposite to a surface on which the conductive plate is disposed, or on one side of an area where the conductive plate is disposed, and may be electrically connected to the conductive plate via a line formed by a printed circuit pattern.

[0098] Figure 3 An electronic device in a network environment including multiple cellular networks according to an embodiment is shown.

[0099] Reference Figure 3 , the electronic device 301 includes a first CP 312, a second CP 314, a first RFIC 322, a second RFIC 324, a third RFIC 326, a fourth RFIC 328, a first RF front end (RFFE) 332, a second RFFE 334, a first antenna module 342, a second antenna module 344, and an antenna 348. The electronic device 301 also includes a processor 120 and a memory 130. The second network 199 may include a first cellular network 392 and a second cellular network 394. The electronic device 301 may also include Figures 2A-2CThe second network 199 may further include at least one of the components of the wireless communication module 192. The first CP 312, the second CP 314, the first RFIC 322, the second RFIC 334, the fourth RFIC 328, the first RFFE 332, and the second RFFE 334 may form at least part of the wireless communication module 192. The fourth RFIC 328 may be omitted or included as part of the third RFIC 326.

[0100] The first CP 312 can establish a communication channel for a frequency band for wireless communication with the first cellular network 392, or can support traditional network communication via the established communication channel. The first cellular network can be a traditional network including a second generation (2G), a third generation (3G), a fourth generation (4G) and / or a long-term evolution (LTE) network. The second CP 314 can be a communication channel corresponding to a specified frequency band (e.g., from about 6 GHz to about 60 GHz) among the frequency bands for wireless communication with the second cellular network 394, or can support 5G network communication through the established communication channel. The second cellular network 394 can be a 5G network defined by the third generation partnership project (3GPP). In addition, the first CP 312 or the second CP 314 can be a communication channel corresponding to another specified frequency band (e.g., about 6 GHZ or lower) among the frequency bands for wireless communication with the second cellular network 394, or can support 5G network communication via the established communication channel. The first CP 312 and the second CP 314 can be implemented in a single chip or a single package. The first CP 312 or the second CP 314 and the processor 120 , the auxiliary processor 123 , or the communication module 190 may be formed in a single chip or a single package.

[0101] The first RFIC 322 may convert a baseband signal generated by the first CP 312 into a radio frequency signal (RF) having a frequency in a range from about 700 MHz to about 3 GHz, which is used by the first cellular network 392 (e.g., a legacy network). The RF signal may be obtained from the first cellular network 392 through the first antenna module 342 and may be pre-processed via the first RFFE 332. The first RFIC 322 may convert the pre-processed RF signal into a baseband signal that may be processed by the first CP 312.

[0102] The second RFIC 3324 may convert a baseband signal generated by the first CP 312 or the second CP 314 into a Sub6 band (eg, approximately 6 GHz or lower) RF signal used by the second cellular network 394 (hereinafter, referred to as a “5G Sub6 RF signal”).

[0103] The 5G Sub6 RF signal may be obtained from the second cellular network 394 through the second antenna module 344 and may be pre-processed via the second RFFE 334. The second RFIC 324 may convert the pre-processed 5G Sub6 RF signal into a baseband signal that may be processed by corresponding processors in the first CP 312 and the second CP 314.

[0104] The third RFIC 326 may convert the baseband signal generated by the second CP 314 into an RF signal of a 5G Above6 frequency band (e.g., from about 6 GHz to about 60 GHz) to be used by a second cellular network 394 (e.g., a 5G network) (hereinafter, referred to as a "5G Above6 RF signal"). The 5G Above6 RF signal may be obtained from the second cellular network 394 through the antenna 348 and may be pre-processed via the third RFFE 336. The third RFIC 326 may convert the pre-processed 5G Above6 RF signal into a baseband signal that may be processed by the second CP 314. The third RFFE 336 may be formed as part of the third RFIC 326.

[0105] The electronic device 301 may include a fourth RFIC 328 that is separate from the third RFIC 326, or include the fourth RFIC 328 as at least part of the third RFIC 326. In this case, the fourth RFIC 328 may convert the baseband signal generated by the second CP 314 into an intermediate frequency band (e.g., from about 9 GHz to about 11 GHz) RF signal (hereinafter, referred to as an "intermediate frequency (IF) signal"), and transmit the IF signal to the third RFIC 326. The third RFIC 326 may convert the IF signal into a 5G Above 6 RF signal. The 5G Above 6 RF signal may be received from the second cellular network 394 through the antenna 348 and may be converted into an IF signal through the third RFIC 326. The fourth RFIC 328 may convert the IF signal into a baseband signal that may be processed by the second CP 314.

[0106] The first RFIC 322 and the second RFIC 3324 may be implemented as at least part of a single chip or a single package. The first RFFE 332 and the second RFFE 334 may be implemented as at least part of a single chip or a single package. At least one of the first antenna module 342 or the second antenna module 344 may be omitted or combined with another antenna module to process multi-band RF signals.

[0107] The third RFIC 326 and the antenna 348 may be disposed on the same substrate to form a third antenna module 346. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (e.g., a main PCB). The third RFIC 326 and the antenna 348 may be disposed on one region (e.g., a bottom) and another region (e.g., a top) of a second substrate (e.g., a sub-PCB) provided separately from the first substrate, respectively, to form the third antenna module 346.

[0108] Arranging the third RFIC 326 and the antenna 348 on the same substrate can shorten the length of the transmission line therebetween, which can reduce the loss (e.g., attenuation) of high-frequency band (e.g., from about 6 GHz to about 60 GHz) signals for 5G network communication due to the transmission line. Therefore, the electronic device 101 can improve the communication quality with the second cellular network 394.

[0109] The antenna 348 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. The third RFIC 326 may include a plurality of phase shifters 338 corresponding to the plurality of antenna elements as part of the third RFFE 336. The plurality of phase shifters 338 may change the phase of a 5G Above 6 RF signal to be transmitted to an external portion of the electronic device 301 (e.g., a 5G network base station) via their respective antenna elements. The plurality of phase shifters 338 may change the phase of a 5G Above 6 RF signal received from an external portion to the same or substantially the same phase via their respective antenna elements so as to perform transmission or reception via beamforming between the electronic device 301 and the external portion.

[0110] The second cellular network 394 can operate independently of the first cellular network 392 (e.g., a traditional network) (e.g., independent networking (SA)), or be connected to the first cellular network 392 (e.g., a traditional network) (e.g., as a non-independent networking (NSA)). For example, a 5G network may include an access network (e.g., a 5G access network (RAN)), but without any core network (e.g., a next-generation core (NGC)). In this case, after accessing the 5G network access network, the electronic device 301 can access an external network (e.g., the Internet) under the control of a core network (e.g., an evolved packet core) of the traditional network. Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio (NR) protocol information) can be stored in the memory 130 and can be accessed by other components (e.g., the processor 120, the first CP 312, or the second CP 314).

[0111] Figure 4A An electronic device including an antenna module according to an embodiment is shown.

[0112] Figure 4B Shown along Figure 4A The electronic device including the antenna module is intercepted by line CC'. Figure 4C Shown along Figure 4A The electronic device including the antenna module is intercepted by line DD'. Figure 4D Shown along Figure 4A The electronic device including the antenna module is intercepted by line EE'.

[0113] Reference FIG. 4A to FIG. 4D The electronic device 400 includes a housing 410, and the housing 410 includes a first plate 420 (eg Figure 2C 40, and a second plate 430 (eg, a front plate 202) spaced apart from the first plate 420 and facing in an opposite direction. Figure 2C The rear plate 280 or rear glass of the first plate 420 and the side surface member 440 surrounding the space between the first plate 420 and the second plate 430.

[0114] The first plate 420 may include a transparent material including a glass plate. The second plate 430 may include a non-conductive material and / or a conductive material. The side surface member 440 may include a conductive material and / or a non-conductive material. At least a portion of the side surface member 440 may be formed integrally with the second plate 430. Figures 4A-4D As shown, the side surface member 440 includes first to third insulators 441 , 443 , and 445 and first to third conductors 451 , 453 , and 455 .

[0115] The electronic device 400 may include, in the space, a display, a main PCB 470, and / or a middle board arranged to be seen through the first board 420. Optionally, the electronic device 400 may further include other various components.

[0116] The electronic device 400 includes a first conventional antenna 451, a second conventional antenna 453, and a third conventional antenna 455 in the space and / or portion (e.g., the side surface member 440) of the housing 410. The first conventional antenna 451 to the third conventional antenna 455 can be used for, for example, cellular communication (e.g., 2G, 3G, 4G, or LTE), short-range communication (e.g., Wi-Fi, Bluetooth, or NFC), and / or GNSS.

[0117] The electronic device 400 includes a first antenna assembly 461, a second antenna assembly 463, and a third antenna assembly to form a directional beam. Antenna modules 461, 463, and 465 can be used in 5G networks (e.g. Figure 3The second cellular network 394), millimeter wave communication, 60 GHz communication or WiGig communication. The antenna modules 461, 463 and 465 can be arranged in the space to be spaced apart from the metal members (such as the housing 410, the internal component 473 and / or the first to third conventional antennas 451 to 455) by a predetermined interval or more.

[0118] The first antenna assembly 461 may be located at the upper left portion (+X axis), the second antenna assembly 463 may be located at the upper middle portion (-Y axis), and the third antenna assembly 465 may be located at the middle right portion (-X axis). The electronic device 400 may include additional antenna modules at additional locations, such as the middle bottom portion (Y axis), or some of the first to third antenna modules 461 to 465 may be omitted. The first to third antenna modules 461, 463, and 465 may be electrically connected to at least one CP on the main PCB 470 using a conductive line 471, such as a coaxial cable or a flexible printed circuit board (FPCB) .

[0119] Reference Figure 4B (It is along Figure 4A ), the antenna array of the first antenna component 461 can be configured so that a portion of the antenna array of the first antenna component 461 (e.g., a patch antenna array) can emit radiation toward the second board 430, and another portion thereof (e.g., a dipole antenna array) can emit radiation through the first insulator 441.

[0120] Reference Figure 4C (It is along Figure 4A ), the antenna array of the second antenna component 463 can be configured so that a portion of the radiator of the second antenna component 463 (e.g., a patch antenna array) can emit radiation toward the second board 430, and another portion thereof (e.g., a dipole antenna array) can emit radiation through the second insulator 443.

[0121] The second antenna assembly 463 may include multiple PCBs. For example, a portion of the antenna array (e.g., a patch antenna array) and another portion (e.g., a dipole antenna array) may be located on different PCBs. The PCBs may be connected together via an FPCB. The FPCB may be disposed around an electrical structure 473 (e.g., a receiver, speaker, sensor, camera, earphone, or button).

[0122] Reference Figure 4D (It is along Figure 4A), the third antenna assembly 465 may be disposed to face the side surface member 440 of the housing 410. The antenna array of the third antenna assembly 465 may be disposed so that a portion of the antenna array of the third antenna assembly 465 (e.g., a dipole antenna array) may emit radiation toward the second board 430, and another portion thereof (e.g., a patch antenna array) may emit radiation through the third insulator 445.

[0123] Figure 5A A cross-sectional view of an electronic device according to an embodiment is shown. Figure 5B FIG. 1 is a cross-sectional view of an electronic device according to an embodiment. Specifically, Figure 5A Shown along Figure 2A A cross-sectional view taken along line AA' of Figure 5B Shown along Figure 5B A cross-sectional view taken along line BB'.

[0124] Reference Figure 5A , the electronic device 500 includes a front plate 510, a display 520, a support member 530, a first heat transfer member 540, a PCB, a battery, and a rear plate 580. Optionally, the electronic device 500 may not include at least one of the components, or additional components may be added. The electronic device 500 also includes a heat sink 521 on the rear surface of the display 520 and a third heat transfer member 534 on the top surface of the support member 530. The PCB may form a stacked PCB structure to ensure a component mounting space corresponding to the application of a half PCB. The PCB may include a first PCB 550a on which a plurality of electronic components are mounted and a second PCB 550b at least partially overlapping the first PCB 550a and electrically connected to the first PCB 550a.

[0125] The first PCB 550a and the second PCB 550b may be electrically connected to each other through the connecting member 550c, and may be connected along a height direction (eg, parallel to Figure 2C The connecting member 550c may be provided on a surface opposite to the surface where the first heat transfer member 540 is formed, relative to the first PCB 550a. The connecting member 550c may include, for example, an interposer, a board-to-board connector, or an FPCB. At least one or more connecting members 550c may be provided to electrically connect the first PCB 550a and the second PCB 550b.

[0126] Various electronic components may be mounted on the first PCB 550a and / or the second PCB 550b.

[0127] Reference Figure 5A (It is along Figure 2A), a stacked structure of multiple electronic components and PCBs may occupy most of the space in the electronic device 500.

[0128] For example, processors 551 and 552 may be mounted on the first PCB 550a. Processors 551 and 552 may include one or more of a CPU, an AP, a GPU, an ISP, or a baseband processor (or CP). Processors 551 and 552 may be implemented as a system on chip (SoC) or a system-in-package (SiP). Various electronic components may be mounted on the first PCB 550a and / or the second PCB 550b. For example, the control circuit may also be configured as an IC chip and mounted on a PCB. The control circuit may be part of a processor or a communication module. Various other electronic components 553a may be further mounted on the first PCB 550a.

[0129] A certain electronic component 553b among the electronic components mounted on the first PCB 550a and / or the second PCB 550b can be arranged in the area between the first PCB 550a and the second PCB 550b, and another 553c can be mounted on one surface of the second PCB 550b or on the opposite surface thereof. Therefore, even when the electronic device 500 forms a semi-PCB structure, more space can be ensured for placing batteries without significantly reducing the installation space of the electronic components. At least some of the electronic components can be surrounded by shielding covers 554a and 554b, and a shielding structure can be formed on one surface of at least some of the electronic components to protect the electronic components from external electromagnetic influences.

[0130] At least one heat transfer member (eg, 540 ) may be provided inside the electronic device 500 to effectively transfer heat generated from an electronic component to a relatively low temperature portion.

[0131] like Figure 5A As shown, the electronic device 500 includes an electronic component 551, a shielding cover 554a and a shielding structure, a heat transfer member, a support member 530, a heat sink 521, a display 520 and a front plate 510 in a cross-sectional view, which are sequentially arranged toward one surface with a PCB (e.g., a first PCB 550a) used as a reference. In addition to the first heat transfer member 540 disposed between the support member 530 and the PCB (e.g., the first PCB 550a), the electronic device 500 also includes a third heat transfer member 534 disposed between the support member 530 and the display 520 as a heat transfer member. The electronic device 500 includes an electronic component 553c, a shielding cover 554b, an antenna 560, a second support member 570 and a rear plate 580 in a cross-sectional view, which are sequentially arranged toward an opposite surface with a PCB (e.g., a second PCB 550b) used as a reference.

[0132] The shielding structure includes a shielding member 555a, heat transfer materials 555b and 555d, and a metal plate 555c. The shielding structure may be disposed between the first heat transfer member 540 and the electronic component 551 to shield the electronic component 551 from surrounding electromagnetic waves, and may be thermally coupled with the first heat transfer member 540.

[0133] At least a partial area of ​​the first heat transfer member 540 may be disposed to face at least one electronic component 551 among the plurality of electronic components mounted on the PCB 550, and at least another partial area that is bent may be disposed to face another electronic component 552 among the plurality of electronic components mounted on the PCB 550.

[0134] The electronic device 500 further includes an antenna module 591. Since the antenna module 591 is spaced apart from the heat transfer member and vertically mounted on one side surface of the electronic device 500, as shown in FIG. Figure 5A As shown, a separate heat transfer component may be provided for antenna module 591.

[0135] like Figure 5B (It is along Figure 2A As shown in the cross-sectional view taken along the line BB' of FIG. 5 , in another cross-sectional view, the battery may occupy most of the space of the electronic device 500. Since no other components (such as a PCB) other than the battery are included on one surface of the electronic device 500, a battery of a larger capacity may be advantageously placed.

[0136] Reference Figure 5B , the electronic device 500 includes a second heat transfer member 535. The second heat transfer member 535 may be disposed between the support member 530 and the battery.

[0137] like Figure 5B As shown, the electronic device 500 includes a rear plate 580 in a cross-sectional view, and the electronic device 500 includes an antenna 560, a heat sink 563, a battery, a heat transfer member, a support member 530, a heat sink 521, a display 520, and a front plate 510 arranged in sequence from the rear plate 580 to one surface. In addition to the second heat transfer member 535 provided between the support member 530 and the battery (BAT), the electronic device 500 may further include a third heat transfer member 534 provided between the support member 530 and the display 520 as a heat transfer member.

[0138] The electronic device 500 further includes an antenna module 592. Since the antenna module 592 is spaced apart from the heat transfer member and vertically mounted on one side surface of the electronic device 500, as shown in FIG. Figure 5B As shown, a separate heat transfer means may be provided for antenna module 592.

[0139] Figure 6 The heat distribution and heat diffusion direction of a component of an electronic device according to an embodiment are shown.

[0140] Reference Figure 6 , for a half-PCB structure or a stacked PCB structure (in which high-performance electronic components such as AP, memory, or communication chips are mounted), the heat generated from the electronic components when the electronic device is operating may be concentrated in a certain area (e.g., a hot spot area on one side of the PCB). For example, more heat may be generated at a processor and an antenna modem among other various electronic components mounted on the PCB in the electronic device.

[0141] Therefore, it may be beneficial to effectively diffuse / dissipate the heat concentrated in the hot spot area to a relatively low temperature portion (eg, a battery mounting area of ​​an electronic device).

[0142] Various heat transfer elements can be used to disperse / dissipate concentrated heat, such as vapor chambers, heat pipes, shields, solid heat sheets, or liquid heat dissipation coatings. Heat transfer by various heat transfer elements can include heat conduction, heat spreading, heat diffusion, heat radiation, or other types of moving heat energy.

[0143] Figure 7 A heat sink located on the rear surface of a display according to an embodiment is shown. More specifically, Figure 7 A plan view of an electronic device 500 ′ is shown, with some components (eg, a front panel and a display) excluded from the electronic device 500 .

[0144] Reference Figure 7 , the electronic device 500 ′ includes a heat sink 521 disposed on the rear surface of the display.

[0145] The heat sink 521 is a component for dissipating heat that may be generated when the display is operated. The heat sink 521 may be attached to the rear surface of the display via an attachment member.

[0146] The heat sink 521 may be formed of a composite sheet obtained by stacking two or more sheets 521a and 521b. At least a portion of the heat sink 521 may include a carbon-based material (e.g., carbon black, graphene, carbon nanotubes, or graphite) having high thermal conductivity or heat transfer efficiency. Through holes 521c may be formed in at least a portion of the composite sheet of the heat sink 521 to improve heat dissipation efficiency.

[0147] For example, the heat sink 521 is formed of a composite sheet having a thickness of about 32 μm. At least a portion of the heat sink 521 includes graphite. Since the heat sink 521 is included in the electronic device 500 ′, the temperature measured at the front of the electronic device 500 ′ can be reduced by about 0.5° C. to 1° C. (compared to when the heat sink 521 is not used).

[0148] Figure 8 FIG. 1 shows a third heat transfer member located on the top surface of the support member according to an embodiment. Specifically, Figure 8 is a plan view of an electronic device 500 ′, from which some components (eg, a front panel and a display) are excluded.

[0149] Reference Figure 8 The third heat transfer member 534 is coupled to the top surface 530a of the support member 530 to transfer heat from one side (eg, the top end) of the support member 530 to the other side (eg, the bottom end) of the support member 530 where the temperature is relatively low.

[0150] On the top surface of the support member 530, at least a portion of the third heat transfer member 534 may be disposed in a first area ( Figure 2C S1) of the housing, and at least another portion thereof may be disposed in a second region ( Figure 2C If the third heat transfer member 534 is added, the third heat transfer member 534 may be located in the length direction of the electronic device (eg Figure 2C y) to extend from a cross section of the electronic device 500 (eg Figure 5A ) and another cross section of the electronic device 500 (eg Figure 5B )See.

[0151] The third heat transfer member 534 may have various shapes. Figure 8 As shown, the third heat transfer member 534 may be shaped to cover the top surface of the support member 530 in a portion other than the component mounting region 533 of the support member 530. The shape of the third heat transfer member 534 is not limited thereto, and various shapes may be used.

[0152] The third heat transfer member 534 may include a carbon-based material (e.g., carbon black, graphene, carbon nanotubes, or graphite) having high thermal conductivity or heat transfer efficiency. Since the electronic device 500' includes the third heat transfer member 534 having a thickness of about 62 μm and at least a portion thereof contains graphite, the temperature measured at the front of the electronic device 500 may be reduced by about 0.5°C to 1°C, and the temperature at the rear of the electronic device 500 may be reduced by about 0.25°C to 0.5°C, compared to when the third heat transfer member 534 is not included.

[0153] Fig. 9A supporting member according to an embodiment is shown. Specifically, Fig. 9 A plan view of the electronic device 500 ′ is shown, in which some components (eg, a front plate, a display, and a third heat transfer member) are excluded from the electronic device 500 .

[0154] Reference Fig. 9 , the support member 530 may be formed of a thermally conductive material in one piece. If the support member 530 includes a side frame structure 531 and a seating portion 532 , the seating portion 532 may be formed of a thermally conductive material in one piece.

[0155] In the supporting member 530, the seating portion 532' may be formed of a thermally conductive member of a different material, such as Fig. 9 shown in the left side view.

[0156] The first seating portion 532a may be formed of a member having a first thermal conductivity (e.g., a Cu plate), and the second seating portion 532b may be formed of a member having a second thermal conductivity (e.g., SUS). If the seating portion 532' is formed of members having different thermal conductivities, when heat moves from a higher temperature portion to a lower temperature portion, the heat may be blocked by a thermal barrier between heterogeneous materials, which may hinder effective heat dissipation.

[0157] Therefore, the support member 530 is formed of an integral thermally conductive material (e.g., an all-aluminum (Al) alloy) having high heat transfer efficiency, preventing a thermal barrier between heterogeneous materials from hindering heat transfer. Using the support member 530 formed of an all-metal alloy (e.g., an all-Al alloy) can reduce the temperature measured at the front of the electronic device 500 by about 0.5°C to 1.5°C and reduce the temperature at the rear of the electronic device 500 by about 0.25°C to about 0.75°C, compared with an electronic device having a thermally conductive member of heterogeneous materials (e.g., Fig. 9 compared to the electronic device shown on the left hand side of FIG.

[0158] Fig.10 A second heat transfer member 535 is shown located on the rear surface of the support member (or on the top surface of the battery) according to one embodiment. Specifically, Fig.10 A plan view of an electronic device 500 ′ is shown, with some components excluded from the electronic device 500 .

[0159] The second heat transfer member 535 may be a component coupled to the bottom surface of the support member 530 to transfer heat concentrated on one side (e.g., the top end) of the support member 530 to the other side (e.g., the bottom end) of the support member 530 where the temperature is relatively low. Alternatively, the second heat transfer member 535 may be a structure coupled to the top surface of the battery. The second heat transfer member 535 may be disposed between the support member 530 and the battery, and the second heat transfer member 535 may transfer heat generated from the PCB 550a to one end of the battery away from the PCB 550a.

[0160] At least another portion of the second heat transfer member 535 may be disposed on the top surface of the battery or the rear surface of the support member 530 in contact with the second region ( Figure 2C The position corresponding to S2).

[0161] The second heat transfer member 535 may have various shapes. Fig.10 As shown, the opening may be formed in a portion of the surface facing the battery. The second heat transfer member 535 may be shaped to be narrowed and elongated along the length direction while bypassing the area where the battery is placed in the support member 530 (e.g., the battery attachment member application area). The second heat transfer member 535 may be shaped to extend to pass through an area close to the center and edge of the battery on the top surface of the battery. The shape of the second heat transfer member 535 is not limited thereto, and other various shapes may be used.

[0162] The second heat transfer member 535 may include a carbon-based material (e.g., carbon black, graphene, carbon nanotubes, or graphite) having high thermal conductivity or high heat transfer efficiency. Since the electronic device 500' includes the second heat transfer member 535 of about 60 μm thickness and at least a portion of the second heat transfer member 535 contains graphite, the temperature measured at the front may be reduced by about 0.5°C to 1°C compared to when the second heat transfer member 535 is not included.

[0163] Fig.11 A first heat transfer member is shown located on the top surface of at least one electronic component mounted on a PCB according to an embodiment. Specifically, Fig.11 A plan view of an electronic device 500 ′ is shown, with some components excluded from the electronic device 500 .

[0164] Reference Fig.11 The first heat transfer member 540 may be formed to cover at least a portion of the top surface of the PCB 550a where heat is concentrated. The first heat transfer member 540 may be a member that quickly diffuses heat generated from electronic components mounted on the first PCB 550a and concentrated at a portion to a relatively low temperature area.

[0165] At least a portion of the first heat transfer member 540 may be disposed on the top surface of the first PCB 550a in contact with the first region ( Figure 2C The position corresponding to S1).

[0166] The first heat transfer member 540 may have various shapes. Fig.11 As shown, when viewed from above the top surface, the first heat transfer member 540 may be L-shaped as a whole, but is not limited thereto. The shape of the first heat transfer member 540 may vary according to the types and arrangement of electronic components on the PCB 550a.

[0167] The first heat transfer member 540 may include a steam chamber. The steam chamber may have at least a portion facing a surface (e.g., a rear surface of the first heat transfer member 540) where heat is dissipated from the electronic components mounted on the first PCB 550a. The first heat transfer member 540 may receive heat through the rear surface. Since the interior of the first heat transfer member 540 is a vacuum, the heat received from the electronic components may be rapidly diffused in the horizontal direction.

[0168] For example, the first heat transfer member 540 may be treated as an internal vacuum and may be a heat conductor filled with a working fluid. If heat is applied to any part of the first heat transfer member 540, the liquid working fluid may evaporate, resulting in a pressure difference. The pressure difference allows the gaseous working fluid to move relatively quickly to a relatively low temperature area. This principle may be used for the first heat transfer member 540.

[0169] The first heat transfer member 540 may be used together with at least one of the second heat transfer member 535 and / or the third heat transfer member 534. Since the first heat transfer member 540 is disposed between the support member 530 and the first PCB 550a and the second heat transfer member 535 and / or the third heat transfer member 534 cover the area where the first heat transfer member 540 is not disposed, heat concentrated on one side (e.g., the top end) of the support member 530 may be transferred to the opposite side (e.g., the bottom end) of the support member 530 where the temperature is relatively low. This results in heat generated from the PCB being transferred to the end of the battery located away from the PCB.

[0170] Fig.12 A wireless charging antenna and a heat sink disposed between the wireless charging antenna and a battery according to an embodiment are shown.

[0171] Reference Fig.12If the electronic device includes a wireless charging antenna 560, the temperature around the wireless charging antenna 560 may soar when the battery is charged. A heat sink 563 may be provided near the wireless charging antenna 560 to transfer the generated heat to a relatively low temperature portion. The heat sink 563 may be provided between the wireless charging antenna 560 and the battery.

[0172] The shape of the wireless charging antenna 560 may vary depending on the specifications of the antenna, the arrangement relationship with other components in the electronic device, and / or the shape of the shielding structure.

[0173] When the wireless charging antenna 560 is formed as a flat plate, as Fig.12 As shown, the heat sink 563 may extend to a portion of the wireless charging antenna 560 that does not affect signal transmission / reception efficiency (eg, the segmented portion 561 or the bent portion 562 ), thereby improving heat transfer efficiency.

[0174] Fig.13 1 shows a second supporting member according to an embodiment. Specifically, Fig.13 A rear view of the electronic device 500 ′ is shown, with some components excluded from the electronic device 500 .

[0175] Reference Fig.13 , the second support member 570 can be added adjacent to the rear plate. The second support member 570 can at least partially include an injection molded material. For example, a partially separated portion of the second support member 570 can be formed by an injection molded material, while other separated portions can be formed by a cladding plate (or cladding metal). As another example, the second support member 570 can be a single structure formed by dual injection molding.

[0176] If it is difficult to implement the injection molding material at the lower portion of the PCB (eg, the lower portion of the second PCB 550 b ) due to the PCB stack structure, the second support member 570 may include a cover plate at the lower portion where the injection molding material is difficult to implement.

[0177] The entire second support member 570 may be formed of a cladding plate. Typically, the back plate is substantially opaque and may include an injection molded material or may partially include a heat sink such as SUS. Since the heat sink is implemented as a cladding plate, the heat transfer efficiency may be improved. The cladding plate may include a first material in the core and a second material in an upper layer and / or lower layer surrounding the core.

[0178] Since Cu is used as the core of the cladding plate and SUS is used as the surrounding layer (e.g., SUS / CU / SUS cladding plate), thermal conductivity can be improved several times (e.g., 0.04 cal / sec for SUS and 0.35 cal / sec for cladding) compared to when no cladding plate is used.

[0179] If the second support member 570 is formed of a cladding plate, the temperature measured at the rear of the electronic device may be reduced by about 0.5° C. to about 1° C.

[0180] Fig.14 An arrangement of an electronic component, a shielding structure, and a first heat transfer member according to an embodiment is shown.

[0181] Reference Fig.14 , various electronic components can be mounted on the first PCB 650a. The electronic components can have various shapes, sizes and specifications according to their functions. When the electronic components perform various functions of the electronic device, they can generate different amounts of heat. Typically, more heat can be generated from electronic components (such as processors) used to control and manage other electronic components. The processor may include a first processor 651 and a second processor 652. The first processor 651 and the second processor 652 may have different levels. For example, the first processor 651 may be higher than the second processor 652.

[0182] The first heat transfer member 640 may be formed to face top surfaces of the first and second processors 651 and 652 .

[0183] The first heat transfer member 640 may be indirectly connected to the first processor 651 and the second processor 652 via at least one shielding structure 655 , rather than directly contacting the first processor 651 and the second processor 652 .

[0184] At least some of the electronic components 651 and 652 mounted on the first PCB 650a may be surrounded by the shield case 654a, and a shielding structure may be provided on one surface of at least some of the electronic components to shield electromagnetic waves.

[0185] The shielding structure further includes a shielding member 655a electrically connected to the shielding cover 654a, a metal plate 655c electrically connected to the shielding member 655a, and a heat transfer material disposed on at least one surface of the metal plate 655c.

[0186] The shielding structure may include: a shielding member 655a, which is arranged to surround the outer surface of the shielding cover 654a and an opening formed in the surface of the shielding cover 654a corresponding to the electronic component and is electrically connected to the shielding cover 654a; a metal plate 655c, which is arranged on the shielding member 655a, covers the opening, and is electrically connected to the shielding member 655a; a first heat transfer material 655b, which is arranged in the opening to contact the electronic component and the metal plate 655c; and a second heat transfer material 655d, which is arranged between the metal plate 655c and the first heat transfer member 640 to contact the metal plate 655c and the first heat transfer member 640.

[0187] The shielding member may include a shielding film and a polyurethane (PU), at least a portion of which is surrounded by the shielding film. The shielding film may be a conductive film based on nanofibers. The shielding structure generated by surrounding the PU foam with a nanofiber shielding film may be referred to as a nanofoam. The first heat transfer material 655b and 655d may include a liquid or solid thermal interface material (TIM). The solid or liquid TIM may include, for example, graphite, carbon nanotubes (CNT), natural recyclable materials, silicone, silicon or other high thermal conductivity materials.

[0188] Heat generated from the electronic components 651 and 652 may be thermally coupled with the first heat transfer member 640 via at least a portion (eg, 655 b , 655 c , and 655 d ) of the shielding structure.

[0189] The first heat transfer member 640 may be stepped corresponding to the step between the first processor 651 and the second processor 652. However, the step formed in the first heat transfer member 640 does not need to be the same in height or level as the step between the first processor 651 and the second processor 652, but may vary according to various combinations and shapes of heat transfer materials. At least one partial area of ​​the first heat transfer member 640 may be formed to face the first processor 651, and at least another partial area of ​​the first heat transfer member 640 (which is bent) may be formed to face the second processor 652.

[0190] The electronic device may further include an attaching member 656 between the shield case 654 a and the shield member and / or between the first heat transfer member 640 and the support member 630 .

[0191] Fig.15A A perspective view is shown of a first heat transfer member according to an embodiment. Fig. 15B A front view of a first heat transfer member according to an embodiment is shown. Fig. 15C A side view of a first heat transfer member is shown according to an embodiment.

[0192] Reference Fig.15A , the first heat transfer member 640 may be bent at least once so that the local area is stepped with the other local area.

[0193] The first heat transfer member 640 includes a first flat portion 641 and a second flat portion 642 extending from the first flat portion 641 and bent to be stepped from the first flat portion 641 .

[0194] Reference FIG. 15A to FIG. 15C The bent portion 643 of the first heat transfer member 640 may have at least one of the shapes of “┐”, “L”, or “Z”. The first heat transfer member 640 may have various other bent shapes other than those listed above.

[0195] although FIG. 15A to FIG. 15C The first heat transfer member 640 is shown to have two bent portions 643, but the present disclosure is not limited thereto. The first heat transfer member 640 may include a single bent portion 643 or three or more bent portions 643. In addition to the first flat portion 641 and the second flat portion 642, the first heat transfer member 640 may further include other flat portions stepped from each of the first flat portion 641 and the second flat portion 642.

[0196] A specific shape of the first heat transfer member 640 may vary according to the kind and size of electronic components disposed on the rear surface 640 b of the first heat transfer member 640 and the amount of heat generated from the electronic components.

[0197] Fig.16 An antenna module and a low dielectric constant heat sink according to an embodiment are shown.

[0198] Reference Fig.16 , the battery and various electronic components can be placed in the internal space of the electronic device. In addition, the antenna modules 791, 792 and 793 and the heat sinks 782 and 783 are positioned adjacent to each other in the internal space of the electronic device.

[0199] The antenna modules 791 , 792 , and 793 may include a PCB formed of a plurality of conductive layers, an RFIC and a PMIC disposed on one surface of the PCB, and an antenna radiator disposed on an opposite surface of the PCB or disposed inside the PCB.

[0200] The antenna modules 791, 792, and 793 may form various directional beams. The first antenna module 791 and the second antenna module 792 may be arranged (vertically mounted) so that one surface of the antenna radiator faces the side surface of the electronic device so as to radiate electromagnetic waves to the side surface. The first antenna module 791 and the second antenna module 792 may be spaced apart from each other to radiate electromagnetic waves in different directions (e.g., in a vertical direction or a relative direction). The third antenna module 793 may be arranged (horizontally mounted) so that one surface of the antenna radiator faces the rear plate 780 so as to radiate electromagnetic waves to the rear surface of the electronic device.

[0201] The heat sinks 782 and 783 may be provided between the first support member and the rear plate 780. The heat sinks 782 and 783 may be attached to the rear plate 780. The heat sinks 782 and 783 may be arranged at positions corresponding to the antenna modules 791, 792, and 793. For example, at least a partial area of ​​the first heat sink 782 may face the first antenna module 791 and the third antenna module 793, and at least a partial area of ​​the second heat sink 783 may face the second antenna module 792.

[0202] The first heat sink 782 may be disposed in the top end region of the rear plate 780 and may cover one surface of the first antenna module 791 and the third antenna module 793 facing the rear plate 780. The first heat sink 782 may be formed to surround at least a portion of the periphery of the opening 781 (for exposing, for example, a camera). As another example, the first heat sink 781 may be integrally formed into a partially curved '┌' or '┐'.

[0203] The second heat sink 783 may be spaced apart from the first heat sink 782. For example, the second heat sink 783 may be disposed in the bottom middle region of the rear plate 780 and may cover the surface of the second antenna module 792 facing the rear plate 380. As another example, the second heat sink 783 may extend from the region where the second antenna module 792 is disposed to the lower end of the rear plate 380. The second heat sink 783 may be integrally shaped as a partially curved '└' or '┘'.

[0204] Despite Fig.16 Two heat sinks 782 and 783 are shown in FIG. 1 , but the present disclosure is not limited thereto. For example, three or more separate heat sinks may be provided to cover three antenna modules.

[0205] The heat sinks 782 and 783 may include an adhesive resin and a ceramic filler. The heat sinks 782 and 783 may also include a high heat dissipation filler. The high heat dissipation filler may be coated with a low dielectric constant insulating material.

[0206] The thickness of the heat sinks 782 and 783 may be in the range from 50 μm to 1000 μm.

[0207] At least one heat sink may be spaced apart from the at least one antenna module and attached to the housing.

[0208] Fig.17A A mounting structure of a vertically mounted antenna module according to an embodiment is shown. Fig. 17B A vertically mounted antenna module is shown according to an embodiment. Fig. 17C A cross-sectional view showing a mounting structure of a vertically mounted antenna module according to an embodiment.

[0209] Reference Fig.17A , the first antenna module (eg Fig.16 antenna module 791) and a second antenna module (eg Fig.16 The antenna module 792) can be a vertically mounted antenna module.

[0210] The vertically mounted antenna module includes a PCB 791b and a radiator 791a disposed on the PCB 791b to face the outside of the electronic device.

[0211] RFIC, PMIC, connectors, and other various electronic components may be disposed on the PCB 791b of the vertically mounted antenna module. The antenna radiator 791a may be disposed on one surface of the PCB 791b.

[0212] The antenna radiator 791a may be a plurality of conductive plates or an antenna array formed of a radiating conductor, and the antenna, which may have various structures, may be at least one of a patch type antenna or a dipole type antenna, for example.

[0213] The RFIC can be electrically connected to the antenna radiator and can receive a communication signal with a specified frequency through a wireless transceiver (e.g., an RF transceiver), or send a received communication signal to the RF transceiver. For example, the RFIC can perform wireless communication using the multiple conductive plates or radiating conductors under the control of the processor. The RFIC can receive control signals and power from the power management module and the processor to process communication signals received from the outside or to be sent to the outside. The RFIC may include a switching circuit for separating the transmit signal and the receive signal, or various amplifiers or filters for improving the quality of the transmit signal or the receive signal. As described above, the RFIC mounted on the board 791b of the vertically mounted antenna module can be a heat source that generates heat when the electronic device is running. Although not described separately, the PMIC can also be a heat source that generates heat when the electronic device is running.

[0214] Reference Fig. 17C , the vertically mounted antenna module 791 may be spaced apart from the heat transfer member. Therefore, it is necessary to transfer, diffuse, disperse or release the heat generated from the modular heat source installed in the electronic device separately from the heat transfer member according to the above-described embodiment.

[0215] according to Fig. 17C In the illustrated embodiment, a heat sink may be placed adjacent to the vertically mounted antenna module to reduce the heat concentrated around the antenna module. The first heat sink 782 may be spaced a specified distance from a surface of the first antenna module 791 facing the rear plate 780. The space may be filled with air, thereby allowing the heat generated from the hot spot area to be evenly diffused to the first heat sink 782.

[0216] Reference Fig. 17B and Fig. 17C, the vertically mounted antenna module 791 may be vertically mounted on the support member 730 using a frame 791c, and may be screwed and fixed using holes located in both side surfaces of the frame 791c. If the frame 791c is thermally coupled to the support member 730, heat from the modular heat source may be transferred, diffused, dispersed, or released outwardly. A heat transfer material 791d (e.g., TIM) may be additionally formed between the at least one antenna module and the frame 791c, thereby expanding the thermal contact area.

[0217] use Fig.17A , Fig. 17B and Fig. 17C configuration, the temperature measured on the electronic device side can be reduced by about 0.5°C to about 1°C, and the temperature of the board on which the RFIC is mounted can be reduced by about 8°C to 12°C.

[0218] Fig.18 A PCB of an antenna module is shown mounted horizontally according to an embodiment.

[0219] Reference Fig.18 , at least one antenna module includes a PCB 793', which is a stack of multiple layers 793a, 793b and 793c facing the placement portion of the support member, and a via 793d can be formed through at least a portion of the multiple layers in at least a partial area of ​​the PCB 793'. The RFIC can be mounted on the PCB 793', and the heat from the PCB 793' can be reduced via the via 793d.

[0220] The surface of PCB 793' facing the rear surface of antenna module 793 can connect the metal layer of the PCB included in antenna module 793 to the rear surface of module 793 while bypassing the insulating layer of the PCB included in antenna module 793. Therefore, heat dissipation can be achieved using the metal layer of the PCB.

[0221] By using Fig.18 configuration, the temperature of a board on which an RFIC is mounted in an electronic device can be reduced by approximately 2°C to 3°C.

[0222] Fig.19 A vertically mounted antenna module and frame are shown according to one embodiment.

[0223] Reference Fig.19 , the frame 792c of the vertically mounted antenna module 792 can be typically formed of an injection molded material. For example, the frame 792c can be formed by processing one side of the support member 730 (e.g., a bracket) during the process of manufacturing the housing of the electronic device. Fig. 9The method of improving the heat transfer efficiency by forming a support member 730 of an integral all-metal alloy (for example, an all-Al alloy), the frame 792c of the vertically mounted antenna module 792 can be formed of an integral material (for example, an all-Al alloy) like the support member 730, thereby improving the heat transfer efficiency around the antenna module.

[0224] By using Fig.19 configuration, the temperature measured on the electronic device side can be reduced by about 0.5°C to about 2.5°C, and the temperature of the board on which the RFIC is mounted can be reduced by about 1.5°C to 3°C.

[0225] Fig. 20 A thermal analysis simulation of a heat transfer member and an electronic device including the heat transfer member according to an embodiment is shown. Specifically, Fig. 20 The upper part shows the simulation results before applying the heat transfer member according to the embodiment, Fig. 20 The lower part of shows the simulation results after applying the heat transfer member according to the embodiment.

[0226] Reference Fig. 20 The use of the heat dissipation member and the electronic device including the same can effectively transfer the heat generated from various electronic components of the electronic device to a relatively low temperature portion.

[0227] Furthermore, the electronic device may effectively release heat generated from the antenna module (eg, RFIC or PMIC) using a heat sink and / or a heat transfer material positioned adjacent to the antenna module.

[0228] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the above-listed embodiments.

[0229] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0230] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0231] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0232] The methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0233] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0234] According to one embodiment, an electronic device includes a housing, a display mounted on at least one surface of the housing, a battery accommodated in the housing, a support member contacting a rear surface of the display and supporting at least a portion of the display, a printed circuit board on which a plurality of electronic components are mounted, a shielding cover surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shielding cover to shield the electronic components, and a first heat transfer member, which is disposed on an outer surface of the shielding structure and has at least a partial area facing at least one electronic component among the plurality of electronic components mounted on the printed circuit board and at least another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

[0235] The shell may include a first area and a second area, wherein the first area divides the space in the shell along the length direction from one end of the supporting member and has a printed circuit board arranged therein, and the second area is positioned adjacent to the first area, divides the space parallel to the first area and has a battery for power supply arranged thereon.

[0236] The printed circuit board includes a first printed circuit board on which a plurality of electronic components are mounted and a second printed circuit board at least partially overlapping the first printed circuit board and electrically connected to the first printed circuit board.

[0237] The electronic device may further include a second heat transfer member disposed between the support member and the battery.

[0238] The electronic device may further include a third heat transfer member disposed on a surface of the support member opposite to one surface at which the second heat transfer member is disposed. The third heat transfer member may be disposed between the display and the support member.

[0239] The support member may be formed of a unitary thermally conductive material.

[0240] The electronic device may further include a heat sink disposed on a rear surface of the display.

[0241] The electronic device may further include a wireless charging antenna and a heat sink disposed between the wireless charging antenna and the battery.

[0242] The housing may include a front plate facing a first direction and a rear plate facing a second direction opposite to the first direction, and the second support member may be included between the rear plate and the printed circuit board. At least a portion of the second support member may include a cladding plate.

[0243] The shielding structure may include a shielding member electrically connected to the shielding cover, a metal plate electrically connected to the shielding member, and a heat transfer material disposed on at least one surface of the metal plate. The shielding member may be formed by surrounding PU foam with a nanofiber film.

[0244] The shielding structure includes: a shielding member, which is arranged to surround the outer surface of the shielding cover and an opening formed in the surface of the shielding cover corresponding to the electronic component, and is electrically connected to the shielding cover; a metal plate, which is arranged on the shielding member, covers the opening, and is electrically connected to the shielding member; a first heat transfer material, which is arranged in the opening to contact the electronic component and the metal plate; and a second heat transfer member, which is arranged between the metal plate and the first heat transfer member to contact the metal plate and the first heat transfer member.

[0245] The electronic device may further include at least one antenna module disposed inside the housing.

[0246] At least one heat sink spaced apart from the at least one antenna module and attached to the housing may be further included.

[0247] The at least one antenna module may include at least one antenna module vertically mounted on the support member via a frame, and a heat transfer material may be formed between the at least one antenna module and the frame.

[0248] The at least one antenna module may include a printed circuit board having a stack of a plurality of layers facing a seating portion of the support member, and a via hole may be formed through at least a portion of the plurality of layers in at least one region of the printed circuit board.

[0249] According to one embodiment, an electronic device includes: a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a supporting member arranged between the front plate and the rear plate to form a space, the housing including a first area dividing the space along a length direction from one end of the supporting member and a second area located adjacent to the first area and dividing the space parallel to the first area; a printed circuit board on which a plurality of electronic components are mounted, the printed circuit board being arranged in the first area, and the printed circuit board including a first printed circuit board on which the plurality of electronic components are mounted and a second printed circuit board at least partially overlapping the first printed circuit board and electrically connected to the first printed circuit board; a battery arranged in the second area; and a first heat transfer member having at least a partial area facing at least one electronic component among the plurality of electronic components mounted on the first printed circuit board, and another partial area being bent and facing another electronic component among the plurality of electronic components mounted on the first printed circuit board.

[0250] The electronic device may further include a second heat transfer member disposed to face at least one surface of the support member and a third heat transfer member disposed to face an opposite surface of the support member. The first heat transfer member may be disposed in a region corresponding to at least a portion of the first region, the second heat transfer member may be disposed in a region corresponding to at least a portion of the second region, and the third heat transfer member may be disposed in a region corresponding to at least a portion of the first region and at least a portion of the second region.

[0251] The first heat transfer member may be disposed between the support member and the printed circuit board, and the first heat transfer member may have at least one bent portion to allow the at least partial region to be stepped with the at least another partial region.

[0252] The plurality of electronic components may include a first processor and a second processor different from the first processor.

[0253] The electronic device may further include an antenna module provided separately from the printed circuit board and functionally connected to the communication circuit provided on the printed circuit board.

[0254] While the present disclosure has been particularly shown and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: A housing, comprising a front plate facing a first direction and a rear plate facing a second direction opposite to the first direction; A display, mounted on the housing; Battery; a support member disposed adjacent to a rear surface of the display and supporting the display; a printed circuit board on which a plurality of electronic components are mounted; a first heat transfer member including a partial area facing at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area being bent and facing another electronic component among the plurality of electronic components mounted on the printed circuit board; as well as at least one antenna module vertically mounted on the support member so that a radiation surface of the at least one antenna module faces a side surface of the electronic device, wherein a first heat sink is disposed on the rear plate of the housing to cover a surface of the at least one antenna module facing the rear plate, and Wherein a heat transfer metal frame is provided to vertically support the at least one antenna module.

2. The electronic device according to claim 1, wherein the housing comprises: a first area dividing the space in the housing along the length direction from one end of the supporting member, the first area including the printed circuit board disposed therein; as well as A second region is positioned adjacent to the first region, divides the space in parallel with the first region, and includes the battery.

3. The electronic device according to claim 1, wherein the printed circuit board comprises: a first printed circuit board having a first plurality of electronic components mounted thereon; and The second printed circuit board at least partially overlaps the first printed circuit board and is electrically connected to the first printed circuit board. 4 . The electronic device according to claim 1 , further comprising a second heat transfer member disposed between the display and the battery. 5 . The electronic device according to claim 4 , further comprising a third heat transfer member provided on a surface of the support member opposite to a surface on which the second heat transfer member is provided. The electronic device according to claim 1 , wherein the support member is formed of a single piece of thermally conductive material. 7 . The electronic device according to claim 1 , further comprising a second heat sink disposed on the rear surface of the display.

8. The electronic device according to claim 1, further comprising: Antennas for wireless charging; and A third heat sink is disposed between the antenna and the battery.

9. The electronic device according to claim 1, Wherein a second supporting member is included between the rear plate and the printed circuit board.

10. The electronic device according to claim 1, further comprising: a shielding cover surrounding at least a portion of the electronic component; and a shielding structure, arranged on the outer surface of the shielding cover to shield the electronic components, The shielding structure comprises: a shielding member electrically connected to the shielding cover; a metal plate electrically connected to the shielding member; and A heat transfer material is disposed on at least one surface of the metal plate.

11. The electronic device according to claim 10, wherein the shielding structure comprises a shielding member disposed to surround an outer surface of the shielding case and an opening formed in a surface of the shielding case corresponding to the electronic component and electrically connected to the shielding case; a metal plate, disposed on the shielding member, covering the opening, and electrically connected to the shielding member; a first heat transfer material disposed in the opening to contact the electronic component and the metal plate; as well as A second heat transfer material is provided between the metal plate and the first heat transfer member to contact the metal plate and the first heat transfer member. 12 . The electronic device of claim 1 , wherein a heat transfer material is formed between the at least one first antenna module and the heat transfer metal frame.

13. The electronic device according to claim 1, further comprising at least one antenna module horizontally mounted on the support member so that a radiation surface of the at least one antenna module horizontally mounted faces the rear plate of the housing, wherein the horizontally mounted at least one antenna module comprises a third printed circuit board comprising a stack of a plurality of layers facing a placement portion of the support member, and A via is formed in at least one region of the third printed circuit board through at least a portion of the plurality of layers.

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