Integrated Microcrystalline Module and Its Production Method

Abstract

The present invention provides an integrated microcrystal module and a production method thereof. The microcrystal module includes a high thermal conductivity metal aluminum plate, a high TG point glass fiber board, and a connecting member. A microcrystal lamp and a photosensor device are attached to the front surface of the high thermal conductivity metal aluminum plate, electronic devices for control are arranged on the front surface of the high TG point glass fiber board, and a heat dissipation layer is laid on the back surface of the high TG point glass fiber board. A notch penetrating the thickness direction is formed in the high thermal conductivity metal aluminum plate. The connecting member includes a fixing seat and pins. The fixing seat is embedded in the notch, the bottom end of the pin is welded to the pad on the high TG point glass fiber board, and the top end thereof is welded to the pad on the front surface of the high thermal conductivity metal aluminum plate. By using reflow soldering, the technical problem of rosin residue existing in the original soldering with a soldering iron is solved. Reflow soldering reduces manual labor and improves speed, greatly improving the product quality. With only one connecting member, the material cost is greatly reduced, and the problem of poor contact existing in the connection with a connector is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of microcrystalline module production, and in particular relates to an integrated microcrystalline module and a production method thereof. Background Art

[0002] At present, the demand for security is growing rapidly, and the demand for civil, household and traditional security is increasing, which brings opportunities for the production batch of fast finished integrated microcrystalline modules. It also puts forward higher requirements for rapid product integration and reducing labor and material costs.

[0003] The current production method of microcrystalline modules uses soldering irons, which has the problem of rosin residue. In addition, the traditional connection method uses two sockets and a flat cable connection (such as Figure 1 As shown in the figure, the material cost is high, and a copper column matching the socket must be assembled, the production process is complicated, and there is a problem of poor contact of the connector. Summary of the invention

[0004] The object of the present invention is to provide an integrated microcrystal module and a production method thereof, aiming to solve the problems of rosin residue, high material cost, complex production process and poor contact of connectors in the existing production method of microcrystal modules.

[0005] The present invention is implemented as follows: an integrated microcrystalline module comprises a high thermal conductivity metal aluminum plate, a high TG point glass fiber plate and a connector; a microcrystalline lamp and a light sensing device are attached to the front of the high thermal conductivity metal aluminum plate, an electronic device for control is arranged on the front of the high TG point glass fiber plate, and a heat dissipation layer is laid on the back of the high TG point glass fiber plate; the high thermal conductivity metal aluminum plate and the high TG point glass fiber plate are stacked up and down, and the heat dissipation layer is in contact with the back of the high thermal conductivity metal aluminum plate;

[0006] The high thermal conductivity metal aluminum plate is provided with a notch extending through the thickness direction thereof, and the periphery of the notch is provided with an insulating material for preventing a short circuit between the connector and the high thermal conductivity metal aluminum plate;

[0007] A solder pad is provided on the back of the high TG point glass fiber board in an area offset from the heat dissipation layer; the connector includes a fixing seat and a pin, the fixing seat is embedded in the notch, and the pin is inserted into the fixing seat;

[0008] The bottom end of the pin is welded to the pad on the high TG point glass fiber board, and the top end thereof extends toward the outside of the fixing seat to form a spanning section, and the free end of the spanning section is welded to the pad on the front side of the high thermal conductivity metal aluminum plate.

[0009] Furthermore, the heat dissipation layer on the back side of the high TG point glass fiber board is a bare copper layer.

[0010] Further, a plurality of microcrystalline lamps are attached to the front surface of the high thermal conductivity metal aluminum plate, and the plurality of microcrystalline lamps are distributed in a ring shape, a star shape or a divergent shape.

[0011] Further, all the electronic components for control of the microcrystalline module are arranged on the front surface of the high TG point glass fiber board, and no electronic components for control are arranged on the front surface of the high thermal conductivity metal aluminum plate.

[0012] Further, the spanning section of the pin is inclined with respect to the horizontal plane, and the end thereof close to the fixed seat is higher than its free end.

[0013] Further, the fixed seat of the connecting member is made of an insulating material, and a plurality of pins are embedded therein at intervals and penetrate through the thickness direction of the fixed seat.

[0014] To solve the above problems, the present invention also provides a production method of an integrated microcrystalline module, which includes the following steps:

[0015] Using an automated device, attach microcrystalline lamps and photosensor devices to the high thermal conductivity metal aluminum plate;

[0016] Using an automated device, attach electronic devices for control to the front surface of the high TG point glass fiber board;

[0017] Design and mold the connecting member to obtain a modular connecting member;

[0018] Weld the bottom end of the pin of the connecting member to the pad on the front surface of the high TG point glass fiber board;

[0019] Stack the back surface of the high TG point glass fiber board under the back surface of the high thermal conductivity metal aluminum plate, and embed the fixed seat of the connecting member into the notch of the high thermal conductivity metal aluminum plate;

[0020] By means of reflow soldering technology, weld the free end of the spanning section of the pin to the pad on the front surface of the high thermal conductivity metal aluminum plate; thus, the integrated microcrystalline module is obtained.

[0021] Further, it also includes the step of manufacturing the high thermal conductivity metal aluminum plate:

[0022] Design the high thermal conductivity metal aluminum plate and determine the position of the notch;

[0023] According to the design, arrange and weld microcrystalline lamps and photosensor devices on the front surface of the high thermal conductivity metal aluminum plate;

[0024] Insulate the edge position of the notch.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] The integrated microcrystalline module of the present invention has a structure in which a high thermal conductivity metal aluminum plate and a high TG point glass fiber board are cleverly combined through a connecting piece. The connecting piece enters from the side of the high thermal conductivity metal aluminum plate through a notch and is welded by reflow soldering, solving the technical problem of rosin residue existing in the original soldering with a soldering iron. Soldering with reflow soldering reduces manual labor, improves speed, and greatly improves product quality. Only through one connecting piece, the material cost is greatly reduced, and the problem of poor contact existing in the connection with connectors is solved.

[0027] The insulating treatment design at the periphery of the notch can be used to install the connecting piece and ensure that the pin is short-circuited with the high thermal conductivity metal aluminum plate. The heat dissipation layer on the back of the high TG point glass fiber board is in full contact with the high thermal conductivity metal aluminum plate, which is beneficial to controlling the rapid heat dissipation of the circuit, reducing the heat of the circuit components on the control board, enabling the circuit to work stably in a high-temperature environment for a long time. Since the heat of the control circuit is reduced, the service life of the entire designed circuit is also extended.

[0028] The integrated microcrystalline module can be stacked by several independent layers. When using the same control board module, the circuit design can be randomly combined with high thermal conductivity metal aluminum plates of various shapes, facilitating various special-shaped appearance designs. Especially the notch design of the high thermal conductivity metal aluminum plate, combined with the connecting piece to cleverly integrate the two, is convenient for fully automated production and reduces the use of manual labor.

[0029] Due to the small and highly adaptable design of the high TG point glass fiber board with high versatility, the same high TG point glass fiber board can be designed onto various different high thermal conductivity metal aluminum plates. Therefore, the versatility is very wide, and a single product can be shared in the mass production of factories, which can greatly reduce the production cost. Since continuous production can be carried out for a long time without stopping the line, the relevant output can also be significantly increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic diagram of the connection of a high thermal conductivity metal aluminum plate and a high TG point glass fiber board using two sockets and a wire harness in the prior art;

[0031] Figure 2 is a schematic three-dimensional structure diagram of an integrated microcrystalline module provided by an embodiment of the present invention;

[0032] Figure 3 is Figure 2 a schematic three-dimensional structure diagram of the integrated microcrystalline module shown from another angle;

[0033] Figure 4 is Figure 2 a front view schematic diagram of the integrated microcrystalline module shown;

[0034] Figure 5 is Figure 2 a back view schematic diagram of the integrated microcrystalline module shown;

[0035] Figure 6It is a schematic three-dimensional structure diagram of the high thermal conductivity metal aluminum plate provided by an embodiment of the present invention;

[0036] Figure 7 It is Figure 6 a front view schematic diagram of the high thermal conductivity metal aluminum plate shown;

[0037] Figure 8 It is Figure 6 a back view schematic diagram of the high thermal conductivity metal aluminum plate shown;

[0038] Figure 9 It is a front view schematic diagram of the high TG point glass fiber board with connectors installed provided by an embodiment of the present invention;

[0039] Figure 10 It is a back view schematic diagram of the high TG point glass fiber board with connectors installed provided by an embodiment of the present invention;

[0040] Figure 11 It is a schematic three-dimensional structure diagram of the high TG point glass fiber board with connectors installed provided by an embodiment of the present invention;

[0041] Figure 12a It is a top view schematic diagram of the connector provided by an embodiment of the present invention;

[0042] Figure 12b It is a side view schematic diagram of the connector provided by an embodiment of the present invention. Detailed implementation manners

[0043] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0044] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention; the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0045] See also Figures 2 to 5 , showing an integrated microcrystalline module provided in this embodiment, which includes a high thermal conductivity metal aluminum plate 1, a high TG point (TG point is the glass transition temperature) glass fiber plate 2 and a connecting member 3.

[0046] See also Figure 6 and Figure 7 , a microcrystalline lamp 4 and a light sensing device 5 are attached to the front of the high thermal conductivity metal aluminum plate 1, please refer to Figure 8 The back side of the high thermal conductivity metal aluminum plate 1 is the back side of the aluminum substrate. Figure 9 The front side of the high TG point glass fiber board 2 is provided with a control electronic device 6. Figure 10 , a heat dissipation layer 21 is laid on the back of the high TG point glass fiber board 2; in this embodiment, the heat dissipation layer 21 is a large area of ​​bare copper layer. The high thermal conductivity metal aluminum plate 1 is stacked on the high TG point glass fiber board 2, and the heat dissipation layer 21 is in contact with the back of the high thermal conductivity metal aluminum plate 1. The large area of ​​bare copper layer is in full contact with the aluminum substrate of the high thermal conductivity metal aluminum plate 1, which is beneficial to the rapid heat dissipation of the control circuit, reduces the heat of the electronic components 6 of the control board circuit, and enables the circuit to work in a high temperature environment for a long time and remain stable. Because the control circuit reduces the heat, the service life of the entire design circuit is also extended.

[0047] In this embodiment, all the control electronic devices 6 of the microcrystalline module are arranged on the front of the high TG point glass fiber board 2, while no control electronic devices are arranged on the front of the high thermal conductivity metal aluminum board 1. The front of the high thermal conductivity metal aluminum board 1 is the lamp surface. Since there are no other control electronic devices, more microcrystalline lamps 4 can be arranged, and several microcrystalline lamps 4 can be distributed in a ring shape, a star shape, or a divergent shape.

[0048] The high thermal conductivity aluminum plate 1 is provided with a notch 11 penetrating through the thickness direction thereof, and an insulating material 110 is provided around the notch 11 to prevent a short circuit between the connector 3 and the high thermal conductivity aluminum plate 1 .

[0049] Please refer again Figure 10 The back of the high TG point glass fiber board 2 is provided with a soldering pad 22 in an area offset from the heat dissipation layer 21; the connector 3 includes a fixing seat 31 and a plurality of spaced pins 32, the fixing seat 31 is embedded in the notch 11, and the plurality of pins 32 are penetrated in the fixing seat 31 and penetrate the thickness direction of the fixing seat 31. The fixing seat 31 of the connector 3 is made of insulating material.

[0050] See also Figure 11 The bottom end of the pin 32 is welded to the pad 22 on the high TG point glass fiber board 2, and the top end thereof extends toward the outside of the fixing seat 31 to form a spanning section. Please refer to Figure 3 The free end of the spanning segment is welded to the welding pad 12 on the front side of the high thermal conductivity metal aluminum plate 1 .

[0051] Please refer to Figure 12a and 12b , the spanning section of the pin 32 is inclined with respect to the horizontal plane, and the end close to the fixing base 31 is higher than its free end. Thus, it can effectively prevent the pin 32 from contacting the high thermal conductivity metal aluminum plate 1 and prevent the occurrence of short circuits.

[0052] This embodiment also provides a production method for an integrated microcrystalline module, including the following steps:

[0053] S1. Design the high thermal conductivity metal aluminum plate 1, determine the positions of the notch 11, the microcrystalline lamps 4 and the photosensor devices 5, and perform insulation treatment on the edge positions of the notch 11 of the high thermal conductivity metal aluminum plate 1;

[0054] S2. Manufacture the high thermal conductivity metal aluminum plate 1, and arrange and weld the microcrystalline lamps 4 and the photosensor devices 5 on the front surface of the high thermal conductivity metal aluminum plate 1 according to the design;

[0055] S3. Design the high TG point fiberglass board 2, confirm the laying area of the bare copper and the short - circuit prevention clearance area; manufacture the high TG point fiberglass board 2;

[0056] S4. Use automated equipment to attach the microcrystalline lamps 4 and the photosensor devices 5 to the high thermal conductivity metal aluminum plate 1;

[0057] S5. Use automated equipment to attach the control electronic devices 6 to the front surface of the high TG point fiberglass board 2;

[0058] S6. Design and mold the connector 3, including determining the arrangement mode of the pins 32, the bending direction, angle and spacing of the pins 32, and then obtain the modular connector 3;

[0059] S7. Weld the bottom ends of the pins 32 of the connector 3 to the pads 22 on the front surface of the high TG point fiberglass board 2;

[0060] S8. Stack the back surface of the high TG point fiberglass board 2 under the back surface of the high thermal conductivity metal aluminum plate 1, and embed the fixing base 31 of the connector 3 into the notch 11 of the high thermal conductivity metal aluminum plate 1;

[0061] S9. Through reflow soldering technology, weld the free ends of the spanning sections of the pins 32 to the pads 22 on the front surface of the high thermal conductivity metal aluminum plate 1; thus, the integrated microcrystalline module is obtained.

[0062] In summary, for the integrated microcrystalline module of this embodiment, its structure is ingeniously combined by a high thermal conductivity metal aluminum plate 1 and a high TG point fiberglass board 2 through a connector 3. The connector 3 ingeniously enters from the side of the high thermal conductivity metal aluminum plate 1 through a notch 11 and is welded by reflow soldering, solving the technical problem of rosin residue existing in the original soldering with a soldering iron. Soldering with reflow soldering reduces labor and improves speed, greatly enhancing the product quality. With only one connector 3, the material cost is significantly reduced, and the problem of poor contact existing in the connection with connectors is solved.

[0063] The integrated microcrystalline module can be stacked by several independent layers. When using the same control board module, the circuit design can randomly match high thermal conductivity metal aluminum plates 1 with various shapes, facilitating various special-shaped appearance designs. In particular, the notch 11 design of the high thermal conductivity metal aluminum plate 1, combined with the ingenious combination of the two by the connector 3, facilitates fully automated production and reduces the use of labor.

[0064] Due to the small and highly adaptable design of the high TG point fiberglass board 2 with high versatility, the same high TG point fiberglass board 2 can be designed on various different high thermal conductivity metal aluminum plates 1. Therefore, the versatility is very wide. The factory can mass-produce with a single product, which can greatly reduce the production cost. Since it can be produced continuously without stopping for a long time, the relevant output can also be significantly increased.

[0065] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. An integrated microcrystalline module, characterized in that, It comprises a high thermal conductivity metal aluminum plate, a high TG point glass fiber plate and a connecting piece; a microcrystalline lamp and a light sensing device are attached to the front of the high thermal conductivity metal aluminum plate, the high TG point glass fiber plate is a glass fiber plate with a high glass transition temperature, the front of the high TG point glass fiber plate is provided with electronic devices for control, and the back of the high TG point glass fiber plate is provided with a heat dissipation layer; the high thermal conductivity metal aluminum plate and the high TG point glass fiber plate are stacked up and down, and the heat dissipation layer is in contact with the back of the high thermal conductivity metal aluminum plate; The high thermal conductivity metal aluminum plate is provided with a notch penetrating the high thermal conductivity metal aluminum plate in the thickness direction thereof, and an insulating material is provided around the notch to prevent a short circuit between the connector and the high thermal conductivity metal aluminum plate; A solder pad is provided on the back of the high TG point glass fiber board in an area offset from the heat dissipation layer; the connector includes a fixing seat and a pin, the fixing seat is embedded in the notch, and the pin is inserted into the fixing seat; The bottom end of the pin is welded to the pad on the high TG point glass fiber board, and the top end thereof extends toward the outside of the fixing seat to form a spanning section, and the free end of the spanning section is welded to the pad on the front side of the high thermal conductivity metal aluminum plate; the heat dissipation layer on the back side of the high TG point glass fiber board is a bare copper layer, and a number of microcrystalline lamps are attached to the front side of the high thermal conductivity metal aluminum plate.

2. The microcrystalline module according to claim 1, characterized in that, All the electronic components for control of the microcrystalline module are arranged on the front side of the high TG point glass fiber board, and no electronic components for control are arranged on the front side of the high thermal conductivity metal aluminum board.

3. The microcrystalline module according to claim 1 or 2, characterized in that, The spanning section of the pin is inclined with respect to the horizontal plane, and one end thereof close to the fixing seat is higher than the free end thereof.

4. The microcrystalline module according to claim 1 or 2, characterized in that, The fixing seat of the connector is made of insulating material, and a plurality of pins are embedded therein and distributed at intervals and penetrate the fixing seat in the thickness direction.

5. A production method for producing the integrated microcrystalline module according to any one of claims 1 to 4, characterized in that, The following steps are involved: Using automated equipment, micro-crystal lamps and light-sensing devices are attached to high thermal conductivity aluminum plates; Using automated equipment, electronic components for control are attached to the front of the high TG point fiberglass board; Design and mold the connector to produce modular connectors; Solder the bottom end of the connector pin to the pad on the front side of the high TG point fiberglass board; The back side of the high TG point glass fiber board is stacked under the back side of the high thermal conductivity metal aluminum board, and the fixing seat of the connecting piece is embedded in the notch of the high thermal conductivity metal aluminum board; By using the reflow soldering technology, the free end of the pin crossing section is soldered to the soldering pad on the front side of the high thermal conductivity metal aluminum plate; thus, an integrated microcrystalline module is obtained.

6. The production method of the integrated microcrystalline module according to claim 5, characterized in that, It also includes the steps for making high thermal conductivity metal aluminum plate: Design a high thermal conductivity aluminum plate and determine the location of the notch; According to the design, micro-crystal lamps and light-sensing devices are arranged and welded on the front of the high thermal conductivity metal aluminum plate; The edges of the notch are insulated.

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